KR102050477B1 - Device for mounting electric component and method for manufacturing a display member - Google Patents

Abstract

[PROBLEMS] To provide a mounting apparatus for an electronic component in which an electronic component having flexibility can be accurately mounted on a flexible display panel.
SOLUTION The mounting apparatus 1 of an electronic component has the stage 21 with the support part which supports the edge part of the display panel P from the lower side, and the pressing head which hold | maintains the electronic component W from the upper side ( 41, the first imaging device 43A for imaging the alignment mark provided on the edge portion of the display panel P from above, and the second imaging device for imaging the alignment mark provided in the electronic component W from below ( 43B) and a control device for aligning the positions of the display panel P and the electronic component W based on the relative position information obtained from the captured images of both alignment marks, and the first and second imaging devices 43A and 43B. ) And a control device for recognizing the relative positional relationship by acquiring the image of the calibration member 42j4, and finding and correcting the deviation of the positional relationship by comparing the recognition result with the reference value.

Description

TECHNICAL FIELD The manufacturing apparatus of the electronic component and the manufacturing method of the display member TECHNICAL FIELD

Embodiment of this invention relates to the mounting apparatus of the electronic component which mounts the flexible electronic component at the edge part of a flexible display panel, and the manufacturing method of a display member.

In the flat panel display market which is used as a display of a portable terminal such as a television, a personal computer or a smartphone, a liquid crystal display occupies an overwhelming penetration rate. Under such circumstances, an organic EL display having a feature of being able to be thinned without requiring a backlight recently and bendable by being formed on a flexible resin film is attracting attention, particularly in the small display market for portable terminals. I am getting it. For this reason, the mounting apparatus of the electronic component which can be bend | folded, ie, can be used suitably for the assembly of the flexible organic electroluminescent display, is calculated | required.

At present, as a mounting apparatus for general electronic components, an outer lead bonding apparatus (hereinafter referred to as an OLB apparatus) for a liquid crystal display is known (see Patent Document 1). However, no OLB device for organic EL displays is known. For this reason, the OLB apparatus for liquid crystal displays is used instead for the mounting process of the electronic component implemented at the time of manufacturing an organic electroluminescent display.

The OLB apparatus for liquid crystal displays mounts an electronic component on the display panel comprised by a glass substrate through an anisotropic conductive tape. In the mounting process using the OLB apparatus for liquid crystal display, first, the edge portion on which the electronic component of the display panel is mounted is held off the stage, and the electronic component is kept close to the edge of the display panel. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged by one camera under the display panel to recognize the relative positions of both. Thereafter, the edge portion of the display panel is held by the backup tool from the lower side, the electronic component is positioned on the display panel based on the recognized relative position, and the electronic component is heated to the edge portion of the liquid crystal panel through the anisotropic conductive tape. Pressurize and mount.

Patent Document 1: Japanese Patent Application Laid-Open No. 2006-135082

When the above-mentioned OLB device for liquid crystal display is applied directly to the manufacturing process of an organic electroluminescent display, an electronic component cannot be mounted precisely. That is, the inventors of the present application mount and display an electronic component on a display panel (hereinafter referred to as an organic EL panel) having flexibility as a component of an organic EL display using the above-described OLB device for a liquid crystal display as it is. An attempt was made to manufacture the member for use. Specifically, a chip on film (COF) having a width of 38 mm was mounted as an electronic component on an organic EL panel having a size of 5.0 inches and a thickness of about 0.2 mm, which are widely used in smartphones. As a result, it has been found that electronic components cannot be accurately mounted on an organic EL panel only by applying the OLB device for a liquid crystal display as it is. Specifically, mounting accuracy of about ± 3 μm is required in an organic EL panel for a smartphone, but it has become clear that such mounting accuracy cannot be satisfied.

The inventors found out that the following two factors influence the precision.

(1. Sagging occurs at the edges of the organic EL panel)

Since the display panel (henceforth a liquid crystal display panel) used for manufacture of a liquid crystal display bonded glass substrates whose thickness is 0.5-0.7 mm, it is comparatively high rigidity. For this reason, even if the edge portion of the liquid crystal display panel is kept at about tens of millimeters from the stage, the edge portion hardly sags downward under its own weight.

In contrast, in an organic EL panel, a polyimide (PI) film having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member on which an organic EL element is usually formed, has a thickness of about 0.1 to 0.2 mm as a supporting material. The rigidity is very low because a thin resin substrate formed by adhering to a polyethylene terephthalate (PET) film is used. Moreover, in the characteristic of a resin film, curvature and wrinkles may arise by elongation by moisture absorption, or the stress at the time of adhesion mentioned above. Therefore, in the organic EL panel, when the edge portion is held out from the stage by several tens of millimeters, the edge portion that protrudes easily sags down by its weight. When the edge portion of the organic EL panel sags downward, the position of the alignment mark formed on the edge portion by that amount is displaced in the horizontal direction. Therefore, in the position recognition of the alignment mark of the organic electroluminescent panel performed using a camera, the recognition position will shift | deviate.

When the inventors of the present application confirmed by experiment, the edge portion of the organic EL panel was kept 20 mm out of the stage in the same manner as in the case of the liquid crystal display panel of the same size, and sagging occurred at the edge portion. It was confirmed that the position shift of about 4 micrometers occurred in the horizontal direction (toward the stage side) by the position of the alignment mark. Moreover, when the edge portion of the organic EL panel sags downward, the alignment mark is inclined with respect to the horizontal state. In the case where the inclined alignment mark is imaged directly below, the image is shorter in comparison with the case where the length in the inclination direction of the imaged alignment mark is imaged in a horizontal state. That is, the shape of the alignment mark imaged by the inclination is deformed. As a result, the shape difference with the reference mark memorize | stored previously arises, and also an error arises in the recognition position of the alignment mark by this.

The inventors of the present invention compared the error of the recognition position in the alignment mark kept horizontally and the alignment mark inclined 5 ° with respect to the horizontal, and it was confirmed that the error of the alignment mark inclined by 5 ° was large on the order of 1 μm on average. . Here, the experiment was performed by tilting the alignment mark at 5 ° because the deflection caused when the edge portion was protruded 20 mm from the stage was measured with respect to the plurality of organic EL panels, and all deflections of 5 ° or more were confirmed.

(2. Variation of light reflection at the edge of the organic EL panel)

When imaging the alignment mark of an organic electroluminescent panel, illumination is made to be put under the camera. The illumination condition (irradiation light amount, irradiation angle, etc.) of this illumination is this reference panel using an organic EL panel (for example, an organic EL panel having a flat edge portion, hereinafter referred to as a "reference panel"). The alignment mark of is set on the conditions which can image favorably. From this, the edges of the organic EL panel actually picked up may have sag or warp, and the state of the organic EL panel is different from the edges of the reference panel. Becomes something else. As a result, there arises a problem that the alignment mark cannot be imaged clearly or at all. As a result of the experiments of the inventors of the present invention, when an alignment mark could not be imaged clearly, it was confirmed that a deviation of up to about 1 μm occurs at the recognition position.

Based on these findings, the inventors of the present invention plan to process a portion (support surface) that supports the edge of the organic EL panel flatly and to penetrate up and down to the portion corresponding to the alignment mark in order to suppress the sagging and bending of the edge of the organic EL panel. The through hole for imaging is formed, and the support member which can adsorb | suck and hold | maintain an edge part is attached to a stage, hold | maintains that the edge part of organic electroluminescent panel does not produce sag or curvature, and mounts an electronic component again in this state. Tried. However, even with the above countermeasures, the mounting accuracy of ± 3 μm could not be sufficiently satisfied. Upon receiving this result, the inventors of the present application conducted further studies and found that the following three factors are related.

(3. Problem of surface precision of organic EL panel)

Resin films, such as PI film and PET film which comprise an organic electroluminescent panel, are manufactured by thinly shape | molding and solidifying resin melt | dissolved by heating and a solvent, such as a solution casting method and a melt extrusion molding method, generally. The resin film thus produced is formed in the state of precision as it is thinly stretched, so-called as it is (a state in which the resin film is molded and left as it is, and no polishing or the like for finishing) is formed. Compared with the glass substrate which is chemically or physically polished later, the surface has fine irregularities (wrinkles). Moreover, this uneven | corrugated state is different from one side of the resin film and the other side. Therefore, when imaging an alignment mark with a camera, the advancing direction of the light reflected by the alignment mark changes with places.

For example, in the organic EL panel, the case where the wrinkles which become a concave curved shape arises in the upper surface part in which the alignment mark was formed is considered. The lower surface of the organic EL panel is approximately horizontal. When light is irradiated to the alignment mark of such an organic EL panel from the lower side through the through-hole of a support member, the light irradiated toward the one end (left end) part of an alignment mark first transmits through the lower surface of an organic EL panel. At this time, since the lower surface of the organic EL panel is a horizontal plane, the incident light is hardly refracted. The light reaching the interface between the top surface of the organic EL panel and the alignment mark is reflected on the interface. At this time, since the surface of the organic EL panel is inclined toward the alignment mark (from left to right) at the left end portion of the alignment mark, the surface of the organic EL panel is reflected toward the outside (left direction) at a reflection angle corresponding to the inclination. The reflected light is refracted because it is obliquely incident on the lower surface of the organic EL panel, and proceeds toward the outside (left direction).

On the other hand, the light irradiated toward the other end (right end) of the alignment mark is reflected in the opposite direction (right direction) at the reflection angle according to the inclination of the upper surface of the organic EL panel at the interface between the upper surface of the organic EL panel and the alignment mark, Further, when passing through the lower surface of the organic EL panel, the light is further refracted to proceed toward the outer side (right direction). Thus, when minute unevenness | corrugation (wrinkles) generate | occur | produce on the surface of the resin film in which the alignment mark was formed, the reflected light of the light irradiated toward the alignment mark M will follow a path different from the light path at the time of incidence, and enter the camera. In addition, the path of the reflected light varies depending on the portion of the alignment mark M. FIG. These become a factor which causes the recognition error of the alignment mark, and the position recognition precision of the alignment mark falls.

(4. Light transmittance problem of organic EL panel)

As mentioned above, the organic EL panel is formed by adhering a PI film to a PET film with an adhesive. Therefore, when the alignment mark formed on the upper surface side of the organic EL panel is imaged on the lower surface side of the organic EL panel, the light transmittance of the organic EL panel affects the recognition accuracy of the alignment mark. Specifically, no matter how the illumination is adjusted, it is difficult to clearly capture the edge portion of the alignment mark.

When the present inventors measured the light transmittance of the glass plate of a liquid crystal display panel and the resin substrate of an organic electroluminescent panel in the part in which the alignment mark was formed, the organic electroluminescent panel was about 7.4% lower than the liquid crystal display panel. . The inventors of the present application repeatedly recognize an alignment mark 10 times for the same liquid crystal display panel and the same organic EL panel using a liquid crystal display panel and an organic EL panel, and confirm the repeating accuracy of the recognition position of the alignment mark. did. As a result, the variation of the position recognition accuracy of the liquid crystal display panel was ± 0.3 µm, whereas the variation of the position recognition accuracy occurred ± 1.2 µm in the organic EL panel.

(5. Problem caused by structure of organic EL panel)

The organic EL panel is formed by bonding a plurality of resin films having different properties to each other with an adhesive or the like. Therefore, the light irradiated toward the organic EL panel enters the camera after passing through the interface between the other members several times.

Here, the structure which adhere | attached the PI film in which the organic electroluminescent element and the alignment mark were formed on the surface through the adhesive agent is considered. When light is irradiated from below toward the alignment mark of such an organic EL panel, the irradiated light passes through the interface between air and the PET film, the interface between the PET film and the adhesive layer, and the interface between the adhesive layer and the PI film. Light reflected at the interface between the PI film and the alignment mark passes through each of the above-described interfaces and enters the camera.

As described above, when the interface between the air and the PET film is inclined under the influence of the surface precision of the organic EL panel, the light is inclined with respect to the lower surface of the PET film, so that light is refracted at each of the above-described interfaces, The light reflected from the alignment mark is incident on the camera along a path different from the path from which the light is incident. Therefore, the recognition position of the alignment mark is shifted as much as the light is refracted. This also reduces the position recognition accuracy of the alignment mark. FIG. 11: is an image which picked up the circular alignment mark of organic electroluminescent panel (FIG. 11 (a)) and a liquid crystal display panel (FIG. 11 (b)). It can be confirmed that the distortion of the peripheral part of the alignment mark of the organic EL panel is large.

Moreover, the thin film with high reflectance may be formed in the back surface side of PI film by vapor deposition etc. in some cases. In this case, most of the light incident on the organic EL panel is reflected by the thin film. In that case, the alignment mark cannot be imaged clearly, and the positional recognition accuracy is significantly reduced. Moreover, carbon particle | grains may be contained in the PI film used as a base material for the purpose of antistatic etc. of an organic electroluminescent panel. In such a case, transmission of light is blocked by the carbon particles, making it difficult to image the alignment mark, and it is impossible to accurately recognize it.

