JP7285303B2 - Mounting equipment for electronic components and method for manufacturing display members - Google Patents

Description

TECHNICAL FIELD Embodiments of the present invention relate to an electronic component mounting apparatus for mounting flexible electronic components on the edge of a flexible display panel, and a display member manufacturing method.

2. Description of the Related Art In the flat panel display market, which is used as displays for mobile terminals such as televisions, personal computers, and smart phones, liquid crystal displays occupy an overwhelming penetration rate. Under such circumstances, in recent years, organic EL displays, which can be made thinner without requiring a backlight and can be bent by being formed on a flexible resin film, have become popular, especially for mobile terminals. It is attracting attention mainly in the small display market. For this reason, there is a demand for an electronic component mounting apparatus that can be bent, that is, that can be suitably used for assembling a flexible organic EL display.

Currently, an outer lead bonding apparatus for liquid crystal displays (hereinafter referred to as an OLB apparatus) is known as a general electronic component mounting apparatus (see Patent Document 1). However, OLB devices for organic EL displays are not known. For this reason, an OLB device for a liquid crystal display is used as a substitute for the electronic component mounting process performed when manufacturing an organic EL display.

An OLB device for a liquid crystal display mounts electronic components on a display panel made of a glass substrate via an anisotropic conductive tape. In the mounting process using an OLB device for a liquid crystal display, first, the edge of the display panel on which electronic components are to be mounted is held so as to protrude from the stage, and the edge of the display panel is held by a crimping head. Keep electronic components close together. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged by one camera from below the display panel, and the relative positions of the two are recognized. After that, the edges of the display panel are held by a backup tool from below, the electronic components are aligned with the display panel based on the recognized relative positions, and the display panel is pressed through the anisotropic conductive tape by a crimping head. An electronic component is mounted by heating and pressurizing on the edge of the board.

JP-A-2006-135082

If the OLB device for the liquid crystal display described above is directly applied to the manufacturing process of the organic EL display, electronic components cannot be mounted with high accuracy. That is, the inventors of the present application have used the above-described OLB device for liquid crystal display as it is to form an electronic component in a flexible display panel (hereinafter referred to as an organic EL panel), which is a component of an organic EL display. and tried to manufacture a display member. Specifically, a COF (Chip on film) with a width of 38 mm was mounted as an electronic component on an organic EL panel with a size of 5.0 inches and a thickness of about 0.2 mm, which is widely used in smartphones. . As a result, it was found that the electronic components could not be mounted on the organic EL panel with high accuracy and high quality only by applying the OLB device for the liquid crystal display as it is. Specifically, an organic EL panel for smartphones requires a mounting accuracy of about ±3 μm, but it has become clear that such mounting accuracy and mounting quality cannot be satisfied.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problem of lower mounting accuracy and lower mounting quality of electronic components that occur when the above-mentioned conventional OLB device for liquid crystal displays is applied to the manufacturing process of organic EL displays. A mounting apparatus for electronic components that enables accurate mounting of electronic components on a display panel even when flexible electronic components are mounted on the flexible display panel by thermocompression bonding. and a method of manufacturing a display member.

In the electronic component mounting apparatus of the embodiment, a plurality of electrodes arranged on the edge of a flexible display panel are arranged corresponding to the plurality of electrodes of the flexible electronic component. An electronic component mounting apparatus that mounts the electronic component on the display panel by connecting a plurality of terminals via a bonding member, wherein the display panel is mounted so that the edge protrudes from the display panel. A horizontally movable stage to be placed, a transport unit that supplies the display panel to the stage, and a backup that supports the edge of the display panel placed on the stage from below. a unit, a horizontally and vertically movable thermocompression bonding head for holding the electronic component from above and thermocompression bonding the electronic component to the upper surface of the edge supported by the backup unit; an imaging device that captures an image of an alignment mark provided on the edge and an alignment mark provided on the electronic component before the edge of the protruding display panel is supported by the backup unit; a position recognition device that recognizes a positional relationship between the display panel and the electronic component ; The edge protruding from the stage of the display panel has a thickness of 50 μm or more and 500 μm or less, a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less, and the display set in advance in the range of 3 mm or more and 15 mm or less. controlling the movement of the stage and the transport unit so that the edge portion of the display panel protrudes from the stage by a range of 3 mm or more and 15 mm or less based on the amount of protrusion of the edge portion of the panel, and Based on the positional relationship recognized by the position recognition device, the relative positions of the stage and the thermocompression head are adjusted so that the positions of the display panel and the electronic component are aligned, and the thermocompression head is adjusted. a control device for controlling the stage and the thermocompression bonding head so as to thermocompress the electronic component to the display panel by means of the thermocompression bonding.

A method for manufacturing a display member according to an embodiment includes a mounting step of mounting a flexible display panel on a stage so that an edge portion having a plurality of electrodes protrudes in a range of 3 mm or more and 15 mm or less. The edge portion of the display panel protruding from the stage has a thickness of 50 μm or more and 500 μm or less, and the bending elastic modulus of the portion of the display panel that protrudes from the stage is 2.6 GPa or more and 4.0 GPa. a placing step, which is
a holding step of holding a flexible electronic component having a plurality of terminals provided corresponding to the plurality of electrodes on a thermocompression bonding head;
a supporting step of supporting the edge of the display panel with a backup unit;
capturing an image of an alignment mark provided at the edge of the display panel placed on the stage while irradiating the alignment mark with light from a side opposite to the side on which the image is captured before the supporting step; position recognition for recognizing a positional relationship between the display panel and the electronic component based on images of the alignment marks provided on the electronic component held by the thermocompression head; process and
Based on the positional relationship recognized in the position recognition step, the relative position between the stage and the thermocompression head is adjusted, and after the support step, the electronic component is attached to the edge of the display panel by the thermocompression head. A thermocompression bonding step of thermocompression bonding to the part,
A display member is manufactured in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via connection members.

According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted on a flexible display panel such as an organic EL panel by thermocompression bonding, the electronic component can be mounted with high precision and accuracy. Mounting can be performed while maintaining mounting quality. Furthermore, according to the method of manufacturing a display member of the present invention, it is possible to provide a display member in which electronic components are mounted on a display panel with high accuracy while maintaining mounting quality.

It is a top view which shows the mounting apparatus of the electronic component in embodiment. FIG. 2 is a side view of the mounting apparatus shown in FIG. 1; 1 is a cross-sectional view of an organic EL panel applied to a mounting apparatus according to an embodiment; FIG. 2 is a perspective view showing a temporary crimping device of the mounting device shown in FIG. 1; FIG. 5 is an enlarged cross-sectional view showing a stage of a temporary pressure bonding device of the mounting device shown in FIG. 4; FIG. It is a top view which shows the organic EL panel and electronic component which are applied to the mounting apparatus of embodiment. FIG. 2 is a perspective view showing a main crimping device of the mounting device shown in FIG. 1; 2 is a perspective view showing an example of a holder for an organic EL panel in the mounting apparatus shown in FIG. 1; FIG. 2 is a perspective view showing another example of a holder for an organic EL panel in the mounting apparatus shown in FIG. 1; FIG. It is a top view which shows the mounting apparatus of the electronic component in other embodiment. 5 is a graph showing variations in mounting accuracy according to Example 1; 7 is a graph showing variations in mounting accuracy according to Comparative Example 1;

An electronic component mounting apparatus and a display member manufacturing method according to embodiments will be described below with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each part, and the like may differ from the actual ones. Unless otherwise specified, the terms indicating the vertical direction in the description indicate the relative direction when the mounting surface of the electronic components of the display panel (organic EL panel) to be described below faces upward.

[Configuration of Mounting Device]
FIG. 1 is a plan view showing the configuration of an electronic component mounting apparatus according to an embodiment, and FIG. 2 is a side view of the electronic component mounting apparatus shown in FIG. The electronic component mounting apparatus 1 shown in FIGS. 1 and 2 is used for manufacturing constituent members (display members) of a display device such as an organic EL display. That is, the mounting apparatus 1 attaches a flexible electronic component W such as a COF punched from a carrier tape T to an organic EL panel P as a flexible display panel, and anisotropic as a connection member. This is an apparatus used for manufacturing a display member in which an electronic component W is mounted on an organic EL panel P by mounting via a conductive tape F.

Here, the organic EL panel P is mainly formed of a flexible member. Polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), or the like is used as the member having flexibility, for example. It is also possible to use these members by pasting them together with an adhesive. The organic EL panel P is configured to have a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less. The thickness and flexural modulus are hereinafter referred to as the physical properties of the organic EL panel P. The organic EL panel P in the present embodiment has a structure in which a PI film having organic EL elements formed thereon is bonded to a PET film as a supporting material via an adhesive. Since the thickness of the PET film (approximately 200 μm) is 10 times or more the thickness of the PI film (approximately 10 μm), the bending elastic modulus of the organic EL panel P is considered to be substantially equal to that of the PET film.

It is not necessary for the entire organic EL panel P to have the physical characteristics described above, and at least a portion protruding from a mounting portion 42a (see FIG. 4) of the stage 42, which will be described later, should have the physical characteristics. For example, if the edge of the organic EL panel P on which the electronic component W is mounted protrudes from the mounting portion 42a of the stage 42 by 15 mm, the range of 15 mm from the edge should have the above physical characteristics. .

More specifically, as shown in FIG. 3, the organic EL panel P on which the electronic component W is mounted has a display portion Pa and an edge portion Pb. The display portion Pa is a portion in which an organic EL element Pa1 as a display element is formed, and is a portion for displaying an image. The edge portion Pb is a portion located on the outer peripheral side of the display portion Pa, and is a portion in which a connection portion Pb1 in which electrodes and the like connected to the electrodes of the electronic component W are formed. Such an organic EL panel P is composed entirely of the PI film Ka as a base material, including the display portion Pa and the edge portion Pb, as described above. Pa1 is formed. This PI film Ka is a very thin member having a thickness of less than 50 μm, specifically about 10 to 30 μm.

Therefore, in this embodiment, a PET film Kb as a support material having the same size as the PI film Ka and a thickness of 200 μm is placed on the back surface of the PI film Ka (the surface opposite to the surface on which the organic EL element Pa1 is formed). ) with an adhesive Kc. Further, an optical film Kd such as a cover film (also called a barrier film) for protecting the organic EL element Pa1 may be adhered to the display portion Pa. The optical film Kd has approximately the same size as the display portion Pa. For example, as the cover film, a plastic film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or cycloolefin polymer (COP) coated with a gas barrier layer can be used. The thickness of the cover film is about several tens of μm to 200 μm.

