TWI663039B - Compression molding device, compression molding method, and manufacturing method of compression molded product - Google Patents

Abstract

Provided is a compression molding apparatus capable of easily suppressing variations in package thickness. In order to achieve the foregoing object, the compression molding apparatus of the present invention includes a molding die (10), which includes: an upper die (100); a lower die (200); a cavity (204) to which a resin material is supplied; and a mold closing A position determining mechanism (207) that maintains the depth of the cavity (204) at a predetermined depth at the time; a remaining resin accommodating portion (205) that holds the remaining resin that is not contained in the cavity (204) during mold clamping; and The resin separation part (103), after the resin in the cavity (204) and the foregoing residual resin are hardened, the remaining resin separation part (103) is opposed to one of the upper mold (100) and the lower mold (200) or Both are relatively raised or lowered to separate the resin hardened in the cavity (204) and the aforementioned surplus resin hardened in the surplus resin accommodating portion (205).

Description

   Compression molding device, compression molding method, and manufacturing method of compression molded product   

The present invention relates to a compression molding device, a compression molding method, and a method for manufacturing a compression molded product.

As a method for producing a resin molded article, compression molding is known (for example, Patent Document 1).

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-301950.

However, when the amount of resin supplied to the mold cavity in compression molding varies, the thickness of the package (resin portion of the resin molded product) may also vary.

Therefore, an object of the present invention is to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variations in package thickness.

In order to achieve the object, the compression molding device of the present invention is characterized by including a molding die having: an upper mold; a lower mold; a cavity to which a resin material is supplied; and a depth of the cavity is maintained at the time of clamping. A position determining mechanism at a predetermined depth; a residual resin accommodating portion that accommodates the remaining resin not contained in the cavity when the mold is closed; and a residual resin separating member; the resin in the cavity and the residual resin are hardened Then, the remaining resin separation member is relatively raised or lowered relative to one or both of the upper mold and the lower mold, so that the resin hardened in the cavity and the remaining resin The remaining resin hardened in the resin container is separated.

The compression molding method of the present invention is characterized by comprising: a resin material supplying step of supplying a resin material into a cavity of a molding die; a clamping step of clamping the upper die and the lower die of the molding die; A remaining resin accommodating step of accommodating the remaining resin not contained in the cavity in the mold step; a mold opening step of opening the upper mold and the lower mold; and removing the remaining resin from the The remaining resin separation step of the hardened resin separation in the cavity; after the resin in the cavity and the remaining resin are hardened in the remaining resin separation step, the remaining resin separation member is made relative to the upper mold and the Either one or both of the lower molds will be performed relatively ascending or descending.

The method for producing a compression-molded article of the present invention is characterized in that a resin is compression-molded by the compression-molding method of the present invention.

According to the present invention, it is possible to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variations in package thickness.

1‧‧‧ substrate

2‧‧‧ release film

10, 10a, 10b ‧ ‧ ‧ forming mold

20a‧‧‧ granular resin (resin material)

20b‧‧‧ molten resin (fluid resin)

20c‧‧‧ molten (flowable resin) remaining resin

20d‧‧‧hardened residual resin (residual resin)

20‧‧‧hardened resin (encapsulation resin, encapsulation)

30‧‧‧ Compression molded products (resin molded products)

40‧‧‧Resin supply mechanism

41‧‧‧Resin Supply Department

42‧‧‧Lower gate

100‧‧‧ Upper mold

101‧‧‧ Upper mold base part (upper mold base block)

102‧‧‧ Upper mold substrate mounting section (substrate mounting section)

103‧‧‧Residual resin separation part (residual resin separation block)

104‧‧‧Elastic parts

105‧‧‧ mold

106‧‧‧Die rod support

107‧‧‧ Elastic parts

200‧‧‧ lower mold

201‧‧‧ Base parts (lower mold base parts, lower mold base blocks)

202‧‧‧Bottom part (lower mold bottom part)

203‧‧‧side parts (lower mold side parts)

204‧‧‧ Cavity (lower cavity)

205‧‧‧Residual resin container

205a‧‧‧resin channel

206‧‧‧Resin pressure member (resin pressure lever)

207‧‧‧stop (position determination mechanism)

208, 209, 210, 211‧‧‧ elastic parts

1000‧‧‧ compression molding device

1100‧‧‧forming unit

1200‧‧‧ substrate supply unit

1210‧‧‧ substrate supply mechanism

1300‧‧‧Resin material supply unit

1310‧‧‧Resin material supply mechanism

1400‧‧‧Control Department (Position Determination Mechanism)

X1 ~ X6‧‧‧‧ Arrows indicating the moving direction of the lower mold 200

Y1‧‧‧ an arrow indicating the moving direction of the ejector lever 105

a1, a2‧‧‧ arrows indicating the moving direction of the lower shutter 42

Fig. 1 is a cross-sectional view schematically showing an example of a mold structure in a compression molding apparatus of the present invention.

FIG. 2 is a cross-sectional view schematically showing one step in an example of the compression molding method of the present invention using the molding die of FIG. 1.

FIG. 3 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

FIG. 4 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 5 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 6 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 7 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 8 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 9 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 10 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 2.

FIG. 11 is a cross-sectional view schematically showing another example of a mold structure in a compression molding apparatus of the present invention.

FIG. 12 is a cross-sectional view schematically showing still another example of a mold structure in a compression molding apparatus of the present invention.

Fig. 13 is a cross-sectional view schematically showing one step in another example of the compression molding method of the present invention using the molding die of Fig. 1.

FIG. 14 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 13.

FIG. 15 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 13.

FIG. 16 is a plan view schematically showing an example of the structure of a compression molding apparatus according to the present invention.

17 (a) to (c) are plan views each schematically showing an example of the structure of a compression-molded article and a residual resin produced according to the present invention.

(A) to (c) of FIG. 18 are plan views each schematically showing still another example of the structure of the compression-molded article and the remaining resin.

Hereinafter, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description.

In the compression molding apparatus of the present invention, for example, the molding die may be a molding die in which one side of a substrate is resin-encapsulated, and one of the upper die and the lower die has the cavity, and the other is The substrate is a fixed mold. In this case, for example, it is possible to have a structure in which, when the upper mold and the lower mold are clamped, an end portion on the side of the remaining resin accommodating portion of the substrate is replaced by a mold surface and a portion of the other mold. The end of the remaining resin separation member is clamped.

