JP6566457B1 - Electronic component mounting equipment - Google Patents

Abstract

An electronic component mounting apparatus is provided that is capable of mounting an electronic component on a substrate with high mounting accuracy that is unlikely to cause damage to the electronic component or the substrate. A first mold, a second mold, an installation member for installing an electronic component and a substrate between the first mold and the second mold, a first mold and a first mold. A movement control unit that controls the proximity and separation of the two molds and a separation member 10 that can separate the installation member from the movable member 31 are provided. Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member. Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate and is movable. The member can relieve by moving the extra pressure which is excessive from the pressure applied by the fixing member, and the separation member is at least a part of the period until the fixing member contacts at least one of the electronic component and the substrate. In the period, the electronic component and the substrate are separated from the movable member. [Selection] Figure 10

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

  Many electronic devices, measuring devices, transportation devices, precision devices, and the like have many electronic components such as semiconductor integrated circuits. Processors, image processing circuits, audio processing circuits, various sensors, and the like have been highly integrated, and many functions are integrated in electronic components. This electronic component is necessary for these devices.

  This electronic component needs to be mounted on a substrate such as a lead frame, a flexible frame, an electronic substrate, a metal base, and a heat sink. When the substrate itself is incorporated into an electronic device or the like, electronic components are mounted on the incorporated substrate. Or an electronic component may be mounted in the board | substrate required in a manufacturing process. This is because when an electronic device or the like requires an electronic component, it must be mounted via a substrate.

  Thus, electronic components such as semiconductor integrated circuits are often mounted on a substrate such as a lead frame, an electronic substrate, a metal base, or a heat sink.

  Here, when mounting an electronic component on a substrate, there is a method of applying an adhesive between the substrate and the electronic component, and applying pressure and heat to perform mounting with the adhesive. A mounting apparatus by this construction method is sometimes called a sintering apparatus. Note that the substrate here includes a single-layer substrate, a single-layer substrate, a multi-layer substrate, and the like.

  On the board, a mounting position that is a position for mounting an electronic component is set. An adhesive is applied to this mounting position. Further, the electronic component is placed at the mounting position so that the electronic component contacts the adhesive. In this state, pressure and heat are applied to the electronic component.

  By applying the pressure and heat, the electronic component can be bonded to the substrate with an adhesive. As a result, an adhesive layer is generated between the substrate and the electronic component. The electronic component is mounted on the substrate through the adhesive layer.

  As described above, the electronic component is mounted on the substrate in order for the electronic component to be stored in an electronic device or the like, or for the next manufacturing process using the electronic component. Since mounting is performed with pressure and heat via an adhesive, it is suitable for mounting a large number of electronic components.

  A technique for such an electronic component mounting apparatus called a sintering apparatus has been proposed (see, for example, Patent Document 1).

JP-T-2006-507164

  Patent Document 1 discloses that a semiconductor die encapsulating method or a semiconductor die carrier mounting method includes a step of providing a first tool part for holding a plurality of semiconductor dies and a step of providing a semiconductor die on the first tool part; Providing a tool portion, wherein one of the first tool portion and the second tool portion includes a plurality of movable insert members that allow each movable insert member to apply pressure on the surface area of the semiconductor die. Combining a first tool part and a second tool part such that a space is defined between the first tool part and the second tool part and the semiconductor product is disposed in the space; including. The movable insertion member applies pressure on the surface area of the semiconductor die. The pressure applied by the movable insertion member is monitored and adjusted. Subsequently, a semiconductor die mounting apparatus is disclosed in which the first tool part and the second tool part are separated and the processed semiconductor die is removed.

  Patent Document 1 discloses a technique for simultaneously mounting a plurality of semiconductor dies on a substrate using a resin. At this time, the semiconductor die and the substrate are sandwiched between the movable member and the fixed member. Based on this configuration, the movable member that can move up and down applies pressure to the semiconductor die, and the fixed member receives the pressure. As a result, mounting with an adhesive is realized.

  However, in the technique of Patent Document 1, the movable member applies pressure to the semiconductor die. That is, since the moving movable member applies pressure to the semiconductor die and the substrate received by the fixed member, there is a concern that the semiconductor die or the substrate may be damaged. This is because damage due to excessive application of pressure can occur. Alternatively, even if the pressure is not applied too much, the moving movable member directly applies pressure to the semiconductor die or the substrate (either the direct movable member pushes or pushes through a film). This is because the semiconductor die and the substrate can be damaged by the operation.

  Conversely, if the pressure is reduced so as not to cause breakage, there is also a problem that mounting with resin becomes insufficient. In order to prevent any of these from occurring, it is necessary to search for an optimum value for the applied pressure in accordance with the type of the semiconductor die or the substrate. Searching for such an optimum value has a problem of increasing the burden in the manufacturing process.

  Also, if the pressure applied by the movable member is inappropriate, the thickness of the adhesive layer between the semiconductor die and the substrate may remain thick. When the adhesive layer between the semiconductor die and the substrate is thick, when the semiconductor die is a high-frequency semiconductor or a power semiconductor, the performance is not sufficiently extracted.

  For this reason, if the applied pressure is inappropriate, the mounting accuracy becomes insufficient, leading to a problem of insufficient performance of the mounted semiconductor die (electronic component). Or there is also a problem that may result in insufficient mounting and lead to defects after mounting.

  In addition, it is necessary to mount a plurality of electronic components on the substrate, and it is necessary to mount the plurality of electronic components at a time. This is to improve the efficiency of the manufacturing process and reduce costs. At this time, in the lamination of the substrate, the adhesive, and the electronic component, the thickness of each of the plurality of electronic components may be non-uniform.

  When the thickness is non-uniform, if the application of pressure by the movable member corresponding to each of the electronic components does not correspond, there is a problem that mounting variations occur in each of the plurality of electronic components. Variations in mounting lead to variations in performance and durability, which is not preferable. In Patent Literature 1, there is a problem that it is difficult to absorb this variation because the movable member directly applies pressure to the semiconductor die.

  In addition, in the prior art, an electronic component is installed between a pressure member that applies pressure to the electronic component and a member that receives the pressure member. At this time, an arrangement member for arranging the plurality of electronic components is installed so that the mounting on the plurality of electronic components can be realized at the same time. This arrangement member is placed on the pressure member or the receiving member.

