JP6880158B1 - Work transfer device, work transfer method, transfer body manufacturing method, semiconductor device manufacturing method, and die bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To confirm the quality of a produced (manufactured) product, and if the quality cannot be confirmed, it is not possible to shift to the main production and mass production of defective products can be prevented. , A method for manufacturing a semiconductor device, a method for transferring a workpiece, and a die bonder. SOLUTION: This work transfer device transfers this work by the operation of a tool for holding the work. Temporary production in which the tool operation means for operating the tool by detecting the event that causes the product defect and the detection means for detecting the event is set to the temporary production operation mode. The command means, the inspection means that inspects the product during or after the operation of the temporary production operation mode, and the production command means that sets the tool operation means that operates the tool based on the result of the inspection means as the production operation mode. Be prepared. [Selection diagram] Fig. 1

Description

The present invention relates to a work transfer device, a work transfer method, a transfer body manufacturing method, a semiconductor device manufacturing method, and a die bonder.

When manufacturing a semiconductor device, die bonding is performed in which a semiconductor chip is mounted on a lead frame as a member to be mounted. For this die bonding, a die bonder provided with a collet for adsorbing chips is used (Patent Document 1).

As shown in FIG. 6, such a die bonder includes a supply unit 2 in which a semiconductor chip 1 to be picked up is arranged, a bonding arm 10 having a collet 3 for sucking the semiconductor chip 1 of the supply unit 2, and a supply unit. A recognition camera 6 for observing the semiconductor chip 1 of 2 and a recognition camera 12 for observing the island portion 5 of the lead frame 4 at the bonding position are provided.

The supply unit 2 includes a semiconductor wafer 8 mounted and supported on the wafer support device 7. The semiconductor wafer 8 is divided into a large number of semiconductor chips 1. Further, the collet 3 is connected to the collet holder 9, and the collet 3 and the collet holder 9 or the like form a bonding arm 10. The bonding arm 10 can be moved between the pickup position and the bonding position via the transport means 11. The transport means 11 can drive the bonding arm 10 in the X, Y, θ and Z directions.

Further, in the collet 3, the tip 1 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 3, and the tip 1 is sucked on the lower end surface of the collet 3. If this vacuum suction (evacuation) is released, the tip 1 will come off from the collet 3.

Next, a die bonding method using the die bonder device shown in FIG. 2 will be described. First, the recognition camera 6 arranged above the supply unit 2 observes the chip 1 to be picked up, positions the collet 3 above the chip 1 to be picked up, and picks up the chip 1.

Further, the recognition camera 12 arranged above the bonding position observes the island portion 5 of the lead frame 4 to be bonded, moves the collet 3 onto the island portion 5, and moves the collet 3 onto the island portion 5. Supply chip 1.

That is, the chip 1 positioned based on the observation of the recognition camera 6 is picked up by the collet 3 of the bonding arm 10, and the island portion 5 of the lead frame (board) 4 conveyed to the lower part of the island recognition camera 12 is picked up. , The camera 12 recognizes and measures the position. Then, feedback control is performed to drive the bonding arm 10, and the chip 1 is mounted on the island portion 5 at the measured position. Therefore, the collet 3 moves as shown by the arrow A shown in FIG.

Japanese Unexamined Patent Publication No. 2008-124382

In the above-mentioned die bonder, product defects (cracks, etc.) may occur due to an operator setup error. In such a case, the operator can confirm the setup method and procedure by providing a mechanism capable of performing the procedure (setup procedure) and confirmation (setup confirmation). However, it is necessary to confirm that there is no problem in the quality of the finally produced product (for example, a semiconductor device).

Conventionally, product quality confirmation (appearance observation, etc.) is generally performed. However, regardless of whether or not such quality confirmation is performed, it is possible to produce (manufacture) a product with a die bonder.

