JP5285737B2 - Resin sealing molding method and resin sealing molding apparatus for electronic parts - Google Patents

Description

  The present invention relates to a molding die for resin sealing molding of an electronic component typified by a semiconductor chip such as an IC, in particular, a required plurality of electronic components mounted on a substrate using a molding die for compression molding. The present invention relates to an improvement in a resin sealing molding method and a resin sealing molding apparatus for electronic parts that are compression molded with a material.

  In recent years, regardless of the type of substrate, the presence / absence of bonding, and the method, in addition to an increasing demand for larger substrates for cost reduction, the substrate tends to be thinner. In addition, there is a tendency that the wire length is increased and the wire interval is reduced due to an increase in the number of terminals of an electronic component such as an IC, particularly a semiconductor chip, a stacking of semiconductor chips, and a thinner package. For these reasons, in addition to the conventional strip-shaped substrate, it is strongly required to efficiently and collectively compress various large and thin substrates.

Hereinafter, a semiconductor chip will be described as an example of the electronic component. A plurality of required semiconductor chips mounted on the substrate are collectively compression-molded, for example, by an apparatus equipped with a two-type compression molding die having an upper mold and a lower mold. As the substrate, a strip-shaped lead frame is used, and a plurality of required semiconductor chips mounted on the substrate are collectively compression-molded with a resin material (see, for example, Patent Document 1). .
That is, when a plurality of required semiconductor chips mounted on a substrate are collectively compression-molded and resin-sealed, as disclosed in Patent Document 1, a cavity formed on the lower mold side (cavity forming portion) ) Supply the required amount of resin material. With the chip mounting side of the substrate facing downward, the substrate is supplied and set in a recess for substrate setting formed in the lower mold. In this state, by clamping the upper and lower molds, the resin material supplied into the cavity is heated and melted to form a molten resin, and then a plurality of required semiconductor chips are immersed in the molten resin in the cavity. . By curing the molten resin, the required plurality of semiconductor chips mounted on the substrate can be resin-sealed by compression molding.

JP 2004-230707 A (page 3-5, FIGS. 5 and 6)

However, according to the conventional apparatus, since a single substrate is compression-molded by using a pair of compression molds and resin-sealed, productivity in the resin-sealing process is improved. There was a limit.
Therefore, according to the present invention, two pre-molding substrates are disposed on a set of molding molds for compression molding, and the electronic components respectively mounted on the pre-molding substrates are compression molded separately and substantially simultaneously. In addition to resin sealing, one or more press units each including a set of molds are connected to each other between the in-unit and the out-unit, thereby further improving productivity in the resin sealing process. The purpose is to improve.

Therefore, in order to solve the technical problem, the resin-encapsulated molding method for an electronic component according to claim 1 of the present invention has been molded by resin-sealing a plurality of electronic components mounted on the substrate before molding. A resin sealing molding method for an electronic component for completing a substrate, comprising the following steps.
(1) Step of preparing a resin sealing molding device having at least the following components
(a) An in-unit that transports a pre-molding substrate and supplies a resin material made of granular resin, powdered resin, or liquid resin
(b) Out unit that receives molded substrate
(c) One press unit that is connected between the in-unit and the out-unit, and has a configuration that can be detachably connected to another press unit.
(d) A set of molds provided in one press unit and including at least two molds facing each other and used for compression molding a substrate before molding
(2) Supplying the pre-molding substrate to the resin sealing molding device
(3) The process of adjusting the required amount of resin material used in one resin sealing from the resin material stored in the storage unit by the adjustment unit
(4) A process of storing a required amount of resin material from the adjustment section in the storage jig
(5) The process of transferring the required amount of resin material from the storage jig to the supply mechanism
(6) A step of transferring a predetermined number of pre-molding substrates corresponding to the cavities provided in either of the two molds to the supply mechanism among the supplied pre-molding substrates
(7) By moving the supply mechanism from the in-unit, a required amount of resin material is supplied and set at a predetermined position of a set of molds, and a predetermined number of resin materials are set at predetermined positions of the set of molds. Process to supply and set the substrate before molding
(8) A state in which the cavity is substantially filled with a molten resin produced by heating a required amount of resin material made of granular resin or powder resin, or with a required amount of resin material made of liquid resin. Process
(9) A step of immersing a plurality of electronic components in molten resin or liquid resin by clamping a set of molds
(10) A step of completing a predetermined number of molded substrates by curing a molten resin or a liquid resin to form a cured resin.
(11) Opening a set of molds
(12) Step of taking out a predetermined number of molded substrates from a set of molds using the take-out mechanism

According to a second aspect of the present invention, there is provided a resin sealing molding method for an electronic component that completes a molded substrate by resin sealing a plurality of electronic components mounted on the substrate before molding. This is a method of molding, characterized by comprising the following steps.
(1) Step of preparing a resin sealing molding device having at least the following components
(a) An in-unit that transports a pre-molding substrate and supplies a resin material made of granular resin, powdered resin, or liquid resin
(b) Out unit that receives molded substrate
(c) A plurality of press units detachably connected to each other between the in-unit and the out-unit
(d) A set of molding dies provided in each of the plurality of press units, including at least two opposing molds and used for compression molding of the substrate before molding.
(2) Supplying the pre-molding substrate to the resin sealing molding device
(3) The process of adjusting the required amount of resin material used in one resin sealing from the resin material stored in the storage unit by the adjustment unit
(4) A process of storing a required amount of resin material from the adjustment section in the storage jig
(5) The process of transferring the required amount of resin material from the storage jig to the supply mechanism
(6) A step of transferring a predetermined number of pre-molding substrates corresponding to the cavities provided in either of the two molds to the supply mechanism among the supplied pre-molding substrates
(7) By moving the supply mechanism from the in-unit, a required amount of resin material is supplied and set at a predetermined position of a set of molds, and a predetermined number of resin materials are set at predetermined positions of the set of molds. Process to supply and set the substrate before molding
(8) A state in which the cavity is substantially filled with a molten resin produced by heating a required amount of resin material made of granular resin or powder resin, or with a required amount of resin material made of liquid resin. Process
(9) A step of immersing a plurality of electronic components in molten resin or liquid resin by clamping a set of molds
(10) A step of completing a predetermined number of molded substrates by curing a molten resin or a liquid resin to form a cured resin.
(11) Opening a set of molds
(12) Step of taking out a predetermined number of molded substrates from a set of molds using the take-out mechanism

  According to a third aspect of the present invention, there is provided a resin sealing molding method for an electronic component according to the above-described resin sealing molding method, wherein the required amount of the resin material is such that the molten resin or liquid resin substantially fills the cavity. It consists of the required amount.

