JP7454763B2 - Electronic component mounting equipment and production data creation system - Google Patents

Description

The present invention relates to an electronic component mounting device that mounts electronic components on a workpiece based on production data, and a production data creation system that creates production data.

Electronic component mounting equipment mounts electronic components such as semiconductor chips, chip components, and packaged LSIs onto a workpiece such as a board to produce components and mounting boards. Electronic component mounting equipment mounts electronic components on a board based on production data including process conditions such as load and temperature when mounting electronic components on a board. There are optimal process conditions for substrates and electronic components that provide optimal mounting conditions, and process conditions determined in advance through experiments and simulations using substrates and electronic components are used in production.

In Patent Document 1, process conditions are set in which factor values are randomly determined from within a predetermined range, and a simulation is performed based on a plurality of set process conditions and member conditions such as member shape and material obtained in advance. The loading status is predicted. A simulation method is disclosed in which a computer executes a series of processes for evaluating the mounting state from a plurality of simulation results and searching for optimal process conditions from the evaluation results.

Japanese Patent Application Publication No. 2005-72576

However, in the conventional technology including Patent Document 1, although it is possible to determine optimized process conditions through simulation for substrates and electronic components for which component conditions already exist, new substrates and electronic components for which component conditions do not exist are delivered. In production sites where products need to be shipped in a short period of time, it is necessary to change process conditions, mount electronic components on actual boards, observe the mounting conditions, and conduct experiments to find the optimal process conditions. There are cases.

In that case, it is necessary to prepare in advance a plurality of pieces of production data with different process conditions, and to conduct an experiment in which electronic components are mounted on a board while changing the process conditions by changing the production data executed by the operator. Therefore, there is a risk that the amount of work required by the operator will increase and there will be a risk of making mistakes, and there is room for further improvement in order to conduct experiments for efficiently and reliably creating production data.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting device and a production data creation system that can efficiently conduct experiments for creating production data.

The electronic component mounting apparatus of the present invention is an electronic component mounting apparatus that mounts electronic components on a workpiece based on production data, and includes production data used to produce the workpiece on which the electronic component is mounted, and a first mode for mounting the electronic component on the workpiece under predetermined conditions based on the production data; and a first mode for mounting the electronic component on the workpiece under predetermined conditions based on the production data; The present invention includes a second mode in which the electronic component is mounted on the workpiece while changing conditions based on data, and a component mounting section that mounts the electronic component on the workpiece in either of the following modes.

The production data creation system of the present invention is a production data creation system that creates the production data used in an electronic component mounting device that mounts electronic components on a workpiece based on production data, and the production data creation system is a production data creation system that creates the production data used in an electronic component mounting device that mounts electronic components on a workpiece based on production data. a storage unit that stores at least experimental information constituting experimental production data used in the storage unit; an experimental production data creation unit that creates the experimental production data based on the information stored in the storage unit; and an electronic component mounting unit. While changing the conditions based on the experimental production data, the electronic component mounting device applies the electronic component to the workpiece under predetermined conditions based on the evaluation results of the electronic component mounted on the workpiece on which the electronic component is mounted. It is equipped with a production data creation department that creates production data for mounting electronic components.

According to the present invention, experiments for creating production data can be efficiently carried out.

Configuration explanatory diagram of an electronic component mounting system according to an embodiment of the present invention Configuration explanatory diagram of an electronic component mounting device according to an embodiment of the present invention A block diagram showing the configuration of a control system of an electronic component mounting device according to an embodiment of the present invention A block diagram showing the configuration of a processing system of a management computer (production data creation system) according to an embodiment of the present invention An explanatory diagram of an example of a basic information input screen displayed on a touch panel of an electronic component mounting apparatus according to an embodiment of the present invention An explanatory diagram of an example of an experiment condition input screen displayed on a touch panel of an electronic component mounting apparatus according to an embodiment of the present invention An explanatory diagram of an example of an experimental production data confirmation screen displayed on a touch panel of an electronic component mounting apparatus according to an embodiment of the present invention An explanatory diagram of an example of an evaluation result input screen displayed on a touch panel of an electronic component mounting apparatus according to an embodiment of the present invention An explanatory diagram of an example of a measurement result display screen displayed on a touch panel of an electronic component mounting device according to an embodiment of the present invention Flow diagram of an electronic component mounting method according to an embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate depending on the specifications of the electronic component mounting device, the mounting evaluation device, and the management computer. Hereinafter, corresponding elements in all drawings will be denoted by the same reference numerals, and redundant explanation will be omitted. In FIG. 2, the X direction of the substrate transport direction (direction perpendicular to the plane of the paper in FIG. 2) and the Y direction (horizontal direction in FIG. 2) perpendicular to the substrate transport direction are shown as two axial directions perpendicular to each other in the horizontal plane. Further, in FIG. 2, the Z direction (vertical direction in FIG. 2) is shown as a height direction perpendicular to the horizontal plane. The Z direction is the vertical direction when the electronic component mounting device is installed on a horizontal surface.

