JP2008053509A - Resin sealing/molding apparatus of electronic component - Google Patents

Resin sealing/molding apparatus of electronic component Download PDF

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JP2008053509A
JP2008053509A JP2006228941A JP2006228941A JP2008053509A JP 2008053509 A JP2008053509 A JP 2008053509A JP 2006228941 A JP2006228941 A JP 2006228941A JP 2006228941 A JP2006228941 A JP 2006228941A JP 2008053509 A JP2008053509 A JP 2008053509A
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mold
resin
electronic component
cavity
heat sink
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JP5128095B2 (en
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Hirotaka Okamoto
裕貴 岡本
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Towa Corp
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Towa Corp
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Priority to TW096120517A priority patent/TW200811968A/en
Priority to KR1020070066899A priority patent/KR100848746B1/en
Priority to CNB2007101485207A priority patent/CN100536100C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing/molding apparatus of an electronic component which can position a heat sink in a cavity easily (simply) and correctly by forming a protrusion in a cavity for resin molding prepared in a metal mold for resin sealing/molding of the electronic component, even if it is a thinned package product and the heat sink. <P>SOLUTION: A heat sink 5 can be positioned while penetrating with regard to one or a plurality of protrusions 18 (a front edge portion 18a in a gate piece 14 and a front edge 18b of an ejector pin 10 (mold releasing pin)) formed in a cavity 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、一方の型と他方の型とから少なくとも成る電子部品の樹脂封止成形用金型を用いて、一方の型に少なくとも設けた樹脂成形用キャビティ内に、電子部品並びに放熱板を金型の型締時に流動性樹脂にて封止成形して成形品を成形する電子部品の樹脂封止成形装置の改良に関するものである。   According to the present invention, an electronic component and a heat dissipation plate are placed in a resin molding cavity provided at least in one mold by using a mold for resin sealing molding of an electronic component including at least one mold and the other mold. The present invention relates to an improvement in a resin sealing molding apparatus for an electronic component that molds a molded product by sealing with a fluid resin when the mold is clamped.

従来から、上型と下型とから成る電子部品の樹脂封止成形用金型を用いて上下両型に設けた樹脂成形用キャビティ内に、電子部品並びに放熱板を金型の型締時に流動性樹脂にて封止成形して封止済基板（成形品）を成形することが行われている（例えば、特許文献１及び特許文献２参照。）。   Conventionally, an electronic component and a heat sink are flown at the time of mold clamping in resin molding cavities provided on both upper and lower molds by using a mold for resin sealing molding of electronic parts consisting of an upper mold and a lower mold. A sealed substrate (molded product) is molded by sealing with a functional resin (see, for example, Patent Document 1 and Patent Document 2).

即ち、前記した特許文献１及び特許文献２では、放熱板を下型側のキャビティ内に位置決めし、且つ半導体チップ等の電子部品の装着されたリードフレームを載置セットし、さらに、この状態で、キャビティ内に流動性樹脂を樹脂通路を介して注入充填する半導体装置の製造方法が開示されている。
前記した特許文献１及び特許文献２では、金型の型締時に流動性樹脂にて封止成形する際に、キャビティ内の放熱板における移動防止について提案されている。
特許文献１の一例としては、放熱板自体に凸部を設け、前記凸部とエジェクタとを互いに引っ掛ける様にして前記エジェクタに放熱板を固定するもの、特許文献２の一例としては、キャビティ内に配置した放熱板を金型のほぼ樹脂注入口のほぼ軸線上に配置した支持ピンによって支えること、さらには放熱板の下面に位置ずれ防止凹部を介して支持ピンにより放熱板を支持するものが開示されている。 That is, in Patent Document 1 and Patent Document 2 described above, the heat sink is positioned in the cavity on the lower mold side, and a lead frame on which an electronic component such as a semiconductor chip is mounted is placed and set. A method of manufacturing a semiconductor device in which a fluid resin is injected and filled into a cavity through a resin passage is disclosed.
In Patent Document 1 and Patent Document 2 described above, when the mold is clamped with a fluid resin at the time of mold clamping, it is proposed to prevent movement of the heat sink in the cavity.
As an example of Patent Document 1, a heat sink is provided with a convex portion, and the heat sink is fixed to the ejector so that the convex portion and the ejector are hooked to each other. Disclosed is that the heat sink is supported by a support pin that is located on the axis of the resin injection port, and that the heat sink is supported by the support pin on the lower surface of the heat sink via a misalignment prevention recess. Has been.

