JPH10135260A - Resin seal-forming method for electronic components and die apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent resin burrs from growing at resin-sealing electronic components mounted on sheets by an upper and lower dies. SOLUTION: The depth B of recesses 26 for setting a pair of lower dies is set to a value equal to the max. thickness of each sheets 25. Cavity blocks 28, having cavities 27 at the upper die face, are formed to conform with the shapes of the recesses 26. A uniformly pressing mechanism 40 for equally pressing the pair of the blocks 28 is composed of a pair of oscillation adjusters 41, couplings 42 for coupling the adjusters 41 and drive 43 for driving the couplings 42 up and down. When clamping both dies 20, 21, the mechanism 40 is used to separately and surely bond the surfaces of the blocks 28 and top surfaces of the sheets 25 and uniformly press the blocks 28 to the sheets 25 at specified pressures separately.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a mold for sealing an electronic component such as an IC mounted on a flexible sheet member made of plastic or the like with a resin material. It relates to improvement of the device.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounted on a lead frame is resin-molded by a transfer molding method. However, this method uses a mold device for resin molding. This is usually performed as follows.

That is, a mold comprising a fixed upper mold and a movable lower mold in the above-described mold apparatus is heated to a resin molding temperature by a heating means, and both the upper and lower molds are opened. Next, the lead frame on which the electronic components are mounted is supplied and set at a predetermined position on the mold surface of the lower mold, and the resin material is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and the lead frame around it are fitted and set in the upper and lower cavities opposed to the upper and lower molds, and the resin material in the pot is heated and sequentially heated. It will be melted. Next, when the resin material in the pot is pressurized by a plunger and the molten resin material is injected and filled into the upper and lower cavities through a transfer passage, the electronic components in the upper and lower cavities and the peripheral parts thereof are removed. The lead frame is sealed in a resin-sealed molded body that is molded according to the shapes of the two cavities. Therefore, after the required time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the resin sealing molded body and the lead frame in the two cavities are joined to the upper and lower molds. The mold is released by the provided ejector pin.

By the way, the above-mentioned lead frame includes:
Usually, a metal board is used. As an alternative to the metal lead frame, a printed circuit board called a PC board has been proposed. Note that the above-described PC board is molded using plastic, for example, BT resin or the like as a material. The above-mentioned printed circuit board (PC board) is a flexible sheet-like member (hereinafter, referred to as a sheet member), on which electronic circuits are provided and electronic components such as ICs are provided. It is attached. Therefore, it can be used for the transfer mold as described above in the same manner as the above-described lead frame. For example, as shown in FIGS. 9 and 10, in a mold including a fixed upper mold 1 and a movable lower mold 2, first, a set recess 3 (set portion) provided on a mold surface of the lower mold 2 is provided. The sheet member 4 is supplied and set, the upper and lower molds (1 and 2) are clamped, and an electronic component (not shown) mounted on the upper surface of the sheet member 4 is provided with a cavity 5 provided in the upper mold 1. Then, the resin material heated and melted through the transfer passage (not shown) of the upper mold 1 is injected and filled into the cavity 5, and the sheet member 4.
The electronic component mounted on the upper surface is sealed and molded in a resin molded body (6.9) corresponding to the shape of the cavity 5.

[0005]

However, this type of sheet member has the following disadvantages. That is, the sheet member 4 normally has a considerable width in the thickness (range of thickness), and the setting of the depth A of the setting recess 3 depends on the thickness of the sheet member 4. Since the average value is used, there is inevitably a difference between the depth A of the setting recess and the thickness of the sheet member 4. Therefore, in the clamped state of the two dies (1 and 2), the difference between the depth A of the set recess 3 and the thickness of the sheet member 4 causes the difference between the two dies (1 and 2). There is a serious adverse effect that the molten resin material intrudes into the gap formed in the substrate and resin burrs are generated.

For example, as shown in FIG. 9, when the thickness of the sheet member 4 is the maximum value H, that is, the sheet member 4 (4a) having the maximum thickness H is placed in the setting recess. When the two molds (1 and 2) are supplied and set to 3 and the molds are clamped at a normal predetermined clamping pressure, the mold surfaces of the upper and lower molds (1 and 2) cannot be securely joined. A gap is formed between the mold surfaces of the upper and lower molds (1 and 2). Therefore, if resin sealing molding is performed in this state, there is a problem in that the molten resin material enters the gap formed between the two mold surfaces and the resin burr 7 is generated. In order to prevent this, that is, in order to securely join the mold surfaces of the upper and lower molds (1 and 2), for example, the mold clamping pressure of the upper and lower molds (1 and 2) is increased by a predetermined mold clamping pressure. When the pressure is higher than the pressure and the mold surfaces of the upper and lower molds (1 and 2) are securely joined so that no gap is formed between the mold surfaces of the upper and lower molds, the surface of the sheet member 4 (4a), etc. Excessive mold clamping pressure will be applied. Therefore, since the above-mentioned sheet member 4 (4a) has flexibility, the above-mentioned sheet member 4 (4a) is greatly deformed by the above-mentioned excessive mold clamping pressure. The electronic circuit disposed on the surface of ()) is severed.

For example, as shown in FIG. 10, when the thickness of the sheet member 4 is the minimum value h, that is, when the sheet member 4 (4b) having the minimum thickness h is When the upper and lower molds (1 and 2) are securely set and the upper and lower molds (1 and 2) are clamped together with the upper and lower molds (1 and 2), the mold surface of the upper mold 1 and the upper mold 1 are fixed. The upper surface of the sheet member 4 (4b) supplied and set in the setting recess 3 is not securely joined, and the upper surface of the sheet member 4 (4b) and the upper mold surface having the cavity 5 are not joined. A gap will be formed. In other words, if resin sealing molding is performed in this state, there is an adverse effect that the molten resin material penetrates into the gap formed between the upper surface of the sheet member 4 (4b) and the upper die surface to generate resin burrs 8. There is.

Accordingly, the present invention provides a method for resin-sealing an electronic component mounted on a sheet member using a mold (both molds) provided in a mold device for resin-sealing molding of an electronic component. Between the mold surfaces of the molds, or the surface of the sheet member supplied and set in the mold setting recess and the surface side having the mold cavity (for example, a mold having the mold cavity). The surface of the mold or the surface of the cavity block having the cavity of the mold is prevented from forming a gap, so that the resin burr formed by the molten resin material entering the gap is formed. It is intended to efficiently prevent the above.

Further, the present invention provides a method in which a mold surface of a mold is securely joined and mold-clamped, and the surface of a sheet member supplied and set in the mold setting recess is connected to the mold surface of the mold. By securely joining the mold surface side, a gap is formed between the mold surfaces of the above-described molds, or between the surface of the sheet member and the surface side having the cavity of the mold. It is an object of the present invention to provide a resin sealing molding method and a mold apparatus for an electronic component, which can efficiently prevent resin burrs formed by infiltration of a molten resin material into the gap and prevent the resin burr from being formed.

