TWI807304B - Component picking, placing and bonding system and method thereof - Google Patents

Abstract

The invention discloses a component pick-and-place lamination system comprising a pick-and-place body, a component observation module, a substrate observation module, a processing unit, and a bearing base. The base plate observation module includes a voice coil motor, and the bearing base carries a substrate. The pick-and-place body picks up a component, and uses the component observation module to observe the pick-and-place body and components to obtain a first image. Combining the above-mentioned images into position information, the pick-and-place body is then attached to the substrate according to the position information, and the pick-and-place and fit of components with nanometer-level accuracy is completed. In addition, the present invention provides a pick-and-place and stick method using the aforementioned system.

Description

Component pick-and-place bonding system and method thereof

The invention belongs to the field of semiconductor packaging, in particular to a component pick-and-place bonding system and method for precisely bonding precision electronic or optical components to designated positions.

The semiconductor packaging process mainly includes stages such as grinding, sorting, cutting, bonding, and sealing. The component pick-and-place bonding system of the present invention is used to transfer and bond the components that have been cut into crystal grains on the specified substrate during the bonding stage.

In order to accurately install the die at the specified position, there are patents disclosed in the Republic of China Patent Application No. TW107114542 (US Patent Application No. US15/947,571, Chinese Patent Application No. CN201810391562.1A, Japanese Patent Application No. JP2018-190958A, Korean Patent Application No. KR1020180048520A) A device and method for mounting a component on a substrate. After using a component camera to photograph the component mark of the component, the component holder is moved below the substrate camera, and the substrate camera is used to capture the fiducial mark of the component holder, and then the component holder is moved away so that the substrate camera can capture the substrate mark of the substrate located below the substrate camera. Finally, the component holder is moved to the bottom of the substrate camera again, and the fiducial mark of the component holder is photographed.

However, the above-mentioned ROC Patent Application No. TW107114542 must constantly move the component holder during alignment, and each movement will cause errors, so that the accuracy of the previous technology is only between two to three microns, so it cannot meet the accuracy requirements of the current semiconductor manufacturing process for the packaging process.

In addition, because the size of transistors has approached the physical limit, in order to continue Moore's Law, semiconductor manufacturing is all developing towards three-dimensional chip packaging, that is, there will be multiple layers of crystal grains on the substrate, but the aforementioned patent application No. TW107114542, because the camera has a fixed depth of field, it is impossible to adjust the depth of field of the camera according to the height of the stacked crystal grains on the substrate.

In view of the shortcomings of the above-mentioned prior art, the creator of the present invention is eager to improve and innovate, and after many years of research and experiments, he finally successfully developed the component pick-and-place lamination system and its method of the present invention.

The present invention is a component pick-and-place lamination system and its method. Its purpose is to: 1. Improve the accuracy of component lamination technology to sub-micron (Sub-Micron) level; 2. Solve the problem that the depth of field of the camera in the prior art cannot be adjusted according to the height of the crystal grains stacked on the substrate.

The component pick-and-place bonding system of the present invention includes a support frame, a pick-and-place body, a component observation module, a substrate observation module, a bearing seat, and a processing module. There are two substrate observation modules, namely the first substrate observation module and the second substrate observation module. There is only one component observation module, but the second substrate observation module is composed of two component observation units, namely the first component observation unit and the second component observation unit.

Wherein, the substrate observation module is arranged on the support frame, and the observation direction of the substrate observation module faces the bearing seat, wherein the substrate observation module includes a first substrate observation assembly and a second substrate observation assembly, and the first substrate observation assembly is formed by connecting a first voice coil motor and a first substrate observation unit, and the second substrate observation assembly is formed by connecting a second voice coil motor and a second substrate observation unit, wherein the first substrate observation assembly is used for observing the substrate label of the substrate, and the second substrate observation assembly is used for observing the part label of the component.

Wherein, the pick-and-place body is arranged on the slide rail of the supporting frame, so that the pick-and-place body can move between the component observation module, the first substrate observation module and the second substrate observation module.

Wherein, the pick-and-place body also includes a transparent pick-and-place unit, and a pick-and-place label is provided on the left and right sides of the pick-and-place unit, and the pick-and-place unit is used to move the component from the place where the component is to be placed to the substrate on the carrier.

Among them, the processing unit is used for manipulating the pick-and-place body, component observation module, substrate observation module, and bearing seat, and to perform image enhancement (Image Upscale), so that the observation accuracy of the substrate observation module and the component observation module can reach sub-micron level.

Wherein, the image enhancement step is one of Sub Pixel Edge, Advanced Adaptive Interpolation, Super Resolution or a combination thereof.

