TW201843668A - Device for mounting electric component and method for manufacturing a display member - Google Patents

Abstract

Provided is a mounting device of an electronic component, which enables an electronic component having flexibility to be stably mounted on a flexible display panel at good precision. The mounting device of an electronic component comprises: a stage (42) having a support unit for supporting the edge portion of a display panel (P) from a lower side; a pressing head (41) for maintaining an electronic component (W) on the upper side thereof; an imaging device (43A, 43B) capable of being able to enter a gap between the display panel (P) and the electronic component (W) positioned above the edge portion of the display panel (P), and simultaneously receiving and photographing an alignment mark provided on the edge portion and an alignment mark provided on the electronic component (W) in one imaging area; and a control device for aligning the display panel (P) and the electronic component (W) on the basis of relative position information obtained from photographed images of the both alignment marks.

Description

Mounting device for electronic component and method of manufacturing display member

An embodiment of the present invention relates to an electronic component mounting device and a display member manufacturing method for mounting a flexible electronic component on the edge of a flexible display panel.

In the flat panel display market used for displays such as televisions, personal computers, smart phones, and the like, the liquid crystal display has an overwhelming popularity. In this case, in recent years, an organic EL display having a feature that it can be formed on a flexible resin film and can be bent without requiring a backlight can be made thinner, and is attracting attention in the market for small displays for portable terminal devices. Based on this, it is required to be able to suitably use an electronic component mounting device that can be assembled in an organic EL display that can be bent, that is, has flexibility.

An external wire bonding device (hereinafter referred to as an OLB device) for a liquid crystal display is known as a mounting device for a general electronic component (see Patent Document 1). However, the OLB device used as an organic EL display is unknown. Therefore, in the mounting process of an electronic component performed when manufacturing an organic EL display, an OLB apparatus for a liquid crystal display is used instead.

An OLB device for a liquid crystal display is a device in which an electronic component is mounted on a display panel made of a glass substrate through an anisotropic conductive tape. In the mounting process of the OLB device for liquid crystal display, first, the edge of the display panel to be mounted as an electronic component is protruded from the table and held, and the electronic component is brought close to the edge of the display panel and held. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously photographed from the lower side of the display panel by one camera, and the relative positions of the two are recognized. Thereafter, it is held from the lower side of the edge of the display panel by a back up tool, and the display panel is aligned with the position of the electronic component according to the recognized relative position, and is heated by the anisotropic conductive tape. The electronic component is attached to the edge of the liquid crystal panel by pressurization. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2006-135082

[Problems to be solved by the invention]

When the OLB device for the above liquid crystal display is directly applied to the manufacturing process of the organic EL display, the mounting of the electronic component is performed with good precision. In other words, the inventors of the present invention have attempted to directly use the OLB device for the liquid crystal display, and to mount an electronic component on a flexible display panel (hereinafter referred to as an organic EL panel) which is a constituent element of the organic EL display, and to manufacture a display. member. Specifically, an organic EL panel having a size of 5.0 inches and a thickness of about 0.2 mm, which is widely used in smart phones, is equipped with a COF (Chip on Film) having a width of 38 mm as an electronic component. As a result, it is understood that the electronic component can be mounted with good precision in the organic EL panel only by directly using the OLB device for the liquid crystal display. Specifically, the organic EL panel for smart phones requires an installation accuracy of about ±3 μm, and it is understood that such mounting accuracy cannot be satisfied.

The inventors of the present invention confirmed the following two factors to influence the accuracy. (1. The occurrence of the sag of the edge of the organic EL panel) The display panel used for the manufacture of the liquid crystal display (hereinafter referred to as the panel for liquid crystal display) is such that the glass substrates having a thickness of 0.5 to 0.7 mm are bonded to each other. The rigidity is relatively high. Therefore, even if the edge portion of the liquid crystal display panel is held by about 10 mm from the table projection, the edge portion hardly sag due to its own weight.

On the other hand, an organic EL panel is generally used, and a polyimine (PI) film having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member for forming an organic EL element, is used, and then the support member is also thick. Since it is a thin resin substrate made of a polyethylene terephthalate (PET) film of about 0.1 to 0.2 mm, the rigidity is extremely low. Further, the resin film may exhibit an elongation due to moisture absorption or a bending or undulation due to stress at the time of the above-mentioned bonding. Therefore, in the organic EL panel, when the edge portion is protruded by 10 mm from the table, the protruding edge portion is liable to sag based on its own weight. When the edge portion of the organic EL panel hangs down, the amount of sag causes the position of the alignment mark formed on the edge portion to deviate in the horizontal direction. Therefore, in the position recognition of the alignment mark of the organic EL panel by the camera, the identification position may be deviated.

The inventors of the present invention have confirmed that the edge portion of the organic EL panel is sagged at the edge portion when the substrate is protruded by 20 mm from the table and held in the same manner as in the case of the liquid crystal display panel of the same size. The position causing the alignment mark produces a positional deviation of about 4 μm in the horizontal direction (toward the stage side). Further, when the edge portion of the organic EL panel is drooped, the alignment mark is inclined with respect to the horizontal state. In the case where the oblique alignment mark is photographed from directly below, the length in the oblique direction of the photographed alignment mark is shortened compared with the case where the photograph is photographed in the horizontal state. That is, the shape of the alignment mark of the photograph is deformed due to the tilt. As a result, a shape difference is generated between the reference mark previously recorded, which also causes an error in the identification position of the alignment mark.

The inventors of the present invention confirmed that the alignment marks held at the horizontal level and the alignment marks inclined by 5° with respect to the horizontal position were compared with each other, and it was confirmed that the alignment marks having an inclination of 5° produced a large error of about 1 μm on average. In addition, the experiment of setting the alignment mark to an inclination of 5° was carried out by measuring the sag caused by the edge portion protruding from the table by 20 mm for the plurality of organic EL panels, and as a result, it was confirmed that the sag was 5° or more.

(2. Variation in reflection of light at the edge of the organic EL panel) When the alignment mark of the organic EL panel is photographed, illumination is performed from a certain lower side of the camera. The irradiation conditions (the amount of irradiation light, the irradiation angle, and the like) of the illumination are set using an organic EL panel (for example, an organic EL panel having a flat edge, hereinafter referred to as a "reference panel"), and the reference panel can be photographed well. Align the conditions of the mark. As a result, the edge portion of the organic EL panel that is actually photographed is sagged or curved, and the edge portion of the reference panel is inclined or the like. Therefore, the reflection state of the illumination at the edge of the organic EL panel is different from that of the reference panel. . As a result, there is a problem that the photographing of the alignment mark cannot be performed clearly, or the photographing cannot be performed in full. As a result of the experiment by the inventors of the present invention, it was confirmed that when the alignment mark could not be clearly photographed, the identification position was largely shifted by about 1 μm.

In order to suppress sagging or bending of the edge portion of the organic EL panel, the inventors of the present invention have processed the portion (support surface) supporting the edge portion of the organic EL panel to be flat, and formed a portion penetrating the portion corresponding to the alignment mark. a through hole for photographing up and down, and a support member that can suck and hold the edge portion is attached to the table so as to be held in a manner that does not cause sagging or bending at the edge of the organic EL panel, and in this state, the electronic component is again tried. installation. However, even if the above measures are taken, the mounting accuracy of ±3 μm cannot be sufficiently satisfied. In the result of the in-depth review, the inventors of the present invention further confirmed the following three factors.

(3. Problems with the surface precision of the organic EL panel) The resin film such as a PI film or a PET film constituting the organic EL panel is usually heated by a solution casting method or a melt extrusion method or by dissolving via a solvent. The resin is thinned and molded to be produced. The resin film thus produced is in a state of being thinned and stretched, and is a state in which a rough product (a direct state after the resin film is formed, a state in which fine processing such as polishing is not performed), and therefore, chemical or physical polishing after molding. Compared with the substrate, the surface has fine irregularities (undulations). Further, the state of the unevenness is different in one surface and the other surface of the resin film. Therefore, when the alignment mark is photographed by the camera, the direction in which the light reflected by the alignment mark proceeds differs depending on the location.

For example, in the organic EL panel, it is considered that the upper portion in which the alignment mark is formed is undulated in a shape in which the curvature is concave. The lower surface of the organic EL panel is set to a substantially horizontal plane. When the alignment mark of the organic EL panel is irradiated with light from the lower side through the through hole of the support member, the light irradiated toward the one end (left end) of the alignment mark first passes through the lower surface of the organic EL panel. At this time, the lower surface of the organic EL panel is a horizontal plane so that incident light is hardly refracted. The light that reaches the interface between the upper surface of the organic EL panel and the alignment mark is reflected in the organic EL panel, and is reflected in the interface. At this time, at the portion at the left end of the alignment mark, the surface of the organic EL panel is inclined downward toward the alignment mark (from left to right), and thus is reflected toward the outside (left direction) at a reflection angle corresponding to the inclination. Then, the reflected light is refracted obliquely with respect to the lower surface of the organic EL panel, and further proceeds to the outside (left direction).

On the other hand, the light irradiated toward the other end (right end) of the alignment mark is directed to the opposite direction at the interface of the upper surface of the organic EL panel and the alignment mark in a direction corresponding to the inclination of the upper surface of the organic EL panel. The (right direction) is reflected, and is further refracted by the lower surface of the organic EL panel and further toward the outside (right direction). When fine irregularities (undulations) are generated on the surface of the resin film on which the alignment mark is formed, the reflected light of the light irradiated toward the alignment mark M is incident on a path different from the path of the incident light. In the camera, the portion of the alignment mark M causes a different path of reflected light. They become the cause of the identification error of the alignment mark, resulting in a decrease in the position recognition accuracy of the alignment mark.

(4. Problem of light transmittance of organic EL panel) As described above, the organic EL panel is formed by bonding a PI film to a PET film by an adhesive. Therefore, when the alignment mark formed on the upper surface side of the organic EL panel is photographed from the lower surface side of the organic EL panel, the light transmittance of the organic EL panel has an influence on the recognition accuracy of the alignment mark. Specifically, no matter how the illumination is adjusted, it is difficult to clearly photograph the edge of the alignment mark.

The inventors of the present invention measured the light transmittance of the glass plate of the liquid crystal display panel and the resin substrate of the organic EL panel with respect to the portion where the alignment mark was formed, and found that the transmittance of the organic EL panel was lower than that of the liquid crystal display panel. About 7.4%. The inventors of the present invention used the liquid crystal display panel and the organic EL panel to repeat the identification of the alignment marks for each of the same liquid crystal display panel and the same organic EL panel, and confirmed the repeatability of the identification position of the alignment mark. . As a result, the error in the position recognition accuracy of the liquid crystal display panel was ±0.3 μm, whereas the position recognition accuracy in the organic EL panel caused an error of ±1.2 μm.

(5. Problems in the structure of the organic EL panel) The organic EL panel is formed by laminating a plurality of resin films of different characteristics by an adhesive or the like. Therefore, the light irradiated toward the organic EL panel is incident on the camera after passing through the interface between the different members at a plurality of times.