Further, if there is no problem in production, the confirmation work for the product is a wasteful work, and the manufacturing process time becomes long. Furthermore, even when confirmation work is required, it is difficult to confirm that the quality has been actually confirmed.

In view of the above problems, the present invention can confirm the quality of the produced (manufactured) product, and if the quality cannot be confirmed, the work cannot be transferred to the main production and the mass production of defective products can be prevented. Provided are an apparatus, a method for manufacturing a transfer body, a method for manufacturing a semiconductor apparatus, a work transfer method, and a die bonder.

The work transfer device of the present invention is a work transfer device that transfers this work by the operation of a tool that holds the work, and the tool can be replaced to detect an event that causes a product defect. detecting means for, said by having detected an event at sensing means, the temporary production command unit for the tool operating means for operating said tool and temporary production operation mode, product the following operation during or operation of the temporary production operation mode and inspecting means for inspecting, based on the result of the inspection unit, the tool operating means for operating said tool is obtained a present production command unit to the production operation mode.

According to the work transfer device of the present invention, if there is an event caused by the exchange of a tool for holding the work (for example, a suction collet), the event can be detected by the detecting means. Here, the event is a process that may deteriorate the quality of the product (work transfer body) assembled by this device. Then, when the detection means detects the event, the temporary production command means instructs the tool operation means to set the temporary production operation mode. Here, the temporary production operation mode is not the main production operation mode of the actual production, but the so-called trial production, and the product produced by this is not a quality-confirmed product.

Then, the product can be inspected by the inspection means during or after the operation of the temporary production operation mode. Based on the result of this product inspection, the tool operation means can be switched to the production operation mode. Therefore, if the result of the product inspection is within the permissible range for the product, the production operation mode can be switched, and if the result of the product inspection is within the permissible range for the product, the switch to the main production operation mode can be prevented. That is, in this production operation mode, a product having a quality problem is not produced. Here, the inspection includes a visual inspection of discoloration, stains, cracks, misalignment (including misalignment) of the product, an electrical characteristic inspection, and the like.

It is preferable to provide an inspection result notification means for notifying the user of the inspection result of the inspection means, or a user confirmation detection means for detecting the user confirmation of the inspection result notified by the inspection result notification means. With the one equipped with the inspection result notification means, the user can grasp the inspection result, and with the one equipped with the user confirmation detection means, the device side grasps the inspection result, and there is a problem in product production. Regardless, it is possible to effectively prevent entering the main production operation mode, or conversely, not entering the main production operation mode even though there is no problem in the production of the product.

The events detected by the detection means include at least the exchange of the tool , the exchange of the work, the change of the operation parameters of the tool operation means , the request from the host computer, and the predetermined specific conditions. At least one of these can be set to be selected. That is, if such an event occurs, it may cause a product defect and cause a problem in the produced product. Here, the exchange of varieties is, for example, the exchange of a chip adsorbed on an adsorption collet as a tool, a substrate on which this chip is transferred, an adhesive interposed between an island portion of the substrate and the chip, and the like. is there.

Between the provisional production operation mode by the provisional production command means and the user confirmation by the user confirmation detection means, a restriction giving means for limiting the operation of the tool by the tool operation means may be provided. .. Restrictions given by the limiting means include prohibiting restarting, producing only a certain number of products that can be produced, slowing down the production speed, setting a warning state, and restricting operations. The operation restrictions include, for example, limiting or prohibiting the range of parameter changes, reducing the items that the operator can operate, changing (restricting) the user's authority, not discharging the product, and the state of the device. There are things such as not letting you change.

The inspection means can be made to be a visual inspection. The visual inspection can be performed by image processing using an observation camera (for example, a CCD camera, a CMOS camera, or the like).

The user confirmation detection means may be provided with a display unit on which the inspection result is displayed. In the case of the one provided with such a display unit, the inspection result is displayed on the display unit, so that the user can easily confirm the inspection result.

