JP2004273756A

JP2004273756A - Device and method for fixing substrate

Info

Publication number: JP2004273756A
Application number: JP2003062245A
Authority: JP
Inventors: Tomoaki Nakanishi; 智昭中西
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2003-03-07
Filing date: 2003-03-07
Publication date: 2004-09-30
Anticipated expiration: 2023-03-07
Also published as: JP3922192B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method by which various kinds of substrates are fixed certainly by means of a simple mechanism. <P>SOLUTION: In a substrate fixing device which is positioned to the mounting position of an electronic component mounting device and fixes a substrate 13 held by a carrier 11 by receiving the substrate 13 from the downside, the carrier 11 is caused to hold the substrate 13 and a substrate contacting member 15 is positioned above a receiving member 5 in a state where the member 15 is placed on the top surface of the substrate 13. When the substrate 13 is received by means of the receiving member 5, the substrate 13 is held by suction by bringing a receiving surface 7a into contact with the bottom surface of the carrier 11 by lowing transport rails 10 and, at the same time, the substrate 13 is fixed by pressing the substrate 13 against the carrier 11 by exerting draw-in forces on the contacting member 5 from suction pads 8 by bringing the pads 8 into contact with the the member 15 through openings 11a and, at the same time, pressing the carrier 11 against the receiving surface 7a. Consequently, various kinds of substrates are fixed certainly with the simple mechanism. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば電子部品実装装置において基板を下受けして固定する基板固定装置および基板固定方法に関するものである。
【０００２】
【従来の技術】
電子部品実装装置では、基板に電子部品を実装する実装位置において基板の位置と姿勢を固定するための基板固定装置が用いられる。この基板固定装置では、基板を水平方向に位置決めするとともに、基板の反り変形を矯正して上面を正しく面合わせする必要がある。従来よりこの面合わせの方法として、基板の下面を支持する下受け部材によって基板を真空吸着する方法（例えば特許文献１参照）や、基板搬送用のキャリアに反り変形矯正用の基板押さえ部を設けたものを用いる方法などが知られている（例えば特許文献２参照）。
【０００３】
【特許文献１】
特開２００２−１３４９９２号公報
【特許文献２】
特開平５−２９９８２８号公報
【０００４】
【発明が解決しようとする課題】
しかしながら上記従来の方法には、次のような難点がある。まず、特許文献１に示すような真空吸着による方法は、基板の剛性がある程度以上あって姿勢保持が容易で、かつ基板に真空吸着を妨げる貫通孔が存在しないような基板に対しては有効であるものの、個片分割用のスリットが予め形成されたタイプの基板などに対しては適用が困難である。
【０００５】
また特許文献２に示すような基板押さえ部を用いる方法では、基板の反りをある程度矯正することは可能であるものの、フレキシブル基板などフィルム状で薄く反り変形の大きい種類の基板に対しては、正しく面合わせした状態で基板を確実に固定することができない。このため従来形状や厚みの異なる種々の基板を対象とする場合には、ねじ式やばね式のクランプ機構などの基板押さえ機構を備えた専用治具を用いることが考えられるが、この場合には多種類の基板を簡易な機構で固定することが困難である。
【０００６】
そこで本発明は、様々な種類の基板を確実かつ簡易的な機構で固定することができる基板固定装置および基板固定方法を提供することを目的とする。
【０００７】
【課題を解決するための手段】
請求項１記載の基板固定装置は、基板搬送用のキャリアに保持された基板を作業位置において下方から下受けして固定する基板固定装置であって、前記作業位置に配置され上面に前記キャリアに当接して下受けする下受け面が設けられた下受け部材と、前記基板の上面に載置され下面が基板の上面に当接する基板当接部材と、前記下受け部材の上方に位置する前記基板当接部材に吸引力を作用させることにより前記基板を前記キャリアに押し付けるとともにこのキャリアを前記下受け面に押し付けて固定する吸引手段とを備えた。
【０００８】
請求項２記載の基板固定装置は、請求項１記載の基板固定装置であって、前記基板当接部材は前記作業位置に基板を搬送する基板搬送手段に取り付けられ、この基板搬送手段に対して前記下受け部材を相対的に昇降させる昇降手段を備えた。
【０００９】
請求項３記載の基板固定装置は、請求項１または２記載の基板固定装置であって、前記吸引手段は、前記基板当接部材を真空吸着するために前記下受け部材に設けられた吸引部およびこの吸引部から真空吸引する真空吸引手段である。
【００１０】
請求項４記載の基板固定装置は、請求項３記載の基板固定装置であって、前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着する。
【００１１】
請求項５記載の基板固定装置は、請求項４記載の基板固定装置であって、前記基板当接部材が可撓性部材である。
【００１２】
請求項６記載の基板固定装置は、請求項１または２記載の基板固定装置であって、前記基板当接部材が磁性体であり、前記吸引手段は、前記基板当接部材を磁力により吸引するために前記下受け部材に設けられた引磁手段である。
【００１３】
請求項７記載の基板固定方法は、基板搬送用のキャリアに保持された基板を作業位置において下方から下受けして固定する基板固定方法であって、前記作業位置に配置され上面に前記キャリアに当接して下受けする下受け面が設けられた下受け部材の上方に、前記キャリアに保持され且つ基板当接部材が上面に載置された基板を位置させる位置合わせ工程と、この下受け部材の上方に位置する前記基板当接部材に吸引手段によって吸引力を作用させることにより前記基板を前記キャリアに押し付けるとともにこのキャリアを前記下受け面に押し付けて固定する基板固定工程とを含む。
【００１４】
請求項８記載の基板固定方法は、請求項７記載の基板固定方法であって、前記基板当接部材は、前記作業位置に基板を搬送する基板搬送手段に取り付けられ、前記基板固定工程に先立ってこの基板搬送手段に対して前記下受け部材を相対的に昇降させる基板昇降工程を含む。
【００１５】
請求項９記載の基板固定方法は、請求項７または８記載の基板固定方法であって、前記基板固定工程において、前記下受け部材に設けられた吸引部から真空吸引することにより前記基板当接部材を真空吸着する。
【００１６】
請求項１０記載の基板固定方法は、請求項９記載の基板固定方法であって、前記基板には基板を貫通する基板貫通孔が設けられており、この基板貫通孔の少なくとも一部を介して前記基板当接部材を真空吸着する。
【００１７】
請求項１１記載の基板固定方法は、請求項１０記載の基板固定方法であって、前記基板当接部材が可撓性部材である。
【００１８】
請求項１２記載の基板固定方法は、請求項７または８記載の基板固定方法であって、前記基板当接部材が磁性体であり、前記基板固定工程において、前記下受け部材に設けられた引磁手段によって前記基板当接部材を磁力により吸引する。
【００１９】
本発明によれば、作業位置に配置されキャリアに当接して下受けする下受け面が設けられた下受け部材の上方に、キャリアによって保持され基板当接部材が上面に載置された基板を位置させ、基板当接部材に吸引手段によって吸引力を作用させて基板をキャリアに押し付けるとともにキャリアを下受け面に押し付けて固定することにより、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【００２０】
【発明の実施の形態】
（実施の形態１）
図１は本発明の実施の形態１の基板固定装置の斜視図、図２は本発明の実施の形態１の基板固定装置の側面図、図３は本発明の実施の形態１の基板固定装置の部分断面図である。
【００２１】
まず図１を参照して基板固定装置の構造を説明する。この基板固定装置は、電子部品実装装置の実装位置（作業位置）に配置され、フレキシブル基板など薄くて撓み易い基板を対象として、基板搬送用のキャリアに保持された状態の基板を下方から下受けして固定する機能を有するものである。図１において、Ｘテーブル２、Ｙテーブル３より成る移動テーブル１上には、ベースプレート４が装着されており、ベースプレート４の上面の中央部には、基板を下受けして高さ位置を保持する下受け部材５が配設されている。
【００２２】
下受け部材５は、矩形のブロック５ａの上面に凸部７を設けた形状となっており、凸部７の上面は基板を保持したキャリアの下面に当接して下受けする下受け面７ａとなっている。下受け面７ａには、キャリア吸着用の吸着溝７ｂおよび後述する基板当接部材吸着用の吸着パッド８が設けられている。吸着溝７ｂおよび吸着パッド８は、吸引管１７を介して真空吸引手段１８に接続されている。
【００２３】
ベースプレート４上面の下受け部材５の両側方には、シリンダ９が垂直姿勢で配設されており、シリンダ９のロッド９ａはＸ方向に配設された搬送レール１０に結合されている。搬送レール１０上では薄いフィルム状の基板１３を保持したキャリア１１が図示しない搬送機構によって搬送され、実装位置に位置決めされる。
【００２４】
基板１３は、板状の基板当接部材１５とキャリア１１との間に挟み込まれた形で搬送され、この実装位置において、基板１３の部品実装位置１３ａには、基板当接部材１５に設けられた開口部１５ａを介して電子部品１６が実装ヘッド（図示省略）によって実装される。なお、図１においては、キャリア１１を搬送レール１０から、また基板当接部材１５をキャリア１１から離した状態を示している。搬送レール１０は、基板１３を搬送して位置決めする基板搬送手段となっている。
【００２５】
シリンダ９を駆動することにより、搬送レール１０はガイド部材１０ａによって案内されて上下動する。搬送レール１０はキャリア１１の両側部を下方から支持する支持部となっており、シリンダ９は、キャリア１１に保持された基板１３を下受け部材５に対して相対的に昇降させる昇降手段となっている。搬送レール１０を下降させた状態では、キャリア１１の下面は下受け面７ａに当接し、上下方向の位置が固定される。
【００２６】
ここでキャリア１１および基板１３の上面に載置される基板当接部材１５について説明する。キャリア１１は矩形の板部材であり、上面に基板１３全体を載置可能な大きさとなっている。キャリア１１の長手方向の両端部には、下受け面７ａの吸着パッド８に対応した位置に吸着パッド８が挿通可能な大きさの開口部１１ａが設けられている。
【００２７】
キャリア１１の上面には、基板当接部材１５の対角コーナ部、基板１３の対角コーナ部に相当する位置に、それぞれ位置決めピン１２ａ、１２ｂが立設されている。基板１３に設けられた位置決め孔１３ｂに位置決めピン１２ｂを嵌合させることにより、基板１３はキャリア１１に対して位置決め状態で保持される。そしてさらにこの基板１３の上に基板当接部材１５を重ね、基板当接部材１５に設けられた位置決め孔１５ｂに位置決めピン１２ａを嵌合させることにより、基板当接部材１５はキャリア１１に対して位置決めされる。
【００２８】
基板１３をキャリア１１に保持させ、さらに基板当接部材１５を載置した状態で搬送レール１０を下降させると、下受け面７ａがキャリア１１の下面に当接するとともに、吸着パッド８がキャリア１１の開口部１１ａを挿通して基板当接部材１５の下面に当接する。
【００２９】
下受け面７ａの吸着溝７ｂは、基板１３の各部品実装位置１３ａを囲むように配置されており、下受け面７ａにキャリア１１が当接した状態で真空吸引手段１８を駆動することにより、キャリア１１は下受け面７ａに真空吸着により保持される。これとともに、基板当接部材１５は吸着パッド８によって下面側から吸引され、この吸引力によって基板１３はキャリア１１に押し付けられ、さらにキャリア１１が下受け面７ａに対して押し付けられ固定される。このようにして位置決めされ固定された基板１３に対して、電子部品１６が実装される。
【００３０】
上記構成において、吸着パッド８は基板当接部材５を真空吸着するために下受け部材５に設けられた吸引部となっている。そして吸着パッド８および真空吸引手段１８は、下受け部材５の上方に位置する基板当接部材１５に吸引力を作用させることにより、基板１３をキャリア１１に押し付けるとともに、このキャリアを下受け面７ａに押し付けて固定する吸引手段となっている。
【００３１】
次に図２、図３を参照して基板固定方法について説明する。まず、基板１３が載置され、さらにその上から基板当接部材１５が装着されたキャリア１１を搬送レール１０によって搬送して図２（ａ）に示すように、実装位置に配置された下受け部材５上に位置させる（位置合わせ工程）。図３（ａ）は、このときのキャリア１１および下受け部材５のＹ方向の断面を示しており、基板１３の下方および基板１３の前後両端側には吸着溝７ｂ、吸着パッド８がそれぞれ位置している。