This invention is made | formed in order to respond to the subject of the fall of the mounting precision of the electronic component which arises when the above-mentioned conventional OLB apparatus for liquid crystal displays is applied to the manufacturing process of an organic electroluminescent display, and is used for the display panel which has flexibility. Even if the electronic component which has flexibility is mounted by thermocompression bonding, it is providing the mounting apparatus of an electronic component and the manufacturing method of a display member which let the electronic component be mounted to a display panel with high precision.

The mounting apparatus of the electronic component of embodiment has the thickness of 20 micrometers or more and 500 micrometers or less, and the bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and is flexible to the some electrode arrange | positioned at the edge part of the display panel which is flexible. A display device as an electronic component mounting apparatus for mounting the electronic component on the display panel by connecting a plurality of terminals arranged in correspondence with the plurality of electrodes in a electronic component having a property through a bonding member. A stage on which a panel for disposition is arranged, having a support for supporting the edge portion on which the electronic component in the display panel is mounted from a lower side, the stage capable of moving in a horizontal direction together with the support, and the electronic component on an upper side In which the electronic components are thermocompression-bonded to the upper surface of the edge portion supported by the support portion, horizontally and vertically 1st imaging device which image | photographs the thermal compression head which can move to the direction, and the alignment mark provided in the said edge part of the said display panel from the upper side in the state in which the said edge part of the said display panel was supported by the said support part of the said stage. And a second imaging device for imaging the alignment mark provided on the electronic component from below while the electronic component is held by the thermocompression head, and from the captured images of the first imaging device and the second imaging device. Based on the obtained relative position information of the alignment mark of the display panel and the electronic component, the relative position of the stage and the thermocompression head is adjusted and adjusted to match the position of the display panel and the electronic component. To thermally compress the electronic component to the display panel by the thermocompression head in the A mounting operation control device for controlling the pre-stage and the thermocompression head, a calibration member used for recognizing a relative positional relationship between the first imaging device and the second imaging device, and the calibration member using the first imaging device; And a horizontal moving device for relatively moving the first imaging device, the second imaging device, and the calibration member in a horizontal direction so as to sequentially position at positions facing the second imaging device, and the first imaging device; A storage unit for storing the reference value of the relative positional relationship of the second imaging device, the first imaging device and the second imaging device to receive an image of the calibration member, and the first image based on the received image; Recognizing the relative positional relationship between the imaging device and the second imaging device, and comparing the recognized result with a reference value stored in the storage unit. Thereby, there is provided a correction operation control device which obtains a deviation of the relative positional relationship between the first imaging device and the second imaging device and corrects the alignment position of the display panel and the electronic component based on the obtained deviation. .

The manufacturing method of the display member of embodiment has the thickness of 20 micrometers or more and 500 micrometers or less and the bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, hold | maintain a flexible display panel on a stage, and the said display panel The support part which makes the edge part which has a some electrode of the support from the lower side by the support part provided in the said stage, and the some terminal provided corresponding to the said some electrode, and has flexible electronic components to a thermocompression head And a first imaging process of imaging an alignment mark provided at the edge portion of the display panel by a first imaging device from above the display panel supported by the support portion, and the column. Alignment mark provided in the said electronic component by the 2nd imaging device under the said electronic component hold | maintained by the crimping head. The display on the basis of a second imaging process for imaging and an image of the alignment mark of the display panel picked up in the first imaging process and an image of the alignment mark of the electronic component picked up in the second imaging process A position recognition step of recognizing the relative positional relationship between the panel and the electronic component; and adjusting the relative position of the stage and the thermocompression head based on the relative position relationship recognized at the position recognition step, and adjusting the positional relationship. And a thermocompression step of thermocompression bonding the electronic component to the display panel by the thermocompression head, wherein the supporting step, the holding step, the first imaging step, the second imaging step, and the position recognition step And repeatedly performing the thermocompression bonding step to thereby provide the plurality of electrodes of the electronic component with the plurality of electrodes of the display panel. A method of manufacturing a display member in which a terminal is continuously manufactured with a display member connected via a bonding member, the method comprising: an image of a correction member used for recognizing a relative positional relationship between the first imaging device and the second imaging device, A recognition step of allowing the first image pickup device and the second image pickup device to recognize the relative positional relationship between the first image pickup device and the second image pickup device, and by comparing the recognized result with a preset reference value. And a correction step of obtaining a deviation of the relative positional relationship between the first imaging device and the second imaging device, and correcting the alignment position of the display panel and the electronic component based on the obtained deviation.

According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted by thermocompression bonding on a display panel having the same flexibility as an organic EL panel, the electronic component can be mounted with high accuracy. Moreover, according to the manufacturing method of the display member of this invention, the display member which mounted the electronic component on the display panel with high precision can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the mounting apparatus of the electronic component in embodiment.
It is a side view of the mounting apparatus of the electronic component shown in FIG.
It is a perspective view which shows the press bonding apparatus of the mounting apparatus of the electronic component shown in FIG.
4 is a plan view illustrating an organic EL panel and an electronic component to be applied to the mounting apparatus of the embodiment.
It is a perspective view which shows the main crimping apparatus of the mounting apparatus of the electronic component shown in FIG.
FIG. 6 is a perspective view showing an example of a holder of an organic EL panel in the mounting apparatus for an electronic component shown in FIG. 1.
7 is a perspective view illustrating another example of the holder of the organic EL panel in the mounting apparatus for the electronic component shown in FIG. 1.
It is a top view which shows the mounting apparatus of the electronic component in other embodiment.
9 is a graph showing a variation in the mounting precision according to the first embodiment.
10 is a graph showing a variation in the mounting precision according to Comparative Example 1. FIG.
It is a figure which shows an example of the image which image | photographed the circular alignment mark of an organic EL panel and a liquid crystal display panel using the conventional OLB apparatus.

EMBODIMENT OF THE INVENTION Hereinafter, the manufacturing apparatus of the electronic component of embodiment and the manufacturing method of a display member are demonstrated with reference to drawings. The drawings are schematic, and the relationship between the thickness and the planar dimension, the thickness ratio of each part, and the like may be different from those in reality. The terms indicating the up and down directions in the description refer to the relative directions when the mounting surface of the electronic component of the display panel (organic EL panel) described later is up unless otherwise specified.

[Configuration of Mounting Device]

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows the structure of the mounting apparatus of the electronic component of embodiment, and FIG. 2 is a side view of the mounting apparatus of the electronic component of FIG. The mounting apparatus 1 of the electronic component shown in FIG. 1 and FIG. 2 is used for manufacture of the structural member (display member) of a display apparatus like organic electroluminescent display. That is, the mounting apparatus 1 uses the electronic component W which has flexibility, such as COF punched out of the carrier tape T, to the organic EL panel P as a display panel with flexibility as a bonding member. It is an apparatus used for manufacturing the display member mounted on the anisotropic conductive tape F and in which the electronic component W was mounted in organic electroluminescent panel P. FIG.

Here, the organic EL panel P is mainly formed with a member having flexibility. As the member having flexibility, for example, PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate) and the like are used. It is also possible to adhere and use these members with an adhesive agent. Organic EL panel P is 20 micrometers or more and 500 micrometers or less in thickness, and is comprised so that bending elastic modulus may be 2.5 GPa or more and 4.0 GPa or less. The organic EL panel P in this embodiment has the structure which adhere | attached the PI film in which the organic electroluminescent element was formed to the PET film which is a support material through an adhesive agent. Since the thickness (about 200 micrometers) of PET film is 10 times or more with respect to the thickness (about 10 micrometers) of PI film, it is thought that the bending elastic modulus of organic electroluminescent panel P is about the same as the bending elastic modulus of PET film.

Here, a bending elastic modulus shall be a value measured according to the test method prescribed | regulated by JISK7171: The method of calculating | requiring plastics-bending characteristic (March 22, 2016 revised edition). Specifically, the bending elastic modulus test is to support a test piece having a dimension of 80 ± 2 mm in length, 10.0 ± 0.2 mm in width, and 4.0 ± 0.2 mm in thickness to the support of the distortion measuring device having adjusted the distance between points to 64 mm. The center of the test piece is bent by lowering the indenter at a test speed of 2 mm / min. The test atmosphere is a standard atmosphere (temperature 23 ° C./humidity 50%) specified in JIS K7100.

As the electronic component W, an electronic component such as COF having flexibility is used. COF is formed by mounting a semiconductor element on a film type circuit board having flexibility formed by PI (polyimide) or the like. As described later, the COF is formed into pieces by being punched out of the tape-like film member.

The display member is obtained by mounting an electronic component W such as COF on a display panel such as an organic EL panel P through a bonding member such as an anisotropic conductive tape F. A display device such as an organic EL display It is a member used as a component part of the.

The mounting apparatus 1 of embodiment adsorbs and holds the punching apparatus 10 (10A, 10B) and the punched electronic component W which punch the electronic component W from the carrier tape T, and rotates intermittently. Intermittent rotation conveyance apparatus 20 to convey and the intermittent stop position in the middle of the conveyance path by the intermittent rotation conveyance apparatus 20 are arrange | positioned as a joining member to the electronic component W conveyed by the intermittent rotation conveyance apparatus 20 The anisotropic conductive tape adhesion device (bonding member adhesion device) 30 which adheres the anisotropic conductive tape F, and the electronic component W to which the anisotropic conductive tape F was stuck were attached to the organic EL panel P to the anisotropic conductive tape ( Pressing apparatus 40 press-bonded through F), main press apparatus 50 for main-pressing the electronic component W press-bonded to organic EL panel P by pressing apparatus 40, and punching apparatus Between the 10 and the intermittent rotation conveyance apparatus 20, the 1st transmission apparatus 60 which transmits the electronic component W, liver The agent which carries in the organic electroluminescent panel P with respect to the 2nd transmission apparatus 70 which delivers the electronic component W between the rotation conveyance apparatus 20 and the press bonding apparatus 40, and the press bonding apparatus 40. FIG. Organic EL panel P from the 1st conveyance part 80 and the 2nd conveyance part 90 which conveys organic electroluminescent panel P to this crimping apparatus 50 from the press bonding apparatus 40, and the main crimping apparatus 50. ), The punching device 10, the intermittent rotational conveying device 20, the anisotropic conductive tape adhesive device 30, the pressure bonding device 40, and the main compression device ( 50, the first delivery device 60, the second delivery device 70, the first conveying unit 80, the second conveying unit 90, the third conveying unit 100 and the like to control the operation It is comprised with the control apparatus 110. FIG.

(Punching device 10)

The punching apparatus 10 is for punching COF as the electronic component W from the carrier tape T, and is equipped with the 1st punching apparatus 10A and the 2nd punching apparatus 10B. The 1st punching apparatus 10A and the 2nd punching apparatus 10B have the same structure, and are arrange | positioned in the state left-right reversed when seen from the front of an apparatus. The first and second punching devices 10A, 10B are used one by one, and the carrier tape T of the other punching devices 10A, 10B is being punched out while punching is performed by one punching device 10A, 10B. ) Can be replaced.

The 1st and 2nd punching apparatus 10A, 10B is an electronic component (1) from the supply reel 11 by which the carrier tape T before punching was wound, and the carrier tape T supplied from the supply reel 11, respectively. The mold apparatus 12 which punches W), and the winding reel 13 which winds the carrier tape T by which the electronic component W was punched by the mold apparatus 12 are provided. The carrier tape T unwound from the supply reel 11 is changed in direction by the plurality of guide rollers 14 and the sprocket 15, and sent to the take-up reel 13 via the mold apparatus 12. Lose. Here, the sprocket 15 is disposed immediately in front of the mold apparatus 12 in the conveyance direction of the carrier tape T, and conveys a carrier tape T while conveying the carrier tape T by rotational drive by the drive motor which is not shown in figure. (T) can be positioned with respect to the mold apparatus 12.

The metal mold | die apparatus 12 is equipped with the upper metal mold | die 12a and the lower metal mold | die 12b arrange | positioned facing the upper metal mold | die 12a. The upper mold 12a includes a punch 12c on its lower surface. On the other hand, the die 12b which penetrates up and down in which the punch 12c enters is formed in the lower metal mold | die 12b. The electronic component W is punched from the carrier tape T by moving the upper metal mold | die 12a to the up-down direction in the state which supplied and positioned the carrier tape T with respect to such a metal mold | die apparatus 12. FIG. In addition, a suction hole (not shown) is formed in the front end surface of the punch 12c, and it is comprised so that the punched electronic component W can be adsorbed-held.

(Intermittent Rotation Carrier 20)

The intermittent rotation conveyance apparatus 20 arrange | positions in the relationship which the four arm part 21 of the same shape mutually orthogonally crosses, and makes the index table 22 and the index table 22 which have a cross shape in plan view 90 It is provided with the rotation drive part 23 which drives rotation intermittently by the interval. At the distal end of each arm portion 21 of the index table 22, a holding head 24 for sucking and holding the electronic component W is provided. At the four stop positions A to D of the index table 22 at every 90 °, to the receiving position A and the holding head 24 for receiving the electronic component W punched by the punching device 10. The gauging / cleaning position B for positioning (gauging) and cleaning with respect to the retained electronic component W, and the anisotropic conductive tape F with respect to the electronic component W held by the holding head 24. ), And a delivery position D for transmitting the electronic component W to which the anisotropic conductive tape F is attached to the pressure bonding device 40 is set.

