JP4631665B2 - Flexible printed circuit board fixing method, flexible printed circuit board fixing device, flexible printed circuit board electronic component mounting apparatus, flexible printed circuit board electronic component mounting method - Google Patents

Description

  The present invention relates to a method for fixing a flexible printed circuit board, which holds and conveys a flexible printed circuit board on which a semiconductor device and small components are mounted, to a carrier for transportation and an electronic component mounting method on the flexible printed circuit board.

  A thin substrate such as a flexible printed circuit board (hereinafter also referred to as an FPC) on which electronic components are mounted is difficult to handle by itself because the substrate itself is not elastic, and usually with a plurality of FPCs held on a plate-shaped carrier. Handled. The electronic component is mounted on the FPC in such a state that the FPC is held on the carrier for conveyance.

  FIG. 9 is a perspective view of a conventional FPC 11 mounting jig and a carrier 700 for transportation, and FIG. 10 is an explanatory diagram of a method of mounting the FPC 11 in the conventional embodiment.

  With reference to FIGS. 9 and 10, an FPC carrier 700 that holds a plurality of FPCs 11 in close contact with the upper surface will be described. The transport carrier 700 has a structure in which a resin layer 702 having a smooth surface is formed on the upper surface of the base plate 701 as a close contact surface for tightly holding the FPC 11. The mounting jig 703 is provided with a reference pin 705 for positioning the FPC 11. In order to mount the FPC 11 to the transport carrier 700, as shown in FIG. 10, after the transport carrier 700 is fixed to the mounting jig 703, the lower surfaces of the plurality of FPCs 11 are pressed against the smooth surface of the resin layer 702 on the upper surface of the transport carrier 700. And make close contact. As a result, the FPC 11 is positioned at a predetermined position of the transport carrier 700 and is held in close contact with the resin layer 702. Thereafter, the transport carrier 700 is removed from the mounting jig, whereby the mounting of the FPC 11 to the transport carrier 700 is completed.

Examples of documents in this field include (Patent Document 1) (Patent Document 2).
JP 2004-071863 A JP 2002-338916 A

  However, according to the conventional method of mounting the FPC 11 on the transport carrier 700, the mounting jig 703 and the transport carrier 700 must be manufactured and prepared for each type of the FPC 11, and the cost is a problem. In addition, when the plurality of FPCs 11 are mounted on the transport carrier 700, the adhesiveness may be individually different, which may cause variations in mounting of electronic components. Furthermore, the man-hour for removing the FPC 11 from the transport carrier 700 is a problem because the FPC 11 is fixed to the transport carrier 700 after mounting the electronic components.

  Therefore, according to the present invention, the FPC can be easily taken out from the mounting carrier after the electronic component is mounted, and the FPC can be fixed stably at a low cost by using a common carrier and mounting jig. It aims at providing the mounting method of components.

  An electronic component mounting method on a flexible printed circuit board according to the present invention includes a holding table, a pin base arranged on the holding table, a press plate provided with a cushioning material arranged on the pin base, and a press plate. A flexible printed circuit board having a conveyance carrier having a resin layer disposed opposite to the carrier, a pressing device that moves the conveyance carrier to the holding plate side, and an extrusion bar that pushes out the pin base from the holding table, and positioned on the holding plate, The flexible printed circuit board fixing device is characterized in that the flexible printed circuit board is fixed between the holding plate and the transport carrier and the flexible printed circuit board is fixed to the transport carrier. According to this configuration, the holding table and the transport carrier depend on the type of FPC. Can be used in common, and multiple FPCs can be fixed to the carrier at the same time. Because, it can be a little variation Moreover fixing apparatus inexpensive flexible printed circuit board.

  According to the flexible printed circuit board mounting method of the present invention, the holding table and the transport carrier can be used in common by simply replacing the pin jig regardless of the type of the FPC. Since a plurality of flexible printed boards can be securely mounted and fixed on the transport carrier, mounting of electronic components is easy and can be easily removed from the transport carrier after mounting. It can be a method.