First, with reference to FIG. 1, the configuration of the electronic component mounting system 1 will be explained. The electronic component mounting system 1 has a configuration in which an electronic component mounting device M1, a mounting evaluation device M2, and a management computer 3 are interconnected through a communication network 2. The electronic component mounting device M1 has a function of mounting an electronic component D such as a semiconductor chip placed on a tray or stuck on an adhesive sheet onto a substrate B (work).

The substrate B is composed of a plurality of individual substrates Ba on which electrodes to which terminals such as bumps of the electronic component D are connected are formed. The electronic component mounting apparatus M1 mounts the electronic components D on the individual boards Ba of the board B that has been carried in (arrow a) (arrow b). During mass production, the individual substrates Ba on which the electronic components D are mounted are cut out from the substrate B (arrow c), and each becomes a new component or substrate. When the electronic component mounting device M1 evaluates the process conditions for mounting the electronic component D onto the board B, the board B on which the electronic component D is mounted is carried into the mounting evaluation device M2 (arrow d), and is separated from the electronic component D. The bonding state with the substrate Ba (substrate B) and the like are evaluated.

In FIG. 1, the mounting evaluation device M2 measures the shear strength, which is the strength at which the bumps of electronic component D are joined to the electrodes of substrate B, the bump height of the joined bumps, and the strength at which the bumps of electronic component D are joined to the electrodes. Evaluate the transfer area, resistance value of the bonded bumps, mounting accuracy, etc. The on-board evaluation device M2 has a plurality of mechanisms with different functions in order to execute these evaluations. Alternatively, a plurality of on-board evaluation devices M2 with different functions may each perform the evaluation. For example, the mounting evaluation device M2 equipped with a camera that images the upper surface of the substrate B images the traces of bumps on the electrodes of the substrate B from which the electronic component D has been peeled off, and evaluates the transfer area and mounting accuracy. Hereinafter, the plurality of onboard evaluation devices M2 having different functions will be collectively referred to as the onboard evaluation device M2.

Next, with reference to FIG. 2, the overall configuration and functions of the electronic component mounting apparatus M1 will be described. The electronic component mounting device M1 has a function of mounting an electronic component D such as a semiconductor chip onto a substrate B (work). A component supply stage 5 and a substrate holding stage 6 are arranged on the base 4 in the Y direction. Further, the electronic component mounting apparatus M1 includes a control device 7 that controls each part.

The component supply stage 5 is configured by providing a component supply section 9 above a component supply section moving section 8 . The component supply section moving section 8 is controlled by the control device 7, and moves the component supply section 9 in the X direction and the Y direction. A plurality of electronic components D are held in the upper part of the component supply section 9. The electronic component D is held at the upper part of the component supply unit 9 while being placed on a tray or adhered to an adhesive sheet.

In FIG. 2, the substrate holding stage 6 is configured by providing a substrate holding part 11 above a substrate holding part moving part 10. The substrate holder moving unit 10 is controlled by the control device 7, and moves the substrate holder 11 in the X direction and the Y direction. The substrate holding section 11 includes a pair of transport rails 11a controlled by the control device 7. The board holding unit 11 carries the board B using the transport rail 11a, positions it at a position where the electronic component D is mounted, and holds the board B. Further, the board holding unit 11 carries out the board B on which the electronic component D is mounted using the transport rail 11a.

The substrate holding section 11 is provided with a substrate heating section 12 that heats the substrate B held by the transport rail 11a, and a stage thermometer 12a that measures the stage temperature of the substrate holding section 11 heated by the substrate heating section 12. ing. The substrate heating section 12 is controlled by the control device 7 and heats the substrate holding section 11 to a specified stage temperature. The stage temperature measured by the stage thermometer 12a is transmitted to the control device 7.

In FIG. 2, the electronic component D is held on the component supply section 9 with the bump Da formed on the back surface of the electronic component D facing upward. A pickup head 13 is installed above the component supply stage 5. The pickup head 13 has a function of sucking and taking out the electronic component D on the component supply section 9. The pickup head 13 is rotated about the X-axis as a rotation axis by a pickup head drive unit 14 controlled by the control device 7 (arrow e). Further, the pickup head 13 moves to a delivery position (arrow f), which will be described later. That is, the pickup head 13 holds the electronic component D at the delivery position with the bump Da facing downward.

