JP2019034445A - Resin molding apparatus and resin molding product manufacturing method - Google Patents

Abstract

An object of the present invention is to provide a resin molding apparatus capable of resin molding with a simple structure. A mold 1000 includes a mold clamping portion 220. The mold 1000 has one mold 100 and the other mold 200. One mold 100 and the other mold 200 are The other mold 200 is attached to the mold clamping portion 220 on the side opposite to the surface facing the one mold 100, and the other mold 200 has a resin material accommodating portion 212 and a plunger 213. The jar 213 is movable in the opening and closing direction of the molding die 1000 with respect to the resin material accommodating portion 212, and the mold clamping portion 220 is moved in the clamping direction of the molding die 1000, thereby clamping the molding die 1000. By pushing the plunger 213 in the direction of the one mold 100, the resin material accommodated in the resin accommodating portion 212 can be pushed out by the plunger 213 to the mold surface of the molding die 1000. Resin molding apparatus. [Selection diagram] Fig. 1

Description

  The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

  As a method for producing a resin molded product, for example, compression molding, transfer molding, or the like is used. In addition, resin molding apparatuses corresponding to the respective methods for producing resin molded products are used.

  In a resin molding apparatus for transfer molding, for example, a transfer drive mechanism is provided in a press (molding die), resin is put into a pot, a plunger is moved using the transfer drive mechanism, and resin is injected (patent) Reference 1).

Japanese Patent Laid-Open No. 05-084765

  However, the resin molding apparatus as in Patent Document 1 has a problem that the structure is complicated because the plunger is attached to a transfer drive mechanism different from the mold clamping mechanism of the mold.

  Therefore, an object of the present invention is to provide a resin molding apparatus capable of resin molding with a simple structure and a method for producing a resin molded product.

In order to achieve the above object, the resin molding apparatus of the present invention comprises:
A mold and a clamping part;
The mold has one mold and the other mold,
The one mold and the other mold face each other,
The other mold is attached to the mold clamping portion on the side opposite to the surface facing the one mold,
The other mold has a resin material container and a plunger,
The plunger is movable in the opening / closing direction of the molding die with respect to the resin material container.
By moving the mold clamping part in the mold clamping direction of the mold, the mold is clamped, and the plunger is pushed in the direction of the one mold to accommodate the resin contained in the resin container The material can be extruded onto the mold surface of the mold by the plunger.

The method for producing the resin molded product of the present invention is as follows.
A resin material housing step of housing the resin material in the resin material housing portion of the mold,
A mold clamping process for clamping the mold,
In the mold clamping step, the mold is clamped and the resin material accommodated in the resin accommodating portion is extruded onto the mold surface of the mold.

  ADVANTAGE OF THE INVENTION According to this invention, the resin molding apparatus and the manufacturing method of a resin molded product which can perform resin molding with a simple structure can be provided.

FIG. 1 is a cross-sectional view schematically illustrating the configuration of the resin molding apparatus according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing one step of a method for producing a resin molded product using the resin molding apparatus of FIG. FIG. 3 is a cross-sectional view schematically showing another step of the same resin molded product manufacturing method as in FIG. FIG. 4 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 5 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 6 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 7 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 8 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 9 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 10 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 11 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 12 is a cross-sectional view schematically showing still another step of the same resin molded product manufacturing method as in FIG. FIG. 13 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 14 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 15A is a cross-sectional view schematically showing one step of a method for producing a resin molded product using a modification of the resin molding apparatus of FIG. 1. FIG. 15B is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as in FIG. 15A. FIG. 15C is a cross-sectional view schematically showing yet another step of the method of manufacturing the same resin molded product as in FIG. 15A. FIG. 16A is a cross-sectional view schematically showing another modification of the resin molding apparatus of FIG. FIGS. 16B and 16C are views schematically showing a part of the resin molding apparatus of FIG. FIG. 17 is a schematic view showing an outline of a resin molding apparatus of Example 2 and a method of manufacturing a resin molded product using the same. 18A to 18E are process cross-sectional views schematically showing a part of the method of manufacturing the resin molding apparatus and the resin molded product of FIG. FIGS. 19A to 19H are process cross-sectional views schematically showing another part of the resin molding apparatus and the resin molded product manufacturing method of FIG. 20A to 20F are process cross-sectional views schematically showing still another part of the resin molding apparatus and the resin molded product manufacturing method of FIG. FIG. 21 is a cross-sectional view schematically showing a modification of the molding die in the resin molding apparatuses of Examples 1 and 2. FIG. 22 is a cross-sectional view schematically showing one step of a method for producing a resin molded product using the mold shown in FIG. FIG. 23 is a cross-sectional view schematically showing another step of the method of manufacturing a resin molded product using the mold shown in FIG. FIG. 24 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product using the mold shown in FIG. FIG. 25 is a cross-sectional view schematically illustrating another modified example of the molding die in the resin molding apparatus according to the first and second embodiments. FIG. 26 is a cross-sectional view schematically showing still another modified example of the molding die in the resin molding apparatus according to the first and second embodiments. 27 is a plan view of the mold shown in FIG. 28A and 28B are process cross-sectional views schematically showing an outline of a method for producing a resin molded product using the molds shown in FIGS. FIG. 29 is a cross-sectional view schematically showing one step of the method of manufacturing the resin molded product of Example 2. FIG. 30 is a cross-sectional view schematically showing another step of the method for producing the same resin molded product as in FIG. FIG. 31 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as FIG. FIG. 32 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 33 is a cross-sectional view schematically showing yet another step of the method for producing the same resin molded product as FIG. FIG. 34 is a cross-sectional view schematically showing yet another step of the method of manufacturing the same resin molded product as in FIG. FIG. 35 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as FIG. FIG. 36 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as that in FIG. FIG. 37 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as FIG. FIG. 38 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG. FIG. 39 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as that in FIG. FIG. 40 is a cross-sectional view schematically showing still another step of the method for manufacturing the same resin molded product as that in FIG. 29. FIG. 41 is a cross-sectional view schematically showing still another step of the method for manufacturing the same resin molded product as FIG. FIG. 42 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as that in FIG. FIG. 43 is a cross-sectional view schematically showing still another step of the method for producing the same resin molded product as in FIG.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

The resin molding apparatus of the present invention is, for example,
The mold clamping part includes a plunger pushing member, an elastic member, and a molding die mounting member,
The other mold is mounted on the mold mounting member on the opposite side of the surface facing the one mold;
The elastic member is disposed on the opposite side of the molding die mounting member from the surface facing the other mold, and elastically supports the molding die mounting member.
The plunger pushing member is movable in the opening / closing direction of the mold relative to the mold by expansion and contraction of the elastic member,
The mold clamping portion is moved in the mold clamping direction of the molding mold to clamp the molding mold, and the plunger push-in member pushes the plunger in the direction of the one mold to accommodate the resin. It may be possible to extrude the resin material accommodated in the part onto the mold surface of the mold by the plunger.

The resin molding apparatus of the present invention is, for example,
The plunger pushing member is a holder block;
The holder block may hold the mold mounting member.

The resin molding apparatus of the present invention is, for example,
The one mold includes a mold cavity, an adjustment member, and an adjustment member elastic member that elastically supports the adjustment member,
The adjustment member is movable in the opening and closing direction of the mold by expansion and contraction of the elastic member for adjustment member,
The resin pressure in the mold cavity may be adjustable by moving the adjusting member.

The resin molding apparatus of the present invention is, for example,
The one mold further has a surplus resin container,
The surplus resin accommodating portion may communicate with the mold cavity and accommodate at least a part of the surplus resin that is not accommodated in the mold cavity when the mold is clamped.

The resin molding apparatus of the present invention is, for example,
At least a part of the adjustment member is disposed in the surplus resin container,
The resin pressure in the mold cavity may be adjustable by adjusting the capacity of the surplus resin container by moving the adjusting member.

The resin molding apparatus of the present invention is, for example,
And a first platen and a second platen,
The one mold is attached to the first platen,
The mold clamping portion may be attached to the second platen.

