CN112677422B

CN112677422B - Method for producing resin molded article and resin molding apparatus

Info

Publication number: CN112677422B
Application number: CN202011103652.XA
Authority: CN
Inventors: 高田直毅; 平野义和; 坂井秀行
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2019-10-17
Filing date: 2020-10-15
Publication date: 2022-12-02
Anticipated expiration: 2040-10-15
Also published as: JP6837530B1; JP2021062591A; TW202122234A; KR20210045922A; CN112677422A; TWI746198B; KR102393495B1

Abstract

The present invention relates to a method for producing a resin molded article and a resin molding apparatus. The present invention prevents the stripping or warping of a mold release film which may occur when the mold release film is used in a needle gate type transfer resin molding method without highly complicating the steps or the structure. In the manufacturing method of the present invention, a gate GT opened from the bottom surface of a cavity 3 formed between a first mold 1 and a second mold 2 is formed at a mold clamping position, and resin is injected and molded; in this method, a mold release film 5 having a through hole 5a penetrating in the thickness direction is disposed on the inner surface of a cavity 3 including the bottom surface so that the through hole 5a overlaps a gate GT; the method includes a step of arranging a pressing runner member 6, the pressing runner member 6 having a pressing surface 61 for pressing a part or all of the periphery of a through hole 5a in a release film 5 to be closely adhered to a cavity bottom surface at a mold clamping position at the time of mold clamping, the pressing runner member 6 forming a communication runner 7 of the through hole 5a and a cavity 3 at the time of mold clamping.

Description

Method for producing resin molded article and resin molding apparatus

Technical Field

The present invention relates to a method for producing a resin molded article formed by a "needle gate system" in which a resin is injected from a gate provided on a bottom surface of a cavity, and a resin molding apparatus used in the production method.

Background

For transfer resin molding, for example, patent document 1 proposes a needle gate method (or a needle-tip gate method) in which a gate is provided at a position corresponding to a surface of a molded article other than a side surface, that is, at a cavity bottom surface in a molding die, and a resin is injected through the gate.

The needle gate approach has general advantages such as: gate traces are small and inconspicuous; multi-point and multi-piece acquisition are easy to achieve; uniform pressure distribution, etc. are easily obtained. Particularly, in the case of resin package molding of IC chips or the like, there is also obtained an advantage that "gate residues are not formed on the circuit board".

On the other hand, as for the transfer resin molding, the following techniques are known: the mold release film is arranged on the inner surface including the bottom surface of the cavity, and the mold release film is interposed between the resin and the cavity, whereby the molded article is easily released from the cavity, and damage to the molded article at the time of mold release can be prevented.

However, in the needle gate method, no example of using a release film has been found.

This is considered to be because, in the needle gate system, when the mold release film is disposed on the inner surface of the cavity, the mold release film covers the gate, and therefore, a hole portion must be provided in the mold release film at a portion corresponding to the gate, which may cause a disadvantage.

The concrete description is as follows. Since the mold release film is sucked to the inner surface of the cavity by the negative pressure suction, if the hole is opened in the mold release film as described above, air leaks from the hole, and the suction force of the mold release film around the gate becomes weak. Thus, the release film around the hole may be peeled off from the cavity inner surface by the pressure at the time of resin injection and filling, and there is a possibility that "molding failure may be caused by the resin entering through the gap".

[ Prior art documents ]

[ patent document ]

[ patent document 1 ] Japanese patent application laid-open No. 2019-111692

Disclosure of Invention

Problems to be solved by the invention

In view of the above problems, the present invention is to realize a transfer resin molding method in which a release film is applied to a needle gate system, to exhibit both advantages thereof, and to prevent "defects such as peeling or warpage of the release film which may occur at the time of resin injection".