【００３２】
図２（ｂ）、図３（ｂ）は、シリンダ９のロッド９ａを没入させて搬送レール１０を下降させ、吸引管１７から真空吸引した状態を示している。この状態では、キャリア１１の下面が下受け面７ａに当接して支持され、搬送レール１０から離れる。そしてキャリア１１の下面が吸着溝７ｂによって真空吸引されるとともに、基板当接部材１５の下面には吸着パッド８が当接し、基板当接部材１５には真空吸引による吸引力が作用する。そしてこの吸引力により、基板１３がキャリア１１に対して押し付けられるとともに、キャリア１１が下受け面７ａに押し付けられ固定される（基板固定工程）。
【００３３】
これにより、フィルム状のフレキシブル基板など、薄くて撓みやすい基板１３を対象とする場合にあっても、基板１３を安定した状態で位置決めし、固定することができる。このとき、基板当接部材１５の装着は、ねじやばねを用いた基板クランプ機構を必要とせず、単に位置決め孔によってキャリア１１に位置合わせして載置するのみでよい。このためキャリア製作コストを低減するとともに、基板をキャリアにセットする際の作業を簡略化することができる。
【００３４】
なお上記実施の形態では、キャリア１１を吸引するための吸着溝７ｂと、基板当接部材１５を吸引するための吸着パッド８を共通の真空吸引回路に接続して同時に真空吸引する例を示しているが、基板吸引用と基板当接部材吸引用とにそれぞれ個別の真空吸引回路を設けるようにしてもよい。これにより、キャリアと基板当接部材をそれぞれ適正吸引力・適正タイミングで吸引することができ、さらに安定した基板固定が実現される。以下に示す各実施の形態において、真空吸引によって基板および基板当接部材を固定する場合についても同様である。
【００３５】
（実施の形態２）
図４は本発明の実施の形態２の基板固定装置の動作説明図である。本実施の形態２は、実施の形態１において予め基板１３とともにキャリア１１に装着される基板当接部材１５を、実装位置に固定的に取り付けるようにしたものである。本実施の形態においては、基板１３はキャリア１１に保持され上面がフリーな状態で搬送される。
【００３６】
図４（ａ）において、位置決めテーブル１上のベースプレート４には、実施の形態１と同様の下受け部材５が配置されており、下受け部材５の側方には、実施の形態１と同様に搬送レール１０がシリンダ９によって昇降自在に配設されている。搬送レール１０の下降時の高さ位置は、搬送レール１０に設けられた位置決め部材２１が、ベースプレートに設けられたストッパボルト２０に当接することによって位置決めされる。
【００３７】
下受け部材５の上方に位置する搬送レール１０の上面には、フィルム状の可撓性部材よりなる基板当接部材１５Ａがボルト固定によって取り付けられている。搬送レール１０には、上流側から搬送され基板当接部材１５Ａの下方に入り込んだキャリア１１が位置決めされ、下受け部材５の上方に位置する（位置合わせ工程）。キャリア１１には予め基板１３がセットされており、基板１３は、キャリア１１に設けられた位置決めピン１２によって、キャリア１１に対して位置合わせされている。
【００３８】
基板当接部材１５Ａには、図１に示す基板当接部材１５と同様の開口部が設けられており、この開口部は実施の形態１に示す開口部１５ａと同様にキャリア１１に保持された基板１３の部品搭載位置１３ａに対応している。さらに基板当接部材１５Ａには、基板１３の幅よりも外側に相当する位置に、基板当接部材１５Ａを構成する膜を蛇腹状に折り曲げた屈曲部２２が長手方向に連続して設けられている。これにより屈曲部２２より内側の基板当接部材１５Ａは、屈曲部２２を介して上下方向の変位が許容されるようになっている。
【００３９】
図４（ｂ）は、シリンダ９のロッド９ａを没入させて搬送レール１０を下降させ、図２（ｂ）と同様に吸着溝７ｂおよび吸着パッド８から真空吸引した状態を示している。搬送レール１０を下降させることにより、まずキャリア１１の下面が下受け面７ａに当接して支持され、搬送レール１０から離れる。そして位置決め部材２１がストッパボルト２０に当接し、搬送レール１０が高さ方向に位置決めされる。
【００４０】
これにより、基板１３の下面が吸着溝７ｂによって真空吸引されるとともに、基板当接部材１５Ａの下面に吸着パッド８が当接し、基板当接部材１５Ａには真空吸引による吸引力が作用する。そしてこの吸引力により、基板当接部材１５Ａが下方に変位して基板１３を下受け面７ａに押し付け固定する（基板固定工程）。
【００４１】
すなわち上記構成では、基板当接部材１５Ａは実装位置に基板１３を搬送する搬送レール１０に取り付けられ、この搬送レール１０に対して下受け部材５を相対的に昇降させる昇降手段を備えた構成となっている。そして本実施の形態２における下受け部材５による基板固定においては、基板固定工程に先立って、搬送レール１０を下降させて、搬送レール１０に対して下受け部材５を相対的に昇降させる基板昇降工程を含む形態となっている。この構成によれば、基板１３を保持するキャリア１１に実施の形態１のような基板当接部材１５をその都度載置する必要が無く、キャリア１１への基板装着作業をさらに簡略化することができる。
【００４２】
（実施の形態３）
図５は本実施の形態３の基板固定装置の部分斜視図である。図５は、図１に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、キャリア、基板および基板当接部材のみを示しており、図外の位置決めテーブル、搬送レール、真空吸引手段などは、図１に示す実施の形態１と同様である。
【００４３】
図５において、基板１３１には複数の部品搭載位置１３１ａが形成されており、各部品搭載位置１３１ａの両側にはスリット１３１ｃが長手方向に形成されている。基板１３１は、スリット１３１ｃに対応した位置に長手方向に連続したスリット１１１ａが設けられたキャリア１１１に保持される。基板１３１のキャリア１１１への位置決めは、基板１３１の位置決め穴１３１ｂにキャリア１１１の位置決めピン１２を嵌合させることにより行われる。そして、部品搭載位置１３１ａに対応した開口部１５１ａが設けられた基板当接部材１５１は、同じ位置決めピン１２を位置決め孔１５１ｂに嵌合させることによって、基板１３１の上面に位置合わせされ載置される。
【００４４】
下受け部材５１に設けられた凸部７１の上面はキャリア１１１の下面に当接して下受けする下受け面７１ａとなっており、下受け面７１ａには、スリット１３１ｃの位置に対応して長手方向に連続した吸着溝７１ｂが形成されている。下受け部材５によってキャリア１１１に保持された基板１３１を下受けして固定する際には、基板１３１を保持したキャリア１１１の下面に下受け面７１ａを当接させ、吸着溝７１ｂから真空吸引する。
【００４５】
これにより、下受け部材５１に設けられた吸引部である吸着溝７１ｂから、キャリア１１１のスリット１１ａおよび基板１３１のスリット１３１ｃを介して基板当接部材１５１に対して真空吸引による吸引力が作用する。そしてこの吸引力により、基板１３１がキャリア１１１に対して押し付けられるとともに、キャリア１１１が下受け面７１ａに押し付けられ固定される。すなわち、本実施の形態３においては、基板１３１には基板１３１を貫通する基板貫通孔としてのスリット１３１ｃが設けられており、この基板貫通孔の少なくとも一部を介して基板当接部材１５１を真空吸着する形態となっている。なお基板当接部材１５１として、テープや樹脂フィルムの様な可撓性部材採用してもよい。
【００４６】
（実施の形態４）
図６は本実施の形態４の基板固定装置の部分斜視図である。図６は、図１に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、キャリア、基板および基板当接部材のみを示しており、図外の位置決めテーブル、搬送レールなどは、図１に示す実施の形態１と同様である。
【００４７】
図６において、基板１３２には格子状に複数の部品搭載位置１３２ａが形成されており、各部品搭載位置１３２ａを区分する境界には、個片分割用のスリット１３２ｃが縦横方向に形成されている。基板１３２は矩形平板状のキャリア１１２に保持され、基板１３２のキャリア１１２への位置決めは、基板１３２の位置決め穴１３２ｂに、キャリア１１２の位置決めピン１２を嵌合させることにより行われる。ここでキャリア１１２は非磁性の金属（例えばオーステナイト系ステンレス鋼など）を矩形平板状に加工したものである。
【００４８】
基板１３２の上面に載置される基板当接部材１５２は、磁性体の金属（例えばマルテンサイト系ステンレス鋼など）で製作されている。基板当接部材１５２には部品搭載位置１３２ａに対応した開口部１５２ａが格子状に設けられており、基板当接部材１５２は、キャリア１１２の同じ位置決めピン１２を位置決め孔１５２ｂに嵌合させることによって、基板１３２の上面に位置合わせされる。
【００４９】
下受け部材５２に設けられた凸部７２の上面はキャリア１１２の下面に当接して下受けする下受け面７２ａとなっており、下受け面７２ａにはキャリア１１２を吸着保持するための吸着溝７２ｂが設けられており、さらに吸着溝７２ｂの内側には複数のマグネット２３が埋設されている。下受け部材５２によってキャリア１１２に保持された基板１３２を下受けして固定する際には、基板１３２を保持したキャリア１１２の下面に対して下受け面７２ａを当接させ、真空吸引手段１８（図１参照）を駆動して吸着溝７２ｂから真空吸引する。
【００５０】
これにより、キャリア１１２が下受け面７２ａに吸着されるとともに、下受け部材５２に設けられた引磁手段であるマグネット２３によって、キャリア１１２および基板１３２を介して磁性体の基板当接部材１５２に対して吸引力としての磁力が作用する。そしてこの吸引力により、基板１３２はキャリア１１２に対して押し付けられるとともに、このキャリア１１２が下受け面７２ａに押し付けられ固定される。すなわち、本実施の形態４においては、基板当接部材１５２が磁性体であり、マグネット２３が基板１５２を磁力によって吸引する吸引手段となっている。
【００５１】
（実施の形態５）
図７は本実施の形態５の基板固定装置の部分斜視図である。図７は、図１に示す基板固定装置と同様の機能を有する基板固定装置を構成する各部のうち、下受け部材、キャリア、基板および基板当接部材のみを示しており、図外の位置決めテーブルや真空吸引手段などは、図１に示す実施の形態１と同様である。
【００５２】
図７において、基板１３３は小型のパッケージ基板であり、複数個がキャリア１１３に保持されて一括して取り扱われる。キャリア１１３には、基板１３３を１個づつ収容する矩形凹部状の基板収容部１１３ａが格子状に形成されており、基板収容部１１３ａの底面には、基板１３３を吸着保持するための吸引孔１１３ｃが設けられている。基板収容部１１３ａが幅方向（搬送方向と直交する方向）に並んだ各列の間には、キャリア１１３の厚みを貫通するスリット１１３ｂが幅方向に設けられている。
【００５３】
各基板収容部１１３ａ内に基板１３３を収容したキャリア１１３には、上面全体を覆って薄膜状のキャリア１５３が載置される。キャリア１５３には、基板収容部１１３ａの位置に対応して開口部１５３ａが格子状に設けられており、キャリア１１３に設けられた位置決めピン１２を位置決め孔１５３ｂに嵌合させることにより、基板当接部材１５３はキャリア１１３に位置合わせされる。そして部品実装時には、キャリア１１３ごと位置決めされ固定された複数の基板１３３に対して、開口部１５３ａを介して基板１３３に電子部品１６が搭載される。
【００５４】
下受け部材５３に設けられた凸部７３の上面は、キャリア１１３の下面に当接して下受けする下受け面７３ａとなっており、下受け面７３ａには、キャリア１１３のスリット１１３ｂの位置に対応して吸着溝７３ｂが幅方向に形成されている。さらに下受け面７３ａには、基板収容部１１３ａの各列位置に対応した位置に、吸着溝７３ｃが幅方向に連続して形成されている。真空吸引手段１８（図１参照）を駆動することにより、吸着溝７３ｂ、７３ｃから真空吸引する。
【００５５】
下受け部材５３によってキャリア１１３に保持された基板１３３を下受けして固定する際には、上面に基板当接部材１５３が載置された状態のキャリア１１３の下面に下受け面７３ａを当接させ、吸着溝７３ｂ、７３ｃから真空吸引する。吸着溝７３ｃからの真空吸引により、吸引孔１１３ｃを介して各基板収容部１１３ａ内が真空吸引され、これにより基板１３３は各基板収容部１１３ａ内に吸着保持される。
【００５６】
そして吸着溝７３ｃからの真空吸引により、キャリア１１３のスリット１１３ｂを介して真空吸引による吸引力が基板当接部材１５３に対して作用する。そしてこの吸引力により、基板１３３がキャリア１１３に対して押し付けられるとともに、キャリア１１３が下受け面７３ａに押し付けられ固定される。なお基板収容部１１３ａの深さは、基板１３３を基板収容部１１３ａに収容した状態において、基板１３３の上面がキャリア１１３の上面よりもわずかに上に突出する寸法設定となっている。
【００５７】
上記各実施の形態において示したように、本発明の基板固定装置は、キャリアに保持された状態の基板の上面に載置された基板当接部材に対して、下受け部材から吸引力を作用させることにより、基板をキャリアに対して押し付けるとともにこのキャリアを下受け部材に押し付けるようにしたものである。
【００５８】
これにより、個片分割用のスリットが予め形成された基板であっても、確実に下受けして固定することができる。またフレキシブル基板などフィルム状で薄く反り変形の大きい種類の基板であっても、基板押さえ機構を備えた専用治具を用いること無く、反りを矯正した状態で固定することができ、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【００５９】
【発明の効果】
本発明によれば、作業位置に配置されキャリアに当接して下受けする下受け面が設けられた下受け部材の上方に、キャリアによって保持され基板当接部材が上面に載置された基板を位置させ、基板当接部材に吸引手段によって吸引力を作用させて基板をキャリアに押し付けるとともにキャリアを下受け面に押し付けて固定するようにしたので、様々な種類の基板を確実かつ簡易的な機構で固定することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の基板固定装置の斜視図
【図２】本発明の実施の形態１の基板固定装置の側面図
【図３】本発明の実施の形態１の基板固定装置の部分断面図
【図４】本発明の実施の形態２の基板固定装置の動作説明図
【図５】本発明の実施の形態３の基板固定装置の部分斜視図
【図６】本発明の実施の形態４の基板固定装置の部分斜視図
【図７】本発明の実施の形態５の基板固定装置の部分斜視図
【符号の説明】
５、５１，５２，５３下受け部材
７ａ、７１ａ、７２ａ、７３ａ下受け面
７ｂ、７１ｂ、吸着溝
９シリンダ
１０搬送レール
