JP4466377B2 - Component mounting device, component mounting method, component reversing device, and component reversing method - Google Patents

Description

  The present invention relates to a component mounting apparatus and component mounting method for mounting a component on a substrate, and a component reversing apparatus and component reversing method for reversing the component.

In the component mounting apparatus, the mounting operation of holding the component taken out from the component supply unit by the mounting head and mounting it on the substrate is repeatedly performed. Parts with bumps, which are projecting electrodes for connection, such as flip chips, are generally supplied with the bump forming surface facing upward, and the components taken out from the component supply unit have their bump forming surfaces turned upside down. Mounted on the board in a downward orientation. As such a component mounting apparatus for components that require upper limit reversal after removal, a plurality of components are placed on the stage on which the flux film is formed by reversing a holding head on which a plurality of components are mounted. 2. Description of the Related Art A component mounting apparatus having a reversing mechanism configured to reverse components all at once and transfer flux to bumps is known (see Patent Document 1).
JP 2003-282642 A

  In the above-described conventional component mounting apparatus, since a plurality of components are held by a single holding head and this holding head is rotated around an axis provided on one end side, the components are taken out from the component supply unit. The holding head for placing a plurality of parts and the stage for placing the reversed parts need to be arranged in parallel in the reversing mechanism. For this reason, in the layout of each functional part in the component mounting apparatus, there is a problem that the space occupied by the reversing mechanism becomes large, which is contrary to the demand for compactness of the apparatus. This problem becomes more prominent as the number of parts to be reversed at the same time increases.

  Accordingly, the present invention provides a component mounting apparatus, a component mounting method, a component reversing apparatus, and a component reversing method, which can compactly configure a reversing mechanism for reversing a component taken out from a component supply unit and promote the downsizing of the device. The purpose is to provide.

A component mounting apparatus according to the present invention is a component mounting device in which a component having an electrode surface on one side of which an electrode is formed is turned upside down and mounted on a substrate by a mounting head, with the component facing the electrode surface upward. A component supply unit for supplying the component in a posture; a component stage for mounting the plurality of components in a posture with the back surface opposite to the electrode surface facing upward; and a holding unit for retaining the component from the back surface side. A plurality of holding plates disposed on the upper surface of the component stage, and the plurality of components are taken out from the component supply unit and held by the nozzle surface from the electrode surface side, and are held by the holding units of the plurality of holding plates. A component take-out means, and a reversing mechanism for reversing the plurality of holding plates to invert the components held on the holding plates and placing them on the component stage Wherein the mounting nozzle of the plurality of components from the component stage receiving by holding the back surface side and a component mounting unit for mounting to the substrate, the reversing mechanism is arranged above the component stage.

The component mounting method of the present invention is a component mounting method in which a component having an electrode surface on one side of which an electrode is formed is turned upside down and mounted on a substrate by a mounting head, with the component facing the electrode surface upward. A plurality of the components are taken out from the component supply unit to be supplied in a posture and held by the nozzle from the electrode surface side, and are held on the holding portions provided on each of the plurality of holding plates disposed on the upper surface of the component stage. A component take-out step for holding, and a plurality of holding plates are reversed by a reversing mechanism disposed above the component stage, so that the components held on the respective holding plates are turned upside down and placed on the component stage. The substrate is received by holding the plurality of components from the component stage from the back side by means of a mounting nozzle. And a component mounting step of mounting.

The component reversing device of the present invention is a component reversing device that vertically flips a component having an electrode surface on one side of which an electrode is formed, with the component placed in a posture with the back surface opposite to the electrode surface facing upward. A component stage to be placed, a plurality of holding plates disposed on the upper surface of the component stage and having a holding portion for holding the component from the back surface side, and the component is turned upside down by inverting the holding plate. and a reversing mechanism for placing the component stage, the reversing mechanism is the
It is arranged above the part stage .

