JP3314663B2 - Chip bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip bonding apparatus for bonding a chip to a substrate held by a carrier.

[0002]

2. Description of the Related Art CSP (Chip Size Pack)
Since small substrates such as age) are small in size and difficult to handle, they are carried on a production line while being held by a large carrier. The carrier is generally made of a bendable thin metal plate, and holds a substrate in its opening to carry out work in each step and transport between steps.

[0003]

When bonding a chip with a bump, such as a flip chip, to a substrate, it is required to maintain strict parallelism between the substrate and the chip during bonding. However, since the carrier is made of a thin metal plate, the rigidity is small, and the carrier is easily deformed by a slight force. Therefore, the substrate held by the carrier is inclined and the posture is easily collapsed. The case where the carrier is transported to the chip bonding apparatus in such a state will be described.

FIG. 9 is a partial front view of a conventional chip bonding apparatus. In FIG. 9, a substrate 6 is held on a carrier 1. A backup member 10 supports the carrier 1 from below during bonding. As a result of the deformation of the carrier 1, the substrate 6 is held in an inclined state with respect to the backup member 10. A bonding head 8 is provided above the carrier 1, and a chip 9 with bumps is vacuum-adsorbed to a lower end of the bonding head 8. When the chip 9 is bonded to the substrate 6 by lowering the bonding head 8 in this state, the chip 9
Is unevenly pressed against the substrate 6 due to the inclination, and the bonding tends to be defective. As described above, in the conventional chip bonding method using a carrier, there is a problem that the parallelism of the substrate 6 is not maintained and a bonding failure is likely to occur.

The present invention solves the above problems and provides a chip bonding apparatus capable of correctly bonding a chip to a substrate while maintaining the parallelism between the substrate and the bonding head even when a flexible carrier is used. The purpose is to provide.

[0006]

According to a first aspect of the present invention, there is provided a chip bonding apparatus comprising: a transfer section for transferring a carrier made of a bendable thin metal plate; and a bonding head for bonding the chip to a substrate held by the carrier. ,
A backup member is provided for supporting the substrate and / or the carrier from below at the time of bonding, and a suction unit provided on the backup member for vacuum-sucking the lower surface of the substrate.

According to a second aspect of the present invention, there is provided the chip bonding apparatus according to the first aspect, wherein an opening having an orthogonal portion for receiving a first corner of the substrate is formed in the carrier, A second diagonal of the first corner
Forming a resiliently deformable pressing piece for pressing the first corner against the orthogonal portion by pressing the second corner toward the first corner on the side of the second corner. The substrate is elastically clamped and held from the diagonal direction by the orthogonal portion and the pressing piece, and a fixing means for fixing the carrier to the backup member is provided, and the pressing piece is forcibly elastically deformed. And a clamp releasing means for releasing the clamped state of the substrate by moving the substrate away from the second corner.

[0008]

According to the first aspect of the present invention, in bonding a chip to a substrate held by a carrier, the lower surface of the substrate is vacuum-adsorbed to a backup member that supports the carrier from below during bonding. Since the suction portion is provided, the substrate can be held parallel to the bonding head during bonding by firmly sucking the substrate with the suction portion.

According to a second aspect of the present invention, in bonding a chip to a substrate clamped and held by a carrier, the bonding state of the substrate by the carrier is released at the time of bonding, and the substrate is attached to the suction portion. Is vacuum-adsorbed, so that the inclination of the substrate can be completely eliminated and the chip can be correctly bonded to the substrate.

(Embodiment 1) FIG. 1 is a perspective view of a chip bonding apparatus according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of the same carrier, and FIG. 3 is a side sectional view of the chip bonding apparatus. 4 (a), 4 (b), 4 (c), and 4 (d) are partial cross-sectional views of the bonding apparatus of the same chip.

