JP4698101B2 - Substrate overlay mechanism and substrate overlay method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is suitable for positioning with high accuracy by overlapping so as to face each other. ,substrate Overlay mechanism And board Superposition method In Related.
[0002]
[Prior art]
A liquid crystal display panel is manufactured by placing two glass substrates facing each other and bonding them together, and encapsulating liquid crystals between the two bonded substrates. In the manufacturing process of such a liquid crystal display panel or the like, the two substrates are superposed through a highly accurate alignment or positioning operation based on alignment (positioning) marks formed on the two glass substrates. Done.
[0003]
FIG. 7 is a plan view of a conventional substrate and a liquid crystal substrate laminating apparatus that employs a superposition mechanism for the substrates. FIGS. 8 (a) and 8 (b) are respectively adhered by the apparatus shown in FIG. It is an enlarged plan view of a glass substrate to be combined, that is, an upper substrate 1U and a lower substrate 1D.
[0004]
As shown in FIG. 7, in the liquid crystal substrate laminating apparatus, first, the upper substrate 1U and the lower substrate 1D are sequentially supplied to a pair of supply mechanisms 2U and 2D arranged to face each other.
[0005]
Between the pair of supply mechanisms 2U and 2D, there is disposed a transfer robot 3 having an arm 3a that can be swung in the direction indicated by the arrow Y while being swiveled, and that is movable in the direction indicated by the arrow X. 1D is conveyed and supplied alternately by the conveying robot 3 to two bonding apparatuses 4 and 4 arranged adjacent to each other.
[0006]
As shown in FIG. 8, the upper substrate 1U and the lower substrate 1D made of glass that are overlapped by the laminating apparatuses 4 and 4 are patterned so that, for example, four liquid crystal panels can be taken out and manufactured. Cross-shaped positioning marks 1U1, 1U2, and 1D1, 1D2 are printed and formed at two locations on the left and right ends of the center (upper substrate 1U and lower substrate 1D), respectively.
[0007]
Further, an adhesive 5 is previously applied and drawn along the pattern on the lower substrate 1D surface, and after the substrate positioning adjustment based on the marks 1U1, 1U2, and 1D1, 1D2, the upper substrate 1U through the adhesive 5 is used. And the lower substrate 1D are bonded together.
[0008]
The bonded upper substrate 1U and lower substrate 1D are transferred to the transfer robot 3 and supplied to the unloading table 6 shown in FIG. 7 to be transferred to the next liquid crystal injection step.
[0009]
The laminating devices 4 and 4 are configured as shown in the front view of FIG. 9. First, the upper suction head 41 that can move in the vertical (Z-axis) direction receives the upper substrate 1U from the transfer robot 3 first. The lower suction stage 42 receives the lower substrate 1D from the transfer robot 3 and holds it by suction.
[0010]
Imaging devices 431 and 432 such as a CCD camera are mounted in the suction stage 42, and the upper substrate 1U sucked and held by the suction head 41 is lowered in the Z direction in the drawing and is lightly superimposed on the lower substrate 1D. Thus, the marks 1U1, 1U2 and 1D1, 1D2 formed on each glass substrate are photographed.
[0011]
The upper suction head 41 is incorporated in the XY-θ movement table 44, and the XY-θ movement table 44 incorporating the suction head 41 is driven and controlled by the controller 7.
[0012]
The controller 7 receives the imaging patterns of the marks 1U1, 1U2 and 1D1, 1D2 from the imaging devices 431, 432, and based on this, the positional deviation amount between the upper substrate 1U and the lower substrate 1D is within an allowable range. The XY-θ movement table 44 is driven and controlled so as to fit.
[0013]
FIG. 10A is an imaging pattern diagram captured by the imaging device 431 in a state of being overlaid at an appropriate position.
[0014]
In a state where the two substrates (upper substrate 1U and lower substrate 1D) are properly overlapped, as shown in FIG. 10A, between the cross-shaped marks 1U1, 1U2, and 1D1, 1D2 forming a pair, respectively. The connected straight lines Lu and Ld intersect so that they are orthogonal to each other, and the intermediate positions Pu and Pd of the marks 1U1, 1U2 and 1D1, 1D2 coincide. Accordingly, for example, when the upper substrate 1U is tilted and held by the suction head 41 and the intermediate positions Pu and Pd are shifted by Δx and Δy in the XY directions as shown in FIG. The built-in microcomputer calculates the coordinate positions of the intermediate positions Pu and Pd from the imaging patterns from the imaging devices 431 and 432 by image processing using a known pattern matching method, and the intermediate positions Pu and Pd match. The XY-θ moving table 44 is driven and controlled so as to do this.