Means for solving the problems

That is, the method for producing a resin molded article according to the present invention is a method for injecting a resin into a cavity formed between a first mold and a second mold from "a gate opening opened in a bottom surface of the cavity", and molding the resin molded article, the method comprising:

a mold release film having a through hole penetrating in a thickness direction is disposed on an inner surface of the cavity including the bottom surface so that the through hole overlaps the gate,

on the other hand, a pressing runner member having a pressing surface which presses a part or all of the periphery of the through hole in the mold release film to be closely adhered to the bottom surface of the cavity at the time of mold clamping is arranged in advance, and which forms a communication runner communicating the through hole with the cavity at the time of mold clamping,

the first mold and the second mold are closed,

and injecting resin into the mold cavity from the gate through the through hole and the communicating runner to harden the resin.

The present invention may be a resin molding apparatus in which a gate is provided on a bottom surface of a cavity formed between a first mold and a second mold, and a resin is injected from the gate into the cavity to mold the resin,

the resin molding device comprises:

a mold release film which is disposed on an inner surface including a bottom surface of the cavity and has a through hole for allowing a resin flowing from the gate to pass therethrough, at a position overlapping the gate in the disposed state; and

a pressing runner component which is provided with a pressing surface and is used for pressing a part or all of the periphery of the through hole in the demoulding film so that the pressing part is tightly attached to the bottom surface of the mould cavity; the pushing runner component forms a communicating runner to communicate the through hole and the die cavity.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, even when the mold release film is used in, for example, a needle gate type transfer resin molding method, the disadvantage that the mold release film is peeled off and the molten resin enters the gap between the mold release film and the inner surface of the cavity can be prevented.

Drawings

Fig. 1 shows a top view of a substrate in an embodiment of the present invention.

Fig. 2 shows a schematic sectional view of the resin molding apparatus at the position of opening the mold in the same embodiment.

Fig. 3 is a schematic sectional view showing a resin molding apparatus at a mold clamping position in the same embodiment.

Fig. 4 is a plan view and a perspective view of the pressing flow path member in the same embodiment as viewed from the back side (a) and (b).

Fig. 5 is a partially enlarged view of fig. 1.

Fig. 6 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A in fig. 5.

FIG. 7 is a schematic sectional view for explaining a method of producing a resin molded article using the resin molding apparatus according to the same embodiment.

FIG. 8 is a schematic sectional view for explaining a method of producing a resin molded article using the resin molding apparatus according to the same embodiment.

FIG. 9 is a schematic sectional view for explaining a method of producing a resin molded article using a resin molding apparatus according to the same embodiment.

FIG. 10 is a schematic sectional view for explaining a method of producing a resin molded article using a resin molding apparatus according to the same embodiment.

FIG. 11 is a schematic sectional view for explaining a method of producing a resin molded article using a resin molding apparatus according to the same embodiment.

Fig. 12 is a perspective view showing a pressing flow path member according to another embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the following embodiments, and it goes without saying that the present invention is not limited to the following embodiments.

< summary of the embodiments >

The method for producing a resin molded article according to the present embodiment is a method for molding a resin molded article by injecting a resin into a cavity formed between a first mold and a second mold from "a gate opening opened in a bottom surface of the cavity" at a mold clamping position, the method comprising:

a mold release film having a through hole penetrating in a thickness direction is disposed on an inner surface including a bottom surface of the cavity so that the through hole overlaps the gate,

on the other hand, a pressing runner component is arranged in advance, and the pressing runner component is provided with a pressing surface which presses a part or all of the periphery of the through hole in the demoulding film to be tightly attached to the bottom surface of the cavity when the mould is closed; the runner pushing member forms a communicating runner communicating the through hole with the cavity when the mold is closed,

the first mold and the second mold are closed,

and injecting resin into the cavity from the gate through the through hole and the communication runner to harden the resin.

According to the above method, since the periphery of the through hole in the mold release film is brought into close contact with the cavity inner surface by pressing the runner member at the time of mold clamping, the molten resin can be prevented from entering the gap between the mold release film and the cavity inner surface. Further, since the communicating runner for communicating the gate to the cavity is formed in the pressing runner member, the molten resin is not prevented from being injected into the cavity.