Further, according to the present invention, when the mold surfaces of the molds are joined and the molds are clamped, the surface of the sheet member supplied and set to the required number of setting recesses of the molds is connected to the surface of the sheet member. By separately and surely joining the surface side having the mold cavity with each other, and independently and uniformly applying a predetermined pressure to the sheet member independently of the mold clamping pressure of the mold, the sheet An object of the present invention is to provide a resin sealing molding method and a mold apparatus for an electronic component, which can efficiently prevent adverse effects such as cutting of an electronic circuit provided on a surface of a member.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned technical problems, a resin sealing molding method for an electronic component according to the present invention comprises a resin sealing molding in which a fixed mold and a movable mold are arranged to face each other. The electronic component mounted on the above-mentioned sheet member is provided by providing a sheet member having an electronic component mounted on a set portion provided on the above-mentioned die, and by clamping the die. Is set in a cavity provided in the mold, and is filled with a heat-melted resin material into the cavity to form a resin-sealed electronic component mounted on the sheet member. A resin sealing molding method for a part, comprising: a step of slidably providing a cavity block having the cavity in the mold; and a sheet member supplied and set to the set portion during mold clamping of the mold. of And a step of applying a predetermined pressure to a sheet member supplied and set to the set section by the cavity block when the mold is clamped. And

[0012] In addition, a resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem includes providing a cavity block having a cavity in one of the above-mentioned molds in a slidable manner. Providing a set portion for feeding and setting the sheet member to the other mold of the mold,
Configuring the shape of the cavity block according to the shape of the set portion.

According to the present invention, there is provided a resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem, wherein a cavity block having a cavity is slidably provided in one of the molds. Forming a set portion of the sheet member with the cavity block in the one mold, and one surface of the sheet member supplied and set to the set portion with the cavity block when the mold is clamped. And bonding the surface of the cavity block to the other surface of the sheet member by bonding the mold surface of the other mold to the mold surface.

[0014] Further, a resin sealing molding method for an electronic component according to the present invention for solving the above technical problem includes providing a resin sealing molding die in which a fixed mold and a movable mold are arranged to face each other. A sheet member having an electronic component mounted thereon is supplied and set to a set portion provided on the mold, and the electronic component mounted on the sheet member is clamped on the mold to provide the electronic component mounted on the mold. A resin sealing molding method for an electronic component, wherein the electronic component mounted on the sheet member is resin-molded by injecting and filling a resin material that has been heated and melted into the cavity, and resin-molding the electronic component mounted on the sheet member. A step of slidably providing a concave block forming a set portion of a sheet member in one of the molds, and providing a cavity in the other mold of the mold; When tightening, Joining the surface of the sheet member supplied and set to the set portion with the mold surface having the cavity of the other mold, and clamping the mold by the concave block. Applying a predetermined pressure to the sheet member.

Further, the resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem is characterized in that the portion of the sheet member supplied and set to the set portion of the mold protrudes from the mold surface. And a step of positioning the entire sheet member supplied and set in the set section in the set section based on a result of the detection and detection in the above-described step of detecting and detecting Features.

[0016] In addition, a resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem, is characterized in that the above-mentioned mold is configured such that an upper mold and a lower mold are opposed to each other. Features.

Further, a mold device for resin sealing and molding of an electronic component according to the present invention for solving the above-mentioned technical problems,
A mold for resin encapsulation consisting of a fixed mold and a movable mold opposed to the fixed mold, a set portion of a required number of sheet members provided in the mold, and a supply set to the set portion. A mold device for resin sealing molding of an electronic component, comprising a cavity for fitting and setting an electronic component mounted on a sheet member, wherein a cavity block having a cavity in one of the molds is slidable. The required number is provided, and the above-mentioned set portions are provided in the other mold of the above-mentioned mold respectively, and the shape of the above-mentioned cavity block is configured corresponding to the shape of the above-mentioned set portion. At the time of clamping the mold, by sliding the cavity blocks, the surfaces of the cavity blocks are separately joined to the surfaces of the sheet members supplied and set in the set portion, Serial, characterized in that the predetermined pressure to the sheet member described above in cavity block provided with a uniformly pressurizing mechanism for pressurizing and uniformly pressurized to each other.

Further, a mold device for resin sealing and molding of an electronic component according to the present invention for solving the above-mentioned technical problems,
A required number of cavity blocks are slidably provided in one of the molds, and a set portion for supplying and setting a sheet member by the cavity block is formed in the one mold. At the time of tightening, the mold surface of the other mold of the mold is separately joined to one surface of the sheet member supplied and set to the set portion provided on one mold of the mold by the cavity block. A surface of the cavity block is separately joined to the other surface of the sheet member, and a uniform pressure mechanism for separately and evenly applying a predetermined pressure to the sheet member in the cavity block is provided. Features.

Further, a mold device for resin-sealing molding of an electronic component according to the present invention for solving the above-mentioned technical problems,
A uniform pressure mechanism corresponding to the pair of cavity blocks provided in the mold described above is provided with a pair of swing adjusting members provided separately in the pair of cavity blocks and a pair of swing adjusting members, respectively. It is characterized by comprising a connecting member for connecting the movement adjusting member in a swingable manner, and a drive unit for moving the connecting member.

According to another aspect of the present invention, there is provided a mold apparatus for resin-sealing molding of an electronic component according to the present invention, wherein a uniform pressure corresponding to a required number of cavity blocks provided in the mold is provided. A mechanism is provided with a required number of hydraulic cylinders fixedly mounted on a frame on which one of the molds is mounted, and a piston rod movably provided by a pressing force by oil pressure-fed into each of the above-described cylinders. A common oil passage formed in the cylinders for communicating between the cylinders and pushing the piston rod; an oil pressurizing supply source for pressurizing and supplying oil to the common oil passage; A pushing member to be moved, a rocker arm provided between the piston rod and the pushing member on the frame side, and a compression spring wound around a shaft of the pushing member. Characterized by being composed of a.

According to another aspect of the present invention, there is provided a resin sealing mold apparatus for an electronic component, comprising: a fixed mold and a movable mold opposed to the fixed mold. A mold for stopping molding, a set portion for a required number of sheet members provided in the mold, and a cavity for fitting and setting an electronic component mounted on the sheet member supplied and set to the set portion. A mold device for resin-sealing molding of an electronic component, wherein a recess block forming the above-mentioned set portion is slidably provided in one of the molds, and the other mold of the mold is provided. The above-mentioned cavity is provided,
Further, in the above-mentioned mold apparatus, when the mold is clamped, the other block is provided on the surface of the sheet member set and supplied to the set section provided in one of the molds by the recess block. While joining the mold surface with the cavity of each separately,
A feature is provided of a uniform pressure mechanism configured to press the predetermined pressure separately and uniformly to the sheet member in the recess block.

Further, a mold device for resin-sealing molding of an electronic component according to the present invention for solving the above-mentioned technical problems, comprises:
The above-mentioned mold is characterized by comprising an upper mold and a lower mold opposed to the upper mold.

[0023]

According to the present invention, in a mold device for resin-sealing molding of an electronic component, a cavity block having a cavity in a fixed upper mold is provided so as to be vertically slidable, and the shape of the cavity block on the fixed upper mold surface is adjusted. Is configured corresponding to the shape of the setting recess in the movable lower mold surface, and when the mold is clamped, the mold surfaces of the mold are securely joined to form the mold surfaces. A gap is prevented from being formed therebetween, and the surface of the cavity block (the surface having the cavity) is surely brought into contact with the surface (the upper surface) of the sheet member supplied and set in the setting recess (set portion). , It is possible to prevent a gap from being formed between the sheet member surface and the cavity block surface. Therefore, resin burrs formed by the molten resin material entering the gaps can be efficiently prevented.

Further, according to the present invention, in a mold apparatus for resin-sealing molding of an electronic component, a bottom of a setting recess for feeding and setting a movable lower mold sheet member is provided, and the setting recess is provided. The recess block to be formed is provided so as to be slidable up and down, and furthermore, at the time of clamping the upper and lower molds, the gap between the upper and lower mold faces is secured by securely joining the upper and lower mold faces. The above-described sheet member surface is prevented by forming the fixed upper mold surface having a cavity on the upper surface of the sheet member supplied and set in the setting recess by the above-described recess block while preventing the formation of the sheet member. A gap can be prevented from being formed between the upper mold surface and the fixed upper mold surface. Therefore, resin burrs formed by the molten resin material entering the gaps can be efficiently prevented.

