JP3333060B2 - Chip bonding method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip bonding method for bonding a semiconductor chip to a circuit board such as a liquid crystal substrate and a device therefor.

[0002]

2. Description of the Related Art Conventionally, chip bonding for bonding a semiconductor chip to a circuit board such as a liquid crystal substrate by heat and pressure, that is, bonding, has been widely used. However, in this bonding, an accuracy of a micron unit is required. And it is becoming more and more accurate.

[0003] Therefore, generally, after the circuit board and the semiconductor chip are transferred so as to be positioned at the bonding position, the relative position between the circuit board and the semiconductor chip is detected by a camera, and based on the calculation result of the displacement amount. The circuit board and the semiconductor chip are subjected to precise positional matching for bonding.

That is, for example, Japanese Patent Application Laid-Open No. H2-222673.
As disclosed in Japanese Unexamined Patent Application Publication No. 7-107, a circuit board mounted on a slide table of an upper table (X table or Y table) constituting an XY table device, and a semiconductor chip is sucked above the board. The bi-view optical system is moved between the holding head and the bonding head to which the bonding tool is attached, the relative position between the circuit board and the semiconductor chip is detected, and the circuit board is calculated based on the calculation result of the positional shift amount. The circuit board and the semiconductor chip are finely moved in position by finely moving the bonding stay supporting the semiconductor chip, and then the bonding head is moved downward to perform bonding.

[0005]

However, in this bonding, since the relative position between the circuit board and the semiconductor chip is detected by a two-field optical system, the accuracy depends on the accuracy of the optical system itself. Concentric relationship between one optical system for detecting alignment marks for positioning reference marked on a semiconductor chip and the other optical system for detecting alignment marks for positioning reference marked on an electrode portion of a lower circuit board. It is not suitable for bonding in a case where higher precision is required in units of microns and further higher (for example, in the case of so-called COG bonding to an electrode of a liquid crystal substrate) depending on the deviation.

Therefore, instead of the two-field optical system, a positioning reference alignment mark marked on the semiconductor chip and a positioning reference alignment mark marked on the electrode portion at one end of the circuit board are positioned below the alignment mark. The adoption of a one-field optical system for detecting from this has been studied, and this type of bonding has already been proposed in Japanese Patent Application Laid-Open No. 4-199525.

However, this bonding, like the former, because by fine movement of the bonding stage which supports the circuit board performs a positional precise alignment between the circuit board and the semiconductor chip, the circuit board large When the weight increases with the increase in the size, there is a disadvantage that it is difficult to perform the positional precision alignment by such fine movement with high accuracy.

In addition, since a path for locating a camera must be formed below the bonding stage with the adoption of the one-field optical system, an XYθ table device for controlling the movement of the bonding stage is used. It was necessary to mount the bonding stage in a cantilevered state on the stage movement control device that was mounted.However, when the bonding stage mounted in this way supported and bonded the circuit board, distortion occurred in the bonding stage. This is particularly noticeable in the case of bonding under a larger pressing condition, such as bonding to an electrode of a liquid crystal substrate.
There is also a disadvantage that it is difficult to perform bonding with high precision.

Further, in order to detect the alignment mark for precision positioning reference of the circuit board mounted on the bonding stage by the camera moved below the bonding stage, the bonding stage is allowed to transmit light. Must be made of transparent material
Therefore, it has a disadvantage that it is not practical.

The present invention focuses on these various drawbacks, and as a result of intensive studies to solve them, firstly,
The semiconductor mounted at the lower end of the bonding head, without performing the positional precision alignment of the circuit board and the semiconductor chip at the bonding position with the bonding head without performing the bonding stage, and without moving the entire bonding head. By finely moving only the bonding tool that sucks and holds the chip, even in the case of bonding to a heavy and large circuit board, the positional precision of the circuit board and the semiconductor chip at the bonding position can be precisely and easily adjusted. They have found what they can do.

Second, the bonding stage is mounted on a stage movement control device composed of an XY table, a stage base mounted on a slide table of an upper table constituting the XY table, and a stage base. A board receiver mounted thereon, a gate-type perspective mount mounted on a slide table of a lower table constituting an XY table, and a stage capable of moving up and down horizontally between the substrate receiver and the portal-type perspective mount. By providing the bonding stage side with a special structure, such as a suction plate mounted on the base and a plurality of suction pads mounted on the suction plate, in bonding under even greater pressing conditions Can prevent the occurrence of distortion in the bonding stage and perform bonding with high accuracy. In which it has been found that it is possible.

