JP4515813B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounter for mounting an electronic component such as an IC chip on a side edge portion of a liquid crystal panel.

Conventionally, a liquid crystal driver mounting machine has been used when mounting electronic components such as an IC chip on the side edge of a liquid crystal panel.
FIG. 8 is an external view of a component mounter 800 in a main press bonding process of a conventional liquid crystal driver mounter. As shown in FIG. 8, two component mounting machines are provided, and a main press bonding process is performed for each of the horizontal direction and the vertical direction of the liquid crystal panel.

  The component mounter 800 includes a panel warp correction unit 801, a panel stage 802, a backup stage 803, an individual pressure head 804, and a sheet supply unit 805.

First, the liquid crystal panel 806 is transported to the position of the panel stage 802 via the transport rail.
The panel warp correction unit 801 corrects the warp of the liquid crystal panel 806 when the IC is finally bonded to the liquid crystal panel 806. By using the panel warp correction unit 801, the IC chip is mounted in parallel to the side edge of the liquid crystal panel 806.

On the panel stage 802, the liquid crystal panel 806 is placed, and the liquid crystal panel 806 is rotated during conveyance.
The backup stage 803 is supplied with an IC chip mounted from the sheet supply unit 805 and serves as a mounting table for performing pressurization and heat treatment for main press-fitting on the side edge of the liquid crystal panel 806.

A sheet supply unit 805 supplies a sheet on which an IC chip is mounted to the backup stage 803.
The pressure head unit 804 mounts the IC chip supplied to the backup stage 803 on the side edge of the liquid crystal panel by performing pressure treatment and heat treatment. As shown in FIG. 8, a method of mounting an IC using an individual pressure head unit 804 is called an individual pressure method (COG: Chip On Grass).

Conventionally, in addition to the individual pressurization method described above, a batch pressurization method (FOG: Film On Grass) is used as the pressurization method in the liquid crystal driver mounting machine.
Hereinafter, the batch pressurization method and the individual pressurization method used when the IC chip is mounted on the side edge of the liquid crystal panel in the main press bonding step will be described with reference to the drawings.

FIG. 9 is an external view for comparing the pressure head sections in the collective pressure method or the individual pressure method, which is the pressure method of the component mounting machine in the main pressure bonding process.
FIG. 9A shows the pressure head portion 901 in the main pressure bonding process in the collective pressure method. An IC chip supplied to the liquid crystal panel 904 from the sheet supply unit 903 to the backup stage 902 is collectively applied to the side edge of the liquid crystal panel 904 to perform pressure treatment and heat treatment. In the case of using the collective pressurization method, it is necessary to attach the IC chip together with a TCP (Tape Carrier Package). Further, in the collective pressurization method, since the IC chips are mounted on the liquid crystal panel all at once using a long pressurization head unit 901, the problem of tact is improved, and depending on the type of electronic component It is easy to change the TCP type.

  FIG. 9B shows the pressure head unit 905 in the main pressure bonding process in the individual pressure method. In the individual pressurization method, since the IC chips are individually mounted on the side edges of the liquid crystal panel 908 using the individual pressurization head 905, the IC chips having different thicknesses can be reliably mounted in parallel. .

By the way, a component mounter for mounting components on a liquid crystal panel without causing damage to substrates of various sizes and types has been disclosed (for example, see Patent Document 1).
The component mounter includes a pallet transport unit that transports a pallet that holds a substrate in the apparatus. The pallet transport unit includes a loading unit that supplies the substrate to the pallet, an ACF attachment unit that supplies the ACF tape to the substrate, Temporary crimping part that positions the component against the board and crimps it with the first crimping force, and crimps the component against the substrate with a second crimping force that is greater than the first crimping force to fix the component to the substrate The pallet is transported in the order of the main crimping part and the unloading part for removing the component-mounted board from the pallet.

Also disclosed are a component mounting panel recognition device, a liquid crystal panel component mounting device, and a liquid crystal panel component mounting method capable of mounting an electronic component at a specified component mounting location even when the panel is bent. (For example, refer to Patent Document 2).
JP 2003-78288 A JP 2001-232527 A

  In recent years, IC chips, TCPs, flexible boards, etc. are peeled off from the liquid crystal surface in environments where vibrations are frequently applied to the device itself, such as mobile terminals and car navigation devices equipped with a liquid crystal screen, which hinders screen display on the liquid crystal surface. There is a problem that occurs.

