JP3717462B2 - Chip supply method in chip bonding apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip supply method in a chip bonding apparatus for bonding a semiconductor chip to a circuit board such as a liquid crystal substrate. In Related.
[0002]
[Prior art]
Conventionally, chip bonding for bonding a semiconductor chip to a circuit board such as a liquid crystal substrate by thermocompression, ie, bonding, has been widely used practically. However, in this bonding, accuracy in micron units is required, and this is further enhanced. It is becoming highly accurate.
[0003]
Therefore, in general, after the circuit board and the semiconductor chip are transferred so as to be positioned at the bonding position, the relative position between the circuit board and the semiconductor chip is detected by a camera, and the circuit board is based on the calculation result of the positional deviation amount. Bonding is performed by precise positional alignment with the semiconductor chip.
[0004]
That is, for example, as disclosed in JP-A-2-226737, a circuit board placed on a slide table of an upper table (X table or Y table) constituting an XY table device, and this The two-field optical system is moved between the bonding head equipped with a bonding tool that holds the semiconductor chip by suction above the substrate, and the relative position between the circuit board and the semiconductor chip is detected. Based on the calculation result, the bonding stay supporting the circuit board is finely moved to precisely align the circuit board and the semiconductor chip, and then the bonding head is moved downward to perform bonding.
[0005]
However, in this bonding, the relative position between the circuit board and the semiconductor chip is detected by the two-field optical system. Dependent on the concentric relationship between one optical system for detecting the alignment mark and the other optical system for detecting the alignment reference alignment mark marked on the electrode part of the circuit board below, in micron units In addition, it is not suitable for bonding when higher precision is required (for example, in the case of so-called COG bonding to the electrode of the liquid crystal substrate).
[0006]
Therefore, instead of the two-field optical system, a positioning reference alignment mark marked on the semiconductor chip and a positioning reference alignment mark marked on the electrode portion at one end of the circuit board are detected from below. Adoption of a single-field optical system has been studied, and this type of bonding has already been proposed in Japanese Patent Laid-Open No. 4-199525.
[0007]
However, in this bonding as well as the former, the bonding stay supporting the circuit board is finely moved to precisely position and align the circuit board and the semiconductor chip. When the weight is increased, there is a drawback that it is difficult to perform the positional precision alignment by such fine movement with high accuracy.
[0008]
In addition, a stage constituted by an XYθ table device or the like that controls the movement of the bonding stage due to the need to form a path for positioning the camera below the bonding stage in accordance with the adoption of the one-field optical system. It was forced to attach the bonding stage to the movement control device in a cantilevered state, but when the circuit board is supported and bonded by the bonding stage thus attached, the bonding stage is likely to be distorted, For this reason, particularly when bonding is performed under much larger pressure conditions, such as when bonding to electrodes of a liquid crystal substrate, the disadvantage is that it is difficult to perform bonding with high accuracy. Had.
[0009]
Further, in order to detect the alignment mark for precision positioning reference of the circuit board placed on the bonding stage by the camera moved below the bonding stage, the bonding stage is transparent material that can transmit light. Therefore, it has a disadvantage that it is not practical.
[0010]
[Problems to be solved by the invention]
As a result of diligent research to solve these disadvantages, and first, as a result, the positional precision alignment between the circuit board and the semiconductor chip at the bonding position is not performed on the bonding stage. When bonding to a heavy, large circuit board by finely moving only the bonding tool attached to the lower end of the bonding head that does not move the entire bonding head and attracting and holding the semiconductor chip. In addition, the present inventors have found that the positional precision matching between the circuit board and the semiconductor chip at the bonding position can be easily performed with high accuracy.
[0011]
Second, a bonding stage is mounted on a stage movement control device configured with an XY table, a stage base mounted on a slide table of an upper table forming the XY table, and a stage base. On the stage base so that it can be moved up and down horizontally between the substrate receiver and the gate-type fluoroscopic cradle, and the gate-type fluoroscopic cradle mounted on the slide table of the lower table constituting the XY table. Even in bonding under even larger pressing conditions, the bonding stage side is provided with a special structure, such as a mounted suction plate and a plurality of suction pads mounted on the suction plate. It is possible to prevent distortion on the stage and perform bonding with high accuracy. It was found to be.