The method for manufacturing a transfer body of the present invention is a method for manufacturing a transfer body in which a work is transferred to a supplied member, and the work is transferred to the supplied member by using the work transfer device. is there.

According to the method for manufacturing a transfer product of the present invention, a product whose quality has not been confirmed is not regarded as a product whose quality has been confirmed, and it is possible to effectively prevent some products having inferior quality from being inferior in quality, and a high quality product (workpiece). (Transferred body) can be provided stably.

The method for manufacturing a transfer body of the present invention is a method for manufacturing a transfer body that transfers this work by the operation of a tool that holds the work to manufacture the transfer body, and detects an event that causes a product defect. A process, a temporary production process in which the tool is operated as a temporary production operation mode by detecting an event in the detection process, an inspection process in which a product is inspected during or after the operation of the temporary production operation mode, and the above. Based on the result of the inspection process, the tool is provided with the main production process for operating the tool as the main production operation mode.

According to the method for manufacturing a transfer body of the present invention, if there is an event caused by the exchange of a tool for holding the work (for example, a suction collet), the event can be detected. If this event is detected, the temporary production process, which is the temporary production operation mode, is performed. The product produced in this way is not a quality-confirmed product. Further, in this production operation mode, a product having a quality problem is not produced.

It may be provided with a verification step which is a re-inspection of the inspection by the inspection step. As described above, in the case of the one provided with the verification process, the inspection accuracy can be improved and the productivity can be improved.

The inspection result by the inspection by the inspection step may be displayed on the display unit, and this display unit may display the result input unit for inputting the result of the verification information of the product after the verification is executed. With this configuration, the result of the verification information of the product after the verification is executed is input to the result input unit, and the data can be accumulated.

In addition, information on products that require verification is organized by the data organization department, and the data organization department ranks products that require verification based on additional information, and based on the ranked information, the data organization department ranks the products that require verification. It can be configured to determine the display order of the products to be displayed on the display unit on which the inspection result is displayed.

In the method for manufacturing a semiconductor manufacturing apparatus of the present invention, the transferred body is a semiconductor device in the method for manufacturing a transferred body. Here, the semiconductor device refers to all devices that function by utilizing semiconductor characteristics, and an electro-optical device, a semiconductor circuit, and an electronic device are semiconductor devices.

The die bonder of the present invention is a die bonder that picks up a work at a pickup position, conveys the picked up work to a bonding position, and bonds chips at the bonding position, and is a die bonder provided with the work transfer device. Is. When manufacturing a semiconductor device using such a die bonder, it is possible to efficiently produce a high-quality semiconductor device.

INDUSTRIAL APPLICABILITY According to the present invention, mass production of problematic products (defective products) can be prevented, and high-quality products can be efficiently produced.

It is a simplified block diagram of the work transfer apparatus of this invention. It is a simplified drawing of the die bonder (bonding apparatus) using the work transfer apparatus of this invention. It is a simplified drawing of a wafer. It is a simplified process diagram of the work transfer method of this invention. It is a flowchart which shows the process of the work transfer method of this invention. It is a simplified perspective view of a conventional die bonder.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 5.

FIG. 1 shows a simplified block diagram of a work transfer device according to the present invention, and FIG. 2 shows a die bonder (bonding device) using this work transfer device. As shown in FIG. 2, the bonding apparatus picks up the chip 19 as a workpiece cut out from the wafer by the collet (adsorption collet) 13 at the pickup position P and transfers it to the bonding position Q of the substrate 44 such as the lead frame ( It is to be installed). As shown in FIG. 3, the wafer 16 is adhered on a wafer sheet (adhesive sheet 15) stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 19 by a dicing process. ).

As shown in FIG. 1, the work transfer device according to the present invention includes a detecting means 20 for detecting an event causing a product defect and a tool for operating the tool 50 by detecting the event with the detecting means 20. The tool 50 is operated based on the results of the temporary production command means 22 in which the operation means 21 is set as the temporary production operation mode, the inspection means 23 that inspects the product during or after the operation of the temporary production operation mode, and the inspection means 23. The present production command means 24 which sets the tool operation means 21 as the present production operation mode is provided.

