JP6804410B2 - Conveying mechanism, resin molding device, method of delivering the object to be molded to the molding mold, and method of manufacturing the resin molded product - Google Patents

Description

The present invention relates to a transport mechanism, a resin molding apparatus, a method of delivering a molded object to a molding mold, and a method of manufacturing a resin molded product.

In the resin molding die of the die-down method (a molding method in which the chip mounting surface faces downward and the upper molding die holds a molding object such as a substrate), the molding object such as a substrate is held by the upper molding die (Patent Document 1). etc).

Japanese Unexamined Patent Publication No. 2017-024398

As a method of delivering the object to be molded such as a substrate to the molding die, for example, the methods shown in FIGS. 21 to 23 can be considered. That is, first, as shown in FIG. 21, the transfer mechanism 1000 is placed on the transfer mechanism 1000 with the substrate (interposer) 2 which is the object to be molded, and the transfer mechanism 1000 is placed below the upper molding die 100 of the molding die (press). It is inserted between the molding die (not shown). As shown in the figure, the transport mechanism 1000 includes a main body 1010, an actuator 1014, and a plate 1013 as main components. As the actuator 1014, for example, an air cylinder including a cylinder 1011 and a piston rod 1012 can be used. The cylinder 1011 is connected to the upper surface of the main body 1010. The plate 1013 is located above the cylinder 1011 and is connected to the cylinder 1011 via a piston rod 1012. As shown in the figure, the substrate 2 can be placed on the plate 13. In FIGS. 21 to 23, the chip mounting surface of the substrate 2 faces downward, and the chip 1 and the wire 3 are mounted (fixed) on the chip mounting surface. A pilot pin 101 is fixed to the lower surface of the upper molding die 100, and the substrate 2 can be positioned by inserting the pilot pin 101 into the hole 4 of the substrate 2.

Next, as shown in FIG. 22, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is pressed against the upper molding die 100 and delivered.

Further, as shown in FIG. 23, the substrate 2 is attracted to and held on the lower surface of the upper molding die 100 by a suction mechanism (not shown) provided on the upper molding die 100. Then, as shown in the figure, the piston rod 1012 is contracted by the cylinder 1011 to lower the plate 1013. Then, after the transport mechanism 1000 is retracted to the outside of the molding die (press), the object to be molded (substrate) 2 is resin-molded by the molding die.

In FIGS. 21 to 23, for example, the object to be molded (board) 2 can be preheated to a predetermined temperature by a heater (not shown) included in the transport mechanism 1000 until it enters the molding die. This preheating causes the substrate 2 to thermally expand. As a result, the diameter of the pilot pin 101 of the upper molding die 100 and the position inside the hole of the substrate 2 make the transfer of the substrate 2 to the upper molding die 100 smooth.

However, in the process of pressing the object to be molded against the upper molding die and delivering it, the difference between the temperature of the molding die and the temperature of the preheating portion of the transport mechanism 1000 may cause insufficient thermal expansion of the object to be molded. Due to this insufficient thermal expansion, the object to be molded before resin molding may be deformed.

Therefore, the present invention relates to a transport mechanism capable of suppressing or preventing deformation of a molded object before resin molding, a resin molding apparatus, a method of delivering the molded object to a molding mold, a resin molding method, and a method for manufacturing a resin molded product. The purpose is to provide.

In order to achieve the above object, the transport mechanism of the object to be molded of the present invention is
A molding target mounting member on which the molding target before resin molding is placed,
Including a vertical movement mechanism for moving the molding object mounting member up and down.
The object to be molded is conveyed while being placed on the member on which the object to be molded is placed.
By moving the molding target mounting member up and down, the molding target can be stopped at a position near the molding mold that does not come into contact with the molding mold and then delivered to the molding mold.

The resin molding apparatus of the present invention includes the transport mechanism and the molding mold.
The object to be molded is delivered to the molding die by the transport mechanism.
It is characterized in that the object to be molded is resin-molded by the molding die.

The first method of delivering the object to be molded to the molding die of the present invention is
The process of transporting the object to be molded before resin molding to the vicinity of the molding mold,
Including the step of moving the object to be molded up and down.
In the step of moving up and down, the object to be molded is stopped at a position near the mold that does not come into contact with the mold.
It is characterized in that the object to be molded is delivered to the molding die.

The second method of delivering the object to be molded to the molding die of the present invention is
The process of transporting the object to be molded before resin molding to the vicinity of the molding mold,
Including the step of moving the object to be molded up and down.
The step of moving up and down
A step of bringing the molding object into contact with the molding mold to stop the molding,
A step of separating the object to be molded from the molding die again and stopping the object at a position near the molding die.
A step of bringing the molding object into contact with the molding mold again to stop the molding,
It is characterized by including. In the following, the first method of delivering the object to be molded to the molding die and the second method of delivering the object to be molded to the molding die of the present invention are collectively referred to as "the object of molding of the present invention. It may be referred to as "a method of delivering an object to a molding die" or simply "a method of delivering an object of the present invention".

The method for producing a resin molded product of the present invention is
A molding object delivery step of delivering the molding object to the molding die by the delivery method of the present invention,
A resin molding step of resin molding the object to be molded by the molding mold,
It is characterized by including.

According to the present invention, there is provided a transport mechanism capable of suppressing or preventing deformation of a molded object before resin molding, a resin molding apparatus, a method of delivering the molded object to a molding mold, and a method of manufacturing a resin molded product. Can be done.

