CN115036250A - Multifunctional chip mounting device and chip mounting method thereof - Google Patents
Multifunctional chip mounting device and chip mounting method thereof Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Abstract
The invention provides a multifunctional chip mounting device and a chip mounting method thereof, wherein the method comprises the following steps that a welding arm component picks up and adsorbs a chip to be mounted from a material box; the double-visual-field visual assembly is moved into the lower surface of the chip to be pasted and is aligned with the chip to be pasted; the coarse movement mechanism moves the chip mounting substrate into the field of view range of the double-field-of-view vision assembly and fixes the position of the wafer bearing table; the double-sided imaging lens simultaneously collects the alignment marks of the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate, and the fine adjustment mechanism moves and adjusts the position of the chip mounting substrate in the three-dimensional direction according to the alignment result of the double-vision visual assembly so as to ensure that the positions of the chip to be mounted and the chip mounting substrate are overlapped; after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of a mounting area of the chip to be mounted; the dispensing assembly moves vertically along with the welding arm assembly, and the chip to be mounted is mounted on the chip mounting substrate. Therefore, the invention improves the patch precision under the condition of being compatible with larger patch force.
Description
Technical Field
The invention relates to the field of integrated packaging of integrated circuit chips, in particular to a multifunctional chip mounting device and a chip mounting method thereof.
Background
With the emerging development of the industries such as big data, optical communication, artificial intelligence, and laser, higher requirements are put on the operation speed, volume, and bandwidth of a semiconductor chip, and also, the performance such as low power consumption, low heat generation, and large storage capacity should be considered.
In addition, as the requirement on the manufacturing precision of the chip is higher and higher, the requirement on the integrated interconnection of the chip is higher. It is clear to those skilled in the art that the integrated interconnection technology of chips goes through conventional packaging and advanced packaging processes. That is to say, eutectic flip, 2.5D package and 3D package technologies are more and more emphasized by various large package manufacturers, and especially, various experimental equipments for chip integrated package are promoted in research and development of various schools and scientific research units for industries such as high bandwidth communication and high power semiconductor laser. Among them, chip mounters (eutectic bonding machines and bonding machines) are important devices for package interconnection applications.
In the chip packaging interconnection technology, due to the difference of integration processes and applications, various mounting processes often appear, for example, the mounting process is divided into a normal mounting mode and an inverted mounting mode according to a placement mode, and the forming process is divided into processes such as a dispensing process, an eutectic welding process, ultrasonic welding, hot-press welding, laser welding and the like according to a connection mode.
The chip mounting device generally comprises an adsorption module for carrying a chip to be mounted, a chip bearing table for placing materials such as a chip or a substrate and the like, an alignment and contraposition module for aligning the chip and the chip or the chip and the substrate and other auxiliary modules according to functional requirements.
Due to the diversity of the mounting process, the mounting device needs to meet the functional requirements of large-range size, large pressure, high precision, rapid heating and the like, and also needs to have low cost. The chip is carried to current paster device adoption adsorption component generally adopts horizontal swinging boom transmission to carry the chip, perhaps turns over the arm perpendicularly and carries the chip, pastes the dress in-process at the chip, often presents the problem that the paster power is applyed inadequately.
In order to apply a large chip-mounting force, the up-and-down moving rotating arm is adopted to transfer and carry the chip, and the chip alignment module in the chip-mounting device usually needs to adopt a plurality of visual alignment units, for example, a set of visual alignment units is arranged up and down respectively, and the alignment of the chip and the substrate is realized according to the coordinate conversion relationship of each visual alignment unit.
However, the above scheme introduces multiple references and calibration links, so that the implementation mechanism is complex, and if the alignment vision unit is replaced by a microscope and placed above the welding arm or on the side edge, only the edge of the chip can be observed, and in the flip process, the bottom features of the chip, such as bumps, cannot be collected, so that the accuracy of the chip mounting is poor.
Therefore, how to improve the patch precision of the patch device on the premise of reducing the manufacturing cost and the volume is a problem which is also urgently needed to be solved in the industry at present.