The tool operating means 21 is a bonding arm in which the suction collet 13 as the tool 50 is detachably attached to a collet holder provided at the tip thereof, and the bonding arm is driven in the X, Y, Z and θ directions. It is equipped with a drive mechanism that can be used. In this case, the drive mechanism can be configured by a robot arm mechanism, an XYZ θ-axis stage, or the like. Further, in the collet 13, the tip 19 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 13, and the tip 19 is sucked on the lower end surface of the collet 13. When this vacuum suction (evacuation) is released, the tip 19 comes off from the collet 13. A vacuum generator such as a vacuum pump or an ejector is used to evacuate the suction collet 13.

The collet 13 as the tool 50 uses the tool operating means 21 to ascend in the arrow A direction and descend in the arrow B direction on the pickup position P, ascend in the arrow C direction on the bonding position Q, and ascend in the arrow D direction. It is possible to descend and reciprocate in the directions of arrows E and F between the pickup position P and the bonding position Q. The tool operating means 21 controls the movement of the arrows A, B, C, D, E, and F by the control means 25. The control means 25 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data executed by the CPU.

By the way, as the pickup of the chip 19 at the pickup position P, a pickup device having a push-up tool (push-up pin) is usually used. That is, the pickup device includes a pickup stage (push-up stage) on which a sheet (adhesive sheet) is placed, and a push-up pin is arranged on the pickup stage.

Further, the suction collet 13 is detachably attached to the collet holder via a chuck mechanism, and therefore, it is necessary to replace the suction collet 13 in order to correspond to the chips to be sucked as the collet 13. .. Therefore, the detection means 20 detects an event that causes a product defect. Here, the events include at least the exchange of the tool 50, the exchange of the product type, the change of the device operation parameters, the request from the host computer (external), the specific conditions set in advance, and the like. Here, the exchange of the product type is the exchange of the chip adsorbed on the adsorption collet, the substrate on which the chip is transferred, the adhesive interposed between the island portion of the substrate and the chip, and the like.

Replacement of the tool 50 includes replacement of the suction collet 13 itself, replacement of the push-up tool, replacement of the push-up stage, replacement of the stage on the bonding position Q side (transfer side stage), and the like. By the way, a pickup device for peeling a chip from a sheet and picking up the chip is provided with a movable stage portion provided so as to be slidable, and the chip is peeled off by sliding the movable stage. Therefore, the replacement of the tool 50 includes the replacement of the movable stage, the replacement of the fixed stage that holds the movable stage in a slidable manner, and the like. Further, the work is replaced by a chip replacement (wafer replacement), a ring (wafer ring) replacement, a wafer sheet (adhesive sheet) replacement, and the like. The operating parameters can be changed by the device operating speed, position (pickup position or bonding position), holding time (work adsorption time), heating time (heating time at the time of bonding), and the like.

Specific conditions set in advance are changes in the environment such as immediately after the device is started, immediately after the device is stopped for a certain period of time and restarted, immediately after an error occurs, every fixed time, every constant production, and temperature.

Therefore, as the detection means 20, various means corresponding to each event to be detected can be used. Therefore, a sensor that detects the presence or absence of an object, a sensor that detects position, displacement, or dimension, a sensor that detects pressure, stress, strain, torque, or weight, a sensor that detects angle, and a sensor that detects speed or rotation speed. Various sensors such as a sensor, a sensor that detects acceleration and vibration, a sensor that detects temperature, a sensor that detects magnetism, and a sensor that detects light can be used. In addition, changes in set parameters can be detected via software and hardware.

