JP4102990B2 - Bonding method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bonding method and apparatus for bonding components such as a semiconductor chip (laser diode, photodiode, IC chip) on a substrate.
[0002]
[Prior art]
Conventionally, a bonding apparatus for bonding a semiconductor chip such as a laser diode to a substrate is known (for example, Patent Document 1). In such a conventional bonding apparatus, the rear surface of the semiconductor chip is aligned with the bonding region on the upper surface of the substrate, and then the rear surface of the semiconductor chip is bonded to the front surface of the substrate.
By the way, when a light emitting element such as a laser diode is bonded to a substrate as a semiconductor chip, a characteristic portion such as a light emitting portion on the surface (upper surface) side of the light emitting element is aligned with a reference position on the upper surface of the substrate. (For example, Patent Document 2).
[Patent Document 1]
JP-A-6-61278
[Patent Document 2]
JP-A-9-312302
[0003]
[Problems to be solved by the invention]
However, in the bonding apparatus disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 9-312302), when the surface of the chip is held by a bonding tool, it is necessary to avoid a characteristic portion (predetermined location) on the surface of the chip. It was. In this case, if the peripheral part of the chip (adjacent part of the outline) is sucked and held, when the chip is pressed against the substrate with the bonding tool, a uniform load cannot be applied to the entire surface of the chip and heating is performed uniformly. There was also a problem that it was not possible. In addition, depending on the shape of the chip, it is necessary to replace the bonding tool in accordance with the shape of the chip, and when manufacturing the chip, it is necessary to adjust so that the characteristic part of the surface of the chip is located at a predetermined position. was there.
[0004]
[Means for Solving the Problems]
  In view of the circumstances described above, the first invention described in claim 1 is a bonding method for positioning and bonding a component such as a semiconductor chip at a predetermined position on the upper surface of the substrate.
A bonding tool that holds a component such as a semiconductor chip and joins it to a substrate, a bonding stage that supports the substrate, a first imaging means that moves downward together with the bonding tool, and an upper portion that moves together with the bonding stage A second imaging means arranged toward the camera, and a transparent table on which the components are placed and movable,
  The above partsTransparent tablePlaced on the surface of the partFrom the topTake a picture with one shooting means and back of the partsFrom the bottom2 Photographed by the photographing means, and based on the images on the front and back surfaces, the amount of deviation between the two surfaces was obtained,
  In addition, the first photographing means canFrom aboveTake a picture and find the position of the board,
  Next, the surface of the part is held by a bonding tool.In addition, the transparent table is moved to a position away from between the part and the second photographing means., The back of the parts at that time with the second photographing meansFrom belowThe surface of the component is positioned with respect to a predetermined position of the substrate by correcting the position obtained from the image on the back surface by the amount of deviation obtained previously.
  Claims3The second invention described in 1 is a bonding tool for holding and bonding a component such as a semiconductor chip to a substrate, a bonding stage for supporting the substrate,Moving means for relatively moving the bonding tool and the bonding stage;In a bonding apparatus that includes an imaging unit that images the component, and positions the component at a predetermined position on the substrate based on an image captured by the imaging unit and then bonds the component to the substrate.
  The above parts can be placedCan be moved withWhile providing a transparent table, the above photographing meansMove with the bonding tool by the moving meansFirst photographing means arranged downward,Move together with the bonding stage by the moving meansThe second photographing means arranged upward,
  The first photographing means includes a surface of a component placed on the transparent table and the aboveSupported on the bonding stageBoardFrom aboveThe second photographing means captures the back surface of the component placed on the transparent table and the back surface of the component held by the bonding tool.From belowShoot,
When the bonding tool holds the part, the transparent table moves to a position outside the part and the second photographing means.
  Based on the images of the front surface of the component imaged by the first imaging means and the back surface of the component imaged by the second imaging means, the amount of deviation in the horizontal direction of both surfaces is obtained,
  The bonding tool and the bonding stage are configured to move relative to each other and align and bond the predetermined position of the substrate and the surface of the component based on the shift amount.
