JP2006190864A - Apparatus and method for mounting part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting a part for speedily and stably performing part transfer operation on a part inverting stage for inverting parts taken out of a part supply section by a low-cost and simple mechanism. <P>SOLUTION: In the part inverting stage arranged at the part mounting apparatus for mounting a chip 6 on a substrate after inverting it up and down, a holding plate 42 that can be inverted up and down while a holding section 43 for holding the chip 6 from the back side is provided, and a part placement section 41 on which a placement surface 41a is provided are placed side by side. A takeout nozzle 33a corresponding to the arrangement of the holding section 43, and a mounting nozzle 33b corresponding to the arrangement of the chip 6 at the part holding section 41 are fitted to a single mounting head 33, thus the chip 6 taken out of the part supply section 2 can be placed to the holding section 43 by the takeout nozzle 33a and the chip 6 can be holded after inversion by the mounting nozzle 33b by the same head elevation operation. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate.

  In the component mounting apparatus, the mounting operation of holding the component taken out from the component supply unit by the mounting head and mounting it on the substrate is repeatedly performed. Parts with bumps, which are projecting electrodes for connection, such as flip chips, are generally supplied with the bump forming surface facing upward, and the components taken out from the component supply unit have their bump forming surfaces turned upside down. Mounted on the board in a downward orientation. As a component mounting device for components that require upper limit reversal after taking out in this way, a plurality of components are obtained by reversing a holding head on which a plurality of components are placed on a stage on which a flux film is formed. There is known a component mounting apparatus provided with a component reversing stage configured to reverse all at once and transfer a flux to a bump (see Patent Document 1).

In this patent document example, a component pick-up transport head for moving a component from a component supply unit to a component reversing stage, and a component mounting for removing the reversed component from the component reversing stage and transferring and mounting it on a substrate An example (Embodiment 1) in which a common parts transport head is used as a common parts transport head, and an example (Embodiment 2) in which dedicated parts transport heads are provided respectively for picking up components and mounting components are disclosed. Yes. By adopting the former, it is possible to carry out all of the component extraction and component mounting with a single component conveying head, so that the mechanism can be simplified and the cost can be reduced. In addition, by adopting the latter, it is possible to carry out the component picking operation and mounting operation in parallel with the dedicated component transport head, shortening the work time from component picking up to mounting and improving the work efficiency. There is an advantage.
JP 2003-282642 A

  In order to achieve the maximum work efficiency at a low equipment cost, it is desirable to adopt a method in which all work is performed by a single component transport head. However, when this method is adopted, the following inconvenience occurs in the movement operation of the component transport head. In this method, since the parts are held by a common holding nozzle, the holding nozzle holds the parts taken out from the parts supply unit and held by the holding head, and then moves onto the part stage to hold the inverted parts. To do. In other words, the holding nozzle must perform an operation of holding a new part immediately after the held part is detached. However, in the process of repeatedly performing such component detachment / holding operations, it has been difficult to ensure a high-speed and stable component transfer operation.

  Accordingly, the present invention provides a component mounting apparatus and a component mounting method capable of performing a component transfer operation in a component reversing stage for reversing a component taken out from a component supply unit at a high speed and stably by a low cost and simple mechanism. The purpose is to do.

A component mounting apparatus according to the present invention is a component mounting device in which a component having an electrode surface on one side of which an electrode is formed is turned upside down and mounted on a substrate by a mounting head, with the component facing the electrode surface upward. A component supply unit that is supplied in a posture; a component mounting unit that extracts the component from the component supply unit and mounts the component on a substrate; and a holding unit that holds the component extracted from the component supply unit from the back side opposite to the electrode surface A holding plate provided with a portion, a reversing mechanism for reversing the component by reversing the holding plate, and a component stage for placing the reversed component in a posture with the back surface facing upward. The component mounting means takes out the component from the component supply unit by holding it from the electrode surface side and holds it by the holding unit, and the extraction nozzle A mounting nozzle for receiving the component from the back side and mounting it on the substrate by mounting from the component stage, and a single mounting head mounted with the same number of extraction nozzles and mounting nozzles. .

