JP2003110208A - Substrate, mechanism for overlaying substrate, and method of overlaying substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently conduct position alignment for bonding two substrates in manufacturing a liquid-crystal display panel or the like. SOLUTION: On glass substrates 8U, 8D to be overlaid, two pairs of marks on each (8U1, 8U2, and 8D1, 8D2) are formed, wherein marks (8U1, 8U2) on one of the substrates are colored red. When the image patterns of marks (8U2, 8D2) consisting of one for each substrate are overlapped, the lamp is changed over to a red lamp 94b so that the colored (red) background display is obtained. Consequently, only the image patterns of the uncolored marks (8D1, 8D2) are exclusively recognized. By computing difference between the image patterns exclusively recognized and the image patterns in which the marks consisting of one for each substrate are overlapped, the image patterns of the colored side (8U1, 8U2) only are exclusively extracted. Since the mark positions of each substrate are separately extracted in this way, enhancement of the substrate bonding-work efficiency is realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate suitable for superposition and alignment with high accuracy so as to face each other,
The invention also relates to an improvement of a superposition mechanism of the substrates and a superposition method.

[0002]

2. Description of the Related Art A liquid crystal display panel is manufactured in such a manner that two glass substrates are opposed to each other and bonded to each other, and liquid crystal is sealed between the bonded two substrates. In the manufacturing process of such a liquid crystal display panel or the like, the two substrates are superposed on each other through highly accurate alignment or positioning operation based on the alignment (positioning) marks formed on the two glass substrates. Done.

FIG. 7 is a plan view of a conventional substrate and a liquid crystal substrate laminating apparatus which employs a mechanism for superposing the substrates. FIGS. 8A and 8B are respectively shown in FIG. FIG. 3 is an enlarged plan view of a glass substrate, that is, an upper substrate 1U and a lower substrate 1D, which are attached to each other by the device.

As shown in FIG. 7, in the liquid crystal substrate laminating apparatus, first, the upper substrate 1U and the lower substrate 1D are sequentially supplied to a pair of supply mechanisms 2U and 2D which are arranged to face each other.

Between the pair of supply mechanisms 2U and 2D, there is arranged a transfer robot 3 having an arm 3a capable of expanding and contracting in the arrow Y direction shown in the drawing and being movable in the arrow X direction. And the lower substrate 1D is the transfer robot 3
The two laminating devices 4 and 4 arranged adjacent to each other by
Are alternately conveyed and supplied.

The upper substrate 1U and the lower substrate 1D made of glass, which are laminated by the laminating devices 4 and 4, are patterned so that, for example, four liquid crystal panels can be taken out and manufactured, as shown in FIG. , The cross-shaped positioning marks 1U1, 1U2, and 1D1, respectively at two positions on the left and right sides of the center of each substrate (upper substrate 1U and lower substrate 1D).
1D2 is printed so as to form a pair.

On the surface of the lower substrate 1D, the adhesive 5 is applied and drawn in advance along the pattern, and the mark 1U is formed.
1, 1U2, and 1D1, 1D2 after positioning adjustment of the substrate, the upper substrate 1U and the lower substrate 1D via the adhesive 5
Is pasted with.

The upper substrate 1U and the lower substrate 1D which are bonded together
Is transferred to the transfer robot 3 and supplied to the unloading table 6 shown in FIG. 7 so as to be transferred to the next liquid crystal injection step.

The laminating devices 4 and 4 are constructed as shown in the front view of FIG. 9, and first, the upper suction head 41 movable in the vertical (Z-axis) direction moves the upper substrate 1U from the transfer robot 3. First, it receives and holds it by suction, and then the lower suction stage 42 receives and holds the lower substrate 1D from the transfer robot 3 by suction.

Imaging devices 431 and 432 such as CCD cameras are mounted in the suction stage 42, and the upper substrate 1U sucked and held by the suction head 41 descends in the Z direction in the drawing, and is lightly superposed on the lower substrate 1D. Marks 1U1, 1U2, and 1D formed on each glass substrate in the as-deposited state
It is configured to photograph 1, 1D2.

The upper suction head 41 is incorporated in the XY-θ moving table 44, and the XY-θ moving table 44 incorporating the suction head 41 is driven and controlled by the controller 7.

The controller 7 receives the supply of the image pickup patterns of the marks 1U1, 1U2 and 1D1, 1D2 from the image pickup devices 431, 432, and based on this, the upper substrate 1U,
The XY-θ movement table 44 is drive-controlled so that the amount of positional deviation between the lower substrates 1D falls within the allowable range.

FIG. 10A is an image pickup pattern diagram taken in by the image pickup device 431 in a state of being superposed on the proper position.

