TWI689402B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The invention provides a resin molding device capable of forming a molding die with a small number of parts. The resin molding apparatus of the present invention is characterized by including a molding die (1000), a temperature rising stage (S1), a resin molding stage (S2), and a discharge stage (S4). The molding die (1000) includes one mold (200) and another mold (100), and the resin molded product (1b) after resin molding can be released from the other mold (100) in a state of being fixed in one mold (200). Mold, at least one of one mold (200) and another mold (100) can be installed and removed relative to each of the stages, and at the same time can be moved between the stages, the heating stage (S1) will form the mold (1000 ) The temperature rises, the resin molding stage (S2) performs resin molding, and the discharge stage (S4) releases the resin molded product (1b) from the molding die (1000).

Description

Resin molding device and method for manufacturing resin molded product

The invention relates to a resin molding device and a method of manufacturing a resin molded product.

Conventionally, in resin molding, a resin molding die is fixed to one stage of a resin molding device to perform molding (for example, Patent Document 1 etc.).

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 6-177190.

However, when performing resin molding to take out (mold release) the resin molded product in one stage, for example, it may be necessary to add accessories for taking out the resin molded product to the molding die. In this case, the number of parts of the mold increases, which may increase the manufacturing cost and manufacturing time of the mold.

Therefore, an object of the present invention is to provide a resin molding device and a method for manufacturing a resin molded product that can form a molding die with a small number of parts.

In order to achieve the above object, the first resin molding apparatus of the present invention is characterized by including a molding die, a temperature rising stage, a resin molding stage, and a discharge stage, and the molding die includes one mold and another mold to mold the resin after resin molding The product can be released from the other mold in a state of being fixed to the one mold, and at least one of the one mold and the other mold can be installed and removed with respect to each of the stages, while being able to Moving between the stages, the temperature-raising stage raises the temperature of the molding die, the resin-molding stage performs resin molding, the discharge stage demolds the resin-molded product from the molding die, and the one mold is equipped with The resin molded article fixing mechanism of the resin molded article.

In addition, in order to achieve the above object, the second resin molding apparatus of the present invention is characterized by including a molding die, a temperature rising stage, a resin molding stage, and a discharge stage. The molding die includes one mold and the other mold. The resin molded product can be released from the other mold while being fixed to the one mold, and at least one of the one mold and the other mold can be attached and detached with respect to each of the stages, while being able to Move between the stages, The temperature rising stage heats up the molding die, the resin molding stage performs resin molding, and the discharge stage causes the resin molded article to be released from the molding die due to the Compared with the area of the surface of the mold that is in contact with the resin, the area of the surface of the one mold that is in opposition to the other mold and in contact with the resin is larger, so that the resin molded product can be fixed to the The state on one mold is released from the other mold.

In addition, in the following, the said 1st resin molding apparatus of this invention and the said 2nd resin molding apparatus of this invention may be collectively called "the resin molding apparatus of this invention."

The first method for manufacturing a resin molded product of the present invention is characterized by using a mold including one mold and another mold, and including: a temperature raising step of raising the temperature of the mold during the temperature raising step; and performing the resin during the resin molding step A molding resin molding step; a first demolding step of demolding the resin molded product after resin molding from the other mold in a state where it is fixed to the one mold by the resin molded product fixing mechanism; and The second demolding step of demolding the resin molded product from the one mold in the ejection stage.

The second method for manufacturing a resin molded product of the present invention is characterized by using a mold including one mold and another mold, and including: A temperature rising step of raising the temperature of the molding die in the temperature rising step; a resin molding step of resin molding in the resin molding step; the resin molded article after resin molding is fixed in the one mold from the other The first demolding step of mold release; and the second demolding step of demolding the resin molded product from the one mold in the ejection stage, due to the other mold and the one mold The area of the surface of the one mold that is in contact with the resin is larger than the area of the surface that is in contact with the resin, so that the resin can be made in the first demolding step The molded product is released from the other mold while being fixed to the one mold.

In addition, in the following, the manufacturing method of the said 1st resin molded article of this invention and the manufacturing method of the said 2nd resin molded article of this invention may be collectively called "the manufacturing method of the resin molded article of this invention."

According to the present invention, it is possible to provide a resin molding device and a method of manufacturing a resin molded product that can form a molding die with a small number of parts.

1‧‧‧ substrate (frame)

1b‧‧‧Resin molded product (packaged substrate)

20‧‧‧cured resin

20a‧‧‧Board (resin material)

20b‧‧‧Melted resin (fluid resin)

20d, 20e, 20f‧‧‧‧Residual resin (useless resin parts, protrusions)

100, 110‧‧‧ Upper mold (another mold)

101, 111‧‧‧Up model cavity (another model cavity)

101a‧‧‧Up model cavity (another model cavity) 101 side

119‧‧‧slot (mounting slot for mold opening suppression member)

200, 210‧‧‧ Lower mold (one mold)

201, 211‧‧‧ Lower model cavity (one model cavity)

201a‧‧‧Lower model cavity (one model cavity) 201 side

202, 212‧‧‧Remnant parts (residual resin storage part, useless resin storage part, resin molded product fixing mechanism)

203‧‧‧Gate (resin runner, resin molded product fixing mechanism)

208‧‧‧slot (burr countermeasure slot)

213‧‧‧1st gate (resin runner)

214‧‧‧stream

215‧‧‧ 2nd gate (resin runner)

219‧‧‧slot (mounting slot for mold opening suppression member)

300‧‧‧ Mold opening suppression components

1000, 1010‧‧‧forming mold

2110‧‧‧Upper pressure plate (another pressure plate)

2111‧‧‧heater

2200‧‧‧Heating platform

2201‧‧‧heater

2210‧‧‧Lower pressure plate (one pressure plate)

2211‧‧‧heater

3100, 3120‧‧‧ Upper platen (another platen)

3101‧‧‧heater

3200, 3210, 3220 ‧‧‧ Lower platen (one platen)

3201, 3211, 3221 ‧‧‧ heater

3202, 3212, 3222 ‧ ‧ plunger driving mechanism (driving mechanism for fluid resin injection member)

3203, 3213, 3223‧ Plunger (fluid resin injection member)

3204, 3214, 3224 ‧‧‧ tank

3205, 3225‧‧‧slot (plunger slot, recess)

3216, 3226‧‧‧Resin input rod

3219, 3229‧‧‧Resin inlet

4000‧‧‧Removable rod for waste material (unused resin removal member)

4001‧‧‧Groove (rod groove, recessed part for discharging residual material)

5000, 5010‧‧‧ cooling platform

5001, 5011‧‧‧cooling mechanism (cold runner)

5002, 5012‧‧‧ Air supply hole

5100‧‧‧Heating platform

5101‧‧‧heater

5102‧‧‧Air supply hole

5200‧‧‧coolant supply mechanism

5201‧‧‧Piping (Piping for coolant supply)

5300‧‧‧Air supply mechanism

5301‧‧‧Piping (Piping for air supply)

6000‧‧‧Unloader (handling mechanism)

6001‧‧‧Cooling unit (resin molded product cooling mechanism)

7000‧‧‧Upper lifting mechanism

8000‧‧‧Heating platform

8001‧‧‧heater

8002‧‧‧Exit slot

a1, a11~a12, a21~a26 ‧‧‧ arrow indicating the moving direction of the lower die (one die) 200

b1‧‧‧ Arrow indicating the direction of rise of plunger 3203

b11, b12‧‧‧ Arrows indicating the ascending direction of plunger 3213

b13‧‧‧arrow indicating the direction of plunger 3213 down

b21, b22‧‧‧arrows indicating the rising direction of plunger 3223

c1, c21‧‧‧ indicates the rising direction of the rod 4000 arrow

c2, c22 ‧‧‧ arrow indicating the downward direction of the rod 4000

d1, d21‧‧‧ Arrow indicating the direction of rotation of the rod 4000

x1, x2, x11, x21 ‧‧‧ arrow indicating the direction of air supply from the air supply hole

A1, A2, A11, A12 ‧‧‧ indicates the rising direction of the lower platen (one platen) 2210

B1, B2, B11, B12 ‧‧‧ arrow indicating the downward direction of the lower platen (one platen) 2210

C1‧‧‧arrow indicating the upward direction of the lower platen (one platen) 3210

C11‧‧‧arrow indicating the ascending direction of lower pressure plate (one pressure plate) 3220

D1‧‧‧arrow indicating the downward direction of the lower pressure plate (one pressure plate) 3210

E1‧‧‧Arrow indicating the rising direction of the mold 1000

E11, E12‧‧‧arrows indicating the rising direction of the mold 1010

F1, F11‧‧‧ Arrow indicating the lowering direction of the upper die lifting mechanism 7000

F2, F12‧‧‧arrows indicating the upward direction of the upper die lifting mechanism 7000

S1‧‧‧Heating stage

S2‧‧‧Resin molding stage

S3‧‧‧Curing stage

S4‧‧‧Discharge stage

1A is a schematic cross-sectional view of a part of the structure of a resin molding apparatus of Example 1 and a part of steps of a method of manufacturing a resin molded article using the resin molding apparatus.

FIG. 1B is another part of the structure of the same resin molding device as FIG. 1A and A schematic cross-sectional view of another step of the method of manufacturing the same resin molded product as FIG. 1A.

1C is a schematic cross-sectional view of a modified example of the resin molding apparatus and the method of manufacturing a resin molded product of Example 1. FIG.

2A is a schematic cross-sectional view of a part of the structure of a resin molding apparatus of Example 2 and a part of steps of a method of manufacturing a resin molded article using the resin molding apparatus.

FIG. 2B is a schematic cross-sectional view of another part of the structure of the same resin molding device as FIG. 2A and another step of the method of manufacturing the same resin molded product as FIG. 2A.

2C is a schematic cross-sectional view of still another part of the structure of the same resin molding apparatus as FIG. 2A and another step of the method of manufacturing the same resin molded article as FIG. 2A.

3A is a schematic cross-sectional view of a part of the structure of a resin molding apparatus of Example 3 and a part of steps of a method of manufacturing a resin molded article using the resin molding apparatus.

3B is a schematic cross-sectional view of another part of the structure of the same resin molding device as FIG. 3A and another step of the method of manufacturing the same resin molded product as FIG. 3A.

3C is a schematic cross-sectional view of still another part of the structure of the same resin molding apparatus as FIG. 3A and another step of the method of manufacturing the same resin molded article as FIG. 3A.

FIG. 3D is a schematic diagram of another part of the structure of the same resin molding device as FIG. 3A and another step of the method of manufacturing the same resin molded product as FIG. 3A. Sectional view.