  In particular, the problem is conspicuous when the IC chip is mounted on the liquid crystal panel using the collective pressurization method described above. This is because when IC chips are mounted using the batch pressurization method, it is necessary to mount the IC chip together with the TCP, compared to the individual pressurization method in which the IC is directly mounted on the liquid crystal panel. This is because the number of connection points increases. As a result, the demand for a COF (Chip On Film) system in which an IC is directly mounted on a liquid crystal panel is rapidly expanding.

  Furthermore, when using the collective pressurization method, it is necessary to attach the TCP together with the IC, which causes a problem in terms of cost compared to the individual pressurization method that does not require the TCP. Is expanding.

  Furthermore, conventionally, a dedicated component mounting machine is used in the individual pressurization method, and a dedicated component mounting machine is used in the collective pressurization method. There is a demand for a component mounter that can handle the above.

  The present invention has been made in view of the above problems, and without using laboratories such as unit replacement or tool replacement of the pressure head unit, a batch pressure method or an individual pressure method is used. The object is to provide a component mounter that can be switched automatically.

In order to solve the above problems, a component mounter according to an embodiment of the present invention mounts the electronic component on the side edge of the liquid crystal panel in a crimping process for crimping the electronic component on the side edge of the liquid crystal panel. A component mounting machine, a head unit that performs a pressure process when the electronic component is crimped to a predetermined position of a side edge of the liquid crystal panel, and a stage that is a mounting unit for performing the crimping process; A tool that is detachably mounted on the lower surface of the head portion, and is sandwiched between the tool and the electronic component in accordance with a pressure treatment in the head portion, and a tool that crimps the electronic component in the crimping process in the stage. The TCP is provided at a position separate from the tool and directly contacts the electronic component in the crimping process, thereby joining the liquid crystal panel and the electronic component. And a low thermal expansion member plate to prevent, the tool is characterized by having a width of crimping at least two of the electronic component simultaneously.
Therefore, in the component mounter according to the present invention, by using a tool wider than the conventional one, at least two or more electronic chips as electronic components are simultaneously mounted on the side edge of the liquid crystal panel by a single mounting process. It is possible to reduce the number of electronic component mounting steps, and it is also possible to perform collective pressurization using a head unit for individual pressurization.

  The component mounting method according to one aspect of the present invention is a component used in a component mounting machine that mounts the electronic component on the side edge of the liquid crystal panel in a crimping step of crimping the electronic component on the side edge of the liquid crystal panel. A mounting method, wherein the component mounter includes a head unit that performs pressure processing when the electronic component is crimped to a predetermined position of a side edge of the liquid crystal panel, and a mounting unit that performs the crimping process. The stage, the low thermal expansion member plate between the tool and the stage, and a removably mounted lower surface of the head part, and the electron in the crimping process in the stage according to the pressurizing process in the head part. A tool for crimping a component, and a tool and an electronic component are provided separately from the tool at a position sandwiched between the tool and the electronic component. A low thermal expansion member plate that prevents the elongation of TCP that joins the liquid crystal panel and the electronic component by contacting with each other, and the tool has a width for simultaneously crimping at least two or more electronic components. The component mounting method includes: a pressurizing step for pressurizing the low thermal expansion member plate in the head unit; a moving step for moving the low thermal expansion member plate in the vertical direction; and the electronic component on the side edge of the liquid crystal panel. And a mounting step for mounting on the head.

  In order to achieve the above object, the present invention is a component mounting method using characteristic configuration steps of a component mounting machine, or a program capable of causing a computer to execute the steps included in this component mounting method. Or a liquid crystal driver mounting machine including the component mounting machine.

  The component mounter according to the present invention automatically switches between the pressurization method of the batch pressurization method or the individual pressurization method without the need to replace the component mounter unit itself or the tool to be mounted on the pressurization head unit. Therefore, the user can more easily select the two pressure method according to the type of the liquid crystal panel or IC chip.

Hereinafter, a component mounter according to the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 shows an overall view of an XL line of a liquid crystal driver mounting machine 100 including a component mounting machine according to the present invention. The component mounting machine according to the first embodiment is characterized in that it can cope with both the batch pressurization method and the individual pressurization method.

