JP2587842Y2 - Mount structure of wafer ring in bonding equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a wafer ring in a bonding apparatus.

[0002]

2. Description of the Related Art Conventionally, in a bonding apparatus such as a die bonder, a wafer ring 1 as shown in FIG. 9 is used to supply a chip to be bonded to a lead frame or a substrate. The wafer ring 1 is a jig in which a plate-shaped flange portion 3 is formed around a short cylindrical portion 2. By fitting a ring (not shown) on the cylindrical portion 2, a wafer formed of a plurality of chips is formed. The attached sheet is attached in a tensioned state. In the bonding apparatus, the wafer ring 1 on which the sheet is mounted is transported by a dedicated transport apparatus to a mount section of the bonding apparatus mainly provided on an XY table.

FIG. 10 shows an example of such a mount section.
That is, the mount is configured on the top plate 101 provided on the XY table. Roller guides 102, 10 are provided on both sides of the top plate 101 along the transfer direction of the wafer ring 1 (the direction of arrow B in FIG. 10).
The wafer ring 1 is conveyed onto the top plate 101 while being guided by both roller guides 102, 102. On one end of the top plate 101, a pair of arms 103, 103 for positioning the transferred wafer ring 1 is provided.

[0004] As shown in FIG. 11, both arms 103, 103 are connected to a support 1 near the top plate 101.
04, an arm plate 105 rotatably supported by
A roller 106 provided at its free end and having a V-shaped groove formed on its peripheral surface. The arm plate 105 is attached to an operating shaft 114 of an air cylinder 113 provided at the other end of the top plate 101. Are linked. Then, the pair of arms 103, 103 move the wafer ring 1 with the top plate 1 while pressing the flange portion 2 with both rollers 106, 106 with the operation of the air cylinder 113.
It operates to slide to the other end of 01.

On the other end side of the top plate 101, positioning pins 107 and 108 are provided so as to project, and the wafer ring 1 that slides is a stopper pin 1
The notches 3a and 3b of the flange portion 3 are positioned by contacting the notches 07 and 108. Further, the other end of the top plate 101 is rotatably supported by a bracket 109 as shown in FIG.
An L-shaped clamper 111 is provided which is connected to the operating shaft 114 of the air cylinder 113 through the ten.

The clamper 111 includes the pair of arms 1.
03, 103, the wafer ring 1 is set to operate with a slight delay.
8, the flange portion 3 of the wafer ring 1 is pressed onto the top plate 101 by the stopper portion 112 protruding toward the upper surface of the top plate 101. Thus, the positioned wafer ring 1 is fixed at the other end of the top plate 101. At the time of such fixing, the wafer ring 1 is prevented from rattling in the vertical direction by the rollers 106 on one end side of the top plate 101.

[0007]

However, in such a conventional fixing structure, since the wafer ring 1 is slid directly on the top plate 101, the wafer ring 1 is not transported to the mounting portion. Was easy to get caught. Also, a pair of arms 103, 10
3 and the clamper 111 are operated by the same air cylinder 113, and it is necessary to set the latter to operate slightly later than the former, so that the adjustment of the operation timing between the two is complicated.

Further, at one end of the top plate 101, rollers 106, 10 of the arms 103, 103 are disposed.
6, the wafer ring 1 is fixed.
At such a location, the wafer ring 1 could not be firmly fixed. Moreover, the top plate 10
In this case, the height of the rollers 106 and 106 with respect to the roller 1 must be strictly adjusted, and the adjustment is complicated.

The present invention has been made in view of such circumstances, and enables a wafer ring to be smoothly transferred and firmly fixed without a complicated adjustment. It is intended to provide a mounting structure.

[0010]

According to the present invention, in order to solve the above-mentioned problems, the wafer ring conveyed to the mounting portion is fixed after being positioned and in contact with the support surface of the mounting portion. A bonding apparatus having a first roller protruding from the support surface, supporting the conveyed wafer ring via the first roller, and operating the wafer ring after the conveyance of the wafer ring to convey the wafer ring; A transfer guide that moves to a predetermined position along the direction, a first driving unit that drives the transfer guide, and are provided to face each other along the transfer direction, and guide the wafer ring during transfer and movement. From the guide position, the wafer ring is actuated to a clamp position for pressing the wafer ring against the support surface, and when in the guide position, protrudes from the support surface. And by supporting the wafer ring, and includes a pair of clampers each having a second roller that retreat from the supporting surface when in said clamping position, and a second driving means for driving the clamper,
After the wafer ring is positioned, the clamper is operated to the clamp position.

[0011]

In the above structure, the wafer ring is supported by the first roller of the transfer guide and the second roller of the clamper until the wafer ring is transferred to the mount of the bonding apparatus and positioned. Therefore, contact of the mount portion with the support surface during this time is prevented. Further, the positioned wafer ring is pressed against the support surface of the mount portion over a wide range along the transport direction by a pair of opposing clampers which are operated from the guide position to the clamp position, thereby being fixed to the mount portion. Is done. On the other hand, the adjustment of the operation timing with the clamper
This is performed by adjusting the operation timings of the first driving means and the second driving means which are different from each other.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are plan views showing a mounting portion of the bonding apparatus according to the present invention. FIG. 1 shows a left half thereof, and FIG. 2 shows a right half thereof.
The mount portion is formed of a rectangular top plate 11 slightly longer in the X-axis direction provided on an XY table (not shown) of the bonding apparatus, as in the conventional example.