Two substrates (upper substrate 1U and lower substrate 1D)
In a state in which the marks are properly overlapped, as shown in FIG. 10A, the straight lines Lu and Ld respectively connected between the pair of cross-shaped marks 1U1, 1U2, and 1D1, 1D2 intersect so as to be orthogonal to each other. In addition, the respective intermediate positions Pu and Pd of the marks 1U1 and 1U2 and 1D1 and 1D2 match.
Therefore, for example, the upper substrate 1U is tilted and held by the suction head 41, and as shown in FIG.
When u and Pd are deviated in the XY direction by Δx and Δy, the microcomputer incorporated in the controller 7 causes the imaging devices 431, 4
From the image pickup pattern from 32, the coordinate position of the intermediate position Pu, Pd is calculated by image processing using a known pattern matching method, and the XY-θ movement table 44 is set so that the intermediate position Pu, Pd match. Drive control.

In this way, the upper and lower two substrates (1U, 1D) which are sucked and held by the suction head 41 and the suction table 42 and overlapped with each other are subjected to the positional deviation detection operation by the image pickup devices 431, 432 and the controller 7. , Controller 7 and XY
The position adjustment for proper bonding is performed through the position shift correction operation using the −θ movement table 44.

[0016]

As described above, in the conventional substrate superposing mechanism and superposing method, the controller 7 determines the intermediate positions Pu, Pd from the image pickup patterns of the marks 1U1, 1U2, 1D1, 1D2. Is calculated and controlled, each imaging device 431, 432 is required to be able to individually recognize the position of each mark 1U1, 1U2, 1D1, 1D2 within its imaging field of view.

By the way, in recent liquid crystal display panels, the display screen has been further refined, and more precise positioning in micron units is required at the time of superposing the substrates. Therefore, the microscope type has a high magnification. Imaging device 431,
432 is being adopted.

In high-accuracy positioning, even if the amount of positional deviation between the upper substrate 1U and the lower substrate 1D becomes large,
As shown in FIG. 11A, one of the two pairs of marks may overlap with the mark of the other substrate. Note that FIG. 11 is similar to FIG.
The imaging pattern taken in by No. 1 is shown.

In FIG. 10 and FIG. 11 (a), for convenience of explanation, the mark 1U on the upper substrate 1U is shown depending on the presence or absence of parallel diagonal lines.
1, 1U2 and the marks 1D1 and 1D2 on the lower substrate 1D are shown separately, but since it is actually sufficient to distinguish them from the transparent glass substrate that is the background, all the cross-shaped marks are displayed in black, for example. Has been done.

Therefore, as shown in FIG.
Of the pair of marks, for example, mark 1U2 and mark 1D
When 2 and 2 partially overlap, the imaging pattern is as shown in FIG.
As shown in FIG. 1 (b), since no overlapping mark is recognized as a cross mark, a recognition error occurs and the controller 7 cannot correct the positional deviation.

As described above, when either one of the marks overlaps with each other and a recognition error occurs, and the apparatus stops, the operator moves the XY-θ moving table 44 to pull out the overlapped marks. In addition, the position of the board 1U is displaced and the position correction operation by the image pickup devices 431 and 432 and the controller 7 is restarted, so that the work efficiency is significantly reduced.

Needless to say, the marks may be supplied and held by the laminating devices 4 and 4 so that the two marks do not overlap from the beginning, but some misalignment can be avoided in each process of transferring and transferring the substrate. As long as there is no mark, it is not easy in reality to eliminate the overlapping of marks, and improvement in handling has been demanded.

Therefore, according to the present invention, a substrate bonding apparatus is
Even if one of the two pairs of marks on the two upper and lower substrates overlaps each other so as to partially overlap with each other, the alignment of the two substrates by the marks can be performed smoothly and appropriately, and An object of the present invention is to provide a superposition mechanism of the substrates and a superposition method.

[0024]

According to a first aspect of the present invention, in a set of two substrates each having a light-transmitting property and formed with positioning marks, one of the two substrates is set. The mark formed on the substrate is a mark of another substrate,
It is characterized by being colored with different lightness or hue.

As described above, the substrate according to the present invention is configured such that the mark formed on one of the substrates is colored differently from the mark on the other substrate.

Therefore, when the glass substrate is irradiated with light of the same color as the colored mark and the irradiated substrate is photographed by the imaging device, the colored mark melts into the background and is not colored. Since only the pair of marks of (1) above emerge from the background, the pair of marks on the non-colored side can be accurately captured on the imaging screen.

Therefore, for example, white light and light of the same color as the color of the colored mark are switched and radiated and photographed, and two sets of mark patterns partially overlapped and a mark of only a pair of marks on the non-colored side are formed. It is possible to obtain two types of imaging patterns.

Therefore, it is also possible to calculate the pattern of the mark on the colored side by comparing the two types of image pickup patterns and recognizing the pattern difference.

