JP2004216558A - Resin seal molding method for electronic component and apparatus therefor - Google Patents

Resin seal molding method for electronic component and apparatus therefor Download PDF

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Publication number
JP2004216558A
JP2004216558A JP2003002949A JP2003002949A JP2004216558A JP 2004216558 A JP2004216558 A JP 2004216558A JP 2003002949 A JP2003002949 A JP 2003002949A JP 2003002949 A JP2003002949 A JP 2003002949A JP 2004216558 A JP2004216558 A JP 2004216558A
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resin
mold
resin material
electronic component
cavity forming
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JP4336499B2 (en
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Shinji Takase
慎二 高瀬
Hideki Tokuyama
秀樹 徳山
Hiroshi Uragami
浩 浦上
Takeru Nakagawa
長 中川
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin seal molding method for an electronic component which enhances the productivity of a product by efficiently preventing product defects such as voids, the unfilling or the like of a product by using a resin material uniformly pressed to a mold for the seal molding of a resin in the manufacturing of a substrate having a plurality of semiconductor chips being electronic components mounted thereon, and an apparatus therefor. <P>SOLUTION: A uniformly pressed granular resin 14 is supplied to a mold cavity forming part 6 almost simultaneously with the sliding and opening of an on-off part 20 in a resin supply mechanism 7 in a horizontal direction in such a state that the granular resin 14 is uniformly pressed by a pressure means 21 at the time of opening of the mold. Accordingly, heat can be uniformly transferred to the whole of the resin from the contact surface of the granular resin 14 with the bottom surface of the mold cavity forming part 6 to the surface of the granular resin and the voids in a molten resin 15 can be efficiently prevented without causing a temperature difference in the granular resin 14. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、ＩＣ等の電子部品の装着した基板が樹脂封止成形用金型に供給された樹脂材料を用いることにより、前記電子部品を樹脂封止成形する、電子部品の樹脂封止成形方法及び装置における改良に関するものである。
【０００２】
【従来の技術】
従来から、電子部品の樹脂封止成形用金型を用いて、前記金型に樹脂材料を供給して、基板に搭載した電子部品である複数個の半導体チップを一括して樹脂封止成形することが行われている。
【０００３】
即ち、従来における電子部品の樹脂封止成形装置は、上型と下型とから成る電子部品の樹脂封止成形用金型と、下型にはタブレット樹脂（樹脂材料）を嵌装させるポットと、ポット内を昇降自在に摺動するプランジャとがあって、まず、半導体チップ（電子部品）を装着した基板が該チップ装着側を上方向にして下型に供給セットして上下型を型締めし、次に、予め加熱溶融化されたタブレット樹脂を溶融樹脂としてポット内のプランジャで押圧し、次に、上型に設けた該チップを嵌装セットするキャビティに溶融樹脂を注入充填し、次に、溶融樹脂が硬化してキャビティ部分と樹脂通路部分とが一体で形成された樹脂成形体を構成し、次に、一体で形成された樹脂成形体を金型より取出してキャビティ部分と樹脂通路部分とを分離する。
以上のことから、キャビティ部分の硬化した樹脂成形後の樹脂封止成形済基板（製品）が完成されて、カル部・ポット部・ランナ部における樹脂通路部分の硬化した樹脂を不要な樹脂材料として廃棄する（例えば、特許文献１参照。）。
【０００４】
【特許文献１】
特開２００１−２８３７７号公報（第４頁、第１図）
【０００５】
【発明が解決しようとする課題】
しかしながら、前述の従来技術を用いて、例えば、複数個の該チップと基板とを電気的に接続するワイヤを装着した基板を、タブレット樹脂を溶融樹脂としてポット内のプランジャを押圧して樹脂通路を介して、該チップとワイヤとが嵌装セットされたキャビティ内に溶融樹脂を注入充填する、トランスファー成形の場合、基板上と樹脂通路とが接触状態で溶融樹脂をキャビティ側面から溶融樹脂を注入充填するので、ワイヤが変形したり或いは断線したりしてワイヤ不良が頻繁に発生すると云う問題があった。
【０００６】
従って、従来のトランスファー成形における金型構造に有するポットとプランジャと樹脂通路部分とを全く設けない、即ち、上下両型を用いて、上型には該チップとワイヤとを装着した基板における該チップ側を下方向に向けた状態で装着固定すると共に、下型に備えたキャビティに樹脂材料を樹脂材料供給機構にてキャビティ内に供給して、キャビティ内の樹脂材料を加熱溶融化して溶融樹脂として、上下両型を型締めすることにより、該チップとワイヤとを溶融樹脂に浸漬内包して樹脂封止成形する基板浸漬成形が行われようになってきた。
また、前記した基板浸漬成形においても、近年の基板の大型化・薄型化や、半導体チップ（電子部品）の極小化・極薄化や、一枚の基板上に複数個の該チップを装着して一括モールドすることから、キャビティの鉛直方向の厚みが非常に薄くなるうえに、キャビティ水平面が非常に広くなるので、樹脂材料としてタブレット樹脂を使用せずに、例えば、顆粒樹脂が用いられることが検討されている。しかしながら、顆粒樹脂をキャビティにそのまま樹脂材料供給機構から自然落下させて供給した場合、顆粒樹脂の粒子間に空隙部が形成されて空気を多量に含んだ状態で不均一な状態で供給されることになる、つまりは、顆粒樹脂とキャビティ面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることが難しく、顆粒樹脂内の温度差が生じることになって、その状態で顆粒樹脂が溶融樹脂となったとしても多量に含んだ空気が溶融樹脂内にボイドとして残留することになる、この状態で基板浸漬成形にて該チップとワイヤとをキャビティ内に嵌装セットして樹脂封止成形された製品となる樹脂成形済基板における樹脂成形体部分にボイドが発生したり、未充填が発生したりする製品不良が発生するので、製品の歩留まりを著しく低下させると云う問題があった。