In the organic EL panel P having such a configuration, if only the edge portion Pb protrudes from the mounting portion 42a of the stage 42, the edge portion Pb should have the physical characteristics described above. In other words, it is sufficient that the portion where the PI film Ka and the PET film Kb are laminated has the physical properties described above. Moreover, when the edge Pb and a part of the display portion Pa protrude from the mounting portion 42a, the edge portion Pb and the display portion Pa may have the above-described physical characteristics. In other words, when the display portion Pa does not have a cover film, it is sufficient that the portion where the PI film Ka and the PET film Kb are bonded together has the physical properties described above. On the other hand, when there is an optical film Kd in the display portion Pa, the physical properties of the portion where the PI film Ka and the PET film Kb, which are the edges, are bonded together, and the PI film Ka, the PET film Ks, and the optical film Kd as the display portion Pa It is sufficient that both the physical properties of the portion where the film Kd is attached have the above physical properties.

Here, the flexural modulus is a value measured according to the test method specified in JIS K7171: Plastics - Determination of flexural properties (revised on March 22, 2016). Specifically, in the flexural modulus test, a test piece having dimensions of 80 ± 2 mm in length, 10.0 ± 0.2 mm in width, and 4.0 ± 0.2 mm in thickness is adjusted to a distance between fulcrums of 64 mm. The center of the test piece is bent by lowering the indenter to the center between the fulcrums at a test speed of 2 mm/min. The test atmosphere is a standard atmosphere (temperature 23° C./humidity 50%) defined by JIS K7100.

As the electronic component W, a flexible electronic component such as a COF is used. The COF is configured by mounting a semiconductor element on a flexible film-like circuit board made of PI (polyimide) or the like. As will be described later, the COF is formed by individualizing by punching out from a tape-shaped film member.
The display member is obtained by mounting an electronic component W such as a COF on a display panel such as an organic EL panel P via a bonding member such as an anisotropic conductive tape F. It is a member used as a constituent part of a display device such as.

The mounting apparatus 1 of the embodiment includes a punching device 10 (10A, 10B) for punching an electronic component W from a carrier tape T, an intermittent rotary conveying device 20 for sucking and holding the punched electronic component W and conveying the electronic component W while intermittently rotating, an intermittent An anisotropic conductive tape attachment for attaching an anisotropic conductive tape F as a joining member to an electronic component W that is placed at an intermittent stop position in the middle of a conveying path of the rotating conveying device 20 and conveyed by the intermittent rotating conveying device 20. Device (bonding member adhering device) 30, temporary pressure bonding device 40 for temporarily pressure bonding the electronic component W to which the anisotropic conductive tape F is adhered to the organic EL panel P via the anisotropic conductive tape F, temporary pressure bonding device a final pressure bonding device 50 for permanently pressure bonding the electronic component W temporarily pressure bonded to the organic EL panel P by 40; A second transfer device 70 for transferring electronic components W between the intermittent rotary transfer device 20 and the temporary pressure bonding device 40, a first transfer section 80 for carrying in the organic EL panel P to the temporary pressure bonding device 40, A second conveying unit 90 for conveying the organic EL panel P from the temporary pressure bonding device 40 to the permanent pressure bonding device 50, a third conveying unit 100 for conveying the organic EL panel P from the permanent pressure bonding device 50, and a punching device 10, An intermittent rotary conveying device 20, an anisotropic conductive tape sticking device 30, a temporary pressure bonding device 40, a main pressure bonding device 50, a first transfer device 60, a second transfer device 70, a first transfer section 80, a second It is configured with a control device 110 that controls the operation of each unit such as the transport unit 90 and the third transport unit 100 .

(Punching device 10)
The punching device 10 is for punching a COF as an electronic component W from a carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration, and are arranged in a left-right reversed state when viewed from the front of the device. The first and second punching devices 10A and 10B are used one by one so that while punching is performed by one of the punching devices 10A and 10B, the carrier tape T of the other punching device 10A and 10B can be exchanged. It has become.

The first and second punching devices 10A and 10B respectively include a supply reel 11 around which the carrier tape T before punching is wound, and a die device 12 for punching the electronic component W from the carrier tape T supplied from the supply reel 11. and a take-up reel 13 for taking up the carrier tape T from which the electronic parts W are punched out by the mold device 12.例文帳に追加The carrier tape T unwound from the supply reel 11 is changed in direction by a plurality of guide rollers 14 and sprockets 15 and sent to the take-up reel 13 via the mold device 12 . The sprocket 15 is arranged in front of the mold device 12 in the conveying direction of the carrier tape T, and is rotated by a drive motor (not shown) to convey the carrier tape T, while conveying the carrier tape T to the mold device 12. Positioning is possible.

The mold device 12 includes an upper mold 12a and a lower mold 12b arranged to face the upper mold 12a. The upper mold 12a has a punch 12c on its lower surface. On the other hand, the lower die 12b is formed with a vertically penetrating die hole 12d into which the punch 12c is inserted. Electronic components W are punched out from the carrier tape T by vertically moving the upper mold 12a while the carrier tape T is supplied and positioned with respect to the mold device 12 as described above. A suction hole (not shown) is provided on the tip surface of the punch 12c so that the punched electronic component W can be held by suction.

(Intermittent rotary conveying device 20)
The intermittent rotary transfer device 20 has four arms 21 of the same shape arranged in a mutually orthogonal relationship, and intermittently rotates the index table 22 having a cross shape in plan view and the index table 22 at intervals of 90°. and a rotation drive unit 23 . A holding head 24 for sucking and holding an electronic component W is provided at the tip of each arm portion 21 of the index table 22 . Four stop positions A to D of the index table 22 at 90° intervals include a receiving position A for receiving the electronic component W punched by the punching device 10, and a positioning position for the electronic component W held by the holding head 24. Gauging/cleaning position B for performing (gauging) and cleaning, sticking position C for sticking the anisotropic conductive tape F to the electronic component W held by the holding head 24, anisotropic conductive tape A transfer position D is set for transferring the electronic component W to which F is adhered to the temporary pressure bonding device 40 .

(Anisotropic conductive tape sticking device 30)
The anisotropic conductive tape sticking device 30 is provided corresponding to the sticking position C of the intermittent rotary conveying device 20, and the tape-shaped member S in which the anisotropic conductive tape F is stuck and supported by the release tape R is provided. The wound supply reel 31, the adhering head 32 arranged at a position facing the holding head 24 positioned at the adhering position C, and the release tape R after the anisotropic conductive tape F is peeled off. a collection unit 33 for housing, a plurality of guide units 34 for guiding the tape-shaped member S supplied from the supply reel 31 to the collection unit 33 along a conveying path passing through the sticking position C, and a plurality of guide units 34 is disposed downstream of the sticking position C of the conveying path of the tape-shaped member S, and intermittently conveys the tape-shaped member S by a predetermined length by reciprocating along the conveying direction of the tape-shaped member S. A chuck feeding unit 35 and a cutting unit 36 arranged upstream of the sticking position C of the conveying path of the tape-shaped member S and cutting only the anisotropic conductive tape F of the tape-shaped member S are provided. .

The sticking head 32 attaches to the terminal portion of the electronic component W held by the holding head 24 positioned at the sticking position C, an anisotropic conductive film cut into a predetermined length and conveyed and positioned at the sticking position C. A sticking tool 32a for pressing the tape F; and a heater 32c attached to the terminal portion of the electronic component W.

(Temporary crimping device 40)
As shown in FIG. 4, the temporary pressure-bonding device 40 sucks and holds the electronic component W to which the anisotropic conductive tape F is adhered by the anisotropic conductive tape applying device 30, and temporarily pressure-bonds it to the organic EL panel P. a temporary pressure bonding head 41 as a thermocompression bonding head for holding and positioning the organic EL panel P; a stage 42 for holding and positioning the organic EL panel P; , a position for recognizing the relative positions of the backup unit 43 that supports the portion protruding from the stage from below, the organic EL panel P held on the stage 42, and the electronic component W held by the temporary pressure bonding head 41. and a recognition device 44 .

The temporary pressure-bonding head 41 includes a pressure tool 41a that sucks and holds the electronic component W from its upper surface side, a tool drive unit 41b that moves the pressure tool 41a in the Y, Z, and θ directions, and a pressure tool 41a. and a heater 41c for heating the pressure tool 41a. As shown in FIG. 4, the stage 42 has a mounting portion 42a on which the organic EL panel P is mounted, and a stage driving portion 42b that moves the mounting portion 42a in the X, Y, Z, and .theta. directions.

A plurality of suction holes 42d for holding the organic EL panel P by suction are formed on the mounting surface 42c of the mounting portion 42a on which the organic EL panel P is mounted. 42 d of this adsorption|suction hole are mainly arrange|positioned in the position which opposes the display area of the image in the organic EL panel P, when the organic EL panel P is mounted in the mounting surface 42c. In this example, the suction holes 42d are arranged in a matrix at equal intervals in the area of the mounting surface 42c on which the organic EL panel P is mounted (the area surrounded by the two-dot chain line in FIG. 4). As will be explained, it is not necessarily the case that the organic EL panel P placed on the placement surface 42c must be sucked and held over its entire area.

For example, in FIG. 4, an area of about half or 1/3 of the length of the organic EL panel P from the side of the placement surface 42c where the temporary pressure bonding head 41 is located may be sucked and held. Since the suction hole 42d sucks the display area of the organic EL panel P, it is preferable to set the hole diameter small so that the suction does not leave a suction mark on the display area. The diameter of the hole can be determined by experimenting with the relationship between the suction force required to fix the organic EL panel P and the amount of deformation of the organic EL panel P due to this suction, and the size of the hole can be set so as not to leave suction marks. good. Note that the mounting surface 42c may be configured by a vacuum chuck using a porous member such as porous ceramics.

Further, in the mounting portion 42a, a suction groove extending from a suction hole for sucking the organic EL panel P to the vicinity of the side may be provided in the side portion on the side where the temporary pressure bonding head 41 is located. Specifically, as shown in FIG. 5, the sides of the mounting portion 42a are configured with suction blocks 42f that are separate members from the mounting portion 42a. The suction block 42f is a member elongated in the X direction, and is fixed to the mounting portion 42a so that its upper surface is flush with the mounting surface 42c of the mounting portion 42a. A plurality of suction holes 42g for sucking the organic EL panel P are arranged along the X direction on the upper surface of the suction block 42f. Further, an upper surface of the suction block 42f is provided with a suction groove 42h extending from each suction hole 42g toward the end of the suction block 42f (the end on the side where the temporary pressure bonding head 41 is located). The tip of the suction groove 42h extends to a position close to the end of the suction block 42f. The distance between the tip of the suction groove 42h and the end of the suction block 42f is preferably 1 to 3 mm. The bottom side of the end portion of the suction block 42f forms an inclined portion 42i that is inclined downward from the end portion side toward the mounting portion 42a side. Interference with the backup unit 43 can be made less likely to occur by forming the lower side of the end portion as the inclined portion 42i.