As described above, according to the substrate of the present invention, even if some marks are overlapped, each mark pattern can be accurately obtained by the image pickup pattern and the recognition processing calculation of the pattern. Similarly to the above, it is possible to correct the positional deviation while obtaining the intermediate position of the pair of marks by calculation, and perform proper and highly accurate overlay.

According to a second aspect of the invention, in a substrate superposing mechanism, translucent marks for positioning are respectively formed, and a mark formed on one of the substrates is different from a mark on the other substrate. A pair of substrates colored with different lightness or hue, a stacking means for stacking the pair of substrates so that the marks provided on the respective substrates face each other, and the stacking means. By a light source configured to irradiate light of the color of at least one of the marks of the pair of substrates superposed by the matching means or the color of the same system, and the transmitted light of the irradiation light from this light source,
An image pickup device for picking up images of the marks on the pair of substrates, and a detection unit for detecting a positional deviation between the two superposed substrates based on an image pickup pattern of each mark taken by the image pickup device. , 2 detected by this detection means
And a correction unit that corrects the positional deviation between the substrates.

A third aspect of the present invention is a method of stacking substrates, in which translucent marks for positioning are respectively formed, and the mark formed on one of the substrates is the mark of the other substrate. Means a superposing step of superposing two sets of substrates colored with different lightness or hue so that the marks provided on the respective boards face each other, and superposing by the superposing step. The irradiation step of switching and irradiating the light of the color of at least one of the marks of the set of the two substrates or the color of the same system as that of the marks, and the light radiated by the irradiation step,
A photographing step of photographing the marks of a set of substrates; a detecting step of detecting a positional deviation between the two superposed substrates based on the photographing pattern of the marks photographed in the photographing step; And a correction step of correcting the positional deviation between the two substrates detected in the detection step.

The substrate superposing mechanism of the second invention,
Also, the substrate superposing method of the third invention relates to a substrate superposing mechanism and a superposing method which employ the substrate of the first invention.

That is, the substrate superposing mechanism of the second invention has a light source of the colored light, an image pickup device for picking up an image of the mark on the substrate by the light from the light source, a detecting means for detecting the positional deviation, and the like. Further, the substrate superposing method of the third invention has an illumination step of irradiating with colored light, a photographing step of photographing the mark of the irradiated substrate, and a detecting step of detecting the positional deviation, so that they partially overlap. The marks can be captured separately, and the misalignment between the two substrates can be detected and corrected to properly and smoothly superpose them.

Incidentally, in relation to the above-mentioned second and third inventions,
In order to separate and capture marks that partially overlap,
It is sufficient if the colored mark is configured to blend into the background of the image pickup screen. Therefore, in addition to the method of irradiating with the light of the same color as the mark (colored light) as described above, it is also possible to transmit light. The same functions and effects as those of the second and third inventions can be obtained even if the mark is photographed through a reflective color filter or a reflecting plate that reflects colored light behind the mark. You can

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a substrate, a substrate stacking mechanism, and a stacking method according to the present invention will be described in detail below with reference to FIGS.
The same components as those of the conventional substrate and the substrate superposing mechanism shown in FIGS. 7 to 11 are designated by the same reference numerals, and detailed description thereof will be omitted.

That is, FIGS. 1A and 1B show an embodiment of a substrate according to the present invention.
1A is a plan view of the upper substrate 8U, and FIG. 1B is a lower substrate 8D.
FIG. FIG. 2 is a plan view of a liquid crystal substrate laminating apparatus that employs an embodiment of the substrate superposing mechanism according to the present invention, and the laminating apparatuses 9 and 9 and the controller 10 are included in the apparatus configuration. Are configured as shown in FIG.

First, the upper substrate 8U and the lower substrate 8D shown in FIG. 1 according to the embodiment of the present invention are made of transparent glass as in the conventional case. Each of the substrates (upper substrate 1U and lower substrate 1D) is patterned so that the LCD panel can be taken out and manufactured.
A pair of cross-shaped (alignment) marks 8U1 and 8U2 for positioning, respectively, at two locations on the left and right ends of the center of
And 8D1 and 8D2 are formed.

In this embodiment, the upper substrate 8U
Marks 8U1 and 8U2 are colored red, and the lower substrate 8D
Marks 8D1 and 8D2 are displayed in black.

In the liquid crystal substrate laminating apparatus shown in FIG. 2, the upper substrate 8U and the lower substrate 8D sequentially supplied to the pair of supply mechanisms 2U and 2D arranged opposite to each other are transferred by the transfer robot 3 to the two substrates. They are alternately conveyed and supplied to the aligning devices 9, 9.

As shown in FIG. 3, the upper substrate 8U and the lower substrate 8D which are laminated by the laminating devices 9 and 9 are sucked onto the suction head 91 and the lower substrate 8D onto the suction stage 92, respectively. The suction heads 91 are held and lowered, and the suction heads 91 are superposed so as to face each other with a slight gap or in a state of being in slight contact.