The resin molding apparatus of the present invention is, for example,
The mold further has an intermediate mold,
The intermediate mold is disposed between the one mold and the other mold,
The intermediate mold may include an intermediate resin material accommodating portion and an intermediate resin path.

The resin molding apparatus of the present invention is, for example,
The mold has a mold cavity, a surplus resin container, and a surplus resin separation member,
The surplus resin accommodating portion communicates with the mold cavity, and accommodates at least a part of surplus resin not accommodated in the mold cavity at the time of mold clamping,
After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member rises or descends relative to one or both of the one mold and the other mold, so that the mold cavity The resin cured inside may be separated from the excess resin cured within the excess resin container.

The resin molding apparatus of the present invention is, for example,
The resin molding apparatus is an apparatus for resin molding a substrate;
When the one mold and the other mold are clamped, the end of the substrate on the side of the surplus resin accommodating portion is sandwiched between the mold surface of the other mold and the end of the surplus resin separating member. Also good.

The resin molding apparatus of the present invention is, for example,
The other mold has a through hole;
The through hole penetrates from the resin material housing part to the opposite side of the surface facing the one mold,
After resin molding, the residual resin in the resin material container may be able to be discharged from the through hole.

The resin molding apparatus of the present invention is, for example,
The resin molding apparatus has a temperature rising stage, a resin molding stage, a cure stage, and an eject stage,
The mold is detachable with respect to each stage, and is movable between the stages.
The temperature raising stage raises the temperature of the mold,
The resin molding stage has the mold clamping part, performs resin molding,
The cure stage cures the resin in the mold,
The eject stage may release the resin molded product from the mold.

The method for producing the resin molded product of the present invention is, for example,
Using the resin molding apparatus of the present invention,
In the mold clamping step, the mold clamping portion is moved in the mold clamping direction of the molding mold to clamp the molding mold and push the plunger in the direction of the one mold to accommodate the resin. The resin material accommodated in the part may be extruded onto the mold surface of the mold by the plunger.

The method for producing the resin molded product of the present invention is, for example,
The resin molding apparatus of the present invention has a temperature raising stage, a resin molding stage, a cure stage, and an eject stage,
The mold is detachable with respect to each stage, and is movable between the stages.
The temperature raising stage raises the temperature of the mold,
The resin molding stage has the mold clamping part, performs resin molding,
The cure stage cures the resin in the mold,
The eject stage allows the resin molded product to be released from the mold.
The resin molding method further comprises:
A mold temperature raising step for raising the temperature of the mold in the temperature raising stage;
A resin curing step of curing the resin in the mold in the cure stage;
A mold release step of releasing the resin molded product from the mold in the eject stage,
You may perform the said resin material accommodation process and the said mold clamping process in the said resin molding stage.

  In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by simply molding a resin or a resin molded product obtained by resin-sealing a component such as a chip. In the present invention, the resin molded product may be, for example, an electronic component.

  In the present invention, “resin molding” or “resin sealing” means, for example, that the resin is cured (solidified).

  In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. . Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include granule resin, fluid resin, sheet-like resin, tablet-like resin, and powder-like resin. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin refers to, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin that is in a liquid or fluid state by melting. The form of the resin may be other forms as long as it can be supplied to a cavity, pot, or the like of the mold.

  In general, the term “electronic component” refers to a chip before resin-sealing and a state in which the chip is resin-sealed, but in the present invention, simply referred to as “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, “chip” refers to a chip before resin sealing, and specifically includes chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in a chip shape.

  In the present invention, “flip chip” refers to an IC chip having bump-like protruding electrodes called bumps on an electrode (bonding pad) on the surface of the IC chip, or such a chip form. This chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used as, for example, a chip for wireless bonding or one of mounting methods.

  In the present invention, for example, one side or both sides of the substrate may be resin-molded to produce a resin molded product. In addition, for example, a resin molded product may be manufactured by resin-sealing (resin molding) a component (for example, a chip or a flip chip) mounted on one or both surfaces of a substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a wafer, or a ceramic substrate. For example, as described above, the substrate may be a mounting substrate in which a chip is mounted on one surface or both surfaces thereof. The chip mounting method is not particularly limited, and examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component in which the chip is resin-sealed may be manufactured by resin-sealing one surface or both surfaces of the mounting substrate. The use of the substrate that is resin-sealed by the resin-sealing device of the present invention is not particularly limited, and examples thereof include a high-frequency module substrate for mobile communication terminals, a power control module substrate, and a device control substrate. .

  In the present invention, “mounting” includes “mounting” or “fixing”. Further, in the present invention, “mounting” includes “fixing”.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  In this example, an example of a resin molding apparatus of the present invention and an example of a method for producing a resin molded product using the same will be described.

  The cross-sectional view of FIG. 1 schematically shows the structure of the resin molding apparatus of this example. As shown in the figure, this resin molding apparatus includes a molding die 1000 and a clamping unit 220 as main components. The mold 1000 has an upper mold (one mold) 100 and a lower mold (the other mold) 200. The upper mold 100 and the lower mold 200 are opposed to each other.

  The upper mold 100 includes an upper mold cavity block 110 and an upper mold base block 120. The upper mold cavity block 110 is fixed to the upper mold base block 120 on the surface opposite to the mold surface (the surface facing the lower mold 200). On the mold surface of the upper mold cavity block 110 (surface facing the lower mold 200), a mold cavity 111, a runner (resin flow path) 112, and a cal (excess resin housing portion) 113 are provided. . There are a plurality of mold cavities 111. The mold cavities 111 adjacent to each other are communicated by a runner 112. One cull 113 is provided at each end of the upper mold cavity block 110. Each cull 113 communicates with an adjacent mold cavity 111 via a runner 112. As will be described later, the cull 113 can accommodate at least a part of the surplus resin that is not accommodated in the mold cavity 111 when the mold is clamped. The upper mold 100 further includes an adjustment member (tablet height adjustment member) 114 and an adjustment member elastic member 115 that elastically supports the adjustment member 114. A part of the adjustment member 114 is disposed inside the cull 113 and is fixed to the upper mold base block 120 by the adjustment member elastic member 115. The adjustment member 114 is movable in the opening / closing direction of the mold 1000 by the expansion / contraction of the adjustment member elastic member 115. The resin pressure in the mold cavity 111 can be adjusted by adjusting the capacity of the cull 113 by moving the adjustment member 114.

  In general, the resin material (tablet) accommodated in the pot 212 has variations in height (weight). For this reason, the amount of resin supplied into the mold cavity 111 and the cull 113 is different for each molding. Therefore, as described above, the adjustment member (tablet height adjustment member) 114 is made movable so as to adjust the volume and injection pressure (resin pressure) of the portion (mold cavity 111 and cull 113) into which the resin material is injected during resin molding. ing. Further, the cal 113 may have a communication cal (the left and right cal 113 are directly connected). By making the cal 113 communicate in this way, it is possible to suppress uneven distribution of the injection pressure (injection speed) of the resin material due to the difference in height of the resin material (tablet).

  The lower mold 200 includes a lower mold cavity block 210 as a main component. The lower mold cavity block 210 has a substrate mounting portion 211. The substrate platform 211 is provided on the mold surface of the lower mold cavity block 210 (the surface facing the upper mold 100) at a position facing the mold cavity 111 of the upper mold 100. The lower mold 200 further includes a pot (resin material housing portion) 212 and a plunger 213. The pot 212 is provided on the mold surface of the lower mold cavity block 210 at a position facing the cull 113 of the upper mold 100. The plunger 212 penetrates from the inside of the pot 212 to the side opposite to the mold surface of the lower mold cavity block 210. The plunger 213 is movable relative to the pot 212 in the opening / closing direction of the mold 1000 (upper mold 100 and lower mold 200).