１１キャリア
１２位置決めピン
１３、１３１，１３２，１３３基板
１５，１５１，１５２，１５３基板当接部材
１８真空吸引手段
２３マグネット[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a board fixing device and a board fixing method for receiving and fixing a board in an electronic component mounting apparatus, for example.
[0002]
[Prior art]
2. Description of the Related Art In an electronic component mounting apparatus, a substrate fixing device for fixing a position and a posture of a substrate at a mounting position for mounting an electronic component on the substrate is used. In this substrate fixing device, it is necessary to position the substrate in the horizontal direction, correct the warpage of the substrate, and properly align the upper surface. Conventionally, as a method of this surface matching, a method of vacuum-sucking a substrate by a lower receiving member that supports the lower surface of the substrate (see, for example, Patent Document 1), or a method of correcting a warpage and providing a substrate pressing portion on a substrate-transporting carrier. A method using such a method is known (for example, see Patent Document 2).
[0003]
[Patent Document 1]
JP 2002-134992 A
[Patent Document 2]
JP-A-5-299828
[0004]
[Problems to be solved by the invention]
However, the above-mentioned conventional method has the following disadvantages. First, the method using vacuum suction as disclosed in Patent Document 1 is effective for a substrate in which the rigidity of the substrate is more than a certain level, the posture can be easily maintained, and there is no through hole in the substrate that prevents vacuum suction. However, it is difficult to apply the method to a substrate or the like in which a slit for dividing an individual piece is formed in advance.
[0005]
Further, in the method using the substrate pressing portion as disclosed in Patent Document 2, although it is possible to correct the warpage of the substrate to a certain extent, it is correctly applied to a thin film-type substrate such as a flexible substrate which has a large warp deformation. The substrate cannot be reliably fixed in a state where the surfaces are aligned. For this reason, when targeting various substrates having different conventional shapes and thicknesses, it is conceivable to use a dedicated jig provided with a substrate holding mechanism such as a screw type or a spring type clamping mechanism. It is difficult to fix various types of substrates with a simple mechanism.
[0006]
Therefore, an object of the present invention is to provide a substrate fixing device and a substrate fixing method capable of fixing various types of substrates with a simple and simple mechanism.
[0007]
[Means for Solving the Problems]
The substrate fixing device according to claim 1, wherein the substrate held by the carrier for transporting the substrate is fixed at a work position by receiving the substrate from below at a work position. A lower receiving member provided with a lower receiving surface for abutting and receiving the lower receiving member; a substrate contacting member placed on the upper surface of the substrate and having a lower surface contacting the upper surface of the substrate; and A suction means is provided for pressing the substrate against the carrier by applying a suction force to the substrate contact member, and pressing and fixing the carrier against the lower receiving surface.
[0008]
The substrate fixing device according to claim 2 is the substrate fixing device according to claim 1, wherein the substrate contact member is attached to a substrate transfer unit that transfers the substrate to the work position. Elevating means for relatively elevating and lowering the lower receiving member is provided.
[0009]
The substrate fixing device according to claim 3 is the substrate fixing device according to claim 1 or 2, wherein the suction unit is provided on the lower receiving member for vacuum-sucking the substrate contact member. And vacuum suction means for performing vacuum suction from the suction unit.
[0010]
According to a fourth aspect of the present invention, there is provided the substrate fixing apparatus according to the third aspect, wherein the substrate is provided with a substrate through hole penetrating the substrate, and at least a part of the substrate through hole is provided. The substrate contact member is vacuum-sucked.
[0011]
A substrate fixing device according to a fifth aspect is the substrate fixing device according to the fourth aspect, wherein the substrate contact member is a flexible member.
[0012]
The substrate fixing device according to claim 6 is the substrate fixing device according to claim 1 or 2, wherein the substrate contact member is a magnetic material, and the suction unit suctions the substrate contact member by magnetic force. Magnetic attraction means provided on the lower receiving member.
[0013]
8. The substrate fixing method according to claim 7, wherein the substrate held by the carrier for transporting the substrate is fixed by receiving the substrate from below at a working position, wherein the substrate is disposed at the working position and attached to the carrier on an upper surface. An alignment step of positioning a substrate held by the carrier and having a substrate abutting member placed on an upper surface thereof above a lower receiving member provided with a lower receiving surface for abutting and receiving the lower receiving member; A substrate fixing step of pressing the substrate against the carrier by applying a suction force to the substrate abutting member located above the substrate by a suction unit and pressing the carrier against the lower receiving surface.
[0014]
The substrate fixing method according to claim 8 is the substrate fixing method according to claim 7, wherein the substrate contact member is attached to a substrate transport unit that transports the substrate to the work position, and prior to the substrate fixing step. The method includes a substrate elevating step of elevating and lowering the lower receiving member with respect to the lever conveying means.
[0015]
A substrate fixing method according to a ninth aspect is the substrate fixing method according to the seventh or the eighth aspect, wherein, in the substrate fixing step, the substrate abutment is performed by vacuum suction from a suction portion provided on the lower receiving member. The member is vacuum-sucked.
[0016]