Here, a configuration in which a PI film having an organic EL element or an alignment mark formed on its surface is adhered to a PET film through an adhesive is considered. In the case where the alignment mark of the organic EL panel is irradiated with light from the lower side, the irradiated light passes through the interface between the air and the PET film, the interface between the PET film and the adhesive layer, and the interface between the adhesive layer and the PI film. . The light reflected by the interface between the PI film and the alignment mark is incident on the camera through the above-described respective interfaces.

As described above, based on the influence of the surface precision of the organic EL panel, when the interface between the air and the PET film is inclined, the light is obliquely incident on the lower surface of the PET film, so that light refraction is generated at the above-mentioned respective interfaces, and it is sought A path having a different path from which light reflected by the alignment mark is incident is incident on the camera. Therefore, the portion of the light refraction causes the identification position of the alignment mark to deviate. Therefore, the position recognition accuracy of the alignment mark is lowered. Fig. 14 is an image of a circular alignment mark of a photographic organic EL panel (Fig. 14 (A)) and a liquid crystal display panel (Fig. 14 (B)). It was confirmed that the deformation of the peripheral portion of the alignment mark of the organic EL panel was large.

Further, on the back side of the PI film, it is possible to form a film having high reflectance by vapor deposition or the like. In this case, light incident on the organic EL panel is almost reflected by the film. In this case, the photographing of the alignment mark cannot be performed clearly, and the position recognition accuracy is remarkably lowered. Moreover, in order to prevent charging of the organic EL panel, etc., it is possible to contain carbon particles in the PI thin film which becomes a base material. In such a case, the carbon particles block the transmission of light, and the imaging of the alignment mark becomes difficult, and the recognition cannot be performed correctly.

The present invention has been made in order to solve the problem of reducing the mounting accuracy of an electronic component caused by applying the above-described conventional OLB device for liquid crystal display to an organic EL display manufacturing process, and an object of the present invention is to provide a thermal compression bonding. In the case where a flexible display panel is provided with a flexible electronic component, the electronic component mounting device and the display member manufacturing method of the electronic component can be mounted on the display panel with good precision. [Means for solving the problem]

The mounting device for an electronic component according to the embodiment is a plurality of electrodes having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and an edge portion of the flexible display panel. In the flexible electronic component, a plurality of terminals arranged in association with the plurality of electrodes are connected to each other by the bonding member, and the electronic component is mounted on the display panel, and includes a table. The table on which the display panel is placed is provided with a support portion for supporting the edge portion on which the electronic component is mounted from the lower side, and is movable in the horizontal direction simultaneously with the support portion; a connector for holding the electronic component from an upper side so as to be movable in a horizontal direction and a vertical direction so that a position of the electronic component is positioned above the edge portion supported by the support portion, and hot pressing the electronic component Connected to the upper surface of the edge portion; the photographing device is positioned at the position of the electronic component at the position of the display panel In a state in which the upper portion of the edge portion is located, the display panel and the electronic component are allowed to enter, and the alignment mark provided on the edge portion and the alignment mark provided on the electronic component are simultaneously taken into one image. And controlling the device to align the display panel and the electronic component with respect to the relative position information of the display panel and the alignment mark of the electronic component obtained from the image of the imaging device; a manner of adjusting the relative position of the table and the hot-pressing joint, and thermally pressing the electronic component to the display panel by the hot-pressing joint according to the adjusted positional relationship. The table and the above-mentioned hot press joint are controlled.

In the method for producing a display member according to the embodiment, the display panel having a thickness of not less than 500 μm and not more than 500 μm and having a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less is held on the table, and the above-described display panel is provided. A support portion having a plurality of electrodes of the display panel is supported from the lower side by a support portion provided on the table; and a plurality of terminals having a plurality of terminals corresponding to the plurality of electrodes and having flexibility Holding the component in the holding process of the thermocompression bonding piece; and positioning the position of the electronic component held by the thermocompression bonding member at a position above the edge portion supported by the support portion; the position of the electronic component is already at the position a state in which the imaging device enters between the display panel and the electronic component in a state where the upper edge of the display panel is positioned above the display device, and the alignment mark provided on the edge portion and the electronic component are provided by the imaging device The alignment mark is taken into one photographic area at the same time and the photographic work is performed; according to the above photography project a position recognition project for recognizing a relative positional relationship between the display panel and the electronic component, and an image identified by the position recognition project The relative positional relationship is adjusted between the table and the hot-pressing joint, and the electronic component is thermocompression-bonded to the thermocompression bonding process of the display panel by the thermocompression bonding joint according to the adjusted positional relationship. [Effects of the Invention]

According to the mounting device of the present invention, even in a flexible display panel such as an organic EL panel, when a flexible electronic component is mounted by thermocompression bonding, the electronic component can be mounted with good precision. installation. Further, according to the method of manufacturing a display member of the present invention, it is possible to provide a display member in which an electronic component is mounted on a display panel with good precision.

Hereinafter, an electronic component mounting device and a method of manufacturing a display member according to an embodiment will be described with reference to the drawings. The drawing is a mode representation, and the relationship between the thickness and the plane size, the ratio of the thickness of each portion, and the like may be different from the actual one. In the case where the direction of the upper and lower directions in the description is not particularly indicated, the direction in which the mounting surface of the electronic component of the display panel (organic EL panel) described later is the upper side is referred to.

[Configuration of Mounting Apparatus] Fig. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment, and Fig. 2 is a side view showing an electronic component mounting apparatus of Fig. 1. The mounting device 1 for an electronic component shown in Fig. 1 and Fig. 2 is used by a manufacturer of a constituent member (a member for display) of a display device such as an organic EL display. In other words, the mounting device 1 is used to transmit the flexible electronic component W such as COF stamped by a carrier tape T through the anisotropic conductive tape F as a bonding member. The organic EL panel P of the flexible display panel is used to manufacture a display member in which the electronic component W is mounted on the organic EL panel P.

Here, the organic EL panel P is mainly formed as a member having flexibility. As the member having flexibility, for example, PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate), or the like can be used. These components can be used by adhesive bonding. The organic EL panel P has a thickness of 20 μm or more and 500 μm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less. The organic EL panel P of the present embodiment has a configuration in which a PI film on which an organic EL element is formed is bonded to a support film, that is, a PET film, through an adhesive. The thickness (about 200 μm) of the PET film is 10 times or more with respect to the thickness of the PI film (about 10 μm), and therefore the bending elastic modulus of the organic EL panel P is almost equal to the bending elastic modulus of the PET film.

Here, the bending elastic modulus is a value measured in accordance with the test method specified in JIS K7171: Calculation method of plastic-bending property (revised edition, March 22, 2016). Specifically, the flexural modulus test is performed by a test piece having a length of 80 ± 2 mm, a width of 10.0 ± 0.2 mm, and a thickness of 4.0 ± 0.2 mm, and is supported by a deflection measuring device having a distance between fulcrums adjusted to 64 mm. The support table was lowered at a test speed of 2 mm/min to the center between the fulcrums, and the center of the test piece was flexed. The test atmosphere was set to a standard atmosphere (temperature 23 ° C / humidity 50%) prescribed by JIS K7100.

As the electronic component W, an electronic component having a flexible COF or the like can be used. The COF is a semiconductor element mounted on a flexible film substrate formed of PI (polyimine) or the like. As will be described later, the COF is formed by stamping and slicing a strip-shaped film member. In the display panel of the organic EL panel P, the electronic component W such as a COF is attached to the bonding member such as the anisotropic conductive tape F, and is used as a constituent element of a display device such as an organic EL display. The components used.

The mounting device 1 of the embodiment includes a press device 10 (10A, 10B) for pressing the electronic component W by the tape carrier T, and the electronic component W after the punching is sucked and held, and is transported while intermittently rotating. The intermittent rotation conveyance device 20 is placed at the intermittent stop position in the middle of the conveyance path of the intermittent rotation conveyance device 20, and the anisotropy of the anisotropic conductive tape F as a bonding member is adhered to the electronic component W conveyed by the intermittent rotation conveyance device 20. a conductive tape sticking device (joining member pasting device) 30; a temporary crimping device 40 that temporarily presses the electronic component W to which the anisotropic conductive tape F is adhered to the organic EL panel P through the anisotropic conductive tape F; The pressure bonding device 40 is temporarily pressed against the electronic component W of the organic EL panel P to be fixedly pressed and fixed, and the first pressure is transferred between the pressing device 10 and the intermittent rotary conveying device 20; The device 60; the second transfer device 70 that transfers the electronic component W between the intermittent rotary transfer device 20 and the temporary pressure bonding device 40; and the organic EL panel P for the temporary pressure bonding device 40 The first transport unit 80 that has been carried in; the second transport unit 90 that transports the organic EL panel P from the temporary pressure bonding device 40 to the fixed pressure bonding device 50; and the third transport that transports the organic EL panel P from the fixed pressure bonding device 50. The unit 100 further includes a pair of press device 10, an intermittent rotary transfer device 20, an anisotropic conductive tape attaching device 30, a temporary crimping device 40, a fixed crimping device 50, a first transfer device 60, and a second transfer device. 70. The control device 110 that controls the operations of the respective units such as the first transport unit 80, the second transport unit 90, and the third transport unit 100.

(Pressing Device 10) The press device 10 is a COF that is manufactured as an electronic component W from a tape carrier T, and includes a first press device 10A and a second press device 10B. The first press device 10A and the second press device 10B have the same configuration, and are disposed in a state of being reversed left and right as viewed from the front of the device. The first and second press devices 10A and 10B are alternately used, and the tape carrier T of the other press devices 10A and 10B is exchanged while one of the press devices 10A and 10B is being pressed.

Each of the first and second press devices 10A and 10B includes a supply reel 11 on which a tape carrier T before punching is wound, and a die device 12 that presses the electronic component W from the tape carrier T supplied from the supply reel 11; The winding reel 13 in which the tape carrier T after the electronic component W is punched out by the die device 12 is wound. The tape carrier T fed from the supply reel 11 is changed in direction by a plurality of guide rollers 14 and sprocket 15, and is returned to the winding reel 13 via the die device 12. Further, the sprocket 15 is disposed in the conveyance direction of the tape carrier T near the mold device 12, and can be carried by the rotation drive of a drive motor (not shown) to carry out the tape carrier T and carry out the tape carrier T and Positioning of the mold unit 12.

The mold device 12 includes an upper mold 12a and a lower mold 12b disposed to face the upper mold 12a. The upper mold 12a is provided with a punch 12c below it. On the other hand, the lower mold 12b is formed with a die hole 12d through which the punch 12c is inserted and penetrates the upper and lower sides. In a state in which the tape carrier T is supplied to the mold apparatus 12 and positioned, the upper mold 12a is moved in the vertical direction, whereby the electronic component W is punched out from the tape carrier T. Further, an adsorption hole (not shown) is provided on the front end surface of the punch 12c to constitute an electronic component W that can be sucked and held.