  According to a fourth aspect of the present invention, there is provided a resin sealing molding method for an electronic component, wherein in the resin sealing molding method described above, two cavities are provided in one of the two molds, and each of the two cavities is provided. One pre-molding substrate corresponds.

  According to a fifth aspect of the present invention, there is provided a resin seal molding method for an electronic component, wherein the two cavities are each a vertically movable sliding member that forms the bottom surface of the cavity. And a clamp member that can freely move up and down surrounding the sliding member. In the step of immersing a plurality of electronic components, the two sliding members and the clamp member surrounding the sliding member are moved up and down, respectively. The clamping members surrounding the sliding members clamp the two pre-molded substrates, respectively, and equalize the pressure by which the two sliding members pressurize the molten resin or liquid resin in the two cavities, respectively. Features.

  According to a sixth aspect of the present invention, there is provided a resin sealing molding method for an electronic component, wherein in the step of immersing a plurality of electronic components in the resin sealing molding method described above, two slides are provided in each press unit. The adjusting means for supporting the moving member is rotated according to the amount of molten resin or liquid resin in the two cavities.

  According to a seventh aspect of the present invention, there is provided a resin sealing molding method for an electronic component, wherein in the above-described resin sealing molding method, one press unit or a plurality of press units are traversed between the in-unit and the out-unit. The supply mechanism is moved and the take-out mechanism is moved along each of the transport rails provided.

  Moreover, the resin sealing molding method of the electronic component which concerns on Claim 8 of this invention is a resin sealing molding method mentioned above WHEREIN: A several electronic component is immersed from the process which makes a cavity the substantially satisfy | filled state. And at least a part of the period, including a step of interposing a sealing member between two mold surfaces so as to block the inside of the cavity from the outside air, and a step of evacuating the inside of the cavity. And

  According to a ninth aspect of the present invention, there is provided a resin seal molding method for an electronic component comprising: a step of stretching a release film between mold surfaces of two molds; and a mold in a cavity in the resin seal molding method described above. And a step of covering the surface with a release film.

  According to a tenth aspect of the present invention, there is provided a resin sealing molding method for an electronic component, wherein the intermediate mold provided between the two molds is moved up and down separately from the two molds in the resin sealing molding method described above. It is characterized by providing.

  According to an eleventh aspect of the present invention, there is provided an electronic component resin-sealing and molding apparatus for resin-molding an electronic component that completes a molded substrate by resin-sealing a plurality of electronic components mounted on a pre-molding substrate. An apparatus for supplying a substrate before molding, aligning and transferring the substrate before molding, and a resin material for storing and supplying at least a resin material made of granular resin, powder resin, or liquid resin An in unit having a mechanism, an out unit having a molded substrate mechanism for transferring and receiving a molded substrate, a single press unit connected between the in unit and the out unit, and the in unit and the out unit. A conveyance rail provided across the one press unit between the units, a press mechanism provided in one press unit, and a press mechanism. Each of the molds includes at least two molds opposite to each other and is used for compression molding a predetermined number of pre-molding substrates and one of the two molds. A cavity substantially filled with a molten resin generated from a resin or a powdered resin or a liquid resin, and a resin material and a predetermined number of pre-molding substrates are separately and substantially simultaneously supplied to a set of molds. A supply mechanism, a take-out mechanism for taking out a predetermined number of molded substrates from between a set of molds separately and substantially simultaneously, and a control mechanism for controlling the entire resin sealing molding apparatus, The press unit compresses and molds a plurality of electronic components mounted on a predetermined number of pre-molding substrates in a set of molding dies for each of a predetermined number of pre-molding substrates. Smell One press unit is detachably connected to the in unit and the out unit, and has a configuration that can be detachably connected to another press unit. Each of the resin material mechanisms is provided so as to be able to reciprocate along the transport rail. The resin material mechanism includes a storage portion for storing the resin material and a required amount of the resin material out of the stored resin material. And an adjustment unit that adjusts and supplies a required amount of the resin material to the housing jig, and the required amount of the resin material is a molten resin or liquid in a predetermined number of cavities corresponding to a predetermined number of pre-molding substrates. It is the amount of resin material that is necessary for the resin to be substantially filled and used in a single resin sealing, and the storage jig that contains the required amount of resin material is transferred to the supply mechanism and supplied Mechanism required The resin material is supplied and set to a predetermined position of a set of molds, and a predetermined number of pre-molding substrates are supplied and set to a predetermined position of a set of molds, and the predetermined number is one. It is characterized by being one or more than two.

  According to a twelfth aspect of the present invention, there is provided an electronic component resin-sealing and molding apparatus for resin-sealing molding of an electronic component that completes a molded substrate by resin-sealing a plurality of electronic components mounted on a substrate before molding. An apparatus for supplying a substrate before molding, aligning and transferring the substrate before molding, and a resin material for storing and supplying at least a resin material made of granular resin, powder resin, or liquid resin An in-unit having a mechanism, an out-unit having a formed-substrate mechanism for transferring, receiving, and storing a molded substrate, a plurality of press units connected between the in-unit and the out-unit, and the in-unit A transport rail provided across the plurality of press units between the out unit, a press mechanism provided in the plurality of press units, and a press machine Each of which includes at least two molds facing each other, and is provided in one of the two molds and a set of molds used when compression molding a predetermined number of pre-molding substrates, and is in a granular form A cavity substantially filled with a molten resin generated from a resin or a powdered resin or a liquid resin, and a resin material and a predetermined number of pre-molding substrates are separately and substantially simultaneously supplied to a set of molds. A supply mechanism, a take-out mechanism for taking out a predetermined number of molded substrates from a set of molds separately and substantially simultaneously, and a control mechanism for controlling the entire resin sealing molding apparatus, The press unit compresses and molds a plurality of electronic components mounted on a predetermined number of pre-molding substrates on a predetermined number of pre-molding substrates in a set of molds. With A plurality of press units are detachably connected to each other, and the supply mechanism and the take-out mechanism are provided so as to reciprocate along the transport rail, respectively, A storage unit that stores the resin material, and an adjustment unit that adjusts the required amount of the resin material from the stored resin material and supplies the required amount of the resin material to the storage jig. The resin material is an amount necessary for the molten resin or liquid resin to substantially fill a predetermined number of cavities corresponding to a predetermined number of pre-molding substrates, and is an amount used for a single resin sealing. A storage jig that is a resin material and contains a required amount of resin material is transferred to a supply mechanism, and the supply mechanism supplies and sets the required amount of resin material to a predetermined position of a set of molds, and A set of pre-molded substrates Supplying and setting to a predetermined position of the mold, the predetermined number is one or three or more.