3E is a schematic cross-sectional view of another part of the structure of the same resin molding apparatus as FIG. 3A and another step of the method of manufacturing the same resin molded article as FIG. 3A.

FIG. 3F is a schematic cross-sectional view of still another part of the structure of the same resin molding apparatus as FIG. 3A and another step of the method of manufacturing the same resin molded article as FIG. 3A.

4 is a schematic diagram showing an outline of an example of a resin molding apparatus of the present invention and a method of manufacturing a resin molded product using the same.

5 is a schematic cross-sectional view of a modified example of the molding die.

6 is a schematic diagram of another modification of the molding die. FIG. 6(a) is a plan view, and FIG. 6(b) is a cross-sectional view.

7 is a schematic diagram of an example of the structure of a useless resin portion after resin molding. Fig. 7(a) is a side view, and Fig. 7(b) is a front view.

8(a) and (b) are each a schematic diagram showing an example of the relationship between the plunger form and the form of the unnecessary resin portion.

Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description.

In the resin molding apparatus of the present invention, for example, the other mold can be fixed in the resin molding stage, and the one mold can be moved between the stages while being detachable from the stages. .

In the resin molding apparatus of the present invention, for example, the tree The grease molding stage can further release the resin molded product from the other mold while being fixed to the one mold, and the discharge stage can enable the resin molded product from the one of the molding molds Mold release.

In the resin molding apparatus of the present invention, for example, both the one mold and the other mold can be attached to and detached from each of the stages, and can move between the stages.

In the resin molding apparatus of the present invention, for example, in the discharge stage, the resin molded product can be released from the other mold while being fixed to the one mold, and the resin molded product can be further removed from The one mold of the forming mold is demolded.

The resin molding apparatus of the present invention can further include, for example, a curing stage that cures the resin in the molding die.

The resin molding apparatus of the present invention can further include, for example, a fluid resin injection member that injects a fluid resin into one mold cavity, and a waste resin part removing member that removes the unnecessary resin part cured by the fluid resin, the fluid resin The injection member includes at least one of a convex portion and a concave portion on the contact surface with the fluid resin, and the unnecessary resin portion removing member includes a convex portion and a concave portion on the contact surface with the unnecessary resin portion At least one.

The resin molding apparatus of the present invention can further include a mold opening suppression member that suppresses mold opening of the one mold and the other mold, for example.

The resin molding apparatus of the present invention can further include, for example A temperature rising mechanism that raises the temperature of the mold and a resin molded article cooling mechanism that cools the resin molded article.

In the resin molding apparatus of the present invention, the one mold may or may not have a mold cavity (one mold cavity). Furthermore, in the resin molding apparatus of the present invention, the other mold may or may not have a mold cavity (another mold cavity). For example, in the resin molding apparatus of the present invention, the one mold may have a mold cavity (one mold cavity), and the other mold may not have a mold cavity. Furthermore, in the resin molding apparatus of the present invention, the one mold may have one mold cavity, and the other mold may have another mold cavity. That is, in the resin molding apparatus of the present invention, both the one mold and the other mold can be provided with mold cavities.

In the other mold of the resin molding apparatus of the present invention, the surface facing the one mold is, for example, a surface perpendicular to the mold opening direction. In addition, the surface opposed to the one mold also includes a surface other than the other mold cavity (for example, the surface of the remaining resin storage portion, the surface of the resin flow channel, etc.). In the one mold of the resin molding apparatus of the present invention, the surface opposed to the other mold is, for example, a surface perpendicular to the mold opening direction. In addition, the surface facing the other mold also includes a surface other than the one mold cavity (for example, the surface of the remaining resin storage portion, the surface of the resin flow channel, the flow channel surface, etc.).

The method for manufacturing a resin molded product of the present invention can perform the first mold release step in the resin molding stage, for example.

The method for manufacturing the resin molded product of the present invention can be In the discharging stage, the first demolding step is performed.

The method for manufacturing a resin molded product of the present invention can further include a resin curing step of curing the resin in the molding die in a curing stage, for example.

The method for manufacturing a resin molded product of the present invention can further include, for example, a fluid resin injection step of injecting a fluid resin into the one mold cavity using a fluid resin injection member; and removing the fluid resin curing using an unnecessary resin portion removing member A useless resin portion removing step of the formed useless resin portion, the fluid resin injection member having at least one of a convex portion and a concave portion on a contact surface with the fluid resin, the useless resin portion removing member at At least one of a convex portion and a concave portion is provided on the contact surface with the unnecessary resin portion.

In the method for manufacturing a resin molded article of the present invention, for example, in the molding step, the mold opening suppression member can be used to suppress mold opening of the one mold and the other mold.

In the method for manufacturing a resin molded article of the present invention, for example, in the mold release step, the resin molded article can be cooled while raising the temperature of the molding die.

In the method for manufacturing a resin molded product of the present invention, the one mold may or may not have a model cavity (one model cavity). Furthermore, in the method for manufacturing a resin molded product of the present invention, the other mold may or may not have a model cavity (another model cavity). For example, in the method for manufacturing a resin molded product of the present invention, the one The mold has a model cavity (one model cavity), and the other mold does not have a model cavity. Furthermore, in the method for manufacturing a resin molded product of the present invention, the one mold may have one mold cavity, and the other mold may have another mold cavity. That is, in the method for manufacturing a resin molded product of the present invention, both the one mold and the other mold can include a mold cavity.

In the other mold of the method for manufacturing a resin molded article of the present invention, the surface opposed to the one mold is, for example, a surface perpendicular to the mold opening direction. In addition, the surface opposed to the one mold also includes a surface other than the other mold cavity (for example, the surface of the remaining resin storage portion, the surface of the resin flow channel, etc.). In the one mold of the method for manufacturing a resin molded article of the present invention, the surface facing the other mold is, for example, a surface perpendicular to the mold opening direction. In addition, the surface facing the other mold also includes a surface other than the one mold cavity (for example, the surface of the remaining resin storage portion, the surface of the resin flow channel, the flow channel surface, etc.).

The manufacturing method of the resin molded article of this invention is performed, for example by using the said resin molding apparatus of this invention.

In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by molding only resin, or a resin molded product obtained by resin-sealing a component such as a wafer. In the present invention, the resin molded product may be, for example, an electronic component. Furthermore, in the present invention, the resin molded product may be, for example, a finished product or an unfinished semi-finished product.

In the present invention, "resin molding" or "resin encapsulation" For example, it means that the resin has been cured (hardened). However, in the present invention, "resin molding" or "resin encapsulation" is not limited to the above meaning, and may be, for example, a semi-cured (semi-cured) state in which the resin is not completely cured (cured). The semi-cured (semi-cured) state may be, for example, a cured (hardened) state to the extent that the resin can be released from the molding die or can be transported together with the molding die.

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. Also, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, as the form of the resin material before molding, for example, granular resin, fluid resin, sheet resin, plate resin, powder resin and the like can be exemplified. In the present invention, the fluid resin is not particularly limited if it is a fluid resin, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin refers to a resin that is liquid or has fluidity at room temperature, for example. In the present invention, the molten resin refers to a resin that becomes liquid or has a fluid state by melting, for example. As for the form of the resin, as long as it can be supplied to the cavity, pot, etc. of the molding die, other forms are also possible.

In addition, although the term “electronic accessory” refers to the case of a wafer before resin encapsulation and the case where a wafer has been resin-encapsulated, in the present invention, only the case of “electronic accessory” unless otherwise specified , Refers to the electronic parts (the finished electronic parts) where the wafer has been encapsulated by resin. In the present invention, "wafer" refers to the crystal before resin encapsulation For example, the chip may be an integrated circuit (IC), a semiconductor wafer, or a semiconductor element for power control. In the present invention, the wafer before resin encapsulation is called a "wafer" for convenience in order to distinguish it from the electronic accessories after resin encapsulation. However, the “wafer” of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in a wafer shape.

In the present invention, "flip-chip" refers to an integrated circuit (IC) wafer or an integrated circuit (IC) wafer having bump-shaped bump electrodes called bumps on electrodes (pads) on the surface of an integrated circuit (IC) wafer Kinds of wafer morphology. The wafer is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as a wafer for wireless bonding or as one of mounting methods.

In the present invention, for example, resin molding may be performed on both surfaces of the substrate to produce a resin molded product. In addition, for example, a resin package (resin molding) is applied to components (for example, wafers, flip chips, etc.) mounted on both sides of the substrate to manufacture a resin molded product. In the present invention, the substrate (also called an interposer) is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, a mounting substrate on which wafers are mounted on one surface or both surfaces as described above. The method of mounting the wafer is not particularly limited, and examples include wire bonding and flip chip bonding. In the present invention, for example, by encapsulating both sides of the mounting substrate with resin, the electronic component in which the wafer is encapsulated with resin can be manufactured. In addition, the use of the resin-encapsulated substrate by the resin encapsulating device of the present invention is not particularly limited, and examples include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control.

Also, in the present invention, "installation" includes "placement" Or "fixed". Further, in the present invention, "positioning" includes "fixing".

In addition, in the present invention, the "molding mold" is not particularly limited, and is a metal mold, a ceramic mold, or the like.

In addition, in the present invention, the method of manufacturing the resin molded product may be any molding method such as transfer molding, injection molding, compression molding, or the like. Furthermore, the resin molding device may be any resin molding device such as a transfer molding device, an injection molding device, a compression molding device, or the like. In Examples 1 to 3 described later, an example of manufacturing a resin molded product by transfer molding using a resin molding device as a transfer molding device will be shown.

As described above, the resin molding apparatus of the present invention includes other stages than the resin molding stage, and can carry the molding die in the other stages. FIG. 4 schematically shows the outline of this example. As shown in the figure, the resin molding apparatus includes a temperature rising stage S1, a resin molding stage S2, a curing stage S3, and a discharge stage S4. Then, the molding die 1000 is moved between the stages in the above-described order to produce the resin molded product 1b. After that, the molding die 1000 can be returned to the temperature rising stage S1 again and the same method of manufacturing the resin molded product can be implemented again. By using a structure in which the molding die is circulated between the stages as described above, for example, it is possible to reduce the number of parts of the molding die and reduce the manufacturing time and cost of the molding die.