[0012]

That is, a chip bonding method according to the present invention is a board positioning stage for controlling the movement of a bonding stage supporting the circuit board so as to transfer the circuit board and position the circuit board at a bonding position. A movement control step; a board position detection step of detecting, with a camera, a precision positioning reference alignment mark of the circuit board positioned at the bonding position; and a suction tool held by a bonding tool provided in a bonding head at the bonding position. A chip position detecting step of detecting the alignment mark for precise positioning reference of the semiconductor chip with the camera, and calculating the position shift amount between the two alignment marks detected by the camera. Positional precision matching After Tsu, wherein the chip bonding method comprising the bonding step of bonding by the bonding head, the positional precision alignment between the circuit board and the semiconductor chip, the bonding scan
Fixed the position of the stage and the bonding head
Remains, and is characterized in that performed by fine movement only the bonding tool.

According to a first aspect of the present invention, there is provided a chip bonding apparatus including a bonding head having a bonding tool for sucking and holding a semiconductor chip, a bonding stage for supporting a circuit board, and a bonding stage transferred by the bonding stage. A camera for detecting an alignment mark for precision positioning reference of the circuit board positioned at a position and detecting an alignment mark for precision positioning reference of the semiconductor chip sucked and held by the bonding tool at the bonding position; and A camera movement control device for controlling the movement of the circuit board into the imaging field of view, and a stage movement control device for controlling the movement of the bonding stage so as to position the circuit board at the bonding position. A chip bonding apparatus configured to perform positional precision matching between the circuit board and the semiconductor chip based on the calculated result of the positional shift amount between the two alignment marks, and then perform bonding by the bonding head. Bonding the bonding head to the bonding head;
The apparatus is characterized in that the position of the page is fixed, and only the bonding tool is finely moved to perform the precise positional alignment.

According to a second aspect of the present invention, there is provided a chip bonding apparatus including a bonding head having a bonding tool for sucking and holding a semiconductor chip, a bonding stage for supporting a circuit board, and bonding transferred by the bonding stage. A camera for detecting an alignment mark for precision positioning reference of the circuit board positioned at a position and detecting an alignment mark for precision positioning reference of the semiconductor chip sucked and held by the bonding tool at the bonding position; and A camera movement control device for controlling the movement of the circuit board into the imaging visual field, and controlling the movement of the bonding stage so as to position the circuit board at the bonding position, and the bonding tool at the bonding position. Prior to detecting the alignment mark for precision positioning reference of the semiconductor chip held by suction with the camera, a stage movement control device for controlling the movement of the bonding stage so as to retreat outside the imaging field of view of the camera, In addition, after performing precise positional alignment between the circuit board and the semiconductor chip based on the calculation result of the amount of positional deviation between the two alignment marks detected by the camera, bonding can be performed by the bonding head. In the chip bonding apparatus, the stage movement control device is configured by an XY table, and the bonding stage is mounted on a stage base mounted on a slide table of an upper table forming the XY table, and on the stage base. With the mounted board receiver A gate-type perspective mount mounted on a slide table of a lower table constituting the XY table, and a suction plate mounted on the stage base so as to be located between the substrate receiver and the portal-type transparent mount And a plurality of suction pads mounted on the suction plate, and one end on which an electrode is formed by suction-holding the circuit board with the suction pad group is formed by the portal-type see-through mount. The camera is moved into a space defined by the portal-type perspective gantry positioned at the bonding position in a state where the camera is supported and the opposite other end is supported by the substrate receiver, and a precision positioning reference of the circuit board is obtained. Alignment mark is detected, and then the slide table of the lower table is moved and the portal <br/> in those characterized by by said camera in a state retracted from the ring position by being configured so as to detect the alignment marks for precision positioning reference of the semiconductor chip Ru Oh.

[0015]

In FIG. 1, a circuit board 1 indicated by a chain line is shown.
Is one end of which is the substrate receiver 3 of the bonding stage 2.
And the other end on which the electrode is formed is supported by the portal-type see-through frame 4 and is suction-held by a plurality of suction pads 6 mounted on the suction plate 5. In addition, a transparent glass 7 is mounted on an upper end of the portal-type transparent gantry 4.

In this state, the CCD camera 9 mounted on the camera movement control device 8 constituted by an XYZ table is moved by the drive control of the camera movement control device 8, and the imaging head 10 is moved to the gate-type see-through frame 4. Then, the alignment mark for precision positioning reference, which is moved to the inside of the space area 11 defined by the above and is marked on one end of the circuit board 1 supported by the portal-type see-through frame 4, is detected from below.

