JP3763284B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
In the electronic component mounting apparatus, the mounting operation of holding the electronic component taken out from the electronic component supply unit by the mounting head and mounting it on the substrate is repeatedly performed. Among electronic components, electronic components on which bumps, which are projecting electrodes for connection, such as flip chips, are generally supplied with the bump forming surface facing upward.
[0003]
The electronic component is taken out from the electronic component supply unit by a dedicated pickup means having a reversing mechanism, and the taken out electronic component is reversed by the reversing mechanism and held with the bumps facing downward. Then, the mounting head for mounting the electronic component on the substrate is handed over the electronic component in the above inverted state, and after performing a flux transfer operation for transferring and applying the flux to the bumps on the flux transfer stage, it moves onto the substrate and moves the electronic component. Parts were being mounted.
[0004]
[Problems to be solved by the invention]
In the above-described conventional electronic component mounting apparatus, the pickup means and the mounting head are provided with only one nozzle, and therefore it is difficult to improve the overall work efficiency.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can shorten the tact time and improve the working efficiency.
[0006]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that applies an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes formed on a protruding electrode forming surface, and mounts the electronic component on a workpiece. An electronic component supply unit that supplies a plurality of electronic components with the protruding electrode formation surface facing upward, and an adhesive that extends the pressure-sensitive adhesive on a flat stage and supplies the adhesive with the liquid level flattened and stickies supply unit for a holding head having a plurality of electronic component holding portion for holding the rear surface side of the electronic component has a reversing actuator for vertically inverting the holding head, wherein by driving the reversing actuator and stickies applying means for applying an adhesive material to the protruding electrodes arranged an electronic component held by the holding head on stickies which are spread over the stage by making the holding head is turned upside down, the electronic component A mounting head having a plurality of mounting nozzles for sucking and holding, picks up a plurality of electronic components of the electronic component supply unit by the mounting head, delivers them to the holding head, and is arranged on the adhesive by the holding head. And mounting means for picking up and taking out the electronic components by the plurality of mounting nozzles and mounting them on the workpiece.
[0007]
An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, wherein the arrangement of the mounting nozzles of the mounting head and the arrangement of the electronic component holding portions of the holding head coincide.
[0008]
The electronic component mounting apparatus according to claim 3 is the electronic component mounting apparatus according to claim 1, wherein the stage is wide enough to arrange the plurality of electronic components held by the holding head on the adhesive. Have.
[0009]
The electronic component mounting method according to claim 4 is an electronic component mounting method for applying an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes on a protruding electrode forming surface, and mounting the electronic component on a workpiece. A plurality of electronic components supplied with the protruding electrode formation surface facing upward are picked up by a plurality of mounting nozzles of the mounting head, and the picked-up electronic components are held heads with the back surface of the electronic components facing upward A transfer step of holding and transferring the electronic component holding unit, and arranging a plurality of electronic components held by the holding head by turning the holding head upside down on an adhesive material extended on a flat stage. The application process of applying adhesive to the protruding electrodes of the electronic component by using the mounting nozzle of the mounting head to take out a plurality of electronic components arranged on the stage and mount them on the workpiece That and a mounting process.
[0010]
The electronic component mounting method according to claim 5 is the electronic component mounting method according to claim 4, wherein a plurality of electronic components are simultaneously transferred from a mounting nozzle of a mounting head to a holding head in the transfer step, In the mounting process, a plurality of electronic components are simultaneously removed from the stage by the mounting nozzle.
[0011]
The electronic component mounting method according to claim 6 is the electronic component mounting method according to claim 4, wherein in the transfer step, when the electronic component is transferred from the mounting head to the holding head, the electronic component mounting method is immediately performed on the stage. An electronic component already placed is taken out by the mounting nozzle of the mounting head, and then the liquid level of the adhesive on the stage is flattened by the squeegee, and then the electronic component held by the holding head is placed on the adhesive. To place.
[0012]
According to the present invention, since work is performed by a plurality of mounting nozzles, work efficiency per part can be improved. In addition, the mounting head delivers the electronic components in the electronic component supply unit to the holding head, and the holding head takes out the electronic components placed on the adhesive and mounts them on the board. The required pickup means can be eliminated and the apparatus can be simplified.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a perspective view of the reversing stage of the electronic component mounting apparatus according to the embodiment of the present invention, and FIGS. 5 and 6 illustrate the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 8 is a processing function of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 9 is a timing chart of an electronic component mounting method according to an embodiment of the present invention. FIGS. 10, 11, 12, and 13 are diagrams of an electronic component mounting method according to an embodiment of the present invention. Process explanatory drawing and FIG. 14 become the electronic component mounting object of one embodiment of this invention. It is a plan view of a plate.
[0014]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. 2 shows an AA arrow view in FIG. 1, and FIG. 3 shows a BB arrow view in FIG. In FIG. 1, an electronic component supply unit 2 is disposed on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder (jig holding unit) 3, and the jig holder 3 is detachable from the jig 4 on which the adhesive sheet 5 is attached. Hold on.
[0015]
A semiconductor chip 6 (hereinafter simply abbreviated as “chip 6”), which is an electronic component, is attached to the adhesive sheet 5 in a state of being separated into individual pieces. On the upper surface of the chip 6, a plurality of bumps 6 a (see FIG. 5A) that are protruding electrodes are formed, and when the jig 4 is held on the jig holder 3, a plurality of electronic component supply units 2 are provided. The chip 6 is supplied with the bump formation surface (projection electrode formation surface) facing upward.
