JP6484370B1 - Electronic component mounting equipment - Google Patents

Abstract

Disclosed is an electronic component mounting apparatus capable of mounting a plurality of electronic components on a substrate while reducing the mounting variations regardless of variations in thickness.
A pedestal core, a first pressure core that faces a first electronic component, a second pressure core that faces a second electronic component, a first pressure core, and a second pressure core. The lid member 4 that presses the upper part of the pressure core 3B so as to be contactable, the press member 5 that presses the lid member, the pedestal core 2, the first pressure core 3A, and the second pressure core 3B are moved and moved away. And a movement control unit 6 that performs control. The first pressure core 3A and the second pressure core 3B move independently from each other, and the position of the first end portion 31A of the first pressure core 3A and the first end portion of the second pressure core 3B. The position of 31B can be different depending on the difference between the thickness of the first electronic component 200A and the thickness of the second electronic component 200B, and the pedestal core 2 allows the extra pressure to escape by moving.
[Selection] Figure 3

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

  Many electronic devices, measuring devices, transportation devices, precision devices, and the like have many electronic components such as semiconductor integrated circuits. Processors, image processing circuits, audio processing circuits, various sensors, and the like have been highly integrated, and many functions are integrated in electronic components. This electronic component is necessary for these devices.

  This electronic component needs to be mounted on a substrate such as a lead frame, a flexible frame, an electronic substrate, a metal base, and a heat sink. When the substrate itself is incorporated into an electronic device or the like, electronic components are mounted on the incorporated substrate. Or an electronic component may be mounted in the board | substrate required in a manufacturing process. This is because when an electronic device or the like requires an electronic component, it must be mounted via a substrate.

  Thus, electronic components such as semiconductor integrated circuits are often mounted on a substrate such as a lead frame, an electronic substrate, a metal base, or a heat sink.

  Here, when mounting an electronic component on a substrate, there is a method of applying an adhesive between the substrate and the electronic component, and applying pressure and heat to perform mounting with the adhesive. A mounting apparatus by this construction method is sometimes called a sintering apparatus. Note that the substrate here includes a single-layer substrate, a single-layer substrate, a multi-layer substrate, and the like.

  Sintering refers to bonding by sintering. Here, pressure and heat are applied to sinter the adhesive to mount electronic components on a substrate. An apparatus for mounting using pressure and heat sintering is sometimes called a sintering apparatus.

  On the board, a mounting position that is a position for mounting an electronic component is set. An adhesive is applied to this mounting position. Further, the electronic component is placed at the mounting position so that the electronic component contacts the adhesive. In this state, pressure and heat are applied to the electronic component.

  By applying the pressure and heat, the electronic component can be bonded to the substrate with an adhesive. As a result, an adhesive layer is generated between the substrate and the electronic component. The electronic component is mounted on the substrate through the adhesive layer.

  As described above, the electronic component is mounted on the substrate in order for the electronic component to be stored in an electronic device or the like, or for the next manufacturing process using the electronic component. Since mounting is performed with pressure and heat via an adhesive, it is suitable for mounting a large number of electronic components. Such an electronic component mounting apparatus may be called a sintering apparatus.

  In addition, electronic components such as highly integrated semiconductor elements, power devices, and large electronic elements often generate high heat generation. Such a highly exothermic electronic component is mounted on a substrate using a metal paste having a high thermal conductivity as an adhesive. At this time, it is preferable that the electronic component is firmly mounted on the substrate via the metal paste so that the heat conduction is increased in the route of the electronic component, the metal paste, and the substrate.

  In other words, a sintering apparatus for mounting electronic components needs to mount the electronic components on the substrate by applying sufficient pressure.

  A technique regarding such an electronic component mounting apparatus called a sintering apparatus has been proposed (see, for example, Patent Document 1).

JP-T-2006-507164

  Patent Document 1 discloses that a semiconductor die encapsulating method or a semiconductor die carrier mounting method includes a step of providing a first tool part for holding a plurality of semiconductor dies and a step of providing a semiconductor die on the first tool part; Providing a tool portion, wherein one of the first tool portion and the second tool portion includes a plurality of movable insert members that allow each movable insert member to apply pressure on the surface area of the semiconductor die. Combining a first tool part and a second tool part such that a space is defined between the first tool part and the second tool part and the semiconductor product is disposed in the space; including. The movable insertion member applies pressure on the surface area of the semiconductor die. The pressure applied by the movable insertion member is monitored and adjusted. Subsequently, a semiconductor die mounting apparatus is disclosed in which the first tool part and the second tool part are separated and the processed semiconductor die is removed.

  Patent Document 1 discloses a technique for simultaneously mounting a plurality of semiconductor dies on a substrate using a resin. At this time, the semiconductor die and the substrate are sandwiched between the movable member and the fixed member. Based on this configuration, the movable member that can move up and down applies pressure to the semiconductor die, and the fixed member receives the pressure. As a result, mounting with an adhesive is realized.

  However, in the technique of Patent Document 1, the movable member applies pressure to the semiconductor die. That is, since the moving movable member applies pressure to the semiconductor die and the substrate received by the fixed member, there is a concern that the semiconductor die or the substrate may be damaged. This is because damage due to excessive application of pressure can occur. Alternatively, even if the pressure is not applied too much, the moving movable member directly applies pressure to the semiconductor die or the substrate (either the direct movable member pushes or pushes through a film). This is because the semiconductor die and the substrate can be damaged by the operation.

  Conversely, if the pressure is reduced so as not to cause breakage, there is also a problem that mounting with resin becomes insufficient. In order to prevent any of these from occurring, it is necessary to search for an optimum value for the applied pressure in accordance with the type of the semiconductor die or the substrate. Searching for such an optimum value has a problem of increasing the burden in the manufacturing process.

  Also, if the pressure applied by the movable member is inappropriate, the thickness of the adhesive layer between the semiconductor die and the substrate may remain thick. When the adhesive layer between the semiconductor die and the substrate is thick, when the semiconductor die is a high-frequency semiconductor or a power semiconductor, the performance is not sufficiently extracted.

  For this reason, if the applied pressure is inappropriate, the mounting accuracy becomes insufficient, leading to a problem of insufficient performance of the mounted semiconductor die (electronic component). Or there is also a problem that may result in insufficient mounting and lead to defects after mounting.

  In addition, it is necessary to mount a plurality of electronic components on the substrate, and it is necessary to mount the plurality of electronic components at a time. This is to improve the efficiency of the manufacturing process and reduce costs. At this time, in the lamination of the substrate, the adhesive, and the electronic component, the thickness of each of the plurality of electronic components may be non-uniform.