The stage driving unit 42b includes an X-axis direction driving unit that moves the mounting unit 42a in the X-axis direction, which is one horizontal direction, and a Y-axis direction driving unit that moves the mounting unit 42a in the Y-axis direction, which is a horizontal direction orthogonal to the X-axis direction. , a Z-axis direction driving portion that moves in the Z-axis direction orthogonal to the horizontal direction, and a θ driving portion that rotates in the horizontal plane, and are stacked in this order from the bottom. In order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the stage driving unit 42b is provided with linear encoders attached to the X-axis direction driving unit and the Y-axis direction driving unit.

The backup unit 43 is provided at a temporary crimping position where the electronic component W is temporarily crimped to the organic EL panel P. As shown in FIG. The backup unit 43 supports an elongated backup tool 43a in the X-axis direction, which supports the edge of the organic EL panel P on which the electrode row ER (FIG. 6) is formed, from below, and the backup tool 43a. and a support base 43b formed in a substantially rectangular parallelepiped shape. The backup tool 43a is made of stainless steel, and has a flat upper end surface (support surface) that supports the edge of the organic EL panel P. As shown in FIG. In this embodiment, the backup unit 43 is fixedly arranged at the temporary crimping position, but it may be arranged movably in the X-axis direction, or in the X-axis direction and the Y-axis direction, if necessary. . In this case, it is preferable to mount the support base 43b on an X-axis moving device or an XY-axis moving device.

Next, the position recognition device 44 will be described with reference to FIGS. 4 and 6. FIG. FIG. 6 is a plan view showing a schematic configuration of the organic EL panel P and the electronic component W whose positions are recognized by the position recognition device 44. As shown in FIG. In the drawings, the X-axis direction will be described as the left-right direction. The organic EL panel P has an electrode row ER formed at its edge and a pair of alignment marks PM provided on both left and right sides of the electrode row ER. The electronic component W has a terminal row TR arranged to correspond to the electrode row ER, and a pair of alignment marks WM provided on both left and right sides of the terminal row TR. The position recognition device 44 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W. FIG.

As shown in FIG. 4, such a position recognition device 44 includes a first image pickup device 44a, a second image pickup device 44b, and an image sensor for processing the images picked up by the first and second image pickup devices 44a and 44b. A processing unit 44c and a light irradiation unit 44d are provided. The first and second imaging devices 44a and 44b are mounted on the support base 43b of the backup unit 43 upward near the end of the backup tool 43a via the X-axis driving section 44e. The first imaging device 44a captures the left alignment mark PM of the pair of alignment marks PM provided on the edge of the organic EL panel P and the left alignment mark WM of the pair of alignment marks WM provided on the electronic component W. WM and WM are taken into an imaging area 44a1 (indicated by a dashed line in FIG. 6) from below at the same time and imaged. The second imaging device 44b simultaneously captures the alignment mark PM on the right side of the organic EL panel P and the alignment mark WM on the right side of the electronic component W within the imaging region 44b1 (indicated by broken lines in FIG. 6) from below. Capture and image.

The first and second imaging devices 43a and 43b respectively take still images of the alignment marks PM and WM, and include a camera 44f such as a CCD (Charge Coupled Device) camera and an optical unit such as a telecentric lens. and a lens barrel portion 44g. The X-axis drive unit 44e can synchronously move the first and second imaging devices 44a and 44b so that the distance between them increases or decreases. In addition, the arrangement interval of the first and second imaging devices 44a and 44b can be changed.

The image processing unit 44c receives an imaging signal from the camera 44f, and extracts images of the alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic parts W from the captured images obtained by being taken into the imaging regions 44a1 and 44b1. It recognizes and detects data on the position of each alignment mark PM, WM (hereinafter referred to as "position data"). The image processing unit 44c uses a known pattern matching process to convert an image that provides a matching rate equal to or higher than a threshold value to a preset reference pattern of the alignment marks PM of the organic EL panel P in the picked-up image as the alignment marks of the organic EL panel P. Recognize as PM. Also, an image that provides a matching rate equal to or higher than a threshold value with the reference pattern of the alignment mark WM of the electronic component W is recognized as the alignment mark WM of the electronic component W. FIG. Position data of the recognized alignment marks PM and WM are obtained based on the camera coordinate system. Thereby, the positional relationship between the organic EL panel P and the electronic component W can be recognized. The obtained position data is transmitted to the control device 110 .

The light irradiation unit 44d is arranged at a position above the organic EL panel P placed on the stage 42 so as to be able to irradiate light directly downward. In the present embodiment, a pair of light irradiation units 44d are provided at the same interval as the arrangement interval of the pair of alignment marks PM of the organic EL panel P. As shown in FIG. The light irradiation unit 44d is provided integrally with the temporary crimping head 41 using a support (not shown), but is not limited to this, and is supported on the frame or base of the mounting apparatus 1 via the support. You can make it work. In short, when the alignment marks PM of the organic EL panel P are imaged by the first and second imaging devices 44a and 44b, the image of the organic EL panel P is captured from the opposite side of the first and second imaging devices 44a and 44b. It suffices if it is provided so that the alignment mark PM can be irradiated with light. Moreover, the light irradiation part 44d may be arranged in a single elongated shape, and the number thereof is not limited.

(Main crimping device 50)
As shown in FIG. 7, the pressure-bonding device 50 includes a stage 51 for holding and positioning the organic EL panel P to which the electronic component W is temporarily pressure-bonded via the anisotropic conductive tape F, and a stage 51 for holding and positioning the organic EL panel P. On the other hand, a final pressure bonding head 52 for final pressure bonding of the electronic component W is arranged below the final pressure bonding head 52 so as to face the final pressure bonding head 52, and the electronic component W on the organic EL panel P is arranged at the time of the final pressure bonding. and a position recognition unit 54 for recognizing the position of the organic EL panel P.

The stage 51 has a mounting portion 51a on which the organic EL panel P is mounted, and a stage driving portion 51b that moves the mounting portion 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in plan view, and a mounting surface (upper surface) 51c for mounting the organic EL panel P has a plurality of suction holes 51d for holding the organic EL panel P by suction. formed. As with the suction holes 42d of the stage 42 of the temporary pressure-bonding device 40, the suction holes 51d preferably have a small hole diameter so as not to leave suction marks on the organic EL panel P. Similar to the stage driving section 42c of the temporary pressure bonding device 40, the stage driving section 51b has an X-axis direction driving section, a Y-axis direction driving section, a Z-axis direction driving section, and a θ driving section stacked in this order from the bottom. It is a drive unit configured as follows.

The main pressure-bonding head 52 includes a pressure tool 52a that presses the electronic component W temporarily pressure-bonded to the organic EL panel P from its upper surface side, a tool driving unit 52b that moves the pressure tool 52a in the Z-axis direction, a pressure and a heater 52c built in the tool 52a for heating the pressure tool 52a. The backup part 53 includes a backup tool 53a having the same length as the pressure tool 52a, which is provided at a position directly below the pressure tool 52a of the main crimping head 52, and a support member 53b for supporting the backup tool 53a. and The upper surface of the backup tool 53a is formed as a flat surface that supports the lower surface of the edge portion to which the electronic component W of the organic EL panel P placed on the placement portion 51a is temporarily crimped.

The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing section (not shown). The first and second cameras 54a and 54b are mounted downward at a predetermined interval above the range of movement of the organic EL panel P by the stage 51, and the electronic components W of the organic EL panel P are temporarily Alignment marks provided near both ends of the crimped edge are imaged. The interval (predetermined interval) between the first and second cameras 54a and 54b described above is the interval between the alignment marks. Note that this alignment mark is an alignment mark different from the alignment mark PM used for recognition of the relative position data in the temporary pressure bonding device 40 . An image processing unit (not shown) recognizes the alignment marks by a known pattern matching process based on the captured images of the alignment marks of the organic EL panel P captured by the first and second cameras 54a and 54b, and Detect the position of

(First delivery device 60)
The first delivery device 60 includes a receiving portion 61 that sucks and holds the electronic component W punched from the carrier tape T from below, and receives the receiving portion 61 at a position directly below the die device 12 of the punching devices 10A and 10B. and an X, Y, Z, .theta.

(Second delivery device 70)
The second transfer device 70 includes a receiving portion 71 that sucks and holds the electronic component W from below, and a position immediately below the holding head 24 of the intermittent rotary conveying device 20 positioned at the transfer position D, and the receiving portion 71 is temporarily pressure-bonded. and an X, Y, Z, .theta.

(First transport unit 80)
The first conveying unit 80 includes a holding member 81 that adsorbs and holds the organic EL panels P supplied from a supply unit (not shown) from above, and a holding unit 81 that is positioned at a position where the organic EL panels P are supplied by the supply unit (not shown). and an XZ drive unit 82 for moving the organic EL panel P to the carrying-in position with respect to the stage 42 of the temporary pressure bonding device 40 .

As shown in FIG. 8, the holding body 81 includes an electrode surface suction block 81a that suctions and holds the edge of the organic EL panel P on which the electrode rows ER on which the electronic components W are mounted is formed, and the electrode surface suction block 81a. and a display area attracting portion 81b that attracts and holds a portion of the organic EL panel P other than the portion that is attracted by the electrode surface attracting block 81a. The electrode surface adsorption block 81a is a rectangular parallelepiped member that is formed to have a length capable of adsorbing and holding the entire edge of the organic EL panel P on which the electrode rows ER are formed, and that is elongated in the direction along the edge. The adsorption surface 81c of the electrode surface adsorption block 81a is formed flat, and is provided with a plurality of adsorption holes 81d. Similar to the mounting portion 42a of the temporary pressure-bonding device 40, the suction hole 81d has a hole diameter set to such a size that the edge of the organic EL panel P is not deformed. The edges on which the electrode rows ER are formed can be flattened and held by suction. The display area adsorption portion 81b is made of a porous body or sponge having a flat adsorption surface, and has a large number of adsorption holes. The adsorption surfaces of the electrode surface adsorption block 81a and the display area adsorption portion 81b are adjusted so as to be positioned on the same plane.

It should be noted that the electrode surface adsorption block 81a does not adsorb and hold the entire electrode row ER. The part on the display area side is held by suction. That is, as indicated by the two-dot chain line in FIG. 8 , the portion of the electrode row ER of the organic EL panel P to which the terminals of the electronic component W are connected is held in a state protruding from the holder 81 .