Subsequently, the lower table 1 which is an X table
The second slide table 13 is moved in the Xa direction, and the portal-type see-through gantry 4 is retracted from the bonding position A. Then, the CCD camera 9 detects, from below, the alignment mark for precision positioning reference, which is marked on the semiconductor chip 16 which is held by the bonding tool 15 of the upper bonding head 14 located at the bonding position A by suction. I do.

Next, the slide table 13 of the lower table 12 is moved in the Xb direction, the portal-type see-through gantry 4 is returned to the bonding position A, and the bonding tool 15 is set in a predetermined manner so as to eliminate the displacement between the two alignment marks. The movement is controlled, whereby the circuit board 1 and the semiconductor chip 16 are precisely aligned in position. Thereafter, the bonding head 14 moves downward to perform the heat compression bonding, that is, bonding.

At this time, only the bonding tool 15, which is a part of the head, is finely moved on the side of the bonding head 14 on which the load of the circuit board 1 does not act and without finely moving the entire bonding head 14.
Matching can be performed with high accuracy. Further, since one end on the bonding side of the circuit board 1 is supported by the gate-type see-through pedestal 4 mounted on the slide table 13 of the lower table 12, it is possible to further reduce the distortion of the bonding stage 2 during bonding. it can.

When bonding is completed and the bonding head 14 is moved to its original position above, the suction plate 5 is moved upward, and the circuit supported by the substrate receiver 3 and the gate-type see-through gantry 4 is moved. The substrate 1 is moved upward, and the slide table 18 of the upper table 17, which is a Y table, is moved in the Yb direction. Note that this movement is performed so that the position where bonding is subsequently performed is positioned at the bonding position A. Therefore, bonding can be performed one after another through the same steps as described above.

[0021]

FIG. 2 shows an overall perspective view of a chip bonding apparatus. A bonding head 14, a bonding stage 2, a CCD camera 9, a chip slider 21, a chip loader 22 and the like are mounted on a machine base 20. However, the chip loader 22 mounts a cylinder 24 on an arm 23 mounted so as to be movable in XY directions orthogonal to each other in a horizontal plane, and attaches a suction pad 25 to the rod end of the cylinder 24.
Is configured.

Therefore, the movement of the arm 23 in the XY directions and the movement of the suction pad 25 by the cylinder 24 in the Z direction (vertical direction) are controlled by the chip tray 26.
The semiconductor chip 16 can be sucked and held from the predetermined storage section and transferred to the outer shape positioning plate 27. The outer shape positioning plate 27 is mounted horizontally on the machine base 20, and has a pair of L-shaped chip pressing plates 28 mounted on the upper surface thereof as shown in FIG. .

Therefore, the semiconductor chip 16 sucked and held by the suction pad 25 and transferred between the two chip pressing plates 28 is controlled by the movement control of the arm 23 in the direction indicated by the arrow (XY direction). It is brought into contact with the pressing plate 28, and is positioned so that the center thereof is sucked and held by the suction pad 25.

At this time, the semiconductor chip 16 is positioned by being sucked and held at such a height that the lower surface thereof does not contact the upper surface of the outer shape positioning plate 27.
6 can prevent damage to the surface to be bonded, that is, the lower surface. According to such a chip positioning method, even if the size of the semiconductor chip 16 changes, the movement control of the chip loader 22 can be prevented. This can be dealt with simply by changing the program in a predetermined manner. Therefore, it is possible to easily deal with a change in chip size without replacing the jig.

Subsequently, when the positioning is completed,
The movement control of the arm 23 in the XY directions and the cylinder 24
Control of the suction pad 25 in the Z direction by the
The semiconductor chip 16 is transferred onto the chip slider 21 and the slider 21 is moved toward the bonding head 14. Note that the tip slider 21
Is mounted so as to be able to move horizontally by being screwed to a screw shaft driven and rotated by a servo motor (not shown), and from the chip receiving position B (origin) to the bonding head 14.
Is moved horizontally to the chip standby position approached by.

When the bonding head 14 finishes bonding below it and returns to the head origin above, the chip slider 21 is moved below the bonding head 14 from the standby position. Therefore, the semiconductor chip 16 is connected to the bonding head 1.
4 can be quickly transferred.

