JP2003273166A - Electronic component loading device and electronic component loading method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component loading device capable of improving the work efficiency of electronic component loading work, and an electronic component loading method. <P>SOLUTION: In the electronic component loading device for loading chips 6 held on the adhesive sheet 5 of an electronic component supply part 2 in the posture with bump formation surfaces facing upward on a board by a loading head 33 provided with a plurality of nozzles 33a, a pickup head 37 having nozzles 37b in the same arrangement as the nozzles 33a, whose nozzles 37b are invertible by a rotary drive part 37d, is provided. The chips 6 are successively picked up from the adhesive sheet 5 with the nozzles 37b facing downward and then the picked-up chips 6 are delivered to the loading head 33 in the same arrangement as the nozzles 33a by turning the nozzles 37b upward. Thus, the time for holding the chips 6 by the loading head 33 is shortened and the work efficiency of the loading work is improved. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and electronic component mounting method for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art An electronic component mounting apparatus includes an electronic component mounting mechanism for holding an electronic component taken out from an electronic component supply section by a mounting head and mounting it on a substrate. The mounting head has a holding nozzle for holding electronic components, and a plurality of holding nozzles can be mounted on one mounting head so that a plurality of electronic components can be mounted in a single mounting operation in which the mounting head accesses the substrate. In many cases, a multi-nozzle type head provided with is used.

In such a case, when the electronic component to be picked up is a component supplied from the tape feeder, the arrangement pitch of the tape feeder arranged in the electronic component supply unit is adjusted to the nozzle pitch. This has the advantage that a plurality of electronic components can be adsorbed at the same time and the tact of mounting operation can be shortened.

[0004]

However, there are various forms of taking out the electronic component from the electronic component supply section, depending on the type of the electronic component as a target. For example, semiconductor chips are often supplied in a state of being adhered in a grid on an adhesive sheet, and semiconductor packages are often supplied in a state of being stored in a container such as a component tray in a regular arrangement.

In such a case, the arrangement pitch of the electronic components is often different depending on the size and shape of the electronic components, and generally the component arrangement pitch and the nozzle arrangement pitch do not match. This is because it is not realistic to individually manufacture the mounting heads by matching the nozzle pitch with the component array, or conversely, prepare the component array such as the component tray according to the nozzle pitch.

Therefore, when the electronic components are taken out from such an electronic component supply section by the multi-nozzle type head, it is necessary to repeat the positioning of the mounting head for each holding nozzle. That is, even when using a multi-nozzle type head for the purpose of improving productivity, it is not always possible to sufficiently exert its advantages, and it takes time to hold all the holding nozzles of the mounting head with electronic components, There is a problem that it is difficult to improve the work efficiency of the electronic component mounting work.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of improving the work efficiency of the electronic component mounting work.

[0008]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component of an electronic component supply section at an electronic component mounting position of a board held by a board holding section. A mounting means provided with a plurality of mounting nozzles for holding electronic components in a predetermined arrangement, and an electronic component arranging means for arranging the plurality of electronic components taken out from the electronic component supply unit in the same arrangement as the predetermined arrangement, The electronic components arranged by the electronic component arrangement means in the same arrangement as the predetermined arrangement are simultaneously held by at least two or more mounting nozzles of the mounting means, and the held electronic components are individually mounted at the electronic component mounting positions. And a mounting control means for controlling the mounting means.

An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, wherein the electronic component arranging means has a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles. Pickup means having a reversing mechanism for reversing these plurality of pickup nozzles upside down, and the pickup nozzle downward by the reversing mechanism to pick up electronic components individually from the electronic component supply unit, and then the pickup nozzle upwards. And a pickup control means for controlling the pickup means so as to deliver the picked up electronic components to the mounting head.

An electronic component mounting apparatus according to a third aspect is the electronic component mounting apparatus according to the first aspect, wherein the electronic component arranging means has a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles. Equipped with a pickup means,
A mounting table on which a plurality of electronic components are mounted and delivered to the mounting head, and an electronic component is individually picked up from the electronic component supply unit by the pickup nozzle, and the plurality of picked-up electronic components are placed on the mounting table. Pickup control means for controlling the pickup means to be placed.

An electronic component mounting apparatus according to a fourth aspect is the electronic component mounting apparatus according to the first aspect, wherein the electronic component arranging means mounts a pickup means having a pickup nozzle and a plurality of electronic components. And a placement table to be delivered to the placement head, the pickup nozzles individually pick up electronic components from the electronic component supply unit, and the plurality of picked up electronic components are arranged on the placement table. Pickup control means for controlling the pickup means so that they are arranged in the same arrangement.

According to a fifth aspect of the present invention, there is provided an electronic component mounting method, wherein electronic components are held by a plurality of mounting nozzles arranged in a predetermined array and mounted at the electronic component mounting position on the substrate held by the substrate holder. A method of arranging a plurality of electronic components taken out from the electronic component supply unit in the same arrangement as the predetermined arrangement, and at least two electronic components among the plurality of electronic components arranged in the predetermined arrangement. The method includes the steps of simultaneously holding the mounting nozzles and the step of individually mounting the electronic components held by the mounting nozzles at the electronic component mounting positions.

An electronic component mounting method according to claim 6 is the electronic component mounting method according to claim 5, wherein a plurality of electronic components taken out from the electronic component supply section are arranged in the same arrangement as the predetermined arrangement. In the above, the electronic components of the electronic component supply unit are individually picked up by a plurality of pickup nozzles arranged in the same arrangement as the mounting nozzles, and these pickup nozzles are vertically inverted.

The electronic component mounting method according to claim 7 is the electronic component mounting method according to claim 5, wherein a plurality of electronic components taken out from the electronic component supply unit are arranged in the same arrangement as the predetermined arrangement. In the above, the electronic components of the electronic component supply unit are individually picked up by a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles and placed on the placing table.

