KR102186384B1 - Die bonding apparatus and manufacturing method of semiconductor device - Google Patents

Abstract

It is to provide a die bonding apparatus in which a semiconductor chip (die) is attached to a substrate to which a mark is not applied, with high positioning accuracy.
The die bonding apparatus includes: a bonding head for loading a picked up die on an upper surface of a transparent substrate; a transparent bonding stage for fixing the substrate; and spaced apart from the bonding stage under the bonding stage; A plate having a reference mark for recognizing a position of the die when it is mounted on the die, and a camera for capturing the die or the reference mark through the bonding stage.

Description

TECHNICAL FIELD The manufacturing method of a die bonding device and a semiconductor device TECHNICAL FIELD

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die place for fan-out panel level packaging.

In the field of electronic component mounting, a plurality of semiconductor chips disposed on an adhesive layer laminated on a substrate and a substrate are collectively sealed with a sealing resin, thereby providing a plurality of semiconductor chips and a sealing resin covering the plurality of semiconductor chips. After the sealing body is formed, there is a step of peeling the substrate including the adhesive layer from the sealing body, and then forming a redistribution layer on the surface to which the adhesive layer of the sealing body was adhered. In this case, the bonding accuracy between the rewiring layer and the semiconductor chip depends on the positioning accuracy of the chip on the substrate. Therefore, it is necessary to improve the positioning accuracy at the time of installation of the semiconductor chip on the substrate.

Japanese Patent Publication No. 2014-45013 Japanese Patent Publication No. 2017-139365

By marking the substrate, it is possible to increase the positioning accuracy of the semiconductor chip to the substrate during temporary fixing. However, the position of the mark on the substrate is determined depending on the structure of the semiconductor chip and the final arrangement relationship between the semiconductor chip and the sealing body. That is, it is necessary to prepare a substrate having a predetermined mark according to the structure of the final product or the arrangement of parts. Therefore, there is a problem that the cost increases because a large number of substrates having a predetermined mark must be manufactured for each product.

An object of the present disclosure is to provide a die bonding apparatus in which a semiconductor chip (die) is mounted on a substrate with high positioning accuracy on a substrate on which no marks are applied.

A brief overview of representative ones of the present disclosure is as follows.

That is, the die bonding apparatus includes a bonding head that loads a picked up die on an upper surface of a transparent substrate, a transparent bonding stage that fixes the substrate, and is located below the bonding stage and spaced apart from the bonding stage, A plate having a reference mark for recognizing a position of the die when it is mounted on the substrate, and a camera for imaging the die or the reference mark through the bonding stage.

According to the die bonding device, the precision of the die place can be improved.

1 is a top view schematically showing a flip chip bonder of an embodiment.
FIG. 2 is a view for explaining operations of a pickup flip head, a transfer head, and a bonding head when viewed from the direction of arrow A in FIG. 1;
3 is a schematic cross-sectional view showing an essential part of the die supply portion of FIG.
Fig. 4 is a schematic side view showing a main part of the bonding unit of Fig. 1;
Fig. 5 is a plan view showing the target mask plate of Fig. 4;
6 is a flowchart illustrating a bonding method performed in the flip chip bonder of the embodiment.
Fig. 7 is a schematic side view showing a main part of a bonding portion of the first modified example.
Fig. 8 is a schematic side view showing a main part of a bonding portion of a second modified example.
Fig. 9 is a schematic side view showing a main part of a bonding portion of a third modified example.
Fig. 10 is a schematic side view showing a main part of a bonding portion of a comparative example.

Hereinafter, comparative examples, examples, and modifications will be described with reference to the drawings. However, in the following description, the same constituent elements are denoted by the same reference numerals, and repeated explanations may be omitted. In addition, in order to make the explanation more clear, the drawings may be schematically expressed with respect to the width, thickness, shape, etc. of each part compared to the actual mode, but are only examples and do not limit the interpretation of the present invention. .