[0016]
As shown in FIG. 2, an ejector 8 is disposed below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 is provided with a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up a chip. When the chip 6 is picked up from the adhesive sheet 5 by a mounting head described later, the ejector pin lowers the adhesive sheet 5 by the ejector pin. The chip 6 is peeled off from the adhesive sheet 5 by pushing up the chip 6 from above. The ejector 8 is an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.
[0017]
As shown in FIG. 3, a substrate holding unit 10 is arranged at a position separated from the electronic component supply unit 2 on the upper surface of the base 1 in the Y direction. A substrate carry-in conveyor 12, a substrate sorting unit 11, a substrate delivery unit 13, and a substrate carry-out conveyor 14 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The substrate carry-in conveyor 12 receives the substrate 16 supplied from the upstream side and passes it to the substrate sorting unit 11.
[0018]
The substrate sorting unit 11 has a configuration in which a sorting conveyor 11a is arranged to be slidable in the Y direction by a slide mechanism 11b, and a substrate 16 (work) received from the substrate carry-in conveyor 12 will be described below. This is selectively distributed to the two substrate holding mechanisms of the unit 10. The substrate holding unit 10 includes a first substrate holding mechanism 10A and a second substrate holding mechanism 10B, and holds the substrate 16 distributed by the substrate distribution unit 11 and positions it at the mounting position.
[0019]
Similarly to the substrate distribution unit 11, the substrate delivery unit 13 has a configuration in which a delivery conveyor 13a is slidable in the Y direction by a slide mechanism 13b. The delivery conveyor 13a includes the first substrate holding mechanism 10A and the second substrate holding mechanism 10A. By selectively connecting to the substrate holding mechanism 10 </ b> B, the mounted substrate 16 is received and transferred to the substrate carry-out conveyor 14. The board carry-out conveyor 14 carries the delivered mounted board 16 downstream.
[0020]
In FIG. 1, a first Y-axis base 20A and a second Y-axis base 20B are arranged at both ends of the upper surface of the base 1 with the longitudinal direction facing the Y direction perpendicular to the substrate transport direction (X direction). It is installed. On the upper surfaces of the first Y-axis base 20A and the second Y-axis base 20B, a Y-direction guide 21 is disposed over the entire length in the longitudinal direction (Y direction), and the pair of Y-direction guides 21 are parallel to each other. In addition, the electronic component supply unit 2 and the substrate holding unit 10 are arranged to be sandwiched therebetween.
[0021]
The pair of Y-direction guides 21 includes three beam members, a first beam member 31, a center beam member 30, and a second beam member 32, both ends of which are supported by the Y-direction guide 21 in the Y direction. It is slidably installed.
[0022]
A nut member 23b protrudes from the right side end of the center beam member 30, and a feed screw 23a screwed into the nut member 23b is disposed in the horizontal direction on the first Y-axis base 20A. It is rotationally driven by the Y-axis motor 22. By driving the Y-axis motor 22, the center beam member 30 moves horizontally in the Y direction along the Y direction guide 21.
[0023]
Further, nut members 25b and 27b project from the left side end portions of the first beam member 31 and the second beam member 32, respectively. Feed screws 25a and 27a screwed into the nut members 25b and 27b are respectively Each of them is rotationally driven by Y-axis motors 24 and 26 disposed horizontally on the second Y-axis base 20B. By driving the Y-axis motors 24 and 26, the first beam member 31 and the second beam member 32 move horizontally in the Y direction along the Y direction guide 21.
[0024]
A mounting head 33 is mounted on the center beam member 30, and a feed screw 41 a screwed into a nut member 41 b coupled to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is guided by an X-direction guide 42 (see FIG. 2) provided on the side surface of the center beam member 30 in the X direction and moves in the X direction.
[0025]
The mounting head 33 is provided with a plurality (four in this case) of nozzles 33a (four mounting nozzles) for sucking and holding one chip 6, and holding the plurality of chips 6 by sucking and holding the chips 6 to the respective nozzles 33a. It is possible to move with. By driving the Y-axis motor 22 and the X-axis motor 40, the mounting head 33 moves horizontally in the X direction and the Y direction, picks up and holds the chip 6 of the electronic component supply unit 2, and holds the held chip 6 on the substrate. It is mounted on the electronic component mounting position 16 a of the substrate 16 held by the holding unit 10.
[0026]
A pair of Y-direction guides 21, a center beam member 30, a Y-direction drive mechanism (Y-axis motor 22, feed screw 23 a and nut member 23 b) that moves the center beam member 30 along the Y-direction guide 21, and a mounting head 33 The X-direction drive mechanism (the X-axis motor 40, the feed screw 41a, and the nut member 41b) moves the mounting head 33 between the electronic component supply unit 2 and the substrate holding unit 10 along the X-direction guide 42. A mounting head moving mechanism is configured.
[0027]
A first camera 34 is attached to the first beam member 31, and a nut member 44 b is coupled to a bracket 34 a that holds the first camera 34. The feed screw 44 a screwed into the nut member 44 b is rotationally driven by the X-axis motor 43, and the first camera 34 is provided on the side surface of the first beam member 31 by driving the X-axis motor 43. It is guided by a guide 45 (see FIG. 2) and moves in the X direction.
[0028]
By driving the Y-axis motor 24 and the X-axis motor 43, the first camera 34 moves horizontally in the X direction and the Y direction. Thus, the first camera 34 moves the substrate holding unit 10 above the substrate holding unit 10 for imaging the substrate 16 held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B of the substrate holding unit 10, and the substrate. Movement for evacuation from the holding unit 10 can be performed.