(Anisotropic Conductive Tape Adhesion Device 30)

The anisotropic conductive tape adhesive device 30 is provided corresponding to the adhesive position C of the intermittent rotation conveyance apparatus 20, and the tape-shaped member which made the anisotropic conductive tape F adhere to the release tape R ( After the supply reel 31 on which S) is wound, the adhesive head 32 disposed at a position opposed to the holding head 24 positioned at the adhesive position C, and the anisotropic conductive tape F are peeled off The recovery part 33 accommodating the release tape R and the tape-shaped member S supplied from the supply reel 31 are guided to the recovery part 33 along a conveyance path passing through the adhesive position C. FIG. It is arrange | positioned downstream from the adhesion position C of the conveyance path | route of the some guide part 34 and the tape-shaped member S by the some guide part 34, and conveyance direction of the tape-shaped member S By reciprocating along this, the conveyance diameter of the chuck | zipper conveyance part 35 which intermittently conveys the tape-shaped member S by predetermined length, and the tape-shaped member S, Placing all of the adhesive location (C) on the upstream side and, and a anisotropic conductive tape (F) cut (36) for cutting only of the tape-like member (S).

The adhesive head 32 is an anisotropic conductive tape cut | disconnected to predetermined length in the terminal part of the electronic component W hold | maintained by the holding head 24 positioned in the adhesion position C, and conveyed and positioned to the adhesion position C. The adhesive tool 32a for pressing (F), the elevating drive part 32b which raises and lowers this adhesive tool 32a, and is built in the adhesive tool 32a, heating the adhesive tool 32a, and anisotropic conductive tape ( The heater 32c which adheres F) to the terminal part of the electronic component W is provided.

(Pressing device 40)

The pressure bonding device 40 adsorbs and holds the electronic component W to which the anisotropic conductive tape F is adhered by the anisotropic conductive tape adhesive device 30, and is a thermocompression head for press bonding to the organic EL panel P. The holding head 41 as a stand, the stage 42 for holding and positioning the organic EL panel P, and the organic EL panel P held at the stage 42 and the holding head 41 are held. And a position recognizing unit 43 for recognizing the relative position of the electronic component W.

The pressing head 41 includes a pressurizing tool 41a for holding and holding the electronic component W on its upper surface side, a tool driver 41b for moving the pressurizing tool 41a in the Y, Z, and θ directions, It has a heater 41c which is built in the pressurizing tool 41a, and heats the pressurizing tool 41a. As shown in FIG. 3, the stage 42 is provided integrally with the placement portion 42a on which the organic EL panel P is disposed and the placement portion 42a. The support part 42b which supports the edge part in which the component W is mounted below, and the stage drive part 42c which moves the mounting part 42a and the support part 42b integrally in the X, Y, Z, and (theta) directions Have

A plurality of adsorption holes 42e for adsorbing and holding the organic EL panel P are formed in the placement surface 42d on which the organic EL panel P in the arrangement portion 42a is disposed. This adsorption hole 42e is mainly arrange | positioned in the position which opposes the display area of the image in organic electroluminescent panel P, when the organic electroluminescent panel P is arrange | positioned at the mounting surface 42d. Although this example demonstrates with the example arrange | positioned at equal intervals in the area | region (region | region enclosed by the dashed-dotted line in FIG. 3) in which the organic EL panel P of the mounting surface 42d is arrange | positioned, the support part mentioned later Since at least the edge portion of the organic EL panel P supported by the 42b can be adsorbed and held flat, the organic EL panel P disposed on the placement surface 42d must be adsorbed and held in its entirety. It is not. For example, you may make it adsorb | suck and hold the area | region of about half or 1/3 of the length of organic electroluminescent panel P in the direction orthogonal to an edge part by the support part 42b side. Since the adsorption hole 42e adsorb | sucks the display area of organic electroluminescent panel P, it is preferable to set a hole diameter small so that an adsorption trace may not remain in a display area by adsorption | suction. The hole diameter may be obtained by a relationship between the suction force required for fixing the organic EL panel P and the deformation amount of the organic EL panel P due to the suction, by experiment or the like, and the size of the hole may be set so that no trace of adsorption remains. Moreover, you may comprise the mounting surface 42d by the vacuum chuck using a porous member, for example, porous ceramics.

As described above, the support portion 42b is an elongated member which is integrally provided with the placement portion 42a and supports the edge portion of the organic EL panel P, and has a flat upper surface as the support surface 42f. Formed. The height position of the support surface 42f is set to the same height as the height of the placement surface 42d of the placement portion 42a. Further, a plurality of adsorption holes 42g for adsorbing and holding the edge portion of the organic EL panel P are arranged in a plurality of rows along the longitudinal direction of the support surface 42f. As for the suction hole 42g of the support part 42b, the smaller one is preferable like the suction hole 42e of the mounting part 42a. However, the edge part of the organic EL panel P which the support part 42b supports is a part in which the electrode for the connection with the electronic component W is arrange | positioned, and is not a display area. Therefore, although the hole diameter does not need to be made smaller as the adsorption hole 42e of the arrangement | positioning part 42a, it is an edge part of organic electroluminescent panel P, and suction | suction is carried out in the part in which alignment mark PM (refer FIG. 4) was formed. It is not preferable to cause deformation due to deterioration in position recognition accuracy. It is preferable that the hole diameter and the attraction force of the suction hole 42g are set to a size such that deformation does not occur at the edge portion of the organic EL panel P. FIG. Further, the arrangement interval of the adsorption holes 42g is such that the edges of the organic EL panel P are in close contact with the supporting surface 42f in the entire area, so that the periods of the unevenness due to the warpage or the wrinkles occurring at the edges of the organic EL panel P are inclined. It is preferable to set it at shorter intervals.

Moreover, the correction | amendment member 42j is provided in the side part (side side part of the X-axis direction left side in FIG. 3) of the mounting part 42a and the support part 42b. In the plan view, the member 42j for straightening is formed by penetrating up and down on a rectangular block-shaped base member 42j1 and an extension line in the X-axis direction of the supporting portion 42b in the base member 42j1. It has a female-shaped recessed part 42j2, the rectangular transparent board | plate material 42j3, such as glass and resin, which fits in this recessed part 42j2, and the target mark 42j4 provided in the center of this transparent plate material 42j3. . The target mark 42j4 is imaged by each of the first imaging section 43a and the pair of imaging sections 43e1 and 43e2 described later, so that the correction values of the relative position shifts of these imaging sections 43a, 43e1, 43e2 are obtained. It is becoming available.

The stage drive part 42c moves in the X-axis direction drive part which moves the mounting part 42a and the support part 42b to the X-axis direction which is one direction of a horizontal direction, and moves to the Y-axis direction which is a horizontal direction orthogonal to an X-axis direction. The Y-axis direction drive part to be made, the Z-axis direction drive part which moves to the Z-axis direction orthogonal to a horizontal direction, and the (theta) drive part which rotates and moves in a horizontal plane are laminated | stacked in this order from the lower side. In addition, in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the stage driver 42c additionally includes a linear encoder in the X-axis direction driver and the Y-axis direction driver.

Next, the position recognition unit 43 will be described with reference to FIGS. 3 and 4. 4 is a plan view illustrating a schematic configuration of the organic EL panel P and the electronic component W that are positionally recognized by the position recognizing unit 43. In the drawings, the X-axis direction is described as the left-right direction. Organic EL panel P has the electrode string ER formed in the edge part, and a pair of alignment mark PM provided in the left and right both sides of the electrode string ER, respectively. The electronic component W has a terminal string TR arranged so as to correspond to the electrode string ER and a pair of alignment marks WM provided on both the left and right sides of the terminal string TR, respectively. The position recognition unit 43 recognizes the relative positional relationship of the pair of alignment mark PM of organic electroluminescent panel P and the alignment mark WM of the electronic component W. As shown in FIG.

This position recognition unit 43 includes a first imaging device 43A and a second imaging device 43B. The first imaging device 43A has the alignment mark PM provided at the edge portion of the organic EL panel P in a state where the edge portion of the organic EL panel P is supported by the support portion 42b of the stage 42. For imaging from the upper side. The 2nd imaging device 43B is for imaging the alignment mark WM provided in the electronic component W in the state in which the electronic component W was hold | maintained in the press bonding head 41. FIG.

The 1st imaging device 43A processes the 1st imaging part 43a which picks up the alignment mark PM of organic electroluminescent panel P with a still image, and the image which the 1st imaging part 43a picked up. It has an image processing part 43b. The first imaging unit 43a includes a camera 43c such as a CCD (Charge Coupled Device) camera including an imaging device, and a barrel portion 43d including an optical unit such as a telecentric lens. The 1st imaging part 43a is the position higher than the stage 42, and pressurization located in the mark recognition position which recognizes alignment marks WM and PM of the electronic component W and the organic EL panel P. FIG. It is supported to be located in the vicinity of the tool 41a (in the vicinity of the right side in FIG. 3). Moreover, the 1st imaging part 43a may be fixed to the frame which is not shown which supports the pressing tool 41a so that it can move to a Y, Z, (theta) direction, and is fixed directly to the mount of a device. It may be fixed to the support member.

The 2nd imaging device 43B is a 2nd imaging part 43e which picks up the alignment mark WM of the electronic component W as a still image, and the image which processes the image picked up by the 2nd imaging part 43e. It has a processing part 43f. The image processing unit 43f may be provided separately from the image processing unit 43b, but the image processing unit 43b and the image processing unit 43f may be used as one image processing unit, and the control device 110 described later. ) May serve as the functions of both image processing units 43b and 43f.

The 2nd imaging part 43e is equipped with the pair of imaging parts 43e1 and 43e2 arrange | positioned corresponding to the arrangement | positioning interval of a pair of alignment mark WM of the electronic component W. As shown in FIG. Each imaging unit 43e1, 43e2 has a barrel 43h with a camera 43g and an optical unit, respectively. Each of the imaging units 43e1 and 43e2 can be individually adjusted to the arrangement intervals of the alignment marks WM of the electronic component W by the X-direction moving device 43i.

The camera 43g is supported by the X-direction moving device 43i so that the optical axis is parallel to the X-axis direction in the horizontal direction. In the barrel portion 43h connected to the camera 43g, a prism 43j is disposed as an optical axis converting portion for converting the optical axis so that the optical axis faces directly above, and receives an image corresponding to the prism 43j. An opening 43h1 is formed as the inlet. The X direction moving apparatus 43i uses both imaging portions 43e1 and 43e2 to have the upper half in the X-axis direction so that the arrangement interval of the opening 43h1 coincides with the arrangement interval of the alignment mark WM of the electronic component W. It moves in synchronism with the direction to become. Although not shown, the coaxial illuminator is incorporated in the barrel portion 43h.

The image processing part 43b in the 1st imaging device 43A receives the imaging signal of the camera 43c, recognizes the alignment mark PM of the organic EL panel P obtained and received in the imaging area, and is aligned The data relating to the position of the mark PM (hereinafter referred to as "position data") is detected. The image processing unit 43b uses the known pattern matching processing to display an image that can obtain a matching pattern equal to or higher than a threshold and the reference pattern of the alignment mark PM of the organic EL panel P preset in the captured image. It recognizes as alignment mark PM of (P). And the position data of the recognized alignment mark PM is calculated | required based on a camera coordinate system. The obtained position data is transmitted to the control device 110.

The image processing unit 43f of the second imaging device 43B receives the imaging signal of the camera 43g, recognizes the alignment mark WM of the electronic component W obtained by being received in the imaging region, and the alignment mark WM. Is the position data (hereinafter referred to as "position data"). The image processing unit 43f uses the known pattern matching processing to display an image capable of obtaining a matching pattern of a reference pattern of the alignment mark WM of the electronic component W preset in the picked-up image and more than a threshold value. Is recognized as an alignment mark WM. Then, the position data of the recognized alignment mark WM is obtained based on the camera coordinate system. The obtained position data is transmitted to the control device 110.

(Main compression apparatus 50)

As shown in FIG. 5, the main crimping apparatus 50 includes a stage 51 for holding and positioning the organic EL panel P to which the electronic component W is pressed through the anisotropic conductive tape F. As shown in FIG. And a main compression head 52 for main compression of the electronic component W with respect to the organic EL panel P, and a main compression head 52 below the main compression head 52. The back-up part 53 which supports the pressed edge of the electronic component W in organic electroluminescent panel P from the lower side at the time of main compression, and the position recognition unit for recognizing the position of organic electroluminescent panel P. FIG. And 54 (54a, 54b).

The stage 51 has a disposition part 51a which arrange | positions organic electroluminescent panel P, and a stage drive part 51b which moves the disposition part 51a to an X, Y, Z, (theta) direction. The placement part 51a is a member which forms a rectangle in planar view, and the adsorption | suction hole for adsorbing-holding organic electroluminescent panel P in the mounting surface (upper surface) 51c which arrange | positions organic electroluminescent panel P ( A plurality of 51d) is formed. As for the adsorption hole 51d, like the adsorption hole 42e of the stage 42 of the press bonding apparatus 40, it is preferable to set a hole diameter small so that the adsorption | suction trace of organic electroluminescent panel P will not remain. The stage drive part 51b is the drive part which laminated | stacked the X-axis direction drive part, the Y-axis direction drive part, the Z-axis direction drive part, (theta) drive part in this order from the lower side similarly to the stage drive part 42c of the pressure bonding apparatus 40. FIG. to be.