Disclosure of Invention
The invention aims to provide a multifunctional chip mounting device and a chip mounting method thereof, so that the multifunctional chip mounting device can be compatible with larger chip mounting force and improve chip mounting precision in the processes of research, development and manufacture of chip packaging and small-batch production.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a multi-functional patch device, comprising:
the welding arm assembly vertically moves up and down and comprises a clamping piece, an adsorption piece arranged on the clamping piece and a driving assembly for controlling the clamping piece to vertically move, wherein the adsorption piece is provided with a group of vacuum inner holes for picking and placing a chip to be pasted and vertically moves along with the clamping piece;
the dispensing assembly is arranged on the welding arm assembly and vertically moves along with the welding arm assembly; the dispensing assembly comprises a dispensing slide rail and a dispensing head which reciprocates on the axis of the dispensing slide rail, and the axis of the dispensing slide rail and the vertical moving axis of the welding arm assembly are arranged at an angle theta; the dispensing head is overlapped with the axis of the welding arm assembly when moving to the lowest end;
the double-vision visual assembly moves horizontally, and is positioned on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate in the alignment calibration process; the optical axis of the double-vision visual assembly is coaxial with the axis of the welding arm assembly; after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted;
a wafer stage comprising a mounting stage; the mounting table is used for bearing the chip mounting substrate, and the coarse movement mechanism and the fine adjustment mechanism move and adjust the position of the mounting table in the three-dimensional direction according to the calibration result of the double-vision visual component in the alignment calibration process;
the double-sided imaging lens collects the alignment marks of the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate at the same time and transmits the alignment marks to the control assembly, and the control assembly adjusts the position of the chip mounting substrate to enable the chip to be mounted to be accurately attached to the chip mounting substrate.
Furthermore, multi-functional paster device, still include a set of side look supplementary sensing subassembly, set up in weld one side of left and right sides of arm subassembly for observe in real time in the subsides dress in-process technology problem in the side, side look supplementary sensing subassembly include a set of camera lens, the camera lens support that can zoom and be used for adjusting the slide rail of camera lens position and around the installation the rotatory anchor clamps of camera lens support. In addition, in the mounting process, when the chip to be mounted is close to the substrate, the rechecking function of the alignment calibration of the chip is completed by the aid of the edge characteristics of the chip to be mounted.
Further, the driving assembly is a first motor, the first motor drives the clamping piece to move linearly, the chip to be mounted is picked up and placed, chip mounting force is provided, and the force application direction of the chip mounting force and the force application point of the chip mounting force are on the same axis.
Further, the driving assembly further comprises a second motor, a force measuring unit, a buffer unit and an adsorption tool, wherein the second motor drives the second motor to rotate, and according to the detection result of the force measuring unit, the buffer unit enables the chip mounting force provided by the adsorption tool to be a preset value so as to ensure that the chip to be mounted is smooth, impact-free and position-offset-free.
Furthermore, the wafer bearing table also comprises a coarse movement mechanism, a fine adjustment mechanism and a locking mechanism; the coarse movement mechanism is a group of air floatation units comprising a plurality of air floatation cushions, the fine adjustment mechanism is arranged on the coarse movement table and used for aligning the chip to be mounted and the chip mounting substrate, and the locking table is positioned between the air floatation units and the supporting table; after the coarse movement mechanism moves in place, the coarse movement mechanism is fixed by opening the vacuum adsorption unit or the electromagnetic adsorption unit on the locking platform.
Further, a heating unit is arranged in the mounting table and used for heating the chip to be mounted or the chip mounting substrate.
Furthermore, the zoom lens is a double-sided imaging lens, and the dual-field-of-view visual assembly further comprises an image acquisition unit and a GUI monitoring interface; and the GUI monitoring interface receives the image acquired by the image acquisition unit and visually displays the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.
Further, when in the normal mounting, the pitch of the alignment point on the chip to be mounted with respect to the alignment point on the chip mounting substrate is δ.
Further, when the chip mounting substrate is mounted in an inverted mode, the position of the chip mounting substrate is adjusted through the fine adjustment mechanism, and whether the bumps of the chip to be mounted and all the bumps of the chip mounting substrate are overlapped in the inverted mode in real-time imaging is observed.
In order to achieve the above purpose, another technical solution of the present invention is as follows:
a multi-functional paster method, it adopts above-mentioned multi-functional paster device, it includes:
step S1: before the chip mounting is started, the welding arm assembly picks up and adsorbs the chip to be mounted from the material box; the chip to be mounted is a flip chip to be mounted or a forward chip to be mounted;
step S2: the double-vision visual assembly moves into the lower surface of the chip to be mounted and aligns with the chip to be mounted; wherein an optical axis of the dual field of view vision assembly is coaxial with an axis of the welding arm assembly;
step S3: the coarse movement mechanism moves the chip mounting substrate into the field of view range of the double-vision assembly and fixes the position of the wafer bearing table; during flip-chip mounting, the double-sided imaging lens simultaneously collects alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; during normal mounting, the double-sided imaging lens preferentially acquires the front information of the chip in step S1, and records the front mark position of the chip to be mounted in a visual interface, and in the step, the upper surface alignment mark of the chip mounting substrate is set through the visual interface; the fine adjustment mechanism moves in the three-dimensional direction to adjust the position of the chip mounting substrate according to the alignment result of the double-vision visual assembly so as to ensure that the positions of the chip to be mounted and the chip mounting substrate are overlapped;
step S4: after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted;
step S5: the dispensing assembly moves vertically along with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.