Next, the bonding head 14 is mounted at the bonding position A.
A support 30 mounted on the machine base 20 includes a reaction force receiver 31 mounted on the upper end of the support 30. That is, in FIG. 4 showing the enlarged view, the bracket vertical guide 32 and the Z table 33 are mounted on a box-shaped bracket 34 (see FIG. 2) mounted on the machine base 20, and The cylinder bracket 35 is mounted so as to be slidable in the Z direction (vertical direction) guided by the bracket vertical guide 32, and the head bracket 36 is also mounted on the cylinder bracket 35.
It is mounted so as to be guided by the Z table 33 and slide in the same direction.

The head bracket 36 is mounted on an XY table 38a constituting the upper part of the XYθ table 38, and the tool bracket 37 is mounted on the XYθ table 38.
It is mounted on a θ table 38b constituting a lower portion of the table 38.

The Z table 33 is provided with a servo motor 3
9, a screw shaft feed mechanism (not shown) for rotating the screw shaft to feed the pitch is provided. The head bracket 36 is linked to this mechanism. Therefore, when the head bracket 36 is moved via such a mechanism, the tool bracket 37 is also moved.

On the other hand, the piston rod 42 of the air cylinder 41 mounted on the cylinder bracket 35
Is positioned concentrically with the pressurizing transmission shaft 43 in the vertical direction, and the lower end of the piston rod 42 is normally (when the piston rod 42 is immersed in the upper origin position as shown). Are separated from the upper end of the pressure transmission shaft 43 at a constant interval.

The pressure transmitting shaft 43 includes a head bracket 36, an XYθ table 38, and a tool bracket 37.
It is mounted so that it can move up and down through
The lower end is in contact with the upper end of the bonding tool 15 and is prevented from coming off. The bearing 19 is mounted on the head bracket 36.

Therefore, with the head bracket 36 and the tool bracket 37 stationary, the piston rod 42 of the air cylinder 41 is protruded downward so that the lower end thereof is in contact with the upper end of the pressure transmission shaft 43, By further projecting downward, the pressure transmission shaft 43 can be slid downward, and by thus sliding the pressure transmission shaft 43 downward, the lower end of the bonding tool 15 is pushed. It can be moved down.

When the piston rod 42 projecting downward is sunk and moved upward, the pressure transmitting shaft 43
Is pushed by the bonding tool 15 attached to the tool bracket 37 via an elastic body (coil spring) 47 and slid upward to return to an original position, as described later. .

In addition, one end of the bonding tool 15 is suctioned through a pressure-resistant hose connected to an intake passage (not shown) provided at a lower end portion (tip end portion) of the tool 15. By doing so, the semiconductor chip 16 can be sucked and held by suction from the suction hole opened in the lower end surface of the tool (chip suction holding surface) so as to be communicated with the suction passage, and a heater is built in. The device 44 (see FIG. 2) is configured so that it can be quickly heated to a predetermined temperature, and
An elastic body (coil spring) 47 is locked to the pin 45 mounted on the pin 7 and the pin 46 mounted on the bonding tool 15 (also locked on the opposite side (not shown)). That is, the pair of elastic bodies (coil springs) 4
7, it is mounted in a state of being suspended from the tool bracket 37.

The tool 15 has a guide portion 51 which is slidably inserted into the vertical guide hole 40 of the tool bracket 37. Therefore, when the head bracket 36 is moved downward. The bonding tool 15 also moves in the same direction following the tool bracket 37 that is moved downward integrally with the table 36. Conversely, when the head bracket 36 is moved upward, the bonding tool 15 also moves. Move in the same direction.

Similarly, an elastic body (coil spring) 50 is also engaged with a pin 48 attached to the cylinder bracket 35 and a pin 49 attached to the reaction force receiver 31. The load cell 29 is mounted on the upper surface of the cylinder bracket 35. The other end of the pressure-resistant hose is connected to a vacuum pump (not shown).

The head bracket 36 is moved downward by the screw shaft feed mechanism of the Z table 33 to position the bonding tool 15 at the bonding start height, and then the piston rod 42 of the air cylinder 41 is moved downward. , And can be heated and pressed, that is, bonded.

When the bonding is completed, the piston rod 42 of the air cylinder 41 is retracted to return to the upper origin position, and the head bracket 36 is moved upward by the screw shaft feed mechanism of the Z table 33 to form a bonding tool. 15 can be returned to the upper origin position.