CC fixed to the suction stage 92
Imaging devices 931 and 932 such as a D camera capture the corresponding marks 8U1 and 8U2 and 8D1 and 8D2, respectively, and the imaging pattern thereof is supplied to the controller 10 that serves as a positional deviation detecting means together with the imaging devices 931 and 932. .

The suction head 91 has an image pickup device 93.
1, 932 are provided with light sources 941 and 942, and light from the light sources 941 and 942 is transmitted through the glass upper substrate 8U and the lower substrate 8D, respectively, and the imaging device 931 is provided.
It is configured to irradiate toward 932.

A white lamp 94a and a red lamp 94b are arranged side by side on each of the light sources 941 and 942 so that they can be selectively switched on, and are switched on by the control of the controller 10.

Therefore, first, the white lamp 94a is turned on, and the light from the white lamp 94a passes through the transparent upper substrate 8U and the lower substrate 8D with the marks, respectively, and illuminates the image pickup devices 931 and 932. So mark 8
Digital image pickup patterns from the image pickup devices 931 and 932 obtained by photographing U1, 8U2, and 8D1 and 8D2 are sequentially supplied to the CPU 101 of the controller 10, and the first image pickup pattern including the RAM is provided from the CPU 101. It is supplied to the frame memory 102 and stored individually. Specifically, for example, the image pickup patterns captured by the image pickup devices 931 and 932 are displayed as marks 8U1, 8U2 and 8D1, 8
Binarization processing with a binarization threshold value (a binarization threshold value that separates the marks 8U1, 8U2 and 8D1, 8D2 from the background image) set between the brightness corresponding to D2 and the brightness corresponding to the background portion. Then, a binarized image pattern is generated, and this binarized image is stored in the first frame memory 102.

An image pickup pattern captured by the image pickup device 931 will be described below as an example.

First, the CPU 101 uses the binarized image pattern stored in the first frame memory 102 to output a pair of corresponding marks 8U1, 8U2 and 8D1, 8D2.
Recognize. At this time, when the marks 8U1, 8U2 and 8D1, 8D2 can be normally recognized, the substrates 8U, 8D are aligned by the same procedure as in the conventional technique, and the marks 8U1, 8U2 and 8D1, 8D2 are normally processed. If it cannot be recognized, the marks 8U1, 8U2 and 8D1, 8D2 are recognized by the procedure described later.

That is, the image pickup pattern obtained by lighting and illuminating the white lamp 94a from the image pickup device 931 is shown in FIG.
As shown in FIG. 10A or FIG. 10B, when the marks 8U1 and 8U2 and 8D1 and 8D2 are individually and independently separated from each other without overlapping with each other, the CPU 101 is Marks 8U1, 8U2 and 8D
It is possible to recognize 1,8D2 normally. Therefore, the CPU 101 determines the intermediate position P of each of the corresponding pair of marks 8U1, 8U2 and 8D1, 8D2 from the binarized image pattern stored in the first frame memory 102.
u and Pd are calculated. Then, based on the respective intermediate point positions obtained from the image pickup pattern captured by the other image pickup device 932, the XY-θ movement table 95 is controlled so that the intermediate positions Pu and Pd coincide with each other, and the position adjustment is performed. .

On the other hand, the white lamp 9 from the image pickup device 931
When the photographing pattern by the lighting irradiation of 4a is one of the marks 8U1, 8U2 and 8D1, 8D2 as shown in FIG. 4, for example, 8U2, 8D2 as shown in the figure is partially overlapped with each other, The CPU 101 cannot normally recognize the marks 8U1, 8U2 and 8D1, 8D2. In this case, the CPU 101 controls the light sources 941 and 942 so that the illumination lamp is switched from the white lamp 94a to the red lamp 94b and turned on.

The color of the light of the red lamp 94b which is switched on and turned on is a pair of two marks 8 which are colored red with the same hue.
Since the colors are similar to U1 and 8U2, marks 8U1 and 8U
As indicated by the parallel hatching in FIG. 5A, 2 is dissolved in the color (background color) of the light of the red lamp 94b of a similar color, and the mark 8D on the other substrate colored black.
Only 1 and 8D2 are imaged as if they were projected from the background. The imaging pattern passes through the CPU 101 of the controller 10 and the second frame memory 103 composed of RAM.
It is supplied and stored in. Specifically, for example, the CPU 101
Is an imaging pattern captured by the imaging device 931
A binarization threshold value set between the brightness of the marks 8U1 and 8U2 corresponding to red and the brightness of the marks 8D1 and 8D2 corresponding to black (marks 8D1 and 8D2 are marked
U1, 8U2 and the binarized image pattern (FIG.
(B)) is generated and the binarized image pattern is stored in the second frame memory 103. At this time, the color of the light (background color) of the red lamp 94b is the marks 8U1 and 8U2.
Since the color is the same as or close to the red color of, the background image and the marks 8U1 and 8U2 have the same color (white) in the image pattern binarized by the binarization threshold value. The marks 8U1 and 8U2 are not displayed, and only the marks 8D1 and 8D2 are cut out.