According to a tenth aspect of the present invention, there is provided the substrate fixing method according to the ninth aspect, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and at least a part of the substrate through-hole is provided. The substrate contact member is vacuum-sucked.
[0017]
A substrate fixing method according to an eleventh aspect is the substrate fixing method according to the tenth aspect, wherein the substrate contact member is a flexible member.
[0018]
A substrate fixing method according to a twelfth aspect of the present invention is the substrate fixing method according to the seventh or the eighth aspect, wherein the substrate contact member is a magnetic material, and in the substrate fixing step, the pull provided on the lower receiving member is provided. The substrate contact member is attracted by magnetic force by magnetic means.
[0019]
According to the present invention, a substrate on which a substrate contact member held by a carrier and placed on an upper surface is provided above a lower receiving member provided with a lower receiving surface which is disposed at a work position and abuts against a carrier to receive the lower surface. Positioning and applying a suction force to the substrate abutting member by the suction means to press the substrate against the carrier and press and fix the carrier against the lower receiving surface to securely fix various types of substrates with a simple mechanism can do.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
FIG. 1 is a perspective view of a substrate fixing device according to Embodiment 1 of the present invention, FIG. 2 is a side view of the substrate fixing device of Embodiment 1 of the present invention, and FIG. 3 is a substrate fixing device of Embodiment 1 of the present invention. FIG.
[0021]
First, the structure of the substrate fixing device will be described with reference to FIG. This substrate fixing device is disposed at a mounting position (working position) of an electronic component mounting device and targets a thin and flexible substrate such as a flexible substrate to a substrate held in a substrate carrying carrier from below. And has a function of fixing the position. In FIG. 1, a base plate 4 is mounted on a moving table 1 composed of an X table 2 and a Y table 3, and a central portion of an upper surface of the base plate 4 receives a substrate and holds a height position. A lower receiving member 5 is provided.
[0022]
The lower receiving member 5 has a shape in which a convex portion 7 is provided on the upper surface of a rectangular block 5a. Has become. The lower receiving surface 7a is provided with a suction groove 7b for sucking a carrier and a suction pad 8 for sucking a substrate contact member described later. The suction groove 7b and the suction pad 8 are connected to a vacuum suction means 18 via a suction pipe 17.
[0023]
On both sides of the lower receiving member 5 on the upper surface of the base plate 4, cylinders 9 are disposed in a vertical posture, and rods 9 a of the cylinders 9 are connected to transport rails 10 disposed in the X direction. On the transport rail 10, the carrier 11 holding the thin film-shaped substrate 13 is transported by a transport mechanism (not shown) and positioned at the mounting position.
[0024]
The board 13 is conveyed while being sandwiched between the plate-shaped board contact member 15 and the carrier 11. In this mounting position, the board 13 is provided at the component mounting position 13 a of the board contact member 15. The electronic component 16 is mounted by a mounting head (not shown) through the opening 15a. FIG. 1 shows a state in which the carrier 11 is separated from the transport rail 10 and the substrate contact member 15 is separated from the carrier 11. The transfer rail 10 serves as a board transfer unit that transfers and positions the board 13.
[0025]
By driving the cylinder 9, the transport rail 10 moves up and down while being guided by the guide member 10a. The transport rail 10 serves as a support for supporting both sides of the carrier 11 from below, and the cylinder 9 serves as an elevating means for elevating and lowering the substrate 13 held by the carrier 11 with respect to the lower receiving member 5. ing. When the transport rail 10 is lowered, the lower surface of the carrier 11 contacts the lower receiving surface 7a, and the position in the vertical direction is fixed.
[0026]
Here, the substrate contact member 15 placed on the upper surfaces of the carrier 11 and the substrate 13 will be described. The carrier 11 is a rectangular plate member, and has a size such that the entire substrate 13 can be placed on the upper surface. At both ends in the longitudinal direction of the carrier 11, openings 11a are provided at positions corresponding to the suction pads 8 on the lower receiving surface 7a, and are sized so that the suction pads 8 can be inserted therethrough.
[0027]
Positioning pins 12a and 12b are provided on the upper surface of the carrier 11 at positions corresponding to diagonal corners of the substrate contact member 15 and diagonal corners of the substrate 13, respectively. By fitting the positioning pins 12b into the positioning holes 13b provided in the substrate 13, the substrate 13 is held in a positioning state with respect to the carrier 11. Further, the board contact member 15 is superimposed on the board 13 and the positioning pins 12a are fitted into the positioning holes 15b provided in the board contact member 15, so that the board contact member 15 is Positioned.
[0028]
When the substrate 13 is held by the carrier 11 and the transport rail 10 is lowered with the substrate contact member 15 placed thereon, the lower receiving surface 7 a contacts the lower surface of the carrier 11 and the suction pad 8 The opening 11 a is inserted into contact with the lower surface of the substrate contact member 15.
[0029]
The suction groove 7b of the lower receiving surface 7a is arranged so as to surround each component mounting position 13a of the substrate 13, and by driving the vacuum suction means 18 in a state where the carrier 11 is in contact with the lower receiving surface 7a, The carrier 11 is held on the lower receiving surface 7a by vacuum suction. At the same time, the substrate contact member 15 is sucked from the lower surface by the suction pad 8, and the substrate 13 is pressed against the carrier 11 by the suction force, and the carrier 11 is further pressed and fixed against the lower receiving surface 7a. The electronic component 16 is mounted on the substrate 13 positioned and fixed as described above.
