JP2004200269A - Method and device for sealing and forming resin of electronic component - Google Patents

Method and device for sealing and forming resin of electronic component Download PDF

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Publication number
JP2004200269A
JP2004200269A JP2002364760A JP2002364760A JP2004200269A JP 2004200269 A JP2004200269 A JP 2004200269A JP 2002364760 A JP2002364760 A JP 2002364760A JP 2002364760 A JP2002364760 A JP 2002364760A JP 2004200269 A JP2004200269 A JP 2004200269A
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resin
mold
electronic component
intermediate plate
cavity space
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JP4052939B2 (en
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Shinji Takase
慎二 高瀬
Hideki Tokuyama
秀樹 徳山
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Towa Corp
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Towa Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide resin sealing/forming method/device of an electronic component for efficiently solving problems when a substrate mounting a plurality of semiconductor chips is formed by using a resin sealing/forming mold and for improving productivity of a product. <P>SOLUTION: An upper die 1 where an electronic component (semiconductor chip 7)-side of a substrate 6 is turned downward and is fixed and both molds 2 and 3 are completely clamped in a state where an intermediate plate 3 and a female mold 2 are clamped, a releasing film 4 is sandwiched with both molds 2 and 3, a cavity space part 29 is formed, the upper die 1 and both molds 2 and 3 are intermediately clamped, and an inner part of the cavity space 29 is vacuumed in an air interruption state. The chips 7 and a wire 8 are immersed in molten resin 31 in the cavity space part 29 and resin is sealed and formed. A resin amount adjusting means 33 formed in the cavity space part 29 adjusts a resin amount in the cavity part 29 at the time of sealing and forming resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、IC等の半導体チップ(電子部品)の搭載された基板を樹脂封止成形用金型にて一括して樹脂封止成形する電子部品の樹脂封止成形方法及び金型の改良に関するものである。
【0002】
【従来の技術】
従来から、電子部品の樹脂封止成形用金型を用いて、基板に搭載した複数個の半導体チップを一括して樹脂封止成形することが行われている。
【0003】
即ち、従来の前記した装置は、上型と下型とから成る樹脂封止成形用金型を設けており、下型にはタブレット樹脂(樹脂材料)を嵌装させるポットと、ポット内を昇降自在に摺動するプランジャとがあって、まず、半導体チップの装着した基板が該チップ装着側を上方向にして下型に供給セットして上下型を型締めし、次に、予め加熱溶融化されたタブレット樹脂を溶融樹脂としてポット内のプランジャで押圧し、次に、上型に設けたポット直上部にあるカル部・ランナ部・ゲート部の樹脂通路を介して上型に設けた該チップを嵌装セットするキャビティに溶融樹脂を注入して充填する。
次に、溶融樹脂が硬化してキャビティ部分と樹脂通路部分とが一体で形成された樹脂成形体を構成し、次に、一体で形成された樹脂成形体を金型より取出してキャビティ部分と樹脂通路部分とを分離する。