ところで、前記した特許文献１及び特許文献２における半導体装置は、上下両パッケージ製品を開示しているが、近年のパッケージ製品の薄型化傾向を反映してか、薄型化した上下両パッケージ製品に換えて、上下いずれか一方の片側パッケージ製品が製造されている。さらには、この薄型化した片側パッケージ製品を上下方向に複数枚積層する積層型パッケージ製品も製造されている。
一方、この薄型化した片側パッケージ製品のパッケージ部分に放熱性を向上させるために放熱板を装着することもあり、パッケージ部分の薄型化に加えて放熱板の薄型化も行われている。 By the way, although the above-described semiconductor devices in Patent Document 1 and Patent Document 2 disclose both upper and lower package products, they reflect the trend of thinning of package products in recent years or are replaced with thinned upper and lower package products. Thus, one of the upper and lower one-side package products is manufactured. Furthermore, a stacked package product is also manufactured in which a plurality of thinned one-side package products are stacked in the vertical direction.
On the other hand, a heat sink may be attached to the package portion of the thinned one-side package product in order to improve heat dissipation, and the heat sink is made thinner in addition to the package portion being thinned.

特開２００１−１１０８３０号公報JP 2001-110830 A 特開平１１−２７４１９６号公報JP-A-11-274196

しかしながら、前記した特許文献１及び特許文献２によれば、薄型化した上下両側、或は片側パッケージ製品のパッケージ部分（キャビティ内）に放熱板を移動することなく固定（支持）するのには、以下のような問題点が考えられる。
即ち、薄型化した放熱板を移動せず固定（支持）するのには、エジェクタ（支持ピン）が最低でも必ず三本必要となる。そして、三本以上のエジェクタ（支持ピン）に対応し、薄型化した放熱板に形成される凸部の形成、或は支持ピンの形成においては、非常に精度を高める必要が生じてくる。このことは、コスト高の要因となる。
また、放熱性を向上させるためには、放熱板をパッケージ部分から露出させることが、放熱板の薄型化もあいまって強く要求されている。そのため、薄型化した金型、放熱板或はエジェクタ（支持ピン）への精度良く且つ複雑な加工をより一層要求されるので、莫大なコストを費やす要因となっている。
さらには、前記した特許文献１及び特許文献２における放熱板を樹脂成形用キャビティ内に位置決めする際に、最低三本以上のエジェクタ（支持ピン）をキャビティ内で水平状態を確実に維持させる必要が生じるので、キャビティ内でのエジェクタ（支持ピン）の制御をシビアに対応しなければならない。つまり、金型内の構造が複雑化する。 However, according to Patent Document 1 and Patent Document 2 described above, in order to fix (support) the heat sink without moving to the thinned upper and lower sides or the package portion (inside the cavity) of the one-side package product, The following problems can be considered.
That is, at least three ejectors (support pins) are always required to fix (support) the thinned heat sink without moving. In addition, it is necessary to increase the accuracy in forming convex portions formed on a thin heat sink corresponding to three or more ejectors (support pins) or forming support pins. This is a cause of high costs.
Further, in order to improve the heat dissipation, it is strongly required to expose the heat sink from the package portion, together with the thin heat sink. For this reason, since a more precise and complicated process is required for a thin mold, a heat sink or an ejector (support pin), it is a factor of enormous cost.
Furthermore, when positioning the heat sink in Patent Document 1 and Patent Document 2 in the resin molding cavity, it is necessary to reliably maintain at least three ejectors (support pins) in a horizontal state in the cavity. As a result, the control of the ejector (support pin) in the cavity must correspond to severe. That is, the structure in the mold becomes complicated.

従って、本発明は、薄型化したパッケージ製品並びに放熱板であっても、電子部品の樹脂封止成形用金型に設けた樹脂成形用キャビティ内に突出部を形成することにより、放熱板をキャビティ内に容易（単純）に且つ精度良く位置決めすることができる電子部品の樹脂封止成形装置を提供することを目的とする。   Accordingly, the present invention provides a heat sink that has a reduced thickness by forming a protrusion in a resin molding cavity provided in a mold for resin sealing molding of electronic parts, even for thin package products and heat sinks. It is an object of the present invention to provide an electronic component resin sealing molding apparatus that can be easily (simple) and accurately positioned inside.