  The component mounting method of the present invention is a component mounting method in which a component having an electrode surface on one side of which an electrode is formed is turned upside down and mounted on a substrate by a mounting head, with the component facing the electrode surface upward. A component take-out process in which a plurality of the components are taken out from the electrode surface side by holding them from the electrode surface side and held in a holding portion provided on the holding plate, and the holding plate is turned over to reverse the holding plate. A component reversing process in which a plurality of components are turned upside down and placed on a component stage, and a component received from the component stage by holding the plurality of components from the back side opposite to the electrode surface and mounted on the substrate A picking nose arranged in the mounting head in correspondence with the arrangement of the holding portions in the holding plate in the component picking up step. In the component mounting step, the same number of extraction nozzles as the number of extraction nozzles are provided in the component mounting step, and the components are mounted by the mounting nozzles corresponding to the arrangement of the components on the component stage. Hold.

  According to the present invention, the same number of takeout nozzles for taking out components from the component supply unit and transporting them to the component reversal stage and mounting nozzles for receiving components from the component reversal stage and mounting them on the substrate are provided in a single mounting. By adopting the configuration of mounting on the head, the component transfer operation in the component reversing stage for reversing the component taken out from the component supply unit can be performed at high speed and stably by a low cost and simple mechanism.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of the component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a component mounting according to an embodiment of the present invention. FIG. 4 is a perspective view of a component reversing stage of the component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a component reversal of the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a plan view of the stage, FIG. 6 is an explanatory diagram of the operation of the component mounting operation by the component mounting device according to the embodiment of the present invention, and FIGS. 7 and 8 are the components inversion operation in the component mounting device of the embodiment of the present invention. It is operation | movement explanatory drawing.

  First, the entire structure of the component mounting apparatus will be described with reference to FIGS. This component mounting apparatus has a function of turning a component having an electrode surface on one side of which electrodes are formed upside down and mounting the component on a substrate by a mounting head. FIG. 2 shows an AA arrow view in FIG.

  In FIG. 1, a component supply unit 2 is disposed on a base 1. As shown in FIG. 2, the component supply unit 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 on which the sheet 5 is mounted. A semiconductor chip (hereinafter simply abbreviated as “chip 6”) as a component is attached to the sheet 5 in a state of being separated into individual pieces. A plurality of bumps 6 a that are protruding electrodes are formed on the upper surface of the chip 6, and in a state where the jig 4 is held by the jig holder 3, the component supply unit 2 places the plurality of chips 6 on the bump formation surface (electrode surface). ) In a posture facing upward.

In FIG. 2, an ejector 8 is disposed below the sheet 5 held by the jig holder 3 so as to be horizontally movable by an XY table 7. The ejector 8 includes a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up the chip. When the chip 6 is picked up from the sheet 5 by a mounting head described later, the chip 6 is ejected from below the sheet 5 by the ejector pin. By pushing up, the chip 6 is peeled from the sheet 5. The ejector 8 serves as a sheet peeling means for peeling the chip 6 from the sheet 5. As a sheet peeling means, besides the pushing-up method using an ejector pin, a method of peeling the sheet 5 from the chip 6 by vacuum-sucking the sheet 5 from the lower surface side, or irradiating ultraviolet light from the lower surface side of the sheet 5 Various methods such as a method for reducing the adhesive force of the chip 6 can be used.

  In FIG. 1, a substrate holding unit 10 is arranged at a position spaced from the component supply unit 2 on the upper surface of the base 1 in the Y direction. A substrate carry-in unit 11 and a substrate carry-out unit 12 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The substrate carry-in unit 11 receives the substrate 13 supplied from the upstream side and carries it into the substrate holding unit 10. The board holding unit 10 holds the carried board 13 and positions it at the component mounting position. The board unloading unit 12 unloads the board 13 after mounting the components transferred from the board holding unit 10 to the downstream side.

  In FIG. 1, Y-axis bases 20A and 20B are arranged in the Y direction at both ends of the upper surface of the base 1, and Y-direction guides 21 are arranged on the upper surfaces of the Y-axis bases 20A and 20B over substantially the entire length. It is installed. On the Y-axis bases 20A and 20B, three beam members, a first beam member 31, a center beam member 30, and a second beam member 32, are supported at both ends by Y-direction guides 21 and are slidable in the Y direction. It is erected.

  The center beam member 30 includes a mounting head 33 that moves in the Y direction by the Y-axis drive mechanism 22 and that can move in the X direction by the built-in X-axis drive mechanism. The mounting head 33 is movable in the X direction and the Y direction within a moving range including the component supply unit 2 and the substrate holding unit 10, and the chip 6 is taken out from the component supply unit 2 to be mounted on the substrate holding unit 10. The chip 6 is mounted on the held substrate 13. Therefore, the center beam member 30, the Y-axis drive mechanism 22, and the mounting head 33 serve as component mounting means for taking out the chip 6 from the component supply unit 2 and mounting it on the substrate 13.