以上のことから、キャビティ部分の硬化した樹脂成形後の樹脂成形済基板(製品)が完成されて、カル部・ポット部・ランナ部における樹脂通路部分の硬化した樹脂を不要樹脂材料として廃棄する(例えば、特許文献1参照。)。
【0004】
【特許文献1】
特開2001-28377号公報(第4頁、第1図)
【0005】
【発明が解決しようとする課題】
しかしながら、近年の基板の大型化・薄型化や電子部品(半導体チップ)の極小化・極薄化や一枚の基板上に複数個の電子部品を装着して一括モールドすることからも、電子部品と樹脂材料との密着性を強くするために、高密度な樹脂材料を使用することが多くなってきている。
ここで、例えば、前述で示すような従来の技術であるトランスファー成形で、複数個の該チップと基板とを接続するワイヤを装着する基板を、高密度の樹脂材料を溶融樹脂としてポット内のプランジャにて押圧して樹脂通路を介して該チップ・ワイヤが嵌装されたキャビティ内に溶融樹脂を注入充填すると、高密度な樹脂材料を使用することで、ポット内のプランジャが円滑に昇降できずに摺動不良が発生したり、ワイヤが変形或いは断線してワイヤ不良が発生したり、樹脂材料と直接的に接触するキャビティ・カル部・ポット部・ランナ部等の金型面に樹脂カスが付着したりすると云う問題があった。
従って、高密度な樹脂材料に離型材を含有した樹脂材料を使用して前述における樹脂成形上の問題点を解決するように樹脂封止成形することが行われる。
しかしながら、高密度な樹脂材料に離型材を含有することで、電子部品(半導体チップ)と樹脂材料との密着性が弱くなって、樹脂封止済基板における製品の歩留まりを低下させる、つまりは、製品の生産性の低下を発生させると云う問題があった。
【0006】
即ち、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型を用いて、樹脂封止成形する時の樹脂成形上の諸問題を効率良く解決して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供することを目的とするものである。
【0007】
【課題を解決するための手段】
前記した技術的課題を解決するために本発明に係わる電子部品の樹脂封止成形方法は、上型と下型と前記両型の間に設けられ且つ貫通した状態の樹脂成形用キャビティを備えた中間プレートとから成る電子部品の樹脂封止成形用金型を搭載した装置と、前記した上型と中間型との間に供給する基板側とワイヤで電気的に接続した電子部品を装着した基板と、前記した中間プレートと下型との間に供給する離型フィルムとを用意する工程と、
前記した中間プレートと下型とを型締めして前記した両型間に前記した離型フィルムを挟持することにより、前記したキャビティと前記した離型フィルムを被覆した下型の金型面とから前記した電子部品とワイヤとを嵌装する樹脂成形用キャビティ空間部を形成する工程と、
前記したキャビティ空間部内に樹脂材料を供給して加熱溶融化する工程と、
前記した上型の金型面の所定位置に前記電子部品側を下方向に向けた状態で前記基板を供給セットした状態で且つ少なくとも前記したキャビティ空間部を外気遮断状態にして真空引きした状態で前記した上型と中間プレートとを型締めすることにより、前記したキャビティ空間部内における加熱溶融化された樹脂材料内に前記した電子部品とワイヤとを浸漬して樹脂封止成形する工程と、
前記した樹脂封止成形工程時に、前記したキャビティ空間部に形成される樹脂量調整手段にて、前記したキャビティ空間部内に前記した電子部品とワイヤとを浸漬して前記した加熱溶融化された樹脂材料の樹脂量を調整する工程とを含むことを特徴とする。
【0008】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、上型と該上型に対向配置した下型と前記した両型間に設けた中間プレートとから成る電子部品の樹脂封止成形用金型と、該上型の所定位置に設けられ且つ基板側とワイヤとで電気的に接続した電子部品を装着した基板を前記した電子部品側を下方向に向けた状態で固定する基板固定手段と、前記した中間プレートに貫通した状態で設けられ且つ前記した基板に装着した電子部品側を嵌装するキャビティと、前記した下型の金型面を被覆する離型フィルムを前記した下型と中間プレートとの間に供給する離型フィルム供給機構と、前記した下型と中間プレートとを型締めして前記した離型フィルムを挟持することにより前記したキャビティと前記した離型フィルムを被覆した下型の金型面とで形成されるキャビティ空間部内に樹脂材料を供給する樹脂材料供給機構と、前記したキャビティ空間部に形成され且つ前記したキャビティ空間部内に前記した電子部品とワイヤとを加熱溶融化された前記樹脂材料に浸漬して樹脂封止成形時の樹脂量を調整する樹脂量調整手段と、前記した上型の金型面と前記した下型の金型面と前記した中間プレートの上型側及び下型側の金型面における少なくとも一方の金型面に設けられ且つ少なくとも前記したキャビティ空間部内を外気遮断状態にして外気遮断空間部を形成するシール部材と、前記した外気遮断空間部内から空気等を強制的に吸引排出する真空引き機構とを含むことを特徴とする。
【0009】
【発明の実施の形態】
即ち、基本的に、従来におけるトランスファー成形における金型構造に有するポットとプランジャとカル部とゲート部とランナ部とを全く設けることなく、上型と下型と中間プレートとから成る樹脂成形用金型と離型フィルムとを用いて、中間プレートと下型とを型締めすることにより離型フィルムを前記した両型間(中間プレート・下型)に狭持してキャビティ空間部を形成して、上型と中間プレートとを型締めすることによりキャビティ空間部内を外気遮断状態にして真空引きした状態で、電子部品(半導体チップ)とワイヤとを装着した基板側を下方向に向け固定された上型と中間プレートとを完全に型締めすることにより、キャビティ空間部内の加熱溶融化された樹脂材料内に該チップとワイヤとを浸漬して樹脂封止成形することを特徴とする。