Here, in mounting, the pressure member and the receiving member are in a heated state. It has been common in the prior art that pressure is applied by a pressure member after the electronic component is placed in contact with the heated pressure member or receiving member.
However, there is a time lag from when the electronic component is installed on the pressure member or the receiving member until the pressure is actually applied by the movable member. During this time lag, the electronic component is in a state of receiving heat from the heated pressure member and the receiving member. This is not preferable for the adhesive because heating is started before the mounting adhesive is pressurized, and the curing of the adhesive starts, and the original adhesive force cannot be obtained.

  As described above, the conventional techniques including Patent Document 1 have problems such as breakage of electronic components and substrates and insufficient mounting accuracy.

  An object of the present invention is to provide an electronic component mounting apparatus that is less likely to cause damage to an electronic component or a substrate and that can mount the electronic component on the substrate with high mounting accuracy.

In view of the above problems, an electronic component mounting apparatus according to the present invention includes a first mold having a single or a plurality of fixing members,
A second form having one or more movable members;
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit for controlling the proximity and separation between the first mold and the second mold;
An installation member, and a separation member that can be separated from the movable member,
The fixing member fixes its position with respect to the first mold,
The movable member can change its position with respect to the second formwork,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can release the extra pressure that is excessive in the pressure applied by the fixed member,
The separation member separates the electronic component and the substrate from the movable member during at least a part of the period until the fixed member contacts at least one of the electronic component and the substrate (hereinafter referred to as “preparation period”).

  The electronic component mounting apparatus of the present invention is configured such that the movable member releases excess pressure while the fixed member applies pressure, so that excessive pressure can be prevented from being applied to the electronic component and the substrate. At this time, since the optimum value control of the pressure when applying the pressure by the fixing member is also reduced, the load on the apparatus is reduced.

  Moreover, since it can also prevent that a pressure becomes too small, it can also prevent that the contact bonding layer becomes thick and the performance shortage of the electronic component after mounting arises.

  Further, even when a plurality of electronic components are mounted simultaneously, the excess pressure applied to the movable member from the fixed member is released by the movable member, so that pressure control corresponding to each electronic component is not required. As a result, the control of the apparatus is simplified, and the load and cost in the manufacturing process can be reduced.

  In addition, the electronic component itself is in a state of being separated from both the fixed member and the movable member until pressure is actually applied by the fixed member. For this reason, it is possible to prevent the electronic component from receiving excessive heat from the fixed member and the movable member that are heated before being pressed. As a result, the adhesive can receive an appropriate pressure and heat at the same time to obtain the original adhesive force, and the adverse effect on the electronic component can be suppressed while improving the mounting accuracy.

It is a front view of the board | substrate with which the electronic component was mounted. It is a side view of the board | substrate with which the electronic component was mounted. It is a block diagram of the electronic component mounting apparatus in Embodiment 1 of this invention. It is a block diagram of the electronic component mounting apparatus in Embodiment 1 of this invention. It is a block diagram of the electronic component mounting apparatus in Embodiment 1 of this invention. It is a block diagram of the electronic component mounting apparatus in Embodiment 1 of this invention. It is an electronic component mounting apparatus in Embodiment 1 of this invention, Comprising: It is a block diagram which shows the pressure provision by a fixing member. It is a block diagram of the electronic component mounting apparatus in Embodiment 2 of this invention. It is a block diagram of the electronic component mounting apparatus in Embodiment 2 of this invention. It is a schematic diagram of the electronic component mounting apparatus in Embodiment 3 of this invention. It is a schematic diagram of the electronic component mounting apparatus in Embodiment 3 of this invention. It is a schematic diagram of the electronic component mounting apparatus in Embodiment 3 of this invention.

An electronic component mounting apparatus according to a first invention of the present invention includes a first mold having one or more fixing members,
A second form having one or more movable members;
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit for controlling the proximity and separation between the first mold and the second mold,
The fixing member fixes its position with respect to the first mold,
The movable member can change its position with respect to the second formwork,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can release the extra pressure that is excessive from the pressure applied by the fixed member.

  With this configuration, it is possible to prevent an electronic component or the like from being damaged by applying excessive pressure when mounting is performed by applying pressure or bonding.

In the electronic component mounting apparatus according to the second invention of the present invention, in addition to the first invention, the movement control unit brings the first mold frame and the second mold frame close to each other, and the fixing member is attached to the electronic component or the substrate. Can be contacted,
By this contact, the fixing member can apply pressure to at least one of the electronic component and the substrate.

  With this configuration, the fixing member can apply pressure for mounting.

  In the electronic component mounting apparatus according to the third invention of the present invention, in addition to the first or second invention, pressure is applied to at least one of the electronic component and the electronic board by the fixed member, and the extra pressure is applied to the movable member. The electronic component is mounted on the board by being escaped by.

  With this configuration, mounting is performed at a pressure optimum for mounting. In addition, since there is no extra pressure, damage to electronic components can be prevented.

  In the electronic component mounting apparatus according to the fourth invention of the present invention, in addition to any one of the first to third inventions, the fixing member pushes the electronic component or the substrate, so that it is attached to at least one of the electronic component and the substrate. Pressure can be applied.

  With this configuration, pressure application by pressing can be realized.

  In the electronic component mounting apparatus according to the fifth aspect of the present invention, in addition to any of the first to fourth aspects, the second mold has one or more insertion holes at positions corresponding to the fixing members. In addition, each of the single or plural movable members can be inserted into the insertion hole and can change its position with respect to the second mold.

  With this configuration, the movable member can relieve excess pressure by changing the position.

  In the electronic component mounting apparatus according to the sixth aspect of the present invention, in addition to the fifth aspect, the movable member changes its position in the insertion hole due to the pressure from the fixed member received via the electronic component and the substrate. Let

  With this configuration, the movable member can release excess pressure.

  In the electronic component mounting apparatus according to the seventh aspect of the present invention, in addition to the sixth aspect, the movable member releases the extra pressure by changing the position inside the insertion hole.

  With this configuration, the movable member can release excess pressure.

  In the electronic component mounting apparatus according to the eighth aspect of the present invention, in addition to the seventh aspect, the movable member can adjust the amount of excess pressure released by the position change amount inside the insertion hole.

  With this configuration, the movable member can absorb the difference in excess pressure depending on the movable amount.

  In the electronic component mounting apparatus according to the ninth aspect of the present invention, in addition to any one of the first to eighth aspects, each of the fixed member, the insertion hole, and the movable member is a single member or a plurality of members that are installed on the installation member. Corresponds to the number and position of electronic components.

  With this configuration, an electronic component can be mounted.

  In the electronic component mounting apparatus according to the tenth aspect of the present invention, in addition to any one of the first to ninth aspects, a sheet is installed between the fixing member and the electronic component.