[0029]
A pair of Y-direction guides 21, a first beam member 31, a Y-direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) for moving the first beam member 31 along the Y-direction guide 21, and a first The X-direction drive mechanism (X-axis motor 43, feed screw 44a and nut member 44b) that moves one camera 34 along the X-direction guide 45 moves the first camera 34 at least above the substrate holder 10. A first camera moving mechanism is configured.
[0030]
A second camera 35 is attached to the second beam member 32, and a nut member 47 b is coupled to a bracket 35 a that holds the second camera 35. The feed screw 47a screwed to the nut member 47b is rotationally driven by the X-axis motor 46, and the second camera 35 is provided in the X direction provided on the side surface of the second beam member 32 by driving the X-axis motor 46. It is guided by a guide 48 (see FIG. 2) and moves in the X direction.
[0031]
By driving the Y-axis motor 26 and the X-axis motor 46, the second camera 35 moves horizontally in the X direction and the Y direction. Accordingly, the second camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2 and moves to retreat from the electronic component supply unit 2. And can be done.
[0032]
A Y-direction drive mechanism (Y-axis motor 26, feed screw 27a and nut member 27b) for moving the pair of first direction guide 21, second beam member 32 and second beam member 32 along the first direction guide 21; The X-direction drive mechanism (the X-axis motor 46, the feed screw 47a, and the nut member 47b) that moves the second camera 35 along the X-direction guide 48 is configured to move the second camera 35 at least in the electronic component supply unit 2. A second camera moving mechanism is configured to move upward.
[0033]
As shown in FIG. 3, a third camera 15 and a reversing stage 17 are disposed between the electronic component supply unit 2 and the substrate holding unit 10. The third camera 15 includes a line camera, and the mounting head 33 holding the chip 6 on the nozzle 33a moves above the third camera 15 to capture the image of the chip 6 held on the nozzle 33a. .
[0034]
The inversion stage 17 will be described with reference to FIGS. 4, 5, and 6. In FIG. 4, two support posts 72 connected to a block 71 are erected on a horizontal base member 70. A reversing table 73 is rotatably held around the horizontal shaft 73a on the support post 72, and a reversing actuator 75 is coupled to the shaft 73a. By driving the reversing actuator 75, the shaft 73a rotates 180 degrees, and the reversing table 73 performs a reversing operation.
[0035]
A holding head 74 is provided on the reversing table 73, and a plurality of chip holding parts 74 a (electronic component holding parts) are arranged on the holding head 74. The chip holding part 74a is provided with suction holes 74b, and the chip holding part 74a is vacuum-sucked from the suction holes 74b in a state where the chip 6 with the bump forming surface facing upward is placed on each chip holding part 74a. Holds the chip 6 by suction. That is, the chip holding part 74a holds the back surface of the chip 6 with the bump forming surface facing upward (see FIG. 5A).
[0036]
Here, the chip 6 is transferred to the holding head 74 by picking up the chip 6 from the electronic component supply unit 2 by the nozzle 33a of the mounting head 33 and transferring the chip 6 to the holding head 74 with the chip holding unit 74a facing upward. Thus, the arrangement of the chip holding portions 74a in the holding head 74 is set to match the arrangement of the nozzles 33a of the mounting head 33.
[0037]
Two slide posts 76 are erected on the base member 70, and a slider 77 fitted to the slide post 76 so as to be slidable in the vertical direction is coupled to a lifting table 78. A rod 84 a of a lift actuator 84 is coupled to the lift table 78. By driving the lifting actuator 84, the lifting table 78 moves up and down along the slide post 76.
[0038]
A stage 79 is provided on the upper surface of the lifting table 78. The stage 79 is a flat bottom container having a flat bottom surface 79a. As will be described later, a transfer stage for transferring and applying the flux 80, which is an adhesive, supplied to the bottom surface 79a to the bumps 6a of the chip 6, and this transfer operation. Sometimes it also functions as a flattening stage for flattening the tip of the bump 6a by pressing the bump 6a. Further, the chip 6 on which the flux 80 is transferred and applied is arranged in a predetermined arrangement for taking out by the mounting head 33. It has a function as an arrangement stage to be arranged at.
[0039]
A slide cylinder 81 for moving the slide block 82 back and forth in the horizontal direction is disposed horizontally on the side surface of the lifting table 78. A squeegee unit 83 having two squeegees 83 a and 83 b (see FIG. 6) that can be raised and lowered is mounted on the slide block 82 so as to extend above the stage 79. The squeegees 83a and 83b have functions as a flux scraping squeegee and a flux extension squeegee as described below.
[0040]
By supplying the flux 80 on the bottom surface 79a and moving the squeegee unit 83 horizontally in the direction of arrow a with the squeegee 83a lowered and in sliding contact with the bottom surface 79a as shown in FIG. The flux 80 adhering to the bottom surface 79a is scraped to one side. Then, as shown in FIG. 6B, the squeegee unit 83 is moved horizontally in the direction of the arrow b in a state where the squeegee 83b is lowered to maintain a predetermined gap between the bottom surface 79a and the lower end of the squeegee 83b. The squeegee 83b extends the flux 80 on the bottom surface 79a to flatten the liquid surface.
[0041]
As a result, a flux film 80a having a predetermined film thickness t with a flattened liquid surface is formed on the bottom surface 79a. The stage 79 is an adhesive supply unit that supplies the flux film 80a, which is an adhesive, in a state where the liquid 80 is flattened by spreading the flux 80, which is an adhesive, on the flat bottom surface 79a. In addition to the flux 80, a resin adhesive or the like is used as the adhesive depending on the type of the bump 6a.