According to the present invention, in a mold apparatus for resin-sealing molding of an electronic component, a cavity block having a cavity in a movable lower mold opposed to a fixed upper mold is provided so as to be vertically slidable. The lower mold is formed by forming a setting recess (set portion) with the cavity block, and the two mold surfaces are securely joined to each other when the mold is clamped. A cavity block is prevented from being formed between the surfaces, and the upper surface of the sheet member supplied and set in the setting recess is joined to the upper mold surface by the upwardly moving cavity block. Is securely joined to the lower surface of the sheet member to prevent a gap from being formed between the sheet member surface and the cavity block surface. Door can be. Therefore, resin burrs formed by the molten resin material entering the gaps can be efficiently prevented.

Further, according to the present invention, in a mold apparatus for resin-sealing molding of an electronic component, sheet members are respectively supplied and set in a required number of setting recesses of the mold, and the mold is clamped. The two mold surfaces of the mold are securely joined, and the mold surface side of the mold is separately and securely joined to the surface of the sheet member of the setting recess, and the molds are joined together. Independently of the clamping pressure to be clamped, a predetermined pressure can be individually and uniformly applied to the sheet member. Therefore, for example, by cutting both the molds with an excessive clamping pressure, it is possible to efficiently prevent the electronic circuit or the like provided on the surface of the sheet member from being cut.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 shows a mold apparatus for resin sealing molding according to the present invention. 2 and 3 show the main part of the mold of the mold apparatus shown in FIG.

As shown in FIG. 1, FIG. 2, and FIG. 3, the mold device includes a fixed upper mold 20 and a movable lower mold 21 opposed to the upper mold 20. A mold is provided. Further, in the above-described mold apparatus, the upper frame 22 and the lower frame (not shown) of the apparatus frame are fixed by a required number of posts 33, and the lower side of the upper frame (fixing plate) 22 is formed. The upper die 20 is mounted on the dies. The lower mold 21 is mounted on the upper side of the movable platen 23, and the movable platen 23 is provided to be vertically slidable with respect to the post 33. Further, the above-mentioned mold apparatus has a mold clamping mechanism for clamping the upper and lower molds (20 and 21) at a normal predetermined mold clamping pressure by moving the lower mold 21 and the movable plate 23 upward. 24 are provided.

Further, as shown in the figure, the lower mold 21 is provided with a required number of setting recesses 26 (set portions) for supplying and setting the sheet members 25, and the respective setting recesses 26 are provided.
Are set to, for example, the maximum value M of the thickness of the sheet member 25, respectively. Therefore, as shown in FIG.
The sheet member supplied and set to the above-described setting recess 26
When the thickness of the sheet member 25 is the maximum value M, the position of the upper surface 30 of the sheet member 25 (25a) whose thickness is the maximum value M is the lower mold.
It will match the position of 21 mold surfaces. Further, as shown in FIG. 3, when the thickness of the sheet member 25 supplied and set in the setting recess 26 is the minimum value m, the sheet member 25 ( 25b) is located below the mold surface of the lower mold 21. A required electronic circuit is provided on the surface of the sheet member 25 described above.

Further, as shown in FIG.
Is provided with an upper mold cavity 27 for resin molding for sealingly molding an electronic component (not shown) mounted on the sheet member 25, and the upper and lower molds (20 and 21) are closed when the molds are clamped. The electronic component is configured to be fitted and set in the cavity 27. Although not shown, at least one of the upper and lower molds (20 and 21) is provided with a required number of resin material supply pots,
A plunger for pressing a resin material is fitted in the pot, and the upper and lower molds (2
A transfer passage (for example, a cull portion, a runner, and a gate) for communicating the pot with the cavity is provided at the time of the mold closing in step 0.21). Therefore, both upper and lower types (20 ・ 21)
And by pressing the resin material heated and melted in the pot with the plunger, the molten resin material can be injected and filled into the cavity 27 through the transfer passage. Have been.

Further, as shown in FIG.
Is provided with an upper mold cavity block 28 having the upper mold cavity 27, and the cavity block 28
Is provided so as to be vertically slidable in a cavity block sliding hole 32 provided in the mold surface of the upper mold 20.
The shape of the cavity block 28 on the upper mold surface corresponds to the shape of the setting recess 26 on the lower mold surface. That is, when the upper and lower dies (20, 21) are clamped, the shape of the upper mold surface 29 of the cavity block 28 (that is, the shape of the upper surface of the sliding hole 32) and the setting recess are set. It is configured so as to match the shape of 26 (that is, the same shape). Accordingly, when the upper and lower dies (20 and 21) are clamped, the sliding hole 32 and the setting recess 26 are formed so as to communicate with each other, and the cavity block 28 is connected to the sliding hole 32. The inside and the inside of the setting recess 26 can be smoothly slid up and down. Further, the upper mold surface 29 of the cavity block 28 including the cavity 27 is joined to the upper surface 30 of the sheet member 25 supplied and set in the setting recess 26 so that there is no gap (close contact state). (See FIGS. 2 and 3). On the upper die 20 side (upper side of the upper frame 22) of the above-described die apparatus, the above-mentioned cavity blocks 28 are respectively slid up and down, so that the required number of The lower surface 29 of the cavity block 28 (the surface having the cavity 27) is individually and reliably joined to the upper surface 30 of the sheet member 25 supplied and set in the setting recess 26, respectively. A uniform pressure mechanism 40 for separately and uniformly applying a predetermined pressure via the block 28 is provided (see FIG. 1). That is, at the time of clamping the upper and lower molds (20, 21), the surface 29 of the cavity block 28 is joined to the surface 30 of the sheet member 25 by the uniform pressing mechanism 40, and The electronic components are fitted and set, and the sheet members 25 supplied and set in the setting recesses 26 are individually and uniformly pressed by the cavity blocks 28 by the uniform pressing mechanism 40. be able to. Accordingly, the molten resin material is injected and filled into the cavity 27, and the electronic component can be sealed in the resin molded body 31 (mold package) corresponding to the shape of the cavity 27. ing.

In the example shown in FIG. 1, the sheet members 25 are respectively supplied to a pair of (two) setting recesses 26, and the respective sheet members 25 are supplied by the uniform pressing mechanism 40.
The lower surfaces 29 of the pair of cavity blocks 28 are separately and securely joined to each other, and the respective sheet members are passed through the pair of cavity blocks 28 by the uniform pressing mechanism 40.
FIG. 25 illustrates a case where predetermined pressures are individually and uniformly applied. That is, as shown in FIG. 1, a uniform pressing mechanism 40 corresponding to the above-described pair of cavity blocks 28 includes a pair of swing adjusting members 41 that are separately provided in the above-described pair of cavity blocks 28 so as to freely swing. A connecting member 42 swingably connected to the pair of swing adjusting members 41, and a vertical drive unit 43 for vertically moving the connecting member 42 swingably.
(Drive unit). Further, the upper end side of the swing adjustment member 41 is swingably coupled to both ends of the connection member 42, respectively, and the center of the connection member 42 is swingably movable by the vertical drive unit 43. Are linked. Accordingly, the coupling member 42, the swing adjustment member 41, and the cavity block 28 can be integrally moved down by the vertical drive unit 43, and when the cavity blocks 28 are moved down. The swing adjusting member 41 and the connecting member 42 can be swung.