  With this configuration, it is possible to protect the electronic component when pressure is applied.

In addition to the tenth invention, the electronic component mounting apparatus according to the eleventh invention of the present invention further includes an intermediate mold for holding the outer periphery of the electronic component between the first mold and the installation member,
The intermediate mold can maintain the state in which the electronic component is held when the sheet is peeled off.

  With this configuration, the electronic component can be prevented from being pulled when the sheet is peeled off.

  In the electronic component mounting apparatus according to the twelfth aspect of the present invention, in addition to any of the first to eleventh aspects, each of the plurality of movable members can individually realize its movable state.

  With this configuration, it is possible to optimally cope with variations in each of a plurality of electronic components.

  In the electronic component mounting apparatus according to the thirteenth aspect of the present invention, in addition to any of the first to twelfth aspects, each of the plurality of movable members is at least one of fluid pressure, elastic pressure, and motor drive. A movable state can be realized.

  With this configuration, the movement of the movable member is suitable for releasing excess pressure.

In the electronic component mounting apparatus according to the fourteenth aspect of the present invention, in addition to any one of the first to thirteenth aspects, the electronic component mounting apparatus further includes a pressure detection unit that detects a pressure applied to at least one of the electronic component and the substrate,
The movable member can change the movable state based on the pressure.

  With this configuration, the extra pressure can be grasped from the pressure actually applied by the fixed member, and the movable member can release the extra pressure. As a result, it is possible to realize the application of pressure that is practical.

In the electronic component mounting apparatus according to the fifteenth aspect of the present invention, in addition to any one of the first to fourteenth aspects, a movable member control unit that controls at least one of the movable amount and the movable speed of the plurality of movable members is provided. In addition,
The movable member control unit can control at least one of a movable amount, an operating time, and a movable speed for each of the plurality of movable members based on a previously stored movable control instruction table.

  With this configuration, the actual extra pressure can be released based on the actual fixing member pressure and the correlation between the pressure and the extra pressure.

An electronic component mounting apparatus according to a sixteenth aspect of the present invention includes a first mold having a single or a plurality of fixing members,
A second form having one or more movable members;
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit for controlling the proximity and separation between the first mold and the second mold;
An installation member, and a separation member that can be separated from the movable member,
The fixing member fixes its position with respect to the first mold,
The movable member can change its position with respect to the second formwork,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can release the extra pressure that is excessive in the pressure applied by the fixed member,
The separation member separates the electronic component and the substrate from the movable member during at least a part of the period until the fixed member contacts at least one of the electronic component and the substrate (hereinafter referred to as “preparation period”).

  With this configuration, it is possible to prevent the electronic component and the substrate from conducting heat from the movable member during the preparation period until actual pressurization is started.

  In the electronic component mounting apparatus according to the seventeenth invention of the present invention, in addition to the sixteenth invention, the preparation period is the first mold after the installation member is installed between the first mold frame and the second mold frame. This is at least a part of the period until the frame and the second mold frame come close to each other and the fixing member comes into contact with at least one of the electronic component and the substrate.

  With this configuration, a period from contact between the fixed member and the movable member to pressurization can be set as a preparation period.

In the electronic component mounting apparatus according to the eighteenth aspect of the present invention, in addition to the sixteenth or seventeenth aspects, the separation member includes an elastic member,
Due to the elastic function of the elastic member, the electronic component and the substrate are separated from the movable member during the preparation period.

  With this configuration, the separation member can easily and reliably achieve separation by the elastic member.

In the electronic component mounting apparatus according to the nineteenth aspect of the present invention, in addition to the eighteenth aspect, the elastic member may be an electronic component, a substrate, a movable member, and a movable member due to the proximity of the first mold frame and the second mold frame. Close
After the preparation period, the movable member can be brought into contact with at least one of the electronic component and the substrate.

  With this configuration, heat can be prevented from being transmitted from the movable member during the preparation period, and actual pressurization can be started between the fixed member and the movable member after the preparation period ends.

  In the electronic component mounting apparatus according to the twentieth invention of the present invention, in addition to any of the sixteenth to nineteenth inventions, the separation member is provided on at least one of the electronic component and the substrate from the movable member in the preparation period. Contact heat can be prevented from being applied.

  With this configuration, unnecessary heat is not applied before pressing, and adverse effects on the adhesive and electronic components can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Mounting electronic components on an electronic board)
The mounting of the electronic component on the board in the present invention will be described. FIG. 1 is a front view of a board on which electronic components are mounted. FIG. 2 is a side view of a substrate on which electronic components are mounted. The substrate 100 is a lead frame, a metal base, a heat sink, an electronic substrate, and the like, and includes a flexible substrate, a tape substrate, a sheet substrate, and the like. Moreover, it has various structures, such as a single layer and a laminated layer.

  FIG. 1 shows a state in which the substrate 100 is viewed from above. One or more electronic components 200 are mounted on the substrate 100. In FIG. 1, a plurality of electronic components 200 are mounted, and the substrate 100 may be stored in an electronic device or the like in this state, or may be used by being divided for each electronic component 200.

  As shown in FIG. 2, the electronic component 200 is mounted on the substrate 100 via an adhesive layer 210. The adhesive layer 210 is an adhesive or the like, and the electronic component 200 is mounted on the substrate 100 by a bonding function of the adhesive. Before mounting, an adhesive is applied and the like, and after mounting is performed by applying pressure for mounting, the adhesive layer 210 is formed.

  The electronic component mounting apparatus of the present invention realizes mounting as shown in FIGS.

(Embodiment 1)
Embodiment 1 will be described. FIG. 3 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. The electronic component mounting apparatus 1 mounts the electronic component 200 on the board 100 described with reference to FIGS.

  The electronic component mounting apparatus 1 includes a first mold 2, a second mold 3, an installation member 4, and a movement control unit 5.

  The first mold 2 has one or a plurality of fixing members 21. The fixing member 21 is fixed to the first mold 2 and does not change the relative positional relationship with the first mold 2. The fixing member 21 fixes the position with respect to the first mold 2. That is, the fixing member 21 moves the position together with the first mold 2. Further, as will be described later, the fixing member 21 is placed between the first mold frame 2 and the second mold frame 3 by reducing the distance between the first mold frame 2 and the second mold frame 3. And pressure is applied to at least one of the substrates 100.

  The second mold 3 is a member that is paired with the first mold 2. In FIG. 3, the first mold 2 is shown on the upper side and the second mold 3 is shown on the lower side. However, the vertical relationship and the horizontal relationship are not limited thereto. The second mold 3 is paired with the first mold 2, and the application of pressure to the electronic component 200 or the like by the fixing member 21 is realized by bringing the relative positional relationship close to each other.