Although one display area adsorption portion 81b is shown in FIG. 8, a plurality of display area adsorption portions 81b may be arranged side by side. As shown in FIG. 9, the display area attracting portion 81b is arranged in a direction (this embodiment are arranged side by side in an orthogonal direction). The two display area suction portions 81b are each supported by the main body portion 81e of the holder 81 so that the distance between them and the electrode surface suction block 81a can be adjusted. These display area adsorption portions 81b include a base portion 81b1 made of metal such as aluminum, and a flat porous sheet 81b2 covering a surface of the base portion 81b1 for holding the organic EL panel P (hereinafter referred to as “lower surface”). and The base portion 81b1 has substantially grid-shaped suction grooves communicating with the vacuum suction holes on its lower surface. The organic EL panel P can be held flat with a substantially uniform suction force over the entire area of 81b2. As the porous sheet 81b2, for example, a resin porous molding processed into a film can be used. With such a configuration, the holding body 81 can hold even a flexible thin film organic EL panel P by suction and flatness without generating suction marks.

(Second transport unit 90)
The second conveying unit 90 includes a holding body 91 that sucks and holds from above the organic EL panel P to which the electronic component W is temporarily pressure-bonded by the temporary pressure bonding device 40 , and an organic An XZ drive unit 92 is provided for moving the EL panel P to a carry-out position for carrying out the EL panel P and a carry-in position for the organic EL panel P to the stage 51 of the main pressure bonding device 50 . The holding body 91 has a display area adsorption portion formed of a porous body or the like having a flat adsorption surface, which adsorbs and holds substantially the entire upper surface of the organic EL panel P. As shown in FIG. This display area attracting portion is configured in the same manner as the display area attracting portion 81 b of the holding body 81 .

(Third transport unit 100)
The third conveying unit 100 includes a holding body 101 that sucks and holds the organic EL panel P to which the electronic component W has been fully pressure-bonded by the main pressure-bonding device 50, that is, the display member from above, and the main pressure-bonding device 50. An XZ drive unit 102 is provided for moving the organic EL panel P from the stage 51 of 50 to a carry-out position and a delivery position to a carry-out device (not shown).

(control device 110)
The control device 110 has a storage unit 111 . The storage unit 111 stores, for example, the load, heating temperature, and pressing time of the temporary pressure bonding device 40 and the main pressure bonding device 50, reference patterns of alignment marks PM and WM related to the image processing unit 44c, and position information of the reference patterns. Various information for controlling each part is stored. The storage unit 111 also stores a protrusion amount G for causing the edge of the organic EL panel P to protrude from the mounting section 42a of the stage 42 by a predetermined amount. Specifically, the protrusion amount G is set in the range of 3 mm or more and 15 mm or less, more preferably in the range of 3 mm or more and 8 mm or less. Here, it is assumed that the protrusion amount G=6 mm is set.

[Operation of Mounting Equipment]
Next, the operation of the mounting apparatus 1 of the embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10A, and the electronic components W are punched out from the carrier tape T by the die device 12 . The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12 c is transferred to the receiving section 61 of the first transfer device 60 and transferred to the receiving position A of the intermittent rotary transfer device 20 by the first transfer device 60 . The electronic component W transferred to the receiving position A is delivered to the holding head 24 of the intermittent rotary conveying device 20 positioned at the receiving position A. As shown in FIG. The first delivery device 60 rotates the electronic component W by 90° while transferring the electronic component W to the receiving position A, so that the edge portion on which the terminal row TR is formed moves to the receiving position A. Align in the direction (Y direction) along the outer side surface of the positioned holding head 24 .

The electronic component W held by the holding head 24 is sequentially transferred to the gauging/cleaning position B, the sticking position C, and the delivery position D by the intermittent rotation of the index table 22 . During this transfer, at the gauging/cleaning position B, the electronic component W is positioned with respect to the holding head 24 by the abutment of the positioning mechanism (not shown), and adheres to the terminal portion by a cleaning mechanism such as a rotating brush (not shown). Dust cleaning is done. An anisotropic conductive tape F is attached to the terminal portion of the electronic component W at the attaching position C by the anisotropic conductive tape attaching device 30 . Positioning and cleaning are performed at the gauging/cleaning position B, and when the electronic component W to which the anisotropic conductive tape F is adhered at the adhering position C is positioned at the delivery position D, the electronic component W is positioned at the delivery position D. is delivered to the receiving section 71 of the second delivery device 70 at the . The electronic component W transferred to the receiving portion 71 is transferred to a position immediately below the temporary pressure bonding head 41 of the temporary pressure bonding device 40 and transferred to the temporary pressure bonding head 41 .

On the other hand, in parallel with the operation described above, the organic EL panel P is taken out from a supply unit (not shown) by the holder 81 of the first transport unit 80 and is supplied and placed on the stage 42 of the temporary pressure bonding device 40 . First, the holding body 81 of the first transporting section 80 moves to a supply section (not shown), and the holding surface of the holding body 81, that is, the electrode surface adsorption block 81a is attracted to the upper surface of the organic EL panel P prepared in the supply section. The surface 81c and the adsorption surface of the display area adsorption portion 81b are brought into contact with each other. At this time, the adsorption force of the electrode surface adsorption block 81a and the display area adsorption portion 81b is applied while the organic EL panel P is lightly pressed by the holding body 81. As shown in FIG. By doing so, even when the organic EL panel P is warped or bent, the organic EL panel P can be held by the holder 81 in a flat state.

Further, when sucking and holding the organic EL panel P of the supply unit, the holder 81 attaches the end of the organic EL panel P on the side where the electrode row ER is formed to the outer end (display area) of the electrode surface sucking block 81a. It is positioned so as to protrude by a preset length H from the edge on the side opposite to the adsorption portion 81b. For example, this length H is a length corresponding to the width over which the electronic component W is superimposed on the organic EL panel P during temporary pressure bonding.

That is, the length H is stored in the storage unit 111 . When the holding member 81 holds the organic EL panel P of the supply unit, the control device 110 refers to the length H stored in the storage unit 111 to determine whether the electrode-side end of the organic EL panel P is from the holding member 81. The XZ drive unit 82 is controlled so that it is held protruded by the length H. Specifically, since the organic EL panel P is prepared at a predetermined fixed position in the supply unit each time, the end of the organic EL panel P on the side where the electrode row ER is formed is positioned on the basis of this fixed position. The XZ drive unit 82 is controlled to move the holding body 81 so that the positional relationship of protruding by the length H is achieved. A detector such as a photoelectric sensor is provided on the holder 81 to detect the edge of the organic EL panel P. Based on the position of the edge of the organic EL panel P detected using this detector, Alternatively, the holder 81 may be moved so that the amount of overhang is a preset length H.

The organic EL panel P held by the holder 81 is conveyed onto the stage 42 of the temporary pressure bonding device 40 . At this time, the stage 42 of the temporary pressure bonding device 40 is positioned at the supply position (the position indicated by the two-dot chain line in FIG. 1) for receiving the supply of the organic EL panel P from the holder 81 . The organic EL panel P transported onto the stage 42 is placed on the stage 42 . The control device 110 mounts the holder 81 and the stage 42 so that the protrusion amount G of the edge portion of the organic EL panel P from the placement portion 42a becomes the protrusion amount G=6 mm stored in the storage unit 111. It controls the relative position of the section 42a, that is, the driving of the XZ driving section 82 and the stage driving section 42b.

The protrusion amount G is set in the range of 3 mm or more and 15 mm or less, more preferably 3 mm or more and 8 mm or less, as described above. By setting the protrusion amount G within such a range, the organic EL panel P having a thickness of 50 μm or more and 500 μm or less, a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less, and having flexibility, Also, it is possible to prevent the edge portion protruding from the mounting portion 42a from sagging. The relationship between the amount of protrusion G and the amount of sagging at the edge varies depending on the type of organic EL panel P. As a result of experiments by the inventors, it was found that in the case of the panel P, if the protrusion amount G is set to 3 mm or more and 15 mm or less, the sagging of the edge portion can be suppressed to a range in which the recognition accuracy of the alignment mark PM can be maintained. .

It should be noted that, even within the range of the physical characteristics described above, in order to ensure stable recognition accuracy regardless of product type, it is better to set the protrusion amount G short, and it is set within the range of 3 mm or more and 8 mm or less. is more preferable. Here, it is known that the shorter the protrusion amount G of the organic EL panel P is, the more reliable the recognition accuracy is ensured. need arises. If the proximity distance between the mounting portion 42a and the backup tool 43a becomes short, there is a risk of interference, that is, collision, between the two, so the lower limit is set to 3 mm. The lower limit (3 mm) of the protrusion amount G is a value set in consideration of the width dimension of the anisotropic conductive tape F used for connecting the organic EL panel P and the electronic component W.

The organic EL panel P is held by the holding member 81 so that the edge protrudes by the length H. As shown in FIG. On the other hand, the placement portion 42a is positioned at the supply position, and since the position is known, the movement position of the holder 81 at which the protrusion amount G is obtained can be easily calculated.

Further, when the organic EL panel P is mounted on the mounting portion 42a, the organic EL panel P is pressed against the mounting surface 42c by the lowering of the holder 81 and flattened. More specifically, the display area of the organic EL panel P is held by suction on the display area suction portion 81b of the holder 81, so that the organic EL panel P is held in a flat state. Since the organic EL panel P is pressed against the mounting surface 42c of the stage 42 in this state, the organic EL panel P is positioned between the mounting surface 42c of the stage 42 and the display area absorbing portion 81b of the holder 81. sandwiched between Therefore, the organic EL panel P is transferred onto the stage 42 while maintaining the flattened state, and is held by the stage 42 by suction.

At this time, in a state in which the organic EL panel P is pressed against the mounting surface 42c of the stage 42, a suction force is applied to the suction holes 42d of the mounting portion 42a of the stage 42, and then the electrode surface suction block of the holder 81 is applied. The suction force between 81a and display area suction portion 81b may be released, or the suction force of holding body 81 may be released before applying suction force to stage 42. By doing so, the restraint in the surface direction of the organic EL panel P sandwiched between the stage 42 and the holder 81 is alleviated. Even if it is held tightly, it is expected that the warp or flexure will be corrected by the clamping and flattened. For this reason, it is preferable to set the force for pressing the holding body 81 against the stage 42 to a magnitude that does not interfere with the correction described above.

