JPH08112793A - Sucker holding device and mounting device - Google Patents

Abstract

PURPOSE: To prevent improper holding, position displacement and flawing of a substrate from occurring when a workpiece is sucked to be held. CONSTITUTION: In a sucker holding device 20 of holding a workpiece P sucked, the device comprises a device main unit 25, sucker hole 26a formed in this device main unit, suction means 28 of generating suction force in the sucker hole 26a and an elastic pad 26b mounted on the sucker hole 26a to elastically hold the workpiece P sucked to the sucker hole 26a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a liquid crystal substrate and a tape automated bonding substrate (hereinafter referred to as "TAB substrate").
Called. ) And the like, and a mounting device that mounts electronic components on a liquid crystal substrate or the like using the suction holding device.

[0002]

2. Description of the Related Art Conventionally, a TAB substrate mounting apparatus has been used to mount a TAB substrate on a side edge of a liquid crystal substrate.
This TAB board mounting device is equipped with a
A liquid crystal substrate transport arm that holds the liquid crystal substrate when transporting to the AB substrate mounting position and a liquid crystal substrate transport stage that positions the liquid crystal substrate at the TAB substrate mounting position are provided.

In the above-mentioned liquid crystal substrate transfer arm and liquid crystal substrate transfer stage, as a substrate holding mechanism for holding the liquid crystal substrate, a clamp system for holding the liquid crystal substrate by sandwiching it from both sides or a planar suction provided with vacuum suction holes is provided. A method of adsorbing with a plate or the like is used.

On the other hand, the outer leads of the TAB substrate are connected to the lead portions at the side ends of the liquid crystal substrate held by the above-mentioned liquid crystal substrate carrying stage at the TAB substrate mounting position. That is, the TAB substrate sucked and held on the lower surface of the mounting head mechanism is brought into contact with a predetermined mounting position of the liquid crystal substrate at a predetermined speed, and the lead portion and the outer lead are formed by thermocompression bonding together with the backup head located on the opposite side of the mounting head. It was designed to be mounted by joining.

[0005]

The TAB substrate mounting apparatus having the above-described conventional substrate holding mechanism and mounting head mechanism has the following problems. In other words, the clamp-type board holding mechanism sandwiches the liquid crystal board from both sides, so the impact at that time
The liquid crystal substrate may be cracked or chipped, and it is difficult to set the liquid crystal substrate in a holding state.

In addition, the substrate holding mechanism using a vacuum suction method using a suction plate or the like causes a suction failure due to dust adhering to the holding surface of the suction plate or the liquid crystal substrate, or wrinkles due to bubbles in a protective sheet attached to the liquid crystal substrate. It was liable to occur and the holding power sometimes decreased. For this reason, the liquid crystal substrate may be displaced due to an impact when the TAB substrate is brought into contact with the side end portion of the liquid crystal substrate, which may hinder precise alignment. Further, since the holding surface of the suction plate is usually made of a metal material, the liquid crystal substrate is easily damaged, and there is a problem that the processing accuracy must be high in order to maintain the flatness of the holding surface.

On the other hand, in the mounting head mechanism for mounting the TAB substrate on the end portion of the liquid crystal substrate, the surface of the TAB substrate and the mounting surface are not kept parallel due to the unevenness of the flatness of the suction plate at the tip of the mounting head. It sometimes came into contact. For this reason, uniform surface contact was impossible. Further, due to the impact applied at the time of contact, the positional displacement of the TAB substrate becomes remarkable, and there is a possibility that the mounting accuracy of each TAB substrate varies. There is also a problem in that the processing accuracy must be high in order to maintain the flatness of the suction plate.

In view of the above, according to the present invention, a suction holding device capable of preventing a holding failure, a position shift, and a scratch on the substrate when sucking and holding a substrate and a position shift of an electronic component due to a shock when the electronic component is mounted. An object of the present invention is to provide a suction holding device that can be reduced, and a mounting device using these suction holding devices.