  According to a thirteenth aspect of the present invention, there is provided a resin seal molding apparatus for an electronic component, wherein the sealing member provided between the mold surfaces of two molds and at least two molds are clamped. And a vacuum unit that evacuates the inside of the cavity.

  According to a fourteenth aspect of the present invention, there is provided a resin seal molding apparatus for an electronic component comprising the above-described resin seal molding apparatus, comprising a film unit that stretches and supplies a release film between mold surfaces of two molds. The mold surface in the cavity is covered with a release film.

  According to a fifteenth aspect of the present invention, there is provided a resin seal molding apparatus for an electronic component according to the above-described resin seal molding apparatus, comprising an intermediate mold provided between two molds, and the intermediate mold is defined as two molds. It is characterized by moving up and down separately.

  According to a sixteenth aspect of the present invention, there is provided a resin sealing molding apparatus for an electronic component, wherein the pre-molding substrate mechanism and the molded substrate mechanism have a common mechanism in the above-described resin sealing molding apparatus. .

According to the present invention, in the resin sealing molding apparatus (1), one or a plurality of press units (7) each including a set of molding dies (5) are connected to an in-unit (4) and an out-unit (9). The structure of connecting between the two is adopted. As a result, the present invention has an excellent effect that the productivity in the resin sealing process can be further improved.
Further, according to the present invention, two pre-molding substrates (17) are arranged in a set of compression-molding molds (5), and the required plural pieces respectively mounted on the pre-molding substrates (17). The individual electronic components (15) can be compression-molded individually and almost simultaneously to be resin-sealed. As a result, the present invention can improve the efficiency at the time of resin sealing, shorten the work time (cycle time) on resin molding, and improve the merit of automatic control (15 The resin sealing molding device (1) is provided with an excellent effect.
Note that the numbers in parentheses in the description of the “effects of the invention” are given for convenience of description, and indicate the reference numerals in the drawings. These numbers are not meant to limit the invention to the embodiments shown in the drawings.

Hereinafter, the present embodiment will be described in detail with reference to FIGS. 1 to 4.
FIG. 1 is a schematic plan view of a resin sealing molding apparatus for a semiconductor chip according to the present invention.
FIG. 2 is a schematic plan view of another semiconductor chip molding apparatus for semiconductor chips according to the present invention.
FIG. 3 is an AA cross-sectional line of the apparatus corresponding to FIG. 1, and shows a mold open state of a pair of compression molds mounted on the apparatus.
FIG. 4 is an AA cross-sectional line of the apparatus corresponding to FIG. 1 and shows a clamped state of a pair of compression molds mounted on the apparatus.
The pair of mold structures shown in FIGS. 3 and 4 show one embodiment.

In light of the recent trend that, in addition to strip-shaped substrates, there is a strong need to efficiently and collectively encapsulate various large and thin substrates, various substrates can be packaged together. In order to perform resin sealing molding, for example, an apparatus equipped with a molding die for compression molding equipped with a two-type structure including one die (upper die) and the other die (lower die) is used.
Conventionally, a single substrate is compression-molded with a pair of compression-molding molds and resin-sealed, but in this embodiment, two compression-molding molds are used. A configuration for efficiently compressing and molding a single substrate will be described.

The resin sealing molding apparatus 1 according to the present invention is provided with the following components. First, as shown in FIG. 1, an in-unit 4 having a pre-molding substrate mechanism 2 and a resin material mechanism 3 is provided. The pre-molding substrate mechanism 2 supplies, aligns, and transports a pre-molding substrate 17 before resin sealing molding, which is a pre-molding material. The resin material mechanism 3 stores and supplies a resin material 18 which is a pre-molding material and is used at the time of sealing molding.
One press unit 7 is detachably attached to the in-unit 4. The press unit 7 has a press mechanism 6 on which a transfer die 5 is mounted. The mold 5 is a pair of resin-sealing molds composed of an upper mold 5a and a lower mold 5b facing each other (see FIG. 3).
An out unit 9 is detachably attached to the press unit 7. The out unit 9 includes a molded substrate mechanism 8 that transfers, receives, and stores a molded substrate 20 after resin sealing molding that is resin-sealed by compression molding in the molding die 5.
A transport rail 10 is provided across the in unit 4, the press unit 7, and the out unit 9. The transport rail 10 is provided with a supply mechanism 11 and a take-out mechanism 12 so as to reciprocate along the transport rail 10. The supply mechanism 11 separates the two pre-molding substrates 17 and the resin material 18 which are pre-molding materials into the molding die 5 (between the upper die 5a and the lower die 5b shown in FIG. 3) and Supply almost simultaneously. The take-out mechanism 12 takes out the two molded substrates 20 out of the mold 5 separately and substantially simultaneously.
In addition, a control mechanism (not shown) for controlling the entire resin sealing molding apparatus 1 is provided.

  Further, according to the resin sealing molding apparatus 1 according to the present invention, in order to further improve the productivity in the resin sealing process, the required number of, for example, four press units 7 are provided instead of one. Can do. FIG. 2 shows another example of the resin sealing molding apparatus 1 in which four press units 7 are connected and arranged between the in unit 4 and the out unit 9. According to this example, in a single resin sealing step, four sets of molds 5 (see FIG. 3) composed of a pair of upper molds 5a and lower molds 5b are used to form two to eight sheets before molding. The substrate 17 can be compression-molded and resin-sealed separately and almost simultaneously.

Further, as shown in FIGS. 1 and 2, the resin sealing molding apparatus 1 according to the present invention includes a film unit 13 for supplying a release film to be supplied between the mold surfaces of the molding die 5; A vacuum unit can be provided for interposing a sealing member between the mold surfaces of the mold 5 and evacuating the mold 5 with the outside air shut off during resin sealing molding. That is, it is possible to carry out by selecting the release film forming and the vacuum drawing (reducing pressure) forming, or selecting both of them. However, in the present embodiment, description is made without using the film unit 13 and the vacuum unit.
In the case where the release film forming and the vacuum drawing forming are performed in combination, the intermediate die is not shown but not the forming die 5 having a two-type structure composed of the upper die 5a and the lower die 5b. A set of molds having a three-type structure can be used. Then, the intermediate mold can be moved up and down individually using an intermediate mold fixing mechanism for driving the intermediate mold different from the press mechanism 6.