Further, the inspection of the inspection means 23 includes a visual inspection and an electrical characteristic inspection of discoloration, stains, cracks, and misalignment (including misalignment) of the product. The visual inspection can be performed by image processing using an observation camera (for example, a CCD camera or a CMOS camera). The electrical characteristics include an energization test, a resistance measurement, a light emission amount measurement, a logic test, a memory test, an analog test, and the like, and when performing such an electrical characteristic inspection, an electrical characteristic inspection device is used. Further, this transfer device includes an inspection result notification means 26 for notifying the user of the inspection result of the inspection means 23 and a user confirmation detection means 27 for detecting the user confirmation of the inspection result notified by the inspection result notification means 26. ..

The inspection result notification means 26 can be configured by having a display device (monitor, touch panel) arranged on or outside the device, and further, a smart phone or tablet that can be carried by the user (smartphone or tablet). It may be a tablet PC) or the like. Here, the tablet is a plate-shaped / thin computer or peripheral device, and can be operated on the panel by using a fingertip or a dedicated pen. As described above, the inspection result notification means 26 has a display unit on which the inspection result is displayed.

The user confirmation detection means 27 indicates a specific position of the display unit of the inspection result notification means 26, and the specific position can be specified by a touch pen, a keyboard, a mouse, or the like. That is, the control means is that the user confirms the inspection result by touching a specific position on the screen (for example, the part where the inspection result is displayed) with a touch pen or the like, inputting with the keyboard, inputting with the switch, or the like. It is input to 25.

Further, this device includes a limiting means 30 that limits the operation of the tool by the tool operating means 21 between the temporary production operation mode by the temporary production command means 22 and the user confirmation by the user confirmation detecting means 27. Here, as the restriction imparting by the restriction granting means 30, there are the prohibition of restarting, the production of only a certain number that can be produced, the slowing down of the production speed, the warning state, and the restriction of the operation. In addition, as restrictions, for example, the range of parameter changes is limited or prohibited, the items that can be operated by the operator are reduced, the user's authority is changed (restricted), the product is not discharged, and the state of the device is not changed. And so on.

Further, this apparatus includes an additional information storage means 31 and a data organizing unit 32 used when performing a verification step (re-inspection step) described later. The additional information storage means 31 stores additional information necessary for verification. The data organizing unit 32 organizes the work information necessary for verification. Here, the additional information is, for example, any one of wafer information, die bonder information, inspection state information of the inspection mechanism, inspection result information by the inspection mechanism, and die information other than the inspection by the inspection mechanism.

By the way, the provisional production command means 22, the main production command means 24, the restriction giving means 30, and the data organizing unit 32 can be configured by the control means 25, and all or arbitrary means of each of the means 22, 24, 30, 32 can be used. It can be configured by another microcomputer different from the control means 25. The storage device as the additional information storage means 31 includes an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), and the like. Consists of. The ROM stores programs and data executed by the CPU.

Next, a work transfer method using the work transfer device (a method of transferring the work by the operation of a tool for holding the work) will be described. That is, as shown in FIG. 2, after observing the chip 19 to be picked up by the confirmation camera arranged above the supply unit 18 and positioning the collet 13 above the chip 19 to be picked up, The collet 13 is lowered as shown by the arrow B to pick up the chip 19. After that, the collet 13 is raised as shown by the arrow A.

Next, the island portion of the lead frame 14 to be bonded is observed with a confirmation camera arranged above the bonding position Q, the collet 13 is moved in the direction of arrow E, and the collet 13 is positioned above the island portion. After that, the collet 13 is moved downward as shown by the arrow D to supply the chip 19 to the island portion. After supplying the chips to the island portion, the collet 13 is raised as shown by the arrow C, and then returned to the standby position above the pickup position P as shown by the arrow F. As the confirmation camera arranged above the bonding position Q, the appearance inspection camera of the inspection means 23 may be used, or another camera may be used.

Therefore, the transfer body T (for example, the substrate 44 on which the chip 19 is transferred) can be manufactured. As such, the vertical movement of the suction collet 13 as the tool 50 at the pickup position P, the vertical movement of the suction collet 13 as the tool 50 at the bonding position Q, and the tool 50 between the pickup position P and the bonding position Q. The reciprocating movement of the suction collet 13 is the tool operation.