  When the thickness is non-uniform, if the application of pressure by the movable member corresponding to each of the electronic components does not correspond, there is a problem that mounting variations occur in each of the plurality of electronic components. Variations in mounting lead to variations in performance and durability, which is not preferable. In Patent Literature 1, there is a problem that it is difficult to absorb this variation because the movable member directly applies pressure to the semiconductor die.

  Moreover, in FIG. 8 of patent document 1, the aspect which assigns the insert 200 to each of several electronic components and gives a pressure with the member 350 which can deform | transform from these several inserts is shown. If there are variations in the thickness of the plurality of electronic components, there will be a difference in the height of the insert. Since the deformable member 350 can absorb the difference in the height of the insert, Patent Document 1 discloses that it can cope with the difference in the height of the insert.

  However, when the deformable member 350 is deformed to absorb the difference in height of the insert 200, a difference is generated in the pressure applied to each of the inserts 200. That is, when mounting a plurality of electronic components together, different pressures are applied to each of the plurality of electronic components.

  Mounting on a plurality of electronic components with different pressures causes a difference in mounting degree. If there is a difference in the degree of mounting, problems such as a difference in performance of each electronic component after mounting, a variation in performance, and a defect or a defect due to a variation in mounting are caused.

  FIG. 9 of Patent Document 1 shows a mode in which a single piston 410 presses and mounts three electronic components together via a plate 360. Also at this time, since one piston 410 pressurizes the three electronic components together, a difference occurs in the pressure applied to each of the electronic components. Further, since the piston 410 that directly pressurizes does not face each of the electronic components, insufficient or non-uniform pressure can be applied due to the pressure being distributed through the plate 360.

  For this reason, even if it is the aspect of FIG. 9, a difference will arise in each mounting degree of several electronic components. If there is a difference in the degree of mounting, problems such as a difference in performance of each electronic component after mounting, a variation in performance, and a defect or a defect due to a variation in mounting are caused.

  As described above, the prior art including Patent Document 1 includes (1) damage to electronic components and boards, and (2) the application pressure cannot be made uniform when a plurality of electronic components are simultaneously mounted. (3) As a result, there is a problem that variations occur in the mounting degree of a plurality of electronic components. Each electronic component has a variation in thickness due to the type or manufacturing accuracy. The above-described problem becomes particularly noticeable when there is such a variation in thickness.

  An object of the present invention is to provide an electronic component mounting apparatus that is less likely to cause damage to an electronic component or a substrate, and can mount a plurality of electronic components on a substrate while reducing the mounting variation regardless of thickness variations. To do.

In view of the above problems, an electronic component mounting apparatus of the present invention is an electronic component mounting apparatus that mounts a first electronic component and a second electronic component on a substrate,
A pedestal core directly or indirectly facing the non-mounting surface of the electronic component on the board
A first pressure core directly or indirectly facing the first electronic component;
A second pressure core directly or indirectly facing the second electronic component;
A lid member capable of contacting the upper portion of the first pressure core and the upper portion of the second pressure core, and holding the upper portions of the first pressure core and the second pressure core;
A pressing member that can contact the upper part of the lid member and holds the lid member;
A pedestal core, and a movement control unit that performs control to move and move the first pressure core and the second pressure core;
The movement control unit brings the pedestal core, the first pressure core and the second pressure core close to each other,
The first pressure core, together with the pedestal core, applies pressure to the first electronic component,
The second pressure core, together with the pedestal core, applies pressure to the second electronic component,
The first pressure core and the second pressure core move independently from each other in the perspective to the pedestal core,
The position of the first end of the first pressure core when the first pressure core pressurizes the first electronic component and the second when the second pressure core pressurizes the second electronic component The position of the first end of the pressure core can be different depending on the difference between the thickness of the first electronic component and the thickness of the second electronic component,
The pedestal core can relieve the extra pressure, which is an excess of the pressure applied by the first pressurization core and the second pressurization core, by movement.

  The electronic component mounting apparatus of the present invention is configured such that the movable member releases excess pressure while the fixed member applies pressure, so that excessive pressure can be prevented from being applied to the electronic component and the substrate. At this time, since the optimum value control of the pressure when applying the pressure by the fixing member is also reduced, the load on the apparatus is reduced.

  Moreover, since it can also prevent that a pressure becomes too small, it can also prevent that the contact bonding layer becomes thick and the performance shortage of the electronic component after mounting arises.

  A plurality of mounting parts can be mounted simultaneously. At this time, even when the thicknesses of the plurality of mounting parts are different, it is possible to apply the same pressure to each of them and prevent the variation in the mounting degree.

  In addition, since the electronic component mounting apparatus according to the present invention is assembled with many members without being connected, the application range can be expanded only by replacing some members with respect to differences in electronic components to be mounted. .

It is a front view of the board | substrate with which the electronic component was mounted. It is a side view of the board | substrate with which the electronic component was mounted. It is a schematic diagram of the electronic component mounting apparatus in Embodiment 1 of this invention. It is a schematic diagram which shows the pressurization state in the operation | movement description 1 in Embodiment 1 of this invention. It is a schematic diagram which shows the state which the pressurization of the operation | movement description 1 in Embodiment 1 of this invention completed and was mounted. It is a schematic diagram of the electronic component mounting apparatus which shows the time of the start in operation | movement description 2 in Embodiment 1 of this invention. It is the schematic diagram of the electronic component mounting apparatus which shows the pressurization start in the operation | movement description 2 in Embodiment 1 of this invention. It is the schematic diagram of the electronic component mounting apparatus which shows the pressurization state in the operation | movement description 2 in Embodiment 1 of this invention. It is a schematic diagram of the electronic component mounting apparatus in Embodiment 2 of this invention. It is a schematic diagram of the electronic component mounting apparatus provided with the elastic member in Embodiment 2 of this invention. It is a schematic diagram of an electronic component mounting apparatus provided with a mold in Embodiment 2 of the present invention. It is a schematic diagram of the electronic component mounting apparatus provided with the pressure detection part in Embodiment 2 of this invention.

An electronic component mounting apparatus according to a first aspect of the present invention is an electronic component mounting apparatus for mounting a first electronic component and a second electronic component on a substrate,
A pedestal core directly or indirectly facing the non-mounting surface of the electronic component on the board
A first pressure core directly or indirectly facing the first electronic component;
A second pressure core directly or indirectly facing the second electronic component;
A lid member capable of contacting the upper portion of the first pressure core and the upper portion of the second pressure core, and holding the upper portions of the first pressure core and the second pressure core;
A pressing member that can contact the upper part of the lid member and holds the lid member;
A pedestal core, and a movement control unit that performs control to move and move the first pressure core and the second pressure core;
The movement control unit brings the pedestal core, the first pressure core and the second pressure core close to each other,
The first pressure core, together with the pedestal core, applies pressure to the first electronic component,
The second pressure core, together with the pedestal core, applies pressure to the second electronic component,
The first pressure core and the second pressure core move independently from each other in the perspective to the pedestal core,
The position of the first end of the first pressure core when the first pressure core pressurizes the first electronic component and the second when the second pressure core pressurizes the second electronic component The position of the first end of the pressure core can be different depending on the difference between the thickness of the first electronic component and the thickness of the second electronic component,
The pedestal core can relieve the extra pressure, which is an excess of the pressure applied by the first pressurization core and the second pressurization core, by movement.

