JP2021062591A - Resin molding method and resin molding equipment - Google Patents

Abstract

To prevent problems such as peeling and lifting of a release film, which can occur when the release film is applied to the pin gate method of transfer resin molding, without significantly increasing the complexity of the process and configuration.SOLUTION: A resin molding method in which resin is injected through a gate GT opening at the bottom of a cavity 3 formed between a first mold 1 and a second mold 2 at the mold tightening position, a mold release film 5 having an insertion hole 5a penetrating in the thickness direction is placed on the inner surface including the bottom of the cavity 3 so that the insertion hole 5a overlaps the gate GT, and a pressure surface 61 is provided that presses some or all of the area around the insertion hole 5a in the mold release film 5 at the mold tightening position to be adhered to the cavity bottom during mold tightening, and furthermore a pressure flow member 6 is arranged to form a connecting flow path 7 between the insertion hole 5a and the cavity 3 when the mold is tightened.SELECTED DRAWING: Figure 2

Description

The present invention relates to a pin gate type resin molding method in which a gate is provided on the bottom surface of the cavity and resin is injected from the gate, and a resin molding apparatus used therein.

In transfer resin molding, for example, as in Patent Document 1, a pin gate method (or a pin gate method) in which a gate is provided at a position corresponding to the surface of the molded product rather than the side surface, that is, the bottom surface of the cavity in the molding mold, and resin is injected from this gate. Pinpoint gate method) has been proposed.

The general advantages of the pin gate method are that the gate mark is small and inconspicuous, it is easy to increase the number of points and take a large number of pieces, and it is easy to obtain an even pressure distribution. In particular, in resin-sealed molding of IC chips and the like, there is also an advantage that the gate residue is not formed on the circuit board.

On the other hand, in the transfer resin molding, a release film is placed on the inner surface including the bottom surface of the cavity, and the release film is interposed between the resin and the cavity to facilitate the release of the molded product from the cavity. A technique for preventing damage to a molded product during molding is known.

However, no example using a release film in the pin gate method has been found yet.

This is because, in the pin gate method, when the release film is placed on the inner surface of the cavity, the release film covers the gate, so that it is necessary to provide a hole in the portion of the release film corresponding to the gate. This is thought to be because a problem may occur.

Specifically, since the release film is adsorbed on the inner surface of the cavity by negative pressure suction, when a hole is made in the release film as described above, air leaks from the hole and the release film around the gate Adsorption power becomes weak. Then, the release film around the hole may be peeled off from the inner surface of the cavity due to the pressure at the time of resin injection and filling, and the resin may enter through the gap to cause a molding defect.

Japanese Unexamined Patent Publication No. 2019-111692

The present invention has been made in view of the above problems, and a release film that can occur during resin injection while applying a release film to a pingate type transfer resin molding method and taking advantage of both of them. This is intended to prevent problems such as peeling and lifting.

That is, the resin molding method according to the present invention is a resin molding method in which resin is injected into the cavity through a gate opened at the bottom surface of the cavity formed between the first mold and the second mold.
A release film having an insertion hole penetrating in the thickness direction is arranged on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps the gate.
A part or all of the periphery of the insertion hole in the release film has a pressing surface that is pressed at the time of molding to bring it into close contact with the bottom surface of the cavity, and the communication flow path that communicates the insertion hole and the cavity is molded. Place the pressing flow path member that is sometimes formed,
Molding the first mold and the second mold,
It is characterized in that a resin is injected into the cavity from the gate through the insertion hole and the communication flow path and cured.

Further, in the present invention, a gate is provided on the bottom surface of the cavity formed between the first mold and the second mold, and resin is injected into the cavity from the gate for molding.
A release film that is arranged on the inner surface including the bottom surface of the cavity and is provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arranged state.
It has a pressing surface that presses a part or all of the periphery of the insertion hole in the release film so that the pressed portion is brought into close contact with the bottom surface of the cavity, and forms a communication flow path that communicates the insertion hole and the cavity. It may be a resin molding apparatus provided with a pressing flow path member.

According to the present invention described above, even if a release film is used in, for example, a pingate type transfer resin molding method, it is possible to prevent a problem that the release film is peeled off and the molten resin invades the gap with the inner surface of the cavity. ..