[0015]
As described above, the upper and lower two substrates (1U, 1D) that are superposed while being sucked and held by the suction head 41 and the suction table 42 are subjected to the positional deviation detection operation by the imaging devices 431, 432 and the controller 7, and the controller 7 and the positional deviation correction operation by the XY-θ movement table 44, and the alignment for proper bonding Set Is done.
[0016]
[Problems to be solved by the invention]
As described above, in the conventional substrate superposition mechanism and superposition method, the controller 7 calculates and controls the intermediate positions Pu and Pd from the imaging patterns of the marks 1U1, 1U2, 1D1, and 1D2. The imaging devices 431 and 432 are required to be able to individually recognize the positions of the marks 1U1, 1U2, 1D1, and 1D2 within the imaging field of view.
[0017]
By the way, in recent liquid crystal display panels, display screens have been further refined, and more accurate positioning in micron units is required when the substrates are overlapped. For this reason, the imaging device 431 is a microscope type and has a high magnification. , 432 have been adopted.
[0018]
In the high-precision positioning, when the amount of misalignment between the upper substrate 1U and the lower substrate 1D is slightly increased, as shown in FIG. It may overlap with the mark on the board. Note that FIG. 11 shows an imaging pattern captured by the imaging device 431, as in FIG.
[0019]
In FIG. 10 and FIG. 11A, for convenience of explanation, the marks 1U1 and 1U2 on the upper substrate 1U and the marks 1D1 and 1D2 on the lower substrate 1D are distinguished depending on the presence or absence of parallel oblique lines. The cross-shaped mark is displayed in black, for example, so long as it can be identified from the transparent glass substrate.
[0020]
Accordingly, as shown in FIG. 11A, when, for example, the mark 1U2 and the mark 1D2 of the pair of two marks partially overlap, the imaging pattern becomes as shown in FIG. 11B. Any of the overlapping marks is not recognized as a cross-shaped mark, so that a recognition error occurs and the controller 7 cannot correct the positional deviation.
[0021]
In this way, when any one of the marks overlaps each other and a recognition error occurs and the apparatus stops, the operator moves the XY-θ movement table 44 so that the overlapped marks are separated. Since the position of 1U is shifted and the position correction operation by the imaging devices 431 and 432 and the controller 7 is restarted, the work efficiency is remarkably lowered.
[0022]
Of course, it is only necessary to supply and hold the laminating devices 4 and 4 so that the two marks do not overlap from the beginning. However, a slight misalignment is unavoidable in each process of transporting and transferring the substrate. In reality, it is not easy to eliminate the overlap of marks, and there has been a demand for improvement in correspondence.
[0023]
Therefore, the present invention provides an operation for aligning two substrates using marks even if the substrate laminating device overlaps so that one of two pairs of marks on the upper and lower substrates partially overlap each other. An object of the present invention is to provide a substrate, a superposition mechanism for the substrate, and a superposition method that can be performed smoothly and appropriately.
[0024]
[Means for Solving the Problems]
A first invention is a set of two substrates each having translucency and each having a mark for positioning, wherein the mark formed on any one of the two sets is another The mark on the substrate is colored with different brightness or hue.
[0025]
As described above, the substrate of the present invention is configured such that the mark formed on any one of the substrates is colored in a color different from the mark on the other substrate.
[0026]
Therefore, when a glass substrate is irradiated with light of the same color as the colored mark, and the image pickup device photographs the irradiated substrate, the colored mark melts into the background and a pair of non-colored sides. Since only the marks emerge from the background, it is possible to accurately capture the pair of mark shapes on the non-colored side on the imaging screen.
[0027]
Accordingly, for example, white light and light of the same color as the color of the colored mark are switched and photographed, and two sets of two overlapping mark patterns and a mark pattern of only a pair of non-colored marks are used. Various types of imaging patterns can be obtained.