The invention according to claim 1 is formed on a holding table having a pressing machine, a pin base formed on the holding table and having a pin for arbitrarily temporarily fixing the position of the flexible printed circuit board, and on the pin base, A presser plate that has a hole for penetrating the pin and temporarily holds the flexible printed board with the penetrating pin, an extrusion bar that passes through the holding table and the pin base and moves the presser plate, and is temporarily fastened on the presser plate When adhering the flexible printed circuit board to the transport carrier, the transport carrier is pressed in the direction of the presser plate with a pressing machine, and the presser plate is moved in the direction of the transport carrier with the extruding bar to separate the pins from the flexible printed circuit board and transport. After pressing the flexible printed circuit board between the carrier and the presser plate, the pressing machine and the push bar are returned to the flexible printer. A flexible printed circuit board fixation device substrate is characterized in that it is secured to the conveying carrier, according to this configuration, the holding table and the transport carrier, it is not necessary to manufacture in accordance with the shape of the FPC, thus the type of FPC The plurality of FPCs can be fixed to the transport carrier at a desired position at the same time, so that a flexible printed circuit board fixing device with little variation can be obtained.

The invention according to claim 2 is the flexible printed circuit board fixing device according to claim 1, wherein the pressing device is provided with a heating device for heating the transport carrier, and the pressing device and the heating device are integrated. Can save space.

The invention according to claim 3 is the flexible printed circuit board fixing device according to claim 1 or 2 , wherein the presser plate is formed by bonding a cushioning material on a metal presser plate base. According to this configuration, since the FPC can be more firmly fixed to the transport carrier in addition to the invention of claim 1 or 2, the flexible printed circuit board fixing device can be provided with less variation and at a low cost.

The invention according to claim 4 is the flexible printed circuit board fixing device according to claim 1 , wherein the transport carrier is formed by applying a resin layer to the transport carrier base, and the resin layer is formed in a grid shape. According to this configuration, in addition to the first aspect of the invention, it is possible to release air from the meshes or absorb expansion of the adhesive resin when the FPC is fixed on the transport carrier. Wrinkles and deformation can be prevented.

According to a fifth aspect of the present invention, there is provided a holding table having a pressing machine, a plate having a heating and pressing unit, and a pin base formed on the holding table and having a pin for arbitrarily temporarily fixing the position of the flexible printed circuit board. A press plate that is formed on the pin base and has a hole for penetrating the pin and temporarily fixes the flexible printed circuit board with the penetrating pin, an extrusion bar that passes through the holding table and the pin base and moves the press plate, When adhering the flexible printed circuit board temporarily clamped on the presser plate to the transport carrier, press the transport carrier in the direction of the presser plate with a pressing machine and move the presser plate in the direction of the transport carrier with the push bar. Separate the pins from the flexible printed circuit board, press the flexible printed circuit board between the carrier and the presser plate, and then press and press Put the transport bar back and take out the carrier, place the removed carrier on the plate with the heating and pressurizing part, heat and press the carrier and flexible printed board, and fix the flexible printed board to the carrier According to this configuration, the FPC can be more firmly fixed to the transport carrier, so that the flexible printed circuit board fixing device can be obtained with less variation and at a low cost.

The invention according to claim 6 is the flexible printed circuit board fixing device according to claim 5 , wherein the heating and pressing unit is a hot plate press device, and the flexible printed circuit board is fixed and fixed by the heating and pressing unit. It becomes possible to carry out in parallel, and the number of fixing steps of the flexible printed circuit board can be reduced.

According to a seventh aspect of the present invention, there is provided a step of holding a pin base provided with positioning pins for a flexible printed circuit board on a holding table, a step of holding a press plate provided with a cushioning material on the pin base, and a press plate The step of positioning the flexible printed circuit board, the step of placing the transport carrier at a position where it comes into contact with the pins provided on the pin base, the carrier carrier is pressurized with a pressing machine, the presser plate is raised with the push rod, and the presser plate is moved to the Separating from the pin, sandwiching the flexible printed circuit board between the transport carrier and the holding plate, fixing the flexible printed circuit board to the transport carrier, returning the pressing device and the extrusion bar to a predetermined position, and removing the transport carrier; The flexible printed circuit board fixing method is characterized by comprising: The table and the transport carrier can be used in common without depending on the type of the flexible printed circuit board, and a plurality of flexible printed circuit boards can be fixed to the transport carrier at the same time. The fixing method can be as follows.