The main crimping head 52 includes a pressing tool 52a for pressing the electronic component W pressed against the organic EL panel P on its upper surface side, and a tool driving unit for moving the pressing tool 52a in the Z-axis direction. 52b and the heater 52c which is built in the pressurizing tool 52a and heats the pressurizing tool 52a. The backup part 53 supports the backup tool 53a and the backup tool 53a which were formed in the length equivalent to the pressure tool 52a provided in the position just under the pressure tool 52a of the main crimping head 52, and the backup tool 53a. It has a supporting member 53b. The upper surface of the backup tool 53a is formed as a flat surface which supports the lower surface of the edge part to which the electronic component W of the organic EL panel P arrange | positioned at the mounting part 51a was pressed.

The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached downwards at predetermined intervals above the movement range of the organic EL panel P by the stage 51, and the organic EL panel P The alignment mark provided in the vicinity of the both ends in the edge part to which the electronic component W was pressed was image | photographed. The space | interval (predetermined space | interval) of the 1st and 2nd cameras 54a and 54b mentioned above is the space | interval of these alignment marks. In addition, this alignment mark is an alignment mark different from the alignment mark PM used for recognition of relative position data in the pressure bonding apparatus 40. FIG. An image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the picked-up image of the alignment mark of the organic EL panel P picked up by the first and second cameras 54a and 54b. The position of the alignment mark is detected.

(First delivery device 60)

The 1st delivery apparatus 60 has the receiving part 61 which adsorbs and hold | maintains the electronic component W punched from the carrier tape T from the lower side, and the receiving part 61 is the metal mold | die of the punching apparatus 10A, 10B. X, Y, Z, θ drive 62 for moving to the position just below the holding device 24 of the intermittent rotational conveying device 20 positioned directly below the position 12 and the receiving position A It is provided.

(Second delivery device 70)

The 2nd delivery apparatus 70 of the intermittent rotation conveyance apparatus 20 in which the receiving part 71 which sucks and hold | maintains the electronic component W from the lower side, and the receiving part 71 was positioned in the delivery position D was carried out. An X, Y, Z, θ drive unit 72 is provided for moving to the position just below the holding head 24 and the position just below the pressing head 41 of the pressing device 40.

(1st conveyance part 80)

The 1st conveyance part 80 is the holding body 81 which adsorbs-holds the organic EL panel P supplied from the supply part which is not shown from the upper side, and the organic EL by the supply part which is not shown in this holding body 81. The XZ drive part 82 for moving to the feeding position of the panel P and the carrying-in position of the organic EL panel P with respect to the stage 42 of the press bonding apparatus 40 is provided.

As shown in FIG. 9, the holder 81 adsorbs and holds the edge portion in which the electrode string ER on which the electronic component W in the organic EL panel P is mounted is formed. ) And a display area adsorption part (arranged adjacent to the electrode surface adsorption block 81a and adsorbing and holding a portion other than the portion adsorbed by the electrode surface adsorption block 81a in the organic EL panel P) 81b). The electrode surface adsorption block 81a is formed in the length which can adsorb | suck and hold the whole edge part in which the electrode row ER of organic electroluminescent panel P was formed, and is a rectangular parallelepiped member extended in the direction along this edge part. The suction surface 81c of the electrode surface suction block 81a is formed flat, and a plurality of suction holes 81d are formed. And similar to the support part 42b of the press bonding apparatus 40, this adsorption hole 81d has a hole diameter set to the magnitude | size so that distortion does not generate | occur | produce in the edge part of organic electroluminescent panel P, The edge portion on which the electrode string ER of the EL panel P is formed can be flattened and held. The display area adsorption part 81b is formed with the porous body or sponge which has a flat adsorption surface, and has many adsorption holes. The adsorption surfaces of the electrode surface adsorption block 81a and the display area adsorption portion 81b are adjusted to be positioned on the same plane.

Although one display area adsorption part 81b is shown in FIG. 6, several display area adsorption part 81b may be arrange | positioned side by side. As shown in FIG. 7, the display area adsorption part 81b is formed in the longitudinal direction of the electrode surface adsorption block 81a (the direction of the edge portion of the organic EL panel P held in the electrode surface adsorption block 81a). Are arranged side by side in the crossing direction (orthogonal direction in this embodiment). Two display area adsorption parts 81b are supported by the main body part 81e of the holding body 81 so that each can adjust the space | interval between the electrode surface adsorption block 81a. These display area adsorption | suction part 81b is called the surface (henceforth "a lower surface") holding the base part 81b1 made of metals, such as aluminum, and the organic EL panel P in this base part 81b1. ), A flat porous sheet 81b2 is provided. In the base portion 81b1, a roughly lattice suction groove communicating with the vacuum suction hole is formed on the lower surface thereof, and a vacuum suction force is applied to the entire area of the porous sheet 81b2 formed on the lower surface thereof, thereby providing the porous sheet 81b2. Organic EL panel P can be kept flat with substantially uniform suction force in the whole area | region. As the porous sheet 81b2, for example, one obtained by processing a porous molded body of resin in a film form can be used. By such a configuration, the holder 81 can be adsorbed and held even with a thin film-like organic EL panel P having flexibility, without causing any adsorption traces to be flat.

In addition, when arrange | positioning the organic EL panel P on the stage 42 of the press bonding apparatus 40, the electrode surface adsorption block 81a will be the upper surface (electrode surface) of the edge part in which the electrode of organic electroluminescent panel P was formed. ) Is pressed against the support 42b of the stage 42. Therefore, the electrode surface of the organic EL panel P is sandwiched between the flat adsorption surface 81c of the electrode surface adsorption block 81a and the flat support surface 42f of the support portion 42b, and the support portion is in a state of being flatly corrected. It is adsorbed and held by 42b. In addition, since the organic EL panel P is brought into contact with the placement surface 42d of the placement portion 42a in a state where the display area adsorption portion 81b adsorbs and holds the organic EL panel P evenly, the organic EL panel P is organic EL. The panel P is adsorbed and held by the placement portion 42a without wrinkles or the like even in the electrode surface.

(2nd conveyance part 90)

The 2nd conveyance part 90 is the holder 91 which adsorbs-holds the organic electroluminescent panel P by which the electronic component W was pressed by the press bonding apparatus 40, and this holder 91 ) Is moved from the stage 42 of the pressing device 40 to the carrying out position of carrying out the organic EL panel P and the carrying position of the organic EL panel P with respect to the stage 51 of the main pressing device 50. An XZ drive unit 92 is provided. The holding body 91 is provided with the display area adsorption | suction part formed with the porous body etc. with which the adsorption surface was flat and adsorbed and hold | maintained substantially the whole area | region in the upper surface of organic electroluminescent panel P. This display area adsorption part is comprised in the same way as the display area adsorption part 81b of the holding body 81. FIG.

(3rd conveyance part 100)

The 3rd conveyance part 100 is the holding body 101 which adsorbs and hold | maintains the organic electroluminescent panel P by which the electronic component W was main-bonded by the main crimping apparatus 50, ie, the display member from the upper side, The XZ drive part 102 for moving this holding body 101 to the carrying out position to which the organic electroluminescent panel P is carried out from the stage 51 of this crimping apparatus 50, and a delivery position to the carrying out apparatus not shown in figure. It is provided.

 (Control device 110)

The control apparatus 110 is a control part (mounting operation control apparatus) which controls the operation | movement which mounts the electronic component W in organic electroluminescent panel P, the 1st imaging device 43A and 2nd imaging device which are mentioned later ( It also serves as a control unit (calibration operation control device) for controlling a calibration operation for correcting the relative positional relationship of 43B). The control device 110 includes a storage unit 111. In this memory | storage part 111, the various information for controlling each part, such as the load in the press bonding apparatus 40, the heating temperature, and the reference position information of the alignment marks PM and WM, are stored. In the storage section 111, the time interval as a timing for receiving the image of the target mark 42j4 as the correction member by the first imaging device 43A and the second imaging device 43B or the mounting of the electronic component W. The number of times (mounting number) is stored in advance. Here, as a time interval which accepts an image, the elapsed time after mounting of the 1st electronic component W is set, for example every 10 minutes, every 30 minutes, etc. are set. The number of mountings sets the number of mountings (may be the number of mountings) after the first electronic component W is mounted, for example, every 100 times, every 300 times, or the like.

The images of the target marks 42j4 by the first and second imaging devices 43A and 43B may be repeatedly received at the same time interval or the same number of mounting times, or the intervals or the number of times are increased for each passage of time. Alternatively, it may be made smaller. For example, when the relative positional relationship of the imaging parts 43a, 43e1, 43e2 is changed by the expansion by the heat of the heater 41c built in the pressurizing tool 41a, since the temperature of the heater 41c is maintained at a fixed temperature, Since thermal expansion is considered to be saturated, the time interval or the number of mounting may be gradually increased in accordance with the increased state of thermal expansion. On the other hand, in the case where the fluctuation continues smoothly without the change in the relative positional relationship between the imaging units 43a, 43e1, 43e2 being saturated, the time interval or the number of mounting may be fixed to a predetermined value.

The control device 110 executes the reception of the target mark 42j4 image by the first and second imaging devices 43A and 43B based on the time interval or the number of mountings stored in the storage unit 111. For example, when a time interval of 30 minutes is set in the storage unit 111, measurement starts at the time when the first electronic component W is mounted, and the target mark 42j4 image is accepted every 30 minutes. Thus, the relative positional relationship between the three imaging units 43a, 43e1, 43e2 of the first and second imaging devices 43A, 43B is recognized.

[Operation of Mounting Device]

Next, operation | movement of the mounting apparatus 1 of embodiment is demonstrated. First, the carrier tape T is supplied from the supply reel 11 of the 1st punching apparatus 10A, and the electronic component W is punched from the carrier tape T by the metal mold | die apparatus 12. As shown in FIG. The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12c is transmitted to the receiving part 61 of the 1st transmission apparatus 60, and the reception position of the intermittent rotation conveyance apparatus 20 is received by the 1st transmission apparatus 60 ( Transferred to A). The electronic component W transferred to the receiving position A is transmitted to the holding head 24 of the intermittent rotation conveyance apparatus 20 positioned at the receiving position A. As shown in FIG. Moreover, the 1st delivery apparatus 60 receives the edge part in which the terminal string TR was formed by rotating the direction of the electronic component W by 90 degrees in the middle of conveying the electronic component W to the receiving position A. FIG. Align with the direction (Y direction) along the outer side surface of the holding head 24 positioned in the position A. As shown in FIG.

The electronic component W held by the holding head 24 is sequentially transferred to the gauging / cleaning position B, the adhesion position C, and the delivery position D by the intermittent rotation of the index table 22. . During this transfer, in the gauging / cleaning position B, the electronic component W is positioned relative to the holding head 24 by abutment of a positioning mechanism (not shown), and a rotary brush or the like not shown. Cleaning of dust attached to the terminal part is done by the cleaning mechanism of. In addition, in the adhesion position C, the anisotropic conductive tape F is adhere | attached to the terminal part of the electronic component W by the anisotropic conductive tape adhesive apparatus 30. FIG. When the positioning and cleaning are performed at the gauging / cleaning position B, and the electronic component W to which the anisotropic conductive tape F is adhered at the adhesive position C is positioned at the delivery position D, the electronic component ( W) is transmitted to the receiving portion 71 of the second delivery device 70 at the delivery position D. FIG. The electronic component W transmitted to the receiving part 71 is transferred to the position just under the pressing head 41 of the pressing device 40, and is transferred to the pressing head 41.

On the other hand, in parallel with the above-mentioned operation, the organic EL panel P is pulled out by the holding body 81 of the first conveying unit 80 from the supply unit not shown, and the stage 42 of the pressure bonding device 40 is used. Is placed in the supply. First, the holding body 81 of the 1st conveyance part 80 moves to the supply part which is not shown, and the holding surface of the holding body 81, ie, electrode surface adsorption | suction, is carried out on the upper surface of organic electroluminescent panel P prepared in the supply part. The adsorption surface 81c of the block 81a and the adsorption surface of the display area adsorption part 81b are made to abut. At this time, in the state where the organic EL panel P is lightly pressed by the holding body 81, the adsorption force of the electrode surface adsorption block 81a and the display area adsorption part 81b is exerted. By doing in this way, even when the organic EL panel P is bent or distorted, the organic EL panel P can be held in the holder 81 in a flat state.

Organic EL panel P hold | maintained by the holding body 81 is conveyed on the stage 42 of the press bonding apparatus 40. FIG. At this time, the stage 42 of the pressing device 40 is positioned at a supply position (a position indicated by a dashed-dotted line in FIG. 1) to receive the organic EL panel P from the holder 81. . Organic EL panel P conveyed on the stage 42 is arrange | positioned at the stage 42. At this time, the organic EL panel P is pressed onto the stage 42 and flattened by the lowering of the holder 81.