In the compression molding apparatus of the present invention, for example, the molding die may be a molding die in which one side of the substrate is resin-encapsulated; one of the upper die and the lower die has the cavity, and the other die has the cavity. A mold that is fixed to the substrate; the one mold has a bottom surface member and a side surface member; the bottom surface member is fixed to the base member; the side surface member is connected to the base member by an elastic member; The space surrounded by the bottom member and the side member forms the cavity; the position determining mechanism includes a stopper fixed on the base member; when the upper mold and the lower mold are closed, the The depth of the cavity is maintained at a predetermined depth by contacting the side member to the stopper.

The compression molding apparatus of the present invention may further include, for example, a control unit that controls the operation of the molding die. Further, for example, the control unit may control the clamping of the molding die, and the position determination mechanism may include the control unit.

The compression molding apparatus of the present invention may further include, for example, a control unit that controls the operation of the molding die; the molding die is a molding die that resin-encapsulates one side of the substrate; and one of the upper die and the lower die There is the cavity, and the other mold is a mold on which the substrate is fixed; the one mold has a bottom surface member and a side surface member; the bottom surface member is fixed on the base member; and the side surface member is connected to the substrate by an elastic member. The base member; the cavity is formed by a space surrounded by the bottom member and the side member; the position determining mechanism includes the control unit; and when the upper mold and the lower mold are clamped, By controlling one or both of the rising position and the falling position of one or both of the upper mold and the lower mold by the control unit, the depth of the cavity is maintained at a predetermined depth.

The compression molding apparatus of the present invention may further include, for example, a resin pressing member that is movable up and down with respect to the remaining resin accommodating portion, and the resin pressing member may be used for the cavity and the remaining resin accommodating portion. The resin is pressurized.

The compression molding apparatus according to the present invention may further include a surplus-resin-receiving-portion resin material supply mechanism for supplying a resin material to the surplus-resin-receiving portion.

In the compression molding apparatus of the present invention, for example, the surplus resin may be sandwiched and fixed between the surplus resin separation member and the surplus resin storage portion.

In the compression molding method of the present invention, for example, the molding die may be a molding die in which one side of a substrate is resin-encapsulated. One of the upper die and the lower die has the cavity, and the other is The substrate is a fixed mold. In this case, for example, during the mold clamping step, an end portion on the side of the remaining resin accommodating portion of the substrate may be clamped by a mold surface of the other mold and an end portion of the remaining resin separation member. hold.

In the compression molding method of the present invention, for example, the molding die may be a molding die in which one side of a substrate is resin-encapsulated; one of the upper die and the lower die has the cavity, and the other die is A mold on which the substrate is fixed; the one mold has a bottom member and a side member; the bottom member is fixed to the base member; the side member is connected to the base member by an elastic member; The space surrounded by the component and the side member forms the cavity; the position determining mechanism includes a stopper fixed to the base member; and in the mold clamping step, the side member is brought into contact To the stopper while maintaining the depth of the cavity at a predetermined depth.

In the compression molding method of the present invention, for example, the molding die may have a resin pressing member that is movable up and down with respect to the remaining resin accommodating portion. In the mold clamping step, the resin pressing member may be used. Pressurizing the resin in the cavity and in the remaining resin containing portion.

In the compression molding method of the present invention, for example, in the resin material supplying step, a resin material may also be supplied to the remaining resin accommodating portion.

The apparatus for performing the compression molding method of the present invention is not particularly limited, and for example, the compression molding apparatus of the present invention can be used.

In addition, the order of performing each step of the compression molding method of the present invention is not particularly limited. That is, as long as it can be performed, the steps of the compression molding method of the present invention may be performed in any order, or a plurality of steps may be performed simultaneously.

As described above, the method for manufacturing a compression-molded article of the present invention is characterized in that a resin is compression-molded by the compression-molding method of the present invention. Other than that, the method for producing a compression-molded article of the present invention is not particularly limited, and for example, it may include steps other than the step of compression-molding the resin (compression-molding step) by the compression-molding method of the present invention, or may include Not included. The other steps are not particularly limited, and may be, for example, a cutting step for cutting a compression-molded product separated from a finished product by cutting an intermediate product produced by the compression-molding step. More specifically, for example, the plurality of wafers arranged on one substrate may be compression-molded (resin-encapsulated) by the compression-molding step to manufacture an intermediate product of the compression-mold (resin-encapsulation), and further, by the cutting The cutting step cuts off the intermediate product, and separates a compression-molded product (finished product) in which individual wafers are encapsulated by a resin.

In the present invention, the resin material (resin for resin encapsulation) is not particularly limited. For example, it may be a thermosetting resin such as an epoxy resin and a silicone resin, or a thermoplastic resin. Furthermore, it may be a composite material containing a part of a thermosetting resin or a thermoplastic resin. Examples of the form of the resin supplied to the resin sealing device include particulate resin, fluid resin, sheet resin, plate resin, powder resin, and the like.

In the present invention, the "flowable resin" is not particularly limited as long as it is a resin having flowability, and examples thereof include a liquid resin and a molten resin. Further, in the present invention, "liquid" means fluidity at normal temperature (room temperature) and flow under the action of force, regardless of the level of fluidity, in other words, regardless of the degree of viscosity. That is, the "liquid resin" in the present invention is a resin that has fluidity at normal temperature (room temperature) and flows under the action of force. In addition, in the present invention, the "melt resin" means, for example, a resin that is melted into a liquid state or has a fluid state. The form of the molten resin is not particularly limited, and may be, for example, a form that can be supplied to a cavity of a mold.