The pre-molding material means the pre-molding substrate 17 and the required amount of the resin material 18. As shown in FIG. 3, the pre-molding substrate 17 includes, for example, a substrate main body 14 and a required plural number (in this case, two rows × four total eight) mounted on a predetermined portion on the substrate main body 14. And a plurality of wires 16 for electrically connecting the substrate body 14 and the semiconductor chip 15. The required amount of resin material 18 is a resin material (in this case, granular resin) for compression-molding the pre-molding substrate 17 separately and almost simultaneously. On the other hand, the post-molding material means a molded substrate 20 having a cured resin 19 produced from the resin material 18 as a raw material, as shown in FIG.
In addition to the wire bonding substrate, a flip chip substrate, a wafer substrate used for manufacturing a wafer level package, or the like is adopted as the substrate body 14 on which a required plurality of semiconductor chips 15 are mounted. As for the shape of the substrate body 14, an arbitrary shape such as a circular shape or a polygonal shape is adopted in addition to the strip shape. As the material of the substrate body 14, an arbitrary metal lead frame, a printed circuit board made of an arbitrary plastic, ceramic, glass, or other material called a PC board, or the like is employed. And about the resin material 18, arbitrary tablet-like resin, liquid resin, powdery resin, etc. other than granular resin are employ | adopted.

In the pre-molding substrate mechanism 2 of the in-unit 4, the substrate supply unit 21 that supplies the pre-molding substrate 17 and the two pre-molding substrates 17 transferred from the substrate supply unit 21 are aligned substantially in parallel at a predetermined interval. There are provided a substrate alignment unit 22 to be transferred and a substrate transfer unit 23 for transferring the pre-molding substrate 17 aligned by the substrate alignment unit 22 to the supply mechanism 11.
The in-unit 4 resin material mechanism 3 includes an appropriate storage portion (not shown) such as a resin stocker for storing the resin material 18, and two pre-molding substrates 17 used in a single resin sealing step. Corresponding to the above, an appropriate adjustment section (not shown) that can adjust the resin material 18 to a required amount is provided. The adjustment unit has at least a function of supplying the resin material 18 to a housing jig (not shown) such as a resin tray.
In the molded substrate mechanism 8 of the out unit 9, a substrate transfer unit 24 that receives and transfers two molded substrates 20 from the take-out mechanism 12, and two molded substrates 20 that are transferred by the substrate transfer unit 24. And a product storage unit 26 in which the two molded substrates 20 transferred from the substrate reception unit 25 are finally stored.
The pre-molding substrate mechanism 2 of the in-unit 4 and the molded substrate mechanism 8 of the out-unit 9 have a difference between before the resin sealing molding and after the resin sealing molding, but before the molding including the substrate body 14 respectively. The substrate 17 and the molded substrate 20 are targeted. Therefore, the pre-molding substrate mechanism 2 and the molded substrate mechanism 8 are configured such that the same mechanism form can be adopted. With this configuration, it is possible to reduce the cost by sharing the parts used for each mechanism in the resin sealing molding apparatus 1.

  Here, a series of resin sealing steps for completing the molded substrate 20 by resin sealing a plurality of semiconductor chips 15 included in the pre-molding substrate 17 using the resin sealing molding apparatus 1 according to the present embodiment. Will be described with reference to FIGS.

In the pre-molding substrate mechanism 2 of the in-unit 4, first, an appropriate means such as a pusher (not shown) is provided from the in-magazine 27 provided in the substrate supply unit 21 and containing the required number of pre-molding substrates 17 to the substrate alignment unit 22. ) To transfer the two pre-molding substrates 17 individually or substantially simultaneously.
Next, in the substrate alignment unit 22, the two pre-molding substrates 17 are set in a predetermined manner corresponding to a predetermined position and a predetermined interval where the two pre-molding substrates 17 are supplied to the molding die 5 and set. Aligned substantially parallel at predetermined intervals in position.
Next, the two pre-molding substrates 17 are transferred individually or substantially simultaneously from the substrate alignment unit 22 to the supply mechanism 11 using a pickup means (not shown) provided in the substrate transfer unit 23. On the other hand, in the resin material mechanism 3 of the in-unit 4, the adjustment unit adjusts the resin material 18 for compressing and molding the two pre-molding substrates 17 to the required amount. Then, a required amount of the resin material 18 is accommodated in each resin tray, and the resin material 18 is transferred to the supply mechanism 11 individually or substantially simultaneously.
Through the steps so far, at the supply position X in the region of the in-unit 3, the supply mechanism 11 has a required amount corresponding to the two pre-molding substrates 17 on the upper surface side and the two pre-molding substrates 17 on the lower surface side. Each of the resin materials 18 is held.
Next, the transport rail from the in-unit 3 to a position where the supply mechanism 11 can enter / exit between the upper mold 5a and the lower mold 5b mounted on the press unit 7 (see FIG. 3) (entry / exit position Y). The supply mechanism 11 is moved along the line 10.
Next, the supply mechanism 11 is moved in the direction orthogonal to the transport rail 10 to enter between the upper mold 5a and the lower mold 5b. The two pre-molding substrates 17 held by the supply mechanism 11 and the required amount of the resin material 18 corresponding to the two pre-molding substrates 17 are placed at predetermined positions on the mold 5 separately and substantially simultaneously. Supply and set. The required amount of the resin material 18 is supplied to a cavity (see the cavity 37 in FIG. 3) provided in the lower mold 5b. Thereafter, the resin material 18 is heated and melted to produce a molten resin 44 (see FIG. 4). The supply mechanism 11 is retracted from between the upper mold 5a and the lower mold 5b, moved to the supply position X along the transport rail 10 via the entry / exit position Y, and waits.
Next, as shown in FIG. 4, the upper mold 5a and the lower mold 5b are clamped. Thus, the plurality of semiconductor chips 15 included in the pre-molding substrate 17 are immersed in the molten resin 44 in the cavity 37 provided in the lower mold 5b. By curing the molten resin 44, the cured resin 19 (see FIGS. 1 and 2) is formed. Through the steps so far, the plurality of semiconductor chips 15 included in the two pre-molding substrates 17 are resin-sealed by compression molding in the mold 5 separately and substantially simultaneously. Thereby, the two molded substrates 20 are completed.
After the supply mechanism 11 is moved to the supply position X (see FIG. 1), the take-out mechanism 12 enters along the transport rail 10 so that the two completed molded substrates 20 can be taken out of the mold 5. Move to the exit position Y and wait. Then, the upper mold 5a and the lower mold 5b in FIG. 4 are opened.
Next, the take-out mechanism 12 of FIG. 1 is moved in the direction orthogonal to the transport rail 10 from the entry / exit position Y to enter between the upper mold 5a and the lower mold 5b. Using the take-out mechanism 12, the two formed substrates 20 are taken out from the mold 5, and the two taken-out formed substrates 20 are held on the upper portion of the take-out mechanism 12. Then, the take-out mechanism 12 is moved backward from between the upper mold 5a and the lower mold 5b to the entry / exit position Y.
Next, in a state where the take-out mechanism 12 holds the two molded substrates 20, the take-out mechanism 12 is moved along the transport rail 10 from the press unit 7 to the area of the out unit 9 (delivery position Z). .
Next, the two molded substrates 20 held by the take-out mechanism 12 located at the delivery position Z are individually or substantially omitted using pickup means (not shown) provided in the substrate transfer unit 24. At the same time, the substrate is transferred to the substrate receiving unit 25.
Next, two sheets are formed by using an appropriate means (not shown) such as a pusher from the substrate receiving section 25 to the out magazine 28 that is provided in the product storage section 26 and stores the required number of molded substrates 20. The finished substrates 20 are transferred or stored individually or substantially simultaneously.
Therefore, using the resin sealing molding apparatus 1 according to the present embodiment, the plurality of semiconductor chips 15 included in the two pre-molding substrates 17 are resin-sealed by compression molding, and the two molded substrates 20 are molded. A series of resin sealing steps to complete the process can be carried out continuously or intermittently. This resin sealing step may include inspection and preheating.