More specifically, in the organic EL panel P, the electrode surface is adsorbed and held on the adsorption surface 81c of the electrode surface adsorption block 81a of the holder 81, and the display area adsorption portion 81b is provided. The display area is held by adsorption and is kept in a flat state by these. In this state, since the organic EL panel P is pressed on the stage 42, the organic EL panel P is the adsorption surface 81c and the display area of the electrode surface adsorption block 81a of the holder 81. It fits between the adsorption surface of the adsorption part 81b, the support surface 42f of the support part 42b of the stage 42, and the placement surface 42d of the mounting part 42a. Therefore, the organic EL panel P is transmitted on the stage 42 while maintaining the planarized state, and is adsorbed and held on the stage 42.

At this time, in the state where the organic EL panel P is pressed on the stage 42, the suction force is applied to the adsorption hole 42g of the support part 42b of the stage 42 and the adsorption hole 42e of the placement part 42a. The suction force of the electrode surface adsorption block 81a and the display area adsorption part 81b of the holder 81 may be released after the operation of the holder 81, but before the suction force is applied to the stage 42, the holder 81 is applied. The suction force of may be released. By doing in this way, the restraint in the surface direction of the organic EL panel P clamped between the stage 42 and the holder 81 is reduced, so that the holder 81 in a state where warpage or distortion remains. Even if it is maintained at, the warpage and distortion can be expected to be corrected by flattening and flattening. For this reason, it is preferable to set the force which presses the holding body 81 to the stage 42 to the magnitude | size which does not interfere with the above-mentioned calibration.

When the organic EL panel P is held in the stage 42, the holder 81 moves to a supply unit not shown. The stage 42 moves to the pressing position by the pressing head 41. In this movement process, the alignment mark PM of the left and right of organic electroluminescent panel P is moved so that it may be located in the position (mark recognition position) directly under 1st imaging part 43a. The first imaging unit 43a receives an image of the organic EL panel P including the alignment mark PM whenever the alignment mark PM of the organic EL panel P is positioned directly below. The captured image of the alignment mark PM received is sent to the image processing part 43b, and is processed by the image processing part 43b, and the position data of each alignment mark PM is calculated | required. The obtained position data is sent to the control device 110. After recognition of the position data of each alignment mark PM is completed, organic electroluminescent panel P supported by the stage 42 is positioned in the pressing position where pressure bonding of the electronic component W is performed.

On the other hand, the press fitting head 41 holding the electronic component W moves to the pressing position from the transfer position that receives the electronic component W from the second transfer device 70. In this moving process, the electronic component W is moved to the mark recognition position. Imaging the alignment mark PM of the organic EL panel P with the upper 1st imaging device 43A, and imaging the alignment mark WM of the electronic component W with the lower 2nd imaging device 43B. Therefore, the organic EL panel P and the electronic component W positioned at the mark recognition position are in a state slightly separated in the horizontal direction as shown in FIG. 4. That is, as shown in FIG. 4, the electronic component W in the mark recognition position is connected to the terminal surface TR in the horizontal direction with respect to the electrode surface of the organic EL panel P positioned at the mark recognition position. The formed edge portion is positioned to face the edge portion adjacent to the edge portion where the electrode string ER is formed, and the lower surface of the electronic component W is slightly smaller than the electrode surface of the organic EL panel P with respect to the vertical (up and down) direction. Positioned to be a high position.

When the electronic component W is positioned at the mark recognition position, the camera 43g of the second imaging device 43B picks up the alignment mark WM of the electronic component W. In other words, the arrangement interval of the openings 43h1 in the pair of imaging units 43e1 and 43e2 of the second imaging apparatus 43B is adjusted to match the arrangement interval of the alignment marks WM of the electronic component W. It is becoming. For this reason, each alignment mark WM of the electronic component W positioned at the mark recognition position is in a state located above the corresponding opening 43h1, respectively. In this state, the pair of imaging sections 43e1 and 43e2 simultaneously receive an image of the alignment mark WM of the electronic component W. And the image of the received both alignment mark WM is sent to the image processing part 43f, and the position data of both alignment mark WM is calculated | required by the image processing part 43f. The obtained position data is sent to the control device 110.

The control apparatus 110 has position data of the left and right alignment mark PM of the organic EL panel P sent from the image processing part 43b, and the left and right alignment mark of the electronic component W sent from the image processing part 43f. Based on the position data of (WM), the relative position shift of X, Y, and (theta) directions of organic electroluminescent panel P and the electronic component W is calculated | required. Based on the obtained relative position shift, the tool driver 41b and the stage driver 42c are controlled so as to eliminate the position shift, and the organic EL panel P and the electrons are moved while the organic EL panel P is moved to the pressing position. Align the position of the part (W).

Specifically, the control apparatus 110, based on the position data of the left and right alignment marks PM of the organic EL panel P, the slope (θP) of the line segment connecting these two points and the coordinate of the midpoint of the line segment ( XP, YP) Moreover, the control apparatus 110 is based on the position data of the left-right alignment mark WM of the electronic component W, and the inclination (theta) W of the line segment which connects these two points, and the coordinate (XW, YW) of the midpoint of this line segment. ) The difference between the inclination and the coordinate of the midpoint obtained here is calculated as the relative positional shift between the two. From the obtained relative position shift, the position shift is corrected as follows.

First, the difference between the inclination θP of the line segments connecting between the alignment marks PM of the organic EL panel P and the inclination θW of the line segments connecting the alignment marks WM of the electronic component W is eliminated. In other words, the pressing tool 41a is rotated in the θ direction so that θP-θW = 0. Next, the stage 42 (stage) so that the midpoint of the line segment connecting between the alignment marks PM of the organic EL panel P coincides with the midpoint of the line segment connecting between the alignment marks WM of the electronic component W. The drive part 42c is driven. At this time, when the rotation center in the θ direction of the pressing tool 41a is deviated with respect to the position of the midpoint of the line segment connecting between the alignment marks WM of the electronic component W, the above-mentioned pressing tool 41a Since the position of the midpoint of the line segment shifts in the horizontal direction by the rotation of the pressing tool 41a by the rotation, the movement position of the organic EL panel P is performed by adding this position shift.

After correcting the positional shift between the organic EL panel P and the electronic component W, the pressing tool 41a is lowered by the driving of the tool driving section 41b. Thereby, the terminal part of the electronic component W is heat-pressed by the anisotropic conductive tape F to the electrode surface of the organic electroluminescent panel P at the preset heating temperature, the pressing force, and the pressurization time, and has electrode row ER. The electronic component W is press-bonded to the organic EL panel P whose edge part was supported by the support part 42b below. At this time, you may provide the backup member which supports the support part 42b of the stage 42 from the lower side, and may support the support part 42b from the bottom when pressurized by this backup member. By doing in this way, since distortion can be prevented from occurring in the stage 42 by pressurization, the rigidity of the stage 42 can be reduced and weight reduction can be attained. The load at the time of moving the stage 42 is reduced, the vibration at the time of the movement is aimed at, and stable and rapid movement and positioning are attained.

When the preset pressing time elapses, the suction of the electronic component W by the pressing tool 41a is released, and the pressing tool 41a rises. The pressurizing tool 41a is moved from the 2nd delivery apparatus 70 to the delivery position to which the electronic component W is transmitted. Moreover, the stage 42 which arrange | positions the organic electroluminescent panel P by which the electronic component W was pressurized is moved to the carrying out position which delivers organic electroluminescent panel P to the 2nd conveyance part 90. FIG. In this carrying out position, organic electroluminescent panel P has the upper surface similar to the holding | maintenance by the holding body 81 of the 1st conveying part 80 by the holding body 91 of the 2nd conveyance part 90. It is adsorbed and held by the formula and conveyed to the stage 51 of the main crimping apparatus 50.

The organic EL panel P supplied by the 2nd conveyance part 90 to the main crimping apparatus 50 is transmitted on the stage 51 located in the loading position, and is attracted and held on the stage 51. . The operation during this transfer is performed in the same manner as the transfer of the organic EL panel P from the first transfer section 80 to the stage 42. However, the point that the edge part of the organic electroluminescent panel P by which the electronic component W was press-bonded is maintained in the state which protruded from the stage 51 differs.

When the organic EL panel P is held by the stage 51, the stage 51 is moved to support the edge of the organic EL panel P on the upper surface of the backup tool 53a. In addition, position recognition of the alignment mark (mark separate from alignment mark PM) of organic electroluminescent panel P is performed by the position recognition unit 54 in the middle of this movement. Based on this position recognition result, the stage 51 is moved so that the electrode surface of organic electroluminescent panel P may be located in the correct positional relationship with the upper surface of the backup tool 53a. When the edge portion of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressing tool 52a is lowered by the driving of the tool driving unit 52b, and the organic EL panel is set at a preset heating temperature, pressing force, and pressing time. The electronic component W press-bonded to the panel P is main-bonded.

When the preset pressing time elapses, the pressing tool 52a is raised. Moreover, the organic EL panel P by which the electronic component W was main-bonded, ie, the stage 51 which arrange | positions the display member, is a carrying out position which delivers organic electroluminescent panel P to the 3rd conveyance part 100. Moreover, in FIG. Is moved to. At this carrying out position, the organic EL panel P is adsorbed-held by the holding body 101 of the 3rd conveyance part 100, and is conveyed to the carrying out apparatus which is not shown in figure.

The mounting operation including the pressing process to the organic EL panel P and the main pressing process of the electronic component W described above is repeated until there is no organic EL panel P to which the electronic component W should be mounted. Run it. In addition, in the mounting apparatus 1 of embodiment, although the improvement of positional accuracy is important for the press bonding process, it is important for the main crimping process to improve the crimping | strength strength and reliability by the anisotropic conductive tape F, and also the process The time is different. For this reason, the mounting efficiency of the electronic component W can be improved by applying the press bonding apparatus 40 and the main press apparatus 50, and performing a press bonding process and a main press process. However, the mounting apparatus 1 of embodiment is not limited to such a structure. The main crimping device 50 may perform the positioning process to the main crimping process. In that case, the support part 42b and the backup part 53 are provided in parallel to the stage 51 of the main crimping apparatus 50.

In the operation process of mounting the electronic component W described above, each time the time interval or the number of times of mounting stored in the storage unit 111 elapses, the control device 110 is connected to the imaging units 43a, 43e1, 43e2. Acceptance of the target mark 42j4 is performed. Based on the image data of the target mark 42j4 received by the imaging sections 43a, 43e1, 43e2, a correction operation for correcting the positional shift of the imaging sections 43a, 43e1, 43e2 is performed. That is, when aligning the position of the organic EL panel P and the electronic component W, the edge part of the organic EL panel P is supported by the support part 42b from below, and the alignment mark PM of the organic EL panel P is also supported. ) Is captured by the upper first imaging device 43A, and the alignment mark WM of the electronic component W is captured by the lower second imaging device 43B, so as to be described in detail later, a conventional OLB. Deterioration of the mounting accuracy due to sagging of the edge portion of the organic EL panel by the device, fluctuation of light reflection at the edge portion, and the like, alignment marks on the upper surface of the organic EL panel and alignment marks on the lower surface of the electronic component are simultaneously captured by one camera Therefore, the fall of the mounting precision based on the surface precision, the light transmittance of the organic EL panel, the structure of the organic EL panel, etc. by position recognition can be suppressed.

As described above, the alignment mark PM of the organic EL panel P is picked up by the upper first imaging device 43A, and the alignment mark WM of the electronic component W is lowered by the second imaging device ( 43B), and the mounting precision within +/- 3 micrometers was obtained by recognizing the relative position of organic electroluminescent panel P and the electronic component W based on the image information of these alignment marks, and adjusting the position. However, when such a mounting process is performed continuously, there exists a possibility that mounting precision may fall with time. The inventors of the present application repeatedly performed the mounting operation for about 5 hours without performing the calibration operation of the imaging unit, and then measured the mounting precision of the electronic component W. As time passed, a decrease in the mounting precision was recognized. .

Specifically, the time (tact time) required to mount one electronic component W was set to 10 seconds, and the mounting precision at the time of 3 hours and 5 hours after each start of mounting was measured, respectively. As a result, immediately after the start of mounting, the mounting position shift, that is, the relative position shift (X, Y, θ) of the organic EL panel P and the electronic component W becomes (-0.4 µm, 1.3 µm, -0.0059 °). , The mounting precision was within ± 3 μm. After 3 hours, the mounting position shift was (1.4 µm, -3.5 µm, -0.0063 °), and the mounting accuracy exceeded ± 3 µm. Moreover, when 5 hours passed, the mounting precision became (2.6 micrometer, -4.1 micrometer, -0.0067 degree), and the mounting precision exceeded +/- 3 micrometer. The phenomenon in which the mounting precision decreases or the mounting accuracy suddenly decreases as the time elapses is caused by simultaneous imaging of alignment marks PM and WM of the organic EL panel P and the electronic component W with one camera. When did not occur. For this reason, by using the two imaging devices 43A and 43B up and down, the shift | offset | difference arises in the relative position of these imaging devices 43A and 43B, and it is thought that mounting precision falls with time. For this reason, in the mounting apparatus 1 of embodiment, the position shift of the imaging parts 43a, 43e1, 43e2 based on the image data of the target mark 42j4 received by the imaging parts 43a, 43e1, 43e2. Perform a corrective action to correct this.

