JP4147963B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
In the electronic component mounting apparatus, the mounting operation of holding the electronic component taken out from the electronic component supply unit by the mounting head and mounting it on the substrate is repeatedly performed. In this mounting operation, it is required to accurately align the electronic component with the substrate. Therefore, the position of the electronic component held by the mounting head and the mounting point on the substrate is optically detected, and this position detection is performed. A method of performing relative alignment between the electronic component and the substrate based on the result is widely used.
[0003]
This optical position detection is performed by performing an image recognition process on two images obtained by imaging the electronic component and the substrate with a camera. In this image recognition, the mounting point of the electronic component and the board is recognized from different images. Therefore, in order to match the mounting point of the electronic component board with the board with high accuracy, the two images on the optical coordinate system are used. It is important that the relative positional relationship is obtained correctly.
[0004]
For this reason, a camera with a bi-directional visual field in which a camera for recognizing a substrate whose imaging visual field direction is downward and an electronic component recognition camera whose imaging visual field direction is upward is integrated is used (for example, Patent Document 1). reference). When using this camera, in general, the camera is advanced to the space between the mounting head and the substrate with the mounting head holding the electronic components positioned on the substrate, and is held by the mounting point of the substrate and the mounting head. Capture images of both electronic components simultaneously. Thus, the relative positional relationship between the upper imaging field and the lower imaging field is always maintained, and highly accurate position detection is realized.
[0005]
[Patent Document 1]
JP 2001-77592 A
[0006]
[Problems to be solved by the invention]
However, in the above-described prior art, there is a limit to shortening the tact time of the mounting operation due to the restriction that the camera needs to be positioned between the substrate and the mounting head. That is, since the position detection described above is performed for each individual electronic component mounted by the mounting head, in the mounting operation of one electronic component, the camera is advanced to just below the mounting head for image capture. Then, in order to avoid interference with the descending operation of the mounting head after the image is captured, it is necessary to perform the operation of retracting the camera from the substrate each time.
[0007]
Further, when the mounting operation holding the electronic component is to perform the mounting operation on the substrate, it is desirable to set the height of the mounting head as small as possible to shorten the operation time. However, since it is necessary to secure a clearance for allowing the camera to advance as described above, the amount of lowering of the mounting head in the mounting operation cannot be reduced. Thus, in the conventional electronic component mounting apparatus, it is difficult to achieve both good mounting position accuracy and highly efficient component mounting work.
[0008]
Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can achieve both good mounting position accuracy and highly efficient component mounting work.
[0009]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 includes a holding unit that holds a substrate; , Electric An electronic component supply means for supplying the child component; Supplied from electronic component supply means Hold electronic components by suction Multiple Mount nozzle Prepared Mounted head And before Mounting head Move A mounting head moving mechanism to be moved, Equipped with camera With observation head ,in front Move the observation head View Observation head moving mechanism, Movement of the mounting head by control of the mounting head moving mechanism, movement of the observation head by control of the observation head moving mechanism, suction of electronic components by the mounting head, and imaging by the observation head Control means, The control means, after moving the mounting head having a plurality of electronic components suctioned and held by the plurality of mounting nozzles above the substrate, advances the observation head into the space between the mounting head and the substrate, While the plurality of electronic components sucked and held by the plurality of mounting nozzles are temporarily positioned sequentially above the corresponding electronic component mounting portions on the substrate, the temporarily positioned electronic components and the corresponding electronic component mounting portions are moved by the observation head. After imaging and retracting the observation head from the space, each electronic component is handled based on the relative positional relationship with the electronic component mounting portion for all electronic components obtained from the image obtained by the imaging. Sequential positioning and mounting on the electronic component mounting part .
[0014]
Claim 2 The electronic component mounting apparatus according to claim 1 is the electronic component mounting apparatus according to claim 1, The control means moves the mounting head. Adsorption holding on the plurality of mounting nozzles Each made Electronic components Corresponding Above the electronic component mounting part Provisional A temporary positioning operation processing unit for positioning; When each electronic component is temporarily positioned above the corresponding electronic component mounting unit by the temporary positioning operation processing unit The position of the mounting head as a temporary positioning position Of the electronic component when temporarily positioned and the electronic component mounting portion corresponding to the electronic component. Temporary positioning position storage unit for storing each set, and the observation head By Imported electronic components And corresponding to its electronic components From the image of the electronic component mounting part Corresponding to electronic components and electronic components With electronic component mounting Relative positional relationship Relative positional relationship calculation processing unit for each pair and relative positional relationship calculation processing unit Leave I was asked The relative positional relationship between the electronic component and the electronic component mounting portion corresponding to the electronic component Is stored in the relative positional relationship storage unit, the temporary positioning position storage unit, and the relative positional relationship storage unit. Above Per pair Above Temporary positioning position and For each group Above Relative positional relationship Based on said mounting head On the board An alignment information calculation unit for calculating alignment information for positioning; Calculated by the alignment information calculator Based on the alignment information Move the mounting head, A mounting operation processing unit for sequentially positioning and mounting the electronic component on the corresponding electronic component mounting unit.
[0019]
Claim 3 The electronic component mounting apparatus according to claim 1 is the electronic component mounting apparatus according to claim 1, The control means moves the mounting head. Adsorption holding on the plurality of mounting nozzles Each made Electronic components Corresponding Above the electronic component mounting part Provisional Temporary positioning operation processing unit for positioning ,in front Observation head By Imported electronic components And corresponding to its electronic components Image of electronic component mounting part Power Child parts and Corresponding to the electronic component With electronic component mounting Relative positional relationship The Temporarily positioned electronic component and the electronic component mounting part corresponding to the electronic component A relative positional relationship calculation processing unit for each pair; When each electronic component is temporarily positioned above the corresponding electronic component mounting unit by the temporary positioning operation processing unit The position of the mounting head; The relative positional relationship between the electronic component obtained in the relative positional relationship processing unit and the electronic component mounting unit corresponding to the electronic component Based on said mounting head On the board An alignment information calculation unit for calculating alignment information for positioning; A Calculation information section In Calculation Said An alignment information storage unit for storing alignment information for each set; , Stored in the alignment information storage unit Based on alignment information Move the mounting head, A mounting operation processing unit for sequentially positioning and mounting the electronic component on the corresponding electronic component mounting unit.
[0020]
Claim 4 The electronic component mounting apparatus described in claim 1 to 3 The electronic component mounting apparatus according to claim 1, Changing the distance between the mounting head and the holding portion Interval change means And the control means controls the distance changing means to narrow the distance between the mounting head and the holding portion after the observation head is retracted from the space. .
[0021]
Claim 5 The electronic component mounting apparatus described in claim 1 to 4 The electronic component mounting apparatus according to claim 1, Above Horizontal space of holding part But A retracted position of the observation head; Has become .
[0022]
Claim 6 The electronic component mounting apparatus described in claim 1 to 5 In the electronic component mounting apparatus described above, the observation head includes an electronic component camera for observing the electronic component and a substrate camera for observing the electronic component mounting portion of the substrate.
[0023]
Claim 7 The electronic component mounting apparatus described in claim 1 to 6 The electronic component mounting apparatus according to claim 1, wherein the optical path of the electronic component camera and the board camera are provided horizontally, and the optical path of the electronic component camera is directed upward. Before A prism for directing the optical path of the substrate camera downward is provided.
[0024]
Claim 8 The electronic component mounting method described is Multiple supplied electronic components Mounted head Prepare for Multiple mounted noses Le Adsorption holding And the step of moving the mounting head above the substrate, the step of moving the observation head into the space between the mounting head moved above the substrate and the substrate, and the plurality of mounting nozzles attracted and held. A step of temporarily positioning a plurality of electronic components above the corresponding electronic component mounting portion on the substrate while imaging the temporarily positioned electronic component and the electronic component mounting portion corresponding to the electronic component with the observation head; and After imaging, the observation head is retracted from the space, and the electronic components corresponding to each electronic component are based on the relative positional relationship with the electronic component mounting unit for all electronic components obtained from the image obtained by the imaging. The process of positioning and mounting sequentially on the component mounting part Including.