According to an eighth aspect of the present invention, there is provided a step of holding a pin base provided with positioning pins for a flexible printed circuit board on a holding table, a step of holding a press plate provided with a cushioning material on the pin base, and a press plate The step of positioning the flexible printed circuit board, the step of placing the transport carrier at a position where it comes into contact with the pins provided on the pin base, the step of heating the press device placed on the back surface of the transport carrier, and pressurizing the transport carrier with a pressing machine A step of raising the presser plate with the push bar, separating the presser plate from the pin of the pin base, heating and pressing the flexible printed circuit board for a predetermined time between the transport carrier and the presser board, and fixing the flexible printed circuit board to the transport carrier; And having a step of returning the pressing device and the extrusion bar to a predetermined position, and a step of taking out the carrier. According to this method, the holding table and the transport carrier can be used in common without depending on the type of FPC, and a plurality of FPCs can be firmly and simultaneously transported. Therefore, the flexible printed circuit board can be fixed at low cost with little variation.

The invention according to claim 9 includes a step of holding a pin base provided with a positioning pin for a flexible printed circuit board on a holding table, a step of holding a press plate provided with a cushioning material on the pin base, and a press plate The step of positioning the flexible printed circuit board, the step of placing the transport carrier at a position where it comes into contact with the pins provided on the pin base, the carrier carrier is pressurized with a pressing machine, the presser plate is raised with the push rod, and the presser plate is moved to the The flexible printed circuit board is sandwiched between the carrier carrier and the holding plate, separated from the pins, the flexible printed circuit board is fixed to the carrier carrier, the press device and the extrusion bar are returned to a predetermined position, the carrier carrier removal process, and the removal Attaching the transported carrier to the hot plate jig and heating and pressurizing the transport carrier. A flexible printed circuit board fixing method characterized in that the holding table and the transport carrier are not dependent on the type of the FPC and are common to each other. In addition, a plurality of FPCs can be firmly fixed to the carrier at the same time, and the fixing process and the heating and pressing process are performed in parallel, so that the working time can be shortened.

The invention according to claim 10 is characterized in that the resin layer of the transport carrier is masked with a masking tape at a portion not facing the flexible printed circuit board and a part of the portion facing the flexible printed circuit board. The flexible printed circuit board fixing method according to any one of Items 9 to 9, wherein according to the method, in addition to the inventions of Claims 7 to 9, the carrier further after mounting the electronic component on the flexible printed circuit board When the flexible printed circuit board is peeled off, it can be easily peeled off based on the non-fixed portion with the masking tape.

The invention according to claim 11 is the flexible printed circuit board fixing method according to any one of claims 7 to 10, wherein a grid is provided in the resin layer of the transport carrier. According to the seventh to tenth aspects of the invention, when the flexible printed circuit board is fixed to the transport carrier, the air component between the flexible printed circuit board and the resin layer of the transport carrier can be released. Wrinkles and deformation can be prevented.

According to a twelfth aspect of the present invention, the flexible printed circuit board fixing device according to any one of the first to sixth aspects is used to mount the electronic component on the flexible printed circuit board, and the flexible printed circuit board is held on the transport carrier. An electronic component mounting apparatus for a flexible printed circuit board, characterized in that the flexible printed circuit board is securely fixed to the transport carrier, so that electronic components can be mounted with high accuracy. According to a thirteenth aspect of the present invention, the flexible printed circuit board is held on the carrier by using the flexible printed circuit board fixing method according to any one of the seventh to eleventh aspects for mounting the electronic component on the flexible printed circuit board. A method for mounting an electronic component on a flexible printed circuit board, characterized in that the flexible printed circuit board is securely fixed to a carrier, so that the electronic component can be mounted with high accuracy.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a diagram showing a process of mounting electronic components on an FPC according to an embodiment of the present invention.

  As shown in FIG. 1, the mounting process in the embodiment of the present invention includes a process 40 for fixing the FPC to the transport carrier, a process 41 for inserting the transport carrier into the board supply device, a process 42 for printing solder paste, and mounting an electronic component. Step 43 for performing soldering, Step 44 for soldering in a reflow furnace, Step 45 for removing the carrier from the substrate storage device, and Step for removing the mounted FPC from the carrier. A thin substrate such as an FPC on which electronic components are mounted is difficult to handle by itself because the substrate itself is not loose, and is usually handled in a state where a plurality of FPCs are held on a plate-shaped carrier. The electronic component is mounted on the FPC in a state where the FPC is held on the carrier for conveyance.