The CPU 101 calculates the intermediate position Pd of the marks 8D1 and 8D2 from the binarized image,
The calculated position information (intermediate position Pd) is once supplied and stored in the memory 104 configured by the RAM.

Next, the CPU 101 of the controller 10 makes the first
4B of the frame memory 102 of FIG. 4B and FIG. 5 of the second frame memory 103 of FIG.
The binarized image pattern shown in (b) is read out respectively, and the two types of imaging patterns are compared with each other, and by the recognition processing operation of the difference, two pairs of two on the side colored in red as shown in FIG. The patterns of the marks 8U1 and 8U2 are calculated, the intermediate position Pu is calculated from the calculated pattern, and R
It is supplied and stored in the memory 104 configured by AM.

The pair of marks 8U1 and 8U2 obtained by the difference recognition processing operation are marks colored in red, but by the difference operation processing, as shown in FIG. The pattern shape is such that only the portion overlapping the mark 8D2 is chipped, and the intermediate position Pu can be calculated without any trouble.

Thereafter, the CPU 101 causes the intermediate point positions Pu and Pd stored in the memory 104 and the other image pickup 93 to be performed.
Position adjustment is performed by controlling the XY-θ moving stage 95 so that the respective intermediate point positions Pu and Pd coincide with each other based on the intermediate point positions Pu and Pd obtained from the image pickup pattern captured in 2.

As described above, according to the substrate stacking mechanism and the substrate stacking method of this embodiment, the positioning mark of one of the substrates is different in color from the positioning mark of the other substrate. That is, since it is configured by being colored with different lightness or hue, it is possible to obtain an imaging pattern by switching to obtain a background of a color of a similar color to that of the coloring, so even if some of the marks overlap. Also, a pair of individual mark positions can be separated and extracted by arithmetic processing.

As described above, according to the present invention, even if a part of the marks overlaps between the two substrates, the position correction operation is efficiently performed, and proper and smooth alignment is automatically performed. be able to.

In the substrate superposing mechanism and method according to the above-described embodiment, the light source switches and lights the lamps of the same color as the color of the colored mark. Since it suffices to irradiate the light so that the background can be obtained, the so-called color filter which omits the red lamp 94b and transmits only the red color can be selectively switched to be inserted between the upper and lower sides of the substrates 8U and 8D. Even if configured, similar functions and effects can be obtained.

Further, light sources 941 and 942, each of which is composed of a white lamp 94a and a red lamp (a lamp having a color similar to the color of the colored mark on one substrate) 94b, are connected to the image pickup device 931.
The same function and effect can be obtained by arranging the lamps on the 932 side and switching the lamps 94a and 94b to light. In this case, it is preferable that the background portion (the suction surface of the upper substrate 8U of the suction head 91) that is transmitted through the substrates 8U and 8D and imaged by the imaging devices 931 and 932 is white or a color close to white. .

The marks 8U1 on the upper substrate 8U are detected from the image pickup patterns captured by the image pickup devices 931 and 932.
As an example of the means for separating the 8U2 and the marks 8D1 and 8D2 of the lower substrate 8D, the light and the background of the colors similar to the colors of the marks 8U1 and 8U2 of the upper substrate 8U have been described, but the invention is not limited thereto.

Specifically, for example, first, image pickup devices 931 and 932 are illuminated under illumination by a light source using a white lamp.
The marks 8U1, 8U2 and 8D1, 8D2 are imaged. The CPU 101 binarizes the imaging pattern captured by the imaging devices 931 and 932 with a binarization threshold (first binarization threshold) that separates the marks 8U1, 8U2 and 8D1, 8D2 from the background image. The binarized image pattern is generated by the binarization process, and the marks 8U1, 8U2 and 8D1, 8D2 in the binarized image pattern are recognized.

When proper recognition cannot be performed for all the marks 8U1, 8U2 and 8D1, 8D2 from this binarized image pattern, the binarization threshold is set to the light amount level from the red marks 8U1, 8U2 and the black level. Of the light amount level from the marks 8D1 and 8D2 of the marks 8D1 and 8D2, that is, the binarization threshold value that separates the marks 8U1 and 8U2 and the background image from the marks 8D1 and 8D2. Value threshold). Then, again, the image pickup patterns of the image pickup devices 931 and 932 picked up under the illumination of the white lamp are binarized by the switched second binarization threshold, and the marks 8D1 and 8D2.
Generate a binarized image in which only this is cut out. This allows
Only the marks 8D1 and 8D2 can be cut out from the imaging pattern by the imaging devices 931 and 932.