[0009]

In order to solve the above problems and achieve the object, the present invention is a suction holding device for sucking and holding a work, the device main body, and a suction hole formed in the device main body. A suction means for generating a suction force in the suction hole and an elastic pad which is attached to the suction hole and elastically holds the work sucked in the suction hole are provided.

Further, in a suction holding device for holding a flat work by suction, a device body, a suction head having a suction hole attached to the device body via an elastic member, and a suction force generated in the suction hole. And a suction means for allowing it to be provided.

On the other hand, a first driving section driven in the XY directions and having a suction hole for sucking and holding a work, a suction means for generating a suction force in the suction hole, and a suction unit attached to the suction hole. A first suction holding device having an elastic pad for elastically holding the substrate sucked into the suction hole;
A second driving unit driven in the Z direction, a suction head unit having a suction hole attached to the second driving unit via an elastic member, and a suction unit for generating a suction force in the suction hole. Then, a second suction holding device for sucking the electronic component through the suction hole is provided.

[0012]

As a result of taking the above-mentioned means, the following effects occur. That is, a suction holding device for sucking and holding a work is provided with a suction pad formed in the main body of the device and an elastic pad for elastically holding the work, and vacuum holds the work. For this reason, even if there is dust attached to the work or wrinkles due to bubbles of the protective sheet attached to the work, a gap is not formed, and it is possible to prevent a reduction in holding force due to poor suction. Further, in the case of mounting an electronic component or the like on this work, even if the electronic component comes into contact with the side end of the work and gives a shock, the shock can be absorbed by the elastic pad, so the position of the work is displaced. Never.
Therefore, it is possible to perform precise alignment. Further, the surface of the work is not damaged.

Further, in the suction holding device for sucking and holding a flat work, since the suction head is attached to the main body of the device through the elastic member, the impact when the work is brought into contact with the substrate is attached. Can be tempered. Furthermore, since it is possible to make uniform surface contact with the mounting surface of the substrate or the like, it is possible to prevent positional displacement due to the mounting operation, and it is possible to perform mounting with high accuracy.

On the other hand, a first device is provided with a suction hole formed in the first apparatus body which is driven in the XY directions, and an elastic pad which is attached to the suction hole and elastically holds the substrate sucked by the suction hole. The substrate held by the first suction-holding device is sucked by the second suction-holding device including a suction head having a suction hole attached to the second device body driven in the Z direction via an elastic member. The held electronic components are installed. Therefore, even if there is dust adhering to the substrate held by the first suction holding device, wrinkles due to bubbles of the protective sheet attached to the substrate, etc., no gap is formed, and a reduction in holding force due to suction failure is prevented. be able to. Moreover, the surface of the substrate is not damaged.

Further, even if the tip of the suction head of the second suction holding device has unevenness in flatness and the surface of the electronic component and the mounting surface of the substrate may come into contact with each other without being held in parallel, the elastic member As a result, the electronic component can follow the substrate to make uniform surface contact. Further, since the elastic member absorbs the impact when the electronic component comes into contact with the surface of the substrate in the vertical direction, the displacement of the electronic component can be prevented. Therefore, it is possible to maintain high accuracy in mounting the electronic component on the substrate.

[0016]

1 is a perspective view showing a TAB board mounting apparatus according to an embodiment of the present invention. 2 (a),
(B) is a diagram showing a liquid crystal substrate transfer stage,
3A is a perspective view of the whole, FIG. 3B is a sectional view of a main part taken along line EE of FIG.
6A and 6B are views showing a main part of the B substrate mounting mechanism, where FIG. 6A is a front view, FIG. 4B is a side view, FIG. 4 is a perspective view showing a liquid crystal substrate transport mechanism, and FIG. 5 is a line FF in FIG. FIG. 6 is a cross-sectional view taken along the line and seen from the direction of the arrow.