A bonding head 15 is installed above the pickup head 13 and the substrate holding stage 6. The bonding head 15 is moved in the Y direction by a bonding head drive section 16 controlled by the control device 7 (arrow g, arrow h). A tool 17 for sucking and holding the electronic component D is provided at the lower end of the bonding head 15. The bonding head 15 and the bonding head drive unit 16 have the tool 17 adsorb and receive the electronic component D from the pickup head 13 at the delivery position, move the electronic component D to the mounting position of the board B held by the board holding unit 11, It has a function of mounting the electronic component D on the board B.

The bonding head 15 is equipped with a component heating section 18 that heats the electronic component D sucked by the tool 17, and a tool thermometer 18a that measures the temperature of the tool 17 heated by the component heating section 18. The component heating unit 18 is controlled by the control device 7 and heats the tool 17 to a specified tool temperature. The tool temperature measured by the tool thermometer 18a is transmitted to the control device 7.

In FIG. 2, a tool elevating mechanism 19 for elevating the tool 17 is installed in the bonding head 15. Furthermore, a pressure sensor 19a is installed in the bonding head 15 to measure the load with which the tool 17 holding the electronic component D is pressed against the substrate B by the tool elevating mechanism 19. The tool elevating mechanism 19 is controlled by the control device 7, and lowers the tool 17 so that the tool 17 mounts the electronic component D on the board B with a specified load. The load measured by the pressure sensor 19a is transmitted to the control device 7.

An ultrasonic oscillator 20 that causes the tool 17 to vibrate ultrasonically is installed in the bonding head 15 . The ultrasonic oscillator 20 is controlled by the control device 7, and when mounting the electronic component D on the substrate B by ultrasonic pressure bonding, the tool 17 is ultrasonically vibrated with specified ultrasonic power, amplitude, and frequency. The electronic component mounting device M1 includes a touch panel 21 connected to the control device 7. The touch panel 21 can input data to the control device 7 and operate the electronic component mounting device M1 using operation buttons displayed on the display section.

In this way, the substrate holding stage 6 includes the substrate heating section 12 and the stage thermometer 12a. The bonding head 15 also includes a component heating section 18, a tool thermometer 18a, a tool lifting mechanism 19, a pressure sensor 19a, and an ultrasonic oscillator 20. The component supply stage 5, the substrate holding stage 6, the pickup head 13, the pickup head drive section 14, the bonding head 15, and the bonding head drive section 16 are a component mounting section 22 (see FIG. 3) that mounts the electronic component D on the substrate B. be.

Next, with reference to FIG. 3, the configuration of the control system of the electronic component mounting apparatus M1 will be described. A component mounting section 22, a touch panel 21, and a mounting communication section 23 are connected to the control device 7 included in the electronic component mounting apparatus M1. The onboard communication unit 23 sends and receives data to and from the onboard evaluation device M2 and the management computer 3 via the communication network 2. The control device 7 includes a mounting storage section 24, a mounting control section 25, an experimental production data creation section 26, an experiment simulation section 27, an evaluation result acquisition section 28, an evaluation result input sheet creation section 29, a production data creation section 30, and a measurement result. A display processing section 31 is provided. The onboard storage unit 24 is a storage device, and stores production data 24a, experimental information 24b, device information 24c, experimental production data 24d, measurement results 24e, evaluation results 24f, and the like.

The production data 24a is data used to produce (mass produce) the board B on which the electronic component D is mounted, and for each type of board (board name), the mounting position (XY coordinates) of the electronic component D on the board B. ), process conditions (values of stage temperature, tool temperature, load, ultrasonic power, etc.) during mass production in which electronic components D are mounted on substrate B by component mounting section 22 are stored. The experimental production data 24d is data used in an experiment to obtain the production data 24a, and includes process conditions for a plurality of experiments in which the electronic component D is mounted on the board B by the component mounting section 22, and the electronic component under each process condition. The mounting position where D is mounted on the board B is stored. That is, the experimental production data 24d includes information associating a plurality of conditions for mounting the electronic component D on the board B and a mounting position for mounting the electronic component D on the board B under the conditions.

In FIG. 3, the mounting control unit 25 includes a first mode processing unit 25a that controls the component mounting unit 22 in the first mode as an internal processing unit, and a second mode processing unit 25b that controls the component mounting unit 22 in the second mode. It is equipped with The first mode processing section 25a controls the component mounting section 22 based on the production data 24a, and mounts the electronic component D at the mounting position of the board B under predetermined process conditions. The second mode processing section 25b controls the component mounting section 22 based on the experimental production data, and mounts the electronic component D at the mounting position of the substrate B while changing the process conditions.