[0042]
When the formation of the flux film is completed in this way, the lifting / lowering table 78 is lowered by driving the lifting / lowering actuator 84 as shown in FIG. As a result, the stage 79 is lowered to the transfer height position for transfer application of the flux 80. In this state, as shown in FIG. 5B, the reversing actuator 75 is driven to reverse the reversing table 73 with respect to the stage 79. By this reversal operation, the holding head 74 that holds the chip 6 by suction on each chip holding portion 74a descends on the stage 79 on which the flux film 80a is formed as shown in FIG. 6C.
[0043]
As shown in FIG. 6D, when the bump 6a of the chip 6 comes into contact with the bottom surface 79a of the stage 79, a load F that presses the stage 79 upward is applied by the lifting actuator 84. As a result, the bottom surface 79a is pressed against the lower surface of each bump 6a, and the bump 6a is flattened, that is, the tip of the bump 6a is flattened to adjust the height, thereby making the bump height uniform. .
[0044]
Thereafter, by reversing the reversing table 73, the holding head 74 returns to the original position shown in FIG. On the stage 79, as shown in FIG. 6 (e), the chip 6 is arranged in a state where the bump 6a is in contact with the flux film 80a. Here, the size of the stage 79 is determined in accordance with the size of the holding head 74, and the size is such that a plurality of chips 6 held by the chip holding portions 74a can be simultaneously arranged on the flux film 80a. Yes. The arrangement of the chips 6 in the stage 79 is the same as the arrangement of the nozzles 33 a in the mounting head 33.
[0045]
The holding head 74 that holds the back surface of the chip 6 with the bump forming surface of the chip 6 facing upward, the reversing table 73 that reverses the holding head 74, and the reversing actuator 75 are on the flux 80 whose liquid surface is flattened. The chip 6 is arranged to place the bump 6a in contact with the flux 80. In the placement operation of the chip 6, flux 80 is applied to the lower end portion of the bump 6a by transfer. That is, the arrangement means described above is an adhesive application means for applying the flux 80 to the bumps 6a by disposing the chip 6 held by the holding head 74 on the flux 80 extended to the bottom surface 79a of the stage 79. .
[0046]
When the placement of the chip 6 on the flux 80 of the stage 79 is completed in this way, the lifting actuator 84 is driven to raise the lifting table 78 and to place the stage 79 at the delivery height. In this state, the chip 6 disposed on the stage 79 is again held by the nozzle 33 a of the mounting head 33 and mounted on the substrate 16 held by the substrate holding unit 10. In the process of moving the mounting head 33 to the substrate 16, the mounting head 33 holding the chip 6 moves in the X direction above the third camera 15, so that the third camera 15 is held by the mounting head 33. The chip 6 is imaged.
[0047]
Therefore, the mounting head 33 and the mounting head moving mechanism described above are mounting means having the following functions. That is, this mounting means has a mounting head 33 provided with a nozzle 33a for sucking and holding the chip 6, picks up a plurality of chips 6 of the electronic component supply unit 2 by the mounting head 33, transfers them to the holding head 74, and holds the holding head. The chips 6 disposed on the flux 80 of the stage 79 by 74 are sucked and taken out by the plurality of nozzles 33 a of the mounting head 33, and these chips 6 held by the mounting head 33 are mounted on the substrate 16.
[0048]
Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 7, the mechanism driving unit 50 includes a motor driver that electrically drives a motor of each mechanism shown below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism drive unit 50 by the unit 54, the following drive elements are driven.
[0049]
The X-axis motor 40 and the Y-axis motor 22 drive a mounting head moving mechanism that moves the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 are a first camera moving mechanism for moving the first camera 34, and the X-axis motor 46 and the Y-axis motor 26 are a second camera for moving the second camera 35. Each moving mechanism is driven.
[0050]
The mechanism driving unit 50 drives the lifting mechanism of the mounting head 33 and the component suction mechanism by the nozzle 33a (see FIG. 2), and the reversing actuator 75, the lifting actuator 84 of the reversing stage 17, the lifting cylinder and ejector of the ejector 8. The drive motor of the XY table 7 is driven. Further, the mechanism driving unit 50 drives the substrate carry-in conveyor 12, the substrate carry-out conveyor 14, the substrate sorting unit 11, the substrate delivery unit 13, the first substrate holding mechanism 10A, and the second substrate holding mechanism 10B.
[0051]
The first recognition processing unit 55 processes the image captured by the first camera 34 to recognize the position of the electronic component mounting position 16a (see FIG. 14) of the substrate 16 held by the substrate holding unit 10. The electronic component mounting position 16a indicates the entire position of the electrode 16b to which the bump 6a of the chip 6 is bonded on the substrate 16, and the position can be detected by image recognition.
[0052]
In addition, the first recognition processing unit 55 performs a substrate pass / fail inspection by detecting the presence or absence of a bad mark applied to the substrate 16 for each electronic component mounting position 16a in the previous process. Furthermore, the image picked up by the first camera 34 is processed to inspect the mounting state such as displacement of the chip 6 mounted at the electronic component mounting position 16a.
[0053]
The second recognition processing unit 56 processes the image captured by the second camera 35 to obtain the position of the chip 6 of the electronic component supply unit 2. The third recognition processing unit 57 processes the image captured by the third camera 15 and obtains the position of the chip 6 held by the mounting head 33. Therefore, the third recognition processing unit 57 is an electronic component recognition unit that recognizes the position of the chip 6 from the image acquired by the third camera 15.