An electronic component mounting method according to claim 8 is the electronic component mounting method according to claim 5, wherein a plurality of electronic components taken out from the electronic component supply section are arranged in the same arrangement as the predetermined arrangement. In, the electronic components of the electronic component supply unit are individually picked up by the pick-up nozzle and arranged on the mounting table in the same arrangement as the arrangement of the mounting nozzles.

According to the present invention, a plurality of electronic components taken out from the electronic component supply unit are arranged in the same arrangement as the arrangement of the mounting nozzles of the mounting head, and these electronic components are arranged in at least two mounting nozzles of the mounting head. By holding the electronic components at the same time, the time for holding the electronic components can be shortened and the work efficiency of the electronic component mounting work can be improved.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a plan view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a side sectional view of an electronic component mounting apparatus according to Embodiment 1 of the present invention. Figure, Figure 3
FIG. 4 is a plan sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 4 is a perspective view of an electronic component supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. Form 1
Block diagram showing the configuration of the control system of the electronic component mounting device of
6 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 7, FIG. 8, FIG. 9, FIG.
0, FIG. 11 and FIG. 12 are process explanatory diagrams of the electronic component mounting method of the first embodiment of the present invention, and FIG. 13 is the first embodiment of the present invention.
FIG. 3 is a plan view of a substrate on which the electronic component is mounted.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. 1, 2, and 3. 2 shows a view taken along the line AA in FIG. 1, and FIG. 3 shows a view taken along the line BB in FIG. In FIG. 1, an electronic component supply unit 2 is arranged on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder 3,
The jig holder 3 detachably holds the jig 4 to which the adhesive sheet 5 is attached. A semiconductor chip 6 (hereinafter simply referred to as “chip 6”), which is an electronic component, is attached to the adhesive sheet 5 in a state of being separated into individual pieces.
When the jig 4 is held in the electronic component supply unit 2, the electronic component supply unit 2 supplies a plurality of chips 6 arranged in a plane.

As shown in FIG. 2, an ejector 8 is disposed below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 has a pin elevating mechanism for elevating an ejector pin (not shown) for pushing up the tip,
From the adhesive sheet 5 to the chip 6 by the mounting head described later.
When picking up, the chip 6 is peeled from the adhesive sheet 5 by pushing up the chip 6 from below the adhesive sheet 5 with an ejector pin. The ejector 8 serves as an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.

As shown in FIG. 3, the substrate holding unit 1 is provided on the upper surface of the base 1 at a position separated from the electronic component supply unit 2 in the Y direction.
0 is placed. A substrate carry-in conveyor 12, a substrate distributing unit 11, and an upstream side and a downstream side of the substrate holding unit 10, respectively.
The board transfer section 13 and the board unloading conveyor 14 are arranged in series in the X direction. The substrate carry-in conveyor 12 receives the substrate 16 supplied from the upstream side and receives the substrate distribution unit 11
Pass to. The substrate allocating unit 11 has a structure in which a allocating conveyor 11a is slidable in the Y direction by a slide mechanism 11b, and a substrate 16 received from the substrate loading conveyor 12 is provided in a substrate holding unit 10 described below. The two substrate holding mechanisms are selectively distributed. Substrate holding unit 10
Is a first substrate holding mechanism 10A and a second substrate holding mechanism 10B.
Is provided and holds the substrate 16 sorted by the substrate sorting unit 11 and positions it at the mounting position.

The board transfer section 13 is similar to the board distribution section 11 in that the transfer conveyor 13a is moved by the slide mechanism 13b.
Is configured to be slidable in the direction, the transfer conveyor 13a is selectively connected to the first substrate holding mechanism 10A and the second substrate holding mechanism 10B to receive the mounted substrate 16, and the substrate unloading conveyor. Pass it to 14. The board unloading conveyor 14 carries out the mounted board 16 having been mounted to the downstream side.

In FIG. 1, a first Y-axis base 20A and a second Y-axis base 20B are provided at both ends of the upper surface of the base 1.
Are arranged with their longitudinal direction oriented in the Y direction orthogonal to the substrate transport direction (X direction). The upper surface of the first Y-axis base 20A and the second Y-axis base 20B has a longitudinal direction (Y direction).
The Y-direction guides 21 are arranged over substantially the entire length, and the pair of Y-direction guides 21 are arranged in parallel so as to sandwich the electronic component supply unit 2 and the substrate holding unit 10.

The pair of Y-direction guides 21 include a first beam member 31, a center beam member 30, and a second beam member 31.
Both ends of the three beam members of the beam member 32 are supported by the Y-direction guides 21 and are slidably installed in the Y-direction.

A nut member 23b is provided on the right side end of the center beam member 30 so as to project therefrom.
The feed screw 23a screwed to the b is the first Y-axis base 20.
It is rotationally driven by a Y-axis motor 22 arranged horizontally on A. By driving the Y-axis motor 22,
The center beam member 30 moves in the Y direction along the Y direction guide 21.
Move horizontally in the direction.

Further, nut members 25b and 25b are provided on the left side end portions of the first beam member 31 and the second beam member 32, respectively.
27b is projected, and the feed screws 25a and 27a screwed to the nut members 25b and 27b are respectively the second Y
The Y-axis motor 2 horizontally arranged on the shaft base 20B.
It is rotationally driven by 4, 26. Y-axis motor 24, 2
By driving 6, the first beam member 31 and the second beam member 32 horizontally move in the Y direction along the Y direction guide 21.

A mounting head 33 is mounted on the center beam member 30, and a feed screw 41a screwed into a nut member 41b connected to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is moved in the X-direction by being guided by the X-direction guide 42 (see FIG. 2) provided on the side surface of the center beam member 30 in the X-direction.