[0025]
According to the present invention, in the electronic component mounting in which the electronic component is sucked and held in each of the plurality of mounting nozzles provided in the mounting head and mounted on the electronic component mounting portion of the substrate, the temporarily positioned electronic component and the electronic component mounting portion The electronic head and the electronic component mounting part are observed by the observation head located in the space between the two, and the relative position detection for obtaining the relative positional relationship between the two is performed for all the electronic components held by the mounting nozzle. Reflecting the calculated relative position relationship, positioning the electronic component on the electronic component mounting part and sequentially mounting the electronic component on all the electronic components will result in good mounting position accuracy and highly efficient component mounting work. Both can be achieved.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a plan view of the electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 3 is the first embodiment of the present invention. FIG. 4 is a functional explanatory diagram of the observation head of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIGS. 5 and 6 are electronic component mounting apparatuses according to the first embodiment of the present invention. FIG. 7 is a perspective view of an inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 8 is an electronic component according to the first embodiment of the present invention. FIG. 9 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 10 is an electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 11 is a functional block diagram showing processing functions in the standard mode. FIG. 12, FIG. 13, FIG. 14 and FIG. 15 are process explanatory diagrams of the electronic component mounting method (standard mode) according to the first embodiment of the present invention. 16 is a functional block diagram showing processing functions in the high precision mode of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 17 is an electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention. ), FIG. 18, FIG. 19, FIG. 20, FIG. 21 and FIG. 22 are process explanatory views of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention.
[0027]
In this specification, a carrier member (conveying jig) in which a plurality of individual substrates are set is also considered as a “substrate”. In this case, the electronic component mounting portion formed on the individual substrate set on the carrier member is referred to as an “electronic component mounting portion formed on the substrate”.
[0028]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. 2 shows an AA arrow view in FIG. 1, and FIG. 3 shows a BB arrow view in FIG. In FIG. 1, an electronic component supply unit 2 is disposed on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 to which the adhesive sheet 5 is attached.
[0029]
A semiconductor chip 6 (hereinafter simply abbreviated as “chip 6”), which is an electronic component, is attached to the adhesive sheet 5 in a state of being separated into individual pieces. A plurality of bumps 6 a (see FIG. 8A) that are protruding electrodes are formed on the upper surface of the chip 6, and when the jig 4 is held by the jig holder 3, a plurality of electronic component supply units 2 are provided. The chip 6 is supplied with the bump forming surface facing upward.
[0030]
As shown in FIG. 2, an ejector 8 is disposed below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 is provided with a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up a chip. When the chip 6 is picked up from the adhesive sheet 5 by a mounting head described later, the ejector pin lowers the adhesive sheet 5 by the ejector pin. The chip 6 is peeled off from the adhesive sheet 5 by pushing up the chip 6 from above. The ejector 8 is an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.
[0031]
As shown in FIG. 3, a holding unit 10 is disposed at a position separated from the electronic component supply unit 2 on the upper surface of the base 1 in the Y direction (first direction). Substrate carry-in conveyors 11 and 12 and substrate carry-out conveyors 13 and 14 are arranged in series in the X direction (second direction) on the upstream side and the downstream side of the holding unit 10, respectively. The substrate carry-in conveyors 11 and 12 receive the substrate 9 supplied from the upstream side and pass it to the holding unit 10. The holding unit 10 holds the delivered substrate 9 and positions it at the mounting position. The mounted substrate 9 is carried out downstream by the carry-out conveyors 13 and 14.
[0032]
Here, the holding part 10 can be raised and lowered by a predetermined raising / lowering stroke by a holding part raising / lowering mechanism 16 (see FIG. 2). The height of the substrate 9 in the state in which the holding unit 10 is raised (see FIGS. 2 and 13) is the component mounting height when the chip 6 is mounted on the substrate 9 by the mounting head 33 described later. The height of the substrate 9 in the state where the position of the substrate 9 is lowered (see FIGS. 12 and 13) is the observation height when the chip 6 and the electronic component mounting portion 9a are observed by the observation head 34 described later.
[0033]
In FIG. 1, the first Y-axis base 20A and the second Y-axis base 20B are arranged at both ends of the upper surface of the base 1 with the longitudinal direction facing the Y direction orthogonal to the substrate transport direction (X direction). It is installed. On the upper surfaces of the first Y-axis base 20A and the second Y-axis base 20B, a Y-direction guide 21 is disposed over a substantially entire length in the longitudinal direction (Y direction), and the pair of Y-direction guides 21 are parallel to each other. In addition, the electronic component supply unit 2 and the holding unit 10 are sandwiched.
[0034]
The pair of Y-direction guides 21 includes three beam members, a first beam member 31, a center beam member 30, and a second beam member 32. Both end portions are supported by the Y-direction guides 21 in the Y direction. It is slidably installed.
[0035]
A nut member 23b protrudes from the right side end of the center beam member 30, and a feed screw 23a screwed into the nut member 23b is disposed in the horizontal direction on the first Y-axis base 20A. The Y-axis motor 22 is rotationally driven. By driving the Y-axis motor 22, the center beam member 30 moves horizontally in the Y direction along the Y direction guide 21.
[0036]
Further, nut members 25b and 27b project from the left side end portions of the first beam member 31 and the second beam member 32, respectively. Feed screws 25a and 27a screwed into the nut members 25b and 27b are respectively Each of them is rotationally driven by Y-axis motors 24 and 26 disposed horizontally on the second Y-axis base 20B. By driving the Y-axis motors 24 and 26, the first beam member 31 and the second beam member 32 move horizontally in the Y direction along the Y direction guide 21.
[0037]
A mounting head 33 is mounted on the center beam member 30, and a feed screw 41 a screwed into a nut member 41 b coupled to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is guided by an X-direction guide 42 (see FIG. 2) provided on the side surface of the center beam member 30 in the X direction and moves in the X direction.
[0038]
The mounting head 33 includes a plurality (four in this case) of nozzles 33a (four mounting nozzles) for sucking and holding one chip 6, and holding the plurality of chips 6 by sucking and holding the chips 6 to the respective nozzles 33a. It is possible to move in the state. The mounting head 33 has a mounting nozzle raising / lowering mechanism for individually raising and lowering these nozzles 33a, and the chip 6 can be individually picked up and mounted by each nozzle 33a.
[0039]
By driving the Y-axis motor 22 and the X-axis motor 40, the mounting head 33 moves horizontally in the X direction and the Y direction, and the chip 6 of the electronic component supply unit 2 is sucked and held by the plurality of nozzles 33a. 6 is mounted on a plurality of electronic component mounting portions 9 a (see FIG. 5) formed on the substrate 9 held by the holding portion 10.
[0040]
A pair of Y-direction guides 21, a center beam member 30, a Y-direction drive mechanism (Y-axis motor 22, feed screw 23 a and nut member 23 b) that moves the center beam member 30 along the Y-direction guide 21, and a mounting head 33 The X-direction drive mechanism (X-axis motor 40, feed screw 41a, and nut member 41b) moves the mounting head 33 between the electronic component supply unit 2 and the holding unit 10 along the X-direction guide 42. The mounting head moving mechanism 59 (see FIG. 10) is configured.
[0041]
The first beam member 31 is provided with an observation head 34 having a lens barrel portion 34 a extending in the horizontal direction, and a nut member 44 b is coupled to a bracket 34 b that holds the observation head 34. The feed screw 44 a screwed into the nut member 44 b is rotationally driven by the X-axis motor 43, and by driving the X-axis motor 43, the observation head 34 is provided with an X-direction guide 45 provided on the side surface of the first beam member 31. (See FIG. 2) and moves in the X direction.
[0042]
As shown in FIG. 3, a temporary positioning camera 15 and a reversing stage 17 are disposed between the electronic component supply unit 2 and the holding unit 10. The temporary positioning camera 15 includes a line camera. When the mounting head 33 holding the chip 6 on the nozzle 33a moves above the temporary positioning camera 15, the image of the chip 6 held on the nozzle 33a is captured. . The position of the chip 6 is recognized by performing a recognition process on the image by the electronic component temporary recognition unit 57 (FIG. 10) described later. This position recognition is provisional recognition for temporarily positioning the chip 6 on the electronic component mounting portion 9a on the substrate 9, as will be described later.
[0043]
Here, the function of the observation head 34 will be described with reference to FIG. As shown in FIG. 4, the observation head 34 has two cameras, an electronic component camera 36A for observing the chip 6 on the lens barrel portion 34a and a substrate camera 36B for observing the electronic component mounting portion 9a of the substrate 9, respectively. The configuration is a combination through lenses 37A and 37B.
[0044]
Illumination units 39A and 39B for irradiating illumination light to the chip 6 and the substrate 9 that are observation objects are provided on the upper and lower surfaces of the lens barrel 34a. Inside the lens barrel portion 34a, mirrors 38A and 38B are respectively arranged at positions where the incident light to the lenses 37A and 37B is guided, and the incident light from both the upper and lower directions is reflected to one of the mirrors 38A and 38B. A prism 38C is incorporated.