なお、前記した樹脂封止成形時に、キャビティ空間部に形成された樹脂量調整手段によりキャビティ空間部内の樹脂量を調整することができる。
つまり、従来の樹脂成形上の問題である高密度な樹脂材料を使用することによる、プランジャの摺動不良やワイヤ不良や樹脂材料と直接的に接触する金型面の樹脂カスの付着を効率良く解決することができるので、電子部品と樹脂材料との密着性を弱めて樹脂封止済基板(製品)の歩留まりを低下させないで、離型材を含有することなく高密度な樹脂材料にて樹脂封止成形をすることができる。
【0010】
従って、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型を用いて、樹脂封止成形する時の樹脂成形上の諸問題を効率良く解決して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供する。
【0011】
【実施例】
以下、図1乃至図5に基づいて、詳細に説明する。
なお、図1乃至図5は、本発明での樹脂封止成形装置の概略縦断面図である。
【0012】
即ち、本発明での樹脂封止成形装置において、図1に示すように、上型1と該上型1に対向配置した下型2と両型1・2間に設けた中間プレート3とから成る電子部品の樹脂封止成形用金型と、下型2と中間プレート3との間に離型フィルム4を供給する離型フィルム供給機構(図示しない)と、下型2と中間プレート3とを型締めして離型フィルム4を挟持することによりキャビティ17と離型フィルム4を被覆された下型2の金型面とで形成されるキャビティ空間部29内に所要量の樹脂材料を供給する樹脂材料供給機構(図示しない)と、上型1及び下型2の金型面に設けられ且つ少なくともキャビティ空間部29内を外気遮断状態にされた外気遮断空間部32を形成するシール部材5と、外気遮断空間部32内から空気等を強制的に吸引排出する真空引き機構(図示しない)とを少なくとも設けている。
【0013】
また、本実施例における基板6は、例えば、図1に示すように、任意の形状である基板6上に所定個所にダイボンディングされた複数個の半導体チップ7(電子部品)と、基板6と該チップ7とを電気的に接続するワイヤ8とから少なくとも構成されていると共に、金型にて電子部品側である樹脂成形体9を一括して樹脂封止成形(一括片面モールド)するように構成されている。
【0014】
また、各金型1・2・3の金型面は、上型1の上型面10と中間プレート3の上型側金型面11とが基板6を介して型締めして、中間プレート3の下型側金型面12と下型2の下型面13とが離型フィルム4を介して型締めするように構成されている。
また、上型1は、図1に示すように、基板6の樹脂成形体9側(電子部品側)を下方向に向けた状態で所定位置に装着固定できる基板固定手段14と、少なくともキャビティ空間部29内を外気遮断空間部32とする上型面10に備えた前記したシール部材5と、外気遮断空間部32内から空気等を強制的に吸引排出する上型面10に貫通し且つ真空引き機構と連通する経路になるエア吸引排出孔15とを設けている。
従って、上型1の基板固定手段14に樹脂成形体9側を下方向に向けた基板6を装着固定させて、樹脂成形体9側を溶融樹脂31にて樹脂封止成形して溶融樹脂31を硬化させて硬化樹脂を形成して樹脂封止済基板(製品)が成形される。
このとき、樹脂封止済基板上には、硬化した樹脂成形体9部分と樹脂封止成形されない基板外周部16が形成される。
【0015】
また、中間プレート3は、図1に示すように、中間プレート3に貫通した状態で設けられ且つ基板6に装着した樹脂成形体9側を嵌装するキャビティ17と、離型フィルム4を下型2の金型面に被覆して緊張させ且つ狭持して型締めできるように構成されたフィルム狭持用の傾斜部18とから構成されている。
また、下型2は、少なくともキャビティ空間部29内を外気遮断空間部32とする下型面13に備えた前記したシール部材5と、外気遮断空間部32内から空気等を強制的に吸引排出する下型面13に貫通し且つ真空引き機構と連通する経路になるエア吸引排出孔19とを設けている。
なお、下型面13には、シール部材5を備えた平面位置Aが最も外側の外周囲に形成され、その内側には平面位置Aより低く形成され且つ後述する第一及び第二狭持部材22・23を嵌装できる凹所20における凹所底面位置Bが形成されて、略中央部分には平面位置Aより高く形成された凸所21における凸所天面位置Cが形成され構成されている。
【0016】
また、第一狭持部材22は、下型2における少なくとも凸所21天面を突出できるように略中央部に貫通孔27を設けて、凹所底面Bに貫通して上下動できる支持部材24上に付設されており、支持部材24を介して、例えば、スプリング等の第一弾性部材25を下型2に埋設されていると共に、図1で示す両型2・3が型開時には、支持部材24底面を第一弾性部材25が上動して凸所天面位置Cより少なくとも第一狭持部材22天面が高い位置で待機するように構成されており、図5で示す両型2・3が完全型締時には、第一狭持部材22の天面と平面位置Aとは同一平面上になるように構成されている。
また、第二狭持部材23は、例えば、L字型の形状をしており、中間プレート3の傾斜部18と離型フィルム4を介して接合する傾斜部28を設けており、少なくとも凸所21天面を突出できるように略中央部を貫通した状態で且つL字型の少なくとも鉛直部分の天面が第一狭持部材22の貫通孔27を突出できるようになっており、第二狭持部材23底面に付設された、例えば、スプリング等の第ニ弾性部材26を下型2に埋設されていると共に、図1で示す両型2・3が型開時には、第二弾性部材26が伸びることで上動して凸所天面位置Cと同一平面上に第二狭持部材23天面が待機するように構成されており、図5で示す両型2・3が完全型締時には、第一狭持部材22の外周囲底面と第二狭持部材23におけるL字型の水平部分の天面とが当接して第一及び第二狭持部材22・23が下動して第二狭持部材23底面が凹所底面位置Bに当接することにより第二狭持部材天面が凸所天面位置Cより低くなり平面位置Aよりも高い位置となるように構成されている。