First, a process that does not include the verification process will be described. Therefore, as a work transfer method, as shown in FIG. 4, a detection step 40 for detecting an event caused by the replacement of the tool and a temporary production operation of the tool by detecting the event in the detection step 40 are performed. Based on the results of the temporary production process 41 that operates as a mode, the inspection process 42 that inspects the product during or after the operation of the temporary production operation mode, and the result of the inspection process 42, the book that operates the tool as the main production operation mode. A plurality of steps with the production step 43 are sequentially performed.

This process will be described with reference to the flowchart shown in FIG. First, it is determined whether or not the event has been detected by the detection means 20 (step S1). If it is detected in step S1, the process proceeds to step S2, and if it is not detected in step S1, the process proceeds to step S3. In step S2, a temporary production operation is performed. It is a so-called trial production, and the product produced by this is not a quality-confirmed product.

In step S3, it is determined whether or not the production operation can be performed. The inspection means 23 can inspect the product during or after the operation of the temporary production operation mode. Based on the result of this product inspection, the tool operation means 21 can be switched to the present production operation mode. Therefore, if the result of the product inspection is within the permissible range for the product, the production operation mode can be switched, and if the result of the product inspection is within the permissible range for the product, the switch to the main production operation mode can be prevented. ..

In this case, the inspection result inspected by the inspection means 20 is notified to the user via the inspection result notification means 26. By this notification, when the user has no problem in production, the user confirmation detection means 27 notifies that there is no problem in the work or the like. Therefore, the temporary production operation mode can be switched to the main production operation mode. Further, when there is a problem in production, the user confirmation detection means 27 notifies the device side that there is a problem. It is not possible to switch from this temporary production operation mode to the main production operation mode. In this case, this work transfer process is completed. If there is a problem in production and the work transfer process is completed, if there is a problem in production, the factor (cause) that causes such a problem is eliminated and the work transfer process is restarted. It will be.

It is determined in step S5 whether to end the main production operation, and if it is completed, the process proceeds to step S6. If the main production operation is not completed in step S5, the process proceeds to step S4 to continue the main production operation.

In step S6, it is determined whether or not to end the work transfer process. If it is determined in step S6 that the work transfer process is to be completed, the process is terminated, and if it is determined not to be completed, the process returns to step S1.

According to the work transfer device of the present invention, if there is an event caused by the replacement of the tool T (for example, the suction collet 13) that holds the work, the event can be detected by the detecting means 20. Here, the event is a process that may deteriorate the quality of the product (work transfer body) assembled by this device. Then, when the detection means 20 detects the event, the temporary production command means 22 instructs the tool operation means 21 to set the temporary production operation mode. Here, the temporary production operation mode is not the main production operation mode of the actual production, but the so-called trial production, and the product produced by this is not a quality-confirmed product. Therefore, the operator or the like of this device can prevent the shipment (product provision) of the product whose quality has not been confirmed. Therefore, it is possible to stably provide a high-quality product (work transfer body) without shipping a product having inferior quality.

The inspection means 20 can inspect the product during or after the operation of the temporary production operation mode. Based on the result of this product inspection, the tool operation means 21 can be switched to the present production operation mode. Therefore, if the result of the product inspection is within the permissible range for the product, the production operation mode can be switched, and if the result of the product inspection is within the permissible range for the product, the switch to the main production operation mode can be prevented. That is, in this production operation mode, a product having a quality problem is not produced.

Therefore, the present invention can prevent mass production of problematic products (defective products), and can efficiently produce high-quality products. Further, using this work transfer device, a transfer body T in which the chip 19 is placed on a supplied member (for example, an island portion of a substrate such as a lead frame) as a work is stably produced (manufactured). be able to.