そこで、前記技術的課題を解決するための本発明に係る電子部品の樹脂封止成形装置は、一方の型と他方の型とから少なくとも成る電子部品の樹脂封止成形用金型と、一方の型に少なくとも設けた樹脂成形用キャビティ内に、放熱板並びに電子部品を金型の型締時に流動性樹脂にて封止成形して成形品を成形する電子部品の樹脂封止成形装置であって、
キャビティ内に形成される１又は複数の突出部に対して、放熱板を貫通状態で位置決めすることを特徴とする。 Accordingly, an electronic component resin sealing molding apparatus according to the present invention for solving the technical problem includes an electronic component resin sealing molding die comprising at least one mold and the other mold, An electronic component resin sealing molding apparatus for molding a molded product by sealing and molding a heat sink and an electronic component with a fluid resin at the time of mold clamping in a resin molding cavity provided at least in a mold. ,
The heat radiating plate is positioned in a penetrating state with respect to one or a plurality of protrusions formed in the cavity.

また、前記技術的課題を解決するための本発明に係る電子部品の樹脂封止成形装置は、請求項１に記載の前記突出部は、前記金型の型締時に流動性樹脂を注入充填する樹脂経路に形成すること、及び／又は、成形品突出用の離型ピンを用いることを特徴とする。   Moreover, the resin sealing molding apparatus of the electronic component which concerns on this invention for solving the said technical subject WHEREIN: The said protrusion part of Claim 1 injects and fills a fluid resin at the time of the mold clamping of the said metal mold | die. It is characterized in that it is formed in a resin path and / or a release pin for projecting a molded product is used.

また、前記技術的課題を解決するための本発明に係る電子部品の樹脂封止成形装置は、請求項２に記載の樹脂通路の一部又は全体を前記金型から着脱自在に内装することを特徴とする。   Moreover, the resin sealing molding apparatus of the electronic component which concerns on this invention for solving the said technical subject installs part or the whole of the resin channel | path of Claim 2 so that attachment or detachment is possible from the said metal mold | die. Features.

本発明によれば、電子部品の樹脂封止成形用金型に設けた樹脂成形用キャビティ内に放熱板を容易（単純）に且つ精度良く位置決めすることにより、放熱板並びに電子部品を装着されたパッケージ製品（成形品）の生産性をより一層向上することができると云う優れた効果を奏する。   According to the present invention, the heat radiating plate and the electronic component are mounted by easily (simplely) and accurately positioning the heat radiating plate in the resin molding cavity provided in the resin sealing molding die of the electronic component. There is an excellent effect that the productivity of the package product (molded product) can be further improved.

以下、本実施形態において、図１及び図５を用いて詳細に説明する。
図１及び図２は、電子部品の樹脂封止成形装置に搭載された金型要部である。
図３から図５は、本装置に搭載された他の金型要部である。 Hereinafter, in this embodiment, it demonstrates in detail using FIG.1 and FIG.5.
1 and 2 show a main part of a mold mounted on a resin sealing molding apparatus for electronic components.
3 to 5 are other mold main parts mounted on the apparatus.

まず、図１及び図２に示す電子部品の樹脂封止成形用金型構造をベースにし、金型を用いる樹脂封止成形方法について説明する。図３から図５においても、図１及び図２に示す符号を転用して説明する。
即ち、金型は、他方の型（固定上型１）と、該上型１に対向配置した一方の型（可動中間型２）と、可動中間型２のパーティングライン面（ P.L面）に対設し且つ放熱板５を嵌装セットする樹脂成形用のキャビティ３と、電子部品４を装着した基板６を供給セットするセット用凹所７と、更に、可動中間型２の下方に別の型（下型）に配置した樹脂材料供給用のポット（図示なし）と、ポット内に嵌装した樹脂加圧用のプランジャ（図示なし）と、ポットとキャビティ３とを連通させる樹脂移送用の樹脂通路８と、両型１・２に少なくとも夫々配設したカートリッジヒータ、及び／又はフレキシブルヒータ等の加熱手段（図示なし）と、キャビティ３内で成形した樹脂成形体（成形品）９をキャビティ３内から突出して離型する成形品突出用の離型ピン（エジェクターピン１０）と、キャビティ３と金型外部とを連通させるエアベント（図示なし）と、が含まれる。 First, a resin sealing molding method using a mold based on a mold structure for resin sealing molding of an electronic component shown in FIGS. 1 and 2 will be described. 3 to 5 will be described using the reference numerals shown in FIGS.
That is, the mold is formed on the other mold (fixed upper mold 1), one mold (movable intermediate mold 2) arranged opposite to the upper mold 1, and the parting line surface (PL surface) of the movable intermediate mold 2. A cavity 3 for resin molding for mounting and setting a heat sink 5, a setting recess 7 for supplying and setting a substrate 6 on which an electronic component 4 is mounted, and another part below the movable intermediate mold 2 A resin material supply pot (not shown) arranged in a mold (lower mold), a resin pressurizing plunger (not shown) fitted in the pot, and a resin transfer resin for communicating the pot with the cavity 3 Cavity 3 includes a passage 8, a heating means (not shown) such as a cartridge heater and / or a flexible heater disposed at least in both molds 1 and 2, and a resin molded body (molded product) 9 molded in cavity 3. For projecting molded parts that protrude from the inside and release -Type pin (ejector pin 10), and an air vent for communicating the cavity 3 and the mold outside (not shown), it is included.