The swing adjusting members 41 are swingably inserted into the insertion holes 44 of the upper mold 20 and the insertion holes 45 of the upper frame 22, respectively. The slide hole 32 of 28 and the insertion holes (44, 45) are configured to communicate with each other. When the pair of cavity blocks 28 is moved down (moved), the swing adjustment member
Reference numeral 41 is configured to be able to swing in the above-mentioned sliding hole 32 and the insertion holes (44, 45). That is, when the pair of cavity blocks 28 are moved down, the pair of swing adjustment members 41 and the connecting member 42 are swung to adjust the down movement distance of the pair of cavity blocks 28 separately, whereby The joining positions where the lower surfaces 29 of the pair of cavity blocks 28 and the upper surfaces 30 of the pair of sheet members 25 are respectively joined are determined by the sheet members 25 supplied and set in the pair of setting recesses 26.
It is configured such that it can be adjusted separately for each thickness. Therefore, when the thickness of the sheet members 25 supplied and set to the pair of setting recesses 26 is different, the pair of cavity blocks 28 are respectively moved down by the uniform pressing mechanism 40, and By adjusting the lower moving distance (moving distance) of each cavity block 28, the lower surface 29 of the cavity block 28 described above is adjusted.
Can be individually and reliably joined to the upper surface 30 of the sheet member 25 corresponding to the thickness of the sheet member 25 supplied and set in the setting recess 26 described above. In addition, the driving force (pressing force) of the above-described vertical driving unit 43 is connected to the connecting member 42 described above.
And the above-described cavity block 28 via the swing adjustment member 41.
And the above-described driving force is a pressing force on the sheet member 25 supplied and set in the setting recess 26. Accordingly, the predetermined pressure is separately and uniformly applied to the sheet member 25 supplied and set to the setting recess 26 through the cavity block 28 by the equal pressing mechanism 40. I have. The uniform pressing mechanism 40 that slides up and down the cavity block 28 and applies a predetermined pressure separately and evenly to the sheet member 25 supplied and set in the setting recess 26 includes the upper and lower molds. It is configured independently of the mold clamping mechanism 24 for clamping (20, 21).

Further, in the example shown in FIG. 1, the case where the thickness of the sheet member 25 (25a) shown in FIG. 3, the case where the thickness of the sheet member 25 (25b) shown in FIG. 3 is the minimum value m is illustrated. For example, as shown in FIG.
When (25a) is supplied and set in the setting recess 26, the depth B of the setting recess 26 is set to the maximum value M of the thickness of the sheet member 25. The position of the upper surface 30 of the sheet member 25 (25a) having the maximum value M coincides with the position of the mold surface of the upper and lower molds (20, 21). Therefore, as shown in FIG. 2, the position of the cavity block 28 that moves down by the uniform pressing mechanism 40 is adjusted, and the lower surface 29 (the surface having the cavity 27) of the cavity block 28 and the sheet described above are adjusted. The upper surface 30 of the member 25 (25a) is securely joined to the upper and lower molds (20, 21) at the positions of the mold surfaces, and the uniform pressing mechanism 40 is attached to the sheet member 25 (25a). A predetermined pressure can be applied through the cavity block 28. For example, as shown in FIG. 3, when the sheet member 25 (25b) whose thickness is the minimum value m is supplied and set in the setting recess 26, the depth B of the setting recess 26 is set. Is set to the maximum value M of the thickness of the sheet member 25, so that the position of the upper surface 30 of the sheet member 25 (25b) having the minimum thickness m is
Will be located within. Therefore, as shown in FIG.
Cavity block 28 moving down by the uniform pressing mechanism 40
Adjust the position of the upper cavity block described above.
The lower surface 29 (the surface having the cavity 27) of the second member 28 and the upper surface 30 of the sheet member 25 (25b) are securely joined at a position within the setting recess 26, and the sheet member 25 (25
b) The predetermined pressure can be applied via the cavity block 28 by the above-described uniform pressure mechanism 40. In addition, as described above, the sheet members having different thicknesses described above.
25, for example, the sheet members (25, 25a, 25b) having the above-mentioned thicknesses of the maximum value M and the minimum value m are respectively supplied and set in the pair of setting recesses 26, and the uniform pressing mechanism 40 The downward movement distance of the cavity block 28 is individually adjusted to adjust the surface 29 of each cavity block 28 to the sheet member (25
It can be separately and reliably joined to the surface 30 of a.25b). Also, as described above, the pair of set recesses 26
For example, the above-described thickness is set to the maximum value M and the minimum value m on the sheet members 25 having different thicknesses supplied and set, respectively.
A predetermined pressure can be separately and uniformly applied to the sheet members (25 / 25a / 25b) via the cavity blocks 28 by the uniform pressing mechanism 40.

That is, as shown in FIG. 1, first, for example, the above-mentioned sheet member 25 (25a) having the maximum value M and the sheet member 25 (25b) having the minimum value m are formed in the pair of setting recesses 26. And the upper and lower molds (20 and 21) are clamped by the mold clamping mechanism 24 at a normal predetermined clamping pressure. At this time, since the mold surfaces of the upper and lower molds (20 and 21) are securely joined together and clamped, no gap is formed between the mold surfaces of the upper and lower molds (20 and 21). Next, the downward movement distance of each of the cavity blocks 28 is adjusted and moved downward by the uniform pressing mechanism 40, and the upper surface of the surface 29 of the cavity block 28 and the upper surface of the sheet member 25 (25a / 25b). And 30 are separately and securely joined. At this time, the predetermined pressure can be separately and uniformly applied to the sheet member 25 in the setting recess 26 by the cavity block 28 by the uniform pressing mechanism 40 and the cavity block surface can be pressed. No gap is formed between 29 and sheet member surface 30. Next, the resin material heated and melted in the pot is pressurized by the plunger and injected and filled into the cavity 27 through the transfer passage. After a lapse of time required for curing the molten resin material, the upper and lower molds (20 and 21) are opened, and the resin-encapsulated molded bodies 31 cured in the cavity 27 are released. be able to. Accordingly, it is possible to prevent a gap from being formed on both mold surfaces of the upper and lower molds (20, 21) and between the surface 29 of the cavity block 28 and the upper surface 30 of the sheet member. In addition, it is possible to efficiently prevent resin burrs generated when the molten resin material enters the gap. Further, the upper and lower molds (20 and 21) are clamped at a normal predetermined mold clamping pressure, and the cavity block described above is clamped.
Since a predetermined pressure can be separately and evenly applied to the sheet member 25 at 28, the sheet member generated when the upper and lower dies (20, 21) are clamped with an excessive clamping pressure. The harmful effect that the electronic circuit disposed on the surface of the 25 is cut can be reliably prevented.

In the above-described embodiment, the case where the depth B of the setting recess 26 is set to the maximum value M of the thickness of the sheet member 25 is exemplified.
26 can be configured by appropriately setting the depth B. For example, the depth B of the setting recess 26 may be
May be adopted as the minimum value m of the thickness or the average value of the two. That is, since the cavity block 28 is provided so as to be vertically slidable in the setting recess 26 and the sliding hole 32, for example, the depth B of the setting recess 26
Is set to the minimum value m of the thickness of the sheet member 25, and when the sheet member 25 (25a) having the maximum thickness M is set in the setting recess 26, the above-described sheet member 25 is set. The upper surface 30 of (25a) is located in the sliding hole 32 of the upper die 20. Therefore, the downward movement distance of the cavity block 28 is adjusted by the uniform pressing mechanism 40, and the surface 29 of the cavity block 28 is placed on the upper surface 30 of the sheet member 25 (25a) in the sliding hole 32. It is possible to surely join, and to apply a predetermined pressure (equally) to the sheet member 25 (25a).