According to the technical scheme, the multifunctional patch device and the patch method thereof have the following technical effects:
firstly, a multifunctional mounting process such as formal mounting and inverted mounting and a mounting mode such as dispensing, eutectic, hot pressing and the like under the process are met, and mounting accuracy of 1-3 mu m can be realized;
secondly, the chip mounter supports large-pressure and large-size range chip mounting, is simple in alignment operation, flexible in chip mounting method, compact in equipment structure, small in occupied area and suitable for research, development and manufacture of chip packaging and small-batch production;
and thirdly, the device can adapt to a larger substrate size range and a larger pressure range, and simultaneously meets the mounting requirement on high-precision positioning.
Drawings
FIG. 1 is a schematic view of a multi-functional patch device of the present invention
FIG. 2 is a schematic diagram of a dual-field alignment assembly according to an embodiment of the present invention
FIG. 3 is a schematic diagram of a placement mechanism for mounting and dispensing in an embodiment of the invention
FIG. 4 is a schematic view of a bearing table axis measuring mechanism in the embodiment of the invention
FIG. 5 is a flow chart illustrating a multi-function patch method according to an embodiment of the present invention
FIG. 6 is a schematic diagram of the bonding modes of the face-up and the face-down in the embodiment of the present invention
FIG. 7 is a schematic flow chart of the flip-chip thermocompression bonding in the embodiment of the present invention
FIG. 8 is a schematic flow chart of the normal dispensing of the adhesive patch in the embodiment of the invention
1 double-vision assembly 2 welding arm assembly 3 glue dispensing assembly 4 side vision auxiliary observation system
5 holding platform assembly 6 supporting platform 11 to-be-mounted chip 12 substrate 13 double-field-of-view lens
Double-view optical axis of 14 detection camera 15 chip mark 16 substrate mark 17
21 suction additional holder 22 suction piece 23 welding arm axis 31 dispensing head 32 dispensing guide rail
33 dispensing guide rail axis 51 mounting table 52 feeding table 53 rotating table 54 air-floating assembly
541 air floating hole piece 55 inclined platform 551 preload piece 552 precision screw
56X-direction adjusting table 57Y-direction adjusting table 58Z-direction adjusting table 6 supporting platform
71 flip chip 710 flip chip bumps 72 flip substrate 720 flip substrate bumps
73 upright chip 730 upright chip alignment point 74 upright substrate
740 normal mounting substrate alignment point 75GUI monitoring interface 750 normal mounting chip marking line
751 obverse-mounting base plate mark
Detailed Description
The following description of the present invention will be made in detail with reference to the accompanying drawings 1 to 8.
Referring to fig. 1, fig. 1 is a schematic view of a multifunctional patch device of the present invention. As shown in fig. 1, the multifunctional chip mounter includes a dual-view vision assembly 1 moving horizontally, a welding arm assembly 2 moving vertically up and down, a dispensing assembly 3, a side-view auxiliary sensing assembly 4, a chip stage 5 including coarse movement and fine movement, and a control assembly (not shown).
In the alignment calibration process, the double-vision visual assembly is positioned on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; the optical axis of the dual-field-of-view vision assembly is coaxial with the axis of the welding arm assembly; and after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted.
Specifically, the dual-view visual assembly comprises a set of double-sided imaging lenses, a lens bracket, a slide rail for adjusting the positions of the lenses, a clamp for rotating around the lens bracket, an image acquisition unit and a GUI monitoring interface; and the GUI monitoring interface receives the image acquired by the image acquisition unit and visually presents the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.
Referring to fig. 2, fig. 2 is a schematic diagram illustrating a dual-field alignment assembly according to an embodiment of the invention. As shown in fig. 2, the dual-view assembly 1 includes a set of dual-view lens 11 for double-sided imaging and a detection camera 14 for imaging, and the dual-view lens 13 can move to the lower part of the welding arm assembly 2 in the X direction to complete the alignment function, and can also realize high-precision movement in the X direction and the Y direction, thereby expanding the observation alignment range of the vision system in the horizontal direction.
As shown in fig. 2, the component of the mark 11 is a chip to be mounted, the component of the mark 12 is a chip mounting substrate, and a mark or a contour pattern for alignment is formed on the chip mounting substrate, as shown by a mark 15 and a mark 16 in fig. 2, the mark is directly imaged on the detection camera 14, so that the positions of the two marks can be observed in real time, and the misalignment of the upper mark and the lower mark can be displayed.
