JP2825300B2 - Carrier tape component mounting device - Google Patents

Description

The present invention relates to a carrier tape component mounting apparatus for mounting a carrier tape component on a terminal portion of a liquid crystal substrate.

(Prior Art) For example, a carrier tape component in which an IC is incorporated in a tape is usually wound around a reel or the like. Then, the carrier tape component is unreeled from a reel, punched out by a die or the like, and then packed and stored in a tray or the like.

When mounting the carrier tape components on a liquid crystal substrate, an operator takes out the carrier tape components from the tray and mounts them one by one by hand.

In other words, with the miniaturization of liquid crystal display devices, a method of directly connecting outer leads of a carrier tape component to terminal portions of a liquid crystal substrate has been implemented. However, when it comes to an A4 size liquid crystal substrate, the number of carrier tape components connected to its terminals is as large as 12 and the terminal pitch is as narrow as 0.25 mm.
In the related art, temporary connection is performed by manually adjusting the positions one by one.

However, manual alignment is cumbersome and inefficient, and high-precision alignment is not possible.
Prone to poor connection.

Conventionally, when aligning the terminal portion of the carrier tape component with the terminal portion of the liquid crystal substrate, each terminal portion is detected by a CCD camera (hereinafter simply referred to as a camera), which is a dedicated optical system, and the same screen is used. The image is taken in the same field of view and photographed above. For example, a camera for imaging the terminal portion of the liquid crystal substrate is arranged below the mounting position,
A camera for imaging the terminal portion of the carrier tape component is arranged above the mounting position. Then, the relative positional deviation between the two terminals is detected by image processing to perform the alignment.

However, the camera is very expensive,
Providing a table adversely affects the cost, and also has a problem of arrangement space, and further complicates a control circuit for controlling them.

Therefore, means for detecting the relative position of both terminals with one camera is conceivable. That is, an object is to reduce the cost by reducing the number of expensive cameras, reduce the arrangement space, and simplify the control circuit.

In this case, for example, the operator increases the magnification and positions the two terminals displayed on the monitor with a manual stage. The camera is fixed to take a wide field of view, and to display many terminals on the monitor, or to project both side edges of the carrier tape component, respectively,
The CCD camera is manually moved by a certain distance corresponding to the distance between both ends of the carrier tape component, and the image is displayed on a monitor.

(Problems to be Solved by the Invention) However, as described above, when a carrier tape component incorporating an IC in a tape is punched in a separate process, the work of packing the punched carrier tape component into a tray or the like is performed. The work of carrying the package to the mounting process is required, and even if the carrier tape components are automatically supplied from the tray, the space of the apparatus is limited, so that the number that can be continuously supplied is limited.

Further, even if the method of aligning the carrier tape components by one camera is adopted, if the camera position is fixed, only a part of the terminals can be aligned in a narrow field of view. Accordingly, an extremely wide field of view is obtained, but on the other hand, the resolution of the camera is reduced, and it becomes difficult to align terminals having an extremely small pitch.

On the other hand, in a component having a large number of terminals, it is inevitable that the accumulated pitch error at both ends of the terminal portion becomes large, and the components must be aligned as a whole in order to appropriately distribute the error. To do so, it is necessary to move the camera and align both ends of the terminal part,
In this case, the distance to be moved is different because the distance between both ends is different depending on the type of the carrier tape component. For this reason, it is necessary to prepare matching jigs for each type of carrier tape component, which causes a new problem such as a troublesome replacement.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to improve productivity by automatically supplying a carrier tape component and mounting it on a liquid crystal substrate without manual intervention. In addition, regardless of the type of the carrier tape component, the positioning of the terminal portion on the liquid crystal substrate and the terminal portion of the carrier tape component can be accurately performed by one optical system, and the carrier tape component having extremely high reliability can be obtained. It is to provide a mounting device.

[Constitution of the Invention] (Means and Action for Solving the Problems) In order to achieve the above object, the present invention supplies a carrier tape component together with a tape from a supply unit, and punches out the supplied carrier tape component. The carrier tape part is punched and held in a predetermined shape, and the carrier tape component is carried out to a take-out position.

On the other hand, a temporary positioning stage for temporarily positioning the carrier tape component is provided between a substrate mounting stage that holds the liquid crystal substrate and is movable in the XY and θ directions in a horizontal plane and a take-out position of the punching machine.