Further, in the above-described embodiment, a fluid pressure uniform pressurizing mechanism using a fluid pressure such as hydraulic pressure or air pressure can be employed instead of the above-described uniform pressurizing mechanism 40. For example, by utilizing a hydraulic pressure equalizing mechanism using hydraulic pressure, each of the sheet members (25) supplied and set in the required number of setting recesses (26) described above can be used as the respective cavity blocks (28). And the sheet members (25) can be individually and evenly pressed. Note that the above-described fluid pressure equalizing pressurizing mechanism can be adopted for the sheet member (25) supplied and set in the single setting recess (26).

In the above-described embodiment, a rocker arm equal pressure mechanism 50 using a rocker arm and a fluid pressure such as hydraulic pressure and air pressure as shown in FIG. Can be adopted. In addition,
The basic configuration of the mold apparatus shown in FIG. 4 is the same as that of the embodiment shown in FIGS. 1, 2 and 3.

That is, the rocker arm uniform pressing mechanism 50 shown in FIG. 4 is provided on the upper die (20) side of the upper and lower dies (20, 21) provided in the resin molding apparatus for electronic parts. It is provided on the frame 51. Further, for example, the above-described rocker arm uniform pressurizing mechanism 50 uses a required number of cylinders 52 for hydraulic pressure (for fluid pressure) fixed to the above-described upper frame 51 and oil pumped into the cylinders 52. Each of the cylinders 52 is formed so as to communicate with a piston rod 53 provided to be vertically movable (movable) by a pushing force (oil pressure) and each of the cylinders 52 to vertically move (push) the piston rod 53. Common oil passage 54, an oil pressurized supply source 55 for supplying oil to the common oil passage 54, and the upper die (2
(0), a pushing member 56 for vertically sliding the cavity block (28), the piston rod 53 and the pushing member described above.
A rocker arm 57 is provided between the working portions on the upper end side (that is, the upper frame 51 side) of the pusher 56, and an appropriate compression spring 58 wound around the shaft of the pushing member 56. ing. Reference numeral 59 denotes a swing shaft of the rocker arm 57. The elastic characteristics of the compression springs 58 are set to be the same, and after the pushing member 56 is pushed from the predetermined position by the rocker arm 57 (after it is moved down), the compression spring 58 The push-up member 56 is pushed up to return to the original predetermined position. That is, in the rocker arm uniform pressurizing mechanism 50, the oil is supplied from the oil pressurized supply source 55 through the common oil passage 54 into each of the cylinders 52 to push the piston rods 53, respectively. Rocker arm above
The rockers 57 can be respectively swung, and the pusher members 56 can be respectively moved down by the rocker arms 57. Accordingly, in the rocker arm uniform pressing mechanism 50, by moving the pushing members 56 downward, the cavity blocks (28) provided on the downward moving members 56 are respectively downwardly moved, and The surface (29) of the cavity block (28) is separately and securely joined to the upper surface (30) of the sheet member (25) supplied and set to the required number of setting recesses (26) of (21). At the same time, a predetermined pressure can be separately and evenly applied to the sheet member (25).

The above-mentioned fluid pressure equalizing press mechanism and rocker arm equal pressurizing mechanism 50 may be singly or plurally supplied and set in the setting recesses (26).
This can be adopted when the above-mentioned cavity block (28) is joined to (25) and a predetermined pressure is applied.

In each of the above-described embodiments, a configuration in which the configuration of the upper die 20 and the configuration of the lower die 21 are exchanged can be adopted. For example, on the lower mold side, a lower mold cavity block having a lower mold cavity, and a uniform pressurizing mechanism (40) for moving the pair of lower mold cavity blocks up and down, respectively, can be provided. Figure 1
(See FIG. 4).

Next, the embodiment shown in FIGS. 5 and 6 will be described. The basic configuration of the resin molding apparatus for electronic components shown in FIGS. 5 and 6 is the same as the basic configuration of the above-described embodiment.

That is, the mold apparatus shown in FIGS. 5 and 6 includes:
Similarly to the above-described embodiment, a fixed upper die 60, a resin sealing molding die including a movable lower die 61 provided opposite to the upper die 60 is provided, and further, the lower die 61 Is a setting recess 63 for supplying and setting a sheet member 62 on which electronic components are mounted.
A required number of (set units) are provided. Similarly to the above-described embodiment, when the upper and lower dies (60, 61) are clamped, the upper die 60 is mounted on the sheet member 62 supplied and set in the setting recess 63. A required number of upper mold cavities 65 for fitting and setting parts are provided, and a mold clamping mechanism for clamping the upper and lower molds (60, 61) at a normal predetermined mold clamping pressure is provided on the lower mold 61 side. (24) is provided.

As shown in FIGS. 5 and 6, the lower die 61 is provided with a recess block 66 having a bottom surface of a setting recess 63 (set portion) on the lower die surface. The set recess 63 provided on the mold surface of the mold 61
The recess block 66 is configured to slide up and down in the recess sliding hole 70 including Each of the above-mentioned recess blocks 66 is configured to slide up and down in the recess sliding holes 70 including the above-described setting recesses 63 by an appropriate vertical movement adjusting mechanism 67 (equal pressing mechanism). Have been. Therefore, by vertically moving the recess block 66 by the above-described vertical movement adjusting mechanism 67, the depth C of the setting recess 63 in which the sheet member 62 is supplied is set to an appropriate depth. It is configured so that it can be set. Also, the above-mentioned vertical movement adjusting mechanism
At 67, the sheet member 62 supplied and set in the setting recess 63 is moved up and down while being placed on the bottom surface of the setting recess 63, that is, on the upper surface of the recess block 66. In addition, the vertical movement adjusting mechanism 67 can position the entire sheet member 62 in the setting recess 63 (in the recess sliding hole 70). Is configured. For example, the upper and lower types
By adjusting the position of the upper surface 64 of the sheet member 62 supplied and set in the setting recess 63 by the vertical movement adjusting mechanism 67 at the time of the mold clamping of (60 ・ 61), the sheet member 62 described above is adjusted. Of the upper surface 64 can be matched with the upper and lower mold surfaces (the lower mold surface). Therefore, both upper and lower types (60 ・ 6
1) During the mold clamping, the upper surface 64 of the sheet member 62 in the setting recess 63 is securely joined to the upper mold surface 68 having the cavity 65 of the upper mold 60 by the vertical movement adjusting mechanism 67 described above. At the same time, a predetermined pressure can be applied to the sheet member 62. The above-described vertical movement adjusting mechanism 67 may employ, for example, the configuration of the uniform pressurizing mechanism 40 shown in FIG. 1 and the configuration of the above-described fluid pressure uniform pressurizing mechanism and rocker arm uniform pressurizing mechanism 50. it can.

For example, the required number of set recesses 63 described above
When the sheet members 62 having different thicknesses are respectively supplied and set, the position of the upper surface 64 of the sheet member 62 is adjusted by the vertical movement adjusting mechanism 67, and the upper surface 64 of each of the sheet members 62 is adjusted. The mold surface of the lower mold 61 can be individually and reliably matched. Therefore, the upper and lower types (6
0 ・ 61), the upper surface 64 of each sheet member 62 in the required number of setting recesses 63 is separately and securely fixed to the mold surface 68 of the upper mold 60 by the vertical movement adjusting mechanism 67. And a predetermined pressure can be separately and evenly applied to the sheet member 62 by the vertical movement adjusting mechanism 67 described above. 5 and 6, the depth C of the setting recess 63 is set to the minimum value n of the thickness of the sheet member 62. Further, in each of the examples shown in FIGS. 5 and 6, a case where a sheet member 62 (62a) having a maximum thickness N is supplied and set on the right side is illustrated. A case where the sheet member 62 (62b) having the minimum value n is supplied and set is illustrated.