  With this configuration, two or more electronic components can be mounted in parallel. In addition, even when there are differences in the thicknesses of two or more electronic components, substantially the same pressure can be applied to each of the electronic components, and it is possible to prevent insufficient mounting or damage.

In the electronic component mounting apparatus according to the second aspect of the present invention, in addition to the first aspect, the end position of the first pressure core and the second additional position are determined by the difference in thickness between the first electronic component and the second component. If the end position of the pressure core is different,
By tilting the lid member, the difference between the end position of the first pressure core and the end position of the second pressure core is absorbed, and the pressure applied by the first pressure core and the second pressure core are applied. The pressure to be made is substantially the same.

  With this configuration, the application of pressure to a plurality of electronic components can be made equal.

  In the electronic component mounting apparatus according to the third aspect of the present invention, in addition to the second aspect, the pressing member presses the lid member even when the lid member is inclined.

  With this configuration, since the first pressure core and the second pressure core can apply pressure from the pressing member via the lid member, it is possible to apply equivalent pressure to the plurality of electronic components.

In the electronic component mounting apparatus according to the fourth invention of the present invention, in addition to the second or third invention, in the case where the lid member is inclined and not inclined,
The first pressure core pressurizes the first electronic component with the first pressure,
The second pressure core pressurizes the second electronic component having a thickness different from that of the first electronic component with the second pressure,
The first pressure and the second pressure are substantially the same.

  With this configuration, even when a plurality of electronic components are mounted in parallel, it is possible to prevent damage or insufficient mounting due to differences in the thickness of the electronic components.

In the electronic component mounting apparatus according to the fifth aspect of the present invention, in addition to any one of the first to fourth aspects, the second end portion of the first pressure core has a convex shape, and the bottom surface of the lid member. Has a concave shape, the convex shape and the concave shape are slidably combined,
The second end portion of the second pressure core has a convex shape, the bottom surface of the lid member has a concave shape, and the convex shape and the concave shape are slidably combined.

  With this configuration, even when the first pressure core and the second pressure core have different heights, the lid member can be tilted while maintaining contact with them. Due to the inclination in maintaining the contact, the pressure applied by the first pressure core and the second pressure core is substantially the same.

  In the electronic component mounting apparatus according to the sixth aspect of the present invention, in addition to the fifth aspect, the convex and concave surfaces have curved surfaces.

  With this configuration, it is easy to slide and the inclination of the lid member can be realized.

  In the electronic component mounting apparatus according to the seventh aspect of the present invention, in addition to any one of the first to sixth aspects, the top surface of the lid member has a convex shape, and the bottom surface of the pressing member has a concave shape. The convex and concave surfaces have curved surfaces and are slidably combined.

  With this configuration, a combination in which the lid member and the pressing member are in contact with each other while sliding can be maintained. This is the same even when the lid member is tilted, and the combination by contact and the maintenance of the pressure are possible.

  In the electronic component mounting apparatus according to the eighth aspect of the present invention, in addition to any one of the first to seventh aspects, the pedestal core corresponds to both the first pressure core and the second pressure core. The region to be made is opposed to the substrate.

  With this configuration, the pedestal core can correspond to a plurality of pressure cores.

In the electronic component mounting apparatus according to the ninth aspect of the present invention, in addition to any of the first to eighth aspects, the pressing member has an elastic member that applies pressure to the lid member,
The elastic member reduces the gap between the combined surface of the lid member and the first pressure core and the combined surface of the lid member and the second pressure core, and provides a gap between the pressing member and the lid member.

  With this configuration, even when the lid member is inclined, the pressure via the lid member is properly transmitted from the pressing member to the pressure core.

  In the electronic component mounting apparatus according to the tenth invention of the present invention, in addition to any of the first to ninth inventions, between the first pressure core and the first electronic component and between the second pressure core and the first A sheet is placed on at least one of the two electronic components.

  With this configuration, electronic components can be protected.

In the electronic component mounting apparatus according to the eleventh aspect of the present invention, in addition to any one of the first to tenth aspects, a first mold frame for storing the pedestal core,
A second mold for storing the first pressure core, the second pressure core, the lid member and the pressing member;
The movement control unit controls the movement of the pedestal core, the first pressure core, and the second pressure core in the near and far directions by moving at least one of the first mold frame and the second mold frame.

  With this configuration, it is possible to realize pressure application by each element in combination by operating the whole.

In the electronic component mounting apparatus according to the twelfth aspect of the present invention, in addition to the eleventh aspect,
The second form has a storage space,
The storage space fixes the pressing member in a detachable state, and stores the first pressure core, the second pressure core, and the lid member in an unconnected state.

  With this configuration, the pressure of the first pressure core and the pressure of the second pressure core are substantially the same while the lid member can be tilted.

In the electronic component mounting apparatus according to the thirteenth aspect of the present invention, in addition to any one of the first to twelfth aspects, the electronic component mounting apparatus further includes a pressure detection unit that detects pressure applied to the first electronic component and the second component,
The pedestal core releases excess pressure based on the pressure detected by the pressure detector.

  With this configuration, damage to electronic components due to excessive pressurization can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Mounting electronic components on an electronic board)
The mounting of the electronic component on the board in the present invention will be described. FIG. 1 is a front view of a board on which electronic components are mounted. FIG. 2 is a side view of a substrate on which electronic components are mounted. The substrate 100 is a lead frame, a metal base, a heat sink, an electronic substrate, and the like, and includes a flexible substrate, a tape substrate, a sheet substrate, and the like. Moreover, it has various structures, such as a single layer and a laminated layer.

  FIG. 1 shows a state in which the substrate 100 is viewed from above. One or more electronic components 200 are mounted on the substrate 100. In FIG. 1, a plurality of electronic components 200 are mounted, and the substrate 100 may be stored in an electronic device or the like in this state, or may be used by being divided for each electronic component 200.

  Also, as shown in FIGS. 1 and 2, two electronic components 200 are mounted in pairs. The electronic component mounting apparatus according to the present invention mounts two (three or more) electronic components in parallel. For this reason, on the substrate 100 after mounting, the two electronic components 200 are mounted in pairs as shown in FIGS. 1 and 2. Of course, FIG. 1 and FIG. 2 are for clarifying the situation where the two electronic components 200 are mounted as a pair, and the electronic components 200 must be arranged in this manner on the actually mounted substrate 100. Do not mean. Further, not only two electronic components 200 may be mounted in parallel, but three or more electronic components 200 may be mounted in parallel.