(Intermittent Rotary Transfer Device 20) The intermittent rotary transfer device 20 includes an indexing table 22 having a cross shape in a plan view in which four arm portions 21 having the same shape are arranged in a mutually orthogonal relationship, and an indexing table 22 is a rotationally driven portion 23 that is intermittently rotationally driven at intervals of 90 degrees. A holding head 24 that sucks and holds the electronic component W is provided at the tip end of each arm portion 21 of the index table 22 . The four stop positions A to D every 90 degrees of the index table 22 are set to receive the position W of the electronic component W punched by the press device 10, and to position the electronic component W held by the holding head 24 ( The aligning/cleaning position B of the cleaning, the bonding position C of the anisotropic conductive tape F to the electronic component W held by the holding head 24, and the electronic component W to which the anisotropic conductive tape F is adhered It is delivered to the delivery position D of the temporary crimping device 40.

(Inertial Conductive Tape Adhesive Device 30) The anisotropic conductive tape attaching device 30 includes a supply reel 31 that is provided corresponding to the adhesive position C of the intermittent rotary transfer device 20, and is wound with a belt-shaped member S. The shape member S is obtained by adhering and supporting the anisotropic conductive tape F to the release tape R; the adhesive head 32 is disposed at a position opposed to the holding head 24 which is aligned with the adhesion position C; and the recovery portion 33 The release tape R after the anisotropic conductive tape F has been removed is accommodated, and the plurality of guide portions 34 guide the tape-shaped member S supplied from the supply reel 31 to the recovery portion 33 along the conveyance path passing through the bonding position C. The chuck delivery portion 35 is disposed on the downstream side of the attachment position C of the plurality of guide portions 34 to the conveyance path of the belt-shaped member S, and reciprocates along the conveyance direction of the belt-shaped member S to cause the belt-shaped member S is intermittently conveyed to a predetermined length; and the cutting portion 36 is disposed on the upstream side of the bonding position C of the transport path of the strip-shaped member S, and only the anisotropic conductive tape F in the strip-shaped member S is cut. .

The pasting head 32 is provided with an adhesive jig 32a which is cut to a predetermined length and which is normally fed and positioned at the pasting position C, and is crimped to the holding head 24 which is positioned at the pasting position C. The terminal portion of the electronic component W; the elevation driving portion 32b moves the bonding fixture 32a up and down; and the heater 32c is built in the bonding fixture 32a, and heats the bonding fixture 32a to adhere the anisotropic conductive tape F The terminal portion of the electronic component W.

(Temperature crimping device 40) The temporary crimping device 40 is provided with a temporary crimping joint 41 as a thermocompression bonding joint, and adsorbs and holds the electronic component W to which the anisotropic conductive tape F has been adhered by the anisotropic conductive tape bonding device 30. And temporarily pressing the organic EL panel P; the table 42 to hold and position the organic EL panel P; and the position identifying unit 43 for holding the organic EL panel P held on the table 42 and holding the temporary pressure joint The relative position of the electronic component W of 41 is identified.

The temporary crimping joint 41 includes a pressurizing jig 41a that sucks and holds the electronic component W from the upper surface side thereof, a jig driving unit 41b that moves the pressurizing jig 41a in the Y, Z, and θ directions, and a built-in The heating fixture 41c that heats the pressure fixture 41a by the press jig 41a. As shown in FIG. 3, the table 42 includes a mounting portion 42a on which the organic EL panel P is placed, and is provided integrally with the mounting portion 42a, and the edge portion on which the electronic component W is mounted is provided from the lower side of the organic EL panel P. The support portion 42b that supports the table 42b and the table drive portion 42c that moves the mounting portion 42a and the support portion 42b in the X, Y, Z, and θ directions.

A plurality of adsorption holes 42e for adsorbing and holding the organic EL panel P are formed on the mounting surface 42d on which the organic EL panel P is placed in the mounting portion 42a. When the organic EL panel P is placed on the mounting surface 42d, the adsorption hole 42e is mainly disposed at a position facing the display region of the image in the organic EL panel P. In this example, an example in which the adsorption holes 42e are arranged in a matrix at equal intervals in a region where the organic EL panel P is placed on the mounting surface 42d (a region surrounded by a two-dotted line in FIG. 3) will be described. When at least the edge portion of the organic EL panel P supported by the support portion 42b is flat and can be adsorbed and held, the organic EL panel P placed on the mounting surface 42d does not need to be adsorbed and held over the entire region. For example, a half or a half of the length of the organic EL panel P may be adsorbed and held by the adsorption hole 42e from the support portion 42b side in a direction orthogonal to the edge portion. Since the adsorption hole 42e adsorbs the display region of the organic EL panel P, it is preferable to make the pore diameter smaller so that the adsorption does not cause the adsorption mark to remain in the display region. In the aperture, the relationship between the attraction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to the suction can be determined by an experiment or the like, and the size can be set so that the adsorption mark does not remain. Further, the placement surface 42d may be constituted by a vacuum chuck using a porous member such as porous ceramic.

As described above, the support portion 42b is integrally provided with the placing portion 42a, and the elongated member that supports the edge portion of the organic EL panel P is formed as a flat supporting surface 42f. The height position of the support surface 42f is set to be the same height as the height of the mounting surface 42d of the mounting portion 42a. In the support surface 42f, a plurality of adsorption holes 42g for adsorbing and holding the edge portion of the organic EL panel P are arranged in a plurality of rows along the longitudinal direction thereof. The adsorption hole 42g of the support portion 42b is also preferably smaller as the adsorption hole 42e of the mounting portion 42a. However, the portion of the organic EL panel P supported by the support portion 42b that is connected to the connection electrode of the electronic component W is not a display region. Therefore, it is not necessary to have a small aperture such as the adsorption hole 42e of the mounting portion 42a. However, if the edge portion of the organic EL panel P is deformed by suction at the portion where the alignment mark PM (see FIG. 6) is formed, It is therefore not good to be able to reduce the accuracy of position recognition. The pore diameter and the adsorption force of the adsorption hole 42g are preferably such that the edge of the organic EL panel P is not deformed. In addition, the arrangement interval of the adsorption holes 42g is set to be a period of unevenness due to bending or undulation generated at the edge of the organic EL panel P so that the entire edge of the organic EL panel P is in close contact with the support surface 42f. Shorter intervals are better.

The table drive unit 42c is a drive unit that is formed by sequentially stacking the lower portion from the lower side, and the X-axis direction drive unit that moves the mounting portion 42a and the support portion 42b in one direction in the horizontal direction, that is, in the X-axis direction. a Y-axis direction drive unit that moves in a horizontal direction orthogonal to the X-axis direction, that is, a Y-axis direction, a Z-axis direction drive unit that moves in a Z-axis direction orthogonal to the horizontal direction, and a θ drive that rotationally moves in a horizontal plane. unit. Further, in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the table driving unit 42c is provided with a linear encoder in the X-axis direction driving unit and the Y-axis direction driving unit.

Next, the position recognizing unit 43 will be described using FIGS. 4 to 6. 4(A) is a plan view showing a schematic configuration of the position recognizing unit 43, and FIG. 4(B) is a front view showing a schematic configuration of the position recognizing unit 43. Fig. 5 is a perspective view showing the configuration of the crucible used by the position recognizing unit 43. FIG. 6 is a plan view showing a schematic configuration of the organic EL panel P and the electronic component W by the position recognizing unit 43 for position recognition. In the figure, the X-axis direction will be described as the left-right direction. The organic EL panel P has an electrode array ER formed at the edge thereof, and a pair of alignment marks PM respectively provided on the right and left sides of the electrode array ER. The electronic component W has a terminal row TR arranged in correspondence with the electrode array ER, and a pair of alignment marks WM respectively provided on the right and left sides of the terminal column TR. In FIG. 6, the organic EL panel P and the electronic component W are shown in a state of being spaced apart for easy understanding. When the position is recognized, the electrode array ER of the organic EL panel P and the terminal column TR of the electronic component W are vertically oriented. The state of the interval is overlapped.

The position recognizing unit 43 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P held on the stage 42 and the alignment mark WM of the electronic component W held by the temporary crimping 41. Therefore, the position recognizing unit 43 has the first photographing device 43A and the second photographing device 43B. The first imaging device 43A performs a photographer on the alignment marks PM and WM on the left side of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. The second imaging device 43B performs a photographer on the alignment marks PM and WM on the right side of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. The first imaging device 43A and the second imaging device 43B have the same configuration, and are arranged in a state of being reversed left and right in FIG. 4 .

Each of the first and second imaging devices 43A and 43B includes a camera (photographing unit) 43a such as a CCD (Charge Coupled Device) camera including a still image capturing alignment mark PM and WM, and a camera element; It is provided that the upper and lower images are simultaneously taken into one imaging area of the camera 43a, and the imaging area is set to the lens barrel portion 43b in a vertically divided state; and the camera 43a and the barrel portion 43b are arranged along the X axis. The X-axis moving device 43c that supports the reciprocating movement in a free direction. The first and second imaging devices 43A and 43B include an image processing unit 43d that processes an image captured by the camera 43a of the first imaging device 43A and an image captured by the camera 43a of the second imaging device 43B. Here, the one imaging area is an area in which the imaging element in which the light receiving elements included in the camera 43a are arranged in a matrix is set in a range in which the image is taken in one time. Therefore, this area may be composed of all of the light receiving elements of the imaging element or a part of the light receiving elements. The camera 43a of the first and second imaging devices 43A and 43B has its optical axis L arranged in parallel with the horizontal direction, that is, the X-axis direction shown in FIG. Coaxial illumination is incorporated in the camera 43a.

The barrel portion 43b includes a right angle 稜鏡 43e as a light guiding optical member that simultaneously guides the upper and lower images to the imaging region of the camera 43a. As shown in FIG. 5, the right angle 稜鏡 43e is formed as a 三角 of a triangular prism which is formed by a equilateral triangle (right-angled equilateral triangle) having a apex angle of 90°, and two sides corresponding to two sides of the same length. The side faces function as the reflecting surfaces 43e1, 43e2. In the right angle 稜鏡43e, the center of the ridgeline 43e3 formed by the two reflecting surfaces 43e1 and 43e2 is located on the optical axis L of the camera 43a, and one reflecting surface 43e1 faces upward, and the other reflecting surface 43e2 faces downward, and The surface corresponding to the bottom edge of the equilateral triangle is perpendicular to the XY plane, and is attached to the barrel portion 43b in this manner. That is, the surface corresponding to the bottom surface of the crucible 43e is fixed to the vertical surface of the front end of the barrel portion 43b. According to this, the light traveling parallel to the optical axis of the camera 43a causes the light incident on the upward reflecting surface 43e1 of the crucible 43e to be reflected upward, and the optical axis of the camera 43a travels in parallel, and is incident on the crucible 43e. The light of the lower reflecting surface 43e2 is reflected directly below. As a result, as will be described later, the image of the alignment mark MW including the electronic component W is guided to the first region of the image pickup element of the camera 43a by the reflection surface 43e1, and the image of the alignment mark PM of the organic EL panel P is reflected by the reflection surface 43e2. At the same time, it is guided to the second region of the imaging element of the camera 43a (different from the first region). The illustration is omitted, and between the surface corresponding to the bottom side of the crucible 43e and the vertical surface of the front end of the barrel portion 43b, a small feed screw (Feed screws) capable of three-dimensionally adjusting the mounting angle of the crucible 43e is provided. Or a tilt adjustment mechanism such as a micrometer.