  In the description of the present embodiment, for example, the type of liquid crystal panel includes a liquid crystal display substrate (LCD substrate), a glass substrate such as a plasma display panel substrate (PDP substrate), a substrate including a flexible printed substrate (FPC substrate), The types of electronic components include IC chips and various semiconductor devices.

  As shown in FIG. 1, the process of the line-type liquid crystal driver mounting machine is an ACF attaching process 101 for attaching an anisotropic conductive tape (ACF tape) to the substrate, which is the first process, and 2 Component mounting according to the present invention, including a temporary press-bonding step 102 for temporarily press-bonding the component to the substrate as the third step and a final press-bonding step 103 for final press-bonding the component against the substrate as the third step The machine is used for the main crimping process 103.

First, the liquid crystal panel is conveyed to the ACF attaching process 101.
The ACF transporting process 101 is provided with an ACF sticking device, and this ACF sticking device is an adhesive tape containing conductive particles of about 3 μm, and is interposed between the liquid crystal panel and the electronic component to place the electronic component on the liquid crystal panel. An apparatus for adhering an anisotropic conductive film tape (hereinafter referred to as an ACF film tape) for electrically connecting an electrode of an electronic component and an electrode of a liquid crystal panel with the conductive particles by heating and pressing to the liquid crystal panel It is. Therefore, the ACF film tape can be used to conduct in the direction between the IC and the liquid crystal panel.

Next, the temporary pressure bonding apparatus in the temporary pressure bonding process 102 will be described.
The temporary crimping device is a device that performs a process of placing an IC on the ACF attached to the liquid crystal panel. Electronic components to be mounted on the side edges of the liquid crystal panel are placed on a tray or TCP tape (from tape to mold). A component holding device that is picked up from the cutout is provided, and the electronic component held by the component holding device is aligned with the side edge portion of the liquid crystal panel, and then attached to a predetermined position to perform temporary pressure bonding.

  In addition, the temporary press-bonding process 102 in the temporary press-bonding apparatus is, for example, a temperature of 80 to 90 degrees and a time of 0.1 seconds in the batch press method, and a temperature of 80 to 90 degrees and a time in the individual press method. Is performed in 0.5 to 1 second.

  Next, the main crimping process 103 in the liquid crystal driver mounting machine will be described. In the main crimping step 103, the electronic component that is temporarily crimped while being heat-treated and pressurized using a head unit for pressing is provided to the side edge portion of the liquid crystal panel. To do. Further, as shown in FIG. 1, the component mounting machine in the main press bonding step 103 is provided with two devices in the vertical direction of the liquid crystal panel and the horizontal direction of the liquid crystal panel. For example, in the individual pressure bonding process, a pressure bonding process is performed at 180 to 200 degrees for 10 seconds in the individual pressure method.

FIG. 2 is an external view of a component mounter 200 according to the present invention.
The component mounting machine 200 includes an invar plate 201, a backup stage 202, a tool 203, a pressure head 204, and a movable unit 205.

  The invar plate 201 is a member having a low thermal expansion, is provided between the tool 203 and the backup stage 202, and is provided to prevent the TCP from extending. The invar plate 201 can prevent the TCP resin from sticking to the tool 203 and extending during the main press bonding.

  The backup stage 202 serves as a placement unit for performing the main pressure bonding process using the pressure head 204. The tool 203 is detachably attached to the lower surface of the pressure head 204, and the tool 203 becomes a wide tool, so that a large number of ICs can be subjected to main pressure bonding by a single pressure process. The pressurizing head 204 performs a pressurizing process and a heating process through the tool 203 to perform a main press-bonding process to the side edge portion of the IC liquid crystal panel. The movable portion 205 is a movable portion for assisting the movement of the invar plate 201 in the vertical direction.

FIG. 3 is an external view of a component mounter 300 having another form.
The component mounter 300 includes an invar block 301 instead of the invar plate 201 included in the component mounter 200 described above. Further, the wide tool 203 is not attached to the lower surface of the pressure head 204.

The invar block 301 can be moved in the front-rear direction and the up-down direction by an actuator such as a motor and an air cylinder by being connected to the movable portion 303.
The component mounter 300 includes a storage unit for storing the Invar block when the Invar block 301 is moved backward.

  When performing the individual pressurization method, the invar block 301 is moved backward by the actuator and the main pressurizing process is performed using the individual pressurization head. On the other hand, when the collective pressurization method is used, the invar block 301 is moved forward. The main pressure-bonding process is performed using an invar block which can be moved to and collectively pressed.