  According to the first and second aspects of the invention, the amount of deviation between the front and back surfaces of a component such as a semiconductor chip is obtained, and then the surface of the component is positioned at a predetermined position on the substrate in consideration of the amount of deviation. To do. Therefore, the surface of a component such as a semiconductor chip can be accurately positioned at a predetermined position on the substrate.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to the illustrated embodiments. In FIG. 1, reference numeral 1 denotes a bonding apparatus for bonding a thin semiconductor chip 3 to a substrate 2.
As shown in a plan view in FIG. 2, the substrate 2 is formed in a thin plate shape and a square, and is formed as a joining region 2A that coincides with the shape of the chip 3 with C1 as the center, and solder is supplied thereto in advance. In addition, circle and square marks m1 and m2 are provided at predetermined positions on the diagonal line across the center C1.
On the other hand, as shown in FIGS. 3 to 6, the chip 3 of this embodiment is formed in a thin square plate smaller than the substrate 2. The front surface 3A and the back surface 3B of the chip 3 have the same shape and dimensions, and are formed so as to be parallel to each other. However, since the front surface 3A and the back surface 3B of the chip 3 are difficult to manufacture completely without misalignment in the current manufacturing technology of the chip 3, as shown in FIGS. In 3B, there is a slight misalignment of about several μm in the direction in which both surfaces extend (horizontal direction). As shown in FIG. 3, in this embodiment, the surface 3A of the chip 3 is provided with circle and square marks M1 and M2 at predetermined positions on the diagonal line. As will be described in detail later, in this embodiment, the marks m1 and m2 attached to the substrate and the marks M1 and M2 attached to the chip are provided for alignment. In this embodiment, alignment marks are attached to the upper surface of the substrate 2 and the surface 3A of the chip 3. However, without such a mark, the corners of the opposing corners of the substrate 2 and the chip 3 are attached. The misalignment amount may be obtained by using an appropriate portion such as a circuit or a mounted component provided on the edge or the surface.
[0006]
The bonding apparatus 1 is arranged on the lower side and movable in the horizontal direction, a bonding stage 5 provided on the movable table 4, and arranged on the upper side of the movable table 4 to hold the chip 3. Then, a bonding tool 6 that is pressed and bonded to the substrate 2 and a lifting mechanism 7 that lifts and lowers the bonding tool 6 and its casing 17 in the vertical direction (Z direction) are provided.
The movable table 4 includes a lower stage 11 that is moved by a motor 8 in the X direction on a horizontal plane, and an upper stage 13 that is placed on the upper surface of the lower stage 11 and is movable by a motor 12 in the Y direction perpendicular to the X direction. And. The bonding stage 5 is fixed horizontally at a predetermined position on the upper stage 13.
The operations of the motors 8 and 12 are controlled by a control device (not shown). By controlling the operation of the motors 8 and 12, the control device can move the substrate 2 placed on the bonding stage 5 relative to the bonding tool 6 in the X direction and the Y direction. ing.
A plurality of supply trays 14 are placed at a supply position A on the upper stage 13. An operator supplies the supply tray 14 in a state where a large number of chips 3 are arranged and accommodated to the supply position A.
[0007]
On the other hand, the substrates 2 are set one by one by an operator on the substrate holding portion provided at the center of the upper surface of the bonding stage 5. As will be described later, when the chip 3 held by the bonding tool 6 is positioned in the bonding region 2A of the substrate 2 and bonding is completed, the operator ejects the bonded substrate 2 from the bonding stage 5, while the new substrate 2 is discharged. Is supplied onto the bonding stage 5.
Further, a lower camera 15 for chip photography is attached to a predetermined position of the upper stage 13 so as to face vertically upward. The lower camera 15 photographs the back surface 3B (lower surface) of the chip 3 placed on a transparent glass plate 16 to be described later, and photographs the back surface 3B of the chip 3 held by the bonding tool 6. Data of an image photographed by the lower camera 15 is transmitted to a control device (not shown).
[0008]
Next, the bonding tool 6 and its casing 17 are moved up and down by a predetermined amount in the vertical direction (Z direction) by the lifting mechanism 7. The bonding tool 6 is linked to a motor 18 attached to the casing 17 with the drive shaft directed vertically downward. As a result, the bonding tool 6 is rotated in the θ direction by the motor 18 with the axis C4 in the vertical direction as the center of rotation. Therefore, by controlling the operation of the lifting mechanism 7 and the motor 18 by the control device, the bonding tool 6 is raised and lowered with respect to the substrate 2 on the bonding stage 5 and the chip 3 is held on the bonding tool 6. The chip 3 can be rotated with respect to the substrate 2.