The X-axis moving device 43c can move the camera 43a and the barrel portion 43b to photograph the photographing of the respective alignment marks PM, WM of the organic EL panel P and the electronic component W at the position where the temporary crimping joint 41 is temporarily crimped. The position (the position shown in Fig. 4(B)) and the retracted position (the position of the barrel portion 43b indicated by the solid line in Fig. 4(A)). Here, the retracted position is a position at which the operation of the pressurizing tool 41a is not hindered when the pressurizing jig 41a moves up and down the electronic component W when the temporary crimping operation is performed. Specifically, the first imaging device 43A is positioned on the left side in the X-axis direction with respect to the imaging position. In addition, the second imaging device 43B is located on the right side in the X-axis direction with respect to the imaging position. The first imaging device 43A is synchronized with the movement of the camera 43a and the barrel portion 43b of the second imaging device 43B.

Further, in the state in which the position is temporarily pressed, as shown in FIG. 4(B), the electronic component W held by the temporary crimping joint 41 is separated from the edge of the organic EL panel P. position. Therefore, the barrel portion 43b enters between the organic EL panel P and the electronic component W, and the position is positioned at the photographing position. In the state where the position is at the photographing position, the upward reflecting surface 43e1 of the crucible 43e is opposed to the alignment mark WM of the electronic component W, and the alignment mark PM of the downward reflecting surface 43e2 and the organic EL panel P is aligned. In the opposite direction.

The image processing unit 43d receives the image pickup signal of the camera 43a, and as shown in FIG. 7, the alignment mark PM and the electronic component W of the organic EL panel P in the photographic image H obtained by being taken in one shot region at the same time. The alignment mark WM recognizes and detects data relating to the relative positions of the two alignment marks PM and WM (hereinafter referred to as "relative position data"). Specifically, as shown in FIG. 7, in the photographic image H of the camera 43a, the ridgeline 43e3 of the 稜鏡43e is photographed horizontally across the center thereof, and the image of the ridgeline 43e3 is the boundary electronic component W ( An image of the alignment mark WM of the electronic component W is imaged in the upper region (first region) H1, and an image of the organic EL panel P (alignment mark PM of the organic EL panel P) is imaged in the lower region (second Area) H2. In addition, in FIG. 7, the patterns other than the alignment marks PM and WM formed in the organic electroluminescent panel P and the electronic component W are abbreviate|omitted.

The image processing unit 43d obtains a matching ratio of a matching ratio of a critical value or more in a reference pattern of the alignment mark WM of the electronic component W set in advance in the first region H1 by a known pattern matching process. It is an alignment mark WM of the electronic component W. In the second region H2, the image of the matching ratio of the alignment mark PM of the organic EL panel P set in advance can be recognized as the alignment mark PM of the organic EL panel P. Next, the relative position data of the two aligned alignment marks WM and PM are detected based on the camera coordinate system. The determined relative position data is transmitted to the control device 110. The functions of the image processing unit 43d of the first and second imaging devices 43A and 43B may be performed by the control device 110 to be described later.

(fixed crimping device 50) As shown in Fig. 8, the fixed crimping device 50 includes a table 51 for holding and positioning the organic EL panel P through which the electronic component W is temporarily pressed by the anisotropic conductive tape F. The organic EL panel P is fixed to the fixed crimping joint 52 of the electronic component W; the lower side of the fixed crimping joint 52 is disposed opposite to the fixed crimping joint 52, and is temporarily suspended in the organic EL panel P during the fixed crimping. A backup portion 53 that supports the edge of the electronic component W from below is crimped, and a position recognizing unit 54 that recognizes the position of the organic EL panel P.

The stage 51 includes a placing portion 51a on which the organic EL panel P is placed, and a table driving portion 51b that moves the placing portion 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in a plan view, and a plurality of adsorption holes 51d for adsorbing and holding the organic EL panel P are formed on the mounting surface (upper surface) 51c on which the organic EL panel P is placed. Similarly to the adsorption holes 42e of the table 42 of the temporary pressure bonding device 40, the adsorption holes 51d have a smaller aperture than the adsorption marks of the organic EL panel P. Similarly to the table driving unit 42c of the temporary pressure bonding device 40, the table driving unit 51b is a driving unit configured by sequentially laminating the following from the lower side: an X-axis direction driving unit, a Y-axis direction driving unit, and a Z-axis direction driving unit. And θ drive unit.

The fixed crimping joint 52 includes a pressurizing jig 52a that presses the electronic component W that is temporarily pressed against the organic EL panel P from the upper surface side thereof, and a jig that drives the pressurizing jig 52a to move in the Z-axis direction. The portion 52b; and a heater 52c built in the pressure fixture 52a to heat the pressure fixture 52a. The backup unit 53 includes a backup tool 53a that is provided at a position directly below the pressurizing jig 52a of the fixed press fitting 52, and has a length equal to that of the pressurizing jig 52a, and a support member 53b that supports the backup tool 53a. The upper surface of the backup tool 53a is formed as a flat surface for supporting the lower surface of the edge portion of the organic EL panel P placed on the mounting portion 51a to which the electronic component W is temporarily crimped.

The position recognition unit 54 includes a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached to the upper side of the movement range of the organic EL panel P by the table 51 at a predetermined interval, and the electronic component W is temporarily pressed against the organic EL panel P. The alignment marks provided near the both end portions of the edge portion are photographed. The interval (predetermined interval) between the first and second cameras 54a and 54b is such that the alignment marks are spaced apart from each other. In addition, the alignment mark is an alignment mark different from the alignment mark PM used for the identification of the relative position data in the temporary crimping device 40. The image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b. The position of the alignment mark is detected.

(1st delivery device 60) The 1st delivery device 60 is provided with the receiving part 61 which adsorbs and hold|maintains the electronic component W punched by the tape carrier T from the lower side, and the receiving part 61 in the press apparatus 10A, 10B. The X, Y, Z, and θ drive units 62 that move directly between the position immediately below the mold device 12 and the position directly below the holding head 24 of the intermittent rotary transfer device 20 that has been positioned at the received position A.

(Second delivery device 70) The second delivery device 70 includes a receiving portion 71 that sucks and holds the electronic component W from the lower side, and a holding portion 24 that allows the receiving portion 71 to be positioned at the delivery position D of the intermittent rotary transfer device 20 The X, Y, Z, and θ drive units 72 that move between the position immediately below and the position immediately below the temporary pressure joint 41 of the temporary crimping device 40.

(the first transport unit 80) The first transport unit 80 includes a holder 81 that sucks and holds the organic EL panel P supplied from a supply unit (not shown) from the upper side; and the holder 81 is not shown. The supply unit supplies the position of the organic EL panel P to the XZ driving unit 82 that moves between the organic EL panel P and the loading position of the table 42 of the temporary pressure bonding device 40.

As shown in FIG. 9 , the holder 81 includes an electrode surface adsorption block 81 a for adsorbing and holding an edge portion of the organic EL panel P on which the electrode array ER is formed, and the electrode array ER is provided as an electronic component W to be mounted; The electrode surface adsorption block 81a is disposed adjacent to each other, and the display region adsorption portion 81b that adsorbs and holds a portion other than the portion of the organic EL panel P that is adsorbed by the electrode surface adsorption block 81a. The electrode surface adsorption block 81a is formed so as to be capable of adsorbing and holding the entire area of the edge portion of the organic EL panel P in which the electrode array ER is formed, and is a member having a rectangular parallelepiped shape that is long along the edge portion. The adsorption surface 81c of the electrode surface adsorption block 81a is formed flat, and a plurality of adsorption holes 81d are provided. Similarly to the support portion 42b of the temporary pressure bonding device 40, the size of the aperture of the adsorption hole 81d is such that the edge of the organic EL panel P is not deformed, and the edge of the electrode array ER can be formed on the organic EL panel P. Adsorption retention is performed flat. The display region adsorption portion 81b is formed of a flat porous body or a sponge, and has a plurality of adsorption holes. The adsorption surface of the electrode surface adsorption block 81a and the display region adsorption portion 81b is adjusted so as to be located on the same plane.

One display area adsorption unit 81b is shown in FIG. 9, and a plurality of display area adsorption units 81b may be arranged in parallel. As shown in FIG. 10, the display region adsorption portion 81b is in a direction intersecting with the longitudinal direction of the electrode surface adsorption block 81a (the direction of the edge portion of the organic EL panel P held by the electrode surface adsorption block 81a) (in this embodiment, Two orthogonal directions are arranged side by side. The two display region adsorption portions 81b are supported by the main body portion 81e of the holder 81 so as to be freely adjustable from the gap between the electrode surface adsorption blocks 81a. The display region adsorption portion 81b includes a base portion 81b1 made of a metal such as aluminum, and a flat porous body covering the surface of the base portion 81b1 that holds the organic EL panel P (hereinafter referred to as "below"). Slice 81b2. In the base portion 81b1, a substantially lattice-shaped suction groove that communicates with the vacuum suction hole is formed on the lower surface thereof, and the vacuum suction force can be applied to the entire region of the porous sheet 81b2 provided on the lower surface of the porous portion 81b2, and the porous sheet 81b2 can be applied to the porous sheet 81b2. The entire area holds the organic EL panel P flatly with a substantially uniform attraction. For the porous sheet 81b2, for example, a porous molded body of a resin can be processed into a film shape. With this configuration, the holding body 81 can be adsorbed and held flat and without causing adsorption marks even in the thin organic film panel P having a thin film shape.

When the organic EL panel P is placed on the stage 42 of the temporary pressure bonding apparatus 40, the electrode surface adsorption block 81a presses the upper surface (electrode surface) of the edge portion of the organic EL panel P on which the electrode is formed, on the stage 42. Support portion 42b. Therefore, the electrode surface of the organic EL panel P is sandwiched between the flat adsorption surface 81c of the electrode surface adsorption block 81a and the flat support surface 42f of the support portion 42b, and is adsorbed and held in a state of being flatly corrected. Part 42b. In addition, the organic EL panel P is in contact with the mounting surface 42d of the mounting portion 42a in a state where the display region adsorption portion 81b is in a state where the organic EL panel P is flatly adsorbed and held. Therefore, the organic EL panel P does not have an electrode surface. Wrinkles and the like are generated and adsorbed and held by the placing portion 42a.

(Second transport unit 90) The second transport unit 90 includes a holder 91 that sucks and holds the organic EL panel P in which the electronic component W is temporarily pressed by the temporary pressure bonding device 40 from the upper side, and an XZ drive unit 92. This holding body 91 moves between the unloading position where the organic EL panel P is carried out from the table 42 of the temporary pressure bonding device 40 and the loading position of the organic EL panel P to the table 51 of the fixed pressure bonding device 50. The holding body 91 includes a display region adsorption portion formed by adsorbing and holding substantially the entire region of the upper surface of the organic EL panel P, and having a flat porous body. The display region adsorption portion is configured in the same manner as the display region adsorption portion 81b of the holder 81.