The component reversal method of the present invention is a component reversal method for vertically reversing a component having an electrode surface on one side of which an electrode is formed, from a component supply unit that supplies the component with the electrode surface facing upward A component take-out step in which a plurality of the components are taken out by being held from the electrode surface side by a take-out nozzle and are held by holding portions provided on a plurality of holding plates disposed on the upper surface of the component stage; A component reversing step of inverting the holding plate by a reversing mechanism disposed above the plurality of components and placing them on a component stage.

According to the present invention, a plurality of holding plates each having a holding portion for holding a component from the back side are arranged on the upper surface of the component stage, and the plurality of holding plates are arranged by a reversing mechanism arranged above the component stage . By adopting a configuration in which a plurality of components are reversed at the same time, a reversing mechanism for reversing the components taken out from the component supply unit can be configured in a compact manner, and the device can be made compact.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of a component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a side sectional view of the component mounting apparatus according to one embodiment of the present invention, and FIGS. 3 and 4 are one embodiment of the present invention. FIG. 5 is a diagram illustrating the structure of the component reversing stage of the component mounting apparatus, FIG. 5 is a diagram illustrating the operation of the component mounting operation performed by the component mounting apparatus according to the embodiment of the present invention, and FIGS. It is operation | movement explanatory drawing of the component inversion operation | movement in a component mounting apparatus.

  First, the entire structure of the component mounting apparatus will be described with reference to FIGS. This component mounting apparatus has a function of turning a component having an electrode surface on one side of which electrodes are formed upside down and mounting the component on a substrate by a mounting head. FIG. 2 shows an AA arrow view in FIG.

  In FIG. 1, a component supply unit 2 is disposed on a base 1. As shown in FIG. 2, the component supply unit 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 on which the sheet 5 is mounted. A semiconductor chip (hereinafter simply abbreviated as “chip 6”), which is a component, is attached to the sheet 5 in a state of being separated into individual pieces. A plurality of bumps 6 a that are protruding electrodes are formed on the upper surface of the chip 6, and in a state where the jig 4 is held by the jig holder 3, the component supply unit 2 places the plurality of chips 6 on the bump formation surface (electrode surface). ) In a posture facing upward.

In FIG. 2, an ejector 8 is disposed below the sheet 5 held by the jig holder 3 so as to be horizontally movable by an XY table 7. The ejector 8 includes a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up the chip. When the chip 6 is picked up from the sheet 5 by a transfer head described later, the chip is ejected from below the sheet 5 by the ejector pin. The chip 6 is peeled from the sheet 5 by pushing up the chip 6. The ejector 8 serves as a sheet peeling means for peeling the chip 6 from the sheet 5. As a sheet peeling means, besides the pushing-up method using an ejector pin, a method of peeling the sheet 5 from the chip 6 by vacuum-sucking the sheet 5 from the lower surface side, or irradiating ultraviolet light from the lower surface side of the sheet 5 Various methods such as a method for reducing the adhesive force of the chip 6 can be used.

  In FIG. 1, a substrate holding unit 10 is arranged at a position spaced from the component supply unit 2 on the upper surface of the base 1 in the Y direction. A substrate carry-in unit 11 and a substrate carry-out unit 12 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The substrate carry-in unit 11 receives the substrate 13 supplied from the upstream side and carries it into the substrate holding unit 10. The board holding unit 10 holds the carried board 13 and positions it at the component mounting position. The board unloading unit 12 unloads the board 13 after mounting the components transferred from the board holding unit 10 to the downstream side.

  In FIG. 1, Y-axis bases 20A and 20B are arranged in the Y direction at both ends of the upper surface of the base 1, and Y-direction guides 21 are arranged on the upper surfaces of the Y-axis bases 20A and 20B over substantially the entire length. It is installed. On the Y-axis bases 20A and 20B, three beam members, a first beam member 31, a center beam member 30, and a second beam member 32, are supported at both ends by Y-direction guides 21 and are slidable in the Y direction. It is erected.