[0045]
By moving the lens barrel 34a between two observation objects positioned in both the vertical direction and aligning the prism 38C with the observation object, the prism 38C, the mirror 38A, and the lens 37A are passed from the upper observation object. An optical path A to the camera 36A and an optical path B from the observation object below to the camera 36B through the prism 38C, the mirror 38B, and the lens 37B are simultaneously formed.
[0046]
That is, the observation head 34 provides the optical path A and the optical path B of the electronic component camera 36A and the board camera 36B horizontally, directs the optical path A of the electronic part camera 36A upward, and at the same position, the board camera. It has a configuration having a prism 38C that directs the optical path B of 36B downward. Here, the upward optical path A and the downward optical path B are on the same vertical line by adjusting the optical system.
[0047]
Therefore, as shown in FIG. 4, the lens barrel 34 a is advanced into the space between the substrate 9 held by the holding unit 10 and the nozzle 33 a positioned by adsorbing and holding the chip 6 above the substrate 9, By aligning the prism 38C with the electronic component mounting portion 9a of the chip 6 and the substrate 9, images of the electronic component mounting portion 9a of the chip 6 and the substrate 9 are simultaneously captured by the electronic component camera 36A and the substrate camera 36B, respectively. The relative positional relationship between the chip 6 and the electronic component mounting portion 9a can be obtained.
[0048]
That is, the observation head 34 temporarily positions the chip 6 sucked and held by the mounting head 33 above the electronic component mounting portion 9a, and between the temporarily positioned chip 6 and the electronic component mounting portion 9a. The image of the electronic component mounting unit 9a is captured.
[0049]
By driving the Y-axis motor 24 and the X-axis motor 43, the observation head 34 moves horizontally in the X direction and the Y direction. Thereby, the observation head 34 can perform the movement above the holding unit 10 for imaging the substrate 9 held by the holding unit 10 and the movement for retreating from the holding unit 10.
[0050]
Y-direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) for moving the pair of Y-direction guides 21, first beam member 31, first beam member 31 along the Y-direction guide 21, and observation The X-direction drive mechanism (X-axis motor 43, feed screw 44a, and nut member 44b) that moves the head 34 along the X-direction guide 45 is an observation head moving mechanism 58 (see FIG. 10) that moves the observation head 34. Constitute.
[0051]
In the electronic component mounting operation, the observation head moving mechanism 58 moves the observation head 34 in synchronization with the chips 6 that are sequentially temporarily positioned by the movement of the mounting head 33 as will be described later, and the chip 6 is moved to the substrate 9. When mounting, the observation head 34 is retracted from the holding unit 10. The space in the horizontal direction (Y direction) of the holding unit 10 is a retreat position where the observation head 34 is retreated from the holding unit 10.
[0052]
As described above, the holding unit 10 can be moved up and down by the holding unit lifting mechanism 16, and the interval between the holding unit 10 and the mounting head 33 can be changed by an operation to be performed. That is, when the observation head 34 is advanced into the space between the mounting head 33 and the substrate 9 for the observation operation, the interval between the holding unit 10 and the mounting head 33 is increased and the observation operation is completed. Decreases this interval. Therefore, the holding unit elevating mechanism 16 functions as an interval changing unit that changes and narrows the interval between the mounting head 33 and the holding unit 10 after the observation head 34 is retracted from the space between the mounting head 33.
[0053]
A wafer camera 35 is attached to the second beam member 32, and a nut member 47 b is coupled to a bracket 35 a that holds the wafer camera 35. The feed screw 47a screwed into the nut member 47b is rotationally driven by the X-axis motor 46. By driving the X-axis motor 46, the wafer camera 35 is provided in the X-direction guide provided on the side surface of the second beam member 32. It is guided by 48 (see FIG. 2) and moves in the X direction.
[0054]
By driving the Y-axis motor 26 and the X-axis motor 46, the wafer camera 35 moves horizontally in the X and Y directions. Thereby, the wafer camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2 and moves to retreat from the electronic component supply unit 2. It can be performed.
[0055]
Y-direction drive mechanism (Y-axis motor 26, feed screw 27a and nut member 27b) for moving a pair of Y-direction guide 21, second beam member 32, and second beam member 32 along Y-direction guide 21, and wafer The X-direction drive mechanism (X-axis motor 46, feed screw 47a, and nut member 47b) that moves the camera 35 along the X-direction guide 48 constitutes a wafer camera moving mechanism that moves the wafer camera 35.
[0056]
Next, a method for recognizing the substrate 9 and the chip 6 by the observation head 34 will be described with reference to FIGS. FIG. 5 shows a two-point recognition method for recognizing the position of the entire recognition object by recognizing two points in the recognition object. When this two-point recognition method is used, the optical magnification of the optical system used for imaging by the electronic component camera 36A and the board camera 36B is increased, and the imaging field is set to a narrow field W1.
[0057]
In FIG. 5A, a substrate 9 is placed on the holding portion 10, and chips 6 are already mounted on two of the plurality of electronic component mounting portions 9 a formed on the substrate 9. Above the holding part 10, the mounting head 33 holding the chip 6 on the nozzle 33a is located. At this time, the mounting head 33 is in a temporarily positioned state so that the chip 6 held by the nozzle 33a is positioned almost directly above the corresponding electronic component mounting portion 9a.
[0058]
In this state, the observation head 34 enters the space between the substrate 9 and the chip 6 and performs imaging for simultaneously recognizing the chip 6 and the substrate 9. At this time, first, the visual field W1 of the electronic component camera 36A and the substrate camera 36B has the bumps 6a on the diagonal side on one side of the chip 6 and the electrodes 9b positioned on the diagonal side on the one side of the electronic component mounting portion 9a. The observation head 34 is moved to include it. Images in the visual field W1 are acquired by the electronic component camera 36A and the board camera 36B, respectively.
[0059]
Next, as shown in FIG. 5B, the observation head 34 is moved so that the visual fields W1 of the electronic component camera 36A and the substrate camera 36B are respectively opposite to the bumps 6a on the other side of the chip 6 and mounted with the electronic components. The observation head 34 is moved so as to include the electrode 9b located on the other side of the part 9a. Similarly, images in the visual field W1 are acquired by the electronic component camera 36A and the board camera 36B, respectively.
[0060]
Then, by recognizing the image data obtained by the above-described two imaging operations by the observation head 34, the position of the chip 6 held by the mounting head 33 and the position of the electronic component mounting portion 9a on the substrate 9 are recognized. Is recognized. This two-point recognition method is used when the size of the target chip 6 is large and cannot be entirely accommodated in the same field of view, or when high position recognition accuracy is required.
[0061]
When this two-point recognition method is used, it is necessary to reliably position the target point within the narrow visual field W1, and therefore the chip 6 held by the mounting head 33 is temporarily positioned as described later. The temporary recognition operation recognized at 15 is performed, and the mounting head 33 is temporarily positioned based on the temporary recognition result.
[0062]
FIG. 6 shows a collective recognition method for recognizing the whole of the chip 6 and the electronic component mounting portion 9a collectively by one imaging. In this case, the imaging heads of the electronic component camera 36A and the board camera 36B are set to a wide field of view W2, and the observation head 34 is advanced into the space between the chip 6 and the board 9. In this state, the entire image of the chip 6 and the electronic component mounting portion 9a in the field of view W1 is acquired by the electronic component camera 36A and the board camera 36B, respectively. In the case of the collective recognition method, since it is easy to include both the chip 6 and the electronic component mounting portion 9a in the wide visual field W2, the provisional recognition of the chip 6 by the provisional positioning camera 15 is easy. Operation is not necessarily required.
[0063]
Next, the inversion stage 17 will be described with reference to FIGS. In FIG. 7, two support posts 72 connected to a block 71 are erected on a horizontal base member 70. A reversing table 73 is rotatably held around the horizontal shaft 73a on the support post 72, and a reversing actuator 75 is coupled to the shaft 73a. By driving the reversing actuator 75, the shaft 73a rotates 180 degrees, and the reversing table 73 performs a reversing operation.
[0064]
A holding head 74 is provided on the reversing table 73, and a plurality of chip holding portions 74 a are arranged on the holding head 74. The chip holding part 74a is provided with suction holes 74b, and the chip holding part 74a is vacuum-sucked from the suction holes 74b in a state where the chip 6 with the bump forming surface facing upward is placed on each chip holding part 74a. Holds the chip 6 by suction. That is, the chip holding part 74a holds the back surface of the chip 6 with the bump forming surface facing upward (see FIG. 8A).
