JP6663940B2 - Electronic component mounting apparatus and display member manufacturing method - Google Patents

Description

  An embodiment of the present invention relates to an electronic component mounting apparatus for mounting a flexible electronic component on an edge of a flexible display panel, and a method for manufacturing a display member.

  In the flat panel display market used as a display of a portable terminal such as a television, a personal computer, and a smartphone, a liquid crystal display has an overwhelming prevalence. Under such circumstances, in recent years, an organic EL display having a feature that it can be thinned without a backlight and can be bent by being formed on a flexible resin film has been used especially for a portable terminal. Is attracting attention mainly in the small display market. For this reason, there is a demand for an electronic component mounting apparatus that can be bent, that is, can be suitably used for assembling a flexible organic EL display.

  At present, as a general electronic component mounting apparatus, an outer lead bonding apparatus (hereinafter, referred to as an OLB apparatus) for a liquid crystal display is known (see Patent Document 1). However, an OLB device for an organic EL display is not known. For this reason, an OLB device for a liquid crystal display is used instead of an electronic component mounting process performed when manufacturing an organic EL display.

  An OLB device for a liquid crystal display mounts electronic components on a display panel made of a glass substrate via an anisotropic conductive tape. In a mounting process using an OLB device for a liquid crystal display, first, an edge of a display panel on which electronic components are mounted is protruded from a stage and held, and the electronic component is brought close to the edge of the display panel. Hold. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged from below the display panel by one camera, and the relative positions of the two are recognized. Thereafter, the edge of the display panel is held by a backup tool from below, the electronic components are aligned with the display panel based on the recognized relative positions, and the edge of the liquid crystal panel is positioned via an anisotropic conductive tape. The electronic parts are mounted on the part by heating and pressing.

JP 2006-135082A

  When the above-described OLB device for a liquid crystal display is directly applied to a manufacturing process of an organic EL display, electronic components cannot be mounted with high accuracy. That is, the present inventors use the above-described OLB device for a liquid crystal display as it is, and as a component of an organic EL display, a flexible display panel (hereinafter, referred to as an organic EL panel) as an electronic component. And tried to manufacture a display member. Specifically, a 38 mm wide COF (Chip on film) was mounted as an electronic component on an organic EL panel having a size of about 5.0 mm and a thickness of about 0.2 mm, which is widely used in smartphones. . As a result, it was found that simply applying the OLB device for a liquid crystal display as it is cannot accurately mount electronic components on an organic EL panel. Specifically, an organic EL panel for a smartphone requires a mounting accuracy of about ± 3 μm, but it has been found that such an mounting accuracy cannot be satisfied.

The present inventors have determined that the following two factors affect accuracy.
(1. Occurrence of dripping at the edge of the organic EL panel)
A display panel used for manufacturing a liquid crystal display (hereinafter, referred to as a liquid crystal display panel) has a relatively high rigidity because glass substrates having a thickness of 0.5 to 0.7 mm are bonded to each other. Therefore, even if the edge of the liquid crystal display panel is held off by several tens of mm from the stage, the edge hardly hangs down by its own weight.

  On the other hand, in an organic EL panel, usually, a polyimide (PI) film having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member on which an organic EL element is formed, is provided with a thickness as a support material. Has a very low rigidity because it uses a thin resin substrate formed by adhering to a polyethylene terephthalate (PET) film of about 0.1 to 0.2 mm. Moreover, due to the characteristics of the resin film, warping or swelling may occur due to elongation due to moisture absorption or the above-described stress during bonding. Therefore, in the organic EL panel, when the edge is protruded by several tens of mm from the stage and held, the protruded edge easily hangs down by its own weight. When the edge of the organic EL panel hangs down, the position of the alignment mark formed on the edge is shifted in the horizontal direction. Therefore, when the position of the alignment mark of the organic EL panel is recognized using a camera, the recognized position is shifted.

  The inventors of the present application have confirmed by experiments that when the edge of the organic EL panel is held 20 mm protruding from the stage in the same manner as in the case of a liquid crystal display panel of the same size, the edge hangs down, It was confirmed that the sag caused a displacement of about 4 μm in the horizontal direction (toward the stage side) at the position of the alignment mark. Moreover, when the edge of the organic EL panel hangs down, the alignment mark is inclined with respect to the horizontal state. When an image of the inclined alignment mark is taken from directly below, the length of the taken alignment mark in the tilt direction is shorter than that in the case where the image is taken in a horizontal state. That is, the shape of the alignment mark to be imaged is deformed by the amount of the inclination. As a result, a difference in shape from the reference mark stored in advance occurs, which also causes an error in the recognition position of the alignment mark.

  The inventors of the present application performed an experiment to compare the error of the recognition position between the alignment mark held horizontally and the alignment mark inclined at 5 ° with respect to the horizontal. As a result, the alignment mark inclined at 5 ° was on average. It was confirmed that the error was large about 1 μm. The reason why the experiment was performed with the alignment mark inclined at 5 ° was that when the sag generated when the edge protruded from the stage by 20 mm was measured for a plurality of organic EL panels, sagging of 5 ° or more was confirmed in each case. is there.

(2. Fluctuation of light reflection at the edge of the organic EL panel)
When imaging the alignment mark of the organic EL panel, illumination is applied from below the camera. The illumination conditions (irradiation amount, illumination angle, etc.) of this illumination are determined by using an organic EL panel as a reference (for example, an organic EL panel having a flat edge, hereinafter referred to as a “reference panel”). The conditions are set so that the alignment marks on the panel can be imaged well. For this reason, the edge of the organic EL panel actually picked up has drooping and warpage, and the state is different, such as inclining with respect to the edge of the reference panel. The degree of reflection is different from that of the reference panel. As a result, there is a problem that the alignment mark cannot be clearly imaged or cannot be imaged at all. As a result of experiments conducted by the inventors of the present application, it has been confirmed that, when the alignment mark cannot be clearly imaged, a maximum shift of about 1 μm occurs in the recognition position.

  Based on these findings, the inventors of the present application processed the portion (supporting surface) supporting the edge of the organic EL panel flat in order to suppress sagging and warpage of the edge of the organic EL panel, and corresponded to the alignment mark. A through-hole for imaging that penetrates up and down is formed in the portion to be formed, and a supporting member capable of holding the edge by suction is attached to the stage, and the edge of the organic EL panel is held so as not to hang or warp. Attempting to mount electronic components again in this state. However, even with the measures described above, the mounting accuracy of ± 3 μm could not be sufficiently satisfied. In response to the results, the inventors of the present application have conducted further intensive studies and found that the following three factors are involved.

(3. Surface accuracy problem of organic EL panel)
A resin film such as a PI film or a PET film constituting an organic EL panel is generally manufactured by thinly molding and solidifying a resin dissolved by heating or a solvent such as a solution casting method or a melt extrusion molding method. The resin film manufactured in this way is in a state of being stretched thinly, that is, in a so-called finished state (a state in which the resin film is kept in a molded state and is not polished to adjust the finish). For this reason, the surface has fine irregularities (undulations) as compared with a glass substrate on which chemical or physical polishing is performed after being formed. In addition, the state of the unevenness is different between one surface and the other surface of the resin film. Therefore, when an image of the alignment mark is captured by the camera, the traveling direction of the light reflected by the alignment mark varies depending on the location.

  For example, consider a case in which, in an organic EL panel, a swell having a concavely curved shape occurs on an upper surface portion where an alignment mark is formed. The lower surface of the organic EL panel is substantially horizontal. When light is irradiated onto the alignment mark of such an organic EL panel from below through the through hole of the support member, light irradiated toward one end (left end) of the alignment mark is first emitted to the lower surface of the organic EL panel. Through. At this time, since the lower surface of the organic EL panel is a horizontal surface, the incident light is hardly refracted. Light that travels in the organic EL panel and reaches a boundary between the upper surface of the organic EL panel and the alignment mark is reflected at the boundary. At this time, at the left end of the alignment mark, the surface of the organic EL panel is inclined downward (from left to right) toward the alignment mark. Reflects toward. Then, the reflected light is refracted because it enters the lower surface of the organic EL panel obliquely, and travels further outward (to the left).

  On the other hand, the light emitted toward the other end (right end) of the alignment mark is reflected at an interface between the upper surface of the organic EL panel and the alignment mark at a reflection angle corresponding to the inclination of the upper surface of the organic EL panel. The light is reflected (to the right) and refracted when passing through the lower surface of the organic EL panel, so that the light travels further outward (to the right). As described above, when fine irregularities (undulations) are generated on the surface of the resin film on which the alignment mark is formed, the reflected light of the light irradiated toward the alignment mark M is reflected on the light path at the time of incidence. The light enters the camera along different paths, and the path of the reflected light differs depending on the position of the alignment mark M. These factors cause an alignment mark recognition error, and the position recognition accuracy of the alignment mark decreases.

(4. Light transmittance of organic EL panel)
As described above, the organic EL panel is configured by bonding a PI film to a PET film with an adhesive. Therefore, when imaging the alignment mark formed on the upper surface side of the organic EL panel from the lower surface side of the organic EL panel, the light transmittance of the organic EL panel affects the recognition accuracy of the alignment mark. Specifically, no matter how the illumination is adjusted, it becomes difficult to clearly capture the edge of the alignment mark.

  When the present inventors measured the light transmittance between the glass plate of the liquid crystal display panel and the resin substrate of the organic EL panel in the portion where the alignment mark was formed, the organic EL panel was better than the liquid crystal display panel. Also had a low light transmittance of about 7.4%. Using the liquid crystal display panel and the organic EL panel, the present inventors repeat the alignment mark recognition 10 times for each of the same liquid crystal display panel and the same organic EL panel, and determine the alignment mark recognition position. Repeat accuracy was confirmed. As a result, the variation of the position recognition accuracy of the liquid crystal display panel was ± 0.3 μm, whereas the variation of the position recognition accuracy of the organic EL panel was ± 1.2 μm.

(5. Problems due to the structure of the organic EL panel)
The organic EL panel is formed by bonding a plurality of resin films having different characteristics with an adhesive or the like. Therefore, the light emitted toward the organic EL panel enters the camera after passing through the boundary surface between different members a plurality of times.

  Here, a configuration is considered in which a PI film having an organic EL element or an alignment mark formed on its surface is bonded to a PET film via an adhesive. When light is irradiated from the lower side toward the alignment mark of such an organic EL panel, the irradiated light is emitted at the interface between the air and the PET film, the interface between the PET film and the adhesive layer, and the adhesive layer. And the PI film. The light reflected on the interface between the PI film and the alignment mark passes through each of the above-described interfaces and enters the camera.