  The center beam member 30 includes a transfer head 33 that moves in the Y direction by the Y-axis drive mechanism 22 and that can move in the X direction by a built-in X-axis drive mechanism. Therefore, the transfer head 33 is movable in the X direction and the Y direction within a moving range including the component supply unit 2 and the substrate holding unit 10. Each transfer head 33 includes a plurality of holding nozzles 33a (here, 4 (X direction) × 2 rows (Y direction) = 8) holding each chip 6 by suction. The size and shape are set so that the chip 6 can be held from either the bump forming surface side or the back surface side (opposite the bump forming surface).

  By driving the Y-axis drive mechanism 22 and the X-axis drive mechanism while holding the chip 6 on each holding nozzle 33a, the transfer head 33 moves while holding the chip 6. Therefore, the transfer head 33, the center beam member 30, and the Y-axis drive mechanism 22 constitute a component transfer mechanism that moves by holding the chip 6 and releases the component by transferring the component.

  The first beam member 31 and the second beam member 32 are moved in the Y direction by the Y-axis drive mechanism 23 and the Y-axis drive mechanism 24, respectively, and are arranged to be movable in the X direction by the built-in X-axis drive mechanism. A substrate recognition camera 34 and a supply unit recognition camera 35 are provided. The substrate recognition camera 34 moves above the substrate holding unit 10 to image the substrate 13, and the supply unit recognition camera 35 moves above the component supply unit 2 to image the chip 6 held on the sheet 5. To do.

  Then, by recognition processing of these imaging results, the component mounting position on the substrate 13 in the substrate holding unit 10 and the position of the chip 6 in the component supply unit 2 are recognized. In a component picking operation and a component mounting operation, which will be described later, position correction of the transfer head 33 is performed based on these recognition results.

  A component recognition camera 15 and a component reversing stage 14 are disposed between the component supply unit 2 and the substrate holding unit 10. The component recognition camera 15 includes a line camera that captures a one-dimensional image. When the transfer head 33 holding the chip 6 on the holding nozzle 33a moves in the X direction above the component recognition camera 15, the component recognition camera 15 moves to the holding nozzle 33a. The held chip 6 is imaged. The position of the chip 6 is detected by recognizing the imaging result.

The structure of the component reversing stage 14 will be described with reference to FIGS. The component reversing stage 14 has a function as a component reversing device that vertically flips the chip 6 having the bump forming surface. As shown in FIG. 3A, the component reversing stage 14 includes a component mounting block 41 that is elongated in the X direction, which can be moved up and down by a lifting cylinder 42 on the base member 40, and further the component mounting block 41. A plurality of component reversing units 45 are arranged in parallel in the X direction above the X direction.

  The bottom surface of the concave portion provided on the upper surface of the component placement block 41 is a smooth placement surface 41a, and a flux 43, which is an adhesive, is extended on the placement surface 41a by a squeegee 44 in a film shape. As will be described later, the chip 6 reversed by the component reversing unit 45 is placed on the placement surface 41a with the back surface facing upward. That is, the component placement block 41 is a component stage on which the plurality of chips 6 are placed in a posture in which the back surface opposite to the bump formation surface is directed upward.

  The component reversing unit 45 arranged in parallel above the component mounting block 41 is held in an elongated shape in the Y direction by two bearing brackets 47 erected on both sides of the component mounting block 41 with the base member 40 interposed therebetween. The plate 46 is supported around the reversing shaft 48. One side (the upper surface in FIG. 3A) of the holding plate 46 is a holding surface 46a that holds the chip 6 from the back side, and each holding surface 46a has a plurality of (here, two) suction holes 46c. ) Is provided side by side in the Y direction. That is, a plurality of holding portions 46 b for holding the chips 6 are arranged along the longitudinal direction of the elongated holding plate 46.