A suction hole is opened at the center of the lower surface serving as the tip of the bonding tool 6, and a negative pressure passage is formed in the casing 17 continuously from the hole. When the control device brings the lower surface of the bonding tool 6 close to the chip 3 by the lifting mechanism 7 when necessary, the negative pressure is introduced from the negative pressure source into the negative pressure passage so that the chip 3 is sucked and held by the bonding tool 6. It can be done. Further, the control device releases the holding state of the chip 3 by the bonding tool 6 by stopping the introduction of the negative pressure into the negative pressure passage.
[0009]
The bonding tool 6 is provided with a heating means in the casing 17, and the bonding tool 6 can be heated by the control device operating the heating means when necessary.
Then, the chip 3 is sucked and held by the bonding tool 6, the bonding tool 6 is lowered by the elevating mechanism 7, the chip 3 held by the bonding tool 6 is pressed against the substrate 2, and the bonding tool 6 is heated. The solder in the joining region 2 is melted to join the chip 3 to the substrate 2.
The basic configuration of such a bonding tool 6 is the same as that of a conventionally known one disclosed in, for example, Patent Document 2, and therefore a detailed description regarding the configuration of the bonding tool 6 is omitted.
Further, an upper camera 21 for photographing the substrate 2 and the chip 3 is attached to the side portion of the casing 17 in a vertically downward direction. The upper camera 21 can photograph the substrate 2 or the chip 3 from the upper side, and image data photographed by the upper camera 21 is transmitted to the control device.
The control device controls the operation of the motors 12 and 8 of the movable table 4 so that the substrate 2 on the bonding stage 5 or the chip 3 on the supply tray 14 can be positioned below the upper camera 21. As a result, the substrate 2 on the bonding stage 5 and the chip 3 on the supply tray 14 are photographed by the upper camera 21, so that the control device determines the position of the substrate 2 or chip 3 in the XY direction and the tilt angle in the θ direction. Be able to. Note that photographing when the chip 3 is taken out from the supply tray 14 by the bonding tool 6 can be omitted depending on the accommodation state of the chip 3.
[0010]
As described above, the present embodiment pays attention to the positional deviation between the front surface 3A and the back surface 3B at the time of manufacturing the chip 3, and accurately connects the front surface 3A of the chip 3 to the bonding region 2A of the substrate 2. It can be positioned.
That is, as shown in FIG. 1, an air cylinder 22 is horizontally fixed to the upper stage 13 of the movable table 4, and a circular transparent glass plate 16 is horizontally attached to the piston of the air cylinder 22. In the non-operating state of the air cylinder 22, the glass plate 16 is located at the retracted end position shown by the solid line in FIG. On the other hand, when the air cylinder 22 is actuated when necessary by the control device, the glass plate 16 moves forward to the forward end position indicated by the imaginary line in FIG. The forward end position of the glass plate 16 is positioned directly above the lower camera 15. A straight line parallel to the XY direction orthogonal to the center C6 is displayed on the upper surface of the glass plate 16.
[0011]
In this embodiment, when the chip 3 on the supply tray 14 is sucked and held by the bonding tool 6 and taken out from the supply tray 14, the chip 3 is first mounted on the glass plate 16 instead of being immediately bonded to the substrate 2. I try to put it.
That is, when the chip 3 on the supply tray 14 is sucked and held by the bonding tool 6, the control device operates the movable table 4 to position the lower camera 15 at a position directly below the bonding tool 6. Since the bonding tool 6 holding the chip 3 is supported at a position higher than the glass plate 16, the air cylinder 22 is operated so that the glass plate 16 is positioned at the forward end and is held by the bonding tool 6. The glass plate 16 is positioned directly below the chip 3. Thereafter, the control device lowers the bonding tool 6 by the lifting mechanism 7 and releases the holding state of the chip 3 by the bonding tool 6, so that the chip 3 is placed on the glass plate 16. .
After that, the control device operates the movable stage 4 to place the glass plate 16 at a position directly below the upper camera 21, so that the chip 3 placed on the glass plate 16 has the upper camera 21 and the lower camera 15. It will be located between.