  In FIG. 1, the plunger 213 further includes a ring (ring member) 214 and a collar portion 215. The ring 214 is provided at a part of the outer periphery of the plunger 213 (two locations in the figure) at a position in contact with the lower mold cavity block 210. More specifically, grooves are provided at two locations on the outer periphery of the plunger 213, and a ring 214 is attached to the groove, and the plunger 213 is held vertically by two-point support by the ring 214. The collar portion 215 is provided at the lower end portion of the plunger 213.

  As shown in FIG. 1, by supporting the plunger 213 by the ring 214, the wear of the plunger 213 itself can be suppressed and the wear can be dealt with by exchanging the ring 214. The ring 214 is not particularly limited, and for example, a fluorine resin such as polytetrafluoroethylene, an engineering plastic, or the like can be used. Further, the material for forming the plunger 213 is not particularly limited. For example, a super steel alloy that hardly wears may be used as a material for forming the plunger 213. However, since it can be supported by the ring 214 to suppress wear, steel may be used as the material of the plunger 213 instead of the super steel alloy. When the super steel alloy forming the plunger 213 contains cobalt, the sheet cleaning material may chemically react with cobalt and cause corrosion of the plunger 213. However, if steel containing no cobalt is used as a material for forming the plunger 213, corrosion of the plunger 213 by such a sheet cleaning material can be suppressed or prevented. If steel is used instead of the super steel alloy, the cost of the plunger 213 itself can be reduced.

  The mold clamping unit 220 includes a holder A block 221, a holder B block 222, a lower mold placement block (molding mold mounting member) 223, and an elastic member 224. The holder block is configured by the holder A block 221 and the holder B block 222. The elastic member 224 is disposed on the opposite side of the lower mold placement block 223 to the surface facing the upper mold 100. The lower mold placing block 223 is elastically supported on the upper surface of the holder B block 222 via an elastic member 224. The lower part of the lower mold placing block 223 has a peripheral part protruding to form a collar part. The holder A block 221 is fixed to the peripheral edge of the upper surface of the holder B block 222. Further, the outer side surface and upper surface peripheral edge portion of the collar portion of the lower mold placing block 223 and the outer side surface of the elastic member 224 are surrounded by the holder A block 221. In this way, the lower mold placement block 223 and the elastic member 224 are held by the holder blocks (holder A block 221 and holder B block 222). Portions other than the collar portion of the lower mold placing block 223 protrude from the upper surface of the holder A block 221. The lower mold 200 is mounted on a lower mold mounting block (molding mold mounting member) 223 that is a part of the mold clamping portion 220 on the side opposite to the surface facing the upper mold 100. Then, as will be described later, the mold clamping unit 220 is moved in the mold clamping direction of the mold 1000 (the upper mold 100 and the lower mold 200) to clamp the mold 1000 and to move the plunger 213 to the upper mold 100. It is possible to push the resin material accommodated in the resin accommodating part 211 onto the mold surface of the mold 1000 by the plunger 213. As will be described later, since the plunger 213 is pushed by the holder A block 221 at the time of clamping, the holder A block 221 corresponds to a “plunger pushing member”.

  1 further includes a stationary platen (first platen) 1100 and a movable platen (second platen) 1200. The upper mold 100 is mounted on the lower surface of the fixed platen 1100, and the mold clamping unit 220 is mounted on the upper surface of the movable platen 1200 on the lower surface of the holder B block 222.

  The manufacturing method of the resin molded product using the resin molding apparatus of FIG. 1 can be performed as shown in FIGS. This will be specifically described below.

  First, as shown in FIG. 2, the substrate 1 is supplied (placed) to the substrate placement portion 211 of the lower mold 200, and the tablet (resin material) 20 a is supplied to the pot 212. At this time, the lower mold 200 and the upper mold 100 are heated in advance by a heater (not shown). The tablet 20a is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. For example, a thermosetting resin such as an epoxy resin or a silicone resin can be used.

  Next, as shown in FIGS. 3 to 6, mold clamping and resin molding are performed.

  First, as shown in FIG. 3, the movable platen 1200 is raised in the direction of the arrow X1. Thereby, the mold clamping part 220 and the lower mold 200 are raised together with the movable platen 1200, and the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are brought into contact with each other as illustrated. At this time, the tablet 20a is melted by the heat of the lower mold 200 and becomes a molten resin (flowable resin) 20b as shown in the figure.

  Next, as shown in FIG. 4, the movable platen 1200 is further raised in the direction of the arrow X2. Thereby, the mold clamping unit 220 and the lower mold 200 are raised together with the movable platen 1200, and the plunger 213 and the holder A block (holder block) 221 are brought into contact with each other as illustrated.

  Next, as shown in FIG. 5, the movable platen 1200 is further raised in the direction of the arrow X3. At this time, as shown in the drawing, the elastic member 224 contracts, and the holder block (the holder A block 221 and the holder B block 222) is raised while the lower mold placing block 223 and the lower mold 200 remain in the same position. As a result, as shown in the figure, the plunger 213 is pushed into the pot 212 with the holder A block (holder block) 221, and the molten resin 20b is filled into the cal 113, the runner 112, and the mold cavity 111.

  Thereafter, as shown in FIG. 6, the heat of the upper mold 100 and the lower mold 200 cures the fluid resin 20b in the cull 113, the runner 112, and the mold cavity 111 to become a cured resin. In FIG. 6, the cured resin in the runner 112 and the mold cavity 111 (hereinafter simply referred to as “cured resin”) is denoted by reference numeral 20, and the cured resin in the cal 113 (hereinafter referred to as “excess resin” or “unnecessary resin portion”). .) Is indicated by reference numeral 20d. Thereby, the resin molded product (sealed substrate) 1b in which one surface of the substrate 1 is resin-molded with the cured resin 20 is formed. Then, after the fluid resin 20b is cured to become the cured resin 20 and the surplus resin (unnecessary resin portion) 20d, the movable platen 1200 is lowered in the direction of arrow Y1, as shown in FIG. At this time, as shown in the drawing, the upward force applied to the elastic member 224 is released, and the elastic member 224 expands again. As a result, the holder block (the holder A block 221 and the holder B block 222) is lowered while the lower mold placing block 223 and the lower mold 200 remain at the same positions.

  Next, as shown in FIGS. 7 to 14, the resin molded product 1 b is released (removed from the mold) and unloaded (conveyed outside the mold).

  First, as shown in FIG. 7, the movable platen 1200 is further lowered in the direction of the arrow Y2. Thereby, as shown in the figure, the mold clamping unit 220 and the lower mold 200 are lowered together with the movable platen, and the upper mold 100 and the lower mold 200 are opened. As a result, the resin molded product 1b (the substrate 1 and the cured resin 20) and the excess resin 20d are lowered together with the lower mold 200 and released from the upper mold 100 as illustrated. Note that, for example, the resin molded product 1b and the excess resin 20d may be released from the upper mold 100 by pressing the adjustment member 114 against the excess resin 20d by the restoring force (extension force) of the adjustment member elastic member 115.

  Thereafter, as shown in FIG. 8, the lower plate 200 is further lowered by further lowering the movable platen 1200 in the direction of the arrow Y3. In this state, as shown in FIGS. 9 and 10, the unloader 300 is moved in the direction indicated by the arrow A <b> 1 (the direction from the outside of the molding die 1000 between the upper die 100 and the lower die 200). The unloader 300 is caused to enter between the lower mold 200 and the lower mold 200. As illustrated, the unloader 300 includes a suction pad 301 for sucking the cured resin 20 and the surplus resin 20d.

  Next, as shown in FIG. 11, the suction pad 301 is lowered in the direction of the arrow B <b> 1, and the surplus resin (unnecessary resin portion) connected to the cured resin 20 of the resin molded product (sealed substrate) 1 b and the cured resin 20. ) Adsorb 20d.