FIG. 4 shows this state, but when the semiconductor chip 16 is transferred below the chip slider 21 by the chip slider 21, the screw shaft feed mechanism of the Z table 33 continuously moves the semiconductor chip 16 downward. Is moved by a predetermined stroke to the semiconductor chip 1 on the chip slider 21.
6 is sucked and held by the bonding tool 15 and then returned to the upper origin position.

As described above, the bonding head 14 is
The semiconductor chip 1 is always mounted at the bonding position A so that it cannot be moved from the bonding position A to another place.
6 is provided so as to be held by suction. Therefore, the bonding head 14 is moved to a position other than the bonding position A to hold the semiconductor chip 16 by suction, and the semiconductor chip 16 is returned to the bonding position A. Shortening can be achieved.

Next, in FIG. 1 which is an enlarged view, the bonding stage 2 is mounted on a stage movement control device 55, and the movement control device 55 includes a lower table 12 which is an X table and a Y table. The slide table 13 of the lower table 12 is guided by a fixed-side table 56,
The upper table 17 is mounted on the slide table 13, that is, the slide table 18 of the upper table 17 is fixed by the fixed table 57 mounted on the slide table 13. It is mounted so that it can be guided and moved in the Y direction.

On the other hand, the bonding stage 2 includes a stage base 58 mounted on the slide table 18,
It comprises a substrate receiver 3 and a suction plate 5 mounted on the base 58, and a gate-type see-through frame 4 mounted on the slide table 13 of the lower table 12. The substrate receiver 3 is mounted on the upper end of the stage base 58 so as to be movable by being guided by a pair of guide rails 59 extending in the X direction.
As shown in FIG. 5 which is a longitudinal sectional view of FIG. 5, the movable bracket 6 attached to the tip of the piston rod of the air cylinder 60 attached to the stage base 58.
1 and mounted so as to be able to move up and down horizontally by the cylinder 60.

The movable bracket 61 is mounted so as to be movable by being guided by left and right vertical guide rails 62 mounted on the stage base 58. in addition,
The suction plate 5 is provided with a plurality of suction holes 63 and is connected to the suction plate 5 so as to communicate with the holes 63.
A plurality of suction pads 6 are mounted on the upper surface side of. Therefore, by connecting the other end of the pipe line 64, one end of which is connected to a vacuum pump (not shown), to the suction port of the suction plate 5, suction can be performed from the suction pad group 6.

FIG. 5 shows a vertical section of the gate-type see-through gantry 4, which is provided at substantially the same level as the substrate receiver 3, and has a see-through glass 7 mounted on the upper end thereof. . It is preferable that the upper surface of the transparent glass 7 is slightly higher than the upper surface of the substrate receiver 3, and a transparent hole 65 is provided below the transparent glass 7.

Further, the CCD camera 9 is mounted on a camera movement control device 8 composed of an XYZ table. That is, the movement control device 8 is configured by mounting the Y table 71 on the lower X table 70 and mounting the Z table 72 on the Y table 71, and
The CCD camera 9 is mounted on the Z table 72. The Z table 72 is mounted so as to be movable in the Z direction by driving and rotating a screw shaft 74 by a servo motor 73.

Each of the slide tables 1 constituting the stage movement control device 55 and the camera movement control device 8
3, 18, 75, and 76 are also mounted so as to be movable via a screw shaft feed mechanism that rotates the screw shaft by the servo motor 73 to feed the pitch.

According to this bonding apparatus,
Thermocompression bonding, that is, bonding can be performed as follows. In addition, when performing bonding,
The circuit board 1 is supplied onto the bonding stage 2, which is performed by an operator while the slide table 18 of the upper table 17 is moved in the Ya direction. At this time, the bonding head 14 has been moved to an upper head origin position. In the suction plate 5 of the bonding stage 2 moved in the Ya direction, the upper end of the suction pads 6 mounted on the suction plate 5 is positioned slightly above the upper surface of the substrate receiver 3 or the gate-type see-through frame 4. Has been moved upward via the cylinder 60.

Then, the worker puts on the suction pad 6 group,
When the circuit board 1 is placed so that one end on which the electrode is formed is positioned on the side of the gate-type see-through frame 4, suction by a vacuum pump (not shown) is started, and the circuit board 1 is moved to the suction pad group 6. Is held by suction. Next, the slide table 18 of the upper table 17 is moved in the Yb direction, and the first bonding position is the bonding position A.
, And then the suction plate 5 is moved downward via the cylinder 60.