In this way, the component mounting section 22 has two modes: the first mode in which the electronic component D is mounted on the board B under predetermined conditions based on the production data 24a, and the first mode in which the electronic component D is mounted on the board B while changing the conditions based on the experimental production data 24d. The electronic component D is mounted on the board B in either of the second mode in which the electronic component D is mounted. Furthermore, in the second mode, the component mounting section 22 mounts the electronic component D at the mounting position of the board B specified by the experimental production data 24d under the specified conditions.

In FIG. 3, the mounting control unit 25 acquires the results measured by the stage thermometer 12a, tool thermometer 18a, and pressure sensor 19a when the component mounting unit 22 mounts the electronic component D on the board B, and obtains the measurement results. It is stored in the on-board storage unit 24 as 24e. That is, the stage thermometer 12a, the tool thermometer 18a, and the pressure sensor 19a are used in the component mounting section under the process conditions set based on the production data 24a or the experimental process conditions set based on the experimental production data 24d. This is a measurement unit that measures the actual measurement value at 22.

The experimental information 24b is information that constitutes the experimental production data 24d used in the experiment to obtain the production data 24a. Specifically, the experimental information 24b includes experimental factors that influence the evaluation result 24f of the electronic component D mounted on the board B, the range of values that the experimental factors can take, and the experimental factors selected from the range. This includes the number of possible levels. The device information 24c is information regarding the configuration of the component mounting section 22 included in the electronic component mounting device M1. Specifically, the device information 24c includes information specifying the configuration of the component mounting section 22, such as whether the component mounting section 22 is configured to allow thermocompression bonding or ultrasonic compression bonding.

In FIG. 3, the experimental production data creation unit 26 creates experimental production data 24d based on information stored in the onboard storage unit 24 (storage unit) including experiment information 24b and device information 24c. The experimental production data 24d created by the experimental production data creation section 26 is stored in the on-board storage section 24. The component mounting section 22 mounts the electronic component D on the board B based on the created experimental production data 24d.

Here, details of creation of the experimental production data 24d by the experimental production data creation section 26 will be described with reference to FIGS. 5 to 7. In FIG. 5, first, the experimental production data creation section 26 causes the touch panel 21 (display section) to display a basic information input screen 50 through which the operator inputs basic information for creating the experimental production data 24d. The basic information input screen 50 includes a “board name” input frame 51, a “device information” input frame 52, a “repetition count” input frame 53, a “mounting method” input frame 54, a “back” button 55, and a “next” button. A button 56 is displayed.

In FIG. 5, when the operator operates the drop-down button 51a of the "board name" input frame 51, the type (board name) of the board B to be tested is selected. Here, "Q1" is selected as the type of substrate B. By operating the drop-down button 52a in the "device information" input frame 52, the operator selects the mounting method (thermal compression bonding, ultrasonic compression bonding, etc.) for mounting the electronic component D included in the device information 24c onto the board B. be done. Here, ultrasonic crimping is selected as the mounting method. When the operator operates the drop-down button 53a of the "number of repetitions" input frame 53, the number of repetitions for mounting the electronic component D on the board B under each experimental process condition is selected. Here, "3" is selected as the number of repetitions.

When the operator operates the drop-down button 54a in the "mounting method" input frame 54, an allocation method for allocating experimental conditions to mounting positions is selected. Examples of the allocation method include a method of sequentially allocating in the numerical order of the experimental conditions, and a method of randomly allocating (or according to a predetermined rule) that cancels the influence caused by the mounting position on the board B. Here, the method of allocating in order of condition number is selected. When the "back" button 55 is operated, the screen changes to the previous screen. When the "Next" button 56 is operated, the screen transitions to the next experimental condition input screen.

In FIG. 6, when the "Next" button 56 is operated on the basic information input screen 50, the experimental production data creation section 26 sets the experimental conditions for inputting experimental conditions for the operator to create the experimental production data 24d. An input screen 57 is displayed on the touch panel 21. The experimental condition input screen 57 displays an “experimental condition” input frame 58, a “back” button 59, and a “next” button 60. The "experimental conditions" input frame 58 displays input frames for the experimental factors included in the experimental information 24b, the number of levels, and the range of values that the experimental factors can take.

When the operator operates the drop-down button in the "experimental factor" input frame, the experimental factor corresponding to the ultrasonic crimping selected in the "apparatus information" input frame 52 of the basic information input screen 50 is displayed. Here, stage temperature, load, load application time, tool temperature, and ultrasonic power are displayed as experimental factor options. The operator selects an experimental factor to be used in the experiment from among the displayed experimental factors. The operator inputs the number of levels by operating the drop-down button in the "number of levels" input frame. Further, the operator inputs the upper limit value and lower limit value of the experimental factor into the lower limit value input field and upper limit value input field of the "range" input frame. Note that when the operator selects an experimental factor in the "experimental factor" input frame, a lower limit value input field, an upper limit value input field, and the unit of the experimental factor are displayed in the "range" input frame.