Reference numeral 10 in FIG. 1 shows a TAB substrate mounting apparatus. The TAB substrate mounting apparatus 10 includes a substrate transfer stage 20 as a first suction holding device and a TAB substrate mounting mechanism 30 as a second suction holding device. The substrate transfer stage 20 includes a transfer rail 21, a transfer rail 22 provided on the transfer rail 21 so as to be slidable in the X direction in the figure, and a slide movement on the transfer rail 22 in the Y direction orthogonal to the X direction. The slider 23 is provided freely. The TAB board mounting mechanism 30 has a function of positioning the holding portion 24 in the XY directions, which will be described later, and drives the transport rail 22.
And a drive mechanism 22b for driving the slider 23.

As shown in FIG. 2, one end of a holding portion 24, which is formed in a cylindrical shape and serves as a first device main body, is fixed to the slider 23. At the other end of the holding portion 24, four arms 25 are provided perpendicularly to the axis of the holding portion 24. Each of the arms 25 has a suction portion 26 at the tip thereof.
Is provided. As shown in FIG. 2B, the suction portion 26 is provided with a suction hole 26a, and a cylindrical pad 26b made of an elastic material such as rubber is fitted as an elastic pad inside the suction hole 26a. One end of the suction hole 26
It projects outside from a. The inside of the suction hole 26 a is connected to a suction device 28 via a suction passage 27. In the figure, P indicates a liquid crystal substrate as a work, which is sucked and held by the suction force from the suction holes 26a.

On the other hand, the TAB substrate mounting mechanism 30 comprises a mounting head mechanism 40 and a backup head mechanism 50 arranged at a position sandwiching the liquid crystal substrate P. As shown in FIG. 3, the mounting head mechanism 40 includes a mounting head 41 that sucks the TAB substrate R, a mounting tool 43 that is connected to the mounting head 41 via a rubber sheet 42 that is an elastic material, and a mounting tool 43. And a drive device 45 for driving the slide shaft 44 so as to be slidable in the W direction in the drawing. The mounting head 41 includes a suction plate 41a made of a metal material and a plurality of suction holes 41b provided on the surface of the suction plate 41a. The suction holes 41b are inside the mounting head 41, a rubber sheet 42 as an elastic member, It is connected to a suction device 47 via a tube 46 passing through the inside of the fixture 43.

The backup head mechanism 50, as shown in FIG. 1, includes a backup head 51 and a drive device (not shown) for driving the backup head 51. The mounting head mechanism 40 and the backup head mechanism 50 are interlocked with each other, and are controlled so as to contact the liquid crystal substrate P almost at the same time as indicated by arrows Z1 and Z2 in FIG.

Reference numeral 60 in FIG. 4 denotes a liquid crystal substrate transfer device. The liquid crystal substrate transfer device 60 includes a transfer rail 61, a slider 62 provided on the transfer rail 61 so as to be slidable in the directions of arrows R1 and R2 in the figure, and fixed on the slider 62 and bent in a U shape. Liquid crystal substrate transfer arm 63
It has and. The slider 62 is driven by a drive device 62a. The liquid crystal substrate transfer arm 63 is provided with a plurality of suction portions 64 formed on the upper surface of the arm. These suction portions 64 have suction holes 64a and the suction holes 64a.
And a cylindrical pad 64b made of an elastic material such as rubber and having one end protruding from the upper surface of the arm. The suction holes 64 a are connected to the suction device 65 via an air intake path passing through the inside of the liquid crystal substrate transfer arm 63. Reference numeral 66 in the figure denotes a liquid crystal substrate cassette on which a plurality of liquid crystal substrates P are placed, and the liquid crystal substrate P can be moved in the direction of arrow S in the figure inside.

In the TAB substrate mounting apparatus thus configured, the step of mounting the TAB substrate R on the side end portion of the liquid crystal substrate P is performed as follows. That is, as shown in FIG. 4, the slider 63 slides in the R1 direction, and the liquid crystal substrate transfer arm 63 is introduced into the liquid crystal substrate cassette 66. The liquid crystal substrate P inside the liquid crystal substrate cassette 66 descends, and pads 64b provided on the liquid crystal substrate transport arm 63
It is placed in the suction hole 64a via. Then, the suction device is activated and the liquid crystal substrate P is vacuum-sucked. At this time, the surface of the liquid crystal substrate P is not scratched because it is adsorbed through the pad 64b which is an elastic material. Further, even if there is dust adhering to the surface of the liquid crystal substrate P or wrinkles on the protective cover applied to the surface, the suction force does not decrease because a gap cannot be formed. For this reason, displacement is unlikely to occur, and suction and retention are ensured.
Next, the slider 62 slides in the R2 direction, and the liquid crystal substrate transfer arm 63 leaves the liquid crystal substrate cassette 66 while holding the liquid crystal substrate P and is transported to the vicinity of the TAB substrate mounting apparatus 10.