  As shown in FIG. 3, nozzle groups A and B in which a plurality of nozzles are arranged are mounted on the lower surface of the mounting head 33. The nozzle groups A and B each have four take-out nozzles 33a and mounting nozzles 33b. Consists of. The take-out nozzle 33a is a nozzle for taking out the chip 6 from the component supply unit 2, and is manufactured in a shape, size and material suitable for holding the bump forming surface of the chip 6 by suction. The mounting nozzle 33b is a nozzle for holding the chip 6 taken out by the take-out nozzle 33a and turned upside down and mounting the chip 6 on the substrate 13. The chip 6 is sucked and held from the back side, and the chip 6 is attached to the substrate. The shape, size and material are suitable for pressing.

  These nozzle groups A and B are arranged along the X direction on the lower surface of the mounting head 33, and each nozzle has two nozzle arrangement lines NL1 and NL2 set in the X direction with a pitch py therebetween. Is placed on top. In the nozzle groups A and B, four take-out nozzles 33a and mounting nozzles 33b are mounted in a cross beam arrangement (X direction pitch px, Y direction pitch py), respectively. The nozzle groups A and B are arranged with an arrangement interval d1 (interval between nozzles located inside each nozzle group). The relative arrangement of the four take-out nozzles 33a and the four mounting nozzles 33b shown here corresponds to the relative arrangement of the holding unit that holds the chip 6 and the inverted chip 6 in the component inversion stage described later. It has become.

The first beam member 31 and the second beam member 32 are moved in the Y direction by the Y-axis drive mechanism 23 and the Y-axis drive mechanism 24, respectively, and are arranged to be movable in the X direction by the built-in X-axis drive mechanism. A substrate recognition camera 34 and a supply unit recognition camera 35 are provided. The substrate recognition camera 34 moves above the substrate holding unit 10 to image the substrate 13, and the supply unit recognition camera 35 moves above the component supply unit 2 to image the chip 6 held on the sheet 5. To do.

  Then, by recognition processing of these imaging results, the component mounting position on the substrate 13 in the substrate holding unit 10 and the position of the chip 6 in the component supply unit 2 are recognized. In a component picking operation and a component mounting operation to be described later, the position correction of the mounting head 33 is performed based on these recognition results.

  A component recognition camera 15 and a component reversing stage 14 are fixed to the base 1 between the component supply unit 2 and the substrate holding unit 10. The component recognition camera 15 includes a line camera that captures a one-dimensional image, and the mounting head 33 that holds the chip 6 on the mounting nozzle 33b moves in the X direction above the component recognition camera 15 to be held on the mounting nozzle 33b. The chip 6 in the state of being taken is imaged. The position of the chip 6 is detected by recognizing the imaging result.

  The structure of the component reversing stage 14 will be described with reference to FIGS. The component reversing stage 14 has a function as a component reversing device that vertically flips the chip 6 having the bump forming surface. In FIG. 4, the base member 40 is fixed to the base 1 by a bracket 14a (see FIG. 2). A component placement portion 41 is disposed on the upper surface of the base member 40. The bottom surface of the concave portion provided on the upper surface of the component mounting portion 41 is a smooth mounting surface 41a, and a flux 48, which is an adhesive, is extended on the mounting surface 41a in a film shape.

  At a position adjacent to the component placement portion 41 in the X direction, a holding plate 42 is disposed with its lower surface held by a reversing member 44. On the upper surface of the holding plate 42, holding portions 43 having suction holes 43a are provided at four locations. The chip 6 is placed on the holding surface 43 by a plurality of take-out nozzles 33a of the mounting head 33 (see FIG. 7A).

  The arrangement pitch of the take-out nozzles 33a in the mounting head 33 coincides with the arrangement pitch of the holding portions 43 in both the X direction and the Y direction, as will be described later, and the four chips 6 taken out from the component supply unit 2 by the mounting head 33. Can be placed on the four holding portions 43 simultaneously. The suction hole 43 a is connected to a vacuum suction source (not shown), and the vacuum suction from the suction hole 43 a is performed with the chip 6 taken out from the component supply unit 2 with the bump formation surface facing upward and placed on the holding unit 43. As a result, the chip 6 is sucked and held by the holding portion 43. That is, the holding unit 43 holds the chip 6 taken out from the component supply unit 2 from the back side.