The mold apparatus shown in FIGS. 5 and 6 includes:
A sensor (not shown) for detecting and detecting a portion of the sheet member 62 supplied and set in the setting recess 63 above the lower mold surface is provided. That is, the set recess 63 is moved by the vertical movement adjusting mechanism 67 described above.
The sheet member 62 set and supplied to the sheet is projected upward from the lower mold surface, and the sheet member 62
It is configured to detect and detect 62 projecting portions. For example, the depth C of the setting recess 63 is set to be slightly smaller than the minimum value n of the thickness of the sheet member 62, and the sheet member 62 having the maximum thickness N is set in the setting recess 63. When (62a) is supplied and set, a part of the sheet member 62 (62a) projects upward from the lower mold surface. That is, while detecting and detecting the portion protruding above the lower mold surface with the sensor,
Based on the results of detection and detection by the above sensors,
By moving the recess block 66 downward by the above-mentioned vertical movement adjusting mechanism 67, the upper surface 64 of the above-mentioned sheet member 62 (62a) matches the lower die surface, and further, the above-mentioned sheet member 62 (62a ) In the set recess 63 (sliding hole 70
In). Therefore, the upper and lower types
At the time of the mold clamping of (60 ・ 61), the upper surface 64 of the above-mentioned sheet member 62 is individually and securely joined to the mold surface 68 of the above-mentioned upper die 60, and a predetermined pressure is separately and uniformly applied to the above-mentioned sheet member 62. It is configured to be pressurized.

First, by moving the recess block 66 up and down by the vertical movement adjusting mechanism 67 shown in FIG. The setting recesses 63 (set portions) are formed by setting each of the sheet members 62 to be shallower than the minimum value n of the thickness. next,
The sheet member 62 is supplied and set in the setting recess 63, and a portion protruding above the lower mold surface is detected and detected by the sensor. Next, based on the result of detection and detection by the above-described sensor, the above-described vertical movement adjusting mechanism 67 moves the recess block 66 downward, and
The upper surface 64 of the above-described sheet member 62 is matched with the lower die surface. Next, as shown in FIG. 6, the upper and lower molds (60, 61) are clamped by the mold clamping mechanism (24) at a normal predetermined mold clamping pressure. ), The upper surface 64 of each of the sheet members 62 is separately and reliably bonded to the upper die surface 68 having the cavity 65, and a predetermined pressure is applied to the sheet member 62. Apply pressure separately and evenly. That is, the upper mold cavity described above
The molten resin material can be injected and filled in 65, and the electronic component mounted on the sheet member 62 can be sealed and molded. Therefore, the mold surfaces of the upper and lower molds (60 and 61) can be securely joined, and the upper surface 64 of the sheet member 62 can be securely joined to the upper mold surface 68 having the cavity 65. Since the formation of a gap in the upper and lower molds (60, 61) can be prevented, resin burrs generated when the molten resin material enters the gap can be efficiently prevented. Further, the upper and lower dies (60 and 61) can be clamped at a normal predetermined clamping pressure, and the predetermined pressure can be separately and evenly applied to the sheet member 62 by the recess block 66. It is possible to prevent the electronic circuit disposed on the surface portion of the sheet member 62, which is generated when the upper and lower molds (60, 61) are clamped with an excessive clamping pressure, from being cut. Can be.

In the embodiment shown in FIGS. 5 and 6, a configuration is adopted in which the depth C of the above-mentioned setting recess 63 is set to, for example, the maximum value N of the thickness of the sheet member 62 or more. be able to. That is, first, the setting recess 63 (set portion) is formed by setting the depth C of the setting recess 63 to be equal to or greater than the maximum value N of the thickness of the sheet member 62. Next, the sheet members 62 are supplied and set in the setting recesses 63, respectively, and the upper and lower dies (60 and 61) are clamped. Next, the concave block 66 is moved up by the vertical movement adjusting mechanism 67 so that the upper surface 64 of the sheet member 62 matches the upper mold surface 68. Can be individually and reliably joined to the upper mold surface 68, and a predetermined pressure can be individually and uniformly applied to each of the sheet members 62.

Next, the embodiment shown in FIGS. 7 and 8 will be described. The basic configuration of the mold apparatus shown in FIGS. 7 and 8 is the same as the configuration of the embodiment shown in FIG.

That is, in the embodiment shown in FIGS. 7 and 8, the fixed upper die 80 and the movable lower die 81 opposed to the upper die 80 are arranged.
Are provided. At a predetermined position on the die surface of the lower die 81, a setting recess 83 (set portion) for supplying and setting the sheet member 82 is provided. In addition, a lower mold cavity 84 for resin molding is provided on the bottom surface of the setting recess 83, and a lower mold cavity block 85 having the above cavity 84 is provided on the mold surface of the lower mold 81. The lower cavity block sliding hole 86 including the setting recess 83 is provided to be vertically slidable. The cavity block 85 is configured to slide up and down in a sliding hole 86 including the setting recess 83 by the uniform pressing mechanism 87, and the uniform pressing mechanism
At 87, the depth D of the setting recess 83 can be set to a predetermined depth. That is, in a state where the sheet member 82 is placed on the bottom surface of the setting recess 83 by the uniform pressing mechanism 87, the lower surface 91 of the sheet member 82 is Upper surface 92
(The surface having the cavity 84)
It can be moved up and down, and both upper and lower types (80 ・ 8
The electronic component mounted on the sheet member 82 can be fitted and set in the lower die cavity 84 at the time of the mold clamping of 1). At this time, the lower surface 91 of the above-described sheet member 82 and the upper surface of the above-described cavity block 85
Since it can be joined separately and securely from 92,
The surface of the sheet member lower surface 91 and the cavity block 85 described above.
No gap is formed between the gap and 92. In addition, both upper and lower types (8
0 ・ 81), the upper surface 88 of the sheet member 82 can be individually and reliably joined to the die surface 89 of the upper die 80 by the uniform pressing mechanism 87, and A predetermined pressure is applied to the member 82 separately and uniformly. In addition, the uniform pressing mechanism described above
The configuration of 87 is basically the same as the configuration of the uniform pressing mechanism 40 described above (see FIG. 1). The apparatus shown in FIGS. 7 and 8 includes the sheet surface 82 of the lower die 81 in the sheet member 82 supplied and set in the setting recess 83, as in the embodiment shown in FIGS. A sensor (not shown) for detecting and detecting a portion projecting upward from the camera is provided. Therefore, similarly to the above-described embodiment, the above-described protruding portion is detected and detected by the sensor, and the entire sheet member 82 is placed in the setting recess 83 (in the sliding hole 86).
Can be located. In the example shown in FIGS. 7 and 8, a case where a sheet member 82 (82 a) having a maximum value Q is supplied and set in the setting recess 83 on the right side is illustrated. On the left side, a case is illustrated in which a sheet member 82 (82b) having a minimum thickness q is supplied and set in the setting recess 83.