The mounting head 33 is provided with a plurality of nozzles 33a (mounting nozzles) for holding one chip 6 in a predetermined arrangement (four in this case), and each nozzle 33a sucks the chip 6 into a plurality of chips. It is possible to move while holding 6. Y-axis motor 22 and X-axis motor 40
The mounting head 33 horizontally moves in the X direction and the Y direction by picking up and holding the chip 6 of the electronic component supply unit 2, and holding the held chip 6 on the substrate holding unit 10.
The electronic component mounting position 16a of the substrate 16 held by is mounted.

The pair of Y-direction guides 21, the center beam member 30, and the center beam member 30 are attached to the Y-direction guide 21.
Y-direction drive mechanism (Y-axis motor 22,
The feed screw 23a and the nut member 23b) and the X-direction drive mechanism (X-axis motor 40, feed screw 41a, and nut member 41b) that moves the mounting head 33 along the X-direction guide 42 are used to mount the mounting head 33 on an electronic component. Supply unit 2
A mounting head moving mechanism that moves between the substrate holding unit 10 and the substrate holding unit 10 is configured. The mounting head moving mechanism and the mounting head 33 are mounting means provided with a plurality of nozzles 33a for holding the chips 6 in a predetermined arrangement.

On the first beam member 31, the first camera 3
4 is mounted, and a nut member 44b is coupled to a bracket 34a that holds the first camera 34.
The feed screw 44a screwed into the nut member 44b is rotationally driven by the X-axis motor 43, and by driving the X-axis motor 43, the first camera 34 causes the first beam member 3 to move.
1 is moved in the X direction by being guided by the X direction guide 45 (see FIG. 2) provided on the side surface of 1.

By driving the Y-axis motor 24 and the X-axis motor 43, the first camera 34 horizontally moves in the X and Y directions. As a result, the first camera 34 moves the substrate holding unit 10 above the substrate holding unit 10 to capture an image of the substrate 16 held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B, and It is possible to perform a movement for retreating from the holding unit 10.

A pair of Y-direction guides 21, a first beam member 31, and a Y-direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) for moving the first beam member 31 along the Y-direction guide 21. And the first camera 34
X-direction drive mechanism (X-axis motor 43, feed screw 44a and nut member 4)
4b) constitutes a first camera moving mechanism that moves the first camera 34 at least above the substrate holding unit 10.

The second beam member 32 is attached to the second camera 3
5 is mounted, and a nut member 47b is coupled to a bracket 35a that holds the second camera 35. The feed screw 47a screwed onto the nut member 47b is
The second camera 35 is rotationally driven by the shaft motor 46, and by driving the X-axis motor 46, the second camera 35 is guided by the X-direction guide 48 (see FIG. 2) provided on the side surface of the second beam member 32 to move in the X-direction. Move to.

As shown in FIG. 4, a pickup head 37 is attached to the lower end of the bracket 35a. The pickup head 37 includes a Z-axis table 36, and a U-shaped lifting member 37c is coupled to the Z-axis table 36. A nozzle holding portion 37a, to which a plurality of nozzles 37b are attached, is rotatably held around a horizontal rotation axis at the tip of the elevating member 37c. Here, since the nozzle holding portion 37a is held by the U-shaped lifting member 37c, the nozzle holding portion 37a is arranged so as not to interfere with the imaging of the electronic component supply unit 2 by the second camera 35.

Each nozzle 37b of the nozzle holder 37a is
A nozzle elevating mechanism (not shown) built in the nozzle holding portion 37a can individually project downward from the nozzle holding portion 37a. With one nozzle 37b projected, the nozzle holding portion 37a is moved by the Z-axis table 36.
By lowering, the chips 6 can be picked up from the wafer sheet 5 by the individual nozzles 37b.

The nozzle holding portion 37a is rotationally driven by the rotary driving portion 37d, and the nozzle holding portion 37a is rotated and turned upside down, whereby the nozzle 37b can be switched between the upward and downward directions. That is, after the face-up chip 6 with the bump forming surface facing upward is taken out by the nozzle 37b facing downward, the nozzle 37b is facing upward to hold the chip 6 in a face-down position with the bump forming surface facing downward. You can do it.

The nozzle 3 mounted on the nozzle holder 37a
The arrangement of 7b is the same as the predetermined arrangement of the nozzles 33a in the mounting head 33. After sequentially picking up the face-up chips 6 from the wafer sheet 5 by the nozzles 37b, the nozzle holder 37a is rotated by the rotation driving unit 37d. By reversing, the chips 6 are held in the same arrangement as the arrangement of the nozzles 33a.

Therefore, the pickup head 37 has a plurality of nozzles 37 arranged in the same arrangement as the arrangement of the nozzles 33a.
b (pickup nozzle) and these nozzles 37b
The pickup means has an inversion mechanism for vertically inverting. As a result, the nozzle 37b facing upwards
Therefore, it is possible to perform the transfer operation of simultaneously suction-holding the plurality of chips 6 in the face-down state by the nozzles 33a of the mounting head 33.

By driving the Y-axis motor 26 and the X-axis motor 46, the pickup head 37 and the second
The camera 35 moves horizontally in the X and Y directions. As a result, the pickup head 37 can perform an operation for picking up the chip 6 held by the electronic component supply unit 2 and a movement for retracting from the electronic component supply unit 2, and the second The camera 35 can move above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2.

A pair of Y-direction guide 21, second beam member 32, and Y-direction drive mechanism for moving the second beam member 32 along the Y-direction guide 21 (Y-axis motor 26, feed screw 27a and nut member 27b). And the second camera 35
X-direction drive mechanism (X-axis motor 46, feed screw 47a and nut member 4)
7b) constitutes a pickup head moving mechanism that moves the pickup head 37 and the second camera 35 at least above the electronic component supply unit 2.