  A reverse shaft 46 supported by a bearing 45 is coupled to the end of the reverse member 44 on the Y direction side. The reversing shaft 46 is rotationally driven by a rotating mechanism 47 using a rotary air actuator. By driving the rotating mechanism 47 and rotating the reversing shaft 46 by 180 °, the holding plate 42 is inverted up and down around the reversing shaft 46. . By driving the rotation mechanism 47 in a state where the chip 6 is held by the holding portion 43 of the holding plate 42, the chip 6 held by the holding portion 43 of the holding plate 42 is turned upside down on the component placement portion 41. (See FIG. 7). That is, the rotation mechanism 47 is a reversing mechanism that flips the chip 6 upside down by reversing the holding plate 42.

The chip 6 that is turned upside down is placed on the placement surface 41a of the component placement portion 41 so that the reverse shaft 46 is symmetric with each holding portion 43 (the chip placement position 41b shown in FIG. 5). The bump 6a is pressed against the mounting surface 41a on which the flux 48 is extended, and the bump 6a contacts the flux 48 applied to the mounting surface 41a. And flattening which smoothes the tip part of bump 6a with the pressing force at this time is performed. That is, the component mounting portion 41 is a component stage that mounts the inverted chips 6 in a posture in which the back surface opposite to the bump forming surface faces upward.

  Here, with reference to FIG. 5, the arrangement of the holding portions 43 on the holding plate 42 and the arrangement of the chip mounting positions 41b on the mounting surface 41a will be described. As shown in FIG. 5, in the forward rotation state with the holding portion 43 facing upward, the four holding portions 43 of the holding plate 42 are arranged with the arrangement of the four extraction nozzles 33 a in the mounting head 33 (in the X direction and the Y direction). They are arranged in an array equal to the grid arrangement of the pitches px and py, respectively (see FIG. 3). Since the arrangement of the chip placement positions 41b on the placement surface 41a is an arrangement in which the arrangement of the holding portions 43 is moved to a symmetrical position with respect to the reversal axis 46, similarly, the pitch px in each of the X direction and the Y direction. , Py.

  The distance d2 between the holding portion 43 located near the reversing shaft 46 in the holding plate 42 and the chip placement position 41b located near the reversing shaft 46 in the component placing portion 41 is equal to the arrangement interval d1 shown in FIG. In this manner, the positional relationship among the component placement portion 41, the holding plate 42, and the reverse shaft 46 is set. That is, the relative arrangement of the holding portion 43 in the holding plate 42 in the normal rotation state and the chip placement position 41b in the component placement portion 41 corresponds to the relative arrangement of the take-out nozzle 33a and the mounting nozzle 33b shown in FIG. Thus, when the mounting head 33 is lowered with respect to the component reversing stage 14, the take-out nozzle 33a is aligned with the holding portion 43, and the mounting nozzle 33b is simultaneously aligned with the chip mounting position 41b. It can be done.

  The chip 6 taken out from the mounting surface 41a by the mounting nozzle 33b moves together with the mounting head 33 in a state where the flux 48 is transferred and applied to the tip of the bump 6a. Here, since the arrangement of the plurality of chip placement positions 41b is equal to the arrangement of the mounting nozzles 33b, the plurality of chips 6 can be simultaneously sucked and held by the plurality of mounting nozzles 33b of the mounting head 33. Yes. Thereafter, the mounting head 33 moves to the substrate holding unit 10, where the chip 6 held by the plurality of mounting nozzles 33 b is sequentially mounted on the substrate 13 by causing the mounting head 33 to perform a component mounting operation. The

  That is, the above-described component mounting means takes out the chip 6 from the component supply unit 2 by holding it from the bump forming surface side and holds it on the holding unit 43 of the holding plate 42, and the extraction nozzle 33a. A single mounting head provided with a mounting nozzle 33b, which is provided separately from the component mounting portion 41 to receive the chip 6 from the back side and is mounted on the substrate 13, and the same number of take-out nozzles 33a and mounting nozzles 33b are mounted. 33.

  In the component reversing stage 14, the flux 43 is spread on the placement surface 41 a of the component placing portion 41, and the chip 6 is turned upside down by the component reversing unit 45 to apply the flux 43 to the bumps 6 a. I am doing so. As a result, the mechanism can be simplified and the space can be saved as compared with the configuration in which the flux transfer stage is provided separately from the component reversal stage, and the component reversal and the flux transfer can be performed in the same process. Shortening is realized.

