JP2774587B2 - Teaching method in TAB component mounting device - Google Patents

Description

The present invention relates to a TAB component mounting apparatus for mounting a carrier tape component as a TAB component on a terminal portion of a liquid crystal substrate.
More particularly, the present invention relates to a teaching method for positioning a liquid crystal substrate and a TAB component.

(Prior Art) For example, a carrier tape component (hereinafter, referred to as a carrier tape component), which is a TAB component in which an IC chip is incorporated in a tape, is usually wound around a reel or the like as a carrier tape. Then, the carrier tape parts are transported to, for example, a liquid crystal substrate (LCD) for a word processor or a liquid crystal television.
To be implemented.

In other words, with the miniaturization of liquid crystal display devices, a method of directly connecting outer leads of a carrier tape component to terminal portions of a liquid crystal substrate has been implemented. However, in the case of an A4 size liquid crystal substrate, the number of carrier tape components connected to its terminals is as large as 12, for example, whereas the terminal pitch is as narrow as about 0.25 mm (minimum 0.1 mm). And are temporarily connected one by one.

However, manual alignment is cumbersome and inefficient, and high-precision alignment is not possible.
Prone to poor connection.

(Problems to be Solved by the Invention) Therefore, the positions of the liquid crystal substrate and the carrier tape component are detected by using an optical system such as a CCD (Charge Coupled Device) camera, and the position is corrected.

In practice, the operator teaches the mounting position of the carrier tape component with respect to the liquid crystal substrate and stores it in the control circuit of the apparatus. Then, an operation is performed to approach the position by correction or the like using the optical system.

However, the liquid crystal substrate is made of a glass liquid crystal cell,
Since it is molded with dimensions that vary within the range of tolerance, if the mounting position is taught using the liquid crystal substrates that are actually joined, the teaching position will also vary as many liquid crystal substrates are joined. This causes a decrease in accuracy.

For this purpose, a liquid crystal substrate as a reference for teaching, that is, a so-called master substrate, is usually manufactured, and teaching is usually performed using the master substrate.

However, such a master substrate must be separately manufactured as a matter of course if the type of the liquid crystal substrate is different, and a time for selecting each time and a time for storing and managing these are newly required. Very cumbersome.

The present invention has been made in view of the above circumstances, and an object thereof is to make it possible to directly teach from a liquid crystal substrate to be actually mounted, thereby eliminating the need for a liquid crystal substrate serving as a plurality of types of teaching standards, and It is an object of the present invention to provide a teaching method in a TAB component mounting apparatus for simplifying the above.

[Structure of the Invention] (Means and Actions for Solving the Problems) In order to achieve the above object, the present invention provides a substrate mounting stage that holds a liquid crystal substrate with a terminal portion protruding and moves in the XYθ axis direction. And a mounting device that holds the TAB component and mounts an outer lead portion formed on the TAB component to a terminal portion of the liquid crystal substrate protruding from the substrate mounting stage, and an image of the terminal portion of the liquid crystal substrate, and In a teaching method in a mounting device for a TAB component having an optical system for imaging the terminal portion of the liquid crystal substrate and the outer lead of the TAB component in the same field of view, the alignment mark provided on the liquid crystal substrate by the optical system is provided. An imaging step, a step of detecting the position of the alignment mark based on the imaging result, and a step of tilting the liquid crystal substrate in the θ direction based on the position of the alignment mark. And correcting the inclination of the liquid crystal substrate on the substrate mounting stage in the θ direction by moving the θ table of the substrate mounting stage based on the calculated value of the inclination in the θ direction. Calculating the position change in the direction and the Y direction; moving the X table and the Y table of the substrate mounting stage so as to cancel out the calculated position change in the X direction and the Y direction; Moving the substrate mounting stage to a position at which the TAB component and the liquid crystal substrate are mounted after all the steps have been performed and teaching the TAB component and the liquid crystal substrate. .

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The substrate mounting stage 1 shown in FIG. 1 and FIG.
It is composed of a table 2, a Y table 3, and a θ table 4. A jig 6 for holding a liquid crystal substrate 5 is provided on the θ table 4. Therefore, the liquid crystal substrate 5 is movable in the XY and θ directions by the substrate mounting stage 1, and the terminal portions 7 are held in a state of protruding laterally from the jig 6.