In this state, the center C6 of the glass plate 16 is simultaneously photographed by both the cameras 21 and 15. Then, the control device obtains the positional relationship between the cameras 21 and 15 in the XYθ directions based on the image data of the cameras 21 and 15.
[0012]
In the present embodiment, the control device, based on the image data of the front surface 3A of the chip 3 photographed by the upper camera 21 and the image data of the rear surface 3B of the chip 3 obtained by the lower camera 15, as described later. The amount of horizontal displacement between the front surface 3A and the back surface 3B is obtained. It should be noted that by making the optical axes of the upper camera 21 and the lower camera 15 coincide with each other at the time of shooting, the amount of deviation between the front surface 3A and the rear surface 3B of the chip 3 can be easily calculated.
Then, when the control device obtains the positional deviation amount between the front surface 3A and the rear surface 3B, when positioning the chip 3 in the bonding region 2A of the substrate 2, the front surface 3A of the chip 3 is placed on the substrate 2 in consideration of the positional deviation amount. Positioning is performed so as to coincide with the joining region 2A.
[0013]
In the above configuration, the bonding apparatus 1 performs the following process to position the chip 3 on the substrate 2 on the bonding stage 5 before bonding.
That is, in FIGS. 1 and 12, first, the optical axes of the upper camera 21 and the lower camera 15 are matched so that the relative positions of the upper camera 21 and the lower camera 15 in the X direction and the Y direction can be grasped first. .
Specifically, the control device operates the air cylinder 22 to position the glass plate 16 at the forward end position, position the lower camera 15 immediately below the glass plate 16, and move the movable table 4 in the XY directions. Thus, the upper camera 21 is positioned directly above the glass plate 16. In this state, the glass plate 16 is simultaneously photographed by the upper camera 21 and the lower camera 15 which are in the vertical position with the glass plate 16 interposed therebetween, and the control device takes both cameras 21 based on the image data of both the cameras 21 and 15. , 15 in the XY direction. The optical axis of the upper camera 21 is made to coincide with the center C6 of the glass plate 16. It is assumed that the optical axis of the lower camera 15 coincides with the center C6 of the glass plate 16. If the optical axis of the lower camera 15 is deviated from the center C6 of the glass plate 16, alignment is performed in the subsequent process in consideration of this deviation amount. (S1 in FIG. 12).
At this time, the substrate 2 has already been supplied to the central portion of the bonding stage 5 by the operator. A plurality of supply trays 14 are supplied to the supply position A.
[0014]
Next, the control device moves the movable table 4 in the X direction and the Y direction, positions one of the supply trays 14 at a position below the upper camera 21, and images the supply tray 14 with the upper camera 21. Accordingly, the control device recognizes the position of one chip 3 accommodated in the supply tray 14 based on the image from the upper camera 21 (S2 in FIG. 12).
Thereafter, the control device moves the movable table 4 in the XY directions so that the specific chip 3 on the supply tray 14 is positioned immediately below the bonding tool 6. Thereafter, the controller lowers the bonding tool 6 by the elevating mechanism 7 until the distance between the tip of the bonding tool 6 and the chip 3 reaches a required distance, and introduces negative pressure to the bonding tool 6. As a result, one chip 3 on the supply tray 14 is sucked and held by the bonding tool 6 (S3 in FIG. 12). Note that the bonding tool 6 is raised after the removal.
Thereafter, the control device moves the movable table 4 so that the substrate 2 on the bonding stage 5 is positioned immediately below the upper camera 21. Then, the substrate 2 is photographed by the upper camera 21, and the control device recognizes the positions in the X direction, Y direction, and θ direction of the center C1 of the bonding region from the positions of the marks m1, m2 on the substrate 2 (FIG. 12 S4).
Then, the control device moves the movable table 4 to position the glass plate 16 directly below the bonding tool 6, and lowers the bonding tool 6 by a lifting mechanism 7 by a required amount. Release the holding state. Thereby, the chip | tip 3 is mounted on the glass plate 16 (S5 of FIG. 12).
[0015]
Next, the movable table 4 is moved by the control device so that the glass plate 16 and the chip 3 placed thereon are positioned immediately below the upper camera 21, and the optical axis of the upper camera 21 is set to the optical axis of the lower camera. To match. As a result, the chip 3 to be photographed exists between the upper camera 21 and the lower camera 15.