  The second mold 3 has one or a plurality of movable members 31. The position of the movable member 31 can be changed with respect to the second mold 3. That is, when the second mold 3 approaches the first mold 2, the movable member 31 can change the position with respect to the second mold 3 depending on the contact state with the electronic component 200 and the like.

  As shown in FIG. 3, the movable member 31 is in a state of being inserted into a recess provided in the second mold 3, and can move in a position change by moving in the recess.

  The installation member 4 installs the electronic component 200 and the substrate 100 between the first mold 2 and the second mold 3. As shown in FIG. 3, the installation member 4 is installed by sandwiching the electronic component 200 and the substrate 100. The electronic component 200 is installed at a position to be mounted on the substrate 100. Alternatively, the electronic component 200 and the substrate 100 are positioned and fixed with an adhesive. The thing in this state is placed on the installation member 4 and installed between the first mold 2 and the second mold 3.

  The installation member 4 installs the electronic component 200 at a position to be mounted on the substrate 100 (or the electronic component 200 that has already been fixed to the substrate 100 is installed on the installation member 4), and the first mold 2 It is installed between the second mold 3. By being installed, the electronic component 200 is mounted by applying pressure by the first mold 2 and the second mold 3. At this time, an adhesive is applied between the electronic component 200 and the substrate 100.

  The movement control unit 5 controls the proximity and separation between the first mold 2 and the second mold 3 in connection with the application of pressure. The movement control unit 5 can control the proximity and separation of the first mold 2 and the second mold 3 by moving at least one of the first mold 2 and the second mold 3.

  Here, each of the fixed member 21 and the movable member 31 has a positional relationship corresponding to the position of the electronic component 200 installed by the installation member 4. In other words, the fixed member 21 and the movable member 31 are in positions opposite to the electronic component 200 installed by the installation member 4.

  The movement control unit 5 brings the first mold 2 and the second mold 3 close to each other. Due to this proximity, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100. By applying this pressure, the electronic component 200 is fixed to the substrate 100 by the action of the adhesive. During the application of pressure, the movable member 31 can relieve the excess pressure, which is an excess of the pressure applied by the fixed member 21, by moving.

  When the movable member 31 releases the extra pressure, only the pressure necessary for mounting is applied to the electronic component 200 and the substrate 100, and no extra pressure is applied. As a result, the electronic component 200 and the substrate 100 are not damaged as in the prior art.

Even when a plurality of electronic components 200 are simultaneously mounted, the movable member 31 can be released corresponding to each of the extra pressures that can be different for each electronic component 200. As a result, it is possible to apply an optimum pressure to each of the plurality of electronic components 200 having variations in height and mounting surface. Excessive pressure is not applied and damage can be prevented. Moreover, since the movable member 31 only releases excess pressure, the pressure required for mounting is applied by each electronic component 200, and mounting can be performed reliably.
Each of the fixed member 21, the insertion hole 32, and the movable member 31 is a position corresponding to the number and position of the electronic components 200 installed in the installation member 4.

(Description of operation)
Next, the operation will be described.

(Initial state: Fig. 3)
FIG. 3 described above shows an initial state. In the initial state, the first mold 2 and the second mold 3 are separated from each other. Further, the substrate 100 and the electronic component 200 are installed by the installation member 4 between the first mold 2 and the second mold 3. At this time, the electronic component 200 is set to the mounting position of the substrate 100 by the installation member 4 (or the electronic component 200 is fixed to the mounting position of the substrate 100 with an adhesive, and the installation member 4 attaches the electronic component 200 to the mounting position. An adhesive or the like is applied between the electronic component 200 and the substrate 100. The adhesive is set between the first mold 2 and the second mold 3).

Moreover, the sheet | seat 110 may be set as needed. The sheet 110 is installed so as to be sandwiched between the fixing member 21 and the electronic component 200. As will be described later, the fixing member 21 applies pressure to the electronic component 200 (if the positional relationship between the electronic component 200 and the substrate 100 is upside down in FIG. 3, the fixing member 21 applies pressure to the substrate 100). . This is because the fixing of the fixing member 21 is facilitated after the pressure is applied because the seat 110 is installed.
The sheet 110 may be installed between the movable member 31 and the substrate 100 or the electronic component 200.

  As will be described below, the movement control unit 5 brings the first mold 2 and the second mold 3 close to each other. By this proximity, the fixing member 21 can directly or indirectly contact at least one of the electronic component 200 and the substrate 100. By this contact, the fixing member 21 can apply pressure to at least one of the electronic component 200 and the substrate 100.

  This is because the fixing member 21 can apply pressure by pressing the electronic component 200 and the substrate 100.

  By applying this pressure, the electronic component 200 is mounted on the substrate 100. At this time, of the pressure from the fixed member 21, the movable member 31 can release the extra pressure that is extra in mounting. The movable member 31 is movable along the pressure application direction, and the extra pressure causes this movement.

  This movement results in excess pressure being relieved. If the excess pressure is released, only the pressure necessary for mounting remains, and mounting can be performed without causing damage.

(Moving installation member: Fig. 4)
FIG. 4 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. This is shown schematically. Elements such as the movement control unit 5 shown in FIG. 3 are also provided in the same manner, but these are omitted for the sake of clarity. The operation by the movement control unit 5 is also performed in FIG.

  As shown in FIG. 4, after the initial state, in the electronic component mounting apparatus 1, the installation member 4 is lowered to approach the second mold 3. The installation member 4 sets the electronic component 200 and the substrate 100, and the set electronic component 200 or the like approaches the second mold 3.

  As the installation member 4 approaches the second mold 3, the electronic component 200 and the substrate 100 installed on the installation member 4 approach the movable member 31. When further approaching, the movable member 31 can be contacted. FIG. 4 shows this state.

  By being in this contactable state, the movable member 31 can release the extra pressure when pressure is applied from the fixed member 21.

  Here, the electronic component mounting apparatus 1 includes a drive unit that operates each element, and the drive unit may move the installation member 4.

(Movement of intermediate mold and sheet: Fig. 5)
FIG. 5 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. In the electronic component mounting apparatus 1, the intermediate mold 6 and the sheet 110 are moved so as to approach the installation member 4. The intermediate mold 6 and the sheet 110 may be lowered to approach the installation member 4, or the second mold 3 may be raised to bring the installation member 4 closer to the intermediate mold 6 or the like.