(the third transport unit 100) The third transport unit 100 includes a holder 101 that adsorbs and holds the organic EL panel P to which the electronic component W is fixed and crimped by the fixed crimping device 50, that is, the display member is sucked and held from the upper side; The XZ drive unit 102 that moves the holding body 101 between the carry-out position where the organic EL panel P is carried out from the table 51 of the fixed crimping device 50 and the transfer position to the unloading device (not shown).

(Control Device 110) The control device 110 includes a storage unit 111. The memory unit 111 stores, for example, various types of information for controlling the respective units such as the load of the temporary pressure bonding device 40, the heating temperature, or the reference position information of the alignment marks PM and WM.

[Operation of Mounting Device] Next, the operation of the mounting device 1 of the embodiment will be described. First, the tape carrier T is supplied from the supply reel 11 of the first press device 10A, and the electronic component W is punched by the tape carrier T by the die device 12. The punched electronic component W is adsorbed and held by the punch 12c. The electronic component W held by the punch 12c is delivered to the receiving portion 61 of the first delivery device 60, and is transferred to the receiving position A of the intermittent rotary conveying device 20 by the first delivery device 60. The electronic component W transferred to the received position A is delivered to the holding head 24 of the intermittent rotary conveying device 20 that has been positioned at the receiving position A. Further, in the middle of transferring the electronic component W to the receiving position A, the first transfer device 60 rotates the direction of the electronic component W by 90° so that the edge portion of the terminal row TR and the edge are positioned at the receiving position A. The direction of the outer side of the holding head 24 (Y direction) is aligned.

The electronic component W held by the holding head 24 is sequentially transferred to the calibration/cleaning position B, the pasting position C, and the delivery position D by the intermittent rotation of the indexing table 22. In the transfer/cleaning position B, the electronic component W is positioned by abutting with a positioning mechanism (not shown), and is attached to the terminal by a cleaning mechanism such as a rotating brush (not shown). The cleaning of the dust. Further, in the pasting position C, the anisotropic conductive tape F is adhered to the terminal portion of the electronic component W by the anisotropic conductive tape bonding device 30. Positioning and cleaning at the calibration/cleaning position B. After the electronic component W to which the anisotropic conductive tape F is attached is positioned at the transfer position D, the electronic component W is handed over to the second transfer at the transfer position D. The receiving portion 71 of the device 70. The electronic component W that has been transferred to the receiving portion 71 is transferred to a position directly below the temporary pressure fitting 41 of the temporary pressure bonding device 40, and is delivered to the temporary pressure fitting 41.

On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out by the holding body 81 of the first conveying unit 80 from the supply unit (not shown), and the table 42 placed on the temporary pressure bonding device 40 is supplied. First, the holder 81 of the first conveying unit 80 is moved to a supply unit (not shown), and the holding surface of the holder 81, that is, the adsorption surface 81c of the electrode surface adsorption block 81a and the adsorption surface of the display region adsorption unit 81b are brought into contact with each other. The upper surface of the organic EL panel P that has been prepared in the supply unit. At this time, the adsorption force of the electrode surface adsorption block 81a and the display region adsorption portion 81b is applied in a state where the organic EL panel P is gently pushed by the holding body 81. In this way, even if the organic EL panel P is bent or bent, the organic EL panel P can be held by the holder 81 in a flat state.

The organic EL panel P held by the holding body 81 is conveyed to the table 42 of the temporary pressure bonding device 40. At this time, the table 42 of the temporary pressure bonding device 40 is positioned at a supply position (a position indicated by a dotted line in FIG. 1) that receives the supply of the organic EL panel P from the holder 81. The organic EL panel P transferred to the table 42 is placed on the table 42. At this time, the organic EL panel P is attached to the table 42 and flattened by the lowering of the holding body 81.

More specifically, the organic EL panel P is adsorbed and held by the adsorption surface 81c of the electrode surface adsorption block 81a of the holder 81, and the display region is adsorbed and held by the display region adsorption portion 81b, and is flattened by them. The status is maintained. In this state, the organic EL panel P is pressed against the table 42. Therefore, the organic EL panel P is sandwiched between the adsorption surface 81c of the electrode surface adsorption block 81a of the holder 81 and the adsorption surface of the display region adsorption portion 81b. The support surface 42f of the support portion 42b of the table 42 and the mounting surface 42d of the mounting portion 42a are disposed. Therefore, the organic EL panel P is transferred to the stage 42 while being maintained in a flattened state, and is adsorbed and held on the stage 42.

At this time, in a state where the organic EL panel P is pressed against the table 42, the suction hole 42g of the support portion 42b of the table 42 and the suction hole 42e of the mounting portion 42a are attracted to each other, and then the holding body 81 is released. The attraction force of the electrode surface adsorption block 81a and the display region adsorption portion 81b may be the same, or the attraction force of the holder 81 may be released before the table 42 is attracted to the suction force. In this way, the restraint in the surface direction of the organic EL panel P between the table 42 and the holder 81 is reduced, and therefore, in the case where the holder 81 is held in a state of being bent or bent, the The bending or flexing can be expected to be flattened by the grip correction. Therefore, it is preferable that the holding body 81 is pressed against the force of the table 42 so as not to hinder the above-described correction.

After the organic EL panel P is held by the stage 42, the holding body 81 moves to a supply unit (not shown). The table 42 is moved to a temporary crimping position where the temporary pressure joint 41 is executed. Accordingly, the position of the organic EL panel P supported by the table 42 is at the temporary crimping position.

On the other hand, the temporary crimping joint 41 holding the electronic component W is moved by the second delivery device 70 from the delivery position of the received electronic component W to the temporary crimping position. At the temporary pressure-bonding position, the position of the electronic component W is in a state of being higher than the electrode surface of the organic EL panel P at the temporary pressure-bonding position by a predetermined height. In other words, the organic EL panel P and the electronic component W in the temporary pressure-bonding position are disposed such that the electrode surface of the organic EL panel P and the terminal portion of the electronic component W are vertically separated.

After the position of the organic EL panel P and the electronic component W is temporarily pressed, the first and second imaging devices 43A and 43B of the position recognition unit 43 are moved to the imaging position by the retracted position. In this state, the first and second imaging devices 43A and 43B simultaneously take in an image of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. Next, the image of the two alignment marks PM and WM taken in is transferred to the image processing unit 43d, and the relative position data of the two alignment marks PM and WM is obtained by the image processing unit 43d. The relative position data is transmitted to the control device 110, and compared with the reference position information of the relative position data previously stored in the storage unit 111, and the relative positions of the organic EL panel P and the electronic component W in the X, Y, and θ directions are obtained based on the results. Deviation. The control device 110 controls the jig driving unit 41b and the table driving unit 42c so as to cancel the positional deviation in accordance with the obtained relative positional deviation, and aligns the positions of the organic EL panel P and the electronic component W.

After the positional deviation of the organic EL panel P and the electronic component W is corrected, the jig 41a is pressed by the driving of the jig driving unit 41b. In this way, the terminal portion of the electronic component W heats and presses the electrode surface of the organic EL panel P through the anisotropic conductive tape F in accordance with the heating temperature, the pressing force, and the pressurization time set in advance, and the electronic component W is temporarily crimped. The organic EL panel P having the edge portion of the electrode row ER supported by the support portion 42b from the lower side. At this time, a backup member that supports the support portion 42b of the table 42 from the lower side is provided, and the backup member may support the support portion 42b from the lower side when the backup member is temporarily crimped. In this way, it is possible to prevent the table 42 from being deflected due to the pressurization, so that the rigidity of the table 42 can be reduced to achieve weight reduction. The load when the table 42 is moved can be reduced, the vibration during movement can be reduced, and the movement and positioning can be performed stably and quickly.

After the pressurization time set in advance has elapsed, the pressurization of the electronic component W by the pressurizing jig 41a is released, and the pressurizing jig 41a is raised. The pressurizing jig 41a moves to the delivery position where the electronic component W is delivered from the second transfer device 70. In addition, the stage 42 on which the organic EL panel P of the electronic component W is temporarily pressed is placed, and the organic EL panel P is transferred to the carry-out position of the second transport unit 90. In the carry-out position, the organic EL panel P is adsorbed and held in the same manner as the holding body 81 of the first transport unit 80 by the holding body 91 of the second transport unit 90, and is fixedly crimped. The table 51 of the apparatus 50 is transported.

The organic EL panel P supplied to the fixed pressure bonding device 50 by the second conveying unit 90 is delivered to the table 51 that has been positioned at the loading position, and is adsorbed and held on the table 51. The operation at the time of the transfer is performed in the same manner as the transfer of the organic EL panel P from the first transfer unit 80 to the table 42. However, there is a difference in the point at which the edge portion of the organic EL panel P in which the electronic component W is temporarily pressed is protruded from the stage 51.

After the organic EL panel P is held on the table 51, the table 51 moves the edge of the organic EL panel P to the upper surface of the backup tool 53a. Further, in the middle of the movement, the position recognition unit 54 performs position recognition of the alignment mark (marker different from the alignment mark PM) of the organic EL panel P. Based on the position recognition result, the table 51 moves in such a manner that the electrode surface of the organic EL panel P and the upper surface of the backup tool 53a are in the correct positional relationship. After the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressurizing fixture 52a is lowered by the driving of the jig driving unit 52b, and the heating temperature, the pressing force, and the pressurizing time set in advance are used. The electronic component W temporarily crimped to the organic EL panel P performs fixed crimping.

After the pressurization time set in advance, the pressurizing jig 52a rises. In addition, the organic EL panel P to which the electronic component W is fixed, that is, the table 51 on which the display member is placed is moved to the carry-out position where the organic EL panel P is transferred to the third transport unit 100. At the carry-out position, the organic EL panel P is sucked and held by the holder 101 of the third transport unit 100, and is transported to a carry-out device (not shown).

The mounting operation of the temporary crimping process and the fixed crimping work of the organic EL panel P including the electronic component W described above is repeated until the organic EL panel P to which the electronic component W is to be mounted does not exist. Further, in the mounting device 1 of the embodiment, it is important to improve the positional accuracy in the temporary pressure-bonding process, and it is important to improve the pressure-bonding strength or the reliability of the anisotropic conductive tape F in the fixed crimping process. There are also differences in engineering time. Therefore, by applying the temporary crimping device 40 and the fixed crimping device 50, the temporary crimping process and the fixed crimping process are performed, and the mounting efficiency of the electronic component W can be improved. However, the mounting device 1 of the embodiment is not limited to such a configuration. It is also possible to perform the positioning work to the fixed crimping work in the fixed crimping device 50. In this case, the support portion 42b and the backup portion 53 are provided in parallel on the table 51 of the fixed crimping device 50.