As shown in FIG. 3, a third camera 15 and a viscous body supply stage 17 are arranged between the electronic component supply section 2 and the substrate holding section 10. The viscous body supply stage 17 is provided with a container 17a for storing the viscous body 18 (see FIG. 7). The container 17a is a squeegee mechanism (not shown) for leveling the liquid surface of the viscous body 18 such as flux and adhesive. ) Is provided. The container 17a can be moved up and down by a cylinder 17b.

By moving the mounting head 33 holding the chip 6 in the nozzle 33a up and down with respect to the viscous body supply stage 17, the viscous body 18 is transferred and applied onto the lower surface of the bump 6a of the chip 6. When the bumps 6a of the chip 6 are solder, flux is used as the viscous body 18, and when it is other than solder, a resin adhesive or the like is used.

When the method of coating or printing the viscous material on the substrate 16 in advance is used, the viscous material supply stage 1
Although it is possible to omit 7, it is advantageous to use the viscous material supply stage 17 by transfer as in the present embodiment, because it is not necessary to add a large-scale device such as a printing device, and the facility can be simplified.

Then, the mounting head 33 holding the chip 6 after the transfer of the viscous material is moved above the third camera 15 by X-axis.
By moving in the direction, the third camera 15 images the chip 6 held by the mounting head 33. After that, the mounting head 33 mounts the chip 6 on the substrate 16 held by the substrate holding unit 10. Since the mounting head 33 mounts the chip transferred from the pickup head 37 on the substrate 16, the height position of the substrate holding unit 10 is as shown in FIG.
As shown in FIG. 5, the chip 6 is arranged higher than the electronic component supply unit 2 by a transfer height required for transferring the chip 6 (a height difference caused by upside down of the nozzle holder 37a).

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 5, the mechanism driving unit 50 includes a motor driver that electrically drives a motor of each mechanism described below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism driving unit 50 by the unit 54,
The following drive elements are driven.

The X-axis motor 40 and the Y-axis motor 22 drive a mounting head moving mechanism for moving the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 move the first camera moving mechanism that moves the first camera 34, and the X-axis motor 46 and the Y-axis motor 26 move the pickup head 37 and the second camera 35. The pickup head moving mechanism is driven.

Further, the mechanism driving section 50 includes the mounting head 33,
The lift mechanism of the pickup head 37, the component suction mechanism by the nozzles 33a and 37b are driven, and further the lift cylinder 17b of the viscous body supply stage 17, the lift cylinder of the ejector 8 and the drive motor of the ejector XY table 7 are driven. Further, the mechanism driving unit 50 includes the substrate loading conveyor 12, the substrate unloading conveyor 14, the substrate sorting unit 11, the substrate delivery unit 13, the first substrate holding mechanism 10A, and the second substrate holding mechanism 10A.
The substrate holding mechanism 10B is driven.

The first recognition processing section 55 uses the first camera 3
The image captured in 4 is processed to recognize the position of the electronic component mounting position 16a (see FIG. 13) of the board 16 held by the board holding unit 10. The electronic component mounting position 16a is the substrate 16
16b to which bump 6a of chip 6 is bonded in
It shows the entire position (see FIG. 13), and the position can be detected by image recognition. Further, the first recognition processing unit 55 uses the electronic component mounting positions 16a in the previous process.
The quality of the board is inspected by detecting the presence or absence of the bad mark applied to the board 16 every time, and the image captured by the first camera 34 is further processed to determine the electronic component mounting position 16
The mounting state of the chip 6 mounted on a, such as the positional deviation, is inspected.

The second recognition processing section 56 uses the second camera 3
The image captured in 5 is processed to recognize the position of the chip 6 of the electronic component supply unit 2. The third recognition processing unit 57 uses the third
The image picked up by the camera 15 of
The position of the chip 6 held by is recognized.

The recognition results of the first recognition processing section 55, the second recognition processing section 56, and the third recognition processing section 57 are sent to the control section 54. The data storage unit 53 stores various data such as the inspection result of the mounting state inspection of the chip 6. The operation unit 51 is an input device such as a keyboard and a mouse, and performs data input and control command input. Display unit 5
2 displays an image pickup screen by the first camera 34, the second camera 35, and the third camera 15 and a guide screen at the time of input by the operation unit 51.

Next, the processing function of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 6, a broken line frame 54
Shows the processing function of the control unit 54 shown in FIG.
Here, the first camera movement processing unit 54a, the second camera movement processing unit 54b, and the pickup head operation processing unit 54.
c, the processing function executed by the mounting head operation processing unit 54d constitutes a first camera movement control means, a second camera movement control means, a pickup control means, and a mounting control means, respectively.

The first camera movement processing unit 54a controls the first camera movement mechanism to position the first camera 34 when the substrate 16 held by the substrate holding unit 10 is imaged, and to mount it. A retracting operation is performed to move the first camera 34 to a position where the mounting of the chip 6 by the head 33 is not hindered. Here, the imaging of the substrate 16 is performed by imaging the bad mark application position in the state where the substrate 16 is carried in, the chip 6
The three types of imaging are performed: the imaging of the electronic component mounting position 16a before the mounting of the chip 6 and the imaging of the electronic component mounting position 16a after the chip 6 is mounted. The second camera movement processing unit 54b controls the pickup head moving mechanism to perform the positioning operation of the second camera 35 when the chip 6 of the electronic component supply unit 2 is imaged.

The pickup head operation processing section 54c is
The function realized by executing the program for controlling the pickup head 37 and the pickup head moving mechanism is shown. Based on the recognition result of the second recognition processing unit 56, the electronic component supply unit 2 picks up the pickup head 3.
From the pick-up operation of taking out the chip 6 by 7,
Control related to a series of operations up to the transfer operation of passing the chip 6 to the nozzle 33a of the mounting head 33 is performed.