[0054]
The recognition results obtained by the first recognition processing unit 55, the second recognition processing unit 56, and the third recognition processing unit 57 are sent to the control unit 54. The data storage unit 53 stores various types of data such as substrate inspection and inspection results of chip 6 mounting state inspection. The operation unit 51 is an input device such as a keyboard or a mouse, and performs data input and control command input. The display unit 52 displays an imaging screen by the first camera 34, the second camera 35, and the third camera 15 and displays a guidance screen at the time of input by the operation unit 51.
[0055]
Next, processing functions of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 8, a broken line frame 54 indicates a processing function by the control unit 54 shown in FIG. Here, the processing functions executed by the first camera movement processing unit 54a, the second camera movement processing unit 54b, the reversing stage operation processing unit 54c, the pickup control unit 54d, and the mounting control unit 54e are respectively the first camera movement processing unit. It constitutes a control means, a second camera movement control means, an inversion stage operation control means, a pickup control means, and a mounting control means.
[0056]
The first camera movement processing unit 54 a controls the first camera moving mechanism to position the first camera 34 when imaging the substrate 16 held by the substrate holding unit 10, and the mounting head 33. The retraction operation of moving the first camera 34 to a position that does not hinder the mounting of the chip 6 is performed. Here, the imaging of the substrate 16 is performed by imaging the bad mark application position when the substrate 16 is carried in, imaging the electronic component mounting position 16a before the chip 6 is mounted, and electronic component after the chip 6 is mounted. This is performed for three types of imaging of the mounting position 16a.
[0057]
The second camera movement processing unit 54 b controls the second camera moving mechanism to position the second camera 35 when the chip 6 of the electronic component supply unit 2 is imaged, and the electronic component by the mounting head 33. The retraction operation of moving the second camera 35 to a position that does not interfere with the pickup is performed.
[0058]
The reversing stage operation processing unit 54 c controls the vacuum suction operation from the suction holes 74 b of the reversing actuator 75, the lifting actuator 84, the squeegee unit 83, and the holding head 74 to receive the chip 6 delivered from the mounting head 33. The placement operation is performed until the top and bottom are reversed and placed on the flux film 80a.
[0059]
The pickup control unit 54d controls the mounting head moving mechanism to determine the positioning operation of the mounting head 33 when the chip 6 is picked up from the electronic component supply unit 2, and the position of the chip 6 obtained by the second recognition processing unit 56. Based on.
[0060]
The mounting control unit 54e controls the mounting head moving mechanism to determine the positioning operation of the mounting head 33 when the chip 6 is mounted on the substrate 16 of the substrate holding unit 10, and the electronic component mounting position of the first recognition processing unit 55. This is performed based on the position of the electronic component mounting position 16a obtained by the detection processing unit 55a and the position of the chip 6 obtained by the third recognition processing unit 57. Therefore, the mounting control unit 54 e is a mounting control unit that controls the mounting unit based on the recognition result of the electronic component recognition unit and positions the chip 6 held by the mounting nozzle 33 on the substrate 16.
[0061]
In addition to the electronic component mounting position detection processing unit 55a, the first recognition processing unit 55 includes a board inspection processing unit 55b and a mounting state inspection processing unit 55c. In the mounting operation by the mounting control unit 54e, the pass / fail determination result of the substrate 16 detected by the substrate inspection processing unit 55b is referred to, and only the electronic component mounting position 16a determined to pass in the pass / fail determination is attached to the chip 6. Mounting is executed.
[0062]
The inspection result recording processing unit 54f performs processing for storing the above-described substrate pass / fail determination result by the substrate inspection processing unit 55b and the mounting state inspection result of the chip 6 by the mounting state inspection processing unit 55c. These inspection results are sent to the inspection result recording processing unit 54 f for data processing and stored in the inspection result storage unit 53 a provided in the data storage unit 53.
[0063]
This electronic component mounting apparatus is configured as described above. Hereinafter, an electronic component mounting method will be described with reference to the timing chart of FIG. 9 and each of FIGS. 10 to 14. FIG. 9 shows the chronological relationship of each unit process in the electronic component mounting operation execution process, and here shows the operation from the first turn to the fifth turn.
[0064]
These unit processes are (1) liquid level flattening process, (2) coating process, (3) mounting process, (4) transfer process, (5) component recognition process, (6) board recognition process, (7 9) The component recognition process is divided into, and among these unit processes, (2) coating process, (3) mounting process, (4) transfer process, and (6) board recognition process are as shown in FIG. In addition, the process is divided into two sub-unit processes that are performed in time.
[0065]
Each unit process will be described. (1) The liquid level flattening step is a step of flattening the liquid level by spreading the flux 80 by the squeegee unit 83 on the bottom surface 79a which is a flat stage. By performing a ging operation, a flux film 80a having a flat liquid surface is formed on the bottom surface 79a of the stage 79 (see FIG. 10A).
[0066]
(2) In the coating process, the holding head 74 that sucks the back surface of the chip 6 is turned upside down with respect to the stage 79 with the bump forming surface of the chip 6 facing upward, and a plurality of chips 6 held by the holding head 74 are In this step, the flux 80 is applied to the bumps 6a of the chip 6 by being placed on the flux 80 extended on a flat stage. When the chip 6 is landed, the bumps 6a are brought into contact with the flux 80 on the flux 80. Arrange in a state.
[0067]
This coating process is composed of the following two sub-processes. (2) -1 Application step (reversal / shaping) reversing the holding head 74 holding the chip 6 to press the chip 6 against the stage 79 on which the flux film 80a is formed, thereby shaping the height of the bump 6a. It is a process to do. At the time of shaping, the flux 80 is applied to the bumps 6a of the chip 6. (2) -2 Application step (return / uplift) is a step of returning the holding head 74 to the original position after shaping the bump 6a and applying the flux to the bump 6a, and raising the stage 79 on which the shaped chip 6 is arranged. (See FIG. 11A).