Then, the carrier tape component at the take-out position is sucked by the transfer head and transferred to the temporary positioning stage, and further, the carrier tape component is sucked by the mounting head, and the carrier tape component is moved to the mounting position of the substrate mounting stage relative to the liquid crystal substrate. Transport.

Here, one optical system can simultaneously image both the liquid crystal substrate terminal portion and the carrier tape component terminal portion to recognize the relative positions of both terminal portions, and can move this optical system across the width of the terminal. And performs position recognition corresponding to the type of carrier tape component.

Then, the backup mechanism receives a pressing force from above the mounting head below the liquid crystal substrate, and the carrier tape component can be mounted on the liquid crystal substrate.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The substrate mounting stage 1 shown in FIG. 1 and FIG.
It is composed of a table 2, a Y table 3, and a θ table 4. A jig 6 for holding a liquid crystal substrate 5 is provided on the θ table 4. Therefore, the liquid crystal substrate 5 is movable in the XY and θ directions by the substrate mounting stage 1, and the terminal portions 7 are held in a state of protruding laterally from the jig 6.

The substrate mounting stage 1 is provided at a front portion of a base 8 of a mounting apparatus, and at a rear portion thereof, a supply portion 9 for supplying a carrier tape component 10 on which an IC chip is mounted is provided. In this embodiment, the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b are of a double type in which they are arranged side by side and have the same structure. It is configured as shown in FIG. 11 is a supply reel, and 12 is a spacer tape take-up reel. The carrier tape component 10 is wound around the supply reel 11 together with the spacer tape 13 and is sequentially fed out. The supply reel 11 is provided with a rear sprocket 15 for regulating the position of the tension roller 14 and the carrier tape component 10 in the width direction, and a take-up reel 16 for winding the punched tape. Further, a front sprocket 17 for feeding the carrier tape component 10 by a certain length is provided on the base 8 at the same height position as the rear sprocket 15. Then, the spacer tape 13 is fed out from the supply reel 11 and wound on the spacer tape take-up reel 12. The carrier tape component 10 unwound from the supply reel 11 is wound in the order of a tension roller 14, a rear sprocket 15, and a front sprocket 17, and a punched tape punched by means described later is wound around a take-up reel 16. It has become.

A punching mechanism 19 for punching the carrier tape component 10 into a predetermined shape is installed in the carrier tape component running path 18 located between the rear sprocket 15 and the front sprocket 17. This punching mechanism 19 comprises an upper mold 20 and a lower mold 21 sandwiching the carrier tape component traveling path 18 up and down,
The upper mold 20 is moved up and down by the air cylinder 22 to punch the carrier tape component 10.

Further, as shown in FIG. 4, the lower mold 21 is placed on a moving table 23 orthogonal to the carrier tape component traveling path 18, and the lower mold 21 is moved between a punching position 24 and a takeout position 25. It is configured to reciprocate. The lower mold
A fixing portion 26 for fixing the punched carrier tape component 10 is provided on the upper surface of the 21, and sucks and holds the carrier tape component 10 by, for example, vacuum suction.

Therefore, in the case of a double type in which the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b are arranged side by side, the take-out position 25 is provided between both punching mechanisms 19, 19. Thus, different types of carrier tape components 10 can be supplied to the take-out position 25 from the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b. Moreover, since the lower mold 21 is placed on the moving table 23 and reciprocates between the punching position 24 and the take-out position 25, when one lower mold 21 is located at the punching position 24, The lower mold 21 is located at the take-out position 25, and the carrier tape component 10 can be alternately supplied to the take-out position 25 from the first carrier tape component supply portion 10a and the second carrier tape component supply portion 10b.

Further, the take-out position 25 and the substrate mounting stage 1
A temporary positioning stage 33 is provided between them. The temporary positioning stage 33 has a rotation axis 35 perpendicular to the base 8, as shown in FIGS.
A positioning table 36 is provided at the upper end of the rotating shaft 35. The positioning table 36 is rotatable by a pulse motor (not shown) directly connected to the rotating shaft 35,
A step 37 is provided on one side edge. The carrier tape component 10 is located on the upper surface of the positioning table 36.
A number of suction holes 38 for vacuum suction are formed, and communicate with a vacuum suction source (not shown). Also,
An L-shaped pusher lever 39 is provided at the step 37 of the positioning table 36, and is provided with an air cylinder.
The portion 40 is formed so as to be able to advance and retreat with respect to the step portion 37. And the pusher lever 39 is positioned on the positioning table.
A positioning mechanism 41 for temporarily positioning the carrier tape component 10 by bushing the edge of the carrier tape component 10 sucked and held on 36 is configured.