When the organic EL panel P is held on the stage 42, the holder 81 moves to a supply section (not shown). On the other hand, the stage 42 moves to the mark recognition position prior to the temporary pressure bonding by the temporary pressure bonding head 41 . The electronic component W held by the temporary pressure bonding head 41 is also positioned at the mark recognition position. In the state positioned at the mark recognition position, the organic EL panel P and the electronic component W are arranged such that the edge portion of the organic EL panel P on which the electrode row ER is formed and the terminal row of the electronic component W are aligned as shown in FIG. It is opposed to the edge where TR is formed with a small gap therebetween. Further, in this state, the light irradiation section 44d is positioned right above the alignment mark PM of the organic EL panel P. As shown in FIG. In such a state, light is emitted from the light irradiation unit 44d, and an image including the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W is captured by the imaging devices 44a and 44b.

The captured image is sent to the image processing section 44c, position data of each alignment mark PM and WM is obtained, and the positions of the organic EL panel P and the electronic component W are recognized. The determined position data is sent to the controller 110 . The alignment marks PM of the organic EL panel P captured in this way are captured as a silhouette image. Even if the image is captured through the resin substrate in which the PI film and the PET film of the EL panel P are bonded together, the alignment mark PM can be taken in as a clear image.

Based on the position data of the left and right alignment marks PM of the organic EL panel P and the position data of the left and right alignment marks WM of the electronic component W sent from the image processing unit 44c, the control device 110 aligns the organic EL panel P and the electronic component. A relative positional deviation in the X, Y, and θ directions with respect to the part W is obtained. Then, the control device 110 moves the organic EL panel P and the electronic component W to the temporary pressure-bonding position. At this time, the organic EL panel P and the electronic component W are aligned by controlling the tool driving section 41b and the stage driving section 42c so as to eliminate the positional deviation based on the obtained relative positional deviation. .

Specifically, from the position data of the left and right alignment marks PM of the organic EL panel P, the control device 110 determines the inclination θP of the line segment connecting these two points and the coordinates (XP, YP) of the midpoint of this line segment. Ask for Also, from the position data of the left and right alignment marks WM of the electronic component W, the control device 110 obtains the inclination θW of the line segment connecting these two points and the coordinates (XW, YW) of the midpoint of this line segment. The difference between the inclination obtained here and the coordinates of the midpoint is obtained as the relative positional deviation between the two. Based on the obtained relative positional deviation, the positional deviation is corrected as follows.

First, the difference between the slope θP of the line segment connecting the alignment marks PM of the organic EL panel P and the slope θW of the line segment connecting the alignment marks WM of the electronic component W is eliminated, that is, θP−θW=0. , the pressure tool 41a is rotated in the .theta. direction. Next, the stage 42 (stage driving section 42b) is moved so that the midpoint of the line segment connecting the alignment marks PM of the organic EL panel P coincides with the midpoint of the line segment connecting the alignment marks WM of the electronic component W. drive. At this time, when the center of rotation of the pressure tool 41a in the θ direction is shifted from the position of the midpoint of the line segment connecting the alignment marks WM of the electronic component W, the rotation of the pressure tool 41a causes: Since the position of the midpoint of the line segment is displaced in the horizontal direction by the amount of rotation of the pressure tool 41a, the movement position of the organic EL panel P is executed taking this displacement into consideration.

The edge of the organic EL panel P positioned at the temporary pressure-bonding position is supported on the upper surface of the backup tool 43a. Further, the electronic component W is positioned so that the terminal row TR faces directly above the electrode row ER of the organic EL panel P with a small gap therebetween. In this state, the pressure tool 41a is lowered by driving the tool driving portion 41b. As a result, the terminal portion of the electronic component W is heated and pressed against the electrode surface of the organic EL panel P via the anisotropic conductive tape F at a preset heating temperature, pressure, and pressure time. An electronic component W is temporarily pressure-bonded to P.

When the preset pressurizing time elapses, the suction of the electronic component W by the pressurizing tool 41a is released and the pressurizing tool 41a is lifted. The pressure tool 41 a is moved to the delivery position where the electronic component W is delivered from the second delivery device 70 . Further, the stage 42 on which the organic EL panel P to which the electronic component W is temporarily pressure-bonded is moved to the unloading position where the organic EL panel P is delivered to the second transport section 90 . At this carry-out position, the upper surface of the organic EL panel P is adsorbed and held by the holding member 91 of the second conveying unit 90 in the same manner as the holding member 81 of the first conveying unit 80 , and the pressure bonding device 50 is held. It is transported to stage 51 .

The organic EL panel P supplied to the main pressure-bonding device 50 by the second transport section 90 is transferred onto the stage 51 positioned at the carry-in position, and held on the stage 51 by suction. This transfer operation is performed in the same manner as the transfer of the organic EL panel P from the first transport section 80 to the stage 42 . At this time, the edge of the organic EL panel P to which the electronic component W is temporarily pressure-bonded is held in a state protruding from the stage 51 .

When the stage 51 holds the organic EL panel P, the stage 51 is moved to support the edge of the organic EL panel P on the upper surface of the backup tool 53a. During this movement, the position recognition unit 54 recognizes the position of the alignment mark of the organic EL panel P (a mark different from the alignment mark PM). Based on this position recognition result, the stage 51 is moved so that the electrode surface of the organic EL panel P is positioned on the upper surface of the backup tool 53a in a correct positional relationship. When the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressure tool 52a is lowered by driving the tool drive unit 52b, and the organic EL panel P is heated at a preset heating temperature, pressure, and pressure time. The electronic component W temporarily pressure-bonded to the EL panel P is finally pressure-bonded.

After the preset pressing time has elapsed, the pressing tool 52a is raised. Further, the organic EL panel P to which the electronic component W is fully pressure-bonded, that is, the stage 51 on which the display member is placed is moved to the unloading position where the organic EL panel P is transferred to the third transport section 100 . At this unloading position, the upper surface of the organic EL panel P is sucked and held by the holder 101 of the third transport unit 100, and transported to a unillustrated unloading device.

The above-described mounting operation including the temporary pressure-bonding step and the final pressure-bonding step of the electronic component W to the organic EL panel P is repeatedly performed until there are no more organic EL panels P to mount the electronic component W on. In the mounting apparatus 1 of the embodiment, while it is important to improve the positional accuracy in the temporary pressure bonding process, it is important to improve the pressure bonding strength and reliability of the anisotropic conductive tape F in the main pressure bonding process. Process times are also different. Therefore, by applying the temporary pressure bonding device 40 and the final pressure bonding device 50 to perform the temporary pressure bonding process and the final pressure bonding process, the mounting efficiency of the electronic component W can be improved. However, the mounting apparatus 1 of the embodiment is not limited to such a configuration. The final crimping device 50 may perform from the positioning process to the final crimping process.

[Action and effect of the mounting device]
In the mounting apparatus 1 of the above-described embodiment, the flexible organic EL panel P having a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less is mounted on the electronic component W. It is mounted on the stage 42 (mounting portion 42a) so that the amount of protrusion from the stage 42 of the edge to be mounted is 3 mm or more and 15 mm or less, and the alignment mark PM provided on the edge of this organic EL panel P , light is emitted from above, which is the side opposite to the imaging devices 44a and 44b, by a light emitting unit 44d. In this state, the alignment marks PM provided on the edge of the organic EL panel P and the alignment marks WM of the electronic component W held by the temporary pressure bonding head 41 are imaged by the imaging devices 44a and 44b. Further, the captured image is image-processed by the image processing unit 44c to recognize the positional relationship between the organic EL panel P and the electronic component W, and based on the position recognition result, the organic EL panel P and the electronic component W are detected by the control device 110. After the electronic component W is temporarily pressure-bonded to the organic EL panel P via the anisotropic conductive tape F, the final pressure-bonding is performed.

By doing so, when the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are detected, the edge portion of the organic EL panel P where the electrodes are formed protrudes from the stage 42 . It is possible to prevent the edges from sagging. In addition, even if the organic EL panel P is made of a resin such as PI or PET, the edges of the panel may warp or swell. By imaging the alignment mark PM as a silhouette image, the difference in brightness between the alignment mark PM and the background can be improved, so the alignment mark PM can be imaged clearly. Therefore, it is possible to reduce recognition errors of the alignment marks PM caused by drooping of the edges of the organic EL panel P and recognition errors of the alignment marks PM caused by lack of sharpness of the captured image. As a result, it is possible to improve the mounting accuracy of the electronic component W on the organic EL panel P. FIG. Therefore, even when the flexible electronic component W is mounted on the flexible organic EL panel P, the mounting precision and mounting quality can be improved.

That is, a display panel (hereinafter referred to as a liquid crystal display panel) used in the manufacture of a conventional liquid crystal display is a laminate of glass substrates having a thickness of 0.5 to 0.7 mm. High rigidity. Therefore, even if the edge of the liquid crystal display panel protrudes from the stage by several tens of millimeters and is held, the edge hardly hangs down due to its own weight.

On the other hand, in the organic EL panel P, as described above, a PI film Ka having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member on which the organic EL element is formed, is used as a supporting material. Since a thin resin substrate adhered to the PET film Kb having a thickness of about 0.1 to 0.2 mm is used, the rigidity is extremely low. For this reason, when the organic EL panel P is held with its edge protruding from the stage by several tens of millimeters, the protruding edge easily hangs down due to its own weight. When the edge of the organic EL panel P hangs down, the position of the alignment mark PM formed on the edge is shifted in the horizontal direction by that amount. Therefore, in recognizing the position of the alignment mark PM of the organic EL panel P using a camera, the recognized position is deviated.

According to experiments conducted by the inventors of the present application, when the edge of the organic EL panel P is held so as to protrude from the stage by 20 mm as in the case of a liquid crystal display panel of the same size, the edge hangs down. It was confirmed that this droop caused a positional deviation of about 4 μm in the horizontal direction (toward the stage side) in the position of the alignment mark PM. Moreover, when the edge of the organic EL panel P hangs down, the alignment mark is tilted with respect to the horizontal state. When the tilted alignment mark PM is imaged from directly below, the length of the imaged alignment mark in the tilt direction is shorter than when imaged in the horizontal state. That is, the shape of the imaged alignment mark PM is deformed by the tilt. As a result, a difference occurs in the shape of the reference mark stored in advance, and this also causes an error in the recognition position of the alignment mark PM.

When the inventors of the present application conducted an experiment to compare the error in the recognition position between the alignment mark PM held horizontally and the alignment mark PM tilted 5° with respect to the horizontal, the average of the alignment marks tilted 5° As a result, it was confirmed that an error of about 1 μm is large. The reason why the experiment was conducted with the alignment mark tilted by 5° is that when the sag that occurs when the edge portion protrudes from the stage by 20 mm was measured for a plurality of organic EL panels P, sagging of 5° or more was confirmed for all of them. is.