In order to realize high-precision alignment, the field of view of the dual-field lens 13 is generally small, and the dual-field lens can move in the direction of X, Y to find more pairs of positions to observe whether the positions to be mounted and the postures of the chips are overlapped or not, including horizontal displacement and rotation angle.
In an embodiment of the present invention, the welding arm assembly moving vertically up and down may include a clamping member, an absorption member mounted on the clamping member, and a driving assembly controlling the vertical movement of the clamping member, wherein the absorption member has a set of vacuum inner holes for picking up and placing a chip to be mounted, and moves vertically with the clamping member.
The dispensing assembly is arranged on the welding arm assembly and vertically moves along with the welding arm assembly; the dispensing assembly comprises a dispensing slide rail and a dispensing head which reciprocates on the axis of the dispensing slide rail, and the axis of the dispensing slide rail and the vertical moving axis of the welding arm assembly are arranged in an angle theta; and the dispensing head is superposed with the axis of the welding arm assembly when moving to the lowest end.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating a placement mechanism for mounting and dispensing in an embodiment of the invention. As shown in fig. 3, the welding arm assembly 2 includes a clamping member 21 and an absorbing member 22, and the absorbing member 22 is an assembly having a set of vacuum holes for picking up and placing chips, is mounted on the clamping member 22, and moves vertically along with the clamping member 21, as shown in fig. 3 in the up-down direction of the paper. The dispensing component 3 is arranged on the welding arm component 2 and vertically moves along with the welding arm component 2.
In the embodiment of the present invention, the dispensing assembly 2 includes a dispensing head 31 and a dispensing slide rail 32. The axis 33 of the slide rail and the vertical moving axis 23 of the welding arm component 2 are arranged in a theta angle, the vertical moving axis 23 of the welding arm is coaxial with the optical axis 17 of the double-vision component, and the dispensing head 31 can reciprocate on the axis 33 of the slide rail and moves to the lowest end to coincide with the axis 23 of the welding arm, wherein the theta angle is based on the fact that the tilting motion of the dispensing head 31 and the interference of the adsorption part 22 are not considered, the arrangement ensures that the dispensing head 31 can directly move to the lowest end after the alignment of the chip on the adsorption part 22 of the welding arm is completed, and vertically moves along with the welding arm to complete the dispensing action, after the dispensing is completed, the dispensing head returns to the original initial position, and the chip (not shown in fig. 3) at the front section of the adsorption part 22 can be directly attached to the dispensed substrate.
The advantage of above-mentioned overall arrangement lies in, both can realize accurate point and glue, if to the chip that the size is only several hundred microns or tens of microns, it can observe the position of dispensing head 31 and wait to glue the position coincidence through two field of vision camera lenses 1 before its point is glued, has also guaranteed simultaneously that the motion end of dispensing head 31 and the vertical removal axis 23 coincidence of welding arm, and then has guaranteed that chip subsides dress counterpoint and glue the synchronous completion of counterpoint, sparingly subsides the time of subsides dress counterpoint. Further, the dispensing head 31 on the dispensing assembly 3 may be replaced by an ultraviolet curing head to realize the ultraviolet curing function after dispensing, which is not shown in the figure.
In the embodiment of the present invention, the vertical movement support of the welding arm assembly 2 may be an independent support column or a gantry support, the driving assembly includes a first motor, the first motor may be a rotating motor capable of implementing a large pressure, or a direct drive motor that is started and stopped at a high speed, the first motor drives the clamping member 21 to move linearly, so as to implement the picking and placing of the chip to be mounted, and provide a chip mounting force, and the force application direction of the chip mounting force and the mounting force application point are on the same axis.
In addition, the driving assembly can further comprise a second motor, a force measuring unit, a buffer unit and an adsorption tool, wherein the second motor drives the second motor to rotate, and the buffer unit enables the chip mounting force provided by the adsorption tool to be a preset value according to the detection result of the force measuring unit so as to ensure that the chip to be mounted is smooth and free of impact and position deviation.
In some preferred embodiments of the present invention, the welding arm assembly 2 may further include the following units (not shown in fig. 3): the unit (namely, the second motor) for setting the adsorption piece 22 to rotate around the welding arm axis 23, the force measuring unit for measuring the mounting force, the heating unit for heating the adsorption piece, the lifting unit for the vertical movement of the welding arm assembly 2 and the buffer unit for chip adsorption reduce the displacement deviation of the patch caused by the impact of an adsorption tool on the chip. That is to say, the above components can cooperate to complete processes such as rotation adjustment and hot-press bonding of the chip.