The Fan Out Wafer Level Package (FOWLP) is a package in which a redistribution layer is formed in a wide area exceeding the chip area. The Fan Out Panel Level Package (FOPLP) is a further development of FOWLP's collective manufacturing mindset. FOWLP reduces the manufacturing cost per package by placing a large number of silicon dies on a wafer having a diameter of 300 mm to manufacture a package at once. FOPLP applies this collective manufacturing thinking method to a panel larger than a wafer (a substrate on a panel). For the panel, a printed circuit board or a glass substrate (eg, a substrate for manufacturing a liquid crystal panel) is used.

There are many types of manufacturing processes for FOPLP, but one of them is a die picked up from a wafer on a glass panel, which is a top plate, bonded through a sticky base applied on the glass panel, temporarily fixed, and then collectively sealed with a sealing resin. There is a method of peeling the sealing body from a glass panel to perform rewiring or forming a pad (PAD). In this method, in order to maintain the yield and quality, it is necessary to mount a die on a glass panel with high precision, and a high precision of 3 µm or the like is required due to the miniaturization of the die and high-density wiring.

In order to increase the precision of the manufacturing apparatus, a method of arranging correction marks or the like on a glass panel is considered, but when processing a glass panel to form a target mark, it is difficult to reuse the glass panel (as a mold), and In order to form an alignment mark on a glass panel with an accuracy of within 3 μm, it is expensive, and an increase in the cost of the glass panel leads to an increase in package price. Therefore, it is necessary to mount the die with high precision on the unmarked plain glass panel, and the manufacturing apparatus becomes expensive. In order to reduce the cost of FOPLP, it is necessary to realize a manufacturing device capable of high-precision and low-cost mounting.

Therefore, a technique (comparative example) of forming a mark serving as a target on a stage for holding and fixing a glass panel was examined. This will be described with reference to FIG. 10. 10 is a cross-sectional view showing a bonding stage and a glass panel of a comparative example.

A target mark TMR is formed by engraving on the glass panel GP side of the bonding stage BSR. The target mark TMR is recognized by the substrate recognition camera 44 through the glass panel GP, and the mounting position of the die D is corrected. Thereby, it is possible to provide a manufacturing apparatus capable of stably mounting a die on a plain glass panel GP with high accuracy, improving the quality and yield of FOPLP, and reducing manufacturing cost. The target mark TMR of the bonding stage BSR is accurately corrected for each device in advance, so that stable mounting accuracy can be achieved. Further, by performing the target mark TMR recognition and correction operation at any time, it is possible to correct deviations in accuracy due to changes in the device over time, temperature changes, and the like, and contribute to maintaining the accuracy.

However, in the comparative example method of marking the target mark on the bonding stage, it is necessary to replace the bonding stage every time a product is changed.

Accordingly, in the embodiment, a bonding stage for fixing a glass panel as a substrate is formed of a transparent material such as glass, and a target mask plate (plate) having a target mark (reference mark) is provided under the bonding stage.

Hereinafter, an example of application to FOPLP will be described as an embodiment, but may also be applied to FOWLP.

[Example]

1 is a top view schematically showing a flip chip bonder of an embodiment. FIG. 2 is a view for explaining operations of the pickup flip head, transfer head, and bonding head when viewed from the direction of arrow A in FIG. 1.

The flip chip bonder 10 is roughly divided into a die supply unit 1, a pickup unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, and a transfer unit 5 ), a substrate supply unit 6K, a substrate carrying unit 6H, and a control device 7 that monitors and controls the operation of each unit.

First, the die supply unit 1 supplies a die D to be mounted on a substrate P such as a glass substrate. The die supply unit 1 includes a wafer holder 12 for holding the divided wafer 11, a push-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11, and a wafer ring supply unit ( 18). The die supply unit 1 moves in the XY direction by a driving means (not shown) and moves the die D to be picked up to the position of the pushing unit 13. The wafer ring supply unit 18 has a wafer cassette in which the wafer ring is accommodated, and sequentially supplies the wafer ring to the die supply unit 1 to exchange a new wafer ring. The die supply 1 moves the wafer ring to a pickup point so that the desired die can be picked up from the wafer ring. The wafer ring is a jig in which a wafer is fixed and can be attached to the die supply unit 1.