It is a top view which shows the substrate in one Embodiment of this invention. It is a schematic cross-sectional view which shows the resin molding apparatus in the mold opening position in the same embodiment. It is a schematic cross-sectional view which shows the resin molding apparatus at the mold clamping position in the same embodiment. It is a plan view and the perspective view which looked at the pressing flow path member in the same embodiment from the back surface. It is a partially enlarged view in FIG. FIG. 5 is a cross-sectional view taken along the line AA in FIG. It is a schematic cross-sectional view for demonstrating the resin molding method using the resin molding apparatus in the same embodiment. It is a schematic cross-sectional view for demonstrating the resin molding method using the resin molding apparatus in the same embodiment. It is a schematic cross-sectional view for demonstrating the resin molding method using the resin molding apparatus in the same embodiment. It is a schematic cross-sectional view for demonstrating the resin molding method using the resin molding apparatus in the same embodiment. It is a schematic cross-sectional view for demonstrating the resin molding method using the resin molding apparatus in the same embodiment. It is a perspective view which shows the pressing flow path member in another embodiment of this invention.

Hereinafter, embodiments of the present invention will be described. It goes without saying that the present invention is not limited to the following embodiments.

<Outline of Embodiment>
The resin molding method according to the present embodiment is resin molding in which resin is injected into the cavity from a gate that opens at the bottom surface of the cavity formed between the first mold and the second mold at the mold clamping position. It ’s a method,
A release film having an insertion hole penetrating in the thickness direction is arranged on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps the gate.
A communication flow path that has a pressing surface that presses a part or all of the periphery of the insertion hole in the release film during mold clamping to bring it into close contact with the bottom surface of the cavity, and that communicates the insertion hole and the cavity during mold clamping. Is provided with a pressing flow path member to be formed at the time of mold clamping.
Molding the first mold and the second mold,
It is characterized in that a resin is injected into the cavity from the gate through the insertion hole and the communication flow path and cured.

In such a method, the pressing flow path member brings the periphery of the insertion hole in the release film into close contact with the inner surface of the cavity at the time of mold clamping, so that the molten resin does not enter the gap between the release film and the inner surface of the cavity. Can be prevented. Further, since the pressing flow path member is formed with a communication flow path for communicating the gate with the cavity, injection of the molten resin into the cavity is not hindered.

In this way, it becomes possible for the first time to use a release film in a pingate type transfer resin molding method. Moreover, since the release film is simply perforated with an insertion hole and a pressing flow path member is provided, the process and structure are not significantly complicated.

As a specific embodiment in which the above-mentioned effect is more prominently exhibited, the release film may be adsorbed on the inner surface of the cavity.

As a specific configuration of the pressing flow path member that can be manufactured relatively easily, one or a plurality of the pressing flow path member having a through hole in the center and extending outward from the through hole to open to the outer peripheral surface. The communication flow path is formed by the through hole and the flow path element.

If one end surface of the pressing flow path member is the pressing surface and the flow path element is formed so as to be separated from the one end surface in the extending direction of the through hole, the pressing surface is the insertion hole in the release film. Since the entire circumference is brought into close contact with the inner surface of the cavity, it is possible to more reliably prevent the resin from entering the gap between the release film and the inner surface of the cavity.

As a specific embodiment of molding a resin on a substrate such as a semiconductor substrate, the first mold holds the substrate, and the second mold has a cavity in which a surface facing the first mold opens. Examples thereof include those in which the substrate is arranged in the opening of the cavity at the mold clamping position, and the resin is formed on the substrate by injecting the resin into the cavity.

The semiconductor chips are formed so as to be formed at a plurality of predetermined positions set in advance on the substrate, and the pressing flow path member is arranged in place of the semiconductor chips at any one or more of the predetermined positions. If this is done, the degree of freedom in selecting the arrangement position of the pressing flow path member is increased, and for example, the pressing flow path member can be arranged at a position suitable for resin injection.

Further, the pressing flow path member can be integrally built with the substrate in advance, so that a step such as positioning of the pressing flow path member becomes unnecessary as compared with the case where the pressing flow path member is a single member. ..