In addition, the "electronic component" generally refers to the case of the wafer before the resin is encapsulated and the case where the wafer is resin-sealed. However, in the present invention, the case where the "electronic component" is referred to as "electronic component" unless otherwise specified. Represents an electronic component (a finished electronic component) in which the wafer is encapsulated with a resin. In the present invention, the "wafer" refers to a wafer in a state where at least a part is exposed without being encapsulated by the resin, and includes a wafer before the resin is encapsulated, a part of the wafer having the resin encapsulated, and at least one of the plurality of wafers is not resin A chip in a packaged and exposed state. Specific examples of the "wafer" of the present invention include wafers such as integrated circuits (ICs), semiconductor wafers, and semiconductor devices for power control. The "wafer" in the present invention includes a flip chip. In the present invention, a wafer in a state where at least a part of the wafer is exposed without being encapsulated by a resin is referred to as a “wafer” for convenience in order to distinguish it from a resin-encapsulated electronic component. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer in a state where at least a part is exposed without being encapsulated by a resin, and may not be wafer-shaped. Further, in the electronic component (resin-encapsulated electronic component) of the present invention, the wafer may be entirely encapsulated with resin, or only a part thereof may be encapsulated with resin. In other words, when a part of the wafer is not resin-encapsulated as a finished electronic component (resin-encapsulated electronic component), such a state is also included in the “electronic component (resin-encapsulated electronic component)” of the present invention.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the respective drawings are schematically drawn by appropriately omitting, exaggerating, and the like.

[Example 1]

An example of a mold structure of the compression molding apparatus of the present invention is shown in the cross-sectional view of FIG. 1. As shown, the molding die 10 includes an upper die 100 and a lower die 200. The molding die 10 is a molding die in which one side of a substrate is resin-encapsulated. The lower mold 200 has a cavity (lower cavity) 204, and the upper mold 100 is a mold in which the substrate is fixed.

The lower mold 200 includes a bottom member (lower mold bottom member) 202 and a side member (lower mold side member) 203. The lower mold bottom surface member 202 is fixed to a base member 201. The lower mold side member 203 is connected to a base member (lower mold base member, or lower mold base block) 201 by elastic members 208, 209, and 210. In addition, each elastic member of the compression molding apparatus of Fig. 1 is not particularly limited, but may be, for example, a spring or the like. The lower cavity 204 is formed by a space surrounded by the upper surface of the lower mold bottom member 202 and the inner peripheral surface of the lower mold side member 203. Stoppers 207 are fixed to both ends of the upper surface of the lower mold base member 201, respectively. The stopper 207 corresponds to at least a part of the “position determining mechanism” of the compression molding apparatus including the molding die 10. When the upper mold 100 and the lower mold 200 are closed, the depth of the lower cavity 204 is maintained at a predetermined depth by contacting the lower mold side member 203 with the stopper 207.

The lower mold side member 203 further includes, at an upper portion thereof, a remaining resin accommodating portion 205 for accommodating the remaining resin not contained in the lower cavity 204 when the mold is closed. The lower cavity 204 is connected to the remaining resin accommodating portion 205 so that the resin can move. The lower mold 200 further includes a resin pressing member 206 that can move up and down with respect to the remaining resin accommodating portion 205. The resin pressing member 206 is not particularly limited, and may be, for example, a resin pressing pin. The resin pressing member 206 is connected to the lower mold base member 201 via an elastic member 211. The lower mold side member 203 has a through hole penetrating from the bottom surface of the remaining resin accommodating portion 205 to the lower surface (lower end) of the lower mold side member 203, and the resin pressing member 206 can move up and down in the through hole. Further, the resin in the lower cavity 204 and the remaining resin accommodating portion 205 is pressed by the resin pressing member 206.

The upper mold 100 includes an upper mold base member (upper mold base block) 101, a substrate installation portion (upper mold substrate installation portion) 102, and a remaining resin separation member (excess resin separation block) 103. The upper mold substrate mounting portion 102 is fixed to the lower surface (lower end) of the upper mold base member 101. On the lower surface (lower end) of the upper mold substrate installation portion 102, the substrate can be fixed by, for example, a substrate fixing member (not shown). The substrate fixing member is not particularly limited, and examples thereof include a jig. The remaining resin separating member 103 is fixed to the lower surface (lower end) of the upper mold base member 101 by the elastic member 104, and can move up and down through a hole opened in the upper mold substrate setting portion 102. The remaining resin separating member 103 is disposed directly above the remaining resin accommodating portion 205, and the remaining resin can be pressed by the remaining resin separating member 103. As shown in the figure, an end portion on the substrate side (lower cavity 204 side) of the lower portion of the remaining resin separation member 103 forms a protruding portion protruding in the horizontal direction. Moreover, when the upper mold 100 and the lower mold 200 are closed, the end portion on the side of the remaining resin accommodating portion 205 of the substrate is subjected to the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting portion 102) and the remaining resin separation member The projection (end portion) of 103 is clamped.

A compression molding method (a method of manufacturing a compression molded product) using the compression molding apparatus of FIG. 1 can be performed, for example, as shown in the step cross-sectional views of FIGS. 2 to 10.

First, as shown in FIG. 2, the substrate 1 and the release film 2 are set on a molding die 10. More specifically, it is as follows. That is, as shown in the figure, the substrate 1 is set on the lower surface of the upper mold substrate setting portion 102. At this time, for example, the substrate 1 can be transferred to the position of the upper mold substrate mounting portion 102 using a substrate transfer mechanism (not shown). In addition, for example, a substrate shifting mechanism (substrate shifting member) can be provided on the mold 10 or the substrate transfer mechanism. Then, after the substrate 1 is conveyed, the substrate 1 can be brought close to the remaining resin separation member 103 by the substrate displacement mechanism. This makes it possible to eliminate the gap between the end portion (end surface) on the side of the remaining resin accommodating portion 205 of the substrate 1 and the remaining resin separating member 103. By doing so, it is possible to more effectively suppress or prevent the adhesion of the resin to the ends described later. In addition, the substrate 1 can be fixed (installed) on the lower surface of the upper mold substrate installation portion 102 by a substrate fixing member (not shown) or the like, as described above. In addition, for example, a substrate suction hole (not shown) may be provided at an appropriate position on the lower surface of the upper mold substrate setting portion 102, and the inside of the substrate suction hole may be performed by a suction mechanism (suction pump, etc., not shown). The substrate 1 is sucked and decompressed, and fixed to the lower surface of the upper mold substrate installation portion 102. An arbitrary number of one or a plurality of types of arbitrary components may be mounted on the lower surface of the substrate 1 or may not be mounted. The arbitrary component is not particularly limited, and examples thereof include a wafer, a lead, an electrode, a capacitor (passive element), and the like. Moreover, these parts can be resin-encapsulated by compression molding. On the other hand, the release film 2 is adsorbed (disposed) on the entire upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203, and the resin pressing member 206). Thereby, the entire mold surface of the lower cavity 204 and the remaining resin accommodating portion 205 is covered with the release film 2. For example, a suction hole (not shown) may be provided at an appropriate position on the upper surface of the lower mold 200, and the inside of the suction hole may be sucked by a suction mechanism (suction pump, etc., not shown) to reduce the pressure, so that The upper surface of the mold 200 adsorbs the release film 2. In addition, each of the substrate 1 and the release film 2 can be transported to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown), and then set as shown in FIG. 2. The conveyance mechanism (substrate conveyance mechanism) of the board | substrate 1 is as mentioned above.