FIG. 1 is a schematic view showing one step of a method of delivering a molded object to a molding die by the transport mechanism of the first embodiment. FIG. 2 is a schematic view showing another step of the same delivery method as in FIG. FIG. 3 is a schematic view showing still another step of the same delivery method as in FIG. FIG. 4 is a schematic view showing a part of the structure of the transport mechanism of the first embodiment. FIG. 5 is a diagram showing an operation flow of the transport mechanism of the first embodiment. FIG. 6 is a schematic view showing one step of a method of delivering a molded object to a molding die by the transport mechanism of the second embodiment. FIG. 7 is a schematic view showing another step of the same delivery method as in FIG. FIG. 8 is a schematic view showing still another step of the same delivery method as in FIG. FIG. 9 is a diagram showing an operation flow of the transport mechanism of the second embodiment. FIG. 10 is a schematic view showing one step of a method of delivering an object to be molded to a molding die according to a modified example of the transport mechanism of the second embodiment. FIG. 11 is a schematic view showing another step of the same delivery method as in FIG. FIG. 12 is a schematic view showing still another step of the same delivery method as in FIG. FIG. 13 is a schematic view showing one step of a method of delivering an object to be molded to a molding die according to another modification of the transport mechanism of the second embodiment. FIG. 14 is a schematic view showing another step of the same delivery method as in FIG. FIG. 15 is a schematic view showing still another step of the same delivery method as in FIG. FIG. 16 is a plan view schematically illustrating the outline of the resin molding apparatus of the present invention. FIG. 17 is a cross-sectional view schematically showing an example of a process in the resin molding step in the method for producing a resin molded product of the present invention. FIG. 18 is a cross-sectional view schematically showing another step in the same resin molding step as in FIG. FIG. 19 is a cross-sectional view schematically showing still another step in the same resin molding step as in FIG. FIG. 20 is a cross-sectional view schematically showing still another step in the same resin molding step as in FIG. FIG. 21 is a schematic view showing one step of a method of delivering an object to be molded to a molding die by a transport mechanism related to the present invention. FIG. 22 is a schematic view showing another step of the same delivery method as in FIG. FIG. 23 is a schematic view showing still another step of the same delivery method as in FIG.

Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

The transport mechanism of the present invention may be capable of stopping the molding target mounting member at a position in contact with the molding mold by, for example, moving the molding target mounting member up and down.

The transport mechanism of the present invention may further include, for example, a positioning mechanism for determining a position for stopping the molded object mounting member.

In the transport mechanism of the present invention, for example, the positioning mechanism may be a positioning member that can move up and down by the vertical movement mechanism.

In the transport mechanism of the present invention, for example, the positioning member may come into contact with the molding die to determine the stop position of the molding object mounting member.

The transport mechanism of the present invention may further include, for example, an elastic member, and the positioning member may move up and down by expanding and contracting the elastic member.

The transport mechanism of the present invention further includes, for example, an actuator for moving the positioning member up and down, and by determining the stop position of the positioning member by setting the pressure of the actuator, the stop position of the molding object mounting member can be determined. It may be possible to decide.

In the transport mechanism of the present invention, for example, by moving the molding object mounting member up and down, the molding target mounting member can be stopped at a position near the molding mold that does not come into contact with the molding mold. , The molding object mounting member can be stopped at a position in contact with the molding mold, and the pressure of the actuator can be set to two types of pressures corresponding to the two types of stopping positions. You may.

The first method of delivering the object to be molded to the molding die of the present invention is, for example,
The step of moving up and down
A step of stopping the object to be molded at a position near the molding die that does not come into contact with the molding die.
A step of bringing the molding object into contact with the molding mold to stop the molding,
A step of separating the object to be molded from the molding die again and stopping the object at a position near the molding die.
A step of bringing the molding object into contact with the molding mold again to stop the molding,
May include.

In the present invention, the "molded object" means a product before molding or an intermediate (semi-finished product) of the product. In the present invention, the object to be molded is, for example, a product or an intermediate (semi-finished product) of a product that is resin-molded with a resin material. In the present invention, the object to be molded is, for example, a substrate, and more specifically, an interposer such as a substrate, a resin substrate, a wiring substrate, or an L / F can be mentioned. However, the object to be molded in the present invention is not limited to these, and is arbitrary. Further, in the present invention, the object to be molded may or may not have a member such as a chip mounted on one surface or both surfaces thereof.

In the present invention, the product produced by molding the object to be molded is not particularly limited, but may be, for example, an electronic component or the like. In general, the "electronic component" may refer to a chip before being resin-sealed or a state in which the chip is resin-sealed. In the present invention, the term "electronic component" is simply used. Unless otherwise specified, it refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, the "chip" refers to a chip in a state in which at least a part is exposed without being resin-sealed, and a chip before resin-sealing and a chip partially resin-sealed are a plurality of chips. It also includes chips in which at least one of them is exposed without being resin-sealed. Specific examples of the "chip" in the present invention include chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, a chip in a state where at least a part of the chip is exposed without being resin-sealed is referred to as a "chip" for convenience in order to distinguish it from an electronic component after resin-sealing. However, the "chip" in the present invention is not particularly limited as long as it is a chip in a state where at least a part of the chip is exposed without being sealed with resin, and it does not have to be in the shape of a chip.

In the present invention, the "resin molding" may be, for example, a "resin sealing" in which a member such as the chip is sealed with a resin. However, in the present invention, the "resin molding" is not limited to this, and may be, for example, a simple resin molding without resin sealing of the member.

In the present invention, "resin sealing" means, for example, a state in which the resin is cured (solidified), but the present invention is not limited to this. That is, in the present invention, "resin sealing" may mean at least a state in which the resin is filled in the mold cavity at the time of mold clamping, and the resin may not be cured (solidified) and may be in a flowing state. ..

Further, in the present invention, the molding die, the resin molding apparatus and the resin molding method are not particularly limited and are arbitrary. For example, the molding die may be a molding die including an upper molding die and a lower molding die. Further, for example, the resin molding method may be any molding method such as compression molding or transfer molding. Further, the resin molding apparatus may be any resin molding apparatus such as a compression molding apparatus and a transfer molding apparatus.

As a method of delivering a molding object such as a substrate before resin molding to a molding mold, for example, the method shown in FIGS. 21 to 23 described above can be considered. However, in the process of pressing the object to be molded against the upper molding die and delivering it, the difference between the temperature of the molding die and the temperature of the preheating part of the transport mechanism causes insufficient thermal expansion of the object to be molded, resulting in a problem. There is a risk. Specifically, for example, the following (1) and (2) can be considered. The following defect (2) may become more prominent as the object to be molded (such as a substrate) becomes thinner.

(1) Occurrence of scratches due to improper positioning of the positioning pilot pin and the hole of the object to be molded (2) Occurrence of wrinkles on the object to be molded due to suction and holding by the upper molding die while the thermal expansion is insufficient.