In FIG. 6, when the "back" button 59 is operated, the screen changes to the previous basic information input screen 50. When the "Next" button 60 is operated, the screen changes to the next experimental production data confirmation screen. When the "Next" button 60 is operated on the experimental condition input screen 57, the experimental production data creation unit 26 uses experimental design, etc. to create experimental production data based on the input experimental factors, ranges, and number of levels. Determine process conditions. That is, the experimental production data creation unit 26 selects experimental factors according to the device information 36c and creates experimental production data 24d.

Furthermore, the experimental simulation unit 27 calculates the total time required to mount the electronic component D on the board B based on the experimental production data 24d created under the determined experimental process conditions. Specifically, the experiment simulation unit 27 predicts the time required to mount the electronic component D on the board B for the number of repetitions specified by each process condition, the time required to change the stage temperature and tool temperature, etc. and calculate the total time.

In FIG. 7, when the "Next" button 60 is operated on the experimental condition input screen 57, the experimental production data creation unit 26 confirms the experimental process conditions for the operator to create the experimental production data 24d. An experimental production data confirmation screen 61 is displayed on the touch panel 21. The experimental production data confirmation screen 61 displays an "expected experiment time" display frame 62, an "experiment conditions" display frame 63, a "loading position" display frame 64, a "back" button 65, and a "next" button 66. ing. The "expected experiment time" display frame 62 displays the expected value of the total time (expected experiment time) calculated by the experiment simulation section 27. Here, it is expected to be "100 min".

The "experimental conditions" display frame 63 displays the mounting position and the process conditions (values of experimental factors) determined by the experimental production data creation unit 26 for each condition number. The “mounting position” display frame 64 displays a total of 48 pieces, 6 columns (1 to 6) in the X direction and 8 rows (A to H) in the Y direction, formed on the board B with the board name “Q1”. Condition numbers of process conditions assigned to individual substrates Ba are displayed in each grid. Since "Condition number order" is selected in the "Mounting method" input frame 54 of the basic information input screen 50, the process conditions are applied to the individual substrates Ba as many times as the number of repetitions in ascending order from the mounting position A1 to the mounting position H6. is assigned.

In FIG. 7, when the "back" button 65 is operated, the screen changes to the previous experimental condition input screen 57. For example, if the expected experiment time displayed in the "expected experiment time" display frame 62 exceeds the allowable time, the screen returns to the experiment condition input screen 57 and the experiment conditions are reviewed. When the "Next" button 66 is operated, the experimental process conditions are determined, and the experimental production data creation section 26 creates experimental production data 24d based on the determined process conditions and mounting position. The information is stored in the on-board storage unit 24.

In FIG. 3, on the board B on which the electronic component mounting device M1 has mounted the electronic component D in the second mode based on the experimental production data 24d, the mounting state of the electronic component D is evaluated by the mounting evaluation device M2. The evaluation result acquisition unit 28 causes the touch panel 21 to display an evaluation result input screen for acquiring the evaluation result 24f of the electronic component D mounted on the board B in the second mode.

Here, with reference to FIG. 8, acquisition of the evaluation result 24f by the evaluation result acquisition unit 28 will be described. The evaluation result input screen 67 displays an “evaluation result” input frame 68, an “export” button 69, a “read” button 70, a “back” button 71, and a “next” button 72. The "evaluation result" input frame 68 displays a plurality of input fields for inputting condition numbers and evaluation results for each mounting position. The mounting position and condition number correspond to the "mounting position" display frame 64 and the "experimental condition" display frame 63 on the experimental production data confirmation screen 61. The evaluation results include the shear strength, bump height, transfer area, bump resistance value, etc. evaluated by the mounting evaluation device M2.

When the "export" button 69 is operated, the evaluation result input sheet creation section 29 creates an evaluation result input sheet for inputting the evaluation results displayed in the "evaluation result" input frame 68. The evaluation result input sheet is created, for example, in a csv format in which fields for inputting evaluation results are separated by commas. The operator in charge of the evaluation inputs the evaluation results by the on-board evaluation device M2 or the like into the evaluation result input sheet using a laptop computer or the like. Alternatively, the on-board evaluation device M2 records the evaluation results on the evaluation result input sheet. When the "read" button 70 is operated, a screen for selecting an evaluation result input sheet into which evaluation results have been input is displayed. When the evaluation result input sheet is selected, the evaluation result is input into the input field of the "evaluation result" input frame 68.