  As the intermediate mold 6 and the sheet 110 approach the installation member 4, the intermediate mold 6 approaches the electronic component 200. The same applies to the sheet 110. As described above, the sheet 110 is installed between the fixing member 21 and the electronic component 200. The same applies to the intermediate mold 6.

  The intermediate mold 6 is a member that holds the outer periphery of the electronic component 200 in the process of applying pressure by the fixing member 21. The electronic component 200 comes into contact with the sheet 110 when pressure is applied by the fixing member 21. The sheet 110 is protected from the fixing member 21 when the fixing member 21 contacts the electronic component 200.

  When the application of pressure is finished and the fixing member 21 is separated from the electronic component 200, the sheet 110 is peeled from the electronic component 200. At this time, since the sheet 110 and the electronic component 200 are subjected to pressure from the fixing member 21, the sheet 110 is attached to the electronic component 200.

  If the sheet 110 is peeled in this state, there is a problem that the electronic component 200 is pulled by the sheet 110. The intermediate mold 6 surrounds and holds the outer periphery of the electronic component 200 when pressure is applied by the fixing member 21. This holding can reduce the problem that the electronic component 200 is pulled by the sheet 110 even when the sheet 110 is removed.

  In the stage of FIG. 5, the intermediate mold 6 and the sheet 110 come closer to contact with the electronic component 200. By preparing this state, various problems in post-processing after mounting can be reduced.

(Proximity between first mold 2 and second mold 3: FIG. 6)
FIG. 6 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. FIG. 6 shows a state in which the first mold 2 and the second mold 3 are close to each other. Here, as an example, the movement control unit 5 raises the second mold 3 to bring the first mold 2 and the second mold 3 close to each other.

  When the first mold frame 2 and the second mold frame 3 are close to each other, a state in which the fixing member 21 can contact the electronic component 200 via the sheet 110 is created. With this contact state, the fixing member 21 can apply pressure to at least one of the electronic component 200 and the substrate 100.

  In addition, as shown in FIG. 6, the fixing member 21 enters the opening of the portion corresponding to the electronic component 200 in the intermediate mold 6. By this penetration, it is possible to enter the opening of the intermediate mold 6 and apply pressure to the electronic component 200.

  Further, the sheet 110 is also pushed in with the contact of the fixing member 21. The sheet 110 adheres to the surface of the electronic component 200 in accordance with the outer shape of the fixing member 21, the intermediate mold 6, and the electronic component 200. With this sheet 110, the electronic component 200 can be protected from the fixing member 21.

  When the first mold 2 and the second mold 3 come close to each other by the movement operation by the movement control unit 5, a pressure can be applied from the fixing member 21. Here, in FIG. 6, the movement control unit 5 is connected to the second mold 3, and the movement control unit 5 raises the second mold 3, but it is also possible to lower the first mold 2. Good. In any case, it suffices if the first mold 2 and the second mold 3 are close to each other.

  The movement control unit 5 controls the proximity of the first mold 2 and the second mold 3 (applying pressure by the fixing member 21) in accordance with sufficient strength and time for mounting the electronic component 200 on the substrate 100. do it. The intensity and time may be programmed in advance in the movement control unit 5 or may be adjusted arbitrarily. Or you may control by the result learned empirically.

(Pressurization by the fixing member 21: FIG. 7)
FIG. 7 is an electronic component mounting apparatus according to Embodiment 1 of the present invention, and is a block diagram illustrating pressure application by a fixing member. FIG. 7 shows a state in which the movement control unit 5 further brings the first mold 2 and the second mold 3 close to each other from the state shown in FIG. In addition to the proximity, the fixing member 21 applies pressure to the electronic component 200 and the substrate 100 as shown in FIG.

  The movement control unit 5 moves at least one of the first mold 2 and the second mold 3 so that the fixing member 21 can apply pressure. Furthermore, it is maintained for a certain time. In this state, the fixing member 21 can apply pressure to the electronic component 200 as indicated by an arrow A shown in FIG.

  At this time, the fixing member 21 is fixed to the first mold 2. In addition, the movable member 31 that receives pressure is movable relative to the second mold 3. As a result, of the pressure indicated by the arrow A applied by the fixed member 21, excess pressure that is excessive in mounting is released by moving the movable member 31 away from the electronic component 200.

  An arrow B in FIG. 7 indicates an extra pressure that the movable member 31 releases. The difference between the arrow A and the arrow B is an appropriate pressure necessary for mounting the electronic component 200 on the substrate 100, and the electronic component 200 and the substrate 100 are not damaged by the appropriate pressure. Can do.

  Here, the second mold 3 has one or a plurality of insertion holes 32 at positions corresponding to the fixing members. The movable member 31 is inserted into the insertion hole 32. The movable member 31 changes the position relative to the second mold 3 by moving the position inside the insertion hole 32 up and down.

  When the extra pressure indicated by the arrow B in FIG. 7 is received (when the pressure applied to the electronic component 200 and the substrate 100 is received from the fixed member 21), the movable member 31 moves in the insertion hole 32. By this movement, excess pressure can be released. This is because the extra pressure due to the position change is released.

  FIG. 7 shows a state in which the extra pressure is released by the movable member 31 while the fixed member 21 applies pressure to the electronic component 200. As a result, reliable mounting can be realized without applying excessive pressure and causing damage to the electronic component 200.

  In addition, the movable member 31 can also adjust the extra pressure to be released by adjusting the amount of change in position inside the insertion hole 32. In some cases, when the extra pressure to be released is zero, the movable member 31 does not cause a change in position with respect to the second mold 3.

(Separation between the first mold and the second mold)
When the mounting is completed, the first mold 2 and the second mold 3 are separated. The movement control unit 5 executes this separation. When the sheet 110 and the like are separated and removed, the member with the electronic component 200 mounted on the substrate 100 is taken out. It will be used in the next process.

  The removal of the sheet 110 or the like may be realized by a drive unit or another mechanism, or may be a mechanism incorporated in the electronic component mounting apparatus 1 or another mechanism. Since these are not directly related to the present invention, description thereof is omitted.

  As described above, the electronic component mounting apparatus 1 according to the first embodiment can realize reliable mounting while reducing the risk of damaging the electronic component 200 and the substrate 100 by applying pressure. In addition, since the optimum pressure can be applied, the thickness of the adhesive layer between the substrate 100 and the electronic component 200 can be optimized.

  In addition, the upper and lower positional relationship between the first mold 2 and the second mold 3 described in FIG. 3 and after may be reversed. The descending and ascending may be reversed, and the movement may be left and right instead of up and down.

  (Embodiment 2)

  Next, a second embodiment will be described. In the second embodiment, various variations will be described.