In view of this point, in the mounting apparatus 1 of the embodiment, as described above, the organic EL panel P having a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less is mounted on the electronic device. By placing the component W on the stage 42 (mounting section 42a) so that the amount of protrusion from the stage 42 of the edge on which the component W is mounted is 3 mm or more and 15 mm or less, the edge of the organic EL panel P that protrudes from the stage 42 It is possible to prevent dripping on the part. As a result, it is possible to suppress the occurrence of recognition errors of the alignment marks PM due to drooping of the protruding portion of the organic EL panel P from the stage 42 . That is, if the organic EL panel P has a bending elastic modulus of 2.6 GPa or more, a thickness of 50 μm or more, and a protrusion amount of 15 mm or less, the protruding portion can be prevented from sagging. If the bending elastic modulus of the protruding portion exceeds 4.0 GPa or the thickness exceeds 500 μm, the characteristics of the organic EL panel P such as flexibility and the basic characteristics as a thin display panel may deteriorate.

Furthermore, when the alignment mark PM of the organic EL panel P is imaged, if illumination is applied from the lower side where the camera is located, the alignment mark PM cannot be imaged clearly or cannot be imaged at all. A problem occurs. The irradiation conditions (irradiation light amount, irradiation angle, etc.) when illuminating from below are determined using a reference organic EL panel (for example, an organic EL panel with a flat edge, hereinafter referred to as a “reference panel”). , the conditions are set so that the alignment marks of the reference panel can be satisfactorily imaged. Even when such irradiation conditions are applied, the edge of the organic EL panel P to be actually imaged has sag or warp, and the state is different such as being inclined with respect to the edge of the reference panel. The state of reflection of illumination at the edge of the EL panel P will be different from that of the reference panel. As a result, there arises a problem that the alignment mark PM cannot be imaged clearly or cannot be imaged at all. As a result of experiments by the inventors of the present application, it has been confirmed that when the alignment mark PM cannot be clearly imaged, a maximum deviation of about 1 μm occurs in the recognition position.

Regarding this point, in the mounting apparatus 1 of the embodiment, in addition to preventing the edge portion of the organic EL panel P protruding from the stage 42 from sagging, the alignment mark PM is provided with an imaging device. A light irradiation unit 44d irradiates light from above, which is the side opposite to 44a and 44b, and a silhouette image of the alignment mark PM is captured by transmitted light. As a result, even if the organic EL panel P is made of a resin such as PI or PET, the edges may be warped or swelled, and even if the organic EL panel P is made of a resin substrate having a lower transmittance than glass, the alignment mark may be Since the brightness difference between PM and the background can be improved, it is possible to image the alignment mark PM clearly. As a result, the recognition error of the alignment mark PM can be reduced, so that the mounting accuracy of the electronic component W to the organic EL panel P can be improved.

In order to suppress the sagging or warping of the edge of the organic EL panel P, the inventors of the present application proposed that the portion (supporting surface) that supports the edge of the organic EL panel P is flattened and provided with suction holes. The fixture was attached to the stage and held so that the edges of the organic EL panel would not sag. In this state, an attempt was made to mount electronic components. The support was made of stainless steel, which is commonly used as a backup tool for OLB equipment. In addition, an observation hole for imaging that penetrates vertically with a diameter of 3 mm was provided in a portion of the support corresponding to the position of the alignment mark.

However, even if such a support is used, some types of organic EL panels cannot sufficiently satisfy the mounting accuracy of ±3 μm. In other words, when conducting experiments to confirm the mounting accuracy using multiple types of organic EL panels, it was found that some types achieved mounting accuracy within ±3 μm, while others exceeded ±3 μm. bottom.

That is, since the organic EL panel P is composed of a thin and flexible resin substrate, if it is adsorbed with a large adsorption force, an adsorption mark will be generated. The edges of the organic EL panel P are formed with fine electrodes (also called “leads”) connected to terminals of the electronic components W, although they are not used for image display. Therefore, if a suction mark is generated in this electrode portion, deformation such as bending occurs in the electrode. Since stress remains inside the deformed electrode, it is not preferable because the durability of the electrode is lowered. For this reason, it is necessary to set the size of the suction holes and the magnitude of the negative pressure acting on the suction holes within a range that does not cause suction marks on the organic EL panel. In the above experiment, suction holes with a diameter of 0.5 mm were formed in a row in the support at intervals of 2 mm, and a negative pressure of -40 kPa was applied to the suction holes. However, it has been found that, depending on the type of organic EL panel, the edges cannot be made to follow the supporting surface of the support when the suction force is set in consideration of the suction marks.

That is, depending on the type of organic EL panel, the edges may be warped or undulated, and even in the organic EL panel where such warped or undulated, the warp or undulation can be corrected by adsorption. There were some that imitated the support surface of the support, and others that did not correct warpage or undulation. It was confirmed that the mounting accuracy exceeded ±3 μm in such an organic EL panel in which warpage and undulation were not corrected. In addition, in the organic EL panel where such warp and undulation are not corrected, the degree of reflection of the illumination irradiated from the same side as the camera is different from that of the reference panel. It was found that the recognition accuracy of the alignment mark was degraded.

Furthermore, it was found that a new problem arises by providing a support and providing an observation hole for imaging in this support. That is, by providing the observation hole, when the crimping head is brought into contact with the organic EL panel through the electronic component during temporary crimping, the impression of the observation hole is generated on the organic EL panel due to the impact caused by the contact. was confirmed. Such impressions also cause deformation of the electrodes of the organic EL panel in the same manner as the above-described attraction marks, and thus degrade the mounting quality and must be avoided. At the suction hole portion of the support, no indentation was observed because the diameter was as small as 0.5 mm.

Therefore, an attempt was made to recognize the alignment mark by forming the support from glass and transmitting through the support without providing an observation hole. As a result, the occurrence of indentations could be eliminated, but it was found that there was a problem with durability. Specifically, when a repeated mounting test was performed, cracking was observed in the supporting member after the number of times of mounting exceeded 10,000. Therefore, when such a support made of glass is used, it is necessary to replace the support after about 10,000 mounting times. In such mounting, the time (takt time) required for mounting one electronic component is usually 3 to 5 seconds. It becomes a calculation to reach times. Therefore, it is necessary to replace the support every 8.3 to 13.9 hours, that is, 2 to 3 times a day.

Precise parallelism is required between the supporting member and the crimping head because it is necessary to uniformly press the electrode portion of the electronic component against the electrode portion of the organic EL panel. Although individual supports are processed to have the same shape, they have individual differences. Therefore, it is necessary to adjust the parallelism of the support with the crimping tool each time it is replaced. Therefore, the operation of the OLB device must be stopped during this adjustment, and production cannot be performed. The occurrence of such stoppages several times a day leads to a significant decrease in productivity, which is not realistic. It is also conceivable to fit a glass lid over the observation hole of the support made of stainless steel so that the supporting surface of the support is apparently flat. However, as long as the lid is made of glass, there is a problem of durability, and if there is a step between the upper surface of the lid and the support surface, there is concern that an indentation may occur, so this is not practical.

The mounting apparatus 1 of the embodiment has a problem when recognizing the alignment mark while preventing the edge of the organic EL panel P from sagging using the support as described above, that is, the impression caused by the observation hole of the support, This makes it possible to suppress deterioration in alignment mark recognition accuracy due to uncorrected warp or undulation of the supporting surface of the support, and reduction in mounting efficiency due to the durability of the glass support. That is, in addition to preventing the edge from protruding from the stage 42 of the organic EL panel P and preventing the protruding edge from drooping, the alignment mark PM is captured as a silhouette image by transmitted light. It is possible to improve the mounting accuracy and the mounting quality of the electronic component W on the organic EL panel P while avoiding the problems caused by the support as described above.

In addition, in the mounting apparatus 1 of the embodiment, the backup tool 43a used for temporary crimping is made of stainless steel, for example, and the support surface for supporting the edge of the organic EL panel P is formed flat. Therefore, it is possible to prevent the edge of the organic EL panel P from being indented during the temporary press-bonding. Moreover, since it is made of stainless steel, it is less likely to be damaged even when pressed by the temporary pressure-bonding head 41, and has excellent long-term durability, making it possible to maintain good productivity.

Further, based on the protrusion amount G of the edge of the organic EL panel P from the mounting portion 42a of the stage 42, which is stored in the storage portion 111, the control device 110 drives the stage driving portion 42b and the XZ driving portion 82. By controlling, the organic EL panel P is placed on the mounting portion 42a of the stage 42 from the holding body 81 of the first transporting portion 80 with a protrusion amount G set in the range of 3 mm or more and 15 mm or less. there is As a result, the organic EL panel P can be reliably placed on the placement portion 42a with the amount of overhang G set, and the edges of the organic EL panel P can be reliably prevented from sagging and stabilized. It is possible to further improve the recognition accuracy of the alignment mark PM. As a result, the mounting accuracy of the electronic component W to the organic EL panel P can be stably obtained, and the mounting quality of the electronic component W can be improved.

In addition, this invention is not limited to above-described embodiment. For example, an organic EL panel has been described as an example of a display panel, but the present invention is not limited to this. For example, it is possible to use a flexible electronic paper constituent member as the display panel. In short, any flexible display panel having a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less can be applied.

Further, the organic EL panel P is mounted on the mounting portion 42a by controlling the stage driving portion 42b and the XZ driving portion 82 based on the set protrusion amount G, but this is not the only option. Alternatively, the protrusion amount of the organic EL panel P may be detected, and the stage drive section 42b and the XZ drive section 82 of the first transport section 80 may be controlled so that the set protrusion amount G is achieved. In this case, for example, at the stage 42 or at the delivery position of the organic EL panel P with respect to the stage 42, a photoelectric sensor or A detector such as a laser sensor is provided, and based on the detection result of this detector, it is preferable to control the protrusion amount of the edge portion from the mounting portion 42a to the set protrusion amount G.

Instead of storing the protrusion amount G in the storage unit 111, information (product type information) regarding the product type of the display panel may be stored. In this case, a conversion table representing the relationship between the product type information of the display panel P and the protrusion amount G corresponding to the product type information is obtained and created in advance by experiments or the like, and this conversion table is stored in the storage unit 111. let me Then, based on the product type information input by an input means (not shown), it is preferable to read out the protrusion amount G corresponding to the product type information.

Further, as imaging devices of the position recognizing device 44, first and second imaging devices 44a and 44b for capturing and imaging the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W simultaneously within the same field of view are provided. Although the case of use has been described, the imaging device of the position recognition device 44 is not limited to this. For example, the first and second imaging devices 44a and 44b may separately image the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, respectively.