Further, as shown in FIG. 2 again, a transport mechanism 42 is provided above the supply section 9 and the temporary positioning table 33. To explain the transport mechanism 42, reference numeral 43 denotes a guide rail, which is a take-out position 25 of the supply unit 9.
And a mounting position 44 of the liquid crystal substrate 5 held on the substrate mounting stage 1. This guide rail
A transfer robot 45 is movably provided on 43, and the transfer robot 45 is provided with a transfer head 46 and a mounting head 47. The distance between the transfer head 46 and the mounting head 47 is equal to the distance between the take-out position 25 and the temporary positioning stage 33. When the transfer head 46 faces the take-out position 25, the mounting head 47 Facing 33. Further, the transfer head 46 and the mounting head 47 have basically the same structure, have vacuum suction portions 46a and 47a on the lower surface, and are moved up and down by a cylinder 49 along a vertical guide 48.

An image of a terminal portion 7 of a liquid crystal substrate 5 held on the substrate mounting stage 1 at a mounting position protruding from the stage 1 is imaged at a lower portion opposed to the mounting position 44, and a terminal of the liquid crystal substrate 5 and the mounting head are mounted. Each of the terminals of the carrier tape component 10 which is vacuum-sucked to 47 is imaged in the same visual field. One camera (CCD camera) as an optical system 5
1 is provided.

As shown in FIG. 6, the camera 51 is engaged with a pair of guide rails 71 provided parallel to the vertical piece 70a of the support base 70 and along the horizontal direction. That is, guide bodies 72, 72 are integrally provided on the side of the camera 51, and recesses provided in these guide bodies 72, 72 engage with the guide rails 71, 71. For example, a servo motor 73 as a driving source is provided on one side of the support base 70, and a ball screw 74 extends from the servo motor 73 to the camera 51. Therefore, when the servo motor 73 is energized, the ball screw 74 rotates, and the camera 51 can move to any two or more positions. And this camera
An image of an alignment mark (not shown) provided on the terminal portion 7 of the liquid crystal substrate 5 is imaged by 51, and a part of the terminals of the liquid crystal substrate 5 and the carrier tape component 10 are imaged in the same field of view. Are recognized by image processing, and the substrate mounting stage 1 is moved to correct the amount of displacement and align the positions. The necessary movement position of the camera 51 is programmed by the NC program with respect to the servo motor 73, and is moved to an appropriate position corresponding to a plurality of types of the carrier tape component 10 to take an image.

Further, a backup mechanism is provided below the mounting position 44.
52 are provided. This backup mechanism 52
As shown in FIG. 8 and FIG.
The vertical direction slider 55 driven by the drive cylinder 54 is connected to the vertical direction guide rail 56 so that the vertical direction slider 55 can move up and down. At the upper end of the vertical slider 55, a horizontal guide rail 57 is provided.
Are provided integrally. And this left and right guide rail
A left-right slider 59 connected to another drive slider 58 is engaged with the 57 so as to be linearly movable in the left-right direction, and supports the backup 60 here. Therefore, by moving the vertical cylinder 55 and the horizontal cylinder 59 in that direction by the respective drive cylinders 54 and 58, the backup 60 can move forward and backward with respect to the mounting position 44, and can move from above to the liquid crystal substrate 5 from above. The pressing force can be supported at the lower part.

As shown in FIG.
The carrier tape component 10 has a width l that is substantially the same as the width of the carrier tape component 10. And
The upper end portion 60a, which is a portion that is actually backed up when the liquid crystal substrate 5 and the carrier tape component 10 are joined, is formed to have a curved surface with a radius of curvature R of, for example, about 10R.

Next, the operation of the carrier tape component mounting apparatus configured as described above will be described.