The pickup section 2 has a pickup flip head 21 that picks up and reverses the die D, and each drive section (not shown) that lifts, rotates, reverses, and moves the collet 22 in the X direction. With such a configuration, the pickup flip head 21 picks up the die, rotates the pickup flip head 21 180 degrees, reverses the bump of the die D and makes the die D face toward the lower surface, and moves the die D to the transfer head 81. ).

The transfer unit 8 receives the inverted die D from the pickup flip head 21 and mounts it on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 including a collet 82 for adsorbing and holding a die D at the tip, similar to the pickup flip head 21, and a Y for moving the transfer head 81 in the Y direction. It has a driving part 83.

The intermediate stage portion 3 has an intermediate stage 31 for temporarily loading the die D and a stage recognition camera 34. The intermediate stage 31 is movable in the Y direction by a driving unit (not shown).

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds the die D onto the conveyed substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 for adsorbing and holding die D at the tip, similar to the pickup flip head 21, and a Y beam for moving the bonding head 41 in the Y direction. It has 43, a substrate recognition camera 44 which captures an image of a target mark (refer FIG. 4) and recognizes a bonding position, and an X-beam 45.

With such a configuration, the bonding head 41 picks up the die D from the intermediate stage 31 and bonds the die D to the substrate P based on the imaging data of the substrate recognition camera 44.

The transport unit 5 includes transport rails 51 and 52 through which the substrate P moves in the X direction. The conveyance rails 51 and 52 are installed in parallel. With this configuration, the substrate P is unloaded from the substrate supply unit 6K, is moved to the bonding position along the transport rails 51 and 52, and then moved to the substrate unloading section 6H after bonding, and the substrate unloading section 6H Pass the substrate P to ). During bonding of the die D to the substrate P, the substrate supply unit 6K carries out the new substrate P and stands by on the transfer rails 51 and 52.

3 is a schematic cross-sectional view showing an essential part of the die supply portion of FIG. 1. As shown in Fig. 3, the die supply unit 1 includes an expand ring 15 holding a wafer ring 14, and a dicing plate held by the wafer ring 14 to which a plurality of die D is adhered. It has a support ring 17 for horizontally positioning the tape 16, and a pushing unit 13 for pushing up the die D upwards. In order to pick up a predetermined die D, the pushing unit 13 moves up and down by a drive mechanism (not shown), and the die supply unit 1 moves in the horizontal direction.

Details of the bonding unit will be described with reference to FIGS. 1, 4 and 5. 4 is a schematic cross-sectional view showing a main part of the bonding portion 4. 5 is a plan view showing a target mask plate.

As shown in Figs. 1 and 4, the bonding unit 4 includes a bonding stage BS and a target mask plate MP supported on the mount 53, and an X-beam installed in the vicinity of the transfer rails 51 and 52. (45), the Y beam 43 supported on the X beam 45, the bonding head 41 supported by the Y beam 43, and the bonding head 41 in the Y-axis direction and the Z-axis direction. It has a driving part (not shown) to drive.

The bonding head 41 is a device having a collet 42 that detachably holds the die D by vacuum suction, and is provided on the Y beam 43 so as to be reciprocally moved in the Y-axis direction.

The bonding head 41 has a function of holding and conveying the die D picked up from the intermediate stage 31, and installing the die D on the substrate P which is suction-fixed to the bonding stage BS.

As shown in FIG. 1, the Y beam 43 extends in the Y-axis direction so as to span on the bonding stage BS, and both ends are supported so as to be movable in the X-axis direction by the X-beam 45. In addition, when the bonding head 41 moves toward the intermediate stage 31 side rather than the X-beam 45, the bonding head 41 rises so that the collet 42 is higher than the X-beam 45.

As shown in Fig. 4, the bonding stage BS is formed of a transparent material such as glass, and is supported so as to be elevating and descending by the support part BSa. The target mask plate MP is supported by the support part BSa so as to be able to move up and down. The target mask plate MP is spaced apart from the bonding stage BS and installed interchangeably under the bonding stage BS. As shown in Fig. 5, on the target mask plate MP, a target mark TM indicating a substrate mounting position is printed and formed. The target mark TM may be formed by engraving on the target mask plate MP. The target mark TM is, for example, a square size of 1 to 2 mm on one side. The substrate P is a rectangular glass panel in plan view, and as shown in Fig. 4, an adhesive base G is applied to the upper surface thereof. Further, the base G may be applied without adhesiveness.