[0028]
Therefore, only the pattern of the colored mark can be calculated by comparing the two types of imaging patterns and recognizing the pattern difference.
[0029]
Thus, according to the substrate of the present invention, each mark pattern can be accurately obtained by the imaging pattern and the recognition processing calculation of the pattern even if there is an overlap in some marks. Therefore, it is possible to perform the misalignment correction while calculating the intermediate position of the pair of marks, and to perform proper and highly accurate overlay.
[0030]
According to a second aspect of the present invention, in the substrate overlapping mechanism, each of the substrates has translucency, a positioning mark is formed, and the mark formed on one of the substrates is the brightness or A set of two substrates colored in different hues, a superimposing unit that superimposes the set of two substrates so that the marks provided on the respective substrates face each other, and the superimposing unit A light source configured to be able to irradiate light of at least one mark color or a color of the same color of the set of two substrates that are superposed on each other, and transmitted light of the irradiation light from the light source. An imaging device that captures a mark on a set of substrates, a detection unit that detects a positional deviation between the two superimposed substrates based on an imaging pattern of each of the marks captured by the imaging device, and the detection Characterized by comprising a correction means for correcting the positional deviation between the two substrates that have been detected by the stage.
[0031]
In addition, the third invention is a method of superimposing substrates, and has translucency, a positioning mark is formed, and a mark formed on one of the substrates is a mark on another substrate. A superimposing step of superimposing a set of two substrates colored with different brightness or hue so that the marks provided on the respective substrates are opposed to each other, and the superposing step An irradiation step of switching and irradiating light of at least one mark color of the set of two substrates or the same color of the same, and under the light irradiated by this irradiation step, An imaging process for imaging a mark, a detection process for detecting a positional deviation between the two superimposed substrates based on an imaging pattern of each mark captured in the imaging process, and a detection process Characterized by comprising the correction step of correcting the positional deviation between the two substrates issued.
[0032]
The substrate overlaying mechanism of the second invention and the substrate overlaying method of the third invention both relate to a substrate overlaying mechanism and a stacking method employing the substrate of the first invention.
[0033]
That is, the substrate superimposing mechanism of the second invention has a light source of colored light, an imaging device that images a mark on the substrate with light from the light source, a detection means that detects a positional shift, and the like. The method for superimposing substrates of the invention has an illumination step of irradiating colored light, a photographing step of photographing a mark of the irradiated substrate, a detection step of detecting misalignment, etc. It can be separated and detected, and a misalignment between the two substrates can be detected and corrected, and can be properly and smoothly superimposed.
[0034]
In addition, in relation to the second and third aspects of the invention, in order to separate and capture the partially overlapped marks, it is sufficient that the colored marks are melted into the background of the imaging screen. In addition to the method of shooting by irradiating with the same color light (colored light) as above, shooting through a translucent color filter or behind the reflector that reflects the colored light Even if the mark is photographed, functions and effects similar to those of the second and third inventions can be obtained.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a substrate, an overlay mechanism of the substrate, and an overlay method according to the present invention will be described in detail with reference to FIGS. The same components as those of the conventional substrate shown in FIGS. 7 to 11 and the overlapping mechanism of the substrates are denoted by the same reference numerals, and detailed description thereof is omitted.
[0036]
1A and 1B show an embodiment of the substrate according to the present invention. FIG. 1A is a plan view of the upper substrate 8U, and FIG. 1B is a lower substrate 8D. FIG. FIG. 2 is a plan view of a liquid crystal substrate laminating apparatus that employs an embodiment of the substrate overlapping mechanism according to the present invention. Among the apparatus configurations, laminating apparatuses 9 and 9 and a controller 10 are shown. Is configured as shown in FIG.
[0037]
First, the upper substrate 8U and the lower substrate 8D according to the embodiment of the present invention shown in FIG. 1 are both made of transparent glass as in the prior art, and have four light-transmitting liquid crystal panels. Are formed in a pattern so that they can be taken out and manufactured, and a pair of cruciform positioning (alignment) marks 8U1, respectively, are provided at two positions on the center left and right ends of each substrate (upper substrate 1U and lower substrate 1D). 8U2 and 8D1 and 8D2 are formed.