[0012]
With the above method, it has become possible to perform the positional precision matching between the circuit board and the semiconductor chip with high accuracy and easily. However, in reality, the size of the semiconductor chip to be bonded is variously changed, and chips of different sizes are supplied, so the chip supply mechanism that supplies the chip to the bonding head side is also positioned with high precision for supply. In addition, there has been a demand for a function that can easily cope with a change in chip size without exchanging jigs and the like.
[0013]
Therefore, an object of the present invention particularly relates to a chip supply mechanism for supplying a chip to the bonding head side in a chip bonding apparatus, and it is possible to easily perform chip size without performing accurate positioning for supply and replacement of a jig or the like. Chip supplying method in a chip bonding apparatus having a function capable of coping with the change of the chip The It is to provide.
[0014]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a chip supply method in a chip bonding apparatus according to the present invention is to provide a chip by adsorbing means on its anti-bonding surface before supplying the chip to the bonding head side for holding and bonding the semiconductor chip. The chip is brought into contact with the chip pressing member having a predetermined shape while being sucked and held, and the position of the chip and the sucking means is determined by adjusting the position of the chip with respect to the sucking means, and the positioned chip is sucked and held by the sucking means. The method comprises supplying to the bonding head side.
[0015]
In this method, it is preferable that the bonding surface of the chip is kept in a non-contact state, and the relative position between the chip and the suction means is determined while the chip is sucked and held by the suction means.
[0016]
The relative position between the chip and the suction means can be set by a movement control program for the suction means. When there is a change in the chip size, etc., the relative position between the chip and the suction means to be determined is changed only by changing the movement control program of the suction means while keeping the chip pressing member in a fixed shape and position. be able to.
[0017]
As for the relative position between the chip and the suction means to be determined, for example, the relative position between the chip and the suction means can be determined so that the center portion of the chip is sucked and held by the suction means.
[0018]
In the chip bonding apparatus according to the present invention Used for chip supply method Chip feeder For example, An apparatus for supplying a chip to a bonding head side for holding and bonding a semiconductor chip, and for adsorbing and removing the chip by adsorbing its anti-bonding surface and moving it to the bonding head side, The relative positioning of the chip and the suction means can be achieved by adjusting the position of the chip with respect to the suction means by being brought into contact with the chip that is provided in the middle of the movement path, held by the suction means and held in the non-contact state by the bonding surface. A positioning mechanism having a chip pressing member of a predetermined shape possible. Ru Consists of things.
[0019]
In this device Is It is also possible to adopt a configuration including a movement control program for the suction means for setting the relative positions of the chip and the suction means. In this case, the tip pressing member can have a fixed shape and a fixed position, and the relative position between the tip and the suction means to be determined can be changed only by changing the movement control program of the suction means.
[0020]
Also in this apparatus, the relative positioning of the tip and the suction means in the positioning mechanism can be performed so that the central portion of the tip is sucked and held by the suction means.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
First, the structure of the chip bonding part of the chip bonding apparatus will be described, and then the structure of the supply apparatus for supplying chips to the chip bonding part will be described.
[0022]
In FIG. 1, a circuit board 1 indicated by a chain line has one end supported by a substrate receiver 3 of a bonding stage 2 and the other end on which an electrode is formed supported by a gate-type fluoroscopic mount 4. In addition, it is sucked and held by a plurality of suction pads 6 mounted on the suction plate 5. A see-through glass 7 is mounted on the upper end of the portal-type see-through gantry 4.
[0023]
In this state, the CCD camera 9 mounted on the camera movement control device 8 constituted by an XYZ table is moved by the drive control of the camera movement control device 8, and the imaging head 10 is partitioned by the portal-type fluoroscopic frame 4. The alignment mark for precision positioning reference that is moved into the space area 11 and is marked on one end of the circuit board 1 supported by the portal type see-through gantry 4 is detected from below.