The clipping of the images of the marks 8U1 and 8U2 is carried out in the same manner as in the first embodiment by the binarization image pattern by the first binarization threshold and the binarization by the second binarization threshold. This can be performed by a recognition processing calculation of a difference from the digitized image pattern.

Even by such means, the mark 8U
1, 8U2 and 8D1, 8D2, even if some of them overlap, each pair of marks 8U1, 8U2 and 8
Since D1 and 8D2 can be separated and extracted, it is possible to obtain the same function and effect as in the first embodiment.

Further, the substrate superposing mechanism and method of the present invention is a reflection plate for reflecting a color similar to the colored color, that is, the above-mentioned, in order to obtain a background of a color similar to the color of the colored mark. In the embodiment, the red color reflector is selectively inserted in the background, and the imaging devices 931 and 932 are provided.
The same function and effect can be obtained even when the image pickup is performed by the illumination from the side. In this case, the mark colored red is made non-translucent, and the other mark used as a pair with this mark has a color with high reflectance (for example,
(Silver), and when the color reflector is inserted in the background for image capture, light is emitted from the imager side, and when the color reflector is not inserted in the background for image capture, the board is sandwiched between the imager and the imager. Light may be emitted from opposite sides.

In the above description, the light source 941,
942 is on the suction head 91 side, and imaging devices 931 and 9
Although it has been described that 32 is installed on the suction table 92 side, the invention is not limited to this.
942 to the suction table 92 side, the imaging device 931
932 can also be installed on the suction head 91 side. In addition, the upper substrate 8U and the lower substrate 8D are aligned with each other by using the upper substrate 8
Although it is explained that the U side is lowered, of course, the lower substrate 8
The U side may be raised, and the XY-θ moving table 95 is arranged on the suction head 91 side, but may be arranged on the suction table 92 side.

Also, an example was used in which the color of the colored mark was red and the color of the other mark was black, but the present invention is not limited to this, and both marks are colored with different lightness or different hues. The color combination is free.

Furthermore, although it has been described that a lamp is used as a light emitting source of the light sources 941 and 942, it goes without saying that an LED or other lighting fixture can also be adopted.

In any case, according to the board of the present invention, the board superposing mechanism using the board, and the superposing method, even if one of the two pairs of positioning marks is the other, Even if it overlaps with the mark on the board, it can be automatically separated and caught, and the operation of stacking the two boards can be appropriately and automatically performed. The manufacturing efficiency can be improved, and a remarkable effect can be obtained in practical use.

[0068]

As described above, according to the present invention,
Positioning of the two substrates to be overlaid is performed smoothly and appropriately, which is a large effect practically obtained by being adopted in the manufacture of liquid crystal display panels and the like.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a substrate according to the present invention.

FIG. 2 is a plan view of a liquid crystal substrate bonding apparatus used for bonding the substrates shown in FIG.

3 is a main part configuration diagram of a laminating apparatus and a controller shown in FIG. 2. FIG.

FIG. 4 is an explanatory diagram of an image pickup pattern of a substrate irradiated with the white lamp shown in FIG. 3 by an image pickup device.

5 is an explanatory diagram of an image pickup pattern of a substrate irradiated with the red lamp shown in FIG. 3 by an image pickup device.

6 is a pattern diagram obtained by processing in the controller shown in FIG.

FIG. 7 is a plan view showing a conventional substrate laminating apparatus.

FIG. 8 is a plan view of a substrate used in the device shown in FIG.

9 is a main part configuration diagram of the laminating apparatus and the controller shown in FIG. 7.

FIG. 10 is an explanatory diagram of an imaging pattern by the imaging device shown in FIG.

11 is an explanatory diagram of an imaging pattern by the imaging device shown in FIG.

[Explanation of symbols]

1U upper substrate 1D lower substrate 2U, 2D supply mechanism 3 Transfer robot 4 Laminating device 41 Suction head 42 adsorption stage 431, 432 Imaging device (detection means) 44 XY-θ movement table (correction means) 5 adhesive 6 unloading table 7 controller 8U upper substrate 8U1, 8U2 (for positioning) mark 8D lower substrate 8D1, 8D2 (for positioning) mark 9 Laminating device 91 Suction head 92 Adsorption stage 931, 932 imaging equipment (detection means) 941,942 light source 94a white lamp 94b red lamp 95 XY-θ movement table (correction means) 10 Controller (detection means, correction means) 101 CPU 102 first frame memory 103 Second frame memory 104 memory Pu, Pd intermediate position

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[Procedure amendment]

[Submission date] July 10, 2002 (2002.7.1)
0)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0015

[Correction method] Change

[Correction content]