However, FIG. 4 is only an example, and the present invention is not limited to this. For example, in the resin molding apparatus of the present invention, the curing stage S3 is optional and may be optional. Examples 1 and 2 described below show examples where the curing stage is not used, and examples 3 described below show examples where the curing stage is used child. In addition, the structure of the mold 1000 in FIG. 4 is only an example, and the structure of the mold of the resin molding apparatus of the present invention is not limited to this. In addition, as shown in the figure, the molding die 1000 of FIG. 4 includes an upper die (another die) 100 and a lower die (one die) 200. The upper mold 100 has an upper mold cavity (another mold cavity) 101 on the lower surface side, and the lower mold 200 has a lower mold cavity (one mold cavity) 201 on the upper surface side. The lower mold 200 is provided with a residual part (residual resin storage part) 202 on the lower surface side. The residual material portion 202 is connected to the lower surface of the lower mold cavity 201 through a gate (resin runner) 203. As far as the forming mold 1000 is concerned, for example, the upper mold (another mold) 100 can be fixed at the resin molding stage, and only the lower mold (one mold) 200 can be installed and removed with respect to each of the stages, while being able to be installed between the stages mobile. In addition, for the molding die 1000, for example, both the upper die (another die) 100 and the lower die (one die) 200 can be attached to and detached from each of the stages, and can be moved between the stages. In addition, the resin molded article 1b of FIG. 4 is a resin (cured resin) 20 that is resin-molded on both sides of the substrate 1. However, the structure of the resin molded product that can be manufactured in the present invention is not limited to the structure of the resin molded product 1b of FIG. 4.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of description, each drawing is schematically drawn by appropriately omitting, exaggerating, etc.

[Example 1]

In this embodiment, an example of a resin molding apparatus and an example of a method of manufacturing a resin molded product using the same are described.

In steps (a) to (f) of FIG. 1A and steps (g) to (n) of FIG. 1B In the figure, a part of the structure of the resin molding apparatus of this embodiment and the steps of the method of manufacturing the resin molded article using the resin molding apparatus are schematically shown. In addition, in steps (l1) to (o1) of FIG. 1C, a modification of the resin molding apparatus and the method of manufacturing a resin molded product of FIGS. 1A and 1B is shown. In addition, FIGS. 1A, 1B, and 1C are diagrams in which FIG. 1 is divided into three parts and illustrated for convenience. Hereinafter, some or all of FIGS. 1A, 1B, and 1C are sometimes referred to as "FIG. 1".

The resin molding apparatus of this embodiment includes a molding die, a temperature rising stage, a resin molding stage, and a discharge stage as described later. In addition, as will be described later, the upper mold (another mold) of the molding die is fixed at the resin molding stage, and the lower mold (one mold) can be attached to and detached from each of the stages. Move between stages.

The method of manufacturing the resin molded product shown in steps (a) to (n) of FIG. 1 can be performed as follows. First, as shown in (a) of FIG. 1, a lower mold (one mold) 200 is prepared. As shown in the figure, the lower mold 200 has a lower mold cavity (one mold cavity) 201 on the upper surface side. In addition, the lower mold 200 is provided with a residue portion (residual resin storage portion) 202 on the lower surface side. The residual material portion 202 is connected to the lower mold cavity 201 through a gate (resin runner) 203. The lower mold 200 can be attached to and detached from each stage of the temperature rising stage, the resin molding stage, and the discharge stage, and can move between the stages.

Next, as shown in (b) of FIG. 1, the lower mold 200 is heated up (heating up step). Specifically, first, the lower mold 200 is moved to the temperature rising stage. As shown in (b) of FIG. 1, this temperature raising stage includes a temperature raising stage 2200. The temperature rising table 2200 includes a heater 2201 inside. The heater 2201 is not particularly limited, for example, Therefore, cartridge heaters and so on. Then, as shown in the figure, the substrate (frame) 1 is supplied on the upper surface of the lower mold 200 in a state where the lower mold 200 is placed on the temperature rising table 2200. Then, in this state, the lower mold 200 and the substrate 1 are heated by the temperature raising stage 2200 and the heater 2201. In addition, a through hole (not shown) may be provided in the substrate 1, for example. For example, through the through-hole of the substrate 1, the fluid resin can flow from the lower mold cavity (one mold cavity) 201 side to the upper mold cavity (the other mold cavity) 101 side as described later.

Then, as shown in (c) of FIG. 1, after the lower mold 200 and the substrate 1 are heated, the lower mold 200 and the substrate 1 are moved to the resin molding stage.

Next, as shown in (d) to (i) of FIG. 1, resin molding is performed in the resin molding stage (resin molding step). In this embodiment, as described later, in the resin molding stage, the resin after resin molding is fixed to the lower mold (one mold) 200 by a resin molded product fixing mechanism (residual part 202 and gate 203). 100 is demolded from the upper mold (another mold) in the state (first demolding step).

As shown in (d) of FIG. 1, the resin molding stage of the resin molding apparatus includes an upper platen (another platen) 3100 and a lower platen (one platen) 3200. The upper platen 3100 includes a heater 3101 inside, and the lower platen 3200 includes a heater 3201 inside. The heaters 3101 and 3201 are not particularly limited, and may be, for example, a cartridge heater. As shown in the figure, the upper platen 3100 has an upper mold (another mold) 100 fixed to its lower surface. The upper mold 100 includes an upper mold cavity (another mold cavity) 101 on the lower surface side. Further, as shown in the figure, the lower platen 3200 includes a can body 3204 in which the plate (resin material) 20a can be accommodated. And, the resin molding stage as shown in the figure further includes a plunger A drive mechanism (fluid resin injection member drive mechanism) 3202 and a plunger (fluid resin injection member) 3203 are provided. By driving the plunger 3203 by the plunger driving mechanism 3202, a fluid resin can be injected into the lower mold cavity (one mold cavity) 201 as described later. As shown in the figure, the plunger 3203 is provided with a groove (recess) 3205 on the contact surface with the fluid resin.

As shown in (d) of FIG. 1, the lower mold 200 and the substrate 1 are transported in the direction of arrow a1 and moved between the upper platen 3100 and the lower platen 3200 in the resin molding stage. For the transportation of the lower mold 200, for example, a transportation mechanism (not shown) can be used. Then, as shown in (d) of FIG. 1, the plate (resin material) 20 a is supplied to the can body 3204.

Then, as shown in FIG. 1(e), the lower mold 200 is fixed to the lower platen 3200, and the resin material 20a is accommodated in the can body 3204. In this state, the upper mold 100 and the lower mold 200 of the mold 1000 are preferably heated to a moldable temperature.

Further, as shown in (f) of FIG. 1, the upper mold 100 and the lower mold 200 of the mold 1000 are closed. At this time, as shown in the figure, the resin material 20a in the can body 3204 is melted into the molten resin (fluid resin) 20b by the lower mold 200 which has been heated up.

Next, as shown in (g) of FIG. 1, the plunger 3203 is raised in the direction of arrow b1 by the plunger drive mechanism 3202. Thus, as shown in the figure, the fluid resin 20b is filled into the lower mold cavity 201 through the residual material portion (useless resin containing portion) 202 and the gate (resin runner) 203, and further through the through hole of the substrate 1 (not (Illustration) is also filled into the upper mold cavity 101. At this time, due to the presence of the residue portion 202 and the gate 203, even if the volume of the fluid resin 20b varies It is also possible to suppress or prevent changes in the resin pressure in the upper mold cavity 101 and the lower mold cavity 201.

In addition, the residual part (useless resin accommodating part) 202 and the gate (resin runner) 203 function as a “resin molded product fixing mechanism” for fixing the resin molded resin to the lower mold 200 as described later. However, the resin molding die of the resin molding device of the present invention is not limited to the form provided with the resin molded article fixing mechanism. For example, regarding the resin molding die of the resin molding device of the present invention, in addition to or in place of the resin molded article fixing mechanism, the Compared with the area of the surface of one mold that is in contact with the resin, the area of the surface of the one mold that is opposite to the other mold and in contact with the resin is larger, so that the resin after molding the resin can be fixed at The state of the one mold is released from the other mold. Specifically, for example, as shown in FIG. 1(g), the inclination angle (slope angle) of the side surface 201a of the lower mold cavity (one mold cavity) 201 and the side surface 101a of the upper mold cavity (the other mold cavity) 101 may be different . In the same figure, the inclination angle of the side surface 101a of the upper mold cavity 101 is gentler and closer to the level than the side surface 201a of the lower mold cavity 201. Thus, compared to the area of the surface of the upper mold (another mold) 100 that faces the lower mold (one mold) 200 and is in contact with the resin (that is, the upper surface of the upper mold 100), the lower mold (one mold) The area on the surface of the surface of 200 that is opposite to the upper mold (another mold) 100 and that is in contact with the resin (that is, the bottom surface of the lower mold 200) is larger. That is, the surface of the upper mold 100 that is perpendicular to the mold opening direction and in contact with the resin (the upper surface of the upper mold 100) is larger than the surface of the lower mold 200 that is perpendicular to the mold opening direction and is in contact with the resin ( The area of the bottom surface of the lower mold 200 is larger. Therefore, in the figure In the mold 1000 of 1, the resin molded product is easily fixed to the lower mold 200 when the mold is opened. Furthermore, in the present invention, the area of the surface of the other mold that is opposite to the one mold and that is in contact with the resin is opposite to the area of the surface of the other mold that is in contact with the resin. The specific example in which the area of the contact surface is larger is not limited to this. For example, since the area of the bottom surface of one mold cavity is larger than the area of the bottom surface of the other mold cavity, the resin molded product can be easily fixed to the one mold. Furthermore, for example, even if the shape of one model cavity and the other model cavity are the same, it is possible to easily fix the resin molded product to the one mold by making one model cavity larger than the other model cavity.

Then, as shown in FIG. 1(h), after the fluid resin 20b is cured (hardened), the upper mold 100 and the lower mold 200 are opened. In addition, the method of curing (hardening) the fluid resin 20b is not particularly limited, and a known method can be appropriately used. For example, when the fluid resin 20b is a thermosetting resin, the fluid resin 20b can be cured (hardened) by continuously heating the upper mold 100 and the lower mold 200. In addition, for example, when the fluid resin 20b is a thermoplastic resin, the fluid resin 20b can be cured (hardened) by cooling or naturally cooling the upper mold 100 and the lower mold 200. In (h) of FIG. 1, the fluid resin 20 b in the upper mold cavity 101 and the lower mold cavity 201 is cured to become the cured resin 20. Then, the resin in the stub (residual resin accommodating part) 202 and the gate (resin runner) 203 is cured to become the remaining resin (useless resin part) 20d. The portion of the unnecessary resin portion 20d that is cured in the plunger groove (recess) 3205 becomes a protruding unnecessary resin portion (protrusion) 20e.