[0030]
In the above configuration, the suction pad 8 serves as a suction unit provided on the lower receiving member 5 for vacuum-sucking the substrate contact member 5. Then, the suction pad 8 and the vacuum suction unit 18 press the substrate 13 against the carrier 11 by applying a suction force to the substrate contact member 15 located above the lower receiving member 5, and press the carrier against the lower receiving surface 7a. It is a suction means that is pressed against and fixed.
[0031]
Next, a method of fixing the substrate will be described with reference to FIGS. First, the carrier 11 on which the substrate 13 is placed and on which the substrate contact member 15 is mounted is transported by the transport rail 10 from above, and as shown in FIG. It is positioned on the member 5 (positioning step). FIG. 3A shows a cross section in the Y direction of the carrier 11 and the lower receiving member 5 at this time, and the suction groove 7b and the suction pad 8 are located below the substrate 13 and on both front and rear ends of the substrate 13, respectively. are doing.
[0032]
2 (b) and 3 (b) show a state in which the rod 9a of the cylinder 9 is immersed, the transport rail 10 is lowered, and vacuum suction is performed from the suction pipe 17. In this state, the lower surface of the carrier 11 contacts and is supported by the lower receiving surface 7a, and separates from the transport rail 10. The lower surface of the carrier 11 is vacuum-suctioned by the suction groove 7b, and the suction pad 8 is in contact with the lower surface of the substrate contact member 15, and the suction force by the vacuum suction acts on the substrate contact member 15. Then, the substrate 13 is pressed against the carrier 11 by this suction force, and the carrier 11 is pressed and fixed to the lower receiving surface 7a (substrate fixing step).
[0033]
Thus, even when the thin and flexible substrate 13 such as a film-like flexible substrate is targeted, the substrate 13 can be positioned and fixed in a stable state. At this time, the mounting of the substrate abutting member 15 does not require a substrate clamping mechanism using screws or springs, and may be simply performed by positioning the carrier 11 with the positioning holes. For this reason, the carrier manufacturing cost can be reduced, and the operation for setting the substrate on the carrier can be simplified.
[0034]
In the above embodiment, an example is shown in which the suction groove 7b for sucking the carrier 11 and the suction pad 8 for sucking the substrate contact member 15 are connected to a common vacuum suction circuit and vacuum suction is performed simultaneously. However, separate vacuum suction circuits may be provided for the substrate suction and for the substrate contact member suction, respectively. As a result, the carrier and the substrate contact member can be sucked with the appropriate suction force and the appropriate timing, respectively, and further stable substrate fixing can be realized. In each of the embodiments described below, the same applies to the case where the substrate and the substrate contact member are fixed by vacuum suction.
[0035]
(Embodiment 2)
FIG. 4 is an operation explanatory diagram of the substrate fixing device according to the second embodiment of the present invention. In the second embodiment, the board contact member 15 previously mounted on the carrier 11 together with the board 13 in the first embodiment is fixedly attached to a mounting position. In the present embodiment, the substrate 13 is held by the carrier 11 and transported with the upper surface free.
[0036]
In FIG. 4A, a lower receiving member 5 similar to that of the first embodiment is disposed on a base plate 4 on a positioning table 1, and a side of the lower receiving member 5 that is the same as that of the first embodiment. A transfer rail 10 is arranged to be able to move up and down by a cylinder 9. The height position of the transport rail 10 when the transport rail 10 is lowered is determined by the positioning member 21 provided on the transport rail 10 abutting against the stopper bolt 20 provided on the base plate.
[0037]
On the upper surface of the transport rail 10 located above the lower receiving member 5, a board contact member 15A made of a film-like flexible member is attached by bolt fixing. The carrier 11 transported from the upstream side and entering under the substrate contact member 15A is positioned on the transport rail 10, and is positioned above the lower receiving member 5 (positioning step). A substrate 13 is set on the carrier 11 in advance, and the substrate 13 is aligned with the carrier 11 by positioning pins 12 provided on the carrier 11.
[0038]
The substrate contact member 15A is provided with an opening similar to the substrate contact member 15 shown in FIG. 1, and this opening is held by the carrier 11 similarly to the opening 15a shown in the first embodiment. It corresponds to the component mounting position 13a of the substrate 13. Further, the substrate contact member 15A is provided at the position corresponding to the outside of the width of the substrate 13 with a bent portion 22 formed by bending a film constituting the substrate contact member 15A in a bellows shape, continuously in the longitudinal direction. I have. Accordingly, the substrate contact member 15A inside the bent portion 22 is allowed to be vertically displaced via the bent portion 22.
[0039]
FIG. 4B shows a state in which the rod 9a of the cylinder 9 is immersed, the transport rail 10 is lowered, and vacuum suction is performed from the suction groove 7b and the suction pad 8 as in FIG. 2B. By lowering the transport rail 10, the lower surface of the carrier 11 first comes into contact with and is supported by the lower receiving surface 7 a, and separates from the transport rail 10. Then, the positioning member 21 comes into contact with the stopper bolt 20, and the transport rail 10 is positioned in the height direction.
[0040]
As a result, the lower surface of the substrate 13 is vacuum-suctioned by the suction groove 7b, and the suction pad 8 comes into contact with the lower surface of the substrate contact member 15A, so that a suction force by vacuum suction acts on the substrate contact member 15A. Then, the substrate contact member 15A is displaced downward by this suction force to press and fix the substrate 13 against the lower receiving surface 7a (substrate fixing step).