  FIG. 2 is an explanatory diagram of an apparatus for fixing to an FPC carrier according to Embodiment 1 of the present invention.

  In FIG. 2, 101 is a holding table, 201 is a pin base, 301 is a pressing plate, 401 is a transport carrier, and 11 is an FPC.

  The holding table 101 is provided with a protruding rod 12 protruding from the lower side of the holding table 101. The protruding rod 12 is attached to the holding table 101 and fixed integrally with the air cylinder 30, and the air cylinder 30 is driven from outside to move the pushing rod 12 up and down.

  Further, the pin base 201 is provided with a hole for inserting the positioning pin 202 in the base plate 204 and press-fitting the positioning pin 202 so that the FPC 11 can be positioned with reference to the positioning pin 202.

  The base plate 204 is a metal plate for fixing the positioning pins 202, and is made of an AlMg metal such as an aluminum alloy, for example, A5052. The base plate 204 is provided with a relief hole 203 so that the protruding rod 12 provided on the holding table 101 passes. The thickness of the base plate 204 is 5 to 10 mm in consideration of strength and easy handling weight, the positioning pin 202 is press-fitted with a pin having a diameter of 1 to 2 mm, the press-fitting protrusion amount is 4 to 8 mm, and the tip of the pin is R processing is carried out.

  FIG. 3 is an explanatory diagram of the presser plate according to the first embodiment of the present invention.

  In FIG. 2 and FIG. 3, the holding plate 301 is released such that the positioning pin 202 appears through the buffering material 303 when the buffering material 303 is bonded to the metal holding plate base 302 and overlapped with the pin base 201. A hole 304 is provided. The pressing plate base 302 and the buffer material 303 are fixed by an adhesive member. The material of the holding plate base 302 is made of an aluminum alloy, for example, an AlMg-based metal such as A5052, and the thickness is preferably 2 to 5 mm in consideration of strength and weight. As the buffer material 303, cellular chloroprene rubber such as neoprene can be used. The escape hole 304 for the positioning pin 202 of the FPC 11 provided in the presser plate 301 has a diameter larger than the diameter of the positioning pin 202. For example, when the diameter of the positioning pin 202 is 1.5 mm, the diameter of the escape hole 304 is 2 mm so that the fitting is facilitated.

  The FPC 11 is provided with a positioning hole 22 that fits with the positioning pin 202, and is positioned such that the positioning pin 202 of the pin base 201 comes out through the positioning hole 22 provided in the FPC 11.

  FIG. 4 is an explanatory diagram of the transport carrier according to the first embodiment of the present invention.

  In FIG. 4, the transport carrier 401 has a resin layer 403 applied to a transport carrier base 402. The resin layer 403 is made of a silicon-based material and has a thickness of 0.05 t to 0.2 t. The transport carrier base 402 is made of a rigid material such as glass epoxy or metal plate, and the thickness of the transport carrier base 402 is 1 mm to 5 mm. If it is thinner than 1 mm, it will be deformed due to changes in diameter during heating and pressurization, and if it is thicker than 5 mm, the weight will be heavy, resulting in poor heat distribution during reflow.

The resin layer 403 is provided with a mesh 404 as shown in FIG. 4, and when the FPC 11 is fixed to the transport carrier 401, air components can escape from the mesh 404 portion and strain due to resin thermal expansion can be absorbed. FPC 11 can be prevented from wrinkling. The cell 404 of the resin layer 403 may be formed by applying the resin layer 403 on the front surface and then cutting the cell 404 or conversely applying the resin layer 403 leaving the cell 404.
A masking tape 405 is attached to the surface of the resin layer 403 of the transport carrier 401.

  FIG. 5 is a perspective view showing an example of masking the resin layer of the transport carrier according to Embodiment 1 of the present invention.

  FIG. 5 shows a state in which the FPC 11 is fixed so that the position after the FPC 11 is fixed to the transport carrier can be seen. As the masking tape 405, a masking tape 405 a masked on a part of the FPC 11 and a part not in contact with the FPC 11 and a masking tape 405 of the masking tape 405 b masked on a part of the position where the FPC 11 is fixed to the resin layer 403 are used. Thus, the resin layer 403 of the transport carrier 401 is masked. In order to mount an electronic component or the like on the transport carrier 401, when the reflow furnace is passed through for soldering the electronic component or the like, the resin layer 403 increases the adhesiveness by the heat of the reflow furnace, and the FPC 11 is fixed to the resin layer 403. By performing masking to prevent this, the resin layer 403 in the masking portion is less susceptible to the heat of reflow, and the adhesion between the resin layer 403 and the FPC 11 is weakened. Can be prevented from sticking to the transport carrier 401 and part of the FPC 11 is masked, so that it is easy to peel the FPC 11 from the transport carrier 401 after mounting the electronic components.