Here, the components of the press mechanism 6 of the press unit 7 and the mold 5 (upper mold 5a and lower mold 5b) will be described in detail below with reference to FIGS.
3 and FIG. 4, the mounting rod 39, the elastic member 40, the tip portion 41, and the adjusting means 42, which will be described later, constitute one embodiment. However, the present invention is not limited to this.

  The press mechanism 6 includes a fixed plate 29 on which the upper die 5a is fixed, a movable plate 30 on which the lower die 5b is mounted, and a plurality of required plates (in this case, four plates) that support the fixed plate 29 and the movable plate 30. A post 31) and a mold clamping means 32 for sliding the movable plate 30 up and down along the post 31. Using the mold clamping means 32, the movable platen 30 on which the lower mold 5 b is placed can be slid up and down along the post 31. Then, for example, an arbitrary cylinder, a motor, or the like that is a driving source of the mold clamping unit 32 can be appropriately selected and disposed in a space region formed below the movable platen 30.

The upper mold 5a is provided with a substrate fixing portion 34 for fixing the two pre-molding substrates 17 or the two molded substrates 20 at predetermined positions on the mold surface (upper mold surface 33) of the upper mold 5a. ing. The pre-molding substrate 17 or the molded substrate 20 is fixed to a predetermined position on the mold surface (upper mold surface 33) of the upper mold 5a with the semiconductor chip 15 facing downward.
The lower mold 5b is provided with the following components. There are clamp members 35 that clamp the outer periphery of the two pre-molded substrates 17 or the two molded substrates 20 (except for the portion of the cured resin 19), in other words, the portion where the substrate body 14 is exposed. Is provided. Appropriate elastic members 36 made of arbitrary springs or the like for sliding the clamp members 35 individually and elastically are provided. Along with each clamp member 35, a cavity 37 is formed separately, and a sliding member 38 that slides separately is provided. The top surface of each sliding member 38 constitutes the inner bottom surface of each cavity 37. On the bottom surface of each sliding member 38, there are provided mounting rods 39 separately attached in the vertical direction shown in FIG. In order to elastically slide each sliding member 38, an appropriate elastic member 40 made of an arbitrary spring or the like wound around each mounting rod 39 is provided.
Furthermore, the movable plate 30 abuts the tip 41 having a smooth curved portion of each mounting bar 39 provided on the lower mold 5b, and the resin material 18 supplied into each cavity 37 is slid. An adjusting means 42 is provided for adjusting so as to be pressed with a required pressure via the moving member 38. The adjusting means 42 moves up and down together with the movable platen 30. In addition, the adjusting means 42 slides each sliding member 38 when the mold 5 is clamped, so that the resin material 18 is adjusted with a pressure adjusted uniformly through each sliding member 38. Press. As a result, the semiconductor chips 15 mounted on the two pre-molding substrates 17 can be resin-sealed by compression molding with equal pressure separately and substantially simultaneously.
According to each of the sliding members 38 and the adjusting means 42, each sliding member 38 is elastically supported by each elastic member 40 when the mold 5 shown in FIG. The top surface of each sliding member 38 (inner bottom surface in each cavity 37) stands by at a position (resin material supply position P) before a required amount of resin material 18 is supplied. The resin material supply position P is a position where the top surface of the sliding member 38 is the lowest in the relative positional relationship between the clamp member 35 and the sliding member 38.
On the other hand, when the mold 5 shown in FIG. 4 is clamped, the top surface of each sliding member 38 (the inner bottom surface in each cavity 37) is raised by sliding the sliding members 38 respectively. It rises to a position (cavity formation position Q) where each cavity 37 corresponding to the cured resin 19 of the finished substrate 20 is formed. By the adjusting means 42, each sliding member 38 presses the molten resin 44 in each cavity 37 with an equal pressure, and in this state, each sliding member 38 rises. Specifically, when there is a slight increase or decrease in the amount of the resin material 18 supplied to each cavity 37, in other words, when there is a slight difference in the amount of each molten resin 44, depending on the difference The adjusting means 42 is slightly rotated. Thereby, the top surface of each sliding member 38 (the inner bottom surface in each cavity 37) moves up and down slightly via each sliding member 38. Therefore, even when there is a slight difference in the amount of the molten resin 44 in each cavity 37, the adjustment means 42 can be used to adjust the molten resin 44 to be pressed with an equal pressure.