また、ボイドを含有した樹脂材料を溶融樹脂とするのには、加熱溶融化時間や溶融樹脂を硬化する硬化所要時間における装置の稼動時間を長びかせてしまうので、製品の生産性を著しく低下させると云う問題があった。
【０００７】
即ち、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供することを目的とするものである。
【０００８】
【課題を解決するための手段】
前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形方法は、電子部品の樹脂封止成形用金型を用いて、前記金型における上型の所定位置に電子部品を装着した基板を装着固定した状態で、前記金型における少なくとも下型に形成されたキャビティ形成部に樹脂材料供給機構で供給された樹脂材料を少なくとも前記下型に備えた金型加熱機構で加熱溶融化して、前記金型を型締めすることで前記した加熱溶融化された樹脂材料に前記電子部品を浸漬内包する電子部品の樹脂封止成形方法であって、前記した金型の型開き時において、前記した樹脂材料供給機構にある樹脂材料を樹脂加圧用の加圧手段で均一に加圧した後に、当該樹脂材料を前記した樹脂材料供給機構からキャビティ形成部に供給する工程と、前記した樹脂材料を前記した樹脂材料供給機構からキャビティ形成部へ供給した後に、樹脂加圧用の前記加圧手段もしくは別の加圧手段にて当該樹脂材料を均一に加圧する工程とを、適宜に組合わせることによって、前記した均一に加圧された樹脂材料を用いることを特徴とする。
【０００９】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形方法は、前記した金型の型開き時において、前記したキャビティ形成部に均一に加圧された当該樹脂材料と非接触状態で樹脂材料用の加熱手段にて当該樹脂材料を加熱溶融化することを特徴とする。
【００１０】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、電子部品の樹脂封止成形用金型と、前記した金型における上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、前記した金型における少なくとも下型に形成された前記電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、前記したキャビティ形成部に当該樹脂材料を供給する樹脂材料供給機構と、前記したキャビティ形成部に供給された樹脂材料を加熱溶融化する前記金型に備えた金型加熱機構とを含む電子部品の樹脂封止成形装置であって、前記した金型の型開き時において、前記したキャビティ形成部に樹脂材料を供給する前に当該樹脂材料を均一に加圧する樹脂材料用の加圧手段と、前記したキャビティ形成部に樹脂材料を供給した後に当該樹脂材料を均一に加圧する樹脂材料用の前記した加圧手段もしくは別の加圧手段とを、適宜に組み合わせて設けたことを特徴とする。
【００１１】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、前記した金型の型開き時において、前記したキャビティ形成部に均一に加圧された当該樹脂材料と非接触状態で加熱溶融化する樹脂材料用の加熱手段を設けたことを特徴とする。
【００１２】
【発明の実施の形態】
即ち、基本的に、電子部品の樹脂封止成形用金型と、前記した金型のうち上型に電子部品を装着した基板を装着固定する基板固定手段と、前記した金型のうち少なくとも下型に形成された電子部品を嵌装セットするキャビティ形成部と、キャビティ形成部に樹脂材料を供給する樹脂材料供給機構と、キャビティ形成部に供給された樹脂材料を加熱溶融化する少なくとも前記下型に備えた金型加熱機構とを設けた樹脂封止成形装置の基板浸漬成形における金型の型開き時において、当該樹脂材料をキャビティ形成部に供給前に均一に加圧する加圧手段と、キャビティ形成部に当該樹脂材料を供給後に均一に加圧する前記した加圧手段もしくは別の加圧手段とを、適宜に組合わせて設けることを特徴とする。
また、キャビティ形成部に均一に加圧された当該樹脂材料を加熱溶融化して溶融樹脂とする時に、金型加熱機構に加えて、金型の型開き時において、当該樹脂材料と非接触状態にある加熱手段にてさらに加熱溶融化することを促進することができる。
従って、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供できる。
【００１３】
【実施例】
以下、図１乃至図６に基づいて、詳細に説明する。
なお、図１乃至図６は、本発明での樹脂封止成形装置の概略縦断面図である。
【００１４】
即ち、本発明に係る装置は、例えば、図１（１）に示すように、上型１と該上型１と相対向配置された少なくとも下型２とを備えた電子部品の樹脂封止成形用金型と、前記した金型のうち上型１の上型面３に電子部品を装着した基板９を装着固定する基板固定手段５と、前記した金型のうち少なくとも下型２の下型面４に形成された電子部品を嵌装セットするキャビティ形成部６と、キャビティ形成部６に樹脂材料を供給する樹脂材料供給機構７と、キャビティ形成部６に供給された樹脂材料を加熱溶融化する少なくとも下型２に埋設した金型加熱機構８とを設けている。
なお、電子部品を装着した基板９とは、図１（１）で示すように、例えば、電子部品である複数個の半導体チップ１０と該チップ１０と基板９とを電気的に接続するワイヤ１１とで構成された所定個所にマトリクス状に配列され装着した任意の形状である一枚の基板９を示していると共に、複数個の該チップ１０とワイヤ１１とを加熱溶融化された樹脂材料にて一括モールドする樹脂成形体１２と一括モールドされない電子部品装着側に形成された基板外周部１３とで構成されている。
また、キャビティ形成部６に供給される樹脂材料とは、図１（１）で示すように、例えば、前記した基板９の樹脂成形体１２を一括モールドするために必要な所要量の顆粒樹脂１４を示していると共に、樹脂材料供給機構７からキャビティ形成部６に金型の型開き時に当該顆粒樹脂１４を供給するように構成されている。
また、金型加熱機構８は、図１（１）で示すように、例えば、キャビティ形成部６に供給された所要量の顆粒樹脂１４（樹脂材料）を加熱溶融化する設定温度にまで上昇させて、キャビティ形成部６の底面のほぼ下部に配置された複数本の加熱ヒータを適宜に埋設されていると共に、顆粒樹脂１４を加熱溶融化して溶融樹脂１５として基板９における樹脂成形体１２部分を一括モールドして溶融樹脂１５を硬化して硬化樹脂１６を形成するように構成されている。
【００１５】
従って、前述した基板９における樹脂成形体１２部分を前記金型にて一括モールドするのには、まず、金型の型開き時において、基板固定手段５における上型面３の所定位置に電子部品側である樹脂成形体１２部分を下方向に向け供給セットすると共に、樹脂材料供給機構７からキャビティ形成部６に所要量の顆粒樹脂１４を供給する（図１（１）参照）。
次に、金型の型開き時において、金型加熱機構８における加熱ヒータにて下型２を加熱してキャビティ形成部６にある所要量の顆粒樹脂１４を加熱溶融化して溶融樹脂１５とする（図１（２）参照）。
次に、キャビティ形成部６にある溶融樹脂１５に金型を型締めする、つまりは、基板外周部１３と下型面４とが当接することで型締め状態となって、樹脂成形体１２部分である複数個の該チップ１０とワイヤ１１とを浸漬内包して一括モールドする基板浸漬成形を行う（図２（１）参照）。
次に、溶融樹脂１５に浸漬内包された樹脂成形体１２部分を硬化させる硬化所要時間経過後に硬化樹脂１６を形成された基板９である樹脂成形済基板１７（製品）が成形されて、金型が型開き時に、基板固定手段５における上型面３の所定位置に樹脂成形済基板１７を装着固定した状態で硬化樹脂１６部分とキャビティ形成部６より離型して型開き状態となる（図２（２）参照）。
【００１６】
ここで、本発明に係る装置の第一の特徴部分は、所要量の顆粒樹脂１４をキャビティ形成部６に供給する前に、当該顆粒樹脂１４を均一に加圧することであり、図３と図４とを用いて、以下に説明する。
【００１７】
つまり、本発明に係る装置において、例えば、図３（１）に示すように、樹脂材料供給機構７は、所要量の顆粒樹脂１４を供給する後述する枠体部１９と開閉部２０とで形成される樹脂材料供給用の樹脂供給空間部１８と、該空間部１８の顆粒樹脂１４を包囲する鉛直方向に貫通した枠体部１９と、該空間部１８の底面を形成し且つ水平方向に往復動可能な該枠体部１９底面に敷設された開閉部２０とを設けていることである。
また、該枠体部１９の貫通部分に嵌装して当該顆粒樹脂１４を該空間部１８で均一に加圧し且つ鉛直方向に上下往復動する加圧手段２１とを設けている。
この場合、まず、加圧手段２１と樹脂材料供給機構７とが離間した状態で、樹脂材料供給機構７における樹脂供給空間部１８を形成した状態、つまりは、開閉部２０が枠体部１９底面の貫通部分を閉じた状態で、所要量の顆粒樹脂１４を該空間部１８に供給する（図３（１）参照）。