In some preferred embodiments of the present invention, the present invention may further include a set of side-view auxiliary sensing elements 4 disposed on left and right sides of the welding arm assembly 2 for observing process problems during the chip mounting process in real time from the side, wherein the side-view auxiliary sensing elements include a set of variable-focus lenses, a lens holder, a slide rail for adjusting the position of the lenses, and a fixture for rotating around the lens holder; and when the chip to be mounted is close to the substrate, the chip alignment calibration can be completed by the aid of the edge characteristics of the chip to be mounted for rechecking.
Specifically, the side-view auxiliary sensing assembly has two functions, one is to observe the process problem in the mounting process in real time from the side, and if the chip mounting process and the melting process of solder such as soldering tin and the like, the overflow state of glue is generated; and secondly, in the mounting process, when the chip approaches the substrate, the rechecking function of the chip alignment is completed by the aid of the edge characteristics of the chip to be mounted.
Referring to fig. 4, as shown in fig. 4, the wafer stage 5 includes a coarse movement mechanism, a fine adjustment mechanism, a material supply stage 52 and a mounting stage 51. The coarse movement stage may mainly comprise a set of air floating assembly 54, and the air floating assembly 54 is provided with a plurality of sets of air holes 541 for introducing compressed gas or vacuum; wherein, the compressed gas is used for the air supporting of the wafer bearing platform 5. When the position of the wafer bearing table 5 needs to be adjusted in a large range, or operations such as feeding and the like are needed, the large-range rapid movement in the X direction and/or the Y direction is realized; after coarse adjustment to the proper position, the vacuum channel is switched to, and after vacuum is introduced, the air floating assembly 54 can be fixed on the supporting platform 6 (as shown in fig. 1), so that the wafer bearing table 5 is adjusted to the proper position and then is fixed and locked by vacuum adsorption, thereby fixing and locking the wafer bearing table 5.
The fine adjustment mechanism may include, from bottom to top, a set of tilt adjustment stages 55, X-direction adjustment stages 56, Y-direction adjustment stages 57, Z-direction adjustment stages 58, and θ Z-direction rotation stage 53. Wherein, a plurality of groups of pre-tightening pieces 551 and precision screws 552 are arranged on the inclined adjusting platform 55 for adjusting the horizontal degree of the sheet bearing platform 5, namely, matching with other fine adjusting functions, and realizing the precision adjustment of the degree of freedom of the supporting platform 6.
The feeding table 52 and the mounting table 51 are arranged at the uppermost part of the wafer bearing table 5, so that material feeding and chip mounting bearing are realized. Inside the mounting table 51, a substrate adsorption plate and a substrate heating unit (not shown in the drawings) are disposed.
The fine adjustment mechanism may be driven by the high-precision differential head device shown in this embodiment, but is not limited thereto, and may also be implemented by an electric fine adjustment mechanism, and the coarse locking function in this embodiment may be implemented by an electromagnetic adsorption function, in addition to the above-mentioned vacuum adsorption function, where an electromagnet is disposed at the bottom of the air floating assembly 54 or in the supporting platform 6 below the air floating assembly, and a corresponding magnetic core is disposed at a corresponding position.
Referring again to fig. 1, the support platform 6 is a platform for mounting and placing other components, and may be configured to have a larger platform size, such as supporting 4 inches, 6 inches, or 8 inches of material, depending on the maximum size of the chip mounting substrate. In order to ensure that the air floating assembly 54 on the wafer bearing table 5 runs smoothly, the upper surface of the supporting platform 6 needs to be finely ground, and components with stable structures, such as a marble platform, a cast iron platform, a stainless steel platform and the like, can be adopted.
In the embodiment of the present invention, the control component may be implemented by using control hardware and/or control software (not shown in the drawings), and in cooperation with the above-mentioned mechanism, multiple functions of forward mounting and flip mounting of the chip can be implemented. In the process of normally mounting the chip, the control software interface can make scale marks in the visual field range of the visual system for presetting the position of the chip to be mounted, specifically, the distance between the alignment point on the chip to be mounted and the alignment point on the chip mounting substrate is delta, and when the chip is to be mounted, the substrate can be moved to the reticle position through the double-visual-field visual assembly 1, so that the normally mounting function is realized. In the process of inversely mounting the chip, a plurality of salient points on the lower surface of the chip and the upper surface of the substrate are directly and simultaneously observed, and the chip is mounted after alignment.
Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a multi-function patch method according to an embodiment of the invention. As shown in fig. 5, the patch method specifically includes the following steps:
step S1: before the chip mounting is started, the welding arm assembly picks up and adsorbs the chip to be mounted from the material box; the chip to be mounted is a flip chip to be mounted or a forward chip to be mounted;
step S2: the double-vision visual assembly moves into the lower surface of the chip to be mounted and aligns with the chip to be mounted; wherein an optical axis of the dual field of view vision assembly is coaxial with an axis of the welding arm assembly;
step S3: the coarse movement mechanism moves the chip mounting substrate into the field range of the double-field vision assembly and fixes the position of the wafer bearing table; the double-sided imaging lens simultaneously collects alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate, and the fine adjustment mechanism moves in the three-dimensional direction to adjust the position of the chip mounting substrate according to the alignment result of the double-vision visual assembly so as to ensure that the chip to be mounted and the chip mounting substrate are overlapped in position;
step S4: after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted;
step S5: the dispensing assembly moves vertically along with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.