  Here, using the resin sealing molding apparatus 1 according to the present embodiment, the two pre-molding substrates 17 are compression-molded on the two molded substrates 20 separately and substantially simultaneously to be resin-sealed. The implementation method will be described below with reference to FIGS. 3 and 4.

First, as shown in FIG. 3, in a state where the upper mold 5a and the lower mold 5b are opened, the supply mechanism 11 is used to correspond to the two pre-molding substrates 17 and the two pre-molding substrates 17. A quantity of resin material 18 is fed into the mold 5 separately and substantially simultaneously. Specifically, each pre-molding substrate 17 is separately attached to the substrate fixing portion 34 in a state where the semiconductor chip 15 mounting side of each pre-molding substrate 17 is directed downward at a predetermined position on the upper mold surface 33. Supply and set. On the mold surface (lower mold surface 43) side of the lower mold 5b, the resin material 18 is separately supplied to each cavity 37 constituted by the clamp member 35 and the sliding member 38. At this time, each clamp member 35 is in a state in which each elastic member 36 is restored (a fully extended state), and thus stands by in a state of protruding from the lower mold surface 43. Each sliding member 38 stands by being elastically supported by each elastic member 40 at an appropriate position (resin material supply position P) where a required amount of resin material 18 can be supplied and set.
Next, the lower mold 5b placed on the movable platen 30 is raised in a state where each pre-molding substrate 17 is fixed at a predetermined position on the upper mold surface 33. Thereby, the outer periphery of each pre-molding substrate 17 is brought into contact with each clamp member 35. At this time, the action that each clamp member 35 elastically presses each pre-molding substrate 17 by each elastic member 36 does not work. Until this state is reached, the entire mold 5 is heated until a predetermined temperature necessary for melting the required amount of the resin material 18 supplied into each cavity 37 is reached. Then, each resin material 18 is melted by heating to produce a molten resin 44.
Next, as shown in FIG. 4, the lower mold 5b placed on the movable plate 30 is further raised. Thereby, the mold 5 is clamped. Since each elastic member 36 is in a contracted state when the mold 5 is clamped, each clamp member 35 is elastically supported. In this state, each clamp member 35 elastically supports (clamps) each pre-molding substrate 17, and the state is maintained.
On the other hand, each sliding member 38 slides up to a position (cavity forming position Q) where each cavity 37 corresponding to the cured resin 19 (see FIG. 1) of the molded substrate 20 is formed. By the action of the adjusting means 42, a state in which the resin material (molten resin 44) is pressed with an equal pressure through each sliding member 38 is realized as follows.
The example of FIG. 4 shows a case where the amount of the molten resin 44 on the left side is slightly larger than the amount of the molten resin 44 on the right side. Due to the difference in the amount of the molten resin 44 between the left side and the right side, the left sliding member 38 and the mounting rod 39 are slightly lowered. Accordingly, the adjusting means 42 that comes into contact with the tip 41 of the left mounting rod 39 rotates slightly counterclockwise with respect to the shaft support portion. As a result, the adjusting means 42 substantially lowers slightly at the portion that abuts against the tip 41 of the left mounting bar 39. Then, the adjustment means 42 substantially rises slightly at the portion that abuts on the tip 41 of the right mounting bar 39. Therefore, the adjusting means 42 is slightly inclined upward. At this time, the left sliding member 38 is slightly lowered and the right sliding member 38 is slightly raised according to the inclined adjusting means 42. Therefore, when the mold 5 is clamped, the resin material 18 can be pressed and adjusted with equal pressure in the cavity 37 via the sliding members 38. As a result, the semiconductor chips 15 mounted on the two pre-molding substrates 17 can be resin-sealed by compression molding with equal pressure separately and substantially simultaneously.

Next, although not shown, the mold 5 is maintained in the clamped state shown in FIG. Then, the time required for curing the molten resin 44 in each cavity 37 is allowed to elapse. Thereby, the molten resin 44 is cured to form the cured resin 19 (see FIGS. 1 and 2), and finally two molded substrates 20 are completed.
Next, although not shown, the two molded substrates 20 are surfaces (cavities 37) formed by the top surface of the sliding member 38 and the inner surface of each clamp member 35 positioned on both sides of the sliding member 38. The mold is released from the forming surface. First, from the state in which each clamp member 35 clamps the substrate body 14 in the molded substrate 20, the top surface of each slide member 38 moves from the cavity formation position Q (see FIG. 4) to the resin material supply position P (see FIG. 3). The lower mold 5b placed on the movable platen 30 is lowered until it moves to. Next, the lower mold 5b is further lowered to perform the mold opening operation. Accordingly, each clamp member 35 that clamps the substrate body 14 (see FIG. 4) in each molded substrate 20 is separated from the substrate body 14. At this stage, the molded substrate 20 is fixed at a predetermined position of the upper mold surface 33, and the resin material 18 is removed from the state shown in FIG. 3 on the lower mold 5b side. Become. Thereafter, the two molded substrates 20 are taken out between the upper die 5a and the lower die 5b using the take-out mechanism 12 (see FIGS. 1 and 4).

The resin sealing molding apparatus 1 that performs the resin sealing molding method of the semiconductor chip 15 in the present embodiment has been described above. According to the resin sealing molding apparatus 1, a required number of press units 7 each having a set of molding dies 5 for compression molding are arranged to be connected between the in-unit 4 and the out-unit 9. This can further improve productivity in the resin sealing step.
Further, after the series of resin sealing steps described above, two pre-molding substrates 17 are arranged with respect to a set of molds 5 for compression molding. A plurality of semiconductor chips 15 included in 17 are resin-sealed by compression molding. Thus, two molded substrates 20 can be completed through a series of resin sealing steps. Then, the above-described control unit can perform the series of resin sealing steps continuously or intermittently by appropriately changing the operation and stopping.
Even when there is a slight difference in the amount of the molten resin 44 in each cavity 37, the adjustment means 42 can be used to adjust the molten resin 44 to be pressed with an equal pressure.

FIG. 1 is a schematic plan view of a resin sealing molding apparatus for a semiconductor chip according to the present invention. FIG. 2 is a schematic plan view of another semiconductor chip molding apparatus for semiconductor chips according to the present invention. FIG. 3 is an AA cross-sectional line of the apparatus corresponding to FIG. 1, and shows a mold open state of a pair of compression molds mounted on the apparatus. FIG. 4 is an AA cross-sectional line of the apparatus corresponding to FIG. 1 and shows a clamped state of a pair of compression molds mounted on the apparatus.