Further, the present invention can also exert the same effect with the following resin molding apparatus.
That is, it is a resin molding apparatus in which a gate is provided on the bottom surface of a cavity formed between the first mold and the second mold, and resin is injected into the cavity from the gate to mold the cavity.
A release film that is arranged on the inner surface including the bottom surface of the cavity and is provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arranged state.
At the mold clamping position, it has a pressing surface that presses a part or all of the periphery of the insertion hole in the release film so that the pressed portion is brought into close contact with the bottom surface of the cavity, and communicates the insertion hole with the cavity. It is a resin molding apparatus provided with a pressing flow path member that forms a communication flow path.

<Detailed Embodiment>
Hereinafter, detailed embodiments will be described with reference to the drawings.
The present embodiment relates to a resin molding method for sealing and covering a required portion of a semiconductor chip arranged on the surface of a substrate with a resin.

Prior to explaining this resin molding method, first, the substrate W and the semiconductor chip C to be sealed with the resin and the resin molding apparatus 100 used in the resin molding method will be described.

<Explanation of board W>
Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. Further, the substrate W may be a carrier used for FOWLP (Fan Out Wsfer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Furthermore, it may be the one that has already been wired or the one that has not been wired.
In this embodiment, as shown in FIGS. 1 and 2, the substrate W has a rectangular shape in a plan view, for example, and the surface Wa has a rectangular shape in a plan view at equal pitches in the vertical and horizontal directions. A plurality of identical semiconductor chips C are arranged so as to project. The substrate W is cut and individualized for each semiconductor chip C after molding. For example, if it is used for FOWLP or FOPLP, the substrate W is sealed without being individualized after molding. It may be separated from the stop resin.

<Explanation of resin molding apparatus 100>
As shown in FIG. 2 and the like, the resin molding apparatus 100 holds the upper mold 1 which is the first mold and the lower mold 2 which is the second mold, and the upper mold 1 and the lower mold 2 and is shown in FIG. A mold clamping mechanism (not shown) that drives the mold to move forward and backward between the mold opening position and the mold clamping position shown in FIG. 3 and the upper mold 1 and the lower mold 2 at the mold clamping position. It is provided with a resin injection mechanism 4 for injecting the resin R into the cavity 3 formed between them.

Each part will be described.
The upper mold 1 is replaceably attached below a fixed platen (not shown). A plurality of suction holes (not shown) are provided on the lower surface of the upper mold 1 (opposing surface facing the lower mold 2), and these suction holes are made negative pressure by a vacuum pump or the like (not shown). It is configured so that the back surface of the substrate W can be adsorbed and fixed.

The lower mold 2 is replaceably attached above a movable platen (not shown), and includes a lower plate 21 and an intermediate plate 22 detachably attached to the upper surface of the lower plate 21. The cavity 3 having a contour slightly smaller than that of the substrate W is formed on the upper surface (opposing surface facing the upper mold) of the intermediate plate 22.

Then, at the mold clamping position, the peripheral portion of the cavity 3 on the upper surface of the intermediate plate 22 is in close contact with the peripheral edge portion of the substrate surface Wa, the upper opening of the cavity 3 is closed by the substrate W, and the cavity 3 is arranged on the substrate W. The semiconductor chip C (formed) is configured to be housed in the cavity 3.

In this embodiment, the depth dimension of the cavity 3 is substantially equal to the thickness dimension of the semiconductor chip C, and the top surface of the semiconductor chip C is set to be in close contact with the bottom surface of the cavity 3 at the mold clamping position. is there. As a result, the resin R does not rotate on the top surface of the semiconductor chip C, and only the side peripheral surface of the semiconductor chip C is covered with the resin R. Therefore, the top surface of the semiconductor chip C is exposed after resin molding. Here, the "top surface" of the semiconductor chip C is a surface opposite to the substrate W and is a surface on the release film 5 side during the resin molding operation.

Further, the intermediate plate 22 is also configured to be lifted from the upper surface of the lower plate 21 by a lift-up mechanism (not shown).

Although not shown, the mold clamping mechanism includes a holding structure for holding the upper mold 1 and the lower mold 2, and a mold raising / lowering mechanism for raising and lowering the lower mold 2 held by the holding structure. ..