  As described above, when the interface between the air and the PET film is inclined due to the influence of the surface accuracy of the organic EL panel, light is incident obliquely to the lower surface of the PET film. The light is refracted at each of the above-described boundaries, and enters the camera along a path different from the path from which the light reflected by the alignment mark has entered. Therefore, the alignment mark recognition position is shifted by the amount of refracted light. This also lowers the accuracy of position recognition of the alignment mark. FIG. 14 is an image of circular alignment marks of the organic EL panel (FIG. 14A) and the liquid crystal display panel (FIG. 14B). It can be confirmed that the distortion of the peripheral portion of the alignment mark of the organic EL panel is large.

  In some cases, a thin film having a high reflectance is formed on the back side of the PI film by vapor deposition or the like. In such a case, most of the light incident on the organic EL panel is reflected by the thin film. In that case, it becomes impossible to clearly image the alignment mark, and the position recognition accuracy is significantly reduced. In some cases, a PI film serving as a base material contains carbon particles for the purpose of preventing electrification of an organic EL panel or the like. In such a case, the transmission of light is blocked by the carbon particles, so that it is difficult to image the alignment mark, and the recognition cannot be performed correctly.

  SUMMARY OF THE INVENTION The present invention has been made to address the problem of a reduction in mounting accuracy of electronic components that occurs when the above-described conventional OLB device for a liquid crystal display is applied to a manufacturing process of an organic EL display. Even when a flexible electronic component is mounted on a display panel by thermocompression bonding, an electronic component mounting apparatus and a display member that enable the electronic component to be mounted on the display panel with high accuracy. It is intended to provide a manufacturing method.

  The electronic component mounting apparatus according to the embodiment has a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a plurality of electronic components mounted on an edge of a flexible display panel. The electronic component is mounted on the display panel by connecting, via a joining member, a plurality of terminals of the flexible electronic component corresponding to the plurality of electrodes to the electrodes. An electronic component mounting apparatus, comprising: a stage on which the display panel is mounted; and a supporter for supporting the edge of the display panel on which the electronic component is mounted from below, A stage that can be moved in a horizontal direction together with a support, and the electronic component is held from above, and the electronic component is positioned in a horizontal direction so as to be positioned above the edge supported by the support. A thermocompression head that is movable in the vertical direction and thermocompression-bonds the electronic component to the upper surface of the edge, and the display is performed in a state where the electronic component is positioned above the edge of the display panel. Imaging device which can enter between a panel for use and the electronic component, and simultaneously captures an alignment mark provided on the edge portion and an alignment mark provided on the electronic component into one imaging region to take an image. And, based on relative position information of the alignment mark of the display panel and the electronic component obtained from the captured image of the imaging device, the stage and the stage so that the display panel and the electronic component are aligned. Adjusting the relative position of the thermocompression bonding head and thermocompression bonding the electronic component to the display panel by the thermocompression bonding head in the adjusted positional relationship. Sea urchin, and a control device for controlling the stage and the thermocompression bonding head.

  The method for manufacturing a display member according to the embodiment has a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a flexible display panel held on a stage, A supporting step of supporting an edge portion of the display panel having a plurality of electrodes from below by a supporting portion provided on the stage, and a plurality of terminals provided corresponding to the plurality of electrodes; A holding step of holding the electronic component having flexibility on the thermocompression bonding head, and a step of positioning the electronic component held by the thermocompression bonding head at a position above the edge supported by the support portion; In a state in which the electronic component is positioned above the edge of the display panel, an image pickup device is inserted between the display panel and the electronic component, and the image pickup device enters the edge portion with the image pickup device. An imaging step of simultaneously taking an alignment mark provided and an alignment mark provided on the electronic component into one imaging area and capturing an image, and the display panel and the alignment mark of the electronic component captured in the imaging step A position recognition step of recognizing a relative positional relationship between the display panel and the electronic component based on the image of the display panel, and the stage and the thermocompression bonding head based on the relative positional relationship recognized in the position recognition step. A thermocompression bonding step of adjusting a relative position and thermocompression bonding the electronic component to the display panel by the thermocompression bonding head in the adjusted positional relationship.

  According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted on a flexible display panel such as an organic EL panel by thermocompression bonding, the electronic component is accurately mounted. can do. Furthermore, according to the method for manufacturing a display member of the present invention, it is possible to provide a display member in which electronic components are mounted on a display panel with high accuracy.

FIG. 2 is a plan view illustrating the electronic component mounting apparatus according to the embodiment. FIG. 2 is a side view of the electronic component mounting apparatus shown in FIG. 1. FIG. 2 is a perspective view illustrating a temporary pressure bonding device of the electronic component mounting device illustrated in FIG. 1. It is a figure which shows the position recognition unit of the temporary press bonding apparatus shown in FIG. 3, (A) is a top view, (B) is a front view. FIG. 5 is a perspective view illustrating a prism used in the position recognition unit illustrated in FIG. 4. FIG. 2 is a plan view showing an organic EL panel and electronic components applied to the mounting apparatus of the embodiment. FIG. 5 is a diagram schematically illustrating an example of a captured image of an alignment mark captured by a camera of the position recognition unit illustrated in FIG. 4. FIG. 2 is a perspective view showing a final crimping device of the electronic component mounting device shown in FIG. 1. FIG. 2 is a perspective view showing an example of an organic EL panel holder in the electronic component mounting apparatus shown in FIG. 1. FIG. 2 is a perspective view showing another example of a holder for an organic EL panel in the electronic component mounting apparatus shown in FIG. 1. It is a top view which shows the mounting device of the electronic component in other embodiment. 5 is a graph illustrating a change in mounting accuracy according to the first embodiment. 9 is a graph showing a variation in mounting accuracy according to Comparative Example 1. FIG. 10 is a diagram illustrating an example of an image obtained by capturing a circular alignment mark of an organic EL panel and a liquid crystal display panel using a conventional OLB device.

  Hereinafter, an electronic component mounting apparatus and a method of manufacturing a display member according to an embodiment will be described with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the plane dimension, the ratio of the thickness of each part, and the like may be different from the actual one. In the description, the terms indicating the up and down directions indicate the relative directions when the electronic component mounting surface of a display panel (organic EL panel) described later is faced up, unless otherwise specified.

[Configuration of mounting device]
FIG. 1 is a plan view showing the configuration of the electronic component mounting apparatus of the embodiment, and FIG. 2 is a side view of the electronic component mounting apparatus of FIG. The electronic component mounting apparatus 1 shown in FIGS. 1 and 2 is used for manufacturing a component (display member) of a display device such as an organic EL display. That is, the mounting apparatus 1 transfers the flexible electronic component W such as COF punched from the carrier tape T to the organic EL panel P as a flexible display panel and anisotropically as a joining member. This is a device that is mounted via a conductive tape F and used to manufacture a display member in which an electronic component W is mounted on an organic EL panel P.

  Here, the organic EL panel P is mainly formed of a flexible member. As the flexible member, for example, PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate), or the like is used. These members can also be used by bonding with an adhesive. The organic EL panel P is configured to have a thickness of 20 μm or more and 500 μm or less and a flexural modulus of 2.5 GPa or more and 4.0 GPa or less. The organic EL panel P according to the present embodiment has a configuration in which a PI film on which an organic EL element is formed is bonded to a PET film as a support via an adhesive. Since the thickness (about 200 μm) of the PET film is 10 times or more the thickness (about 10 μm) of the PI film, it is considered that the bending elastic modulus of the organic EL panel P is almost equal to the bending elastic modulus of the PET film.

  Here, the flexural modulus is a value measured according to a test method specified in JIS K7171: Plastics-Determination of flexural properties (revised on March 22, 2016). Specifically, in the flexural modulus test, a test piece having a length of 80 ± 2 mm, a width of 10.0 ± 0.2 mm, and a thickness of 4.0 ± 0.2 mm was adjusted to have a fulcrum distance of 64 mm. The center of the test piece is bent by lowering the indenter at a test speed of 2 mm / min to the center between the fulcrums. The test atmosphere is a standard atmosphere (temperature: 23 ° C./humidity: 50%) specified by JIS K7100.

As the electronic component W, a flexible electronic component such as COF is used. The COF is formed by mounting a semiconductor element on a flexible film-like circuit board formed of PI (polyimide) or the like. As will be described later, the COF is formed into individual pieces by punching from a tape-shaped film member.
The display member is obtained by mounting an electronic component W such as COF on a display panel such as an organic EL panel P via a bonding member such as an anisotropic conductive tape F. Etc. are members used as components of display devices.

  The mounting apparatus 1 according to the embodiment includes a punching device 10 (10A, 10B) for punching an electronic component W from a carrier tape T, an intermittent rotation transport device 20, which sucks and holds the punched electronic component W, and transports the electronic component W while rotating intermittently. Attach anisotropic conductive tape F as a joining member to electronic component W conveyed by intermittent rotary transfer device 20 at an intermittent stop position in the middle of the transfer path by rotary transfer device 20 Device (joining member adhering device) 30, temporary crimping device 40 for temporarily crimping electronic component W to which anisotropic conductive tape F is stuck to organic EL panel P via anisotropic conductive tape F, temporary crimping device 40, a first press-fitting device 50 for main-pressing the electronic component W temporarily press-bonded to the organic EL panel P, and a first transfer of the electronic component W between the punching device 10 and the intermittent rotary transfer device 20. The delivery device 60, the second delivery device 70 for delivering the electronic component W between the intermittent rotary transfer device 20 and the temporary crimping device 40, and the first delivery of the organic EL panel P to the temporary crimping device 40. A transport section 80, a second transport section 90 for transporting the organic EL panel P from the temporary pressure bonding apparatus 40 to the final pressure bonding apparatus 50, and a third transport section 100 for transporting the organic EL panel P from the final pressure bonding apparatus 50, are further provided. Punching device 10, intermittent rotary conveyance device 20, anisotropic conductive tape sticking device 30, temporary crimping device 40, final crimping device 50, first delivery device 60, second delivery device 70, first delivery unit 80 , A second transport unit 90, a third transport unit 100, and the like.

(Punching device 10)
The punching device 10 is for punching COF as the electronic component W from the carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration, and are arranged in a state where they are reversed left and right when viewed from the front of the device. The first and second punching devices 10A and 10B are used one by one, and the carrier tape T of the other punching devices 10A and 10B can be replaced while the punching is performed by one of the punching devices 10A and 10B. It has become.