The present invention also provides a component pick-and-place bonding method, starting from picking up the component, using the pick-and-place unit to move the component to the top of the component observation module, and using the component observation module to photograph the component to obtain the first image data; then using the pick-and-place unit to move the component to the top of the substrate, and then the substrate observation module located at the top, photographs the component label on the component and the substrate label on the substrate from top to bottom to obtain the second image data; then the processing module obtains the second image data according to the first position information and the second position information. The third position information; finally, according to the third position information, the components are accurately placed on the specified position of the substrate.

Among them, the process of placing the parts on the specified position is completed by the pick-and-place unit and the carrier plate in cooperation, and the movement of the carrier plate is zero backlash.

As mentioned above, the component pick-and-place bonding system of the present invention uses the component observation module to simultaneously observe the component labels of the components and the pick-and-place labels of the pick-and-place unit, and then uses the substrate observation module of the present invention to simultaneously observe the substrate labels of the substrate and the pick-and-place labels of the pick-and-place unit.

1: support frame

2: The first substrate observation module

211: The first substrate observation unit

21: The first substrate observation component

212: The first voice coil motor

22: The second substrate observation component

221: The second substrate observation unit

222:Second voice coil motor

3: The second substrate observation module

31: The third substrate observation component

311: The third substrate observation unit

312: The third voice coil motor

32: The fourth substrate observation component

321: The fourth substrate observation unit

322: Fourth voice coil motor

4: Part observation module

41: The first component observation unit

42: The second component observation unit

5: Pick and place the body

51: Pick and place unit

52:Left pick and place label

53: Right pick and place label

6: Bearing seat

7: Processing module

8: Parts

81:Left part label

82:Right part label

9: Substrate

91: left base plate label

92:Right base plate label

10: Second part

101: left second part label

102: Right second part label

S101-S110: Steps

1 is a schematic diagram of the substrate observation system of the present invention; FIG. 2 is a schematic diagram of the component pick-and-place lamination system of the present invention; FIG. 3 is a step diagram of the component pick-and-place lamination method of the present invention; FIG.

In order to enable those with ordinary knowledge in the technical field to fully understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and described in detail as follows in the form of embodiments, and the purposes of the drawings used therein are only for illustration and auxiliary description The use of the book is not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and the scope of rights of the present invention in actual implementation should not be limited.

Please refer to FIG. 1, which is a schematic diagram of the substrate observation system of the present invention. As shown in the figure, the substrate observation system of the present invention includes a support frame 1, a first substrate observation module 2 and a second substrate observation module 3, wherein the mechanism design of the second substrate observation module 3 is the same as that of the first substrate observation module 2, and both are installed on the support frame 1.

Wherein, the first substrate observation module 2 includes a first substrate observation component 21 and a second substrate observation component 22 , which are adjacent to each other with a small distance between them.

Wherein, the first substrate observation unit 21 includes a first substrate observation unit 211 and a first voice coil motor 212 , the distance between the first substrate observation unit 211 and a substrate can be controlled by the first voice coil motor 212 .

Wherein, the second substrate observation unit 22 includes a second substrate observation unit 221 and a second voice coil motor 222 , the distance between the second substrate observation unit 221 and a pick-and-place unit can be controlled by the second voice coil motor 222 .

Wherein, the second substrate observation module 3 includes a third substrate observation assembly 31 and a fourth substrate observation assembly 32, the third substrate observation assembly 31 includes a third substrate observation unit 311 and a third voice coil motor 312, the fourth substrate observation assembly 32 includes a fourth substrate observation unit 321 and a fourth voice coil motor 322, and the mechanism relationship of the second substrate observation module 3 is the same as that of the first substrate observation module 2, so it will not be repeated.

Please refer to FIG. 2 , which is a schematic diagram of the component pick-and-place lamination system of the present invention. As shown in the figure, the component pick-and-place lamination system of the present invention includes a support frame 1 , a first substrate observation module 2 , a second substrate observation module 3 , a component observation module 4 , a pick-and-place body 5 , a bearing seat 6 and a processing module 7 .

Wherein, the support frame 1 is a bracket of a multi-axis alignment platform, located above the bearing seat 6, wherein the pick-and-place body 5 is arranged on the support frame 1, and the drive system of the support frame 1 is used to make the pick-and-place body 5 move within a certain range of movement, wherein the pick-and-place body 5 faces one end of the bearing seat 6, and a pick-and-place unit 51 is provided, and a left pick-and-place label 52 and a right pick-and-place label 53 are provided on the left and right sides of the pick-and-place unit 51.