また、図1で示す両型2・3が型開時には、所定の張力に張架された状態で水平に保持された離型フィルム4が、離型フィルム供給機構にて供給され送り出されるように構成されている。
【0017】
従って、本実施例の装置に搭載した金型1・2・3にて該チップ7とワイヤ8とを装着した基板6を樹脂封止成形する場合、まず、上型1と下型2と中間プレート3とが型開き状態で、上型1と中間プレート3の上型側金型面11との間に樹脂成形体9側を下方向に向けた基板6を供給すると共に、中間プレート3の下型側金型面12と下型2との間に離型フィルム4を供給する(図1参照)。
次に、上型1の基板固定手段14における上型面10の所定位置に基板6の樹脂成形体9非装着面を装着固定すると共に、中間プレート3を下動させることにより、所定の張力にて張架された離型フィルム4と中間プレート3の下型側金型面12とが接触し、次に、下型側金型面12に接触した離型フィルム4と第一狭持部材22天面とが接触することで、中間プレート3の下型側金型面12と第一狭持部材22天面とが離型フィルム4を狭持する(図2参照)。
【0018】
次に、図2の状態にある中間プレート3を更に下動させることにより、第一狭持部材22における貫通孔27部分に被覆された離型フィルム4に下型2の凸所21天面と第二狭持部材23における鉛直部分の天面とが略同時に接触して被覆し、次に、中間プレート3を更に下動させることにより、第一狭持部材22底面と第二狭持部材23の水平部分の天面と当接すると共に、中間プレート3の傾斜部18と第二狭持部材23の傾斜部28とが接合して離型フィルム4を狭持することで、同一平面上にある下型面13の凸所21天面と第二狭持部材23における鉛直部分の天面とに離型フィルム4が緊張して被覆される(図3参照)。
このとき、図3に示すように、第二狭持部材23は下動せずに凹所底面位置Bと第二狭持部材23底面とは離間しており、平面位置Aの下型面13に備えたシール部材5と下型側金型面12とが離型フィルム4を介して当接しており、下型2にあるエア吸引排出孔19が凹所底面位置Bから平面位置Aまで鉛直方向に連通する。
つまり、図3に示す両型2・3が型締め状態で、中間プレート3のキャビティ17と離型フィルム4が緊張して被覆された同一平面上にある凸所21天面と第二狭持部材23における鉛直部分の天面とで構成されたキャビティ空間部29が形成される。
【0019】
次に、図3に示す両型2・3が型締め状態で、例えば、顆粒樹脂30から成る所要量の樹脂材料を樹脂材料供給機構からキャビティ空間部29に顆粒樹脂30が均一に供給されると共に、離型材を含有していない高密度な顆粒樹脂30を用いて樹脂封止成形する。
このとき、予め金型1・2・3に埋設された加熱ヒータ(図示しない)により金型1・2・3の温度を上昇させて顆粒樹脂30を加熱溶融化させるようにすることが好ましい。
次に、図3に示す両型2・3が型締めした状態で、両型2・3が上動することにより上型1における上型面10に備えたシール部材5と中間プレート3の上型側金型面11とが当接すると共に、キャビティ空間部29に供給した顆粒樹脂30が加熱溶融化されて溶融樹脂31となる(図4参照)。
このとき、上型面10及び基板6における基板外周部16は、中間プレート3の上型側金型面11と離間した状態であって、つまりは、図4に示す金型1・2・3が型締めした状態が、中間型締め状態を示している。
つまり、図4で示す中間型締め状態が、少なくともキャビティ空間部29内を外気遮断状態とする外気遮断空間部32を形成して、外気遮断空間部32から空気等を強制的に真空引き機構にて吸引排出する(真空引きする)。
【0020】
次に、図4で示す中間型締め状態で且つキャビティ空間部29内を外気遮断状態にして真空引きした状態で、樹脂成形体9側をキャビティ空間部29にある溶融樹脂31に徐々に接近させて、該チップ7とワイヤ8とに溶融樹脂31が浸漬内包するように上型1と両型2・3とを徐々に型締めする(図5参照)。
このとき、基板6の基板外周部16と中間プレート3の上型側金型面11とが当接すると共に、中間プレート3の下型側金型面12と平面位置Aにおける下型面13とが離型フィルム4を介して狭持して型締めする、つまりは、図5で示す金型1・2・3が型締めした状態が、完全型締め状態を示している。
また、図5で示す完全型締め状態で、平面位置Aにおける下型面13と第一狭持部材22天面とが同一平面上となると共に、第一狭持部材22底面は、第二狭持部材23における水平部分の天面に当接した状態で、第二狭持部材23底面と凹所底面位置Bとが当接する位置まで第一及び第二狭持部材22・23は下動することで、第二狭持部材の鉛直部分の天面が凸所天面位置Bより低くなる、つまりは、キャビティ空間部29内の溶融樹脂31が、基板外周部16に漏出しないように当該樹脂量を調整する樹脂量調整手段33を形成する。
つまり、樹脂量調整手段33は、図5で示す完全型締め状態となる樹脂封止成形時にキャビティ空間部29の底面である第二狭持部材の鉛直部分の天面を下動させることで、キャビティ空間部29内の溶融樹脂31の樹脂漏れを防止することができる。
【0021】
次に、図5で示す完全型締めした状態で、基板6に装着された樹脂成形体9が硬化して硬化樹脂が形成されて樹脂封止済基板が成形し、次に、樹脂封止済基板の樹脂成形体9側を下方向に向けた状態で上型1の基板固定手段14の所定位置に樹脂封止済基板を装着固定させて、上型1と両型2・3とが型開きして、キャビティ空間部29底面の離型フィルム4から離型される。