First, the overall structure of a chip bonding apparatus will be described with reference to FIG. In FIG. 1, reference numeral 11 denotes a transfer rail, and a pair of right and left is disposed to face each other.
A belt 12 is movably mounted on the upper surface of the transport rail 11, and the belt 12 is tuned to a pulley 13. The carrier 1 holding the substrate 6 is placed on the belt 12, and the carrier 1 is transported on the transport rail 11 as the belt 12 runs. Therefore, the transport rail 11 and the belt 12 constitute a transport section of the carrier 1. A movable table 14 is disposed above the transport rail 11.
A bonding head 15 is mounted on the movable table 14. The bonding head 15 bonds the chip 9 on the substrate 6.

Next, the carrier 1 will be described with reference to FIG. In FIG. 2, the carrier 1 is made of an elongated metal sheet. A plurality of rectangular openings 2 are formed in the carrier 1 at a pitch. A strip-shaped bridge 3 is formed in a diagonal direction of the opening 2. A circular portion 4 is provided at the center of the bridge 3. The circular portion 4 is formed with a pin hole 5 and a cutout 4a of approximately 90 degrees. The orthogonal portion 2a of the opening 2 receives the first corner 6a of the substrate 6, and the second corner 6b on the diagonal line of the first corner 6a of the substrate 6 is in the diagonal direction of the substrate 6 (arrow It is pressed toward the first corner 6a by the notch 4a of the bridge 3, which is a pressing piece elastically deformable in the direction (a). That is, the substrate 6 is elastically clamped and held from the diagonal direction by the orthogonal part 2a and the notch part 4a. The substrate 6 is released from the clamped state by inserting the pin into the pin hole 5 and forcibly deforming the bridge 3 in the direction of arrow a. 7 is a slit provided along the opening 2.

Next, the backup member will be described with reference to FIGS. In FIG. 1, a block-shaped backup member 17 is provided below the bonding head 15. On the upper surface of the backup member 17, three suction portions 18 are provided corresponding to the positions of the three substrates 6 held by the carrier 1. As shown in FIG. 3, the suction section 18 is provided with a suction hole 19. The suction hole 19 is connected to a vacuum suction means 24 through a suction path 20 and a pipe 21 inside the backup member 17.

The rod 23 of the cylinder 22 is connected to the lower surface of the backup member 17. When the rod 23 of the cylinder 22 protrudes and retracts, the backup member 1
7 moves up and down, and with the backup member 17 raised, the upper surface of the suction portion 18 contacts the lower surface of the substrate 6 and / or the carrier 1 around the substrate 6. Therefore, when the carrier 1 holding the substrate 6 is positioned with respect to the backup member 17, the backup member 17 is lifted and vacuum-sucked, so that the suction portion 18 becomes the lower surface of the substrate 6 and / or the carrier 1 around the substrate 6. Is vacuum-adsorbed. In this manner, the substrate 6 and / or the lower surface of the carrier 1 around the substrate 6 are vacuum-suctioned by the suction unit 18, so that the substrate 6 is in a completely horizontal posture.

This chip bonding apparatus has the above-described configuration, and its operation will be described below with reference to FIG. FIG. 4A shows a state in which the carrier 1 holding the substrate 6 is conveyed by the belt 12 and positioned. At this time, the carrier 1 is warped and deformed, and the substrate 6 is inclined by the deformation of the carrier 1.
Next, as shown in FIG. 4B, the rod 23 of the cylinder 22 is protruded to raise the backup member 17 (see arrow b). As a result, the suction portion 18 partially contacts the lower surface of the substrate 6, but since the substrate 6 is inclined,
A gap G exists between the suction part 18 and the substrate 6.

Next, when the vacuum suction means 24 is driven to vacuum suction through the suction hole 19 of the suction section 18 (see arrow c),
The substrate 6 and / or the carrier 1 are vacuum-adsorbed to the adsorption unit 18. At this time, since the carrier 1 is easily bent, when the substrate 6 is vacuum-sucked, the carrier 1 also deforms without difficulty following the vacuum-sucking, so that the carrier 1 does not hinder the vacuum-suction of the substrate 6. At this time, an operation of lowering the bonding head 16 and pressing the substrate 6 against the suction unit 18 may be performed. By this pressing operation, the substrate 6 can be more quickly vacuum-sucked to the suction portion 18.