[0024]
Subsequently, the slide table 13 of the lower table 12 which is the X table is moved in the Xa direction, and the portal type see-through gantry 4 is retracted from the bonding position A. Then, the CCD camera 9 detects the precision positioning reference alignment mark, which is marked on the semiconductor chip 16 held by the bonding tool 15 of the upper bonding head 14 positioned at the bonding position A, from below. To do.
[0025]
Next, the slide table 13 of the lower table 12 is moved in the Xb direction, the portal-type fluoroscopic frame 4 is returned to the bonding position A, and the bonding tool 15 is controlled to move in a predetermined manner so as to eliminate the misalignment of both alignment marks. As a result, the circuit board 1 and the semiconductor chip 16 are precisely aligned in position, and the bonding head 14 is moved downward to perform thermocompression bonding, that is, bonding.
[0026]
At that time, only the bonding tool 15 which is a part of the head is finely moved on the side of the bonding head 14 to which the load of the circuit board 1 does not act, and the entire bonding head 14 is not finely moved. be able to. Further, since the one end of the circuit board 1 on the bonding side is supported by the gate-type fluoroscopic mount 4 mounted on the slide table 13 of the lower table 12, the distortion of the bonding stage 2 during bonding can be further reduced. it can.
[0027]
When the bonding head 14 is moved to the upper original position after the bonding is completed, the suction plate 5 is moved upward, and the circuit board 1 supported by the substrate receiver 3 and the gate-type fluoroscopic mount 4 is moved. The slide table 18 of the upper table 17 that is a Y table is moved in the Yb direction. This movement is performed so as to position the subsequent bonding position at the bonding position A. Therefore, bonding can be performed one after another through the same process as described above.
[0028]
Next, the structure of the supply device for supplying chips to the chip bonding unit will be described. In FIG. 2, the overall perspective view of the chip bonding device is shown. The stage 2, CCD camera 9, chip slider 21, and chip loader 22 for supplying the chip 16 to the bonding head 14 side are mounted. The chip loader 22 can move in the XY directions orthogonal to each other in the horizontal plane. A cylinder 24 is mounted on the arm 23 mounted in this manner, and a suction pad 25 as a suction means is mounted on the tip of the rod of the cylinder 24.
[0029]
Therefore, by controlling the movement of the arm 23 in the X and Y directions and the movement control of the suction pad 25 in the Z direction (vertical direction) by the cylinder 24, the semiconductor from the predetermined storage section of the chip tray 26 as the chip storage portion is obtained. The chip 16 can be sucked and held on its anti-bonding surface and transferred to the external positioning plate 27 of the chip positioning mechanism in the present invention. The outer shape positioning plate 27 is mounted horizontally on the machine base 20, and on the upper surface thereof, as shown in FIG. 3, a predetermined shape, in this embodiment, a pair of L-shaped chips. A chip pressing plate 28 as a pressing member is mounted.
[0030]
Therefore, the semiconductor chip 16 that is sucked and held by the suction pad 25 and transferred between the two chip pressing plates 28 is still held by the suction pad 25 so that the position of the semiconductor chip 16 can be displaced. 23 is controlled to move in the indicated arrow direction (XY direction), that is, by movement control in the suction pad 25XY direction, the chip 16 and the suction pad are brought into contact with the L-shaped surfaces of both chip pressing plates 28. The relative position of 25 is determined as a target predetermined positional relationship. In this embodiment, the center portion of the chip 16 is positioned so as to be sucked and held by the suction pad 25.
[0031]
At this time, since the lower surface of the semiconductor chip 16 is attracted and held (with the bonding surface in a non-contact state) so as not to contact the upper surface of the outer shape positioning plate 27, the bonding of the semiconductor chip 16 is performed. It is possible to prevent damage to the surface to be intended (bonding surface), that is, the lower surface. Further, according to such a chip positioning method, even if the size of the semiconductor chip 16 changes, it is possible to cope with it by simply changing the movement control program of the chip loader 22 (that is, the movement control program of the suction pad 25) to a predetermined value. Therefore, highly accurate positioning can be ensured, and chip size change can be easily dealt with without exchanging jigs.