Here, the shapes of the residual material portion 202 and the gate 203 (resin molded product fixing mechanism) are as shown in the figure, and become thinner as they go upward. Thus, as shown in Figure 1 (h) As shown, when the mold is opened, in a state where the resin molded product (cured resin 20 and the substrate 1) connected to the unnecessary resin portion 20d is fixed to the lower mold 200, only the upper mold 100 is removed from the resin molded product (cured resin 20 and the Substrate 1) Demolding (first demolding step).

Next, as shown in (i) of FIG. 1, the lower mold 200 is conveyed out of the resin molding stage together with the resin molded product and the unnecessary resin portion 20d.

Further, as shown in (j) to (l) of FIG. 1, the unnecessary resin portion 20d is removed from the resin molded product in the residual material discharge step (useless resin portion removal step) (useless resin removal step).

As shown in (j) of FIG. 1, the residual material discharge stage (useless resin part removal stage) of the resin molding apparatus includes a residual material discharge rod (useless resin part removal member) 4000. The residue discharge rod 4000 includes a groove (recess) 4001 having the same shape and size as the plunger groove 3205 on the contact surface with the unnecessary resin portion 20d.

As shown in (j) of FIG. 1, the rod 4000 for residual material discharge is raised in the direction of arrow c1. Thereby, as shown in (k) of FIG. 1, the residue discharge lever 4000 is brought into contact with the unnecessary resin portion 20d. At this time, as shown in the figure, the unnecessary resin portion (protrusion) 20e fits into the groove (recess) 4001 of the residue discharge lever. In this state, as shown in the figure, the rod 4000 for residual material discharge is rotated in the direction of arrow d1. Thus, the unnecessary resin portion 20d is twisted off and separated from the cured resin 20 in the lower mold cavity 201.

Thereafter, as shown in (l) of FIG. 1, the rod 4000 for residual material discharge is lowered in the direction of arrow c2. As a result, as shown in the figure, the useless resin portions 20d and 20e connected to the residue discharge rod 4000 descend, and from the lower mold cavity 201 The cured resin 20 in is completely separated. As a result, as shown in the figure, a resin molded product 1b in which both surfaces of the substrate 1 are resin-molded with the cured resin 20 is manufactured.

Next, the lower mold 200 and the resin molded product 1b are moved to the discharge stage together. Then, as shown in (m) and (n) of FIG. 1, in the discharge stage, the resin molded product 1 b is released from the lower mold 200 (second release step).

As shown in (m) of FIG. 1, the discharge stage of the resin molding apparatus includes a cooling stage 5000. The cooling stage 5000 includes a cooling mechanism (cold flow path) 5001 inside. In addition, the cooling stage 5000 is provided with air supply holes 5002 penetrating from the upper surface to the lower surface of the cooling stage 5000 at positions corresponding to the residual material portion 202 and the gate 203 of the lower mold 200.

As shown in FIG. 1(m), the lower mold 200 and the resin molded product 1b are placed on the cooling stage 5000 together. In this state, the lower mold 200 and the resin molded product 1b are cooled by the cooling table 5000 and the cold runner 5001.

In the case of this embodiment, the resin molded product (package) 1b is larger than the lower mold 200 in terms of shrinkage due to cooling. Therefore, if cooling is performed in the state of (m) of FIG. 1, a gap will be formed between the cured resin 20 of the resin molded product 1 b and the lower mold cavity 201. This makes it easy to release the resin molded product 1 b from the lower mold 200. However, the present invention is not limited to this. For example, in the present invention, in the demolding step of the method of manufacturing a resin molded product, the mold may be heated (increased in temperature) in addition to or in place of the mold cooling. In addition, the resin molded product may be cooled or heated (heated) in the demolding step. In addition, in the demolding step, each of the molding die and the resin molded product may or may not be cooled, and may or may not be heated (elevated temperature). And, as mentioned above, in this embodiment, the shrinkage due to cooling In other words, the resin molded product (package) 1b is larger than the lower mold 200. However, the present invention is not limited to this. Depending on the thermal expansion coefficient of the molding die and the resin after resin molding, the shrinkage due to cooling may sometimes be different from the foregoing. In this case, for example, in the demolding step, a method different from this embodiment can be used.

Further, as shown in (n) of FIG. 1, air is supplied so as to blow the resin molded product 1b from the air supply hole 5002 in the direction of the arrow x1, that is, from bottom to top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. As a result, the resin molded product 1b is released from the lower mold 200.

In this embodiment, the resin molded product 1b can be manufactured as described above.

Next, FIG. 1C shows a modification of the method of manufacturing the resin molded article of this embodiment. In this modification, first, the steps up to (a) to (l) of FIG. 1 are performed in the same manner as described above (not shown). Thereafter, the second demolding step is performed as steps (l1) to (o1) shown in FIG. 1C. details as follows.

First, (l1) of FIG. 1 shows the state of the lower mold 200 immediately after the step of (l) of FIG. 1 is completed. As shown in the figure, a resin molded product 1 b is placed on the lower mold 200. The unnecessary resin portion 20d is separated and removed from the resin molded product 1b. This molding die (lower mold 200) and the resin molded product 1b are moved to the discharge stage, and as shown in (m1) to (o1) of FIG. 1, the resin molded product 1b is released from the lower mold 200.

As shown in (m1) of FIG. 1, this discharge stage includes a temperature rising table 5100 instead of a cooling table 5000. The temperature rising table 5100 includes a heater 5101 inside. The heater 5101 is not particularly limited, and may be, for example, a cartridge heater. In addition, the temperature-increasing stage 5100 corresponds to the residual part 202 and the gate 203 of the lower mold 200. Is provided with an air supply hole 5102 penetrating from the upper surface to the lower surface of the temperature rising table 5100.

As shown in (m1) of FIG. 1, the lower mold 200 and the resin molded product 1b are placed on the temperature rising table 5100 together. In this state, the lower mold 200 and the resin molded product 1b are heated by the temperature raising table 5100 and the heater 5101 (temperature raising mechanism).

Then, in this state, as shown in (n1) of FIG. 1, the resin molded article 1b is cooled. Specifically, as shown in the figure, the cooling unit 6001 of the unloader (conveying mechanism) 6000 provided with the cooling unit (resin molded product cooling mechanism) 6001 is brought into contact with the resin molded product 1b and cooled. The cooling part 6001 is not particularly limited, and may be a Peltier element, for example. In this way, by raising the temperature of the molding die (lower die 200) while cooling the resin molded article 1b, the lower die 200 will expand and the resin molded article 1b will shrink. Thus, a gap can be formed between the cured resin 20 of the resin molded product 1b and the lower mold cavity 201. Therefore, the resin molded product 1b is easily released from the lower mold 200. In this state, as shown in the figure, air is supplied so as to blow the resin molded product 1b from the air supply hole 5102 in the direction of the arrow x2, that is, from the bottom to the top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thus, the resin molded product 1b is released from the lower mold 200 (second release step).

Then, as shown in (o1) of FIG. 1, the resin molded product 1b demolded from the lower mold 200 is conveyed out of the discharge stage using an unloader 6000.

[Example 2]

Next, another embodiment of the present invention will be described.

In Example 1, it is shown that the upper mold (another mold) 100 is fixed to the resin molding stage, and the lower mold (one mold) 200 can be installed and removed with respect to each stage of the resin molding apparatus, while being able to move between the stages example of. On the other hand, in this example (Example 2), both the lower mold (one mold) 200 and the upper mold (the other mold) 100 showing the molding mold 1000 can be attached and detached to each stage of the resin molding apparatus , An example of being able to move between stages at the same time.

Steps (a) to (f) of FIG. 2A, steps (g) to (m) of FIG. 2B, and steps (n) to (s) of FIG. 2C schematically show a part of the structure of the resin molding apparatus of this embodiment And the steps of the method for manufacturing a resin molded product using the resin molding device. In addition, (q1) of FIG. 2C shows a modification. In addition, FIGS. 2A, 2B, and 2C are diagrams illustrating that FIG. 2 is divided into three parts for convenience. Hereinafter, some or all of FIGS. 2A, 2B, and 2C are sometimes referred to as "FIG. 2".

The method of manufacturing the resin molded product shown in steps (a) to (s) of FIG. 2 can be performed as follows. First, as shown in (a) of FIG. 2, a mold 1000 is prepared. This molding die 1000 includes an upper die (another die) 100 and a lower die (one die) 200 in the same manner as in Example 1, and has the same structure as in Example 1. In addition, as shown in the figure, the structures of the upper mold 100 and the lower mold 200 are also the same as in the first embodiment.

Next, the molding die 1000 is moved to the temperature rising stage of the resin molding apparatus, and as shown in (b) to (f) of FIG. 2, the molding die 1000 is heated in the temperature rising stage (temperature rising step).

As shown in (b) of FIG. 2, the temperature rising stage of the resin molding device The upper platen (other platen) 2110 and the lower platen (one platen) 2210 are included. The upper platen 2110 includes a heater 2111 inside. The lower platen 2210 includes a heater 2211 inside. The heater 2111 and the heater 2211 are not particularly limited, and may be, for example, a cartridge heater.

First, as shown in (b) of FIG. 2, the lower mold 200 is fixed to the lower platen 2210. At this time, the upper mold 100 is placed on the lower mold 200. That is, the molding die 1000 is placed on the lower platen 2210 as a whole.

Next, as shown in (c) of FIG. 2, the lower platen 2210 is raised in the direction of arrow A1. Then, as shown in the figure, the upper mold 100 is fixed to the lower surface of the upper platen 2110. In addition, the method of fixing the lower mold 200 to the lower platen 2210 and the method of fixing the upper mold 100 to the lower surface of the upper platen 2110 are not particularly limited. For example, an electrostatic chuck or a mechanical chuck can be used.

Further, as shown in FIG. 2( d ), the lower platen 2210 is lowered in the direction of arrow B1, the mold 1000 is opened, and the substrate (frame) 1 is supplied to the mold 1000. In the same figure, although the substrate 1 is fixed to the lower surface of the upper mold 100, it is not limited to this, and may be placed on the upper surface of the lower mold 200, for example. As shown in the figure, when the substrate 1 is fixed to the lower surface of the upper mold 100, the method is not particularly limited. For example, the upper mold 100 can be provided with an upper mold substrate holding portion (not shown) to fix the substrate 1. The upper mold substrate holding portion is not particularly limited, and may be, for example, a substrate holding member (substrate clamp) holding the substrate 1. Alternatively, for example, a suction hole is provided in the upper mold, a suction mechanism (not shown) is connected to the suction hole, and the substrate 1 is suction-fixed to the upper mold 100 by suction from the suction hole. The suction mechanism is not particularly limited, and may be, for example, a decompression pump or the like. Furthermore, the substrate 1 may be the same the same.