金型１・２は、図１及び図２において、三型構造にしているが、二型さらには四型以上の金型構造に採用することができる。また、本装置に搭載される金型１・２構造を単数個ではなく、所要数を並列に配設するモジュール方式に採用することができる。   Although the molds 1 and 2 have a three-type structure in FIGS. 1 and 2, they can be used in a mold structure of two types or four or more types. Moreover, it is possible to adopt a modular system in which the required number of molds 1 and 2 mounted on the apparatus is not a single structure but is arranged in parallel.

電子部品４は、図例のとおり、基板６上に装着されたＩＣ等の半導体チップ１１と該チップ１１と基板６とを電気的に接続するワイヤ１２とで構成されている。図例には、基板６に対して該チップ１１を単数個配置しているが、該チップ１１を基板６に対して複数個装着するマップ型或はマトリックス型の基板６を採用することができる。このマップ型或はマトリックス型の基板６であれば、該チップ１１に対応してキャビティ３を所要数、或は複数の該チップ１１を一群とする一括キャビティを単数群又は所要複数群を、金型（この場合、可動中間型２）に形成することができる。
また、上記したワイヤボンディング基板に限定されず、フリップチップ基板、或はウェーハレベルパッケージ基板に採用することができる。
さらには、上記した様々な基板におけるパッケージ製品を上下方向に所要数積層する積層型パッケージ基板にも採用することができる。 The electronic component 4 includes a semiconductor chip 11 such as an IC mounted on a substrate 6 and wires 12 that electrically connect the chip 11 and the substrate 6 as shown in the figure. In the illustrated example, a single chip 11 is arranged on the substrate 6, but a map type or matrix type substrate 6 on which a plurality of the chips 11 are mounted on the substrate 6 can be adopted. . In the case of this map type or matrix type substrate 6, a required number of cavities 3 corresponding to the chips 11, or a single group or a required plurality of groups of collective cavities including a plurality of the chips 11 as a group, A mold (in this case, the movable intermediate mold 2) can be formed.
Further, the present invention is not limited to the above-described wire bonding substrate, and can be employed as a flip chip substrate or a wafer level package substrate.
Furthermore, the present invention can be applied to a stacked package substrate in which a required number of package products on the various substrates described above are stacked in the vertical direction.

放熱板５は、薄型化したパッケージ製品の動向に反映し、図例では、電子部品４と限りなく接近した非接触状態で電子部品４側に載置される。この載置された放熱板５は、樹脂封止成形後には、樹脂成形体９における天面の水平部分が露出状態となる。この露出状態の放熱板５により、より一層放熱性を向上させ、さらに薄型化したパッケージ製品に適応する樹脂成形体９（成形品）に構成されている。そして、放熱板５は、前記したワイヤボンディング基板とは樹脂封止成形前に固着していない。つまり、樹脂封止成形時において金型１・２内に嵌装セットされた電子部品４並びに放熱板５を樹脂材料によって一体化させる。そして、図１に示す放熱板５では、水平部１５と該水平部１５を支持する支持部１６とで少なくとも構成され、該水平部１５・支持部１６には、樹脂封止成形時において加熱溶融化された樹脂材料（流動性樹脂１７）が円滑に流動するように開口部分が所要箇所形成される。なお、放熱板５、主に水平部１５の外形は、円形或は多角形状となる。   The heat sink 5 is reflected on the trend of thinned package products, and is placed on the electronic component 4 side in a non-contact state as close as possible to the electronic component 4 in the illustrated example. As for this mounted heat sink 5, the horizontal part of the top | upper surface in the resin molding 9 will be in an exposed state after resin sealing molding. The exposed heat radiating plate 5 constitutes a resin molded body 9 (molded product) that is further improved in heat dissipation and adapted to a thinner package product. And the heat sink 5 is not adhering to the above-described wire bonding substrate before resin sealing molding. That is, at the time of resin sealing molding, the electronic component 4 and the heat sink 5 fitted and set in the molds 1 and 2 are integrated with the resin material. 1 includes at least a horizontal portion 15 and a support portion 16 that supports the horizontal portion 15, and the horizontal portion 15 and the support portion 16 are heated and melted during resin sealing molding. An opening portion is formed at a required location so that the resin material (fluid resin 17) that has been converted to flow smoothly. The outer shape of the heat radiating plate 5, mainly the horizontal portion 15, is circular or polygonal.