[0032]
Subsequently, when the positioning is completed, the semiconductor chip 16 is transferred onto the chip slider 21 by the movement control of the arm 23 in the XY direction and the movement control of the suction pad 25 in the Z direction by the cylinder 24. The slider 21 is moved toward the bonding head 14 (that is, the chip 16 is supplied to the bonding head 14 side). The chip slider 21 is mounted on a screw shaft that is driven and rotated by a servo motor (not shown) so that the chip slider 21 can move horizontally, and the chip slider 21 approaches the bonding head 14 from the chip receiving position B (origin). It is moved horizontally to the tip standby position.
[0033]
When the bonding head 14 finishes bonding below and returns to the upper head origin, the chip slider 21 is moved below the bonding head 14 from the standby position. Therefore, the semiconductor chip 16 can be quickly transferred below the bonding head 14.
[0034]
Next, the bonding head 14 is mounted at the bonding position A, and this head 14 is configured by a reaction force receiver 31 mounted on the upper end of a column 30 mounted on the machine base 20. That is, in FIG. 4 showing the enlarged view, the bracket vertical guide 32 and the Z table 33 are mounted on a box-shaped bracket 34 (see FIG. 2) mounted on the machine base 20, and The cylinder bracket 35 is mounted so that it can be guided by the bracket vertical guide 32 and can slide in the Z direction (vertical direction), and the head bracket 36 is also guided by the Z table 33 and slides in the same direction. It is attached to be able to.
[0035]
The head bracket 36 is mounted on an XY table 38 a that forms the upper part of the XYθ table 38, and the tool bracket 37 is mounted on the θ table 38 b that forms the lower part of the XYθ table 38.
[0036]
The Z table 33 includes a screw shaft feed mechanism (not shown) that rotates the screw shaft by the servo motor 39 to feed the pitch, and the head bracket 36 is linked to this mechanism. Therefore, when the head bracket 36 is moved through such a mechanism, the tool bracket 37 is also moved together.
[0037]
On the other hand, the piston rod 42 of the air cylinder 41 mounted on the cylinder bracket 35 is positioned concentrically with the pressurizing transmission shaft 43 in the vertical direction, and the lower end of the piston rod 42 is normally (as illustrated). When the piston rod 42 is immersed in the upper origin position), the piston rod 42 is separated from the upper end of the pressure transmission shaft 43 at a constant interval.
[0038]
The pressure transmission shaft 43 is mounted so as to be able to move up and down through the head bracket 36, the XYθ table 38, and the tool bracket 37, and the lower end thereof comes into contact with the upper end of the bonding tool 15 and comes off. It has been stopped. The bearing 19 is attached to the head bracket 36.
[0039]
Therefore, in a state where the head bracket 36 and the tool bracket 37 are stationary, the piston rod 42 of the air cylinder 41 protrudes downward to bring the lower end into contact with the upper end of the pressure transmission shaft 43 and further downward. By projecting, the pressure transmission shaft 43 can be slid downward, and by sliding the pressure transmission shaft 43 in this way, the bonding tool 15 is pushed at the lower end and moved downward. Can be made.
[0040]
When the piston rod 42 protruding downward is immersed and moved upward, the pressure transmission shaft 43 is suspended from the tool bracket 37 via an elastic body (coil spring) 47 as will be described later. It is pushed by the bonding tool 15 mounted in the above state, slid upward, and returned to its original position.
[0041]
In addition, one end of the bonding tool 15 is sucked through a pressure hose connected to an intake passage (not shown) provided in a lower end side portion (tip side portion) of the tool 15. The semiconductor chip 16 can be sucked and held by suction from the suction hole opened in the lower end surface of the tool (chip suction holding surface) so as to communicate with the suction passage, and the heater is built in, and the pulse heater control device 44 ( 2), and an elastic body (coil spring) 47 is locked to the pin 45 attached to the tool bracket 37 and the pin 46 attached to the bonding tool 15. (It is also locked on the opposite side not shown). That is, the pair of elastic bodies (coil springs) 47 are attached to the tool bracket 37 in a suspended state.