次に、樹脂供給空間部１８にある顆粒樹脂１４を加圧手段２１に形成された樹脂加圧面２２と顆粒樹脂１４が接触し且つ枠体部１９の内周囲に樹脂加圧面２２と鉛直方向に平行に形成された樹脂加圧部２３の外周囲が嵌装されて、加圧手段２１が顆粒樹脂１４を鉛直方向へ下動することにより当該顆粒樹脂１４を均一に加圧すると共に、金型の型開き時において、加圧手段２１にて均一に加圧した状態の樹脂材料供給機構７が、キャビティ形成部６の所定位置における直上部に供給される（図３（２）参照）。
次に、金型の型開き時において、加圧手段２１にて均一に加圧された当該顆粒樹脂１４を、樹脂材料供給機構７における開閉部２０が水平方向にスライドして開く状態、つまりは、図例における左方向に開閉部２０がスライドするのと略同時に、均一に加圧された所要量の顆粒樹脂１４の一部分がキャビティ形成部６に落下して供給される（図４（１）参照）。
次に、金型の型開き時において、加圧手段２１にて均一に加圧された当該顆粒樹脂１４を、樹脂材料供給機構７における開閉部２０が水平方向にスライドして枠体部１９の貫通部分から完全に左方向に退くのと略同時に、加圧手段２１にて均一に加圧した所要量の顆粒樹脂１４がキャビティ形成部６に完全に供給される（図４（２）参照）。
このとき、樹脂材料供給機構７における枠体部１９の貫通部分に樹脂加圧部２３が完全に嵌装されて樹脂加圧面２２が枠体部１９底面よりもほぼ同じか突出するように構成されていると共に、加圧手段２１が枠体部１９の貫通部分より落下しないように枠体部１９天面に当接し且つ樹脂加圧部２３の上面部分を樹脂加圧面２２よりも広く形成されている。
次に、前述した図４（２）から顆粒樹脂供給機構７と加圧手段２１とが金型外部へ退いた後、図１（１）で示すように、均一に加圧された所要量の顆粒樹脂１４をキャビティ形成部６に供給することになる。
次に、図１（２）と図２（１）と図２（２）とで示す基板浸漬成形にて順次実施して、電子部品を装着した基板９を一括モールドして樹脂成形済基板１７（製品）が成形される。
つまり、顆粒樹脂１４の粒子間に空隙部が形成されずに均一な状態で供給されるので、顆粒樹脂１４とキャビティ形成部６底面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることができて、顆粒樹脂１４内の温度差が生じることなく、溶融樹脂１５内のボイドを効率良く防止できる。
従って、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型を用いて、前記金型に樹脂材料（顆粒樹脂１４）を均一に加圧して供給することにより、製品のボイドや未充填等の製品不良を効率良く防止することができる。
【００１８】
ここで、本発明に係る装置の第二の特徴部分は、所要量の顆粒樹脂１４をキャビティ形成部６から樹脂材料供給機構７にて供給した後に、キャビティ成形部６にある所要量の顆粒樹脂１４を均一に加圧することであり、図５を用いて、以下に説明する。
【００１９】
つまり、従来の基板浸漬成形による樹脂材料供給機構７と同様に、所要量の顆粒樹脂１４をキャビティ形成部６に不均一な状態のままで供給してから、図５（１）で示すように、例えば、キャビティ形成部６底面よりもほぼ同じか小さい樹脂加圧面２４を有する鉛直方向に上下往復動し且つキャビティ形成部６の当該顆粒樹脂１４を均一に加圧する図３（１）で示す加圧手段２１もしくは別の加圧手段２５を設けることである。
この場合、まず、従来の基板浸漬成形による樹脂材料供給機構７と同様に、所要量の顆粒樹脂１４をキャビティ形成部６に不均一な状態のままで供給する。
次に、加圧手段２１もしくは別の加圧手段２５が、不均一な所要量の顆粒樹脂１４を有するキャビティ形成部６の所定位置における直上部に供給される（図５（１）参照）。
次に、所要量の顆粒樹脂１４を有するキャビティ形成部６の所定位置における直上部に供給された加圧手段２１もしくは別の加圧手段２５が下動することにより、不均一な当該顆粒樹脂１４をキャビティ形成部６内で均一に加圧される（図５（２）参照）。
次に、前述した図５（２）から加圧手段２１もしくは別の加圧手段２５とが金型外部へ退いた後、図１（１）で示すように、所要量の顆粒樹脂１４がキャビティ形成部６で均一に加圧された状態となる。
次に、図１（２）と図２（１）と図２（２）とで示す基板浸漬成形にて順次実施して、電子部品を装着した基板９を一括モールドして樹脂成形済基板１７（製品）が成形される。
つまり、顆粒樹脂１４の粒子間に空隙部が形成されずに均一な状態となるので、顆粒樹脂１４とキャビティ形成部６底面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることができて、顆粒樹脂１４内の温度差が生じることなく、溶融樹脂１５内のボイドを効率良く防止できる。
従って、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型を用いて、前記金型内で樹脂材料（顆粒樹脂１４）を均一に加圧することにより、製品のボイドや未充填等の製品不良を効率良く防止することができる。
【００２０】
更に、前述した本発明に係る装置における第一及び第二の特徴部分のいずれか一方のみを実施するのではなく、適宜に組合わせることにより、キャビティ形成部６の鉛直方向の厚みが非常に薄くなったり、キャビティ形成部６の水平面が非常に広くなったとしても、図３（１）或いは図５（１）で示す各加圧手段２１・２５で、所要量の顆粒樹脂１４を均一に加圧できるので、製品のボイドや未充填等の製品不良をより一層、効率良く防止することができる。
【００２１】
加えて、本発明に係る装置の第三の特徴部分は、キャビティ形成部６に均一に加圧された所要量の当該顆粒樹脂１４（樹脂材料）を、前記した金型が型開きした状態で且つ前記した均一に加圧された顆粒樹脂１４と非接触状態で、前記した金型加熱機構８とは別の樹脂材料用の加熱手段２６を設けることにより、当該顆粒樹脂１４を効率良く加熱溶融化することであり、図６を用いて、以下に説明する。
【００２２】
つまり、図１（１）から図１（２）の動作に至る、当該顆粒樹脂１４を加熱溶融化して溶融樹脂１５とする時に、金型加熱機構８に加えて、金型の型開き時において、当該顆粒樹脂１４と非接触状態にある加熱手段２６に備えた、例えば、図６に示すように、均一に加圧された所要量の顆粒樹脂１４の樹脂表面側から加熱ボード２７・ヒータ２８・断熱ボード２９という任意の順序構成である任意のヒータ板で効率良く加熱溶融化することである。
この場合、当該顆粒樹脂１４と非接触状態にある加熱手段２６であれば、前述した構成ではなく、例えば、遠赤外線やハロゲン等の任意の加熱手段２６を用いてもよい。
従って、加熱溶融化時間や溶融樹脂１５を硬化する硬化所要時間における装置の稼動時間を長びかせることなく、製品の生産性を向上させることができる。
【００２３】
ここで、前述した本発明に係る装置の第一乃至第三の特徴部分は、第一乃至第三の全ての特徴部分、或いは、第一と第三の特徴部分、或いは、第二と第三の特徴部分、或いは、第一の特徴部分のみ、或いは、第二の特徴部分のみを適宜に組合わせて実施することができる。
【００２４】
即ち、本発明は、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型に均一に加圧された樹脂材料（顆粒樹脂１４）を用いることにより、製品（樹脂成形済基板１７）のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上することができる、電子部品の樹脂封止成形方法及び装置を提供することができる。
【００２５】
なお、第一の特徴部分である所要量の顆粒樹脂１４を樹脂材料供給機構７内で加圧手段２１における樹脂加圧面２２で当該顆粒樹脂１４を水平状態で均一に加圧するように説明してきたが（図３（２）参照）、図示していないが、樹脂加圧面２２を格子状に形成して、所要量の顆粒樹脂１４を丸型や多角型（四角型が好ましい）である任意の形状に区切り、顆粒樹脂１４を均一に加圧するように実施してもよい。
また、樹脂材料供給機構７における開閉部２０において、図４（１）・（２）に示すように、水平方向の片側方向へのみスライドして顆粒樹脂１４をキャビティ形成部６へ供給するような構成で説明しているが、任意の方向でスライドするように実施してもよい、また、図示していないが、開閉部２０を所要の間隔で任意に分割して水平方向に任意の方向でスライドさせたり、任意に分割された開閉部２０を鉛直方向の下側へ各別に各開閉部２０を回動させることにより、開閉状態を行うように適宜に変更して実施してもよい。
【００２６】
なお、第一及び第二の特徴部分である所要量の顆粒樹脂１４を均一に加圧する各加圧手段２１・２５における少なくとも当該顆粒樹脂１４と接触する各樹脂加圧面２２・２４おいては、テフロン（登録商標）等の任意のコーティング材をコーティングして実施してもよい。