樹脂通路７は、例えば、ポットに対向配置した樹脂分配用のカルとランナ・ゲート（スプル）とから構成されており、図例において、キャビティ３の略中央部に開口したゲート口１３から流動性樹脂１７がキャビティ３内に注入充填される（図２参照）。
ゲート口１３は、可動中間型２に設けたゲートピース１４に形成される。そして、ゲートピース１４は、可動中間型２から着脱自在に内装するように構成されている。
ゲートピース１４におけるゲート口１３の先端部分は、キャビティ３の水平面よりも突出した状態で、且つ放熱板５をキャビティ３内に載置セット時に貫通状態となっており、この突出部位を突出部１８ａとして示す。つまり、図１に示すように、突出部１８は、ゲートピース１４のゲート口１３を含む先端部分１８ａ並びにエジェクターピン１０の先端部分１８ｂを総称する。
このように、両突出部１８ａ・１８ｂの二箇所を、放熱板５の水平部１５の開口部分に貫通状態で、放熱板５を効率良く位置決めするように構成されている。このとき、キャビティ３の水平面と放熱板５の水平部とは接触状態で載置セットされる。また、放熱板５の水平部１５における開口部分よりも突出部１８の先端部位を貫通状態で突出している。貫通状態で突出部１８を突き出すことにより放熱板５を上下方向並びに水平方向への移動を効率良く防止することができる。
従って、キャビティ３内における突出部１８は、略中央部分の突出部１８ａと、突出部１８ａ周囲の所定箇所にもう一方の突出部１８ｂとの二箇所を配置構成するだけで、放熱板５をキャビティ３内に容易（単純）に且つ精度良く位置決めすることができる。 The resin passage 7 is composed of, for example, a resin distributing cull and a runner gate (sprue) arranged opposite to the pot. In the illustrated example, the resin passage 7 has a fluidity from a gate port 13 opened substantially at the center of the cavity 3. Resin 17 is injected and filled into the cavity 3 (see FIG. 2).
The gate port 13 is formed in the gate piece 14 provided in the movable intermediate mold 2. The gate piece 14 is configured to be detachably mounted from the movable intermediate mold 2.
The front end portion of the gate port 13 in the gate piece 14 is in a state of protruding from the horizontal surface of the cavity 3 and is in a penetrating state when the heat sink 5 is placed in the cavity 3 and set. As shown. That is, as shown in FIG. 1, the protruding portion 18 is a generic term for the tip portion 18 a including the gate port 13 of the gate piece 14 and the tip portion 18 b of the ejector pin 10.
In this way, the heat radiating plate 5 is efficiently positioned with the two protrusions 18a and 18b passing through the opening of the horizontal portion 15 of the heat radiating plate 5. At this time, the horizontal surface of the cavity 3 and the horizontal portion of the heat sink 5 are placed and set in contact with each other. Moreover, the front-end | tip part of the protrusion part 18 protrudes in the penetration state rather than the opening part in the horizontal part 15 of the heat sink 5. FIG. By projecting the protrusion 18 in the penetrating state, the heat sink 5 can be efficiently prevented from moving in the vertical direction and in the horizontal direction.
Therefore, the projecting portion 18 in the cavity 3 is configured such that the heat radiating plate 5 is formed as a cavity only by arranging and arranging the projecting portion 18a of the substantially central portion and the other projecting portion 18b around the projecting portion 18a. 3 can be positioned easily (simple) and with high accuracy.