[0038]
In this embodiment, the marks 8U1 and 8U2 on the upper substrate 8U are colored in red, and the marks 8D1 and 8D2 on the lower substrate 8D are painted in black.
[0039]
In the liquid crystal substrate bonding apparatus shown in FIG. 2, the upper substrate 8U and the lower substrate 8D that are sequentially supplied to the pair of supply mechanisms 2U and 2D that are arranged to face each other are transferred by the transfer robot 3 into two bonding apparatuses 9. , 9 are alternately conveyed and supplied.
[0040]
As shown in FIG. 3, the upper substrate 8U and the lower substrate 8D that are overlapped by the laminating apparatuses 9 and 9 are held by suction on the suction head 91 and the lower substrate 8D on the suction stage 92, respectively. The suction head 91 is lowered and overlapped so as to face each other with a slight gap or in a light contact state.
[0041]
Imaging devices 931 and 932 such as a CCD camera attached and fixed to the suction stage 92 photograph the corresponding marks 8U1, 8U2, and 8D1 and 8D2, respectively, and the imaging patterns together with the imaging devices 931 and 932 are used to detect misalignment. It is supplied to the responsible controller 10.
[0042]
Further, the suction head 91 is provided with light sources 941 and 942 corresponding to the imaging devices 931 and 932, and light from the light sources 941 and 942 is imaged through the glass upper substrate 8U and the lower substrate 8D, respectively. It is comprised so that it may irradiate toward the apparatus 931,932.
[0043]
Each of the light sources 941 and 942 is provided with a white lamp 94a and a red lamp 94b arranged in parallel so that they can be selectively switched on and off, and are switched on under the control of the controller 10.
[0044]
Therefore, first, the white lamp 94a is turned on, and the light from the white lamp 94a passes through the translucent upper substrate 8U and the lower substrate 8D with marks, and is irradiated to the imaging devices 931 and 932, respectively. The digital imaging patterns from the imaging devices 931 and 932 obtained by imaging the marks 8U1, 8U2, and 8D1, 8D2 are sequentially supplied to the CPU 101 of the controller 10, and the CPU 101 includes a RAM and the like. One frame memory 102 is supplied and stored separately. Specifically, for example, an imaging pattern captured by the imaging devices 931 and 932 is a binarization threshold set between the brightness corresponding to the marks 8U1, 8U2 and 8D1, 8D2 and the brightness corresponding to the background portion. A binarized image pattern is generated by binarization processing using values (binarization threshold values for separating the marks 8U1, 8U2 and 8D1, 8D2 from the background image), and the binarized image is generated in the first frame memory 102. Is remembered.
[0045]
Hereinafter, an imaging pattern taken in by the imaging device 931 will be described as an example.
[0046]
First, the CPU 101 recognizes each corresponding pair of marks 8U1, 8U2 and 8D1, 8D2 from the binarized image pattern stored in the first frame memory 102. At this time, if the marks 8U1, 8U2 and 8D1, 8D2 can be recognized normally, the substrates 8U, 8D are aligned in the same procedure as in the prior art, and the marks 8U1, 8U2, 8D1, 8D2 are normally operated. If it cannot be recognized, the marks 8U1, 8U2 and 8D1, 8D2 are recognized according to the procedure described later.
[0047]
That is, in the same manner as the image pickup pattern by lighting the white lamp 94a from the image pickup device 931 is shown in FIG. 10 (a) or FIG. 10 (b), each of the marks 8U1, 8U2, and 8D1, 8D2 However, the CPU 101 can normally recognize each of the marks 8U1, 8U2 and 8D1, 8D2 when they are individually separated without overlapping with each other. Therefore, the CPU 101 calculates the intermediate positions Pu and Pd of the corresponding pairs of marks 8U1, 8U2 and 8D1, 8D2 from the binarized image pattern stored in the first frame memory 102 by calculation. Then, based on each intermediate point position obtained from the imaging pattern captured by the other imaging device 932, alignment is performed by controlling the XY-θ movement table 95 so that the intermediate positions Pu and Pd coincide with each other. .