Thus, the mold release film can be used for the first time in a needle gate type transfer resin molding method. Further, since the through hole is formed in the mold release film and only the pressing runner member is provided, the process and the structure are not highly complicated.

As a specific means for more remarkably exhibiting the above-described effects, the release film may be adsorbed to the inner surface of the cavity.

Specific examples of the pressing flow path member that can be manufactured relatively easily include: the pressing runner component is provided with a through hole in the center, and is provided with one or more runner parts, the runner parts extend outwards from the through hole to form openings on the peripheral surface of the outer side, and the pressing runner component forms the communication runner by the through hole and the runner parts.

When the one end surface of the pressing runner member is the pressing surface and the runner portion is formed to be spaced from the one end surface in the extending direction of the through hole, the pressing surface brings the entire periphery of the through hole in the mold release film into close contact with the cavity inner surface, and therefore, the resin can be more reliably prevented from entering the gap between the mold release film and the cavity inner surface.

Specific examples of the method for molding a resin on a substrate such as a semiconductor substrate include: while the first mould is fixedly holding the substrate, the second mould is provided with a mould cavity, and the mould cavity is opened towards the surface of the first mould; in the mold clamping position, the substrate is disposed at the opening of the cavity, and resin is injected into the cavity, whereby the resin is molded on the substrate.

If the substrate is configured in such a manner that "semiconductor chips are formed at a plurality of predetermined positions on the substrate" and the pressing runner is disposed at any one or more of the predetermined positions instead of the semiconductor chips, the degree of freedom in selecting the position at which the pressing runner is disposed is increased, and the pressing runner can be disposed at an appropriate position for resin injection, for example.

Further, the pressing flow path member can be integrally formed with the substrate in advance, and thus, a step of positioning the pressing flow path member is not required as compared with a case where the pressing flow path member is formed as a separate member.

The resin molding apparatus described below can also exhibit the same effects.

That is, a resin molding apparatus in which a gate is provided on a bottom surface of a cavity formed between a first mold and a second mold, and a resin is injected from the gate into the cavity to mold,

the resin molding apparatus includes:

a mold release film which is disposed on an inner surface including a bottom surface of the cavity and has a through hole for passing a resin flowing from the gate at a position overlapping the gate in the disposed state; and

the pushing runner component is provided with a pushing surface, the pushing surface pushes a part or all of the periphery of the through hole in the demolding film at the mold closing position so that the pushing part is tightly attached to the bottom surface of the mold cavity, and the pushing runner component forms a communication runner for communicating the through hole and the mold cavity.

< detailed description of the embodiments >

Hereinafter, detailed embodiments are described with reference to the drawings.

The present embodiment relates to a method for producing a resin molded article, for example, by encapsulating and coating a semiconductor chip disposed on a surface of a substrate with a resin at a desired position.

Before describing the manufacturing method, a substrate W and a semiconductor wafer C to be packaged with a resin, and a resin molding apparatus 100 used in the manufacturing method will be described.

< description of the substrate W >

Examples of the substrate W include: a semiconductor substrate such as a silicon wafer, a lead frame, a printed circuit board, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, or the like. The substrate W may be a carrier used for FOWLP (Fan-Out Wafer Level Packaging) or FOPLP (Fan-Out Panel Level Packaging). In other words, the wiring may be applied or not.

As shown in fig. 1 and 2, the substrate W in this embodiment is, for example, rectangular in plan view, and is disposed on its surface Wa in the following manner: a plurality of identical semiconductor wafers C, each having a rectangular shape in plan view and being equally spaced in the longitudinal and lateral directions, protrude. After the formation, the substrate W is broken and diced into individual semiconductor wafers C. For example, when used for FOWLP or FOPLP, the substrate W may be separated from the encapsulating resin without being formed into individual pieces after molding.