Therefore, first, the depth D of the setting recess 83 of the lower die 81 is set to, for example, the average value of the thickness of the sheet member 82, and the setting recess 83 is set. Then, the above-described sheet members 82 are supplied and set, respectively. At this time, the sheet member 82 having the maximum thickness Q described above (82a)
Is to project a part of the lower mold 81 above the mold surface 93. Therefore, similarly to the above-described embodiment, the protruding portion of the sheet member 82 (82a) is detected and detected by, for example, a sensor, and the sheet member 82 (82a) is detected by the uniform pressing mechanism 87. The upper surface 88 of 82a) is matched with the lower die surface 93. Next, the upper and lower molds (80 and 81) are clamped. Next, with the uniform pressing mechanism 87 described above, with the sheet members 82 placed on the cavity blocks 85, respectively, the upper surface 88 of each sheet member 82 is separately and reliably placed on the upper mold surface 89. At the same time, the lower surface 91 of each of the sheet members 82 is separately and securely bonded to the surface 92 (the surface having the cavity 84) of the lower mold cavity block 85,
Further, a predetermined pressure can be individually and uniformly applied to each of the sheet members 82 by the cavity block 85 described above. Accordingly, the molten resin material is injected and filled into the lower mold cavity 84, and the electronic component mounted on the sheet member 82 in the lower mold cavity 84 is molded into the resin molded body 90. Can be. In the above-described embodiment, the depth D of the setting recess 83 of the lower die 81 is set to be equal to or greater than the maximum value Q of the thickness of the sheet member 82, and the setting recess 83 is After the sheet member 82 is supplied and set, and the upper and lower dies (80 and 81) are closed, the upper surface 88 of each of the sheet members 82 is moved upward by moving the cavity block 85 upward. In addition, the lower surface 91 of each of the sheet members 82 is securely joined to the surface 92 of the lower mold cavity block 85, and a predetermined pressure can be separately and uniformly applied to each of the sheet members 82.

In the embodiment shown in FIGS. 7 and 8, in place of the uniform pressurizing mechanism 87, the above-described fluid pressure uniform pressurizing mechanism and the above-described rocker arm uniform pressurizing mechanism 50 can be employed. .

The configuration using the recess block 66 as shown in FIGS. 5 and 6 and the cavity block 85 as shown in FIGS. 7 and 8 is a single or plural set recess.
This can be adopted when a predetermined pressure is applied to the sheet members (62, 82) supplied and set in the (63, 83) by the recess block 66 and the cavity block 85 described above.

The present invention is not limited to the above-described embodiment, but can be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

Further, in each of the above embodiments, for example, the mold clamping pressure by the mold clamping mechanism (24) is set at a normal predetermined mold clamping pressure.
The pressure on the sheet member (25) supplied and set in (6) is
Since it is configured to be performed independently by the uniform pressing mechanism (40) or the like, the mold clamping pressure of the mold clamping mechanism (24) is directly supplied to the setting recess (26). The pressed sheet member (25) is not pressed. That is, in each of the above-described embodiments, for example, when the upper and lower dies (20, 21) are clamped by the excessive clamping pressure by the clamping mechanism (24), the excessive clamping pressure is set by the set pressure. The sheet member (25) of the setting recess (26) is configured so as not to be applied to the sheet member (25) of the recess (26) and applies a predetermined pressure by the uniform pressing mechanism (40). (25) is configured to be able to pressurize separately and evenly.

In each of the above embodiments, the cavity block (28) is controlled by the uniform pressing mechanism (40) and the like.
The pressure for pressurizing the sheet member (25) through is appropriately adjusted in consideration of not cutting the electronic circuit disposed on the surface of the sheet member (25) according to the gist of the present invention. Pressure is set to, for example, the mold clamping mechanism described above
It may be set to be almost the same as the normal predetermined mold clamping pressure according to 24.

The above-mentioned sheet member includes, in addition to the above-mentioned PC board, what is called a printed board or a carrier board, and the above-mentioned sheet member includes, for example, polyimide or the like. A film-like material (polyimide substrate) as a material is included and can be used in each of the above-described embodiments. The above-described sheet member is configured as a single layer or a plurality of layers (lamination).

[0058]

Therefore, according to the present invention, when the electronic component mounted on the sheet member is resin-molded with a mold provided in the mold device for resin-molding the electronic component, the above-described metal mold is used. A gap is prevented from being formed between the mold surfaces or between the surface of the sheet member supplied and set in the mold setting recess and the surface having the mold cavity. Thereby, there is an excellent effect that a resin burr formed by the molten resin material entering the gap can be efficiently prevented.

Further, according to the present invention, the mold surface of the mold is securely joined and mold-clamped, and the surface of the sheet member supplied and set in the mold setting recess and the mold are connected. By securely joining the mold surface side of the mold, a gap is formed between the mold surfaces of the molds, or between the surface of the sheet member and the surface side having the cavity of the mold. It is possible to provide a resin sealing molding method and a mold apparatus for an electronic component that can prevent the formation of the resin component and efficiently prevent resin burrs formed by infiltration of the molten resin material into the gap. It has an excellent effect.

Further, according to the present invention, when the mold surfaces of the molds are joined and the molds are clamped, the surfaces of the sheet members supplied and set respectively to the required number of setting recesses of the molds. And the surface side having the cavity of the mold is separately and reliably joined, and independently of the mold clamping pressure of the mold, a predetermined pressure is separately and uniformly applied to the sheet member, An excellent effect of being able to provide a resin sealing molding method and a mold device for an electronic component that can efficiently prevent adverse effects such as cutting of an electronic circuit provided on the surface of the sheet member. Play.

[Brief description of the drawings]

FIG. 1 is a partially cut-away longitudinal sectional view showing a main part of a mold device for resin sealing molding of an electronic component according to the present invention, showing a mold clamping state of a mold provided in the device. I have.

FIG. 2 is a longitudinal sectional view showing a main part of a mold provided in the apparatus shown in FIG. 1, showing a mold clamping state of the mold;
The case where the thickness of the sheet member is the maximum value is shown.

FIG. 3 is a longitudinal sectional view showing a main part of a mold provided in the apparatus shown in FIG. 1, showing a mold clamping state of the mold;
The case where the thickness of the sheet member is the minimum value is shown.

FIG. 4 is a partially cut-away longitudinal sectional view showing a main part of the mold apparatus for resin sealing molding according to the present invention.

FIG. 5 is a longitudinal sectional view showing another embodiment of a mold apparatus for resin sealing molding of an electronic component according to the present invention, showing a mold opened state of a mold provided in the apparatus.

FIG. 6 is a longitudinal sectional view showing a mold apparatus corresponding to FIG. 5, showing a mold clamping state of a mold provided in the apparatus.

FIG. 7 is a longitudinal sectional view showing another embodiment of a mold device for resin sealing molding of an electronic component according to the present invention, showing a mold opened state of a mold provided in the device.

8 is a longitudinal sectional view showing a mold apparatus corresponding to FIG. 7, showing a mold clamping state of a mold provided in the apparatus.

FIG. 9 is a longitudinal sectional view showing a main part of a mold provided in a conventional resin-sealing molding mold apparatus, showing a mold-clamped state of the mold, and having a maximum thickness of a sheet member. The value is shown.

FIG. 10 is a longitudinal sectional view showing a main part of a mold provided in a conventional resin sealing molding mold apparatus, showing a mold clamping state of the mold, and having a minimum thickness of a sheet member. The value is shown.