[0042]
The tool 15 is provided with a guide portion 51 that is inserted so as to be slidable in the vertical guide hole 40 of the tool bracket 37. Therefore, when the head bracket 36 is moved downward, the table 15 36, the bonding tool 15 also moves in the same direction following the tool bracket 37 that is moved downward integrally. When the head bracket 36 is moved upward, the bonding tool 15 also moves in the same direction. Moving.
[0043]
Similarly, an elastic body (coil spring) 50 is also locked to a pin 48 attached to the cylinder bracket 35 and a pin 49 attached to the reaction force receiver 31. A load cell 29 is mounted on the upper surface side of the cylinder bracket 35. The other end of the pressure hose is connected to a vacuum pump (not shown).
[0044]
Thus, the screw bracket feed mechanism of the Z table 33 moves the head bracket 36 downward to position the bonding tool 15 at the bonding start height, and then moves the piston rod 42 of the air cylinder 41 downward by a predetermined stroke. It can be made to protrude and thermocompression-bonded, that is, bonded.
[0045]
When the bonding is completed, the piston rod 42 of the air cylinder 41 is retracted and returned to the upper origin position, and the head bracket 36 is moved upward by the screw shaft feed mechanism of the Z table 33 to move the bonding tool 15 upward. Can be returned to the origin position.
[0046]
FIG. 4 shows this state. Subsequently, when the semiconductor chip 16 is transferred downward by the chip slider 21, the screw shaft feed mechanism of the Z table 33 causes a predetermined downward stroke. The semiconductor chip 16 on the chip slider 21 is moved and sucked and held by the bonding tool 15 and then returned to the upper origin position.
[0047]
In this way, the bonding head 14 is mounted so that it cannot move from the bonding position A to another place, and the semiconductor chip 16 is always sucked and held at the bonding position A. Therefore, the bonding head 14 is moved to a place other than the bonding position A to hold the semiconductor chip 16 by suction, and the chip supply cycle is compared with the chip supply mode in which it is returned to the bonding position A. Shortening can be achieved.
[0048]
Next, in FIG. 1 which is an enlarged view, the bonding stage 2 is mounted on a stage movement control device 55. The movement control device 55 includes a lower table 12 which is an X table and an upper table which is a Y table. The slide table 13 of the lower table 12 is mounted so as to be guided by the fixed side table 56 and can move in the X direction, and the upper table 17 is mounted on the slide table 13. That is, the slide table 18 of the upper table 17 is mounted so as to be guided in the fixed table 57 mounted on the slide table 13 and move in the Y direction.
[0049]
On the other hand, the bonding stage 2 includes a stage base 58 mounted on the slide table 18, a substrate receiver 3 and suction plate 5 mounted on the base 58, and a gate mounted on the slide table 13 of the lower table 12. It consists of a mold see-through rack 4. The substrate receiver 3 is mounted on the upper end of the stage base 58 so as to be guided and moved by a pair of guide rails 59 extending in the X direction, and the suction plate 5 is a longitudinal sectional view of FIG. As shown in FIG. 5, it is mounted on a movable bracket 61 mounted on the tip of a piston rod of an air cylinder 60 mounted on a stage base 58 so that the cylinder 60 can move up and down horizontally. It is attached to.
[0050]
The movable bracket 61 is mounted so as to be guided and moved by the left and right vertical guide rails 62 mounted on the stage base 58. In addition, the suction plate 5 is provided with a plurality of suction holes 63, and a plurality of suction pads 6 are mounted on the upper surface side of the suction plate 5 so as to communicate with the holes 63. Therefore, by connecting the other end of the pipe line 64, one end of which is connected to a vacuum pump (not shown), to the suction port of the suction plate 5, it is possible to suck air from the suction pad 6 group.
[0051]
Further, the vertical perspective view of the portal-type fluoroscopic frame 4 is shown in FIG. 5, but is provided at substantially the same level as the substrate receiver 3, and a transparent glass 7 is attached to the upper end thereof. The upper surface of the see-through glass 7 is preferably slightly higher than the upper surface of the substrate receiver 3, and a see-through hole 65 is provided below the see-through glass 7.