(Treatment of extra pressure by movable members)
FIG. 8 is a block diagram of an electronic component mounting apparatus according to Embodiment 2 of the present invention.

  The second mold 3 has a movable member 31. The second mold 3 is provided with an insertion hole 32, and the movable member 31 is inserted into the insertion hole 32 and moves. By this movement, it is in a movable state. When the fixed member 21 applies pressure to the electronic component 200, the movable member 31 can move downward, for example, to release excess pressure.

  In the insertion hole 32, the movable member 31 is movable by air pressure or hydraulic pressure. It is possible to measure the extra pressure that escapes from the air pressure and hydraulic pressure. At this time, as shown in FIG. 8, it is also preferable to further include an extra pressure adjusting unit 52.

  The extra pressure adjusting unit 52 can adjust the movement amount (movable amount, moving time, moving speed) of the movable member 31. The extra pressure to be released is determined by the amount of movement of the movable member 31 and how it moves. The extra pressure adjusting unit 52 sets an extra pressure to be released by the extra pressure adjusting unit 52. In accordance with the set extra pressure, the extra pressure adjustment unit 52 controls the amount of movement and the manner of movement of the movable member 31.

  By moving the movable member 31 based on this control, the movable member 31 can release the necessary extra pressure.

  Here, the movable member 31 can realize a movable state by at least one of liquid pressure, elastic pressure, and motor drive.

  The fixing member 21 includes a pressure detection unit 7. The pressure detection unit 7 detects the magnitude of pressure applied to the electronic component 200 by the fixing member 21. The pressure detection unit 7 outputs the magnitude of the detected pressure to the movable member control unit 53.

  The movable member control unit 53 can read data in the movable control instruction table 54 set in advance. The movable control instruction table 54 stores the relative relationship between the pressure applied by the fixed member 21 and the extra pressure that the movable member 31 should release.

  The movable member control unit 53 can calculate the extra pressure that the movable member 31 should release based on the pressure of the fixed member 21 notified from the pressure detection unit 7. The calculation result is output to the extra pressure adjustment unit 52. The extra pressure adjusting unit 52 controls the movement of the movable member 31 by the extra pressure based on the pressure by the actual fixed member 21 as the calculation result.

  In this manner, the extra pressure can be released by the movable member 31 based on the pressure value actually applied by the fixed member 21. As a result, mounting with an optimum pressure is realized, and damage to the electronic component 200 can be prevented.

(Multiple implementations)
FIG. 9 is a block diagram of the electronic component mounting apparatus according to Embodiment 2 of the present invention. FIG. 9 shows the electronic component mounting apparatus 1 for mounting a plurality of electronic components 200 at a time.

  The first mold 2 is provided with a plurality of fixing members 21. The second mold 3 is provided with a plurality of movable members 31 at positions corresponding thereto. The installation member 4 and the intermediate mold 6 are also forms corresponding thereto. Thus, the electronic component mounting apparatus 1 can mount a plurality of electronic components 200 at a time.

  Also in the case of FIG. 9, the fixed member 21 and the movable member 31 perform the operation as described above, and can be mounted with an optimum pressure.

Here, the plurality of electronic components 200 may vary in thickness, the amount of adhesive applied, and the like. It is preferable to mount at the same pressure regardless of variations in thickness and the like.
In some cases, each electronic component 200 is mounted with different pressures.

For this reason, it is preferable that each of the plurality of movable members 31 can individually realize a movable state. As shown in FIG. 9, the movable state of each of the plurality of movable members 31 is individually controlled by the extra pressure adjusting unit 52. By this individual control, each of the plurality of movable members 31 can individually realize a movable state. Even if the amount of movement and inclination to be escaped are different, the individual movable members 31 can operate in accordance with each.
In addition, the extra pressure to be relieved can be changed individually.

  The extra pressure adjusting unit 52 and the movable member control unit 53 are based on the pressure values of the plurality of fixed members 21 and the movable control instruction table, and at least the movable amount, the movable time, and the movable speed of the plurality of movable members 31. Control one. With this control, it is possible to relieve the extra pressure tailored to the individual electronic component 200.

  Alternatively, the extra pressure adjustment unit 52 and the movable member control unit 53 may control at least one of the movable timing and the stepwise pressure increase / decrease operation. This is because the control of these leads to the control of the optimum extra pressure to be released corresponding to each of the electronic components 200.

  As a result, an optimum pressure can be applied to each electronic component 200. Even when there is a variation in the thickness of the electronic component 200 or the amount of adhesive applied, it is possible to prevent problems caused by applying an optimum pressure to each electronic component 200.

  As described above, the electronic component mounting apparatus 1 according to the second embodiment can perform an optimal extra pressure process according to an actual pressure application state. In addition, a plurality of electronic components 200 can be mounted at an optimum pressure at a time.

  (Embodiment 3)

  Next, a third embodiment will be described. FIG. 10 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. Necessary elements are shown as visible so that the elements of the electronic component mounting apparatus 1 can be described. The actual electronic component mounting apparatus 1 may be surrounded by an external housing or the like.

  The electronic component mounting apparatus according to the third embodiment shown in FIG. 10 includes the first mold 2 and the second mold 3 as described in the first embodiment with reference to FIG. The first mold 2 has one or a plurality of fixing members 21. The second mold 3 has one or a plurality of movable members 31. The electronic component mounting apparatus 1 includes a movement control unit 5 and a separation member 10 as will be described later.

  The first mold 2 having the fixed member 21 and the second mold 3 having the movable member 31 are combined while facing each other. That is, the first mold 2 and the second mold 3 are paired so as to face each other. Although not shown in FIG. 10, the movement control unit 5 is further provided as described in the first embodiment. This movement control part 5 makes the 1st mold 2 and the 2nd mold 3 approach or separate.

  The installation member 4 is located between the first mold 2 and the second mold 3. The installation member 4 is positioned so as to be sandwiched between the first mold 2 and the second mold 3. The installation member 4 is not always positioned between the first mold frame 2 and the second mold frame 3 but is disposed in the process of mounting the electronic component 200 on the substrate 100.

  The installation member 4 has one or a plurality of sections, and the substrate 100 and the electronic component 200 are installed in accordance with the sections. That is, the board 100 and the electronic component 200 to be mounted are arranged in the section of the installation member 4. By installing the installation member 4 between the first mold 2 and the second mold 3, pressure can be applied by the proximity of the first mold 2 and the second mold 3 in a later step. The electronic component 200 is mounted on the substrate 100. In mounting, an adhesive or an adhesive paste (including a metal paste or the like) is used.