This is shown in FIG. In the figure, a circuit board 1 is supported by a gate-type see-through pedestal 4 and a board receiver 3 which have been moved to a bonding position A while being suction-held by a group of suction pads 6. At the same time, the semiconductor chip 16 is transferred to the bonding position A by the chip slider 21 and is held by the bonding tool 15 of the bonding head 14. This state is shown in FIG.

Subsequently, the CCD retracted in the Xb direction
The camera 9 is driven by the camera movement control device 8 to control Xa
And the imaging head 10 is moved in the direction
Then, the alignment mark for precise positioning reference, which is moved into the space area 11 defined by the above and is marked on one end of the circuit board 1 supported by the gate-type see-through frame 4, is detected from below. At that time, the camera movement control device 8
Drive control is performed in a predetermined manner so that the tables 72, 75, and 76 are moved in predetermined directions selected from the X, Y, and Z directions as needed.

When the detection is completed, the slide table 13 of the lower table 12 is moved in the Xa direction, and the gate-type see-through gantry 4 is retracted from the bonding position A to the Xa side, that is, out of the field of view of the CCD camera 9. Will be evacuated. Then, the CCD camera 9 detects the alignment mark for precision positioning reference, which is marked on the semiconductor chip 16 that is held by the bonding tool 15 above the suction tool, from below. At that time, if necessary, C
The CD camera 9 is moved in the Za direction. And
When this detection is completed, the process returns to the original retreat position on the Xb side.

Subsequently, the slide table 13 of the lower table 12 is moved in the Xb direction, the portal-type see-through gantry 4 is returned to the bonding position A, and the bonding tool 15 eliminates the positional deviation between the two alignment marks. Is controlled in a predetermined manner,
The circuit board 1 and the semiconductor chip 16 are precisely aligned in position. The determination of the displacement between the two alignment marks is performed in the image processing system, and based on the result, such movement control, that is, movement control of only the bonding tool 15 is performed. At this time, the bonding tool 15 is finely moved by the XYθ table 38 in a predetermined direction selected from the X direction, the Y direction, and the θ rotation.

In other words, the positional precision matching between the circuit board 1 and the semiconductor chip 16 at the bonding position A is
Only the bonding tool 15 attached to the lower end of the bonding head 14 for sucking and holding the semiconductor chip 16 is slightly moved by the bonding head 14 without moving the bonding stage 2 and without moving the entire bonding head 14. Let me go.

Therefore, even when bonding to the heavy and large circuit board 1, regardless of the fact, the circuit board 1 and the semiconductor chip 16 at the bonding position A are connected.
And high-precision position matching with high accuracy can be easily performed. In addition, by performing such positional precision matching a plurality of times as necessary, more precise matching can be achieved.

Note that calibration is performed as necessary because accuracy in the order of microns is required. That is, the reference index provided in the bonding tool 15 is controlled by a predetermined correction parameter obtained by driving the XYθ table 38 or the camera movement control device 8 in a predetermined manner and searching the reference index with the CCD camera 9. Various parameters input to the system (for example, the rotation center of the θ table in the XYθ table 38, the axis inclination of the X table and the Y table, the actual feed amount, or the axis inclination of each table in the camera movement control device 8) , The actual feed amount, etc.). Thereby, even if the mechanical characteristics change over time, the bonding accuracy can be kept high.

Thereafter, when the precision alignment is completed, the bonding head 14 moves downward to perform heat compression bonding, that is, bonding. This is because Z
Via the table 33, the bonding tool 15 at the upper origin position is moved downward to be positioned at the bonding start position close to the circuit board 1, and then the air cylinder 41 is bonded by projecting the piston rod 42 downward. The tool 15 is pressed against the circuit board 1.

At this time, one end of the circuit board 1 to be bonded, that is, one end to which a large pressing force is applied, is supported by the gate-type see-through mount 4 mounted on the slide table 13 of the lower table 12. Therefore, the occurrence of stage distortion, which has been regarded as a problem when the bonding stage is mounted in a cantilever structure, can be prevented even in bonding under a larger pressing condition, and bonding can be performed with high precision. it can.

When the bonding head 14 is returned to the upper origin position after the bonding, the suction plate 5 is moved upward through the air cylinder 60, and is supported by the substrate receiver 3 and the gate-type see-through frame 4. The moved circuit board 1 is moved upward, and in this state, the slide table 18 of the upper table 17, which is the Y table, is moved in the Yb direction.