  Note that the masking position of the resin layer 403 of the transport carrier 401 is changed in accordance with the FPC 11 depending on the type of the FPC 11.

  FIG. 6 is a diagram illustrating a procedure for mounting the FPC according to the first embodiment of the present invention to the transport carrier.

  A method for fixing the FPC 11 to the transport carrier 401 will be described with reference to FIG.

  As shown in FIG. 6A, the pin base 201 is held on the holding table 101. Then, as shown in FIG. 6B, the presser plate 301 is held on the pin base 201. Thereafter, as shown in FIG. 6C, the FPC 11 is fitted on the cushioning material 303 of the presser plate 301 with the positioning hole 22 of the FPC 11 fitted to the positioning pin 202 as a reference, and the FPCs 11 are arranged side by side. A plurality of FPCs 11 can be arranged at the same time, but one FPC 11 may be provided. A positioning pin 202 is press-fitted into the pin base 201, and the positioning pin 202 is fitted into the relief hole 304 of the presser plate 301, and is set so that the tip of the positioning pin 202 protrudes from the cushioning material 303 of the presser plate 301. The FPC 11 is arranged with reference to the positioning pin 202.

  The positioning pin 202 is exposed from 1 mm to 3 mm from the surface of the cushioning material 303. If the positioning pin 202 is shorter than 1 mm, it is difficult to position the FPC, and if it is larger than 3 mm, the pin is likely to be bent. In disposing the FPC 11, the surface fixed to the transport carrier 401 is disposed on the cushioning material 303 with the back surface of the component mounting surface.

  Further, different types of FPCs 11 can be fixed to the transport carrier 401 by changing the pin base 201 and the presser plate 301. The holding table 101 and the transport carrier 401 have different types of FPCs 11. Can be used as is. Furthermore, since the desired types of pin base 201 and presser plate 301 are prepared, it is possible to respond immediately to a plurality of models, to support the production of a small number of many models, to simplify the apparatus and to be inexpensive. A flexible printed circuit board fixing device is provided.

  FIG. 7 is a diagram showing the operation of the fixing method according to the embodiment of the present invention.

  As shown in FIG. 7A, a press device 451 and a holding table 101 are incorporated in the flexible printed circuit board fixing device base 600.

  The pin base 201 is overlaid on the holding table 101, and the FPC 11 is positioned on the cushioning material 303 of the pressing plate 301 with reference to the positioning pin 202. Thereafter, after the carrier carrier 401 is arranged on the positioning pins 202, as shown in FIG. 7B, the carrier carrier 401 is moved in the direction of the holding plate 301 below the press device 451, and the press device 451 is operated and pressurized. At substantially the same time, the stick 12 is pushed out from the lower side of the holding table 101, the presser plate 301 is lifted, the presser plate 301 is separated from the pin base 201, the positioning pin 202 is separated from the FPC 11, and between the carrier carrier 401 and the presser plate 301. Then, the FPC 11 is sandwiched. After pressurizing for a desired time, as shown in FIG. 7C, the press device 451 is returned to the original position, the protruding rod 12 is returned to the original position, and the holding table 101 is moved from the press device 451. As shown in FIG. 7D, the FPC 11 can be fixed to the transport carrier by taking out the transport carrier 401.

  In addition, the press device 451 is provided with a heater 460, and the press device 451 is heated to 60 ° C. to 100 ° C. By pressurizing and heating, the adhesiveness between the transport carrier 401 and the resin layer 403 is increased. Can be increased. The pressurizing and heating time is preferably 30 to 60 seconds, and if it is longer than 60 seconds, the number of manufacturing steps becomes longer, and if it is shorter than 30 seconds, the adhesive effect is not sufficient.

  Although the heating process has been described with the configuration performed in the same apparatus, if the heating and pressing process is a separate apparatus, the transfer process and the heating and pressing process can be performed in parallel, and the creation time can be shortened. .

