WO2016125571A1

WO2016125571A1 - Resin molding die, resin molding method, and method for producing resin molded article

Info

Publication number: WO2016125571A1
Application number: PCT/JP2016/051344
Authority: WO
Inventors: 中沢　英明; 中島　謙二; 雅志岡本; 友一高橋
Original assignee: アピックヤマダ株式会社
Priority date: 2015-02-04
Filing date: 2016-01-19
Publication date: 2016-08-11
Also published as: TW201637812A; TWI657910B

Abstract

The present invention addressed the problem of providing a technique that makes it possible to improve molding quality. As a solution, a resin molding die (210) is provided with an upper and lower pair of dies (11, 12) having a cavity (13), it being possible for the dies (11, 12) to be opened and closed. The resin molding die (210) is provided with a base (18), which is provided on the upper die (11) and which is moved in a relative manner so as to come closer to the lower die (12) when the dies are closed and to move away when the dies are opened, and a plurality of plungers (17) arranged around the cavity (13) as viewed from above, and provided on the base (18).

Description

Resin molding die, resin molding method, and method of manufacturing molded product

The present invention relates to a technique effective when applied to a resin molding die, a resin molding method, and a method of manufacturing a molded product.

Japanese Patent Application Laid-Open No. 2004-179345 (hereinafter referred to as “Patent Document 1”) describes a technique related to an excess resin absorption mechanism that absorbs excess resin when the amount of resin consumption in a cavity changes in compression molding. (In particular, refer to paragraphs [0059] to [0061] and FIG. 10 of the specification).

Japanese Patent Laid-Open No. 2012-166432 (hereinafter referred to as “Patent Document 2”) describes a pot provided on the bottom surface of a cavity recess opened at a parting surface, and a relative relative to the mold clamping operation in the pot. A technique relating to a resin molding die having a plunger provided so as to reciprocate is described (in particular, refer to claim 1).

Japanese Patent Application Laid-Open No. 2002-283388 (hereinafter referred to as “Patent Document 3”) describes a technique in which resin is supplied from the outer edge of a semiconductor wafer by a supply rod that is raised by a driving means (particularly, the specification thereof). Paragraph [0060]). Patent Document 3 describes a technique in which an electrode is exposed by polishing the surface of a resin (particularly, refer to paragraph [0080] of the specification).

Japanese Patent Application Laid-Open No. 2003-45906 (hereinafter referred to as “Patent Document 4”) discloses a technique in which a plunger in a pot provided at the bottom of a recess serving as a cavity rises to seal the surface of a semiconductor wafer with resin. In particular (see paragraphs [0012] and [0023] of the specification). Patent Document 4 describes a technique in which the surface of a semiconductor wafer on which a conductive post is formed is resin-sealed and the tip of the conductive post is exposed by polishing (particularly, paragraphs [0019], [ 0036]).

Japanese Patent Application Laid-Open No. 2013-43391 (hereinafter referred to as “Patent Document 5”) discloses a technique of pressing a pressing pin at the bottom of a cavity recess of one mold against a workpiece placed on the other mold. (See claim 1 in particular).

Japanese Laid-Open Patent Publication No. 2013-187351 (hereinafter referred to as “Patent Document 6”) describes a technique of resin-sealing by exposing the surface opposite to the substrate surface of a semiconductor chip flip-chip bonded to a substrate. (See in particular claims 7 and 8 and FIG. 5).

JP 2004-179345 A JP 2012-166432 A JP 2002-283388 A JP 2003-45906 A JP 2013-43391 A JP 2013-187351 A

In a general compression molding method, the resin mold is closed and the resin in the cavity is filled and compressed to be molded. The compression molding method is used when, for example, a large-sized wafer such as a wafer level package (WLP: Wafer Level Package) or a component mounted on a substrate is sealed with a resin (see, for example, Patent Documents 1 and 2). . By the way, when the mounting component on the board is entirely sealed with resin, it is necessary to grind or polish the mold surface after molding in order to expose the surface of the mounting component (see, for example, Patent Documents 3 and 4). Here, if the resin remains on the surface of the mounted component, the connectivity with a connecting member such as a solder ball, a heat sink, or a shield plate is lowered. For this reason, quality will deteriorate as a molded article.

By the way, in the technique as described in Patent Document 6, after resin is supplied to a resin molding die (inner bottom surface of the cavity) at a predetermined temperature, the inner bottom surface of the cavity and the surface (anti-substrate) of the semiconductor chip (mounting component) Side surface). However, when the resin is supplied, it melts and spreads depending on the mold temperature, and the resin adheres to the surface of the semiconductor chip before the contact between the inner bottom surface of the cavity and the surface of the semiconductor chip (the surface opposite to the substrate). It is also possible that In such a case, resin burrs (flash) may occur on the surface.

If resin burrs are still generated, for example, the connectivity of connecting members such as a heat sink and a shield plate to the surface of the semiconductor chip is reduced, so that the molding quality is reduced (that is, it is treated as a defective product). ) For this reason, a process of removing the resin burr is required, but the productivity of the molded product is lowered. Patent Documents 1 to 5 do not describe or suggest a resin burr when exposing a part of a mounted component. In particular, the techniques described in Patent Documents 1 and 2 expose a mounted component. It seals without making it.

An object of the present invention is to provide a technique capable of improving the molding quality. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

A resin molding die according to one solution of the present invention is a resin molding die including a pair of molds having a cavity that can be opened and closed. The resin molding die is provided in one of the molds with respect to the other mold. A base that is moved close to the mold in a closed state and moved relatively away from the mold in an opened state, and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in a plan view. Features.

The resin molding method according to one solution of the present invention is: (a) a resin molding die including a pair of molds having a cavity that can be opened and closed, provided in one mold, and the other mold A base that moves closer to the mold in a closed state and is moved relatively away from the mold in an opened state, and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in plan view, A step of preparing the resin molding die provided with: (b) in a state where the mold is opened, at a position facing the cavity piece constituting the cavity provided in the resin molding die in a plan view. A step of setting a workpiece having the mounting component facing the mounting component; (c) a step of setting a resin at a position facing the resin pressing portion in a plan view with the mold opened; and (d) mold closing. A step of clamping the mold with a clamper around the cavity piece provided in the resin mold, and (e) a step of closing the mold further than the step (d) and applying the cavity piece to the mounting component And (f) closing the mold further than the step (e), pressing the resin with the resin pressing portion, and filling the cavity with the resin.

According to this, compared with the case where resin is pressed (injected) into the cavity from one place around the cavity in plan view, the distance that the resin flows in the cavity can be shortened. If the distance that the resin flows becomes long, there will be variations in the timing of curing between the one that flows first and the one that flows later, and the filler contained in the resin will segregate and voids (bubbles) will be inherent. There is a fear. Therefore, by pressing (injecting) the resin into the cavity from a plurality of locations around the cavity, the distance that the resin flows in the cavity can be shortened, and the segregation of filler and the generation of bubbles can be prevented. That is, the molding quality can be improved.

In addition, when resin molding is performed on a workpiece having a mounting component, the mounting component is applied (pressed) with the cavity piece to prevent the resin from adhering to the surface, and then the resin is pressed by the resin pressing portion. Can start to do. Thereby, it is possible to prevent the occurrence of resin burrs (molding defects) on the surface of the mounted component. That is, the molding quality can be improved.

Further, in the resin molding die according to the one solving means, in a plan view, apart from the cavity, arranged around the cavity, a plurality of insertion portions into which the plurality of resin pressing portions are respectively inserted, and the one or the other It is more preferable to further include a plurality of runner gates that are provided on the parting surface of the mold and narrow toward the cavity from positions facing the plurality of insertion portions in plan view. According to this, even if the molding resin remains on the runner gate, the thickness of the molding resin is thin, and it is easy to break and to be easily removed.

The resin mold according to the one solution may further include a plurality of insertion portions that are in contact with the cavity in a plan view and are arranged around the cavity and into which the plurality of resin pressing portions are respectively inserted. preferable. According to this, compared with the case where resin is pressed (injected) into the cavity from a location away from the cavity, the injection timing can be changed so as to accelerate the injection into the cavity. Moreover, generation | occurrence | production of an unnecessary molding resin can be suppressed. Here, it is more preferable to further include a runner gate provided on the resin pressing surface of the resin pressing portion and narrowing toward the cavity. According to this, even if the molding resin remains in the insertion portion, the molding resin is thin and easily broken and easily removed.

Further, the resin molding die according to the one solving means further includes a resin setting portion provided at a position facing the resin pressing portion in a plan view and recessed in the parting surface of the one or the other die. It is more preferable. According to this, resin can be easily set to the resin setting part. In addition, since the resin is positioned at the resin setting portion, for example, the resin can be prevented from moving or spreading to the workpiece set before pressing the resin.

Moreover, it is more preferable that the resin molding die according to the one solution means further includes an elastic member, and the resin pressing portion is provided on the base via the elastic member. Moreover, in the resin molding die according to the one solving means, it is more preferable that the resin pressing portion is provided fixed to the base. According to this, it is not necessary to provide, for example, a drive mechanism for driving the resin pressing portion in addition to the mechanism for opening and closing the mold, and the structure becomes simple and the resin can be molded.

Further, in the resin molding die according to the one solution means, provided in the overflow cavity provided around the cavity apart from the cavity in a plan view, and in the parting surface of the one or the other die, in a plan view. And a runner heading from the position facing the overflow cavity to the cavity. According to this, even when the air that becomes a void is involved and the resin flows in the cavity, the resin containing the air can be pushed out to the overflow cavity, and the filling property of the resin in the cavity can be improved. it can.

Moreover, it is more preferable that the resin molding die according to the one solving means further includes a film that covers at least one parting surface of the one or the other die. According to this, when resin molding is performed on a workpiece having mounted parts, the molded workpiece can be easily released from the resin molding die.

A resin molding method according to another solution of the present invention includes (a) a pair of molds that can be opened and closed, and a cavity recess is provided on a parting surface of at least one of the other molds, A resin molding die is prepared in which a bottom portion of a cavity recess includes a resin pressing portion that presses resin and a component pressing portion that presses a mounting component of a workpiece set so as to face the cavity recess. (B) a step of setting the workpiece in a state where the mold is opened; (c) a step of setting resin at a location facing the resin pressing portion in a state where the mold is opened; and (d). A step of closing the mold and pressing the mounted component of the set workpiece with the component pressing portion; and (e) pressing the mounted component with the component pressing portion while the workpiece is pressed with the resin pressing portion. Against Resins continue to press and a step of filling with the resin melted the cavity recess, characterized in that it comprises a step of thermally curing the resin filled in (f) the cavities. According to this, after pressing the surface of the mounting component (the surface pressed by the component pressing portion) with the component pressing portion to prevent the resin from adhering to the surface, the resin pressing portion starts to press the resin. Therefore, it is possible to prevent the occurrence of resin burrs (molding defects). That is, the molding quality can be improved.

In the resin molding method according to the other solution, in the step (a), the resin pressing part is supported by a support part, and the component pressing part is supported by the support part via a spring member. More preferably, a mold is prepared, and in the step (e), the resin pressing portion is relatively moved with respect to the component pressing portion to press the resin. According to this, the structure of the resin molding die becomes simple, and resin molding can be performed.