電子部品４並びに放熱板５を金型１・２に載置セットするのには、電子部品４側を下方に向けた状態とし、この電子部品４を嵌装させるキャビティ３も下方側に形成され、この下方側に形成されたキャビティ３の水平面に突き出した二箇所の突出部１８（１８ａ・１８ｂ）を用いる。
まず、金型１・２の型開時に、放熱板５における水平部１５の開口部分に二箇所の突出部１８（１８ａ・１８ｂ）を貫通状態で位置決めし、この効率良く位置決めされた放熱板５をキャビティ３内に供給セットした状態で、電子部品４を装着された基板６を載置セットするように構成されている。
つまり、放熱板５を突出部１８に位置決めする場合、図１及び図２では、ゲートピース１４における先端部分１８ａとエジェクターピン１０の先端部分１８ｂとの二箇所に貫通状態で挿入する。図３では、エジェクターピン１０の先端部分１８ｂとさらに同様のエジェクターピン１０の別の先端部分１８ｃとの二箇所に貫通状態で挿入する。この図３では、ゲートピース１４の先端部分はキャビティ３内に突き出さず、キャビティ３の水平面とゲート口１３とが略水平状態で形成される。当然のことながら、放熱板５の外形形状、例えば、真円形状であれば、ゲートピース１４の先端部分１８ａの一箇所をキャビティ３内の略中央（中心）部分にて放熱板５を貫通状態で位置決めすることができる。
また、図１から図３では、ゲートピース１４をキャビティ３内の略中央部分に形成しているが、図４及び図５に示すフリップチップ基板を樹脂封止する際には、該チップ１１と基板７との間にも流動性樹脂１７を注入充填（アンダーフィル）することも考えられるので、ゲート口１３の配置を、図４ではキャビティ３の水平面における端部、図５ではキャビティ３の側面部分の基板７に接触状態で開口させることができる。図３から図５では、放熱板５を貫通状態で位置決めする場合、エジェクターピン１０の二箇所の先端部分１８ｂ・１８ｃで行う。そして、図１から図４までは、樹脂通路７におけるゲートピース１４を着脱自在の構造にしているが、図５では、着脱しない金型、さらに可動中間型２でもなく二型構造における可動下型１９に形成する。
以上のとおり、薄型化したパッケージ製品並びに放熱板５であっても、電子部品４の樹脂封止成形用金型１・２に設けた樹脂成形用キャビティ３内に突出部１８を形成することにより、放熱板５をキャビティ３内に容易（単純）に且つ精度良く位置決めすることができる。 In order to place the electronic component 4 and the heat sink 5 on the molds 1 and 2, the electronic component 4 side is directed downward, and the cavity 3 into which the electronic component 4 is fitted is also formed on the lower side. Two projecting portions 18 (18a and 18b) projecting to the horizontal surface of the cavity 3 formed on the lower side are used.
First, when the molds 1 and 2 are opened, two projecting portions 18 (18a and 18b) are positioned through the opening portion of the horizontal portion 15 of the heat radiating plate 5, and the heat radiating plate 5 positioned efficiently. Is placed and set in the cavity 3, and the substrate 6 on which the electronic component 4 is mounted is placed and set.
That is, when positioning the heat sink 5 to the protrusion 18, in FIG. 1 and FIG. 2, the heat sink 5 is inserted in two positions, the front end portion 18 a of the gate piece 14 and the front end portion 18 b of the ejector pin 10. In FIG. 3, it inserts in the penetration state in two places, the front-end | tip part 18b of the ejector pin 10, and another front-end | tip part 18c of the ejector pin 10 similar. In FIG. 3, the distal end portion of the gate piece 14 does not protrude into the cavity 3, and the horizontal surface of the cavity 3 and the gate port 13 are formed in a substantially horizontal state. As a matter of course, if the outer shape of the heat sink 5 is, for example, a perfect circle shape, one end of the gate piece 14 is passed through the heat sink 5 at a substantially central (center) portion in the cavity 3. Can be positioned.
1 to 3, the gate piece 14 is formed at a substantially central portion in the cavity 3. However, when the flip chip substrate shown in FIGS. Since it is also possible to inject and fill (underfill) the fluid resin 17 between the substrate 7 and the substrate 7, the arrangement of the gate port 13 is shown in FIG. 4 at the end of the cavity 3 in the horizontal plane, and in FIG. An opening can be made in contact with the partial substrate 7. 3 to 5, when positioning the heat sink 5 in the penetrating state, it is performed at the two tip portions 18 b and 18 c of the ejector pin 10. 1 to 4, the gate piece 14 in the resin passage 7 is configured to be detachable. In FIG. 5, the mold is not detachable, and the movable lower mold in the two-type structure is not the movable intermediate mold 2. 19 to form.
As described above, even if the package product and the heat sink 5 are thinned, the protrusion 18 is formed in the resin molding cavity 3 provided in the resin sealing molding molds 1 and 2 of the electronic component 4. The heat sink 5 can be easily (simple) and accurately positioned in the cavity 3.