In this state, the chip 3 on the glass plate 16 is photographed by the upper camera 21 and at the same time, the chip 3 is photographed through the glass plate 16 by the lower camera 15.
FIG. 7 shows image data of the front surface 3A of the chip 3 photographed by the upper camera 21, and FIG. 8 shows image data of the back surface 3B of the chip 3. 9 to 11 are reference diagrams for explaining the processing steps by the control device.
Here, the control device first recognizes the positions of the marks M1 and M2 in the X and Y directions based on the image data of the surface 3A shown in FIG. 7, and based on that, the position of the center C2 of the surface 3A and the marks M1 and M2 An inclination angle in the θ direction is obtained from the direction of a virtual straight line connecting the two.
Then, the control device calculates the amount of displacement ΔAx, ΔAy in the XY direction with respect to the center 21C of the upper camera 21 with respect to the center C2 of the surface 3A (see S6 in FIGS. 7, 9, and 12). The angle θ in the θ direction_AAlso calculate.
[0016]
Next, the control device obtains the position and inclination angle of the center C3 of the back surface 3B based on the image data of the lower camera 15 shown in FIG. In this embodiment, as shown on the right side of FIG. 8, corner patterns P1 and P2 at opposite positions on the back surface 3B are previously stored in the control device, and these patterns P1 and P2 are stored as image data. By applying to the corresponding corners in FIG. 5, the inclination angle in the θ direction is obtained from the direction of the imaginary straight line connecting the position of the center C3 of the back surface 3B and the apex of the corners. Then, the control device calculates positional deviation amounts ΔBx and ΔBy in the XY direction with respect to the center 15C of the lower camera 15 with respect to the center C3 of the back surface 3B (S7 in FIGS. 8, 9, and 12). The angle θ in the θ direction_BAlso calculate.
Next, as illustrated in FIG. 9, the control device subtracts the positional deviation amount ΔBx (for example, +5 μm) on the back surface side from the positional deviation amount ΔAx (for example, +20 μm) on the front surface 3A side, so that the front surface 3A and the back surface 3B. The positional deviation amount X1 (15 μm) in the X direction is calculated. Similarly, the control device detects the positional deviation amount Y1 in the Y direction between the front surface 3A and the rear surface 3B and the angular deviation amount θ1 (θ in the θ direction)._A―Θ_B) Is obtained (see S8 in FIGS. 9 and 12).
In this embodiment, first, the positional deviation amounts X1 and Y1 and the angular deviation amount θ1 between the front surface 3A and the rear surface 3B of the chip 3 placed on the glass plate 16 are obtained.
[0017]
Next, the control device moves the movable stage 4 to position the bonding tool 6 at a position directly above the chip 3 so as to coincide with the optical axis 15C of the lower camera, and then lowers the bonding tool 6 by the lifting mechanism 7. The surface 3A of the chip 3 on the glass plate 16 is sucked and held (S9 in FIG. 12).
Here, the position of the chip 3 with respect to the optical axis 15C of the lower camera is different between FIG. 9 and FIG. 10 because the tip of the bonding tool 6 and the chip 3 are not contacted and slightly separated at the time of chip adsorption. This is due to the occurrence of deviation.
Next, the control device moves the glass plate 16 to the retracted end position (FIG. 10). In this state, the lower camera 15 photographs the chip 3 held by the bonding tool 6 from the lower side. Next, the control device determines how much the center C2 of the surface 3A of the chip 3 is displaced in the XY direction from the axis C4 of the bonding tool 6 based on the image data from the lower camera 15 as follows. (S10 in FIGS. 10 and 12).
That is, in the X direction shown in FIG. 10, how much the center C3 of the back surface 3B is displaced in the X direction with respect to the center of the lower camera 15 or the axis C4 of the bonding tool 6 is shown in S8 of FIG. The same processing is performed to obtain. As shown in FIG. 10, if this value is, for example, 6 μm, the displacement amount X1 in the X direction between the front surface 3A and the back surface 3B has been determined to be 15 μm first, so it is determined by subtracting 6 μm from 15 μm. Further, 9 μm is the positional deviation amount X2 in the X direction of the center C2 of the surface 3A with respect to the axis C4 of the bonding tool 6.