The liquid crystal substrate 5 is held on the jig 6 of the substrate mounting stage 1, and the terminal 7 is located at the mounting position 44. In this state, the camera 51 moves the alignment marks at both ends in the longitudinal direction of the terminal portion 7 of the liquid crystal substrate 5 to capture an image, and recognizes the position of the electrode pattern relative to the outer diameter of the liquid crystal substrate 5 by image processing. On the other hand, the carrier tape component 10 to be mounted on the liquid crystal substrate 5 is alternately supplied to the take-out position 25 from the first and second carrier tape component supply units 10a and 10b.
That is, the carrier tape component 10 fed from the supply reel 11 travels in the order of the tension roller 14, the rear sprocket 15, and the front sprocket 17. Since a carrier tape component running path 18 located between the rear sprocket 15 and the front sprocket 17 is provided with a punching mechanism 19 for punching the carrier tape component 10 into a predetermined shape,
The upper mold 20 is lowered by the air cylinder 22, and the carrier tape component 10 is punched with the lower mold 21. The punched carrier tape component 10 is fixed to the fixing portion 26 of the lower die 21, and the carrier table component 10 moves to the removal position 25 by the movement of the moving table 23.

That is, the first carrier tape component supply unit 10a and the second
Since the carrier tape component supply units 10b are arranged side by side, the carrier tape component 10 is supplied to the take-out position 25 alternately from both punching mechanisms 19, 19.

When the transport mechanism 42 operates, the transfer head 46 faces the take-out position 25, sucks the carrier tape component 10 by the vacuum suction part 46a, and places the carrier tape component 10 on the positioning table 36 of the temporary positioning stage 33. . When the carrier tape component 10 is placed on the positioning table 36,
The pusher lever 39 moves in the Y direction, and pushes one end surface of the carrier tape component 10 to perform positioning in the Y direction.
From this state, the transfer mechanism 42 operates again, and the transfer robot 45
Is moved rightward along the guide rail 43, the transfer head 46 faces the support table 32, and the mounting head 47 faces the positioning table 36 of the temporary positioning stage 33. When the transfer head 46 and the mounting head 47 are simultaneously lowered, the transfer head 46 sucks the carrier tape component 10 on the support table 32, and the mounting head 47 moves to the positioning table 36.
The carrier tape component 10 positioned above is sucked.

Next, after the transfer head 46 and the mounting head 47 simultaneously move up, when the transport robot 45 moves a predetermined distance to the left, the carrier tape component 10 adsorbed by the mounting head 47 faces the mounting position 44. Here, as shown in FIG. 7, the distance L between the terminal surface of the liquid crystal substrate 5 and the terminal surface of the carrier tape component 10 is maintained at 0.5 to 1.0 mm.
5x of the terminal part 7 and the terminal 10 of the carrier tape component 10.
Each part of X is magnified and imaged in the same field of view. Since the field of view may be relatively narrow, the resolution of the camera 51 does not decrease even when the image is magnified, and there is no problem in alignment even if the terminal pitch is extremely small.

At the same time, the servo motor 73 shown in FIG. 6 is energized, and the camera 51
Are moved over the width direction of the terminals 10X... In such a component having a large number of terminals, the accumulated pitch error at both ends of the terminal portion becomes large, and the position must be adjusted as a whole in order to appropriately distribute the error. In the direction to align both ends. Then, the relative displacement between the two terminals 5x and 10x is detected by image processing, and the substrate mounting stage 1 is moved in the XY and θ directions to perform positioning. Even for multiple types such as carrier tape parts 10A and 10B of different types, since the movement position corresponding to the type is programmed by the NC program, the optimum position always corresponds to the carrier tape parts 10A and 10B. It is possible to move the camera 51 to take an image.

At this time, the backup 60 of the backup mechanism 52 falls off the visual field of the camera 51 and stands by.

Next, the backup mechanism 52 operates to perform backup.
As shown in FIG. 8, the backup 60 is opposed to the lower surface of the terminal portion 7 of the liquid crystal substrate 5. The carrier tape component 10 attracted to the mounting head 47 is pressed against the terminal portion 7 of the liquid crystal substrate 5 as the mounting head 47 descends. At this time, as shown in the figure, an ACF (Anistropic Conductive F
ilm, anisotropic conductive film) 10a-20kg because 7a is applied
Temporary connection is performed by pressing with a load of the order. Further, the upper end 60a of the backup 60 contacts the lower surface of the terminal portion 7 of the liquid crystal substrate 5 and receives the pressing force of the mounting head 47 to perform backup. The liquid crystal substrate 5 is made of glass, which is a brittle material. However, since the upper end 60a of the backup 60 is formed as a curved surface, no trouble such as one-side contact or point contact with the terminal portion 7 occurs.