[Operation and Effect of Mounting Device] The mounting device 1 according to the above embodiment is supported by a table 42 including a support portion 42b for mounting the electronic component in the flexible organic EL panel P. The edge portion of the W is supported from the lower side, and the relative positional information of the alignment mark PM of the organic EL panel P supported by the stage 42 and the alignment mark WM of the electronic component W held by the temporary crimping joint 41 is The image of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W can be simultaneously taken into the first and second imaging devices 43A and 43B in one imaging region. The detection is performed, and the positional alignment of the organic EL panel P and the electronic component W is performed based on the detected relative position data, and the electronic component W is temporarily pressure-bonded by the organic EL panel P through the anisotropic conductive tape F, and then fixedly pressed.

Therefore, when the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W is detected, the edge portion of the organic EL panel P on which the electrode is formed becomes the support portion of the stage 42. 42b support. According to this, it is possible to prevent the edge portion of the organic EL panel P from sagging, and it is possible to improve the positional recognition accuracy of the alignment mark PM provided at the edge portion.

Further, the alignment mark PM of the organic EL panel P is photographed from the upper side, the alignment mark WM of the electronic component W is photographed from the lower side, and the images of the two alignment marks PM and WM are transmitted through the single lens barrel. The 稜鏡43e of the portion 43b is simultaneously taken into one imaging area of one camera 43a. Therefore, the alignment mark PM formed on the upper surface of the organic EL panel P can be imaged without being transmitted through a resin such as PI or PET constituting the organic EL panel P. Therefore, the alignment mark PM can be photographed stably and clearly. Further, since the image of the two alignment marks PM and WM is inserted into the one imaging region of the camera 43a through the cassette 43e provided in the single barrel portion 43b, it is assumed that the barrel portion 43b generates heat due to an increase in the ambient temperature or the like. In the case of deformation, it is also possible to minimize the deviation of the optical axis of the image in which the two alignment marks PM and WM are taken in.

Further, the image of the two alignment marks PM and WM is transmitted through the 稜鏡43e provided in the single barrel portion 43b while being taken into one imaging region of the camera 43a, so that the vibration of the lens barrel portion 43b or the like is caused even by the vibration of the device. In this case, it is also possible to prevent the relative positional relationship between the two alignment marks PM and WM in the image capturing area of the camera 43a from being shifted. That is, the image of the two alignment marks PM, WM is guided to the barrel portion 43b of the camera 43a, so that even if the barrel portion 43b vibrates, the path and the light of the light from the alignment mark PM side to the camera 43a The positional relationship of the path of the light that aligns the mark WM side to the camera 43a does not change. Therefore, even if the positions where the alignment marks PM and WM are photographed in the imaging region of the camera 43a are changed, it is possible to prevent the relative positional relationship between the alignment marks PM and WM from fluctuating.

According to this, the identification accuracy of the relative positional data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W can be improved. Therefore, the positional alignment accuracy of the organic EL panel P and the electronic component W can be improved by using such relative positional data, and as a result, even in the case where the flexible organic EL panel P is mounted with the flexible electronic component W It can also improve the installation accuracy.

In the support surface 42f of the support portion 42b for supporting the electronic component W from the lower side of the organic EL panel P, the plurality of adsorption holes 42g are organic. The edge of the organic EL panel P is adsorbed and held in a state where the edge of the organic EL panel P is supported by the support surface 42f at a shorter interval in which the period of the unevenness due to the bending or undulation of the edge portion of the EL panel P is shorter. According to this, the edge portion of the organic EL panel P can be supported in a flatter state, and therefore the alignment mark PM of the organic EL panel P and its surrounding portion can be stably maintained in a horizontal and flat state, and the position of the alignment mark PM is aligned. The identification accuracy can be further improved.

Further, in the organic EL panel P, as the edge portion on which the electronic component W is mounted, a plurality of adsorption holes 42g provided on the support surface 42f of the support portion 42b are adsorbed from the lower side. Therefore, even if the resin constituting the organic EL panel P is bent or undulated upward at the edge of the organic EL panel P based on moisture absorption or the like, the organic EL panel P may be in close contact with the support surface 42f of the support portion 42b. According to this, the alignment mark PM of the organic EL panel P and the surrounding portion thereof are stably maintained in a flat state, and the position recognition accuracy of the alignment mark PM can be improved.

The organic EL panel P is supplied to the holder 81 of the first conveying unit 80 placed on the table 42 by the flat adsorption surface 81c of the electrode surface adsorption block 81a and the flat adsorption surface of the display region adsorption portion 81b. The surface of the organic EL panel P is kept to be a flat surface. According to this, even if the flexible organic EL panel P which is likely to be bent or bent is held by the flat holding surface by suction, it can be held in the holder 81 in a flat state. Therefore, the organic EL panel P can be placed and held on the table 42 in a flat state, whereby the effect of improving the position recognition accuracy of the alignment mark PM performed in the state of being held by the table 42 can be stably obtained.

When the organic EL panel P is placed on the table 42 by the holding body 81, the organic EL panel P is held by the support surface 42f of the support portion 42b of the table 42 by the holding surface of the holding body 81. Between the mounting surfaces 42d of the portion 42a. According to this, the organic EL panel P can be transferred to the stage 42 while maintaining a flat state. According to this, the organic EL panel P can be held on the table 42 in a flat state, and the effect of improving the position recognition accuracy of the alignment mark PM performed in the state of being held by the table 42 can be further stably obtained.

In addition, the first and second imaging devices 43A and 43B of the position recognizing unit 43 that detects the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are provided. The X-axis moving device 43c, in which the camera 43a and the barrel portion 43b move in the X-axis direction, moves the camera 43a and the barrel portion 43b between the photographing position and the retracted position by linear movement in the X-axis direction. Moreover, the mobile system is synchronized. That is, the left and right cameras 43a and the barrel portion 43b move simultaneously in opposite directions and stop at the same time. In other words, since the first and second imaging devices 43A and 43B have the same configuration, the weight of the camera 43a and the lens barrel 43b are the same, and the members of the same weight move simultaneously in the opposite direction and stop at the same time, so that mutual movement and stop are generated. The vibration is cancelled, and the vibration generated by the movement or stop of both can be reduced. Therefore, the imaging of the alignment marks PM and WM of the organic EL panel P and the electronic component W can be performed while suppressing vibration as much as possible, and the relative position data of the alignment marks PM and WM can be detected with high precision.

Further, the present invention is not limited to the above embodiment. For example, the display panel is described by taking an organic EL panel as an example, but is not limited thereto. For example, a constituent member of the flexible electronic paper may be used as a display panel.

Further, the connection between the organic EL panel P and the electronic component W is performed using the anisotropic conductive tape F, but is not limited thereto. Other bonding members such as an adhesive containing conductive particles may be used. In the case of using an adhesive, a thermosetting or photocurable adhesive can be used.

The position of the camera 43a and the barrel portion 43b of the first and second imaging devices 43A and 43B of the position recognizing unit 43 is set to the imaging position and the retracted position by the movement in the X-axis direction. For example, by moving in the Y-axis direction, the position may be at the photographing position and the retracted position. In short, the camera 43a and the barrel portion 43b are retracted to a position that does not interfere with the movement of the lifting and lowering movement of the jig 41a. In addition, the image forming unit is a camera 43a, and the lens portion 43b that is independent of the camera 43a is provided with a crucible 43e as a light guiding optical member. However, the imaging unit and the light guiding optical member are not limited to being independent. The member may be integrated, and for example, an optical member for guiding light may be built in the camera.

The configuration of the first to third transport units 80, 90, and 100 is not limited to the above, and other configurations are also possible. For example, instead of using a porous sheet, a plurality of openings for adsorption may be provided in a soft rubber or a resin material such as foamed urethane rubber or enamel rubber.

The organic EL panel P is transported from the table 42 of the temporary pressure bonding device 40 to the table 51 of the fixed pressure bonding device 50 by the second conveying unit 90, but the invention is not limited thereto. For example, the table 51 of the fixed crimping device 50 is moved to a position close to the table 42 of the temporary crimping device 40, and the fixed crimping device 50 is moved to the close position of the table 42 of the temporary crimping device 40. In the table 51, the organic EL panel P may be transported using the first transport unit 80. In other words, the first transport unit 80 may also serve as the second transport unit 90.

In the case where the temporary pressure bonding device 40 and the fixed pressure bonding device 50 thermally press the one piece of the organic EL panel P, the present invention is not limited thereto. For example, usually fixed crimping and temporary crimping require several times longer. Here, it is possible to arrange a plurality of, for example, two sets of fixed pressure bonding devices 50 with respect to one temporary pressure bonding device 40, and it is possible to shorten the waiting time of the temporary pressure bonding device 40 and improve productivity. In this case, as a substitute for the plurality of fixed crimping devices 50, a table 51 in which a plurality of organic EL panels P can be placed side by side in one fixed crimping device 50 can be provided, and a plurality of sheets which can be placed in parallel can be provided. The electronic component W on the organic EL panel P is integrated or individually fixedly crimped to the fixed crimping joint 52. In the case where the fixed pressure bonding is performed in combination, the fixed crimping joint 52 is provided with a pressurizing jig 52a that can cover the entire length of the plurality of organic EL panels P placed in parallel. In the case where the pressure-bonding is performed individually, the length of the electronic component W that can be attached to one organic EL panel P is placed in the fixed crimping joint 52 in accordance with the mounting interval of the organic EL panel P. With 52a. It is preferable that the pressing means 52a can be individually set to apply a pressing force.

In the holder 81 of the first conveying unit 80, the edge portion of the organic EL panel P on which the electrode array ER is formed is adsorbed and held, but the invention is not limited thereto. For example, when the electrode row ER of the organic EL panel P is adhered with the anisotropic conductive tape F, the electrode array ER of the organic EL panel P is not in contact with other members, and when the contact is not expected, the organic EL panel P is not used. The edge portion of the electrode array ER is formed to be adsorbed and held, and the edge portion may be held while being protruded from the holder 81. In the case where the edge portion of the electrode array ER is formed to be adhered and held by the organic EL panel P, the soft organic EL having a thickness of 20 μm or more and 500 μm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less is used. In the panel (display panel), the vicinity of the electrode array ER is adsorbed by the flat adsorption surface 81c of the holder 81. Thus, it is assumed that an influential bending or undulation occurs at the edge portion where the electrode array ER is formed. Next, the flat support surface 42f of the support portion 42b of the table 42 can be adsorbed and held by the edge portion by the adsorption force of the plurality of adsorption holes 42g.

Further, an illumination device may be built in the support surface 42f of the support portion 42b of the table 42. Specifically, an illumination device is built in a portion of the support surface 42f that is opposed to the alignment mark PM of the organic EL panel P, and the alignment mark PM is performed by the first and second imaging devices 43A and 43B. Light is irradiated from the lower side of the alignment mark PM at the time of photographing. In this way, as compared with the case where the alignment mark PM is photographed by the reflected light, a large difference in brightness between the image of the alignment mark PM and the background image can be obtained, and a clearer alignment mark PM can be obtained. Image can improve recognition accuracy. Further, instead of arranging the illuminating device in the support portion 42b, the light transmission window may be provided instead, or the support portion 42b may be formed of a translucent member such as a transparent glass material, and may be irradiated with light.