Further, two image pickup devices are provided, first and second image pickup devices 44a and 44b image the alignment marks WM of the electronic component W, and the other two image pickup devices image the alignment marks PM of the organic EL panel P. You can make it work. At this time, the other two imaging devices may be attached so as to image the alignment marks PM of the organic EL panel P from above instead of from below. In this case, the light irradiation section 44d is arranged at a position lower than the mounting section 42a of the stage 42, and the alignment mark PM of the organic EL panel P is irradiated with light from below. In this way, when the alignment mark PM of the organic EL panel P is imaged from above with transmitted illumination, the alignment mark P provided on the upper surface side of the organic EL panel P is directly imaged. Therefore, it is possible to obtain a greater contrast difference than when an image is captured with transmitted illumination from below through the resin base material of the organic EL panel P, and the recognition accuracy can be further improved.

Although the alignment mark PM of the organic EL panel P is imaged with transmitted illumination, the alignment mark WM of the electronic component W may also be imaged with transmitted illumination. In this case, the pressure tool 41a of the temporary crimping head 41 is provided with a light guide portion aligned with the position of the alignment mark WM of the electronic component W, and the light emitted from the light irradiation portion 44d passes through the light guide portion to the alignment mark. It is also possible to lead to WM. Of course, the light irradiation section may be provided separately, or the light irradiation section may be embedded in the pressure tool 41a.

Also, although the anisotropic conductive tape F is used to connect the organic EL panel P and the electronic component W, the present invention is not limited to this. Other connecting members such as an adhesive containing conductive particles may be used. When using an adhesive, it is possible to use a thermosetting or photocurable adhesive.

The configurations of the first to third conveying units 80, 90, 100 are not limited to those described above, and may be other configurations. For example, instead of using a porous sheet, a soft rubber or resin material such as urethane foam rubber or silicon rubber provided with a plurality of openings for adsorption may be used.

It has been described that the organic EL panel P is transported from the stage 42 of the temporary pressure bonding device 40 to the stage 51 of the main pressure bonding device 50 using the second transport section 90, but the present invention is not limited to this. For example, the stage 51 of the main pressure bonding device 50 is configured to be movable to a position close to the stage 42 of the temporary pressure bonding device 40, and the stage 51 of the main pressure bonding device 50 is moved to a position close to the stage 42 of the temporary pressure bonding device 40. Alternatively, the organic EL panel P may be transported using the first transport section 80 . That is, the first transport section 80 may also serve as the second transport section 90 .

A plurality of permanent pressure bonding devices 50 may be installed in the mounting apparatus 1 in consideration of the difference in process time between the temporary pressure bonding process and the final pressure bonding process. Further, instead of providing a plurality of main pressure bonding devices 50, a stage 51 on which a plurality of organic EL panels P can be mounted in parallel is provided in one main pressure bonding device 50, and a plurality of organic EL panels P are mounted in parallel. A final pressure bonding head 52 capable of performing final pressure bonding of the electronic components W on the panel P collectively or individually may be provided. Here, when the main pressure bonding is performed collectively, the main pressure bonding head 52 is equipped with a pressure tool 52a having a length capable of covering the entire area of the plurality of organic EL panels P placed in parallel. In the case of individual main pressure bonding, the main pressure bonding head 52 is equipped with a pressure tool 52a having a length that can cover the electronic components W to be mounted on one organic EL panel P in accordance with the mounting interval of the organic EL panels P. do. Each pressure tool 52a is preferably configured so that the pressure can be set individually.

In the above-described embodiment, the configuration in which the anisotropic conductive tape F is attached to the electronic component W has been described, but the configuration is not limited to this. The anisotropic conductive tape F may be adhered to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape sticking device 30 at the sticking position C of the intermittent rotary conveying device 20, the anisotropic conductive tape is placed on the organic EL panel P upstream of the feeding section of the organic EL panel P. It is preferable to provide an anisotropic conductive tape sticking device for sticking F. For example, a mounting device 201 as shown in FIG. 10 may be applied. FIG. 10 shows the configuration of a mounting device 201 of another embodiment.

[Mounting apparatus according to another embodiment]
The mounting device 201 shown in FIG. 10 has an anisotropic conductive tape sticking device 230, a temporary pressure bonding device 240, and a main pressure bonding device 250 arranged side by side in the X direction, and a punching device 210 is arranged behind the temporary pressure bonding device 240 in the Y direction. Further, between the temporary crimping device 240 and the punching device 210, a conveying device 260 for conveying the electronic component W is arranged. Transport units 271 , 272 , 273 and 274 for the organic EL panels P are arranged between the processing devices 230 , 240 and 250 . The mounting apparatus 201 supplies four organic EL panels P each and processes them in each processing apparatus. The punching device 210 punches out the electronic components W from the carrier tape T, and has the same configuration as the punching device 10 described in the above embodiment.

The anisotropic conductive tape sticking device 230 sticks the anisotropic conductive tape F to the organic EL panel P. FIG. In the anisotropic conductive tape sticking device 230, two mounting portions 231 and 232 for holding two organic EL panels P side by side in the X direction are arranged side by side in the X direction. These mounting parts 231 and 232 are provided so as to be movable in the XYZθ directions. Adhering units 233 and 234 for the anisotropic conductive tape F are arranged corresponding to the two mounting portions 231 and 232, respectively. The placement sections 231 and 232 sequentially position the organic EL panels P on the placement sections 231 and 232 at the sticking positions of the sticking units 233 and 234 corresponding thereto. Each sticking unit 233, 234 sticks the anisotropic conductive tape F to the organic EL panel P positioned at the sticking position.

The temporary pressure-bonding device 240 temporarily pressure-bonds the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is adhered. The temporary pressure-bonding device 240 includes a mounting portion 241 that holds four organic EL panels P arranged in the X direction, a temporary pressure-bonding head 242 that temporarily pressure-bonds the electronic component W to the organic EL panel P held by the mounting portion 241, A backup tool (not shown) is provided to support the organic EL panel P from below when the electronic component W is temporarily pressure-bonded to the organic EL panel P by the temporary pressure-bonding head 242 . The mounting portion 241 is provided movably in the XYZθ directions, and sequentially positions the four organic EL panels P on the mounting portion 241 to temporary pressure-bonding positions by the temporary pressure-bonding head 242 . The temporary pressure-bonding head 242 sequentially temporarily pressure-bonds the electronic components W to the organic EL panel P positioned at the temporary pressure-bonding position. Needless to say, the temporary pressure bonding device 240 includes a position recognition device similar to the temporary pressure bonding device 40 described in the above embodiment.

Here, the electronic components W punched by the punching device 210 are sequentially supplied to the temporary pressure bonding head 242 by the conveying device 260 . That is, the conveying device 260 is movable in the XYZθ directions by an XYZθ driving unit 261 and includes a receiving unit 262 that sucks and holds the electronic component W from below. hand over to

The final pressure-bonding device 250 performs final pressure-bonding of the electronic component W temporarily pressure-bonded to the organic EL panel P. FIG. The pressure-bonding device 250 has four mounting portions 251, 252, 253, and 254 arranged side by side in the X direction for individually holding the organic EL panels P one by one. Four main pressure bonding heads 255 , 256 , 257 and 258 are provided corresponding to the four mounting portions 251 , 252 , 253 and 254 . The main pressure-bonding heads 255, 256, 257, and 258 are provided so that the pressing force can be individually adjusted, and are collectively provided so that they can move up and down. The individual mounting portions 251 , 252 , 253 , 254 are movable in the XYZθ directions, and the organic EL panel P can be positioned with respect to the corresponding main pressure bonding heads 255 , 256 , 257 , 258 . The four main pressure bonding heads 255 , 256 , 257 and 258 collectively perform the main pressure bonding on the four organic EL panels P positioned by the four mounting portions 251 , 252 , 253 and 254 .

The transport units 271, 272, 273, and 274 simultaneously transfer four organic EL panels P to and from the processing devices 230, 240, and 250, respectively. In other words, each of the transport units 271, 272, 273, and 274 is formed by arranging four holding units in parallel in the X direction for sucking and holding the organic EL panel P from above. Then, the transport section 271 simultaneously delivers four organic EL panels P from a supply section (not shown) to the anisotropic conductive tape sticking device 230 . The conveying unit 272 simultaneously transfers four organic EL panels P from the anisotropic conductive tape sticking device 230 to the temporary pressure bonding device 240 . The conveying unit 273 simultaneously transfers four organic EL panels P from the temporary pressure-bonding device 240 to the main pressure-bonding device 250 . The conveying unit 274 simultaneously unloads the four organic EL panels P from the main pressure-bonding device 250 to an unillustrated unillustrated unloading unit. The present invention can also be applied to the mounting apparatus 201 having such a configuration.

Next, examples of the present invention and their evaluation results will be described.

(Example 1)
Using the mounting apparatus 1 of the above-described embodiment, an experiment was conducted to confirm mounting accuracy by TEG (Test Element Group) under the following conditions. Here, TEG is an evaluation member produced for testing, and an evaluation member for the organic EL panel P was produced here. Specifically, a PI film having a size equivalent to 5 inches (120 mm × 65 mm) and a thickness of 0.03 mm (30 µm) was coated with a PET film having a size equivalent to 5 inches and a thickness of 0.20 mm (200 µm). A TEG for an organic EL panel was produced by bonding using an optical ultraviolet curable resin. PET has a flexural modulus of 3.07 GPa and PI has a flexural modulus of 3.5 GPa. From the ratio of both thicknesses, the flexural modulus of the organic EL panel P was estimated to be approximately 3.1 GPa. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was used. The TEG of the organic EL panel P is simply referred to as the organic EL panel P hereinafter. The target accuracy was ±3 μm, which is the general accuracy required for organic EL panels used in display panels for smartphones.

<Experimental conditions>
Temporary crimping head heater: OFF
Takt time: 10 seconds (However, the moving speed of the temporary crimping tool 41a and the mounting portion 42a was the same as in the case of mounting with a takt time of 5 seconds.)
Repeat time (number of times): 2.8 hours (1000 times)

In the experiment, first, the organic EL panel P is placed on the placement portion 42a while each is in the standby position, and the electronic component W is held by the pressure tool 41a. The standby position is a supply position for receiving the organic EL panel P from the first transport section 80 for the mounting section 42a, and a position for receiving the electronic component W from the second delivery device 70 for the pressure tool 41a. From this state, the organic EL panel P and the electronic component W are positioned at the mark recognition position prior to temporary pressure bonding. At this time, the pressure head 41a is positioned while being rotated in the horizontal direction of θ=+5°. This is for confirming the correction accuracy of the rotation deviation. The protrusion amount G of the edge of the organic EL panel P was set to 4 mm.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are recognized using the first and second imaging devices 44a and 43b, and the alignment marks of the organic EL panel P and the electronic component W are recognized based on this recognition result. Align. In this alignment, the edge of the electronic component W is not superimposed on the edge of the organic EL panel P, but the edge of the organic EL panel P and the edge of the electronic component W are separated by a small distance. It is done in a state of facing each other at a distance. Specifically, the alignment is performed so that the alignment marks PM and WM are separated from each other by a distance of 3 mm. Since the distances from the alignment marks PM and WM to the edges are approximately 0.6 to 1.2 mm, respectively, the edges are arranged at intervals of 0.6 to 1.8 mm.