[0065]
Here, the chip 6 is transferred to the holding head 74 by picking up the chip 6 from the electronic component supply unit 2 by the nozzle 33a of the mounting head 33 and transferring the chip 6 to the holding head 74 with the chip holding unit 74a facing upward. Thus, the arrangement of the chip holding portions 74a in the holding head 74 is set to match the arrangement of the nozzles 33a of the mounting head 33.
[0066]
Two slide posts 76 are erected on the base member 70, and a slider 77 fitted to the slide post 76 so as to be slidable in the vertical direction is coupled to a lifting table 78. A rod 84 a of a lift actuator 84 is coupled to the lift table 78. By driving the lifting actuator 84, the lifting table 78 moves up and down along the slide post 76.
[0067]
A stage 79 is provided on the upper surface of the lifting table 78. The stage 79 is a flat bottom container having a flat bottom surface 79a. The transfer stage for transferring and applying the flux 80 supplied to the bottom surface to the bumps 6a of the chip 6 and the bumps 6a are pressed by pressing the bumps 6a during the transfer operation. It also functions as a flattening stage for flattening the tip, and also functions as an arrangement stage for arranging the chips 6 on which the flux 80 is transferred and applied in a predetermined arrangement for the take-out operation by the mounting head 33. is doing.
[0068]
A slide cylinder 81 for moving the slide block 82 back and forth in the horizontal direction is disposed horizontally on the side surface of the lifting table 78. A squeegee unit 83 having two squeegees that can be moved up and down is mounted on the slide block 82 so as to extend above the stage 79. As the squeegee unit 83 moves horizontally and performs a flux scraping operation and a flux spreading operation, a flux film having a predetermined film thickness with a flattened liquid surface is formed on the bottom surface of the stage 79.
[0069]
FIG. 8A shows a state in which the lift table 78 is lowered by driving the lift actuator 84 after the formation of the flux film. As a result, the stage 79 is lowered to the transfer height position for transfer application of the flux 80. In this state, as shown in FIG. 8B, the reversing actuator 75 is driven to reverse the reversing table 73 with respect to the stage 79. Next, when a load that presses the stage 79 upward is applied by the lifting actuator 84, the lower surface of the bump 6a is pressed against the stage 79, the bump 6a is flattened, and a flux is transferred onto the bump 6a.
[0070]
When the placement of the chip 6 on the flux 80 of the stage 79 is completed in this way, the lifting actuator 84 is driven to raise the lifting table 78 and to place the stage 79 at the delivery height. In this state, the chip 6 disposed on the stage 79 is again held by the nozzle 33 a of the mounting head 33 and mounted on the substrate 9 held by the holding unit 10. Therefore, the mounting head 33 that picks up the chip 6 from the electronic component supply unit 2 and the reversing stage 17 and the electronic component supply unit 2 and transfers the chip 6 to the reversing stage 17 has a higher flux than the mounting head 33 that mounts the electronic components on the substrate. This is an electronic component supplying means for supplying the chip 6 in a state where 80 is transferred and applied and flattening is completed.
[0071]
In the process of moving the mounting head 33 to the substrate 9, the mounting head 33 holding the chip 6 moves in the X direction above the temporary positioning camera 15, so that the temporary positioning camera 15 becomes the mounting head as described above. The chip 6 held at 33 is imaged.
[0072]
Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 9, the mechanism drive unit 50 includes a motor driver that electrically drives a motor of each mechanism shown below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism drive unit 50 by the unit 53, the following drive elements are driven.
[0073]
The X-axis motor 40 and the Y-axis motor 22 drive a mounting head moving mechanism that moves the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 drive an observation head moving mechanism 58 that moves the observation head 34, and the X-axis motor 46 and the Y-axis motor 26 drive a wafer camera moving mechanism that moves the wafer camera 35, respectively. To do.
[0074]
The mechanism driving unit 50 drives the mounting nozzle lifting mechanism of the mounting head 33 and the component suction mechanism by the nozzle 33a (see FIG. 2), and the reversing actuator 75, the lifting actuator 84, the ejector 8 and the ejector XY of the reversing stage 17. The drive motor of the table 7 is driven. Further, the mechanism driving unit 50 drives the substrate carry-in conveyors 11 and 12, the substrate carry-out conveyors 13 and 14, the substrate holding mechanism of the holding unit 10, and the holding unit lifting mechanism 16 that raises and lowers the holding unit 10.
[0075]
The electronic component recognition unit 54 recognizes the image captured by the electronic component camera 36 </ b> A of the observation head 34, and recognizes the position of the chip 6 attracted and held by the nozzle 33 a of the mounting head 33. The board recognition unit 55 recognizes the position of the electronic component mounting unit 9 a of the board 9 held by the holding unit 10 by performing recognition processing on the image captured by the board camera 36 </ b> B of the observation head 34. The electronic component mounting portion 9a is obtained by binding the electrodes 9b to which the bumps 6a of the chip 6 are bonded on the substrate 9 in units of chips, and the position can be detected by image recognition.
[0076]
The wafer recognition unit 56 processes the image captured by the wafer camera 35 to obtain the position of the chip 6 of the electronic component supply unit 2. The electronic component temporary recognition unit 57 recognizes the image captured by the temporary positioning camera 15 and obtains the position of the chip 6 held by the mounting head 33. This position recognition is used for temporary positioning of the mounting head 33 on the substrate 9 as described above.
[0077]
Recognition results by the electronic component recognition unit 54, the substrate recognition unit 55, the wafer recognition unit 56, and the electronic component temporary recognition unit 57 are sent to the control unit 53. The operation unit 51 is an input device such as a keyboard or a mouse, and performs data input, control command input, operation mode setting described later, and the like. The display unit 52 displays an imaging screen by the observation head 34, the wafer camera 35, and the temporary positioning camera 15, and displays a guidance screen at the time of input by the operation unit 51.
[0078]
This electronic component mounting apparatus is configured as described above. Hereinafter, the operation mode of the electronic component mounting apparatus and the electronic component mounting operation in each operation mode will be described. In the electronic component mounting apparatus according to the present embodiment, three operation modes, that is, a high accuracy mode, a standard mode, and a high speed mode can be selected according to required mounting accuracy. The switching of the operation mode can be set by operating the operation unit 51.
[0079]
Next, the processing function and electronic component mounting operation of the electronic component mounting apparatus in the standard mode will be described with reference to FIGS. The electronic component mounting operation in the standard mode includes the step of sucking and holding the chip (electronic component) 6 to the plurality of nozzles (mounting nozzle) 33a of the mounting head 33, and the chip sucked and held by one of the plurality of nozzles 33a. 6 is temporarily positioned above one electronic component mounting portion 9a, and the chip 6 and the electronic component are mounted by the observation head 34 positioned in the space between the temporarily positioned chip 6 and the electronic component mounting portion 9a. An observation process for capturing an image of the unit 9a, a relative positional relationship detection process for obtaining a relative positional relationship between the chip 6 and the electronic component mounting unit 9a captured in the observation process, and suction holding by another nozzle 33a The temporary positioning step, the observation step, and the relative positional relationship detection step for all the chips 6 that have been performed, and the observation head retreat for retracting the observation head 34 from the substrate 9 The operation of positioning and mounting the chip 6 sucked and held by the plurality of nozzles 33a on the electronic component mounting portion 9a by moving the mounting head 33 reflecting the relative positional relationship obtained in the relative position detection step. Are sequentially performed on all the chips 6 held by suction by the nozzle 33a.
[0080]
In FIG. 10, a rectangular frame 53 indicates a processing function of the control unit 53 in the standard mode. As described below, the control unit 53 controls the mounting head moving mechanism 59 based on the images of the chip 6 and the electronic component mounting unit 9a captured by the observation head 34, and is sucked and held by each nozzle 33a. The chip 6 has a function as control means for sequentially positioning and mounting the chip 6 on the corresponding electronic component mounting portion 9a.
[0081]
Detailed functions of the control unit 53 will be described. The control unit 53 has a built-in storage function, and includes three storage units: a substrate information storage unit 53e, a temporary positioning position storage unit 53f, and a relative positional relationship storage unit 53g. The board information storage unit 53e is information about the board 9 on which the chip 6 is mounted, that is, the board size and the arrangement information on the board 9 of the electronic component mounting position 9a (see FIGS. 5 and 6) on which the chip 6 is mounted (see FIG. 5 and FIG. 6). Information such as the position of the recognition mark provided on the substrate 9 is stored.