  The first and second punching apparatuses 10A and 10B respectively include a supply reel 11 on which a carrier tape T before punching is wound, and a die apparatus 12 for punching an electronic component W from the carrier tape T supplied from the supply reel 11. And a take-up reel 13 for winding the carrier tape T from which the electronic component W has been punched out by the mold apparatus 12. The direction of the carrier tape T fed from the supply reel 11 is changed by a plurality of guide rollers 14 and sprockets 15, and is sent to the take-up reel 13 via the mold device 12. The sprocket 15 is disposed in front of the mold device 12 in the transport direction of the carrier tape T, and transports the carrier tape T to the mold device 12 while transporting the carrier tape T by rotational driving by a drive motor (not shown). Positioning is possible.

  The mold device 12 includes an upper mold 12a and a lower mold 12b disposed to face the upper mold 12a. The upper mold 12a has a punch 12c on its lower surface. On the other hand, the lower die 12b is formed with a vertically extending die hole 12d into which the punch 12c enters. The electronic component W is punched out of the carrier tape T by moving the upper mold 12a in the vertical direction in a state where the carrier tape T is supplied and positioned to such a mold apparatus 12. In addition, a suction hole (not shown) is provided on the tip end surface of the punch 12c, and is configured to be able to suck and hold the punched electronic component W.

(Intermittent rotation transfer device 20)
The intermittent rotary transfer device 20 includes four arm portions 21 having the same shape arranged in orthogonal relation to each other, and an index table 22 having a cross shape in a plan view, and intermittently driving the index table 22 at 90 ° intervals. A rotation drive unit 23. At the end of each arm 21 of the index table 22, a holding head 24 that sucks and holds the electronic component W is provided. The four stop positions A to D at every 90 ° of the index table 22 include a receiving position A for receiving the electronic component W punched by the punching device 10 and a positioning with respect to the electronic component W held by the holding head 24. (Gauging) and gauging / cleaning position B for cleaning, bonding position C for bonding anisotropic conductive tape F to electronic component W held by holding head 24, anisotropic conductive tape A transfer position D for transferring the electronic component W to which the F is attached to the temporary crimping device 40 is set.

(Anisotropic conductive tape sticking device 30)
The anisotropic conductive tape sticking device 30 is provided corresponding to the sticking position C of the intermittent rotary transfer device 20, and the tape-shaped member S that sticks and supports the anisotropic conductive tape F to the release tape R is provided. The supply reel 31 wound, the bonding head 32 disposed at a position facing the holding head 24 positioned at the bonding position C, and the release tape R after the anisotropic conductive tape F has been peeled off. A collecting unit 33 for accommodating, a plurality of guide units 34 for guiding the tape-shaped member S supplied from the supply reel 31 to the collecting unit 33 along a transport path passing through the attaching position C, and a plurality of guide units 34, the tape-like member S is disposed downstream of the sticking position C of the transport path of the tape-like member S, and reciprocates along the transport direction of the tape-like member S, thereby intermittently transporting the tape-like member S by a predetermined length. The chuck feeder 35 and the tape-shaped member S Than adhering position C of the transfer path is disposed upstream, and a cutting unit 36 which cuts only the anisotropic conductive tape F of tape-like member S.

  The bonding head 32 is cut into a predetermined length at the terminal portion of the electronic component W held by the holding head 24 positioned at the bonding position C, and is transported and positioned at the bonding position C to the anisotropic conductive member. A sticking tool 32a for pressing the tape F, an elevating drive unit 32b that moves the sticking tool 32a up and down, and a built-in sticking tool 32a that heats the sticking tool 32a to heat the anisotropic conductive tape F And a heater 32c for adhering to the terminal part of the electronic component W.

(Temporary crimping device 40)
The temporary pressure bonding device 40 serves as a thermocompression head for temporarily holding the electronic component W to which the anisotropic conductive tape F is stuck by the anisotropic conductive tape sticking device 30 and temporarily pressing the electronic component W to the organic EL panel P. A temporary pressure bonding head 41, a stage 42 for holding and positioning the organic EL panel P, and a relative position between the organic EL panel P held by the stage 42 and the electronic component W held by the temporary pressure bonding head 41 are recognized. And a position recognition unit 43.

  The temporary pressure bonding head 41 is built in the pressure tool 41a that sucks and holds the electronic component W from the upper surface side, a tool driving unit 41b that moves the pressure tool 41a in the Y, Z, and θ directions, and is built in the pressure tool 41a. And a heater 41c for heating the pressing tool 41a. As shown in FIG. 3, the stage 42 is provided integrally with the mounting portion 42a on which the organic EL panel P is mounted and the mounting portion 42a, and the edge of the organic EL panel P on which the electronic component W is mounted. A supporting section 42b for supporting the section from below, and a stage driving section 42c for integrally moving the mounting section 42a and the supporting section 42b in the X, Y, Z, and θ directions.

  A plurality of suction holes 42e for sucking and holding the organic EL panel P are formed on a mounting surface 42d of the mounting portion 42a on which the organic EL panel P is mounted. When the organic EL panel P is mounted on the mounting surface 42d, the suction holes 42e are mainly arranged at positions facing the image display area of the organic EL panel P. In this example, the suction holes 42e are arranged in a matrix at equal intervals in an area (area surrounded by a two-dot chain line in FIG. 3) of the mounting surface 42d where the organic EL panel P is mounted. As will be described, since it is sufficient that the organic EL panel P supported by the support portion 42b described later can be suction-held so that at least the edge portion is flat, the organic EL panel P mounted on the mounting surface 42d is moved over the entire area. It does not have to be held by suction. For example, an area of about half or about 1/3 of the length of the organic EL panel P may be suction-held by the suction hole 42e from the support portion 42b side in a direction orthogonal to the edge. Since the suction hole 42e sucks the display area of the organic EL panel P, it is preferable to set the hole diameter small so that no suction mark remains in the display area due to the suction. The hole diameter is determined by determining the relationship between the suction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to the suction through experiments and the like, and setting the size so that no suction mark remains. good. The mounting surface 42d may be formed of a porous member, for example, a vacuum chuck using porous ceramics.

  As described above, the support portion 42b is a long member that is provided integrally with the placement portion 42a and supports the edge of the organic EL panel P, and has an upper surface formed as a flat support surface 42f. ing. The height position of the support surface 42f is set to the same height as the height of the mounting surface 42d of the mounting portion 42a. A plurality of suction holes 42g for suction-holding the edge of the organic EL panel P are arranged in a plurality of rows along the longitudinal direction of the support surface 42f. It is preferable that the suction hole 42g of the support portion 42b be smaller, like the suction hole 42e of the mounting portion 42a. However, the edge of the organic EL panel P supported by the support portion 42b is a portion where electrodes for connection to the electronic component W are arranged, and is not a display area. For this reason, it is not necessary to make the hole diameter as small as the suction hole 42e of the mounting portion 42a, but deformation due to suction occurs at the edge of the organic EL panel P where the alignment mark PM (see FIG. 6) is formed. Is not preferable because it causes a reduction in position recognition accuracy. The hole diameter and the suction force of the suction hole 42g are preferably set to such a size that the edge of the organic EL panel P is not deformed. Further, the arrangement interval of the suction holes 42g is shorter than the period of the unevenness due to warpage or undulation generated at the edge of the organic EL panel P so that the edge of the organic EL panel P is in close contact with the support surface 42f over the entire area. Preferably, it is an interval.

  The stage driving unit 42c moves the mounting unit 42a and the supporting unit 42b in the X-axis direction, which is one horizontal direction, and moves in the Y-axis direction, which is a horizontal direction orthogonal to the X-axis direction. A drive unit configured by stacking a Y-axis direction drive unit to be moved, a Z-axis direction drive unit to move in the Z-axis direction orthogonal to the horizontal direction, and a θ drive unit to rotate in a horizontal plane in this order from the bottom. is there. The stage drive section 42c is provided with a linear encoder in association with the X-axis direction drive section and the Y-axis direction drive section in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction.

  Next, the position recognition unit 43 will be described with reference to FIGS. 4A is a plan view illustrating a schematic configuration of the position recognition unit 43, and FIG. 4B is a front view illustrating a schematic configuration of the position recognition unit 43. FIG. 5 is a perspective view showing a configuration of a prism used in the position recognition unit 43. FIG. 6 is a plan view illustrating a schematic configuration of the organic EL panel P and the electronic component W whose position is recognized by the position recognition unit 43. In the drawing, the X-axis direction is described as a left-right direction. The organic EL panel P has an electrode row ER formed on the edge thereof, and a pair of alignment marks PM provided on both left and right sides of the electrode row ER. The electronic component W has a terminal row TR arranged so as to correspond to the electrode row ER, and a pair of alignment marks WM provided on both right and left sides of the terminal row TR. In FIG. 6, the organic EL panel P and the electronic component W are shown with a space between them for the sake of simplicity. The components W are arranged so as to overlap with the terminal rows TR of the components W with an interval in the vertical direction.

  The position recognition unit 43 recognizes a relative positional relationship between the pair of alignment marks PM of the organic EL panel P held on the stage 42 and the alignment marks WM of the electronic component W held on the temporary pressure bonding head 41. For this reason, the position recognition unit 43 includes a first imaging device 43A and a second imaging device 43B. The first imaging device 43A is for imaging the left alignment marks PM and WM of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. The second imaging device 43B is for imaging the right alignment marks PM and WM among the alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W. The first imaging device 43A and the second imaging device 43B have the same configuration, and are arranged in a horizontally inverted state in FIG.

  The first and second imaging devices 43A and 43B are each provided with a camera (imaging unit) 43a such as a CCD (Charge Coupled Device) camera including an imaging device for imaging the alignment marks PM and WM as a still image, and a camera. A lens barrel 43b provided integrally with the camera 43a to simultaneously capture upper and lower images into one image capturing area of the camera 43a in a state where the image capturing area is vertically divided into two parts; and a camera 43a and a lens barrel 43b. And an X-axis moving device 43c for supporting the X-ray reciprocally in the X-axis direction. The first and second imaging devices 43A and 43B include an image processing unit 43d that processes an image captured by the camera 43a of the first imaging device 43A and an image captured by the camera 43a of the second imaging device 43B. . Here, one imaging region is a region provided in the camera 43a and set as a range in which an imaging device in which light receiving elements are arranged in rows and columns captures an image at a time. Therefore, this region may be constituted by all the light receiving elements of the image pickup element or may be constituted by a part of the light receiving elements. The cameras 43a of the first and second imaging devices 43A and 43B are arranged such that their optical axes L are parallel to the X-axis direction which is the horizontal direction shown in FIG. A coaxial illumination is incorporated in the camera 43a.