  Furthermore, as shown in FIG. 12, the suction pad 301 is raised in the direction of the arrow C1 while the resin molded product 1b and the excess resin 20d are being sucked. As a result, the resin molded product 1b and the excess resin 20d are released from the mold surface of the lower mold 200, as shown. At this time, if the excess resin 20d and the plunger 213 are not separated at this time, the plunger 213 rises together with the excess resin 20d. However, as shown in the figure, the plunger 213 is configured not to rise above a predetermined height when the flange portion 215 of the plunger 213 is caught by the lower mold cavity block 210. Therefore, as shown in FIG. 13, when the surplus resin 20d is further raised together with the suction pad 301 in the direction of the arrow C2, the surplus resin 20d and the plunger 213 are separated.

  Then, as shown in FIG. 14, the unloader 300 is moved together with the resin molded product 1 b and the surplus resin 20 d in the direction of the arrow D <b> 1 (toward the outside of the molding die 1000), and is withdrawn from the molding die 1000. Thereafter, the resin molded product 1b and the surplus resin 20d are separated from the unloader 300, and the surplus resin 20d is separated from the resin molded product 1b (not shown). The resin molded product 1b can be manufactured as described above.

  As mentioned above, the example of the resin molding apparatus of this invention and the resin molding method using the same was shown to FIGS. However, the resin molding apparatus and the resin molding method of the present invention are not limited to the examples of FIGS. 1 to 14 and various modifications are possible. For example, a hydraulic mechanism 228 may be provided instead of the elastic member 224 as in the resin molding apparatus shown in FIGS. The resin molding apparatus of FIGS. 15A to 15C is the same as the resin molding apparatus of FIGS. 1 to 14 except that the mold clamping unit 220 includes a hydraulic mechanism 228 instead of the elastic member 224. The method for producing a resin molded product using this resin molding apparatus can be performed, for example, in the same manner as in FIGS. FIG. 15A is a diagram showing a state in which the substrate 1 and the tablet (resin material) 20a are supplied to the lower mold 200, and corresponds to the step of FIG. In FIG. 15B, the tablet 20a is melted to form a molten resin (flowable resin) 20b, and the movable platen 1200, the mold clamping unit 220, and the lower mold 200 are raised to bring the lower mold 200 and the upper mold 100 into contact with each other. It is a figure of a state. FIG. 15B corresponds to the step of FIG. FIG. 15C is a diagram showing a state in which molten resin (fluid resin) is injected into the mold cavity 111, the runner 112, and the cull 113 by the plunger 213, and corresponds to the step of FIG.

  Further, for example, in the mold 1000 of the resin molding apparatus of FIGS. 1 to 14, the lower mold 200 may have a structure shown in FIGS. 16 (a) to (c), for example. FIG. 16A shows the structure of the lower mold 200 together with the mold clamping part 220 and the movable platen 1200. The lower mold 200 in FIG. 16A is the same as the lower mold 200 in FIGS. 1 to 14 except that the lower mold cavity block 210 has a through hole (residual resin dropping hole) 218. As illustrated, the through-hole 218 communicates with the pot 212 and penetrates from the pot 212 to the opposite side of the lower mold cavity block 210 facing the upper mold 100. With this structure, after resin molding, the residual resin in the pot 212 can be dropped from the through hole 218 and discharged.

  FIG. 16B is an enlarged view of a part of the plunger 213 and the through hole (residual resin dropping hole) 218 in FIG. As illustrated, there are a plurality of through holes 218, which are arranged so as to surround the plunger 213. Since the through-hole 218 is provided only in a part of the periphery of the plunger 213, the upper end portion (collar-shaped portion) of the plunger 213 is caught in the portion where the through-hole 218 is not provided, and the plunger 213 is lowered. It is supposed not to fall.

  FIG. 16C is a schematic diagram showing a modified example of the plunger 213. The figure shows only the lower part of the plunger 213 in an enlarged manner. In FIGS. 1-14, the lower end (part which contacts the holder A block 221) of the plunger 213 was shown flat like the figure on the left side of FIG.16 (c). However, since the plunger 213 is a convex portion 213a having a rounded bottom end as shown in the right side of FIG. 16C, the area of the portion in contact with the holder A block 221 is as small as possible (for example, It may be at only one point at the tip of the convex portion 213a). By doing so, for example, the dependence on the flatness (flatness) of the upper surface of the holder A block 221 and the lower surface of the plunger 213 is reduced, and the plunger 213 is raised straightly along the direction of gravity. be able to.

  According to the resin molding apparatus of the present invention, for example, the structure of a resin molding apparatus for transfer molding can be simplified. Specifically, for example, as shown in the present embodiment, the resin is injected by moving the plunger up and down using the clamping force of the press (clamping part). In this way, since the mold clamping mechanism also serves as a transfer drive mechanism (mechanism for injecting a resin material into the mold surface of the mold), resin molding can be performed without providing another transfer drive mechanism of the mold clamping mechanism. The structure of the device can be simplified.

  Next, another embodiment of the present invention will be described.

  In this embodiment, an example in which the resin molding apparatus includes a temperature raising stage, a resin molding stage, a cure stage, and an eject stage will be described.

  In the schematic diagram of FIG. 17, the outline of the resin molding apparatus of a present Example and the manufacturing method of a resin molded product using the same is shown. As shown in the figure, the resin molding apparatus includes a temperature raising stage S1, a resin molding stage S2, a cure stage S3, and an eject stage S4. The mold 1000 can be attached to and detached from the respective stages S1 to S4 and can be moved between the respective stages S1 to S4. The temperature raising stage S1 raises the temperature of the mold 1000. The resin molding stage S2 has a molding die 1000 and a clamping part, and performs resin molding. The cure stage S3 cures the resin in the mold 1000. The eject stage S4 releases the resin molded product 1b from the mold 1000. The mold 1000 is not particularly limited, and may be the same as the mold 1000 in the resin molding apparatus of Example 1 (FIGS. 1 to 16), for example. Moreover, the said mold clamping part is not specifically limited, For example, the same as the mold clamping part 220 in the resin molding apparatus of Example 1 (FIGS. 1-16) may be sufficient.

  When implementing the manufacturing method of a resin molded product, as shown in FIG. 17, you may circulate the shaping | molding die 1000 between each stage of S1-S4, for example. Specifically, for example, as shown in the figure, the mold 1000 is moved in the order of the temperature raising stage S1, the resin molding stage S2, the cure stage S3, and the eject stage S4 to manufacture the resin molded product 1b. And after collect | recovering the resin molded products 1b by eject stage S4, the shaping | molding die 1000 is returned to temperature rising stage S1, and the manufacturing method of a resin molded product is implemented again. The mechanism and method for moving (conveying) the mold 1000 are not particularly limited. For example, the mold 1000 can be transported using a known technique such as a robot hand or a rotary table.

  In the first embodiment described above, one stage of the resin molding apparatus has all the functions of the temperature raising stage, the resin molding stage, the cure stage, and the eject stage. That is, in Example 1, as shown in FIGS. 2 to 14, the resin molding stage having the molding die 1000 and the clamping part functions as a temperature rising stage for raising the temperature of the molding die 1000, and the resin in the molding die 1000. It also serves as a cure stage for curing the resin and an eject stage for releasing the resin molded product 1b from the mold 1000.

  On the other hand, the following effects can be obtained, for example, by providing the resin molding apparatus with a stage different from the resin molding stage and having a function different from the resin molding stage as in the present embodiment. . For example, it is not necessary to provide an ejection mechanism (for example, a pin, an ejector, etc.) in the molding die by releasing the resin molded product from the molding die using the ejection stage different from the molding stage. That is, the structure of the mold can be simplified. Further, for example, the resin is cured by heating the molding die in a curing stage different from the molding stage, so that another resin molding can be performed in the molding stage. In this case, it is not necessary to wait for the time until the resin is cured in the molding stage, and the operating efficiency of the molding stage is improved, so that the molding cycle can be shortened.

  In the cure stage, for example, the mold can be heated to raise the temperature, and the resin in the mold can be cured at that temperature. In this case, the cure stage has a function of raising the temperature of the mold in common with the temperature raising stage. Therefore, in this case, the cure stage may also be used as the temperature raising stage.