[0041]
That is, in the above-described configuration, the board contact member 15A is attached to the transport rail 10 that transports the board 13 to the mounting position, and includes a lifting unit that raises and lowers the lower receiving member 5 relative to the transport rail 10. Has become. In the fixing of the substrate by the lower receiving member 5 in the second embodiment, before the substrate fixing step, the transport rail 10 is moved down to raise and lower the lower receiving member 5 relative to the transport rail 10. It has a form including a process. According to this configuration, it is not necessary to mount the substrate contact member 15 as in the first embodiment on the carrier 11 holding the substrate 13 each time, and the work of mounting the substrate on the carrier 11 can be further simplified. it can.
[0042]
(Embodiment 3)
FIG. 5 is a partial perspective view of the substrate fixing device according to the third embodiment. FIG. 5 shows only a lower receiving member, a carrier, a substrate, and a substrate contact member among the components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The transfer rail, vacuum suction means, and the like are the same as those in the first embodiment shown in FIG.
[0043]
In FIG. 5, a plurality of component mounting positions 131a are formed on the substrate 131, and slits 131c are formed in the longitudinal direction on both sides of each component mounting position 131a. The substrate 131 is held by a carrier 111 provided with slits 111a continuous in the longitudinal direction at positions corresponding to the slits 131c. The positioning of the substrate 131 with respect to the carrier 111 is performed by fitting the positioning pins 12 of the carrier 111 into the positioning holes 131b of the substrate 131. The board contact member 151 provided with the opening 151a corresponding to the component mounting position 131a is positioned and placed on the upper surface of the board 131 by fitting the same positioning pin 12 into the positioning hole 151b. .
[0044]
The upper surface of the convex portion 71 provided on the lower receiving member 51 is a lower receiving surface 71a which comes into contact with the lower surface of the carrier 111 and receives the lower surface. The lower receiving surface 71a has a longitudinal shape corresponding to the position of the slit 131c. A suction groove 71b continuous in the direction is formed. When the substrate 131 held by the carrier 111 is received and fixed by the lower receiving member 5, the lower receiving surface 71 a is brought into contact with the lower surface of the carrier 111 holding the substrate 131, and vacuum suction is performed from the suction groove 71 b. .
[0045]
Thus, a suction force by vacuum suction acts on the substrate contact member 151 from the suction groove 71b, which is a suction portion provided in the lower receiving member 51, via the slit 11a of the carrier 111 and the slit 131c of the substrate 131. . Then, the substrate 131 is pressed against the carrier 111 by this suction force, and the carrier 111 is pressed and fixed to the lower receiving surface 71a. That is, in the third embodiment, the substrate 131 is provided with the slit 131c as a substrate through hole penetrating the substrate 131, and the substrate contact member 151 is evacuated through at least a part of the substrate through hole. It is in the form of adsorbing. Note that a flexible member such as a tape or a resin film may be employed as the substrate contact member 151.
[0046]
(Embodiment 4)
FIG. 6 is a partial perspective view of the substrate fixing device according to the fourth embodiment. FIG. 6 shows only the lower receiving member, the carrier, the substrate, and the substrate contacting member among the components constituting the substrate fixing device having the same function as the substrate fixing device shown in FIG. The transport rails and the like are the same as those in the first embodiment shown in FIG.
[0047]
In FIG. 6, a plurality of component mounting positions 132a are formed on the substrate 132 in a lattice shape, and slits 132c for dividing the individual components are formed in the vertical and horizontal directions at boundaries that divide the respective component mounting positions 132a. . The substrate 132 is held by a rectangular flat carrier 112, and the positioning of the substrate 132 with respect to the carrier 112 is performed by fitting the positioning pins 12 of the carrier 112 into the positioning holes 132 b of the substrate 132. Here, the carrier 112 is formed by processing a nonmagnetic metal (for example, austenitic stainless steel or the like) into a rectangular flat plate shape.
[0048]
The substrate contact member 152 mounted on the upper surface of the substrate 132 is made of a magnetic metal (for example, martensitic stainless steel). Openings 152a corresponding to the component mounting positions 132a are provided in a lattice shape in the board contact member 152, and the board contact member 152 is formed by fitting the same positioning pins 12 of the carrier 112 into the positioning holes 152b. , On the upper surface of the substrate 132.
[0049]
The upper surface of the convex portion 72 provided on the lower receiving member 52 is a lower receiving surface 72a that abuts on the lower surface of the carrier 112 and receives the lower surface. The lower receiving surface 72a is a suction groove for sucking and holding the carrier 112. 72b are provided, and a plurality of magnets 23 are buried inside the suction groove 72b. When the substrate 132 held on the carrier 112 is received and fixed by the lower receiving member 52, the lower receiving surface 72a is brought into contact with the lower surface of the carrier 112 holding the substrate 132, and the vacuum suction means 18 ( (See FIG. 1) to drive the vacuum suction from the suction groove 72b.
[0050]
As a result, the carrier 112 is attracted to the lower receiving surface 72a, and the magnet 23 serving as the magnetic attraction provided on the lower receiving member 52 causes the magnetic substrate contact member 152 to pass through the carrier 112 and the substrate 132. A magnetic force acts as an attraction force. The suction force causes the substrate 132 to be pressed against the carrier 112 and the carrier 112 to be pressed and fixed to the lower receiving surface 72a. That is, in the fourth embodiment, the substrate contact member 152 is a magnetic material, and the magnet 23 serves as a suction unit that suctions the substrate 152 by magnetic force.