Wherein, both the first substrate observation module 2 and the second substrate observation module 3 are installed on the support frame 1, and the first substrate observation module 2 and the second substrate observation module 3 are separated by a distance, so that the first substrate observation module 2 can observe the left pick-and-place label 52 while the second substrate observation module 3 can also observe the right pick-and-place label 53.

Wherein, the component observation module 4 is set within the moving range of the pick-and-place body 5, and the component observation module 4 includes a first component observation unit 41 and a second component observation unit 42. When the pick-and-place body 5 is attached with a component 8 and the pick-and-place body 5 moves above the observation module 4, the first component observation unit 41 observes the left component label 81 of the component 8, and the second component observation unit 42 observes the right component label 82. The two cooperate to generate image data.

Wherein, the bearing seat 6 is a mobile platform without backlash.

Among them, the processing module 7 is connected with the support frame 1, the first substrate observation module 2, the second substrate observation module 3, the component observation module 4, the pick-and-place body 5, and the bearing seat 6, and the processing module 7 receives the image data from the first substrate observation module 2, the second substrate observation module 3, and the component observation module 4, and uses an image enhancement step (Image Upscale) to improve the resolution of the image data, and then generates position information based on the image data, and then controls the support frame 1, the pick-and-place body 5 and the bearing seat 6 according to the position information, and executes the component 8 and the substrate 9 alignment/placement fit tasks.

Please refer to FIG. 3 , which is a step diagram of the pick-and-place bonding method of the present invention.本發明之取放方法包含： S101：取放本體移動至部件待置處，並運用取放單元拾取部件；S102：取放本體移動至部件觀測模組上方；S103：部件觀測單元觀測部件的部件標籤及取放單元的取放標籤，而獲得第一影像資料，再以影像增強步驟獲得第一高解析影像資料；S104：基於第一高解析影像資料，判斷部件標籤及取放標籤在X方向的差值(△x ₁ )，以及部件標籤及取放標籤在Y方向的差值(△y ₁ )，而獲得第一位置資訊，其中第一位置資訊係由X方向的差值(△x ₁ )及Y方向的差值(△x ₁ )組成的向量資訊(△x ₁ ,△y ₁ )；S105：取放本體移動至基板的指定位置上方，並將基板觀測模組移動至取放本體上方；S106：利用第一音圈馬達調整第一基板觀測單元與基板之間的距離，而使基板的基板標籤得位於第一基板觀測單元的景深範圍內，以及利用第二音圈馬達調整第二基板觀測單元與取放單元之間的距離，而使取放單元的取放標籤得位於第二基板觀測單元的景深範圍內；S107：基板觀測模組觀測基板的基板標籤及取放單元的取放標籤，而獲得第二影像資料，再以影像增強步驟獲得第二高解析影像資料；S108：基於第二高解析影像資料，判斷基板標籤及取放標籤在X方向的差值(△x ₂ )，以及基板標籤及取放標籤在Y方向的差值(△y ₂ )，而獲得第二位置資訊，其中第二位置資訊係由X方向的差值(△x ₂ )及Y方向的差值(△x ₂ )組成的向量資訊(△x ₂ ,△y ₂ )； S109：將部件標籤及取放標籤在X方向的差值之絕對值(|△x ₁ |)，與基板標籤及取放標籤在X方向的差值之絕對值(|△x ₂ |)相加，而獲得部件標籤及基板標籤在X方向的差值(△x ₃ )；將部件標籤及取放標籤在Y方向的差值之絕對值(|△y ₁ |)，與基板標籤及取放標籤在Y方向的差值之絕對值(|△y ₂ |)相加，而獲得部件標籤及基板標籤在Y方向的差值(△y ₃ )；藉由上述步驟S109，而獲得第三位置資訊，其中第三位置資訊係由X方向的差值(△x ₃ )及Y方向的差值(△x ₃ )組成的向量資訊(△x ₃ ,△y ₃ )；S110：承載座依據第三位置資訊作零背隙的移動，而使部件與基板上的指定位置對準，再由取放單元將部件放置於基板上。

Please refer to FIG. 4 , which is a schematic diagram of parts picked up by an embodiment of the component pick-and-place lamination system. As shown in the figure, in the embodiment of the present invention, the component pick-and-place lamination system includes a first substrate observation module 2 , a second substrate observation module 3 , a component observation module 4 , a pick-and-place body 5 , a bearing seat 6 and a processing module 7 .

Wherein, the pick-and-place body 5 includes a pick-and-place unit 51, and a left pick-and-place label 52 and a right pick-and-place label 53 are respectively provided on the left and right sides of the pick-and-place unit 51. The pick-and-place unit 51 picks up a component 8, and a left component label 81 and a right component label 82 are respectively provided on the left and right sides of the component 8.