  In addition, since the heating means using the heater 302 is attached to the invar block 301, the pressurizing process is performed using the head unit 204, and the heating process is performed using the invar block 301.

  For this reason, the use of the invar block 301 makes it unnecessary to change the tool when switching between the individual pressurization method and the collective pressurization method, and the invar block 301 also serves to prevent the TCP from extending. Therefore, it is possible to cope with both pressing methods in one component mounting machine, and the user can change the pressing method as appropriate according to the type of liquid crystal panel or IC.

  FIG. 4 is a side view for explaining the pressure head unit 204 of the component mounter 200 according to the present invention. FIG. 4A is a side view of a pressure head unit in a conventional component mounter, and one IC 401 temporarily bonded onto the ACF film tape 402 corresponds to one tool 403. Crimping has been done.

  As shown in FIG. 4B, the component mounter 200 according to the present invention uses a wide tool 203 to which two ICs 402 are finally crimped to one tool 203. The material of the tool 203 is, for example, diamond or ceramic having excellent thermal conductivity. The tool 203 is detachably attached to the pressure head 204.

FIG. 4C is a side view when the invar plate 201 is sandwiched between the IC 401 and the wide tool 203.
As described above, by using the wide tool 203, the main press-bonding process can be realized with the same effect as that of the collective pressurization method without changing the pressurizing head portion 294. The final pressure bonding of the IC that has been performed can be performed in one step.
In addition, the tool is changed manually.

FIG. 5 is a top view for explaining a connection state between the liquid crystal panel and the IC when each pressure method is adopted in the component mounter according to the present invention.
FIG. 5A is a top view when the IC 502 is mounted on the side edge of the liquid crystal panel 501 using the individual pressurization method, and the IC 502 is mounted directly on the side edge of the liquid crystal panel 501. FIG. It becomes. In the individual pressurization method, every other mounting head performs a final pressure bonding process of the IC. In FIG. 5A, for example, two pressure bonding processes are required. The number of outputs of the IC 502 mounted on the liquid crystal panel 501 corresponds to the number of pixels of the liquid crystal panel 501.

  FIG. 5B is a top view when the IC 504 is mounted on the side edge portion of the liquid crystal panel 503 using the collective pressurization method, and the IC 504 is connected to the liquid crystal panel 503 via the TCP 505. Therefore, in the collective pressurization method, the number of junction points is between IC and TCP, TCP and the liquid crystal panel, and is increased compared to the number of junction points using the individual pressurization method described above.

FIG. 6 is an external view of a transport unit of a liquid crystal driver mounter including the component mounter according to the present invention.
The transport unit of the liquid crystal driver mounting machine transports the liquid crystal panel 604 using a transport rail 602 that supports the liquid crystal panel 604 from the lower surface. Further, the rail width can be changed according to the size of the liquid crystal panel, and the liquid crystal panel 604 can be fixed by performing vacuum suction from the vacuum suction holes.

The transport rail 602 transports the liquid crystal panel 604 placed on the transport belt, for example, by rotating the transport belt using a drive motor.
Therefore, compared with the case of using two transfer arms generally used in a conventional liquid crystal driver mounting machine, the conventional liquid crystal panel is transported in an unstable state, the liquid crystal panel is dropped, the transport arm It is possible to solve problems such as rotation limitation.

FIG. 7 is an external view for explaining the function of the temporary pressure bonding device of the liquid crystal driver mounting machine 100 including the component mounting machine according to the present invention.
In the liquid crystal driver mounting machine 100 used in the present invention, various types of supply means can be used as the components supplied to the temporary crimping apparatus. For example, a stacking tray cassette 701 can be used in the IC supply unit, a punching die mounting TCP reel cassette 702 can be used in the TCP supply, and a stacking blister tray supply unit 703 can be used in the FPC supply.

  Therefore, in the component mounter according to the present invention, the invar block 301 of the low thermal expansion member that is movable between the pressure head 204 and the backup stage 202 in the front-rear direction and the up-down direction and is controlled by the thermocouple 302 is provided. Install.