On one side of the top plate 11 in the Y-axis direction, a wafer ring 1 (see FIG. 9) which is transferred to a mount portion by a transfer device (not shown) is supported.
A transfer guide 12 for moving the wafer ring 1 after transfer to a predetermined position is provided. The transport guide 12 is shown in FIG.
As shown in FIG. 3, a shaft 14 penetrates a bearing housing 13 provided on the top plate 11 and has both ends rotatably supported by the top plate 11.
have. Two roller holders 15, 15 are fixed to the shaft 14 at appropriate intervals in the X-axis direction, and a first roller 16 is rotatably provided at the tip of each roller holder 15.

A lever 1 is provided at one end of the shaft 14.
7 is fixed, and a spring hanger 18 provided on the upper end thereof and a fixed-side spring hanger 19 provided on the top plate 11 side are connected via a spring 20. Thereby, the transport guide 12
Means that the first rollers 16, 16 are
Is always urged to the positioning state close to the side of the.

The top plate 11 is provided with an air cylinder 21 serving as a first driving means in the vicinity of the lever 17. As shown in FIG. 4, the air cylinder 21 has an operating shaft 22 projecting in the Y-axis direction. The operating shaft 22 is connected to the upper end of the lever 17 via a bracket 23. Thereby, the transport guide 12 is rotated against the bias of the spring 20, and the transport state in which the first roller 16 is separated from the side of the top plate 11 (see FIGS. 1, 2 and 4 (a)). ) (B)
(A state shown by a two-dot chain line). And
The transport guide 12 is configured to rotate from the transport state to the positioning state with the operation of the air cylinder 21.

On the other hand, as shown in FIG. 5, one end of the top plate 11 in the X-axis direction is provided with a stand 25 fixed to the lower surface of the top plate 11 through an air slide as a second driving means in the present invention. A table 26 is supported. The air slide table 26 has an operating shaft 27 that moves in and out by air pressure, and a moving block 28 that is slid in the X-axis direction by the operating shaft 27. Moving block 28
A rod holder 29 extending in the Y-axis direction is attached to the upper surface side of the base plate 11. Drive rods 30, 30 extending in the X-axis direction on the lower surface side of the top plate 11 are mounted on both ends of the rod holder 29. One ends are respectively connected.

On the other hand, on the upper surface 11a of the top plate 11, that is, on the support surface, the transferred wafer ring 1 (FIG. 9).
Two pins 45, 46 for positioning the
A pair of opposing clampers 31, 31 for pressing and fixing the wafer ring 1 to the upper surface 11a are provided. Each of the pair of clampers 31 has a clamp plate 32 extending in the Y-axis direction. The clamp plate 32 is, as shown in FIG.
The ball bushings 33, 33 supported by 1 and the shafts 34, 34 are supported so as to be able to move up and down. A clamp block 35 is fixed to the clamp plate 32 so as to be located between the clamp plate 32 and the top plate 11. The plurality of compression springs 36... 6 and FIG.
(Position shown in (a)).

The clamp block 35 has, on the lower surface side of the clamp plate 32, a second roller 37 having a rotating shaft projecting toward the other clamper 31, and a rotating shaft projecting upward. Third roller 38
Are provided at predetermined intervals in the Y-axis direction. The second rollers 37 are provided so as to slightly protrude from the upper surface of the top plate 11 when the clamper 31 is at the guide position, as shown in FIG. 7A. As shown in FIG. 8, straight cams 39, 39 having cam grooves 39 a inclined about 20 degrees in the X-axis direction on both sides of the clamp block 35 are provided on the lower surface of the clamp plate 32. Installed.

Further, near the straight cams 39, the other ends of the drive rods 30, 30 are supported on the lower surface of the top plate 11 via ball bushes 40 so as to be movable in the extending direction. A bearing holder 41 is provided at the other end of the drive rod 30, and a fourth roller 42 supported by the bearing holder 41 is accommodated in the cam groove 39a. Thus, when the drive rods 30, 30 move in the X-axis direction (left side in FIG. 8) with the operation of the rod holder 29, the clampers 32, 31
, And the second roller 37.
Is operated to a clamp position (the position shown in FIGS. 7A and 8B) located below the upper surface 11a.

In the present embodiment having the above configuration, when the wafer ring 1 is transferred, the transfer guide 12 is
4 (a) and 4 (b), the clampers 31, 31 are at the guide positions (FIGS. 7 (a) and 8 (a)), and the wafer ring 1 is not shown. The sheet is conveyed to the mount section from the side of the conveyance guide 12 along the Y axis direction by the conveyance device. At this time, the wafer ring 1 includes the first rollers 16, 16 of the transport guide 12 and the second rollers 37 of the pair of clampers 31, 31,.
While the flange 3 is inserted between the pair of clampers 31, 31, the rear edge of the flange 3 is guided to a predetermined position beyond the transport guide 12.