For example, the following causes can be considered as the causes of the problems (1) and (2).

(1) Causes of scratches due to improper positioning In the process of delivering the molded object to the upper molding die, if the molded object is not preheated to the same temperature as the molding die, thermal expansion will be insufficient and the molded object will be insufficiently expanded. The position of the positioning hole and the pilot pin of the upper molding die (member that determines the holding position of the molding die) are misaligned. If the positioning hole of the object to be molded is pressed against the pilot pin in the displaced state, stress is generated on (the positioning hole) of the object to be molded, and the positioning hole is damaged.

(2) Causes of wrinkles If the object to be molded is not preheated to the same temperature as the temperature of the mold before being delivered to the upper molding mold, the object to be molded is further thermally expanded by receiving heat from the mold. However, since the object to be molded is attracted and held by the intake mechanism of the molding die, it cannot expand in the horizontal direction and wrinkles occur.

In the present invention, the deformation of the molding object before resin molding can be suppressed or prevented by stopping the molding object at a position near the molding mold that does not come into contact with the molding mold. Specifically, by stopping the molding target at a position near the molding mold, it is possible to promote heat reception of the molding target from the molding mold at that position and further thermally expand the molding target. it can. As a result, when the molding object is brought into contact with the molding die, further expansion of the molding target can be suppressed or prevented, so that deformation of the molding target before resin molding can be suppressed or prevented.

Hereinafter, specific examples of the present invention will be described with reference to the drawings. For convenience of explanation, each figure is schematically drawn by omitting or exaggerating as appropriate.

The process charts of FIGS. 1 to 3 show an example of a method of delivering the object to be molded to the molding die by the transport mechanism of this embodiment.

First, as shown in FIG. 1, in a state where the substrate (interposer) 2 which is the object to be molded is placed on the transport mechanism 1000, the transport mechanism 1000 is mounted on the upper molding die 100 and the lower molding die 100 of the molding die (press). Enter between (not shown). As a result, the substrate 2 is conveyed between the upper molding die 100 and the lower molding die (near the molding die). As shown in the figure, the transport mechanism 1000 includes a main body 1010, an actuator 1014, a plate (resin molded product mounting member) 1013, a set block 1100, and an upper molded set block 1120 as main components. As the actuator 1014, for example, as shown in the figure, an air cylinder including a cylinder 1011 and a piston rod 1012 can be used. The cylinder 1011 is connected to the upper surface of the main body 1010. The plate 1013 is located above the cylinder 1011 and is connected to the cylinder 1011 via a piston rod 1012. As shown in the figure, the substrate 2 can be placed on the plate 1013. In FIG. 1, the chip mounting surface of the substrate 2 faces downward, and the chip 1 and the wire 3 are mounted (fixed) on the chip mounting surface. A pilot pin 101 is fixed to the lower surface of the upper molding die 100, and the substrate 2 can be positioned by inserting the pilot pin 101 into the hole 4 of the substrate 2. A set block 1100 is installed on the outer peripheral portion of the upper surface of the plate 1013 at a position surrounding the substrate 2. Further, on the outer peripheral portion of the lower surface of the upper molding die 100, the upper molding die set block 1120 is installed at a position corresponding to the set block 1100.

Next, as shown in FIG. 2, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100.

Next, as shown in FIG. 3, the piston rod 1012 is further extended by the cylinder 1011 to further raise the plate 1013. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is pressed against the upper molding die 100 and delivered. Further, the substrate 2 is attracted to and held on the lower surface of the upper molding die 100 by a suction mechanism (not shown, for example, a vacuum pump) provided on the upper molding die 100. In this way, the object to be molded (substrate) 2 is delivered to the molding die including the upper molding die 100.

After that, as in FIG. 23, the piston rod 1012 is contracted by the cylinder 1011 to lower the plate 1013. Then, after the transport mechanism 1000 is retracted to the outside of the molding die (press), the object to be molded (substrate) 2 is resin-molded by the molding die.

In FIGS. 1 to 3, the object to be molded (board) 2 is preheated to a predetermined temperature by a heater (not shown) included in the transport mechanism 1000 until it enters the molding die. This preheating causes the substrate 2 to thermally expand. As a result, the diameter of the pilot pin 101 of the upper molding die and the position inside the hole of the substrate 2 make the transfer of the substrate 2 to the upper molding die 100 smooth. Further, in this embodiment, as shown in FIG. 2, the molding object (substrate) 2 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100 of the molding die. As a result, the heat receiving from the upper molding die 100 to the molding target (board) 2 at that position can be promoted, and the molding target (board) 2 can be further thermally expanded. Therefore, when the molding target (board) 2 is brought into contact with the upper molding mold 100, it is possible to suppress or prevent the molding target (board) 2 from further expanding, so that the molding target (board) before resin molding can be suppressed. The deformation of 2 can be suppressed or prevented.

In the transfer mechanism 1000 of FIGS. 1 to 3, a mechanism for stopping the object to be molded (board) 2 at a position near the upper molding die 100 that does not come into contact with the upper molding die 100 of the molding die (that is, the "positioning mechanism"). ) Etc. are not particularly limited. For example, as the "positioning mechanism", as will be described later, the molding target (substrate) 2 is located at a position near the upper molding die 100 (not in contact with the upper molding die 100) and at a position where the molding object (base) 2 is in contact with the upper molding die 100. In order to stop at two types of positions, the pressure of the cylinder 1011 may be set to two types of pressures corresponding to the two types of stop positions (not shown, hereinafter referred to as "two-pressure mechanism". ) May have. Further, in addition to or instead of the two-pressure mechanism, a positioning member for determining the stop position of the plate 1013 may be provided as in the second embodiment described later.

Then, the substrate 2 is resin-molded by a molding die including the upper molding die 100. In the present invention, the molding die, the resin molding apparatus, and the resin molding method are not particularly limited as described above.