Wherein, the pick-and-place unit 51 moves to the top of the component observation module 4, so that the first component observation unit 41 can observe the left pick-and-place label 52 and the left component label 81 at the same time, and the second component observation unit 42 can simultaneously observe the right pick-and-place label 53 and the right component label 82, so as to obtain the first image data and send it to the processing module 7 in real time.

After the processing module 7 receives the first image data, the resolution of the first image data is improved by an image enhancement step (Image Upscale), and converted into the first high-resolution image data, and then judged The relative position between the left pick-and-place tag 52 and the left part tag 81 , and the relative position between the right pick-and-place tag 53 and the right part tag 82 are used to obtain the first position information.

Please refer to FIG. 5 , which is a schematic diagram of aligning components of an embodiment of the component pick-and-place laminating system. As shown in the figure, in this embodiment, the pick-and-place body 5 moves the component 8 above the designated position of the substrate 9 , and at the same time, the first substrate observation module 2 and the second substrate observation module 3 also move above the pick-and-place body 5 .

Wherein, a left substrate label 91 and a right substrate label 92 are provided on the left and right sides of the substrate 9 respectively.

Wherein, the first substrate observation module 2 uses the first voice coil motor 212 to extend the first substrate observation unit 211 toward the substrate 9, so that the left substrate label 91 of the substrate 9 enters the depth of field range of the first substrate observation unit 211;

Wherein, the first substrate observation module 2 uses the second voice coil motor 222 to approach the second substrate observation unit 221 toward the pick-and-place unit 51, so that the left pick-and-place label 52 of the pick-and-place unit 51 enters the depth of field range of the second substrate observation unit 221;

Wherein, the first substrate observation module 2 observes the left pick-and-place label 52 and the left substrate label 91 at the same time, and the second substrate observation module 3 simultaneously observes the right pick-and-place label 53 and the right substrate label 92, and through the cooperation of the first substrate observation module 2 and the second substrate observation module 3, the second image data is obtained and transmitted to the processing module 7 in real time.

After receiving the second image data, the processing module 7 upgrades the resolution of the second image data through an image enhancement step (Image Upscale), and converts it into a second high-resolution image data, and then judges the relative position between the left pick-and-place label 52 and the left substrate label 91, and the relative position between the right pick-and-place label 53 and the right substrate label 92, and obtains the second position information.

The processing module 7 then obtains the third location information in step S109.

After picking and placing the main body 5 and the carrier 6, step S109 is performed to accurately place the component 8 on the designated position of the substrate 9, and the accuracy reaches the sub-micron (Sub-Micron) level.

Please refer to FIG. 6, which is a schematic diagram of a second embodiment of the present invention. As shown in the figure, in this embodiment, a plurality of layers of second components 10 have been stacked above the substrate 9, wherein a left second component label 101 and a right second component label 102 are provided on the second component 10.

In this embodiment, the first voice coil motor 212 adjusts the distance between the first substrate observation unit 211 and the second component 10 so that the left second component label 101 is within the depth of field of the first substrate observation unit 211 .

In this embodiment, the fourth voice coil motor 322 adjusts the distance between the fourth substrate observation unit 321 and the second component 10 so that the right second component label 102 is within the depth of field of the fourth substrate observation unit 321 .

In this embodiment, the second voice coil motor 222 and the third voice coil motor 312 respectively adjust the distance between the second substrate observation unit 221 and the third substrate observation unit 311 and the pick-and-place unit 51, so that the left pick-and-place label 52 and the right pick-and-place label 53 are located within the depth of field of the second substrate observation unit 221 and the third substrate observation unit 311 respectively.

Due to the cooperation of the first voice coil motor 212, the second voice coil motor 222, the third voice coil motor 312 and the fourth voice coil motor 322, the component pick-and-place bonding system of the present invention can be adapted to various substrates 9, The thickness of the component 8 and the second component 10 can also be elastically adjusted in height to complete the stacking operation of the multi-layer components 8 .

Wherein, the component 8 of the present invention is a flip chip, and may also be any semiconductor crystal grain. In some embodiments, component 8 may be electronic, optical, optoelectronic or any other component.

Wherein, the substrate observation unit is a common high-resolution CCD camera or CMOS camera in the art.