  As shown in FIG. 2, the electronic component 200 is mounted on the substrate 100 via an adhesive layer 210. The adhesive layer 210 is an adhesive or the like, and the electronic component 200 is mounted on the substrate 100 by a bonding function of the adhesive. Before mounting, an adhesive is applied and the like, and after mounting by applying pressure and heat for mounting, the adhesive layer 210 is formed.

  The electronic component mounting apparatus of the present invention realizes mounting as shown in FIGS. In particular, as described above, two (including three or more) electronic components 200 are mounted in parallel. Here, “simultaneous and parallel” means that the electronic component mounting apparatus is mounted at a time, and does not indicate the narrow meaning of simultaneous in a strict time.

  (Embodiment 1)

(Overview)
FIG. 3 is a schematic diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. The electronic component mounting apparatus 1 schematically shows that the electronic component 200 is mounted. On the surface of the substrate 100, the first electronic component 200A and the second electronic component 200B are installed. The electronic component mounting apparatus 1 mounts the two first electronic components 200A and the second electronic component 200B simultaneously in parallel. Of course, as described above, there may be a third electronic component or a fourth electronic component.

  The electronic component device 1 includes a pedestal core 2, a first pressure core 3 </ b> A, a second pressure core 3 </ b> B, a lid member 4, a pressing member 5, and a movement control unit 6.

  The pedestal core 2 directly or indirectly faces the non-mounting surface of the electronic component 200 on the substrate 100. In FIG. 3, the first electronic component 200 </ b> A and the second electronic component 200 </ b> B are installed on the upper surface of the substrate 100. For this reason, the pedestal core 2 is positioned below the substrate 100. As will be described later, the pedestal core 2 applies pressure and heat to the substrate 100 and the electronic component by being close to the first pressure core 3A and the second pressure core 3B.

  The first pressure core 3A is located on the opposite side of the base core 2 with respect to the substrate 100, and directly or indirectly faces the first electronic component 200A. As will be described later, the first pressurizing core 3A pressurizes the base 100 together with the substrate 100 and the first electronic component 200A. This pressurization realizes mounting of the substrate 100 and the first electronic component 200A.

  The second pressure core 3B is located on the opposite side of the base core 2 with respect to the substrate 100, and directly or indirectly faces the second electronic component 200B. As will be described later, the second pressure core 3B pressurizes together with the base core 2 with the substrate 100 and the second electronic component 200B interposed therebetween. This pressurization realizes mounting of the substrate 100 and the second electronic component 200B.

  Here, the term “direct” refers to a state in which no member is interposed therebetween, and the term “indirect” refers to a state in which some member is interposed therebetween. For example, a protective sheet or the like may be interposed, and in this case, the pedestal core 2 and the pressure core 3 are indirectly opposed via the protective sheet.

  Each of the first pressure core 3 </ b> A and the second pressure core 3 </ b> B is movable with respect to the substrate 100. In FIG. 3, the pedestal core 2 is positioned below the substrate 100, and the first pressure core 3 </ b> A and the second pressure core 3 </ b> B are positioned above the substrate 100. For this reason, each of the 1st pressurization core 3A and the 2nd pressurization core 3B can move up and down (lifting).

  At this time, the first pressure core 3A and the second pressure core 3B can move independently of each other.

  The lid member 4 can contact the upper portion of the first pressure core 3A and the upper portion of the second pressure core 3B, and suppresses the upper portions of the first pressure core 3A and the second pressure core 3B. That is, the lid member 4 plays a role of pressing down the first pressure core 3A and the second pressure core 3B. In FIG. 3, each element is positioned in the vertical direction, and the electronic component 200 is mounted by pressing in the vertical direction. For this reason, the lid member 4 presses the first pressure core 3A and the second pressure core 3B from above.

  The pressing member 5 holds the lid member 4. In FIG. 3, since each element is positioned in the vertical direction, the pressing member 5 is above the lid member 4 and presses the upper side of the lid member 4.

  The movement control unit 6 performs control to move the pedestal core 2, the first pressure core 3 </ b> A, and the second pressure core 3 </ b> B so as to move closer and closer. Since they are far and near, the base core 2, the first pressure core 3A, and the second pressure core 3B are remoted or brought close to each other.

  Here, the movement control unit 6 brings the pedestal core 2 close to the first pressure core 3A and the second pressure core 3B. Due to this proximity, the first pressure core 3A, together with the pedestal core 2, applies pressure to the first electronic component 200A. At this time, the pressure core 3 and the pedestal core 2 apply heat in addition to pressure. This is because the electronic component 200 can be mounted on the substrate 100 by pressure and heat (the same is true in the following. In the following, there is a description that pressure is applied, but pressure and heat are applied in mounting). However, for the purpose of explaining the application and control of pressure, only the application of pressure may be described in the description (however, heat is also applied in the actual mounting operation). This is because the first pressure core 3A and the pedestal core 2 sandwich the substrate 100 and the first electronic component 200A due to the proximity.

  Similarly, due to the proximity, the second pressure core 3B applies pressure and heat to the second electronic component 200B together with the base core 2. This is because the second pressure core 3B and the pedestal core 2 sandwich the substrate 100 and the second electronic component 200B due to the proximity.

  The movement of the first pressure core 3A and the second pressure core 3B by the movement control unit 6 operates independently of each other. Therefore, the first pressure core 3A applies pressure and heat to the first electronic component 200A, and the second pressure core 3B applies pressure and heat to the second electronic component 200B in an independent state. it can.

  Due to this independence, even when the thicknesses of the first electronic component 200A and the second electronic component 200B are different, the first pressure core 3A and the second pressure core 3B can individually and flexibly correspond.

  That is, the position of the first end 31A of the first pressure core 3A when the first pressure core 3A pressurizes the first electronic component 200A and the second pressure core 3B pressurizes the second electronic component 200B. The position of the first end 31B of the second pressure core 3B can be different depending on the difference between the thickness of the first electronic component 200A and the thickness of the second electronic component 200B. If the thickness is different, the position of the first end 31A of the first pressure core 3A is different from the position of the first end 31B of the second pressure core 3B.

  The first pressure core 3A applies pressure to the first electronic component 200A and the second pressure core 3B applies pressure to the second electronic component 200B in the different positions. For this reason, the pressure applied to the first electronic component 200A and the pressure applied to the second electronic component 200B are equivalent. Even if there is a difference in the thickness of the electronic component 200, it is possible to prevent the pressure applied to each from being different.

