KR20170094042A - mask alignment device and mask alignment method using the same - Google Patents

mask alignment device and mask alignment method using the same Download PDF

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Publication number
KR20170094042A
KR20170094042A KR1020160015006A KR20160015006A KR20170094042A KR 20170094042 A KR20170094042 A KR 20170094042A KR 1020160015006 A KR1020160015006 A KR 1020160015006A KR 20160015006 A KR20160015006 A KR 20160015006A KR 20170094042 A KR20170094042 A KR 20170094042A
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KR
South Korea
Prior art keywords
substrate
pressing plate
mask
clamping
disposed
Prior art date
Application number
KR1020160015006A
Other languages
Korean (ko)
Inventor
주성중
차유민
Original Assignee
삼성디스플레이 주식회사
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Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020160015006A priority Critical patent/KR20170094042A/en
Publication of KR20170094042A publication Critical patent/KR20170094042A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The present invention discloses a mask aligning device and a mask aligning method using the same. The present invention includes: a substrate holder on which a substrate is placed; a mask stage which is located below the substrate and which a mask is mounted on; a pressing plate disposed on the substrate and moving up and down toward the substrate; and a magnet unit disposed on the pressing plate. The substrate holder and the pressing plate are integrated. The pressing plate may be provided with a first clamping for supporting the substrate by using a magnet unit. Accordingly, the present invention is able to arrange a mask at a right position when mounting the mask on the substrate, as well as preventing damage to the substrate.