Then, as shown in (e) of FIG. 2, the lower platen 2210 is raised in the direction of arrow A2 to close the molding die 1000. In this state, the heaters 2111 and 2211 can be operated to raise the temperature of the mold 1000 and the substrate 1. Alternatively, the heaters 2111 and 2211 may be operated in advance before the molding die 1000 is placed on the lower platen 2210 to increase the temperature of the molding die 1000 and the substrate 1.

Next, the fixing of the lower mold 200 and the lower pressure plate 2210 and the fixing of the upper mold 100 and the upper pressure plate 2110 are released. Then, as shown in (f) of FIG. 2, the lower pressure plate 2210 is lowered and the lower pressure plate 2210 and the upper pressure plate 2110 are opened to move the molding die 1000 to the resin molding stage.

Next, as shown in (g) to (m) of FIG. 2, resin molding is performed in the resin molding stage (resin molding step).

As shown in (g) of FIG. 2, the resin molding stage of the resin molding apparatus includes an upper platen (other platen) 3100 and a lower platen (one platen) 3210. The upper pressure plate 3100 is the same as the upper pressure plate 3100 of Example 1 except that the upper mold 100 is not fixed. The upper platen 3100 includes the heater 3101 in the same manner as in the first embodiment, and the lower platen 3210 includes the heater 3211 in the interior. The heaters 3101 and 3211 are not particularly limited, and may be, for example, cartridge heaters. As shown in the figure, the lower platen 3210 includes a can body 3214 and can accommodate the plate (resin material) 20a therein. The lower platen 3210 has a resin inlet 3219 connected to the tank 3214 on its side. In addition, for example, a heat insulating material may be arranged around the resin inlet 3219 for heat insulation. In addition, as shown in the figure, the resin molding stage further includes a plunger driving mechanism (fluid resin injection member driving mechanism) 3212 and a plunger (fluid resin injection mechanism) Pieces) 3213. By driving the plunger 3213 by the plunger driving mechanism 3212, as will be described later, a fluid resin can be injected into the lower mold cavity (one mold cavity) 201. Further, unlike the plunger 3203 of Example 1, the contact surface of the plunger 3213 with the fluid resin has no grooves (recesses) and is flat.

First, as shown in (g) of FIG. 2, the plate (resin material) 20 a is supplied (dropped) to the tank 3214 from the resin drop port 3219 through the resin drop bar 3216. Then, as shown in the figure, the mold 1000 and the substrate 1 are transported in the direction of arrow a11 and moved between the lower platen 3210 and the upper platen 3100.

Next, as shown in (h) of FIG. 2, the molding die 1000 is fixed to the lower platen 3210. Then, as shown in the figure, the plunger 3213 is raised in the direction of the arrow b11, and the plate (resin material) 20a is pushed up above the resin inlet 3219. At this time, since the resin input lever 3216 is still inserted into the resin input port 3219, the plate (resin material) 20a does not overflow from the resin input port 3219. In addition, the shape of the resin input rod 3216 is not particularly limited. For example, as shown in the figure, if the front end of the resin injection rod 3216 is circular, when the plunger 3213 is raised in the direction of arrow b11, the plunger 3213 can be suppressed or prevented from being caught at the front end of the resin injection rod 3216.

Next, as shown in (i) of FIG. 2, the lower platen 3210 is raised in the direction of arrow C1. Thus, as shown in the figure, the mold 1000 is sandwiched between the lower platen 3210 and the upper platen 3100. In this state, since the molding die 1000 is heated by the temperature raising step, and the heaters 3101 and 3211 are heated by the upper platen 3100 and the lower platen 3210, the resin material 20a is heated to a temperature that can be melted. As a result, as shown in the figure, the resin material 20a in the can body 3214 is melted into a molten resin (fluid resin) 20b.

Next, as shown in (j) of FIG. 2, the plunger 3213 is raised in the direction of arrow b12 by the plunger drive mechanism 3212. Thus, as shown in the figure, the fluid resin 20b is filled into the lower mold cavity 201 and the upper mold cavity 101. The mechanism by which the fluid resin 20b is filled into the lower mold cavity 201 and the upper mold cavity 101 is the same as that of Embodiment 1, for example.

Then, as shown in (k) of FIG. 2, the fluid resin 20 b is cured (hardened), and the cured resin 20 and the unnecessary resin portion 20 d are formed in the same manner as in Example 1. The method of curing (hardening) the fluid resin 20b is the same as in Example 1, for example. Thereafter, as shown in the figure, the lower pressure plate 3210 is lowered in the direction of the arrow D1, and the upper mold 100 and the upper pressure plate 3100 are separated.

Next, as shown in (1) of FIG. 2, the mold 1000 and the resin molded product 1b (substrate 1 and cured resin 20) are lifted together in the direction of arrow E1 by a conveyance mechanism (not shown) or the like. At this time, as shown in the figure, the unnecessary resin portion 20d remains on the lower platen 3210 and is separated from the resin molded product 1b. This is because the bottom surface of the unnecessary resin portion 20d (the surface where the lower pressure plate 3210 and the plunger 3213 contact the unnecessary resin portion 20d) is set to a larger area than the surface where the unnecessary resin portion 20d contacts the cured resin 20, and the residual portion 202 And the shape of the gate 203 is set to a tapered shape that expands toward the bottom surface of the unnecessary resin portion 20d. Then, as shown in the figure, the mold 1000 and the resin molded product 1b are moved together in the direction of arrow a12 and transported out of the molding stage to move to the discharge stage.

On the other hand, as shown in FIG. 2(m), the plunger 3213 is lowered in the direction of the arrow b13 and the unnecessary resin portion 20d is separated. The unnecessary resin portion 20d is transported and discharged out of the molding stage by a transport mechanism (not shown) or the like.

Further, as shown in (n) to (s) of FIG. 2, the resin molded product 1 b is released from the molding die 1000 in the discharge stage. This step will be described later and includes the first demolding step of demolding the cured resin 20 after molding the resin from the upper mold (the other mold) 100 in a state of being fixed to the lower mold (one mold) 200, and removing The second mold release step of releasing the resin molded product 1b from the mold 1000 (lower mold 200).

As shown in (n) of FIG. 2, the discharge stage provided in the resin molding apparatus includes a cooling table 5000 and an upper mold lifting mechanism (upper mold lifting portion) 7000. The cooling stage 5000 includes the cooling mechanism (cold flow path) 5001 and the air supply hole 5002 in the same manner as in the first embodiment, and has the same structure as the cooling stage 5000 of the first embodiment.

In addition, as shown in FIG. 2(n), with respect to the molding die 1000, the side 101a of the upper mold cavity 101 has a gentler slope angle and is closer to the level than the side 201a of the lower mold cavity 201. This makes it easier to fix the resin molded product in the lower mold 200 compared to the upper mold 100. Therefore, as described later, the cured resin 20 after resin molding can be released from the upper mold (other mold) 100 in a state of being fixed to the lower mold (one mold) 200.

Figure 2 (n) ~ (s) of the demolding step (the first demolding step and the second demolding step) First, as shown in Figure 2 (n), the lower surface of the lower mold 200 is fixed to the cooling table 5000 on. In this state, the mold 1000 and the resin molded product 1b are cooled by the cooling table 5000 and the cold runner 5001. At this time, as in Example 1, the resin molded product (package) 1b is larger than the lower mold 200 in terms of shrinkage due to cooling. Therefore, if cooling is performed in the state of (n) of FIG. 2, between the cured resin 20 of the resin molded product 1b and the upper mold cavity 101, and A gap is formed between the cured resin 20 and the lower mold cavity 201. This makes it easy to release the resin molded product 1b from the mold 1000. However, as described in Embodiment 1, the present invention is not limited to this.

Then, as shown in (n) of FIG. 2, the upper die lifting mechanism 7000 is lowered in the direction of arrow F1. Thereby, as shown in (o) of FIG. 2, the upper mold 100 is brought into contact with and fixed to the lower surface of the upper mold lifting mechanism 7000. Further, as shown in (o) of FIG. 2, the upper mold lifting mechanism 7000 is raised in the direction of arrow F2. Thus, as shown in (p) of FIG. 2, the upper mold 100 is lifted up. At this time, as described above, since the inclination angle of the side surface 101a of the upper mold cavity 101 is gentler than the side surface 201a of the lower mold cavity 201, the resin molded product 1b is easily fixed to the lower mold 200. And, as shown in the figure, compared with the area of the upper surface of the upper mold cavity 101 (the surface on the upper mold cavity 101 that is opposite to the lower mold 200 and perpendicular to the mold opening direction), the bottom surface of the lower mold cavity 201 (in the lower mold The area of the cavity 201 that is opposite to the upper mold 100 and perpendicular to the mold opening direction is larger, so the cured resin 20a on the lower mold 200 side is easier to fix than the cured resin 20a on the upper mold 100 side. As a result, the resin The molded product 1b is easily fixed to the lower mold 200. Therefore, as shown in (p) of FIG. 2, the cured resin 20 after resin molding can be demolded from the upper mold (other mold) 100 in the state of being fixed to the lower mold (one mold) 200 (first demolding step) .

Further, as shown in (q) of FIG. 2, air is supplied so as to blow the resin molded product 1b from the air supply hole 5002 in the direction of the arrow x11, that is, from the bottom to the top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thus, the resin molded product 1b is released from the lower mold 200 (second release step). After that, by the unloader (transport mechanism, not shown) (Shown) etc. to transport the resin molded product 1b out of the discharge stage. In this way, the resin molded article 1b can be manufactured.

On the other hand, after the resin molded product 1b is carried out of the discharge stage, the upper mold lifting mechanism 7000 is lowered. Then, as shown in (r) of FIG. 2, the upper mold 100 and the lower mold 200 are closed again.

After that, only the upper mold lifting mechanism 7000 is raised and separated from the upper mold 100 as shown in (s) of FIG. 2. Thereafter, the molding die 1000 is transported out of the discharge stage by a transport mechanism (not shown) or the like. By carrying the molding die 1000 again to the temperature rising stage, the method of manufacturing the resin molded article in the same steps as (a) to (s) of FIG. 2 can be performed again.