The substrate mounting stage 1 is provided at the front of a base 8 of a mounting apparatus, and at the rear thereof, a TA on which an IC chip is mounted is mounted.
A supply unit 9 for supplying a carrier tape T as a B component is provided. In this embodiment, the first carrier tape supply unit 10a and the second carrier tape supply unit 10b are of a double type in which they are arranged side by side and have the same structure.
Explaining one, it is configured as shown in FIG. 11 is a supply reel, and 12 is a spacer tape take-up reel. A carrier tape T is wound around the supply reel 11 together with the spacer tape 13 and is sequentially fed out. A rear sprocket for regulating the position of the tension roller 14 and the carrier tape T in the width direction is provided on the supply reel 11.
15 is provided, and a take-up reel 16 for winding the punched tape is provided. Further, a front sprocket 17 for feeding the carrier tape T by a fixed length is provided on the base 8 at the same height position as the rear sprocket 15. And the spacer tape
13 is fed out from the supply reel 11 and wound up on the spacer tape take-up reel 12. The carrier tape T unwound from the supply reel 11 is wound in the order of a tension roller 14, a rear sprocket 15, and a front sprocket 17, and a punched tape punched by means described later is wound around a take-up reel 16. Has become.

A punching mechanism 19 for punching the carrier tape T into a predetermined shape is provided in the carrier tape running path 18 located between the rear sprocket 15 and the sprocket 17. The punching mechanism 19 includes an upper mold 20 and a lower mold 21 sandwiching the carrier tape running path 18 up and down, and the upper mold 20 is moved up and down by an air cylinder 22 to move the carrier tape component 10.
Punching.

Further, as shown in FIG. 4, the lower mold 21 is placed on a moving table 23 orthogonal to the carrier tape running path 18, and reciprocates the lower mold 21 between a punching position 24 and a takeout position 25. It is configured to exercise. Note that a fixing portion 26 for fixing the punched carrier tape component 10 is provided on the upper surface of the lower mold 21, and sucks and holds the carrier tape component 10 by, for example, vacuum suction.

Therefore, the first carrier tape supply unit 10a and the second
In the case of a double type in which the carrier tape supply units 10b are arranged side by side, the take-out position 25 is provided between both punching mechanisms 19, 19, and the first carrier tape supply unit 10a and the second
Different types of carrier tape components 10 can be supplied to the take-out position 25 from the carrier tape supply unit 10b. Moreover, since the lower mold 21 is placed on the moving table 23 and reciprocates between the punching position 24 and the take-out position 25, when one lower mold 21 is located at the punching position 24, The lower die 21 is located at the take-out position 25, and the carrier tape component 10 is taken out from the first carrier tape supply unit 10a and the second carrier tape supply unit 10b alternately at the take-out position 2.
5 can be supplied.

Further, the take-out position 25 and the substrate mounting stage 1
A temporary positioning stage 33 is provided between them. The temporary positioning stage 33 has a rotation axis 35 perpendicular to the base 8 as shown in FIG.
Has a positioning table 36 at the upper end thereof. The positioning table 36 is rotatable by a pulse motor (not shown) directly connected to the rotation shaft 35, and the carrier tape component 10 is vacuum-adsorbed to the upper surface thereof. Further, an L-shaped pusher lever (not shown) is provided on the positioning table 36, and the carrier tape component sucked and held on the positioning table 36 is provided.
A positioning mechanism 41 for temporarily positioning the carrier tape component 10 by pushing the edge of the tenth is configured.

A transport mechanism 42 is provided above the supply section 9 and the temporary positioning table 33. A description will be given of the transport mechanism 42. Reference numeral 43 denotes a guide rail, which is provided between the take-out position 25 of the supply unit 9 and the mounting position 44 of the liquid crystal substrate 5 held on the substrate mounting stage 1. I have. A transfer robot 45 is movably provided on the guide rail 43, and a transfer head is provided on the transfer robot 45.
46 and a mounting head 47 are provided. This transfer head 46
The distance between the transfer head 46 and the mounting head 47 is equal to the distance between the take-out position 25 and the temporary positioning stage 33.
The mounting head 47 faces the temporary positioning stage 33 when faces the take-out position 25. Furthermore, the transfer head 47
The mounting head 47 and the mounting head 47 have basically the same structure, have vacuum suction portions 46a and 47a on the lower surface, and are moved up and down by a cylinder 49 along a vertical guide 48.

An image of a terminal portion 7 of a liquid crystal substrate 5 held on the substrate mounting stage 1 at a mounting position protruding from the stage 1 is imaged at a lower portion opposed to the mounting position 44, and a terminal of the liquid crystal substrate 5 and the mounting head are mounted. A camera 51 is provided as an optical system for picking up an image of a part of each terminal of the carrier tape component 10 to be vacuum-sucked in the same field of view. Then, the camera 51 detects alignment marks a, which are provided at the terminal portions 7 of the liquid crystal substrate 5 as shown in FIG. 5 and are, for example, deformed cross marks as shown in FIG. Recognize by image processing. Further, the amount of positional deviation between the terminals of the liquid crystal substrate 5 and the terminals of the carrier tape component 10 is recognized by image processing, and the substrate mounting stage 1 is moved to correct the amount of deviation and align the positions.