As a result, the substrate 6 is placed in a posture parallel to the backup member 17 whose parallelism with the bonding head 16 has been adjusted in advance, and the inclination of the substrate is corrected. With respect to this substrate 6, as shown in FIG.
The chip 9 is bonded by the bonding head 16. At this time, since the posture of the substrate 6 is maintained correctly and horizontally, the chip 9 is bonded in a normal posture with respect to the substrate 6, and no bonding failure due to the poor posture of the substrate 6 occurs.

(Embodiment 2) FIG. 5 is a perspective view of a chip bonding apparatus according to Embodiment 2 of the present invention, FIG. 6 is a side sectional view of the chip bonding apparatus, and FIG. Partial perspective views, FIGS. 8A and 8B,
(C), (d) is a partial cross-sectional view of the bonding device of the same chip. First, FIG. 5 shows an overall structure of a chip bonding apparatus. In the second embodiment, the transport unit of the chip bonding apparatus, the portion related to the bonding head, and the carrier 1 are the same as those in the chip bonding apparatus described in the first embodiment. Are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 5, a backup member 27 is provided below the bonding head 16 as in the first embodiment.

Next, the backup member 27 will be described. 6 and 7, on the upper surface of the backup member 27, a suction portion 28 is provided corresponding to the position of the substrate 6 held by the carrier 1. A suction hole 29 is formed in the suction section 28. The suction hole 29 is connected to a vacuum suction means 34 via a suction path 30 inside the backup member 27. Further, on the upper surface of the backup member 27, a fixing claw 41 as a fixing means of the carrier 1 is provided. When the backup member 27 rises, the fixing claw 41 fits into the slit 7 of the carrier 1 (see FIG. 2) to fix the carrier 1.

The backup member 27 has a built-in cylinder 46, and is disposed in a horizontal posture such that the rod 47 of the cylinder 46 extends and retracts in the diagonal direction of the suction portion 28 (the direction of arrow d in FIG. 7). ing. A block 45 is connected to a rod 47 of the cylinder 46, and the pin 42 stands on the block 45. The pin 42 protrudes upward from an opening 43 provided on the upper surface of the backup member 27. When the backup member 27 is raised to support the carrier 1 from below, the pin 42 is provided in the pin hole 5 provided in the circular portion 4 of the carrier 1 (see FIG. 2).
Is inserted into. Therefore, when the rod 47 of the cylinder 46 protrudes in this state, the pin 45 protruding from the upper surface of the backup member 27 moves in the upright posture in the horizontal direction (the direction of the arrow a in FIG. 2), and the bridge 3 of the carrier 1 is moved. The substrate 6 is bent to release the clamp. That is, the cylinder 46 and the pin 45 constitute a clamp releasing unit that releases the clamp of the substrate 6.

Next, the overall operation will be described. FIG. 8 (a)
Shows a state in which the carrier 1 holding the substrate 6 is conveyed by the belt 12 and positioned at the bonding position. At this time, the carrier 1 is warped and deformed, and the substrate 6 is inclined by the deformation of the carrier 1. Next, as shown in FIG. 8B, the rod 33 of the cylinder 32 is protruded to raise the backup member 27 (see arrow e). As a result, the suction unit 28 partially abuts the lower surface of the substrate 6, but since the substrate 6 is inclined, a gap G exists between the suction unit 28 and the substrate 6.
At the same time, the fixing claws 41 on the upper surface of the backup member 27 are fitted into the slits 7 of the carrier 1, and the pins 42 are inserted into the pin holes 5 of the carrier 1.

Next, the clamp 46 of the substrate 6 is released by driving the cylinder 46 to move the pin 42 in the direction of the arrow g to bend the bridge 3, and to drive the vacuum suction means 34 to drive the suction section. When vacuum suction is performed through the suction holes 29 (see arrow f), the substrate 6 is suctioned by the suction unit 28. As a result, the substrate 6 has the backup member 2 whose parallelism with the bonding head has been adjusted in advance.
8 is placed in a posture parallel to the position of FIG.
As shown in (d), the bonding head 16 is lowered (see arrow h), and the chip 9 is bonded. At this time, since the posture of the substrate 6 is correctly kept horizontal,
The chip 9 is bonded to the substrate 6 in a normal posture, and no bonding failure due to the poor posture of the substrate 6 occurs.