  FIG. 8 is a diagram showing another method of pressure heating according to the embodiment of the present invention.

  In FIG. 8, the carrier carrier 401 taken out in FIG. 7D is taken out, the carrier carrier 401 is placed on the hot plate 701, and is heated under pressure by a hot plate press device 702 provided on the hot plate 701. The hot place press 702 is provided with a buffer material such as neoprene rubber so that no stress is applied when the FPC 11 is heated under pressure. When the pressure heating with the hot plate 701 is performed, the pressure heating in FIG. 7 is omitted, and the time can be shortened.

  Further, by performing the fixing process of the FPC 11 in FIG. 7 and the pressure heating by the hot plate 701 in parallel, the total number of fixing steps can be reduced.

  In addition, the hot plate press apparatus is provided with a timer 704 so that pressure heating can be performed for a desired time.

  Further, in the embodiment of the present invention, the method of performing pressure heating has been described. However, heating may not be required by extending the pressurization time even if the heating and pressurization is not particularly concerned.

  When the FPC 11 is fixed to the transport carrier 401, the electronic component is mounted in the electronic component mounting process.

  For mounting electronic components, cream solder is applied to the FPC 11 mounting portion of the carrier carrier base 402 in a state where the FPC 11 is fixed to the carrier carrier 401. The material of the cream solder is lead-free solder, for example, Sn—Ag—Cu alloy, and solder that does not contain Pb is used to give consideration to the environment.

  After applying the cream solder, the electronic component is placed on the FPC 11, and the electronic component is soldered on the FPC 11 through a reflow furnace.

  When the soldering is completed, the FPC 11 on the transport carrier 401 is removed. Since the masking portion on the transport carrier 401 is not fixed to the resin layer 403 of the transport carrier 401, it can be easily removed by removing the masking portion as a reference.

  Note that not only cream solder but also adhesive resin, UV resin, or the like can be applied by transfer paste using the same method.

  The present invention can be applied to a general electronic device in which electronic components are surface-mounted on a flexible printed circuit board, for example, a flexible printed circuit board used in various electronic devices such as an optical disk device and a television device, a robot, an aircraft, and a rocket.

The figure which shows the mounting process of the electronic component to FPC concerning embodiment of this invention Explanatory drawing of the apparatus which adheres to the conveyance carrier of FPC concerning Embodiment 1 of this invention Explanatory drawing of the presser plate concerning embodiment of this invention Explanatory drawing of the conveyance carrier concerning embodiment of this invention The perspective view which shows the example of the masking to the resin layer of the conveyance carrier concerning Embodiment 1 of this invention The figure which shows the attachment procedure of FPC concerning embodiment of this invention to a conveyance carrier The figure which showed operation | movement of the fixing method concerning embodiment of this invention. The figure which shows another method of the pressurization heating concerning embodiment of this invention Perspective view of conventional FPC mounting jig and carrier for conveyance Explanatory drawing of conventional FPC mounting method

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Flexible printed circuit board 12 Extrusion stick | rod 22 Positioning hole 101 Holding table 201 Pin base 202 Positioning pin 204 Base board 301 Pressing board 303 Buffer material 401 Conveyance carrier 402 Conveyance carrier base 403 Resin layer 404 Grid 405 Masking tape 451 Press device 460 Heater

Claims (13)