Note that FIG. 4 schematically shows an example of the configuration of the set block 1100 and the upper molding set block 1120. As shown, the set block 1100 includes a loader set block 1110, an elastic member (spring) 1132, fixing bolts 1133, bushes 1134, and vertically movable pins 1135. As shown in the drawing, the loader set block 1110 is fixed to the upper surface of the plate 1013 and can be fitted to the upper molded set block 1120. The bush 1134 is fixed to the upper surface of the plate 1013 by fixing bolts 1133. The vertically movable pin 1135 penetrates the inside of the bush 1134. The lower portion of the vertically movable pin 1135 can be moved up and down in the escape hole 1131 provided on the upper surface of the plate 1013. Further, the elastic member 1132 is sandwiched between the periphery of the hole 1131 on the upper surface of the plate 1013 and the brim provided in the middle of the vertically movable pin 1135. An upward force due to the extension force of the elastic member 1132 acts on the brim of the vertically movable pin 1135. Further, in FIG. 4, the upper end of the brim of the vertically movable pin 1135 is caught by the bush 1134 so that it does not rise any further. The vertically movable pin 1135 is vertically movable by expanding and contracting the elastic member 1132.

In the set block 1100 and the upper molding set block 1120 shown in FIG. 4, in the state of FIG. 1, that is, in the state where the plate 1013 is not raised, the loader set block 1110 does not fit into the upper molding set block 1120 and is separated. There is. Further, when the upper end of the vertically movable pin 1135 comes into contact with the upper molding die 100, the transport mechanism 1100 does not come into contact with the upper molding die 100 in the state of FIG. It can be in a stopped state at a position near the molding die 100. That is, the vertically movable pin 1135 corresponds to a "positioning member" that determines a position for stopping the plate (molding object mounting member) 1013. Further, in the state of FIG. 3, that is, in the state where the molding object (board) 2 is in contact with the upper molding die 100, the vertically movable pin 1135 is pushed down by the upper molding die set block 1120, and the lower portion of the vertically movable pin 1135 is an escape hole 1131. It will be in a descending state inside.

The configuration of the transport mechanism 1000 of this embodiment is not limited to the configuration of FIGS. 1 to 3. For example, the transport mechanism 1000 may not have the set block 1100 and the upper molding set block 1120, and may be the same as the transport mechanism 1000 of FIGS. 21 to 23 except that it has the two-pressure mechanism.

FIG. 5 shows an example of the operation flow of the transport mechanism 1000 of this embodiment. The figure is also an example of the flow of the method of delivering the object to be molded to the molding die using the transport mechanism 1000 of this embodiment. In the figure, each operation is represented by reference numerals S101 to S106, S201 to S209, and S302 to S307.

In FIGS. 1 to 3, an example is shown in which the object to be molded (board) 2 is brought into contact with the upper molding die 100 and then sucked by the upper molding die 100 as it is (adsorbed to the upper molding die 100). On the other hand, in FIG. 5, as will be described later, after the molding target (board) 2 is brought into contact with the upper molding die 100, the table 1013 is once lowered to move the molding target (board) 2 to the upper molding die 100. Keep away from. As a result, the object to be molded (board) 2 can be released from the stress due to thermal expansion, and the deformation of the object to be molded (board) 2 can be more effectively suppressed or prevented.

As shown in FIG. 5, first, the cylinder 1011 is operated at a low pressure (S101). As a result, the plate 1013 starts to rise (S201). Next, the object to be molded (substrate) 2 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100 (S202). At this time, the cylinder 1011 is adjusted to a pressure that does not press the molding object (board) 2 against the upper molding die 100 (S302). On the other hand, the timer (not shown) is operated from the time when the upper molding die 100 is stopped at a position near the upper molding die 100, and the heater (not shown) provided in the molding die is used to keep the molding object (board) 2 for a certain period of time. Heat (S102). Upper molding die Upper forming die Upper forming die Next, the cylinder 1011 is operated at a high pressure (S103). As a result, the plate 1013 is raised again (S203). Next, the preheating timer of the heater (not shown) provided in the molding die (mold) is operated (S104). On the other hand, the pressure of the cylinder 1011 is increased to bring the molding object (substrate) 2 into contact with the upper molding die 100, but at this time, the molding object is not attracted (adsorbed) by the upper molding die 100 (S304). By these S104 and S304, the plate 1013 is stopped at the position (upper end) where the molding object (board) 2 comes into contact with the upper molding die 100 (S204). As a result, the object to be molded (substrate) 2 is thermally expanded by the heat of the upper molding die 100 (S205). Next, the pressure of the cylinder 1011 is lowered, and the plate 1013 is once lowered (S206). As a result, the object to be molded (substrate) 2 is released from the stress due to thermal expansion (S306), and the pressure of the cylinder 1011 is immediately raised again to raise the plate 1013 again (S107). As a result, the heat-expanded molded object (substrate) 2 is brought into contact with the upper molding die 100 again and finally set (S307). Then, the object to be molded (substrate) 2 is attracted to the upper molding die 100 by a suction mechanism (not shown, for example, a vacuum pump) provided in the upper molding die 100 (S208). Then, the plate 1013 is lowered again to complete the delivery of the object to be molded (substrate) 2 to the molding die (S209).

In the present invention, the overall configuration of the resin molding apparatus is not particularly limited and is arbitrary, but may be, for example, as shown in FIG. FIG. 16 is a plan view schematically showing the resin molding apparatus 3000 of this embodiment. More specifically, the figure is a schematic plan view showing the resin molding apparatus 3000 on the assumption that the member on the upper molding mold side has been removed. As shown in the figure, the resin molding apparatus 3000 has one material receiving module 400, four molding modules 2000, and one payout module 500. The molding module 2000 has a molding mold in it. The configuration of the molding die is not particularly limited and may be the same as that of a general resin molding apparatus (for example, a compression molding apparatus or the like), but may be the same as that of FIGS. 17 to 20 described later, for example. In addition, the resin molding apparatus 3000 has a power supply 401 for supplying electric power to the entire resin molding apparatus 3000, and a control unit 402 for controlling each component.

The material receiving module 400 and the leftmost molding module 2000 in FIG. 16 can be mounted and separated from each other. Further, the adjacent molding modules 2000 can be mounted and separated from each other. The rightmost molding module 2000 and the payout module 500 in FIG. 16 can be mounted and separated from each other. The positioning method for mounting the above-mentioned components is not particularly limited, but can be performed by, for example, a well-known means such as a positioning hole and a positioning pin. The mounting method is also not particularly limited, but it can be carried out by a well-known means such as screwing using bolts and nuts.