That is, the pickup head operation processing unit 54c picks up the chips 6 individually from the electronic component supply unit 2 with the nozzle 37b facing downward by the reversing mechanism, and picks up the chip 6 with the nozzle 37b facing upward. It is a pickup control means for controlling the pickup means so as to be delivered to. Then, the pickup head 37 (pickup means) and the pickup head operation processing unit 54c (pickup control means) described above arrange the plurality of chips 6 taken out from the electronic component supply unit 2 in the same arrangement as the predetermined arrangement of the nozzles 33a. It is an electronic component arranging means.

The mounting head operation processing section 54d shows a function realized by executing a program for controlling the mounting head 33 and the mounting head moving mechanism. From the receipt of the chip 6 by the mounting head 33 to the substrate 16. The control relating to a series of operations up to the mounting of the chip 6 is performed. The positioning when mounting the chip 6 on the substrate 16 is the first
Electronic component mounting position detection processing unit 55a of the recognition processing unit 55
This is performed based on the position of the electronic component mounting position 16a obtained in step 3 and the position of the chip 6 obtained in the third recognition processing section 57.

That is, the mounting head operation processing section 54d
The nozzle 33 of the mounting head 33 by the electronic component arranging means described above.
The chips 6 arranged in the same array as the predetermined array of a are simultaneously held by at least two or more nozzles 33a of the mounting means, and the held chips 6 are individually mounted on the electronic component mounting positions 16a of the substrate 16. It is a mounting control means for controlling the mounting means.

The first recognition processing section 55 has a board inspection processing section 55b and a mounting state inspection processing section 55c in addition to the electronic component mounting position detection processing section 55a. In the mounting operation by the mounting head operation processing unit 54d, the quality determination result of the substrate 16 detected by the substrate inspection processing unit 55b is referred to, and only the electronic component mounting position 16a that is determined to be acceptable in the quality determination is chip 6 is executed.

The inspection result recording processing section 54f performs processing for storing the above-mentioned board quality determination result by the board inspection processing section 55b and the mounting state inspection result of the chip 6 by the mounting state inspection processing section 55c. These inspection results are sent to the inspection result recording processing unit 54f for data processing, and stored in the inspection result storage unit 53a provided in the data storage unit 53.

This electronic component mounting apparatus is configured as described above, and the electronic component mounting method will be described below with reference to FIGS.
2 will be described. In FIG. 7, a large number of chips 6 are attached to the adhesive sheet 5 held by the electronic component supply unit 2. Further, in the substrate holding part 10, the first substrate holding mechanism 10A and the second substrate holding mechanism 10B are respectively provided with the substrate 1
6 is positioned. In the electronic component mounting shown here, a plurality of (here, four) chips 6 are mounted on the mounting head 33.
Are held by suction by the four nozzles 33a arranged in a predetermined array, and these four chips 6 are mounted in one mounting turn.
Are sequentially mounted on a plurality of electronic component mounting positions 16a of the substrate 16.

First, as shown in FIG. 7A, the second camera 35 is moved above the electronic component supply unit 2 by the pick-up head moving mechanism to pick up a plurality of (four) chips 6 to be picked up. The image is captured by the second camera 35. Then, the acquired image is processed by the second recognition processing unit 56 to recognize the positions of the plurality of chips 6. At this time, the mounting head 33 stands by at the delivery position of the chip 6. The container 17a of the viscous material supply stage 17 is in a lowered state in which the rod of the cylinder 17b is retracted in order to avoid interference with the pickup head 37.

In parallel with the image pick-up by the second camera 35 in the electronic component supply unit 2, the first camera 34 is held by the first substrate holding mechanism 10A of the substrate holding unit 10 by the first camera moving mechanism. It is moved onto the substrate 16. Then, as shown in FIG.
Of the four electronic component mounting positions 16a, the first camera 34 is sequentially moved so that the four electronic component mounting positions 16a on the left side are sequentially surrounded by the image capturing range 19, and the plurality of electronic component mounting positions 16a and each electronic component are mounted. The bad mark application position of the mounting position 16a is imaged to capture an image, and then the first camera 34 is retracted from above the substrate 16 (see FIG. 7B).

Then, the image of the image capturing range 19 imaged by the first camera 34 is processed by the first recognition processing section 55, and the electronic component mounting position 16a of the board 16 (FIG. 13A).
Position). In the recognition of the board 16, the position of the electronic component mounting position 16a is detected, and whether or not the electronic component mounting position 16a is a defective substrate to which a bad mark is applied as a result of the board inspection performed in the previous process is performed. A pass / fail judgment is made.

Next, the pickup head 37 is moved on the electronic component supply section 2, and the pickup head 37 is sequentially positioned on these chips 6 based on the recognized positions of the plurality of chips 6 as shown in FIG. 7B. The plurality of chips 6 are sequentially picked up by the nozzle 37b while causing the pickup head moving mechanism to perform the positioning operation.

Next, as shown in FIG. 8A, the pickup head 37 moves to the delivery position, where the chip 6 is delivered to the mounting head 33. First, the nozzle holder 37a is turned upside down so that the chip 6 held by the nozzle 37b faces upward. As a result, the plurality of chips 6 taken out from the electronic component supply unit 2 are attached to the nozzle 33a.
Are arranged in the same arrangement as the predetermined arrangement of.

That is, in the step of arranging the chips 6, the chips 6 of the electronic component supply unit 2 are individually picked up by a plurality of nozzles 37b (pickup nozzles) arranged in the same arrangement as the mounting nozzles 33, and these chips are picked up. The nozzle 37b is turned upside down. And these chips 6
The nozzle 33a of the mounting head 33 is aligned and moved up and down, the plurality of chips 6 are simultaneously adsorbed to the nozzle 33a, and at least two of the plurality of chips 6 arranged in a predetermined array are arranged.
The individual chips 6 are held simultaneously by the nozzle 33a.