次に、中間プレート3の下型側金型面12と下型面13との間で狭持された離型フィルム4を中間プレート3と下型2とを型開きすることにより、下型2に嵌装された第一及び第二狭持部材22・23が第一及び第二弾性部材25・26の上方向に押し戻ることにより、第一狭持部材22天面は支持部材24を介して凸所天面位置Cより高い位置まで上動して復元し且つ第二狭持部材23の鉛直部分の天面は凸所天面位置Cと同一平面上に上動して復元することで、第一及び第二狭持部材22・23は各別に待機する(図1参照)。
このとき、樹脂封止成形時で使用された離型フィルム4は、中間プレート3と下型2との間に所定の張力に張架された状態で中間プレート3の下型側金型面12と下型面13と離間して水平に保持される(図1参照)。
また、図5で示す完全型締めした状態から上型1と両型2・3とが型開きするまでには、真空引き機構にて空気等の吸引排出することを停止するように構成されている。
また、樹脂封止成形後における使用済の離型フィルム4は、離型フィルム供給機構にて金型外部へ送り出されて、使用前の離型フィルム4を離型フィルム供給機構より金型内部へ供給されるように構成されている。
また、樹脂封止済基板は、図5で示す完全型締めした状態から上型1と両型2・3とが型開きしてからであれば、基板固定手段14より装着固定解除されて次工程へと搬送されるように構成されていると共に、次の樹脂封止前の該チップ7とワイヤ8とを装着された基板6を上型1の基板固定手段14に供給されて所定位置に装着固定できるように構成されている。
【0022】
即ち、中間プレート3と下型2とを型締めすることにより、離型フィルム4を狭持してキャビティ空間部29を形成する金型構造になっているので、従来におけるトランスファー成形における金型構造に有するポットとプランジャとカル部とゲート部とランナ部とを全く設けることなく、中間プレート3と下型2とを型締めすることにより離型フィルム4を両型間2・3に狭持してキャビティ空間部29を形成して、上型1と両型2・3とを中間型締めすることによりキャビティ空間部29内を外気遮断状態にして外気遮断空間部32を形成して真空引きした状態で、電子部品(半導体チップ7)とワイヤ8とを装着した基板側を下方向に向け固定された上型1と両型2・3とを完全型締めすることにより、キャビティ空間部29内の加熱溶融化された樹脂材料内に該チップ7とワイヤ8とを浸漬して樹脂封止成形する。
なお、前記した樹脂封止成形時に、キャビティ空間部29に形成された樹脂量調整手段33によりキャビティ空間部29内の樹脂量を調整することができる。
つまり、従来の樹脂成形上の問題である高密度な樹脂材料を使用することによる、プランジャの摺動不良やワイヤ不良や樹脂材料と直接的に接触する金型面の樹脂カスの付着を効率良く解決することができるので、電子部品と樹脂材料との密着性を弱めて樹脂封止済基板(製品)の歩留まりを低下させないで、離型材を含有することなく高密度な樹脂材料にて樹脂封止成形をすることができる。
従って、電子部品である複数個の半導体チップ7を装着した基板6が樹脂封止成形用金型1・2・3を用いて、樹脂封止成形する時の樹脂成形上の諸問題を効率良く解決して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供することができる。
【0023】
なお、本実施例におけるシール部材5において、少なくともキャビティ空間部29を外気遮断状態にして外気遮断空間部32を形成するのであれば、上型面10と下型面13と中間プレート3の上型側金型面11及び下型側金型面12における少なくとも一方の金型面に適宜に選択して設けてもよいし、装置全体或いは金型全体を外気遮断空間部32にして実施したりすることも適宜可能である。
【0024】
また、本実施例における離型フィルム4に粘着層を形成した離型フィルム4を使用して実施してもよい。
【0025】
また、本実施例においては、樹脂成形前の基板6を図2で示す状態で上型1の基板固定手段14に装着固定するようにしたが、図4で示す中間型締め状態になるまでに基板6を装着固定するのであれば任意に変更して実施できる。
【0026】
また、本実施例における図4で示す金型1・2・3を型締めした中間型締め状態においては、前述した中間型締め状態と完全型締め状態(図5参照)とを断続的に停止させて実施するか、もしくは、両型2・3を停止させることなく、前述した中間型締め状態の位置から完全型締め状態の位置に至るまでの間、型締めの速度(両型2・3の型締め速度)を遅くしながら連続的に行うように適宜設定して実施することも可能である。
【0027】
また、本実施例においては、固定上型1と上下往復動可能な中間プレート3と可動下型2とから成る樹脂封止成形用金型構造にしたが、可動させる金型を任意に変更させて実施することも可能である。
【0028】
また、本実施例においては、中間プレート3・下型2の第二狭持部材23に各傾斜部18・28及び下型2の外周囲に設けた第一及び第二狭持部材22・23や支持部材24や第一及び第二弾性部材25・26の構成にてキャビティ空間部29底面における下型面13の凸所21天面に離型フィルム4を緊張させ被覆させるような構造にしたが、キャビティ空間部29底面を離型フィルム4に緊張させ被覆させる構造であれば、任意に部材・形状・材質・配置等を変更させて対応することも可能である。
【0029】
また、本実施例においては、半導体チップ7とワイヤ8とから少なくとも構成された樹脂成形体9を顆粒樹脂30にて樹脂封止成形する構成にて説明してきたが、所要量の顆粒樹脂30ではなく所要量の液状樹脂・粉末状樹脂を採用して実施することも適宜可能である。
【0030】
また、本実施例においては、ワイヤボンデングされた電子部品を樹脂封止成形する構成にて説明してきたが、ワイヤ8の無い電子部品を搭載されたフリップチップ基板等においても前述の樹脂封止成形を適応することは可能であると共に、ワイヤ8の無い基板の場合においては、所要量のタブレット状の樹脂を供給するような構成にすることも可能である。