In accepting the above-described image, first, the stage driver 42c is moved so that the target mark 42j4 moves to a preset position (XY coordinate) immediately below the barrel portion 43d of the first imaging portion 43a in FIG. 3. To control. And if the target mark 42j4 is positioned under the barrel part 43d, the 1st imaging part 43a will image the target mark 42j4. The image processing unit 43b detects data (hereinafter referred to as "position data") regarding the position of the target mark 42j4 based on the captured image of the first imaging unit 43a. Here, the position data is XY coordinates. If no deviation occurs in the position of the first imaging unit 43a, this position data coincides with the coordinate of the movement position of the target mark 42j4. The image processing unit 43b detects the position data of the alignment mark PM, but also has a function of detecting the position data of the target mark 42j4. The position data of the target mark 42j4 detected in this way is transmitted to the control device 110.

When the imaging of the target mark 42j4 by the first imaging unit 43a is completed, the target mark 42j4 is previously located immediately above the opening 43h1 of the imaging unit 43e1 located on the right side of the drawing in FIG. 3. The stage driver 42c is controlled to move to the set position. And if the target mark 42j4 is positioned just above the opening 43h1, the imaging mark 43e1 will image the target mark 42j4. Similar to the image processing unit 43b, the image processing unit 43f detects and transmits the position data of the target mark 42j4 to the control device 110 based on the captured image of the imaging unit 43e1. Here, the image processing unit 43f also serves as a function of detecting the position data of the target mark 42j4.

In addition, when imaging of the target mark 42j4 by the imaging part 43e1 is completed, the target mark 42j4 advances immediately before the opening 43h1 of the imaging part 43e2 located in the left side of the figure in FIG. The stage driver 42c is controlled to move to the set position. And if the target mark 42j4 is positioned directly above the opening 43h1, the imaging mark 43e2 will image the target mark 42j4. The image processing unit 43f detects the position data of the target mark 42j4 based on the picked-up image of the imaging unit 43e2 and transmits it to the control apparatus 110 similarly to the above. In addition, the stage driver 42c includes a drive device for the stage 42 of the organic EL panel P during the mounting operation, first and second imaging devices 43A and 43B and the target during the calibration operation. It serves as a moving device (horizontal moving device) of the mark 42j4.

When the detection of the position data of the target mark 42j4 in each imaging section 43a, 43e1, 43e2 is completed, the control device 110 calculates the shift of the relative positions of the imaging sections 43a, 43e1, 43e2. That is, in the memory | storage part 111, the reference position of the target mark 42j4 is memorize | stored before every imaging part 43a, 43e1, 43e2. The reference position is the XY coordinate in this embodiment. The XY coordinate is the target mark (e.g., as described above using the respective imaging units 43a, 43e1, 43e2 in the previous step of starting the mounting of the electronic component W, for example). It can acquire by recognizing the position of 42j4).

The control apparatus 110 compares the position data of the target mark 42j4 for every imaging part 43a, 43e1, 43e2 which it actually detected, and the reference position corresponding to it, and compares each imaging part 43a, 43e1 with respect to a reference position. 43e2) is obtained. The relative position shift obtained for each of the imaging units 43a, 43e1, 43e2 is stored in the storage unit 111 as a correction value for each of the imaging units 43a, 43e1, 43e2. The correction value stored in the storage section 111 is used to determine the relative positional shift in the X, Y, and θ directions of the organic EL panel P and the electronic component W. FIG.

That is, the positional data of the alignment mark PM of the organic electroluminescent panel P, and the positional data of the alignment mark WM of the electronic component W by the 1st imaging device 43A and the 2nd imaging device 43B. Is obtained and these positional data are sent to the control device 110. The relative position shift in the X, Y, and θ directions of the organic EL panel P and the electronic component W is determined by the controller 110. At this time, if the correction value is stored in the storage unit 111, the control device 110 stores the position data of each alignment mark PM, WM sent from each of the imaging devices 43A, 43B in the storage unit 111. Correct with the correction value.

More specifically, regarding the position data of left and right alignment marks PM of the organic EL panel P recognized by the first imaging device 43A, the correction value stored as the correction value of the imaging unit 43a is used. The corrected value is referred to as position data (corrected position data). Regarding the position data of the alignment mark WM on the right recognized using the imaging unit 43e1 among the alignment marks WM of the electronic component W recognized by the second imaging device 43B, the imaging unit The value corrected using the correction value stored as the correction value for 43e1 is referred to as position data (correction position data). In addition, with respect to the position data of the left alignment mark WM recognized using the imaging unit 43e2, the position data (correction position data) is corrected using the correction value stored as the correction value of the imaging unit 43e2. )

Based on the correction position data of each alignment mark PM and WM thus obtained, relative position shifts in the X, Y, and θ directions of the organic EL panel P and the electronic component W are obtained. In addition, the position data detected using each of the above-described imaging units 43a, 43e1, 43e2 is stored in the storage unit 111 as a new reference position, thereby updating the stored reference position. That is, the reference position is updated each time at the timing of receiving the target mark 42j4 image by each of the imaging units 43a, 43e1, 43e2.

[Effects of Mounting Device]

According to the mounting apparatus 1 of the above-mentioned embodiment, the organic EL panel P which has flexibility is attached to the stage 42 provided with the support part 42b which supports the edge part in which the electronic component W is mounted below. And the alignment mark PM of the organic EL panel P in the state supported by this stage 42 by the 1st imaging part 43a of the 1st imaging device 43A from upper side, and pressurizing it. The alignment mark WM of the electronic component W of the state hold | maintained at the attachment head 41 is image | photographed by the pair of imaging parts 43e1 and 43e2 of the 2nd imaging device 43B from below. And based on these picked-up image, the relative positional relationship of organic electroluminescent panel P and the electronic component W is recognized, and based on the recognized relative positional relationship of organic electroluminescent panel P and the electronic component W, According to the position, the electronic component W is press-bonded to the organic EL panel P through the anisotropic conductive tape F, and then main bonding is performed.

In addition, at the timing stored in the storage section 111, by the pair of imaging sections 43e1 and 43e2 of the first imaging section 43a of the first imaging device 43A and the second imaging device 43B, The target mark 42j4 provided in the stage 42 is imaged, and each of the pair of imaging sections 43e1 and 43e2 of the first imaging section 43a of the first imaging device 43A and the second imaging device 43B is provided. The relative positional relationship between is recognized, and the alignment position of organic electroluminescent panel P and the electronic component W is correct | amended based on this recognition result.

In such a configuration, when detecting the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, the electrode in the organic EL panel P is formed. The edge portion is supported by the support portion 42b of the stage 42. Thereby, sagging of the edge part of organic electroluminescent panel P is prevented, and the position recognition precision of the alignment mark PM provided in the edge part can be improved. Moreover, the alignment mark PM of organic electroluminescent panel P is imaged from the upper side, and the alignment mark WM of the electronic component W is imaged from the lower side. Therefore, since the alignment mark PM formed in the upper surface of organic electroluminescent panel P can be imaged without passing through resin, such as PI and PET which comprise organic electroluminescent panel P, alignment mark PM It is possible to capture images stably and stably.

The pair of imaging sections 43e1 of the first imaging section 43a of the first imaging device 43A and the second imaging device 43B at the timing (time interval or number of times of mounting) stored in the storage section 111. And 43e2) to recognize the relative positional relationship between each of them, and correct the position alignment of the organic EL panel P and the electronic component W based on the recognition result. For this reason, even when the 1st imaging part 43a and a pair of imaging parts 43e1 and 43e2 are arrange | positioned independently of each other, the shift | offset | difference of the relative positional relationship with time progresses can be recognized. As a result, even if a deviation occurs in the relative positional relationship between the first imaging unit 43a and each of the pair of imaging units 43e1 and 43e2, it is possible to correct it. For example, in the case of repeating long-term continuous mounting such as 24 hours of operation, between the imaging units 43a, 43e1, 43e2 due to thermal expansion caused by a change in the internal temperature of the device under the influence of frictional heat of the movable part or a heat source such as a heater. Even if there is a so-called temperature drift in which the relative position of is misaligned, high mounting accuracy can be maintained by correcting it.

Thereby, the recognition precision of the relative position data of the alignment mark PM of organic electroluminescent panel P and the alignment mark WM of electronic component W can be improved. The alignment accuracy of the organic EL panel P and the electronic component W performed using such relative position data is improved, and as a result, the electronic component having flexibility in the organic EL panel P having flexibility ( Even in the case of mounting W), the mounting accuracy can be improved.

Further, a plurality of adsorption holes 42g are provided on the support surface 42f of the support part 42b supporting the edge portion on which the electronic component W in the organic EL panel P is mounted on the organic EL panel P. It is arranged to be formed at intervals shorter than a period of unevenness due to warpage and wrinkles generated at the edge portion of the edge), and the edge portion of the organic EL panel P is held by the support surface 42f. Thereby, since the edge part of organic electroluminescent panel P can be supported in a more flat state, alignment mark PM and the peripheral part of organic electroluminescent panel P are stably maintained in a horizontal and flat state, and alignment is carried out. The position recognition accuracy of the mark PM can be further improved.

Moreover, the edge part in which the electronic component W in organic electroluminescent panel P is mounted is made to adsorb | suck from below by the some adsorption hole 42g formed in the support surface 42f of the support part 42b. . Therefore, even when the resin constituting the organic EL panel P is bent to the edge portion of the organic EL panel P due to moisture absorption or the like, wrinkles occur, the edge portion of the organic EL panel P is supported by the support portion 42b. It can be made to adhere to the surface 42f. Thereby, alignment mark PM of organic electroluminescent panel P and its surrounding part can be stably maintained in a flat state, and the position recognition precision of alignment mark PM can be improved.

The holding body 81 of the 1st conveyance part 80 which supplies and arrange | positions organic electroluminescent panel P to the stage 42 is made into the flat adsorption surface 81c of the electrode surface adsorption block 81a, and the display area adsorption part ( On the flat suction surface of 81b), the surface holding the organic EL panel P is formed to be a flat surface. Thereby, even if the flexible organic EL panel P which tends to bend or distort is adsorbed and held on this flat holding surface, the holding body 81 can be held in a flat state. Therefore, the organic EL panel P can be arranged and held on the stage 42 in a flat state, thereby improving the position recognition accuracy of the alignment mark PM performed in the state held on the stage 42. The effect can be obtained stably.

When the organic EL panel P is disposed on the stage 42 by the holder 81, the organic EL panel P is supported by the holding surface of the holder 81. It is made to sandwich between the support surface 42f of 42b and the mounting surface 42d of the mounting part 42a. Thereby, the organic EL panel P can be transferred to the stage 42 while maintaining a flat state. Thereby, the organic EL panel P can be held in the stage 42 in a flat state, and the effect of improving the position recognition accuracy of the alignment mark PM performed in the state held by the stage 42 is further improved. It can be obtained stably.

In addition, a pair of alignment marks PM of the organic EL panel P is used for imaging the pair of alignment marks WM of the electronic component W using the pair of imaging units 43e1 and 43e2. Is taken by using a single imaging section 43a. That is, the imaging of four alignment marks WM and PM in total is performed by three imaging parts 43a, 43e1, and 43e2. In addition, imaging of a pair of alignment marks PM of the organic EL panel P by the single imaging unit 43a is performed by moving the organic EL panel P. FIG.

By using two cameras which image a pair of alignment marks WM of the electronic component W, and two cameras which image a pair of alignment marks PM of the organic EL panel P, a total of four cameras are used. In comparison with the case where the alignment marks WM and PM are recognized, the error caused during the so-called calibration can be reduced at the time of correcting the error due to the temperature drift using the target mark 42j4. That is, in the case of recognizing the position of the target mark 42j4 by the individual imaging units 43a, 43e1, 43e2, the position recognition error of the target mark 42j4 or the target mark (for each imaging unit 43a, 43e1, 43e2). A positioning error of 42j4) occurs. Therefore, as the number of cameras (image pickup units) increases, the influence of this error becomes larger. By suppressing the number of imaging sections 43a, 43e1, 43e2 to three, the above-described error can be reduced as much as possible.

By imaging the pair of alignment marks WM of the electronic component W by the two imaging units 43e1 and 43e2, it becomes possible to recognize the distance between the alignment marks WM. This makes it possible to recognize the difference between the reference interval between the alignment marks WM of the electronic component W, for example, the distance between the alignment marks WM in the design. From this, the amount of elongation of the electronic component W can be recognized. Therefore, the mounting precision of the electronic component W can be improved by reflecting the elongation amount of the electronic component W recognized here by the positioning position at the time of press bonding, the thermocompression conditions at the time of main compression, etc.

For example, regarding the positioning position of pressure bonding, in the terminal string TR of the electronic component W and the electrode string ER of the organic EL panel P, the terminal and the electrode are moved outward as they are directed from the center to the outside. There is a H-shaped terminal string or electrode string which is inclined toward the side and arranged so as to increase the inclination angle of the terminal or the electrode. When mounting the electronic component W and the organic EL panel P equipped with such a terminal string TR or an electrode string ER, the mounting precision is corrected by correcting the positioning position in the Y direction based on the above-mentioned amount of elongation. Can be improved.