The holding structure (not shown) can be raised and lowered to, for example, a base plate, a plurality of guide posts rising from the base plate, the fixed platen fixed to the upper end of the guide posts, and an intermediate portion of the guide posts. It is provided with the movable platen that can be held. Then, as described above, the upper mold 1 is attached below the fixed platen. The upper mold 1 may be attached to the lower surface of the fixed platen via an upper mold holder (not shown). The upper mold holder may be provided with a heater for heating the upper mold 1, and may be further provided with a heat insulating material on the fixed platen side of the heater.
Further, as described above, the lower mold 2 is attached above the movable platen. The lower mold 1 may be attached to the lower surface of the movable platen via a lower mold holder (not shown). The lower mold holder may be provided with a heater for heating the lower mold 2, and may be further provided with a heat insulating material on the movable platen side of the heater.
The mold elevating mechanism includes a ball screw mechanism that elevates and drives the lower mold 2 via the movable platen, a hydraulic cylinder, a toggle mechanism, and the like.

As shown in FIG. 2 and the like, the resin injection mechanism 4 presses the resin injection hole 41 penetrating the lower mold 2 in the thickness direction and the molten resin R filled in the resin injection hole 41 into the cavity 3. It is provided with a plunger mechanism 42 for injecting.

Each part will be described.
The resin injection hole 41 includes a first hole 411 penetrating the intermediate plate 22 in the thickness direction and a second hole 412 penetrating the lower plate 21 in the thickness direction. It is arranged so as to be continuous with the second hole 412.

The first hole 411 has a circular cross-section that tapers toward the bottom surface of the cavity 3, one end of which opens to the bottom surface of the cavity 3 functions as a gate GT, and the other portion serves as a sprue SP. Take on the function.

The second hole 412 has a circular shape having the same cross section in the penetrating direction, and functions as a pot for accommodating the molten resin R.

The plunger mechanism 42 includes a plunger 421 inserted into the second hole 412 from the lower end portion, and an advancing / retreating actuator 422 such as a ball screw or a motor for moving the plunger 421 up / down.

The plunger 421 has a columnar shape whose outer diameter is set to be equal to the inner diameter of the second hole 412, and is slidably fitted into the second hole 412 without play.

The advance / retreat actuator 422 moves the plunger 421 between a standby position whose tip surface is below the upper surface of the second hole 412 and an injection completion position set above the standby position by a predetermined distance. It drives forward and backward. At the standby position, a predetermined amount of tablet-shaped resin R in a solid state is put into the second hole 412 from above and melted by a heating mechanism (not shown) provided on the lower plate 21. Further, when the advance / retreat actuator 422 raises the plunger 421 to the injection completion position from that state, the molten resin R is injected into the cavity 3 via the sprue SP and the gate GT. In this embodiment, a thermosetting resin is used as the tablet-like resin.

Further, the resin molding apparatus 100 includes a release film 5, a film supply mechanism (not shown) for supplying the release film 5 to the upper surface of the intermediate plate 22, and an inner surface of the cavity 3 and a periphery of the cavity 3. It is provided with a film adhesion mechanism that adheres to the upper surface of the intermediate plate 22.

The release film 5 is arranged in close contact with the inner surface including the bottom surface of the cavity 3, so that the release film 5 is interposed between the inner surface of the cavity 3 and the injected resin and solidified in the cavity 3 after molding. The resin R is used to make it easy to peel off from the cavity 3. The description of the material and the like is omitted because it is known.

By the way, in this embodiment, since the gate GT is open to the bottom surface of the cavity 3, the gate is located at a position corresponding to the gate GT in the release film 5 so as not to block the gate GT. An insertion hole 5a having a diameter equal to or slightly larger than the opening diameter of the GT is formed.

Although not shown, the film adhesion mechanism includes a plurality of suction holes provided on the inner surface of the cavity 3 and / or the outer peripheral upper surface of the cavity 3, and a vacuum pump (not shown) for making these suction holes negative pressure. The release film 5 is adsorbed by the negative pressure of each adsorption hole.