In the resin molding method according to the other solving means, in the step (a), the component pressing portion is provided by being divided into a first component pressing portion and a second component pressing portion, and the first component pressing portion and the Each of the second component pressing portions independently prepares the resin molding die provided so as to be movable back and forth with respect to the resin pressing portion. In the step (b), the mounting components are different in height. The workpiece on which the first and second mounting components are mounted is set, and in the step (d), the first mounting component is pressed by the first component pressing portion, and the second mounting component is pressed by the second component pressing It is more preferable to press at the part. According to this, even if the mounting components have different heights, the first component pressing portion and the second component pressing portion corresponding to each of the mounting components prevent the resin from adhering to the surface of the mounting component. be able to.

In the resin molding method according to the other solving means, in the step (a), the resin molding die in which a plurality of the resin pressing portions are arranged along the outer shape of the bottom of the cavity concave portion in plan view is prepared. More preferably. According to this, unfilling of the resin in the cavity recess can be prevented.

In the resin molding method according to the other solution, in the step (c), a first resin is set higher than the height of the mounting component as the resin, and the portion where the first resin is set and the mounting component More preferably, the second resin is set to be lower than the height of the mounted component at the location of the workpiece excluding the location where is mounted. According to this, even if it is a workpiece | work of a large area, the unfilling of the resin in a cavity recessed part can be prevented.

In the resin molding method according to the other solution, in the step (a), the resin molding die including a rubber member provided in the component pressing portion is prepared, and in the step (d), the mounting component is prepared. Is pressed with the rubber member to cause the location of the rubber member to function as the component pressing portion, and in the step (e), while pressing the mounting component at the location of the rubber member that functions as the component pressing portion, More preferably, the resin in the cavity recess is pressed by the rubber member so that the location of the rubber member functions as the resin pressing portion. Alternatively, in the resin molding method according to the one solving means, in the step (a), the resin molding die including a rubber member provided at the bottom of the cavity recess is prepared, and in the step (d), The mounting component is pressed with the rubber member to cause the location of the rubber member to function as the component pressing portion, and in the step (e), the mounting component is pressed at the location of the rubber member that functions as the component pressing portion. However, it is more preferable that the resin in the cavity recess is pressed by the rubber member so that the location of the rubber member functions as the resin pressing portion. According to this, for example, since the surplus resin can be absorbed by the elasticity of the rubber member, it is possible to set a resin larger than the amount of the molded resin and prevent unfilling of the resin in the cavity recess.

In the resin molding method according to the other solution, in the step (a), the parting surface including the cavity recess is covered, and a surface opposite to the parting surface includes an adhesive film. More preferably, a resin molding die is prepared, and in the step (d), the film is adhered to the mounting component and the mounting component is pressed by the component pressing portion. According to this, it is possible to further prevent the resin from adhering to the surface of the mounted component.

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows. According to the resin molding die according to the solving means of the present invention, the molding quality can be improved.

It is a typical sectional view of a resin mold concerning Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view of a resin mold during operation following FIG. 1. FIG. 3 is a schematic cross-sectional view of a resin mold during operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of the resin mold during operation following FIG. 3. FIG. 2 is a schematic plan view of an upper parting surface of a resin mold shown in FIG. 1. FIG. 2 is a schematic plan view of a lower parting surface of a resin mold shown in FIG. 1. FIG. 2 is a schematic cross-sectional view of a resin molding die for processing a workpiece W different from that in FIG. 1. It is a typical top view of the parting surface of the upper model of the resin mold concerning Embodiment 2 of the present invention. It is a typical top view of the parting surface of the lower mold of the resin mold concerning Embodiment 2 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 3 of the present invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 4 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 5 of this invention. FIG. 13 is a schematic plan view of an upper parting surface of the resin mold shown in FIG. 12. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 6 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 7 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 8 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 9 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 10 of this invention. It is typical sectional drawing of the resin molding metal mold | die in operation | movement which concerns on Embodiment 11 of this invention. FIG. 20 is a schematic cross-sectional view of the resin mold during operation following FIG. 19. FIG. 21 is a schematic cross-sectional view of the resin molding die in operation following FIG. 20. FIG. 22 is a schematic cross-sectional view of the resin molding die in operation following FIG. 21. FIG. 23 is a schematic cross-sectional view of the resin molding die in operation following FIG. 22. FIG. 20 is a schematic plan view of the upper parting surface of the resin mold shown in FIG. 19. FIG. 20 is a schematic plan view of a lower parting surface of the resin mold shown in FIG. 19. It is a principal part schematic sectional drawing of a molded article. It is a principal part schematic sectional drawing of a various workpiece | work. It is a typical sectional view of a resin mold concerning Embodiment 12 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 13 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 14 of the present invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 15 of this invention. It is a typical sectional view of a resin mold concerning Embodiment 16 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 17 of the present invention. FIG. 34 is a schematic plan view of a lower parting surface of the resin mold shown in FIG. 33. It is a typical top view of resin used for the resin mold shown in FIG. It is a typical sectional view of a resin mold concerning Embodiment 18 of the present invention. It is a typical top view of resin used for the resin mold concerning Embodiment 19 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 20 of the present invention. It is other typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 20 of this invention.

In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding die 210 (resin molding die mechanism) according to this embodiment will be described with reference to FIGS. 1 to 4 are cross-sectional views schematically showing the resin molding die 210 in operation. FIG. 5 is a plan view schematically showing a parting surface 11 a (also referred to as a clamp surface or a mold surface) of the upper mold 11. FIG. 6 is a plan view schematically showing a parting surface 12a (also referred to as a clamp surface or a mold surface) of the lower mold 12. As shown in FIG. Note that FIG. 4 shows a molded product 100 (work W after molding) molded by a resin molding die 210.

The resin mold 210 includes a pair of molds (an upper mold 11 and a lower mold 12) having a cavity 13 (hereinafter also referred to as a cavity recess 13), which are separated and can be opened and closed. In the present embodiment, one mold is the upper mold 11 and the other mold is the lower mold 12. In the resin mold 210, a known mold opening / closing mechanism (press mechanism) (not shown) is used. With this mold opening / closing mechanism, for example, the upper mold 11 may be a fixed mold and the lower mold 12 may be a movable mold so that the mold can be opened / closed, or the upper mold 11 may be a movable mold and the lower mold 12 may be a fixed mold. 11 and the lower mold 12 may be movable. The resin molding die 210 may be manually opened and closed without using the mold opening and closing mechanism.

In the resin mold 210, the cavity recess 13 is provided (formed) in the upper mold 11. The cavity recess 13 is provided so as to be recessed from the parting surface 11 a of the upper mold 11, and the mold is closed to constitute the cavity 13. The resin molding die 210 includes a release film F (hereinafter also simply referred to as “film”) that covers the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. By providing the film F, the molded workpiece W can be easily released from the resin molding die 210.

The resin molding die 210 is provided with a known pressure reducing mechanism, and the cavity recess 13 can be degassed by this pressure reducing mechanism. For example, the decompression mechanism includes an air vent groove (not shown) that communicates the cavity recess 13 and the outside with the lower end surface of the clamper 15 (parting surface 11a of the upper mold 11), and a decompression mechanism that is connected to the air vent groove on the outside side. A device (for example, a vacuum pump).

Also, the resin molding die 210 is provided with a set portion 14 on which the workpiece W is set (arranged) on the lower die 12. The set part 14 is provided on the parting surface 12a of the lower mold 12, and is configured to suck and hold the workpiece W from a suction path (not shown). In the setting unit 14, the workpiece W is set so as to face the cavity recess 13. Further, in the resin molding die 210, a plurality of resins in which a plurality of resins R (tablet resin in the present embodiment) are set (arranged) on the parting surface 12 a of the lower mold 12 side by side around the set portion 14. A set unit 29 is provided. In addition, the setting part 14 and the resin setting part 29 may be provided as a recessed part recessed from the parting surface 12a of the lower mold | type 12 so that the workpiece | work W and the resin R may be accommodated, respectively.

The workpiece W includes a substrate 101 and a plurality of mounting components 102. The substrate 101 has a circular shape in plan view. The work W is a plate-like body having a circular shape in plan view as a whole, and can be said to have a plurality of mounting components 102. A plurality of mounting components 102 are surface-mounted (mounted) in a matrix form on the substrate 101 (see FIG. 6). The mounting component 102 has a surface of a board surface 102a on the side to be mounted and an opposite surface 102b. In addition, according to the planar view shape (refer FIG. 6) of the workpiece | work W, the planar view shape (refer FIG. 5) of the cavity recessed part 13 is circular shape.

Here, the planar view shape of the workpiece W (substrate 101) is not limited to a circular shape, and may be, for example, a rectangular shape. The substrate 101 may be, for example, a wafer or a wiring substrate, or a simple plate-like carrier, a glass substrate, or a semiconductor chip on which a semiconductor chip typified by eWLB (embedded Wafer Level Ball Grid Array) is temporarily mounted. It may be a resin-sealed substrate in which electronic parts such as these are included. The mounting component 102 may be, for example, an active component or a passive component such as a semiconductor chip or an electronic component, or may be a wiring pattern or a wiring block body that requires an exposed terminal such as a lead frame. Good.

Further, the resin molding die 210 includes a heater (not shown) and can be heated to a predetermined temperature (for example, 180 ° C.). In the resin molding die 210, the cavity recess 13 is closed (the cavity 13 is formed) by the upper mold 11 and the lower mold 12, and the resin R filled and compressed in the cavity recess 13 is heated in a pressurized state. A process of forming (manufacturing) the molded product 100 (see FIG. 4) by curing is performed.

Next, the upper mold 11 of the resin molding die 210 will be specifically described. The upper die 11 has a clamper 15, a cavity piece 16, a plunger 17 (resin pressing part), and a base 18 (the upper die 11 has a reference numeral 18 a and the lower die 12 has a reference numeral 18 b. In some cases, these mold blocks are assembled. In the present embodiment, the clamper 15, the cavity piece 16, and the base 18 (base 18a) are each composed of a plate-shaped mold block, and the plunger 17 is composed of a cylindrical mold block.

The clamper 15 is provided with a circular through hole 15a formed in the thickness direction (mold opening / closing direction) at the center of the upper mold 11 in plan view (parting surface view). A cavity piece 16 is inserted into the through hole 15 a and is provided on the base 18 via a spring member 21. The plunger 17 may be directly fixed to the base 18 as will be described later. Further, the clamper 15 is provided with a plurality of circular through holes 15b formed in the thickness direction (mold opening / closing direction) in a plan view (parting surface view) of the upper mold 11. A plurality of plungers 17 are inserted into each of the plurality of through holes 15 b and are provided on the base 18 via spring members 19. Thus, the through hole 15b is also an insertion portion into which the plunger 17 is inserted. The through holes 15b have a smaller diameter than the through holes 15a in a plan view, and are arranged at equal intervals around the cavity pieces 16 away from the cavity pieces 16 (through holes 15a). In addition, when it is desired to raise the flow of the resin to one side, it is not always necessary to have the same interval.

Further, the clamper 15 has a plurality of runner gates 28 (resin passages) narrowing from the plurality of through holes 15 b toward the cavity recesses 13 (through holes 15 a) on the end surface constituting the parting surface 11 a of the upper mold 11. Formed and provided. The plunger 17 presses (injects) the resin R into the cavity recess 13 through the runner gate 28. That is, in the resin molding die 210, the plurality of plungers 17, the plurality of through holes 15 b, and the periphery of the cavity recess 13 are arranged so that the resin R flows from the outer peripheral portion of the cavity recess 13 toward the center portion in plan view. A plurality of runner gates 28 are provided. Although the runner gate 28 is provided in the upper mold, the runner gate 28 may be provided in the lower mold 12 by providing a cull (not shown) in the lower mold 12. In this case, it is possible to perform mold release after molding by providing a known ejector mechanism for mold release.