  The lens barrel 43b includes a right-angle prism 43e as an optical member for guiding light, which simultaneously guides the upper and lower images into the imaging area of the camera 43a. As shown in FIG. 5, the right-angle prism 43e is a prism formed as a triangular prism forming an isosceles triangle with a vertex angle of 90 ° (right-angled isosceles triangle), and corresponds to two sides having the same length. The two side surfaces function as reflection surfaces 43e1 and 43e2. In the right-angle prism 43e, the center of a ridge line 43e3 formed by the two reflecting surfaces 43e1 and 43e2 is located on the optical axis L of the camera 43a, one reflecting surface 43e1 faces upward, and the other reflecting surface 43e2 faces downward. It is attached to the lens barrel 43b so that it faces side and the surface corresponding to the base of the isosceles triangle is perpendicular to the XY plane. That is, the surface corresponding to the bottom surface of the prism 43e is fixed to the vertical surface at the tip of the lens barrel 43b. Accordingly, the light traveling parallel to the optical axis of the camera 43a, the light incident on the upward reflecting surface 43e1 of the prism 43e is reflected upward, and further travels parallel to the optical axis of the camera 43a. The light incident on the downward reflecting surface 43e2 is reflected just below. As a result, as described later, an image including the alignment mark MW of the electronic component W is guided to the first area of the image sensor of the camera 43a by the reflection surface 43e1, and the image of the alignment mark PM of the organic EL panel P is changed to the reflection surface. The light is guided simultaneously to a second area (different from the first area) of the image sensor of the camera 43a by 43e2. Although not shown, between the surface corresponding to the bottom side of the prism 43e and the vertical surface at the tip of the lens barrel 43b, a minute feed screw, a micrometer, or the like that can adjust the mounting angle of the prism 43e three-dimensionally is provided. The used tilt adjustment mechanism is provided.

  The X-axis moving device 43c is an imaging position for imaging the alignment marks PM and WM of the organic EL panel P and the electronic component W positioned at the temporary compression position by the temporary compression head 41 (the position shown in FIG. 4B). ) And the retracted position (the position where the lens barrel 43b is indicated by a solid line in FIG. 4A). Here, the retracted position is set to a position where the operation of the pressing tool 41a is not hindered when the pressing tool 41a moves up and down with respect to the electronic component W when performing the temporary crimping operation. Specifically, the first imaging device 43A is set at a position on the left side in the X-axis direction with respect to the imaging position. Further, the second imaging device 43B is set to a position on the right side in the X-axis direction with respect to the imaging position. The movement of the camera 43a and the lens barrel 43b of the first imaging device 43A and the second imaging device 43B is performed in synchronization.

  In the state where the electronic component W is positioned at the temporary press-bonding position, the electronic component W held by the temporary press-bonding head 41 faces the edge of the organic EL panel P, as shown in FIG. At a distance from each other. Therefore, the lens barrel 43b enters between the organic EL panel P and the electronic component W and is positioned at the imaging position. In the state where the prism 43e is positioned at the imaging position, the upward reflecting surface 43e1 of the prism 43e faces the alignment mark WM of the electronic component W, and the downward reflecting surface 43e2 faces the alignment mark PM of the organic EL panel P. Has become.

  The image processing unit 43d receives the imaging signal of the camera 43a, and as shown in FIG. 7, the alignment mark PM of the organic EL panel P and the electronic component W in the captured image H obtained by being simultaneously captured in one imaging region. And the data relating to the relative position of both alignment marks PM and WM (hereinafter referred to as “relative position data”) is detected. Specifically, in the captured image H of the camera 43a, as shown in FIG. 7, the ridge line 43e3 of the prism 43e is imaged so as to horizontally cross the center thereof, and the upper region ( An image of the electronic component W (the alignment mark WM of the electronic component W) is captured in the first area (H1), and the organic EL panel P (the alignment mark PM of the organic EL panel P) is captured in the lower area (the second area) H2. Are taken. In FIG. 7, patterns other than the alignment marks PM and WM formed on the organic EL panel P and the electronic component W are not shown.

  The image processing unit 43d converts the image in which the matching rate equal to or higher than the threshold value with the preset reference pattern of the alignment mark WM of the electronic component W in the first area H1 by the known pattern matching process. It is recognized as the alignment mark WM. Further, in the second region H2, an image in which a predetermined reference pattern of the alignment mark PM of the organic EL panel P and a matching ratio equal to or higher than the threshold value are obtained is recognized as the alignment mark PM of the organic EL panel P. Then, relative position data with respect to the two recognized alignment marks WM and PM are detected based on the camera coordinate system. The obtained relative position data is transmitted to the control device 110. The function of the image processing unit 43d of the first and second imaging devices 43A and 43B may be performed by a control device 110 described later.

(Firm bonding device 50)
As shown in FIG. 8, the final pressing device 50 includes a stage 51 for holding and positioning the organic EL panel P to which the electronic component W has been temporarily pressed via the anisotropic conductive tape F, and the organic EL panel P A main press-bonding head 52 for main-pressing the electronic component W, and an electronic component W in the organic EL panel P disposed below the main press-bonding head 52 so as to face the main press-bonding head 52. And a position recognition unit 54 for recognizing the position of the organic EL panel P.

  The stage 51 has a placement section 51a on which the organic EL panel P is placed, and a stage drive section 51b for moving the placement section 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in plan view, and a mounting surface (upper surface) 51c on which the organic EL panel P is mounted has a plurality of suction holes 51d for sucking and holding the organic EL panel P. Is formed. It is preferable that the diameter of the suction hole 51d is set small like the suction hole 42e of the stage 42 of the temporary pressure bonding apparatus 40 so that no suction mark of the organic EL panel P remains. The stage driving unit 51b, like the stage driving unit 42c of the temporary crimping device 40, stacks an X-axis driving unit, a Y-axis driving unit, a Z-axis driving unit, and a θ driving unit in this order from the bottom. The driving unit is configured as follows.

  The main pressing head 52 includes a pressing tool 52a for pressing the electronic component W temporarily pressed on the organic EL panel P from the upper surface side, a tool driving unit 52b for moving the pressing tool 52a in the Z-axis direction, A heater 52c that is built into the tool 52a and heats the pressing tool 52a. The backup unit 53 includes a backup tool 53a provided at a position directly below the pressure tool 52a of the main pressure bonding head 52 and having the same length as the pressure tool 52a, and a support member 53b for supporting the backup tool 53a. And The upper surface of the backup tool 53a is formed as a flat surface that supports the lower surface of the edge where the electronic component W of the organic EL panel P mounted on the mounting portion 51a is temporarily pressed.

  The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are mounted downward at a predetermined interval above the moving range of the organic EL panel P by the stage 51, and the electronic component W of the organic EL panel P is temporarily An image of an alignment mark provided near both ends of the crimped edge is taken. The interval (predetermined interval) between the first and second cameras 54a and 54b is the interval between the alignment marks. The alignment mark is an alignment mark different from the alignment mark PM used for recognizing the relative position data in the temporary crimping device 40. The image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b, and Detect the position of.

(First delivery device 60)
The first transfer device 60 receives the electronic component W punched out of the carrier tape T by suction from below and holds the receiving portion 61 at a position directly below the die device 12 of the punching devices 10A and 10B. An X, Y, Z, θ drive unit 62 for moving the intermittent rotary transfer device 20 positioned at the position A to a position directly below the holding head 24 is provided.

(Second delivery device 70)
The second delivery device 70 is provided with a receiving portion 71 for sucking and holding the electronic component W from below, and a temporary press-fit between a position directly below the holding head 24 of the intermittent rotary transfer device 20 positioned at the delivery position D. An X, Y, Z, θ drive unit 72 for moving the device 40 to a position directly below the temporary pressure bonding head 41 is provided.

(First transport unit 80)
The first transport unit 80 includes a holding body 81 that sucks and holds the organic EL panel P supplied from a supply unit (not shown) from above, and a supply position of the organic EL panel P by the supply unit (not shown). And an XZ drive unit 82 for moving the organic EL panel P to a position at which the organic EL panel P is carried in with respect to the stage 42 of the temporary crimping device 40.

  As shown in FIG. 9, the holding body 81 includes an electrode surface suction block 81a for sucking and holding an edge of the organic EL panel P on which the electrode array ER on which the electronic component W is mounted is formed, and the electrode surface suction block 81a. And a display area suction portion 81b that sucks and holds a portion of the organic EL panel P other than the portion sucked by the electrode surface suction block 81a. The electrode surface suction block 81a is a member having a rectangular parallelepiped shape formed to have a length capable of sucking and holding the entire edge of the organic EL panel P on which the electrode array ER is formed, and extending in a direction along the edge. The suction surface 81c of the electrode surface suction block 81a is formed flat and has a plurality of suction holes 81d. The diameter of the suction hole 81d is set to such a size that the edge of the organic EL panel P is not deformed similarly to the support portion 42b of the temporary pressure bonding apparatus 40. The edge on which the row ER is formed can be flattened and held by suction. The display area suction part 81b is formed of a porous body or sponge having a flat suction surface, and has many suction holes. The suction surfaces of the electrode surface suction block 81a and the display area suction portion 81b are adjusted so as to be located on the same plane.

  FIG. 9 shows one display area suction unit 81b, but a plurality of display area suction units 81b may be arranged side by side. As shown in FIG. 10, the display area suction portion 81b intersects with the longitudinal direction of the electrode surface suction block 81a (the edge direction of the organic EL panel P held by the electrode surface suction block 81a) (this embodiment). In this case, two are arranged side by side in the direction orthogonal to each other. The two display area suction portions 81b are supported by the main body portion 81e of the holder 81 such that the distance between the two display area suction portions 81b and the electrode surface suction block 81a can be adjusted. These display area adsorbing portions 81b are flat porous sheets 81b2 that cover a base portion 81b1 made of metal such as aluminum and a surface of the base portion 81b1 that holds the organic EL panel P (hereinafter, referred to as a “lower surface”). And A substantially lattice-shaped suction groove communicating with the vacuum suction hole is formed on the lower surface of the base portion 81b1, and a vacuum suction force is applied to the entire area of the porous sheet 81b2 provided on the lower surface to form a porous sheet. The organic EL panel P can be held flat with a substantially uniform suction force over the entire area 81b2. As the porous sheet 81b2, for example, a sheet obtained by processing a resin porous molded body into a film shape can be used. With this configuration, even if the holding body 81 is a thin film-shaped organic EL panel P having flexibility, the holding body 81 can be sucked and held flat without causing suction marks.