< description of the resin Molding apparatus 100 >

As shown in fig. 2 and the like, the resin molding apparatus 100 includes: an upper die 1 as a first die and a lower die 2 as a second die; a clamping mechanism (not shown) for holding the upper mold 1 and the lower mold 2 and driving them to advance and retreat between a mold opening position shown in fig. 2 and a clamping position shown in fig. 3, so as to move them toward or away from each other; and a resin injection mechanism 4 that injects the resin R into a cavity 3 formed between the upper mold 1 and the lower mold 2 at the mold-closing position.

The description will be given for each part.

The upper mold 1 is replaceably mounted below a fixed platen, not shown. Here, the bottom surface (the side surface facing the lower mold 2) of the upper mold 1 is provided with a plurality of suction holes (not shown), and the back surface of the substrate W can be sucked and fixed by applying a negative pressure to the suction Kong Jieyou by a vacuum pump or the like (not shown).

The lower die 2 is replaceably mounted above a movable platen, not shown, and includes a bottom plate portion 21 and an intermediate plate portion 22 detachably mounted on the top surface of the bottom plate portion 21. The cavity 3 having a contour one turn smaller than that of the substrate W is formed in the top surface (the opposite side surface opposite to the upper mold) of the intermediate plate portion 22.

In the mold clamping position, the peripheral portion of the cavity 3 on the top surface of the intermediate plate portion 22 is closely attached to the edge of the substrate surface Wa, the top opening of the cavity 3 is closed by the substrate W, and the semiconductor wafer C disposed (formed) on the substrate W is accommodated in the cavity 3.

Also, in this embodiment, it is set that: the depth of the cavity 3 is set to be approximately equal to the thickness of the semiconductor wafer C, and the top surface of the semiconductor wafer C is closely attached to the bottom surface of the cavity 3 at the mold clamping position. Thereby, the resin R does not flow to the top surface of the semiconductor wafer C, and only the side peripheral surface of the semiconductor wafer C is covered with the resin R. Thus, the top surface of the semiconductor wafer C is exposed after the resin molding. The "top surface" of the semiconductor wafer C is a surface on the opposite side of the substrate W, that is, a surface on the side of the release film 5 during the resin molding operation.

The intermediate plate portion 22 is also pushed up from the top surface of the bottom plate portion 21 by a raising mechanism not shown.

Although not shown, the mold clamping mechanism includes: a holding structure for holding the upper mold 1 and the lower mold 2; and a mold lifting mechanism for lifting the lower mold 2 held by the holding structure.

The holding structure (not shown) includes, for example: a base plate; a plurality of guide pins erected from the base plate; the fixed pressing plate is fixed at the upper end part of the guide pin; and the movable pressing plate can be fixed at the middle part of the guide pin in a lifting way. Further, the upper die 1 is mounted below the fixed platen as described above. The upper mold 1 may be attached to the bottom surface of the stationary platen through an upper mold support portion not shown. The upper mold supporting part may be provided with a heater for heating the upper mold 1, and a heat insulating material may be provided on the fixed platen side of the heater.

Further, as described above, the lower die 2 is mounted above the movable platen. The lower die 2 may be attached to the bottom surface of the movable platen through a lower die support portion not shown. The lower mold support part may be provided with a heater for heating the lower mold 2, and a heat insulating material may be provided on the movable platen side of the heater.

The mold lifting mechanism is constituted by "a ball screw mechanism, a hydraulic cylinder, a link mechanism, etc., which lift and drive the lower mold 2 via the movable platen".

As shown in fig. 2 and the like, the resin injection mechanism 4 includes: a resin injection hole 41 penetrating the lower mold 2 in the thickness direction; and a plunger mechanism 42 for pressing the molten resin R filled in the resin injection hole 41 and injecting the same into the cavity 3.

The description is for each section.