[Explanation of symbols]

 20 Fixed upper die 21 Movable lower die 22 Upper frame (fixed plate) 23 Movable plate 24 Mold clamping mechanism 25: 25a: 25b Sheet member 26 Set recess (set part) 27 Cavity 28 Cavity block 29 Cavity block surface 30 Sheet Upper surface of member 31 Resin-sealed molded body 32 Cavity block sliding hole 33 Post 40 Uniform pressing mechanism 41 Swing adjustment member 42 Connecting member 43 Vertical drive unit 44 Insertion hole 45 Insertion hole 50 Rocker arm uniform pressing mechanism 51 Upper frame 52 Cylinder 53 Piston rod 54 Common oil passage 55 Oil pressurized supply source 56 Pushing member 57 Rocker arm 58 Compression spring 59 Swing shaft 60 Fixed upper die 61 Movable lower die 62: 62a: 62b Seat member 63 recess for set Set part) 64 Upper surface of sheet member 65 Cavity 66 Depressed block 67 Vertical movement adjustment mechanism (Equal pressing mechanism) 68 Upper die surface 69 Resin-sealed molded body 70 Recessed slide hole 80 Fixed upper die 81 Movable Lower die 82: 82a: 82b Sheet member 83 Setting recess (set part) 84 Cavity 85 Cavity block 86 Cavity block sliding hole 87 Equal pressing mechanism 88 Upper surface of sheet member 89 Upper die surface 90 Resin molding 91 Lower surface of sheet member 92 Surface of cavity block 93 Lower mold surface B Depth of recess for set C Depth of recess for set D Depth of recess for set M Maximum thickness of sheet member m Sheet member Minimum value of thickness N Maximum value of thickness of sheet member n Minimum value of thickness of sheet member Q Maximum value of thickness of sheet member q Minimum value of thickness of sheet member

Claims (12)

[Claims] A mold for resin sealing in which a fixed mold and a movable mold are arranged to face each other, and a sheet member on which an electronic component is mounted is supplied and set to a set section provided on the mold; In addition, the electronic component mounted on the sheet member is clamped to the electronic component mounted in the mold, and the resin material heated and melted is injected into the cavity. A resin sealing molding method for an electronic component, wherein the electronic component mounted on the sheet member is filled and molded with a resin. The method further comprising: slidably providing a cavity block having the cavity in the mold. A step of joining the surface of the cavity block to the surface of the sheet member supplied and set to the set portion at the time of mold clamping of the mold; Applying a predetermined pressure to the sheet member supplied and set to the set section. 2. A step of slidably providing a cavity block having a cavity in one of the molds and providing a set portion for supplying and setting a sheet member to the other mold of the mold; 2. The method of claim 1, further comprising the step of configuring the shape of the electronic component corresponding to the shape of the set portion. 3. A step of slidably providing a cavity block having a cavity in one of the molds, and forming a set portion of a sheet member with the cavity block in the one mold. At the time of mold clamping, by joining the mold surface of the other mold of the mold to one surface of the sheet member supplied and set to the set portion by the cavity block,
Bonding the surface of the cavity block to the other surface of the sheet member. The method according to claim 1, further comprising: 4. A resin-molding mold having a stationary mold and a movable mold opposed to each other is provided, and a sheet member on which an electronic component is mounted is supplied and set to a set section provided in the mold. In addition, the electronic component mounted on the sheet member is clamped to the electronic component mounted in the mold, and the resin material heated and melted is injected into the cavity. What is claimed is: 1. A resin sealing molding method for an electronic component, comprising: resin sealing and molding an electronic component mounted on a sheet member and filled with the sheet member, wherein the recess block forms a set portion of the sheet member in one of the molds. Slidably, and providing a cavity in the other mold of the mold; and, during clamping of the mold, the surface of the sheet member supplied and set to the set portion by the recess block. The other type of key Resin sealing of an electronic component, comprising: a step of joining the mold to a mold surface having a degree of viscosity; and a step of applying a predetermined pressure to the sheet member by the recess block when the mold is clamped. Stop molding method. 5. A step of detecting and detecting a portion of a sheet member supplied and set in a mold setting portion that protrudes from a mold surface, and detecting and detecting the portion based on a result of the detection and detection by the detecting and detecting step. 5. The method according to claim 3, further comprising the step of: positioning the entire sheet member supplied and set in the setting section in the setting section. 6. 6. The mold according to claim 1, wherein the upper and lower dies are arranged to face each other.
A resin sealing molding method for an electronic component according to claim 3, 4, or 5. 7. A resin-sealing molding die comprising a fixed die and a movable die opposed to the fixed die, a set portion of a required number of sheet members provided in the die, and the set portion. And a cavity for fitting and setting the electronic component mounted on the sheet member supplied and set to the resin member. A cavity device having a cavity in one of the dies. A required number of blocks are slidably provided, and the above-mentioned set portions are provided in the other mold of the above-mentioned molds, respectively, and the shape of the above-mentioned cavity block is configured corresponding to the shape of the above-mentioned set portion. When the mold is clamped by the mold, the cavity blocks are slid, respectively, so that the surfaces of the cavity blocks are separately joined to the surfaces of the sheet members supplied and set in the set section. And a uniform pressure mechanism for separately and uniformly applying a predetermined pressure to the sheet member in the cavity block. 8. A mold having a required number of cavity blocks slidably provided in one of the molds, and a set portion for supplying and setting a sheet member by the cavity blocks is formed in the one mold. At the time of the mold clamping of the mold, the mold surface of the other mold of the mold is separately attached to one surface of the sheet member supplied and set to the set portion provided in one mold of the mold in the cavity block. By joining
The cavity block surface is joined to the other surface of the sheet member separately, and a uniform pressure mechanism for separately and evenly applying a predetermined pressure to the sheet member in the cavity block is provided. The mold device for resin sealing and molding of electronic components according to claim 7. 9. A uniform pressure mechanism corresponding to a pair of cavity blocks provided in a mold, a pair of swing adjusting members respectively provided in said pair of cavity blocks so as to be swingable, and 8. A connecting member for connecting a pair of swing adjusting members in a swingable manner, and a driving unit for moving the connecting member.
A mold device for resin sealing molding of an electronic component according to claim 8. 10. A uniform number pressing mechanism corresponding to a required number of cavity blocks provided in a mold, a required number of hydraulic cylinders fixedly mounted on a frame on which one of the molds is mounted, and A piston rod movably provided by a pushing force of oil fed into each cylinder, a common oil passage of each of the cylinders formed to communicate between the cylinders to push the piston rod, and An oil pressurized supply source for pressurizing and supplying oil to the oil passage;
A pushing member for sliding the cavity block, a rocker arm provided between the piston rod and the pushing member on the frame side, and a compression wound around a shaft portion of the pushing member. 9. The mold device for resin-sealing and molding electronic components according to claim 7, wherein the mold device comprises a spring. 11. A resin sealing molding die comprising a fixed die and a movable die opposed to the fixed die, a set portion of a required number of sheet members provided in the die, and the set portion. And a cavity for fitting and setting the electronic component mounted on the sheet member supplied and set to the resin member. A recess block forming a portion is slidably provided, the other cavity of the mold is provided with the cavity described above, and the above-described mold device is provided with the above-mentioned recess block when the mold is clamped. At the same time, the mold surface having the cavity of the other mold is separately joined to the surface of the sheet member supplied and set to the setting portion provided in one mold of the mold, and the sheet is formed by the concave block. Predetermined pressure is applied separately to each member Resin-seal-molding die apparatus of electronic components comprising the uniform pressing mechanism configured to pressurize. 12. The mold according to claim 7, wherein the mold comprises an upper mold and a lower mold opposed to the upper mold. 12. The mold device for resin sealing molding of an electronic component according to claim 10 or 11.