  Specifically, the method for producing a resin molded product using the resin molding apparatus shown in the schematic diagram of FIG. 17 can be performed, for example, as shown in FIGS.

  First, as shown in the process cross-sectional views of FIGS. 18A to 18D, the temperature of the mold is raised in the temperature raising stage. As illustrated, the temperature raising stage includes a fixed platen 1110 and a movable platen 1210. The fixed platen 1110 has a heater 1111, and the movable platen 1210 has a heater 1211. The heaters 1111 and 1211 are not particularly limited, but may be cartridge heaters, for example. The movable platen 1210 is disposed below the fixed platen 1110, and the mold 1000 can be sandwiched between the fixed platen 1110 and the movable platen 1210.

  First, as shown to Fig.18 (a), the shaping | molding die 1000 is prepared. The mold 1000 may be the same as the mold 1000 of Example 1 (FIGS. 1-14). 19 and 20 to be described later, the same mold 1000 can be used. On the other hand, the temperature of the fixed platen 1110 and the movable platen 1210 is raised by the heaters 1111 and 1211 in advance. Next, as shown in FIG. 18 (b), the mold 1000 is conveyed into a temperature rising stage that has been heated in advance, and placed on the movable platen 1210 and fixed. The method for fixing the mold 1000 to the movable platen 1210 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like may be used. Next, as shown in FIG. 18C, the movable platen 1210 is raised, and the mold 1000 is clamped (pinched) by the fixed platen 1110 and the movable platen 1210, and the temperature of the mold 1000 is raised. After the mold is heated, the movable platen 1210 is lowered as shown in FIG. Thereafter, the mold 1000 is removed from the temperature raising stage and moved to the molding stage.

  Further, for example, the temperature raising stage may be configured as shown in FIG. 18E instead of the configuration shown in FIGS. As shown in FIG. 18E, the temperature raising stage in FIG. 18E has no fixed platen 1110 and heater 1111 and has a temperature raising table 1212 instead of the movable platen 1210. It is the same as the temperature rising stage of d). The temperature raising base 1212 has a heater 1211 as with the movable platen 1210. In this case, instead of the steps shown in FIGS. 18B to 18D, as shown in FIG. 18A, the mold 1000 is placed on the temperature raising table 1212 that has been heated by the heater 1211 in advance. Fix it. And after raising the temperature of the shaping | molding die 1000, it takes out from a temperature raising stage and moves to a shaping | molding stage.

  Next, as shown in the process cross-sectional views of FIGS. 19A to 19H, resin molding is performed at the resin molding stage. 19A to 19H, members similar to those in the first embodiment (FIGS. 1 to 14) are denoted by the same reference numerals. As shown in FIGS. 19A to 19H, the resin molding stage includes a mold clamping unit 220, a fixed platen (first platen) 1100, and a movable platen (second platen) 1200. The mold clamping unit 220, the fixed platen 1100, and the movable platen 1200 may be the same as those in the first embodiment (FIGS. 1 to 14). Further, for example, the mold 1000 may be heated by providing a heater (for example, a cartridge heater) in the mold clamping unit 220, the fixed platen 1100, the movable platen 1200, and the like in the same manner as the temperature raising stage.

  First, as shown in FIG. 19A, the molding die 1000 is transported from the temperature rising stage into the resin molding stage and placed on the clamping unit 220.

  Next, as shown in FIG. 19B, the movable platen 1200 is raised to bring the upper mold 100 into contact with the fixed platen 1100. In this state, the upper mold 100 is fixed to the fixed platen 1100 and the lower mold 100 is fixed to the mold clamping unit 220. At this time, a method for fixing the upper mold 100 and the lower mold 200 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like may be used.

  Next, as shown in FIG. 19C, a substrate and a tablet (resin material) are supplied to the lower mold 200. This step may be the same as that shown in FIG.

  Next, the tablet (resin material) is melted to obtain a molten resin (flowable resin). After that, as shown in FIG. 19 (d), the mold clamping part 220 is raised and the plunger of the lower mold 200 is pushed (raised), and the molten resin (flowable resin) is placed on the mold surface of the mold 1000. ) And supply. This process may be the same as that shown in FIGS.

  Next, as shown in FIGS. 19E to 19H, the mold opening and the mold 1000 are taken out. In these steps, unlike FIGS. 6 to 14 in Example 1, the curing of the molten resin (flowable resin), the release of the resin molded product, and the conveyance of the resin molded product out of the mold are not performed. This is because the molten resin (flowable resin) is cured on a cure stage, which will be described later, and the mold release of the resin molded product and the conveyance of the resin molded product to the outside of the mold are performed on an eject stage, which will be described later.

  First, as shown in FIG. 19 (e), the movable platen 1200 is lowered together with the mold clamping unit 220 and the mold 1000. As a result, the upper mold 100 is separated from the fixed platen 1100 as illustrated.

  Next, as shown in FIG. 19 (f), the movable platen 1200 is further lowered together with the mold clamping part 220 and the mold 1000.

  Thereafter, as shown in FIGS. 19G to 19H, the mold 1000 is moved out of the molding stage and conveyed into a cure stage (not shown).

  Thereafter, the mold 1000 is heated in a cure stage (not shown) to raise the temperature, and the fluid resin in the mold 1000 is cured. Thereby, a resin molded product is manufactured. In addition, the said cure stage may have the structure similar to the temperature rising stage shown to Fig.18 (a)-(e), for example. Further, for example, the cure stage may be used in combination with the temperature raising stage shown in FIGS. The process of curing the fluid resin in the mold 1000 with the cure stage is not particularly limited. For example, except that the mold 1000 is filled with the fluid resin, FIGS. 18A to 18E. You may perform the process similar to.

  Thereafter, as shown in the process cross-sectional views of FIGS. 20A to 20F, the resin molded product is released from the mold 1000 in the eject stage. As shown in the figure, the eject stage includes a holder 230 and movable platens 1120 and 1220. The movable platens 1120 and 1220 can move up and down. The movable platen 1120 can fix the upper mold 100 to the lower surface thereof. The movable platen 1220 can be fixed by placing a holder 230 on the upper surface thereof. The holder 230 includes a holder A block 231, a holder B block 232, an ejector plate mounting block 233, an elastic member 234, an ejector plate 235, and an ejector rod 236. The holder A block 231, the holder B block 232, the ejector plate mounting block 233, and the elastic member 234 are the holder A block 221, the holder B block 222, and the bottom in the mold clamping unit 220 of the first embodiment (FIGS. 1 to 14), respectively. The mold mounting block (molding mold mounting member) 223 and the elastic member 224 have the same configuration. The ejector plate 235 is fixed to the upper surface of the ejector plate mounting block 233. The ejector plate 235 has an ejector rod 236, and the upper surface of the ejector plate 235 can contact the entire lower surface of the lower mold 200. The ejector rod 236 is disposed at a position corresponding to the plunger of the lower mold 200 and can move up and down in the ejector plate 235. As will be described later, a part of the ejector rod 236 can be pushed out from the upper surface of the ejector plate 235 by raising the holder A block 231. And by doing in this way, a part of plunger of the lower mold | type 200 can be extruded from the upper surface of the lower mold | type 200 with the ejector rod 236, and hardened | cured surplus resin can be isolate | separated from a resin molded product.

  The mold release step of the resin molded product shown in FIGS. 20A to 20F can be performed as follows.

  First, as shown to Fig.20 (a), the shaping | molding die 1000 is mounted on the ejector plate 235, and is fixed. The fixing method is not particularly limited, and for example, an electrostatic chuck or a mechanical chuck may be used. At this time, for example, mold release assistance may be performed by applying vibration, heat (linear expansion due to temperature rise), or the like to the mold 1000.

  Next, as shown in FIG. 20B, the movable platen 1220 is raised together with the holder 230 and the mold 1000, and the upper mold 100 is fixed to the lower surface of the movable platen 1120. The fixing method is not particularly limited, and for example, an electrostatic chuck or a mechanical chuck may be used.