The resin injection hole 41 is constituted by "a first hole 411 penetrating the intermediate plate portion 22 in the thickness direction and a second hole 412 penetrating the bottom plate portion 21 in the thickness direction", and the first hole 411 and the second hole 412 are arranged so as to be continuous.

The first hole 411 has a circular cross-sectional shape that tapers toward the bottom surface of the cavity 3, wherein one end of the bottom surface of the cavity 3 that is open functions as a gate GT and the other portion functions as a gate SP.

The second hole 412 has a circular shape with the same diameter in cross section across the penetrating direction, and functions as a groove portion for receiving the molten resin R.

The plunger mechanism 42 is constituted by "a plunger 421 inserted into the second hole 412 from the lower end portion, and a forward/backward movement actuator 422 such as a ball screw or a motor for moving the plunger 421 up and down and forward and backward".

The plunger 421 is "cylindrical shape having an outer diameter set to be equal to the inner diameter of the second hole 412", and is slidably fitted in the second hole 412 without play.

The advancing/retreating actuator 422 advances and retreats between a "standby position where the plunger 421 is positioned at a tip end surface thereof below the top surface of the second hole 412" and an "injection completion position set at a predetermined distance above the standby position". As shown in fig. 3 and the like, in the standby position, a predetermined amount of the resin R in a solid state in the form of an ingot is placed into the second hole 412 from above, and is melted by a heating means, not shown, provided in the bottom plate portion 21. In this state, when the advancing/retreating actuator 422 raises the plunger 421 to the injection completion position, as shown in fig. 9, the molten resin R is injected into the cavity 3 through the gate SP and the gate GT. In this embodiment, a thermosetting resin is used as the resin R.

Further, the resin molding apparatus 100 includes: a mold release film 5; a film supply mechanism (not shown) for supplying the release film 5 to the top surface of the intermediate plate portion 22; and a film close-fitting mechanism (not shown) for closely fitting the release film 5 to the inner surface of the cavity 3 and the top surface of the intermediate plate portion 22 around the cavity 3.

The release film 5 is disposed so as to be closely adhered to the "inner surface including the bottom surface of the cavity 3", and is interposed between the inner surface of the cavity 3 and the injected resin R, whereby the "resin R after molding after curing in the cavity 3" is easily peeled from the cavity 3. The description of these materials and the like is well known and omitted.

Further, since the gate GT is opened at the bottom surface of the cavity 3 in this embodiment, a through hole 5a having the same or a slightly larger diameter than the opening diameter of the gate GT is formed in the mold release film 5 at a position corresponding to the gate GT so as not to block the gate GT.

Although not shown, the film sticking mechanism is constituted by "a plurality of suction holes provided in the inner surface of the cavity 3 and/or the peripheral top surface of the outer side of the cavity 3" and "a vacuum pump or the like not shown in the drawings for applying a negative pressure to the suction holes", and therefore, the release film 5 can be sucked by the negative pressure of each suction hole.

However, the resin molding apparatus 100 of this embodiment further includes a pressing runner member 6, and the pressing runner member 6 is pressed via the substrate W to closely adhere to the inner surface of the cavity 3 at the mold clamping position around the through hole 5a in the release film 5.

Next, the pressing flow path member 6 will be described in detail.

The pressing runner member 6 in this embodiment is in the form of a thin disk having a through-hole 6a at the center, as shown in fig. 4 in which the pressing runner member 6 is viewed from the back side. The surface 61 of which is flat, the surface 61 being the aforementioned pushing surface. On the other hand, a plurality of (4 in this case) bottomed grooves 6b extending radially are uniformly formed in the back surface 62. These grooves 6b are provided so as to straddle between the outer peripheral surface and the inner peripheral surface of the pressing flow path member 6. In other words, the outer end surface of each bottomed groove 6b is opened to the outer peripheral surface of the pressing flow path member 6, and the inner end surface of each bottomed groove 6b is opened to the inner peripheral surface of the pressing flow path member 6 (i.e., the through hole 6 a), so that the "radially outer side of the pressing flow path member 6" and the "radially inner side" i.e., the through hole 6a are communicated with each other via the bottomed grooves 6b.