The liquid crystal substrate P transported to the vicinity of the TAB substrate mounting apparatus 10 is transferred to the liquid crystal substrate transport stage 20 shown in FIG. Then, the suction device is activated and the liquid crystal substrate P is vacuum-sucked. At this time, the surface of the liquid crystal substrate P is not scratched because it is adsorbed to the adsorption holes 26a via the pads 26b made of an elastic material. Further, even if there is dust adhering to the surface of the liquid crystal substrate P or wrinkles on the protective cover applied to the surface, the suction force does not decrease because a gap cannot be formed. For this reason, displacement is unlikely to occur, and suction and retention are ensured. The liquid crystal substrate transfer stage 20 is precisely positioned by the drive devices 21a and 22a.

After the positioning, the mounting head 41 descends to bring the TAB substrate R sucked by the suction plate 41a into contact with the predetermined position Q of the liquid crystal substrate P. On the other hand, the backup head 41 contacts from the opposite side of the liquid crystal substrate P.
At this time, the shock caused by the contact between the mounting head 41 and the backup head 51 is absorbed by the pad 26b of the suction hole 26a. Further, in the mounting head 41, the impact due to the contact is further absorbed by the rubber sheet 42. Therefore, the suction plate 41 that sucks the TAB substrate R
The unevenness of the parallelism of a is reduced by the rubber sheet 42, and uniform surface contact is performed. Therefore, it is possible to prevent positional displacement during the mounting operation.

The TAB substrate R is adsorbed and held by the mounting head 41, and the TAB substrate R is pressed against a predetermined position of the liquid crystal substrate P by the support of the backup head 51.
The TAB board R is attached. At this time, even if the liquid crystal substrate P is tilted by the impact of the mounting head 41 and the backup head 51, the pad 26b does not form a gap between the suction hole 26a and the liquid crystal substrate P, so that the suction force does not decrease. Further, since the impact of the mounting head 41 and the backup head 51 is softened, the precisely positioned liquid crystal substrate P is less likely to be displaced.

As described above, in this embodiment, the liquid crystal substrate P
When the liquid crystal substrate P is held, the pads 26b and 64b can hold the liquid crystal substrate P without damaging it.
Even if the mounting head 41 or the like is impacted and tilted at the time of mounting the TAB substrate R, the suction force does not decrease and the mounting head 41 can be securely held.

On the other hand, in the mounting head 41, the rubber sheet 4
2 makes it possible to absorb the shock when the TAB substrate R is mounted, and prevent the displacement due to the shock. Further, even if the suction plate 41a has unevenness in flatness, the TAB substrate R can be made to follow the liquid crystal substrate P by the rubber sheet 42, and uniform surface contact can be achieved. Therefore, it is possible to prevent the positional deviation during the mounting operation, and it is possible to mount the TAB board R accurately.

Further, the rubber sheet 42 is mechanically simpler than the case where a spring is used as the shock absorbing member, and is easily attached. Further, the rubber sheet 42 can be used as a seal member between the mounting tool 43 and the mounting head 41. Further, the rubber sheet 42 is easier to arrange in the vicinity of the TAB substrate R than in the case of the spring sheet, in terms of design. Therefore, even when the TAB substrate R and the liquid crystal substrate P are brought into contact with the liquid crystal substrate P without being held in parallel with each other, the positional deviation between the lead portion of the liquid crystal substrate P and the outer lead of the TAB substrate R is minimized. You can keep it to the limit.