Since the substrate P and the bonding stage BS are transparent, the substrate recognition camera 44 can recognize the target mark TM formed on the target mask plate.

Next, a bonding method (a method of manufacturing a semiconductor device) implemented in the flip chip bonder of the embodiment will be described with reference to FIG. 6. 6 is a flowchart illustrating a bonding method performed in the flip chip bonder of the embodiment.

Step S1: The control device 7 moves the wafer holder 12 so that the die D to be picked up is positioned directly above the pushing unit 13 to push the die to be peeled up to the lift unit 13 and the collet 22 To determine the location. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. At this time, the control device 7 adsorbs the dicing tape 16 on the upper surface of the pushing unit 13. The control device 7 lowers the collet 22 while evacuating, lands on the die D to be peeled, and adsorbs the die D. The control device 7 raises the collet 22 and peels the die D from the dicing tape 16. Thereby, the die D is picked up by the pick-up flip head 21.

Step S2: The control device 7 moves the pickup flip head 21.

Step S3: The control device 7 rotates the pickup flip head 21 by 180 degrees, inverts the bump surface (surface) of the die D, faces the lower surface, and passes the die D to the transfer head 81. do.

Step S4: The control device 7 picks up the die D from the collet 22 of the pickup flip head 21 by the collet 82 of the transfer head 81, and transfers the die D.

Step S5: The control device 7 inverts the pickup flip head 21 so that the suction surface of the collet 22 faces downward.

Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

Step S7: The control device 7 loads the die D held by the transfer head 81 onto the intermediate stage 31.

Step S8: The control device 7 moves the transfer head 81 to the delivery position of the die D.

Step S9: After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the transfer position with the bonding head 41.

Step SA: The control device 7 picks up the die D from the intermediate stage 31 by the collet of the bonding head 41, and transfers the die D.

Step SB: The control device 7 moves the intermediate stage 31 to the transfer position with the transfer head 81.

Step SC: The control device 7 moves the die D held by the collet 42 of the bonding head 41 onto the substrate P.

Step SD: The control device 7 loads the die D picked up from the intermediate stage 31 by the collet 42 of the bonding head 41 on the substrate P coated with the adhesive base G. More specifically, the control device 7 recognizes the target mark (position recognition mark) TM of the target mask plate MP through the substrate P and the bonding stage BS by the substrate recognition camera 44. The control device 7 recognizes the edge of the die D by the substrate recognition camera 44. The edge of die D is recognized right before the place. In this case, it is desirable to recognize simultaneously and one field of view. The control device 7 calculates the recognition result. The target mark TM is recognized to calculate the place position, and the die D is recognized to calculate the die position. The control device 7 corrects the position of the die D by moving the bonding head 41 based on the calculation result. The control device 7 loads (places) the die D on the substrate P.

Step SE: The control device 7 moves the bonding head 41 to the transfer position with the intermediate stage 31.

Moreover, after step S8, the control device 7 takes out the board|substrate P to which the die D was bonded from the conveyance rails 51 and 52 by the board|substrate carrying out part 6H. The substrate P is taken out from the flip chip bonder 10. After that, a plurality of dies (semiconductor chips) disposed on the adhesive layer G of the substrate P are collectively sealed with a sealing resin to form a sealing body comprising a plurality of semiconductor chips and a sealing resin covering the plurality of semiconductor chips. , The substrate P is peeled from the sealing body, and then a rewiring layer is formed on the surface of the sealing body to which the substrate P has been adhered to, thereby manufacturing FOPLP.

In the embodiment, a stage for fixing a glass panel, which is a substrate on which a semiconductor chip is loaded, is formed of glass or a transparent material, can be exchanged under it, and a target mark that is a reference mark for recognizing the position of the semiconductor chip loaded on the glass panel A target mask plate formed by engraving or printing is provided, and a semiconductor chip is mounted on a plain glass panel based on this. The target mask plate is disposed in a non-contact manner with the bonding stage. The target mark is provided on the upper surface side of the target mask plate when an image is captured by the substrate recognition camera from above and recognized. The position of the target mark is imaged with an upper substrate recognition camera, and the position is verified and corrected.