A wide tool 203 is detachably mounted on the lower surface of the pressurizing head 204 so that a plurality of electronic components can be subjected to a main pressure bonding process at once.
Therefore, in the component mounters 200 and 300, there is no need to replace the unit in the main crimping process unit or the tool attached to the pressure tool, and one component mounter according to the type of liquid crystal panel or electronic component. Can be automatically switched to the individual pressurization method or the collective pressurization method required by the user.

  Further, by using the invar plate 201 or the invar block 301, the TCP sticks to the tool 203 or the pressure head 204 to be deformed, so that it is possible to prevent a problem that a negative effect is caused in the main pressure bonding process of the electronic component.

  Furthermore, in transporting the liquid crystal panel 604 between the steps of the liquid crystal driver mounting machine 100 used in the present invention, the liquid crystal panel 604 is supported and transported from below, so that the loss of the liquid crystal panel 604 during transport is improved. It becomes possible.

  The component mounting machine according to the present invention can be used in a liquid crystal driver mounting machine for producing a liquid crystal panel used in, for example, a car navigation device, a mobile phone, a liquid crystal television, and the like.

The whole XL line of a liquid crystal driver mounting machine provided with the component mounting machine concerning the present invention is shown. 1 is an external view of a component mounter according to the present invention. It is an external view of the component mounting machine which has another form. It is a side view for demonstrating the pressurization head part of the component mounting machine which concerns on this invention. It is a top view for demonstrating the connection state of a liquid crystal panel and IC when each pressurization system is employ | adopted in the component mounting machine which concerns on this invention. It is an external view of the conveyance part of a liquid crystal driver mounting machine provided with the component mounting machine which concerns on this invention. It is an external view for demonstrating the function of the temporary crimping | compression-bonding apparatus of a liquid crystal driver mounting machine provided with the component mounting machine which concerns on this invention. It is an external view of the component mounting machine in the main press-bonding process of the conventional liquid crystal driver mounting machine. It is an external view for comparing the pressurization head part in the collective pressurization method or the individual pressurization method which is the pressurization method of the component mounting machine in the main crimping step.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Liquid crystal driver mounting machine 101 ACF sticking apparatus 102 Temporary crimping apparatus 200,300 Component mounting machine 201 Invert plate 202 Backup stage 203 Tool
204 Pressurizing head 205 Movable part 301 Invar block 302 Thermocouple 303 Movable part 401 IC
402 ACF film sheet 501, 503 Liquid crystal panel 502, 504 IC
505 TCP
602 Transport rail 603 Vacuum adsorption unit 701 IC tray supply unit 702 TCP supply unit 703 FPC tray supply unit

Claims (2)

In a crimping process for crimping an electronic component to a side edge of a liquid crystal panel, a component mounter for mounting the electronic component on a side edge of the liquid crystal panel,
A head portion for performing pressure treatment when the electronic component is crimped to a predetermined position of a side edge portion of the liquid crystal panel;
A stage which is a mounting portion for performing the crimping step;
A tool that is detachably mounted on the lower surface of the head part, and that crimps the electronic component in the crimping process in the stage according to the pressure process in the head part ,
Provided as a separate body from the tool at a position sandwiched between the tool and the electronic component, and by directly contacting the electronic component in the crimping process, the TCP panel that joins the liquid crystal panel and the electronic component With a low thermal expansion member plate to prevent elongation,
The tool has a width for simultaneously crimping at least two or more of the electronic components. In a crimping process of crimping an electronic component to a side edge of a liquid crystal panel, a component mounting method used for a component mounter that mounts the electronic component on a side edge of the liquid crystal panel,
The component mounter is
A head portion for performing pressure treatment when the electronic component is crimped to a predetermined position of a side edge portion of the liquid crystal panel;
A stage which is a mounting portion for performing the crimping step;
A low thermal expansion member plate between the tool and the stage;
A tool that is detachably mounted on the lower surface of the head part, and crimps the electronic component in the crimping process in the stage according to the pressure process in the head part ,
The TCP is provided as a separate body from the tool at a position between the tool and the electronic component, and directly contacts the electronic component in the crimping process to join the liquid crystal panel and the electronic component. With a low thermal expansion member plate to prevent elongation,
The tool has a width for simultaneously crimping at least two or more electronic components,
The component mounting method includes:
A pressurizing step of pressurizing the low thermal expansion member plate in the head portion;
A moving step of moving the low thermal expansion member plate in the vertical direction;
A mounting step of mounting the electronic component on a side edge of the liquid crystal panel.

Images