The material receiving module 400 has a substrate material receiving unit 403, a resin material receiving unit 404, and a material transfer mechanism 405. The substrate material receiving unit 403 receives a substrate (pre-molded substrate) from the outside of the resin molding apparatus 3000. The resin material receiving unit 404 receives the resin material 20a made of solid resin from the outside of the resin molding apparatus 3000. FIG. 16 shows a granular resin as the resin material 20a.

The resin molding apparatus 3000 is provided with an X-direction guide rail 406 along the X direction from the material receiving module 400 to the payout module 500 via the four molding modules 2000. The X-direction guide rail 406 is provided so that the transport mechanism 1000 can move along the X-direction. The transport mechanism 1000 is provided with a Y-direction guide rail 408 along the Y-direction. The Y-direction guide rail 408 is provided so that the transport mechanism 1000 and the sub-transport mechanism 501 can move along the Y direction. As described above, the transport mechanism 1000 can transport the substrate (pre-molded substrate, molded object) 2. The sub-conveying mechanism 501 can accommodate and transport the resin material 20a. The transport mechanism 1000 and the sub-convey mechanism 501 reciprocate between the upper part of the X-direction guide rail 406 in one molding module 2000 and the upper part of the lower mold cavity 201 in the lower mold 200. The lower molding die 200 and the lower molding die cavity 201 are shown in FIGS. 17 to 20 described later. The transfer mechanism 1000 and the sub-convey mechanism 501 supply the substrate 2 to the lower surface of the upper molding die (not shown), and supply the resin material 20a to the lower molding cavity 201 of the lower molding die 200.

The resin molding apparatus 3000 has a control unit 402. The rotation direction, rotation speed, and torque of the motor of the resin molding mechanism (not shown) that performs resin molding by the molding die are controlled by the signal of the control driver included in the control unit 402. The control unit 402 also controls the operation of the transfer mechanism 1000 and the sub-transfer mechanism 501.

In this embodiment, for example, the transfer mechanism 1000 and the sub-transfer mechanism 501 are formed by resin-sealing the substrate (pre-molded substrate) 2 and the chip 2 mounted on the substrate 2 (see FIG. 1). Both of the molded product (post-molded substrate) 2B may be conveyed. According to this configuration, since the transport mechanism 1000 and the sub-transport mechanism 501 also serve as the carry-in mechanism and the carry-out mechanism, the configuration of the resin molding device 3000 is simplified. Further, as a modification, in the resin molding apparatus 3000, the transport mechanism 1000 and the sub-transport mechanism 501 may be used as a carry-in mechanism, and a carry-out mechanism may be provided separately from the carry-in mechanism. In this case, since the carry-in mechanism and the carry-out mechanism operate independently, the efficiency of the molding operation in the resin molding apparatus 3000 is improved.

The payout module 500 has a resin molded product transfer mechanism 502 for transporting the resin molded product 2B, and a magazine 503 for accommodating the resin molded product 2B. The payout module 500 has a vacuum pump (not shown). The vacuum pump is a decompression source for adsorbing the substrate 2, the resin molded product 2B, and the like for the entire resin molding apparatus 3000. The vacuum pump may be provided in the material receiving module 400.

The vacuum pump is also used as a decompression source for sucking the outside air blocking space including the lower molding cavity 201, which is a space between the upper molding die (not shown) and the lower molding die 200. The outside air blocking space is the space between the upper molding die and the lower molding die 200 after the resin material 20a is supplied to the lower molding die cavity 201 until the molding of the molding die 10 is completed. It is formed in the space including the lower molded cavity 201. Specifically, the space between the upper molding die and the lower molding die 200 including the lower molding die cavity 201 is shielded from the outside air by using a sealing member (not shown). .. By sucking the outside air blocking space, the generation of air bubbles (voids) in the cured resin is suppressed. As the decompression source, a decompression tank sucked by the vacuum pump and having a large capacity may be used.

According to the resin molding apparatus of FIG. 16, adjacent molding modules 2000 among the four molding modules 2000 can be mounted and separated from each other. As a result, the number of molding modules 2000 can be increased in response to an increase in demand, and the number of molding modules 2000 can be reduced in response to a decrease in demand. For example, when the demand for a specific product increases in the area where the factory A is located, the resin molding apparatus 3000 owned by the factory B located in the area where the demand does not increase is used for producing the specific product. Molding module 2000 is separated. The separated molding module 2000 is transported to the factory A, and the transported molding module 2000 is mounted on the resin molding apparatus of the factory A. In other words, the molding module 2000 is added to the resin molding apparatus. As a result, it is possible to meet the increased demand in the area where the factory A is located. Therefore, according to the resin molding apparatus of FIG. 16, a resin molding apparatus capable of flexibly responding to an increase or decrease in demand is realized.

Next, an example of the resin molding step in the method for producing the resin molded product of the present invention will be described with reference to FIGS. 17 to 20. In the resin molding steps shown in FIGS. 17 to 20, a resin molding mechanism including a molding die 300 is used. The resin molding mechanism is not particularly limited, and may be, for example, a general resin molding mechanism (for example, a compression molding mechanism). However, in FIGS. 17 to 20, the parts other than the molding die 300 are not shown for the sake of simplicity.

As shown in the figure, the molding die 300 includes an upper molding die 100 and a lower molding die 200. The upper molding die 100 is the same as that of FIG. 1 except that it does not have the upper molding die set block 1120. As shown in the figure, the lower mold 200 has a lower mold base member 202, a lower mold cavity side surface member 203, an elastic member 204, and a lower mold cavity bottom surface member 205. The lower molding base member 202 is placed on the upper surface of the movable platen 112. The lower mold cavity bottom surface member 205 is attached to the upper surface of the lower mold base member 202 and constitutes the bottom surface of the lower mold cavity 201. The lower molding cavity side surface member 203 is a frame-shaped member arranged so as to surround the lower surface member 205 of the lower molding cavity bottom member, and is attached to the upper surface of the lower molding base member 202 via the elastic member 204. It constitutes the side surface of the molding cavity 201. In the lower molding die 200, the lower molding die cavity 201 is formed by the lower molding die cavity bottom surface member 205 and the lower molding die cavity side surface member 203. Further, the lower molding die 200 is provided with, for example, a heating mechanism (not shown) for heating the lower molding die 200. By heating the lower molding die 200 with the heating mechanism, for example, the resin in the lower molding die cavity 201 is heated and melted or cured.