DESCRIPTION OF SYMBOLS 1 Resin sealing molding apparatus 2 Mechanism before substrate 3 Mechanism for resin material 4 In unit 5 Mold 5a Upper mold 5b Lower mold 6 Press mechanism 7 Press unit 8 Molded substrate mechanism 9 Out unit 10 Transport rail 11 Supply mechanism 12 Unloading mechanism 13 Film unit (film supply mechanism unit)
14 Substrate body 15 Semiconductor chip (electronic component)
16 Wire 17 Pre-molding substrate 18 Resin material 19 Cured resin 20 Molded substrate 21 Substrate supply unit 22 Substrate alignment unit 23/24 Substrate transfer unit 25 Substrate receiving unit 26 Product storage unit 27 In magazine 28 Out magazine 29 Fixed plate 30 Movable plate 31 Post 32 Mold clamping means 33 Upper mold surface 34 Substrate fixing part 35 Clamp member 36/40 Elastic member 37 Cavity 38 Sliding member 39 Mounting rod 41 Tip part 42 Adjusting means 43 Lower mold surface 44 Molten resin P Resin material supply position Q Cavity formation position X Supply position Y Entry / exit position Z Delivery position

Claims (16)

An electronic component resin sealing molding method for completing a molded substrate by resin sealing a plurality of electronic components mounted on a pre-molding substrate, comprising the following steps: Resin sealing molding method.
(1) Step of preparing a resin sealing molding device having at least the following components
(a) An in-unit that transports the pre-molding substrate and supplies a resin material made of any of granular resin, powdered resin, or liquid resin
(b) Out unit for receiving the molded substrate
(c) One press unit connected between the in-unit and the out-unit, and having a configuration that can be detachably connected to another press unit.
(d) A set of molds provided in the one press unit and including at least two opposing molds and used for compression molding the substrate before molding
(2) supplying the pre-molding substrate to the resin sealing molding device
(3) A step of adjusting the required amount of resin material used in one resin sealing from the resin material stored in the storage unit by the adjustment unit
(4) A step of accommodating the required amount of the resin material from the adjusting portion in an accommodation jig.
(5) A step of transferring the required amount of the resin material from the housing jig to the supply mechanism
(6) a step of transferring a predetermined number of the pre-molding substrates corresponding to the cavities provided in either of the two molds to the supply mechanism among the supplied pre-molding substrates
(7) By moving the supply mechanism from the in-unit, the required amount of resin material is supplied and set to a predetermined position of the set of molds, and a predetermined position of the set of molds Supplying and setting the predetermined number of pre-molded substrates on
(8) The cavity is substantially formed by a molten resin produced by heating the required amount of resin material made of the granular resin or the powdered resin, or by the required amount of resin material made of the liquid resin. Process to be fully satisfied
(9) A step of immersing the plurality of electronic components in the molten resin or the liquid resin by clamping the set of molds
(10) The step of completing the predetermined number of the molded substrates by curing the molten resin or the liquid resin to form a cured resin.
(11) Opening the set of molds
(12) Step of taking out the predetermined number of molded substrates from the set of molds using a take-out mechanism An electronic component resin sealing molding method for completing a molded substrate by resin sealing a plurality of electronic components mounted on a pre-molding substrate, comprising the following steps: Resin sealing molding method.
(1) Step of preparing a resin sealing molding device having at least the following components
(a) An in-unit that transports the pre-molding substrate and supplies a resin material made of any of granular resin, powdered resin, or liquid resin
(b) Out unit for receiving the molded substrate
(c) A plurality of press units detachably connected to each other between the in unit and the out unit
(d) a set of molds provided in each of the plurality of press units, including at least two opposing molds and used for compression molding the pre-molding substrate
(2) supplying the pre-molding substrate to the resin sealing molding device
(3) A step of adjusting the required amount of resin material used in one resin sealing from the resin material stored in the storage unit by the adjustment unit
(4) A step of accommodating the required amount of the resin material from the adjusting portion in an accommodation jig.
(5) A step of transferring the required amount of the resin material from the housing jig to the supply mechanism
(6) a step of transferring a predetermined number of the pre-molding substrates corresponding to the cavities provided in either of the two molds to the supply mechanism among the supplied pre-molding substrates
(7) By moving the supply mechanism from the in-unit, the required amount of resin material is supplied and set to a predetermined position of the set of molds, and a predetermined position of the set of molds Supplying and setting the predetermined number of pre-molded substrates on
(8) The cavity is substantially formed by a molten resin produced by heating the required amount of resin material made of the granular resin or the powdered resin, or by the required amount of resin material made of the liquid resin. Process to be fully satisfied
(9) A step of immersing the plurality of electronic components in the molten resin or the liquid resin by clamping the set of molds
(10) The step of completing the predetermined number of the molded substrates by curing the molten resin or the liquid resin to form a cured resin.
(11) Opening the set of molds
(12) Step of taking out the predetermined number of molded substrates from the set of molds using a take-out mechanism In the resin sealing molding method of the electronic component according to claim 1 or 2,
The resin sealing molding method for electronic parts, wherein the required amount of the resin material is an amount necessary for the molten resin or the liquid resin to substantially fill the cavity. In the resin sealing molding method of the electronic component as described in any one of Claims 1-3,
Two of the cavities are provided in either of the two molds,
A resin-sealed molding method for electronic parts, wherein one of the pre-molding substrates corresponds to each of the two cavities. In the resin sealing molding method of the electronic component according to claim 4,
Each of the two cavities is constituted by a vertically movable sliding member that constitutes the bottom surface of the cavity and a vertically movable clamping member that surrounds the sliding member,
In the step of immersing the plurality of electronic components, the two sliding members and the clamp member surrounding the sliding member are moved up and down, respectively, so that the two clamping members surrounding the sliding member are two. A resin for an electronic component, characterized in that the pressure before the two sliding members pressurize the molten resin or the liquid resin in the two cavities is equalized by clamping the pre-molding substrates, respectively. Seal molding method. In the resin sealing molding method of the electronic component according to claim 5,
In the step of immersing the plurality of electronic components, in each of the press units, adjusting means for supporting the two sliding members is rotated according to the amount of the molten resin or the liquid resin in the two cavities. A resin sealing molding method for an electronic component, characterized in that it moves. In the resin sealing molding method for an electronic component according to any one of claims 1 to 6,
The supply mechanism is moved along a transport rail provided across the one press unit or the plurality of press units between the in-unit and the out-unit, and the take-out mechanism is A resin sealing molding method for an electronic component, characterized by being moved. In the resin sealing molding method for an electronic component according to any one of claims 1 to 7,