In FIG. 8, the evaluation results can be input into the "evaluation result" input frame 68 by selecting an already input evaluation result input sheet by operating the "load" button 70, or by inputting the evaluation results into the "evaluation result" input frame 68 by the operator. You can also enter numerical values directly into the fields. Furthermore, when the on-board evaluation device M2 records the evaluation results on the evaluation result input sheet, the evaluation result acquisition unit 39 directly obtains the evaluation results from the on-board evaluation device M2 via the communication network 2.

In addition, when the mounted evaluation device M2 records the image of the bump trace on the electrode of the substrate B by the camera as the evaluation result, the evaluation result acquisition unit 39 performs image recognition of the image taken by the camera to calculate the transfer area and the like. The mounting accuracy is calculated and the calculation result is input into the input field of the “evaluation result” input frame 68. Since the evaluation results are input into the "evaluation result" input frame 68 in the order of the mounting position, it is possible to prevent operational errors when inputting the evaluation results by the mounting evaluation device M2 or the like.

In FIG. 8, when the "back" button 71 is operated, the screen changes to the previous screen. When the "Next" button 72 is operated, the evaluation result 24f is stored in the mounting storage section 24, and the production data creation section 41 creates production data 24a based on the evaluation result 24f. The production data creation unit 41 executes statistical processing such as response surface method based on the acquired evaluation results 24f to determine optimal process conditions for mass production, and creates production data 24a based on the determined process conditions. The created production data 24a is stored in the mounting storage section 24.

In this way, the electronic component mounting apparatus M1 includes the evaluation result acquisition unit 28 that acquires the evaluation result 24f of the electronic component D mounted on the board B in the second mode according to the mounting position, and the evaluation result 24f that is acquired. The production data creation section 30 creates production data 24a based on the above. Thereby, it is possible to prevent errors in inputting the evaluation results 24f and easily create the production data 24a.

In FIG. 3, the measurement result display processing unit 31 displays the experimental process conditions and the measurement unit on the touch panel 21 (display unit) based on the experimental production data 24d and measurement results 24e stored in the on-board storage unit 24. A measurement result display screen 73 that displays the measured actual values is displayed. In FIG. 9, the measurement result display screen 73 includes an "experiment condition" selection button 74, a "first measurement result" display frame 75, a "second measurement result" display frame 76, a "back" button 77, and a "next" button. A button 78 is displayed. When the "experimental conditions" selection button 74 is operated, the measurement results 24e displayed in the "first measurement result" display frame 75 and the "second measurement result" display frame 76 are changed.

The “first measurement result” display frame 75 and the “second measurement result” display frame 76 display, for each condition number, the measured item, the condition value set in the experimental production data 24d, and the measurement value for each repetition. is displayed. Here, the stage temperature measured by the stage thermometer 12a and the measured value of the load measured by the pressure sensor 19a are displayed. In this way, by displaying the measurement result 24e and condition values in a list, the operator can easily determine whether the measurement result 24e is normal or not. When the "back" button 77 is operated, the screen changes to the previous screen, and when the "next" button 78 is operated, the screen changes to the next screen.

As explained above, the electronic component mounting apparatus M1 of the present embodiment has a storage section (mounting storage section 24), an experimental production data creation unit 26 that creates experimental production data 24d based on the information stored in the storage unit, and an electronic component on the board B (workpiece) based on the created experimental production data 24d. A component mounting section 22 on which D is mounted is provided. This makes it possible to prevent human errors when an operator inputs the experimental production data 24d into the electronic component mounting device M1, and to easily create experimental production data 24d that corresponds to multiple process conditions. .

Further, the electronic component mounting apparatus M1 of the present embodiment includes production data 24a used to produce the board B (workpiece) on which the electronic component D is mounted, and an experiment used in an experiment to obtain the production data 24a. a first mode in which the electronic component D is mounted on the board B under predetermined process conditions based on the production data 24a; A second mode in which the electronic component D is mounted on the substrate B while changing process conditions based on the process conditions; and a component mounting section 22 in which the electronic component D is mounted on the substrate B in either of the following modes. Thereby, experiments for creating the production data 24a can be efficiently carried out.

Next, with reference to FIG. 4, the configuration of the information processing system of the management computer 3 will be described. Here, among the functions of the management computer 3, the function of creating experimental production data and mass production production data will be described. An input section 33, a management display section 34, and a management communication section 35 are connected to a management processing device 32 included in the management computer 3.

The input unit 33 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The management display section 34 is a display device such as a liquid crystal panel, and in addition to displaying various data, it also displays an operation screen for operations by the input section 33, a data input screen, etc. on the display screen. The management communication unit 35 transmits and receives data to and from the electronic component mounting apparatus M1 and the mounting evaluation apparatus M2 via the communication network 2.