To sum up, the component pick-and-place lamination system and pick-and-place method of the present invention can achieve sub-micron accuracy when aligning and laminating the components 8 and the substrate 9. In addition, the voice coil motor included in the substrate observation module of the present invention has the function of adjusting the distance between the substrate observation unit and the substrate, so as to solve the problem that the high-resolution CCD camera or CMOS camera in this field has a narrow depth of field, and it is difficult to cope with the multiple height requirements in the three-dimensional chip packaging process.

The above description is only for illustration, and is used to illustrate feasible specific embodiments of the technical content of the present invention, and is not used to limit the present invention. Equivalent replacements, modifications or changes made by persons with ordinary knowledge in the technical field of the present invention based on the teachings disclosed in the specification are included in the scope of the patent application of the present invention and do not depart from the scope of rights of the present invention.

1: support frame

2: The first substrate observation module

3: The second substrate observation module

4: Part observation module

41: The first component observation unit

42: The second component observation unit

5: Pick and place the body

51: Pick and place unit

52:Left pick and place label

53: Right pick and place label

6: Bearing seat

7: Processing module

8: Parts

81:Left part label

82:Right part label

Claims (10)

A pick-and-place lamination system for placing a component on a substrate, wherein the component is provided with a label for the component, and the substrate is provided with a label for the substrate. The pick-and-place lamination system includes: a support frame; a pick-and-place body, which is set on the support frame and moves between the substrate and the place where the component is to be placed, wherein the pick-and-place body further includes a pick-and-place unit for picking and placing the component, wherein the pick-and-place unit is provided with a pick-and-place label; Inside, when the pick-and-place body is located within the observation range of the component observation module, and the pick-and-place unit is picking up the component, the component observation unit simultaneously observes the component label and the pick-and-place label; and a substrate observation module, which is arranged on the support frame, and the substrate observation module includes a first substrate observation component and a second substrate observation component; wherein, the first substrate observation component includes a first substrate observation unit, and the second substrate observation component includes a second substrate observation unit; wherein, when the pick-and-place unit aligns the component on the substrate, the first The substrate observation unit observes the substrate label, and the second substrate observation unit observes the component label. The component pick-and-place bonding system as described in Claim 1, wherein the first substrate observation component further includes a first voice coil motor and is connected to the first substrate observation unit, wherein the second substrate observation component further includes a second voice coil motor and is connected to the second substrate observation unit. The component pick-and-place bonding system as described in Claim 1, wherein the component observation module further includes a first component observation unit and a second component observation unit, and the first component observation unit is connected to the second component observation unit. The component pick-and-place bonding system as described in claim 1, wherein the pick-and-place unit is light-transmissive. According to the component pick-and-place lamination system described in Claim 1, multiple layers of the component are stacked on the substrate. The component pick-and-place laminating system as described in claim 1 further includes a bearing seat, which is set within the observation range of the substrate observation module, wherein the bearing seat is used to carry and move the substrate, and the mechanism of the bearing seat is designed with no backlash. The component pick-and-place bonding system as described in claim 1 further includes a processing module connected to the substrate observation module and the component observation module, wherein the processing module is used to perform an image enhancement step (Image Upscale), wherein the image enhancement step is one or a combination of sub-pixel edge step (Sub Pixel Edge), advanced adaptive interpolation step (Advanced Adaptive Interpolation), super-resolution step (Super Resolution). A component pick-and-place bonding method, comprising: using a pick-and-place body to pick up a component, and attaching the component to a pick-and-place unit of the pick-and-place body; moving the pick-and-place unit to the observation range of a component observation module, and using the component observation module to obtain first image data; A processing module is used to generate a first position information based on the first image data, wherein the first position information is a relative position between a component label and a pick-and-place label; the pick-and-place unit is moved between the substrate and a substrate observation module, and second image data is obtained by the substrate observation module; a second position information is generated based on the second image data by the processing module, wherein the second position information is a relative position between the component label and a substrate label; using the processing module, a third position is obtained based on the first position information and the second position information Position information, wherein the third position information is the relative position between the component label and the substrate label; using the pick-and-place body, based on the third position information, the component is aligned with the substrate, and the component is placed and pasted on the substrate. The component pick-and-place bonding method as described in Claim 8 further includes using the processing module to perform an image enhancement step to improve the resolution of the substrate observation module and the component observation module, wherein the resolution enhancement step is one of sub-pixel edge step, advanced adaptive interpolation step, and super-resolution step or a combination of more than two. The component pick-and-place lamination method as described in claim 8, wherein when the pick-and-place unit moves between the substrate and a substrate observation module, the component pick-and-place lamination method further includes: using a first voice coil motor to adjust the distance between a first substrate observation unit and the substrate; A second voice coil motor is used to adjust the distance between a second substrate observation unit and the pick-and-place unit.

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