Next, when the wafer ring 1 reaches the predetermined position, the air cylinder 21 is operated, and the transfer guide 12 is rotated by about 45 ° toward the side edge of the top plate 11 on the transfer side (see FIG. 2). 4 (b)). Along with this, the wafer ring 1 has the positioning pins 45 and 4 described above.
6 until it comes into contact with the roller 6 (see FIG. 1).
And the state shown in FIG. 2). Thereafter, the transport guide 1
The air slide table 26 is operated with a slight delay from the operation of Step 2, and the pair of clampers 31, 31 is operated from the guide position to the clamp position via the rod holder 29 and the drive rod 30. As a result, the wafer ring 1
The flange portion 3 is pressed against the upper surface 11a of the top plate 11 by the clamp plates 32, 32, and is fixed in position.

Therefore, in the present embodiment, the wafer ring 1 is prevented from contacting the upper surface 11a of the top plate 11 from the time when the wafer ring 1 is conveyed to the mounting portion to the time when the wafer ring is positioned. Can be transported to Further, since the positioned wafer ring 1 is pressed against the upper surface 11a of the top plate 11 by a pair of clampers 31, the flange portion 3 is widely pressed along the Y-axis direction, that is, the transport direction. The wafer ring 1 can be firmly fixed to the mounting portion. On the other hand, the transport guide 12 and the clamper 3
The operation of adjusting the operation timing of the air cylinders 1 and 31 is performed by adjusting the operation timing of the air cylinder 21 and the air slide table 26. Therefore, the adjustment operation can be performed extremely easily.

[0023]

[Effect of the Invention] As described above, in the present invention,
Until the wafer ring is transported and positioned
Since the wafer ring is configured such that the first roller of the transfer guide and the second roller of the clamper prevent contact with the support surface of the mount, the wafer ring can be transferred smoothly. Further, since the positioned wafer ring is configured to be pressed against the support surface of the mount portion over a wide range along the transport direction only by the clamper, the fixing strength of the wafer ring to the mount portion is improved. In addition, at the time of such fixing, the clamper only operates from the guide position to the clamp position and presses the wafer ring against the support surface of the guide portion, so that fine adjustment of the installation position and the like is unnecessary. Furthermore, since the operation timings of the transport guide and the clamper are adjusted by adjusting the operation timings of the first driving means and the second driving means which are different from each other, it is extremely easy to adjust the operation timings. is there.

Accordingly, it is possible to provide a mount structure capable of smoothly transporting the wafer ring and firmly fixing the wafer ring without performing complicated adjustment.

[Brief description of the drawings]

FIG. 1 is a plan view of a mount unit according to an embodiment of the present invention.

FIG. 2 is a plan view following FIG. 1;

FIG. 3 is a view taken in the direction of arrow A in FIG. 1;

4A and 4B are diagrams showing the operation of the conveyance guide in one embodiment of the present invention, wherein FIG. 4A is a side view of a portion indicated by an arrow a in FIG. 3 and FIG. FIG.

FIG. 5 is a view taken in the direction of arrow B in FIG. 2;

FIG. 6 is a cross-sectional view illustrating the clamper according to the embodiment of the present invention;

FIG. 7 is a sectional view taken along the line CC of FIG. 1;
FIG. 3B is a view showing a state in which the clamper is at the guide position,
FIG. 5 is a diagram showing a state where the clamper is at a clamp position.

8 is a view corresponding to an arrow D in FIG. 1, wherein (a) corresponds to (a) of FIG. 7, and (b) is a view corresponding to (b) of FIG. 7;

FIG. 9 is an external perspective view showing a wafer ring.

FIG. 10 is a plan view showing a conventional example.

FIG. 11 is a sectional view taken along line EE in FIG. 10;

FIG. 12 is a sectional view taken along the line FF of FIG. 10;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer ring 3 Flange part 11 Top plate 11a Upper surface (support surface) 12 Transport guide 16 1st roller 21 Air cylinder (1st drive means) 26 Air slide table (2nd drive means) 30 Drive rod 31 Clamper 32 Clamp plate 37 Second roller 39 Straight cam

Claims (1)

(57) [Scope of request for utility model registration] 1. A bonding apparatus in which a wafer ring conveyed to a mount section is positioned and fixed in contact with a support surface of the mount section, comprising: a first roller protruding from the support surface; A transfer guide that supports the transferred wafer ring via the first roller, and is operated after the transfer of the wafer ring to move the wafer ring to a predetermined position in the transfer direction; and drives the transfer guide. A first driving unit, which is provided so as to face each other along the transfer direction, and guides the wafer ring during transfer and during movement from a guide position.
Actuated to a clamp position for pressing the wafer ring against the support surface, protruding from the support surface when in the guide position, supporting the wafer ring, and retracting from the support surface when in the clamp position. A pair of clampers each having a second roller, and second driving means for driving the clamper, wherein after the wafer ring is positioned, the clamper is operated to the clamp position. Mounting structure of wafer ring in bonding equipment