After that, the pickup head 37 moves onto the electronic component supply unit 2 for the next pickup operation. Then, the transfer head 33, to which the chip 6 is transferred, moves onto the viscous body supply stage 17 and lowers the chip 6 with respect to the viscous body 18 in the container 17a, so that the viscous body is transferred to the bumps 6a on the lower surface. 18 is transfer-coated. Next, the mounting head 33 holding the four chips 6 in each nozzle 33a performs a scanning operation of moving above the third camera 15. As a result, the image of the chip 6 held by each nozzle 33a is captured by the third camera 15, and the position of the chip 6 is recognized by performing recognition processing on this image by the third recognition unit processing unit 57. .

Next, the loading operation is started. At this time, the chip 6 is mounted only on the electronic component mounting position 16a for which the first recognition processing unit 55 has determined that the board inspection has passed. The mounting head 33 moves above the substrate holding unit 10 as shown in FIG. And here first
The mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the determination result by the board inspection.

That is, of the plurality of electronic component mounting positions 16a of the substrate 16 positioned by the first substrate holding mechanism 10A, the chip 6 held by the nozzle 33a of the mounting head 33 is located at the electronic component mounting position 16a determined to be non-defective. The chip 6 held by the mounting head 33 is individually mounted in the electronic component mounting position 16a while causing the mounting head moving mechanism to perform a positioning operation for sequentially positioning.

Then, when the mounting head 33 mounts the chips 6, the second camera 35 is moved above the plurality of chips 6 to be picked up next in the electronic component supply unit 2, and the plurality of chips 6 are moved to the first position. Imaged by the camera 35 of No. 2,
The position of the chip 6 is detected. Then, as shown in FIG. 9B, the pickup head 37 is moved on the electronic component supply unit 2, and the pickup head 37 is sequentially positioned on the chips 6 based on the recognized positions of the chips 6, The plurality of chips 6 are sequentially picked up by the nozzle 37b.

Then, the chip 6 in the electronic component supply unit 2
The first camera 34 during the pickup of the substrate holder 1
The first substrate holding mechanism 0A of 0 is moved to image the substrate 16. Here, the chip 6 mounted on the substrate 16
The mounting state inspection, the position detection of the plurality of electronic component mounting positions 16a on which the chip 6 is mounted in the next mounting turn, and the quality determination of these electronic component mounting positions 16a are performed.

That is, in this image pickup, as shown in FIG. 13C, the first camera 34 is sequentially moved so that the eight electronic component mounting positions 16a set on the substrate 16 are sequentially surrounded by the image capturing range 19. Then, the image is captured, and then the first camera 34 is retracted from above the substrate 16. Then, the image captured by the first camera 34 is processed by the first recognition processing unit 55, and the next inspection processing is performed.

First, the images in the four image capturing areas 19 on the left side are inspected for the mounting state of the chip 6, that is, whether or not the displacement of the position / orientation of the chip 6 is normal. Then, for the four image capturing areas 19 on the right side, the position of the electronic component mounting position 16a of the substrate 16 is detected and the substrate inspection before the chip 6 is mounted is performed.

Then, as shown in FIG. 10A, the pickup head 37 moves to the delivery position, where the chip 6 is delivered to the mounting head 33. That is, first, the nozzle holder 37a is turned upside down and the nozzle 3
The chip 6 held by 7b is turned upward. Then, the nozzles 33a of the mounting head 33 are aligned with the chips 6 and moved up and down, and the plurality of chips 6 are simultaneously adsorbed to the nozzles 33a.

Thereafter, as shown in FIG. 10B, the pickup head 37 moves onto the electronic component supply section 2.
Then, the transfer head 33 is moved onto the viscous body supply stage 17, where the tip 6 is lowered with respect to the viscous body 18 in the container 17a to transfer and coat the viscous body 18 on the bumps 6a on the lower surface. Next, the mounting head 33, which holds four chips in each nozzle 33a, performs a scanning operation of moving above the third camera 15. As a result, the image of the chip 6 held by each nozzle 33a is captured by the third camera, and the position of the chip 6 is recognized by subjecting this image to recognition processing by the third recognition unit processing unit 57.

Then, the loading operation is started. At this time, the chip 6 is mounted only on the electronic component mounting position 16a for which the first recognition processing unit 55 has determined that the board inspection has passed. The mounting head 33 moves above the substrate holding unit 10 as shown in FIG. Then, the mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the determination result by the board inspection.

That is, of the plurality of electronic component mounting positions 16a of the substrate 16 positioned by the first substrate holding mechanism 10A, the chip 6 held by the nozzle 33a of the mounting head 33 is located at the electronic component mounting position 16a which is determined to be non-defective. Are sequentially positioned and mounted on the four unmounted electronic component mounting positions 16a of the substrate 16. As a result, as shown in FIG. 13D, the mounting of the chip 6 on the eight electronic component mounting positions 16a of the substrate 16 is completed. And this mounting head 3
During the mounting operation of the chip 6 by the third camera 3, the second camera 35 is moved again onto the chip 6 of the electronic component supply unit 2, and the chip 6 picked up next by the second camera 35 is imaged.

Then, as shown in FIG. 11B, the pickup head 37 is moved above the electronic component supply unit 2,
Based on the position of the chip 6 recognized by the second recognition processing unit 56, the chips 6 are sequentially picked up by the nozzle 37b.

In parallel with this operation, the first camera moving mechanism moves the first camera 34 onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10.
The eight electronic component mounting positions 1 set on the board 16
Of the 6a, the first camera 3 is arranged so that the image capturing range 19 sequentially surrounds the four electronic component mounting positions 16a on the right side.
4 is sequentially moved to capture an image.