【0031】
また、樹脂封止済基板と両型2・3と離型フィルム4とが離型する時に、樹脂封止済基板を容易に離型できるように、溶融樹脂31と少なくとも接触する金型及び金型面を、低離型力を得られる表面処理や材質にすることも適宜に変更して実施できる。
【0032】
また、下型2の凸所21天面に被覆された離型フィルム4を介して型締め圧力をモニタリングできるように圧力センサー等の測定機器を埋設したり、樹脂封止成形時に樹脂成形体9を溶融樹脂31に浸漬してキャビティ空間部29に備えた樹脂量調整手段33にて樹脂量を調整するのに加えて、溶融樹脂31を逃がす役目を有する基板外周部16と当接する中間プレート3の上型側金型面11に設けたダミーキャビティ部(図示しない)を形成し樹脂量を更に調整するような構成にすることも可能である。
【0033】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に変更・選択して採用できるものである。
【0034】
【発明の効果】
本発明によれば、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型を用いて、樹脂封止成形する時の樹脂成形上の諸問題を効率良く解決して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供するという優れた効果を奏するものである。
【図面の簡単な説明】
【図1】図1は、本発明に係わる電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、上型と下型と中間プレートとを型開きした状態を示す。
【図2】図2は、本発明に係わる電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、中間プレートが下動する状態を示す。
【図3】図3は、本発明に係わる電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、基板を装着して、顆粒樹脂を供給した状態を示す。
【図4】図4は、本発明に係わる電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、上型と下型と中間プレートとを中間型締めして真空引きした状態を示す。
【図5】図5は、本発明に係わる電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、上型と下型と中間プレートとを完全型締めした状態を示す。
【符号の説明】
1 上型
2 下型
3 中間プレート
4 離型フィルム
5 シール部材
6 基板
7 半導体チップ
8 ワイヤ
9 樹脂成形体
10 上型面
11 上型側金型面
12 下型側金型面
13 下型面
14 基板固定手段
15・19 エア吸引排出孔
16 基板外周部
17 キャビティ
18・28 傾斜部
20 凹所
21 凸所
22 第一狭持部材
23 第二狭持部材
24 支持部材
25 第一弾性部材
26 第二弾性部材
27 貫通孔
29 キャビティ空間部
30 顆粒樹脂
31 溶融樹脂
32 外気遮断空間部
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing molding method for an electronic component and a mold improvement in which a substrate on which a semiconductor chip (electronic component) such as an IC is mounted is collectively resin molded by a resin molding die. Things.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a plurality of semiconductor chips mounted on a substrate have been collectively resin-molded using a resin-molding mold for electronic components.
[0003]
That is, the above-described conventional apparatus is provided with a resin sealing molding die composed of an upper die and a lower die, and a pot in which a tablet resin (resin material) is fitted in the lower die, and a pot that moves up and down in the pot. There is a plunger that slides freely. First, the substrate on which the semiconductor chip is mounted is supplied to the lower mold with the chip mounting side facing upward, and the upper and lower molds are clamped. The pressed tablet resin is pressed as a molten resin by a plunger in a pot, and then the chip provided in the upper mold via a resin passage of a cull part, a runner part, and a gate part immediately above the pot provided in the upper mold. The molten resin is injected and filled into the cavity for fitting and setting.