  When the organic EL panel P is placed on the stage 42 of the temporary crimping device 40, the upper surface (electrode surface) of the edge on which the electrodes of the organic EL panel P are formed is supported by the electrode surface suction block 81a. It will be pressed against the part 42b. Therefore, the electrode surface of the organic EL panel P is sandwiched between the flat suction surface 81c of the electrode surface suction block 81a and the flat support surface 42f of the support portion 42b, and the support portion 42b is flattened. Is held by suction. Further, the organic EL panel P is brought into contact with the mounting surface 42d of the mounting portion 42a in a state where the display area suction portion 81b sucks and holds the organic EL panel P flatly. It is sucked and held by the mounting portion 42a without wrinkles or the like.

(Second transport unit 90)
The second transport unit 90 includes a holding body 91 that adsorbs and holds the organic EL panel P to which the electronic component W has been temporarily pressed by the temporary bonding apparatus 40 from above, and the holding body 91 is organically moved from the stage 42 of the temporary bonding apparatus 40. An XZ drive unit 92 for moving the EL panel P to a carry-out position for carrying out the EL panel P and a carry-in position for the organic EL panel P with respect to the stage 51 of the main crimping device 50 is provided. The holding body 91 has a display area suction portion formed by a porous body or the like having a flat suction surface, which sucks and holds substantially the entire area of the upper surface of the organic EL panel P. This display area suction unit is configured similarly to the display area suction unit 81b of the holding body 81.

(Third transport unit 100)
The third transport unit 100 includes a holding member 101 that suction-holds the organic EL panel P to which the electronic component W has been completely pressed by the main pressing device 50, that is, a display member from above, and attaches the holding member 101 to the main pressing device. An XZ drive unit 102 is provided for moving the organic EL panel P from the stage 51 to an unloading position for unloading the organic EL panel P and a delivery position to a unloading device (not shown).

(Control device 110)
The control device 110 includes a storage unit 111. The storage unit 111 stores various information for controlling each unit such as a load in the temporary crimping device 40, a heating temperature, reference position information of the alignment marks PM and WM, and the like.

[Operation of mounting device]
Next, the operation of the mounting apparatus 1 according to the embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10A, and the electronic component W is punched from the carrier tape T by the mold device 12. The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12c is transferred to the receiving portion 61 of the first transfer device 60, and is transferred to the receiving position A of the intermittent rotary transfer device 20 by the first transfer device 60. The electronic component W transferred to the receiving position A is transferred to the holding head 24 of the intermittent rotary transfer device 20 positioned at the receiving position A. The first delivery device 60 rotates the direction of the electronic component W by 90 ° during the transfer of the electronic component W to the receiving position A, so that the edge on which the terminal row TR is formed is moved to the receiving position A. The position is adjusted in the direction (Y direction) along the outer side surface of the positioned holding head 24.

  The electronic component W held by the holding head 24 is sequentially transferred to a gauging / cleaning position B, a sticking position C, and a delivery position D by intermittent rotation of the index table 22. During this transfer, at the gauging / cleaning position B, the electronic component W is positioned with respect to the holding head 24 by abutment of a positioning mechanism (not shown), and adheres to the terminal portion by a cleaning mechanism such as a rotating brush (not shown). Cleaning of dust is performed. Further, at the sticking position C, the anisotropic conductive tape F is stuck to the terminal part of the electronic component W by the anisotropic conductive tape sticking device 30. When the positioning and cleaning are performed at the gauging / cleaning position B, and the electronic component W to which the anisotropic conductive tape F is attached is positioned at the application position C at the delivery position D, the electronic component W is transferred to the delivery position D. At the receiving portion 71 of the second delivery device 70. The electronic component W transferred to the receiving portion 71 is transferred to a position directly below the temporary pressure bonding head 41 of the temporary pressure bonding device 40 and transferred to the temporary pressure bonding head 41.

  On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out from the supply unit (not shown) by the holding body 81 of the first transport unit 80, and is supplied and placed on the stage 42 of the temporary pressure bonding apparatus 40. First, the holding body 81 of the first transport unit 80 moves to a supply unit (not shown), and the holding surface of the holding body 81, that is, the suction of the electrode surface suction block 81a, is placed on the upper surface of the organic EL panel P prepared in the supply unit. The surface 81c is brought into contact with the suction surface of the display area suction portion 81b. At this time, the suction force of the electrode surface suction block 81a and the display area suction portion 81b is applied while the organic EL panel P is lightly pressed by the holding body 81. By doing so, even when the organic EL panel P is warped or bent, the organic EL panel P can be held by the holder 81 in a flat state.

  The organic EL panel P held by the holder 81 is transferred onto the stage 42 of the temporary crimping device 40. At this time, the stage 42 of the temporary pressure bonding apparatus 40 is positioned at a supply position (a position indicated by a two-dot chain line in FIG. 1) where the organic EL panel P is supplied from the holder 81. The organic EL panel P conveyed on the stage 42 is mounted on the stage 42. At this time, the organic EL panel P is pressed onto the stage 42 and flattened by the lowering of the holder 81.

  More specifically, in the organic EL panel P, the electrode surface is suction-held on the suction surface 81c of the electrode surface suction block 81a of the holder 81, and the display area is suction-held by the display area suction portion 81b. By these, it is held in a flat state. In this state, since the organic EL panel P is pressed onto the stage 42, the organic EL panel P is supported by the suction surface 81c of the electrode surface suction block 81a of the holder 81 and the suction surface of the display area suction portion 81b, and by the support of the stage 42. It is sandwiched between the support surface 42f of the portion 42b and the mounting surface 42d of the mounting portion 42a. Therefore, the organic EL panel P is transferred onto the stage 42 while maintaining the flattened state, and is suction-held by the stage 42.

  At this time, in a state where the organic EL panel P is pressed on the stage 42, after applying a suction force to the suction hole 42 g of the support portion 42 b of the stage 42 and the suction hole 42 e of the mounting portion 42 a, the holding member 81 Although the suction force of the electrode surface suction block 81a and the display area suction portion 81b may be released, the suction force of the holder 81 may be released before the suction force is applied to the stage 42. By doing so, the restraint in the surface direction of the organic EL panel P sandwiched between the stage 42 and the holding member 81 is reduced, so that the holding member 81 may be temporarily warped or bent. It is expected that even if it is held, the warpage and bending will be corrected by pinching and flattened. For this reason, it is preferable that the force for pressing the holder 81 against the stage 42 be set to a magnitude that does not hinder the above-described correction.

  When the organic EL panel P is held on the stage 42, the holder 81 moves to a supply unit (not shown). The stage 42 moves to a temporary pressure bonding position by the temporary pressure bonding head 41. Thereby, the organic EL panel P supported by the stage 42 is positioned at the temporary pressure bonding position.

  On the other hand, the temporary pressure bonding head 41 holding the electronic component W moves from the delivery position where the electronic component W is received from the second delivery device 70 to the temporary pressure bonding position. At the temporary compression position, the electronic component W is positioned at a predetermined height above the electrode surface of the organic EL panel P positioned at the temporary compression position. That is, the organic EL panel P and the electronic component W at the provisional pressure bonding position are opposed to each other with the electrode surface of the organic EL panel P and the terminal portion of the electronic component W vertically separated.

  When the organic EL panel P and the electronic component W are positioned at the temporary pressure bonding position, the first and second imaging devices 43A and 43B of the position recognition unit 43 move from the retracted position to the imaging position, respectively. In this state, the first and second imaging devices 43A and 43B simultaneously capture images of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, respectively. Then, the captured images of the alignment marks PM and WM are sent to the image processing unit 43d, and the image processing unit 43d obtains relative position data of the alignment marks PM and WM. The relative position data is sent to the control device 110 and compared with the reference position information of the relative position data stored in the storage unit 111 in advance, and based on the result, the X, Y, The relative displacement in the θ direction is determined. The control device 110 controls the tool driving unit 41b and the stage driving unit 42c based on the obtained relative positional deviation so as to eliminate the positional deviation, and aligns the organic EL panel P with the electronic component W.

  After correcting the displacement between the organic EL panel P and the electronic component W, the pressing tool 41a is lowered by driving the tool driving unit 41b. As a result, the terminal portion of the electronic component W is heated and pressurized on the electrode surface of the organic EL panel P via the anisotropic conductive tape F at a preset heating temperature, pressurizing force, and pressurizing time. The electronic component W is temporarily pressure-bonded to the organic EL panel P whose edge having is supported from below by the support portion 42b. At this time, a backup member that supports the support portion 42b of the stage 42 from below may be provided, and the support portion 42b may be supported from below when the temporary compression bonding is performed by the backup member. By doing so, it is possible to prevent the stage 42 from bending due to pressurization, so that it is possible to reduce the rigidity of the stage 42 and reduce the weight. The load at the time of moving the stage 42 is reduced, the vibration at the time of movement can be reduced, and stable and quick movement and positioning can be performed.

  After a predetermined pressurizing time has elapsed, the suction of the electronic component W by the pressurizing tool 41a is released and the pressurizing tool 41a rises. The pressing tool 41a is moved to a delivery position where the electronic component W is delivered from the second delivery device 70. The stage 42 on which the organic EL panel P to which the electronic component W has been temporarily pressed is placed is moved to a carry-out position where the organic EL panel P is delivered to the second transport unit 90. At this unloading position, the upper surface of the organic EL panel P is suction-held by the holder 91 of the second transport unit 90 in the same manner as the hold by the holder 81 of the first transport unit 80. To the stage 51.

  The organic EL panel P supplied to the final pressure bonding apparatus 50 by the second transport unit 90 is delivered to the stage 51 positioned at the carry-in position, and is suction-held on the stage 51. The operation at the time of the delivery is performed in the same manner as the delivery of the organic EL panel P from the first transport unit 80 to the stage 42. However, the difference is that the edge of the organic EL panel P to which the electronic component W has been temporarily pressed is held in a state of protruding from the stage 51.

  When the organic EL panel P is held on the stage 51, the stage 51 is moved to support the edge of the organic EL panel P on the upper surface of the backup tool 53a. During this movement, the position of the alignment mark (a mark different from the alignment mark PM) of the organic EL panel P is recognized by the position recognition unit 54. Based on this position recognition result, the stage 51 is moved so that the electrode surface of the organic EL panel P is positioned on the upper surface of the backup tool 53a in a correct positional relationship. When the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressing tool 52a is lowered by driving the tool driving unit 52b, and the organic EL panel P is driven at a preset heating temperature, pressure, and pressing time. The electronic component W temporarily crimped to the EL panel P is completely crimped.