Description

[0001] The present invention relates to a mask alignment device and a mask alignment method using the same,
The present invention relates to a mask aligning apparatus and a mask aligning method using the same.
Typically, the display device can be used in mobile devices such as smart phones, lap top computers, digital cameras, camcorders, portable information terminals, tablet personal computers, and electronic devices such as desktop computers, televisions, outdoor billboards, have.
Recently, a slimmer display device is being released.
BACKGROUND OF THE INVENTION [0002] A flexible display device is easy to carry and can be applied to devices of various shapes. Among them, a flexible display device based on organic light emitting display technology is the most promising flexible display device.
The patterned thin film on the display device may be formed in a chamber for a thin film deposition apparatus. The thin film can be patterned using a mask having a pattern. When the mask is mounted on the substrate, alignment of the substrate and the mask is necessary.
Embodiments of the present invention provide a mask aligning apparatus and a mask aligning method using the same.
According to an aspect of the present invention, there is provided a mask aligning apparatus comprising: a substrate holder on which a substrate is placed; a mask stage disposed below the substrate and on which a mask is mounted; And a magnet unit disposed above the pressing plate, wherein the substrate holder and the pressing plate are integral with each other, and the pressing plate is provided with a first magnetron unit for supporting the substrate by using the magnet unit, Clamping can be installed.
In one embodiment, a plurality of guide holes are disposed in the pressing plate, a vertical guide bar is provided in the guide hole, and the pressing plate can move up and down along the vertical guide bar.
In one embodiment, the substrate holder may be provided below the pressing plate facing the mask stage, and a connecting portion may be provided between the substrate holder and the pressing plate to connect the substrate holder and the pressing plate.
In one embodiment, the connecting portion includes elastic bias means for resiliently supporting the substrate holder with respect to the pressing plate.
In one embodiment, the connection portion includes a guide bar disposed between the substrate holder and the pressing plate.
In one embodiment, the pressing plate can contact the substrate by its own weight.
In one embodiment, the pressing plate includes an electrostatic chuck.
In one embodiment, the pressing plate is provided with a concave portion from a surface facing the substrate, and the first clamping portion may be disposed in the concave portion.
In one embodiment, the first clamping may elastically support the outer surface of the substrate that is in contact with the pressing plate by the magnet unit in the recess.
According to an embodiment of the present invention, the first clamping may include: a pressing part pressed against the magnet unit; a contact part connected to the pressing part and contacting the outer surface of the substrate; Elastic bias means.
In one embodiment, the contact portion is vertically connected to the pressing portion, and can selectively support the outer surface of the substrate through the pressing plate.
In one embodiment, the depressions correspond to the depressed regions of the pressure plate, and a plurality of depressions may be disposed at the edges of the pressure plate.
In one embodiment, the second clamping may be further provided in the recess to elastically support the outer surface of the substrate in contact with the pressing plate.
According to an aspect of the present invention, there is provided a mask alignment method including: mounting a mask on a mask stage; placing a substrate on a substrate holder integrally coupled to the pressing plate; A step of aligning a position of the mask with a substrate, a step of bringing the pressing plate into contact with the substrate, a step of lowering the magnet unit to move the substrate and the mask by the magnetic force of the magnet unit, And supporting the substrate with the first clamping disposed in the concave portion of the pressing plate.
In one embodiment, a connecting portion for elastically supporting the substrate holder and the pressing plate is disposed between the substrate holder and the pressing plate, and the substrate holder and the pressing plate can move up and down together.
In one embodiment, a vertical guide bar is provided along a plurality of guide holes formed in the pressing plate, and the pressing plate can be lowered toward the substrate by its own weight.
In one embodiment, the first clamping can elastically support the substrate in the recess by pressing the magnet unit after the pressing plate contacts the substrate.
In one embodiment, a second clamping is further provided in the recess, and the substrate can be elastically supported within the recess when the pressing plate is brought into contact with the substrate.
As described above, the mask aligning apparatus of the present invention and the mask aligning method using the same can align the mask on the substrate at the time of mounting the mask, and can prevent the substrate from being damaged.
It is needless to say that the effects of the present invention can be derived from the following description with reference to the drawings in addition to the above-mentioned contents.
1 is a block diagram illustrating a mask aligning apparatus according to an embodiment of the present invention.