  The suction hole 46c is connected to a vacuum suction source (not shown), and the chip 6 is held by vacuum suction from the suction hole 46c while covering the suction hole 46c and placing the chip 6 on the holding portion 46b. Adsorbed and held by the portion 46b. That is, the plurality of holding plates 46 include holding portions 46b that hold the chip 6 from the back surface side, and are disposed on the upper surface of the mounting surface 41a. That is, a plurality of holding plates 46 are arranged along the longitudinal direction of the elongated component mounting block 41.

  As shown in FIG. 3A, the chip 6 is placed on the holding surface 46 a of the component reversing unit 45 by the plurality of holding nozzles 33 a of the transfer head 33. Here, the arrangement pitch of the holding nozzles 33a in the transfer head 33 is the same as the arrangement pitch of the holding units 46b in the component reversing stage 14 in both the X direction and the Y direction, and the transfer head 33 takes out the components from the component supply unit 2. Eight chips 6 can be simultaneously held by the eight holding portions 46 b of the component reversing stage 14.

  That is, the pitch py (FIG. 3B) of the holding portions 46b in the holding plate 46 is set to coincide with the arrangement pitch (see FIG. 2) of the holding nozzles 33a in the transfer head 33 in the Y direction. Yes. The arrangement pitch in the X direction of the holding plates 46 in the component reversing stage 14 corresponds to the arrangement pitch of the holding nozzles 33a in the component transfer mechanism, and the interval between the holding portions 46b is the holding nozzle 33a in the transfer head 33. Is set to coincide with the arrangement pitch px in the X direction. Therefore, the above-described component transfer mechanism takes out the plurality of chips 6 from the component supply unit 2 by holding them from the bump forming surface side by the holding nozzle 33a as a nozzle, and holds them on the holding units 46b of the plurality of holding plates 46. The component taking-out means to be made is comprised.

The holding plate 46 is coupled to a rotation mechanism 49 using a rotary air actuator via an inversion shaft 48. Each component reversing unit 45 drives the rotation mechanism 49 to rotate the reversing shaft 48 by 180 °, whereby the plurality of holding plates 46 are reversed up and down around the reversing shaft 48 in the same direction. By simultaneously driving the rotating mechanism 49 while holding the chip 6 on the holding portion 46b of each holding plate 46, the chip 6 held on the holding plate 46 is simultaneously moved up and down as shown in FIG. Inverted.

  In this state, the rod 42a of the elevating cylinder 42 is projected to raise the component placement block 41, whereby the bump 6a is pressed against the placement surface 41a on which the flux 43 is extended, and the bump 6a is placed. The flux 43 applied to the placement surface 41a comes into contact. And flattening which smoothes the tip part of bump 6a with the pressing force at this time is performed.

  Thereafter, in a state where the suction holding of the chip 6 by the suction hole 46c is released, the component mounting block 41 is lowered, and then the holding plate 46 is inverted in the direction in which the holding surface 46a faces upward, the plurality of chips 6 are Placed in a posture in which the back surface is directed upward at the chip placement position 41b on the placement surface 41a that is separated from the holding surface 46a (symmetrical position with respect to the reversal axis 48 of the holding portion 46b). It will be in the state. That is, the plurality of component reversing units 45 arranged on the upper surface of the component mounting block 41 inverts the plurality of holding plates 46 so that the chips 6 held on the respective holding plates 46 are turned upside down in the same direction. Thus, the reversing mechanism is mounted on the mounting surface 41a of the component mounting block 41.

  Thereafter, the chip 6 taken out from the mounting surface 41a by the holding nozzle 33a moves together with the transfer head 33 in a state where the flux 43 is transferred and applied to the tip of the bump 6a. Here, since the plurality of chip mounting positions 41b are equal to the arrangement of the holding portions 46b translated in the X direction, the plurality of chips 6 are simultaneously sucked by the plurality of holding nozzles 33a of the transfer head 33. It is possible to hold. Thereafter, the transfer head 33 moves to the substrate holding unit 10, where the chip 6 held by the plurality of holding nozzles 33 a is sequentially applied to the substrate 13 by causing the transfer head 33 to perform a component mounting operation. Installed.