In addition, as a modification of the discharge stage and the demolding step (the first demolding step and the second demolding step) shown in (n) to (s) of FIG. 2, as shown in (q1) of FIG. 2, Instead of the cooling stage 5000, a temperature raising stage 5100 and a cooling unit 6001 are used. The temperature rise table 5100 shown in (q1) of FIG. 2 includes the heater 5101 and the air supply hole 5102 in the same manner as in the first embodiment, and has the same structure as the temperature rise table 5100 of the first embodiment. In addition, the unloader (conveying mechanism) 6000 shown in (q1) of FIG. 2 includes the cooling unit 6001 in the same manner as in the first embodiment, and has the same structure as the unloader (conveying mechanism) 6000 in the first embodiment. First, the procedure similar to (n) to (p) of FIG. 2 is performed except that the temperature raising stage 5100 is used instead of the cooling stage 5000. Thereafter, as shown in (q1) of FIG. 2, the cooling part 6001 of the unloader (conveying mechanism) 6000 is brought into contact with the resin molded product 1b and cooled. By raising the temperature of the molding die (lower die 200) as described above while cooling the resin molded article 1b, the lower die 200 will expand and the resin molded article 1b will shrink. Thus, a gap can be formed between the cured resin 20 of the resin molded product 1b and the lower mold cavity 201 Gap. Therefore, the resin molded product 1b is easily released from the lower mold 200. In this state, as shown in the figure, in the direction of arrow x11 from the air supply hole 5102,

That is, air is supplied by blowing the resin molded product 1b from bottom to top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thus, the resin molded product 1b is released from the lower mold 200 (second release step). Thereafter, the resin molded product 1b demolded from the lower mold 200 is conveyed by the unloader 6000 to the outside of the discharge stage (not shown).

[Example 3]

Next, other embodiments of the present invention will be described.

In this embodiment, an example of further using the curing stage will be described. In addition, an example of further using the mold opening suppression member will be described.

Steps (a) to (z2) of FIGS. 3A to F schematically show a part of the structure of the resin molding apparatus of the present embodiment and the steps of the method of manufacturing a resin molded article using the resin molding apparatus. In addition, FIGS. 3A to 3F are diagrams in which FIG. 3 is divided into 6 parts and illustrated for convenience. Hereinafter, some or all of FIGS. 3A to 3F are sometimes referred to as “FIG. 3”.

The method of manufacturing the resin molded product shown in steps (a) to (z2) of FIG. 3 can be performed in the following manner. First, as shown in FIG. 3(a), a mold 1010 is prepared. As shown in the figure, the forming mold 1010 includes an upper mold (another mold) 110 and a lower mold (one mold) 210. The upper mold 110 has an upper mold cavity (another mold cavity) 111 on the lower surface side, and the lower mold 210 includes a lower mold cavity (one mold cavity) 211 on the upper surface side. The lower mold 210 is provided on the lower surface side The residual material part (residual resin storage part) 212. In addition, the lower mold 210 includes a flow channel 214 on the upper surface side. The residual part 212 is connected to the lower surface of the runner 214 via a first gate (resin runner) 213. The runner 214 is connected to the side surface of the lower mold cavity 211 via a second gate (resin runner) 215. In addition, the upper mold 110 and the lower mold 210 are provided with grooves (mold opening suppressing member mounting grooves) 119 and 219 on the left and right side surfaces, respectively.

Next, the molding die 1010 is moved to the temperature rising stage of the resin molding apparatus, and as shown in (b) to (f) of FIG. 3, the molding die 1010 is heated in the temperature rising stage (temperature rising step).

As shown in FIG. 3(b), the temperature rising stage of the resin molding apparatus includes an upper platen (other platen) 2110 and a lower platen (one platen) 2210. As in Embodiment 2, the upper platen 2110 includes a heater 2111 inside, and the lower platen 2210 includes a heater 2211 inside.

First, as shown in FIG. 3(b), the lower mold 210 is fixed to the lower platen 2210. At this time, the upper mold 110 is placed on the lower mold 210. That is, the molding die 1010 is placed on the lower platen 2210 as a whole.

Next, as shown in (c) of FIG. 3, the lower platen 2210 is raised in the direction of arrow A11. Then, as shown in the figure, the upper mold 110 is fixed to the lower surface of the upper platen 2110. In addition, the method of fixing the lower mold 210 to the lower platen 2210 and the method of fixing the upper mold 110 to the lower surface of the upper platen 2110 are not particularly limited. For example, an electrostatic chuck or a mechanical chuck can be used.

Further, as shown in FIG. 3( d ), the lower platen 2210 is lowered in the direction of arrow B11, the mold 1010 is opened, and the substrate (frame) is supplied to the mold 1010. In this figure, although the substrate 1 is fixed to the lower mold 210 But not limited to this, for example, it can be fixed on the lower surface of the upper mold 110. In addition, the substrate 1 may be the same as in the first and second embodiments, for example.

Then, as shown in FIG. 3(e), the lower platen 2210 is raised in the direction of arrow A12 to close the mold 1010. In this state, the heaters 2111 and 2211 can be operated to raise the temperature of the mold 1010 and the substrate 1. Alternatively, the heaters 2111 and 2211 may be operated in advance to raise the temperature of the mold 1010 and the substrate 1 before the mold 1010 is placed on the lower platen 2210.

Next, the fixing of the lower mold 210 and the lower pressure plate 2210 and the fixing of the upper mold 110 and the upper pressure plate 2110 are released. Then, as shown in FIG. 3(f), the lower pressure plate 2210 is lowered and the lower pressure plate 2210 and the upper pressure plate 2110 are opened to move the molding die 1010 to the resin molding stage.

Next, as shown in (g) to (n) of FIG. 3, resin molding is performed in the resin molding stage (resin molding step).

As shown in (g) of FIG. 3, the resin molding stage of the resin molding apparatus includes an upper platen (another platen) 3120 and a lower platen (one platen) 3220. The upper platen 3120 includes a heater 3121 inside. The lower platen 3220 includes a heater 3221 inside. The heaters 3121 and 3221 are not particularly limited, and may be, for example, cartridge heaters. As shown in the figure, the lower platen 3220 includes a can body 3224 and can accommodate a plate (resin material) 20a therein. The lower platen 3220 has a resin inlet 3229 connected to the tank 3224 on its side. In addition, a heat insulating material may be arranged around the resin inlet 3229 for heat insulation, for example. Moreover, as shown in the figure, the resin molding stage further includes a plunger drive mechanism (fluid resin injection member drive mechanism) 3222 and a plunger (fluid resin injection member) 3223. Driven by the plunger drive mechanism 3222 As described later, the movable plunger 3223 can inject fluid resin into the lower mold cavity (one mold cavity) 211. As shown in the figure, the plunger 3223 is provided with a groove (recess) 3225 on the contact surface with the fluid resin.

First, as shown in FIG. 3(g), the plate (resin material) 20a is supplied (dropped) to the tank 3224 from the resin drop opening 3229 through the resin drop lever 3226. Then, as shown in the figure, the mold 1010 and the substrate 1 are transported in the direction of arrow a22 and moved between the lower platen 3220 and the upper platen 3120.

Next, as shown in (h) of FIG. 3, the molding die 1010 is fixed to the lower platen 3220. Then, as shown in the figure, the plunger 3223 is raised in the direction of arrow b21, and the plate (resin material) 20a is pushed up to above the resin inlet 3229. At this time, since the resin input rod 3226 is still inserted into the resin input port 3229, the plate (resin material) 20a does not overflow from the resin input port 3229. In addition, the shape of the resin input rod 3226 is not particularly limited. For example, as shown in the figure, if the front end of the resin injection rod 3226 is circular, it is possible to suppress or prevent the plunger 3223 from being caught on the front end of the resin injection rod 3226 when the plunger 3223 is raised in the direction of arrow b21.

Next, as shown in FIG. 3(i), the lower platen 3220 is raised in the direction of arrow C11. Thereby, as shown in the figure, the lower pressing plate 3220 and the upper pressing plate 3120 sandwich the molding die 1010. In this state, the molding die 1010 is heated by the temperature raising step, and the heaters 3121 and 3221 are heated by the upper platen 3120 and the lower platen 3220, thereby raising the temperature of the resin material 20a to a temperature that can be melted. As a result, the resin material 20a in the can body 3224 is melted into molten resin (fluid resin).

Then, as shown in (j) of FIG. 3, by the plunger driving mechanism 3222 raises the plunger 3223 in the direction of arrow b22. Thereby, as shown in the figure, the molten resin (fluid resin) 20 b is filled in the lower mold cavity 211 and the upper mold cavity 111. Specifically, the flowable resin 20b flows in the order of the inside of the residue portion (useless resin containing portion) 212, the first gate (resin runner) 213, the runner 214, and the second gate (resin runner) 215 It is filled into the lower mold cavity 211. Furthermore, the fluid resin 20b is also filled into the upper mold cavity 111 through the through-hole (not shown) of the substrate 1. At this time, due to the presence of the residue portion (useless resin accommodating portion) 212, the first gate (resin runner) 213, the runner 214, and the second gate (resin runner) 215, even if the volume of the fluid resin 20b has The deviation can also suppress or prevent the change in the resin pressure in the upper mold cavity 111 and the lower mold cavity 211.

In addition, as described later, the runner 214 and the second gate (resin runner) 215 function as a “resin molded product fixing mechanism” that fixes the resin molded resin to the lower mold 210.

”字形狀，其前端能夠插入上模110的槽119以及下模210的槽(開模抑制構件安裝槽)219。如圖3之(k)所示，使左右的開模抑制構件300向箭頭e1方向(亦即，朝向成型模1010)移動。然後，如圖3之(l)所示，在上模110以及下模210的槽(開模抑制構件安裝槽)219插入並安裝開模抑制構件300的前端。由此，能夠抑制或防止上模110以及下模210打開。 Next, as shown in (k) of FIG. 3, one mold opening suppression member 300 is prepared on each of the left and right. As shown in the figure, the mold opening suppression member 300 is provided with "

In the shape of a letter, its front end can be inserted into the groove 119 of the upper mold 110 and the groove (mold opening suppressing member mounting groove) 219 of the lower mold 210. As shown in FIG. Move in the e1 direction (that is, toward the molding die 1010). Then, as shown in (l) of FIG. 3, insert and install the mold opening suppression in the grooves (die opening suppression member mounting grooves) 219 of the upper mold 110 and the lower mold 210. The front end of the member 300. This can suppress or prevent the upper mold 110 and the lower mold 210 from opening.

Then, as shown in (m) of FIG. 3, the fluid resin 20b is cured (hardened) into a cured resin 20 and useless resin portions 20d, 20e and 20f. As shown in the figure, the resin cured in the upper mold cavity 111 and the lower mold cavity 211 becomes the cured resin 20. The resin cured in the stub portion (residual resin storage portion) 212 and the first gate (resin runner) 213 becomes a surplus resin (useless resin portion) 20d. The resin cured in the plunger groove (recess) 3225 becomes a protruding unnecessary resin portion (protrusion) 20e. Then, the resin cured in the runner 214 and the second gate (resin runner) 215 becomes an excess resin (useless resin portion) 20f. The method of curing (hardening) the fluid resin 20b is the same as in Example 1 and Example 2, for example. In addition, in this embodiment, the resin is further cured using a curing stage as described later. Therefore, in the stages (m) and (n) of FIG. 3 (in the resin molding stage), the cured resin 20 and the useless resin parts 20d, 20e, and 20f are cured to the extent that they can be transported together with the mold 1010. The status is sufficient. After that, the fixing of the upper mold 110 and the upper pressure plate 3120 is released, and as shown in the figure, the lower pressure plate 3220 is lowered and the upper mold 110 and the upper pressure plate 3120 are separated.