Thereby, it becomes possible to mount semiconductor chips on a plain glass panel without marks with high precision.

High-precision semiconductor chips can be mounted on a glass panel as a mold of FOPLP without processing a target mark, making it possible to reuse the glass panel and reduce costs. A semiconductor chip can be loaded with a reference mask at all times without the influence of shift due to processing on the glass panel.

The target mask panel can be easily replaced at the time of changing the type, shortening the working time, and improving the throughput. Further, offline accuracy verification can also be performed frequently. In addition, no contact with the bonding stage during replacement occurs.

Since the target mask plate does not deteriorate due to no contact with the bonding stage, it can be used permanently as long as there is no exchange due to a change in type.

<modification example>

Hereinafter, some examples are given of typical modified examples. In the following description of the modified example, it is assumed that the same reference numerals as those in the above-described embodiment may be used for portions having the same configuration and function as those described in the above-described embodiment. In addition, it is assumed that the description in the above-described embodiment can be appropriately used within a range not technically contradictory for the description of such a part. In addition, a part of the above-described embodiment, and all or part of a plurality of modified examples, may be appropriately and complexly applied within a range not technically contradictory.

(1st modification)

Fig. 7 is a schematic side view showing a main part of a bonding portion of the first modified example.

The target mask plate MPA of the first modification is provided below the bonding stage BS and spaced apart from the bonding stage BS, similarly to the embodiment. The target mask plate MPA is made of a transparent material (eg, glass), and a target mark TM is provided on the lower surface side of the target mask plate MPA. The position of the target mark TM and the die D is verified and corrected from the lower surface side of the target mask plate MPA using an undervision camera 46 or the like.

(2nd modification)

Fig. 8 is a schematic side view showing a main part of a bonding portion of a second modified example.

The target mask plate MPB of the second modification is provided below the bonding stage, spaced apart from the bonding stage BS, as in the embodiment. The target mask plate MPB has an opening OP at the position of the target mark, and a target mark TMB for self-luminescence is formed by a light source LS such as an LED from the lower surface side of the target mask plate MPB, and the substrate recognition camera 44 Recognizes the image and recognizes the target mark TMB of self-luminescence without using the camera's illumination.

By using the self-luminous target mark TMB, even when the state of the substrate P and the bonding stage BS is bad, and it is difficult to recognize the target mark TM well by illumination of the camera, it becomes possible to recognize by the self-luminous target mark. For example, when there is an influence on imaging due to reflection on the surface of the substrate P, the influence is eliminated and correction can be performed with high precision.

(3rd modification)

9 is a schematic side view showing a main part of a bonding portion of a third modified example.

The target mask plate MPC of the third modified example is provided below the bonding stage and spaced apart from the bonding stage BS, similarly to the embodiment. The target mask plate MPC is composed of a display panel DP such as liquid crystal, organic EL or plasma light emission, and the display panel DP displays the position of a semiconductor chip (target mark TMC) mounted on the substrate P by image data. The display panel DP has a dot size or line width capable of recognizing a position by the substrate recognition camera 44, and displays a wavelength (color) that is easy to recognize through the glass panel P.

By configuring the target mask plate MPC as a display panel, it is possible to respond to changes in the arrangement of target marks at the time of type change by changing only the image data of the display panel, eliminating the replacement of the target mask plate itself, further improving throughput. Is planned.

As described above, the invention made by the present inventors has been specifically described based on embodiments, examples, and modifications, but the present invention is not limited to the above embodiments, examples, and modifications, and it goes without saying that various modifications are possible. .

For example, in the embodiment, a flip chip bonder has been described, but it is also applicable to a die bonder that bonds a die picked up from the die supply unit without inverting it.