  Next, as shown in FIG. 20C, the movable platen 1120 is raised together with the upper mold 100, and the movable platen 1220 is lowered together with the holder 230 and the lower mold 200. As a result, the upper mold 100 and the lower mold 200 are opened. In this state, the unloader 300 is caused to enter between the upper mold 100 and the lower mold 200 as illustrated. As illustrated, the unloader 300 includes a suction pad 301 for sucking the cured resin 20 and the surplus resin 20d, similarly to the unloader 300 in FIGS. 9 to 14 of the first embodiment. Furthermore, the unloader 300 shown in FIG. 20 has a sealed substrate holding member (resin molded product holding member) 302 as shown.

  Next, as shown in FIG. 20D, the movable platen 1120 is lowered together with the upper mold 100, and the movable platen 1220 is raised together with the holder 230 and the lower mold 200. As a result, the unloader is sandwiched and fixed between the upper mold 100 and the lower mold 200 as illustrated. Further, as shown in the figure, the resin molded product holding member 302 is lowered in the direction of arrow I1 to hold the resin molded product (sealed substrate) 1b. As illustrated, the resin molded product holding member 302 holds the resin molded product 1b by pressing a portion of the cured resin 20 that has been cured in the runner 112 from above. For example, instead of the portion cured in the runner 112 in the cured resin 20, a portion cured in the mold cavity 111 may be pressed from above by the resin molded product holding member 302. Further, the movable platen 1220 is raised together with the holder 230 and the lower mold 200. At this time, as shown in the figure, as the holder A block 231 rises, a part of the ejector rod 236 is pushed out from the upper surface of the ejector plate 235. Thereby, a part of plunger of the lower mold | type 200 is extruded from the upper surface of the lower mold | type 200 with the ejector rod 236, and the hardened | cured surplus resin is isolate | separated from the resin molded product as illustration.

  After that, as shown in FIG. 20 (e), the resin molded product (sealed substrate) and the excess resin separated from the resin molded product are adsorbed by the suction pad 301 of the unloader 300. Thereafter, the unloader 300 is transported out of the ejector stage together with the resin molded product and the surplus resin (not shown). These steps may be performed in accordance with, for example, FIGS.

  Further, as shown in FIG. 20 (f), the mold 1000 is separated from the movable platen 1120. Thereafter, the mold 1000 is separated from the holder 230 and conveyed outside the ejector stage. For example, the mold 1000 can be transported again into the temperature raising stage of FIG. 18 and the method of manufacturing a resin molded product described with reference to FIGS. 18 to 20 can be performed again.

  In the present invention, the configuration of the molding die of the resin molding device is not limited to the molding die 1000 shown in FIGS. 21 to 28 show some modified examples of the mold.

  The cross-sectional view of FIG. 21 schematically shows a modification of the mold. As shown in the figure, the molding die 1000 includes a lower die 200 having an excess resin separation member (surplus resin separation block) 216, an elastic member for excess resin separation member 217, and a lower die base block 210B, and a ring 214. Except not, it is the same as that of the mold 1000 shown in FIGS. In the figure, the lower mold cavity block 210 is fixed to the upper surface of the lower mold base block 210B. The plunger 213 passes through the lower mold base block 210B. The surplus resin separating member 216 is disposed so as to surround the outer periphery and the lower surface of the pot 212, and is elastically supported on the lower mold base block 210B via the surplus resin separating member elastic member 217. The surplus resin separating member 216 can be moved up and down by the expansion and contraction of the elastic member 217 for surplus resin separating member. The plunger 213 passes through the surplus resin separating member 216 and the surplus resin separating member elastic member 217. The surplus resin separating member 216 is disposed directly under the cal (surplus resin accommodating portion) 213, and the surplus resin inside the cal 213 can be pressed by the surplus resin separating member 216. As shown in the drawing, the upper end portion of the excess resin separating member 216 forms a protruding portion that protrudes in the horizontal direction. Thereby, when the upper mold 100 and the lower mold 200 are clamped, the end of the substrate on the side of the cull (excess resin accommodating portion) 213 is formed between the mold surface of the lower mold 200 and the end of the excess resin separating member 216. Sandwiched.

  The manufacturing method of the resin molded product using the mold 1000 of FIG. 21 can be performed in the same manner as in FIGS. In the case of the mold 1000 in FIG. 21, the cured resin of the resin molded product and the excess resin in the cal 113 can be separated by opening the mold after the resin is cured. The outline of the method for producing a resin molded product using the mold 1000 of FIG. 21 can be specifically shown by, for example, process cross-sectional views of FIGS. First, as shown in FIG. 22, the substrate 1 is supplied (placed) to the substrate placement portion 211 of the lower mold 200, and the tablet (resin material) 20 a is supplied to the pot 212. Next, the mold is heated and clamped in the same manner as in FIGS. Accordingly, as shown in FIG. 23, the plunger 213 is pushed into the pot 212 in a state where the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are in contact (clamped). In this way, as shown in FIG. 23, the molten resin 20b in which the resin material 20a is melted is filled into the cull 113, the runner 112, and the mold cavity 111. Thereafter, in the same manner as in FIGS. 6 to 8, after the resin in the mold cavity 111 and the surplus resin in the cull 113 are cured, the mold is released by opening the mold. When the mold is released by this mold opening, as shown in FIG. 24, the excess resin separation member 216 is moved to the lower mold 200 by the extension of the elastic member 217 for the excess resin separation member with the resin molded product 1 b fixed to the lower mold 200. Rise against. As a result, the surplus resin 20d cured in the cal 113 is pushed up by the surplus resin separating member 216, so that the resin 20 cured in the mold cavity 111 and the surplus resin 20d cured in the cal 113 are separated as illustrated. it can.

  FIG. 25 is a cross-sectional view schematically showing another modification of the mold. As shown in the figure, in this mold 1000, the upper mold 100 does not have the cull 113. Further, the upper part of the pot 213 of the lower mold 200 forms a cull 113B communicating with the runner 112 of the upper mold 100. Further, the lower surface of the substrate mounting portion 211 of the lower mold 200 has a concave shape at a position corresponding to the upper mold cavity 111 to form a lower mold cavity 111B. Except for these and not having the ring 114, the mold 1000 of FIG. 25 is the same as the mold 1000 shown in FIGS.

  The method for producing a resin molded product using the mold 1000 of FIG. 25 can be performed in the same manner as in FIGS. In the case of the mold 1000 of FIG. 25, for example, by using a perforated substrate, the fluid resin injected into the upper mold cavity 111 can be injected into the lower mold cavity 111B from the hole of the substrate. .

  The sectional view of FIG. 26 schematically shows still another modification of the mold. As shown in the figure, in this mold 1000, an intermediate mold 400 is disposed between the upper mold 100 and the lower mold 200. The intermediate mold 400 has an intermediate resin material container 413 at a position directly above the pot (resin material container) 212. The intermediate-type resin material container 413 can accommodate the resin material (tablet) 20a, and communicates with the cal 113 during mold clamping, and injects molten (fluidized) resin material (fluid resin) into the cal 113. it can. In other words, the intermediate resin material accommodating portion 413 also serves as an intermediate resin passage. In addition, the lower mold 200 in FIG. 26 does not have the substrate platform 211. Instead, in FIG. 26, the intermediate mold 400 has a substrate mounting portion 411 on the surface facing the upper mold 100. The lower surface of the substrate placement portion 411 of the intermediate mold 400 has a concave shape at a position corresponding to the upper mold cavity 111 to form an intermediate mold cavity 412. Except these and the ring 114, the mold 1000 in FIG. 26 is the same as the mold 1000 in FIGS.

  27 is a plan view of the upper mold cavity block 110 and the intermediate mold 400 of FIG. 26 as viewed from the mold surface side. As described above, the intermediate mold resin material accommodating portion (intermediate mold resin passage) 413 corresponds to the position of the cull 113 in the upper mold cavity block 110, and the intermediate mold cavity 412 corresponds to the position of the mold cavity 111 in the upper mold cavity block 110, respectively. doing.