[0051]
(Embodiment 5)
FIG. 7 is a partial perspective view of the substrate fixing device according to the fifth embodiment. FIG. 7 shows only a lower receiving member, a carrier, a substrate, and a substrate abutting member among components constituting the substrate fixing device having the same functions as the substrate fixing device shown in FIG. The vacuum suction means and the like are the same as those in the first embodiment shown in FIG.
[0052]
In FIG. 7, a substrate 133 is a small package substrate, and a plurality of substrates are held by the carrier 113 and handled collectively. In the carrier 113, a rectangular recessed substrate accommodating portion 113a for accommodating the substrates 133 one by one is formed in a lattice shape, and a suction hole 113c for adsorbing and holding the substrate 133 is formed on the bottom surface of the substrate accommodating portion 113a. Is provided. A slit 113b penetrating the thickness of the carrier 113 is provided in the width direction between each row in which the substrate accommodating portions 113a are arranged in the width direction (a direction orthogonal to the transport direction).
[0053]
On the carrier 113 in which the substrate 133 is accommodated in each substrate accommodating portion 113a, a thin-film carrier 153 is placed so as to cover the entire upper surface. Openings 153a are provided in the carrier 153 in a lattice shape corresponding to the positions of the substrate accommodating portions 113a, and the positioning pins 12 provided on the carrier 113 are fitted into the positioning holes 153b to thereby bring the substrate into contact. Member 153 is aligned with carrier 113. Then, at the time of component mounting, the electronic component 16 is mounted on the substrate 133 via the opening 153a with respect to the plurality of substrates 133 positioned and fixed together with the carrier 113.
[0054]
The upper surface of the convex portion 73 provided on the lower receiving member 53 is a lower receiving surface 73a which abuts on the lower surface of the carrier 113 to receive the lower surface. The lower receiving surface 73a is located at the position of the slit 113b of the carrier 113. Correspondingly, the suction groove 73b is formed in the width direction. Further, on the lower receiving surface 73a, suction grooves 73c are continuously formed in the width direction at positions corresponding to the respective row positions of the substrate housing portion 113a. By driving the vacuum suction means 18 (see FIG. 1), vacuum suction is performed from the suction grooves 73b and 73c.
[0055]
When the substrate 133 held by the carrier 113 is received and fixed by the lower receiving member 53, the lower receiving surface 73a is brought into contact with the lower surface of the carrier 113 in a state where the substrate contact member 153 is placed on the upper surface. Then, vacuum suction is performed through the suction grooves 73b and 73c. Due to the vacuum suction from the suction groove 73c, the inside of each substrate accommodating portion 113a is suctioned through the suction hole 113c, whereby the substrate 133 is adsorbed and held in each substrate accommodating portion 113a.
[0056]
Then, by the vacuum suction from the suction groove 73c, the suction force by the vacuum suction acts on the substrate contact member 153 through the slit 113b of the carrier 113. Then, the substrate 133 is pressed against the carrier 113 by the suction force, and the carrier 113 is pressed and fixed to the lower receiving surface 73a. The depth of the substrate accommodating portion 113a is set such that the upper surface of the substrate 133 projects slightly above the upper surface of the carrier 113 when the substrate 133 is accommodated in the substrate accommodating portion 113a.
[0057]
As described in the above embodiments, the substrate fixing device of the present invention applies a suction force from the lower receiving member to the substrate contact member placed on the upper surface of the substrate held in the carrier. By doing so, the substrate is pressed against the carrier, and the carrier is pressed against the lower receiving member.
[0058]
This makes it possible to reliably receive and fix even a substrate on which a slit for dividing an individual piece is formed in advance. In addition, even if the substrate is a thin film with a large warp deformation such as a flexible substrate, it can be fixed in a straightened state without using a special jig with a substrate holding mechanism, and various types of substrates can be fixed. The substrate can be fixed by a reliable and simple mechanism.
[0059]
【The invention's effect】
According to the present invention, a substrate on which a substrate contact member held by a carrier and placed on an upper surface is provided above a lower receiving member provided with a lower receiving surface which is disposed at a work position and abuts against a carrier to receive the lower surface. The substrate is pressed against the carrier by applying suction force to the substrate abutting member by the suction means, and the carrier is pressed against the lower receiving surface and fixed. Can be fixed with
[Brief description of the drawings]
FIG. 1 is a perspective view of a substrate fixing device according to a first embodiment of the present invention.
FIG. 2 is a side view of the substrate fixing device according to the first embodiment of the present invention.
FIG. 3 is a partial cross-sectional view of the substrate fixing device according to the first embodiment of the present invention.
FIG. 4 is an operation explanatory view of the substrate fixing device according to the second embodiment of the present invention;
FIG. 5 is a partial perspective view of a substrate fixing device according to a third embodiment of the present invention.
FIG. 6 is a partial perspective view of a substrate fixing device according to a fourth embodiment of the present invention.
FIG. 7 is a partial perspective view of a substrate fixing device according to a fifth embodiment of the present invention.
[Explanation of symbols]
5, 51, 52, 53 Lower receiving member
7a, 71a, 72a, 73a Lower receiving surface
7b, 71b, suction groove
9 cylinders
10 Transport rail
11 Career
12 Positioning pin
13, 131, 132, 133 substrate
15,151,152,153 Substrate contact member
18 Vacuum suction means
23 magnet