  That is, here, the above-described component transfer mechanism receives a plurality of chips 6 from the component mounting block 41 by holding them from the back side by a holding nozzle 33a as a mounting nozzle, and mounts them on the substrate 13. Thus, the component mounting means is also used as the above-described component taking-out means. Of course, the component mounting means and the component taking-out means may be provided separately.

  In the component reversing stage 14, the flux 43 is spread on the placement surface 41 a of the component placing block 41, and the chip 6 is turned upside down by the component reversing unit 45 to apply the flux 43 to the bumps 6 a. I am doing so. As a result, the mechanism can be simplified and the space can be saved as compared with the configuration in which the flux transfer stage is provided separately from the component reversal stage, and the component reversal and the flux transfer can be performed in the same process. Shortening is realized.

  Next, referring to FIG. 5, FIG. 6, and FIG. 7, a component mounting method in which a component having an electrode surface on one side of an electrode is turned upside down and mounted on a substrate by a mounting head, and this component mounting process is performed. The component reversing operation will be described. In FIG. 5A, a plurality of chips 6 are stuck on the sheet 5 held by the component supply unit 2 in an aligned state with the bump formation surface facing upward. In the component supply unit 2, first, the chip 6 to be taken out is imaged by the supply unit recognition camera 35 to recognize these chips 6. Then, after the supply unit recognition camera 35 has retreated, the transfer head 33 advances above the sheet 5, and the plurality of chips 6 to be taken out are sequentially sucked and held by the holding nozzles 33a and taken out.

Thereafter, the transfer head 33 holding the chip 6 in each holding nozzle 33a moves above the component reversing stage 14 as shown in FIG. 5B. Thereafter, in the component reversing stage 14, the component reversing operation shown in FIGS. 6 and 7 is executed. Here, an operation process executed in one component reversing unit 45 of the component reversing stage 14 is shown.

  First, as shown in FIG. 6A, the chip 6 held by the holding nozzle 33a is placed on the holding surface 46a of the holding plate 46, and the chip 6 is sucked and held by the holding portion 46b. That is, a plurality of chips 6 are taken out from the component supply unit 2 by being held from the bump forming surface side by holding nozzles 33a serving as take-out nozzles, and are held by holding portions 46b provided on the respective holding plates 46 ( Part removal process).

  Thereafter, as shown in FIG. 6B, the holding plate 46 is turned upside down, and then the component placement block 41 is raised as shown in FIG. 6C, so that the flux 43 extends the bumps 6a of the chip 6. It is made to land on the placed mounting surface 41a. Then, as shown in FIG. 6D, the holding plate 46 is turned upside down again and the component placement block 41 is lowered so that the chip 6 held by the retention plate 46 is placed on the component placement block 41. It is mounted on the mounting surface 41a. That is, by inverting the plurality of holding plates 46, the chips 6 held on the respective holding plates 46 are turned upside down and placed on the component placement block 41 (component reversing step).

  Here, in the component take-out step, the chip 6 is held by a plurality of holding portions 46b arranged along the longitudinal direction of the elongated holding plate 46 (see FIG. 3B). Each chip 6 is inverted by individually inverting the plurality of holding plates 46 arranged along the longitudinal direction of the elongated component mounting block 41.

  Thereafter, the transfer head 33 moves again to the component supply unit 2, and after moving out the plurality of chips 6 from the sheet 5 again, moves to the component reversal stage 14. Then, as shown in FIG. 7A, the chip 6 held by the holding nozzle 33a is placed on the holding plate 46 and held by the holding portion 46b. Next, the holding nozzle 33a that has released the suction holding of the chip 6 moves above the chip 6 already placed on the placement surface 41a, and as shown in FIG. 7B, the chip 6 is moved by the holding nozzle 33a. Adsorb and hold from the back side.