By providing the inspection result notification means 26 for notifying the user of the inspection result of the inspection means 20, the user can grasp the inspection result, and by providing the user confirmation detection means 27, the production of the product It is possible to effectively prevent entering the main production operation mode even though there is a problem with the product, or conversely, not entering the main production operation mode even though there is no problem in the production of the product. it can.

Between the temporary production operation mode by the temporary production command means 22 and the user confirmation by the user confirmation detection means 27, the restriction giving means 30 for giving a limit to the operation of the tool by the tool operation means 21 may be provided. .. Restriction granting by the restriction granting means 30 includes prohibiting restarting, producing only a certain number that can be produced, slowing down the production speed, setting a warning state, and restricting the operation. The operation restrictions include, for example, limiting or prohibiting the range of parameter changes, reducing the items that the operator can operate, changing (restricting) the user's authority, not discharging the product, and the state of the device. There are things such as not letting you change. By imposing restrictions in this way, the production of defective products can be reduced.

The user confirmation detection means 27 may be provided with a display unit on which the inspection result is displayed. In the case of the one provided with such a display unit, the inspection result is displayed on the display unit, so that the user can easily confirm the inspection result.

In the method for manufacturing a semiconductor manufacturing device of the present invention, the transfer body T is a semiconductor device in the method for manufacturing a transfer body. Here, the semiconductor device refers to all devices that function by utilizing semiconductor characteristics, and an electro-optical device, a semiconductor circuit, and an electronic device are semiconductor devices. Therefore, in the manufacturing method of the semiconductor manufacturing apparatus of the present invention, mass production of the problematic semiconductor manufacturing apparatus can be prevented, and high quality semiconductor manufacturing apparatus can be efficiently produced.

Next, a case will be described in which a verification step of performing verification, which is a re-inspection by inspection by inspection step 42, is provided. That is, even if there is no problem (passed product) inspected by the inspection means 23, there is actually a problem if it is not a passed product, or conversely, there is a problem (non-passed product) inspected by the inspection means. Even if it is a passing product), it may actually be a passing product without any problem. This verification step is also performed during or after the operation of the temporary production operation mode.

The verification (re-inspection) may be performed by image processing using an observation camera (for example, a CCD camera or a CMOS camera), or may be an inspection by the operator's visual inspection. As described above, in the case of the one provided with the verification process, the inspection accuracy can be improved and the productivity can be improved.

The inspection result by the inspection by the inspection step 42 may be displayed on the display unit, and this display unit may display the result input unit for inputting the result of the verification information of the product after the verification is executed. With this configuration, the result of the verification information of the product after the verification is executed is input to the result input unit, and the data can be accumulated. Here, the verification information includes the verification (re-inspection) judgment result (OK, NG, hold, OK type, NG type), the data used for the judgment, and the result of another inspection inside and outside the process related to the work. Measurement data, etc.

Further, the data organizing unit 32 organizes the information of the products requiring verification, and the data organizing unit 32 ranks the products requiring verification based on the additional information (additional information by the additional information storage means 31). Then, based on the ranked information, it can be configured to determine the display order of the products to be displayed on the display unit on which the inspection result is displayed.

If the first inspection process and the verification process are not visually inspected by the operator, the threshold values that are the criteria for judging good / bad are set to different values even if they are set to be the same in the first inspection process and the verification process. You may.

The die bonder of the present invention is a die bonder that picks up a work at a pickup position P, conveys the picked up work to a bonding position Q, and bonds the work at the bonding position Q, and uses the work transfer device. It was used. When manufacturing a semiconductor device using such a die bonder, it is possible to efficiently produce a high-quality semiconductor device.

The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, the present invention can be used for various devices such as an assembly device, an inspection device, and a processing device other than a bonding device. Further, the supplied member 45 for supplying the chip 19 may be a card such as a credit card, a cash card, an IC card, or a flat plate such as a sheet metal. Therefore, the work to be supplied to the supplied member 45 is not limited to the chip 19, but is a component corresponding to the supplied member 45.