In the thermocompression bonding at the time of main compression, the thermocompression bonding is carried out under the thermocompression conditions in which the elongation amount of the electronic component W is increased so as to suppress the expansion of the electronic component W generated at the main compression. As a result of experiments by the present inventors, it can be seen that the elongation suppression effect of the electronic component W is improved as the initial increase in the pressing force (time until reaching a predetermined pressing force) is steep. Based on this knowledge, it is conceivable to control the increase in the pressing force steeply as the amount of elongation of the electronic component W increases. In this case, as for the organic EL panel P, it can be considered that thermal expansion is caused by heating. Therefore, the stretching tendency of the elongation of the organic EL panel P due to the heating at the time of the main compression is examined in advance by experiment or the like. It may be grasped and added to the main crimping conditions.

In addition, this invention is not limited to said embodiment. For example, although an organic electroluminescent panel was mentioned as an example and demonstrated as a display panel, it is not limited to this. For example, it is also possible to use the structural member of the flexible electronic paper as a display panel.

In addition, although the anisotropic conductive tape F was used for connection of organic electroluminescent panel P and the electronic component W, it is not limited to this. Another joining member, for example, an adhesive containing conductive particles, may be used. When using an adhesive agent, it is possible to use a thermosetting or photocurable adhesive agent.

The structure of the 1st-3rd conveyance parts 80, 90, 100 is not limited to what was mentioned above, A different structure may be sufficient. For example, instead of using the porous sheet, a plurality of adsorption openings may be used in soft rubber or a resin material such as foamed urethane rubber or silicone rubber.

Although the organic EL panel P was conveyed using the 2nd conveyance part 90 from the stage 42 of the crimping | compression-bonding apparatus 40 to the stage 51 of this crimping apparatus 50, it demonstrated to this. It is not limited. For example, the stage 51 of the main crimping device 50 can be moved to a position close to the stage 42 of the crimping device 40, so that the stage 42 of the crimping device 40 is close to the stage 42. You may make it convey the organic EL panel P with respect to the stage 51 of the main crimping apparatus 50 which moved to using the 1st conveyance part 80. In other words, the first conveying unit 80 may serve as the second conveying unit 90.

In addition, although taking into account the image of the target mark 42j4 performed for every preset timing was performed once per each imaging part 43a, 43e1, 43e2, it is not limited to this. For example, the image capturing unit 43a, 43e1, 43e2 may be accepted several times, and the average value of the positions of the target marks 42j4 recognized several times may be recognized as the positions of the target marks 42j4.

The main compression apparatus 50 may be provided in the mounting apparatus 1 in consideration of the difference between the process time of a press bonding process and a main compression process. In addition, instead of providing several main compression apparatuses 50, the stage 51 which can arrange several sheets of organic electroluminescent panel P in parallel in one main compression apparatus 50 is provided, and multiple parallelisms are provided. The main crimping head 52 which can main-compress the electronic component W on the organic EL panel P arranged in a batch or individually may be provided. Here, in the case of main compression at a time, the main compression head 52 is equipped with a pressing tool 52a having a length that can cover the entire regions of the plurality of organic EL panels P arranged in parallel. Moreover, when main-bonding individually, the pressing tool 52a of the length which can cover the electronic component W mounted in one organic EL panel P is matched with the arrangement | positioning interval of organic EL panel P. It is equipped with the main crimping head 52. It is preferable to comprise each pressurizing tool 52a so that a pressing force can be set individually.

Although the edge part in which the electrode column ER of organic electroluminescent panel P was formed to be adsorb | sucked by the holding body 81 of the 1st conveyance part 80 is not limited to this. For example, when the anisotropic conductive tape F adheres to the electrode string ER of the organic EL panel P, other members are not brought into contact with or contact with the electrode string ER of the organic EL panel P. In the case where there is a situation in which it is not desired, the edge portion may be kept in a state in which the edge portion is protruded from the holder 81 without being adsorbed and held on the edge portion where the electrode string ER of the organic EL panel P is formed. . Thus, even when the electrode portion ER of the organic EL panel P is protruded and adsorbed and held, the flexible organic EL having a thickness of 20 µm or more and 500 µm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less In the case of a panel (display type panel), the vicinity of the electrode string ER is adsorbed and held on the flat adsorption surface 81c of the holder 81, so that warpage or wrinkles occur on the edge where the electrode string ER is formed. Even if the flat support surface 42f of the support part 42b of the stage 42 is attracted and held along the edge part by the adsorption force of the some adsorption hole 42g, it can be made to adsorb | suck and hold.

Although the correction of the position recognition error of each alignment mark PM and WM by the relative positional shift of the imaging parts 43a, 43e1, and 43e2 using the target mark 42j4 was demonstrated about the so-called temperature drift correction, Is not limited to the above-described method, but may be other methods.

For example, as the reference position of the target mark 42j4, the position of the target mark 42j4 recognized using each of the imaging units 43a, 43e1, 43e2 in the previous step of starting the mounting of the electronic component W is used. The positions of the design image capturing units 43a, 43e1, 43e2, and more specifically, the viewing center positions of the design cameras 43c, 43g may be used as reference positions. In other words, an absolute reference position may be set.

Although the reference position of the target mark 42j4 is updated every time the image of the target mark 42j4 is received by the imaging units 43a, 43e1, and 43e2, the reference position stored at the beginning is used as the reference position as it is. It may be used continuously, that is, the reference position may not be updated. Even in this case, the same effect can be obtained.

In addition, the single target mark 42j4 is fixedly disposed on the placement portion 42a of the stage 42, and the stage mark 42 is moved to position the target marks 42j4 of the respective imaging portions 43a, 43e1, 43e2. Although the position is given at, it may be configured as follows.

For example, a calibration glass substrate having three target marks attached thereto is prepared on one glass substrate in accordance with the arrangement position of the imaging units 43a, 43e1, 43e2, and the calibration glass substrate is placed on the placement unit 42a. It is arranged in a preset positional relationship using. At this time, the two target marks picked up by the imaging sections 43e1 and 43e2 for the electronic component W are empty by a predetermined amount toward the position where the pressing head 41 is positioned on the supporting section 42b of the stage 42. Let it come out. Thereby, the target mark can be picked up by the imaging sections 43e1 and 43e2 from below. And the stage 42 which arrange | positioned the calibration glass substrate is moved so that three target marks may be located in the reference position of each imaging part 43a, 43e1, 43e2. In this state, the corresponding target marks are recognized using the respective imaging sections 43a, 43e1, 43e2, respectively, and the relative position shifts of the respective imaging sections 43a, 43e1, 43e2 with respect to the reference position are recognized.

In addition, a dedicated target mark may be disposed for each of the imaging units 43a, 43e1, 43e2. Specifically, the target mark is formed in the state where positioning and retreat are possible with respect to the position immediately above or just below the respective imaging sections 43a, 43e1, 43e2. By placing this target mark in the position immediately above or just below each imaging part 43a, 43e1, 43e2 from a retreat position for every preset timing, and using each imaging part 43a, 43e1, 43e2, You may make it possible to recognize the relative position shift | offset of each imaging part 43a, 43e1, 43e2 with respect to a reference position. In this case, it is preferable to make each target mark directly support the frame of the mounting apparatus 1 in order to prevent as much as possible the relative positional shift between each target mark.

Furthermore, the lighting device may be incorporated in the support surface 42f of the support portion 42b of the stage 42. Specifically, a lighting apparatus is built in a portion of the supporting surface 42f opposite to the alignment mark PM of the organic EL panel P, and the alignment mark PM is performed by the first imaging unit 43a. ), The light is irradiated from the lower side of the alignment mark PM. By doing in this way, a large contrast difference can be obtained between the image of alignment mark PM and a background image, compared with the case where imaging alignment mark PM is imaged by reflected light, and the image of alignment mark PM is seen more. It can obtain clearly, and the improvement of recognition accuracy can be aimed at. Instead of a built-in lighting device in the support 42b, a light-transmitting window may be provided, or the support 42b may be formed of a light-transmissive member, for example, a transparent glass material, so that light may be irradiated through them.

In the above-mentioned embodiment, although the structure which adheres the anisotropic conductive tape F to the electronic component W was demonstrated, it is not limited to this. The anisotropic conductive tape F may be adhered to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape adhesive device 30 in the adhesion position C of the intermittent rotation conveyance apparatus 20, the organic EL panel P is located upstream of the supply part of organic electroluminescent panel P. What is necessary is just to provide the anisotropic conductive tape adhesion device which sticks the anisotropic conductive tape F to the inside. For example, a mounting apparatus 201 such as shown in FIG. 8 may be applied. 8 illustrates a configuration of the mounting apparatus 201 of another embodiment.

[Mounting Device According to Another Embodiment]

The mounting apparatus 201 shown in FIG. 8 arrange | positions the anisotropic conductive tape adhesion apparatus 230, the press bonding apparatus 240, and the main press apparatus 250 side by side in the X direction, and the Y of the press bonding apparatus 240 is arranged. The punching apparatus 210 is arrange | positioned in the direction back, and the conveying apparatus 260 which conveys the electronic component W is arrange | positioned between the press bonding apparatus 240 and the punching apparatus 210, and it has the structure. The 1st-4th conveyance part 271, 272, 273, 274 of organic electroluminescent panel P is arrange | positioned between each processing apparatus 230, 240, 250. As shown in FIG. This mounting apparatus 201 supplies four organic electroluminescent panels P, and performs processing by each processing apparatus 230,240,250. The punching apparatus 210 punches the electronic component W from the carrier tape T, and has the same structure as the punching apparatus 10 demonstrated in embodiment mentioned above.

In the anisotropic conductive tape adhesive apparatus 230, the anisotropic conductive tape F is stuck by organic electroluminescent panel P. FIG. In the anisotropic conductive tape adhesive apparatus 230, two arrangement | positioning parts 231 and 232 which hold two sheets of organic electroluminescent panel P side by side in the X direction are arrange | positioned side by side in the X direction. These arrangement | positioning parts 231 and 232 are each provided so that a movement to XYZ (theta) direction is possible. In addition, the adhesion units 233 and 234 of the anisotropic conductive tape F are disposed corresponding to the two placement portions 231 and 232. Each arrangement part 231, 232 sequentially positions the organic EL panels P on the placement parts 231, 232 at the adhesion positions of the corresponding adhesion units 233, 234, respectively. Each adhesion unit 233,234 adheres the anisotropic conductive tape F to organic electroluminescent panel P located in the adhesion position.

The pressure bonding device 240 press-bonds the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is attached. The pressure bonding device 240 includes an electronic component W in a placement portion 241 for holding four organic EL panels P side by side in the X-direction, and an organic EL panel P held in the placement portion 241. When pressing the electronic component W to the organic EL panel P by the pressing head 242 and the pressing head 242 to press the pressure, the organic EL panel P is not shown. Does not have a backup tool. The mounting portion 241 is provided to be movable in the XYZθ direction, and sequentially positions the four organic EL panels P on the mounting portion 241 to the pressing position by the pressing head 242. The pressing head 242 sequentially press-bonds the electronic component W to the organic EL panel P positioned at the pressing position. In addition, of course, the press bonding apparatus 240 is equipped with the position recognition apparatus similar to the press bonding apparatus 40 demonstrated in embodiment mentioned above.

Here, the electronic component W punched by the punching device 210 is sequentially supplied to the pressing head 242 by the conveying device 260. That is, the conveying apparatus 260 is movable by the XYZθ driving part 261 in the XYZθ direction, and includes a receiving part 262 which sucks and holds the electronic component W from the lower side, from the punching unit 210. The electronic component W is received and delivered to the pressurized head 242.

The main crimping apparatus 250 main-presses the electronic component W press-bonded to the organic EL panel P. FIG. The main crimping apparatus 250 arranges four placement parts 251, 252, 253, and 254 which hold the organic EL panel P individually one by one in the X direction. In addition, four main compression heads 255, 256, 257, and 258 are provided corresponding to the four placement parts 251, 252, 253, and 254. The main compression heads 255, 256, 257, and 258 are provided to be able to individually adjust the pressing force and to be able to move up and down collectively. The individual placement parts 251, 252, 253, 254 are movable in the XYZθ direction, and the organic EL panel P can be positioned with respect to the corresponding main compression heads 255, 256, 257, 258. have. The four main compression heads 255, 256, 257, and 258 collectively perform main compression on the four organic EL panels P positioned by the four placement units 251, 252, 253, and 254. Do it.

The 1st-4th conveyance parts 271, 272, 273, and 274 transfer four organic electroluminescent panels P simultaneously with each processing apparatus 230,240,250. That is, the 1st-4th conveyance parts 271, 272, 273, 274 provide four holding parts which hold | maintain and hold | maintain organic electroluminescent panel P from the upper side, respectively. And the 1st conveyance part 271 simultaneously transmits four organic electroluminescent panels P to the anisotropic conductive tape adhesion device 230 from the supply part which is not shown in figure. The 2nd conveyance part 272 transfers four organic electroluminescent panels P simultaneously from the anisotropic conductive tape adhesive apparatus 230 to the pressure bonding apparatus 240. FIG. The 3rd conveyance part 273 delivers four organic electroluminescent panels P simultaneously from the press bonding apparatus 240 to the main crimping apparatus 250. The 4th conveyance part 274 carries out four organic electroluminescent panels P simultaneously to the carrying out part not shown from the main crimping apparatus 250. FIG. The present invention can also be applied to the mounting apparatus 201 having such a configuration.