  Here, the electronic component mounting apparatus 1 installs the installation member 4 on which the electronic components 200 and the like are continuously installed between the first mold 2 and the second mold 3. As described above, the installed installation member 4 is arranged by arranging the electronic component 200 and the substrate 100.

  When the installation member 4 is installed, each of the fixed members 21, each of the electronic components 200 (and the substrate 100) arranged in the section of the installation member 4, and each of the movable members 31 are in a series of positional relationships. Become. When the first mold frame 2 and the second mold frame 3 come close to each other due to the series of positional relationships, the fixed member 21 applies pressure to the electronic component 200 (substrate 100), while the movable member 31 is redundant. Relieve pressure. The electronic component 200 and the substrate 100 are mounted by sandwiching the fixed member 21 and the movable member 31 with an appropriate pressure. This is as described in the first embodiment.

  Here, the electronic component 200 and the substrate 100 are mounted using an adhesive. For example, an adhesive such as a metal paste is applied between the electronic component 200 and the substrate 100, and the adhesive such as a metal paste is applied to the electronic component 200 due to the pressure between the fixed member 21 and the movable member 31. And the substrate 100 are bonded.

  When the first mold 2 and the second mold 3 come close to each other by the movement control by the movement control unit 5, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100 in this way. Of the applied pressure, the movable member 31 releases excess pressure that is excessive. As a result, an optimum pressure for mounting (adhesion) is applied to at least one of the electronic component 200 and the substrate 100. The optimum is not a pressure that is too strong to cause an influence on the electronic component 200 or the board 100, nor is it a pressure that is too weak to cause insufficient mounting (adhesion).

  Thus, the electronic component 200 and the substrate 100 are reliably mounted by sandwiching the fixed member 21 and the movable member 31 with an optimum pressure. Even when mounting a plurality of electronic components 200 at the same time, even if the thickness of the electronic components 200 varies, the variation in mounting accuracy is less likely to occur due to the action of the movable member 31 for each electronic component 200.

  Here, the electronic component 200 and the substrate 100 are mounted with an adhesive such as a metal paste. Therefore, an adhesive is applied to the installation member 4 between the electronic component 200 and the substrate 100 in advance.

  On the other hand, in mounting by pressure application (pressurization) sandwiched between the fixed member 21 and the movable member 31, bonding with this adhesive is performed. In order to make this adhesion efficient and reliable, the fixed member 21 and the movable member 31 apply heat in addition to applying pressure. This is because it is appropriate to apply both pressure and heat in bonding with an adhesive such as a metal paste.

  The electronic component mounting apparatus 1 needs to perform a mounting process with respect to the installation members 4 installed one after another. For this reason, each of the fixed member 21 and the movable member 31 is preferably heated in advance. That is, when the electronic component mounting apparatus 1 is in an operating state, each of the fixed member 21 and the movable member 31 is heated and has heat.

  Here, as shown in FIG. 10, when the second mold 3 (movable member 31) is provided on the lower side and the first mold 2 (fixed member 21) is provided on the upper side, the installation member 4 is the second mold frame. It will be in the state installed on 3. The upper side of FIG. 10 shows a state where the installation member 4 is first inserted between the first mold 2 and the second mold 3.

  Next, the installation member 4 is installed so as to be placed on the second mold 3. This is because the first mold 2 can approach and receive pressure after that. That is, as shown in the lower side of FIG. 10, the installation member 4 is placed on the second mold 3.

  Here, as shown in the lower side of FIG. 10, it is assumed that the electronic component 200 or the substrate 100 comes into contact with the movable member 31 when the installation member 4 is placed on the second mold 3. As described above, the movable member 31 is heated corresponding to the mounting process and has heat. That is, when the electronic component 200 or the substrate 100 comes into contact with the movable member 31, the heat of the movable member 31 is directly transmitted to the electronic component 200 or the substrate 100.

  At this time, even when the installation member 4 is placed on the second mold 3, the first mold 2 is not yet close, and there is a time lag until the pressure is applied by the fixing member 21. During this time lag, heat from the movable member 31 is transferred to the adhesive such as a metal paste or the electronic component 200. That is, heat is received before the pressure is applied.

  When an adhesive such as a metal paste receives heat before pressure is applied, the adhesive is hardened and causes a problem such as a decrease in adhesive strength. For this reason, it is preferable that the heat from the movable member 31 is not directly transmitted to the electronic component 200 and the substrate 100 until the actual pressure is applied.

  As shown in FIG. 10, the separation member 10 has the electronic component 200 and the substrate 100 even when the installation member 4 is installed on the second mold 3 until the pressurization by the fixing member 21 actually occurs. Are separated from the movable member 31.

  That is, the separation member 10 moves the electronic component 200 and the substrate 100 from the movable member 31 during at least a part of the period until the fixing member 21 contacts at least one of the electronic component 200 and the substrate 100 (preparation period). Separate. The lower side of FIG. 10 shows this separated state. A space 500 in FIG. 10 is this separated portion.

  Since the separation is realized by the separation member 10, at least a part of the period until pressurization by the fixing member 21 (the fixing member 21 actually contacts and applies pressure to the electronic component 200 or the substrate 100) is started. In the preparation period, the electronic component 200 and the substrate 100 can avoid contact with the movable member 31. By avoiding, it is possible to prevent the electronic component 200 and the substrate 100 from receiving heat from the movable member 31 before actual pressurization is started. As a result, the adhesive can also be prevented from receiving heat, and problems due to heat conduction before pressurization can be prevented.

  FIG. 11 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. FIG. 11 shows a state following the lower side of FIG.

  FIG. 11 shows a state in which the movement control unit 5 starts to bring the first mold 2 close to the second mold 3. In a state where the first mold 2 starts to approach, the fixing member 21 has not yet contacted at least part of the electronic component 200 and the substrate 100. That is, in FIG. 11, it is the above-described preparation period, and the electronic component 200 and the like can avoid direct contact with the movable member 31. As shown in FIG. 11, a space 500 is created and contact can be avoided.

  The preparation period is, as described above, after the installation member 4 is installed between the first mold frame 2 and the second mold frame 3, the first mold frame 2 and the second mold frame 3 are close to each other and the fixing member. This is at least a part of the period until 21 comes into contact with at least one of the electronic component 200 and the substrate 100. For this reason, it may be a time until the fixing member 21 contacts the electronic component 200 or the like and starts pressurization, or may be a time before that.

  The separation member 10 prevents heat conduction from the movable member 31 to the electronic component 200 or the like during the preparation period, thereby preventing adverse effects on the adhesive or the like.