[0052]
Further, the CCD camera 9 is mounted on a camera movement control device 8 constituted by an XYZ table. That is, the movement control device 8 is configured by mounting the Y table 71 on the lower X table 70 and the Z table 72 on the Y table 71, and mounting the CCD camera 9 on the Z table 72. are doing. The Z table 72 is mounted so that it can move in the Z direction by driving and rotating the screw shaft 74 with a servo motor 73.
[0053]
The slide tables 13, 18, 75, 76 constituting the stage movement control device 55 and the camera movement control device 8 are also connected via a screw shaft feed mechanism that rotates the screw shaft by the servo motor 73 and feeds the pitch. It is mounted so that it can move.
[0054]
Thus, according to this bonding apparatus, thermocompression bonding, that is, bonding can be performed as follows. In performing bonding, the circuit board 1 is supplied onto the bonding stage 2, which is performed by an operator while the slide table 18 of the upper table 17 is moved in the Ya direction. At that time, the bonding head 14 is moved to the upper head origin position. Further, the suction plate 5 of the bonding stage 2 moved in the Ya direction has the upper end of the suction pad 6 group mounted on the suction plate 5 positioned slightly above the upper surface of the substrate receiver 3 or the portal-type fluoroscopic mount 4. As shown in FIG.
[0055]
Then, when the worker places the circuit board 1 on the suction pad 6 group so that one end on which the electrode is formed is positioned on the gate-type fluoroscopic gantry 4 side, a vacuum pump (not shown) is used. Intake is started and the circuit board 1 is sucked and held by the suction pads 6 group. Next, the slide table 18 of the upper table 17 is moved in the Yb direction, the first bonding location is positioned at the bonding position A, and then the suction plate 5 is moved downward via the cylinder 60.
[0056]
This is shown in FIG. In the figure, the circuit board 1 is supported by the gate-type see-through gantry 4 and the substrate receiver 3 which are moved to the bonding position A while being sucked and held by the suction pads 6 group. In parallel with this, the semiconductor chip 16 is transferred to the bonding position A by the chip slider 21 and is sucked and held by the bonding tool 15 of the bonding head 14. This state is shown in FIG.
[0057]
Subsequently, the CCD camera 9 that has been retracted in the Xb direction is moved in the Xa direction by the drive control of the camera movement control device 8, and the imaging head 10 is moved into the space region 11 defined by the portal-type fluoroscopic frame 4. Then, a precision positioning reference alignment mark marked on one end of the circuit board 1 supported by the portal-type fluoroscopic frame 4 is detected from below. At that time, the camera movement control device 8 is controlled to be driven so as to move the tables 72, 75, and 76 in a predetermined direction selected from the X, Y, and Z directions as necessary.
[0058]
When the detection is completed, the slide table 13 of the lower table 12 is moved in the Xa direction, and the portal-type fluoroscopic frame 4 is retracted from the bonding position A to the Xa side, that is, retracted out of the imaging field of the CCD camera 9. . Then, the CCD camera 9 detects the precision positioning reference alignment mark on the semiconductor chip 16 held by the upper bonding tool 15 by suction from below. At this time, if necessary, the CCD camera 9 is moved in the Za direction. When this detection is completed, the process returns to the original retracted position on the Xb side.
[0059]
Subsequently, the slide table 13 of the lower table 12 is moved in the Xb direction, the portal-type fluoroscopic frame 4 is returned to the bonding position A, and the bonding tool 15 is predetermined so as to eliminate the positional deviation between the alignment marks. Accordingly, the circuit board 1 and the semiconductor chip 16 are precisely aligned with each other. Note that the determination of the positional deviation of both alignment marks is performed in the image processing system, and based on the result, such movement control, that is, movement control of only the bonding tool 15 is performed. At that time, the bonding tool 15 is finely moved in a predetermined direction selected from the X direction, the Y direction, and the θ rotation by the XYθ table 38.
[0060]
In other words, the positional precision alignment between the circuit board 1 and the semiconductor chip 16 at the bonding position A is not performed on the bonding stage 2 but on the bonding head 14 and without moving the entire bonding head 14. The semiconductor chip 16 attached to the lower end of 14 is finely moved by only the bonding tool 15 for holding the suction.