First, as shown in FIG. 17, the substrate (pre-molding substrate, molding target) 2 is supplied to the lower surface of the upper molding die 100 and fixed. The substrate 2 can be fixed to the lower surface of the upper molding die 100 by, for example, a clamp (not shown) or the like. The chip 1 is fixed to the lower surface of the substrate 2 (the side opposite to the fixed surface with respect to the upper molding die 100) as in FIG.

Next, as shown in FIG. 17, the release film 11 on which the resin material (granular resin) 20a is placed is conveyed to the molding die 300 by the resin loader (resin transport mechanism) 521 (conveyance step). At this time, for example, as shown in the drawing, the frame member 701 may be placed on the release film 11, and the resin material 20a may be placed on the release film 11 in the opening of the frame member 701. The resin loader 521 is not particularly limited, but for example, the auxiliary transport mechanism 501 shown in FIG. 16 may be used as the resin loader 521.

Then, as shown in FIG. 18, the resin loader 521 places the release film 11 on which the resin material 20a is placed in the cavity 201 of the lower molding die 200. At this time, the release film 11 may be attracted to the cavity 201 by a suction mechanism (not shown). As a result, the resin material 20a is supplied to the cavity 201 of the lower molding die 200 together with the release film 11. At this time, the lower molding die 200 may be heated in advance by a heating mechanism (not shown) to raise the temperature.

Next, as shown in FIGS. 19 to 20, the substrate 2 is resin-molded with the lower molding die 200 of the molding die 300. Specifically, for example, first, the resin material 20a is heated by the heat of the lower molding die 200 to obtain a molten resin (fluid resin) 20b as shown in FIG. Next, as shown in FIG. 19, the lower molding die 200 is raised in the direction of arrow Y1 by a mold clamping mechanism (not shown), and the substrate 2 is placed on the fluid resin 20b filled in the lower cavity 201. The chip 1 attached to the lower surface is immersed. After that, the fluid resin 20b is heated and cured to become the resin (cured resin) 20 as shown in FIG. At this time, the fluid resin 20b may be heated by the lower molding die 200 which has been heated in advance by the above-mentioned heating mechanism (not shown). As a result, as shown in FIG. 20, a resin-sealed substrate (resin molded product, electronic component) 2B in which the chip 1 fixed to the substrate 2 is sealed with the resin (cured resin) 20 can be manufactured. .. After that, as shown in FIG. 20, the lower molding die 200 is lowered in the direction of arrow Y2 by the mold clamping mechanism (not shown) to open the mold.

Although the example of the resin molding step has been shown above, the resin molding step is not particularly limited, and may be performed according to, for example, a general resin molding method (for example, a compression molding method).

Although FIGS. 16 to 20 show an example in which the resin material 20a is a granular resin, in the present invention, the resin material before molding and the resin after molding are not particularly limited. For example, the resin material before molding and the resin after molding may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a thermosetting resin or a composite material containing a part of a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include granule resin, fluid resin, sheet-like resin, tablet-like resin, powder-like resin and the like. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin means, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin that has become liquid or fluid due to melting. The form of the resin may be any other form as long as it can be supplied to the cavity or pot of the molding die.

Next, another embodiment of the present invention will be described.

The process charts of FIGS. 6 to 8 show an example of a method of delivering the object to be molded to the molding die by the transport mechanism of this embodiment. In the first embodiment, an example of a method of delivering the object to be molded to the molding mold when the two-pressure mechanism is used is shown, but in this embodiment, an example when the two-pressure mechanism is not used is shown.

First, as shown in FIG. 6, in a state where the substrate (interposer) 2 which is the object to be molded is placed on the transport mechanism 1000, the transport mechanism 1000 is mounted on the upper molding die 100 and the lower molding die 100 of the molding die (press). Enter between (not shown). As a result, the substrate 2 is conveyed between the upper molding die 100 and the lower molding die (near the molding die). As shown in the figure, the transport mechanism 1000 has Example 1 (FIGS. 1 to 4) except that it does not have the set block 1100 and the upper molded set block 1120 and has the stopper pin 1021 and the height adjusting shim 1022. ) Is the same as the transport mechanism 1000. The stopper pin 1021 and the height adjusting shim 1022 correspond to the "positioning member" of the transport mechanism of the present invention. As shown in the figure, the stopper pin 1021 is installed at a position outside the substrate 2 on the outer peripheral portion of the upper surface of the table 1013. The lower part of the stopper pin 1021 is attached to the upper end of the table 1013. The shim 1022 is installed between the lower part of the stopper pin 1021 and the plate 1013.

Next, as shown in FIG. 7, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, the upper end of the stopper pin 1021 (positioning member) comes into contact with the lower surface of the upper molding die 100. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100. At this time, since the shim 1022 performs the height adjusting function, the distance (gap, reference numeral G) between the upper surface of the substrate 2 and the lower surface of the upper molding die 100 becomes equal to the thickness of the shim 1022 as shown in the figure. At this time, the upper molding die 100 is preheated by a heater (not shown). Then, in the state of FIG. 7, the object to be molded (substrate) 2 is heated for a while by the heat of the upper molding die 100 to thermally expand it.

Further, from the state of FIG. 7, the suction mechanism (not shown, for example, a vacuum pump or the like) provided in the upper molding die 100 is operated while keeping the position of the plate 1013 as it is. As a result, the substrate 2 is attracted to the upper molding die 100, and as shown in FIG. 8, is attracted to and held by the upper molding die 100 in a state of being in contact with the lower surface of the upper molding die 100. In this way, the object to be molded (substrate) 2 is delivered to the molding die including the upper molding die 100.

After that, as in FIG. 23, the piston rod 1012 is contracted by the cylinder 1011 to lower the plate 1013. Then, after the transport mechanism 1000 is retracted to the outside of the molding die (press), the object to be molded (substrate) 2 is resin-molded by the molding die.