従って、予め、両型１・２を加熱手段にて樹脂成形温度にまで加熱し、まず、可動中間型２（或るは、可動下型１９）の所定位置、図１及び図２では、二箇所の突出部１８ａ・１８ｂ、図３から図５では二箇所の突出部１８ｂ・１８ｃに、放熱板５の水平部１５における開口部分を貫通状態で放熱板５を位置決めし、次に、貫通状態で位置決めされた放熱板５をキャビティ３内に嵌装した状態で、電子部品５を装着した基板６（或は、リードフレーム）を載置セットし、且つ、ポット内に樹脂材料を供給し、可動中間型２（或るは、可動下型１９）を上動して両型１・２を型締めする。このとき、キャビティ３内には放熱板５並びに電子部品４とその周辺の基板６とが嵌装セットされる。
次に、ポット内で加熱溶融化された樹脂材料をプランジャで加圧することによりキャビティ３内に流動性樹脂１７を注入充填すると共に、キャビティ３内で放熱板５並びに電子部品４とその周辺の基板６とをキャビティ３の形状に対応した樹脂成形体（成形品）９内に封止成形する。
硬化に必要な所要時間の経過後、両型１・２を型開きして可動中間型２（或るは、可動下型１９）を下動してキャビティ３から放熱板５を位置決めするために用いるエジェクターピン１０を含めたエジャクターピン１０にて樹脂成形体９を突出して離型する。
また、次に、金型１・２から樹脂成形体９と基板６とを取り出すことができる。 Accordingly, both molds 1 and 2 are heated in advance to the resin molding temperature by the heating means, and first, a predetermined position of the movable intermediate mold 2 (or the movable lower mold 19), two in FIG. 1 and FIG. 3 to FIG. 5, the heat radiating plate 5 is positioned in the projecting portions 18 b, 18 c at two locations in the horizontal portion 15 of the heat radiating plate 5 while penetrating the opening portions in the horizontal portion 15. In the state where the heat sink 5 positioned in the step 3 is fitted in the cavity 3, the substrate 6 (or lead frame) on which the electronic component 5 is mounted is placed and set, and a resin material is supplied into the pot. The movable intermediate mold 2 (or the movable lower mold 19) is moved upward to clamp both molds 1 and 2. At this time, the heat sink 5 and the electronic component 4 and the peripheral substrate 6 are fitted and set in the cavity 3.
Next, the resin material heated and melted in the pot is pressurized with a plunger to inject and fill the fluid resin 17 into the cavity 3, and in the cavity 3, the heat sink 5, the electronic component 4, and the peripheral substrate. 6 is sealed and molded in a resin molded body (molded product) 9 corresponding to the shape of the cavity 3.
In order to position the heat sink 5 from the cavity 3 by opening the molds 1 and 2 and moving the movable intermediate mold 2 (or the movable lower mold 19) downward after the time required for curing has elapsed. The resin molded body 9 is protruded and released by the ejector pins 10 including the ejector pins 10 to be used.
Next, the resin molded body 9 and the substrate 6 can be taken out from the molds 1 and 2.

即ち、本実施形態によれば、電子部品４の樹脂封止成形用金型１・２に設けた樹脂成形用キャビティ３内に放熱板５を容易（単純）に且つ精度良く位置決めすることにより、放熱板５並びに電子部品４を装着されたパッケージ製品（成形品）の生産性をより一層向上することができる。   That is, according to this embodiment, by positioning the heat sink 5 easily (simple) and accurately in the resin molding cavity 3 provided in the resin sealing molding dies 1 and 2 of the electronic component 4, The productivity of the package product (molded product) on which the heat sink 5 and the electronic component 4 are mounted can be further improved.