  The mounting arrangement of the take-out nozzle 33a and the mounting nozzle 33b in the mounting head 33 corresponds to the arrangement of the holding plate 42 and the component mounting portion 41 in the normal rotation posture with the holding portion 43 facing upward. That is, the take-out nozzle 33a side (nozzle group A side shown in FIG. 3) corresponds to the holding plate 42 side, and the mounting nozzle 33b side (nozzle group B side shown in FIG. 3) corresponds to the component mounting block 41 side. It has become.

  Thus, when the mounting head 33 accesses the component reversing stage 14, the nozzles constituting the two nozzle groups are moved to their respective operation target positions (the holding plate 42 for the take-out nozzle 33a and the component mounting for the mounting nozzle 33b). Block 41) is accessed with the correct correspondence. Therefore, the mounting head 33 can be moved without waste to move the two nozzle groups to the respective operation target positions, and an efficient component mounting operation can be realized.

  Further, in the above embodiment, the arrangement interval d1 shown in FIG. 3 is made to coincide with the interval d2 shown in FIG. 5, and the relative arrangement (see FIG. 3) of the take-out nozzle 33a and the installation nozzle 33b in the mounting head 33 is normal rotation. This is a form corresponding to the relative arrangement (see FIG. 5) of the holding portion 43 in the holding plate 42 in the posture and the chip 6 in the component placement portion 41. Thus, in one nozzle lifting operation by the mounting head 33, the chip 6 held by the take-out nozzle 33a is placed on the holding plate 42, and the chip 6 placed on the component placement part 41 is placed on the mounting nozzle 33b. It is possible to hold by.

  When the arrangement interval d1 shown in FIG. 3 and the interval d2 shown in FIG. 5 do not match, the two nozzle groups A and B mounted on the mounting head 33 are simultaneously aligned with the component reversing stage 14. I can't. For this reason, it is necessary to perform the placement of the chip 6 before the upside down by the take-out nozzle 33a and the holding by the mounting nozzle 33b of the chip 6 turned upside down by separate head lifting operations. That is, after the mounting head 33 is moved to the component reversing stage 14, the chip 6 held by the take-out nozzle 33 a is first placed on the holding plate 42. Then, after performing an operation of raising the mounting head 33 and moving it in the X direction, an operation of holding the chip 6 by the mounting nozzle 33b is performed.

  Next, referring to FIG. 6, FIG. 7, and FIG. 8, a component mounting method in which a component having an electrode surface on one side of an electrode is turned upside down and mounted on a substrate by a mounting head, and this component mounting process is performed. The component reversing operation will be described. In FIG. 6A, a plurality of chips 6 are stuck to the sheet 5 held by the component supply unit 2 in a posture in which the bump forming surface is directed upward in an aligned state. In the component supply unit 2, first, the chip 6 to be taken out is imaged by the supply unit recognition camera 35, and these chips 6 are recognized. Then, after the supply unit recognition camera 35 has retreated, the mounting head 33 advances above the sheet 5, and the plurality of chips 6 to be taken out are sequentially sucked and held by the take-out nozzle 33a and taken out.

  Thereafter, the mounting head 33 holding the chip 6 in each take-out nozzle 33a moves above the component reversing stage 14 as shown in FIG. 6B. Thereafter, in the component reversing stage 14, the component reversing operation shown in FIGS. 7 and 8 is executed. First, as shown in FIG. 7A, the mounting head 33 holding the chip 6 is aligned with the component reversing stage 14 by the take-out nozzle 33a. As a result, the tip 6 held by the take-out nozzle 33 a is positioned immediately above the holding portion 43. Next, as shown in FIG. 7B, the mounting head 33 is moved up and down, and the chip 6 held by the take-out nozzle 33 a is placed on the holding portion 43 of the holding plate 42 and sucked and held.

  That is, the plurality of chips 6 are taken out from the component supply unit 2 by being held from the bump forming surface side by the take-out nozzle 33a and are held by the holding unit 43 provided on the holding plate 42 (component take-out step). In this component take-out step, the chip 6 is held by the take-out nozzle 33a arranged in the mounting head 33 corresponding to the arrangement of the holding portions 43 in the holding plate 42.