This movement is performed so as to position the portion to be subsequently bonded at the bonding position A.
Thereafter, the suction plate 5 is moved downward, and the circuit board 1 is moved.
Is again supported by the substrate receiver 3 and the gate-type see-through frame 4.
Therefore, bonding can be performed one after another with high accuracy through the same steps as described above. The bonding tool 1
The suction holding of the semiconductor chip 16 by 5 is released when the bonding is finished, and when the semiconductor chip 16 is received, the suction is started and the suction holding can be performed.

As described above, the board positioning stage movement control step of controlling the movement of the bonding stage 2 supporting the circuit board 1 so as to transfer the circuit board 1 and position it at the bonding position A; A substrate position detecting step of detecting the alignment mark for precision positioning reference of the circuit board 1 from below the circuit board 1 with the CCD camera 9, and being sucked and held by the bonding tool 15 provided in the bonding head 14 at the bonding position A. A chip position detecting step of detecting the alignment mark for precise positioning reference of the semiconductor chip 16 from below the bonding head 14 with the CCD camera 9, and the bonding stage 2 is retracted out of the field of view of the CCD camera 9 prior to the chip position detecting step. Like bondin The evacuation stage movement control step for controlling the movement of the stage 2 and the positional precision alignment between the circuit board 1 and the semiconductor chip 16 based on the calculation result of the amount of displacement between the two alignment marks detected by the CCD camera 9 are performed by a bonding tool. After performing only a slight movement of only 15, chip bonding is performed through a bonding step of bonding with the bonding head 2.

If the size of the circuit board 1 to be bonded next is different from that of the preceding circuit board, the board receiver 3 is moved to the Xb side and is moved to a predetermined position by a suitable means such as a set screw. The circuit boards 1 having different sizes can be successively bonded by such a simple adjustment work. At this time, as described above, since the portal-type perspective gantry 4 is not mounted on the slide table 18 of the upper table 17 but is mounted on the slide table 13 of the lower table 12, bonding under a large pressing condition is performed. Also, it is possible to prevent distortion from occurring in the bonding stage.

The embodiment according to the present invention has been described above. However, in the present invention, the circuit board to be bonded is not limited to a transparent substrate such as a liquid crystal substrate, but may be another opaque circuit board. Alternatively, the upper table may be arranged in the X direction and the lower table may be arranged in the Y direction, and the board receiver is mounted so that it can be automatically moved via a screw shaft feed mechanism or the like. You may.

The alignment mark for positioning reference, which is to be marked on the semiconductor chip and the circuit board, may have any form. Further, it is preferable that the bonding head is mounted so as not to be moved from the bonding position to another position. So-called mobile type.

For mounting the suction plate, a large portal-type see-through table is installed, that is, for example, a support upper end surface (upper end surface for supporting the circuit board) longer than the entire length of the circuit board can be formed. When a large portal-type see-through table is installed, it may be mounted in a form that does not move up and down.

[0065]

As described above, according to the first to fifth aspects of the present invention, even when bonding to a heavy and large circuit board, the positional precision of the circuit board and the semiconductor chip can be precisely adjusted by the bonding stage and the bonding stage. Bonding
With the position of the pad fixed, only the bonding tool
By performing the fine movement , precise positional alignment between the circuit board and the semiconductor chip at the bonding position can be easily performed with high precision. Further, according to the invention as set forth in claim 6, it is possible to perform bonding to a large and small circuit board, and it is possible to prevent the bonding stage from being distorted even under bonding under a larger pressing condition, and to achieve a high level. Bonding can be performed with high precision, and it is possible to bond opaque circuit boards as well as transparent circuit boards.
You.

[Brief description of the drawings]

FIG. 1 is an enlarged perspective view of a bonding stage unit.

FIG. 2 is a perspective view showing an overall configuration of a chip bonding apparatus.

FIG. 3 is a perspective view showing an external form positioning mode.

FIG. 4 is a perspective view of a bonding head.

FIG. 5 is a longitudinal sectional view of FIG.

[Explanation of symbols]

 A Bonding position 1 Circuit board 2 Bonding stage 3 Substrate receiver 4 Gate-type transparent table 5 Suction plate 6 Suction pad 7 Transparent glass 8 Camera movement control device 9 CCD camera 10 Imaging head 12 Lower table 13 Slide table 14 Bonding head 15 Bonding tool 16 Semiconductor chip 17 Upper table 18 Slide table 55 Stage movement controller 58 Stage base