Next, as shown in FIG. 3(n), the molding die 1010, the resin molded product 1b (substrate 1 and cured resin 20), and the useless resin portions 20d, 20e, and 20f are directed together by a conveyance mechanism (not shown) or the like. Lift up in the direction of arrow E11. Then, as shown in the figure, the mold 1010, the resin molded product 1b, and the unnecessary resin portions 20d, 20e, and 20f are moved together in the direction of the arrow a23 and transported out of the molding stage, and then moved to the curing stage.

Next, as shown in (o) and (p) of FIG. 3, the resin in the mold 1010 is cured in the curing stage (resin curing step).

As shown in (o) of FIG. 3, the curing stage of the resin molding apparatus includes a temperature rise station 8000. The temperature rising table 8000 includes a heater 8001 inside. The heater 8001 is not particularly limited, and may be, for example, a cartridge heater. In addition, the temperature-increasing stage 8000 includes an exit groove 8002 at a position corresponding to the unnecessary resin portions 20d and 20e on the upper part.

As shown in FIG. 3(o), the molding die 1010, the resin molded article 1b, and the unnecessary resin portions 20d, 20e, and 20f are placed on the temperature rise table 8000 together. At this time, the protrusion 20e of the unnecessary resin portion is accommodated in the exit groove 8002. Then, the mold 800 is heated by the heater 8001 and the heating table 8000. Thereby, the curing of the cured resin 20 and the unnecessary resin portions 20d, 20e, and 20f is further promoted, and the cured resin 20 and the unnecessary resin portions 20d, 20e, and 20f are cured to such an extent that the shape can be maintained even if the mold 1010 is opened.

Thereafter, as shown in FIG. 3(p), the mold 1010, the resin molded product 1b, and the unnecessary resin portions 20d, 20e, and 20f are lifted together in the direction of arrow E12 by a conveyance mechanism (not shown) or the like. Further, the mold 1010, the resin molded product 1b, and the unnecessary resin portions 20d, 20e, and 20f are moved together in the direction of the arrow a24 (that is, outside the curing stage) and further transported to the residue discharge stage (useless resin portion removal stage) in.

Further, as shown in (q) to (s) of FIG. 3, in the residual material discharge stage (useless resin part removal stage), the useless resin part 20 d is removed from the resin molded product.

As shown in (q) of FIG. 3, the residual material discharge stage (useless resin portion removal stage) of the resin molding apparatus includes a residual material discharge rod (useless resin portion removal member) 4000. The rod 4000 for residual material discharge has the same shape as the plunger groove 3225 on the contact surface with the unnecessary resin portion 20d as in Example 1. Small groove (recess) 4001.

As shown in (q) of FIG. 3, the rod 4000 for residual material discharge is raised in the direction of arrow c21. Thereby, as shown in (r) of FIG. 3, the rod 4000 for residual material discharge is brought into contact with the unnecessary resin portion 20 d. At this time, as shown in the figure, the unnecessary resin portion (protrusion) 20e fits into the groove (recess) 4001 of the residue discharge lever. In this state, as shown in the figure, the rod 4000 for residual material discharge is rotated in the direction of arrow d21. As a result, the unnecessary resin portion 20d is twisted off and separated from the unnecessary resin portion 20f in the lower mold cavity 211.

After that, as shown in FIG. 3(s), the rod 4000 for residual material discharge is lowered in the direction of arrow c22. As a result, as shown in the figure, the useless resin portions 20d and 20e connected to the residue discharge rod 4000 are lowered and completely separated from the useless resin portion 20f in the lower mold cavity 211. Further, as shown in the figure, the molding die 1010, the resin molded product 1b and the unnecessary resin portion 20f are moved together in the direction of arrow a25 (that is, outside the residual material discharge stage) by a conveying mechanism (not shown), etc., and Further transport to the discharge stage.

Further, as shown in (t) to (z2) of FIG. 3, the resin molded product 1b is demolded from the mold 1010 in the ejection stage (mold release step). As described later, this demolding step includes a first demolding step of demolding the cured resin 20 from the upper mold (other mold) 110 in a state of being fixed to the lower mold (one mold) 210, and removing the resin in the discharge stage The second release step of releasing the molded product 1b from the mold 1010 (lower mold 210).

As shown in FIG. 3(t), the discharge stage provided in the resin molding apparatus includes a cooling stage 5010 and an upper mold lifting mechanism (upper mold lifting portion) 7000. The cooling stage 5010 is equipped with a cooling mechanism (cold flow Road) 5011. In addition, the cooling stage 5010 is provided with air supply holes 5012 penetrating from the upper surface to the lower surface of the cooling stage 5010 at positions corresponding to the residual portion 212 and the gate 213 of the lower mold 210.

The demolding steps (first demolding step and second demolding step) of (t) to (z2) of FIG. 3 first fix the lower surface of the lower mold 210 to the cooling stage 5010 as shown in (t) of FIG. 3 . In this state, the mold 1010 and the resin molded product 1b are cooled by the cooling table 5010 and the cold runner 5011. This method is not particularly limited. For example, as shown in the figure, the discharge stage may further include a coolant supply mechanism 5200 and piping (pipe for cooling fluid supply) 5201. Then, the cooling stage 5010 can be cooled by supplying and circulating the cooling liquid from the cooling liquid supply mechanism 5200 through the piping 5201 to the cold runner 5011. At this time, as in Example 1 and Example 2, the resin molded product (package) 1b is larger than the lower mold 210 in terms of shrinkage due to cooling. Therefore, if cooling is performed in the state of FIG. 3(t), a gap can be formed between the cured resin 20 of the resin molded product 1b and the upper mold cavity 111 and between the cured resin 20 and the lower mold cavity 211. This makes it easy to release the resin molded product 1b from the mold 1010. However, as described in Embodiment 1 and Embodiment 2, the present invention is not limited to this.

Next, as shown in FIG. 3( u ), the left and right mold opening suppression members 300 are moved in the direction of arrow e2 (that is, the direction of separation from the mold 1010) and removed from the mold 1010.

Then, as shown in FIG. 3(v), the upper die lifting mechanism 7000 is lowered in the direction of arrow F11. Thereby, as shown in FIG. 3(w), the upper mold 110 is brought into contact with and fixed to the lower surface of the upper mold lifting mechanism 7000. Further, as shown in (w) of FIG. 3, the upper mold lifting mechanism 7000 is raised in the direction of arrow F12. by Therefore, as shown in (x) of FIG. 3, the upper mold 110 is lifted up. At this time, since the unnecessary resin portion 20 f remains in the runner 214 and the second gate 215, the resin molded product 1 b is easily fixed to the lower mold 210. In other words, in the molding die 1010 of this embodiment, since the lower die (one die) 210 includes the runner 214 and the second gate 215, it is the same as the upper die (other die) 110 and the lower die (one die) ) 210 is the surface of the surface that is in contact with the resin (that is, the upper surface of the upper mold 110), and the surface of the lower mold (one mold) 210 that is opposite to the upper mold (the other mold) 110 and is in contact with the resin (also That is, the area of the bottom surface of the lower mold 210 is larger. That is, since the lower mold (one mold) 210 includes the runner 214 and the second gate 215, the area of the surface (upper surface of the upper mold 110) that is perpendicular to the mold opening direction and contacts the resin on the upper mold 110 In contrast, the area of the surface of the lower mold 210 perpendicular to the mold opening direction and in contact with the resin (the bottom surface of the lower mold 210) is larger. Therefore, as shown in (x) of FIG. 3, the cured resin 20 after resin molding can be demolded from the upper mold (other mold) 110 in the state of being fixed to the lower mold (one mold) 210 (first demolding step) ).

Furthermore, as shown in FIG. 3(y), air is supplied so as to blow the resin molded product 1b from the air supply hole 5012 in the direction of the arrow x21, that is, from bottom to top. Specifically, for example, as shown in the figure, the air may be supplied by the air supply mechanism 5300 through the piping (air supply piping) 5301. The air supply mechanism 5300 is not particularly limited, and for example, an air pump or the like can be used. Thus, the resin molded product 1b is released from the lower mold 210 (second release step). Thereafter, the resin molded product 1b is transported out of the discharge stage by an unloader (transport mechanism, not shown) or the like. As described above, the resin molded product 1b can be manufactured. In addition, the unnecessary resin portion 20f can be molded from the resin in another stage, for example Product 1b is separated.

On the other hand, after the resin molded product 1b is transported out of the discharge stage, the upper mold lifting mechanism 7000 is lowered. Then, as shown in (z) of FIG. 3, the upper mold 110 and the lower mold 210 are closed again.

After that, only the upper mold lifting mechanism 7000 is raised and separated from the upper mold 110 as shown in (z3) of FIG. 3. Thereafter, the molding die 1010 is moved in the direction of arrow a26 by a conveying mechanism (not shown) or the like, and is conveyed out of the discharge stage. The molding die 1010 can be carried again to the temperature-raising stage to perform the method of manufacturing the resin molded article in the same steps as (a) to (y) of FIG. 3 again. In addition, for example, the molding die 1010 may be cleaned before performing the manufacturing method of the resin molded article again.

In this example (Example 3), an example in which a curing stage is used and the resin in the molding die is cured in the curing stage is shown. However, in the present invention, the curing stage is arbitrary as described above, and is optional.

In the present invention, for example, as in the first embodiment, the other mold of the molding mold is fixed at the resin molding stage, and the one mold can be installed and removed relative to each stage, and at the same time Move between stages. In addition, for example, as in Embodiment 2 and Embodiment 3, both the one mold and the other mold can be attached to and detached from each of the stages, and can be moved between the stages. In the case of the former, there is an advantage that only the one mold can be moved between the stages. In the latter case, there is an advantage that it is not necessary to align the one mold and the other mold in the molding stage. And, in In the former case (when only one mold is moved), the resin must be completely cured (hardened) in the resin molding stage. In the latter case (when both one mold and the other mold are moved), the resin may be in a semi-cured (semi-cured) state in the resin molding stage. As a result, the use time of the resin molding stage in one cycle of the method of manufacturing a resin molded product is shortened, and therefore the cycle can be accelerated to have the advantage of high production efficiency of the resin molded product. In order to completely cure (harden) the resin in a semi-cured (semi-cured) state, for example, as described in Example 3 and FIG. 4, a curing stage may be used. Also, in this case, in order to suppress or prevent the leakage of the resin in a semi-cured (semi-cured) state from the mold, for example, as described in Example 3, a mold opening suppression member may be used.