Fig. 2 is a configuration diagram showing a state after the mask is placed on the mask stage of Fig. 1 and the substrate is placed on the substrate holder. Fig.
FIG. 3 is a configuration diagram showing a state after the substrate is placed on the mask of FIG. 2. FIG.
Fig. 4 is a configuration diagram showing a state after the mask pressing plate is brought into contact with the substrate of Fig. 3;
Fig. 5 is a configuration diagram showing a state after the magnet unit presses the first clamping of Fig. 4; Fig.
6 is an enlarged view of a modified example of the combination of the mask plate and the substrate holder of FIG.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and particular embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by terms. Terms are used only for the purpose of distinguishing one component from another.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, Should not be construed to preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.
Hereinafter, an embodiment of a mask aligning apparatus and a mask aligning method using the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or corresponding components The same reference numerals are assigned to the same elements and a duplicate description thereof will be omitted.
FIG. 1 illustrates a mask aligning apparatus 100 according to an embodiment of the present invention.
Referring to the drawings, the mask aligning apparatus 100 includes a substrate holder 120, a mask stage 140, a pressing plate 150, and a magnet unit 160.
In one embodiment, the mask aligning apparatus 100 may be installed in a chamber of a thin film deposition apparatus.
In one embodiment, the mask alignment device 100 may be used to deposit a thin film of a display device, such as an organic light emitting display device.
The substrate holder 120 may have a mounting surface 121 formed thereon. The substrate 110 may be mounted on the mounting surface 121 of the substrate holder 120. A plurality of the substrate holders 120 are disposed on the edge of the substrate 110 to support the lower surface of the substrate 110. The substrate 110 may be a glass substrate. In another embodiment, the substrate 110 may be a thin polymer substrate.
The mask stage 140 may be located below the substrate 110. A mask 130 may be mounted on the mask stage 140. The mask 130 may have a pattern to be formed on the substrate 110. In one embodiment, the mask 130 may be a fine metal mask (FMM) or an open mask. The mask 130 may be formed of a metal plate. In one embodiment, the mask 130 is installed on the mask frame.
The pressing plate 150 may be disposed above the substrate 110. The pressing plate 150 can move up and down toward the substrate 110. The pressing plate 150 may be in close contact with the substrate 110.
The pressing plate 150 may be a plate made of a non-magnetic material. In one embodiment, the pressing plate 150 may be a non-magnetic metal or ceramic. The pressing plate 140 can press the substrate 110 uniformly.
In one embodiment, the pressure plate 150 includes an electrostatic chuck (ESC). When the pressing plate 150 has the electrostatic chuck, the substrate 110 and the mask 130 can be attracted by the electrostatic force.
A plurality of guide holes 153 may be formed in the pressing plate 150. The guide hole 153 may pass through the pressing plate 150. A vertical guide rod 154 may be installed in the guide hole 153. The pressing plate 150 can move up and down along the vertical guide rods 154.
In one embodiment, the pressing plate 150 can be lowered by its own weight. The lowered pressing plate 150 can contact the substrate 110. In another embodiment, the pressing plate 150 can be moved up and down by receiving a driving force by a driving means such as a driving motor.
The substrate holder 120 may be integrally coupled to the pressing plate 150. The substrate holder 120 may move together with the pressing plate 140.
The pressing plate 150 includes a first surface 151 facing the mask stage 140 and a second surface 151 opposite to the first surface 151 and facing the magnet unit 160. [ Lt; RTI ID = 0.0 > 152 < / RTI > The substrate holder 120 may be installed below the first surface 151 of the pressing plate 150.
Between the substrate holder 120 and the pressing plate 150, a connection unit 190 for connecting the substrate holder 120 and the pressing plate 150 may be provided. The connection portion 190 includes elastic bias means 191 such as a spring for elastically supporting the substrate holder 120 with respect to the pressing plate 150.
When the substrate 110 is mounted on the mask 130, the substrate holder 120 may be positioned on the mask stage 140 with elasticity. Accordingly, it is possible to prevent the substrate 110 from being damaged.
6, the connection portion 690 includes a guide bar 691 between the substrate holder 120 and the pressing plate 150. As shown in FIG. When the connection portion 690 does not perform the clamp function, the connection portion 690 may not include the elastic bias means.
Referring again to FIG. 1, the magnet unit 160 may be disposed above the pressing plate 150. The magnet unit 160 may be a metal plate made of a magnetic material. The magnet unit 160 may be moved up and down along the guide 161 toward the substrate 110. The substrate 110 and the mask 130 may be in close contact with each other due to the magnetic force of the magnet unit 160. [
The pressing plate 150 may be provided with a first clamping member 170 for supporting the substrate 110 using the magnet unit 160.
Specifically, the pressing plate 150 may have a recess 155 formed therein. The concave portion 155 may be formed from the first surface 151 of the pressing plate 150 facing the substrate 110. The concave portion 155 may correspond to a predetermined depth from the first surface 151 of the pressing plate 150. A plurality of recesses 155 may be disposed on the edge of the pressing plate 150.