In this way, the upper and lower two substrates (1U, 1D) which are sucked and held by the suction head 41 and the suction table 42 and overlapped with each other are subjected to the positional deviation detection operation by the image pickup devices 431, 432 and the controller 7. , Controller 7 and XY
Through the misregistration correction operation by -θ moving table 44, move the position for the proper lamination is performed.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0049

[Correction method] Change

[Correction content]

The color of the light of the red lamp 94b which is switched on and turned on is a pair of two marks 8 which are colored red with the same hue.
Since the colors of U1 and 8U2 are colors of the same system, that is, similar colors, the marks 8U1 and 8U2 have the colors of the light of the red lamp 94b (similar colors shown in FIG. 5A). Only the marks 8D1 and 8D2 on the other substrate, which are melted into the background color) and colored black, are imaged as if they were raised from the background. The image pickup pattern passes through the CPU 101 of the controller 10 and the second image formed by the RAM.
The frame memory 103 is supplied and stored. Specifically, for example, the CPU 101 sets the imaging pattern captured by the imaging device 931 between the brightness corresponding to the red color of the marks 8U1 and 8U2 and the brightness corresponding to the black color of the marks 8D1 and 8D2. Threshold value (Mark 8D
1 and 8D2 are binarized by the binarization threshold value for separating the marks 8U1 and 8U2 and the background image to generate a binarized image pattern (FIG. 5B), and the binarized image pattern is generated. It is stored in the second frame memory 103. At this time, the color of the light of the red lamp 94b (background color) is the same as or close to the red color of the marks 8U1 and 8U2. Therefore, the image pattern binarized by the binarization threshold is the background. The part and the marks 8U1 and 8U2 have the same color (white), the marks 8U1 and 8U2 are not displayed in the binarized image, and only the marks 8D1 and 8D2 are cut out.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0053

[Correction method] Change

[Correction content]

Thereafter, the CPU 101 determines each of the intermediate point positions Pu and Pd stored in the memory 104 and the intermediate point positions Pu and Pd obtained from the image pickup pattern captured by the other image pickup device 932. Intermediate point positions Pu and Pd
The X-Y- [theta] moving table 95 is controlled so as to match with each other.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0061

[Correction method] Change

[Correction content]

[0061] Incidentally, the cut-out image of the mark 8U1,8U2, as in the first embodiment, the two of the first of the two binary image pattern by binarization threshold and a second binarization threshold This can be performed by a recognition processing calculation of the difference from the binarized image pattern.

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Claims (11)