Next, the molten resin is cured to form a resin molded body in which the cavity portion and the resin passage portion are integrally formed. Next, the integrally formed resin molded body is removed from the mold, and the cavity portion and the resin are formed. Separate from the passage.
From the above, the resin molded substrate (product) after the resin molding in which the cavity portion is cured is completed, and the cured resin in the resin passage portion in the cull portion, the pot portion, and the runner portion is discarded as unnecessary resin material ( For example, see Patent Document 1.)
[0004]
[Patent Document 1]
JP-A-2001-28377 (page 4, FIG. 1)
[0005]
[Problems to be solved by the invention]
However, recent years have seen that the size and thickness of electronic boards (semiconductor chips) have become smaller and thinner, and that multiple electronic components have been mounted on a single substrate and molded together, which has led to the development of electronic components. In order to strengthen the adhesion between the resin and the resin material, a high-density resin material is often used.
Here, for example, in the transfer molding which is a conventional technique as described above, a substrate for mounting a plurality of wires for connecting the chip and the substrate is connected to a plunger in a pot using a high-density resin material as molten resin. When the molten resin is injected and filled into the cavity in which the chip wire is fitted through the resin passage through the resin passage, the plunger in the pot cannot be raised and lowered smoothly by using a high-density resin material. Insufficient sliding occurs, wire deformation or disconnection causes wire failure, and resin scraps on the mold surface such as cavities, culls, pots, runners, etc. that come into direct contact with the resin material. There is a problem that it adheres.
Therefore, resin sealing molding is performed using a resin material containing a release material in a high-density resin material so as to solve the above-described problem in resin molding.
However, by including the release material in the high-density resin material, the adhesiveness between the electronic component (semiconductor chip) and the resin material is weakened, and the product yield on the resin-sealed substrate is reduced, that is, There is a problem that the productivity of the product is reduced.