また、前記した各加圧手段２１・２５は、当該顆粒樹脂１４と接触させて実施しているが、非接触状態にあるホットエア等の加熱された任意の気体を用いて均一に加圧させてもよい。
【００２７】
また、本実施例においては、顆粒樹脂１４を樹脂材料として用いているが、例えば、任意の複数個のタブレット樹脂を各加圧手段２１・２５でコイン形状等にして任意の形状にて薄くキャビティ形成部６に均一に加圧するような構成にしてもよい。
【００２８】
また、本実施例においては、ワイヤボンデングされた電子部品を樹脂封止成形する構成にて説明してきたが、ワイヤ１１の無い電子部品を搭載されたフリップチップ基板等においても前述の樹脂封止成形を適応することは可能である。
また、本実施例においては、一枚の円型（ウェーハレベルパッケージ型）や多角型（四角型が好ましい）の任意の形状である基板９を一括モールドする構成にしているが、例えば、短冊状の基板９を複数枚配置したり、短冊状の基板９を配置できる専用治具等の任意の治具にて載置固定して前記した装置における基板固定手段５に装着固定するようにして実施してもよい。
【００２９】
また、本実施例においては、金型のうち上型１と下型２（二枚型）のみを図例にて説明してきたが、上下型１・２においても、一括モールドする基板９に対応して、各金型１・２を分割金型構造で実施してもよい、或いは、上下型１・２との間に中間型を設ける三枚型の金型構造にてキャビティ形成部６を中間型と下型２とを型締めして形成するような構成にしてもよい。
この場合、離型フィルムを中間型と下型２との間に供給してキャビティ形成部６の底面を被覆して一括モールドする離型フィルム成形や、或いは、加熱溶融化された樹脂材料により一層、ボイド等の発生を効率良く防止するために少なくとも樹脂材料が接触する金型面を外気遮断範囲として外気遮断範囲の空気等を強制的に吸引して真空引き状態とする真空引き成形とを、一方もしくは両方の成形を併用して実施してもよい。
なお、前記した離型フィルム成形や真空引き成形を本実施例に適宜に選択して実施してもよい。
【００３０】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に変更・選択して採用できるものである。
【００３１】
【発明の効果】
本発明は、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供すると云う優れた効果を奏するものである。
【図面の簡単な説明】
【図１】図１は、本発明に係る電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、電子部品の装着された基板を一括モールドする状態を段階的に示す。
【図２】図２は、図１に対応する前記装置要部の概略拡大縦断面図であって、電子部品の装着された基板を一括モールドする状態を段階的に示す。
【図３】図３は、図１（１）に至る装置要部の第一の特徴である概略拡大縦断面図であって、樹脂材料を均一に加圧した後に前記金型内に供給する状態を段階的に示す。
【図４】図４は、図３に対応する前記装置要部の概略拡大縦断面図であって、樹脂材料を均一に加圧した後に前記金型内に供給する状態を段階的に示す。
【図５】図５は、図１（１）に至る装置要部の第二の特徴である概略拡大縦断面図であって、樹脂材料を前記金型内で均一に加圧する状態を段階的に示す。
【図６】図６は、図１（１）から図１（２）に至る装置要部の第三の特徴である概略拡大縦断面図であって、前記金型内の均一に加圧された樹脂材料と非接触状態にある加熱手段で加熱溶融化する状態を示す。
【符号の説明】
１ 上型
２ 下型
３ 上型面
４ 下型面
５ 基板固定手段
６ キャビティ形成部
７ 樹脂材料供給機構
８ 金型加熱機構
９ 基板
１０ 半導体チップ
１１ ワイヤ
１２ 樹脂成形体
１３ 基板外周部
１４ 顆粒樹脂（樹脂材料）
１５ 溶融樹脂
１６ 硬化樹脂
１７ 樹脂成形済基板（製品）
１８ 樹脂供給空間部
１９ 枠体部
２０ 開閉部
２１・２５ 加圧手段
２２・２４ 樹脂加圧面
２３ 樹脂加圧部
２６ 加熱手段
２７ 加熱ボード
２８ ヒータ
２９ 断熱ボード[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing molding method for an electronic component, wherein a substrate on which an electronic component such as an IC is mounted uses a resin material supplied to a resin sealing molding die, and the electronic component is molded. And improvements in equipment.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a resin material is supplied to a mold using a resin sealing molding die of an electronic component, and a plurality of semiconductor chips, which are electronic components mounted on a substrate, are collectively resin molded. That is being done.
[0003]
That is, a conventional resin sealing and molding apparatus for electronic components includes a resin sealing and molding die for electronic components including an upper mold and a lower mold, and a pot for fitting a tablet resin (resin material) into the lower mold. There is a plunger that slides up and down in the pot. First, the substrate on which the semiconductor chip (electronic component) is mounted is supplied to the lower die with the chip mounting side facing upward, and the upper and lower dies are clamped. Then, the tablet resin preliminarily heated and melted is pressed as a molten resin by a plunger in a pot, and then the molten resin is injected and filled into a cavity provided in the upper die for setting the chip. Then, the molten resin is hardened to form a resin molded body in which the cavity portion and the resin passage portion are integrally formed. Next, the integrally formed resin molded body is taken out from the mold, and the cavity portion and the resin passage are removed. Separate from parts.
From the above, the resin-sealed molded substrate (product) after the resin molding in which the cavity portion is cured is completed, and the cured resin in the resin passage portion in the cull portion, the pot portion, and the runner portion is used as an unnecessary resin material. Discard (for example, refer to Patent Document 1).