In at least a part of the period from the step of substantially filling the cavity to the step of immersing the plurality of electronic components,
A step of interposing a sealing member between the mold surfaces of the two molds to bring the inside of the cavity into an outside air blocking state;
And a step of evacuating the inside of the cavity. In the resin sealing molding method for an electronic component according to any one of claims 1 to 8,
Stretching a release film between the mold surfaces of the two molds;
And a step of coating the mold surface of the cavity with the release film. In the resin sealing molding method of the electronic component according to claim 8 or 9,
A method for resin-sealing molding of electronic parts, comprising a step of raising and lowering an intermediate mold provided between the two molds separately from the two molds. A resin-encapsulated molding apparatus for electronic components that completes a molded substrate by resin-sealing a plurality of electronic components mounted on the substrate before molding,
A mechanism for a pre-molding substrate that supplies, aligns, and transports the pre-molding substrate; and a mechanism for a resin material that stores and supplies at least a resin material made of any of granular resin, powdered resin, or liquid resin. In-unit,
An out unit having a molded substrate mechanism for transferring, receiving and storing the molded substrate;
One press unit connected between the in-unit and the out-unit;
A transport rail provided across the one press unit between the in unit and the out unit;
A press mechanism provided in the one press unit;
A set of molding dies each provided in the press mechanism and including at least two opposing molds and used for compression molding a predetermined number of the pre-molding substrates;
A cavity that is provided in one of the two molds and is substantially filled with the molten resin produced from the granular resin or the powdered resin, or with the liquid resin;
A supply mechanism for supplying the resin material and the predetermined number of pre-molding substrates separately and substantially simultaneously to the set of molds;
A take-out mechanism for taking out the predetermined number of molded substrates separately and substantially simultaneously from between the set of molds;
A control mechanism for controlling the entire resin sealing molding apparatus,
Further, the one press unit compresses a plurality of electronic components mounted on the predetermined number of pre-molding substrates in the set of molds for each of the predetermined number of pre-molding substrates almost simultaneously. And
Between the in unit and the out unit, the one press unit is detachably connected to the in unit and the out unit, and can be detachably connected to another press unit. Has a configuration,
The supply mechanism and the take-out mechanism are provided so as to reciprocate along the transport rail,
The mechanism for the resin material adjusts to a required amount of the resin material out of the stored resin material and a storage portion for storing the resin material, and supplies the required amount of the resin material to the storage jig And an adjustment unit that
The required amount of the resin material is an amount necessary for the molten resin or the liquid resin to substantially fill the predetermined number of the cavities corresponding to the predetermined number of the pre-molding substrates. The amount of resin material used in the resin sealing of
The storage jig storing the required amount of resin material is transferred to the supply mechanism,
The supply mechanism supplies and sets the required amount of the resin material to a predetermined position of the set of molds, and supplies the predetermined number of pre-molded substrates to the predetermined positions of the set of molds. Set
The predetermined number is one or three or more. A resin-encapsulated molding apparatus for electronic components that completes a molded substrate by resin-sealing a plurality of electronic components mounted on the substrate before molding,
A mechanism for a pre-molding substrate that supplies, aligns, and transports the pre-molding substrate; and a mechanism for a resin material that stores and supplies at least a resin material made of any of granular resin, powdered resin, or liquid resin. In-unit,
An out unit having a molded substrate mechanism for transferring, receiving and storing the molded substrate;
A plurality of press units connected between the in unit and the out unit;
A transport rail provided across the plurality of press units between the in unit and the out unit;
A press mechanism provided in the plurality of press units;
A set of molding dies each provided in the press mechanism and including at least two opposing molds and used for compression molding a predetermined number of the pre-molding substrates;
A cavity that is provided in one of the two molds and is substantially filled with the molten resin produced from the granular resin or the powdered resin, or with the liquid resin;
A supply mechanism for supplying the resin material and the predetermined number of pre-molding substrates separately and substantially simultaneously to the set of molds;
A take-out mechanism for taking out the predetermined number of molded substrates separately and substantially simultaneously from between the set of molds;
A control mechanism for controlling the entire resin sealing molding apparatus,
Further, the plurality of press units compress the plurality of electronic components mounted on the predetermined number of pre-molding substrates in the set of molds for each of the predetermined number of pre-molding substrates and substantially simultaneously. Molded,
Between the in unit and the out unit, the plurality of press units are detachably connected to each other,
The supply mechanism and the take-out mechanism are provided so as to reciprocate along the transport rail,
The mechanism for the resin material adjusts to a required amount of the resin material out of the stored resin material and a storage portion for storing the resin material, and supplies the required amount of the resin material to the storage jig And an adjustment unit that
The required amount of the resin material is an amount necessary for the molten resin or the liquid resin to substantially fill the predetermined number of the cavities corresponding to the predetermined number of the pre-molding substrates. The amount of resin material used in the resin sealing of
The storage jig storing the required amount of resin material is transferred to the supply mechanism,
The supply mechanism supplies and sets the required amount of the resin material to a predetermined position of the set of molds, and supplies the predetermined number of pre-molded substrates to the predetermined positions of the set of molds. Set
The predetermined number is one or three or more. In the resin sealing molding apparatus for electronic components according to claim 11 or 12,
A seal member provided between the mold surfaces of the two molds;
A resin sealing molding apparatus for electronic parts, comprising: a vacuum unit that evacuates the inside of the cavity in a state where at least the two molds are clamped. In the resin sealing molding apparatus of the electronic component as described in any one of Claims 11-13,
While having a film unit that stretches and supplies a release film between the mold surfaces of the two molds,
The resin sealing molding apparatus for electronic parts, wherein a mold surface in the cavity is covered with the release film. In the resin sealing molding apparatus for electronic components according to claim 13 or 14,
With an intermediate mold provided between the two molds,
The intermediate mold is raised and lowered separately from the two molds. In the resin sealing molding apparatus of the electronic component as described in any one of Claims 11-15,
The pre-molding substrate mechanism and the molded substrate mechanism have a common mechanism.

Images