  After a predetermined pressurizing time has elapsed, the pressurizing tool 52a is raised. The stage 51 on which the organic EL panel P on which the electronic component W has been permanently pressed, that is, the stage on which the display member is placed, is moved to a carry-out position where the organic EL panel P is transferred to the third transport unit 100. At this unloading position, the upper surface of the organic EL panel P is adsorbed and held by the holder 101 of the third transfer unit 100, and the organic EL panel P is transferred to a not-shown unloading device.

  The above-described mounting operation including the step of temporarily pressing the electronic component W onto the organic EL panel P and the step of final pressing is repeatedly performed until there is no more organic EL panel P on which the electronic component W is to be mounted. In the mounting device 1 of the embodiment, it is important to improve the positional accuracy in the provisional pressure bonding process, while it is important to improve the bonding strength and reliability of the anisotropic conductive tape F in the final pressure bonding process. The process time is also different. Therefore, the mounting efficiency of the electronic component W can be improved by applying the temporary crimping device 40 and the final crimping device 50 and performing the temporary crimping process and the final crimping process. However, the mounting device 1 of the embodiment is not limited to such a configuration. You may make it perform the process from a positioning process to a main press bonding process with the main press bonding apparatus 50. In this case, the supporting portion 42b and the backup portion 53 are provided on the stage 51 of the final crimping device 50.

[Function and effect of mounting device]
According to the mounting apparatus 1 of the above-described embodiment, the edge on which the electronic component W of the flexible organic EL panel P is mounted is supported by the stage 42 having the support portion 42b that supports the edge from below. The relative position data between the alignment mark PM of the organic EL panel P supported by the stage 42 and the alignment mark WM of the electronic component W held by the provisional pressure bonding head 41 is separated from each other by the vertically arranged organic EL. Images of the alignment mark PM of the panel P and the alignment mark WM of the electronic component W are detected by using the first and second imaging devices 43A and 43B capable of simultaneously taking in one imaging region, and the detected relative position data is obtained. The organic EL panel P and the electronic component W are aligned based on the electronic component W, and the electronic component W is temporarily attached to the organic EL panel P via the anisotropic conductive tape F. After wearing, so that to this bonding.

  Therefore, when detecting the relative position data between the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, the edge of the organic EL panel P where the electrodes are formed is supported by the support portion 42b of the stage 42. Will be supported. Accordingly, the edge of the organic EL panel P is prevented from sagging, and the position recognition accuracy of the alignment mark PM provided on the edge can be improved.

  Further, the alignment mark PM of the organic EL panel P is imaged from above, the alignment mark WM of the electronic component W is imaged from below, and the images of both alignment marks PM and WM are provided in a single lens barrel 43b. At the same time, it is taken into one imaging region of one camera 43a via the prism 43e thus set. Therefore, the alignment mark PM formed on the upper surface of the organic EL panel P can be imaged without passing through a resin such as PI or PET constituting the organic EL panel P. And clear images. In addition, since the images of both alignment marks PM and WM are taken into one imaging area of the camera 43a via the prism 43e provided on the single lens barrel 43b, the temperature of the lens barrel 43b may be temporarily increased. Therefore, even if thermal deformation occurs, it is possible to minimize the displacement of the optical axis for capturing the images of the two alignment marks PM and WM.

  Further, since the images of both the alignment marks PM and WM are simultaneously captured into one imaging region of the camera 43a via the prism 43e provided in the single lens barrel 43b, the vibrations of the device cause the images to be captured in the lens barrel 43b and the like. Even if vibration occurs, it is possible to prevent the relative positional relationship between the two alignment marks PM and WM taken into the imaging region of the camera 43a from being shifted. That is, since the lens barrel 43b that guides the images of both the alignment marks PM and WM to the camera 43a is single, even if the lens barrel 43b vibrates, the light path from the alignment mark PM to the camera 43a remains The positional relationship of the light path from the alignment mark WM to the camera 43a does not change. Therefore, even if the position where the alignment marks PM and WM are imaged in the imaging region of the camera 43a changes, the relative positional relationship between the alignment marks PM and WM is prevented from changing.

  From these facts, it is possible to improve the recognition accuracy of the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. Accordingly, the alignment accuracy between the organic EL panel P and the electronic component W, which is performed using the relative position data, is improved, and as a result, the flexible electronic component W is attached to the flexible organic EL panel P. Even in the case of mounting, the mounting accuracy can be improved.

  In addition, a plurality of suction holes 42g are formed on the edge of the organic EL panel P on the support surface 42f of the support portion 42b provided on the stage 42 and supporting the edge of the organic EL panel P on which the electronic component W is mounted from below. Are provided at intervals shorter than the period of the unevenness due to the warpage or undulation occurring in the organic EL panel P, and the organic EL panel P is held by suction while being supported by the supporting surface 42f. Thereby, the edge of the organic EL panel P can be supported in a flatter state, so that the alignment mark PM of the organic EL panel P and its surrounding portion are stably held in a horizontal and flat state, and The position recognition accuracy of the mark PM can be further improved.

  Further, the edge of the organic EL panel P on which the electronic component W is mounted is sucked from below by a plurality of suction holes 42g provided in the support surface 42f of the support portion 42b. Therefore, even when the resin constituting the organic EL panel P is warped to the edge of the organic EL panel P due to moisture absorption or the like, the organic EL panel P is moved to the supporting surface 42f of the supporting portion 42b. It becomes possible to make it adhere closely. Thereby, the alignment mark PM of the organic EL panel P and its surrounding portion can be stably held in a flat state, and the position recognition accuracy of the alignment mark PM can be improved.

  The holding body 81 of the first transport unit 80 that supplies and mounts the organic EL panel P on the stage 42 is separated by the flat suction surface 81c of the electrode surface suction block 81a and the flat suction surface of the display area suction unit 81b. The surface holding the EL panel P is formed to be flat. Thus, even if the organic EL panel P is flexible and is likely to be warped or bent, it can be held in a flat state by the holding body 81 by being sucked and held on the flat holding surface. . This allows the organic EL panel P to be placed and held on the stage 42 in a flat state, thereby stabilizing the effect of improving the position recognition accuracy of the alignment mark PM performed while being held on the stage 42. It can be obtained.

  Further, when the organic EL panel P is placed on the stage 42 by the holder 81, the organic EL panel P is moved by the holding surface of the holder 81 onto the support surface 42 f of the support part 42 b of the stage 42 and the mounting part 42 a. It is configured to be sandwiched between the placing surface 42d. Thus, the organic EL panel P can be delivered to the stage 42 while maintaining a flat state. Thus, the organic EL panel P can be held on the stage 42 in a flat state, and the effect of improving the position recognition accuracy of the alignment mark PM performed in the state held on the stage 42 can be more stably obtained. It becomes possible.

  Further, the first and second imaging devices 43A and 43B of the position recognition unit 43 for detecting the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W include a camera 43a and a lens barrel. An X-axis moving device 43c for moving the section 43b in the X-axis direction is provided, and the camera 43a and the lens barrel 43b are moved between the imaging position and the retracted position by linear movement in the X-axis direction. I have. This movement is performed synchronously. That is, the left and right cameras 43a and the lens barrel 43b simultaneously move in opposite directions and stop at the same time. That is, since the first and second imaging devices 43A and 43B have the same configuration, the weights of the camera 43a and the lens barrel 43b are the same, and the members having the same weight move in the opposite directions at the same time and stop at the same time. Therefore, it can be expected that the vibration caused by the movement or the stop of each other is canceled, and the vibration caused by the movement or the stop of both is reduced. Therefore, imaging of the alignment marks PM and WM of the organic EL panel P and the electronic component W can be performed in a state where vibration is suppressed as much as possible, and detection of relative position data of the alignment marks PM and WM can be performed with high accuracy. Becomes possible.

  Note that the present invention is not limited to the above embodiment. For example, an organic EL panel has been described as an example of the display panel, but the display panel is not limited to this. For example, it is also possible to use a component of flexible electronic paper as a display panel.

  Further, the anisotropic conductive tape F is used for connecting the organic EL panel P and the electronic component W, but the present invention is not limited to this. Other joining members such as an adhesive containing conductive particles may be used. When an adhesive is used, a thermosetting or photocurable adhesive can be used.

  The camera 43a and the lens barrel 43b of the first and second imaging devices 43A and 43B of the position recognition unit 43 are positioned at the imaging position and the retreat position by moving in the X-axis direction. The positioning in the imaging position and the retreat position may be performed by moving in the axial direction. In short, it is only necessary that the camera 43a and the lens barrel 43b can be retracted to a position where they do not hinder the movement of the pressurizing tool 41a such as the vertical movement. Also, the imaging unit is described as a camera 43a, and the prism 43e as a light guiding optical member is provided on a lens barrel 43b separate from the camera 43a. However, the imaging unit and the light guiding optical member are separate members. The optical member for guiding light may be built in a camera, for example.

  The configurations of the first to third transport units 80, 90, 100 are not limited to those described above, and may be other configurations. For example, instead of using a porous sheet, a material in which a plurality of openings for suction are provided in a soft rubber or resin material such as urethane foam rubber or silicone rubber may be used.

  Although it has been described that the organic EL panel P is transported from the stage 42 of the temporary pressure bonding apparatus 40 to the stage 51 of the final pressure bonding apparatus 50 using the second transport unit 90, the present invention is not limited to this. For example, the stage 51 of the final crimping device 50 is configured to be movable to a position close to the stage 42 of the temporary crimping device 40, and the stage 51 of the final crimping device 50 moved to the position close to the stage 42 of the temporary crimping device 40 On the other hand, the organic EL panel P may be transported using the first transport unit 80. That is, the first transport unit 80 may also serve as the second transport unit 90.

  The description has been made on the assumption that the organic EL panels P are thermocompression-bonded one by one by the temporary crimping device 40 and the main crimping device 50, but the present invention is not limited to this. For example, in general, final compression requires several times longer than temporary compression. Therefore, it is also possible to arrange a plurality of, for example, two main crimping devices 50 with respect to one temporary crimping device 40, thereby reducing the waiting time of the temporary crimping device 40 and improving the productivity. At this time, instead of providing a plurality of main bonding apparatuses 50, a stage 51 capable of mounting a plurality of organic EL panels P in parallel is provided in one main bonding apparatus 50, and a plurality of organic EL panels P are mounted in parallel. It is also possible to provide a permanent press head 52 that can perform final press-bonding of the electronic components W on the EL panel P collectively or individually. Here, in the case where the final compression bonding is performed at once, the final compression head 52 is provided with a pressing tool 52a having a length that can cover the entire area of the plurality of organic EL panels P placed in parallel. In addition, in the case where the main bonding is performed individually, a pressing tool 52a having a length that can cover the electronic component W mounted on one organic EL panel P is provided in the main bonding head 52 according to the mounting interval of the organic EL panel P. I do. It is preferable that each pressing tool 52a is configured so that the pressing force can be set individually.