[0082]
The temporary positioning position storage unit 53f is position information indicating a stop position of the mounting head 33 when the chip 6 sucked and held by the nozzle 33a of the mounting head 33 is temporarily positioned above the electronic component mounting part 9a of the substrate 9, that is, mounting. The mounting head position information (P) output from the head moving mechanism 59 is stored for each set of the chip 6 and the electronic component mounting portion 9a as a temporary positioning position. The relative positional relationship storage unit 53g indicates the relative positional relationship between the chip 6 and the electronic component mounting position 9a obtained by the relative positional relationship calculation processing unit 53i described below, and sets the chip 6 and the electronic component mounting position 9a. Remember every time.
[0083]
This relative positional relationship is the relative positional relationship between the chip 6 and the electronic component mounting portion 9a corresponding to the chip 6 in a state where the mounting head 33 holding the chip 6 on the nozzle 33a is temporarily positioned with respect to the substrate 9. That is, the horizontal displacement of the chip 6 with respect to the electronic component mounting portion 9a is shown. This relative positional relationship is acquired by imaging the chip 6 and the substrate 9 with the observation head 34.
[0084]
Image data obtained by imaging the chip 6 with the electronic component component camera 36A is subjected to recognition processing by the electronic component recognition unit 54, whereby position information of the chip 6 is obtained, and the substrate 9 is imaged with the substrate camera 36B. The position information of the electronic component mounting unit 9a is obtained by performing recognition processing on the image data obtained by the substrate recognition unit 55, and the relative information of both is obtained from the position information of the chip 6 and the position information of the electronic component mounting unit 9a. The relative positional relationship calculation processing unit 53i calculates the relative positional relationship.
[0085]
That is, the relative positional relationship calculation processing unit 53i uses the image of the chip 6 captured by the observation head 34 and the image of the electronic component mounting unit 9a to determine the relative relationship between the chip 6 attracted and held by the mounting head 33 and the electronic component mounting unit 9a. Is determined for each set of chip 6 and electronic component mounting portion 9a.
[0086]
The alignment information calculation unit 53h is based on the provisional determination position and relative positional relationship for each set of the chip 6 and the electronic component mounting unit 9a stored in the temporary positioning position storage unit 53f and the relative positional relationship storage unit 53g, respectively. Alignment information for positioning the mounting head 33 is calculated. This alignment information indicates the final target position of the mounting head 33 in the mounting operation for mounting the chip 6 on the electronic component mounting portion 9a of the substrate 9, and the relative relationship between the chip 6 and the electronic component mounting portion 9a described above. Is output in a form including a correction amount for correcting a general positional deviation.
[0087]
The observation head movement processing unit 53a controls the holding unit elevating mechanism 16 and the observation head moving mechanism 58 based on the arrangement information of the electronic component mounting unit 9a included in the board information stored in the board information storage unit 53e. Then, the positioning operation of the observation head 34 when imaging the substrate 9 held by the holding unit 10 and the retraction operation of moving the observation head 34 to a position that does not hinder the mounting of the chip 6 by the mounting head 33 are performed.
[0088]
The observation head 34, the observation head moving mechanism 58, and the observation head movement processing unit 53a are separated from the space between the chip 6 and the electronic component mounting unit 9a for each set of the temporarily positioned chip 6 and electronic component mounting unit 9a. An observation means including an observation head 34 for capturing images of the chip 6 and the electronic component mounting portion 9a is configured.
[0089]
The pickup operation processing unit 53 b controls the mounting head moving mechanism 59 to determine the positioning operation of the mounting head 33 when picking up the chip 6 from the electronic component supply unit 2 based on the position of the chip 6 in the electronic component supply unit 2. Let me do it. The position of the chip 6 is obtained by performing recognition processing by the wafer recognition unit 56 on the imaging result of the wafer camera 35.
[0090]
The temporary positioning operation processing unit 53c controls the mounting head moving mechanism 59 to sequentially position the chips 6 sucked and held by the plurality of nozzles 33a above the electronic component mounting unit 9a. This temporary positioning operation is performed based on the arrangement information of the electronic component mounting unit 9 a stored in the board information storage unit 53 e and the position of the chip 6 held in the mounting head 33. The position of the chip 6 is obtained by imaging the chip 6 held on the mounting head 33 by the temporary positioning camera 15 and performing recognition processing on the imaging result by the electronic component temporary recognition unit 57.
[0091]
The mounting operation processing unit 53d controls the mounting head moving mechanism 59 based on the alignment information calculated by the alignment information calculating unit 53h, so that the chip 6 held in each nozzle 33a corresponds to the substrate 9. The electronic component mounting portion 9a is sequentially positioned.
[0092]
Next, the electronic component mounting operation in the standard mode will be described with reference to FIGS. 12 to 15 along the flow of FIG. Here, as shown in FIGS. 5 and 6, an operation example is shown in the case where the mounting operation is continuously performed on the substrate 9 on which the already mounted chip 6 is present.
[0093]
In FIG. 11, first, electronic component suction holding is performed (ST1). That is, the chip 6 is sucked and held from the stage 79 (see FIGS. 7 and 8) by the plurality of nozzles 33a of the mounting head 33 (component holding step). Then, when the mounting head 33 holding the chip 6 passes above the temporary positioning camera 15, a temporary recognition operation of the chip 6 is performed (ST 2), and thereby the chip 6 held by the mounting head 33. Is captured and the position is recognized. Based on the temporary recognition result, the first set of temporary positioning operations is performed (ST3). That is, the mounting head 33 is moved onto the substrate 9 held by the holding unit 10, and the chip 6 attracted and held by one of the plurality of nozzles 33 a of the mounting head 33 is replaced with one electron corresponding to the chip 6. Temporary positioning is performed above the component mounting portion 9a (temporary positioning step).
[0094]
Here, first, the chip 6 held by the mounting head 33 (the chip 6 held by the right nozzle 33a in FIG. 12A) is used as the first electronic component mounting portion 9a of the substrate 9 in the mounting operation. Temporary positioning is performed on the electronic component mounting portion 9a) adjacent to the right side of the chip 6. This temporary positioning is performed based on the arrangement information of the electronic component mounting unit 9a stored in the board information storage unit 53e and the above-described temporary recognition result.
[0095]
In parallel with these operations, the holding unit 10 is lowered in the holding unit 10 (ST4), thereby securing a space in which the observation head 34 advances on the holding unit 10. In this state, as shown in FIG. 12A, the observation head 34 is advanced into the space between the substrate 9 and the chip 6 held by the mounting head 33, and the observation head positioning operation is performed (ST5). .
[0096]
Thereafter, an observation operation is performed (ST6), and images of the chip 6 and the electronic component mounting portion 9a are captured by the observation head 34 positioned in the space between the temporarily positioned chip 6 and the electronic component mounting portion 9a ( Observation process). Here, for the first group described above, as shown in FIG. 12A, images of the chip 6 and the electronic component mounting unit 9a are captured by the electronic component camera 36A and the board camera 36B. In this example, an example is shown in which a collective recognition method (see FIG. 6) for recognizing recognition targets collectively with a wide visual field W2. Then, the position of the mounting head 33 at this time is stored as a temporary positioning position corresponding to the set of the chip 6 and the electronic component mounting unit 9a in the temporary positioning position storage unit 53f in association with this set.
[0097]
Thereafter, a relative positional relationship between the chip 6 and the electronic component mounting portion 9a captured in the observation step is obtained (relative positional relationship detection step). That is, based on the images of the chip 6 and the electronic component mounting unit 9a, the electronic component recognition unit 54 and the board recognition unit 55 recognize the positions of the chip 6 and the electronic component mounting unit 9a, respectively, and the relative positional relationship calculation processing unit 53i detects the chip. 6 and the relative positional relationship between the electronic component mounting portion 9a are calculated. The calculation result is stored in association with the set of the chip 6 and the electronic component mounting unit 9a corresponding to the relative positional relationship storage unit 53g.
[0098]
Next, the presence / absence of a set of the next chip 6 and the electronic component mounting portion 9a is determined (ST7). If there is a next set, the temporary positioning operation (ST8) of the next set and the observation head positioning operation (ST9) are performed. ) Is executed. These operations are the same as the operations shown in (ST3) and (ST5), respectively. That is, as shown in FIG. 12B, the mounting head 33 and the observation head 34 are moved to align the next chip 6 with the next electronic component mounting portion 9a. At this time, the operation of the observation head 34 is performed in synchronization with the movement of the chip 6 by the mounting head 33.