According to this, compared with the case where the resin R is injected into the cavity recess 13 from one place around the cavity recess 13, the distance through which the resin R flows in the cavity recess 13 can be shortened. When the distance through which the resin R flows becomes long, the timing of curing varies between the first flow and the second flow, and the filler contained in the resin R segregates or voids (bubbles) exist. There is a risk that. Therefore, by injecting the resin R into the cavity recess 13 from a plurality of locations around the cavity recess 13, the distance in which the resin R flows in the cavity recess 13 can be shortened, and segregation of filler and generation of bubbles can be prevented. .

Thus, the clamper 15, the cavity piece 16, and the plunger 17 are assembled to the base 18 via the respective spring members. In other words, the clamper 15, the cavity piece 16, and the plunger 17 are held on the base 18 via respective spring members. Here, when the mold of the resin molding die 210 is opened and closed, the upper die 11 (one die) is relatively separated from or approaches the lower die 12 (the other die). For this reason, in this embodiment, the base 18 is moved relative to the lower mold 12 so as to approach the lower mold 12 in the mold closed state and leave in the mold open state.

The cavity piece 16 is provided on the lower mold 12 side of the base 18. The cavity piece 16 constitutes the back (bottom) of the cavity recess 13. That is, the end surface of the cavity piece 16 on the lower mold 12 side becomes the inner bottom surface of the cavity recess 13 having a circular shape in plan view. In this embodiment, the cavity piece 16 hits the mounting component 102 in a mold-closed state (see FIG. 3). The cavity piece 16 is provided on the lower mold 12 side of the base 18 via a spring member 21 (first elastic member). For this reason, the cavity piece 16 is suspended from the base 18 by the spring member 21.

Further, the clamper 15 is provided on the lower mold 12 side of the base 18. The clamper 15 surrounds the cavity piece 16 and constitutes a side portion of the cavity recess 13. That is, the inner wall surface of the through hole 15 a of the clamper 15 becomes the inner surface of the cavity recess 13. The clamper 15 hits the lower mold 12 in a closed state (see FIG. 2). The clamper 15 is provided on the lower mold 12 side of the base 18 via a spring member 20 (second elastic member, indicated by a broken line in FIG. 5). For this reason, the cavity piece 16 is suspended from the base 18 by the spring member 20. In the present embodiment, in order to prevent resin leakage when pressing the resin R with the plunger 17, as shown in FIG. 5, a plurality of spring members 20 are provided around the plunger 17 (resin setting portion 29) in plan view. Provided. Specifically, a plurality of spring members 20 are provided along the outer edge portion of the upper end surface (end surface on the base 18 side) of the clamper 15.

In this way, the clamper 15 is provided on the lower mold 12 side of the base 18 so as to be movable relative to the cavity piece 16 in the mold opening / closing direction (movable forward and backward). For example, after the clamper 15 hits the lower mold 12 by mold closing (see FIG. 2), when the mold is further closed, the spring member 20 is urged with the clamper 15 hitting the lower mold 12. Then, the cavity piece 16 approaches the lower mold 12 and hits the mounting component 102 (see FIG. 3).

The plunger 17 is provided on the lower mold 12 side of the base 18. The plunger 17 presses (injects) the resin R into the cavity recess 13 in a mold-closed state. The plunger 17 is provided on the lower mold 12 side of the base 18 via a spring member 19 (third elastic member). For this reason, the plunger 17 is suspended from the base 18 by the spring member 19.

In this way, the plunger 17 is provided on the lower mold 12 side of the base 18 so as to be movable (movable forward and backward) relative to the cavity piece 16 and the clamper 15 in the mold opening / closing direction. Accordingly, for example, after the cavity piece 16 hits the mounting component 102 by closing the mold (see FIG. 3), when the mold is further closed, the spring member 20 is urged with the clamper 15 hitting the lower mold 12. In addition, the spring member 21 is biased in a state where the cavity piece 16 hits the mounting component 102. Then, when the plunger 17 approaches the lower mold 12, begins to press the resin R, and further closes the mold, the spring member 19 is biased (see FIG. 4). That is, in this embodiment, as the mold is closed, the lower surface of the clamper 15 contacts the upper surface of the lower mold 12, the lower surface of the cavity piece 16 contacts the upper surface of the mounting component 102, and the plunger 17 presses the resin R.

As described above, according to the resin molding die 210, the operation of the plunger 17 does not use a complicated mechanism (for example, a separate drive actuator such as a hydraulic cylinder or a motor), but has a simple structure associated with opening and closing the die. Can be provided. As will be described later, according to the resin molding die 210, the mounting component 102 is applied (pressed) with the cavity piece 16 to prevent the resin R from adhering to the surface thereof, and then the resin R is applied with the plunger 17. Thus, it is possible to prevent the occurrence of resin burrs (molding defects). That is, the molding quality can be improved.

Next, the operation of the resin molding die 210 as a compression molding according to the present embodiment (process of the resin molding method) will be described. First, as shown in FIG. 1, a resin molding die 210 having the above-described pair of molds (upper die 11 and lower die 12) that can be opened and closed is prepared.

Next, in a state where the resin molding die 210 is opened, the workpiece W (molded product) before molding is set (supplied) at a position facing (opposing) the cavity piece 16 in the mold opening / closing direction. Specifically, the work W is transported to the parting surface 12a of the lower mold 12 by a loader (not shown), and the work W (more specifically, the mounted component 102 is directed toward the cavity piece 16 side). The substrate 101) in the state is set. The workpiece W is sucked and held by a known suction device (for example, a vacuum pump) using a suction path (not shown) formed in the lower mold 12 and set in the set unit 14.

In the state where the resin molding die 210 is opened, the resin R is set (supplied) at a position facing (opposing) the plunger 17 in the mold opening / closing direction. Specifically, a tablet-like resin R (tablet resin) is conveyed to the inside of the mold by a loader (not shown), and the resin R is set in each of the plurality of resin setting portions 29.

In the state where the resin mold 210 is opened, the film F is set so as to cover the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. Specifically, the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. This film F is, for example, known using a gap between the inner wall surface of the through hole 15a of the clamper 15 and the outer side surface of the cavity piece 16, or a gap between the inner wall surface of the through hole 15b of the clamper 15 and the outer side surface of the plunger 17. The suction device (for example, a vacuum pump) is attached to the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. The film F has a heat resistance that can withstand the heating temperature of the resin molding die 210, is easily peeled off from the parting surface 11a of the upper mold 11, and is a film material having flexibility and extensibility. . As the film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.

Subsequently, the mold closing operation is started, and as shown in FIG. 2, the resin molding die 210 is closed (the upper mold 11 and the lower mold 12 are brought closer to each other), and the lower side is moved through the film F. The clamper 15 is applied to the mold 12 (that is, the mold is clamped). At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is reduced. Thereby, the opening part of the cavity recessed part 13 is obstruct | occluded by the parting surface 12a of the lower mold | type 12. FIG. In this embodiment, since the size of the workpiece W (substrate 101) in plan view is smaller than the size of the cavity recess 13 in plan view, the workpiece W is housed in the cavity recess 13. On the other hand, here, the plunger 17 is prevented from hitting (not contacting) the resin R. The space of the cavity recess 13 begins to be depressurized via an air vent groove (not shown) formed in the lower end surface of the clamper 15. As shown in FIG. 7, when the size of the workpiece W (substrate 101) in plan view is larger than the size of the cavity recess 13 in plan view, the substrate 101 set in the lower mold 12 is clamped by the clamper 15. It is also good to In this case, it is necessary for the clamper 15 to escape a step having a thickness of the substrate 101. The necessity of this step is the same in other embodiments.

Subsequently, the resin molding die 210 is further closed, and the cavity piece 16 is applied to the mounting component 102 as shown in FIG. At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is further reduced. Thereby, the mounting component 102 of the workpiece W set on the set portion 14 (parting surface 12a of the lower mold 12) is clamped (pressed) by the cavity piece 16 via the film F. Further, the spring member 20 is urged (compressed) while the clamper 15 is in contact with the lower mold 12. As described above, the cavity piece 16 is also a component pressing portion that presses the mounting component 102 in the mold closing operation. And the depth (height) of the cavity recessed part 13 becomes shallow (lower), and becomes the molding thickness of the molded product 100. On the other hand, here, the plunger 17 is prevented from hitting (not contacting) the resin R. However, the plunger 17 may be applied to the resin R as long as the resin R does not flow to the mounting component 102 (work W) side.

Subsequently, the resin molding die 210 was further closed, and the plunger 17 started to press (inject) the resin R through the runner gate 28 against the cavity recess 13 and was closed as shown in FIG. In the state, the cavity recess 13 is filled with molten resin R. At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is further reduced. As a result, the resin R is also filled between the plurality of mounted components 102. Further, when the clamper 15 hits the lower mold 12 and the cavity piece 16 contacts the mounting component 102, the

spring members

20 and 21 are urged (compressed), and further, when the mold is closed, the spring member 19 is attached. Be forced.

Here, clamping the mounting component 102 with the cavity piece 16 via the film F prevents the resin R from adhering to the opposite surface 102b of the mounting component 102 because the mounting component 102 bites into the film F to some extent. Can do. Further, the film F attached to the parting surface 11a of the upper mold 11 may be a non-adhesive film, but the surface opposite to the parting surface 11a (the lower mold 12 side) is slightly adhered. If it has a property (slightly adhesive film), it is possible to press the mounting component 102 with the cavity piece 16 while adhering to the mounting component 102. According to this, it is possible to further prevent the resin R from adhering to the opposite surface 102 b of the mounting component 102. Further, by providing the film F, for example, the occurrence of a resin burr caused by the resin R entering the gap between the clamper 15 and the cavity piece 16 or the gap between the clamper 15 and the plunger 17 can be prevented. It is possible to prevent the piece 16 from becoming difficult to move.

Next, after the resin R filled in the cavity recess 13 is thermally cured in a pressure-holding state, the mold W is opened and released, and the workpiece W is further thermally cured (post-cure). Thus, the molded product 100 in which the opposite surface 102b (front surface) of the mounting component 102 is exposed and the other surfaces (the substrate surface 102a and the side surfaces) are covered (sealed) with the resin molded portion 103 (resin R). Almost complete. Further, when unnecessary molding resin remains in the through hole 15b (insertion portion) into which the plunger 17 is inserted or the runner gate 28, the molding resin corresponding to the runner gate 28 is thin and easily broken. Unnecessary molding resin can be removed.

As described above, in the resin mold 210, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, for example, it is possible to start pressing the resin R while clamping the mounting component 102 by preventing the mounting component 102 from being damaged. Thereby, it is possible to prevent a resin burr (molding defect) from occurring on the opposite surface 102b of the mounting component 102. Therefore, according to the resin molding die 210, the manufacturing yield can be improved and the molding quality of the molded product 100 can be improved. Moreover, since the process of removing the resin burrs is not necessary, the manufacturing cost can be reduced.

(Embodiment 2)
In the first embodiment, the resin molding die 210 in which a plurality of through holes 15b (insertion portions) of the clamper 15 into which the plunger 17 is inserted is arranged at equal intervals on the entire circumference of the cavity recess 13 has been described. The difference from this will be described with reference to FIGS. 8 and 9 as the resin molding die 210A according to the present embodiment. FIG. 8 is a plan view schematically showing the parting surface 11a of the upper mold 11 in the resin mold 210A. FIG. 9 is a plan view schematically showing the parting surface 12a of the lower mold 12 in the resin mold 210A. In FIG. 8, the spring member 20 (see FIG. 5) is not shown.