The pressing runner member 6 is manufactured as a separate member provided separately from the substrate W by etching, machining, or the like. As shown in fig. 5 and 6, the back surface 62 of the pressing flow path member 6 is joined to the bonding substrate surface Wa and integrated with the substrate W. Thus, the flow path portion 71 is formed by the bottom groove 6b of the pressing flow path member 6 and the substrate surface Wa, and is separated from the pressing surface (surface) 61 of the pressing member in the penetrating direction of the through hole 6 a. The through hole 6a and the flow path portion 71 constitute a so-called communication flow path 7. As shown in fig. 5, in this embodiment, the flow path portion 71 extends in a direction inclined at 45 ° different from the arrangement direction of the semiconductor wafer C. This is to facilitate the outflow of the resin R into the cavity.

Next, the arrangement position of the pressing flow path member 6 will be described. As described above, the semiconductor chips C as the objects to be packaged by the resin R are arranged at equal pitches in the vertical and horizontal directions on the substrate surface Wa. Accordingly, if this is maintained, there is no room for disposing the pressing runner member 6, so in this embodiment, as shown in fig. 1 and 5, the semiconductor chip C is not disposed at one or more (two in this case) of the predetermined positions where the semiconductor chip C should be originally disposed, and the pressing runner member 6 is disposed in advance at this position.

The thickness of the pressing runner member 6 is substantially equal to the "distance between the substrate surface Wa and the bottom surface of the cavity 3". This is because, as described above, in the mold clamping position, the surface 61 (corresponding to the so-called pressing surface 61) of the runner member 6 is pressed, and the release film 5 is pressed via the substrate W and is brought into close contact with the inner surface (bottom surface) of the cavity 3. The thickness of the pressing flow path member 6 is equal to the thickness of the semiconductor wafer C in this embodiment, as it is between the front surface 61 and the back surface 62.

< description of the method for producing a resin molded article >

Next, an example of a method for producing a resin molded product using the resin molding apparatus 100 configured as described above will be described with reference to fig. 2, 3, and 7 to 11. In fig. 2, 3, and 7 to 11, the portions including the substrate W are patterned for easy understanding.

First, as shown in fig. 2, the upper mold 1 and the lower mold 2 are separated from each other and then opened.

Next, as shown in fig. 7, the substrate W is held by suction on the bottom surface of the upper mold 1 in a state where the semiconductor wafer C faces the cavity 3 while the release film is placed on and sucked to the intermediate plate portion 22 positioned on the bottom plate portion 21.

Next, as shown in fig. 8, the intermediate plate portion 22 is lifted and separated from the bottom plate portion 21 by a lifting mechanism not shown. At this time, the plunger 421 is set to "a standby position where its front end surface is located below the top surface opening of the second hole 412 provided in the bottom plate portion 21".

After the resin R in the form of a solid tablet is introduced from the top surface of the second hole 412, the resin R in the form of a tablet is melted by a heating means, not shown, provided in the bottom plate portion 21.

Subsequently, the mold is closed. That is, as shown in fig. 3, the bottom plate portion 21 is lifted by the mold lifting mechanism to be integrated with the intermediate plate portion 22, and the release film 5 is sandwiched between the top surface of the intermediate plate portion 22 and the edge portion of the substrate surface Wa. This position is the mold clamping position. At this time, as described above, the pressing surface 61 pressing the runner member 6 presses the periphery of the through hole 5a in the release film 5 to be closely adhered to the bottom surface of the cavity 3.

Next, as shown in fig. 9, the plunger 421 is raised up to the injection completion position. Thereby, the molten resin R is injected and filled into the cavity 3.