[0018]
Similarly, the control device obtains a positional deviation amount Y2 in the Y direction of the center C2 of the surface 3A with respect to the axis C4 of the bonding tool 6. Further, an angle θ2 in the θ direction of the surface 3A is also obtained.
In this embodiment, the surface 3A of the chip 3 is aligned with the bonding region 2A of the substrate 2 on the bonding stage 5 and the chip 3 is bonded to the substrate 2. This is performed based on the image data of the back surface 3B taken by the lower camera 15 with respect to the joining region 2A.
Therefore, since the control device first obtains the position of the bonding region 2A of the substrate 2 by the upper camera 21, so that the center C2 of the surface 3A of the chip 3 coincides with the center C1 of the bonding region 2A. While the movable table 4 is moved, the bonding tool 6 is driven by the motor 18 so that the virtual straight line connecting the marks M1 and M2 provided on the surface of the chip 3 coincides with the virtual straight line connecting the marks m1 and m2 of the bonding area 2A of the substrate 2. Is slightly rotated (S11 in FIGS. 11 and 12).
Thereby, as shown in FIG. 11, the surface 3A of the chip 3 and the bonding region 2A of the substrate 2 coincide with each other to complete the positioning.
[0019]
In this way, when the alignment of the surface 3A of the chip 3 with respect to the bonding region 2A of the substrate 2 is completed, the control device lowers the bonding tool 6 by a required amount by the lifting mechanism 7 and holds the chip held on the bonding tool 6 3 is pressed against the bonding region 2A of the substrate 2 and simultaneously heated by the bonding tool 6. As a result, the solder on the substrate 2 is melted and the chip 3 is bonded to the bonding region of the substrate 2 (S12 in FIG. 12).
Thereafter, the control device releases the holding state of the chip 3 by the bonding tool 6 and moves up.
In this manner, the surface of the chip 3 is positioned with respect to the bonding region 2A of the substrate 2 on the bonding stage 5 so that the chip 3 is bonded to the substrate 2.
Thereafter, one chip 3 is bonded to one substrate 2 by repeating the processing steps described above.
[0020]
As described above, in this embodiment, first, the positional deviation amounts X1 and Y1 and the angular deviation amount θ1 of the front surface 3A and the rear surface 3B of the chip 3 in the XY direction are obtained. The positional deviation amounts X2, Y2 and the inclination angle θ2 of the center of the surface 3A with respect to the axis C4 of the bonding tool 6 at the time of holding are obtained, and the deviation amounts of X2, Y2, and the angle are eliminated. The surface 3A is positioned on the substrate 2. In addition, after the optical axes of the upper camera 21 and the lower camera 15 are matched in advance, the front surface 3A and the rear surface 3B of the chip 3 are photographed by both the cameras 21 and 15. Therefore, the surface 3A can be positioned very accurately in units of several μm with respect to the bonding region 2A of the substrate 2.
In the above-described embodiment, the chip 3 placed on the glass plate 16 is photographed at the same time on the front surface 3A and the back surface 3B by the cameras 21 and 15 in the vertical position. It is also possible to photograph the front surface 3A and the back surface 3B. In other words, by arranging one camera on the extension of the air cylinder 22 at the same height as the glass plate 16 and arranging a total of six reflecting mirrors between the glass plate 16 and the camera in three pairs of upper and lower sides. The front surface 3A and the back surface 3B of the chip 3 can be photographed simultaneously with a single camera.
Further, in order to photograph the front surface 3A and the back surface 3B of the chip 3, a pair of upper and lower photographing cameras for the chip 3 may be arranged separately from the both cameras 21 and 15. That is, in this case, four cameras are provided.
Further, in the above embodiment, the substrate 2 placed on the bonding stage 5 is photographed by the upper camera 21. However, if the substrate 2 can be accurately set at a predetermined position on the bonding stage 5, the upper camera The imaging of the substrate 2 by 21 can be omitted.
Further, the supply of the supply tray 14 of the chips 3, the supply of the substrate 2 to the bonding stage 5, and the discharge operation of the substrate 2 after the bonding process may be processed by a robot, for example.