Thus, the resin molding apparatus 100 of this embodiment presses the periphery of the insertion hole 5a in the release film 5 through the substrate W at the mold clamping position, and brings the pressing flow path member 6 into close contact with the inner surface of the cavity 3. Is further equipped.

Next, the pressing flow path member 6 will be described in detail.

The pressing flow path member 6 in this embodiment has a thin disk shape having a through hole 6a provided in the center, as shown in FIG. 4 showing a state viewed from the back surface side thereof. The surface 61 is flattened, and the surface 61 serves as a pressing surface according to a claim. On the other hand, a plurality of (here, four) bottomed grooves 6b extending radially are uniformly formed on the back surface 62. Each of these bottomed grooves 6b is provided between the outer peripheral surface and the inner peripheral surface of the pressing flow path member 6. In other words, the outer end surface of each bottomed groove 6b opens to the outer peripheral surface of the pressing flow path member 6, and the inner end surface opens to the inner peripheral surface of the pressing flow path member 6 (that is, the through hole 6a). The bottomed grooves 6b are configured so that the radial outer side of the pressing flow path member 6 and the through hole 6a which is the radial inner side communicate with each other.

The pressing flow path member 6 is manufactured by etching, machining, or the like as a single member separate from the substrate W. Then, as shown in FIG. 6, the back surface 62 of the pressing flow path member 6 is joined to the substrate surface Wa and integrated with the substrate W. In this way, the bottomed groove 6b of the pressing flow path member 6 and the substrate surface Wa form a flow path element 71 separated from the pressing surface (surface) 61 of the pressing member 6 in the penetrating direction of the through hole 6a. It is done like this. The through hole 6a and the flow path element 71 form the communication flow path 7 according to the claim. In this embodiment, as shown in FIG. 5, the flow path element 71 extends in the oblique 45 ° direction, which is different from the arrangement direction of the semiconductor chips C. This is to facilitate the discharge of the resin into the cavity.

Next, regarding the arrangement position of the pressing flow path member 6, as described above, the semiconductor chips C, which are the objects to be sealed by the resin R, are provided on the substrate surface Wa at equal pitches in the vertical and horizontal directions. Therefore, as it is, there is no room for arranging the pressing flow path member 6, but in this embodiment, as shown in FIGS. 1 and 5, one or more of the predetermined positions where the semiconductor chip C should be originally provided. The semiconductor chip C is not provided at the location (here, two locations), and the pressing flow path member 6 is arranged in advance at that location.

Further, the thickness dimension of the pressing flow path member 6 is substantially equal to the distance dimension between the substrate surface Wa and the bottom surface of the cavity 3. This is because, as described above, at the mold clamping position, the surface 61 of the pressing flow path member 6 (pressing surface 61 in the claim) presses the release film 5 via the substrate W, and this is pressed by the cavity 3. This is to make it adhere to the inner surface (bottom surface). The thickness dimension of the pressing flow path member 6 is the dimension between the front surface 61 and the back surface 62, and is equal to the thickness dimension of the semiconductor chip C in this embodiment.

<Explanation of resin molding method>
Next, refer to FIGS. 2, 3, 7 to 11 for an example of a resin molding method for sealing and molding the semiconductor chip C of the substrate W using the resin molding apparatus 100 configured as described above. explain. In FIGS. 2, 3 and 7 to 11, each part including the substrate W is modeled for easy understanding.

First, as shown in FIG. 2, the mold opening position is set so that the upper mold 1 and the lower mold 2 are separated from each other.

Next, as shown in FIG. 7, the release film 5 is placed on the intermediate plate 22 on the lower plate 21 and adsorbed, while the substrate W is placed in a posture in which the semiconductor chip C faces the cavity 3. It is attracted to and held on the lower surface of the upper mold 1.

Next, as shown in FIG. 8, the intermediate plate 22 is lifted from and separated from the lower plate 21 by a lift-up mechanism (not shown). At this time, the plunger 421 is set in a standby position whose tip surface is below the upper surface opening of the second hole 412 provided in the lower plate 21.

Then, the tablet resin R in a solid state is charged from the upper surface of the second hole 412, and then the tablet resin R is melted by a heating mechanism (not shown) provided on the lower plate 21.