  Next, as shown in FIG. 7C, the holding nozzle 33 a is raised together with the chip 6. At this time, the flux 43 extended to the mounting surface 41a is applied to the lower end portion of the bump 6a by transfer. That is, here, the flux 43 is spread on the component placement block 41, and the chip 6 is turned upside down in the component reversing step so that the flux 43 is applied to the bumps 6a. On the mounting surface 41a after the chip 6 is taken out, squeegee 44 is reciprocated to scrape the flux 43, and squeezing is performed to smoothly repair the flux film roughened by the transfer.

  Thereafter, the transfer head 33 holding the chip 6 after the flux transfer moves above the component recognition camera 15 as shown in FIG. 5B, and recognizes the chip 6 here. Thereafter, the chip 6 is moved to the substrate holding unit 10 and the chips 6 held by the holding nozzles 33a are sequentially mounted at the component mounting positions on the substrate 13. That is, in the present embodiment, the chip 6 is held by the common holding nozzle 33a in the component take-out process and the component mounting process.

  Then, in the component reversing stage 14, as shown in FIG. 7D, after the holding plate 46 is reversed again and the chip 6 is placed on the placement surface 41a, the holding plate 46 is placed with the holding surface 46a facing upward. Return to the normal rotation state. Thereby, the state returns to the state shown in FIG. 6D, and the same operation is repeatedly executed thereafter.

  As described above, in the component mounting apparatus configured to be mounted on the substrate 13 after the chip 6 taken out from the component supply unit 2 is inverted, by adopting the above configuration for the component inversion stage 14, the component supply unit 2. The function of the holding head that holds the chips 6 taken out from the substrate in a predetermined array and the function as a mounting stage that mounts the inverted chips 6 in the predetermined array are limited on one component mounting block 41. It is in a form arranged within the area.

  Therefore, compared with the conventional device in which the holding head for mounting the plurality of chips taken out from the component supply unit and the mounting stage for mounting the inverted components are individually arranged in parallel, The space occupied by the reversing mechanism can be halved, and the apparatus can be made compact.

  The component mounting apparatus of the present invention has an effect that the reversing mechanism for reversing the component taken out from the component supply unit can be compactly configured to promote the compactness of the device, and has an electrode surface such as a flip chip. This is useful for a component mounting apparatus in which a component is mounted after being turned upside down.

The top view of the component mounting apparatus of one embodiment of this invention Side sectional view of a component mounting apparatus according to an embodiment of the present invention Structure explanatory drawing of the component inversion stage of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the component inversion stage of the component mounting apparatus of one embodiment of this invention Operation explanatory diagram of component mounting operation by component mounting device of one embodiment of the present invention Operation explanatory diagram of component reversal operation in component mounting apparatus of one embodiment of the present invention Operation explanatory diagram of component reversal operation in component mounting apparatus of one embodiment of the present invention

Explanation of symbols

2 Component supply unit 5 Sheet 6 Chip 10 Substrate holding unit 13 Substrate 14 Component reversing stage 33 Transfer head 33a Holding nozzle 41 Component mounting block 41a Mounting surface 43 Flux 45 Component reversing unit 46 Holding plate 46a Holding surface 46b Holding unit 46c Adsorption hole 49 Rotation mechanism

Claims (16)