[0061]
Therefore, even when bonding to a heavy and large circuit board 1, regardless of this, the positional precision alignment between the circuit board 1 and the semiconductor chip 16 at the bonding position A is easily performed with high accuracy. be able to. It should be noted that such positional precise alignment can be performed more precisely by performing multiple times as necessary.
[0062]
It should be noted that calibration is performed as necessary because accuracy in units of microns is required. That is, the reference index provided in the bonding tool 15 is controlled by a predetermined correction parameter obtained by driving the XYθ table 38 or the camera movement control device 8 to search for the reference index with the CCD camera 9. Various parameters input to the system (for example, the rotation center of the θ table in the XYθ table 38, the axis tilt of the X table and the Y table, the actual feed amount, or the axis tilt of each table in the camera movement control device 8) , Actual feed amount, etc.) are corrected and updated. Thereby, even if the mechanical characteristics change with time, the bonding accuracy can be kept high.
[0063]
Thereafter, when such precise alignment is completed, the bonding head 14 moves downward to perform thermocompression bonding, that is, bonding. As described above, first, the bonding tool 15 at the upper origin position is moved downward and positioned at the bonding start position approaching the circuit board 1 via the Z table 33 as described above. The bonding tool 15 is pressed against the circuit board 1 by the downward protrusion of the piston rod 42.
[0064]
At that time, one end of the circuit board 1 to be bonded, that is, one end to which a large pressing force is applied is supported by the gate-type fluoroscopic mount 4 mounted on the slide table 13 of the lower table 12. Generation of stage distortion, which has been regarded as a problem when the bonding stage is mounted on a cantilever structure, can be prevented even in bonding under a larger pressing condition, and bonding can be performed with high accuracy.
[0065]
Then, when the bonding is finished and the bonding head 14 is returned to the upper origin position, the suction plate 5 is moved upward via the air cylinder 60 and is supported by the substrate receiver 3 and the portal type see-through frame 4. The circuit board 1 is moved upward, and in this state, the slide table 18 of the upper table 17 that is a Y table is moved in the Yb direction.
[0066]
This movement is performed so that the position where the bonding is subsequently performed is positioned at the bonding position A, and then the suction plate 5 is moved downward so that the circuit board 1 is again supported by the board receiver 3 and the gate-type fluoroscopic mount 4. The Therefore, bonding can be performed with high accuracy one after another through the same process as described above. The suction holding of the semiconductor chip 16 by the bonding tool 15 is released when the bonding is completed, and when the semiconductor chip 16 is received, suction is started and the suction holding can be performed.
[0067]
In this way, the substrate positioning stage movement control step for controlling the movement of the bonding stage 2 that supports the circuit board 1 so as to move the circuit board 1 to be positioned at the bonding position A, and the circuit board positioned at the bonding position A 1 is a substrate position detection step of detecting a precision positioning reference alignment mark from below the circuit board 1 by a CCD camera 9, and a semiconductor chip 16 attracted and held by a bonding tool 15 provided in a bonding head 14 at a bonding position A. A chip position detecting step for detecting the alignment mark for precise positioning reference from below the bonding head 14 by the CCD camera 9 and bonding so as to retract the bonding stage 2 out of the imaging field of the CCD camera 9 prior to the chip position detecting step. Stage 2 Only the bonding tool 15 is used to perform the positional precise alignment between the circuit board 1 and the semiconductor chip 16 based on the calculation result of the displacement amount of the alignment marks detected by the CCD camera 9 and the retract stage movement control process for movement control. After performing fine movement, chip bonding is performed through a bonding process of bonding by the bonding head 2.
[0068]
If the circuit board 1 to be bonded next is different in size from the previous one, the board holder 3 is moved to the Xb side and fixed to a predetermined position by an appropriate means such as a set screw. The circuit boards 1 having different sizes can be bonded one after another by such a simple adjustment operation. At this time, as described above, the portal-type fluoroscopic frame 4 is not mounted on the slide table 18 of the upper table 17 but mounted on the slide table 13 of the lower table 12, so that bonding under a large pressing condition is performed. In this case, it is possible to prevent the bonding stage from being distorted.