In the above embodiment, the configuration in which the anisotropic conductive tape F is adhered to the electronic component W is described, but the configuration is not limited thereto. The anisotropic conductive tape F may be adhered to the organic EL panel P, that is, the display panel. In this case, the anisotropic conductive tape attaching device 30 is provided instead of the adhesive position C of the intermittent rotary transfer device 20, and the anisotropic conductive tape is attached to the organic EL panel P on the upstream side of the supply portion of the organic EL panel P. F's anisotropic conductive tape bonding device can also be used. For example, it can be applied to the mounting device 201 shown in FIG. Fig. 11 is a view showing the configuration of a mounting device 201 of another embodiment.

[Mounting device according to another embodiment] The mounting device 201 shown in Fig. 11 has a configuration in which the anisotropic conductive tape attaching device 230, the temporary crimping device 240, and the fixed crimping device 250 are arranged side by side in the X direction. The press device 210 is disposed behind the Y-direction of the crimping device 240, and a transfer device 260 that transports the electronic component W is disposed between the temporary crimping device 240 and the press device 210. The first to fourth transfer units 271, 272, 273, and 274 of the organic EL panel P are disposed between the respective processing devices 230, 240, and 250. The mounting device 201 supplies the four organic EL panels P to the processors in the respective processing devices 230, 240, and 250. The press device 210 is a stamper for the electronic component W by the tape carrier T, and has the same configuration as the press device 10 described in the above embodiment.

In the anisotropic conductive tape attaching device 230, the anisotropic conductive tape F is adhered to the organic EL panel P. In the anisotropic conductive tape attaching device 230, the two placing portions 231 and 232 in which the two organic EL panels P are held in parallel in the X direction are arranged in parallel in the X direction. The mounting portions 231 and 232 are movable in the XYZθ direction. Moreover, the pasting units 233 and 234 of the anisotropic conductive tape F are disposed corresponding to the two mounting portions 231 and 232. Each of the placing portions 231 and 232 sequentially aligns the positions of the organic EL panels P on the placing portions 231 and 232 to the bonding positions of the respective attaching units 233 and 234. Each of the pasting units 233, 234 adheres the anisotropic conductive tape F to the organic EL panel P whose position has been aligned to the pasting position.

The temporary crimping device 240 temporarily crimps the electronic component W to the organic EL panel P to which the anisotropic conductive tape F has been attached. The temporary pressure bonding device 240 includes a mounting portion 241 in which the four organic EL panels P are arranged in parallel in the X direction, and a temporary pressure bonding device that temporarily presses the electronic component W on the organic EL panel P held by the mounting portion 241. 242; and a backup tool (not shown) that supports the organic EL panel P from the lower side when the electronic EL panel P is temporarily pressure-bonded to the organic EL panel P by the temporary crimping joint 242. The placing portion 241 is movable in the XYZθ direction, and sequentially aligns the positions of the four organic EL panels P on the placing portion 241 to the temporary crimping positions of the temporary crimping joints 242. The temporary crimping joint 242 performs temporary crimping of the electronic component W on the organic EL panel P whose position has been aligned to the temporary crimping position. Further, of course, the temporary pressure bonding device 240 includes the same position recognition device as the temporary pressure bonding device 40 described in the above embodiment.

Here, the electronic component W punched out by the press device 210 is sequentially supplied to the temporary crimping joint 242 by the transport device 260. In other words, the transport device 260 is movable in the XYZθ direction by the XYZθ drive unit 261, and includes a receiving portion 262 that sucks and holds the electronic component W from the lower side, receives the electronic component W from the press unit 210, and delivers it to the temporary crimping terminal 242. .

The fixed crimping device 250 performs fixed pressure bonding on the electronic component W that is temporarily crimped to the organic EL panel P. The fixed crimping device 250 is provided in the X direction in which the four mounting portions 251, 252, 253, and 254 of the respective organic EL panels P are individually held. Further, four fixed crimping joints 255, 256, 257, and 258 are provided corresponding to the four placing portions 251, 252, 253, and 254. The fixed crimping joints 255, 256, 257, and 258 are set to be individually adjustable in pressure, and are configured to be integrated with the lifting movement. Each of the placing portions 251, 252, 253, and 254 is movable in the XYZθ direction, and the positioning of the organic EL panel P can be performed for the corresponding fixed crimping joints 255, 256, 257, and 258. The four fixed crimping joints 255, 256, 257, and 258 are fixedly and pressure-bonded to the four organic EL panels P whose positions have been aligned by the four placing portions 251, 252, 253, and 254.

The first to fourth transport units 271, 272, 273, and 274 simultaneously transfer four organic EL panels P between the respective processing devices 230, 240, and 250. In other words, the first to fourth transfer portions 271, 272, 273, and 274 are provided with four holding portions that simultaneously hold and hold the organic EL panel P from the upper side in the X direction. Next, the first transport unit 271 simultaneously transfers the four organic EL panels P to the anisotropic conductive tape attaching device 230 from a supply unit (not shown). The second transport unit 272 simultaneously transfers the four organic EL panels P from the anisotropic conductive tape attaching device 230 to the temporary pressure bonding device 240. The third transport unit 273 simultaneously delivers four organic EL panels P from the temporary pressure bonding device 240 to the fixed pressure bonding device 250. The fourth transport unit 274 simultaneously carries out four organic EL panels P from the fixed pressure bonding device 250 to a carry-out unit (not shown). The present invention also applies to the mounting device 201 thus constructed. [Examples]

Next, an embodiment of the present invention and its evaluation results will be described.

(Example 1) Using the mounting device 1 of the above-described embodiment, an experiment for confirming the mounting accuracy was performed under the following conditions. Here, as the organic EL panel P, a display surface (120 mm × 65 mm) having a size of 5 inches was prepared. The organic EL panel P has a thickness of 210 μm and a bending elastic modulus of 3.0 GPa. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was prepared. The target accuracy is a general accuracy obtained in an organic EL panel used for a smart phone display panel, and is set to ±3 μm.

<Experimental conditions> Heater of temporary pressure fitting: OFF Working time: 10 seconds (However, the moving speed of the temporary crimping jig 41a and the mounting portion 42a is the same as that of the mounting time of 5 seconds.) Time (number of times): 5.4 hours (1944 times)

In the experiment, the organic EL panel P is placed on the mounting portion 42a in the state of being in the standby position, and the electronic component W is held by the pressing jig 41a. In the standby position, the mounting position of the organic EL panel P is received from the first transport unit 80 in the mounting portion 42a, and the position of the electronic component W is received from the second transfer device 70 in the press fixture 41a. From this state, similarly to the above-described embodiment, the position of the organic EL panel P and the electronic component W is temporarily pressed. In other words, the organic EL panel P and the electronic component W are spaced apart from each other such that the lens barrel portions 43b of the first and second imaging devices 43A and 43B can enter, and the edge portions thereof are arranged to face each other. At this time, the position of the pressing head 41a is in a state of being rotated in the horizontal direction of θ=+5°. This is to confirm the correction accuracy of the rotation deviation.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are identified using the first and second imaging devices 43A and 43B, and the positions of the organic EL panel P and the electronic component W are performed based on the identification results. Align. This alignment is not to align the edge of the electronic component W with the edge of the organic EL panel P, but to maintain the interval at which the barrel portion 43b can enter, that is, to maintain the position in which the height direction is not changed. In this state, the position of the alignment mark of the organic EL panel P and the electronic component W is aligned. Therefore, the first and second imaging devices 43A and 43B do not have to be retracted when the positions are aligned.

After the alignment of the position is completed, the alignment marks of the organic EL panel P and the alignment marks of the electronic component W are photographed by the first and second imaging devices 43A and 43B, and the relative positions between the organic EL panel P and the electronic component W are photographed. Deviation is identified. Next, the relative positional deviation obtained from the identification result is recorded as the mounting accuracy.

(Comparative Example 1) In the comparative example, the left and right alignment marks PM of the organic EL panel P and the left and right of the electronic component W are replaced by the first and second imaging devices 43A and 43B described in the embodiment. The four cameras that were individually photographed by the alignment mark WM were checked for mounting accuracy. Further, the correctness of the position alignment accuracy is confirmed, and the deviation due to the assembly accuracy due to the deviation of the assembly accuracy at the time of pressure bonding can be canceled by setting the offset value, and thus can be regarded as the mounting accuracy.

In the comparative example, when the position alignment accuracy is checked as described later, it is necessary to photograph the alignment mark PM of the organic EL panel P from the lower side, that is, through the organic EL panel P. Therefore, the organic EL panel P is used. TEG (Test Element Group). TEG is a member for evaluation produced for testing. Here, the TEG of the organic EL panel P is used in a size equivalent to a 5-inch organic EL panel P using a glass plate having a thickness of 0.5 mm. Hereinafter, the TEG of the organic EL panel P is simply referred to as an organic EL panel P.

Among the four cameras, the two cameras that photograph the alignment mark PM of the organic EL panel P are placed in an organic EL panel in which the position is in the position of the identification position before the temporary pressure bonding is performed. The alignment mark of P is directly under the PM and is mounted upward. The two cameras for photographing the alignment mark WM of the electronic component W are positioned such that the position of the alignment mark WM of the electronic component W in the position where the position is already in the recognized position before the temporary crimping is performed. Install it below and up. Further, in the support portion 42b that supports the edge portion of the organic EL panel P, a notch portion that penetrates the upper and lower sides is provided at a position corresponding to the alignment mark, and the alignment mark can be recognized from the lower side to be an experimenter.

By using the mounting device as described above, the alignment result of the position of the organic EL panel P and the electronic component W is recorded as the mounting accuracy. Specifically, the two cameras for the organic EL panel P are used to recognize the position of the alignment mark of the organic EL panel P whose position is already in the recognized position, and the two cameras for using the electronic component W are positioned at the position. The position of the alignment mark of the electronic component W of the identified position is identified. At this time, the electronic component W is in the state of being rotated in the horizontal direction of θ=+5° as in the above-described embodiment. Next, the position alignment of the organic EL panel P and the electronic component W is performed in accordance with the result of the discrimination.

In addition, this position is aligned, and the edge of the organic EL panel P is not overlapped with the edge of the electronic component W, but the edge of the organic EL panel P is separated from the edge of the electronic component W by a predetermined distance. Going forward. Specifically, the edge portions are aligned at intervals of 3.3 mm from each other. The identification of the position alignment accuracy is performed by using two cameras that are placed upward as the imaging marks of the electronic component W, and the alignment marks of the organic EL panel P and the electronic component W are simultaneously taken into the same field of view. The relative positional deviation is identified. In other words, the alignment marks on the right side of the organic EL panel P and the electronic component W are photographed using the right camera for the electronic component W and simultaneously taken into the same field of view, and the left side alignment marks are used to the left side. The camera takes a picture and simultaneously takes it into the same field of view. The positional alignment accuracy is obtained from the relative positions of the photographed alignment marks, and is recorded as the mounting accuracy.