In FIG. 4, the management processing device 32 includes a management storage section 36, an experimental production data creation section 37, an experiment simulation section 38, an evaluation result acquisition section 39, an evaluation result input sheet creation section 40, a production data creation section 41, and a measurement result A display processing section 42 is provided. The management storage unit 36 is a storage device, and stores production data 36a, experiment information 36b, device information 36c, experimental production data 36d, evaluation results 36e, and the like. Production data 36a, experimental information 36b, equipment information 36c, experimental production data 36d, and evaluation results 36e are the production data 24a, experimental information 24b, equipment information 24c, experimental production data 24d, and This is the same as the evaluation result 24f, and detailed explanation will be omitted.

The experimental production data creation section 37, the experiment simulation section 38, the evaluation result acquisition section 39, the evaluation result input sheet creation section 40, the production data creation section 41, and the measurement result display processing section 42 generate experimental production data included in the control device 7. It is the same as the creation section 26, the experiment simulation section 27, the evaluation result acquisition section 28, the evaluation result input sheet creation section 29, the production data creation section 30, and the measurement result display processing section 31, and detailed explanation will be omitted. The experimental production data 36d created by the experimental production data creation section 37 is transmitted to the electronic component mounting apparatus M1 via the management communication section 35 (transmission section).

In this way, the management computer 3 has a storage unit (management storage unit 36) that stores at least the experimental information 36b that constitutes the experimental production data 36d used in the experiment to obtain the production data 36a, and An experimental production data creation section 37 that creates experimental production data 36d based on the information obtained, and a transmission section (management communication section 35) that transmits the created experimental production data 36d to the electronic component mounting apparatus M1. It is a production data creation system equipped with Thereby, experimental production data 36d corresponding to a plurality of process conditions can be easily created.

The management computer 3 also includes a storage unit (management storage unit 36) that stores at least the experimental information 36b constituting the experimental production data 36d, and creates experimental production data 36d based on the information stored in the storage unit. The experimental production data creation unit 37 and the electronic component mounting device M1 change the conditions based on the experimental production data 36d to obtain the evaluation result 36e of the electronic component D mounted on the board B (workpiece) on which the electronic component D is mounted. This production data creation system includes a production data creation unit 41 that creates production data 36a for electronic component mounting apparatus M1 to mount electronic components D on board B under predetermined conditions. Thereby, it is possible to efficiently conduct an experiment for creating the production data 36a and easily create the production data 36a.

In addition, the experimental production data 36d includes information that associates a plurality of process conditions for mounting the electronic component D on the board B (workpiece) and a mounting position for mounting the electronic component D on the board B under those conditions. ing. Then, the production data creation system (management computer 3) records the evaluation result 36e of the electronic component D mounted on the board B based on the experimental production data 36d, based on the information relating the process conditions and the mounting position. An evaluation result input data creation unit (evaluation result input sheet creation unit 40) that creates evaluation result input data (evaluation result input sheet) for The evaluation result acquisition unit 39 is provided. This makes it easy to obtain the evaluation result 36e.

Next, an electronic component mounting method in the electronic component mounting apparatus M1 will be described along the flow shown in FIG. When mounting a new electronic component D on a new board B in the electronic component mounting apparatus M1, production data 24a is created based on the optimal process conditions calculated through experiments, and electronic component mounting is performed based on the created production data 24a. Part D is mounted on board B.

First, the operator uses the basic information input screen 50 (see FIG. 5) displayed on the touch panel 21 to enter the type of board B (board name), mounting method (ultrasonic crimping), number of repetitions, and process conditions. Basic information such as the method of allocation to positions (in order of condition number) is input (ST1). Next, the operator uses the experimental condition input screen 57 (see FIG. 6) displayed on the touch panel 21 to enter experimental conditions such as experimental factors, the number of levels, and the range of values that the experimental factors can take (maximum value, minimum value). is input (ST2). Next, the experimental production data creation section 26 creates experimental production data 24d based on the input experimental conditions and the like. Next, the second mode processing unit 25b mounts the electronic component D on the substrate B while changing the process conditions in the second mode (ST4).

In FIG. 10, the operator then evaluates the mounting state of the electronic component D using the mounting evaluation device M2 (ST5). Next, the evaluation result acquisition unit 28 acquires the evaluation result 24f by the on-board evaluation device M2 (ST6). Next, the production data creation unit 30 creates production data 24a based on the evaluation result 24f (ST7). When the production data 24a is created, the first mode processing unit 25a mounts the electronic component D on the substrate B in the first mode under the process conditions for mass production (ST8). Thereby, the experimental production data 24d corresponding to a plurality of process conditions can be easily created, and an experiment for creating the production data 24a can be efficiently carried out.