Then, as shown in FIG. 3, a resin material (particulate resin) 20a is supplied (set) in the lower cavity 204 (resin material supply step). At this time, the resin material 20a is supplied in an amount slightly larger than the amount required for compression molding (an amount corresponding to the target package thickness or package volume). In addition, although the resin material 20a is a particulate resin in the figure, it is not limited to this as described above. 2 and 3 show an example in which the resin material 20a is supplied (installed) after installation of the release film, but the present invention is not limited to this. For example, in a state where the resin material 20 a is loaded on the release film 2, the resin material 20 a and the release film 2 are transported together to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown). Then, the resin material 20a is supplied (set) by adsorbing the release film 2 on the upper surface of the lower mold 200.

Then, as shown in FIG. 4, the resin material (particulate resin) 20a is melted into a fluid resin (melt resin) 20b. The melting of the resin material 20a can be performed, for example, by heating (heating) the lower mold 200 by a heating mechanism (heater, not shown). For example, before the step (resin material supplying step) of FIG. 3, the lower mold 200 may be heated (heated up) beforehand. In addition, for example, a heating mechanism (heater, not shown) may be used to heat the upper mold 100 instead of the lower mold 200 or to add the upper mold 100 in addition to the lower mold 200 (temperature increase). At this time, the upper mold 100 may be heated (heated up) before the step (resin material supplying step) in FIG. 3 for standby.

Then, as shown in FIGS. 5 to 7, a step (clamping step) of closing the upper mold 100 and the lower mold 200 is performed. First, as shown in FIG. 5, the entire lower mold 200 is raised in the direction of the arrow X1, and the remaining resin separation member 103 and the remaining resin accommodating portion 205 are brought into contact through the release film 2.

Then, as shown by an arrow X2 in FIG. 6, the entire lower mold 200 is further raised. At this time, the remaining resin separation member 103 is pushed up by the lower mold side member 203, and the elastic member 104 contracts. Thereby, as shown in FIG. 6, the end portion on the side of the remaining resin accommodating portion 205 of the substrate 1 is protruded by the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting portion 102) and the remaining resin separation member 103 Part (end). Accordingly, since the flowable resin can be suppressed or prevented from flowing into the end portion on the side of the remaining resin accommodating portion 205 of the substrate 1, the resin can be suppressed or prevented from adhering to the end portion. On the other hand, the end of the substrate 1 on the side opposite to the remaining resin accommodating portion 205 is sandwiched between the upper mold substrate setting portion 102 and the lower mold side member 203 as shown in FIG. 6. At this time, the substrate 1 and the lower mold side member 203 are not in direct contact, but are in contact via the release film 2 as shown in the figure. And, as shown in FIG. 6, in this state, a resin passage 205 a is formed between the lower cavity 204 and the remaining resin accommodation portion 205. The flowable resin 20b can be moved between the lower cavity 204 and the remaining resin containing portion 205 through the resin passage 205a.

Further, as shown by an arrow X3 in FIG. 7, the lower mold base member 201 is further raised. At this time, since the lower mold side member 203 is in direct or indirect contact with the upper mold 100 as described above, it cannot rise further. On the other hand, the lower mold bottom surface member 202 and the resin pressing member 206 rise together with the lower mold base member 201, and the elastic members 208, 209, 210, and 211 shrink. As shown in the figure, because the stopper 207 contacts the lower mold side member 203, the lower mold base member 201 cannot be further raised and is fixed at this position, so the depth of the lower cavity 204 is maintained at a predetermined depth. Then, as shown in the figure, the lower cavity 204 is filled with the fluid resin 20b. At the same time, the remaining flowable resin 20b (residual resin) flows into the remaining resin containing portion 205 through the resin passage 205a, and is filled in the remaining resin containing portion 205 as the remaining flowable resin (residual resin) 20c. At this time, the elongation force of the elastic member 211 is transmitted to the resin pressurizing member 206, so that the flowable resin 20b in the lower cavity 204 and the flowable resin (residual resin) 20c in the remaining resin accommodating portion 205 are pressed by the resin pressing member 206 Pressurize. Further, at this time, since the elastic member 211 can be expanded and contracted, the resin pressing member 206 can be moved up and down, and thus the capacity of the remaining resin accommodating portion 205 can be changed. Therefore, even if the amount of resin in the remaining resin accommodating portion 205 is uneven, it is possible to suppress or prevent the resin from being unfilled (resin pressure is not formed) in the remaining resin accommodating portion 205. This makes it possible, for example, to prevent or prevent a poor molding state such as resin from being unfilled (bubbles, defects, etc.) in the package.

Further, as shown in FIGS. 8 to 10, a step (mold opening step) of opening the upper mold 100 and the lower mold 200 is performed. And, at this time, the step of separating the remaining resin in the remaining resin accommodating portion 205 from the hardened resin in the lower cavity 204 (the remaining resin separation step) is performed at approximately the same time. First, as shown in FIG. 8, after the flowable resins 20 b and 20 c are hardened (cured) to the hardened resins 20 and 20 d, respectively, the lower mold base member 201 is lowered in the direction of the arrow X4. As shown in the figure, the resin hardened resin (encapsulating resin) hardened in the lower cavity 204 is indicated by symbol 20, and the remaining resin hardened in other places (in the remaining resin accommodating portion 205 and the resin channel 205a) is indicated by symbol 20d said. In addition, when the fluid resins 20b and 20c are thermosetting resins, the hardening (curing) of the fluid resins 20b and 20c can continue to heat the fluid resin 20b in the mold clamping state, for example, by the heated mold 10. And 20c. When the flowable resins 20b and 20c are thermoplastic resins, for example, the flowable resins 20b and 20c can be cured by stopping the heating of the molding die 10 and leaving it for a while. Then, as the lower mold base member 201 is lowered, as shown in FIG. 8, the lower mold bottom surface member 202 and the resin pressing member 206 are lowered together with the lower mold base member 201 from Underside separation.