The present invention is not limited to the above embodiment. That is, in the above embodiment, the suction hole of the substrate holding mechanism is provided with the pad, but it may be used instead of the suction plate of the mounting head. Therefore, when the TAB substrate R is suction-held, the method of interposing the rubber sheet is effective so as not to damage the outer leads of the TAB substrate R. Of course, various modifications can be made without departing from the scope of the present invention.

[0030]

According to the present invention, a pad is provided in the suction hole for sucking and holding, and the liquid crystal substrate or the like is vacuum sucked and held through the pad. Therefore, it is possible to prevent a suction failure and a positional shift when the liquid crystal substrate or the like is transported or mounted in the substrate transport device or the substrate mounting device. Further, it is possible to hold the liquid crystal substrate and the like without damaging it.

On the other hand, since the mounting head and the driving means are connected via the elastic material, it is possible to reduce the impact when the TAB substrate is brought into contact with the liquid crystal substrate or the like. Furthermore, since it is possible to make uniform surface contact with the mounting surface, it is possible to prevent positional displacement due to the mounting operation, and it is possible to obtain highly accurate mounting.

[Brief description of drawings]

FIG. 1 is a perspective view showing a TAB board mounting apparatus incorporated in a TAB board mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a liquid crystal substrate transfer stage incorporated in the same TAB substrate mounting apparatus, FIG.
(B) is sectional drawing cut | disconnected by the EE line in (a), and seen from the arrow direction.

3A and 3B are views showing a mounting head incorporated in the same apparatus, in which FIG. 3A is a front view and FIG. 3B is a side view.

FIG. 4 is a perspective view showing a liquid crystal substrate transfer mechanism incorporated in the TAB substrate mounting apparatus according to the embodiment.

FIG. 5 is a cross-sectional view of the liquid crystal substrate transport arm incorporated in the liquid crystal substrate transport mechanism incorporated in the TAB substrate mounting apparatus according to the embodiment, taken along line FF in FIG.

[Explanation of symbols]

10 ... TAB board mounting device 20 ... Board transfer stages 21, 22 ... Transfer rails 21a, 22a ...
Drive device 23 ... Slider 24 ... Holding part 25 ... Arm 26 ... Suction part 26a ... Suction hole 26b ... Pad 27 ... Suction path 28 ... Suction device 30 ... TAB substrate mounting mechanism 40 ... Mounting head mechanism 41 ... Mounting head 41a ... Suction plate 41b ... Suction hole 42 ... Rubber sheet 43 ... Mounting tool 44 ... Slide shaft 45 ... Driving device 46 ... Tube 47 ... Suction device 50 ... Backup head mechanism 51 ... Backup head 60 ... Liquid crystal substrate transport device 61 ... Transport rail 62 ... Slider 62 ... Drive device 63 ... Liquid crystal substrate transfer arm 64 ... Adsorption part 64a ... Adsorption hole 64b ... Pad 65 ... Suction device 66 ... Liquid crystal substrate cassette

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/60 311 T 7726-4E 21/68 P B H05K 13/04 B

Claims (3)

[Claims] 1. A suction holding device for sucking and holding a work, a device main body, a suction hole formed in the device main body, suction means for generating a suction force in the suction hole, and the suction hole being attached to the suction hole. A suction holding device, comprising: an elastic pad that elastically holds the workpiece sucked into the suction hole. 2. A suction holding device for holding a flat work by suction, a device body, a suction head having a suction hole attached to the device body via an elastic member, and a suction force generated in the suction hole. A suction holding device comprising: 3. A first drive unit driven in the XY directions and having a suction hole for sucking and holding a work, a suction means for generating a suction force in the suction hole, and attached to the suction hole. A first suction holding device including an elastic pad that elastically holds the substrate sucked in the suction holes, a second driving unit driven in the Z direction, and an elastic member for the second driving unit. A suction head portion having a suction hole attached via the suction head portion, a suction means for generating a suction force in the suction hole, and a second suction holding device for sucking an electronic component through the suction hole. Mounting device characterized by.