Referring to fig. 6, fig. 6 is a schematic diagram illustrating a normal mounting mode and a flip-chip mounting mode according to an embodiment of the invention. As shown in fig. 6, the "front-mounting" refers to a bonded package with a chip front side and a substrate front side, and the "flip-mounting" refers to a bonded package with a chip back side and a substrate front side.
The flow of the present invention in the "face-up" mounting process and the "flip-chip" mounting process is explained in detail below by example 1 and example 2, respectively.
Example 1
Referring to fig. 7 in conjunction with fig. 6, fig. 7 is a schematic flow chart illustrating flip-chip thermocompression bonding according to an embodiment of the present invention. As shown in fig. 7, the flip chip hot press bonding method of the invention specifically includes the following steps:
step S11: adsorbing the flip chip 71 reversely buckled in the material box on the welding arm assembly;
step S12: moving in the dual field of view module 1 and aligning the lower surface of the flip chip 71;
step S13: rapidly moving the chip mounting substrate into the field of view range of the double-field-of-view vision assembly through a coarse movement mechanism below the wafer bearing table 5, switching the coarse movement mechanism into a vacuum adsorption table, and fixing the position of the wafer bearing table 5;
step S14: the position of the chip mounting substrate is adjusted through a fine adjustment mechanism on the wafer bearing table 5, and whether the flip chip salient point 710 and the flip chip mounting substrate salient point 720 in real-time imaging are overlapped or not is observed;
step S15: the double-vision assembly 1 is horizontally moved left and right and moved back and forth, more upper and lower salient points are searched for alignment, meanwhile, the fine adjustment mechanism adjusts the position overlapping of the chip and the chip mounting substrate, and the horizontal dislocation and the angle rotation reach set values.
Step S16: after the images are overlapped, the double-vision assembly 1 is moved away;
step S17: driving the welding arm assembly to mount the reversed chip on the chip mounting substrate, observing through the side-looking auxiliary sensing assembly 4 in the contact process of the reversed chip and the chip mounting substrate, increasing pressure, and simultaneously starting up and down heating functions to weld the chip and the chip mounting substrate;
step S18: recording the temperature and pressure values, and removing the welding arm assembly when the temperature and pressure values reach a threshold value;
step S19: the double-vision visual component 1 observes the mounted effect again, and the mounting is finished.
Example 2
Referring to fig. 8 in conjunction with fig. 6, fig. 8 is a schematic flow chart illustrating a normal dispensing adhesive sheet according to an embodiment of the invention. As shown in fig. 8, fig. 8 illustrates a chip mounting process of normal mounting, and alignment of mark lines on a GUI monitoring interface is required because normal mounting cannot observe the front surface of a chip and the front surface of a chip mounting substrate through two fields of view. As shown in the front mounting schematic view of fig. 5, after the mounting target is a patch, the pitch between the alignment point 730 on the chip and the alignment point 740 on the chip mounting substrate is δ, and the chip is fixed by dispensing, and the mounting steps are as follows:
step S21: moving the double-vision field visual component 1 into a station to be pasted; moving the chip 73 to be placed into the lower part of the double-vision assembly 1;
step S22: by moving the mounting table 51, aligning and coinciding the alignment point 730 on the mounting chip 73 with the mounting mark alignment line 750 on the GUI monitoring interface 75;
step S23: the double-vision system 1 is removed, and the welding arm assembly 2 adsorbs the chip to be pasted; placing the chip mounting substrate 74 into a wafer bearing table, moving the dual-field system 1 into a working position, and ensuring that the position of the chip mounting substrate to be mounted is within the field range;
step S24: setting a positive chip mounting substrate alignment mark 751 in the GUI monitoring interface 75, and ensuring that the space between the mark and a positive chip alignment line is delta;
step S25: by observing the GUI monitoring interface 75 and moving the displacement table, the alignment point 740 of the front chip mounting substrate is ensured to move into and coincide with the alignment mark 751 of the front chip mounting substrate;
step S26: removing the dual-field vision assembly 1; the glue dispensing device 3 moves downwards along the angle theta from the initial position to coincide with the axis of the welding arm assembly, moves downwards along with the welding arm assembly 2 to the chip mounting substrate for glue dispensing, and resets to the initial position after the glue dispensing is finished;
step S27: the chip on the welding arm component 2 moves down the paster along with the welding arm component and stops when the preset paster force is reached;
step S28: the auxiliary alignment observation system 4 observes the glue bonding condition in the mounting process;
step S29: and resetting the welding arm assembly 2, observing the effect after mounting by the double-visual-field visual assembly 1 again, and finishing mounting.