  The manufacturing method of the resin molding apparatus using the mold 1000 of FIG. 26 can be performed in the same manner as in FIGS. The outline is shown in the process sectional views of FIGS. FIG. 28A shows a state in which the tablet 20 a is accommodated in the pot 212. From this state, after placing the substrate on the intermediate-type substrate placing portion 411, the tablet 20a is melted (fluidized) and then clamped, as in FIGS. The runner 112 and the mold cavity 111 can be injected. In the case of the mold 1000 in FIG. 26, for example, by using a perforated substrate, the fluid resin injected into the upper mold cavity 111 is injected into the intermediate mold cavity 412 from the hole of the substrate. Can do. Thereafter, when the fluid resin is cured, the fluid resin becomes the cured resin 20 and the surplus resin (unnecessary resin portion) 20d as shown in FIG. Processes other than these can be performed in the same manner as in FIGS.

  21 to 28 can be further arbitrarily modified. For example, although the ring 114 is omitted in FIGS. 21 to 28, the ring 114 may be provided as in FIGS. Further, for example, as shown in FIGS. 16A to 16C, the lower mold may have a through hole (residual resin dropping hole) 218, or the lower end of the plunger 213 (holder A block 221). The portion in contact with the surface may be rounded. Furthermore, in this invention, a shaping | molding die is not limited to the structure of the shaping | molding die 1000 of FIGS. 1-28, Arbitrary shaping | molding dies can be used. For example, in the molding die 1000 of FIGS. 1 to 28, the example in which the substrate 1 is set (placed) on the substrate placement portion 211 of the lower die 200 is shown, but the present invention is not limited to this, and the substrate is placed on the upper die May be set. Also, for example, in the mold 1000 of FIGS. 1 to 24, only the upper mold has the mold cavity 111, and in the mold mold battle of FIGS. 25 to 28, both the upper mold and the lower mold have mold cavities. The invention is not limited to this, and only the lower mold may have a mold cavity.

  Next, another example of the step of releasing the resin molded product from the mold 1000 in the eject stage will be described with reference to FIGS. 29 to 43, the same members as those in FIGS. 20A to 20F are denoted by the same reference numerals. 29 to 43 includes a fixed platen 1100 in place of the movable platen 1120.

  First, as shown in FIG. 29, the molding die 1000 holding the resin molded product 1d after the resin molding and the excess resin 20d is transported into the eject stage. Specifically, first, as shown in the figure, the mold 1000 is conveyed (moved) in the direction of the arrow E1 (the direction from the outside to the inside of the eject stage), and is positioned between the fixed platen 1100 and the holder 230. Let Thereafter, the mold 1000 is moved in the direction of arrow E2 (downward) and placed on the ejector plate 235 and fixed. The fixing method is not particularly limited, and for example, an electrostatic chuck or a mechanical chuck may be used. At this time, for example, mold release assistance may be performed by applying vibration, heat (linear expansion due to temperature rise), or the like to the mold 1000.

  Next, as shown in FIG. 30, the movable platen 1220 is raised in the direction of arrow F <b> 1 together with the holder 230 and the mold 1000, and the upper mold 100 is fixed to the lower surface of the movable platen 1120. The fixing method is not particularly limited, and for example, an electrostatic chuck or a mechanical chuck may be used.

  Next, as shown in FIG. 31, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of the arrow G1. As a result, the upper mold 100 and the lower mold 200 are opened. Thereby, as illustrated, the resin molded product 1b (cured resin 20) and the surplus resin (unnecessary resin portion) 20d are released from the mold surface of the upper mold 100 while being held in the direction of the lower mold 200.

  Next, with the upper mold 100 and the lower mold 200 opened as shown in FIG. 31, as shown in FIG. 32, the unloader 300 is moved in the direction of arrow H1 (the direction from the outside of the mold 1000 to the inside). Transport (move). Thereby, as shown in FIG. 33, the unloader 300 is caused to enter between the upper mold 100 and the lower mold 200. The unloader 300 includes a suction pad 301 for sucking the cured resin 20 and the surplus resin 20d, similarly to the unloader 300 in FIGS. Furthermore, the unloader 300 shown in FIGS. 32 and 33 has a sealed substrate holding member (resin molded product holding member) 302 as shown in the figure.

  Next, as shown in FIG. 34, the movable platen 1220 is raised in the direction of the arrow F2 together with the holder 230 and the lower mold 200. Thereby, as shown in the drawing, the unloader is sandwiched between the upper mold 100 and the lower mold 200 and fixed (clamped).

  Next, as shown in FIG. 35, the resin molded product holding member 302 is lowered in the direction of arrow I1 to hold the resin molded product (sealed substrate) 1b. As illustrated, the resin molded product holding member 302 holds the resin molded product 1b by pressing a portion of the cured resin 20 that has been cured in the runner 112 from above. For example, instead of the portion cured in the runner 112 in the cured resin 20, a portion cured in the mold cavity 111 may be pressed from above by the resin molded product holding member 302.

  Next, as shown in FIG. 36, the movable platen 1220 is raised in the direction of the arrow F3 together with the holder blocks (the holder A block 231 and the holder B block 232). At this time, as shown in the figure, as the holder A block 231 rises, a part of the ejector rod 236 is pushed out from the upper surface of the ejector plate 235. Thereby, a part of the plunger 213 of the lower mold 200 is pushed out from the upper surface of the lower mold 200 by the ejector rod 236, and as shown, the cured surplus resin 20d is separated from the resin molded product 1b.

  Next, as shown in FIG. 37, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of the arrow G2. Thereby, the clamp of the unloader 300 is released.

  Next, as shown in FIG. 38, the suction pad 301 of the unloader 300 is lowered in the direction of the arrow J1. As a result, as shown in the drawing, the suction pad 301 is brought into contact with the portion of the cured resin 20 that has been cured in the mold cavity 111 and the excess resin 20d that has been separated from the resin molded product 1b to be absorbed.

  Next, as shown in FIG. 39, the suction pad 301 is raised in the direction of the arrow K1. Then, as shown in FIG. 40, the suction pad 301 is further raised in the direction of the arrow K2. Thereby, the resin molded product 1b and the excess resin 20d adsorbed by the adsorption pad 301 are released from the lower mold 200 as illustrated.

  Thereafter, as shown in FIG. 41, the unloader 300 is moved (conveyed) in the direction of the arrow L1 (the direction from the inside of the ejector stage) together with the resin molded product 1b and the surplus resin 20d, and the outside of the ejector stage. To leave.

  Thereafter, as shown in FIG. 42, the movable platen 1220 is raised together with the holder 230 and the lower mold 200 in the direction of the arrow F4, and the mold 1000 is clamped. In this state, the fixation of the fixed platen 1100 and the mold 1000 is released.

  Further, as shown in FIG. 43, the movable platen 1220 is lowered in the direction of the arrow G3 together with the holder 230 and the mold 100, and the mold 1000 is separated from the fixed platen 1100. Thereafter, the mold 1000 is separated from the holder 230, moved (conveyed) in the direction of the arrow M1 (the direction from the inside of the ejector stage), and then moved out of the ejector stage. For example, the mold 1000 can be transported again into the temperature raising stage, and the method for producing a resin molded product can be performed again.

  In the present embodiment, the example of the resin molding apparatus having one each of the temperature raising stage, the resin molding stage, the cure stage, and the eject stage has been mainly described. However, the present invention is not limited to this. For example, the resin molding apparatus of the present invention may include a plurality of stages having at least one function among a temperature raising stage, a resin molding stage, a cure stage, and an eject stage. By doing in this way, the manufacturing efficiency of a resin molded product can be improved, for example. In addition, for example, a specific stage may share two or more functions among the stages. For example, in the first embodiment, as described above, one stage of the resin molding apparatus has all four functions of the temperature raising stage, the resin molding stage, the cure stage, and the eject stage. In addition, the resin molding apparatus of the present invention is not limited to this. For example, one specific stage has two or three functions of the four stages, and the specific one stage is Another stage may have other functions. For example, as described above, the same stage may function as the temperature raising stage and the cure stage.