A holding table having a pressing machine;
A pin base formed on the holding table and having a pin for arbitrarily temporarily fixing the position of the flexible printed circuit board;
A presser plate that is formed on the pin base and has a hole for penetrating the pin, and temporarily holds the flexible printed circuit board with the pin penetrating;
Through the holding table and the pin base, a push rod for moving the holding plate,
When bonding the flexible printed circuit board that is tacked on the presser plate in the transport carrier, with pressurized by the press machine the transport carrier in the direction of the pressing plate, the said pressing plate by the push rod Move in the direction of the carrier to separate the pins from the flexible printed circuit board,
The flexible printed circuit board anchoring device characterized in that the flexible printed circuit board returning the pressing machine and the pushrod after pressurizing the flexible printed circuit board with the pressing plates and the transport carrier is fixed to the transport carrier. The flexible printed circuit board anchoring device according to claim 1, characterized in that a heating device for heating the transport carrier in the pressing machine. The flexible printed circuit board fixing device according to claim 1, wherein the pressing plate is formed by bonding a buffer material on a metal pressing plate base. The transport carrier is formed by applying a resin layer to the transport carrier base, a flexible printed circuit board anchoring device of claim 1, wherein the resin layer is characterized by being formed by meshes shape. A holding table having a pressing machine;
A plate having a heating and pressing unit;
A pin base formed on the holding table and having a pin for arbitrarily temporarily fixing the position of the flexible printed circuit board;
Said formed on the pin base, pressing plates that temporarily fixed the flexible printed circuit board with said pin passing through a hole through which the said pin,
Through the holding table and the pin base, a push rod for moving the holding plate,
When bonding the temporarily fixed to a flexible printed board on the holding plate in the transport carrier, with pressurized by the press machine the transport carrier in the direction of the pressing plate, the transfer of the pressing plate in the push rod Move in the direction of the carrier to release the pin from the flexible printed circuit board,
Wherein the flexible printed circuit board in a transport carrier the pressing plates pressurized the back pressing machine and the pushrod after taking out the transport carrier,
The transport carrier taken out is placed on a plate having the heating and pressing unit,
Heating and pressing the flexible printed circuit board and the transport carrier,
A flexible printed circuit board fixing device, wherein the flexible printed circuit board is fixed to the transport carrier . 6. The flexible printed circuit board fixing device according to claim 5, wherein the heating and pressing unit is a hot plate press. A step of holding a pin base provided with a pin for positioning a flexible printed circuit board on a holding table;
Holding a press plate provided with a cushioning material on the pin base;
Positioning the flexible printed circuit board on the presser plate;
A step of arranging a transport carrier at a position in contact with a pin provided in the pin base;
The pressurized conveying carrier by the pressing machine, raising the pressing plate in pushrod, said pressing plate away from the pin base of the pin, sandwiching the flexible printed circuit board between the transport carrier the pressing plates, the flexible Fixing the printed circuit board to the transport carrier;
Returning the pressing device and the push rod to a predetermined position;
And a step of taking out the carrier. A step of holding a pin base provided with a pin for positioning a flexible printed circuit board on a holding table;
Holding a press plate provided with a cushioning material on the pin base;
Positioning the flexible printed circuit board on the presser plate;
A step of arranging a transport carrier at a position in contact with a pin provided in the pin base;
Heating a pressing device placed on the back of the carrier;
The pressurized transport carrier in the pressing machine, raising the pressing plate in pushrod, the pressing plate away from the pin base of the pin, the transport carrier and the presser plates in the flexible printed circuit board for a predetermined time Heating and pressing, and fixing the flexible printed circuit board to the transport carrier;
Returning the pressing device and the push rod to a predetermined position;
A flexible printed circuit board fixing method comprising a step of taking out the transport carrier. A step of holding a pin base provided with a pin for positioning a flexible printed circuit board on a holding table;
Holding a press plate provided with a cushioning material on the pin base;
Positioning the flexible printed circuit board on the presser plate;
A step of arranging a transport carrier at a position in contact with a pin provided in the pin base;
The transport carrier is pressurized by a pressing machine, the presser plate is lifted by an extrusion bar, the presser plate is separated from the pin of the pin base, and the flexible printed circuit board is sandwiched between the transport carrier and the presser plate, and the flexible print A step of fixing the substrate to the transport carrier, a step of returning the pressing device and the extrusion bar to a predetermined position,
Removing the carrier,
Attaching the removed transport carrier to a hot plate jig;
And a step of fixing the flexible printed circuit board to the transport carrier by heating and pressurizing the transport carrier. Claim 7, characterized in that the resin layer of the transfer carrier is masked partially with a masking tape of the flexible printed circuit board not opposed to part and the flexible printed circuit board facing the portion of claim 9 the flexible printed circuit board fixing method according to. The flexible printed circuit board fixing method according to any one of claims 7 to 10, wherein a mesh is provided in the resin layer of the transport carrier. A flexible print using the flexible printed circuit board fixing apparatus according to any one of claims 1 to 6 for mounting an electronic component on the flexible printed circuit board, and holding the flexible printed circuit board on a transport carrier. Device for mounting electronic components on boards. A flexible print using the flexible printed circuit board fixing method according to any one of claims 7 to 11 for mounting an electronic component on the flexible printed circuit board, and holding the flexible printed circuit board on a transport carrier. A method for mounting electronic components on a board.

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