After the completion of the bonding, the carrier 1 clamps the substrate 6 again by immersing the rod 47 of the cylinder 46. In this state, the vacuum suction of the substrate 6 is released, and the backup member 27 descends. Thereafter, the carrier 1 is transported to the next step by the belt 12.

The present invention is not limited to the first and second embodiments. For example, in the second embodiment, the cylinder 46 and the pin 42 serving as the clamp releasing means are built in the backup member 27 which receives the carrier 1 from below. However, the means for releasing the clamp is not limited to this. In short, a means for elastically bending the bridge 3 of the carrier 3 may be provided, and the carrier 1 is pressed from above during bonding. It is also possible to provide a masking member for fixing the cylinder and a pin in the masking member.

[0025]

According to the first aspect of the present invention, in bonding a chip to a substrate held by a carrier,
It is possible to correct the inclination of the substrate due to the deformation of the carrier or the displacement when the substrate is held by the carrier. Further, according to the second aspect of the present invention, it is possible to completely eliminate the inclination of the substrate due to the same reason. Thereby, at the time of chip bonding, the substrate is kept parallel to the bonding head, and the bonding failure of the chip due to the poor posture of the substrate can be eliminated.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the carrier according to the first embodiment of the present invention.

FIG. 3 is a side sectional view of the chip bonding apparatus according to the first embodiment of the present invention;

FIG. 4A is a partial cross-sectional view of the chip bonding apparatus according to the first embodiment of the present invention. FIG. 4B is a partial cross-sectional view of the chip bonding apparatus according to the first embodiment of the present invention. Partial cross-sectional view of the chip bonding apparatus according to the first embodiment. (D) Partial cross-sectional view of the chip bonding apparatus according to the first embodiment of the present invention.

FIG. 5 is a perspective view of a chip bonding apparatus according to a second embodiment of the present invention.

FIG. 6 is a side sectional view of a chip bonding apparatus according to a second embodiment of the present invention;

FIG. 7 is a partial perspective view of a chip bonding apparatus according to a second embodiment of the present invention.

8A is a partial cross-sectional view of a chip bonding apparatus according to a second embodiment of the present invention. FIG. 8B is a partial cross-sectional view of a chip bonding apparatus according to a second embodiment of the present invention. Partial sectional view of a chip bonding apparatus according to a second embodiment. (D) Partial sectional view of a chip bonding apparatus according to a second embodiment of the present invention.

FIG. 9 is a partial front view of a conventional chip bonding apparatus.

[Explanation of symbols]

 Reference Signs List 1 carrier 6 substrate 9 chip 11 transfer rail 12 belt 15 bonding head 17, 27 backup member 18, 28 suction unit 19, 29 suction hole 22, 32 cylinder 41 fixing claw 42 pin 46 cylinder

Claims (2)

(57) [Claims] 1. A transport section for transporting a carrier made of a bendable metal sheet, a bonding head for bonding a chip to a substrate held by the carrier, and a backup member for supporting the substrate and / or the carrier from below during bonding. And a suction unit provided on the backup member to vacuum-suction the lower surface of the substrate. 2. An opening having an orthogonal portion for receiving a first corner of the substrate is formed in the carrier, and an opening is formed on a second corner on a diagonal line of the first corner. 2 by pressing the second corner toward the first corner.
An elastically deformable pressing piece for pressing the corner portion of the substrate against the orthogonal portion, the substrate is elastically clamped and held from the diagonal direction by the orthogonal portion and the pressing piece, and the backup member is provided. Fixing means for fixing the carrier, and clamp releasing means for releasing the clamped state of the substrate by forcibly elastically deforming the pressing piece and separating it from the second corner. The chip bonding apparatus according to claim 1, wherein