[0048]
On the other hand, as shown in FIG. 4, the shooting pattern by lighting the white lamp 94a from the imaging device 931 is one of the marks 8U1, 8U2, and 8D1, 8D2, for example, 8U2 and 8D2 as shown in FIG. In the case of overlapping, the CPU 101 cannot normally recognize the marks 8U1, 8U2 and 8D1, 8D2. In this case, the CPU 101 controls the light sources 941 and 942 so that the illumination lamp is switched from the white lamp 94a to the red lamp 94b.
[0049]
The color of the light of the red lamp 94b that is switched on is a pair of two marks 8U1 and 8U2 that are colored with the same hue red. Is the same color as the color of Since the colors are similar, the marks 8U1 and 8U2 are mixed with the light color (background color) of the red lamp 94b having the same color as shown by the parallel oblique lines in FIG. Only the marks 8D1 and 8D2 on the other substrate are imaged as if they were raised from the background. The imaging pattern is supplied to and stored in the second frame memory 103 constituted by the RAM via the CPU 101 of the controller 10. Specifically, for example, the CPU 101 sets the imaging pattern captured by the imaging device 931 between the brightness corresponding to the red of the marks 8U1 and 8U2 and the brightness corresponding to the black of the marks 8D1 and 8D2. A binarized image pattern (FIG. 5 (b)) is generated by binarization processing with a binarization threshold (binarization threshold for separating the marks 8D1 and 8D2 from the marks 8U1 and 8U2 and the background image). The binarized image pattern is stored in the second frame memory 103. At this time, the color of light (background color) of the red lamp 94b is the same color as the red color of the marks 8U1 and 8U2, or a red color close thereto, so that the image pattern binarized with the binarization threshold value is the background. The portion and the marks 8U1 and 8U2 have the same color (white), the marks 8U1 and 8U2 are not displayed in the binarized image, and only the marks 8D1 and 8D2 are cut out.
[0050]
The CPU 101 calculates the intermediate position Pd of the marks 8D1 and 8D2 from the binarized image by calculation, and temporarily supplies the calculated position information (intermediate position Pd) to the memory 104 configured by the RAM.
[0051]
Next, the CPU 101 of the controller 10 uses the binarized image pattern shown in FIG. 4B of the first frame memory 102 and the binarization shown in FIG. 5B of the second frame memory 103. Each image pattern is read out, the two types of imaging patterns are compared, and the pattern of two pairs of marks 8U1 and 8U2 on the side colored in red as shown in FIG. Then, the intermediate position Pu is obtained from the calculated pattern, and is supplied and stored in the memory 104 constituted by the RAM.
[0052]
The pair of marks 8U1 and 8U2 obtained by the difference recognition processing calculation are marks colored in red. However, by the difference calculation processing, as shown in FIG. Only the overlapping portion is missing, and the intermediate position Pu is calculated without any trouble.
[0053]
Thereafter, the CPU 101 determines the intermediate point positions Pu and Pd stored in the memory 104 and the other imaging. machine Based on the intermediate point positions Pu and Pd obtained from the imaging pattern captured by 932, XY-θ movement so that the intermediate point positions Pu and Pd coincide with each other. table 95 is controlled to perform alignment.
[0054]
As described above, according to the superposition mechanism and superposition method of the substrate according to this embodiment, the positioning mark on one of the substrates is different in color from the positioning mark on the other substrate, that is, different. Since it is configured to be colored in lightness or hue, it can be switched so that a background of the same color as the colored color is obtained, and an imaging pattern is obtained, so even if parts of the mark overlap, it is calculated By processing, each pair of mark positions can be separated and extracted.
[0055]
As described above, according to the present invention, even if a part of the mark overlaps between the two substrates, the position correction operation can be performed efficiently and appropriate and smooth alignment can be automatically performed. .
[0056]
In the substrate overlapping mechanism and method according to the above-described embodiment, the lamp having the same color as the color of the colored mark is switched and lit on the light source. In short, the background of the color of the same color as the color of the colored mark is obtained. Therefore, the red lamp 94b is omitted and a so-called color filter that transmits only red is configured to be selectively inserted between the upper and lower sides of the substrates 8U and 8D. The same function and effect can be obtained.