[0068]
(3) The mounting process is a process in which the chip 6 arranged on the bottom surface 79a of the stage 79 is picked up by the plurality of nozzles 33a of the mounting head 33 and taken out and mounted on the substrate 16, and is configured by the following two sub processes. Is done. The (3) -1 mounting step (removal) is a removal step in which the plurality of chips 6 arranged on the flux 80 on the bottom surface 79a of the stage 79 are picked up and taken out by the nozzles 33a of the mounting head 33 (FIG. 11B). )reference). At this time, the plurality of chips 6 are taken out from the stage 79 by the nozzles 33 a for each chip 6 at the same time.
[0069]
(3) -2 In the mounting process (mounting), the mounting head 33 is moved based on the recognition result of the component recognition process, the plurality of chips 6 held by the nozzle 33a are aligned with the substrate 16, and then the chips 6 are individually separated. This is a step of mounting on the substrate 16 (see FIG. 12B).
[0070]
(4) The transfer process is a process in which the chip 6 is picked up from the electronic component supply unit 2 by the mounting head 33 and transferred to the holding head 74, and includes the following two sub-processes. (4) -1 The transfer step (pickup) individually picks up the plurality of chips 6 supplied with the bump formation surface facing upward in the electronic component supply unit 2 by the plurality of nozzles 33a of the mounting head 33. (See FIG. 10B).
[0071]
(4) -2 The transfer process (delivery) is a process in which the back surfaces of the plurality of chips 6 picked up from the electronic component supply unit 2 are held by the chip holding unit 74a of the holding head 74 and transferred (FIG. 11 ( b)). At this time, the transfer of the plurality of chips 6 from the nozzle 33 a of the mounting head 33 to the holding head 74 is performed simultaneously for each chip 6. This (4) -2 transfer process is an electronic component holding process in which the holding head 74 holds the chip 6 with the chip holding portion 74a of the holding head 74 facing upward.
[0072]
(5) The component recognition step is a step of recognizing the position by imaging the chip 6 with the second camera 35 in the electronic component supply unit 2 (FIGS. 10A, 10B, and 12B). reference). (6) The substrate recognition step is a step of performing image recognition for a predetermined purpose by picking up an image of the substrate 16 with the first camera 34 in the substrate holding unit 10, and includes the following two sub steps.
[0073]
(6) -1 Substrate recognition step (mounting position recognition) is a step of recognizing the position of the electronic component mounting position 16a by imaging the substrate 16 before chip mounting with the first camera 34 (FIG. 10A). reference). (6) -2 Substrate recognition step (mounting state inspection) is a step of inspecting the mounting state by imaging the substrate 16 after chip mounting (see FIG. 13A). (7) The component recognition step is a step in which the chip 6 before mounting held by the mounting head 33 is imaged by the third camera 15 and the position of the chip 6 is recognized from the image acquired by this imaging (FIG. 12). (See (a)).
[0074]
Next, an electronic component mounting method will be described while showing a time-series relationship between the unit processes. In FIG. 10A, a large number of chips 6 are adhered to the adhesive sheet 5 of the jig 4 held by the electronic component supply unit 2 with the bump forming surface facing upward. In the substrate holding unit 10, the substrate 16 is positioned on each of the first substrate holding mechanism 10A and the second substrate holding mechanism 10B.
[0075]
First, the first turn is started. As shown in FIG. 10A, the second camera 35 moves above the electronic component supply unit 2 and images a plurality (four) of chips 6 to be mounted in the first turn. Then, the image captured by the second camera 35 is processed by the second recognition processing unit 56 to obtain the positions of the plurality of chips 6.
[0076]
At this time, the first camera 34 moves onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10, and the eight electrons set on the substrate 16 are shown in FIG. Among the component mounting positions 16a, the first camera 34 is sequentially moved so that the image capturing range 18 sequentially surrounds the left four electronic component mounting positions 16a, and images of the plurality of electronic component mounting positions 16a are captured. take in. Then, the image of the image capturing range 18 captured by the first camera 34 is processed by the first recognition processing unit 55 to obtain the position of the electronic component mounting position 16a on the board 16.
[0077]
Further, in parallel with the above operation, in the reversing stage 17, squeegeeing is performed in which the squeegee unit 83 extends the flux 80 onto the stage 79 to form the flux film 80 a. That is, here, (5) component recognition step, (6) -1 substrate recognition step (mounting position recognition) and (1) liquid level flattening step are executed simultaneously (see FIG. 9).
[0078]
Next, the mounting head 33 is moved above the electronic component supply unit 2, and the mounting head 33 is sequentially positioned on these chips 6 based on the recognized positions of the plurality of chips 6 as shown in FIG. While performing the positioning operation, the plurality of chips 6 are sequentially picked up by the four nozzles 33a of the mounting head 33. Next, the mounting head 33 moves onto the holding head 74 and transfers the held plurality of chips 6 to the chip holding portion 74a.
[0079]
If the mounting head 33 moves away from the electronic component supply unit 2, the second camera 35 immediately advances onto the electronic component supply unit 2 and images the chip 6 to be mounted in the second turn to recognize the position. To do. Here, (4) -2 transfer process (delivery) is performed after (4) -1 transfer process (pickup), and (4) -2 transfer process (delivery) and (5) component recognition process. Are executed concurrently (see FIG. 9).