The first clamping piece 170 may be disposed on the concave portion 155. The first clamping unit 170 elastically supports the outer surface of the substrate 110 that is in contact with the pressing plate 150 by the magnet unit 160. The elastic distance of the first clamping part 170 may be the inside of the concave part 155.
In one embodiment, the first clamping unit 170 may include a pressing unit 171 that is pressed against the magnet unit 160. The pressing portion 171 may be disposed on the second surface 152 of the pressing plate 150.
The contact portion 172 may be connected to the pressing portion 171. The contact portion 172 may be connected to the pressing portion 171 in a vertical direction. The contact portion 172 may selectively contact the outer surface of the substrate 110 through the pressing plate 150.
The contact portion 172 may be resiliently supported by an elastic bias means 173. The elastic bias means 173 may be disposed on the second surface 152 of the pressing plate 150 around the contact portion 172.
The first clamping unit 170 can elastically support the outer surface of the substrate 110 which is in contact with the pressing plate 150 only when the magnet unit 160 is pressed. In one embodiment, the first clamping member 170 is limited to any structure or shape as long as it can elastically support the substrate 110 by the pressing force of the magnet unit 160 no.
The second clamping 180 may be installed in the recess 155.
The second clamping 180 includes elastic bias means 181, such as a spring. In one embodiment, the second clamping 180 may be disposed within the recess 155. The second clamping 180 may elastically support the outer surface of the substrate 110 that contacts the pressing plate 150.
The second clamping unit 180 may have a portion protruding outward from the lower surface of the pressing plate 150 (g in Fig. 2). When the pressing plate 150 contacts the substrate 110, the protruding portion g can be compressed.
In one embodiment, the second clamping 180 is not limited to any one structure as long as it elastically supports the outer surface of the substrate 110.
A process of aligning the substrate 110 and the mask 130 using the mask aligning apparatus 100 having the above structure will be described.
As shown in FIG. 2, the mask 130 is mounted on the mask stage 140. Subsequently, the substrate 110 is placed on the substrate holder 120. The substrate 110 is mounted on the mounting surface 121 of the substrate holder 120. The substrate holder 102 may mount the substrate 120 at the edge of the substrate 110.
Next, as shown in FIG. 3, the substrate 110 is placed on the mask 130.
When the substrate holder 120 is lowered, the substrate 110 mounted on the mounting surface 121 of the substrate holder 120 may be mounted on the mask 130. Since the substrate holder 120 is integrally coupled to the pressing plate 150, the holder 120 can be lowered as the pressing plate 140. The pressing plate 140 can be lowered by its own weight.
The lower surface of the holder 120 is positioned on the mask stage 140. At this time, since the connection part 190 is provided between the substrate holder 120 and the pressing plate 140, the holder 120 is elastically biased by the elastic bias means 191 provided on the connection part 190 May be located on the mask stage 140.
After the substrate 110 is mounted on the mask 130, alignment positions of the substrate 110 and the mask 130 are checked using an alignment camera (not shown).
Subsequently, as shown in FIG. 4, the pressing plate 150 is brought into contact with the substrate 110.
Vertical guide rods 154 may be disposed in a plurality of guide holes 153 formed in the pressing plate 150. The pressing plate 150 may descend along the vertical guide rods 154. The pressing plate 150 is lowered toward the substrate 110 due to its own weight.
The pressing plate 150 is in close contact with one surface of the substrate 110. When the pressing plate 150 has an electrostatic chuck, the pressing plate 150 can adsorb the substrate 110 by an electrostatic force.
A second clamping unit 180 may be installed in the recess 155 formed in the pressing plate 150. When the pressing plate 150 contacts the substrate 110, the protruding portion (g in Fig. 3) of the second clamping protrusion 180 protruding outside the lower surface of the pressing plate 150 is compressed, The elastic biasing means 181 provided on the second clamping unit 180 elastically supports the outer surface of the substrate 110.
Next, as shown in FIG. 5, the magnet unit 160 is lowered. The magnet 160 may be lowered and positioned on the outer surface of the pressing plate 150. When the magnet unit 160 is lowered, the substrate 110 and the mask 130 can be closely contacted by the magnetic force of the magnet unit 160.
At this time, a first clamping unit 170 may be installed in the recess 155 formed in the pressing plate 150. When the magnet unit 160 is lowered, the magnet unit 160 presses the first clamping unit 170.
When the magnet unit 160 presses the first clamping piece 170, the first clamping piece 170 elastically supports the substrate 110 in the concave part 155.
The substrate 110 and the mask 130 are pressed and adhered to each other by the pressing plate 150 and the magnet plate 160 and the first clamping member 170 and the second clamping member 180 are press- As shown in Fig.
100 ... mask aligning device 110 ... substrate
120 ... substrate holder 130 ... mask
140 ... mask stage 150 ... pressure plate
160 ... Magnet unit 170 ... First clamping
180 ... second clamping 190 ... connection