[0057]
In addition, light sources 941 and 942 composed of a white lamp 94a and a red lamp (a lamp having the same color as the color of the colored mark on one substrate) 94b are arranged on the imaging device 931 and 932 side, and the lamps 94a and 94b are arranged. Similar functions and effects can be obtained even if the switch lights up. In this case, it is preferable that the background (the suction surface of the upper substrate 8U of the suction head 91) that is transmitted through the substrates 8U and 8D and captured by the imaging devices 931 and 932 has a white color or a color close to white. .
[0058]
Further, as means for separating the marks 8U1 and 8U2 on the upper substrate 8U and the marks 8D1 and 8D2 on the lower substrate 8D from the imaging patterns captured by the imaging devices 931 and 932, the colors of the marks 8U1 and 8U2 on the upper substrate 8U Although the example which uses the light and background of the same color was demonstrated, it is not restricted to this.
[0059]
Specifically, for example, first, the marks 8U1, 8U2 and 8D1, 8D2 are imaged by the imaging devices 931, 932 under illumination by a light source using a white lamp. The CPU 101 binarizes the imaging pattern captured by the imaging devices 931 and 932 with a binarization threshold value (first binarization threshold value) that separates the marks 8U1, 8U2, 8D1, and 8D2 from the background image. The binarized image pattern is generated by the digitizing process, and the marks 8U1, 8U2 and 8D1, 8D2 in the binarized image pattern are recognized.
[0060]
When proper recognition of all the marks 8U1, 8U2 and 8D1, 8D2 cannot be performed from the binarized image pattern, the binarization threshold value is set to the light amount level from the red marks 8U1, 8U2 and the black mark 8D1. , 8D2, the binarization threshold set between the light intensity levels, that is, the binarization threshold for separating the marks 8U1 and 8U2 and the background image from the marks 8D1 and 8D2 (second binarization threshold). Value). Then, the imaging pattern by the imaging devices 931 and 932 captured under the illumination of the white lamp is binarized again with the switched second binarization threshold, and only the marks 8D1 and 8D2 are cut out. Generate a digitized image. Thereby, only the marks 8D1 and 8D2 can be cut out from the image pickup patterns by the image pickup devices 931 and 932.
[0061]
Note that the images of the marks 8U1 and 8U2 are cut out in the first implementation. of Similar to the embodiment, it can be performed by the recognition processing calculation of the difference between the binarized image pattern by the first binarization threshold and the binarized image pattern by the second binarization threshold.
[0062]
Even with such means, even if the marks 8U1, 8U2 and 8D1, 8D2 partially overlap each other, the individual pairs of marks 8U1, 8U2, 8D1, 8D2 can be separated and extracted. Functions and effects similar to those of the embodiment can be obtained.
[0063]
In addition, the substrate overlapping mechanism and method of the present invention is a reflector that reflects a color of the same color as the colored color in order to obtain a background of a color similar to the color of the colored mark, that is, the above embodiment. Then, the same function and effect can be obtained even when the red color reflector is selectively inserted into the background and the image is picked up by illumination from the imaging devices 931 and 932 side. In this case, the red colored mark is made non-translucent, and the other mark used as a pair with this mark is formed in a color with high reflectance (for example, silver) and a color reflector is inserted in the background. When taking an image, light is emitted from the imaging device side, and when taking an image without inserting the color reflection plate in the background, light is preferably emitted from the side facing the imaging device with the substrate interposed therebetween.
[0064]
In each of the above descriptions, the light sources 941 and 942 are described as being installed on the suction head 91 side, and the imaging devices 931 and 932 are installed on the suction table 92 side. 942 can be installed on the suction table 92 side, and the imaging devices 931 and 932 can be installed on the suction head 91 side.
In addition, the upper substrate 8U side has been described to be lowered for the alignment of the upper substrate 8U and the lower substrate 8D, but of course the lower substrate 8U side may be raised, and the XY-θ moving table 95 is sucked. Although it is configured on the head 91 side, it may be configured on the suction table 92 side.
[0065]
In addition, although the example in which the color of the colored mark is red and the color of the other mark is black is used, the present invention is not limited to this, and it is sufficient that both marks are colored with different brightness or different hue. The color combination is free.
[0066]
Furthermore, although it has been described that lamps are used as the light sources of the light sources 941 and 942, it goes without saying that LEDs and other lighting fixtures can also be employed.