Claims

A substrate fixing device for receiving and fixing a substrate held by a carrier for transferring a substrate from below at a working position, wherein a lower receiving surface which is disposed at the working position and abuts against the carrier on an upper surface and receives the lower surface is provided. A suction force is applied to the provided lower receiving member, a substrate contact member placed on the upper surface of the substrate and having a lower surface in contact with the upper surface of the substrate, and the substrate contact member located above the lower receiving member. And a suction means for pressing the substrate against the carrier and pressing and fixing the carrier against the lower receiving surface.

2. The apparatus according to claim 1, wherein said substrate contacting member is attached to substrate transporting means for transporting the substrate to said working position, and further comprises elevating means for elevating said lower receiving member relative to said substrate transporting means. 2. The substrate fixing device according to 1.

3. The suction unit according to claim 1, wherein the suction unit is a suction unit provided on the lower receiving member for vacuum-sucking the substrate contact member, and a vacuum suction unit for vacuum-sucking from the suction unit. Substrate fixing device.

4. The substrate fixing device according to claim 3, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and the substrate contact member is vacuum-sucked through at least a part of the substrate through-hole. .

The substrate fixing device according to claim 4, wherein the substrate contact member is a flexible member.

The said board | substrate contact member is a magnetic body, The said attraction | suction means is the magnetic attraction provided in the said lower receiving member in order to attract | suck the said board | substrate contact member by magnetic force, The Claim 1 or Claim 2 characterized by the above-mentioned. 3. The substrate fixing device according to 2.

A substrate fixing method for receiving and fixing a substrate held by a carrier for transferring a substrate from below at a work position, wherein a lower receiving surface which is disposed at the work position and abuts against the carrier on the upper surface and receives the lower surface is provided. An alignment step of positioning a substrate held by the carrier and having a substrate abutting member mounted on the upper surface thereof, above the provided lower receiving member, and the substrate abutting member located above the lower receiving member Applying a suction force to the carrier by applying a suction force to the carrier, and fixing the carrier by pressing the carrier against the lower receiving surface.

The substrate abutting member is attached to a substrate transporting unit that transports the substrate to the work position, and performs a substrate elevating step of relatively elevating the lower receiving member with respect to the substrate transporting unit prior to the substrate fixing step. The method for fixing a substrate according to claim 7, comprising:

9. The substrate fixing method according to claim 7, wherein, in the substrate fixing step, the substrate contact member is vacuum-adsorbed by vacuum suction from a suction unit provided on the lower receiving member. 10.

The substrate fixing method according to claim 9, wherein the substrate is provided with a substrate through-hole penetrating the substrate, and the substrate contact member is vacuum-sucked through at least a part of the substrate through-hole. .

The substrate fixing method according to claim 10, wherein the substrate contact member is a flexible member.

9. The substrate abutting member is a magnetic material, and in the substrate fixing step, the substrate abutting member is attracted by magnetic force by magnetic attraction means provided on the lower receiving member. Substrate fixing method.