[0004]
[Patent Document 1]
JP 2001-28377 A (page 4, FIG. 1)
[0005]
[Problems to be solved by the invention]
However, using the above-described conventional technique, for example, a substrate on which a plurality of wires for electrically connecting the chip and the substrate are mounted is pressed using a tablet resin as a molten resin to press a plunger in a pot to form a resin passage. Injects and fills the molten resin into the cavity where the chip and wire are fitted and set. In the case of transfer molding, the molten resin is injected and filled from the side of the cavity while the substrate and the resin passage are in contact with each other. Therefore, there has been a problem that the wire is frequently deformed or broken and wire failure occurs frequently.
[0006]
Therefore, there is no pot, plunger, and resin passage portion provided in the mold structure in the conventional transfer molding. That is, using both the upper and lower molds, the upper mold has the chip on the substrate on which the chip and the wire are mounted. The resin material is supplied to the cavity provided in the lower mold by the resin material supply mechanism, and the resin material in the cavity is heated and melted to form a molten resin. Substrate immersion molding, in which both the upper and lower dies are clamped, so that the chip and the wire are immersed and encapsulated in a molten resin and molded with a resin, has come to be performed.
Also, in the above-mentioned substrate immersion molding, in recent years, the size and thickness of a substrate have been reduced, the size of a semiconductor chip (electronic component) has been minimized and reduced, and a plurality of chips have been mounted on a single substrate. Because the vertical thickness of the cavity becomes very thin and the cavity horizontal surface becomes very wide, batch molding can be used instead of using tablet resin as the resin material. Is being considered. However, when the granular resin is naturally dropped from the resin material supply mechanism into the cavity and supplied, a void portion is formed between the particles of the granular resin, and the granular resin is supplied in an uneven state with a large amount of air. In other words, it is difficult to uniformly transfer heat to the entire resin from the contact surface side of the granular resin and the cavity surface to the resin surface side, resulting in a temperature difference in the granular resin, and in that state, the granular resin Even if the resin becomes molten resin, a large amount of air will remain as voids in the molten resin. In this state, the chip and wire are fitted and set in the cavity by substrate immersion molding, and the resin is sealed. Product defects such as voids and unfilled parts occur in the resin molded part of the resin molded substrate that becomes a fixed molded product, resulting in extremely low product yield There has been a problem that the cell is.
In addition, if the resin material containing voids is used as the molten resin, the operation time of the apparatus in the heat melting time and the curing time required to cure the molten resin is prolonged, which significantly reduces product productivity. There was a problem of doing so.
[0007]
That is, the present invention uses a resin material in which a substrate on which a plurality of semiconductor chips as electronic components are mounted is uniformly pressed in a resin molding die, so that products such as voids and unfilled products can be obtained. An object of the present invention is to provide a method and an apparatus for resin-encapsulating and molding electronic components, which efficiently prevent defects and improve product productivity.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned technical problem, a resin sealing molding method for an electronic component according to the present invention uses a resin sealing molding die for an electronic component, and the electronic component is positioned at a predetermined position of an upper mold in the die. In a state where the substrate on which is mounted is mounted and fixed, the resin material supplied by the resin material supply mechanism to at least the cavity forming portion formed in the lower mold in the mold is heated by the mold heating mechanism provided in at least the lower mold. A resin sealing molding method for an electronic component in which the electronic component is immersed and encapsulated in the heat-melted resin material by melting and clamping the mold, wherein the mold is opened. In the above, after uniformly pressing the resin material in the resin material supply mechanism by the pressing means for resin pressing, supplying the resin material from the resin material supply mechanism to the cavity forming portion; Tree After the material is supplied from the resin material supply mechanism to the cavity forming section, the step of uniformly pressing the resin material by the pressing means for pressing the resin or another pressing means is appropriately combined. Thus, the above-described resin material uniformly pressed is used.
[0009]
In addition, in order to solve the above-mentioned technical problem, the resin sealing molding method for an electronic component according to the present invention is characterized in that, when the mold is opened, the resin is uniformly pressed into the cavity forming portion. The resin material is heated and melted by a heating means for the resin material in a non-contact state with the material.
[0010]
Further, in order to solve the above-mentioned technical problem, a resin sealing and molding apparatus for an electronic component according to the present invention includes a resin sealing and molding mold for an electronic component, and an electronic component at a predetermined position of an upper mold in the mold. A substrate fixing means for mounting and fixing a substrate on which a component is mounted, a cavity forming portion for resin molding for fitting and setting the electronic component formed at least in the lower mold in the mold, and a cavity forming portion for the resin. A resin sealing and molding apparatus for an electronic component, comprising: a resin material supply mechanism for supplying a resin material; and a mold heating mechanism provided in the mold for heating and melting the resin material supplied to the cavity forming section. In addition, at the time of opening the mold, the resin material pressurizing means for uniformly pressing the resin material before supplying the resin material to the cavity forming portion; And it said the pressure means or another pressurizing means for the resin material uniformly pressurized the resin material after providing the fat material, characterized by providing appropriately combined.
[0011]
Further, in order to solve the above-mentioned technical problem, the resin sealing and molding apparatus for an electronic component according to the present invention is configured such that when the mold is opened, the resin is uniformly pressed to the cavity forming portion. A heating means for a resin material which is heated and melted in a non-contact state with the material is provided.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
That is, basically, a resin-sealing molding die for an electronic component, substrate fixing means for mounting and fixing a substrate on which an electronic component is mounted on the upper die of the above-mentioned die, and at least a lower die of the above-mentioned die. A cavity forming section for fitting and setting an electronic component formed in the mold, a resin material supply mechanism for supplying a resin material to the cavity forming section, and at least the lower mold for heating and melting the resin material supplied to the cavity forming section Pressurizing means for uniformly pressurizing the resin material before supplying the resin material to the cavity forming portion, when the mold is opened in the substrate immersion molding of the resin sealing molding apparatus provided with the mold heating mechanism provided in the cavity; The present invention is characterized in that the above-mentioned pressurizing means or another pressurizing means for uniformly pressurizing the resin material after being supplied to the forming portion is provided in appropriate combination.
In addition, when the resin material uniformly pressurized in the cavity forming portion is heated and melted to be a molten resin, in addition to the mold heating mechanism, the resin material is brought into a non-contact state when the mold is opened. Further heating and melting by a certain heating means can be promoted.
Accordingly, the present invention provides a product, such as a void or unfilled product, by using a resin material in which a substrate on which a plurality of semiconductor chips as electronic components are mounted is uniformly pressed in a resin molding die. It is possible to provide a method and an apparatus for resin-encapsulating and molding electronic components, which efficiently prevent defects and improve product productivity.
[0013]
【Example】
Hereinafter, the present embodiment will be described in detail with reference to FIGS.
1 to 6 are schematic longitudinal sectional views of the resin molding apparatus according to the present invention.
[0014]
That is, the apparatus according to the present invention is, for example, as shown in FIG. 1 (1), resin-encapsulation molding of an electronic component including an upper mold 1 and at least a lower mold 2 opposed to the upper mold 1. A metal mold, substrate fixing means 5 for mounting and fixing a substrate 9 having electronic components mounted on the upper mold surface 3 of the upper mold 1 of the above-mentioned dies, and a lower mold of at least the lower mold 2 of the above-mentioned dies A cavity forming section 6 for fitting and setting an electronic component formed on the surface 4, a resin material supply mechanism 7 for supplying a resin material to the cavity forming section 6, and heating and melting the resin material supplied to the cavity forming section 6 And a mold heating mechanism 8 embedded in at least the lower mold 2.