In summary, the multifunctional chip mounting device and the chip mounting method thereof of the invention adopt the double-vision visual assembly to accurately align the flip chip and the front chip, and also solve the problem that the wafer bearing table is only a single X-axis and Y-axis motion table, so that the requirements of large stroke and high precision positioning are compatible in the processes of chip station transfer and mounting offset adjustment, the inclined position of the motion table can be conveniently adjusted, the problems of chip mounting warpage, low yield after mounting and the like are solved. In addition, the multifunctional patch device meets the volume requirement of the multifunctional patch device, so that the whole device is simple to control and has low structural cost.
The above description is only for the preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all the equivalent structural changes made by using the contents of the description and the drawings of the present invention should be included in the scope of the present invention.
Claims (10)
1. A multi-functional patch device, comprising:
the welding arm assembly vertically moves up and down and comprises a clamping piece, an adsorption piece arranged on the clamping piece and a driving assembly for controlling the vertical movement of the clamping piece, wherein the adsorption piece is provided with a group of vacuum inner holes for picking and placing a chip to be pasted and vertically moves along with the clamping piece;
the dispensing assembly is arranged on the welding arm assembly and vertically moves along with the welding arm assembly; the dispensing assembly comprises a dispensing slide rail and a dispensing head which reciprocates on the axis of the dispensing slide rail, and the axis of the dispensing slide rail and the vertical moving axis of the welding arm assembly are arranged at an angle theta; the dispensing head is overlapped with the axis of the welding arm assembly when moving to the lowest end;
the double-vision visual assembly moves horizontally, and is positioned on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate in the alignment calibration process; the optical axis of the dual-field-of-view vision assembly is coaxial with the axis of the welding arm assembly; after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted;
the wafer bearing platform comprises a mounting platform; the mounting table is used for bearing the chip mounting substrate, and in the alignment calibration process, the coarse movement mechanism and the fine adjustment mechanism move and adjust the position of the mounting table in the three-dimensional direction according to the calibration result of the double-vision visual component;
the double-sided imaging lens collects the alignment marks of the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate at the same time and transmits the alignment marks to the control assembly, and the control assembly adjusts the position of the chip mounting substrate to enable the chip to be mounted to be accurately attached to the chip mounting substrate.
2. The multifunctional patch device as claimed in claim 1, further comprising a set of side-view auxiliary sensing components disposed on left and right sides of the welding arm component for observing process problems in a mounting process in real time from the side, wherein the side-view auxiliary sensing components comprise a set of variable-focus lens, a lens holder, a slide rail for adjusting the position of the lens, and a fixture for rotating around the lens holder, and when the chip to be mounted is close to the substrate in the mounting process, a rechecking function of chip alignment calibration is completed by the aid of edge features of the chip to be mounted.
3. The multifunctional chip mounting device according to claim 1, wherein the driving component is a first motor, the first motor drives the clamping member to move linearly, so as to pick and place the chip to be mounted and provide a chip mounting force, and a force application direction of the chip mounting force and a chip force bearing point are on the same axis.
4. The multifunctional chip mounting device according to claim 2, wherein the driving assembly further comprises a second motor for driving rotation, a force measuring unit, a buffer unit and a suction tool, and the buffer unit enables the chip mounting force provided by the suction tool to be a predetermined value according to the detection result of the force measuring unit so as to ensure that the chip to be mounted is smooth, impact-free and position-offset-free.
5. The multi-functional patch device of claim 1, wherein the support platform further comprises a coarse movement mechanism, a fine adjustment mechanism, and a locking mechanism; the coarse movement mechanism is a group of air floatation units comprising a plurality of air floatation cushions, the fine adjustment mechanism is arranged on the coarse movement table and used for aligning the chip to be mounted and the chip mounting substrate, and the locking table is positioned between the air floatation units and the supporting table; after the coarse movement mechanism moves in place, the coarse movement mechanism is fixed by opening the vacuum adsorption unit or the electromagnetic adsorption unit on the locking platform.
6. A multi-functional chip device according to claim 1, wherein a heating unit is disposed in said mounting table for heating said chip to be mounted or said chip mounting substrate.
7. A multi-functional patch device according to claim 1, wherein the variable focus lens is a dual-sided imaging lens, the dual field-of-view vision assembly further comprising an image acquisition unit and a GUI monitoring interface; and the GUI monitoring interface receives the image acquired by the image acquisition unit and visually presents the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.