Further, the glass plate 16 may be disposed on a stage provided separately from the movable table 4 without being attached to the upper stage 13 of the movable table 4.
Furthermore, in order to transfer the chip 3 from the supply tray 14 to the glass plate 16, a transfer device different from the bonding tool 6 may be provided.
[0021]
【The invention's effect】
As described above, according to the present invention, there is an effect that the surface of a component such as a semiconductor chip can be accurately positioned at a predetermined position on the substrate.
[Brief description of the drawings]
FIG. 1 is a perspective view of a bonding apparatus showing an embodiment of the present invention.
FIG. 2 is an enlarged plan view of a substrate 2 shown in FIG.
3 is an enlarged plan view of a surface 3A of a chip 3 shown in FIG.
4 is a side view as seen from the direction of arrow IV in FIG. 3. FIG.
FIG. 5 is an enlarged bottom view of the back surface 3B of the chip 3 shown in FIG.
6 is a side view seen from the direction of arrow VI in FIG. 3;
7 is a view showing image data of the chip 3 taken by the upper camera 21 of FIG. 1. FIG.
8 is a view showing image data of the chip 3 taken by the lower camera 15 of FIG.
FIG. 9 is a view showing a processing step by a control device of the bonding apparatus shown in FIG. 1;
FIG. 10 is a view showing a processing step by a control device of the bonding apparatus shown in FIG. 1;
FIG. 11 is a view showing a processing step by the bonding apparatus shown in FIG. 1;
12 is a view showing a processing step by the bonding apparatus shown in FIG. 1;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Bonding apparatus 2 ... Board | substrate
3 ... chip 3A ... surface
3B ... Back 6 ... Bonding tool
15 ... Lower camera 16 ... Glass plate
21 ... Upper camera

Claims (3)

In a bonding method of positioning and bonding a component such as a semiconductor chip at a predetermined position on the upper surface of the substrate,
A bonding tool that holds a component such as a semiconductor chip and joins it to a substrate, a bonding stage that supports the substrate, a first imaging means that moves downward together with the bonding tool, and an upper portion that moves together with the bonding stage A second imaging means arranged toward the camera, and a transparent table on which the components are placed and movable,
The component is placed on a transparent table , the surface of the component is photographed from above by the first photographing means, and the back surface of the component is photographed from below by the second photographing means, and images of the front and back surfaces are also obtained. And calculate the amount of deviation on both sides,
Also, the position of the substrate obtained by photographing the substrate from above by the first photographing means,
Next, the surface of the component is held by a bonding tool, and the transparent table is moved to a position that is out of the space between the component and the second photographing means, and the back surface of the component at that time is moved by the second photographing means. A bonding method characterized in that the surface of the component is positioned with respect to a predetermined position of the substrate by photographing from below and correcting the position obtained from the image on the back surface by the amount of deviation obtained previously. Bonding method according to claim 1, wherein the benzalkonium be photographed simultaneously by both acquisition means from by matching the optical axis of the components on the transparent table of said first imaging means and second imaging means. A bonding tool for holding and bonding a component such as a semiconductor chip to a substrate; a bonding stage for supporting the substrate; a moving means for moving the bonding tool and the bonding stage relative to each other; and a photographing means for photographing the component. In the bonding apparatus for bonding to the substrate after positioning the component at a predetermined position on the substrate based on the image photographed by the photographing means,
A transparent table on which the component can be placed and moved is provided, and the photographing means is moved together with the bonding tool by the moving means, and the first photographing means arranged downward and moved together with the bonding stage by the moving means. is composed of a second imaging means disposed upward to,
The first photographing means photographs the surface of the component placed on the transparent table and the substrate supported on the bonding stage from above, and the second photographing means comprises the rear surface of the component placed on the transparent table and a bonding tool. shooting back surface of the retained parts from below,
When the bonding tool holds the part, the transparent table moves to a position outside the part and the second photographing means.
Based on the images of the front surface of the component imaged by the first imaging means and the back surface of the component imaged by the second imaging means, the amount of deviation in the horizontal direction of both surfaces is obtained,
A bonding apparatus characterized in that the bonding tool and the bonding stage are relatively moved so as to align and bond the predetermined position of the substrate and the surface of the component based on the amount of deviation.

Images