Thereafter, as shown in FIG. 7C, the holding plate 42 is turned upside down, and the bumps 6a of the chip 6 are landed on the mounting surface 41a on which the flux 48 is extended. Then, as shown in FIG. 7 (d), the holding plate 42 is turned upside down again, so that the chip 6 sucked and held by the holding portion 43 is placed on the placement surface 41 a of the component placement portion 41. . That is, by flipping the holding plate 42, the chip 6 held by the holding portion 43 is turned upside down and placed on the component placement portion 41 (component reversing step).

  Thereafter, the mounting head 33 again moves to the component supply unit 2, and after the plurality of chips 6 are taken out again from the sheet 5 by the take-out nozzle 33 a, the mounting head 33 moves to the component reversing stage 14. Then, as shown in FIG. 8A, the mounting head 33 is aligned with the component reversing stage 14. Thereby, the chip 6 held by the take-out nozzle 33a is positioned immediately above the holding portion 43, and the mounting nozzle 33b is positioned immediately above the chip 6 already mounted on the mounting surface 41a.

  Next, as shown in FIG. 8B, the mounting head 33 is lowered, the chip 6 held by the take-out nozzle 33a is held by the holding portion 43, and the mounting nozzle 33b is brought into contact with the back surface of the chip 6, The chip 6 is sucked and held. And as shown in FIG.8 (c), the mounting head 33 is raised and the chip | tip 6 adsorbed-held by the mounting nozzle 33b is raised from the mounting surface 41a. At this time, the flux 48 extended on the mounting surface 41a is applied to the lower end of the bump 6a by transfer. That is, here, the flux 48 is spread on the component mounting portion 41, and the chip 48 is turned upside down in the component reversing step so that the flux 48 is applied to the bumps 6a.

  On the mounting surface 41a after the chip 6 is taken out, squeegee (not shown) is reciprocated to scrape the flux 48 and perform squeezing to smoothly repair the flux film roughened by the transfer. As a result, the component reversal stage 14 returns to the state shown in FIG. 7B, and thereafter the same operation is repeatedly executed. The mounting head 33 holding the chip 6 after the flux transfer moves above the component recognition camera 15 as shown in FIG. 6B, and recognizes the chip 6 here. Thereafter, the mounting head 33 moves to the substrate holding unit 10 and sequentially mounts the chips 6 held by the holding nozzles 33a at the component mounting positions on the substrate 13.

  In other words, the plurality of chips 6 are received from the component mounting portion 41 by being held from the back side and mounted on the substrate 13 (component mounting step). In this component mounting step, the same number of extraction nozzles 33a as the number of extraction nozzles 33a are provided separately from the extraction nozzles 33a, and the chips 6 are mounted by the mounting nozzles 33b disposed on the mounting head 33 corresponding to the arrangement of the chips 6 in the component mounting portion 41. I try to keep it.

  As described above, the relative arrangement of the take-out nozzle 33 a and the mounting nozzle 33 b in the mounting nozzle 33 corresponds to the relative arrangement of the holding portion 43 in the holding plate 42 and the chip 6 in the component placement portion 41. Thereby, in one nozzle raising / lowering operation by the mounting head 33, the chip 6 held by the take-out nozzle 33a is placed on the holding plate 42, and the chip 6 placed on the component placement part 41 is placed on the mounting nozzle. The operation form held by 33b becomes possible, and the operation efficiency of the mounting head 33 can be greatly improved.

  As described above, in the component mounting apparatus shown in the present embodiment, the take-out nozzle 33a that takes out the chip 6 from the component supply unit 2 and conveys it to the component reversing stage 14 and the chip 6 from the component reversing stage 14 are received. A configuration is adopted in which the same number of mounting nozzles 33 b mounted on the substrate 13 are provided and mounted on a single mounting head 33. Therefore, the operation of placing the chip 6 on the holding plate 2 while holding the bump forming surface, and the chip 6 placed on the component placement portion 41 after being inverted upside down are held on the substrate 13 from the back side. The mounting operation can be executed by a dedicated nozzle.

  As a result, inconvenience that occurs when the above two operations are performed by a common holding nozzle, for example, operation instability that occurs when a new component is sucked and held immediately after the component held by the holding nozzle is sucked and held. In addition, the component transfer operation in the component inversion stage 14 that inverts the chip 6 taken out from the component supply unit 2 can be performed at high speed and stably by a low-cost and simple mechanism including a single mounting head. Furthermore, since the take-out nozzle 33a and the mounting nozzle 33b can be manufactured with shapes, sizes, and materials corresponding to the target operating characteristics, the transfer operation can be stabilized.