[0067]
In any case, according to the substrate of the present invention, the substrate overlaying mechanism using the substrate, and the overlaying method, either one of the pair of positioning marks is marked on the other substrate. Even if it overlaps with this, it can be separated and caught automatically, and the operation of overlaying the two substrates can be performed appropriately and automatically. Efficiency can be realized, and a remarkable effect can be obtained in practical use.
[0068]
【The invention's effect】
As described above, according to the present invention, the positioning of the two substrates to be superposed is performed smoothly and appropriately, and a large effect that can be obtained practically when employed in the manufacture of liquid crystal display panels and the like. It is.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a substrate according to the present invention.
2 is a plan view of a liquid crystal substrate laminating apparatus employed for laminating substrates shown in FIG. 1. FIG.
FIG. 3 is a main part configuration diagram of the laminating apparatus and the controller shown in FIG. 2;
4 is an explanatory diagram of an imaging pattern by an imaging device for a substrate irradiated on a white lamp shown in FIG. 3. FIG.
FIG. 5 is an explanatory diagram of an imaging pattern by the imaging device for the substrate irradiated on the red lamp shown in FIG. 3;
6 is a pattern diagram obtained by processing in the controller shown in FIG. 3. FIG.
FIG. 7 is a plan view showing a conventional substrate laminating apparatus.
8 is a plan view of a substrate used in the apparatus shown in FIG.
9 is a main part configuration diagram of the laminating apparatus and the controller shown in FIG. 7;
10 is an explanatory diagram of an imaging pattern by the imaging device shown in FIG. 9;
11 is an explanatory diagram of an imaging pattern by the imaging device shown in FIG. 9;
[Explanation of symbols]
1U Upper substrate
1D Lower substrate
2U, 2D supply mechanism
3 Transfer robot
4 laminating equipment
41 Suction head
42 Suction stage
431, 432 Imaging equipment (detection means)
44 XY-θ movement table (correction means)
5 Adhesive
6 Unloading stand
7 Controller
8U Upper board
8U1, 8U2 (for positioning) mark
8D Lower substrate
8D1, 8D2 (for positioning) marks
9 Laminating equipment
91 Suction head
92 Adsorption stage
931, 932 Imaging equipment (detection means)
941, 942 Light source
94a White lamp
94b Red lamp
95 XY-θ movement table (correction means)
10 Controller (detection means, correction means)
101 CPU
102 first frame memory
103 second frame memory
104 memory
Pu, Pd intermediate position

Claims (8)

It has translucency, each of the positioning marks is formed, and the mark formed on one of the substrates is different from the mark on the other substrate in a hue of a set of two substrates . A superposition mechanism ,
And superimposing means for the mark the two pair of substrates are formed on each substrate is superimposed to face,
A plurality of colors including the color of at least one mark of the two sets of substrates arranged on one side of the set of two substrates and superposed by the superimposing means or light of the same color as the mark . A light source configured to emit light freely;
An imaging device that is arranged on the other side of the set of two substrates and shoots the mark formed on the set of two substrates by transmitted light of the irradiation light from the light source;
Detecting means for detecting a positional deviation between the two substrates superimposed on the basis of an imaging pattern of each mark photographed by the imaging device;
A substrate superposition mechanism comprising: correction means for correcting a positional deviation between the two substrates detected by the detection means. It has translucency, each of the positioning marks is formed, and the mark formed on one of the substrates is different from the mark on the other substrate in a hue of a set of two substrates . A superposition mechanism ,
And superimposing means for the mark the two pair of substrates are formed on each substrate is superimposed to face,
A light source disposed on one side of the set of two substrates;
An imaging device that is arranged on the other side of the set of two substrates and shoots the mark formed on the set of two substrates by transmitted light of the irradiation light from the light source;
Inserted freely provided in between the light source and the imaging device, the superposed opposite the mark position of the two pair of substrates superimposed by means during insertion, at least of the two pair of substrates A color filter that transmits light of the color of one mark or the same type of color,
A detecting means for detecting a positional deviation between the basis of the imaging pattern of each mark taken by the image pickup device, superimposed the two substrates,
A substrate superposition mechanism comprising: correction means for correcting a positional deviation between the two substrates detected by the detection means. It has translucency, each of the positioning marks is formed, and the mark formed on one of the substrates is different from the mark on the other substrate in a hue of a set of two substrates . A superposition mechanism ,
And superimposing means for the mark the two pair of substrates are formed on each substrate is superimposed to face,
A light source disposed on one side of the set of two substrates;