EXAMPLE

Next, the Example of this invention and its evaluation result are described.

(Example 1)

Using the mounting apparatus 1 of embodiment mentioned above, the experiment which confirmed the mounting precision by TEG (Test Element Group) on the following conditions was performed. Here, TEG means the member for evaluation produced for the test, and the member for evaluation of organic electroluminescent panel P was produced here. Specifically, a TEG of an organic EL panel having a size of 5 inches (120 mm × 65 mm) was produced using a glass plate having a thickness of 0.5 mm. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was used. In addition, the reason why TEG of organic electroluminescent panel P was produced with the glass plate is in order to prevent the influence of a curvature, a distortion, and a transmittance as much as possible for the convenience of confirmation of the positioning precision mentioned later. Hereinafter, TEG of organic electroluminescent panel P is simply called organic electroluminescent panel P. FIG. The target accuracy was set to ± 3 μm, which is the general precision required for organic EL panels used for smartphone display panels.

<Experimental conditions>

Heater of pressurized head: OFF

Tact time: 10 seconds (However, the movement speeds of the pressure bonding tool 41a and the placement part 42a were the same as in the case of mounting with 5 seconds of tact.)

Repetition time (number of times): 4.8 hours

Temperature Drift Correction: Once Every 360 Times

In experiment, first, the organic EL panel P is arrange | positioned at the mounting part 42a in the state which is in a standby position, and the electronic component W is hold | maintained in the pressurizing tool 41a. The standby position is a supply position that receives the organic EL panel P from the first conveyance portion 80 with respect to the placement portion 42a, and electrons from the second delivery device 70 with respect to the pressing tool 41a. It is a position to receive the component (W). In this state, the organic EL panel P and the electronic component W are positioned at the mark recognition position prior to the pressure bonding. At this time, the pressurizing head 41a is positioned in the state rotated in the horizontal direction of θ = + 5 °. This is to confirm the correction accuracy of the rotation shift.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are recognized using the first and second imaging devices 43A and 43B, and based on this recognition result, the organic EL panel ( Align the position of P) with the electronic component (W). In addition, this positioning does not overlap the edge part of the electronic component W with respect to the edge part of organic electroluminescent panel P, but the edge part of organic electroluminescent panel P and the edge part of electronic component W are few. It is performed in the state which opposes at a distance. Specifically, alignment marks PM and WM are aligned so as to space 3.3 mm apart. Since the distances from the alignment marks PM and WM to the edges are approximately 0.6 to 1.2 mm, respectively, the edges are arranged at intervals of 0.9 to 2.1 mm.

When the alignment is completed, the alignment mark of the organic EL panel P and the alignment mark of the electronic component W are put in the same field of view from the lower side using the second imaging device 43B to simultaneously capture an image, and the organic EL panel ( The relative positional shift between P) and the electronic component W is recognized. That is, the alignment marks on the right side of the organic EL panel P and the electronic component W are put in the same field of view of the image capturing unit 43e1 of the second imaging device 43B and imaged simultaneously, and the left alignment marks are second to each other. The image is taken within the same field of view of the image capturing section 43e2 of the image capturing apparatus 43B and imaged simultaneously. And the relative position shift calculated | required from this recognition result is recorded as mounting precision.

Moreover, the support part 42b which supports the edge part of organic electroluminescent panel P formed the notch which penetrated up and down at the position corresponding to the alignment mark, and produced for the experiment which made it possible to recognize the alignment mark even from the lower side. Used one. The organic EL panel P is made of a glass plate in order to prevent as much as possible the influence of warpage, wrinkles, or transmittance of the TEG on the recognition accuracy even when the alignment mark is recognized through the TEG.

(Comparative Example 1)

Comparative Example 1 differs only in that it does not perform "temperature drift correction", and the other conditions were made the same as Example 1 mentioned above.

In Example 1 and Comparative Example 1 described above, the above-described repetition time (4.8 hours) was recorded for movement of the organic EL panel P and the electronic component W, recognition of each alignment mark, and recording of relative position shift. Was carried out continuously. The measurement result of Example 1 is shown in Table 1 and FIG. The measurement result of the comparative example 1 is shown in Table 2 and FIG. As a result shown in these tables and figures, in the data (approximately 1800 times) acquired during the repetition time, the average value (1) of the first to tenth data and the average value (10) of data for each ten times therefrom ((2) to (18) is shown in Table 1 and Table 2 as "relative position shift recognition result", respectively. "Difference with the measurement result of (1)" in Table 1 and Table 2 is the value which subtracted the 1st data (1) from the average value ((2)-(18)) of data every 100 times. 9 and 10 show variations in the "difference from the measurement result of (1)". As is clear from the comparison of Table 1 and FIG. 9 and Table 2 and FIG. 10, the variation in the mounting accuracy can be significantly suppressed by performing the “temperature drift correction”. Therefore, it turns out that the mounting precision of the electronic component which has flexibility with respect to a flexible display panel can be maintained for a long time.

[Table 1] [Table 2] Difference between measurement time, relative position shift recognition result and measurement result of (1)

On the other hand, although some embodiments of the present invention have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and its modifications are included in the scope and spirit of the invention, and are included in the invention and equivalent scope thereof as described in the claims.

DESCRIPTION OF SYMBOLS 1: Mounting apparatus, 10 (10A, 10B): punching apparatus, 12: metal mold | die apparatus, 20: intermittent rotation conveying apparatus, 21: arm part, 24: holding head, 30: anisotropic conductive tape adhesive apparatus (bonding member adhesive apparatus) 32: adhesive head, 40: pressure bonding device, 40, 41: pressure bonding head, 42: stage, 42a: placement portion, 42b: support portion, 42c: stage drive portion, 42j: calibration member, 42j 3: transparent plate, 42j4: target mark, 43: position recognition unit, 43A: first imaging device, 43B: second imaging device, 43a: first imaging unit, 43e (43e1, 43e2)): second imaging unit, 43b, 43f: image Processing unit, 50: main compression apparatus, 51: stage, 52: main compression head, 53: backup unit, 60: first delivery device, 61: receiver, 70: second delivery device, 71: receiver, 80: first 1 conveying part, 81 holding body, 81a: electrode surface adsorption block, 81b: display area adsorption part, 90: 2nd conveying part, 91: holding body, 100: 3rd conveying part, 101: holding body, 110: control Device, 111: memory, F: anisotropic conductive tape, P: organic EL panel, W: electronic Products.

Claims (12)

In an electronic component having flexibility in a plurality of electrodes having a thickness of 20 µm or more and 500 µm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less and arranged on the edge portion of the display panel having flexibility, In the mounting apparatus of the electronic component which mounts the said electronic component to the said display panel by connecting several terminal arrange | positioned corresponding to the said some electrode through the bonding member,
A stage on which the display panel is arranged, having a support portion supporting the edge portion on which the electronic component in the display panel is mounted from below, the stage being movable in a horizontal direction together with the support portion;
A thermocompression head movable in a horizontal direction and a vertical direction to hold the electronic component from above, and to thermally compress the electronic component to an upper surface of the edge portion supported by the support portion;
A first imaging device for imaging the alignment mark provided on the edge portion of the display panel from an upper side in a state where the edge portion of the display panel is supported by the support portion of the stage;
A second imaging device for imaging the alignment mark provided on the electronic component from the lower side in a state where the electronic component is held by the thermocompression head;
The position of the display panel and the electronic component to be aligned based on the relative position information of the alignment panel of the display panel and the electronic component obtained from the captured images of the first imaging apparatus and the second imaging apparatus. A mounting operation control for adjusting the relative position between the stage and the thermocompression head and controlling the stage and the thermocompression head to thermocompress the electronic component to the display panel by the thermocompression head in an adjusted position relationship; Device,
A calibration member for use in recognizing a relative positional relationship between the first imaging device and the second imaging device;
Relatively moving the first imaging device, the second imaging device, and the calibration member in the horizontal direction so as to sequentially position the calibration member at positions facing the first imaging device and the second imaging device. With horizontal shifter,
A storage unit that stores a reference value of relative positional relationship between the first imaging device and the second imaging device;
Causing the first imaging device and the second imaging device to accept an image of the calibration member, and recognize a relative positional relationship between the first imaging device and the second imaging device based on the received image; The deviation of the relative positional relationship between the first imaging device and the second imaging device is obtained by comparison of the reference value stored in the storage unit with the result of the comparison between the display panel and the electronic component. Calibration behavior control to correct the alignment
Including,
The alignment mark of the display panel is a pair of alignment marks provided on both sides of the plurality of electrodes of the display panel,
The alignment mark of the electronic component is a pair of alignment marks provided on both sides of the plurality of terminals of the electronic component,
The first imaging device is positioned above the stage, and the thermocompression head is disposed near a thermocompression position for thermocompression bonding the electronic component to the edge portion of the display panel.
The second imaging device includes a pair of imaging devices, and the pair of imaging devices arrange a pair of alignment marks of the electronic component below a surface on which the display panel is disposed in the stage. The mounting apparatus of an electronic component which is arrange | positioned corresponding to the space | interval. The method of claim 1,
The storage section further stores a time interval as a timing for receiving an image of the calibration member or the number of times the electronic component is mounted by the thermocompression head.
The correction operation control device is configured to execute image reception of the calibration member by the first imaging device and the second imaging device based on the time interval or the number of mountings stored in the storage unit. Mounting device. The method of claim 1,
The correction operation control device stores the relative positional relationship, which is recognized by accepting an image of the calibration member as the first imaging device and the second imaging device, as the new reference value in the storage unit. Mounting device. The method of claim 1,
The said calibration member is equipped with the target mark which can image in both upper and lower directions, and is fixed to the said stage, The mounting apparatus of the electronic component. The method of claim 1,
And the support portion has a plurality of adsorption holes for adsorbing and holding an edge portion of the display panel. The method of claim 1,
Further comprising a conveying unit for supplying the display panel to the stage,
The said conveyance part is a display area adsorption part which adsorbs and hold | maintains parts other than the part adsorbed by the electrode surface adsorption block in the said display panel, and the electrode surface adsorption block in the said display panel. The mounting apparatus of the electronic component containing the holding body which has. The method of claim 6,
The display area adsorption unit has an adsorption surface formed flat and a porous sheet provided on the adsorption surface. The method according to claim 6 or 7,
The display area adsorption units are arranged in parallel in a direction intersecting the edges of the display panel adsorbed and held on the electrode surface adsorption block, so that each of the display area adsorption blocks can be adjusted to be spaced apart from the electrode surface adsorption block. The mounting apparatus of the electronic component which is provided. The method of claim 1,
A punching device for punching the electronic component from a carrier tape,
An intermittent rotation conveying device having a plurality of holding heads for holding the electronic component punched by the punching device and intermittently rotating the holding head;
A bonding member adhesive device which is disposed in a conveyance path of the electronic component by the intermittent rotation conveying apparatus and adheres the bonding member to the electronic component;
A pressure bonding device including the stage, the thermocompression head, the first imaging device, and the second imaging device, and press-bonding the electronic component to which the bonding member is adhered by the bonding member adhesion device to the display panel. Wow,
A main compression device for main compression of the electronic component press-bonded to the display panel by the pressure bonding device;
A first transfer device for transferring the electronic component between the punching device and the intermittent rotary transfer device;
A second transfer device for transferring the electronic component between the intermittent rotation transfer device and the pressing device;
Carrier part which conveys the said display panel from the said pressure bonding apparatus to the said main compression apparatus
Including,
The pressing device and the main pressing device are disposed adjacent to each other,
The said intermittent rotation conveyance apparatus and the said punching apparatus are arrange | positioned in the order of the said intermittent rotation conveyance apparatus and the said punching apparatus in the direction orthogonal to the said adjacent direction with respect to the said pressure bonding apparatus. The method of claim 1,
A punching device for punching the electronic component from a carrier tape,
A bonding member adhesive device for adhering the bonding member to the edge portion on which the electronic component punched by the punching device is mounted in the display panel;
A pressure bonding device including the stage, the thermocompression head, the first imaging device, and the second imaging device, for pressing and bonding the electronic component to the display panel through the bonding member;
A main compression device for main compression of the electronic component press-bonded to the display panel by the pressing device;
A transfer device for transferring the electronic component between the punching device and the pressing device;
A conveying unit for conveying the display panel from the bonding member adhesive apparatus to the pressing apparatus;
Another conveyance part which conveys the said display panel from the said pressure bonding apparatus to the said main compression apparatus
Including,
The bonding member adhesive device, the pressing device and the main pressing device are arranged in this order,
The punching device is an electronic component mounting device that is disposed in a direction orthogonal to the arrangement direction with respect to the pressing device. delete delete

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