Claims (18)

  1. A substrate holder on which a substrate is placed;
    A mask stage located below the substrate and on which a mask is mounted;
    A pressing plate disposed above the substrate and moving up and down toward the substrate; And
    And a magnet unit disposed above the pressing plate,
    The substrate holder and the pressing plate are integrally formed,
    Wherein the pressing plate is provided with a first clamping member for supporting the substrate by using the magnet unit.
  2. The method according to claim 1,
    Wherein a plurality of guide holes are disposed in the pressing plate, a vertical guide rod is installed in the guide hole, and the pressing plate is moved up and down along the vertical guide rod.
  3. 3. The method of claim 2,
    Wherein the substrate holder is disposed below the pressing plate facing the mask stage, and a connection portion for connecting the substrate holder and the pressing plate is provided between the substrate holder and the pressing plate.
  4. The method of claim 3,
    Wherein the connecting portion includes elastic bias means for elastically supporting the substrate holder with respect to the pressing plate.
  5. The method of claim 3,
    And the connection portion includes a guide bar provided between the substrate holder and the pressing plate.
  6. 3. The method of claim 2,
    Wherein the pressing plate is in contact with the substrate by its own weight.
  7. The method according to claim 1,
    Wherein the pressure plate comprises an electrostatic chuck.
  8. The method according to claim 1,
    Wherein the pressing plate is provided with a concave portion from a surface facing the substrate, and the first clamping is disposed in the concave portion.
  9. 9. The method of claim 8,
    Wherein the first clamping resiliently supports the outer surface of the substrate in contact with the pressing plate by the magnet unit in the recess.
  10. 10. The method of claim 9,
    Wherein the first clamping comprises:
    A pressing unit that is pressed against the magnet unit;
    A contact portion connected to the pressing portion and contacting an outer surface of the substrate; And
    And elastic bias means for resiliently supporting the contact portion.
  11. 11. The method of claim 10,
    Wherein the contact portion is vertically connected to the pressing portion and selectively supports the outer surface of the substrate through the pressing plate.
  12. 9. The method of claim 8,
    Wherein the concave portion corresponds to the drawn-in region of the pressing plate, and a plurality of the concave portions are disposed at the edge of the pressing plate.
  13. 9. The method of claim 8,
    And a second clamping mechanism for elastically supporting the outer surface of the substrate in contact with the pressing plate is further provided in the recess.
  14. Placing a mask on a mask stage;
    Seating the substrate in a substrate holder integrally coupled to the pressure plate;
    Lowering the substrate holder to mount the substrate on the mask;
    Aligning the position of the mask and the substrate;
    Contacting a pressure plate on the substrate; And
    Lowering the magnet unit to bring the substrate and the mask into close contact with each other by the magnetic force of the magnet unit, and supporting the substrate by the first clamping disposed in the recess of the pressing plate.
  15. 15. The method of claim 14,
    Wherein a connection part for elastically supporting the substrate holder and the pressing plate is disposed between the substrate holder and the pressing plate, and the substrate holder and the pressing plate move up and down together.
  16. 16. The method of claim 15,
    Wherein a vertical guide rod is provided along a plurality of guide holes formed in the pressing plate, and the pressing plate is lowered toward the substrate by its own weight.
  17. 15. The method of claim 14,
    Wherein the first clamping elastically supports the substrate within the recess by pressing of the magnet unit after the pressing plate contacts the substrate.
  18. 15. The method of claim 14,
    Wherein a second clamping is further provided in the recess and the substrate is resiliently supported within the recess when the pressing plate contacts the substrate.
KR1020160015006A 2016-02-05 2016-02-05 mask alignment device and mask alignment method using the same KR20170094042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160015006A KR20170094042A (en) 2016-02-05 2016-02-05 mask alignment device and mask alignment method using the same

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Application Number Priority Date Filing Date Title
KR1020160015006A KR20170094042A (en) 2016-02-05 2016-02-05 mask alignment device and mask alignment method using the same

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Publication Number Publication Date
KR20170094042A true KR20170094042A (en) 2017-08-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190103740A (en) * 2018-02-28 2019-09-05 이노6 주식회사 Bonding apparatus for electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190103740A (en) * 2018-02-28 2019-09-05 이노6 주식회사 Bonding apparatus for electronic parts

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