  The edge of the organic EL panel P on which the electrode array ER is formed is suction-held by the holder 81 of the first transport unit 80, but is not limited thereto. For example, when the anisotropic conductive tape F is adhered to the electrode row ER of the organic EL panel P, other members cannot or do not want to contact the electrode row ER of the organic EL panel P. In some circumstances, the edge of the organic EL panel P where the electrode row ER is formed may not be held by suction, but may be held in a state where the edge protrudes from the holding body 81. As described above, even when the edge portion of the organic EL panel P on which the electrode array ER is formed is protruded and held by suction, a flexible film having a thickness of 20 μm or more and 500 μm or less and a flexural modulus of 2.5 GPa or more and 4.0 GPa or less is provided. In the case of an organic EL panel (display-like panel), the vicinity of the electrode array ER is sucked and held by the flat suction surface 81c of the holding body 81, so that warpage and undulation temporarily reaching the edge portion where the electrode array ER is formed are provided. Even if this occurs, the flat supporting surface 42f of the supporting portion 42b of the stage 42 can be sucked and held by the edges of the plurality of suction holes 42g by the suction force of the suction holes 42g.

  Further, a lighting device may be built in the support surface 42f of the support portion 42b of the stage 42. Specifically, a lighting device is built in a portion of the support surface 42f facing the alignment mark PM of the organic EL panel P, and when the alignment mark PM is imaged by the first and second imaging devices 43A and 43B. Light is irradiated from below the alignment mark PM. By doing so, it is possible to obtain a large difference in brightness between the image of the alignment mark PM and the background image, as compared with the case where the alignment mark PM is imaged by reflected light, and to make the image of the alignment mark PM clearer. And the recognition accuracy can be improved. Also, instead of incorporating the lighting device in the support portion 42b, a light-transmitting window is provided, or the support portion 42b is formed of a light-transmitting member, for example, a transparent glass material, and light is irradiated through these. You may do it.

  In the embodiment described above, the configuration in which the anisotropic conductive tape F is attached to the electronic component W has been described, but the present invention is not limited to this. The anisotropic conductive tape F may be attached to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape sticking device 30 at the sticking position C of the intermittent rotary transfer device 20, the anisotropic conductive tape is attached to the organic EL panel P upstream of the supply section of the organic EL panel P. It is preferable to provide an anisotropic conductive tape sticking device for sticking F. For example, a mounting device 201 as shown in FIG. 11 may be applied. FIG. 11 shows a configuration of a mounting apparatus 201 according to another embodiment.

[Mounting Device According to Another Embodiment]
The mounting device 201 shown in FIG. 11 includes an anisotropic conductive tape sticking device 230, a temporary pressure bonding device 240, and a full pressure bonding device 250 arranged side by side in the X direction, and a punching device 210 disposed behind the temporary pressure bonding device 240 in the Y direction. Further, a transport device 260 for transporting the electronic component W is disposed between the temporary pressure bonding device 240 and the punching device 210. First to fourth transport units 271, 272, 273, and 274 of the organic EL panel P are disposed between the processing devices 230, 240, and 250. The mounting device 201 supplies the organic EL panels P four by four and performs processing in the processing devices 230, 240, and 250. The punching device 210 punches out the electronic component W from the carrier tape T, and has the same configuration as the punching device 10 described in the above embodiment.

  In the anisotropic conductive tape sticking device 230, the anisotropic conductive tape F is stuck to the organic EL panel P. In the anisotropic conductive tape adhering device 230, two mounting portions 231 and 232 for holding two organic EL panels P side by side in the X direction are arranged side by side in the X direction. These mounting portions 231 and 232 are provided so as to be movable in the XYZθ directions. Adhering units 233 and 234 for anisotropic conductive tape F are arranged corresponding to the two mounting portions 231 and 232. The mounting portions 231 and 232 sequentially position the organic EL panels P on the mounting portions 231 and 232 at the bonding positions by the corresponding bonding units 233 and 234, respectively. Each of the sticking units 233 and 234 sticks the anisotropic conductive tape F to the organic EL panel P positioned at the sticking position.

  The temporary crimping device 240 temporarily crimps the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is stuck. The temporary crimping device 240 includes a mounting portion 241 that holds the four organic EL panels P arranged in the X direction, a temporary bonding head 242 that temporarily compresses the electronic component W to the organic EL panel P held by the mounting portion 241, When the electronic component W is temporarily bonded to the organic EL panel P by the temporary bonding head 242, a backup tool (not shown) that supports the organic EL panel P from below is provided. The mounting portion 241 is provided so as to be movable in the XYZθ directions, and sequentially positions the four organic EL panels P on the mounting portion 241 at the temporary pressure bonding position by the temporary pressure bonding head 242. The temporary pressure bonding head 242 sequentially temporarily compresses the electronic component W to the organic EL panel P positioned at the temporary pressure bonding position. It goes without saying that the temporary crimping device 240 includes the same position recognition device as the temporary crimping device 40 described in the above embodiment.

  Here, the electronic components W punched by the punching device 210 are sequentially supplied to the temporary pressure bonding head 242 by the transport device 260. That is, the transport device 260 is movable in the XYZθ direction by the XYZθ driving unit 261, includes the receiving unit 262 that sucks and holds the electronic component W from below, receives the electronic component W from the punching unit 210, and Hand over to

  The final pressure bonding apparatus 250 performs final pressure bonding of the electronic component W temporarily pressed to the organic EL panel P. In the final pressure bonding apparatus 250, four mounting portions 251, 252, 253, 254 for individually holding the organic EL panels P are arranged side by side in the X direction. Also, four permanent pressure bonding heads 255, 256, 257, 258 are provided corresponding to the four mounting portions 251, 252, 253, 254. The press bonding heads 255, 256, 257, 258 are provided so that the pressing force can be individually adjusted, and are provided so as to be able to move up and down collectively. Each of the mounting portions 251, 252, 253, 254 is movable in the XYZθ direction, and the organic EL panel P can be positioned with respect to the corresponding main pressure bonding heads 255, 256, 257, 258. The four final pressure bonding heads 255, 256, 257, 258 collectively perform final pressure bonding on the four organic EL panels P positioned by the four mounting portions 251, 252, 253, 254.

  The first to fourth transport units 271, 272, 273, and 274 transfer four organic EL panels P to and from each of the processing devices 230, 240, and 250 at the same time. That is, each of the first to fourth transport units 271, 272, 273, and 274 includes four holding units that adsorb and hold the organic EL panel P from the upper side in the X direction. Then, the first transport unit 271 transfers four organic EL panels P from the supply unit (not shown) to the anisotropic conductive tape sticking device 230 at the same time. The second transport unit 272 transfers four organic EL panels P from the anisotropic conductive tape sticking device 230 to the temporary crimping device 240 at the same time. The third transport unit 273 transfers four organic EL panels P from the temporary pressure bonding device 240 to the final pressure bonding device 250 at the same time. The fourth transport section 274 simultaneously transports four organic EL panels P from the final pressure bonding apparatus 250 to a transport section (not shown). The present invention is applicable to the mounting apparatus 201 having such a configuration.

  Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)
Using the mounting apparatus 1 of the above-described embodiment, an experiment for confirming the mounting accuracy under the following conditions was performed. Here, a panel having a 5-inch display surface (120 mm × 65 mm) was prepared as the organic EL panel P. The thickness of the organic EL panel P is 210 μm, and the flexural modulus is 3.0 GPa. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was prepared. The target accuracy was ± 3 μm, which is a general accuracy required for an organic EL panel used for a display panel for a smartphone.

<Experiment conditions>
Temporary pressure head heater: OFF
Tact time: 10 seconds (however, the moving speed of the temporary crimping tool 41a and the mounting portion 42a is the same as the case of mounting in 5 seconds of tact).
Repetition time (number of times): 5.4 hours (1944 times)

  At the time of the experiment, the organic EL panel P is first mounted on the mounting portion 42a in a state where each is at the standby position, and the electronic component W is held by the pressing tool 41a. The standby position is a supply position for receiving the organic EL panel P from the first transport unit 80 for the placement unit 42a, and a position for receiving the electronic component W from the second delivery device 70 for the pressing tool 41a. From this state, the organic EL panel P and the electronic component W are positioned at the temporary pressure bonding position in the same manner as in the above-described embodiment. That is, between the organic EL panel P and the electronic component W, the edges thereof are arranged to face each other with an interval at which the lens barrel 43b of the first and second imaging devices 43A and 43B can enter. . At this time, the pressure head 41a is positioned while being rotated in the horizontal direction at θ = + 5 °. This is to confirm the correction accuracy of the rotational deviation.

  In this state, the position of the alignment mark between the organic EL panel P and the electronic component W is recognized using the first and second imaging devices 43A and 43B, and based on the recognition result, the organic EL panel P and the electronic component W are recognized. Perform position adjustment. This alignment does not overlap the edge of the electronic component W with the edge of the organic EL panel P, but keeps the above-described lens barrel 43b at an interval where the lens barrel 43b can enter, that is, in the height direction. The positions of the alignment marks of the organic EL panel P and the electronic component W were adjusted without changing the positions. Therefore, it is not always necessary to retract the first and second imaging devices 43A and 43B during alignment.

  When the alignment is completed, the alignment mark of the organic EL panel P and the alignment mark of the electronic component W are imaged using the first and second imaging devices 43A and 43B, and the alignment between the organic EL panel P and the electronic component W is performed. Recognize the relative displacement between them. Then, the relative position deviation obtained from the recognition result is recorded as mounting accuracy.

(Comparative Example 1)
In the comparative example, the left and right alignment marks PM of the organic EL panel P and the left and right alignment marks WM of the electronic component W are individually captured instead of the first and second imaging devices 43A and 43B described in the embodiment. In this example, four cameras were mounted, and the mounting accuracy was confirmed. Although the accuracy of the alignment is confirmed accurately, the misalignment that occurs during crimping is a certain tendency due to the assembling accuracy and can be offset by setting the offset value. Can be seen.

  In addition, in the comparative example, when the alignment accuracy is checked as described later, the alignment mark PM of the organic EL panel P needs to be imaged from below, that is, through the organic EL panel P. TEG (Test Element Group) was used. The TEG is an evaluation member manufactured for a test. Here, as the TEG of the organic EL panel P, a glass plate having a thickness of 0.5 mm and a size corresponding to the 5-inch organic EL panel P was prepared and used. Hereinafter, the TEG of the organic EL panel P is simply referred to as the organic EL panel P.