8. A multi-function patch device as claimed in claim 7, wherein the alignment points on the chip to be mounted are spaced δ relative to the alignment points on the chip mounting substrate when in face-on mounting.
9. A multi-function chip device as defined in claim 5, wherein when flip-chip mounting is performed, the position of said chip mounting substrate is adjusted by a fine adjustment mechanism to observe whether or not said bumps of said chip to be mounted and said bumps of said chip mounting substrate, which are flipped in real-time imaging, coincide with each other.
10. A multi-functional patch method using the multi-functional patch device of any one of claims 1 to 9, comprising:
step S1: before the chip mounting is started, the welding arm assembly picks up and adsorbs the chip to be mounted from the material box; the chip to be mounted is a flip chip to be mounted or a forward chip to be mounted;
step S2: the double-vision visual assembly moves into the lower surface of the chip to be mounted and aligns with the chip to be mounted; wherein an optical axis of the dual field of view vision assembly is coaxial with an axis of the welding arm assembly;
step S3: the coarse movement mechanism moves the chip mounting substrate into the field of view range of the double-vision assembly and fixes the position of the wafer bearing table; during flip-chip mounting, the double-sided imaging lens simultaneously collects alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; during normal mounting, the double-sided imaging lens preferentially acquires the front information of the chip in step S1, and records the front mark position of the chip to be mounted in a visual interface, and in the step, the upper surface alignment mark of the chip mounting substrate is set through the visual interface; the fine adjustment mechanism moves in the three-dimensional direction to adjust the position of the chip mounting substrate according to the alignment result of the double-vision visual assembly so as to ensure that the positions of the chip to be mounted and the chip mounting substrate are overlapped;
step S4: after the alignment calibration process is finished, the double-vision visual assembly is horizontally moved out of the mounting area of the chip to be mounted;
step S5: the dispensing assembly moves vertically along with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210548636.4A CN115036250A (en) | 2022-05-20 | 2022-05-20 | Multifunctional chip mounting device and chip mounting method thereof |
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| CN202210548636.4A CN115036250A (en) | 2022-05-20 | 2022-05-20 | Multifunctional chip mounting device and chip mounting method thereof |
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| CN115831815A (en) * | 2022-11-23 | 2023-03-21 | 中科长光精拓智能装备(苏州)有限公司 | Chip mounting system and mounting method thereof |
| CN115914811A (en) * | 2023-01-06 | 2023-04-04 | 深圳中科精工科技有限公司 | Active alignment assembly method and device for bottom surface chip, electronic equipment and medium |
| CN117182841A (en) * | 2023-09-08 | 2023-12-08 | 深圳市镭恩特自动化技术有限公司 | Pressurizing mechanical device for pasting piezoelectric ceramic plate |
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| CN117878428A (en) * | 2024-03-05 | 2024-04-12 | 深圳市铂纳特斯智能装备股份有限公司 | Battery double-sided paster method and system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115831815A (en) * | 2022-11-23 | 2023-03-21 | 中科长光精拓智能装备(苏州)有限公司 | Chip mounting system and mounting method thereof |
| CN115914811A (en) * | 2023-01-06 | 2023-04-04 | 深圳中科精工科技有限公司 | Active alignment assembly method and device for bottom surface chip, electronic equipment and medium |
| CN115914811B (en) * | 2023-01-06 | 2023-07-07 | 深圳中科精工科技有限公司 | Active alignment assembly method and device for bottom chip, electronic equipment and medium |
| CN117182841A (en) * | 2023-09-08 | 2023-12-08 | 深圳市镭恩特自动化技术有限公司 | Pressurizing mechanical device for pasting piezoelectric ceramic plate |
| CN117182841B (en) * | 2023-09-08 | 2024-05-10 | 深圳市镭恩特自动化技术有限公司 | Pressurizing mechanical device for pasting piezoelectric ceramic plate |
| CN117393655A (en) * | 2023-12-08 | 2024-01-12 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
| CN117393655B (en) * | 2023-12-08 | 2024-02-20 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
| CN117878428A (en) * | 2024-03-05 | 2024-04-12 | 深圳市铂纳特斯智能装备股份有限公司 | Battery double-sided paster method and system |
| CN117878428B (en) * | 2024-03-05 | 2024-06-04 | 深圳市铂纳特斯智能装备股份有限公司 | Battery double-sided paster method and system |
| CN117961394A (en) * | 2024-04-01 | 2024-05-03 | 苏州明益信智能设备有限公司 | Automatic core tube mounting equipment and mounting method |
| CN117976595A (en) * | 2024-04-02 | 2024-05-03 | 珠海市硅酷科技有限公司 | Die bonding device |
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