  The component mounting apparatus of the present invention has the effect that the component transfer operation in the reversing mechanism for reversing the component taken out from the component supply unit can be performed at high speed and stably by a low cost and simple mechanism. This is useful for a component mounting apparatus in which a component having an electrode surface such as a chip is mounted after being turned upside down.

The top view of the component mounting apparatus of one embodiment of this invention Side sectional view of a component mounting apparatus according to an embodiment of the present invention Explanatory drawing of nozzle arrangement | positioning in the mounting head of the component mounting apparatus of one embodiment of this invention The perspective view of the component inversion stage of the component mounting apparatus of one embodiment of this invention The top view of the component inversion stage of the component mounting apparatus of one embodiment of this invention Operation explanatory diagram of component mounting operation by component mounting device of one embodiment of the present invention Operation explanatory diagram of component reversal operation in component mounting apparatus of one embodiment of the present invention Operation explanatory diagram of component reversal operation in component mounting apparatus of one embodiment of the present invention

Explanation of symbols

2 Component supply unit 6 Chip 10 Substrate holding unit 13 Substrate 14 Component reversing stage 33 Mounting head 33a Extraction nozzle 33b Mounting nozzle 41 Component mounting unit 41a Mounting surface 42 Holding plate 43 Holding unit 46 Rotating mechanism 48 Flux

Claims (7)

A component mounting apparatus that vertically flips a component having an electrode surface on which an electrode is formed on one side and mounts it on a substrate by a mounting head,
A component supply unit for supplying the component with the electrode surface facing upward; component mounting means for extracting the component from the component supply unit and mounting the component on a substrate; and a component extracted from the component supply unit for the electrode A holding plate provided with a holding portion for holding from the back side opposite to the surface, a reversing mechanism for turning the component upside down by reversing the holding plate, and turning the reversed part upside down. Component stage to be placed in a different posture,
The component mounting means takes out the component from the component supply unit by holding it from the electrode surface side and holds it by the holding unit, and is provided separately from the extraction nozzle and removes the component from the component stage. A component mounting apparatus comprising: a mounting nozzle that is received by being held from the back side and mounted on the substrate; and a single mounting head on which the same number of extraction nozzles and mounting nozzles are mounted.   The component mounting apparatus according to claim 1, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by inverting the component by the reversing mechanism.   The mounting arrangement of the take-out nozzle and the mount nozzle in the mounting head corresponds to the arrangement of the holding plate and the component stage in a normal rotation posture with the holding portion facing upward, and the holding nozzle is held on the holding nozzle side. The component mounting apparatus according to claim 1, wherein the component mounting apparatus corresponds to a plate side, and the mounting nozzle side corresponds to the component stage side.   The relative arrangement of the take-out nozzle and the mounting nozzle in the mounting head corresponds to the relative arrangement of the holding part in the forward rotation holding plate and the component in the component stage. Item mounting apparatus according to Item 1. A component mounting method in which a part having an electrode surface on which an electrode is formed is turned upside down and mounted on a substrate by a mounting head,
A component take-out step of taking out the plurality of components by holding them from the electrode surface side and holding them on a holding portion provided on a holding plate from a component supply portion that supplies the components with the electrode surface facing upward. A component reversing step in which the plurality of components are turned upside down by placing the holding plate upside down and placed on the component stage, and the plurality of components from the component stage are held from the back side opposite to the electrode surface. And a component mounting process for receiving and mounting on the board,
In the component take-out step, the component is held by a take-out nozzle disposed in the mounting head corresponding to the arrangement of the holding portions in the holding plate,
In the component mounting step, the same number of extraction nozzles as the number of extraction nozzles are provided separately from the extraction nozzle, and the components are held by a mounting nozzle disposed in the mounting head corresponding to the arrangement of the components on the component stage. Component mounting method.   The relative arrangement of the take-out nozzle and the mounting nozzle in the mounting nozzle corresponds to the relative arrangement of the holding portion in the holding plate and the component in the component stage, and the nozzle is moved up and down once by the mounting head. 6. The component mounting method according to claim 5, wherein the component held by the take-out nozzle is placed on the holding plate, and the component placed on the component stage is held by the mounting nozzle. . 6. The component mounting method according to claim 5, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by reversing the component in the component reversing step.

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