  In addition, the pedestal core 2 can move when pressure is applied along a vector in the pressure application direction. By this movement, the pedestal core 2 can relieve excess pressure among the pressures applied by the first pressure core 3A and the second pressure core 3B. In addition to this, the pressure applied by the first pressure core 3A to the first electronic component 200A is equal to the pressure applied by the second pressure core 3B to the second electronic component 200B. When the pressure of the first pressure core 3A and the second pressure core 3B is received from the opposite side, the pedestal core 2 moves in the pressure direction by the pressure core 3, which is an excess pressure. Extra pressure can be released.

  As described above, while the first pressure core 3A and the second pressure core 3B are independently pressurized (and heat is applied), the positions of the first end portions can be different (contact positions can be different). In addition, since the pedestal core 2 releases the excess pressures of the pressure cores, it is possible to apply equivalent pressures to the first electronic component 200A and the second electronic component 200B, which may have a difference in thickness. it can. As a result, it is possible to prevent problems such as damage to any of the electronic components 200 or insufficient mounting of any of the electronic components 200.

(Cover member)
The lid member 4 can contact the upper part of the first pressure core 3A and the upper part of the second pressure core 3B. In FIG. 3, since the member is positioned in the vertical direction, the lid member 4 can come into contact with the upper portion of the first pressure core 3A and the upper portion of the second pressure core 3B, but the positional relationship in the lateral direction or the like. If so, it is possible to contact the part corresponding to this relationship.

  The lid member 4 presses the first pressure core 3A and the second pressure core 3B by contact. By this pressing, it is possible to prevent the pressure applied by the first pressure core 3A and the second pressure core 3B from becoming insufficient.

  Here, the lid member 4 can be inclined or level. This is because the lid member 4 is combined only with the first pressure core 3 </ b> A and the second pressure core 3 </ b> B, and is not connected or fixedly connected. When the thicknesses of the first electronic component 200A and the second electronic component 200B are different, the positions of the first end 31A and the first end 31B of the first pressure core 3A and the second pressure core 3B are different. To do. In other words, the height is also different.

  Corresponding to this difference in height, the lid member 4 can be tilted. By tilting the lid member 4, the difference in position between the first end 31A and the second end 31B can be absorbed. By this absorption, the pressure applied by the first pressure core 3A and the second pressure core 3B can be made substantially the same.

  Whether the lid member 4 is tilted or not tilted, the first pressure core 3A applies a first pressure to the first electronic component 200A. Similarly, the second pressure core 3B applies a second pressure to the second electronic component 200B. At this time, the first pressure and the second pressure are substantially the same.

(Presser member)
The pressing member 5 contacts the upper part of the lid member 4 and presses the lid member 4. At this time, even when the lid member 4 is tilted (or, of course, not tilted), the pressing member 5 presses the lid member 4. By this pressing, it is possible to prevent insufficient pressure from being applied by the first pressure core 3A and the second pressure core 3B via the lid member 4. In addition, the pressing member 5 can hold the lid member 4 while the lid member 4 is tilted. For this reason, even when the heights of the first pressure core 3A and the second pressure core 3B are different, the first pressure and the second pressure can be maintained substantially the same.

  The pressing member 5 is not fixed or connected to the lid member 4 and is in a state of being combined with the lid member 4. For this reason, the pressing member 5 has a combined degree of freedom in relation to the lid member 4. For this reason, even when the lid member 4 is inclined, the press against the lid member 4 can be maintained. The relationships among the pedestal core 2, the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, the lid member 4, and the pressing member 5 are not connected or fixed to each other. These are combined so that they can contact each other. Therefore, pressurization is also realized by the inclination of the lid member 4 or the difference between the first pressurization core 3A and the second pressurization core 3B.

  However, the pressing member 5 is fixed to a second mold frame described later. Since the pressing member 5 is fixed to the second mold, the pressing member 5 applies pressure to the lid member 4 even with respect to the movement of the pressure core 3 and the lid member 4 combined inside. Can be maintained.

(Description of operation 1: When there is not much difference in thickness of electronic parts)
Next, the operation of the electronic component mounting apparatus 1 of the present invention will be described. First, as an operation explanation 1, a case where there is not much difference in thickness of electronic components will be described.

  FIG. 3 shows a state at the start of the operation explanation 1. This state is the start of mounting by the electronic component mounting apparatus 1. FIG. 4 is a schematic diagram showing a pressurized state in the first operation explanation 1 according to the first embodiment of the present invention. FIG. 4 shows a state after FIG.

(At start)
As shown in FIG. 3, the electronic component mounting apparatus 1 sets a substrate 100 on which a first electronic component 200A and a second electronic component 200B are placed. When the electronic component mounting apparatus 1 is combined on the premise of vertical movement, the pedestal core 2 is installed below the substrate 100. The first pressure core 3A is installed above the first electronic component 200A. The second pressure core 3B is installed above the second electronic component 200B.

  Of course, if the moving direction for pressurization is the horizontal direction, these elements are installed and combined along the horizontal direction.

  At the start, the first pressure core 3A, the second pressure core 3B, and the pedestal core 2 are sufficiently separated. By this separation, the first pressure core 3A does not apply pressure to the first electronic component 200A, and the second pressure core 3B does not apply pressure to the second electronic component 200B.

  The movement control unit 6 moves the first pressure core 3A and the second pressure core 3B and the pedestal core 2 so as to approach each other. At this time, the movement control unit 6 may move only the pedestal core 2 to move closer, move only the first pressure core 3A and the second pressure core 3B, or move all of them. You may let them get close.

(When pressurized)
FIG. 4 shows a state in which the first pressure core 3A and the second pressure core 3B and the pedestal core 2 are approaching as described above. Due to this proximity, the first pressure core 3A applies pressure to the first electronic component 200A, and the second pressure core 3B applies pressure to the second electronic component 200B. As shown in FIG. 4, the first pressure core 3A is in contact with the first electronic component 200A, and the second pressure core 3B is in contact with the second electronic component 200B.

  FIG. 4 shows a state in which the first pressurizing core 3A pressurizes with the first pressure and the second pressurizing core 3B pressurizes with the second pressure by this contact. Heat is also applied in conjunction with pressure.

  In FIG. 4, there is almost no difference in the thickness of the first electronic component 200A and the second electronic component 200B. For this reason, the positions of the first end 31A of the first pressure core 3A and the second end 31B of the second pressure core 3B are substantially the same. If the length in the moving direction of the first pressure core 3A and the second pressure core 3B is substantially the same, the height of the first pressure core 3A and the height of the second pressure core 3B are also substantially the same.

  For this reason, the lid member 4 that holds the first pressure core 3A and the second pressure core 3B is in a horizontal state. In this state, the lid member 4 and the pressing member 5 realize the pressurization of both the first pressure core 3A and the second pressure core 3B. The first pressure and the second pressure are substantially the same state.