In the resin molding die 210A, a plurality of through holes 15b are arranged in one region around the cavity recess 13, and a plurality of overflow cavities 15c (recesses for excess resin) are arranged in another region without the through hole 15b. In the present embodiment, the clamper 15 of the resin mold 210A is provided with a plurality of overflow cavities 15c arranged around the cavity recess 13 and spaced apart from the cavity recess 13 in plan view (parting surface view). The overflow cavity 15c may be provided between the through holes 15b (same as in the first embodiment) or may be provided in the lower mold 12.

The overflow cavity 15 c is provided so as to be recessed from the end surface constituting the parting surface 11 a of the upper mold 11, and the mold is closed so as to be closed by the parting surface 12 a of the lower mold 12, thereby configuring the cavity 13. For this reason, the resin setting part 29 is not provided in the position of the parting surface 12a of the lower mold 12 facing the overflow cavity 15c in the mold opening / closing direction. In addition, the clamper 15 is provided with a plurality of runners 50 (resin passages) each directed from the cavity recess 13 (through hole 15a) to the plurality of overflow cavities 15c on the end surface constituting the parting surface 11a of the upper die 11.

According to such a resin molding die 210A, even when air that becomes a void is involved and the resin R flows through the cavity recess 13, the resin R containing the air can be pushed out to the overflow cavity 15c. Therefore, the resin filling property in the cavity recess 13 can be improved.

Further, in the resin molding die 210A, a region where a plurality of through holes 15b (insertion portions) into which the plunger 17 is inserted and a region where a plurality of overflow cavities 15c are combined sandwich the cavity recess 13 in plan view. It is divided into positions. According to this, since the flow of the resin R from the plunger 17 (through hole 15b) to the cavity recess 13 and to the overflow cavity 15c becomes smooth, the filling property of the resin in the cavity recess 13 can be further improved. .

Also in such a resin molding die 210A, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 3)
In the first embodiment, the resin mold 210 in which the film F is covered only on the parting surface 11a of the upper mold 11 has been described. The difference from this will be described as the resin molding die 210B according to the present embodiment, with reference to FIG. FIG. 10 is a schematic cross-sectional view of the resin molding die 210B.

In the resin molding die 210B, both the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12 are covered with the film F. In the present embodiment, since the parting surface 12a of the lower mold 12 of the resin molding die 210B is covered with the film F, the workpiece W is set on the setting unit 14 via the film F. Similarly, the resin R is set on the resin setting portion 29 through the film F. According to the resin molding die 210B in which both the upper die 11 and the lower die 12 are covered with the film F, when resin molding is performed on the workpiece W having the mounting component 102, the molded workpiece W is replaced with the resin molding die. The mold 210 can be easily released from the mold. Further, resin leakage from the parting line of the resin molding die 210B (the boundary between the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12) can be prevented.

Further, in the resin molding die 210B, a concave portion that is recessed from the parting surface 12a of the lower die 12 is provided as a resin setting portion 29 at a position facing (opposing) the plunger 17 in the mold opening / closing direction. According to this, the resin R can be easily set in the resin setting portion 29 (concave portion). Further, since the resin R is positioned by the resin setting portion 29, for example, before the resin R is pressed, the resin R moves or spreads toward the workpiece W set on the parting surface 12a of the lower mold 12. Can be prevented. Further, since the resin setting portion 29 is a concave portion, the runner gate 28 can be provided on the parting surface 12a of the lower die 12 so as to communicate with the resin setting portion 29 instead of the upper die 11 (clamper 15).

Also in such a resin molding die 210B, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 4)
In the first embodiment, the resin molding die 210 in which the plunger 17 is provided on the lower mold 12 side of the base 18 via the spring member 19 has been described. The difference from this will be described as the resin molding die 210C according to this embodiment, with reference to FIG. FIG. 11 is a schematic cross-sectional view of a resin molding die 210C.

In the resin molding die 210C, the plunger 17 is fixed to the base 18. In the present embodiment, in the resin molding die 210C, the plunger 17 (resin pressing portion) is provided fixed to the lower mold 12 side of the base 18 by, for example, a bolt (not shown). Even in such a resin molding die 210C, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 5)
In the first embodiment, the resin molding die 210 in which the through hole 15b (insertion portion) into which the plunger 17 is inserted is provided away from the cavity piece 16 so that the resin R flows through the runner gate 28 is provided. explained. A difference from this will be described as a resin molding die 210D according to the present embodiment, and will be described with reference to FIGS. FIG. 12 is a schematic cross-sectional view of a resin molding die 210D. FIG. 13 is a schematic plan view of the parting surface 11a of the upper mold 11 in the resin mold 210D.

In the resin molding die 210D, the through hole 15b (insertion portion) is provided in contact with the cavity piece 16 (cavity recess 13). In the present embodiment, the clamper 15 of the resin molding die 210D is arranged around the cavity recess 13 in a plan view (parting surface view), and a through hole 15b (insertion portion) into which the plunger 17 (resin pressing portion) is inserted. Are provided in direct contact with the cavity piece 16 (cavity recess 13). According to such a resin molding die 210D, the injection timing is set so as to accelerate the injection into the cavity recess 13 as compared with the case where the resin R is pressed (injected) into the cavity recess 13 from a position away from the cavity recess 13. Can change. Moreover, generation | occurrence | production of an unnecessary molding resin can be suppressed.

Also, a runner gate 28 that narrows toward the cavity recess 13 is provided on the resin pressing surface (the end surface on the lower mold 12 side) of the plunger 17. In the present embodiment, the lower end surface of the plunger 17 is formed in a tapered shape so that the cavity recess 13 side forms an acute angle. According to this, even when the molding resin remains in the through-hole 15b (insertion portion), the molding resin corresponding to the taper shape is thin and easily broken, and the remaining molding resin can be easily removed. Become.

Also in such a resin molding die 210D, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 6)
In the first embodiment, the resin mold 210 in which the upper mold 11 is provided with the cavity recess 13 and the plunger 17 has been described. The difference from this will be described as a resin molding die 210E according to this embodiment, with reference to FIG. FIG. 14 is a schematic cross-sectional view of a resin molding die 210E.

In the resin molding die 210E, the upper mold 11 is provided with a cavity recess 13 and the lower mold 12 is provided with a plurality of plungers 17 (resin pressing sections) arranged around the cavity recess 13 (cavity 13) in plan view. Specifically, the upper mold 11 includes a base 18 a, a cavity piece 16, and a clamper 15. The lower mold 12 includes a base 18b and a lower mold plate 52. In the first embodiment, the base 18 exists on the upper mold 11 side. However, in the present embodiment, the base 18a exists on the upper mold 11 side, and the base 18b also exists on the lower mold 12 side. In the lower mold 12, the lower mold plate 52 is provided on the upper mold 11 side of the base 18 b via the spring member 54.

Further, the lower mold plate 52 is provided with a plurality of through holes 52a (insertion portions) into which the plunger 17 is inserted outside the cavity recess 13 in plan view. The through hole 52a is formed in the thickness direction of the lower mold plate 52 (mold opening / closing direction). A plurality of plungers 17 are inserted into each of the plurality of through holes 52 a and are provided on the base 18 b via the spring members 19. A tapered runner gate 28 that narrows toward the cavity recess 13 is provided on the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12.

In such a resin molding die 210E, the set portion 14 on which the workpiece W is set becomes the upper end surface (the end surface on the upper mold 11 side) of the lower mold plate 52. Further, the resin setting portion 29 in which the resin R is set serves as a through hole 52 a (insertion portion) formed in the lower mold plate 52. For this reason, the resin R can be easily set in the resin setting portion 29 (concave portion). Further, since the resin R is positioned by the resin setting portion 29, for example, before pressing the resin R, the resin R is moved to the work W side set on the upper end surface of the lower mold plate 52 (parting surface 12a of the lower mold 12). Can be prevented from moving or spreading.

Also in such a resin molding die 210E, the plunger 17 is provided on the base 18b so as to be movable relative to the lower mold plate 52 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 7)
In the first embodiment, the resin mold 210 in which the cavity recess 13 is provided in the upper mold 11 has been described. The difference from this will be described as the resin molding die 210F according to the present embodiment, with reference to FIG. FIG. 15 is a schematic cross-sectional view of a resin molding die 210F.

In the resin molding die 210F, the cavity recess 13 is provided in the lower die 12. In the present embodiment, in the resin molding die 210F, the lower mold 12 includes a base 18, a cavity piece 16, a clamper 15, and a plunger 17 (resin pressing portion). In the first embodiment, the base 18 exists on the upper mold 11 side, but in the present embodiment, the base 18 exists on the lower mold 12 side. In the lower mold 12, the clamper 15 is provided with a plurality of through-holes 15 b (insertion portions) into which the plunger 17 is inserted and arranged around the cavity piece 16 away from the cavity piece 16. A plurality of runner gates 28 that narrow from the plurality of through holes 15 b toward the cavity recesses 13 are provided on the upper end surface (the end surface on the upper mold 11 side) of the clamper 15 of the lower mold 12. In addition, although the runner gate 28 is provided in the lower mold | type 12, you may provide a cull (not shown) in the upper mold | type 11, and you may use it as an upper mold | type runner gate.

In such a resin molding die 210F, the set portion 14 on which the workpiece W is set becomes the upper end surface (end surface on the upper mold 11 side) of the cavity piece 16 of the lower mold 12. Further, the resin setting portion 29 in which the resin R is set becomes a through hole 15b (insertion portion) formed in the clamper 15 of the lower mold 12. Further, since the resin R is positioned by the resin setting portion 29, for example, before the resin R is pressed, the resin R moves or spreads toward the workpiece W set on the parting surface 12a of the lower mold 12. Can be prevented.

Also in such a resin molding die 210F, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 8)
In the seventh embodiment, the resin mold 210 </ b> F in which the lower mold 12 is provided with the cavity recess 13 and the cavity recess 13 is provided with the set portion 14 has been described. The difference from this will be described as the resin molding die 210G according to the present embodiment, with reference to FIG. FIG. 16 is a schematic cross-sectional view of a resin molding die 210G.

In the resin molding die 210G, the upper die 11 is provided with a set portion 14. In the present embodiment, the film F is provided so as to cover the parting surface 11 a of the upper mold 11. However, the work W can be adhered to the film F and set on the setting unit 14. Instead of using the film F, the workpiece W may be sucked and held by a known suction device (for example, a vacuum pump) using a suction path provided on the parting surface 11a of the upper mold 11.

Here, in the resin molding die 210G on the left side of the alternate long and short dash line in FIG. 16, the plunger 17 is provided on the base 18 via the spring member 19. The through hole 15b into which the plunger 17 is inserted becomes a resin setting portion 29, and a tablet resin is set as the resin R. On the other hand, in the resin molding die 210G on the right side of the alternate long and short dash line in FIG. 16, the plunger 17 is fixed to the base 18. The plurality of plungers 17 may all be configured to be movable via the spring member 19, may be configured to be all fixed, or may have a configuration in which a part is the spring member 19 and the other part is fixed.

Further, the through hole 15b into which the plunger 17 is inserted becomes a resin setting portion 29, and a granular resin is set as the resin R. The shape of the resin R is not limited to a tablet shape or a granule shape, and may be a liquid or a powder shape. Further, it may be a sheet-like resin having holes in the shape of mounted components.