Then, the image of the image capturing range 19 imaged by the first camera 34 is processed by the first recognition processing section 55, and the mounting state of the chip 6 at the electronic component mounting position 16a of the substrate 16 is inspected. In addition, the first substrate holding mechanism 1
The first camera 34, which has completed the image capturing at 0A, moves to the unmounted substrate 16 held by the second substrate holding mechanism 10B, and here, the electronic component mounting position 16a where the chip 6 is to be mounted next. Is imaged, and the position detection of the electronic component mounting position 16a and the board inspection are performed.

After this imaging operation, as shown in FIG. 12, the substrate 16 is carried out from the first substrate holding mechanism 10A to the substrate delivery section 13, and a new substrate 16 is placed in the first substrate holding mechanism 10A.
Is delivered. After that, the same operation is continuously repeated.

As described above, in the first embodiment, in the electronic component mounting work for mounting the chip 6 on the substrate 16 by the multi-nozzle type mounting head 33,
The pick-up head 37 having the same arrangement as the arrangement of the nozzles 33 a in the mounting head 33 picks up the chips 6 in advance and transfers them to the mounting head 33. For this reason, all the nozzles 33a can hold the chips 6 at the same time, and it is not necessary to position the mounting head for each nozzle as in the conventional case, and the advantages of the multi-nozzle type head can be exhibited to perform the electronic component mounting work. Work efficiency can be improved.

(Second Embodiment) FIG. 14 is a partial perspective view of an electronic component mounting apparatus according to a second embodiment of the present invention. In the second embodiment of the present embodiment, the electronic components supplied in a packing form that does not need to be inverted are mounted on the substrate 16 by the electronic component mounting apparatus including the substrate holding unit 10 having the same configuration as the first embodiment. The application example in this case is shown.

In FIG. 14, the substrate 16 is held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B of the substrate holding portion 10. Above the substrate holder 10, there is a first
Camera 34, and the third camera 15 is arranged on the side of the substrate holding unit 10. The configurations of the substrate holder 10, the first camera 34, and the third camera 15 are similar to those shown in the first embodiment.

The electronic component supply unit 60 includes a substrate holding unit 10
The component array container 61 is placed at the same height position as.
In the component array container 61, chips 62, which are electronic components in a face-down state with the bump formation surface facing downward, are arrayed in a grid pattern. A camera 63 (having the same function as the second camera 35 described in the first embodiment) and a pickup head 64 are arranged above the electronic component supply unit 60. Since the pickup head 64 does not need to invert the chip 62, it has a configuration in which the rotary drive unit 37d of the pickup head 37 shown in the first embodiment is removed.

The nozzle holder 64a has a plurality of nozzles 6
4b is attached, and the nozzle 64b sucks and holds the electronic component 62 held in the component array container 61. Here, the arrangement of the pickup nozzles 64b in the pickup head 64 is the same as the arrangement of the nozzles 68a in the mounting head 68.

Camera 63 and pickup head 64
Moves horizontally on the electronic component supply unit 60 by the pickup head moving mechanism 65. The pickup head 64 and the pickup head moving mechanism 65 constitute pickup means, and the operation of the pickup means is controlled by the pickup head operation processing section 66. The pickup head operation processing unit 66 represents a processing mechanism realized by executing a program for controlling the pickup head 64 and the pickup head moving mechanism 65, and constitutes a pickup control means.

A mounting table 67 is disposed adjacent to the third camera 15 between the electronic component supply unit 60 and the substrate holding unit 10. The chips 62 picked up by the pickup head 64 from the component array container 61 are simultaneously placed on the placing table 67. This allows
The chips 62 are arranged on the mounting table 67 in the same arrangement as the arrangement of the nozzles 68a of the mounting head 68.

The chips 6 arranged in this way
2 is simultaneously held by the plurality of nozzles 68 a of the mounting head 68, and is mounted on the substrate 16 of the substrate holder 10. That is, the electronic component mounting apparatus configured as described above includes electronic component arranging means for arranging the plurality of chips 62 taken out from the electronic component supply unit 60 in the same arrangement as the arrangement of the nozzles 68a in the mounting head 68.

This electronic component arranging means is equipped with a mounting head 68.
Pick-up means having a plurality of nozzles 64b arranged in the same arrangement as the arrangement, a mounting table 67 on which a plurality of chips 62 are mounted and transferred to the mounting head 68, and the nozzles 64.
The chip 62 is individually picked up from the electronic component supply unit 60 in step b, and a pickup control means for controlling the pickup means so as to mount the plurality of picked-up chips 62 on the mounting table 67 is provided.

In the step of arranging the plurality of chips 62 taken out from the electronic component supply unit 60 in the same arrangement as the nozzle 68a, the electronic component supply unit 60 is arranged by the plurality of nozzles 64b arranged in the same arrangement as the nozzle 68a. Chips 62 of each are individually picked up and placed on the mounting table 67.
Place them in a batch at the same time.

By adopting such a configuration, it is possible to simultaneously hold the electronic components in the respective nozzles of the multi-nozzle type mounting head, targeting the electronic components supplied in the packaging form that does not need to be inverted. Efficient mounting operation can be performed.

(Third Embodiment) FIG. 15 is a partial perspective view of an electronic component mounting apparatus according to a third embodiment of the present invention. The third embodiment shows an example in which, in the electronic component mounting apparatus shown in the second embodiment, a pickup head having only one nozzle is used instead of the pickup head 64 having a plurality of nozzles 64b. .

That is, as shown in FIG. 15, one nozzle 69b is attached to the nozzle holding portion 69a of the pickup head 69. In the third embodiment,
By changing the control program that causes the pickup head operation processing unit 66 to function, the plurality of chips 6 taken out from the electronic component supply unit 60 will be described as described below.
The component array operation is performed to arrange the two on the mounting table 67 in a predetermined array.