The measurement results of the above Example 1 are shown in Table 1 and FIG. The measurement results of Comparative Example 1 are shown in Table 2 and FIG. Regarding the measurement results, among the 1944 pieces of data obtained by repeating the above-mentioned operation for 5.4 hours, the average value (1) of the first to the tenth data, and the data of the 101st to the 110th (2) In the mean, the average value ((3) to (20)) of the data which is taken 10 times per 100 times in the same manner is shown as "relative position deviation identification result" and shown in Table 1 and Table 2, respectively. The difference between the measurement results and the measurement results of (1) in Tables 1 and 2 is the subtraction of the first to the tenth data from the average value (2) to (20) of each data of each of the 100 times. The average value (1) is the value obtained. FIG. 12 and FIG. 13 show the fluctuation of "the difference from the measurement result of (1)". As is apparent from comparison between Table 1 and Fig. 12 and Table 2 and Fig. 13, the variation in the mounting accuracy of the examples was largely suppressed as compared with the comparative example. Therefore, the mounting accuracy of the flexible electronic component for the flexible display panel can be maintained for a long period of time.

In addition, the embodiments of the present invention are described, and the embodiments are merely illustrative and are not intended to limit the scope of the invention. The implementation of the new rules can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. The scope of the invention or its modifications are also included in the scope of the invention and the scope of the invention as set forth in the appended claims.

1‧‧‧Installation device

10 (10A, 10B) ‧ ‧ stamping device

12‧‧‧Molding device

20‧‧‧Intermittent rotary conveyor

21‧‧‧ Arms

24‧‧‧ Keep head

30‧‧‧Inertial Conductive Tape Adhesive Device (Joint Member Adhesive Device)

32‧‧‧adhesive head

40‧‧‧ Temporary crimping device

41‧‧‧ Temporary pressure joint

42‧‧‧Workbench

42a‧‧‧Loading Department

42b‧‧‧Support

42c‧‧‧Workbench Drive Department

43‧‧‧Location Identification Unit

43A‧‧‧1st camera

43B‧‧‧2nd camera

43a‧‧‧ camera

43b‧‧‧Mirror Tube

43c‧‧‧X-axis mobile device

43d‧‧‧Image Processing Department

43e‧‧‧right angle

50‧‧‧Fixed crimping device

51‧‧‧Workbench

52‧‧‧Fixed pressure joint

53‧‧‧Backup Department

60‧‧‧1st junction device

61‧‧‧Acceptance Department

70‧‧‧2nd handover device

71‧‧‧Acceptance Department

80‧‧‧1st transport department

81‧‧‧ Keeping body

81a‧‧‧electrode surface adsorption block

81b‧‧‧Display area adsorption department

90‧‧‧2nd Transport Department

91‧‧‧ Keeping body

100‧‧‧3rd Transport Department

101‧‧‧ Keeping body

110‧‧‧Control device

111‧‧‧Memory Department

F‧‧‧ anisotropic conductive tape

P‧‧‧Organic EL panel

W‧‧‧Electronic components

Fig. 1 is a plan view showing an apparatus for mounting an electronic component in an embodiment. Fig. 2 is a side view showing the mounting device of the electronic component shown in Fig. 1. Fig. 3 is a perspective view showing a temporary crimping device of the mounting device of the electronic component shown in Fig. 1. Fig. 4 is a view showing a position recognizing unit of the temporary pressure bonding device shown in Fig. 3, wherein (A) is a plan view and (B) is a front view. Fig. 5 is a perspective view showing a cymbal used in the position recognizing unit shown in Fig. 4. Fig. 6 is a plan view showing an organic EL panel and electronic components applied to a mounting device according to an embodiment. Fig. 7 is a schematic view showing an example of a photographed image of an alignment mark photographed by a camera of the position recognizing unit shown in Fig. 4. Fig. 8 is a perspective view showing a fixing and crimping device of the mounting device for the electronic component shown in Fig. 1. FIG. 9 is a perspective view showing an example of a holder of an organic EL panel in the mounting apparatus for the electronic component shown in FIG. 1. FIG. 10 is a perspective view showing another example of the holding body of the organic EL panel in the mounting apparatus for the electronic component shown in FIG. 1. Fig. 11 is a plan view showing an apparatus for mounting an electronic component in another embodiment. Fig. 12 is a graph showing the variation of the mounting accuracy of the first embodiment. Fig. 13 is a graph showing the variation of the mounting accuracy of Comparative Example 1. FIG. 14 is a view showing an example of an image in which a circular alignment mark of an organic EL panel and a liquid crystal display panel is photographed using a conventional OLB apparatus.

Claims (11)

A device for mounting an electronic component is a plurality of electrodes arranged to have a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a flexible display panel. The member is connected to a plurality of terminals of the flexible electronic component that are arranged in correspondence with the plurality of electrodes, and the electronic component is mounted on the display panel, and includes a table for loading The table for the display panel includes a support portion for supporting the edge portion on which the electronic component is mounted from the lower side of the display panel, and is movable in the horizontal direction simultaneously with the support portion; And holding the electronic component from the upper side so that the position of the electronic component can be moved in the horizontal direction and the vertical direction so as to be positioned above the edge portion supported by the support portion, and the electronic component is thermocompression bonded On the upper surface of the edge portion; the photographing device is located at the position of the electronic component In a state where the edge of the display panel is above the edge portion, the display panel and the electronic component are allowed to enter, and the alignment mark provided on the edge portion is simultaneously taken with the alignment mark provided on the electronic component. And entering a photographing area and performing photographing; and the control device aligns the display panel with the relative position information of the display panel and the alignment mark of the electronic component obtained from the photographed image of the photographing device Adjusting the relative position of the table and the hot-pressing joint to the position of the electronic component, and thermally pressing the electronic component to the display panel by the thermocompression bonding joint according to the adjusted positional relationship The above-mentioned workbench and the above-mentioned hot press joint are controlled. The mounting device for an electronic component according to the first aspect of the invention, wherein the support portion of the table is provided at a contact portion with the edge portion of the display panel, and has a plurality of points attached to the edge portion Adsorption holes. The mounting device for an electronic component according to the second aspect of the invention, wherein the plurality of adsorption holes are disposed at a shorter interval than a period of unevenness generated by the edge portion of the display panel. The mounting device for an electronic component according to any one of claims 1 to 3, further comprising: a conveying unit that supplies the display panel to the table, wherein the conveying unit includes a holding body: the holding body has An electrode surface adsorption block that adsorbs and holds the edge portion of the display panel in a flat state, and a display region adsorption portion that adsorbs and holds a portion other than the portion of the display panel that is adsorbed by the electrode surface adsorption block. The mounting device for an electronic component according to the fourth aspect of the invention, wherein the display region adsorption portion has a porous sheet in which an adsorption surface is formed flat. The mounting device for an electronic component according to the fourth aspect of the invention, wherein the display region adsorption portion is arranged in parallel in a direction intersecting with the edge portion of the display panel that is adsorbed and held by the electrode surface adsorption block, The manner of freely adjusting the interval between each of the electrode face adsorption blocks described above is set. The mounting device for an electronic component according to any one of claims 1 to 3, wherein the imaging device includes: an imaging unit having an imaging element; and an optical member for guiding light, wherein the image of the display panel and the image are The image of the electronic component is simultaneously guided to the above-described photographic element. The mounting device for an electronic component according to claim 7, wherein the optical member for guiding light is configured to have a triangular prism having a right-angled equilateral triangle having a bottom surface, and two sides corresponding to two sides having the same length as a right angle 构成 formed by the reflecting surface, the image of the display panel is guided to the first region of the imaging element by one of the two reflecting surfaces, and the other surface is The image of the electronic component is directed to the second region of the imaging element. The mounting device for an electronic component according to any one of claims 1 to 3, further comprising: a press device for punching the electronic component from the tape carrier; and an intermittent rotary transfer device having a punching device to be punched out by the punching device The plurality of holding heads held by the electronic component are configured to intermittently rotate the holding head; the bonding member attaching device is disposed in a transport path of the intermittent rotating transport device to the electronic component, and the bonding member is adhered to the electronic component The temporary pressure bonding device includes the above-described table, the hot press fitting, and the photographing device, and the electronic component to which the bonding member is adhered by the bonding member bonding device is temporarily pressure-bonded to the display panel; The connection device fixes and presses the electronic component that has been temporarily pressed against the display panel by the temporary pressure bonding device; and the first transfer device performs the electronic component between the press device and the intermittent rotary transfer device Handover The second delivery device performs the transfer of the electronic component between the intermittent rotary transfer device and the temporary pressure bonding device, and the transfer unit that transports the display panel from the temporary pressure bonding device to the fixed pressure bonding device. The temporary pressure bonding device is disposed adjacent to the fixed pressure bonding device, and the intermittent rotation conveying device and the pressing device are in the direction orthogonal to the adjacent direction with respect to the temporary pressure bonding device, and the intermittent rotation conveying device The order of the above-described press devices is configured. The mounting device for an electronic component according to any one of claims 1 to 3, further comprising: a press device for punching the electronic component from the tape carrier; and a bonding member bonding device for mounting in the display panel The edge portion of the electronic component punched out by the press device is bonded to the bonding member; and the temporary pressure bonding device includes the table, the hot press fitting, and the image forming device for using the electronic component The bonding member is temporarily pressed against the display panel; the fixed pressure bonding device fixes and presses the electronic component that has been temporarily pressed against the display panel by the temporary pressure bonding device; and the delivery device performs the pressing The electronic component is transferred between the device and the temporary pressure bonding device; the conveying unit transfers the display panel to the temporary pressure bonding device from the bonding member bonding device; and the other conveying portion from the temporary pressure bonding device Transfer the above display panel to the above fixed Connection means; the joining member adhesive means, the temporary compression bonding device, and the fixed crimping means based in this order is arranging the press apparatus with respect to the temporary compression bonding device lines disposed in a direction orthogonal to the arranging direction. A method for producing a display member, comprising: holding a display panel having a thickness of 20 μm or more and 500 μm or less and having a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and holding the flexible display panel on the table; a support portion of the panel having a plurality of electrodes supported by a support portion provided on the table from the lower side; and a plurality of terminals having a plurality of terminals corresponding to the plurality of electrodes and having flexible electronic components are held a holding process of the thermocompression joint; a step of positioning the position of the electronic component held by the thermocompression bonding member above the edge portion supported by the support portion; and displaying the position of the electronic component at the position a state in which the imaging device enters between the display panel and the electronic component in a state where the upper edge of the panel is positioned, and the alignment mark provided on the edge portion and the pair of the electronic component are provided by the imaging device A photographic project in which a quasi-mark is simultaneously taken into one photographic area and photographed; a position recognition project for identifying a relative positional relationship between the display panel and the electronic component according to an image of the display panel and the alignment mark of the electronic component photographed by the photographing project; and the position recognition project according to the position recognition project Adjusting the relative positional relationship of the table to adjust the relative position of the table and the hot-pressing joint, and thermocompression bonding the electronic component to the display panel by the thermocompression bonding joint according to the adjusted positional relationship engineering.