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Masanori Akita 1-1-45 Oe, Otsu City, Shiga Prefecture Examiner at Toray Engineering Co., Ltd. Noboru Nakazawa (56) References JP-A-4-130636 (JP, A) JP-A-58-80893 (JP, A) JP-A-49-8166 (JP, A) JP-A-8-330393 (JP, A) JP-A 8-335609 (JP, A) JP-A-6 JP-A-84977 (JP, A) JP-A-6-69286 (JP, A) JP-A-6-236904 (JP, A) JP-A-4-199525 (JP, A) JP-A-2-226737 (JP, A) (58) Fields surveyed (Int. Cl. ⁷ , DB name) H01L 21/60 311

Claims (6)

(57) [Claims] A stage for controlling the movement of a bonding stage supporting the circuit board so as to transfer the circuit board and position the circuit board at a bonding position; and a step of moving the circuit board positioned at the bonding position. A substrate position detecting step of detecting the alignment mark for precise positioning reference with a camera, and detecting the alignment mark for precision positioning reference of the semiconductor chip sucked and held by a bonding tool provided in the bonding head at the bonding position with the camera After performing a chip position detecting step and performing precise positional alignment between the circuit board and the semiconductor chip based on a calculation result of a positional shift amount of both alignment marks detected by the camera, bonding by the bonding head And a step of precisely positioning the circuit board and the semiconductor chip with the bonding stage and the semiconductor chip.
A chip bonding method characterized in that the bonding is performed by slightly moving only the bonding tool while the position of the bonding head is fixed . 2. The chip bonding method according to claim 1, wherein the fine movement of the bonding tool at the time of precise positional alignment between the circuit board and the semiconductor chip is performed in at least one of the XYθ directions. 3. The chip bonding method according to claim 1, wherein the holding of the semiconductor chip by the bonding tool is always performed at the bonding position. 4. The chip bonding method according to claim 1, wherein the precise positional alignment between the circuit board and the semiconductor chip is performed a plurality of times. 5. A bonding head having a bonding tool for sucking and holding a semiconductor chip, a bonding stage for supporting a circuit board, and a precision positioning reference for the circuit board transferred by the bonding stage and positioned at a bonding position. A camera that detects an alignment mark and detects an alignment mark for precise positioning reference of the semiconductor chip that is suction-held by the bonding tool at the bonding position; and a camera movement control device that controls movement of the camera into an imaging field of view. A stage movement control device that controls the movement of the bonding stage so as to position the circuit board at the bonding position, and calculates a displacement amount between the two alignment marks detected by the camera. In a chip bonding apparatus configured to perform precise positional alignment between the circuit board and the semiconductor chip based on the bonding head, the bonding head is connected to the bonding head and the bonding step.
A chip bonding apparatus configured to perform the positional precision alignment by finely moving only the bonding tool while fixing the position of the page . 6. A bonding head having a bonding tool for sucking and holding a semiconductor chip, a bonding stage for supporting a circuit board, and a precision positioning reference for the circuit board transferred to the bonding position and positioned at a bonding position by the bonding stage. A camera that detects an alignment mark and detects an alignment mark for precise positioning reference of the semiconductor chip that is suction-held by the bonding tool at the bonding position; and a camera movement control device that controls movement of the camera into an imaging field of view. Moving the bonding stage so as to position the circuit board at the bonding position, and precisely positioning the semiconductor chip suction-held by the bonding tool at the bonding position. A stage movement control device that controls the movement of the bonding stage so as to be retracted out of the imaging field of view of the camera prior to detecting the corresponding alignment mark with the camera, and the alignment mark of both alignment marks detected by the camera. In a chip bonding apparatus configured to perform positional precision matching between the circuit board and the semiconductor chip based on the calculation result of the amount of displacement, and then perform bonding by the bonding head, the stage movement control device may include: An XY table, wherein the bonding stage comprises a stage base mounted on a slide table of an upper table constituting the XY table, a substrate receiver mounted on the stage base, and the XY table. Sly on the lower table A gate-type perspective mount mounted on a table, a suction plate mounted on the stage base so as to be located between the substrate receiver and the portal-type perspective mount, and a plurality of mounted on the suction plate. The circuit board is suction-held by the suction pad group, and one end on which an electrode is formed is supported by the portal-type see-through frame and the other end is supported by the substrate receiver. In this state, the camera is moved into a space defined by the portal-type perspective gantry positioned at the bonding position to detect the alignment mark for precise positioning reference of the circuit board, and then the lower table In the state where the slide table is moved to retract the gate-type perspective gantry from the bonding position, the slide table is moved forward by the camera. Chip bonding apparatus characterized by being configured so as to detect the alignment marks for precision positioning reference of the semiconductor chip.