Then, as shown by an arrow X5 in FIG. 9, the entire lower mold 200 is lowered. Thereby, the lower mold side member 203 is separated from the hardened resin 20 hardened in the lower cavity 204. Along with this, due to the restoring force (elongation force) of the elastic member 104, the remaining resin separation block 103 and the lower mold 200 are lowered together. That is, the remaining resin separation block 103 is relatively lowered with respect to the upper mold 100. Thereby, the hardened residual resin 20d is also lowered together with the lower mold 200 and the residual resin separation block 103. At this time, as shown in the figure, since the hardening resin (encapsulating resin) 20 hardened in the lower cavity 204 is still fixed to the upper mold substrate setting portion 102 together with the substrate 1, it is separated from the remaining resin 20d. By doing so, it is possible to separate the compression-molded product (resin-molded product) 30 formed from the hardened resin (encapsulated resin, package) 20 and the substrate 1 from the remaining resin 20d.

Then, as shown by an arrow X6 in FIG. 10, the entire lower mold 200 is further lowered to a predetermined position (the same position as in FIGS. 1 to 4 before the mold is closed). Thereby, the surplus resin 20d is separated from the surplus resin storage portion 205. The hardened residual resin 20 d can be removed from the molding die 10 by being transported outside the molding die 10 using a transfer mechanism (not shown), for example, after being separated (released) from the residual resin separation block 103. As described above, a compression molding method using the compression molding apparatus of FIG. 1 can be performed. This compression molding method is also a method for manufacturing the compression molded product 30.

The compression molding apparatus and the compression molding method shown in Figs. 1 to 10 can be appropriately modified without departing from the scope of the present invention. For example, although the example in which the release film 2 is provided in the lower mold 200 is shown in FIGS. 2 to 10, the compression molding method can be performed without using the release film.

In the present invention, compression molding is used as a resin molding method.

Generally, compression molding and transfer molding are used as a resin molding method. In transfer molding, since the amount of resin in the cavity during molding is easily maintained at a constant amount, there is an advantage that the resin thickness (package thickness) of a predetermined resin molded product is easily maintained. On the other hand, in transfer molding, the resin flows into the cavity during molding. Therefore, the resin flow may cause component defects (for example, deformation, cutting, contact, etc.) of the resin molded product, voids ( Bubbles), unfilled parts, etc.

In order to solve the problem of variation in the amount of resin in compression molding (variation in package thickness), the following methods are known. That is, a molding resin containing a remaining component in addition to a necessary component required for compression molding is previously contained in a cavity of a compression molding die. Then, at the time of compression molding (at the time of mold clamping), the remaining resin flows out of the cavity, and only the necessary amount of the resin required for compression molding remains in the cavity for use. Then, after compression molding, the compression-molded article (resin-molded article) is taken out of the molding die together with the remaining resin. Thereafter, the remaining resin is separated from the compression-molded article outside the molding die. However, in this method, it is necessary to prepare a mechanism (step) for removing excess resin from the molded substrate in addition to the molding die. Therefore, the apparatus size of the compression molding apparatus becomes large and complicated. Moreover, in this method, the manufacturing steps of the compression-molded article are complicated due to the separation operation of the remaining resin. Further, in this method, it is necessary to transport the compression-molded product before the separation from the surplus resin and the surplus resin together outside the molding die. In addition, as for the compression-molded product, for example, as shown in FIG. 18 (b) described later, the excess resin is attached to the outer periphery of the molded substrate. Thus, in fact, the size of the substrate in plan view is larger than that of the substrate before molding, and the amount of residual resin in the substrate after molding is larger. In other words, the substrate size will actually change before and after molding. Thus, for example, a two-system substrate transfer mechanism or a one-system variable substrate transfer mechanism is prepared. Therefore, the size of the compression molding apparatus is further increased and complicated.

On the other hand, in the present invention, after the compression molding, the resin molded product and the remaining resin can be separated in the molding die without removing the resin molded product and the remaining resin from the molding die. That is, according to the present invention, a compression molding method including a separation step of the remaining resin can be easily performed. Thus, as described above, it is possible to easily suppress variations in the thickness of the package (the resin portion of the resin molded product). In addition, according to the present invention, it is possible to suppress or prevent, for example, a change in the size of the substrate in plan view from the substrate before molding and the molded substrate (compressed molded product). According to this, it is not necessary to prepare a substrate conveyance mechanism for two systems or a substrate conveyance mechanism with a variable size for one system, and the structure of the substrate conveyance mechanism can be simplified.

[Example 2]

Figs. 11A and 11B show another example of a molding die of the compression molding apparatus of the present invention. In the drawings, the same components as those in FIGS. 1 to 10 are denoted by the same symbols. As shown in the figure, this molding die 10a is the same as the molding die 10 of FIGS. 1 to 10 except that it has a ejector lever 105. In addition, in FIG. 11, although 210 of the elastic members 208, 209, and 210 connecting the lower mold side member 203 and the lower mold base member 201 is omitted, it is not limited to this, and an elastic member can be provided as in FIGS. 1 to 10. 210.

As shown in FIG. 11, the ejector lever 105 can move up and down through a through hole that penetrates from the upper end (upper surface) of the upper mold substrate installation portion 102 to the lower end (lower surface) of the remaining resin separation member 103. An ejector support member (flange) 106 is fixed to the upper end of the ejector lever 105. For the upper mold base member 101, a part of the upper portion is dug out to form a receiving portion of the lifter rod support member 106. The lower end (lower surface) of the ejector lever support member 106 is connected to the upper mold base member 101 and the upper mold substrate installation portion 102 on the bottom surface of the accommodating portion by an elastic member 107. The ejector lever 105 penetrates the inside of the elastic members 104 and 107.