A backup mechanism 52 is provided below the mounting position 44. The backup mechanism 2 is provided with a guide member 54 that can move up and down with respect to the base 53. The guide member 54 has a holding table 55 that can move linearly in the horizontal direction. The holding table 55 can move forward and backward with respect to the camera 51 provided opposite to the lower part of the mounting position 44, and holds the pressing force of the mounting head 47 against the liquid crystal substrate 5 from above. The backup mechanism 52 and the mounting head 47 constitute a mounting device 56.

Next, the operation of the carrier tape component mounting apparatus configured as described above will be described.

The liquid crystal substrate 5 is held on the jig 6 of the substrate mounting stage 1, and the terminal 7 is located at the mounting position 44. In this state, the camera 51 moves the alignment marks a, a at both ends in the longitudinal direction of the terminal portion 7 of the liquid crystal substrate 5 to capture an image, and teaches the position of the electrode pattern with respect to the outer diameter of the liquid crystal substrate 5 by image processing.

To be more specific, the liquid crystal substrate 5 to be actually mounted is arbitrarily selected in advance, a camera 51 is used to image the alignment marks a, a provided on the liquid crystal substrate 5, and the alignment mark is obtained based on the captured data. Detect the positions of a and a.
Then, the inclination of the liquid crystal substrate 5 in the θ direction is calculated from the position where the alignment marks a, a are detected, and the θ table 4 of the substrate mounting stage 1 is calculated based on the calculated inclination value in the θ direction.
Is moved in the θ direction, and the liquid crystal substrate 5 on the substrate mounting stage 1 is moved.
Is corrected in the θ direction. Since the position in the X direction and the position in the Y direction are changed by performing such correction in the θ direction, the respective amounts of change are calculated. The X table 2 and the Y table 3 of the substrate mounting stage 1 are moved to correct the position in the same direction so as to offset the calculated position change in the X and Y directions. After performing these corrections, the board mounting stage 1 is moved to a position where the terminal of the carrier tape component 10 and the terminal of the liquid crystal substrate 5 are joined, and teaching is performed.

Such a teaching method is softwareized, and FIG. 7 shows a series of process flows. Here, the only teaching method performed so far is simply part B, and the teaching is simplified by adding a new part A this time. Moreover,
Since the dispersion due to the tolerance of the liquid crystal substrate 5 is corrected when actually teaching the bonding position, the teaching accuracy is ensured even when a large number of liquid crystal substrates 5 are continuously bonded.

On the other hand, the carrier tape component 10 to be mounted on the liquid crystal substrate 5 includes first and second carrier tape supply units 10.
a and 10b are supplied alternately to the take-out position 25. That is, the carrier tape T fed from the supply reel 11 travels in the order of the tension roller 14, the rear sprocket 15, and the sprocket 17. The rear sprocket 15
Since the punching mechanism 19 for punching the carrier tape component 10 into a predetermined shape is installed in the carrier tape running path 18 located between the sprocket 17 and the sprocket 17, the upper mold 20 is lowered by the air cylinder 22, The carrier tape component 10 is punched between the lower die 21. The punched carrier tape component 10 is fixed to the fixing portion 26 of the lower die 21, and the carrier table component 10 moves to the removal position 25 by the movement of the moving table 23. Since the first carrier tape supply section 10a and the second carrier tape supply section 10b are provided side by side, the carrier tape component 10 is supplied to the take-out position 25 alternately from both punching mechanisms 19,19.

When the transport mechanism 42 operates, the transfer head 46 faces the take-out position 25, sucks the carrier tape component 10 by the vacuum suction part 46a, and places the carrier tape component 10 on the positioning table 36 of the temporary positioning stage 33. . When the carrier tape component 10 is placed on the positioning table 36,
The pressure lever 39 moves in the direction of the positioning table 36 in FIG. 2, and pushes one end surface of the carrier tape component 10 to perform positioning in the Y direction. From this state, the transport mechanism 42
Is operated again, and the transfer robot 45 moves rightward along the guide rail 43, the transfer head 46 is moved to the support table 32.
The mounting head 47 faces the positioning table 36 of the temporary positioning stage 33. When the transfer head 46 and the mounting head 47 are simultaneously lowered, the transfer head 46 sucks the carrier tape component 10 on the support table 32, and the mounting head 47 removes the carrier tape component 10 positioned on the positioning table 36. Adsorb.

Next, after the transfer head 46 and the mounting head 47 simultaneously move up, when the transfer robot 45 moves a predetermined distance to the left, the carrier tape component 10 is attracted to the mounting head 47 and faces the mounting position 44. Here, the distance between the terminal surface of the liquid crystal substrate 5 and the terminal surface of the carrier tape component 10 is maintained at 0.5 to 1.0 mm, and a part of each of the terminal of the liquid crystal substrate 5 and the terminal of the carrier tape component 10 is made identical by the camera 51. An image is taken in the field of view, the amount of relative positional deviation between both terminals is detected by image processing, and the substrate mounting stage 1 is moved in the XY and θ directions to perform positioning.