(Embodiment 9)
With respect to the resin molding die 210H according to the present embodiment, differences from the eighth embodiment will be described with reference to FIG. FIG. 17 is a schematic cross-sectional view of a resin molding die 210H.

In the resin molding die 210H, in the lower mold 12, the clamper 15 is provided with a plurality of through holes 15b (insertion portions) that are arranged around the cavity piece 16 and into which the plunger 17 is inserted in contact with the cavity piece 16. A tapered runner gate 28 that narrows toward the cavity recess 13 is provided on the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12. As with the lower mold 12, the upper mold 11 may or may not have the film F (not shown in FIG. 17).

(Embodiment 10)
The resin molding die 210I according to the present embodiment will be described with respect to differences from the sixth embodiment with reference to FIG. FIG. 18 is a schematic cross-sectional view of a resin molding die 210I.

In the resin mold 210I, the clamper 15 of the upper mold 11 is fixed to the base 18a via the fixed block 56, not the spring member. Further, a runner gate 28 is provided at a position facing the plunger 17 of the lower die 12 on the lower end surface of the clamper 15 of the upper die 11 (parting surface 11a of the upper die 11). The lower mold 12 is provided with an ejector pin mechanism (not shown) for releasing the molding resin remaining on the runner gate 28 after the resin molding from the lower mold 12. A stopper 58 is provided on the upper surface of the base 18b of the lower mold 12 so that the lower mold plate 52 is locked at a certain position when the mold is closed. In addition, like the upper mold | type 11, although the film F may exist in the lower mold | type 12, it is not necessary (it shall not be in FIG. 18).

(Embodiment 11)
The resin molding die 10 (resin molding die mechanism) according to this embodiment will be described with reference to FIGS. 19 to 23 are cross-sectional views schematically showing the resin molding die 10 during operation (during the manufacturing process). 24 and 25 are plan views schematically showing parting surfaces (also referred to as a clamp surface and a mold surface) of the upper mold 11 and the lower mold 12, respectively. FIG. 26 is a schematic cross-sectional view of a main part of the molded product 100 (work W after molding).

As shown in FIG. 19, the resin molding die 10 includes a pair of dies (one and the other dies), and is configured to be openable and closable by contact and separation. In the first to tenth embodiments, the plunger 17 is disposed outside the cavity recess 13 in plan view, but in the following embodiments, embodiments in which the plunger 17 is disposed in the cavity recess 13 will be described. In the first embodiment, the resin molding die 210 in which a plurality of through holes 15b (insertion portions) of the clamper 15 into which the plunger 17 is inserted is arranged all around the cavity recess 13 has been described. The difference from this will be described as the resin molding die 10 according to the present embodiment. In the eleventh embodiment, the through hole 16a is provided in the central portion (center C) of the cavity piece 16, and the plunger 17 is disposed. In FIG. 19, the plunger 17 is fixed to the base 18, but a spring member may be interposed between the base 18 and the plunger 17 as in the first to tenth embodiments.

The workpiece W and the film F, which are the processing targets of the resin molding die 10, are the same as those in the first to tenth embodiments. As will be described later, since the resin R is set (arranged) at the center (center C) of the substrate 101, the mounting component 102 is not mounted on the substrate 101 at that position. In the present embodiment, the shape of the cavity recess 13 in plan view (see FIG. 24) is circular in accordance with the shape of plan view of the workpiece W (see FIG. 25). In addition, the planar view shape of the workpiece | work W is not restricted circularly, For example, a rectangular shape may be sufficient.

When the workpiece W becomes a molded product 100 (see FIG. 26), the opposite surface 102b (the surface opposite to the substrate) opposite to the substrate surface 102a (the substrate side surface) on the substrate 101 side is exposed, and the other surface (substrate) Surface 102 a and side surface) are covered with resin molding portion 103. That is, the opposite surface 102 b of the mounting component 102 is clamped as a clamping surface, and the substrate surface 102 a and the side surface of the mounting component are resin-sealed in the cavity recess 13. In the present embodiment, the size of the workpiece W (substrate 101) in plan view is described as being larger than the size of the cavity recess 13 in plan view, but may be smaller. Even the side surface of the substrate 101 is covered with the resin molding portion 103.

At the bottom of the cavity recess 13 (see FIG. 24), the cavity piece 16 and the plunger 17 are divided into a region for clamping the mounting component 102 and a region for pressurizing the resin R. In the present embodiment, the plunger 17, the cavity piece 16, and the clamper 15 have concentric outer shapes in plan view. That is, the plunger 17 is provided at the center of the bottom of the cavity recess 13 so that the resin R flows from the center of the bottom of the cavity recess 13 toward the outer periphery.

The resin molding die 10 has a simple structure by using a mold opening / closing mechanism in combination instead of using a complicated mechanism for moving the plunger 17, for example, as in the first embodiment. It should be noted that a separately driven actuator such as a hydraulic cylinder or a motor may be used to move the plunger 17.

Thus, in the resin molding die 10, at the bottom of the cavity recess 13, a function (cavity piece 16) for pressing the opposite surface 102 b of the mounting component 102 to clamp the mounting component 102, and pressing and compressing the resin R ( The function of pressing (plunger 17) is divided and made independent. Since each function acts independently, for example, it is possible to press the resin R by preventing the occurrence of a resin burr while preventing the mounting component 102 from being damaged and clamping the mounting component 102 with an appropriate pressure. . That is, it is possible to improve the molding quality of the molded product 100 that is resin molded using the resin molding die 10.

Next, the operation of the resin molding die 10 as a compression molding according to the present embodiment (the process of the resin molding method and the process of the molded product manufacturing method) will be described. First, as shown in FIG. 19, a pair of molds (an upper mold 11 and a lower mold 12) that can be opened and closed are provided, and a cavity recess 13 is provided on the parting surface 11 a of the upper mold 11 so as to face the cavity recess 13. Thus, the resin molding die 10 in which the set portion 14 on which the workpiece W is set is provided on the parting surface 12a of the lower die 12 is prepared.

Next, as shown in FIG. 20, in a state where the resin molding die 10 is opened, a work W (molded product) before molding on which the mounting component 102 is mounted is set in the setting unit 14. Specifically, the work W is transported to the parting surface 12a of the lower mold 12 by a loader (not shown), and the work W (more specifically, the mounted component 102 is directed to the upper mold 11 side). The substrate 101) in the state is set (arranged). The workpiece W is sucked and held by a known suction device (for example, a vacuum pump) using a suction path (not shown) formed in the lower mold 12 and set in the set unit 14.

In the state where the resin molding die 10 is opened, the film F is set so as to cover the parting surface 11 a of the upper die 11 including the inner surface of the cavity recess 13. Specifically, the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. The film may be cut into a predetermined length from the roll shape. For example, the film F is formed between the inner surface of the clamper 15 (inner wall surface of the through hole 15a) and the outer surface of the cavity piece 16, or the inner surface of the cavity piece 16 (inner wall surface of the through hole 16a) and the plunger 17. It is sucked and held by a known suction device (for example, a vacuum pump) using a gap with the outer side surface and stretched on the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13.

By providing such a film F, the workpiece W (molded product 100) after molding can be easily released from the upper mold 11. Moreover, since the mounting component 102 bites into the film F to some extent by pressing the mounting component 102 with the cavity piece 16 through the film F, it is possible to prevent the resin R from adhering to the opposite surface 102b of the mounting component 102. .

Subsequently, as shown in FIGS. 20 and 25, in the state where the resin molding die 10 is opened, the resin R is set (mounted) on the part of the workpiece W set on the setting unit 14 facing the plunger 17. ). FIG. 25 is a plan view, but the resin R is hatched for clarity of explanation. Specifically, the tablet-shaped resin R (tablet resin) is conveyed to the inside of the mold by a loader (not shown), and the resin R is supplied to a predetermined position (a position facing the plunger 17) of the workpiece W. When the resin R is a tall resin (for example, a tablet resin) that is taller than the mounted component 102, a desired amount of molding resin can be secured even if the set region is narrow.

As shown in FIGS. 33 to 34, in addition to the resin R (the tall resin Rh) that is taller than the mounting component 102 such as a tablet resin, for example, a granular resin, You may set (mount or apply | coat) resin R (back resin Rl) lower than the mounting components 102 like liquid resin and sheet resin. For example, even when a large area work requires a large amount of molding resin, unfilling of the resin R in the cavity recess 13 can be prevented.

Subsequently, a mold closing operation is started, and as shown in FIG. 21, the resin molding die 10 is closed (the upper mold 11 and the lower mold 12 are brought close to each other), and the upper mold 11 is interposed via the film F. The workpiece W (substrate 101) is clamped by the (clamper 15) and the lower mold 12. Thereby, the opening part of the cavity recessed part 13 is obstruct | occluded by the workpiece | work W (board | substrate 101). However, the depth (height) of the cavity recess 13 at this time is deeper than the depth for obtaining the molding thickness of the molded product 100. The space of the cavity recess 13 begins to be depressurized via an air vent groove (not shown) formed in the lower end surface of the clamper 15. When the size of the workpiece W in plan view is smaller than the size of the cavity recess 13 in plan view, the clamper 15 and the lower mold 12 are brought into contact with each other to close the mold (die clamp), and the cavity recess 13 is a state in which the workpiece W is housed in 13.

Subsequently, the resin molding die 10 is further closed, and as shown in FIG. 22, the mounting component 102 of the workpiece W set in the setting portion 14 is clamped by the cavity piece 16 at the bottom of the cavity recess 13. And press. At this time, since the base 18 comes close to the clamper 15 that clamps the workpiece W, the spring member 20 between them is compressed (in other words, the clamper 15 is urged). And the depth (height) of the cavity recessed part 13 becomes shallow (lower), and becomes the molding thickness of the molded product 100. At this time, the resin R is not pressed by the plunger 17. Alternatively, it is possible to press the resin R to such an extent that the resin R does not flow to the mounting component 102 even when pressed.

Subsequently, the resin molding die 10 is further closed, and while pressing the mounting part 102 with the cavity piece 16, the plunger 17 starts to press the resin R against the workpiece W, as shown in FIG. In the closed state, the cavity recess 13 is filled with the molten resin R. Specifically, since the base 18 comes close to the cavity piece 16 that clamps the mounting component 102, the spring member 21 therebetween contracts and urges the cavity piece 16. At this time, since the plunger 17 is fixed to the base 18, the plunger 17 moves relative to the cavity piece 16 toward the lower mold 12. Therefore, the plunger 17 presses the resin R in the cavity 13.

23, the lower end surface of the cavity piece 16 and the lower end surface of the plunger 17 are flush with each other (the same distance from the lower end surface of the base 18). However, in the resin molding die 10, a predetermined molding pressure (clamp) Pressure), the amount of the molding resin can be adjusted, and therefore it is not always the same. This is because, in the resin molding die 10, the cavity piece 16 and the plunger 17 constituting the bottom of the cavity recess 13 are relatively movable.

For example, when a resin R having a larger resin amount than the molding resin amount is set, the lower end surface of the plunger 17 is lower than the lower end surface of the cavity piece 16 with respect to the workpiece W (the mounting surface of the mounting component 102). The resin molding is performed at a distance (retracted). At this time, the through hole 16a into which the plunger 17 is inserted functions as an overflow cavity. On the other hand, when the resin R having a resin amount smaller than the molding resin amount is set, the lower end surface of the plunger 17 is closer to the workpiece W than the lower end surface of the cavity piece 16 by the shortage (entered). ) Resin molding is performed. Thus, since the amount of molding resin can be adjusted in the resin molding die 10, for example, even if the workpiece W has a different number of mounted components 102, the resin R is not filled in the cavity recess 13. Can be prevented. As the resin amount adjustment, in addition to the adjustment at the pressing position of the lower end surface of the plunger 17 with respect to the lower end surface of the cavity piece 16 as described above, as shown in FIG. A known overflow cavity (recessed portion for excess resin) provided with a recessed portion can also be used. In this case, the overflow cavity may be an overflow cavity containing the plunger of the pressure adjusting mechanism.