As shown in FIG. 1A, the substrate 9 on which the electronic component is mounted is, for example, a plurality of semiconductor chips 10 as electronic components and wires 11 for electrically connecting the chip 10 and the substrate 9. Shows a single substrate 9 of an arbitrary shape arranged and mounted in a matrix at predetermined locations composed of: and a plurality of the chips 10 and wires 11 in a resin material which is melted by heating. And an outer peripheral portion 13 formed on the electronic component mounting side which is not subjected to collective molding.
The resin material supplied to the cavity forming unit 6 is, for example, as shown in FIG. 1A, a required amount of the granular resin 14 necessary for collectively molding the resin molded body 12 of the substrate 9 described above. And the resin material supply mechanism 7 supplies the granular resin 14 to the cavity forming section 6 when the mold is opened.
Also, as shown in FIG. 1A, the mold heating mechanism 8 raises a required amount of the granular resin 14 (resin material) supplied to the cavity forming section 6 to a set temperature at which the resin is heated and melted, for example. In addition, a plurality of heaters arranged at substantially the lower portion of the bottom surface of the cavity forming portion 6 are appropriately embedded, and the resin molded body 12 portion of the substrate 9 is melted by heating and melting the granular resin 14 as a molten resin 15. It is configured to cure the molten resin 15 by batch molding to form a cured resin 16.
[0015]
Therefore, in order to collectively mold the resin molded body 12 portion of the substrate 9 with the mold, first, when the mold is opened, the electronic component is placed at a predetermined position on the upper mold surface 3 of the substrate fixing means 5. The resin molded body 12 on the side is supplied and set downward, and a required amount of the granular resin 14 is supplied from the resin material supply mechanism 7 to the cavity forming section 6 (see FIG. 1A).
Next, when the mold is opened, the lower mold 2 is heated by the heater of the mold heating mechanism 8 to heat and melt a required amount of the granular resin 14 in the cavity forming portion 6 to obtain a molten resin 15. (See FIG. 1 (2)).
Next, the mold is clamped to the molten resin 15 in the cavity forming portion 6, that is, the outer peripheral portion 13 and the lower mold surface 4 come into contact with each other, so that the mold is in a clamped state. Then, a plurality of chips 10 and wires 11 are immersed and encapsulated and subjected to collective molding to perform substrate immersion molding (see FIG. 2A).
Next, a resin-molded substrate 17 (product), which is the substrate 9 on which the cured resin 16 is formed, is formed after a lapse of a required time for curing for curing the portion of the resin molded body 12 immersed and encapsulated in the molten resin 15, and a mold is formed. When the mold is opened, the cured resin 16 is separated from the cavity forming portion 6 in a state where the resin-molded substrate 17 is mounted and fixed at a predetermined position on the upper mold surface 3 of the substrate fixing means 5, and the mold is opened (FIG. 2 (2)).
[0016]
Here, the first characteristic part of the apparatus according to the present invention is to pressurize the granular resin 14 uniformly before supplying the required amount of the granular resin 14 to the cavity forming section 6, as shown in FIGS. 4 will be described below.
[0017]
In other words, in the apparatus according to the present invention, for example, as shown in FIG. 3A, the resin material supply mechanism 7 is formed by a frame body portion 19 and a opening / closing portion 20 which supply a required amount of the granular resin 14, which will be described later. A resin supply space 18 for supplying a resin material to be supplied, a frame portion 19 penetrating in the vertical direction surrounding the granular resin 14 in the space 18, and forming a bottom surface of the space 18 and reciprocating in the horizontal direction An opening / closing unit 20 laid on the bottom surface of the movable frame unit 19 is provided.
Further, there is provided a pressurizing means 21 which is fitted into the penetrating portion of the frame portion 19 to uniformly press the granular resin 14 in the space portion 18 and reciprocate up and down in the vertical direction.
In this case, first, the resin supply space 18 in the resin material supply mechanism 7 is formed in a state where the pressing means 21 and the resin material supply mechanism 7 are separated from each other. A required amount of the granular resin 14 is supplied to the space 18 in a state where the penetrating portion is closed (see FIG. 3A).
Next, the granular resin 14 in the resin supply space 18 is brought into contact with the resin pressing surface 22 formed in the pressing means 21 and the granular resin 14, and the resin pressing surface 22 is formed on the inner periphery of the frame 19 in the vertical direction. The outer periphery of the resin pressing portion 23 formed in parallel is fitted, and the pressing means 21 moves down the granular resin 14 in the vertical direction, thereby uniformly pressing the granular resin 14 and simultaneously pressing the mold. At the time of opening the mold, the resin material supply mechanism 7 in a state of being uniformly pressurized by the pressurizing means 21 is supplied just above a predetermined position of the cavity forming portion 6 (see FIG. 3 (2)).
Next, when the mold is opened, the opening / closing section 20 of the resin material supply mechanism 7 slides and opens the granular resin 14 uniformly pressed by the pressing means 21, that is, At the same time as the opening / closing unit 20 slides to the left in the illustrated example, a part of the required amount of the granular resin 14 uniformly pressed is dropped and supplied to the cavity forming unit 6 (FIG. 4A). reference).
Next, when the mold is opened, the opening / closing section 20 of the resin material supply mechanism 7 slides the granular resin 14 uniformly pressed by the pressing means 21 in the horizontal direction, and At about the same time when the resin completely retreats leftward from the penetrating portion, a required amount of the granular resin 14 uniformly pressed by the pressing means 21 is completely supplied to the cavity forming section 6 (see FIG. 4B). .
At this time, the resin pressing portion 23 is completely fitted into the penetrating portion of the frame portion 19 in the resin material supply mechanism 7, and the resin pressing surface 22 is configured to be substantially the same as or protrude from the bottom surface of the frame portion 19. In addition, the pressing means 21 is in contact with the top surface of the frame body portion 19 so as not to drop from the penetrating portion of the frame body portion 19, and the upper surface portion of the resin pressing portion 23 is formed wider than the resin pressing surface 22. I have.
Next, after the granular resin supply mechanism 7 and the pressing means 21 withdraw from the mold from FIG. 4B described above, as shown in FIG. The granular resin 14 is supplied to the cavity forming section 6.
Next, the substrate 9 on which the electronic components are mounted is collectively molded by performing the substrate immersion molding shown in FIG. 1B, FIG. 2A, and FIG. (Product) is molded.
That is, since the gap is not formed between the particles of the granular resin 14 and is supplied in a uniform state, heat is uniformly applied to the entire resin from the contact surface side between the granular resin 14 and the bottom surface of the cavity forming portion 6 to the resin surface side. It is possible to effectively transmit the voids in the molten resin 15 without causing a temperature difference in the granular resin 14.
Therefore, the substrate 9 on which a plurality of semiconductor chips 10 as electronic components are mounted is supplied with a resin material (granule resin 14) uniformly pressed and supplied to the mold by using a resin molding mold. In addition, product defects such as voids and unfilled products can be efficiently prevented.
[0018]
Here, the second characteristic part of the apparatus according to the present invention is that, after the required amount of the granular resin 14 is supplied from the cavity forming unit 6 by the resin material supply mechanism 7, the required amount of the granular resin 14 is pressed uniformly, which will be described below with reference to FIG.