In the step of performing the component arranging operation, the nozzles 69b of the pickup head 69 individually pick up the chips 62 of the electronic component supply unit 60 and sequentially mount them on the mounting table 67. In this component arrangement, the chips 62 are arranged on the mounting table 67 in the same arrangement as the nozzles 68a of the mounting head 68. The arrayed chips 62 are simultaneously held by the plurality of nozzles 68 a of the mounting head 68, and the substrate holding unit 10
The substrates 16 are sequentially mounted. This arrangement operation is performed by the pickup head operation processing unit 66, which has a function as a pickup control unit, controlling the above-mentioned pickup unit.

By adopting the above configuration, it is possible to configure an electronic component arranging means for arranging the chips 6 in a predetermined arrangement with a simple structure provided with only one nozzle of the pickup head. Moreover, even when the layout of the nozzles of the mounting head is changed, it is not necessary to modify the pickup means for taking out the chip from the electronic component supply section, and it is sufficient to simply change the program of the pickup means, which is a highly versatile device. It is composed.

[0095]

According to the present invention, a plurality of electronic components taken out from the electronic component supply unit are arranged in the same arrangement as the arrangement of the mounting nozzles of the mounting head, and these electronic components are mounted on at least two mounting heads. Since the nozzles are held at the same time, the time for holding electronic components is shortened,
The work efficiency of the electronic component mounting work can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a plan sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a perspective view of an electronic component supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 5 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 6 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 7 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 8 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 9 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 10 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 11 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 12 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 13 is a plan view of a substrate on which electronic components are mounted according to the first embodiment of the present invention.

FIG. 14 is a partial perspective view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 15 is a partial perspective view of an electronic component mounting apparatus according to a third embodiment of the present invention.

[Explanation of symbols]

2 Electronic parts supply department 6 chips 10 Substrate holder 10A First substrate holding mechanism 10B Second substrate holding mechanism 15 Third camera 16 substrates 16a Electronic component mounting position 30 Center beam member 31 First Beam Member 32 Second beam member 33 mounting head 33a nozzle 34 First camera 35 Second camera 37 Pickup head 37b nozzle 54 control unit 54c Pickup head operation processing unit 54d Mounted head operation processing unit 55 First Recognition Processing Unit 56 Second recognition processing unit 57 Third Recognition Processing Unit 60 Electronic Component Supply Department 62 chips 67 Placement table

Claims (8)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component of an electronic component supply unit on an electronic component mounting position of a substrate held by a substrate holding unit, wherein a plurality of mounting nozzles for holding the electronic component are arranged in a predetermined arrangement. Mounting means provided, electronic component arranging means for arranging a plurality of electronic components taken out from the electronic component supply unit in the same arrangement as the predetermined arrangement, and electronic component arranging means arranged in the same arrangement as the predetermined arrangement. And a mounting control means for controlling the mounting means so that the electronic components are simultaneously held by at least two mounting nozzles of the mounting means and the held electronic components are individually mounted at the electronic component mounting positions. A characteristic electronic component mounting device. 2. A pickup means, wherein the electronic component arranging means includes a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles, and a reversing mechanism for reversing the plurality of pickup nozzles upside down, and the pickup nozzle. A pickup that controls the pickup means so that the electronic parts are individually picked up from the electronic part supply section by the reversing mechanism and then the pick-up nozzle is turned up and the picked-up electronic parts are delivered to the mounting head. The electronic component mounting apparatus according to claim 1, further comprising a control unit. 3. The electronic component arranging means has a plurality of pick-up nozzles arranged in the same arrangement as the arrangement of the mounting nozzles, and a mounting means for mounting a plurality of electronic components and delivering them to the mounting head. A placement table and a pickup control means for individually picking up the electronic component from the electronic component supply unit by the pickup nozzle and controlling the pickup means to place the plurality of picked-up electronic components on the placement table. The electronic component mounting apparatus according to claim 1, further comprising: 4. The electronic component arranging device includes a pick-up device having a pick-up nozzle, a mounting table for mounting a plurality of electronic components and delivering the electronic components to the mounting head, and the electronic component supply section using the pickup nozzle. Pick-up control means for controlling the pick-up means so that a plurality of picked-up electronic parts are individually picked up and arranged on the mounting table in the same arrangement as the arrangement of the mounting nozzles. The electronic component mounting apparatus according to claim 1. 5. An electronic component mounting method for holding an electronic component by a plurality of mounting nozzles arranged in a predetermined array and mounting the electronic component at an electronic component mounting position on a substrate held by a substrate holder, said electronic component supplying method. Arranging a plurality of electronic components taken out of the unit in the same arrangement as the predetermined arrangement, and holding at least two electronic components of the plurality of electronic components arranged in the predetermined arrangement at the same time by the mounting nozzle. And individually mounting the electronic component held by the mounting nozzle at the electronic component mounting position. 6. In the step of arranging a plurality of electronic components taken out from the electronic component supply unit in the same arrangement as the predetermined arrangement, the electronic component supply is performed by a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles. 6. The electronic components of each part are individually picked up, and these pickup nozzles are turned upside down.
Electronic component mounting method described. 7. In the step of arranging a plurality of electronic components taken out from the electronic component supply unit in the same arrangement as the predetermined arrangement, the electronic component supply is performed by a plurality of pickup nozzles arranged in the same arrangement as the arrangement of the mounting nozzles. 6. The electronic component mounting method according to claim 5, further comprising individually picking up electronic components of each unit and mounting them on a mounting table. 8. A placing table in which a plurality of electronic components taken out from the electronic component supply unit are arranged in the same arrangement as the predetermined arrangement so that the electronic components of the electronic component supply unit are individually picked up by a pickup nozzle. The electronic component mounting method according to claim 5, wherein the mounting nozzles are arranged in the same arrangement as the mounting nozzles.