  Among the four cameras, two cameras for imaging the alignment marks PM of the organic EL panel P are provided one by one immediately below the alignment marks PM of the organic EL panel P in a state positioned at the recognition position prior to the temporary crimping. It was mounted face up. Two cameras for imaging the alignment mark WM of the electronic component W are attached upward so as to be positioned one by one immediately below the alignment mark WM of the electronic component W positioned at the recognition position prior to the temporary crimping. Was. In addition, the supporting portion 42b that supports the edge of the organic EL panel P is provided with a notch vertically penetrating at a position corresponding to the alignment mark, and is manufactured for an experiment in which the alignment mark can be visually recognized from below. What was used was used.

  Using the mounting apparatus configured as described above, the alignment result between the organic EL panel P and the electronic component W was recorded as mounting accuracy. Specifically, the position of the alignment mark of the organic EL panel P positioned at the recognition position is recognized using two cameras for the organic EL panel P, and the position of the alignment mark of the electronic component W positioned at the recognition position. Was recognized using two cameras for the electronic component W. At this time, the electronic component W was positioned while being rotated in the horizontal direction at θ = + 5 °, as in the above-described embodiment. Then, based on these recognition results, the organic EL panel P and the electronic component W were aligned.

  In this alignment, the edge of the electronic component W is not overlapped with the edge of the organic EL panel P, but the edge of the organic EL panel P and the edge of the electronic component W are slightly set in advance. The test was performed so as to face each other at an appropriate distance. Specifically, positioning was performed such that the edges formed a 3.3 mm interval. Recognition of the alignment accuracy is performed by simultaneously capturing the alignment marks of the organic EL panel P and the electronic component W in the same field of view by using two cameras provided upward for imaging the alignment marks of the electronic component W, and determining the relative position. A gap was recognized. That is, the right alignment marks of the organic EL panel P and the electronic component W are simultaneously captured in the same field of view using the right camera for the electronic component W and imaged, and the left alignment marks are used by the left camera. At the same time in the same field of view. The alignment accuracy was determined from the relative positions of the imaged alignment marks, and recorded as the mounting accuracy.

  Table 1 and FIG. 12 show the measurement results of Example 1 described above. The measurement results of Comparative Example 1 are shown in Table 2 and FIG. Regarding the measurement results, the average value (1) of the 1st to 10th data among the 1944 data obtained from the result of repeatedly executing the above operation for 5.4 hours, and the 101st to 110th data ( Tables 1 and 2 show the average value of 2), and similarly, the average value ((3) to (20)) of the data for 10 times every 100 times ((3) to (20)). The “difference from the measurement result of (1)” in Tables 1 and 2 means the average value (1) of the first to tenth data from the average value (2) to (20) of the data every 100 times. It is the value subtracted. FIGS. 12 and 13 show the fluctuation of “difference from the measurement result of (1)”. As is clear from the comparison between Table 1 and FIG. 12 and Table 2 and FIG. 13, it can be seen that the variation in the mounting accuracy is significantly suppressed in the example as compared with the comparative example. Therefore, it is understood that the mounting accuracy of the flexible electronic component on the flexible display panel can be maintained for a long period of time.

  Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and their equivalents.

  DESCRIPTION OF SYMBOLS 1 ... Mounting apparatus, 10 (10A, 10B) ... Punching apparatus, 12 ... Die apparatus, 20 ... Intermittent rotation conveyance apparatus, 21 ... Arm part, 24 ... Holding head, 30 ... Anisotropic conductive tape sticking apparatus (joining) Member sticking device), 32 Sticking head, 40 Temporary pressure bonding device, 41 Temporary pressure bonding head, 42 Stage, 42a Placement portion, 42b Support portion, 42c Stage drive portion, 43 Position recognition unit 43A: First imaging device, 43B: Second imaging device, 43a: Camera, 43b: Barrel unit, 43c: X-axis moving device, 43d: Image processing unit, 43e: Right angle prism, 50: Final crimping device 51, stage, 52, final pressure bonding head, 53, backup unit, 60, first delivery device, 61, receiving unit, 70, second delivery device, 71, receiving unit, 80, first transport unit, 81: Holder, 81a Electrode surface suction block, 81b: display area suction unit, 90: second transport unit, 91: holder, 100: third transport unit, 101: holder, 110: control unit, 111: storage unit, F ... Anisotropic conductive tape, P: organic EL panel, W: electronic component.

Claims (11)

Flexible electrodes having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and arranged on the edges of a flexible display panel, A component mounting device for mounting the electronic component on the display panel by connecting a plurality of terminals arranged in correspondence with the plurality of electrodes through a joining member in the component,
A stage on which the display panel is mounted, comprising: a supporter for supporting the edge of the display panel on which the electronic component is mounted, from below, and is movable in a horizontal direction together with the supporter. The stage,
The electronic component is horizontally and vertically movable so as to hold the electronic component from above and position the electronic component at a position above the edge supported by the support portion, and to move the electronic component on an upper surface of the edge. A thermocompression head for thermocompression bonding,
In a state where the electronic component is positioned above the edge of the display panel, the electronic component can be inserted between the display panel and the electronic component, and the alignment mark provided on the edge and An imaging device that simultaneously captures an alignment mark provided on an electronic component into one imaging region and performs imaging;
The stage and the heat source are adjusted so that the position of the display panel and the electronic component is adjusted based on the relative position information of the alignment mark of the display panel and the electronic component obtained from the captured image of the imaging device. A control device that controls the stage and the thermocompression head so as to adjust the relative position of the crimp head and to thermocompress the electronic component to the display panel by the thermocompression head in the adjusted positional relationship. Electronic component mounting equipment.   2. The electronic component according to claim 1, wherein the support portion of the stage has a plurality of suction holes provided at a contact portion with the edge of the display panel so as to suck the edge. 3. Mounting device.   3. The electronic component mounting apparatus according to claim 2, wherein the plurality of suction holes are arranged at intervals shorter than a period of irregularities generated on the edge of the display panel. Further, a transport unit that supplies the display panel to the stage,
The transport unit includes an electrode surface suction block that sucks and holds the edge portion of the display panel flat, and a display area suction block that sucks and holds a portion of the display panel other than a portion that is sucked by the electrode surface suction block. The mounting device for an electronic component according to claim 1, further comprising a holding body having a portion.   The electronic component mounting apparatus according to claim 4, wherein the display area suction unit includes a porous sheet having a flat suction surface.   A plurality of the display area suction units are arranged side by side in a direction intersecting with the edge of the display panel sucked and held by the electrode surface suction block, and each of them has an interval between the electrode surface suction blocks. The electronic component mounting device according to claim 4, wherein the electronic component mounting device is provided so as to be adjustable.   The imaging device according to claim 1, wherein the imaging device includes an imaging unit having an imaging device, and a light guiding optical member that simultaneously guides an image of the display panel and an image of the electronic component to the imaging device. An electronic component mounting apparatus according to claim 1.   The light-guiding optical member has a right-angled prism having a triangular prism whose bottom surface is a right-angled isosceles triangle and two side surfaces corresponding to two sides having equal lengths as reflecting surfaces. An image of the display panel is guided to a first region of the imaging device on one of the reflection surfaces, and an image of the electronic component is guided to a second region of the imaging device on the other reflection surface. The mounting device for an electronic component according to claim 7, wherein the mounting device is configured. A punching device for punching the electronic component from a carrier tape,
An intermittent rotation transfer device that includes a plurality of holding heads that hold the electronic component punched by the punching device, and that moves the holding head intermittently.
A joining member sticking device that is arranged on the transport path of the electronic component by the intermittent rotation transport device and sticks the joining member to the electronic component,
The stage, the thermocompression head, and the imaging device, a temporary pressure bonding device that temporarily presses the electronic component to which the bonding member is bonded by the bonding member bonding device to the display panel,
A final press bonding device for final press bonding of the electronic component temporarily pressed to the display panel by the temporary press bonding device;
A first delivery device that delivers the electronic component between the punching device and the intermittent rotation transport device;
A second delivery device for delivering the electronic component between the intermittent rotary transfer device and the temporary crimping device,
A transport unit that transports the display panel from the temporary compression bonding apparatus to the final compression bonding apparatus,
The temporary crimping device and the main crimping device are arranged adjacent to each other,
The said intermittent rotation conveyance device and the said punching device are arrange | positioned in order of the said intermittent rotation conveyance device and the said punching device in the direction orthogonal to the said adjacent direction with respect to the said temporary crimping | compression-bonding apparatus, Claim 1 thru | or Claim. Item 10. The electronic component mounting apparatus according to any one of items 8. A punching device for punching the electronic component from a carrier tape,
In the display panel, a joining member attaching device that attaches the joining member to the edge on which the electronic component punched by the punching device is mounted,
The stage, the thermocompression bonding head, and the imaging device, the temporary bonding device for temporarily bonding the electronic component to the display panel via the bonding member,
A final press bonding device for final press bonding of the electronic component temporarily pressed to the display panel by the temporary press bonding device;
A delivery device for delivering the electronic component between the punching device and the temporary crimping device,
A transport unit that transports the display panel from the bonding member attaching device to the temporary pressure bonding device,
With another transport unit that transports the display panel from the temporary pressure bonding device to the final pressure bonding device,
The joining member attaching device, the temporary crimping device, and the final crimping device are arranged in this order,
9. The electronic component mounting device according to claim 1, wherein the punching device is arranged in a direction orthogonal to the arrangement direction with respect to the temporary crimping device. 10. A flexible display panel having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and holding a flexible display panel on a stage, and an edge of the display panel having a plurality of electrodes. Supporting the portion from below by a supporting portion provided on the stage,
A holding step of holding a plurality of terminals provided corresponding to the plurality of electrodes, and holding a flexible electronic component on a thermocompression bonding head,
Positioning the electronic component held by the thermocompression bonding head at a position above the edge supported by the support,
In a state where the electronic component is positioned above the edge of the display panel, an imaging device is inserted between the display panel and the electronic component, and the imaging device is provided at the edge with the imaging device. An imaging step of simultaneously capturing and imaging the alignment mark and the alignment mark provided on the electronic component in one imaging region;
A position recognition step of recognizing a relative positional relationship between the display panel and the electronic component based on an image of the alignment mark of the display panel and the electronic component captured in the imaging step;
The relative position between the stage and the thermocompression head is adjusted based on the relative positional relationship recognized in the position recognition step, and the thermocompression head applies the electronic component to the display panel with the adjusted positional relationship. A method for manufacturing a display member, comprising: a thermocompression bonding step of performing compression bonding.

Images