[0099]
Thereafter, returning to (ST6), the observation operation by the observation head 34 is executed, and thereafter, all chips held by suction to the other nozzles 33a until it is confirmed in (ST7) that there is no next set. 6, the temporary positioning step, the observation step, and the relative positional relationship detection step are sequentially executed.
[0100]
When the temporary positioning, observation, and relative position detection processes have been completed for all the groups, the holding unit is raised (ST11) after the observation head retracting operation (ST10). That is, as shown in FIG. 13A, the observation head 34 is retracted from the substrate 9 (observation head retracting step), and then the holding unit 10 is raised to the component mounting height as shown in FIG. 13B. . In parallel with these operations, the first chip 6 and the electronic component mounting portion 9a (the left chip 6 held by the mounting head 33 and the second electronic component mounting portion 9a from the already mounted chip 6) are mounted. Alignment is performed (ST12).
[0101]
In this alignment, the alignment information calculation unit 53h first reads a relative positional relationship with the temporary positioning position for the group from the temporary positioning position storage unit 53f and the relative positional relationship storage unit 53g, and alignment information necessary for the alignment. Is calculated from the relative positional relationship with the read temporary positioning position. Then, the mounting operation processing unit 53d controls the mounting head moving mechanism 59 based on the calculated alignment information and positions the mounting head 33.
[0102]
Then, as shown in FIG. 14 (b), the nozzle 33a holding the first set of chips 6 is lowered to mount the chips 6 on the electronic component mounting portion 9a of the substrate 9 (ST13). The presence / absence of the next set is determined (ST14). If there is a next group, as shown in FIG. 14 (b), the positioning operation of the next group is performed (ST15), and the process returns to (ST13), as shown in FIGS. 15 (a) and 15 (b). The chip 6 is mounted by lowering 33a.
[0103]
That is, by reflecting the relative positional relationship obtained in the relative position detecting step and moving the mounting head 33, the chip 6 sucked and held by the plurality of nozzles 33a is positioned and mounted on the electronic component mounting portion 9a. The mounting operation is executed for all the chips 6 that are sucked and held by the nozzles 33 a of the mounting head 33. Then, in (ST14), it is confirmed that there is no next group and mounting for all the groups is completed, and the electronic component mounting operation is terminated.
[0104]
As described above, in the electronic component mounting method in the standard mode, when the chip 6 is mounted on the substrate 9 by the mounting head 33 having the plurality of nozzles 33a, the set of all the chips 6 and the electronic component mounting portion 9a is previously set. After performing the observation operation as the target and preparing the necessary information (temporary positioning position, relative positional relationship) for calculating the alignment information for alignment during the mounting operation for each set, The alignment information is calculated and aligned for each chip, and the mounting operation for lowering the nozzle 33a and landing the chip 6 on the electronic component mounting portion 9a is sequentially executed.
[0105]
This eliminates the need to move the observation head 34 back and forth between the mounting head 33 and the holding unit 10 each time a mounting operation for one chip 6 is performed, and the operation time can be shortened. When the chip 6 is landed on the substrate 9, the nozzle 33a is lowered while the holding portion 10 is raised to the component mounting height, so that the time required for the nozzle 33a to descend during the mounting operation can be shortened. The overall operation time can be further shortened. In other words, the above method is a mounting execution form as a standard mode in which electronic components can be efficiently mounted on a substrate for general use.
[0106]
Next, a processing function and an electronic component mounting operation of the electronic component mounting apparatus in the high accuracy mode will be described with reference to FIGS. In the electronic component mounting operation in the high accuracy mode, the chip (electronic component) 6 is sucked and held by a plurality of nozzles (mounting nozzles) 33a of the mounting head 33, and is sucked and held by one of the plurality of nozzles 33a. A temporary positioning step of temporarily positioning the chip 6 above one electronic component mounting portion 9a, and the observation head 34 positioned in the space between the temporarily positioned chip 6 and the electronic component mounting portion 9a, and the chip 6 and the electronic component An observation step for capturing an image of the mounting portion 9a, a relative positional relationship detection step for obtaining a relative positional relationship between the chip 6 and the electronic component mounting portion 9a captured in the observation step, and an observation head 34 for the substrate 9 Temporary positioning is performed by moving the mounting head 33 to reflect the relative positional relationship obtained in the observation head withdrawing step and the relative position detecting step. An electronic component mounting process for positioning and mounting the chip 6 on the electronic component mounting portion 9a, and a temporary positioning process, an observation process, a relative positional relationship detection process, an observation head for all the chips 6 sucked and held by the other nozzles 33a. And a step of sequentially performing an evacuation step and an electronic component mounting step.
[0107]
In the high-precision mode functional block diagram shown in FIG. 16, the temporary positioning position storage unit 53f and the relative positional relationship storage unit 53g are removed from the standard mode functional block diagram shown in FIG. The function of storing the temporary positioning position information and the relative positional relationship information that is the basis of the above is deleted. In the high accuracy mode, alignment information is calculated without temporarily storing these two pieces of information. That is, as shown in FIG. 16, the alignment information calculation unit 53h is transmitted from the mounting head moving mechanism 59 and the relative positional relationship between the chip 6 and the electronic component mounting unit 9a calculated by the relative positional relationship calculation processing unit 53i. Based on the current position (temporary positioning position) of the mounting head 33, alignment information is calculated.
[0108]
Next, the electronic component mounting operation in the high-accuracy mode will be described with reference to FIGS. 18 to 22 along the flow of FIG. Here, as in the case described above, an example of operation in the case where the mounting operation is continuously performed on the substrate 9 on which the already mounted chip 6 exists is shown.
[0109]
In FIG. 17, each step shown in (ST21) to (ST25) has the same contents as (ST1) to (ST5) shown in FIG. By completing these steps, the chip 6 and the electronic component mounting portion 9a can be observed.
[0110]
Thereafter, an observation operation is performed (ST26), and images of the chip 6 and the electronic component mounting portion 9a are captured by the observation head 34 located in the space between the temporarily positioned chip 6 and the electronic component mounting portion 9a. Here, as in the first embodiment, the image of the chip 6 and the electronic component mounting part 9a is captured by the observation head 34 as shown in FIG.
[0111]
Then, the relative positional relationship between the chip 6 and the electronic component mounting portion 9a captured by the observation process is obtained. That is, based on the images of the chip 6 and the electronic component mounting unit 9a, the positions of the chip 6 and the electronic component mounting unit 9a are recognized by the electronic component recognition unit 54 and the board recognition unit 55, respectively, and the chip 6 is detected by the relative positional relationship calculation processing unit 53i. And the relative positional relationship between the electronic component mounting portion 9a. Then, the alignment information calculation unit 53h calculates alignment information based on the calculated relative positional relationship and the current position of the mounting head 33 transmitted from the mounting head moving mechanism 59.
[0112]
If the relative positional relationship is detected for one group, after the observation head retracting operation (ST27), the holding unit is raised subsequently (ST28). That is, as shown in FIG. 18B, the observation head 34 is retracted from the substrate 9, and then the holding unit 10 is raised to the component mounting height as shown in FIG. 19A. In parallel with these operations, the first chip 6 and the electronic component mounting portion 9a (the right chip 6 held by the mounting head 33 and the electronic component mounting portion 9a adjacent to the already mounted chip 6) are positioned. Combine (ST29).
[0113]
Then, as shown in FIG. 19B, the nozzle 33a holding the first set of chips 6 is lowered to mount the chips 6 on the electronic component mounting portion 9a of the substrate 9 (ST30), and then the mounting target The presence / absence of the next set is determined (ST31). Here, when there is a next set, the operation returns to the operation for performing observation by the observation head 34 again. That is, as shown in FIG. 20A, the holding unit 10 is lowered to the recognition height (ST32), and the observation head 34 is advanced between the chip 6 and the substrate 9 to perform the positioning operation of the observation head 34 ( ST33).
[0114]
In parallel with these steps, the next set of temporary positioning operations is performed (ST34). Then, returning to (ST26), as shown in FIG. 20B, images of the chip 6 and the electronic component mounting portion 9a are captured by the observation head. Similarly, the relative positional relationship is detected. Thereafter, as shown in FIG. 21A, the observation head 34 is retracted from the holding unit 10, and then the holding unit 10 is raised to the component mounting height as shown in FIG. The pair of chips 6 and the electronic component mounting portion 9a (the left chip 6 held by the mounting head 33 and the electronic component mounting portion 9a adjacent to the previously mounted chip 6) are aligned.