The inspection result notification means 26 may not be displayed on the monitor (screen), but may emit an alarm sound or a warning light from the warning light. Further, although image processing is used as the inspection means in the above-described embodiment, the inspection may be performed visually by the operator. Of course, it may not have a verification process.

19 Work (chip)
20 Detection means 21 Tool operation means 22 Temporary production command means 23 Inspection means 24 Main production command means 26 Inspection result notification means 27 User confirmation Detection means 30 Limitation giving means 40 Detection process 41 Temporary production process 42 Inspection process 43 Main production process 45 Supply member 50 Tool T transfer body

Claims (15)

A work transfer device that transfers this work by the operation of a tool that holds the work.
A detection means that can replace the tool and detects an event that causes a product defect,
By having detected an event by the sensing means, the temporary production command unit for the tool operating means for operating said tool and temporary production operation mode,
An inspection means for inspecting products during or after the operation of the temporary production operation mode, and
Based on the results of the inspection means, the workpiece transfer apparatus is characterized in that a present production command unit for the tool operating means for operating said tool and the production operation mode. The work transfer device according to claim 1, further comprising an inspection result notification means for notifying the user of the inspection result of the inspection means. The work transfer device according to claim 2, further comprising a user confirmation detecting means for detecting a user confirmation of an inspection result notified by the inspection result notification means. The events detected by the detection means include at least the exchange of the tool , the exchange of the work, the change of the operation parameter of the tool operation means , the request from the host computer, and the preset specific conditions. The work transfer device according to any one of claims 1 to 3, wherein at least one of these is selected. Claims wherein between from the preliminary production operation mode by the temporary production command unit until the user confirmation by the user confirmation sensing means, characterized by comprising a restriction applying means for applying a limit to the operation of the tool by the tool operating means Item 3. The work transfer device according to item 3. The work transfer device according to any one of claims 1 to 5, wherein the inspection means is a visual inspection. The user confirmation sensing means, the workpiece transfer apparatus according to any one of claims 3 or claim 5, characterized in that a display unit which test results are displayed. It is a manufacturing method of a transfer body in which a work is transferred to a supplied member to manufacture a transfer body.
A method for manufacturing a transfer body, which comprises transferring a work to a supplied member by using the work transfer device according to any one of claims 1 to 7. The method for manufacturing a semiconductor device according to claim 8, wherein the transfer body is a semiconductor device. It is a method of manufacturing a transfer body that transfers this work by the operation of a tool that holds the work to manufacture the transfer body.
A detection process that detects events that cause product defects,
A temporary production process in which the tool is operated as a temporary production operation mode by detecting an event in the detection process, and a temporary production process.
An inspection process in which a product is inspected during or after the operation of the temporary production operation mode, and
A method for manufacturing a transfer body, which comprises a present production process in which the tool is operated as the present production operation mode based on the result of the inspection step. The method for manufacturing a transferred product according to claim 10, further comprising a verifying step of performing verification which is a re-inspection by the inspection by the inspection step. The eleventh aspect of claim 11, wherein the inspection result by the inspection by the inspection step is displayed on the display unit, and this display unit displays the result input unit for inputting the result of the verification information of the work after the verification execution. Manufacturing method of the transfer body. The data organization department organizes the information of the work that requires verification, and the data organization department ranks the work that requires verification based on the additional information, and the inspection result is based on the ranked information. The method for manufacturing a transfer body according to claim 12 , wherein the display order of the workpieces to be displayed on the displayed display unit is determined. The method for manufacturing a semiconductor device according to any one of claims 10 to 13, wherein the transfer body is a semiconductor device. It is a die bonder that picks up the work at the pickup position, conveys the picked up work to the bonding position, and bonds the work at that bonding position.
A die bonder according to any one of claims 1 to 7, wherein the work transfer device is used.

Images