Next, when the backup mechanism 52 operates and the holding table 55 moves forward, the holding table 55 faces the lower surface of the terminal portion 7 of the liquid crystal substrate 5 and supports the pressing force from above the mounting head 47 from below. . Then, the carrier tape component 10 adsorbed to the mounting head 47 is mounted on the terminal portion 7 of the liquid crystal substrate 5 as the mounting head 47 descends. At this time, the terminal portion 7 has an adhesive property such as an ACF (Anisotropic Conductive Film, Since an isotropic conductive film is applied, temporary connection is performed by pressing with a load of about 10 to 20 kg.

When the temporary connection of the carrier tape component 10 to the liquid crystal substrate 5 is completed, the vacuum suction force of the mounting head 47 is released, the mounting head 47 rises, and then moves rightward with the transfer head 46 by the transport mechanism 42. . Then, the carrier tape component 10 is sucked, and the mounting head 47 sucks the carrier tape component 10 temporarily positioned on the temporary positioning stage 33. Then, by repeating the above operation again, the mounting of the carrier tape component 10 on the liquid crystal substrate 5 can be automatically performed.

In the above-described embodiment, one camera is provided as the optical system 51, and the terminal unit 7 at the mounting position protruding from the substrate mounting stage 1 of the liquid crystal substrate 5 is imaged. Although the terminal of the carrier tape component 10 to be vacuum-sucked is picked up in the same field of view, the present invention is not limited to this. That is, a camera which is a dedicated optical system for imaging the terminal portion 7 at a mounting position protruding from the substrate mounting stage 1 of the liquid crystal substrate 5, and an image of the terminal of the liquid crystal substrate 5 and the terminal of the carrier tape component 10 in the same field of view. The present invention can also be applied to a mounting device having two cameras, a camera which is a dedicated optical system for performing the operation.

[Effects of the Invention] As described above, according to the present invention, when teaching the bonding position between the TAB component and the liquid crystal substrate, the liquid crystal substrate to be actually mounted is arbitrarily selected in advance, and the position is selected from here. Since the alignment mark is detected and the position correction in the θ direction and the X and Y directions is performed, the liquid crystal substrate to be mounted can be replaced without preparing a separate liquid crystal substrate as a teaching reference. Accordingly, there is no need to manufacture, select, store, and manage a liquid crystal substrate serving as a plurality of types of teaching standards, and the teaching method is simplified.

[Brief description of the drawings]

The drawings show an embodiment of the present invention, FIG. 1 is a perspective view of a carrier tape component mounting apparatus, FIG. 2 is a side view of the same, FIG. 3 is a schematic side view of a carrier tape component supply unit, FIG. 4 is a schematic plan view showing a relationship between a punching mechanism and a take-out position, FIG. 5 is an explanatory view of alignment between a liquid crystal substrate and a TAB component, FIG. 6 is an enlarged view of an alignment mark provided on the liquid crystal substrate, FIG. 7 is a flowchart of the teaching method. 7 ... Terminal part, 5 ... Liquid crystal substrate, 1 ... Substrate mounting stage, T ... Carrier tape, 10 ... TAB component (carrier tape component), 56 ... Mounting device, 51 ... Optical system (camera) , A ... alignment mark.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 311

Claims (1)

(57) [Claims] 1. A substrate mounting stage that holds a liquid crystal substrate in a state in which a terminal portion protrudes and moves in the XYθ axis direction, and holds a TAB component and an outer lead portion formed on the TAB component is mounted on the substrate mounting stage. A mounting device to be mounted on a terminal portion of a liquid crystal substrate protruded from an optical system for imaging the terminal portion of the liquid crystal substrate, and imaging the terminal portion of the liquid crystal substrate and the outer lead of the TAB component in the same field of view. In the teaching method in the provided TAB component mounting apparatus, a step of imaging the alignment mark provided on the liquid crystal substrate by the optical system; a step of detecting a position of the alignment mark based on the imaging result; Calculating the tilt of the liquid crystal substrate in the θ direction based on the position of the alignment mark; and calculating the θ table of the substrate mounting stage based on the calculated value of the tilt in the θ direction. Moving and correcting the inclination of the liquid crystal substrate on the substrate mounting stage in the θ direction; calculating the position change in the X and Y directions caused by the correction in the θ direction; and the calculated X and Y directions Moving the X table and the Y table of the substrate mounting stage so as to offset the change in position, and performing the position correction. After performing all of these steps, mounting the substrate at the position where the TAB component and the liquid crystal substrate are mounted. And a step of teaching by moving a stage.