本発明に係る電子部品の樹脂封止成形装置に搭載された樹脂封止成形用金型を概略的に示す概略断面図であり、金型の型開状態を示す。It is a schematic sectional drawing which shows schematically the resin-molding metal mold | die mounted in the resin-sealing molding apparatus of the electronic component which concerns on this invention, and shows the mold open state of a metal mold | die. 図１に示す金型であって、金型の型締時における流動性樹脂注入充填状態を示す。It is a metal mold | die shown in FIG. 1, Comprising: The fluid resin injection filling state at the time of mold clamping of a metal mold | die is shown. 図１に示す金型とは別の金型であって、金型の型締時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1, and shows a fluid resin injection filling state when the mold is clamped. 図１に示す金型とは別の金型であって、金型の型締時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1, and shows a fluid resin injection filling state when the mold is clamped. 図１に示す金型とは別の金型であって、金型の型締時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1, and shows a fluid resin injection filling state when the mold is clamped.

符号の説明Explanation of symbols

１ 固定上型
２ 可動中間型
３ キャビティ
４ 電子部品
５ 放熱板
６ 基板
７ セット用凹所
８ 樹脂通路
９ 樹脂成形体（成形品）
１０ エジェクターピン（離型ピン）
１１ 半導体チップ
１２ ワイヤ
１３ ゲート口
１４ ゲートピース
１５ 水平部
１６ 支持部
１７ 流動性樹脂
１８（１８ａ・１８ｂ・１８ｃ） 突出部
１９ 可動下型 DESCRIPTION OF SYMBOLS 1 Fixed upper type | mold 2 Movable intermediate type | mold 3 Cavity 4 Electronic component 5 Heat sink 6 Substrate 7 Set recess 8 Resin passage 9 Resin molding (molded product)
10 Ejector pin (release pin)
DESCRIPTION OF SYMBOLS 11 Semiconductor chip 12 Wire 13 Gate port 14 Gate piece 15 Horizontal part 16 Support part 17 Flowable resin 18 (18a, 18b, 18c) Protrusion part 19 Movable lower type

Claims (3)

一方の型と他方の型とから少なくとも成る電子部品の樹脂封止成形用金型と、前記一方の型に少なくとも設けた樹脂成形用キャビティ内に、放熱板並びに電子部品を前記金型の型締時に流動性樹脂にて封止成形して成形品を成形する電子部品の樹脂封止成形装置であって、
前記キャビティ内に形成される１又は複数の突出部に対して、前記放熱板を貫通状態で位置決めすることを特徴とする電子部品の樹脂封止成形装置。 A mold for resin-sealing molding of an electronic component comprising at least one mold and the other mold, and a mold for clamping the heat sink and the electronic component in a resin molding cavity provided at least in the one mold. It is a resin sealing molding apparatus for electronic parts that sometimes molds a molded product by sealing molding with a flowable resin,
A resin sealing molding apparatus for an electronic component, wherein the heat radiating plate is positioned in a penetrating state with respect to one or a plurality of protrusions formed in the cavity. 請求項１に記載の前記突出部は、前記金型の型締時に流動性樹脂を注入充填する樹脂経路に形成すること、及び／又は、成形品突出用の離型ピンを用いることを特徴とする電子部品の樹脂封止成形装置。   The projecting portion according to claim 1 is formed in a resin path for injecting and filling a fluid resin when the mold is clamped, and / or using a release pin for projecting a molded product. Resin sealing molding device for electronic parts. 請求項２に記載の樹脂通路の一部又は全体を前記金型から着脱自在に内装することを特徴とする電子部品の樹脂封止成形装置。   A resin sealing molding apparatus for electronic parts, wherein a part or the whole of the resin passage according to claim 2 is detachably mounted from the mold.
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TW096120517A TW200811968A (en) 2006-08-25 2007-06-07 Resin sealing apparatus for electronics parts
KR1020070066899A KR100848746B1 (en) 2006-08-25 2007-07-04 Resin sealing apparatus for electronics parts
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JP2015188006A (en) * 2014-03-26 2015-10-29 エムテックスマツムラ株式会社 Method of manufacturing hollow package and hollow package
KR20150141153A (en) 2014-06-09 2015-12-17 토와 가부시기가이샤 Resin sealing apparatus and resin sealing method
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JP7544456B2 (en) 2020-07-28 2024-09-03 華為技術有限公司 Power module, manufacturing mold, and equipment

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