[0080]
Next, as shown in FIG. 11A, when the second camera 35 moves away from the electronic component supply unit 2, the mounting head 33 moves onto the electronic component supply unit 2 and becomes a mounting target in the second turn. The chip 6 is picked up individually. In parallel with this, in the reversing stage 17, first, the stage 79 after the formation of the flux film 80 a is lowered to the transfer height position in the (1) liquid level flattening step, and then the holding head 74 with respect to the stage 79. Flips upside down. As a result, the bumps 6 a of the chip 6 held by the holding head 74 abut against the bottom surface 79 a of the stage 79. Then, by pressing the stage 79 upward, shaping is performed to flatten the tips of the bumps 6a of the chip 6 (see FIG. 6D).
[0081]
Thereafter, the holding head 74 is reversed after returning from the vacuum suction from the suction hole 74b to return to the original position, and the stage 79 rises to the delivery height position. That is, here, (4) -1 transfer process (pickup), (2) coating process ((2) -1 coating process (reversing / shaping) and (2) -2 coating process (returning / raising)) Are performed concurrently.
[0082]
Next, as shown in FIG. 11B, the mounting head 33 that picks up the plurality of chips 6 from the electronic component supply unit 2 moves above the holding head 74. When the held chip 6 is transferred to the holding head 74, the mounting head 33 immediately moves onto the stage 79, and the chip 6 disposed on the flux film 80a is taken out by the nozzle 33a.
[0083]
Here, following the (4) -2 transfer process (delivery), the (3) -1 mounting process (removal) is executed. In this transfer step, when the chip 6 is transferred from the mounting head 33 to the holding head 74, the chip 6 disposed on the stage 79 is immediately taken out by the nozzle 33a of the mounting head 33.
[0084]
Then, as shown in FIG. 12A, when the removal of the chip 6 from the stage 79 is completed, the liquid level of the flux 80 of the stage 79 is flattened by the squeegee unit 83 in the reversing stage 17. A flattening process is performed, and a flux film 80 a is formed on the stage 79 again.
[0085]
The mounting head 33 that has taken out the chip 6 from the stage 79 and held it on the nozzle 33a performs a scanning operation to move above the third camera 15, and then above the substrate 16 held by the first substrate holding mechanism 10A. Move to. Then, the image of the chip 6 held by scanning is taken in, and the position of the chip 6 is recognized. Here, (7) the component recognition step (before mounting) and (1) the liquid level flattening step are executed in parallel.
[0086]
Thereafter, as shown in FIG. 12B, the chip 6 is mounted on the substrate 16 by the mounting head 33. Here, the mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the board inspection determination result. Thereby, as shown in FIG. 14B, the chip 6 is mounted at the four electronic component mounting positions 16 a of the substrate 16.
[0087]
When the mounting head 33 is mounted with the chip 6, the reversing stage 17 has the same (2) coating process ((2) -1 coating process (reversing / shaping), (2) as in FIG. 11A). -2 application step (return / rise)) is performed following the (1) liquid leveling step shown in FIG.
[0088]
Furthermore, in the electronic component supply unit 2, the second camera 35 performs imaging and position recognition of the chip 6 to be mounted in the third turn. Here, during the execution of (3) -2 mounting step (mounting), (2) coating step ((2) -1 coating step (reversing / shaping), (2) -2 coating step (returning / raising)) (5) A component recognition process is executed.
[0089]
Next, as shown in FIG. 13 (a), if the second camera 35 has moved away from the electronic component supply unit 2, the mounting head 33 moves to the electronic component supply unit 2 and is mounted on the third turn. Each chip 6 is picked up individually. During this pickup operation, the first camera 34 is moved onto the first substrate holding mechanism 10 </ b> A of the substrate holding unit 10 to image the substrate 16. Here, the inspection of the mounting state of the chip 6 mounted on the substrate 16 and the position recognition of a plurality of electronic component mounting positions 16a on which the chip 6 is mounted in the next mounting turn are performed.
[0090]
That is, in this imaging, as shown in FIG. 14C, the first camera 34 is sequentially moved so that the image capturing range 18 sequentially surrounds the eight electronic component mounting positions 16 a set on the substrate 16. Then, the first camera 34 is retracted from above the substrate 16. Then, the image captured by the first camera 34 is processed by the first recognition processing unit 55, and the next inspection process is performed.
[0091]
First, with respect to the images in the four image capturing ranges 18 on the left side, an inspection of the mounting state of the chip 6, that is, whether or not the position / posture deviation of the chip 6 is normal is inspected. Then, regarding the four image capturing ranges 18 on the right side, position recognition of the electronic component mounting position 16a of the board 16 is performed. Here, during the execution of (4) -1 transfer step (pickup), (6) substrate recognition step ((6) -1 substrate recognition step (mounting position recognition), (6) -2 substrate recognition step (mounting) Condition check)) is performed.
[0092]
Thereafter, the operation proceeds to the operation shown in FIG. In this operation, similarly to the operation shown in FIG. 11B, the (3) -1 loading step (removal) is executed following the (4) -2 transfer step (delivery). Thereafter, the same unit process described above is repeatedly executed at the same timing.
[0093]
As a result, the mounting of the chip 6 at each electronic component mounting position 16a of the substrate 16 is completed as shown in FIG. 14D, and thereafter the right four chips 6 are mounted as shown in FIG. 14E. Imaging for state inspection is performed, and the electronic component mounting work on the substrate 16 is completed.
[0094]
As described above, in the electronic component mounting method of the present embodiment, the holding head 74 provided on the reversing stage 17 is arranged in parallel with the arrangement of the nozzles 33 a of the mounting head 33 on the flux 80 of the stage 79. The chip 6 is disposed, and the flux is applied to the bumps 6a and the bumps 6a are flattened.