Next, after the resin R filled in the cavity recess 13 is thermally cured in a pressure-holding state, the mold W is opened and released, and the workpiece W is further thermally cured (post-cure). As a result, as shown in FIG. 26, a molded product 100 including a resin molded portion 103 (resin R) that exposes the opposite surface 102b of the mounting component 102 is substantially completed.

As described above, in the resin molding die 10, the cavity piece 16 that clamps the mounting component 102 and the plunger 17 that presses and compresses (presses) the resin R relative to each other in the mold opening / closing direction at the bottom of the cavity recess 13. It is divided so that it can move forward and backward. For this reason, for example, it is possible to start the pressing of the resin R while preventing the mounting component 102 from being damaged and clamping the mounting component 102 with an appropriate pressure, and the resin burr (molding failure) on the opposite surface 102 b of the mounting component 102. Can be prevented. Therefore, according to the resin molding die 10, the manufacturing yield can be improved, and the molding quality of the molded product 100 can be improved. Moreover, since the process of removing the resin burrs is not necessary, the manufacturing cost can be reduced.

By the way, the resin molding method using the resin molding die 10 can be applied not only to the workpiece W described above but also to a workpiece W (three types of workpieces W1, W2, W3) as shown in FIG. . FIG. 27 is a schematic cross-sectional view of a main part of various workpieces W1, W2, and W3.

The workpiece W1 is obtained by flip-chip mounting the mounting component 104 having the bump 105 (solder ball) on the lower surface 104a on the substrate 101 via the bump 105. As described above, after the upper surface 104b of the mounting component 104 is pressed by the cavity piece 16, the workpiece W1 is formed by the resin molding by pressing the resin R with the plunger 17 so that the workpiece W1 includes the substrate 101 and the lower surface 104a including between the bumps 105. Is sealed with resin (so-called mold underfill), and the upper surface 104b is exposed.

Also, the workpiece W2 is obtained by flip-chip mounting a mounting component 106 having a bump 105 on the lower surface 106a and a bump 107 and another mounting component 108 on the upper surface 106b on the substrate 101 via the bump 105. By the resin molding method described above, the workpiece W2 is resin-sealed between the substrate 101 and the lower surface 106a by resin molding, and a part of the surface of the bump 107 is exposed.

In addition, the workpiece W3 is mounted on the substrate 101 by flip chip mounting the mounting component 104 and the mounting component 106, and another substrate 109 (also mounting component) is attached to the post 110 (mounting component) so as to cover (pinch) these stacked components. And also mounted via the mounting component 106. By the resin molding method described above, the workpiece W3 is resin-sealed between the substrate 101 and the substrate 109 (between the upper and lower substrates) by resin molding, and the upper surface of the substrate 109 is exposed.

Embodiment 12
In the eleventh embodiment, the technique related to the resin mold 10 in which the cavity recess 13 is provided in the upper mold 11 has been described. In the present embodiment, the mold configuration of the resin molding die 10 is turned upside down, and the technology relating to the resin molding die 10A in which the cavity recess 13 is provided in the lower mold 12 will be described with reference to FIG. explain. FIG. 28 is a cross-sectional view schematically showing the resin molding die 10A. The resin in this case may be any of liquid, granule, powder, and tablet. Since this applies to all of the following examples, the type is not particularly described.

The resin molding die 10A includes a pair of molds (upper die 11 and lower die 12) that can be opened and closed. A cavity recess 13 is provided in the parting surface 12a of the lower die 12, and the parting surface of the upper die 11 is provided. A set unit 14 on which the workpiece W is set is provided at 11a. At the bottom of the cavity recess 13, the through hole 16 a of the cavity piece 16 serves as a pot, and the resin R is set at a position (tip surface of the plunger 17) facing the plunger 17 in the through hole 16 a (pot). With the upper end surface of the base 18 as the reference surface, the upper end surface of the plunger 17 is lower than the upper end surface of the cavity piece 16 (the distance is shorter). For this reason, even if the resin R is supplied to the pot (through hole 16a), the resin R can be prevented from overflowing to the cavity piece 16 side of the cavity recess 13. Therefore, the mounting component 102 can be pressed by the cavity piece 16 through the film F to which the resin R is not adhered, and molding defects such as a resin burr occur on the opposite surface 102b (see FIG. 26) of the mounting component 102. Can be prevented. That is, the molding quality can be improved. In FIG. 28, the workpiece W is set on the upper die 11, but after the resin R is mounted in the through hole 16a of the lower die 12, the workpiece W is placed on the parting surface 12a (set portion 14 and the lower die 12). It may be set on top.

(Embodiment 13)
In the eleventh embodiment, the technique related to the resin mold 10 in which the film F is provided on the parting surface 11a of the upper mold 11 has been described. In the present embodiment, a technique related to the resin molding die 10B in which the film F is not provided in the resin molding die 10 will be described with reference to FIG. FIG. 29 is a cross-sectional view schematically showing the resin molding die 10B.

Also in the resin molding die 10 </ b> B, the resin R is pressed against the workpiece W by the plunger 17 while pressing the mounting part 102 of the workpiece W with the cavity piece 16 at the bottom of the cavity recess 13. Filled with molten resin R and heat cured. Also by this, it is possible to prevent the occurrence of resin burrs (molding defects) on the opposite surface 102b of the mounting component 102. That is, the molding quality can be improved.

(Embodiment 14)
In the eleventh embodiment, the technology related to the resin mold 10 in which one plunger 17 is provided at the bottom center of the cavity recess 13 has been described. In the present embodiment, a technique relating to a resin mold 10C provided with a plurality of plungers 17 will be described with reference to FIG. FIG. 30 is a cross-sectional view schematically showing the resin molding die 10C.

In the resin molding die 10 </ b> C, as shown in FIG. 30, the bottom of the cavity recess 13 is composed of one plate-like cavity piece 16 supported by a base 18 and a plurality of pin-like plungers 17. That is, the inner bottom surface of the cavity recess 13 is constituted by the lower end surface of the cavity piece 16 and the lower end surfaces of the plurality of plungers 17. A plurality of through holes 16a (pots) are formed in the cavity piece 16 in the thickness direction (mold opening / closing direction) around the center in plan view. A plurality of plungers 17 are provided in each of the plurality of through holes 16a. The plurality of plungers 17 are arranged along the outer shape of the bottom of the cavity recess 13 in a plan view shape (circular shape). Note that the shape is not necessarily circular, and may be rectangular. Moreover, you may match | combine with a workpiece | work shape.

In such a resin molding die 10C, a plurality of resins R (tablet resin) are set in each of a plurality of locations facing the plurality of plungers 17 in the workpiece W set in the setting portion 14. The plurality of resins R are set around a center C of the workpiece W (substrate 101) at a location along the outer peripheral shape of the workpiece W in a circular shape in plan view. For this reason, in the bottom part of the cavity recessed part 13 which opposes the workpiece | work W, the some plunger 17 will be arrange | positioned so that circular shape may be drawn. And since the planar view shape of the cavity recessed part 13 is circular shape according to the planar view shape of the workpiece | work W, the some plunger 17 matches the external shape of the planar view shape (circular shape) of the bottom part of the cavity recessed part 13 ( Along). Therefore, the distance from each plunger 17 to the corner (boundary portion) between the bottom and the side of the cavity recess 13 is the same, and the resin R flows through this distance. Fillability can be improved.

Further, the places where a plurality of resins R are set are the places between the mounted parts 102 (between the pitches) arranged in a matrix, that is, the parts of the workpiece W excluding the mounted parts 102. When the amount of the molding resin is the same, the tablet resin becomes larger with one, but the tablet resin can be smaller with more than one. Therefore, unlike the case of the eleventh embodiment (see FIG. 25) in which an area for placing a relatively large tablet resin is required, the mounting component 102 is not provided at the center C of the workpiece W. In the embodiment, it is possible to cope with the case where the mounting component 102 exists at the center C of the workpiece W, and the resin R can be set even in a narrow region between the pitches of the mounting components 102 arranged in a matrix.

(Embodiment 15)
In the eleventh embodiment, the technology related to the resin molding die 10 corresponding to the same mounting component 102 mounted on the workpiece W has been described. In the present embodiment, referring to FIG. 31, a technique related to a resin molding die 10 </ b> D that can be applied to a workpiece W on which mounting components 102 having different heights (a lower mounting component 102 l and a higher mounting component 102 h) are mounted. I will explain. FIG. 31 is a cross-sectional view schematically showing the resin molding die 10D.

As shown in FIG. 31, in the resin molding die 10D, the cavity piece 16 is divided into an inner part 16i and an outer part 16o, and each of the inner part 16i and the outer part 16o is independent of the plunger 17. It is provided so that it can move forward and backward. From this figure, the inner portion 16i and the outer portion 16o have a ring shape inside the inner portion 16i, but it is not necessarily a ring shape, and is divided by a partial rectangular inner portion of the ring. Also good. The inner part 16i and the outer part 16o are assembled to the base 18 via a spring member 21i and a spring member 21o (for example, a spring), respectively, and are provided so as to be movable back and forth in the mold opening / closing direction.

In such a resin mold 10D, in a state where the mold is opened, the workpiece W on which the mounting components 102l and 102h having different heights are mounted is set, the mounting component 102l is pressed by the inner portion 16i, and the mounting component 102h is It is pressed by the outer portion 16o. According to this, even if the parts to be mounted on the workpiece W are the mounting parts 102l and 102h having different heights, they are pressed by the corresponding cavity pieces 16 (the inner part 16i and the outer part 16o). Therefore, it is possible to prevent the resin R from adhering to the surfaces (surfaces opposite to the substrate 101) of the mounting components 102l and 102h.

(Embodiment 16)
In the eleventh embodiment, the technology related to the resin molding die 10 in which the spring member 21 provided on the base 18 urges the cavity piece 16 to press the mounting component 102 has been described. In the present embodiment, a technique related to a resin molding die 10E that includes the wedge mechanism 22 and prevents the cavity piece 16 from being lifted and fixes the cavity piece 16 will be described with reference to FIG. FIG. 32 is a cross-sectional view schematically showing the resin molding die 10E.

The wedge mechanism 22 includes a spacer portion 23 and

taper portions

24 and 25 that are overlapped between the base 18 and the cavity piece 16 that is suspended and supported by the spring member 21. The

taper portions

24 and 25 have different thicknesses in the direction intersecting the mold opening / closing direction, and the taper surfaces (the lower end surface of the taper portion 24 and the upper portion of the taper portion 25 are formed so that the entire thickness is uniform in that direction. The end face is overlapped. The wedge mechanism 22 has a structure in which one of the tapered

portions

24 and 25 superimposed on the upper and lower stages is slidable by a driving source such as an air cylinder or a motor. The wedge mechanism 22 is written in two sets with respect to the integral cavity piece 16, but it is sufficient that the wedge mechanism 22 is arranged in a balanced manner with respect to the workpiece W, and three sets, four sets, etc. are arranged equally according to the cavity shape. It is okay.