[0019]
That is, similarly to the conventional resin material supply mechanism 7 by substrate immersion molding, a required amount of the granular resin 14 is supplied to the cavity forming section 6 in an uneven state, and then, as shown in FIG. For example, as shown in FIG. 3 (1), the granular resin 14 of the cavity forming portion 6 is reciprocated vertically in a vertical direction having a resin pressing surface 24 substantially the same as or smaller than the bottom surface of the cavity forming portion 6 and uniformly pressurized. The pressure means 21 or another pressure means 25 is provided.
In this case, first, a required amount of the granular resin 14 is supplied to the cavity forming section 6 in a non-uniform state, similarly to the conventional resin material supply mechanism 7 by substrate immersion molding.
Next, the pressurizing unit 21 or another pressurizing unit 25 is supplied to a position immediately above a predetermined position of the cavity forming unit 6 having a nonuniform required amount of the granular resin 14 (see FIG. 5A).
Next, the pressing means 21 or another pressing means 25 supplied immediately above a predetermined position of the cavity forming section 6 having the required amount of the granular resin 14 moves downward, so that the uneven granular resin 14 Is uniformly pressed in the cavity forming section 6 (see FIG. 5 (2)).
Next, after the pressing means 21 or another pressing means 25 withdraws from the mold from FIG. 5 (2) described above, as shown in FIG. The pressing unit is uniformly pressed by the forming unit 6.
Next, the substrate 9 on which the electronic components are mounted is collectively molded by performing the substrate immersion molding shown in FIG. 1B, FIG. 2A, and FIG. (Product) is molded.
In other words, since no gap is formed between the particles of the granular resin 14 and the state is uniform, the heat is uniformly transferred to the entire resin from the contact surface side between the granular resin 14 and the bottom surface of the cavity forming portion 6 to the resin surface side. Thus, voids in the molten resin 15 can be efficiently prevented without causing a temperature difference in the granular resin 14.
Therefore, the substrate 9 on which a plurality of semiconductor chips 10 as electronic components are mounted is pressed uniformly with the resin material (granule resin 14) in the mold by using a resin molding mold. Product defects such as voids and unfilled portions can be efficiently prevented.
[0020]
Furthermore, not only one of the first and second characteristic portions in the device according to the present invention described above is performed, but also the thickness in the vertical direction of the cavity forming portion 6 is extremely small by appropriately combining the first and second characteristic portions. Even if the cavity plane 6 becomes extremely wide, the required amount of the granular resin 14 is uniformly applied by the pressing means 21 and 25 shown in FIG. 3 (1) or FIG. 5 (1). Since pressure can be applied, product defects such as voids and unfilled products can be more efficiently prevented.
[0021]
In addition, the third characteristic part of the apparatus according to the present invention is that the required amount of the granular resin 14 (resin material) uniformly pressed into the cavity forming part 6 is applied in a state where the above-mentioned mold is opened. Further, by providing a heating means 26 for a resin material different from the mold heating mechanism 8 in a non-contact state with the uniformly pressurized granular resin 14, the granular resin 14 is efficiently heated and melted. This will be described below with reference to FIG.
[0022]
In other words, when the granular resin 14 is heated and melted into the molten resin 15 from the operation shown in FIG. 1 (1) to the operation shown in FIG. 1 (2), in addition to the mold heating mechanism 8, when the mold is opened, For example, as shown in FIG. 6, a heating board 27 and a heater 28 are provided on a heating means 26 in a non-contact state with the granular resin 14 from a resin surface side of a required amount of the granular resin 14 uniformly pressed. -It is to heat and melt efficiently with an arbitrary heater plate having an arbitrary order configuration of the heat insulating board 29.
In this case, as long as the heating means 26 is not in contact with the granular resin 14, an arbitrary heating means such as far infrared rays or halogen may be used instead of the above-described configuration.
Therefore, the productivity of the product can be improved without prolonging the operation time of the apparatus in the heating and melting time or the curing time required for curing the molten resin 15.
[0023]
Here, the first to third characteristic portions of the device according to the present invention described above are all the first to third characteristic portions, or the first and third characteristic portions, or the second and third characteristic portions. , Or only the first characteristic portion, or only the second characteristic portion can be appropriately combined and implemented.
[0024]
That is, the present invention provides a product (granule resin 14) in which a substrate 9 on which a plurality of semiconductor chips 10 as electronic parts are mounted is made of a resin material (granule resin 14) uniformly pressed in a resin molding die. It is possible to provide a method and an apparatus for resin-encapsulating and molding electronic components, which can efficiently prevent product defects such as voids and unfilled resin-molded substrates 17) and improve product productivity.
[0025]
It has been described that the required amount of the granular resin 14, which is the first characteristic portion, is uniformly pressed in a horizontal state by the resin pressing surface 22 of the pressing means 21 in the resin material supply mechanism 7 in a horizontal state. Although not shown (see FIG. 3 (2)), the resin pressing surface 22 is formed in a lattice shape, and the required amount of the granular resin 14 is round or polygonal (preferably square). The process may be performed such that the granular resin 14 is divided into shapes and the granular resin 14 is uniformly pressed.
In addition, in the opening / closing section 20 of the resin material supply mechanism 7, as shown in FIGS. 4A and 4B, the granular material 14 is slid only in one horizontal direction to supply the granular resin 14 to the cavity forming section 6. Although described in terms of configuration, it may be implemented to slide in any direction.Although not shown, the opening / closing unit 20 may be arbitrarily divided at required intervals and horizontally in any direction. The opening / closing state may be appropriately changed so that the opening / closing state is performed by sliding or rotating the respective opening / closing sections 20 arbitrarily divided downward and vertically respectively.
[0026]
In each of the pressing means 21 and 25 for uniformly pressing a required amount of the granular resin 14 as the first and second characteristic portions, at least the resin pressing surfaces 22 and 24 that come into contact with the granular resin 14, The coating may be performed by coating with an arbitrary coating material such as Teflon (registered trademark).
In addition, each of the above-described pressurizing means 21 and 25 is implemented by being brought into contact with the granular resin 14, but is uniformly pressurized using a heated arbitrary gas such as hot air in a non-contact state. Is also good.
[0027]
Further, in this embodiment, the granular resin 14 is used as the resin material. The configuration may be such that the forming section 6 is uniformly pressed.
[0028]
Further, in the present embodiment, the configuration in which the wire-bonded electronic component is molded with resin is described. However, the above-described resin molding is also applied to a flip chip substrate or the like on which an electronic component without the wire 11 is mounted. It is possible to adapt the shaping.
Further, in the present embodiment, one substrate 9 having an arbitrary shape such as a circular shape (wafer level package type) or a polygonal shape (preferably a square shape) is molded at a time. A plurality of substrates 9 are arranged, and the substrate 9 is placed and fixed by an arbitrary jig such as a dedicated jig capable of disposing the strip-shaped substrate 9 and mounted and fixed to the substrate fixing means 5 in the above-described apparatus. May be.
[0029]
Further, in this embodiment, only the upper mold 1 and the lower mold 2 (two-piece mold) among the molds have been described with reference to the drawings, but the upper and lower molds 1 and 2 correspond to the substrate 9 to be collectively molded. Then, each of the molds 1 and 2 may be implemented with a split mold structure, or the cavity forming portion 6 may be formed by a three-piece mold structure in which an intermediate mold is provided between the upper and lower molds 1 and 2. The intermediate mold and the lower mold 2 may be formed by clamping.