After the alignment is completed, the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are placed in the same field of view from below and captured simultaneously using the first and second imaging devices 44a and 44b. Then, the relative positional deviation between the organic EL panel P and the electronic component W is recognized. Then, the relative positional deviation obtained from this recognition result was recorded as the mounting accuracy. Note that the alignment marks PM and WM are aligned so that they are separated from each other by a distance of 3 mm. Therefore, in an ideal positioning state, the alignment marks PM and WM are shifted by 3 mm in the Y-axis direction. .

As a result, the maximum value of positional deviation in the X-axis direction was 0.7 μm, and the minimum value was −0.4 μm. Further, the maximum value of positional deviation in the Y-axis direction was 0.5 μm, and the minimum value was −0.9 μm. Both were within ±3 μm, which is the target accuracy.

(Example 2)
In Example 2, an experiment was conducted under the same conditions as in Example 1, except that the protrusion amount G was set to 15 mm. As a result, the maximum value of positional deviation in the X-axis direction was 1.6 μm, and the minimum value was −1.1 μm. Further, the maximum value of positional deviation in the Y-axis direction was 0.9 μm, and the minimum value was −2.3 μm. Both were within ±3 μm, which is the target accuracy.

(Comparative example 1)
In Comparative Example 1, an experiment was conducted under the same conditions as in Example 1, except that the protrusion amount G was set to 20 mm. As a result, the maximum value of positional deviation in the X-axis direction (maximum positional deviation in the positive direction) was 2.7 μm, and the minimum value (maximum positional deviation in the negative direction) was −2.0 μm. Further, the maximum value of positional deviation in the Y-axis direction was 1.5 μm, and the minimum value was −5.8 μm. The positional deviation in the X-axis direction was within the target accuracy of ±3 μm, but the positional deviation in the Y-axis direction greatly deviated from the target accuracy of ±3 μm.

Table 1 and FIG. 11 show the measurement results of Example 1 described above. Table 2 and FIG. 12 show the measurement results of Comparative Example 1. Tables 1 and 2 show the average value (1) of the 1st to 10th data in the 1000 data acquired during the repetition time, and the average value (2) of the 101st to 110th data after that. In the same way, the average values ((3) to (10)) of the data for 10 times are shown as the "relative positional deviation recognition result" for every 100 times. "Difference from the measurement result of (1)" in Table 1 is the value obtained by subtracting the average value (1) from the average values ((2) to (10)) of the data for every 100 times. 11 and 12 show variations in "difference from the measurement result of (1)". As is clear from the comparison between Table 1 and FIG. 11 and Table 2 and FIG. 12, Example 1 has significantly reduced variations in mounting accuracy compared to Comparative Example 1. FIG. Therefore, it can be seen that the mounting accuracy of the flexible electronic component on the flexible display panel can be maintained for a long period of time.

(Examples 3 and 4)
As Examples 3 and 4, using the mounting apparatus 1 of the above-described embodiment, another TEG was produced and an experiment was conducted to confirm the mounting accuracy. Assuming that the organic EL panel P has an optical film attached to the display portion, a TEG was produced by attaching a PEN film to a portion corresponding to the display portion. More specifically, a PEN film having a size of 114 mm × 65 mm and a thickness of 0.15 mm (125 µm) was pasted to the TEG used in Examples 1 and 2 using an optical ultraviolet curable resin. A TEG was produced. This PEN film was arranged so that the edge opposite to the edge where the electronic component W was mounted was aligned with the TEG used in Examples 1 and 2, and the edge on the edge where the electronic component W was mounted and the edge of the PEN film so that a gap of 6 mm was formed between them. PEN has a flexural modulus of 2.2 GPa, PI has a flexural modulus of 3.5 GPa, and PET has a flexural modulus of 3.07 GPa. From the thickness ratio of the three, the bending elastic modulus of the organic EL panel P was estimated to be about 2.8 GPa. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was used as in Examples 1 and 2.

In Example 3, an experiment was conducted under the same conditions as in Example 1. As a result, the maximum value of positional deviation in the X-axis direction was 0.9 μm, and the minimum value was −0.3 μm. Further, the maximum value of positional deviation in the Y-axis direction was 1.0 μm, and the minimum value was −0.7 μm. Although inferior to Example 1, all were within the target accuracy of ±3 μm. In Example 3, the protruding amount G was 4 mm, and the portion protruding from the stage 21 in the organic EL panel P was only the edge portion where no PEN film was present. Guess.

In Example 4, an experiment was conducted under the same conditions as in Example 1, except that the protrusion amount G was set to 12 mm. By setting the protrusion amount G to 12 mm, the portion of the organic EL panel P where the PEN film is bonded protrudes by 6 mm. As a result, the maximum value of positional deviation in the X-axis direction was 1.9 μm, and the minimum value was −1.5 μm. Further, the maximum value of positional deviation in the Y direction was 2.6 μm, and the minimum value was −1.6 μm. Both were within ±3 μm, which is the target accuracy.

(Comparative example 2)
In Comparative Example 2, an experiment was conducted under the same conditions as in Example 1, except that the protrusion amount G was set to 20 mm. As a result, the maximum value of positional deviation in the X-axis direction was 2.8 μm, and the minimum value was −2.3 μm. Further, the maximum value of positional deviation in the Y direction was 8.2 μm, and the minimum value was −0.6 μm. Although the positional deviation in the X-axis direction was within ±3 μm, which is the target accuracy, the positional deviation in the Y-axis direction greatly deviated from the target accuracy of ±3 μm.

From these results, it can be seen that the mounting accuracy can be improved as the protrusion amount G of the edge portion of the organic EL panel P from the mounting portion 42a of the stage 42 is shorter. It was also confirmed that the mounting accuracy can be kept within ±3 μm by setting the protrusion amount to 15 mm or less.

It should be noted that while several embodiments of the invention have been described, these embodiments are provided by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

REFERENCE SIGNS LIST 1 mounting device 10 (10A, 10B) punching device 12 mold device 20 intermittent rotary conveying device 21 arm 24 holding head 30 anisotropic conductive tape sticking device (bonding Member sticking device), 32: Sticking head, 40: Temporary pressure bonding device, 41: Temporary pressure bonding head, 42: Stage, 42a: Mounting unit, 42b: Stage driving unit, 43: Backup unit, 43a: Backup tool, 44 Position recognition device 44a First imaging device 44b Second imaging device 44c Image processing device 44d Light irradiation unit 50 Final pressure bonding device 51 Stage 52 Final pressure bonding head 53... Backup part 60... First delivery device 61... Receiving part 70... Second delivery device 71... Receiving part 80... First conveying part 81... Holder 81a... Electrode surface adsorption block , 81b... display area adsorption unit, 90... second conveying unit, 91... holder, 100... third conveying unit, 101... holder, 110... control device, 111... storage unit, F... anisotropic conduction Tape, P... organic EL panel, W... electronic component.

Claims (4)

A plurality of terminals arranged corresponding to the plurality of electrodes of the flexible electronic component are connected to the plurality of electrodes arranged at the edge of the flexible display panel via a bonding member. An electronic component mounting apparatus for mounting the electronic component on the display panel by connecting,
a horizontally movable stage on which the display panel is placed so that the edge protrudes;
a transport unit that supplies the display panel to the stage;
a backup unit that supports the edge of the display panel placed on the stage from below;
a horizontally and vertically movable thermocompression bonding head that holds the electronic component from above and thermocompresses the electronic component to the top surface of the edge supported by the backup unit;
Imaging of an alignment mark provided on the edge portion and an alignment mark provided on the electronic component before the edge portion of the display panel protruding from the stage is supported by the backup unit. a position recognition device that recognizes the positional relationship between the display panel and the electronic component, the position recognition device comprising: a device;
with
The edge of the display panel protruding from the stage has a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less,
Based on the protrusion amount of the edge of the display panel set in advance in the range of 3 mm or more and 15 mm or less, the display panel is placed so that the edge protrudes from the stage in the range of 3 mm or more and 15 mm or less. controlling the movement of the stage and the transport section;
Further, based on the positional relationship recognized by the position recognition device, the relative positions of the stage and the thermocompression bonding head are adjusted so that the positions of the display panel and the electronic component are aligned, and the thermal compression bonding head is adjusted. A control device for controlling the stage and the thermocompression head so that the electronic component is thermocompression bonded to the display panel by the compression head,
An electronic component mounting apparatus comprising: The imaging device of the position recognition device simultaneously captures and captures an image of the alignment mark on the display panel placed on the stage and an image of the alignment mark on the electronic component within the same field of view. Item 1. The electronic component mounting apparatus according to item 1. A mounting step of placing a flexible display panel on a stage so that an edge portion having a plurality of electrodes protrudes in a range of 3 mm or more and 15 mm or less, wherein the display panel is placed on the stage. the edge protruding from the stage has a thickness of 50 μm or more and 500 μm or less, and the bending elastic modulus of the portion of the display panel that protrudes from the stage is 2.6 GPa or more and 4.0 GPa or less;
a holding step of holding a flexible electronic component having a plurality of terminals provided corresponding to the plurality of electrodes on a thermocompression bonding head;
a supporting step of supporting the edge of the display panel with a backup unit;
capturing an image of an alignment mark provided at the edge of the display panel placed on the stage while irradiating the alignment mark with light from a side opposite to the side on which the image is captured before the supporting step; position recognition for recognizing a positional relationship between the display panel and the electronic component based on images of the alignment marks provided on the electronic component held by the thermocompression head; process and
Based on the positional relationship recognized in the position recognition step, the relative position between the stage and the thermocompression head is adjusted, and after the support step, the electronic component is attached to the edge of the display panel by the thermocompression head. A thermocompression bonding step of thermocompression bonding to the part,
A method of manufacturing a display member, comprising manufacturing a display member in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via connection members. 4. The display member according to claim 3, wherein the display member is continuously manufactured by repeatedly performing the placing step, the holding step, the supporting step, the position recognition step, and the thermocompression bonding step. manufacturing method.

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