A compression molding method using the molding die 10a of FIG. 11 and a compression molding apparatus including the same can be performed, for example, in the same manner as in FIGS. 2 to 10. (A) of FIG. 11 is a state after performing the same steps as those of FIGS. 2 to 10. That is, (a) of FIG. 11 is a state in which the entire lower mold 200 is lowered to a predetermined position as shown by an arrow X6 in the figure. As shown in the figure, the hardened residual resin 20 d is attached to the lower end (lower surface) of the residual resin separation member 103 in a state separated from the resin molded product 30. From this state, as shown in FIG. 11 (b), the mold rod support member 106 is pushed down in the direction of the arrow Y1 to lower the mold rod 105. Thereby, as shown in the figure, the remaining resin 20d can be pushed down to be separated (released) from the remaining resin separating member 103. The remaining resin 20d separated (released) from the remaining resin separation block 103 can be removed from the molding die 10, for example, by transferring it to the molding die 10 using a transfer mechanism (not shown).

In addition, although the example using a release film is shown in FIG. 11, it is not limited to this, For example, like FIG. 2-10, a release film may not be used.

[Example 3]

FIG. 12 shows another example of a molding die of the compression molding apparatus of the present invention. This molding die 10b has two lower cavities, and is capable of compression-molding two substrates at substantially the same time. More specifically, as shown in the figure, the molding die 10b has two lower cavities 204, which are disposed on both sides with the remaining resin accommodating portion 205 interposed therebetween. Each of the two lower mold cavities 204 is connected to the remaining resin accommodating portion 205, and the resin can move between the lower mold cavity 204 and the remaining resin accommodating portion 205. On the lower surface (lower end) of the upper mold substrate installation portion 102, two substrates can be installed by setting (fixing) the substrates at positions directly above the two lower cavities 204, respectively. Otherwise, the molding die 10b of FIG. 12 is the same as the molding die 10 of FIGS. 1 to 10.

The method of using the compression molding apparatus of FIG. 12 is not particularly limited, and for example, it can be used in the same manner as the compression molding apparatus of FIGS. 1 to 10. According to the compression molding apparatus of FIG. 12, since two substrates can be compression-molded at substantially the same time, a compression molding method (a method of manufacturing a compression-molded product) can be efficiently performed. In addition, although FIG. 12 shows an example of a state in which the particulate resin 20a is supplied (disposed) to the lower cavity 204 without using a release film, the present invention is not limited to this, and it can be used in the same manner as in FIGS. 2 to 10 Release film.

[Example 4]

13 to 15 are cross-sectional views schematically showing a resin material supply step in another example of the compression molding method using the molding die of Example 1 (FIGS. 1 to 10). In this example, in the resin material supplying step (the step of supplying the resin material into the cavity of the molding die), in addition to supplying the resin material into the cavity, the remaining resin containing portion resin material supply is used. A mechanism for supplying a resin material into the remaining resin containing portion.

First, the substrate 1 and the release film 2 are provided in the same manner as in FIG. 2. In this state, as shown in FIG. 13, two resin supply mechanisms 40 containing a resin material (pellet resin) 20 a are inserted between the upper mold 100 and the lower mold 200. One of the two resin supply mechanisms 40 Its function is a "cavity resin material supply mechanism" that supplies the resin material 20a into the cavity 204, and the other function is a "residual resin housing portion resin material supply mechanism" that supplies the resin material 20a into the remaining resin storage portion 205 . As shown in the figure, the resin supply mechanism 40 includes a resin supply portion 41 and a lower shutter 42. The resin supply portion 41 has a frame-like shape in which openings are formed at the upper and lower ends. The lower end opening of the resin supply section (frame) 41 is closed by the lower shutter 42. Thereby, as shown in FIG. 13, the resin material 20a can be accommodated in the space enclosed by the resin supply part (frame) 41 and the lower shutter 42.

Then, as shown in FIG. 14, by opening the lower shutter 42 in the directions of arrows a1 and a2 (horizontally), the opening at the lower end of the resin supply portion (frame) 41 is opened, and the resin material 20a is dropped from the opening. Thereby, as shown in the figure, the resin material 20 a can be supplied (loaded) into the lower cavity 204 and into the remaining resin accommodation portion 205. After that, if the two resin supply mechanisms 40 are withdrawn from between the upper mold 100 and the lower mold 200, as shown in FIG. 15, the resin material 20 a is supplied to each of the downward cavity 204 and the remaining resin accommodation portion 205. status. Thereafter, for example, compression molding can be performed by the same steps as those in Figs. 4 to 10.

If the resin material is supplied to the remaining resin accommodating portion in addition to the cavity in the resin material supplying step as in this embodiment, the resin flow can be more suppressed in the compression molding step. This makes it possible to more effectively suppress or prevent problems such as component defects (for example, deformation, cutting, contact, wafer displacement, etc.), voids (air bubbles), and unfilled portions of the resin molded product described above.

In addition, in FIGS. 13 to 15, although the “cavity resin material supply mechanism” and the “residual resin storage portion resin material supply mechanism” are used to supply the resin material at substantially the same time, a method of supplying the resin material to the remaining resin storage portion Not limited to this. For example, the order in which the resin material 20 a is supplied to the lower cavity 204 and the remaining resin accommodating portion 205 is approximately the same in FIGS. 13 to 15, but it is not limited thereto, and either side may be used first. Furthermore, although two resin supply mechanisms 40 are used in FIGS. 13 to 15, the present invention is not limited to this. For example, only one resin supply mechanism 40 may be used, and thus, the resin material 20a to the lower cavity 204 and the remaining resin accommodating portion 205 is sequentially supplied, not substantially simultaneously.

In addition, for example, in the resin material supply step in the compression molding method (FIGS. 2 to 10) of Embodiment 1, the resin supply portion 41 and the lower shutter 42 may be used in the same manner as in FIGS. 13 to 15. Resin supply mechanism 40.

[Example 5]

The plan view of FIG. 16 schematically illustrates the configuration of another example of the compression molding apparatus of the present invention. As shown in the figure, the compression molding apparatus 1000 includes a molding unit 1100, a substrate supply unit 1200, a resin material supply unit 1300, and a control unit 1400. The substrate supply unit 1200 and the resin material supply unit 1300 are disposed on opposite sides of each other with the molding unit 1100 interposed therebetween. The substrate supply unit 1200 includes a substrate supply mechanism 1210. The resin material supply unit 1300 is provided with a resin material supply mechanism 1310. The control unit 1400 is arranged in the substrate supply unit 1200. A molding die (not shown) is arranged in the molding unit 1100. The molding die is not particularly limited except that it has characteristics as a molding die in the compression molding apparatus of the present invention, and is arbitrary. For example, the molding die may be the same as the molding die 10 of Embodiment 1 (FIGS. 1 to 10), the molding die 10 a of Embodiment 2 (FIG. 11), or the molding die 10 b of Embodiment 3 (FIG. 12).