In this case, a release film is supplied between the intermediate mold and the lower mold 2 to cover the bottom surface of the cavity forming portion 6 and collectively mold, or a resin film melted by heating. In order to efficiently prevent the generation of voids and the like, at least the mold surface in contact with the resin material is set as the outside air cutoff range, and the air or the like in the outside air cutoff range is forcibly sucked to form a vacuum state. One or both moldings may be used in combination.
The above-described release film molding and vacuum elongation molding may be appropriately selected and performed in this embodiment.
[0030]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .
[0031]
【The invention's effect】
According to the present invention, a substrate on which a plurality of semiconductor chips as electronic parts are mounted is made of a resin material which is uniformly pressed in a resin molding die, so that voids or unfilled products can be obtained. The present invention has an excellent effect of providing a method and an apparatus for resin-encapsulating and molding electronic parts, which efficiently prevent the product failure and improve the productivity of the product.
[Brief description of the drawings]
FIG. 1 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding apparatus for an electronic component according to the present invention, and shows a state in which a substrate on which an electronic component is mounted is collectively molded.
FIG. 2 is a schematic enlarged longitudinal sectional view of a main part of the apparatus corresponding to FIG. 1, and shows a state in which a substrate on which electronic components are mounted is collectively molded;
FIG. 3 is a schematic enlarged longitudinal sectional view which is a first feature of the main part of the apparatus leading to FIG. 1 (1), and supplies a resin material into the mold after uniformly pressing the resin material. The state is shown step by step.
4 is a schematic enlarged longitudinal sectional view of a main part of the apparatus corresponding to FIG. 3, and shows a state in which a resin material is supplied into the mold after being uniformly pressed.
FIG. 5 is a schematic enlarged longitudinal sectional view which is a second feature of the main part of the apparatus leading to FIG. 1 (1), and shows a state in which a resin material is uniformly pressed in the mold. Shown in
FIG. 6 is a schematic enlarged vertical cross-sectional view showing a third feature of the main part of the apparatus from FIG. 1 (1) to FIG. 1 (2), wherein uniform pressurization in the mold is performed. FIG. 6 shows a state in which the resin is heated and melted by a heating unit that is not in contact with the resin material.
[Explanation of symbols]
1 Upper type
2 lower mold
3 Upper mold surface
4 Lower mold surface
5 Board fixing means
6 Cavity forming part
7 Resin material supply mechanism
8 Mold heating mechanism
9 Substrate
10 Semiconductor chip
11 wires
12 Resin molding
13 Peripheral part of substrate
14 Granule resin (resin material)
15 molten resin
16 Cured resin
17 Resin molded substrate (product)
18 Resin supply space
19 Frame body
20 opening and closing part
21 ・ 25 Pressurizing means
22 ・ 24 Resin pressing surface
23 Resin pressure unit
26 heating means
27 Heating board
28 heater
29 Insulation board

Claims (4)

電子部品の樹脂封止成形用金型を用いて、前記金型における上型の所定位置に電子部品を装着した基板を装着固定した状態で、前記金型における少なくとも下型に形成されたキャビティ形成部に樹脂材料供給機構で供給された樹脂材料を少なくとも前記下型に備えた金型加熱機構で加熱溶融化して、前記金型を型締めすることで前記した加熱溶融化された樹脂材料に前記電子部品を浸漬内包する電子部品の樹脂封止成形方法であって、
前記した金型の型開き時において、
前記した樹脂材料供給機構にある樹脂材料を樹脂加圧用の加圧手段で均一に加圧した後に、当該樹脂材料を前記した樹脂材料供給機構からキャビティ形成部に供給する工程と、
前記した樹脂材料を前記した樹脂材料供給機構からキャビティ形成部へ供給した後に、樹脂加圧用の前記加圧手段もしくは別の加圧手段にて当該樹脂材料を均一に加圧する工程とを、
適宜に組合わせることによって、前記した均一に加圧された樹脂材料を用いることを特徴とする電子部品の樹脂封止成形方法。Forming a cavity formed in at least the lower mold in the mold, with the board on which the electronic component is mounted being fixed at a predetermined position of the upper mold in the mold using a resin sealing mold for the electronic component. The resin material supplied by the resin material supply mechanism to the portion is heated and melted by at least the mold heating mechanism provided in the lower mold, and the heat-fused resin material is heated and melted by clamping the mold. A resin sealing molding method of an electronic component that includes an electronic component by immersion,
At the time of opening the mold described above,
After uniformly pressing the resin material in the resin material supply mechanism with the pressurizing means for resin pressing, supplying the resin material from the resin material supply mechanism to the cavity forming portion,
After supplying the resin material to the cavity forming portion from the resin material supply mechanism, a step of uniformly pressing the resin material with the pressing means or another pressing means for pressing the resin.
A resin sealing molding method for an electronic component, characterized by using the above-mentioned uniformly pressurized resin material by appropriately combining. 前記した金型の型開き時において、前記したキャビティ形成部に均一に加圧された当該樹脂材料と非接触状態で樹脂材料用の加熱手段にて当該樹脂材料を加熱溶融化することを特徴とする請求項１に記載の電子部品の樹脂封止成形方法。When the mold is opened, the resin material is heated and melted by heating means for the resin material in a non-contact state with the resin material uniformly pressed in the cavity forming portion. The resin sealing molding method for an electronic component according to claim 1. 電子部品の樹脂封止成形用金型と、前記した金型における上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、前記した金型における少なくとも下型に形成された前記電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、前記したキャビティ形成部に当該樹脂材料を供給する樹脂材料供給機構と、前記したキャビティ形成部に供給された樹脂材料を加熱溶融化する前記金型に備えた金型加熱機構とを含む電子部品の樹脂封止成形装置であって、
前記した金型の型開き時において、
前記したキャビティ形成部に樹脂材料を供給する前に当該樹脂材料を均一に加圧する樹脂材料用の加圧手段と、前記したキャビティ形成部に樹脂材料を供給した後に当該樹脂材料を均一に加圧する樹脂材料用の前記した加圧手段もしくは別の加圧手段とを、適宜に組み合わせて設けたことを特徴とする電子部品の樹脂封止成形装置。A resin sealing mold for the electronic component, substrate fixing means for mounting and fixing a substrate on which the electronic component is mounted at a predetermined position of the upper mold in the mold, and at least a lower mold in the mold; A cavity forming section for resin molding in which the electronic component is fitted and set; a resin material supply mechanism for supplying the resin material to the cavity forming section; and a heat melting of the resin material supplied to the cavity forming section. A resin heating molding device for an electronic component including a mold heating mechanism provided in the mold,
At the time of opening the mold described above,
Pressurizing means for a resin material for uniformly pressing the resin material before supplying the resin material to the cavity forming portion, and uniformly pressing the resin material after supplying the resin material to the cavity forming portion. A resin sealing and molding apparatus for an electronic component, wherein the above-mentioned pressing means or another pressing means for a resin material is provided in an appropriate combination. 前記した金型の型開き時において、前記したキャビティ形成部に均一に加圧された当該樹脂材料と非接触状態で加熱溶融化する樹脂材料用の加熱手段を設けたことを特徴とする請求項３に記載の電子部品の樹脂封止成形装置。A heating means for a resin material which is heated and melted in a non-contact state with the resin material uniformly pressed in the cavity forming portion when the mold is opened. 4. The resin sealing molding apparatus for an electronic component according to 3.
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