The above description describes the creation of experimental production data and production data for the electronic component mounting device M1 that mounts an electronic component D such as a semiconductor chip on the substrate B, which is a workpiece. The electronic component D is not limited to an unpackaged semiconductor chip. For example, the electronic component D may be a packaged LSI. Further, the target for mounting the electronic component D is not limited to the board B. For example, electronic component mounting may be performed in which another electronic component D is mounted on the top surface of the electronic component D (work).

INDUSTRIAL APPLICABILITY The electronic component mounting apparatus and production data creation system of the present invention have the effect of being able to efficiently conduct experiments for creating production data, and are useful in the field of mounting electronic components on boards.

3 Management computer (production data creation system)
12a Stage thermometer (measuring part)
18a Tool thermometer (measuring part)
19a Pressure sensor (measurement part)
21 Touch panel (display section)
B Substrate (work)
D Electronic component M1 Electronic component mounting device

Claims (11)

An electronic component mounting device that mounts electronic components on a workpiece based on production data,
a storage unit that stores at least production data used to produce the workpiece on which the electronic component is mounted, and experimental production data used in an experiment to obtain the production data;
a first mode in which the electronic component is mounted on the workpiece under predetermined conditions based on the production data; and a second mode in which the electronic component is mounted on the workpiece while changing conditions based on the experimental production data. An electronic component mounting device comprising: a component mounting section that mounts the electronic component on the workpiece. The experimental production data includes information associating a plurality of conditions for mounting the electronic component on the workpiece and a mounting position for mounting the electronic component on the workpiece under the conditions,
The electronic component mounting apparatus according to claim 1, wherein in the second mode, the component mounting section mounts the electronic component at the mounting position of the workpiece specified by the experimental production data under the specified conditions. . a measurement unit that measures actual values of conditions set based on the experimental production data;
comprising a display section;
The storage unit stores measurement results measured by the measurement unit when the component mounting unit mounts the electronic component on the workpiece,
The electronic component mounting apparatus according to claim 1 or 2, wherein the display section displays the set conditions and the measured actual values based on the experimental production data and the measurement results. The electronic component mounting apparatus according to any one of claims 1 to 3, further comprising an experimental production data creation section that creates the experimental production data based on experimental information constituting the experimental production data. The experimental information includes an experimental factor that influences the evaluation result of the electronic component mounted on the workpiece, a range of values that the experimental factor can take, and the number of levels that the experimental factor can select from the range. The electronic component mounting apparatus according to claim 4, comprising: . The electronic component mounting device according to claim 5 , wherein the experimental production data creation unit creates the experimental production data by selecting the experimental factors according to device information of the electronic component mounting device. The electronic component mounting according to any one of claims 1 to 6, further comprising a production data creation unit that creates the production data based on the evaluation result of the electronic component mounted on the workpiece in the second mode. Device. The experimental production data includes information associating a plurality of conditions for mounting the electronic component on the workpiece and a mounting position for mounting the electronic component on the workpiece under the conditions,
an evaluation result acquisition unit that acquires an evaluation result of the electronic component mounted on the workpiece in the second mode according to the mounting position;
The electronic component mounting apparatus according to any one of claims 1 to 6, further comprising a production data creation unit that creates the production data based on the acquired evaluation results. A production data creation system that creates production data used in an electronic component mounting device that mounts electronic components on a workpiece based on production data, the system comprising:
a storage unit that stores at least experimental information constituting experimental production data used in an experiment to obtain the production data;
an experimental production data creation unit that creates the experimental production data based on the information stored in the storage unit;
The electronic component mounting device changes the conditions based on the experimental production data, and based on the evaluation results of the electronic component mounted on the workpiece on which the electronic component is mounted, the electronic component mounting device changes the conditions under predetermined conditions. A production data creation system, comprising: a production data creation unit that creates production data for mounting the electronic component on a workpiece. The experimental production data includes information associating a plurality of conditions for mounting the electronic component on the workpiece and a mounting position for mounting the electronic component on the workpiece under the conditions,
10. Production data creation according to claim 9, further comprising: an evaluation result acquisition unit that acquires evaluation results of the electronic component mounted on the workpiece based on the experimental production data in accordance with the mounting position. system. The experimental production data includes information associating a plurality of conditions for mounting the electronic component on the workpiece and a mounting position for mounting the electronic component on the workpiece under the conditions,
evaluation results for creating evaluation result input data for recording evaluation results of the electronic components mounted on the workpiece based on the experimental production data, based on information relating the conditions and the mounting positions; an input data creation section;
The production data creation system according to claim 9, further comprising: an evaluation result acquisition unit that acquires the evaluation results created in accordance with the evaluation result input data.

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