1: die supply
2: pickup unit
21: pickup flip head
22: collet
3: middle stage part
4: bonding part
41: bonding head
42: collet
43: Y beam
44: board recognition camera
45: X beam
7: control device
10: flip chip bonder
11: wafer
13: push-up unit
D: Die
P: substrate
MP: Target mask plate
G: adhesive layer
TM: Target mark
BS: Bonding stage

Claims (13)

A bonding head that is a transparent substrate sealed by a resin together with a plurality of dies, and loads the picked up die on the upper surface of the substrate to be peeled off from the sealed resin;
A transparent bonding stage for fixing the substrate,
A plate located below the bonding stage and spaced apart from the bonding stage and having a reference mark for recognizing the position of the die when the die is loaded onto the substrate;
A camera that passes through the bonding stage and captures the die or the reference mark
Die bonding apparatus comprising a. The method of claim 1,
The substrate includes a glass substrate and an adhesive provided on an upper surface of the glass substrate,
The camera is positioned above the substrate, the die is photographed, and the die bonding apparatus passes through the substrate and the bonding stage to photograph the reference mark. The method of claim 2,
The plate is a die bonding apparatus having the reference mark imprinted or printed on the upper surface side thereof. A bonding head that loads the picked up die on the upper surface of a transparent substrate,
A transparent bonding stage for fixing the substrate,
A plate located below the bonding stage and spaced apart from the bonding stage and having a reference mark for recognizing the position of the die when the die is loaded onto the substrate;
A camera that transmits an image of the die or the reference mark through the bonding stage,
Light source provided under the plate
And,
The plate has an opening,
The reference mark is constituted by the light source and the opening,
The substrate includes a glass substrate and an adhesive provided on an upper surface of the glass substrate,
The camera is positioned above the substrate, the die is photographed, and the die bonding apparatus passes through the substrate and the bonding stage to photograph the reference mark. A bonding head that loads the picked up die on the upper surface of a transparent substrate,
A transparent bonding stage for fixing the substrate,
A plate located below the bonding stage and spaced apart from the bonding stage and having a reference mark for recognizing the position of the die when the die is loaded onto the substrate;
A camera that passes through the bonding stage and captures the die or the reference mark
And,
The plate has a display panel,
The reference mark is constituted by display on the display panel,
The substrate includes a glass substrate and an adhesive provided on an upper surface of the glass substrate,
The camera is positioned above the substrate, the die is photographed, and the die bonding apparatus passes through the substrate and the bonding stage to photograph the reference mark. The method of claim 1,
The substrate includes a glass substrate and an adhesive provided on an upper surface of the glass substrate,
The plate has the reference mark imprinted or printed on its lower surface side,
The camera is located under the plate, and while imaging the reference mark, the die bonding apparatus for imaging the die by passing through the bonding stage and the substrate. The method according to any one of claims 1 to 6,
With a die supply,
A pickup head that picks up a die from the die supply and reverses it up and down;
A die bonding apparatus further comprising a transfer head for picking up the die from the pickup head. The method of claim 7,
Further comprising an intermediate stage in which the die picked up by the transfer head is loaded,
The bonding head picks up the die from the intermediate stage and loads the die on the upper surface of the substrate with the circuit formation surface of the die down. (a) a substrate sealed by a resin together with a plurality of dies, a die bonding apparatus for bonding a die to a substrate peeled from the sealed resin, a transparent bonding stage for fixing the transparent substrate having an adhesive layer on the upper surface thereof; A process of preparing a die bonding apparatus having a plate provided below the bonding stage and spaced apart from the bonding stage and having a reference mark;
(b) preparing a wafer ring holding a dicing tape having a die;
(c) picking up the die from the wafer ring, and
(d) the step of loading the picked up die onto the substrate
And,
In the step (d), the picked-up die is mounted on an upper surface of the substrate while imaging the picked-up die and the reference mark. The method of claim 9,
In the step (d), the die and the reference mark are imaged from above the substrate. The method of claim 10,
The step (c) further has a step of inverting the picked up die up and down,
In the step (d), the inverted die is picked up, and the circuit formation surface of the die is placed down on the substrate. The method of claim 10,
The step (c) further has a step of loading the picked up die onto an intermediate stage,
In the step (d), the die is picked up from the intermediate stage, and the die is mounted on the substrate with the circuit formation surface of the die facing up. The method of claim 11 or 12,
In the step (d), a position of the picked-up die is corrected based on a result of image pickup of the die and the reference mark, and the position of the picked-up die is corrected and mounted on the substrate.

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