The wedge mechanism 22 moves the

taper portions

24 and 25 relatively so as to slide on each other's taper surface, thereby changing the total thickness of the stacked parts so that the molding thickness of the molded product 100 becomes a desired thickness. The cavity piece 16 is fixed. For example, when a resin pressure such as a holding pressure of the resin R filled in the cavity concave portion 13 is applied, the cavity piece 16 is moved toward the base 18 against the urging force of the spring member 21 by the lower mold 12 via the workpiece W. Trying to be pushed back. At this time, since the upper end surface of the cavity piece 16 is in contact with the wedge mechanism 22 (lower end surface of the taper portion 25) at a predetermined molding position, the cavity piece 16 can be fixed. Therefore, the molding thickness of the molded product 100 can be kept constant. Note that one of the inner part 16i and the outer part 16o obtained by dividing the cavity piece 16 of the fifteenth embodiment may be used as the wedge mechanism 22 of the sixteenth embodiment.

(Embodiment 17)
In the eleventh embodiment, the technique related to the resin mold 10 provided with the plunger 17 that is relatively movable with respect to the cavity piece 16 that presses the mounting component 102 has been described. In this embodiment, the rubber member 30 (elastic member) is provided in the cavity piece 16 together with the plunger 17, and the function of pressing the mounting component 102 against the rubber member 30 (component pressing portion 40) and the function of pressing the resin R (resin pressing) A technique relating to the resin molding die 10G having the portion 41) will be described with reference to FIGS. FIG. 33 is a cross-sectional view schematically showing a resin molding die 10G. FIG. 34 is a schematic plan view of the parting surface 12a of the lower mold 12 of the resin molding die 10G, showing the resin R (the tall resin Rh and the tall resin Rl) supplied onto the workpiece W. Yes. FIG. 35 is a schematic plan view of a resin R (a low resin Rl) used in the resin molding die 10G. 33 to 34, a tablet resin is shown as the tall resin Rh, a granule resin (see FIG. 33) or a liquid resin (see FIG. 34) is shown as the low resin Rl, and FIG. A sheet resin is shown as the resin Rl. In the sheet resin of the low resin Rl shown in FIG. 35, a through hole 31a is formed at a location corresponding to the mounting component 102 of the set work W, and a location corresponding to the plunger 17 (set high resin Rh). The through-hole 31b is formed in this. In the present embodiment, as the resin R, the tall resin Rh and the tall resin Rl are used in combination.

The resin mold 10G includes a rubber member 30 (elastic member) provided on the cavity piece 16 and a film F stretched on the parting surface 11a including the cavity recess 13 so as to cover the rubber member 30. Yes. Specifically, a rubber member 30 that matches the shape of the cavity piece 16 in plan view (for example, an annular shape) is used, and the rubber member 30 is provided in contact with the lower end surface of the cavity piece 16. For this reason, a through hole is also formed in the rubber member 30 in accordance with the through hole 16 a of the cavity piece 16. The rubber member 30 has a function of pressing the mounting component 102 (hereinafter referred to as a component pressing portion 40) and a function of pressing the resin R (hereinafter referred to as a resin pressing portion 41). In FIG. 33, the location of the rubber member 30 corresponding to the mounting component 102 (component pressing portion 40) and the location of the rubber member 30 corresponding to the low-profile resin Rl (resin pressing portion 41) are indicated by broken lines. Show.

The operation of the resin molding die 10G according to this embodiment will be described. First, in a state where the mold is opened, the workpiece W on which the mounting component 102 is mounted is set in the setting unit 14. Next, in a state where the mold is opened, a tall resin Rh (tablet resin) is set at a position facing the plunger 17 of the work W, and a position facing the resin pressing portion 41 of the work W (that is, the set work W A short resin Rl (granular resin, liquid resin or sheet resin) is set between the mounting components 102).

Next, the mold is closed, and the mounting component 102 of the workpiece W set in the setting unit 14 is pressed at a location (component pressing unit 40) of the rubber member 30 that presses the mounting component 102 at the bottom of the cavity recess 13. At this time, since the low resin R1 is made lower than the mounting component 102, the resin pressing portion 41 is prevented from contacting the low resin R1 before the component pressing portion 40 contacts the mounting component 102. Yes.

Next, while pressing the mounting component 102 with the component pressing portion 40, the plunger 17 starts to press the tall resin Rh, and the resin pressing portion 41 starts to press the tall resin Rl to melt the inside of the cavity recess 13. Filled with R (tall resin Rh and low resin Rl). Next, the resin R filled in the cavity concave portion 13 is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), thereby exposing the opposite surface 102b of the mounting component 102. The molded product 100 provided with 103 (resin R) is substantially completed (see FIG. 26). According to such a resin molding die 10G, the elasticity of the rubber member 30 can prevent the resin R from adhering to the opposite surface 102b of the mounting component 102 and absorb the excess resin. Therefore, even when a larger amount of resin R than the amount of molding resin is set, unfilling of the resin R in the cavity recess 13 can be prevented.

(Embodiment 18)
In the eleventh embodiment, the technique related to the resin mold 10 provided with the plunger 17 that is relatively movable with respect to the cavity piece 16 that presses the mounting component 102 has been described. In the present embodiment, the rubber member 30 (elastic member) is provided in the cavity piece 16 without providing the plunger 17, the function of pressing the mounting component 102 against the rubber member 30 (the component pressing portion 40), and the function of pressing the resin R. A technique related to the resin molding die 10H provided with (resin pressing portion 41) will be described with reference to FIG. FIG. 36 is a cross-sectional view schematically showing the resin molding die 10H.

The upper mold 11 of the resin molding die 10H includes a clamper 15, a cavity piece 32, and a base 18, and these die blocks are assembled. The clamper 15 is assembled to the base 18 via a spring member 20 (elastic member), and is provided so as to be movable back and forth in the mold opening / closing direction. A through-hole 15a is formed in the clamper 15 in the thickness direction, and a cavity piece 32 is provided in the through-hole 15a. The cavity piece 32 is fixed to and supported by the base 18. The side of the cavity recess 13 is constituted by the clamper 15, and the bottom of the cavity recess 13 is constituted by the cavity piece 32. The inner bottom surface of the cavity recess 13 is formed by the lower end surface of the cavity piece 32.

The resin molding die 10H includes a rubber member 30 (elastic member) provided at the bottom of the cavity recess 13, that is, the cavity piece 16. Specifically, a rubber member 30 that matches the shape of the cavity piece 16 in plan view (for example, a circular shape) is used, and the rubber member 30 is provided in contact with the lower end surface of the cavity piece 16. The rubber member 30 has a function of pressing the mounting component 102 (component pressing part 40) and a function of pressing the resin R (resin pressing part 41). In the resin molding die 10H, the film F is stretched in the cavity recess 13 so as to cover the rubber member 30 in contact with the lower end surface of the cavity piece 16.

The operation of the resin molding die 10H according to this embodiment will be described. First, in a state where the mold is opened, the work W on which the mounting component 102 is mounted is set on the setting unit 14. Next, in a state where the mold is opened, a short resin Rl (granular resin, liquid resin or sheet resin) is placed at a position facing the resin pressing portion 41 of the workpiece W (that is, between the mounted parts 102 of the set workpiece W). set.

Next, while pressing the mounted component 102 with the component pressing portion 40, the resin pressing portion 41 starts to press the low resin Rl, and the cavity recess 13 is filled with the molten resin R (low resin Rl). Next, the molded product 100 including the resin molded portion 103 (resin R) that exposes the opposite surface 102b of the mounting component 102 is obtained by thermosetting the resin R filled in the cavity recess 13 while holding the pressure. Completed (see FIG. 26). According to such a resin molding die 10H, surplus resin can be absorbed by the elasticity of the rubber member 30. Therefore, a resin R larger than the amount of molding resin is set, and the resin R in the cavity recess 13 is not filled. Can be prevented.

In the resin mold 10H, the rubber member 30 having a uniform thickness is used, and as shown in FIG. 36, the thickness of the rubber member 30 is thinner at a location corresponding to the component pressing portion 40 than at a location corresponding to the resin pressing portion 41. A rubber member 33 can also be used. Specifically, the rubber member 33 provided in the cavity piece 32 has a flat surface on the workpiece W (mounting component 102) side, and a recess is formed at a location corresponding to the component pressing portion 40 on the surface on the cavity piece 32 side. The thickness is reduced. A convex portion that fits into the concave portion is formed on the lower end surface of the cavity piece 32. According to this, for example, surplus resin can be absorbed by the elasticity of the thick rubber member 33, so that a larger amount of resin R than the amount of molding resin is set to prevent unfilling of the resin R in the cavity recess 13 can do.

In addition, you may form the space by the recessed part by using the rubber member 33 which has a recessed part in the location corresponding to the component press part 40, keeping the lower end surface of the cavity piece 32 flat. According to the component pressing portion 40 having a space (concave portion), when the mounted component 102 is pressed, the space is narrowed, and the resin R can be pressed so that the resin pressing portion 41 is pushed out by the action.

(Embodiment 19)
In the eighteenth embodiment, the technology related to the resin molding die 10H provided with the cavity piece 32 fixed to the base 18 has been described. In the present embodiment, a technique relating to the resin molding die 10I in which the cavity piece 32 is provided on the base 18 so as to be movable back and forth in the mold opening / closing direction will be described with reference to FIG. FIG. 37 is a cross-sectional view schematically showing the resin molding die 10I.

The cavity piece 32 is suspended and supported by the base 18 via a spring member 34 (elastic member), and is provided in the through hole 15a of the clamper 15 so as to be movable back and forth in the mold opening / closing direction. A rubber member 30 (elastic member) is provided in contact with the lower surface of the cavity piece 32. The rubber member 30 has a function of pressing the mounting component 102 (component pressing part 40) and a function of pressing the resin R (resin pressing part 41), but these functions are easily exhibited by the elastic action of the spring member 34. Become. Therefore, it is possible to prevent molding defects such as resin burrs from occurring on the opposite surface 102b (see FIG. 26) of the mounting component 102. That is, the molding quality can be improved.

(Embodiment 20)
In the above embodiments 11 to 19, the technique in which the cavity recess 13 is provided in either the upper mold 11 or the lower mold 12 has been described. In the present embodiment, a technique relating to the resin molding die 10J in which the cavity recess 13 is provided in each of the upper mold 11 and the lower mold 12 will be described with reference to FIGS. 38 to 39. FIG. 38 to 39 are cross-sectional views schematically showing the resin mold 10J.

38 to 39, although not shown, a stopper is provided on the upper end surface of the base 18 of the lower mold 12 so as to abut against the lower end surface of the clamper 15 of the lower mold 12 when the mold is closed. The cavity structure described in the above embodiments 11 to 19 may be combined to form a resin molding die 10J having the cavity recess 13 in each of the upper mold 11 and the lower mold 12 as shown in FIGS. it can.

The operation of the resin molding die 10J as the compression molding according to the present embodiment (the process of the resin molding method and the process of the manufacturing method of the molded product) will be described as a representative as shown in FIG. Note that FIG. 39 shows a plunger 27 as an example in which another drive actuator is used instead of the plunger 17 as shown in FIG. First, a pair of molds (upper mold 11 and lower mold 12) that can be opened and closed are provided. A cavity recess 13 is provided in the parting surface 11a of the upper mold 11, and the cavity recess 13 is formed in the parting surface 12a of the lower mold 12. The resin molding die 10J provided with is prepared. In the resin molding die 10J, the bottom of each cavity recess 13 of the upper mold 11 and the lower mold 12 is set so that the resin pressing portion 17 (plunger) that presses the resin R and the cavity recess 13 are opposed to each other. A component pressing portion 16 (cavity piece) that presses the W mounted component 102 is included. In the work W shown in this embodiment, a plurality of mounting components 102 are mounted on both surfaces (upper and lower surfaces) of the substrate 101.