This is explained in more detail. By raising the plunger 421 from the standby position, the molten resin R flows into the through hole 6a of the pressing runner member 6 shown in fig. 6 through the gate SP, the gate GT, and the through hole 5a of the release film 5, and further flows into the cavity 3 through the runner portion 71 formed by the closed-end groove 6b of the pressing runner member 6 and the substrate surface Wa.

In this way, after the cavity 3 is filled with the molten resin R, the resin R is cured and solidified by waiting for a predetermined time in a heated state.

Thereafter, as shown in fig. 10, the lower mold 2 (the bottom plate portion 21 and the intermediate plate portion 22) is lowered by the mold lifting mechanism to be in the mold open position. At this time, the residual resin R (residue) remaining at the gate SP, gate GT, and the top of the second hole 412 is removed from the substrate W, and the substrate W (resin molded article) after resin molding is removed from the upper die 1. On the other hand, as shown in fig. 11, the intermediate plate portion 22 is separated from the bottom plate portion 21 by the lifting mechanism, and the residue R is taken out and discarded.

< Effect >

In the present embodiment as described above, the pressing surface 61 for pressing the runner member 6 is formed in a closed ring shape (here, in an annular shape) at the mold clamping position or at the time of mold clamping, and the pressing surface 61 tightly contacts the entire periphery of the through hole 5a in the release film 5 to the bottom surface of the cavity 3, so that a gap is not formed between them, and the molten resin R can be reliably prevented from entering the release film 5 and the cavity inner surface. Further, since the communicating flow path 7 is formed in the pressing flow path member 6, the molten resin R is not prevented from being injected into the cavity 3.

Thus, the release film 5 can be used for the first time in a needle gate type transfer resin molding method. Further, since the through hole 5a is opened in the release film 5 and only the pressing flow path member 6 is provided, the process and the structure are not significantly complicated.

In particular, in the present embodiment, since the pressing runner member 6 can be disposed in place of the semiconductor wafer C by disposing any one of a plurality of predetermined positions where the semiconductor wafer C is to be disposed, the degree of freedom in selecting the disposition position of the pressing runner member 6 is increased, and the pressing runner member 6 can be disposed at a position suitable for resin injection. In this embodiment, for example, as shown in fig. 1, since the pressing runner members 6 serving as the resin injection ports are arranged at two bilaterally symmetrical positions on the center line extending in the longitudinal direction (left-right direction) of the rectangular substrate W, the resin can be injected into the cavity 3 as uniformly and quickly as possible.

Further, since the pressing runner member 6 is bonded to the substrate W in advance and integrated therewith, an effect of "no need to perform a step of positioning the pressing runner member 6 at the position of the molding die" can be obtained.

< other embodiments >

The present invention is not limited to the above embodiments.

For example, although in the above-described embodiment the pressing flow path member 6 is joined to the substrate W as a separate member provided separately from the substrate W, the pressing flow path member 6 may be formed integrally with the substrate W.

Further, the release film 5 to which the pressing runner member 6 is attached in advance may be supplied to the molding die. In this case, the positional relationship among the pressing runner member 6, the release film 5, the substrate W, and the semiconductor wafer C at the time of mold clamping can be the same as in the above embodiment.

As shown in fig. 12, instead of the bottom groove 6b, a hole 6b' or the like may be provided to communicate the outer peripheral surface of the pressing flow path member 6 with the through hole 6 a.

Further, the pressing flow path member 6 may be disposed upside down. At this time, the bottomed grooves 6b face the release film 5 side, and the entire periphery of the through holes 5a in the release film 5 cannot be pressed at the portions corresponding to the bottomed grooves 6b, but this can contribute to preventing the release film 5 from peeling.

The pressing flow path member 6 may be a rectangular disk or a polygonal disk instead of a disk.

The pressing flow path member 6 may be configured not solely, for example, by a plurality of pressing elements arranged so as to be separated from each other around the through hole 5a. At this time, the gap between the pressing members forms a communication flow passage.