  Furthermore, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. Is.

1 Substrate 1b Resin molded product (sealed substrate)
20 Cured resin 20a Tablet (resin material)
20b Molten resin (flowable resin)
20d surplus resin (unnecessary resin part)
100 Upper mold (one mold)
110 Upper mold cavity block 111 Mold cavity 112 Runner (resin flow path)
113 Cal (excess resin housing)
113B Cal (excess resin housing part)
114 Adjustment member (tablet height adjustment member)
115 Elastic member 120 for adjusting member Upper mold base block 200 Lower mold (the other mold)
210 Lower mold cavity block 211 Substrate placement part 212 Pot (resin material accommodation part)
213 Plunger 213a Convex part 214 Ring (ring member)
215 Brim portion 216 Surplus resin separation member 217 Elastic member 218 for excess resin separation member Through hole (residual resin dropping hole)
220 Clamping part 221 Holder A block (holder block)
222 Holder B block (holder block)
223 Lower die placement block (molding die mounting member)
224 Elastic member 228 Hydraulic mechanism 230 Holder 231 Holder A block (holder block)
232 Holder B block (holder block)
233 Ejector plate mounting block 234 Elastic member 235 Ejector plate 236 Ejector rod 300 Unloader 301 Suction pad 302 Resin molded product holding member (sealed substrate holding member)
400 Intermediate mold 411 Substrate placement section 412 Intermediate mold cavity 413 Intermediate mold resin material container (intermediate mold resin passage)
1000 Mold 1100 Fixed platen (first platen)
1110 Fixed platen 1111 Heater 1120 Movable platen 1200 Movable platen (second platen)
1210 Movable platen 1211 Heater 1212 Temperature rising table 1220 Movable platen

A1 Arrow B1 indicating the entry direction of the unloader 300 B1 Arrow C1 to C2 indicating the descending direction of the suction pad 301 D1 Arrow D1 indicating the upward direction of the suction pad 301 Arrow E1 to E2 indicating the exit direction of the unloader 300 Movement of the mold 1000 Arrows F1 to F4 indicating directions Arrows G1 to G3 indicating upward directions of the movable platen 1220 Arrows H1 indicating downward directions of the movable platen 1220 Arrows I1 indicating directions of entry of the unloader 300 I1 indicates a downward direction of the resin molded product holding member 302 Arrow J1 Arrows K1 to K2 indicating the descending direction of the suction pad 301 Arrow L1 indicating the upward direction of the suction pad 301 Arrow M1 indicating the retracting direction of the unloader 300 Arrow X1 to X3 indicating the retracting direction of the mold 1000 The movable platen 1200 Arrows Y1 to Y3 indicating ascending direction Lowering of movable platen 1200 Arrow S1 heated stage showing the direction S2 resin molding stage S3 cure stage S4 eject stage

Claims (15)

A mold and a clamping part;
The mold has one mold and the other mold,
The one mold and the other mold face each other,
The other mold is attached to the mold clamping portion on the side opposite to the surface facing the one mold,
The other mold has a resin material container and a plunger,
The plunger is movable in the opening / closing direction of the molding die with respect to the resin material container.
By moving the mold clamping part in the mold clamping direction of the mold, the mold is clamped, and the plunger is pushed in the direction of the one mold to accommodate the resin contained in the resin container A resin molding apparatus characterized in that a material can be extruded onto the mold surface of the mold by the plunger. The mold clamping part includes a plunger pushing member, an elastic member, and a molding die mounting member,
The other mold is mounted on the mold mounting member on the opposite side of the surface facing the one mold;
The elastic member is disposed on the opposite side of the molding die mounting member from the surface facing the other mold, and elastically supports the molding die mounting member.
The plunger pushing member is movable in the opening / closing direction of the mold relative to the mold by expansion and contraction of the elastic member,
The mold clamping portion is moved in the mold clamping direction of the molding mold to clamp the molding mold, and the plunger push-in member pushes the plunger in the direction of the one mold to accommodate the resin. The resin molding apparatus according to claim 1, wherein the resin material accommodated in the portion can be extruded onto the mold surface of the mold by the plunger. The plunger pushing member is a holder block;
The resin molding apparatus according to claim 2, wherein the holder block holds the mold mounting member. The one mold includes a mold cavity, an adjustment member, and an adjustment member elastic member that elastically supports the adjustment member,
The adjustment member is movable in the opening and closing direction of the mold by expansion and contraction of the elastic member for adjustment member,
The resin molding apparatus according to any one of claims 1 to 3, wherein a resin pressure in the mold cavity can be adjusted by movement of the adjusting member. The one mold further has a surplus resin container,
5. The resin molding apparatus according to claim 4, wherein the surplus resin accommodating portion communicates with the mold cavity and accommodates at least a part of surplus resin not accommodated in the mold cavity when the mold is clamped. At least a part of the adjustment member is disposed in the surplus resin container,
The resin molding apparatus according to claim 5, wherein the resin pressure in the mold cavity can be adjusted by adjusting the capacity of the surplus resin container by moving the adjusting member. And a first platen and a second platen,
The one mold is attached to the first platen,
The said mold clamping part is a resin molding apparatus as described in any one of Claim 1 to 6 with which the said 2nd platen was mounted | worn. The mold further has an intermediate mold,
The intermediate mold is disposed between the one mold and the other mold,
The resin molding apparatus according to any one of claims 1 to 7, wherein the intermediate mold includes an intermediate mold resin material accommodating portion and an intermediate mold resin passage. The mold has a mold cavity, a surplus resin container, and a surplus resin separation member,
The surplus resin accommodating portion communicates with the mold cavity, and accommodates at least a part of surplus resin not accommodated in the mold cavity at the time of mold clamping,
After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member rises or descends relative to one or both of the one mold and the other mold, so that the mold cavity The resin molding apparatus as described in any one of Claim 1 to 7 from which the resin hardened | cured inside and the said excess resin hardened | cured in the said excess resin accommodating part are isolate | separated. The resin molding apparatus is an apparatus for resin molding a substrate;
When clamping the one mold and the other mold, the end of the substrate on the side of the surplus resin container is sandwiched between the mold surface of the other mold and the end of the surplus resin separating member. Item 9. A resin molding apparatus according to Item 9. The other mold has a through hole;
The through hole penetrates from the resin material housing part to the opposite side of the surface facing the one mold,
The resin molding apparatus according to claim 1, wherein after the resin molding, the residual resin in the resin material housing portion can be discharged from the through hole. The resin molding apparatus has a temperature rising stage, a resin molding stage, a cure stage, and an eject stage,
The mold is detachable with respect to each stage, and is movable between the stages.
The temperature raising stage raises the temperature of the mold,
The resin molding stage has the mold clamping part, performs resin molding,
The cure stage cures the resin in the mold,
The eject stage causes the resin molded product to be released from the mold.
The resin molding apparatus as described in any one of Claims 1-11. A resin material housing step of housing the resin material in the resin material housing portion of the mold,
A mold clamping process for clamping the mold,
In the mold clamping step, the mold is clamped and the resin material accommodated in the resin accommodating portion is extruded onto the mold surface of the mold. Using the resin molding apparatus according to any one of claims 1 to 12,
In the mold clamping step, the mold clamping portion is moved in the mold clamping direction of the molding mold to clamp the molding mold and push the plunger in the direction of the one mold to accommodate the resin. The method of manufacturing a resin molded product according to claim 13, wherein the resin material accommodated in the portion is extruded onto the mold surface of the mold by the plunger. The resin molding apparatus is the resin molding apparatus according to claim 12,
The resin molding method further comprises:
A mold temperature raising step for raising the temperature of the mold in the temperature raising stage;
A resin curing step of curing the resin in the mold in the cure stage;
A mold release step of releasing the resin molded product from the mold in the eject stage,
The method for producing a resin molded product according to claim 14, wherein the resin material accommodation step and the mold clamping step are performed in the resin molding stage.

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