[0115]
Then, as shown in FIG. 22A, the nozzle 33a is lowered to mount the chip 6 on the electronic component mounting portion 9a of the substrate 9 (ST30). These steps are repeatedly executed, and if it is determined that there is no next set to be mounted in (ST31), the electronic component mounting operation is terminated.
[0116]
As described above, the electronic component mounting method in the high-accuracy mode is a combination of a set of the chip 6 and the electronic component mounting portion 9a when the chip 6 is mounted on the substrate 9 by the mounting head 33 having the plurality of nozzles 33a. When the alignment information for aligning these is obtained based on the observation result, the mounting operation by the mounting head 33 is immediately executed based on the alignment information. .
[0117]
Thereby, when positioning the mounting head 33 based on the alignment information, positioning errors caused by the mechanism errors of the respective axes of the mounting head moving mechanism 59 for moving the mounting head 33 can be eliminated, and high mounting position accuracy is achieved. Is realized. That is, the above method is a mounting execution form as a high-accuracy mode for the purpose of mounting high-precision components that require high mounting accuracy on a substrate with good positional accuracy.
[0118]
FIG. 23 is a functional block diagram showing processing functions in the high speed mode of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 24 is a flowchart of the electronic component mounting method (high speed mode) according to the first embodiment of the present invention. FIG.
[0119]
The functional block diagram shown in FIG. 23 is the same as the functional block diagram of the standard mode shown in FIG. 10, but the temporary positioning position storage unit 53f, the relative positional relationship storage unit 53g, the relative positional relationship calculation processing unit 53i, the temporary positioning operation processing unit 53c, The configuration is such that the electronic component camera 36A and the electronic component recognition unit 54 are removed, and the method for calculating alignment information is simplified.
[0120]
As shown in FIG. 23, the alignment information calculation unit 53h includes the position recognition result of the chip 6 obtained by the electronic component temporary recognition unit 57 recognizing the image of the chip 6 captured by the temporary positioning camera 15; The alignment information is calculated based on the position recognition result of the substrate 9 obtained by the substrate recognition unit 55 performing recognition processing on the image captured by the substrate camera 36B. The position recognition of the substrate 9 is performed based on the position of a characteristic part such as a recognition mark provided on the substrate 9.
[0121]
That is, the position of each electronic component mounting part 9a is specified from the arrangement information of the electronic component mounting part 9a included in the board information stored in the board information storage part 53e and the positional deviation of the board 9 obtained by the board recognition. Then, the final target position of the mounting head 33 is calculated based on the position displacement of the chip 6 obtained from the position of the electronic component mounting portion 9a and the recognition result of the chip 6.
[0122]
Next, the electronic component mounting operation in the high-speed mode will be described along the flow of FIG. This electronic component mounting operation is a high-speed mode of the mounting operation executed using the electronic component mounting apparatus. Prior to the start of the mounting operation, the substrate 9 held by the holding unit 10 is recognized by the substrate camera 36B, and the positional deviation of the substrate 9 is obtained. In FIG. 24, first, electronic component suction holding is performed (ST41).
[0123]
That is, the chip 6 is sucked and held from the stage 79 by the nozzle 33 a of the mounting head 33. Then, when the mounting head 33 holding the chip 6 passes above the temporary positioning camera 15, a temporary recognition operation of the chip 6 is performed (ST 42), thereby the chip 6 held by the mounting head 33. Is captured and the position of the chip 6 is recognized. Based on the temporary recognition result, the first set of temporary positioning operations is performed (ST43).
[0124]
After that, it shifts to mounting operation. Here, the nozzle 33a holding the first chip 6 is lowered in the temporarily positioned state, and the chip 6 is mounted on the electronic component mounting portion 9a of the substrate 9. Then, the presence / absence of the next set is determined, and if the next set exists, the temporary positioning operation of the next set is executed (ST46), and the mounting operation for returning the nozzle 33a in the same manner is returned to (ST44). Executed. These steps are repeatedly executed, and if it is determined that there is no next set to be mounted in (ST45), the electronic component mounting operation is terminated.
[0125]
As described above, in the electronic component mounting method in the high speed mode, when the chip 6 is mounted on the substrate 9 by the mounting head 33 having the plurality of nozzles 33a, the mounting head 33 holding the chip 6 is removed from the component supply unit 2. The electronic position obtained by adding the board recognition result to the position of the chip 6 obtained by capturing the image by the temporary positioning camera 15 in the path of movement to the holding section 10 and the arrangement information of the electronic component mounting section 9a stored in advance. The alignment information is calculated based on the position of the component mounting portion 9a.
[0126]
Thereby, electronic component mounting can be performed without performing an observation operation for positioning for each set of the chip 6 and the electronic component mounting portion 9a. That is, the above method is a mounting execution form as a high-speed mode in which high-speed mounting is performed with a short tact time for an electronic component that does not require high mounting position accuracy.
[0127]
As described above, the electronic component mounting apparatus shown in the first embodiment is not limited to the general standard mode mounting execution mode aiming to achieve both good mounting position accuracy and highly efficient component mounting work. The high accuracy mode and the high speed mode can be selected in accordance with the mounting accuracy required for the target electronic component.
[0128]
In other words, with an electronic component mounting apparatus having the same configuration, for a high-accuracy mode mounting execution mode targeting high-precision components that require high mounting accuracy, and for electronic components that do not require high mounting position accuracy, A mounting execution form as a high-speed mode in which high-speed mounting is performed with a short tact time is possible.
[0129]
(Embodiment 2)
Next, the electronic component mounting apparatus according to the second embodiment will be described. The electronic component mounting apparatus of the second embodiment is different from that of the first embodiment only in the processing mechanism in the standard mode, and other configurations and processing functions in the high-precision mode and the high-speed mode are the same as those in the first embodiment. It is. Therefore, the description of the electronic component mounting apparatus according to the second embodiment is limited to the processing function in the standard mode.
[0130]
FIG. 25 is a functional block diagram showing processing functions in the standard mode of the electronic component mounting apparatus according to the second embodiment of the present invention. In the first embodiment (see FIG. 10), information indicating the temporary positioning position of the mounting head 33 and the relative positional relationship between the chip 6 and the electronic component mounting portion 9a is used for each set of the chip 6 and the electronic component mounting portion 9a. However, in the second embodiment, the alignment information is stored for each set of the chip 6 and the electronic component mounting portion 9a.
[0131]
That is, as shown in FIG. 25, the relative positional relationship calculated by the relative positional relationship calculation processing unit 53i is directly transmitted to the alignment information calculating unit 53h without being temporarily stored. The alignment information calculation unit 53h calculates alignment information based on the position of the mounting head 33 at the time of temporary positioning stored in the temporary positioning position storage unit 53f and the relative positional relationship calculated by the relative positional relationship calculation processing unit 53i. To do.
[0132]
The alignment information storage unit 53j stores the alignment information calculated by the alignment information calculation unit 53h for each set of the chip 6 and the electronic component mounting unit 9a. When mounting operation is controlled by the mounting operation processing unit 53d, the mounting head moving mechanism 59 is controlled based on the alignment information stored in the alignment information storage unit 53j. Also in the second embodiment, similar to the first embodiment, since the mounting operation is performed after the observation operation for calculating the alignment information is executed in advance for all the sets, the same effect can be obtained.
[0133]
As described above, in the electronic component mounting method (standard mode) of the present invention, the chip 6 is sucked and held on each of the plurality of nozzles 33 a provided on the mounting head 33 and mounted on the electronic component mounting portion 9 a of the substrate 9. In mounting the electronic component, the chip 6 and the electronic component mounting portion 9a are observed by the observation head 34 located in the space between the temporarily positioned chip 6 and the electronic component mounting portion 9a, and the relative positional relationship between them is observed. Relative position detection is performed for all the chips 6 that are attracted and held by the nozzle 33a, and the mounting operation for positioning and mounting the chip 6 on the electronic component mounting portion 9a reflecting the obtained relative positional relationship is performed for all the chips. 6 are sequentially executed.
[0134]
As a result, the tact time per component can be greatly reduced as compared with the conventional method in which the camera is moved back and forth between the mounting head and the substrate each time one electronic component is mounted. Furthermore, the holding part that holds the substrate can be moved up and down, and the interval between the substrate and the mounting head is reduced during the mounting operation, so that the time required for the nozzle to move up and down is shortened and the tact time is further reduced. It is possible to achieve both good mounting position accuracy and highly efficient component mounting work.