The compression molding apparatus of FIG. 16 can use the compression molding method of this invention or the manufacturing method of a compression molded product. The specific use method is not particularly limited, and for example, the compression molding method or the method for manufacturing a compression molded product described in Examples 1 to 4 can be used.

More specifically, the compression molding apparatus of FIG. 16 can be used as described below, for example. For example, in the substrate supply mechanism 1210 in the substrate supply unit 1200, a substrate for compression molding may be arranged for standby, and the substrate may be supplied to a molding die. The substrate can be transferred to a position of a molding die by a substrate transfer mechanism (not shown), for example. The substrate conveyance mechanism may be arranged in the substrate supply unit 1200, for example. In addition, in the resin material supply mechanism 1310 in the resin material supply unit 1300, a resin material may be arranged for standby, and the resin material may be supplied into a cavity of a molding die (resin material supply step). The resin material can be transferred to a position of a mold by a resin material transfer mechanism (not shown), for example. The resin material conveyance mechanism may be disposed in, for example, the resin material supply unit 1300. The resin material conveyance mechanism can convey the resin material using, for example, the resin supply mechanism 40 described in Embodiment 4 (FIGS. 13 to 15).

The control unit 1400 controls a part or all of the operations of the compression molding apparatus 1000 of FIG. 16. The operation controlled by the control unit 1400 is, for example, a part or all of the steps in the compression molding method or the method for manufacturing a compression molded product according to the present invention, and may include one or both of the steps of clamping the mold and opening the mold. . For example, the control unit 1400 can control the mold clamping and maintain the cavity depth at the predetermined depth during the mold clamping. At this time, the control unit 1400 functions as at least a part of the "position determining mechanism" in the compression molding apparatus of the present invention. In addition to the "position determining mechanism", for example, in addition to controlling the mold clamping by the control unit, as described in Embodiments 1 to 4, a stopper fixed to the base member may be used. The operations controlled by the control unit 1400 may include, for example, supplying the substrate to the molding die by the substrate supply unit 1200 (substrate supplying step), and supplying the resin material (resin material) into the cavity of the molding die by the resin material supply unit 1300. The supply step) may not be included.

In addition, the configuration of the molding unit 1100, the substrate supply unit 1200, the resin material supply unit 1300, and the control unit 1400 is not limited to the configuration of FIG. 16 and may be arbitrary. Further, although the number of the molding units 1100 is three in FIG. 16, the number of the molding units 1100 is not limited to this, and may be arbitrary, and may be one, two, or four or more. If a plurality of molding units 1100 are provided as shown in FIG. 16, for example, a plurality of substrates can be compression-molded at substantially the same time, and compression molding efficiency is high. Alternatively, for example, one side of the substrate may be compression-molded in one molding unit 1100, and then the other side of the substrate may be compression-molded in another molding unit 1100. That is, it is possible to cope with both sides of the substrate by compression molding.

Further, the compression molding apparatus 1000 shown in FIG. 16 may or may not have any other unit or mechanism (not shown). Examples of the other arbitrary unit or mechanism include a release film supply unit that supplies a release film to a mold. The release film supply unit may include, for example, a release film supply mechanism in which a release film is arranged and a release film transport mechanism that transports the release film to a position of a molding die.

[Example 6]

Hereinafter, an example of the form of the remaining resin when a compression-molded article is manufactured according to the present invention will be described.

An example of the structure of the compression-molded article and the surplus resin manufactured by this invention is shown in each plan view of (a)-(c) of FIG. As shown in the figure, (a) to (c) of FIG. 17 respectively show a state before the remaining resin is separated from the resin molded product containing the substrate 1 and the hardened resin 20 (for example, the state of FIG. 8 in Example 1). As shown in the drawings, in each of FIGS. 17A to 17C, one side of the substrate 1 is encapsulated with a hardening resin 20 except for its edge portion. Further, the hardened residual resin 20 d is connected to the hardened resin 20 and protrudes from the outer periphery of the substrate 1. FIG. 17 (a) shows a state where the excess resin 20 d protrudes from one side of the substrate 1. FIG. 17 (b) shows a state where the remaining resin 20 d protrudes from the left and right sides of the substrate 1. Fig. 17 (c) shows an example in which the portions of the cured resin 20 of the two compression-molded products are connected to each other by the remaining resin 20d to be integrated. (A) of FIG. 17 can be manufactured using the shaping | molding die of Example 1 (FIG. 1-10), for example. (B) of FIG. 17 can be manufactured using the shaping | molding die (not shown) in which the excess resin accommodation part was arrange | positioned on the left and right sides of a cavity, for example. (C) of FIG. 17 can be manufactured using the shaping | molding die of Example 3 (FIG. 12), for example.

Moreover, each of (a) to (c) of FIG. 18 shows an example of the structure of a compression-molded article and a surplus resin that can be produced by the present invention or a general resin molding method.

(A) of FIG. 18 shows an example of the structure of a resin molded article which can be manufactured by a general resin molding method. In the resin molded product of this figure, one surface of the substrate 1 is resin-molded with a hardening resin 20. The hardening resin 20 contains a residual resin at its edge portion. The remaining resin does not protrude from the outer periphery of the substrate 1. In addition, the remaining resin is not separated from the resin molded product, but constitutes a part of the resin molded product (product).

(B) of FIG. 18 shows another example of the structure of a resin molded article which can be manufactured by a general resin molding method. In the resin molded product of this figure, one surface of the substrate 1 is resin-molded with a hardening resin 20. The remaining resin 20 d is connected to the outer periphery of the cured resin 20. The remaining resin 20 d protrudes from the outer periphery of the substrate 1. After the resin molded article of FIG. 18 (b) is removed from the molding die (release), the remaining resin 20d is separated from the resin molded article.

(C) of FIG. 18 shows an example of a structure of a resin molded product (compression molded product) that can be produced according to the present invention. The structure of the resin molded product in this figure is the same as that in FIG. 17 (b), except that the left-right direction on the paper surface and the vertical direction on the paper surface are reversed.