When the temporary connection of the carrier tape component 10 to the liquid crystal substrate 5 is completed, the vacuum suction force of the mounting head 47 is released, the mounting head 47 rises, and then moves rightward with the transfer head 46 by the transport mechanism 42. . Then, the carrier tape component 10 is sucked, and the mounting head 47 sucks the carrier tape component 10 temporarily positioned on the temporary positioning stage 33. By repeating the above operation again, the mounting of the carrier tape component 10 on the liquid crystal substrate 5 can be performed automatically.

In the above-described embodiment, the case where the carrier tape component 10 is temporarily connected to the liquid crystal substrate 5 has been described. It is possible.

Further, by extending the stroke of the X table 2 of the substrate mounting stage 1 and holding the plurality of liquid crystal substrates 5 in one row, a carrier tape component for the plurality of liquid crystal substrates 5 is provided.
10 implementations can be performed continuously.

Further, the first carrier tape component supply unit 10a and the second
And the carrier tape component supply unit 10b is arranged in a two-line system so that different carrier tape components 10 can be supplied alternately, but the present invention is not limited to this.

[Effects of the Invention] As described above, according to the present invention, a carrier tape component is automatically supplied continuously and punched into a predetermined shape.
Then, temporary positioning and mounting can be continuously and automatically performed, and productivity is improved. Furthermore, when mounting, both the liquid crystal substrate terminal portion and the carrier tape component terminal portion are set to one.
Since the optical systems simultaneously image and recognize the position, effective use of the optical systems can be achieved, which contributes to a reduction in component costs. At this time, since the optical system can be moved in the width direction of the terminals, it is possible to take an imaging position corresponding to a plurality of different types of carrier tape components having a large number of terminals or an extremely small pitch, thereby improving imaging accuracy. This has the effect of improving sophistication and improving reliability.

[Brief description of the drawings]

The drawings show an embodiment of the present invention, FIG. 1 is a perspective view of a carrier tape component mounting apparatus, FIG. 2 is a side view of the same, FIG. 3 is a schematic side view of a carrier tape component supply unit, FIG. 4 is a schematic plan view showing a relationship between a punching mechanism and a take-out position, FIG. 5 is a perspective view of a temporary positioning table,
FIG. 6 is a perspective view of a drive mechanism of the optical system, FIG. 7 is an explanatory view showing a screen in which terminals are aligned with each other, FIG. 8 is a schematic configuration diagram of a backup mechanism and a mounting position, and FIG. FIG. 10 is a perspective view showing a state in which a carrier tape component is temporarily connected to a liquid crystal substrate. DESCRIPTION OF SYMBOLS 1 ... Board mounting stage, 5 ... Liquid crystal board, 7 ... Terminal part, 9
... Supply unit, 10 ... Carrier tape parts, 33 ... Temporary positioning stage, 19 ... Punching mechanism, 44 ... Mounting position, 46 ... Transfer head, 47 ... Mounting head, 51 ... Optical system (camera), 52 ...
Backup mechanism.

Claims (1)

(57) [Claims] 1. A supply unit for supplying a carrier tape component together with a tape, a carrier tape component supplied from the supply unit is punched into a predetermined shape, and the punched carrier tape component is held and carried out to a take-out position. Tentatively, a substrate mounting stage that holds the liquid crystal substrate and is movable in the XY and θ directions in a horizontal plane, and a carrier tape component installed between the substrate mounting stage and the take-out position of the punching mechanism. A temporary positioning stage for positioning, a vertically movable transfer head for sucking the carrier tape component at the take-out position and transferring it to the temporary positioning stage, and a substrate mounting stage for sucking the temporarily positioned carrier tape component A mounting head that can be moved up and down to transfer to a mounting position of a liquid crystal substrate placed on the Both the liquid crystal substrate terminal portion and the carrier tape component terminal portion are simultaneously imaged to recognize the relative positions of the two terminal portions and to be movable in the width direction of the terminal so as to recognize the position corresponding to the type of the carrier tape component. An optical system, and a backup mechanism that supports the liquid crystal substrate terminal portion and the carrier tape component terminal portion whose positions are recognized by the optical system from below and receives a pressing force from above during mounting by the mounting head. Carrier tape component mounting device.