FIG. 9 shows an example of the operation flow of the transport mechanism 1000 of this embodiment. The figure is also an example of the flow of the method of delivering the object to be molded to the molding die using the transport mechanism 1000 of this embodiment. Note that FIG. 5 shows a flow when the two-pressure mechanism is used, but FIG. 9 shows a flow when the two-pressure mechanism is not used. Further, in FIG. 9, the same operation as in FIG. 5 is indicated by the same reference numerals.

As shown in FIG. 9, first, the actuator 1014 is operated to start raising the plate 1013 (S201). As the plate 1013 continues to rise, the stopper pin 1021 connected to the plate 1013 via the height adjusting shim 1022 (positioning member) comes into contact with the upper molding die 100 (S302). As a result, as shown in FIG. 7, the plate 1013 is stopped at a position in the vicinity of the upper molding die 100 where the molding object (board) 2 does not come into contact with the upper molding die 100 (S202). Next, the preheating timer of the preheating mechanism (not shown) provided in the molding die (mold) is operated (S104). As a result, the object to be molded (substrate) 2 is thermally expanded by the heat of the upper molding die 100 (S205). The upper molding die Then, the object to be molded (substrate) 2 is attracted to the upper molding die 100 by a suction mechanism (not shown, for example, a vacuum pump) provided in the upper molding die 100 (S208). Then, the plate 1013 is lowered again to complete the delivery of the object to be molded (substrate) 2 to the molding die (S209).

Further, FIGS. 10 to 12 show a modified example of this embodiment. The method of delivering the object to be molded to the molding die according to FIGS. 10 to 12 can be carried out in the same manner as in FIGS. 6 to 8 except that the structure of the transport mechanism 1000 is slightly different. Specifically, it is as follows.

First, as shown in FIG. 10, in a state where the substrate (interposer) 2 which is the object to be molded is placed on the transport mechanism 1000, the transport mechanism 1000 is mounted on the upper molding die 100 and the lower molding die 100 of the molding die (press). Enter between (not shown). As a result, the substrate 2 is conveyed between the upper molding die 100 and the lower molding die (near the molding die). As shown in the figure, the transport mechanism 1000 is the same as the transport mechanism 1000 of FIGS. 6 to 8 except that it has a height determining block 1031 instead of the stopper pin 1021 and the height adjusting shim 1022. The height determining block 1031 corresponds to the "positioning member" of the transport mechanism of the present invention. The height determining block 1031 is installed so as to be sandwiched between the piston rod 1012 and the table 1013.

Next, as shown in FIG. 11, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100. At this time, since the height determining block 1031 fulfills the height adjusting function, the distance (gap, reference numeral G) between the upper surface of the substrate 2 and the lower surface of the upper molding die 100 is the thickness of the height determining block 1031 as shown in the figure. Become equal. At this time, the upper molding die 100 is preheated by a preheating mechanism (not shown). Then, in the state of FIG. 11, the object to be molded (substrate) 2 is heated for a while by the heat of the upper molding die 100 to be thermally expanded.

Further, from the state of FIG. 12, the suction mechanism (not shown, for example, a vacuum pump or the like) provided in the upper molding die 100 is operated while keeping the position of the plate 1013 as it is. As a result, the substrate 2 is attracted to the upper molding die 100, and as shown in FIG. 13, is attracted to and held by the upper molding die 100 in a state of being in contact with the lower surface of the upper molding die 100. In this way, the object to be molded (substrate) 2 is delivered to the molding die including the upper molding die 100.

After that, as in FIG. 23, the piston rod 1012 is contracted by the cylinder 1011 of the actuator 1014 to lower the plate 1013. Then, after the transport mechanism 1000 is retracted to the outside of the molding die (press), the object to be molded (substrate) 2 is resin-molded by the molding die. As in FIG. 5 (Example 1), after the molding target (board) 2 is brought into contact with the upper molding die 100, the plate 1013 is once lowered to move the molding target (board) 2 to the upper molding die 100. After separating from the above, the plate 1013 may be raised again to bring the molding object (board) 2 into contact with the upper molding die 100.

Further, FIGS. 13 to 15 show another modification of this embodiment. The method of delivering the object to be molded to the molding die according to FIGS. 13 to 15 can be carried out in the same manner as in FIGS. 6 to 8 or 10 to 12 except that the structure of the transport mechanism 1000 is slightly different. Specifically, it is as follows.

First, as shown in FIG. 13, in a state where the substrate (interposer) 2 which is the object to be molded is placed on the transport mechanism 1000, the transport mechanism 1000 is mounted on the upper molding die 100 and the lower molding die 100 of the molding die (press). Enter between (not shown). As a result, the substrate 2 is conveyed between the upper molding die 100 and the lower molding die (near the molding die). As shown in the figure, the transport mechanism 1000 is the same as the transport mechanism 1000 of FIGS. 6 to 8 except that it has a bolt 1041 and a nut 1042 instead of the stopper pin 1021 and the height adjusting shim 1022. The bolt 1041 and the nut 1042 correspond to the "positioning member" of the transport mechanism of the present invention. As shown, the bolt 1041 is installed at a position outside the substrate 2 on the outer peripheral portion of the upper surface of the plate 1013. The bolt 1041 is screwed into the tapped hole 1043 of the plate 1013 and tightened by the nut 1042 to be fixed to the table 1013.

Next, as shown in FIG. 14, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, the upper end of the bolt 1041 (positioning member) comes into contact with the lower surface of the upper molding die 100. As a result, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position near the upper molding die 100 that does not come into contact with the upper molding die 100. The distance (gap) between the upper surface of the substrate 2 and the lower surface of the upper molding die 100 is indicated by reference numeral G. At this time, the upper molding die 100 is preheated by a heater (not shown). Then, in the state of FIG. 7, the object to be molded (substrate) 2 is heated for a while by the heat of the upper molding die 100 to thermally expand it.