When a substrate is molded by a general resin molding method to produce a resin molded product (for example, a resin-encapsulated electronic component that encapsulates a wafer resin on the substrate), it has the following problems.

In the molding die, if a surplus resin accommodating portion is provided at a position inside the substrate, for example, as shown in FIG. 18A, there may be a case where a surplus resin cannot be separated from the resin molded product (product) inside the substrate. At this time, the product area (package area) of the substrate becomes smaller, and the number of products per one substrate (the number of electronic components that can be mounted on the substrate) decreases.

On the other hand, in a case where a surplus resin accommodating portion is provided at a position outside the substrate in the molding die, for example, as shown in FIG. 18 (b), the surplus resin is attached to the outer periphery of the molded substrate. In this case, the size of the substrate in plan view is actually more than that of the substrate before molding. In other words, the substrate size will actually change before and after molding. Thus, for example, a two-system substrate transfer mechanism or a one-system variable substrate transfer mechanism is prepared. Therefore, the apparatus size of the compression molding apparatus is further increased and complicated. Furthermore, in addition to the molding die, it is necessary to separately prepare a mechanism (step) for removing excess resin from the molded substrate, thereby increasing the size of the compression molding apparatus and making it complicated. In addition, the steps of the compression molding method become complicated.

However, according to the present invention, even if a surplus resin storage portion is provided at a position outside the substrate, the surplus resin can be removed from the molded substrate in the molding die. Therefore, it is possible to effectively suppress or prevent problems such as the device size of the compression molding device from becoming large or complicated. In addition, as described above, it is possible to easily suppress variations in package thickness.

In addition, the structures of the compression-molded article and the remaining resin in the present invention are not limited to those shown in (a) to (c) of FIG. 17 and (c) of FIG. 18, and may be arbitrary, for example, a structure as shown in FIG. Wait. However, a structure in which the compression-molded product and the remaining resin are easily separated in the molding die is preferred.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected and adopted according to needs within the scope not departing from the spirit of the present invention.

This application claims priority based on Japanese application patent application 2016-231493 filed on November 29, 2016, the entire contents of which are incorporated herein by reference.

Claims (9)

A compression molding device includes a molding die for resin-encapsulating one side of a substrate; the foregoing molding die includes: an upper mold; a lower mold; a cavity to which a resin material is supplied; and a depth of the foregoing cavity is maintained at a predetermined depth when the mold is closed. A position determining mechanism for the remaining resin; a remaining resin accommodating section for storing the remaining resin not contained in the cavity at the time of mold clamping; and a remaining resin separating part; one of the upper mold and the lower mold has the cavity, and One mold is a mold to which the substrate is fixed; the one mold has a bottom member and a side member; the bottom member is fixed to the base member; the side member is connected to the base member by an elastic member; The space surrounded by the side members forms the aforementioned cavity; the position determining mechanism includes a stopper fixed to the base member; and when the upper mold and the lower mold are closed, the side member contacts the stopper While keeping the depth of the cavity at a predetermined depth, the resin in the cavity and the remaining resin are hard Then, the remaining resin separation member is relatively raised or lowered relative to one or both of the upper mold and the lower mold, so that the resin hardened in the cavity and the resin remaining portion are hardened. The aforementioned residual resin is separated. A compression molding device includes a molding die for resin-encapsulating one side of a substrate; the foregoing molding die includes: an upper mold; a lower mold; a cavity to which a resin material is supplied; and a depth of the foregoing cavity is maintained at a predetermined depth when the mold is closed. A position determining mechanism for the remaining resin; a remaining resin accommodating section for storing the remaining resin not contained in the cavity at the time of mold clamping; and a remaining resin separating part; one of the upper mold and the lower mold has the cavity, and One mold is a mold to which the substrate is fixed; the one mold has a bottom member and a side member; the bottom member is fixed to the base member; the side member is connected to the base member by an elastic member; The space surrounded by the side members forms the aforementioned cavity; the position determining mechanism includes a control section that controls the operation of the molding die; and when the upper mold and the lower mold are closed, the upper section and the lower section are controlled by the control section. One or both of the rising position and the falling position of one or both of the molds, so that the depth of the cavity is maintained A predetermined depth; after the resin in the cavity and the remaining resin are hardened, the remaining resin separation member is relatively raised or lowered relative to one or both of the upper mold and the lower mold, so that the The resin hardened in the cavity is separated from the aforementioned surplus resin hardened in the aforementioned surplus resin receiving portion. The compression molding device according to claim 1 or 2, wherein, when the upper mold and the lower mold are clamped, an end portion on the side of the remaining resin accommodating portion of the substrate is replaced by a mold surface of the other mold and the remaining portion. The end of the resin separation member is clamped. The compression molding device according to claim 1 or 2, further comprising a resin pressurizing member that can move up and down with respect to the remaining resin accommodating portion; and the resin pressing member accommodates the cavity and the remaining resin. The resin in the part is pressurized. The compression molding device according to claim 1 or 2, further comprising a surplus resin containing portion resin material supply mechanism that supplies a resin material to the surplus resin containing portion. A compression molding method that uses the compression molding device described in claim 1 or 2 and includes the following steps: a resin material supply step of supplying a resin material into a cavity of the foregoing mold; and an upper mold and a lower mold of the foregoing mold The mold performs a mold clamping step; a residual resin accommodating step of accommodating the remaining resin not contained in the cavity in the mold clamping step in the remaining resin accommodating portion; and opening the upper mold and the lower mold. A mold opening step; and a residual resin separation step of separating the residual resin from the resin hardened in the cavity; the residual resin separation step separates the residual resin after the resin in the cavity and the residual resin are hardened; The component is relatively raised or lowered relative to one or both of the upper mold and the lower mold. The compression molding method according to claim 6, wherein the molding die further has a resin pressing member that can move up and down with respect to the remaining resin accommodating portion; in the mold clamping step, the resin pressing member is used to The resin in the cavity and in the remaining resin receiving portion is pressurized. The compression molding method according to claim 6 or 7, wherein, in the resin material supplying step, a resin material is also supplied to the remaining resin accommodating portion. A method for producing a compression-molded article, which comprises compression-molding a resin by the compression-molding method according to any one of claims 6 to 8.