An imaging device that is disposed on the same side as the light source and that captures the mark formed on the set of two substrates by reflected light of irradiation light from the light source;
It said insert freely provided by two other side of the pair of substrates, the superposed opposite the mark position of the two pair of substrates superimposed by means upon insertion, the two pair of substrates A color reflecting plate that reflects light of at least one mark color or the same type of color; and
A detecting means for detecting a positional deviation between the basis of the imaging pattern of each mark taken by the image pickup device, superimposed the two substrates,
A substrate superposition mechanism comprising: correction means for correcting a positional deviation between the two substrates detected by the detection means. The detection means includes a difference between an imaging pattern obtained by irradiating, transmitting, or reflecting light of at least one of the colors of the mark or the same color and an imaging pattern obtained by irradiating other light having a hue different from that of the color. the basis, superimposed the two mechanisms overlay substrate according to any one of claims 1 to 3, wherein the detecting the positional deviation between the substrate. Has translucency, marks for positioning are respectively formed, one of the marks formed on the substrate and marks of the other substrate, a set of two sheets of substrates formed by colored with different in hue A superimposing step of superimposing such that the marks formed on the respective substrates face each other,
From a light source arranged on one side of the two pair of substrates, including the superimposed color of at least one of the marks more superimposed the two pair of substrates to process or color of light in the same system An irradiation step of switching and irradiating light of a plurality of colors ;
A photographing step of photographing the mark formed on the set of two substrates with an imaging device arranged on the other side of the pair of substrates under the light irradiated by the irradiation step;
Based on the imaging pattern of each of the marks photographed in this photographing process, a detection process for detecting a positional deviation between the two substrates superimposed,
A correction process for correcting a positional deviation between the two substrates detected in the detection process;
A method for superimposing substrates, comprising: Has translucency, marks for positioning are respectively formed, one of the marks formed on the substrate and marks of the other substrate, a set of two sheets of substrates formed by colored with different in hue A superimposing step of superimposing such that the marks formed on the respective substrates face each other,
Irradiating light from a light source disposed on one side of the set of two substrates;
A photographing step of photographing the mark formed on the set of two substrates with an imaging device arranged on the other side of the pair of substrates under the light irradiated by the irradiation step;
At the time of this photographing process, a color filter that allows the color of at least one mark of the set of two substrates or the light of the same system color to pass between the light source and the imaging device is superposed by the superposition process. An insertion step of inserting the set of two sheets so as to face the mark position of the set of two substrates ;
A detection step of detecting the positional deviation between the basis of the imaging pattern of each mark taken by the image taking step, superimposed the two substrates,
A correction process for correcting a positional deviation between the two substrates detected in the detection process;
A method for superimposing substrates, comprising: Has translucency, marks for positioning are respectively formed, one of the marks formed on the substrate and marks of the other substrate, a set of two sheets of substrates formed by colored with different in hue A superimposing step of superimposing such that the marks formed on the respective substrates face each other,
Irradiating light from a light source disposed on one side of the set of two substrates;
Under the light irradiated by this irradiation step, a photographing step of photographing the mark formed on the set of two substrates with an imaging device arranged on the same side as the light source,
At the time of this photographing process, a color reflecting plate that reflects light of at least one mark color of the pair of substrates or the same type of color on the other side of the pair of substrates is the superimposing step. An insertion step of inserting the pair of the two sheets so as to face the mark position of the set of two substrates ,
A detection step of detecting the positional deviation between the basis of the imaging pattern of each mark taken by the image taking step, superimposed the two substrates,
A correction process for correcting a positional deviation between the two substrates detected in the detection process;
A method for superimposing substrates, comprising: The detection step is based on a difference between an image pickup pattern by irradiation, transmission, or reflection of light of at least one mark color or the same type of color and an image pickup pattern by other light having a hue different from that of the color. , superimposed manner superposition substrate according to any one of claims 5 to 7 and detecting the positional deviation between the two substrates.

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