[Claims] 1. A pair of substrates each having a light-transmitting property and formed with positioning marks, wherein the mark formed on one of the two substrates is the other substrate. The mark on the substrate is a substrate that is colored with different lightness or hue. 2. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a different brightness or hue from the mark on the other substrate. Two sets of substrates, a stacking unit that stacks the two sets of substrates so that the marks provided on the substrates face each other, and the two sets that are stacked by the stacking unit A light source configured to irradiate at least one of the marks of the substrate or light of a color similar to that of the mark, and the transmitted light of the irradiation light from the light source captures the marks of the pair of substrates. An image pickup device, a detection unit that detects a positional deviation between the two substrates that are superposed on the basis of an image pickup pattern of each of the marks shot by the image pickup device, and the two sheet members that are detected by the detection unit. Basis Mechanism superposition substrate, characterized by comprising a correction means for correcting the misalignment between. 3. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a different brightness or hue from the mark on the other substrate. Two sets of substrates, a stacking unit that stacks the two sets of substrates so that the marks provided on the substrates face each other, and the two sets that are stacked by the stacking unit Of the pair of substrates, which is opposed to the mark position of the substrate and can be inserted before or after the pair of substrates, and transmits light of at least one of the marks of the pair of substrates or a color of the same system. A color filter, an imaging device that captures the pair of two marks by transmitted light through the color filter and the pair of substrates, and an imaging pattern of each mark captured by the imaging device. Based on A detecting means for detecting a positional deviation between the two substrates which are overlapped with each other, and a correcting means for correcting a positional deviation between the two substrates detected by the detecting means. Substrate stacking mechanism. 4. A translucent mark is formed for positioning, and the mark formed on one of the substrates is colored with a different brightness or hue from the mark on the other substrate. Two sets of substrates, a stacking unit that stacks the two sets of substrates so that the marks provided on the substrates face each other, and the two sets that are stacked by the stacking unit Is provided so as to be opposed to the mark position of the substrate and can be inserted before or after the pair of substrates, and reflects the color of at least one of the marks of the pair of substrates or a color of the same system as the mark. A color reflecting plate, an image pickup device that picks up the two pairs of marks by reflected light that is reflected by the color reflecting plate, and passes through the pair of substrates, and a mark of the mark that is picked up by the image pickup device. In the imaging pattern Firstly, there is provided a detection means for detecting a positional deviation between the two superposed substrates and a correction means for correcting a positional deviation between the two substrates detected by the detecting means. Substrate stacking mechanism. 5. The detecting means uses an image pickup pattern by irradiating or transmitting or reflecting light of at least one mark color or a color of a color similar to that of the mark, and by irradiating another light having a hue different from that of the color. 5. The substrate superposing mechanism according to claim 2, wherein a positional deviation between the two superposed substrates is detected based on a difference from an imaging pattern. 6. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a different lightness or hue from the mark on the other substrate. And a superposing step of superposing two sets of the substrates so that the marks provided on the respective substrates face each other, and at least one of the superposing substrates is superposed by the superposing step. An irradiation step of switching and irradiating light of the color of the mark or a color of the same system as that of the mark, and an imaging step of imaging the marks of the pair of substrates under the light emitted by this irradiation step, and this imaging A detection step of detecting a positional deviation between the two substrates overlapped with each other based on an image pickup pattern of each mark photographed in the step, and a position difference between the two substrates detected in the detection step. How superposition substrate, characterized by comprising a correction step of correcting. 7. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a lightness or hue different from that of the mark on the other substrate. And a step of superposing the two sets of substrates described above so that the marks provided on the respective substrates face each other, and a mark position of the two sets of substrates superposed by the step of superposing And an insertion step of inserting a color filter that allows the light of the color of at least one of the marks of the pair of substrates or the color of the same system to pass through before or after the pair of substrates, The photographing step of photographing the mark by the transmitted light of the color filter inserted in the step, and the two substrates superposed on each other based on the photographing pattern of the mark photographed in the photographing step. A substrate superimposing method comprising: a detecting step of detecting a positional deviation between the two substrates; and a correcting step of correcting a positional deviation between the two substrates detected in the detecting step. 8. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a lightness or hue different from that of the mark on the other substrate. And a step of superposing the two sets of substrates described above so that the marks provided on the respective substrates face each other, and a mark position of the two sets of substrates superposed by the step of superposing And an insertion step of inserting a color reflector that reflects the color of at least one of the marks of the pair of substrates or a color of the same system as the mark before or after the pair of substrates. Based on the photographing step of photographing the mark by the reflected light reflected by the color reflecting plate inserted in the inserting step and having passed through the pair of substrates, based on the image pickup pattern of the mark photographed in this photographing step A detection step of detecting a positional deviation between the two superposed substrates, and a correction step of correcting the positional deviation between the two substrates detected in the detection step. How to stack. 9. The detection step uses an image pickup pattern by irradiation, transmission or reflection of light of at least one mark color or a color of the same system as that of the mark, and another light having a lightness or a hue different from that of the color. 9. The substrate superimposing method according to claim 6, wherein a positional deviation between the two superposed substrates is detected based on a difference from an imaging pattern. 10. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a different brightness or hue from the mark on the other substrate. A set of two substrates, a stacking unit that stacks the two sets of substrates so that the marks provided on the respective substrates face each other, and photographs each mark of the two sets of substrates. An image pickup device, a first binarization threshold value for separating each mark provided on each substrate and a rear image from an image pickup pattern of the mark photographed by the image pickup device, and provided on one substrate. A second binarization threshold value for separating the mark formed on the other substrate and the second binarization threshold value, and the first binarization processing is performed on the imaging pattern with the first binarization threshold value. Binarized image pattern and the imaging pattern Detecting means for detecting a positional deviation between the two superposed substrates based on a second binarized image pattern binarized by the second binarization threshold value. And a correction unit that corrects the positional deviation between the two substrates detected by the above method. 11. A light-transmitting, positioning mark is formed on each of the substrates, and the mark formed on one of the substrates is colored with a lightness or hue different from that of the mark on the other substrate. And a superposing step of superposing two sets of the substrates so that the marks provided on the respective substrates face each other, and by the superposing step, each mark of the superposed substrates of the two sets is formed. An imaging device for photographing, an irradiation step for switching and irradiating light of a color or a color of the same system, and an imaging step for photographing the marks on the pair of substrates under the light irradiated by this irradiation step. And binarizing the imaging pattern photographed in this imaging step with a first binarization threshold value for separating each mark provided on each substrate from the back surface image, and first binarization Generate an image pattern The binarization processing step of No. 1 and a second binary method for separating the image pickup pattern photographed in the image pickup step into a mark and a background image provided on the one substrate and a mark provided on the other substrate. A second binarization process using a binarization threshold value to generate a second binarized image pattern;
And the position between the two substrates superposed based on the first and second binarized image patterns obtained in the first and second binarization processes. A method of stacking substrates, comprising: a detecting step of detecting a shift; and a correcting step of correcting a positional shift between the two substrates detected in the detecting step.