Next, the mold is fastened. That is, as shown in FIG. 3, the lower plate 21 is raised by the mold elevating mechanism to be integrated with the intermediate plate 22, and the release film 5 is formed between the upper surface of the intermediate plate 22 and the peripheral edge of the substrate surface Wa. Sandwich. This position is the mold clamping position. At this time, as described above, the pressing surface 61 of the pressing flow path member 6 presses the periphery of the insertion hole 5a in the release film 5 to bring it into close contact with the bottom surface of the cavity 3.

Next, as shown in FIG. 9, the plunger 421 is raised to the injection completion position. As a result, the molten resin R is injected and filled into the cavity 3.

This will be described in more detail. When the plunger 421 rises from the standby position, the molten resin R flows into the through hole 6a of the pressing flow path member 6 shown in FIG. 6 or the like through the insertion hole 5a of the sprue SP, the gate GT, and the release film 5. Further, it flows into the cavity 3 through the flow path element 71 formed by the bottomed groove 6b of the pressing flow path member 6 and the substrate surface Wa.

In this way, after the molten resin R is filled in the cavity 3, the resin R is cured and solidified by waiting for a certain period of time in a heated state.

After that, as shown in FIG. 10, the lower mold 2 (lower plate 21 and intermediate plate 22) is lowered by the mold elevating mechanism to set the mold opening position. At this time, the residual resin R (cal) remaining on the sprue SP, the gate GT, and the upper part of the second hole 412 is peeled off from the substrate W, and the substrate W after resin molding is removed from the upper mold 1. On the other hand, as shown in FIG. 11, the cal R is taken out by separating the intermediate plate 22 from the lower plate 21 by a lift-up mechanism and discarded.

<Effect>
According to the present embodiment as described above, at the mold clamping position or at the time of mold clamping, the pressing surface 61 of the pressing flow path member 6 forms a closed annular shape (here, an annular shape), and the pressing surface 61 is a release film. Since the entire circumference of the insertion hole 5a in No. 5 is brought into close contact with the bottom surface of the cavity 3, no gap is formed between them, and the molten resin R can be reliably prevented from entering the release film 5 and the inner surface of the cavity. Further, since the communication flow path 7 is formed in the pressing flow path member 6, the injection of the molten resin R into the cavity 3 is not hindered.

In this way, it becomes possible for the first time to use the release film 5 in the pin gate type transfer resin molding method. Moreover, since the release film 5 is only provided with the insertion hole 5a and the pressing flow path member 6, the process and structure are not significantly complicated.

In particular, in the present embodiment, the pressing flow path member 6 can be arranged instead of the semiconductor chip C at any of a plurality of predetermined positions where the semiconductor chip C should be arranged, so that the pressing flow path member 6 can be arranged. The degree of freedom in selecting the arrangement position of 6 is increased, and the pressing flow path member 6 can be arranged at a position suitable for resin injection. In this embodiment, for example, as shown in FIG. 1, the pressing flow path members 6 serving as resin injection ports are arranged at two symmetrical locations on the center line extending in the longitudinal direction (left-right direction) of the rectangular substrate W. Therefore, the resin can be injected into the cavity 3 as evenly and promptly as possible.

Further, since the pressing flow path member 6 is previously joined to the substrate W and integrated, there is an effect that a step such as positioning of the pressing flow path member 6 is not required at the position of the molding die.

<Other Embodiments>
The present invention is not limited to the above embodiment.

For example, in the above-described embodiment, the pressing flow path member 6 is joined to the substrate W as a single member separate from the substrate W, but the pressing flow path member 6 may be integrally formed with the substrate W.
Further, the release film 5 to which the pressing flow path member 6 is attached in advance may be supplied to the molding die. In this case, the positional relationship between the pressing flow path member 6, the release film 5, the substrate W, and the semiconductor chip C at the time of molding can be the same as in the above-described embodiment.

Further, as shown in FIG. 12, instead of the bottomed groove 6b, a hole 6b'that communicates the outer peripheral surface of the pressing flow path member 6 with the through hole 6a may be provided.