[0095]
As a result, the mounting head does not require a pressing mechanism for pressing the bumps against the flattening surface during flattening that also serves as flux transfer, and does not require sufficient strength to withstand this pressing force. For this reason, the structure of the mounting head 33 can be simplified and reduced in weight, and the speed of the mounting operation can be increased.
[0096]
Further, in the mounting operation, the flux transfer operation that also serves as the flattening operation performed by the holding head 74 and the mounting operation by the mounting head 33 can be performed in parallel, and until the mounting on the board 16 is completed after the components are taken out. It is possible to shorten the tact time and improve the working efficiency of the mounting operation.
[0097]
Further, in the present embodiment, the mounting head 33 is provided with a plurality of mounting nozzles 33a, and the holding head 74 is also provided with a plurality of chip holding portions 74a, so that the arrangement of the mounting head 33 and the holding head 74 is matched. A plurality of chips 6 can be delivered to the holding head 74 by the mounting head 33 simultaneously, and a plurality of chips 6 arranged on the flux film 80a can be simultaneously taken out by the mounting head 33 by the holding head 74. . For this reason, the mounting work time of the chip 6 by the mounting head 33 can be shortened, and the productivity can be increased. In the present embodiment, when the shaping of the bump 6a is unnecessary, the pressurization (the shaping of the bump 6a) in the arrangement step may be omitted.
[0098]
【The invention's effect】
According to the present invention, since work is performed by a plurality of mounting nozzles, work efficiency per part can be improved. In addition, the mounting head delivers the electronic components in the electronic component supply unit to the holding head, and the holding head takes out the electronic components placed on the adhesive and mounts them on the board. The required pickup means can be eliminated and the apparatus can be simplified.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a side sectional view of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a perspective view of a reversing stage of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 5 is a reversing stage of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a diagram illustrating the operation of the reversing stage of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7 is a diagram illustrating the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 8 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 9 is a timing chart of the electronic component mounting method according to the embodiment of the present invention. Process explanatory drawing of the electronic component mounting method of one embodiment of the invention FIG. 12 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the invention. FIG. 12 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the invention. FIG. 14 is a plan view of a substrate to be mounted with an electronic component according to an embodiment of the present invention.
2 Electronic component supply unit 6 Chip 10 Substrate holding unit 10A First substrate holding mechanism 10B Second substrate holding mechanism 15 Third camera 16 Substrate 16a Electronic component mounting position 17 Reversing stage 30 Center beam member 31 First beam member 32 Second Beam member 33 Mounting head 33a Nozzle 34 First camera 35 Second camera 54d Pickup control unit 54e Mounting control unit 55 First recognition processing unit 56 Second recognition processing unit 57 Third recognition processing unit 74 Holding head 74a Tip holding part 80 Flux 83 Squeegee unit

Claims (6)

An electronic component mounting apparatus for applying an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes formed on a protruding electrode forming surface and mounting the electronic component on a workpiece,
An electronic component supply unit that supplies a plurality of electronic components with the protruding electrode formation surface facing upward;
An adhesive supply unit for supplying an adhesive in a state where the adhesive is spread on a flat stage and the liquid level is flattened;
A holding head having a plurality of electronic component holding portion for holding the rear surface side of the electronic component has a reversing actuator for vertically inverting the retaining head, the retaining head be vertically reversed by driving the reversing actuator and stickies applying means for applying an adhesive material to the protruding electrodes arranged an electronic component held by the holding head on stickies which are spread over the stage by,
A mounting head having a plurality of mounting nozzles for sucking and holding electronic components; and picking up a plurality of electronic components of the electronic component supply unit by the mounting head and delivering them to the holding head; An electronic component mounting apparatus, comprising: mounting means for picking up the electronic components disposed on the workpiece by the plurality of mounting nozzles and mounting the electronic components on the workpiece. The electronic component mounting apparatus according to claim 1, wherein an arrangement of mounting nozzles of the mounting head and an arrangement of electronic component holding portions of the holding head coincide with each other. 2. The electronic component mounting apparatus according to claim 1, wherein the stage has a width that allows a plurality of electronic components held by the holding head to be arranged on an adhesive. An electronic component mounting method of applying an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes on a protruding electrode forming surface and mounting the electronic component on a workpiece,
A plurality of electronic components supplied with the protruding electrode formation surface facing upward are picked up by a plurality of mounting nozzles of the mounting head, and the picked-up electronic components are held heads with the back surface of the electronic components facing upward A transfer process of holding the electronic component holding part and delivering it,
An application step of applying an adhesive to the protruding electrodes of the electronic component by placing the plurality of electronic components held by the holding head by turning the holding head upside down on an adhesive that is extended on a flat stage;
A mounting step in which a plurality of electronic components arranged on the stage are taken out by a mounting nozzle of the mounting head and mounted on a workpiece. A plurality of electronic components are simultaneously transferred from the mounting nozzle of the mounting head to the holding head in the transfer step, and a plurality of electronic components are simultaneously extracted from the stage by the mounting nozzle in the mounting step. The electronic component mounting method according to claim 4. In the transfer step, if the electronic component is transferred from the mounting head to the holding head, the electronic component already arranged on the stage is immediately taken out by the mounting nozzle of the mounting head, and then the adhesive on the stage 5. The electronic component mounting method according to claim 4, wherein the liquid surface is flattened by the squeegee and then the electronic component held by the holding head is disposed on the adhesive.

Images