  FIG. 12 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. FIG. 12 shows a state in which the first mold 2 and the second mold 3 are brought close to each other by the movement controller 5 from the state of FIG. 11. Further, FIG. 12 shows a state in which the fixing member 21 starts contact with at least one of the electronic component 200 and the substrate 100 and starts applying pressure.

  In FIG. 12, the fixing member 21 contacts the electronic component 200 and starts applying pressure. As in the first and second embodiments, in the third embodiment, the sheet 110 is disposed between the electronic component 200 and the fixing member 21, and the fixing member 21 is connected to the electronic component via the sheet 110. 200 (or substrate 100) may be contacted. Here, the contact is not intended to be a physical complete contact, but is intended to enable a pressure application. It is intended to include pressure applied contact through sheet 110.

  The movement control unit 5 brings the first mold 2 and the second mold 3 close to each other. FIG. 12 shows a state in which the fixing member 21 comes into contact with at least one of the electronic component 200 and the substrate 100 and starts applying pressure due to the proximity. When the fixing member 21 applies pressure, the separation member 10 is pressed by this pressure and contracts. As the separation member 10 contracts, the electronic component 200 and the substrate 100 gradually approach the movable member 31. Furthermore, it comes into contact with the movable member 31. FIG. 12 shows this state.

  In this case, the electronic component 200 and the substrate 100 come into contact with the fixed member 21 and the movable member 31 (as described above, the sheet 110 may be interposed). The electronic component 200 and the substrate 100 are brought into contact with each other, and the electronic component 200 and the substrate 100 are bonded by an adhesive, so that mounting is realized.

  At this time, it is possible to prevent the excessive pressure from being applied by allowing the movable member 31 to release the extra pressure from the fixed member 21 as necessary. This is as described in the first and second embodiments.

  In the state where the pressurization is progressing, heat from the fixed member 21 and the movable member 31 is transmitted so that the bonding (mounting) with an adhesive such as a metal paste is reliably performed. This is because the preparation period has ended in the pressurized state, and the movable member 31 is in contact with the electronic component 200 and the substrate 100. By this contact, heat from the movable member 31 can be conducted.

  When the preparation period is over, the state shown in FIG. 12 is reached, and pressure and heating are combined to mount the electronic component 200 on the substrate 100. In the preparation period until the pressurization and heating are performed, as described above, the electronic component 200 and the substrate 100 are not in contact with the movable member 31, so there is no unnecessary heat conduction, and the actual pressurization and heating are performed. There will be no problems with the adhesive or the like until this occurs. For this reason, mounting with high adhesive force is performed at the time of actual mounting.

  In this manner, the separation member 10 can prevent unnecessary heat conduction and implement high adhesive strength during the preparation period until the pressurization and heating process in which actual mounting is performed.

    (Elastic member)

  Here, as shown in FIGS. 10 to 12, the separation member 10 includes an elastic member 11. The elastic member 11 is a spring or the like and has an elastic function. With this elastic function, the electronic component 200 and the substrate 100 can be separated from the movable member 31 during the preparation period. This is because it can act on the installation member 4 on which the elastic member 11 is installed, so that the electronic component 200 and the substrate 100 do not contact the movable member 31.

  Further, even after the fixing member 21 starts to press the electronic component 200 and the substrate 100, the separation from the movable member 31 can be maintained while the elastic member 11 is contracted. That is, the electronic component 200 and the substrate 100 can be prevented from contacting the movable member 31 as a preparation period until the fixed member 21 and the movable member 31 are actually brought into contact with each other and pressed. Yes.

  Of course, if the fixing member 21 is further pushed in, the elastic member 11 contracts and the electronic component 200 and the substrate 100 come into contact with the movable member 31. When the movement control unit 5 separates the first mold 2 and the second mold 3, the elastic member 11 pushes up the installation member 4 to separate the movable member 31 from the electronic component 200 and the like.

  By the elastic member 11, the separation member 10 can easily realize switching between separation and contact.

  Thus, the elastic member 11 maintains the separation between the electronic component 200 and the substrate 100 and the movable member 31 during the preparation period, and contact between the electronic component 200 and the substrate 100 and the movable member 31 after the preparation period has elapsed. Can be realized. In the separated state, contact heat due to heat conduction from the movable member 31 can be prevented.

  As described above, the electronic component mounting apparatus 1 according to the third embodiment conducts heat from the movable member 31 to the electronic component 200 and the substrate 100 (and further the adhesive) in the preparation period until actual pressurization. Can be prevented.

  Here, the upper side has been described as the first mold 2 and the lower side as the second mold 3. The same applies to the opposite case.

  The electronic component mounting apparatus described in the first to third embodiments is an example for explaining the gist of the present invention, and includes modifications and alterations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 1st mold 21 Fixed member 3 2nd mold 31 Movable member 32 Insertion hole 4 Installation member 5 Movement control part 6 Intermediate type 7 Pressure detection part 52 Extra pressure adjustment part 53 Movable member control part 54 Movable Control instruction table 100 Substrate 110 Sheet 200 Electronic component 10 Separation member 11 Elastic member 500 Space

Claims (5)

A first mold having one or more fixing members;
A second form having one or more movable members;
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit for controlling the proximity and separation between the first mold and the second mold;
A separation member that can separate the installation member from the movable member;
The fixing member fixes its position with respect to the first formwork,
The movable member can change its position with respect to the second formwork,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can move an extra pressure that is excessive in the pressure applied by the fixed member. Can be escaped by
The separation member includes the electronic component and the substrate in at least a part of a period until the fixing member contacts at least one of the electronic component and the substrate (hereinafter referred to as “preparation period”). An electronic component mounting apparatus that is separated from a movable member.   In the preparation period, after the installation member is installed between the first mold frame and the second mold frame, the first mold frame and the second mold frame are close to each other, and the fixing member is the electronic component. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is at least a part of a period until contact with at least one of the substrates. The separation member includes an elastic member,
The electronic component mounting apparatus according to claim 1, wherein the electronic component and the substrate are separated from the movable member during the preparation period by an elastic function of the elastic member. The elastic member brings the electronic component and the substrate close to the movable member due to the proximity of the first mold and the second mold,
The electronic component mounting apparatus according to claim 3, wherein the movable member is capable of contacting at least one of the electronic component and the substrate after the preparation period.   5. The electronic component mounting apparatus according to claim 1, wherein the separation member can prevent contact heat from the movable member from being applied to at least one of the electronic component and the substrate during the preparation period. 6.