  In this way, when the thicknesses of the first electronic component 200A and the second electronic component 200B are not different, the combined pressure core and lid member pressurize in a substantially horizontal state. By applying this pressure, the first electronic component 200A and the second electronic component 200B are mounted on the substrate 100 simultaneously in parallel. In mounting, a mounting adhesive or the like is used.

(Mounting state)
FIG. 5 is a schematic diagram showing a state where the pressurization No. 1 according to the first embodiment of the present invention is completed and mounted. The reference numerals of the same elements as those in FIG. 4 are omitted. The first pressure core 3A, the second pressure core 3B, the lid member 4 and the pressing member 5 that are combined are in close contact with each other. In this state, the substrate 100, the first electronic component 200A, and the second electronic component 200B are sufficiently pressurized and heated.

  By performing sufficient pressurization and heating, mounting via an adhesive or the like is completed.

(Description of operation part 2: When there is a difference in thickness between the first electronic component and the second electronic component)
Next, a case where there is a difference in thickness between the first electronic component 200A and the second electronic component 200B will be described. The first electronic component 200A and the second electronic component 200B may have different thicknesses due to differences in the types or the same type, but variations during manufacturing.

(At start)
FIG. 6 is a schematic diagram of the electronic component mounting apparatus showing the start of operation explanation 2 in Embodiment 1 of the present invention. The first pressurizing core 3A and the like are not yet close to each other and pressurization is not started. The thickness of the first electronic component 200A is larger than the thickness of the second electronic component 200B.

  The first pressure core 3A faces the first electronic component 200A, and the second pressure core 3B faces the second electronic component 200B. By this opposition, the first pressure core 3A pressurizes the first electronic component 200A, and the second pressure core 3B pressurizes the second electronic component 200B. Although not shown in the figure, the movement control unit 6 reduces the distance between the pressure core and the pedestal core 2.

(Pressurization start)
FIG. 7 is a schematic diagram of the electronic component mounting apparatus showing the start of pressurization in Operation Explanation 2 in Embodiment 1 of the present invention. The movement control unit 6 moves the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, and the pedestal core 2. By this moving operation, the first pressure core 3A and the second pressure core 3B and the pedestal core 2 come close to each other.

  By approaching, the first pressure core 3A and the first electronic component 200A approach each other, and the first pressure core 3A and the first electronic component 200A come into contact with each other as shown in FIG.

  At this time, since the thickness of the second electronic component 200B is smaller than the thickness of the first electronic component 200A, the second pressure core 3B cannot contact the second electronic component 200B. This is because the proximity is still insufficient for contact. In the state of FIG. 7, the first pressure core 3A is in contact with the first electronic component 200A, but the second pressure core 3B is not in contact with the second electronic component 200B.

  Only the first pressurizing core 3A is in a state of starting pressurization on the first electronic component 200A.

(Pressurized state)
FIG. 8 is a schematic diagram of the electronic component mounting apparatus showing a pressurized state in Operation Explanation 2 in Embodiment 1 of the present invention. The movement control part 6 makes the 1st pressurization core 3A and the 2nd pressurization core 3B, and the base core 2 further approach. From the state where the thickness of the second electronic component 200B is small as shown in FIG. 7 and the second pressure core 3B and the second electronic component 200B are separated, the second pressure core 3B is second as shown in FIG. It will be in the state which contacts the electronic component 200B.

  At this time, the first end 31B of the second pressure core 3B is positioned below the first end 31A of the first pressure core 3A. That is, the second pressure core 3B is lowered from the first pressure core 3A. The height of the first pressure core 3A and the second pressure core 3B is different.

  Corresponding to the state where height differs, the cover member 4 inclines. FIG. 8 shows a state in which the lid member 4 is tilted. By tilting the lid member 4, different heights of the first pressure core 3A and the second pressure core 3B can be absorbed. The lid member 4 is not fixedly connected but merely combined with the first pressure core 3A or the like so as to be separable and contactable. For this reason, even if there is a difference in height between the first pressure core 3A and the second pressure core 3B, it can be absorbed by tilting.

  Further, the lid member 4 in a state where the pressing member 5 on the lid member 4 is tilted can be pressed. As a result, even when the lid member 4 is tilted, the connection between the pressing member 5, the lid member 4, the first pressure core 3A, and the second pressure core 3B can apply pressure to the electronic component 200 and the substrate 100. it can.

  Further, the lid member 4 is inclined to realize the pressurization of the first pressure core 3A and the second pressure core 3B. For this reason, the first pressure and the second pressure are substantially the same. This is because the lid member 4 pushes both the first pressure core 3A and the second pressure core 3B while tilting. In addition, since the pedestal core 2 can release excess pressure, pressure that is excessive for mounting can be released. In addition, the first pressure and the second pressure, which are optimum pressures, are applied as pressurization.

  Thus, even the first electronic component 200A and the second electronic component 200B having different thicknesses can be mounted in parallel while applying substantially the same pressure.

(Combination of pressure core and lid member)
6-8, 2nd end part 32A which is an edge part which 3A of 1st pressurization cores and the cover member 4 can contact has convex shape. The bottom surface of the lid member 4 has a concave shape corresponding to this convex shape. The convex shape of the second end portion 32A and the concave shape of the bottom surface of the lid member 4 are slidably combined. By being slidable, the concave curved surface of the bottom surface of the lid member 4 moves so as to slide with respect to the convex curved surface of the second end portion 32A. By this movement, the lid member 4 can make an inclination.

  Similarly, the second end portion 32B of the second pressure core 3B has a convex shape. The bottom surface of the lid member 4 has a concave shape corresponding to this convex shape. The convex shape of the second end portion 32B and the concave shape of the bottom surface of the lid member 4 are slidably combined. By being slidable, the concave curved surface of the bottom surface of the lid member 4 slides with respect to the convex curved surface of the second end portion 32B. By this movement, the lid member 4 can make an inclination.

  Even if the height of the first pressure core 3A and the second pressure core 3B is different due to being slidable by the combination of the convex shape and the concave shape, the lid member 4 inclines this while tilting. Can absorb.

  Here, the convex surfaces of the second end portions 32A and 32B have curved surfaces. Similarly, the concave surface of the bottom surface of the lid member 4 has a curved surface. When the curved surfaces come into contact with each other, sliding becomes possible. As shown in FIG. 8, the first pressure core 3A is positioned higher than the second pressure core 3B. At this time, the concave shape of the lid member 4 slides with respect to the second end portion 32A of the first pressure core 3A. By the sliding, the lid member 4 is inclined obliquely. After the inclination, the concave shape of the lid member 4 can come into contact with the second end portion 32B of the second pressure core 3B.