Although Embodiments 1 to 3 have been described above, the present invention is not limited to this, and various changes can be made. For example, in Examples 1 to 3, examples in which the lower mold is the "one mold" of the present invention and the upper mold is the "other mold" of the present invention are shown. However, the present invention is not limited to this. For example, the upper mold may be the "one mold" of the present invention, and the lower mold may be the "other mold" of the present invention.

Further, some modified examples of the present invention will be described using FIGS. 5 to 8.

Examples 1 to 3 show an example in which both the upper mold and the lower mold are provided with mold cavities. However, as described above, the molding die in the present invention is not limited to this. For example, in the present invention, as far as the forming mold is concerned, only one of the upper mold and the lower mold should have a mold cavity. The cross-sectional view of FIG. 5 schematically shows an example of such a mold. The formation of the molding die 1000 of FIG. 5 and Examples 1 and 2 The mold 1000 is the same and includes an upper mold (another mold) 100 and a lower mold (one mold) 200. The forming mold 1000 of FIG. 5 is the same as the forming mold 1000 of Examples 1 and 2 except that the upper mold 100 does not include the upper mold cavity (another mold cavity) 101. In addition, the molding die of the present invention may be, for example, contrary to FIG. 5, only the upper die has a model cavity, and the lower die does not have a model cavity.

6 schematically shows a modification of the lower mold (one mold) 200 of Examples 1 and 2. FIG. 6(a) is a plan view of a part of the lower mold 200, and FIG. 6(b) is a cross-sectional view. As shown in the figure, a groove (burr countermeasure groove) 208 is provided around the resin injection port (casting port) of the residual material portion 202. By having the groove 208, even if resin leaks from around the resin injection port, the leaked resin will be accommodated in the groove 208. Thereby, molding defects and the like caused by thin burrs (useless resin portions) from the leaked resin can be suppressed or prevented.

FIG. 7 schematically shows an example of the structure of the unnecessary resin portions 20d and 20e. Fig. 7(a) is a side view, and Fig. 7(b) is a front view. As shown in the figure, the protrusion 20e of the unnecessary resin portion has a convex shape of "- (minus sign)" shape. As described in the foregoing embodiment, the plunger (fluid resin injection member) has grooves on the contact surface with the fluid resin, and protrusions (protrusions) like unnecessary resin portions 20e are formed corresponding to the shape of the grooves . Thus, as described in the foregoing embodiment, for example, it is easy to remove the useless resin portion using the residue discharge lever (useless resin portion removing member). However, the present invention is not limited to this. For example, when the fluid resin injection member includes at least one of a convex portion and a concave portion on the contact surface with the fluid resin, the shape of at least one of the convex portion and the concave portion is not limited to the groove shape , Can be any shape. Furthermore, corresponding to at least one of the convex portion and the concave portion of the fluid resin injection member The shape of at least one of the convex portion and the concave portion formed in the unnecessary resin portion is not limited to the shape of 20e in FIG. 7 and may be any shape. For example, the protrusion 20e of FIG. 7 has the aforementioned "- (minus sign)" shape. However, it is not limited to this. For example, the fluid resin injection member has a concave portion or convex portion in the shape of "+ (plus)" on the contact surface with the fluid resin. Corresponding to this, the unnecessary resin portion 20e may be A convex or concave part with a "+ (plus sign)" shape. Further, corresponding to this, the shape of at least one of the convex portion and the concave portion provided on the abutment surface of the waste material discharge lever (useless resin portion removing member) on the waste resin portion can also be changed as appropriate.

The side views of (a) and (b) of FIG. 8 each schematically show an example of the relationship between the form of the plunger (fluid resin injection member) and the form of the unnecessary resin portion. FIG. 8( a) is an example in which the useless resin portion 20 d (that is, the cured product of the fluid resin) does not overflow from the outer periphery of the contact surface of the plunger 3213 with the useless resin portion 20 d. FIG. 8(b) is an example in which the unnecessary resin portion 20d overflows from the outer periphery of the contact surface of the plunger 3213. In the case of (a) of FIG. 8, it is easy to suppress or prevent the overflow of the fluid resin from the outer periphery of the abutment surface of the plunger 3213. On the other hand, in the case of (b) of FIG. 8, it is easy to apply force to the fluid resin by the plunger 3213.

According to the present invention, for example, since a member (for example, a plunger, etc.) for taking out a resin molded product can be omitted from the molding die, the molding die can be configured with a small number of parts.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the gist of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2017-245620 filed on December 21, 2017, and the entire contents of the disclosure are incorporated herein.

1‧‧‧ substrate (frame)

1b‧‧‧Resin molded product (packaged substrate)

20‧‧‧cured resin

100‧‧‧ Upper mold (another mold)

101‧‧‧Up model cavity (another model cavity)

200‧‧‧ Lower mold (one mold)

201‧‧‧ Lower model cavity (one model cavity)

202‧‧‧Remnant part (remaining resin storage part, useless resin storage part, resin molded product fixing mechanism)

203‧‧‧Gate (resin runner, resin molded product fixing mechanism)

1000‧‧‧Forming die

S1‧‧‧Heating stage

S2‧‧‧Resin molding stage

S3‧‧‧Curing stage

S4‧‧‧Discharge stage

Claims (15)

A resin molding device including a molding die, a temperature rising stage, a resin molding stage, and a discharge stage; the foregoing molding die includes a mold and another mold; and enables the resin molded product after resin molding to be fixed in the state of the aforementioned one mold from The aforementioned another mold is demolded; at least one of the aforementioned one mold and the aforementioned another mold can be installed and removed relative to each of the aforementioned stages, while being able to move between the aforementioned stages; the aforementioned temperature-increasing stage warms up the aforementioned molding die; and the aforementioned resin Resin molding is performed in the molding stage; the resin molding product is released from the molding mold in the discharge stage; and the one mold includes a resin molded product fixing mechanism that fixes the resin molded product. A resin molding device including a molding die, a temperature rising stage, a resin molding stage, and a discharge stage; the foregoing molding die includes a mold and another mold; and enables the resin molded product after resin molding to be fixed in the state of the aforementioned one mold from The aforementioned another mold is demolded; at least one of the aforementioned one mold and the aforementioned another mold can be installed and removed relative to each of the aforementioned stages, and at the same time can be moved between the aforementioned stages; the aforementioned temperature-increasing stage heats up the aforementioned molding die; The resin molding stage performs resin molding; the ejection stage releases the resin molded product from the molding die; compared to the area of the surface on the other mold that is opposite to the one mold and in contact with the resin, The surface of the mold facing the other mold and in contact with the resin has a larger area, so that the resin molded article can be released from the other mold while being fixed to the one mold. The resin molding apparatus according to claim 1 or 2, wherein the other mold is fixed at the resin molding stage; the one mold can be installed and removed with respect to each of the stages, and can move between the stages; The resin molding step further releases the resin molded article from the other mold in a state of being fixed to the one mold; the ejection stage releases the resin molded article from the one mold of the molding mold. The resin molding apparatus according to claim 1 or 2, wherein both the one mold and the other mold can be attached and detached with respect to each of the stages, and can be moved between the stages; the discharge stage makes the resin The molded product is released from the other mold while being fixed to the one mold, and the resin molded product is further released from the one mold of the molding mold. The resin molding device as described in claim 1 or 2, further including Curing stage; the aforementioned curing stage cures the resin in the aforementioned molding die. The resin molding apparatus according to claim 1 or 2, further comprising a fluid resin injection member for injecting a fluid resin into one mold cavity and an unnecessary resin portion removing member for removing the unnecessary resin portion cured by the fluid resin; The fluid resin injection member includes at least one of a convex portion and a concave portion on the contact surface with the fluid resin; the unnecessary resin removal member includes a convex portion and a concave portion on the contact surface with the unnecessary resin portion at least one. The resin molding apparatus according to claim 1 or 2, further comprising a mold opening suppression member that suppresses mold opening of the aforementioned one mold and the aforementioned other mold. The resin molding apparatus according to claim 1 or 2, further comprising a temperature rising mechanism that raises the temperature of the mold and a resin molded article cooling mechanism that cools the resin molded article. A method for manufacturing a resin molded product using the resin molding device described in claim 1, and comprising the following steps: a temperature rising step of raising the temperature of the molding die in the temperature increasing step; and a resin that performs resin molding in the resin molding step Molding step; the resin molded product after resin molding is fixed to the one mold by the resin molded product fixing mechanism from the other The first demolding step of the mold release; and the second demolding step of demolding the resin molded product from the one mold in the discharge stage. A method for manufacturing a resin molded product using the resin molding device described in claim 2 and including the following steps: a temperature increasing step of increasing the temperature of the molding die in the temperature increasing step; a resin that performs resin molding in the resin molding step Molding step; a first demolding step of demolding the resin molded article after being molded in the one mold from the other mold; and removing the resin molded article from the one mold in the discharging stage The second demolding step of the mold; compared to the area of the surface of the other mold that is opposite to the one mold and in contact with the resin, the surface of the one mold that is opposite to the other mold and is in contact with the resin The larger area allows the resin molded article to be released from the other mold in the state of being fixed to the one mold in the first demolding step. The method for manufacturing a resin molded product according to claim 9 or 10, further comprising a resin curing step of curing the resin in the molding die in the curing stage. The method for manufacturing a resin molded product as described in claim 9 or 10, which further includes using a fluid resin injection member into a mold cavity A fluid resin injection step of injecting a fluid resin; and a useless resin portion removing step of removing the useless resin portion cured by the fluid resin using a waste resin removal member; the fluid resin injection member resists the fluid resin At least one of the convex portion and the concave portion is provided on the interface; the unnecessary resin removing member includes at least one of the convex portion and the concave portion on the contact surface with the unnecessary resin portion. The method for manufacturing a resin molded product according to claim 9 or 10, wherein in the resin molding step, a mold opening suppression member is used to suppress mold opening of the one mold and the other mold. The method for manufacturing a resin molded product according to claim 9 or 10, wherein in the mold release step, the resin molded product is cooled while raising the temperature of the mold. The method for producing a resin molded product as described in claim 9 or 10 is performed using the resin molding device described in claim 1 or 2.

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