Further, the pressing flow path member 6 may be arranged upside down. In this case, the bottomed groove 6b faces the release film 5 side, and the entire periphery of the insertion hole 5a in the release film 5 cannot be pressed in the portion corresponding to the bottomed groove 6b, but the mold release film 5 is removed. It can contribute to the prevention of peeling of the film 5.

The pressing flow path member 6 may have a rectangular or polygonal disc shape instead of a disc shape.

The pressing flow path member 6 may be composed of, for example, a plurality of pressing elements arranged around the insertion hole 5a so as to be separated from each other, instead of a single unit. In this case, the gap between the pressing elements forms a communication flow path.

Regarding the release film 5, the insertion hole 5a may be pre-drilled as in the above embodiment, or the release film 5 may be placed on the intermediate plate 22 and adsorbed, and then the position of the gate GT. It may be perforated according to the above.

The resin molding method is not limited to the above-described embodiment, and the procedure may be changed back and forth. Further, for example, the release film 5 may not be adsorbed, and the pressing flow path member 6 may simply press the periphery of the insertion hole 5a. Even in this way, the release film 5 can be brought into close contact with the inner surface of the cavity 3 due to the filling pressure of the resin R.

Although the cavity 3 is provided only in the lower mold 2 in the above embodiment, it may be provided in the upper mold and molded by injecting resin into both the front and back surfaces of the substrate.

The object to be molded is not limited to the substrate W on which the semiconductor chip C is provided, and this resin molding method can also be applied when only the resin R is molded by the cavity 3.
The present invention can be applied not only to a molding die that moves up and down, but also to a molding die that moves forward and backward in a horizontal direction or in another direction.

In addition, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

100 ... Resin molding device 1 ... Upper mold (1st mold)
2 ... Lower type (2nd type)
3 ... Cavity GT ... Gate R ... Resin 5 ... Release film 5a ... Insertion hole 6 ... Pressing flow path member 61 ... Pressing surface 6a ... Through hole 7 ...・ Communication flow path 71 ・ ・ ・ Flow path element W ・ ・ ・ Substrate C ・ ・ ・ Semiconductor chip

Claims (7)

A resin molding method in which a gate is provided on the bottom surface of a cavity formed between the first mold and the second mold, and resin is injected into the cavity through the gate.
A release film having an insertion hole penetrating in the thickness direction is arranged on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps the gate.
A part or all of the periphery of the insertion hole in the release film is pressed at the time of molding to bring it into close contact with the bottom surface of the cavity, and a communication flow path for communicating the insertion hole and the cavity is formed at the time of molding. Place the members and
Molding the first mold and the second mold,
A resin molding method characterized by injecting a resin from the gate into the cavity through the insertion hole and the communication flow path and curing the resin. The resin molding method according to claim 1, wherein the release film is adsorbed on the inner surface of the cavity. The pressing flow path member has a through hole in the center, and also includes one or a plurality of flow path elements that extend outward from the through hole and open to the outer peripheral surface, and the through hole and the flow path element. The resin molding method according to claim 1 or 2, wherein the communication flow path is formed by the above method. The resin molding method according to claim 3, wherein a pressing surface is set on one end surface of the pressing flow path member, and the flow path element is formed so as to be separated from the one end surface in the extending direction of the through hole. The first mold holds a substrate, and the second mold is provided with a cavity in which a surface facing the first mold opens.
The resin molding according to any one of claims 1 to 4, wherein at the mold clamping position, the opening of the cavity is closed by the substrate, the resin is injected into the cavity, and the resin is molded on the substrate. Method. The resin molding method according to claim 5, wherein the semiconductor chip is arranged at each predetermined position on the substrate, and the pressing flow path member is arranged instead of the semiconductor chip at any of the predetermined positions. .. A resin molding device in which a gate is provided on the bottom surface of a cavity formed between the first mold and the second mold, and resin is injected into the cavity from the gate for molding.
A release film that is arranged on the inner surface including the bottom surface of the cavity and is provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arranged state.
It has a pressing surface that presses a part or all of the periphery of the insertion hole in the release film so that the pressed portion is brought into close contact with the bottom surface of the cavity, and forms a communication flow path that communicates the insertion hole and the cavity. A resin molding apparatus including a pressing flow path member.

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