  Thus, the contact between the lid member 4 and the pressure core is maintained by sliding between the curved surfaces. As a result, the first pressure core 3A applies a first pressure to the first electronic component 200A, and the second pressure core 3B applies a second pressure to the second electronic component 200B. The first pressure and the second pressure are substantially the same.

(Combination of lid member and holding member)
As shown in FIG. 8, the upper surface of the lid member 4 has a convex shape. The bottom surface of the pressing member 5 has a concave shape. The convex shape of the upper surface of the lid member 4 has a curved surface. The concave shape of the bottom surface of the pressing member 4 also has a curved surface corresponding thereto. Since the curved surfaces can be in contact with each other, the lid member 4 and the pressing member 5 can slide with each other when they come into contact with each other.

  By this slidability, the lid member 4 can be tilted while being in contact with the pressing member 5. By being in the contact state, even when the lid member 4 is tilted, the pressing member 5 presses the lid member 4 and pressure application can be maintained.

  When the first electronic component 200A and the second electronic component 200B have different thicknesses as shown in FIG. 8, the heights of the first pressure core 3A and the second pressure core 3B are different. This difference is absorbed by the lid member 4 that is tilted while maintaining contact with the pressure core. Further, the tilted lid member 4 and the pressing member 5 can maintain contact. As a result, the pressure member 5 to the pedestal core 2 can maintain a continuous connection and maintain the pressure. In addition, since it is only due to the inclination, substantially the same first pressure and second pressure can be maintained.

  Moreover, the base core 2 makes the area | region corresponding to the area | region of both the 1st pressurization core 3A and the 2nd pressurization core 3B oppose the board | substrate 100. FIG. For this reason, the base core 2 can receive the pressure which the 1st pressurization core 3A and the 2nd pressurization core 3B apply. When one pedestal core 2 receives each pressurization, the pressurization by the first pressurization core 3A and the pressurization by the second pressurization core 3B are appropriately applied to the electronic component 200.

  As described above, the electronic component mounting apparatus 1 according to Embodiment 1 can simultaneously mount a plurality of electronic components 200 having different thicknesses. At this time, since the pressure applied to each electronic component can be made substantially the same, it is possible to prevent any of the mounting from being insufficient or damage to any of the components.

  (Embodiment 2)

  Next, a second embodiment will be described.

(Sheet)
FIG. 9 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 2 of the present invention. In FIG. 9, the sheet 310 is installed between at least one of the first pressure core 3A and the first electronic component 200A and between the second pressure core 3B and the second electronic component 200B.

  The sheet 210 is a thin member made of a material such as resin, paper, metal, alloy, or chemical product. A film-like thing may be sufficient. Since the sheet 310 is installed, the first pressure core 3A pressurizes the first electronic component 200A via the sheet 310. Similarly, the second pressure core 3B pressurizes the second electronic component 200B via the sheet 310.

  In this way, the pressure core 3 does not directly contact the electronic component 200 during pressurization. Since pressure is applied by this indirect contact, it is not necessary to damage the electronic component 200.

(Elastic member)
FIG. 10 is a schematic diagram of an electronic component mounting apparatus including an elastic member according to Embodiment 2 of the present invention. In the electronic component mounting apparatus 1 of FIG. 10, the pressing member 5 further includes an elastic member 8 that applies pressure to the lid member 4. The elastic member 8 is provided in an internal space provided in the pressing member 5.

  The pressing member 5 is combined with the lid member 4 and applies pressure. At this time, the elastic member 8 is in a state where it can contact the lid member 4 from the inside of the pressing member 5. By this contact, the elastic member 8 can apply pressure to the lid member 4.

  The lid member 4 that receives pressure by the elastic member 8 is pressed against the first pressure core 3A and the second pressure core 3B. As a result, a gap is formed between the lid member 4 and the pressing member 5, and there is an effect of smoothing the moving operation such as the inclination of the lid member 4.

  For example, the lid member 4 may be inclined due to the difference in thickness between the first electronic component 200A and the second electronic component 200B. When the lid member 4 and the pressing member 5 are in contact with each other, the tilting operation of the lid member is hindered by contact resistance, and malfunction may occur without tilting. At this time, the elastic member 8 is pressed by an elastic force, so that the lid member 4 receives pressure toward the first pressure core 3 </ b> A and the second pressure core 3 </ b> B and has a gap between the pressure member 5. The lid member 4 can be smoothly tilted.

(Formwork)
FIG. 11 is a schematic diagram of an electronic component mounting apparatus including a mold according to Embodiment 2 of the present invention. In FIG. 11, the state provided with the 1st mold 20 and the 2nd mold 30 is shown. For the convenience of illustration, the outer shapes of a part of the first mold 20 and the second mold 30 are indicated by solid lines.

  The first mold frame 20 stores the pedestal core 2. The second mold 30 stores the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, the lid member 4, and the pressing member 5. The movement control unit 6 moves at least one of the first mold 20 and the second mold 30. As the first mold frame 20 and the second mold frame 30 are moved closer, the pedestal core 2 and the first pressure core 3A are moved closer.

  That is, the movement control unit 6 brings the first mold frame 20 and the second mold frame 30 close to each other. Due to this proximity, the pedestal core 2 is brought close to the first pressure core 3A and the second pressure core 3B. By this proximity, pressurization for mounting is realized.

  At this time, the second mold 30 stores the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, the lid member 4, and the pressing member 5. For this reason, when the second mold 30 is close to the first mold 20, the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, the lid member 4, and the pressing member 5 stored in the second mold 30. Everything is close together. By this proximity, in addition to the first pressure core 3A and the second pressure core 3B, the lid member 4 and the pressing member 5 are also close to each other. This total proximity allows the entire combined element to achieve pressurization.

  Since the second mold 30 has a storage space, the second mold 30 does not connect the first pressure core 3 </ b> A, the second pressure core 3 </ b> B, and the lid member 4 to the storage space. Store in the state of connection. The pressing member 5 is fixed to the second mold 30 in a detachable state. That is, with the pressing member 5 fixed to the second mold 30 as the upper part, the first pressure core 3A, the second pressure core 3B, and the lid member 4 are combined in an unconnected state. In other words, these elements and the pressing member 5 are combined in a non-connected manner in relation to each other.

  By such a combination, the lid member 4 can be tilted, and the pressing member 5 can press the tilted lid member 4. When the second mold 30 is brought close to each other, these elements stored inside are brought close together so that pressure is applied as a whole.

(Excess pressure treatment by pedestal core)
The pedestal core 2 plays a role of releasing an extra pressure that is an extra pressure among the pressures received from the first pressurization core 3A and the second pressurization core 3B. By releasing the excess pressure, only the pressure necessary for mounting is applied to the electronic component 200 and the substrate 100, and no excessive pressure is applied. As a result, the electronic component 200 and the substrate 100 are not damaged as in the prior art.