Next, in a state where the resin mold 10J is opened, the parting surface 11a including the inner surface of the cavity recess 13 of the upper mold 11 and the parting surface 12a including the inner surface of the cavity recess 13 of the lower mold 12 are covered. Set film F. Next, in a state where the mold is opened, the lower mold resin R filled in the cavity 13 of the lower mold 12 is set at a location facing the resin pressing portion 17 of the lower mold 12 (tip surface of the resin pressing portion 17). .

Also, the workpiece W is set on the set portion 14 with the resin molding die 10J being opened. In the resin mold 10J, a set portion 14 on which the workpiece W is set is provided on the parting surface 12a of the lower mold 12 (the upper end surface of the clamper 15 of the lower mold 12). In a state where the workpiece W is set in the set portion 14, a plurality of mounting components 102 mounted on one side surface (lower surface) of the workpiece W (substrate 101) are accommodated in the cavity recess 13 of the lower mold 12. Next, in a state where the resin molding die 10J is opened, the upper mold resin R filled in the cavity 13 of the upper mold 11 is set at a location facing the resin pressing portion 17 of the set work W. Note that the workpiece W may be set on the set portion 14 in a state where the upper mold resin R is set on the workpiece W.

Next, the resin molding die 10J is closed, and the mounting component 102 on one side (upper surface side) of the set work W is pressed by the component pressing portion 16 of the upper die 11. Further, the mounting component 102 on the other side (lower surface side) of the set work W is pressed by the component pressing portion 16 of the lower mold 12.

Next, the resin molding die 10J is further closed, and the mounting component 102 on one side of the work W is pressed against the component pressing portion 16 of the upper die 11 while being pressed by the component pressing portion 16 of the upper die 11. The resin pressing portion 17 of the mold 11 is relatively moved, and the upper mold resin R is pressed by the resin pressing portion 17 of the upper mold 11. In this way, the cavity recess 13 of the upper mold 11 is filled with the molten upper mold resin R. Further, while pressing the mounting component 102 on the other side of the workpiece W with the component pressing portion 16 of the lower mold 12, the resin pressing portion 17 of the lower mold 12 is moved relative to the component pressing portion 16 of the lower mold 12. Then, the lower mold resin R is pressed by the resin pressing portion 17 of the lower mold 12. In this way, the cavity recess 13 of the lower mold 12 is filled with the molten lower mold resin R.

Next, after the upper mold resin R filled in the cavity recess 13 of the upper mold 11 and the lower mold resin R filled in the cavity recess 13 of the lower mold 12 are thermally cured, the mold is opened. The released work W is further thermally cured (post-cure). As a result, the molded product 100 having the resin molded portion 103 exposing the opposite surface 102b of the mounting component 102 as shown in FIG. 26 on both surfaces (upper and lower surfaces) of the workpiece W (substrate 101) is substantially completed.

The present invention has been specifically described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and it goes without saying that various selections and modifications can be made without departing from the scope of the invention. Absent.

For example, the first embodiment and the eleventh embodiment may be combined to set the resin in both the cavity recess 13 and the clamper 15. In the case of double-sided molding, the lower mold of the first embodiment is combined with the first embodiment. You may make it like the form 20. Any embodiment may be used selectively.

For example, in the first embodiment, the case where the mounting component is mounted on the substrate as the work has been described. For example, the mounting component may be flip-chip mounted on the substrate via bumps. Even in such a case, a so-called mold underfill in which the space between the substrate and the mounting component (bumps) is filled with resin can be performed.

For example, in the first embodiment, the case has been described in which the cavity piece is applied to the opposite surface (surface) of the mounting component and resin-molded to expose the opposite surface. Not limited to this, for example, by providing a jaw stopper mechanism that contacts the upper surface of the clamper at the top of the cavity piece so that the cavity piece does not fall below a certain distance with respect to the base. It is also possible to mold the resin without hitting it. In other words, the entire mounted component including the opposite surface can be sealed. In this case, the opposite surface of the mounting component is covered with resin.

Claims

A resin mold having a pair of molds that can be opened and closed with a cavity,
A base that is provided in one mold and is moved relative to the other mold so as to approach the mold in a closed state and leave in a mold-open state;
A plurality of resin pressing portions provided on the base and arranged around the cavity in a plan view;
A resin molding die comprising:
In the resin molding die according to claim 1,
A plurality of insertion portions that are arranged around the cavity apart from the cavity in plan view, and the plurality of resin pressing portions are respectively inserted;
A plurality of runner gates provided on a parting surface of the one or the other mold, and narrowed toward the cavity from positions opposed to the plurality of insertion portions in plan view;
A resin molding die further comprising:
In the resin molding die according to claim 1,
A resin molding die, further comprising a plurality of insertion portions arranged in contact with the cavity in plan view and arranged around the cavity, into which the plurality of resin pressing portions are respectively inserted.
In the resin molding die according to claim 3,
A resin molding die, further comprising a runner gate provided on a resin pressing surface of the resin pressing portion and narrowing toward the cavity.
In the resin molding die according to any one of claims 1 to 4,
A resin molding die, further comprising a resin setting portion provided at a position facing the resin pressing portion in a plan view and recessed in a parting surface of the one or the other die.
In the resin molding die according to any one of claims 1 to 5,
An elastic member;
The resin molding die, wherein the resin pressing portion is provided on the base via the elastic member.
In the resin molding die according to any one of claims 1 to 5,
The resin molding die, wherein the resin pressing portion is fixed to the base.
In the resin molding die according to any one of claims 1 to 7,
An overflow cavity provided around the cavity away from the cavity in plan view;
A runner which is provided on a parting surface of the one or the other mold and faces the cavity from a position facing the overflow cavity in a plan view;
A resin molding die further comprising:
In the resin molding die according to any one of claims 1 to 8,
A resin-molding die, further comprising a film that covers at least one parting surface of the one or the other die.
(A) A resin mold having a pair of molds having a cavity and capable of opening and closing, provided on one mold, approaching the other mold in a closed state, Preparing the resin molding die comprising: a base that is relatively moved so as to leave in a state; and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in plan view;
(B) In a state where the mold is opened, a workpiece having the mounting component is set with the mounting component facing the cavity piece side at a position facing the cavity piece constituting the cavity of the resin molding die in plan view. And a process of
(C) setting the resin at a position facing the resin pressing portion in plan view with the mold opened;
(D) a step of closing the mold and clamping the mold with a clamper around the cavity piece provided in the resin molding mold;
(E) a step of closing the mold further than the step (d) and applying the cavity piece to the mounting component;
(F) The step of closing the mold further than the step (e), pressing the resin with the resin pressing portion, and filling the cavity with the resin;
A resin molding method comprising:
(A) A pair of molds that can be opened and closed is provided, a cavity recess is provided on the parting surface of at least one of the other molds, and the bottom of the cavity recess is a resin pressing part that presses the resin. A step of preparing a resin molding die configured to include a component pressing portion that presses a mounting component of a work set so as to face the cavity recess;
(B) a step of setting the workpiece in a state where the mold is opened;
(C) In a state where the mold is opened, a step of setting the resin at a location facing the resin pressing portion;
(D) a step of closing the mold and pressing the mounted component of the set workpiece with the component pressing portion;
(E) a step of pressing the resin against the workpiece with the resin pressing portion while pressing the mounting component with the component pressing portion, and filling the cavity recess with the molten resin;
(F) a step of thermosetting the resin filled in the cavity recess, and a resin molding method.
The resin molding method according to claim 11,
In the step (a), the resin pressing part is supported by a support part, and the component pressing part is prepared by supporting the support part via a spring member.
In the step (e), the resin pressing method presses the resin by moving the resin pressing portion relative to the component pressing portion.
The resin molding method according to claim 11 or 12,
In the step (a), the component pressing portion is divided into a first component pressing portion and a second component pressing portion, and each of the first component pressing portion and the second component pressing portion is independently Prepare the resin molding die provided so as to be movable back and forth with respect to the resin pressing part,
In the step (b), the workpiece on which the first and second mounting components having different heights are mounted as the mounting component is set,
In the step (d), the first mounting component is pressed by the first component pressing portion, and the second mounting component is pressed by the second component pressing portion.
In the resin molding method according to any one of claims 11 to 13,
In the step (a), the resin molding method in which a plurality of the resin pressing portions are arranged along the outer shape of the bottom of the cavity recess in a plan view shape is prepared.
In the resin molding method according to any one of claims 11 to 14,
In the step (c), the first resin is set higher than the height of the mounting component as the resin, and the location of the workpiece excluding the location where the first resin is set and the location where the mounting component is mounted And setting a second resin lower than the height of the mounted component.
In the resin molding method according to any one of claims 11 to 15,
In the step (a), the resin molding die including a rubber member provided in the component pressing portion is prepared,
In the step (d), the mounting component is pressed with the rubber member so that the location of the rubber member functions as the component pressing portion,
In the step (e), while pressing the mounting component at the location of the rubber member that functions as the component pressing portion, the resin in the cavity recess is pressed by the rubber member so that the location of the rubber member is A resin molding method, which functions as a resin pressing portion.
The resin molding method according to claim 11,
In the step (a), the resin molding die provided with a rubber member provided at the bottom of the cavity recess is prepared,
In the step (d), the mounting component is pressed with the rubber member so that the location of the rubber member functions as the component pressing portion,
In the step (e), while pressing the mounting component at the location of the rubber member that functions as the component pressing portion, the resin in the cavity recess is pressed by the rubber member so that the location of the rubber member is A resin molding method, which functions as a resin pressing portion.
In the resin molding method according to any one of claims 11 to 17,
In the step (a), the resin molding die provided with a film that covers the parting surface including the cavity concave portion and has an adhesive surface on the side opposite to the parting surface;
In the step (d), the film is adhered to the mounting component, and the mounting component is pressed by the component pressing portion.
With a pair of molds that can be opened and closed,
A cavity recess is provided in the parting surface of at least one of the one or the other mold,
The bottom of the cavity recess is configured to include a resin pressing portion that presses the resin, and a component pressing portion that presses the mounting component of the workpiece set so as to face the cavity recess,
The cavity is filled with the molten resin by pressing the resin with the resin pressing portion while pressing the mounted component of the set workpiece with the component pressing portion, and thermosetting is performed. Resin molding mold characterized by
(A) A pair of molds that can be opened and closed is provided, a cavity recess is provided on the parting surface of at least one of the other molds, and the bottom of the cavity recess is a resin pressing part that presses the resin. A step of preparing a resin molding die configured to include a component pressing portion that presses a mounting component of a work set so as to face the cavity recess;
(B) a step of setting the workpiece in a state where the mold is opened;
(C) In a state where the mold is opened, a step of setting the resin at a location facing the resin pressing portion;
(D) a step of closing the mold and pressing the mounted component of the set workpiece with the component pressing portion;
(E) a step of pressing the resin against the workpiece with the resin pressing portion while pressing the mounting component with the component pressing portion, and filling the cavity recess with the molten resin;
(F) thermosetting the resin filled in the cavity recess, and forming a resin molding portion on the workpiece that seals the mounting component exposed at the surface pressed by the component pressing portion. A method for producing a molded product characterized by the above.