[0069]
Further, as described above, even if the size of the chip 16 to be bonded changes, it can be dealt with by simply changing the movement control program of the chip loader 22 (that is, the movement control program of the suction pad 25) to a predetermined value. In addition to ensuring high-accuracy positioning, it is possible to easily cope with chip size changes without changing jigs.
[0070]
As mentioned above, although one embodiment according to the present invention has been described, in the present invention, the circuit board to be bonded is not limited to a transparent substrate such as a liquid crystal substrate, and may be other opaque circuit boards, Further, the upper table may be arranged in the X direction and the lower table may be arranged in the Y direction, and the substrate receiver may be mounted so that it can be automatically moved via a screw shaft feed mechanism or the like. .
[0071]
Further, the positioning reference alignment mark marked on the semiconductor chip and the circuit board may be in any form. The bonding head is preferably mounted so that it cannot move from the bonding position to other places. However, the bonding head is moved to a place other than the bonding position, for example, to suck and hold the semiconductor chip, and is then attached to the bonding position. It may be mounted in a so-called mobile manner to be transferred to the vehicle.
[0072]
In addition, for the mounting of the suction plate, a large gate-type fluoroscopic table is installed, that is, for example, a large gate that can form a support upper end surface (upper end surface that supports the circuit board) that is longer than the entire length of the circuit board. In the case where a mold see-through table is installed, it may be mounted in an aspect that does not move up and down.
[0073]
【The invention's effect】
As described above, the chip supply method in the chip bonding apparatus according to the present invention. In According to the above, when supplying the chip to the bonding head side, the relative position between the chip suction means and the chip can be determined in a desired positional relationship easily and with high accuracy while the chip is sucked and held during the supply, In addition, it is possible to easily cope with the change in the size of the chip simply by changing the movement control program of the suction means without performing jig replacement or the like.
[Brief description of the drawings]
FIG. 1 is an enlarged perspective view of a bonding stage portion.
FIG. 2 is a perspective view showing an overall configuration of a chip bonding apparatus.
FIG. 3 is a perspective view showing an outer shape positioning mode.
FIG. 4 is a perspective view of a bonding head.
5 is a longitudinal sectional view of FIG. 1. FIG.
[Explanation of symbols]
A Bonding position
1 Circuit board
2 Bonding stage
3 Substrate holder
4 portal type see-through table
5 Suction plate
6 Suction pad
7 perspective glass
8 Camera movement control device
9 CCD camera
10 Imaging head
12 Lower table
13 Slide table
14 Bonding head
15 Bonding tool
16 Semiconductor chip
17 Upper table
18 Slide table
21 Chip slider
22 Chip loader
23 Arm
24 cylinders
25 Suction pad as suction means
26 Chip tray as chip storage
27 External positioning plate for chip positioning mechanism
28 Chip Pushing Plate as Chip Pushing Member
55 Stage Movement Control Device
58 stage base

Claims (5)

  Before supplying the chip to the bonding head side for holding and bonding the semiconductor chip, the chip is brought into contact with the chip pressing member having a predetermined shape while holding the chip opposite to the bonding surface by the suction means. A chip supply method in a chip bonding apparatus, wherein the relative position between the chip and the suction means is determined by adjusting the position of the chip, and the positioned chip is supplied to the bonding head side while being sucked and held by the suction means.   2. The chip supply method in a chip bonding apparatus according to claim 1, wherein the bonding surface of the chip is maintained in a non-contact state, and the relative position between the chip and the suction means is determined while the chip is sucked and held by the suction means.   3. The chip supply method in the chip bonding apparatus according to claim 1, wherein a relative position between the chip and the suction means is set by a movement control program for the suction means.   4. The chip supply in the chip bonding apparatus according to claim 3, wherein the relative position between the chip and the suction means to be determined is changed only by changing the movement control program of the suction means while keeping the chip pressing member in a constant shape and position. Method.   5. The chip supply method in a chip bonding apparatus according to claim 1, wherein a relative position between the chip and the suction means is determined so that the center portion of the chip is sucked and held by the suction means.

Images