A component mounting apparatus that vertically flips a component having an electrode surface on which an electrode is formed on one side and mounts it on a substrate by a mounting head,
A component supply unit for supplying the component in a posture with the electrode surface facing upward, a component stage for placing the plurality of components in a posture with the back surface opposite to the electrode surface facing upward, and the component A plurality of holding plates provided on the upper surface of the component stage with a holding portion for holding from the back surface side, and taking out the plurality of components from the component supply portion by holding them from the electrode surface side by a nozzle. Component take-out means for holding the holding portions of the plurality of holding plates; a reversing mechanism for turning the plurality of holding plates upside down and placing the components held on the respective holding plates upside down; , received by holding the back surface side by the mounting nozzles of the plurality of components from the component stage and a component mounting unit for mounting the substrate
The component mounting apparatus, wherein the reversing mechanism is disposed above the component stage .   2. The plurality of holding portions are arranged along a longitudinal direction of the elongated holding plate, and a plurality of the holding plates are arranged along a longitudinal direction of the elongated part stage. The component mounting device described.   The component mounting apparatus according to claim 1, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by vertically inverting the component by the reversing mechanism.   2. The component mounting apparatus according to claim 1, wherein an arrangement pitch of the holding plates corresponds to an arrangement pitch of mounting nozzles in the component mounting means.   The component mounting apparatus according to claim 1, wherein the component mounting unit also serves as the component extraction unit. A component mounting method in which a part having an electrode surface on which an electrode is formed on one side is turned upside down and mounted on a substrate by a mounting head,
A plurality of components are taken out from a component supply unit that supplies the components with the electrode surface facing upward, by taking out the components from the electrode surface side by a nozzle, and a plurality of components arranged on the upper surface of the component stage . A component take-out process for holding the holding plate in each holding plate, and a component held on each holding plate by reversing the plurality of holding plates by a reversing mechanism disposed above the component stage. Including a component reversing step of turning upside down and placing on the component stage, and a component mounting step of receiving the plurality of components from the component stage by holding them from the back side by a mounting nozzle and mounting them on the substrate. Part mounting method.   In the component take-out step, the component is held by a plurality of holding portions arranged along the longitudinal direction of the elongated holding plate, and in the component reversing step, a plurality of components are arranged along the longitudinal direction of the elongated component stage. The component mounting method according to claim 6, wherein the arranged holding plates are individually inverted.   The component mounting method according to claim 6, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by vertically inverting the component in the component reversing step.   The component mounting method according to claim 6, wherein the component is held by a common holding nozzle in the component taking-out step and the component mounting step. A component reversing device for vertically reversing a component having an electrode surface on one side where electrodes are formed,
A plurality of component stages including a component stage for placing the component in a posture with the back surface opposite to the electrode surface facing upward, and a holding unit disposed on the upper surface of the component stage to hold the component from the back surface side; A holding plate, and a reversing mechanism for turning the component upside down and placing it on the component stage by reversing the holding plate ,
The component reversing apparatus, wherein the reversing mechanism is disposed above the component stage .   11. A plurality of the holding portions are arranged along a longitudinal direction of the elongated holding plate, and a plurality of the holding plates are arranged along a longitudinal direction of the elongated stage. Parts reversing device.   The component reversing apparatus according to claim 10, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by vertically inverting the component by the reversing mechanism.   The component reversing device according to claim 10, wherein an arrangement pitch of the holding plates corresponds to an arrangement pitch of mounting nozzles in the component mounting means. A component reversing method for vertically reversing a component having an electrode surface on one side where electrodes are formed,
A plurality of components are taken out from a component supply unit that supplies the components with the electrode surface facing upward, by taking out the components from the electrode surface side by a nozzle, and a plurality of components arranged on the upper surface of the component stage . A component take-out step for holding the holding plate on a holding plate and a reversing mechanism disposed above the component stage to invert the holding plate so that the plurality of components are turned upside down and placed on the component stage. A component reversing method comprising: a component reversing step. In the component take-out step, the component is held by a plurality of holding portions arranged along the longitudinal direction of the elongated holding plate, and in the component reversing step, a plurality of components are arranged along the longitudinal direction of the elongated component stage. The component reversing method according to claim 14, wherein the arranged holding plates are individually reversed.   The component reversal method according to claim 14, wherein an adhesive is spread on the component stage, and the adhesive is applied to the electrode by reversing the component in the component reversing step.

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