Further, from the state of FIG. 14, the suction mechanism (not shown, for example, a vacuum pump or the like) provided in the upper molding die 100 is operated while keeping the position of the plate 1013 as it is. As a result, the substrate 2 is attracted to the upper molding die 100, and as shown in FIG. 15, is attracted to and held by the upper molding die 100 in a state of being in contact with the lower surface of the upper molding die 100. In this way, the object to be molded (substrate) 2 is delivered to the molding die including the upper molding die 100.

After that, as in FIG. 23, the piston rod 1012 is contracted by the cylinder 1011 of the actuator 1014 to lower the plate 1013. Then, after the transport mechanism 1000 is retracted to the outside of the molding die (press), the object to be molded (substrate) 2 is resin-molded by the molding die.

In this embodiment, the overall view of the resin molding apparatus, the configuration of the molding mold, and the method for producing the resin molded product are not particularly limited, but may be the same as in Example 1 (FIGS. 16 to 20).

According to the present invention, as described above, it is possible to suppress or prevent deformation of the object to be molded before resin molding. The present invention is particularly effective for a thin molded object (such as a substrate) that is easily deformed, but is not limited to this, and can be widely applied to any molded object.

Furthermore, the present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is a thing.

1 chip 2 substrate (molded object)
3 Wire 4 holes 11 Release film 20a Resin material (granule resin)
20b Molten resin (fluid resin)
20 resin (cured resin)
100 Upper mold (upper mold of molding mold)
101 Pilot pin 200 Lower mold (lower mold of molding mold)
201 Lower molded cavity 202 Lower molded base member 203 Lower molded cavity side member 204 Elastic member 205 Lower molded cavity bottom member 300 Molded 400 Material receiving module 401 Power supply 402 Control unit 403 Substrate material receiving part 404 Resin material receiving part 405 Material transfer mechanism 406 X-direction guide rail 408 Y-direction guide rail 500 Discharge module 501 Sub-conveyance mechanism 502 Resin molded product transfer mechanism 503 Magazine 521 Resin loader (resin transfer mechanism)
701 Frame member 1000 Transport mechanism 1010 Transport mechanism body 1011 Cylinder 1012 Piston rod 1014 Actuator (vertical movement mechanism)
1013 plate (resin molded product mounting member)
1021 Stopper pin (positioning member)
1022 shim (positioning member)
1031 Height determination block (positioning member)
1041 bolt (positioning member)
1042 Nut 1043 Tap hole 1100 Set block 1110 Loader set block 1120 Top molding set block 1131 Relief hole 1132 Elastic member (spring)
1133 Fixing bolt 1134 Bush 1135 Vertical movable pin (positioning member)
2000 Molding module 3000 Resin molding device Y1 Arrow indicating the mold tightening direction Y2 Arrow indicating the mold opening direction

Claims (12)

A molding target mounting member on which the molding target before resin molding is placed,
Including a vertical movement mechanism for moving the molding object mounting member up and down.
The object to be molded is conveyed while being placed on the member on which the object to be molded is placed.
While placing the molded object to the molding object mounting member, by the operation of the vertical movement mechanism, after stopping at the position of the mold vicinity without contact with the molded object in forming a shape type, conveying mechanism of the molding object, wherein the receiving pass score in the mold is stopped at a position in contact with the shaped object in the mold. Further, the transport mechanism of claim 1 further comprising a positioning mechanism for positioning stopping the molded object mounting member. The transport mechanism according to claim 2 , wherein the positioning mechanism is a positioning member that can move up and down by the vertical movement mechanism. The transport mechanism according to claim 3 , wherein the stopping position of the molding object mounting member can be determined by contacting the positioning member with the molding die. In addition, it includes elastic members
The transport mechanism according to claim 3 or 4 , wherein the positioning member can move up and down by expanding and contracting the elastic member. Further, the actuator including an actuator for moving the positioning member up and down is included.
The transport mechanism according to any one of claims 3 to 5 , wherein the stop position of the molding object mounting member can be determined by determining the stop position of the positioning member by setting the pressure of the actuator. The operation of the vertical movement mechanism, the molded object mounting member, as well as a can be stopped at the position of the mold near not in contact with the mold, the molded object mounting member, said mold It is possible to stop at the position where it comes in contact with
The transport mechanism according to claim 6 , wherein the pressure of the actuator can be set to two types of pressures corresponding to the two types of stop positions. The transport mechanism according to any one of claims 1 to 7 and the molding die are included.
The object to be molded is delivered to the molding die by the transport mechanism.
A resin molding apparatus characterized in that the object to be molded is resin-molded by the molding die. The process of transporting the object to be molded before resin molding to the vicinity of the molding mold,
Including a step of operating a vertical movement mechanism for moving the object to be molded up and down .
In the step of operating the vertical movement mechanism , the molding target is stopped at a position near the molding mold that does not come into contact with the molding mold, and then the molding target is brought into contact with the molding mold to stop the molding. A method of delivering an object to be molded to a mold, which comprises delivering the object to a mold. The process of transporting the object to be molded before resin molding to the vicinity of the molding mold,
Including a step of operating a vertical movement mechanism for moving the object to be molded up and down.
The process of operating the vertical movement mechanism is
A step of stopping the object to be molded at a position near the molding die that does not come into contact with the molding die.
A step of bringing the molding object into contact with the molding mold to stop the molding,
A step of separating the object to be molded from the molding die again and stopping the object at a position near the molding die.
A step of bringing the molding object into contact with the molding mold again to stop the molding,
Including
In the step of operating the vertical movement mechanism, the object to be molded is stopped at a position in the vicinity of the mold that does not come into contact with the mold.
A method for delivering a molding object to a molding die, which comprises delivering the molding object to the molding die. The process of transporting the object to be molded before resin molding to the vicinity of the molding mold,
Including a step of operating a vertical movement mechanism for moving the object to be molded up and down .
The process of operating the vertical movement mechanism is
A step of bringing the molding object into contact with the molding mold to stop the molding,
A step of separating the object to be molded from the molding die again and stopping the object at a position near the molding die.
A step of bringing the molding object into contact with the molding mold again to stop the molding,
A method for delivering an object to be molded to a molding die, which comprises. A molding object delivery step of delivering the molding object to the molding mold by the delivery method according to any one of claims 9 to 11 .
A resin molding step of resin molding the object to be molded by the molding mold,
A method for producing a resin molded product, which comprises.

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