[0135]
【The invention's effect】
According to the present invention, in the electronic component mounting in which the electronic component is sucked and held in each of the plurality of mounting nozzles provided in the mounting head and mounted on the electronic component mounting portion of the substrate, the temporarily positioned electronic component and the electronic component mounting portion The electronic head and the electronic component mounting part are observed by the observation head located in the space between the two, and the relative position detection for obtaining the relative positional relationship between the two is performed for all the electronic components held by the mounting nozzle. The mounting operation of positioning and mounting the electronic component on the electronic component mounting part, reflecting the obtained relative positional relationship, is executed sequentially for all the electronic components, so good mounting position accuracy and highly efficient component mounting work Can be made compatible.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.
FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional plan view of the electronic component mounting apparatus according to the first embodiment of the present invention.
4 is a functional explanatory diagram of an observation head of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG.
FIG. 5 is an explanatory diagram of an electronic component and substrate observation method using an observation head of the electronic component mounting apparatus according to the embodiment of the present invention.
6 is an explanatory diagram of an electronic component and substrate observation method using an observation head of the electronic component mounting apparatus according to the embodiment of the present invention. FIG.
7 is a perspective view of an inversion stage of the electronic component mounting apparatus according to Embodiment 1 of the present invention. FIG.
FIG. 8 is an operation explanatory diagram of the inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 9 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 10 is a functional block diagram showing processing functions in the standard mode of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 11 is a flowchart of the electronic component mounting method (standard mode) according to the first embodiment of the present invention;
FIG. 12 is a process explanatory diagram of the electronic component mounting method (standard mode) according to the first embodiment of the present invention;
FIG. 13 is a process explanatory diagram of the electronic component mounting method (standard mode) according to the first embodiment of the present invention;
FIG. 14 is a process explanatory diagram of the electronic component mounting method (standard mode) according to the first embodiment of the present invention;
FIG. 15 is a process explanatory diagram of the electronic component mounting method (standard mode) according to the first embodiment of the present invention;
FIG. 16 is a functional block diagram showing processing functions in the high precision mode of the electronic component mounting apparatus according to the first embodiment of the present invention;
FIG. 17 is a flowchart of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 18 is a process explanatory diagram of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 19 is a process explanatory diagram of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 20 is a process explanatory diagram of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 21 is a process explanatory view of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 22 is a process explanatory diagram of the electronic component mounting method (high accuracy mode) according to the first embodiment of the present invention;
FIG. 23 is a functional block diagram showing processing functions in the high-speed mode of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 24 is a flowchart of the electronic component mounting method (high-speed mode) according to the first embodiment of the present invention;
FIG. 25 is a functional block diagram showing processing functions in the standard mode of the electronic component mounting apparatus according to the second embodiment of the present invention;
[Explanation of symbols]
2 Electronic parts supply department
6 chips
9 Board
9a Electronic component mounting part
10 Holding part
15 Temporary positioning camera
16 Holder lifting mechanism
33 Mounted head
33a nozzle
34 Observation head
36A Camera for electronic parts
Camera for 36B circuit board
53 Control unit
53a Observation head movement processing unit
53c Temporary positioning operation processing unit
53d Onboard operation processing unit
53f Temporary positioning position storage unit
53g Relative positional relationship storage unit
53h Alignment information calculation unit
53i Relative positional relationship calculation processing unit
54 Electronic component recognition unit
55 Board recognition unit

Claims (8)

A holding unit for holding a substrate, an electronic component supply means for supplying the electronic components, and mounting head having a plurality of mounting nozzles you sucking and holding the electronic component supplied from the electronic component supplying means, before Symbol mounting head a mounting head moving mechanism for moving, and observation head having a camera, and observation head moving mechanism before moving the prior SL observation head, movement of the mounting head according to the control of the mounting head moving mechanism, the observation head movement of the observation head according to control of the moving mechanism, and a control means for causing the imaging by adsorption and the observation head of the electronic component by the mounting head,
The control means, after moving the mounting head having a plurality of electronic components suctioned and held by the plurality of mounting nozzles above the substrate, advances the observation head into the space between the mounting head and the substrate, While the plurality of electronic components sucked and held by the plurality of mounting nozzles are temporarily positioned sequentially above the corresponding electronic component mounting portions on the substrate, the temporarily positioned electronic components and the corresponding electronic component mounting portions are moved by the observation head. After imaging and retracting the observation head from the space, each electronic component is handled based on the relative positional relationship with the electronic component mounting portion for all electronic components obtained from the image obtained by the imaging. An electronic component mounting apparatus characterized by being sequentially positioned and mounted on an electronic component mounting portion . Wherein said control means comprises a provisional positioning operation processing part for temporarily positioning the electronic components, wherein by moving the mounting head is adsorbed held in the plurality of mounting nozzles above the corresponding electronic component mounting portion, provisional positioning operation processing unit The electronic component when the electronic component is temporarily positioned above the corresponding electronic component mounting portion by using the position of the mounting head as the temporary positioning position and the electronic component mounting portion corresponding to the electronic component An electronic component and an electronic component mounting unit corresponding to the electronic component from an image of the electronic component captured by the observation head and an electronic component mounting unit corresponding to the electronic component. the relative positional relationship calculating process part for determining the relative positional relationship for each of the sets, and to the electronic components the electronic components obtained Oite the relative positional relationship calculating process part The relative positional relationship and the relative positional relationship storage unit for storing each said set of said provisional positioning position of the provisional positioning position storage unit and the relative positional relationship respectively in the storage unit stored the sets each of the electronic component mounting portion to respond and an alignment information calculating part for calculating alignment information used to position the mounting head to the substrate based on the relative positional relationship of said set each, the mounting head on the basis of the alignment information calculated in the alignment information calculating section The electronic component mounting apparatus according to claim 1, further comprising: a mounting operation processing unit that moves the electronic component and sequentially positions and mounts each electronic component on the corresponding electronic component mounting unit. Wherein said control means comprises a provisional positioning operation processing part for temporarily positioning the electronic components, wherein by moving the mounting head is adsorbed held in the plurality of mounting nozzles above the corresponding electronic component mounting portion, the front Symbol observation head the electronic component and the electronic component mounting portion electronic component and the electronic component image by Ri electronic components and the relative positional relationship between the electronic component mounting portion corresponding to the electronic components are temporarily positioned in corresponding to the electronic component taken the relative positional relationship calculating process part for determining each set of the corresponding electronic component mounting portion, the position of the mounting head when the electronic component is provisionally positioned above the corresponding electronic component mounting portions by provisional positioning operation processing unit positioning the substrate said mounting head based on the relative positional relationship between the electronic component obtained in the relative positional relationship processor and the electronic component mounting portion corresponding to the electronic component The alignment information and the alignment information calculating part for calculating alignment information, stored the alignment information calculated in A Raimento information calculating unit and the alignment information storage unit for storing each said set, the alignment information storage unit for wherein moving the mounting head, the electronic component mounting apparatus according to claim 1, characterized in that a mounting operation processing part for mounting sequentially positioning the electronic components in the corresponding electronic component mounting portion based on . An interval changing unit that changes an interval between the mounting head and the holding unit is provided, and the control unit controls the interval changing unit after the observation head is retracted from the space and then holds the mounting head and the holding unit. electronic component mounting apparatus according to any one of claims 1 to 3, characterized in that narrowing the gap between the parts. Electronic component mounting apparatus according to any one of claims 1 to 4, characterized in that lateral space of the holder is in the retracted position of said observation head. Electronic component mounting apparatus according to any one of claims 1 to 5, characterized in that said observation head includes a substrate camera for observing the electronic component mounting portion of the electronic component camera and the board to observe the electronic component . And characterized by having the electronic component camera and horizontally installed an optical path of the camera substrate, to together Turning optical path of said electronic component camera upwards, direct light path before Symbol camera substrate downward prism The electronic component mounting apparatus according to any one of claims 1 to 6 . The supplied plurality of electronic components is attracted to and held on a plurality of mounting Nozzle provided in the mounting head, a step of moving the mounting head above the substrate, between the mounting head and the substrate is moved above the substrate A step of advancing the observation head into the space, a plurality of electronic components sucked and held by the plurality of mounting nozzles while temporarily positioning the electronic components on the substrate sequentially above the corresponding electronic component mounting portion, and the electronic components Steps of imaging an electronic component mounting portion corresponding to an electronic component with the observation head, and after the imaging, the observation head is retracted from the space, and for all electronic components obtained from the image obtained by the imaging characterized in that it comprises a step of based on the relative positional relationship between the electronic component mounting portion, thereby mounted sequentially positioned in the electronic component mounting portions corresponding to each electronic component Electronic component mounting method for.

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