  The lower part of the pedestal core 2 is connected by hydraulic pressure, pneumatic pressure, or the like. When a certain pressure or more is applied by this hydraulic pressure or air pressure, excess pressure can be released in the pressure direction applied from the first pressurizing core 3A or the like.

  For example, the pedestal core 2 can move along the pressure application direction in response to an excessive extra pressure among the pressures applied from the first pressure core 3A and the like. By this movement, excess pressure can be released.

  At this time, it is also preferable to further include a pressure detection unit that detects pressure applied to the first electronic component 200A and the second electronic component 200B. FIG. 12 is a schematic diagram of an electronic component mounting apparatus including a pressure detection unit according to Embodiment 2 of the present invention.

  The pressure detector 40 detects the pressure applied to the first electronic component 200A and the second electronic component 200B. Here, the pressure applied to the first electronic component 200A and the pressure applied to the second electronic component 200B are substantially the same as described above. The pressure detection unit 40 notifies the pedestal core 2 of the detected pressure. Alternatively, the control unit that controls the operation of the pedestal core 2 is notified.

  The pedestal core 2 releases excess pressure based on the pressure detected by the pressure detection unit 40. For example, when the reference pressure is fixed and the pressure detected by the pressure detector 40 exceeds the reference pressure, the pedestal core 2 moves away due to the excess pressure.

  The pedestal core 2 itself moves, or the control unit that controls the pedestal core 2 moves the pedestal core 2 to release excess pressure. For example, the movement control unit 6 may move the pedestal core 2 to release excess pressure. By such movement (position change) of the pedestal core 2, the extra pressure can be released.

  As described above, the electronic component mounting apparatus 1 according to the second embodiment can further improve mounting accuracy and capability. In the first and second embodiments, the simultaneous and parallel mounting of the two electronic components, the first electronic component 200A and the second electronic component 200B, has been described. May be deployed.

  The electronic component mounting apparatus described in the first and second embodiments is an example for explaining the gist of the present invention, and includes modifications and alterations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Base core 3A 1st pressurization core 3B 2nd pressurization core 31A, 31B 1st end part 32A, 32B 2nd end part 4 Lid member 5 Holding member 6 Movement control part 8 Elastic member 20 1st Formwork 30 Second formwork 40 Pressure detecting unit 100 Substrate 200 Electronic component 200A First electronic component 200B Second electronic component 310 Sheet

Claims (13)

An electronic component mounting apparatus for mounting a first electronic component and a second electronic component on a substrate,
A pedestal core directly or indirectly facing the non-mounting surface of the electronic component on the substrate;
A first pressure core directly or indirectly facing the first electronic component;
A second pressure core directly or indirectly facing the second electronic component;
The second end portion of the first pressure core and the second end portion of the second pressure core can be contacted with the second end portion of the first pressure core and the second end portion of the second pressure core. A lid member having a first end to hold down;
A pressing member that is capable of contacting the second end of the lid member and has an end for pressing the lid member;
A movement control unit that performs control to move the pedestal core, the first pressure core, and the second pressure core to move away from each other;
The movement control unit brings the pedestal core, the first pressure core, and the second pressure core close to each other,
The first pressure core, together with the pedestal core, applies pressure to the first electronic component,
The second pressure core, together with the pedestal core, applies pressure to the second electronic component,
The first pressure core and the second pressure core move independently from each other in the perspective to the pedestal core,
The position of the first end of the first pressure core when the first pressure core pressurizes the first electronic component, and the second pressure core pressurizes the second electronic component. The position of the first end portion of the second pressure core when doing can be different depending on the difference between the thickness of the first electronic component and the thickness of the second electronic component,
The pedestal core is an electronic component mounting apparatus capable of movably releasing an extra pressure which is an excess of the pressure applied by the first pressurization core and the second pressurization core. When the first end position of the first pressure core is different from the first end position of the second pressure core due to a difference in thickness between the first electronic component and the second electronic component. Is
The lid member is inclined to absorb the difference between the first end position of the first pressure core and the first end position of the second pressure core, and the first pressure core provides the difference. The electronic component mounting apparatus according to claim 1, wherein the pressure to be applied and the pressure applied by the second pressure core are substantially the same.   The electronic component mounting apparatus according to claim 2, wherein the pressing member presses the lid member even when the lid member is inclined. When the lid member tilts and does not tilt,
The first pressure core pressurizes the first electronic component with a first pressure,
The second pressure core pressurizes the second electronic component having a thickness different from that of the first electronic component with a second pressure,
The electronic component mounting apparatus according to claim 2, wherein the first pressure and the second pressure are substantially the same. The second end portion of the first pressure core has a convex shape, the first end portion of the lid member has a concave shape, and the convex shape and the concave shape are slidably combined. ,
The second end of the second pressure core has a convex shape, the first end of the lid member has a concave shape, and the convex shape and the concave shape are slidably combined. The electronic component mounting apparatus according to any one of claims 1 to 4.   The electronic component mounting apparatus according to claim 5, wherein the convex and concave surfaces have curved surfaces.   The second end portion of the lid member has a convex shape, the end portion of the pressing member has a concave shape, and the convex shape and the surface of the concave shape have a curved surface and are slidable. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is combined.   The electronic component mounting apparatus according to any one of claims 1 to 7, wherein the pedestal core is configured so that regions corresponding to both the first pressure core and the second pressure core are opposed to the substrate. The pressing member has an elastic member that applies pressure to the lid member,
The elastic member reduces a gap between a combination surface of the lid member and the first pressure core and a combination surface of the lid member and the second pressure core, and between the pressing member and the lid member. The electronic component mounting apparatus according to claim 1, wherein a gap is provided.   The sheet according to any one of claims 1 to 9, wherein a sheet is disposed between at least one of the first pressure core and the first electronic component and between the second pressure core and the second electronic component. The electronic component mounting apparatus described. A first form for storing the pedestal core;
A second mold for storing the first pressure core, the second pressure core, the lid member, and the pressing member;
The movement control unit controls movement of the pedestal core, the first pressure core, and the second pressure core in the near and far directions by moving at least one of the first mold frame and the second mold frame. The electronic component mounting apparatus according to any one of claims 1 to 10. The second mold has a storage space;
The storage space fixes the pressing member in a detachable state, and stores the first pressure core, the second pressure core, and the lid member in an unconnected state. Electronic component mounting equipment. A pressure detector for detecting pressure applied to the first electronic component and the second electronic component;
The electronic component mounting apparatus according to claim 1, wherein the pedestal core releases excess pressure based on the pressure detected by the pressure detection unit.