If the release film 5 is formed, the through-holes 5a may be formed in advance as in the above embodiments; the release film 5 may be placed on the intermediate plate portion 22 and adsorbed, and then a through hole may be formed in accordance with the gate GT.

The method for producing a resin molded product is not limited to the above embodiment, and the order may be adjusted in the front-rear direction. For example, the release film 5 may not be attracted, and only the periphery of the through hole 5a may be pressed by pressing the runner member 6. In this case, the release film 5 may be closely attached to the inner surface of the cavity 3 by the filling pressure of the resin R.

Although the cavity 3 is provided only in the lower mold 2 in the above embodiment, it may be provided in the upper mold, and the resin may be injected into both the front and back surfaces of the substrate to mold the substrate.

The object to be molded is not limited to the substrate W on which the semiconductor wafer C is provided, and the present manufacturing method is also applicable to a case where only the resin R is molded by the cavity 3.

The forming die is not only used for lifting up and down, but also can relatively advance and retreat in the horizontal direction or other directions, and the invention can also be applied.

The present invention is not limited to the above embodiments, and various changes can be made without departing from the scope of the invention.

Attached pictureDescription of the invention

100 resin molding apparatus

1: upper die (first die)

2 lower die (second die)

21 bottom plate part

22 middle plate part

3: die cavity

4: resin injection mechanism

41 resin injection hole

411 first hole

412 second hole

42 plunger mechanism

421 plunger

422 advancing and retreating actuator

5: mold release film

5a through hole

6 pushing runner component

61 pressing surface

6a through hole

6b bottom ditch

6b' hole

7: communicating flow passage

71 flow path part

C semiconductor chip

GT gate

R is a resin

SP pouring gate

W is a substrate

Claims

1. A method for manufacturing a resin molded product, wherein a gate is provided on the bottom surface of a cavity formed between a first mold and a second mold, and a resin is injected into the cavity from the gate to mold the resin molded product,

the method for manufacturing the resin molded product comprises the following steps:

disposing a mold release film having a through hole penetrating in a thickness direction on an inner surface including a bottom surface of the cavity so that the through hole overlaps the gate;

a pushing runner component is arranged in advance, and pushes a part or all of the periphery of the through hole in the demolding film to be tightly attached to the bottom surface of the mold cavity when the mold is closed, and a communication runner for communicating the through hole and the mold cavity is formed when the mold is closed;

closing the first mold and the second mold; and

injecting resin from the gate into the mold cavity through the through hole and the communicating runner to harden the resin,

the pressing runner component is provided with a through hole in the center and one or more runner parts which extend outwards from the through hole and are opened on the outer peripheral surface, and the communicating runner is formed by the through hole and the runner parts.

2. The method for producing a resin molded article according to claim 1,

the release film is adsorbed to the inner surface of the cavity.

3. The method for producing a resin molded article according to claim 1,

a pressing surface is provided on one end surface of the pressing flow path member, and the flow path portion is formed to be spaced from the one end surface in the extending direction of the through hole.

4. The method for producing a resin molded article according to claim 1,

the first mould is fixedly held with a substrate, the second mould is provided with a mould cavity, and an opening is formed on the surface of the mould cavity facing the first mould;

in the mold clamping position, the opening of the cavity is closed by the substrate, and resin is injected into the cavity to mold resin on the substrate.

5. The method for producing a resin molded article according to claim 4,

a semiconductor chip is disposed at each predetermined position on the substrate, and the pressing runner member is disposed at any one of the predetermined positions in place of the semiconductor chip.

6. A resin molding apparatus, it sets up the gate on the bottom surface of the cavity formed between first mould and second mould, and inject the resin into the cavity from the gate and shape;

the resin molding apparatus includes:

a pressing runner member having a pressing surface which presses a part or all of the periphery of the through hole in the mold release film so that the pressing portion is closely attached to the bottom surface of the cavity; the push runner member forms a communication runner communicating the through hole with the cavity,