[0006]
That is, the present invention efficiently solves various problems in resin molding when a substrate on which a plurality of semiconductor chips, which are electronic components, is mounted using a resin sealing molding die. It is an object of the present invention to provide a method and an apparatus for resin-encapsulating and molding electronic components, which improve the productivity of products.
[0007]
[Means for Solving the Problems]
In order to solve the above-described technical problem, a resin sealing molding method for an electronic component according to the present invention includes a resin molding cavity provided between an upper mold, a lower mold, and both molds, and in a penetrated state. A device mounted with a resin-sealing mold for electronic components comprising an intermediate plate, and a substrate mounted with electronic components electrically connected by wires to a substrate side supplied between the upper die and the intermediate die And a step of preparing a release film to be supplied between the intermediate plate and the lower mold,
By clamping the intermediate plate and the lower mold, and holding the release film between the two dies, the cavity and the lower mold surface coated with the release film are removed from the mold surface. Forming a cavity space for resin molding for fitting the electronic component and the wire,
A step of supplying a resin material into the cavity space and heating and melting the resin material,
In a state where the substrate is supplied and set in a state where the electronic component side faces downward at a predetermined position on the mold surface of the upper mold, and in a state where at least the cavity space described above is evacuated to an outside air blocking state. By clamping the upper mold and the intermediate plate, a step of immersing the electronic component and the wire in a resin material that has been heated and melted in the cavity space to perform resin sealing molding,
At the time of the resin encapsulation molding step, the electronic component and the wire are immersed in the cavity space by the resin amount adjusting means formed in the cavity space, and the resin is heated and melted. Adjusting the amount of resin of the material.
[0008]
Further, in order to solve the above-mentioned technical problem, the resin sealing and molding apparatus for an electronic component according to the present invention includes an upper mold, a lower mold facing the upper mold, and an intermediate plate provided between the molds. A resin-sealing molding die for an electronic component, comprising: a substrate mounted with an electronic component provided at a predetermined position of the upper die and electrically connected to the substrate by a wire; A substrate fixing means for fixing the electronic component side mounted on the substrate, the cavity being provided in a state penetrating the intermediate plate, and covering the mold surface of the lower mold. A release film supply mechanism for supplying the release film between the lower mold and the intermediate plate, and clamping the release film by clamping the lower mold and the intermediate plate. Cavity and separation as described above A resin material supply mechanism for supplying a resin material into a cavity space formed by a lower mold surface coated with a film; and an electronic component formed in the cavity space and in the cavity space described above. A resin amount adjusting means for adjusting the amount of resin during resin encapsulation by immersing the wire and the resin material heated and melted, and the upper mold surface and the lower mold surface. A seal member provided on at least one mold surface of the upper mold side and the lower mold side of the intermediate plate, and forming an outside air blocking space portion with at least the inside of the cavity space portion being in an outside air blocking state, A vacuuming mechanism for forcibly sucking and discharging air and the like from the outside air blocking space.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
That is, basically, without providing a pot, a plunger, a cull portion, a gate portion, and a runner portion in the mold structure in the conventional transfer molding at all, a resin molding mold including an upper mold, a lower mold, and an intermediate plate is provided. Using a mold and a release film, the intermediate plate and the lower mold are clamped to form a cavity space by clamping the release film between the two molds (the intermediate plate and the lower mold). Then, the substrate side on which the electronic components (semiconductor chips) and the wires were mounted was fixed facing downward in a state where the inside of the cavity space was cut off by closing the upper mold and the intermediate plate to evacuate the outside air. By completely clamping the upper mold and the intermediate plate, the chip and the wire are immersed in the resin material that has been heated and melted in the cavity space to perform resin sealing molding. And butterflies.
At the time of the above-mentioned resin sealing molding, the amount of resin in the cavity space can be adjusted by the resin amount adjusting means formed in the cavity space.
In other words, by using a high-density resin material, which is a problem in the conventional resin molding, it is possible to efficiently remove the poor sliding of the plunger, the poor wire, and the adhesion of the resin residue on the mold surface that directly contacts the resin material. It is possible to solve this problem without weakening the adhesion between the electronic component and the resin material, thereby lowering the yield of the resin-sealed substrate (product), and using a high-density resin material without a release material. Stop molding can be performed.
[0010]
Therefore, the present invention efficiently solves various problems in resin molding when a substrate on which a plurality of semiconductor chips as electronic components are mounted is molded using a resin sealing mold. Provided are a method and an apparatus for resin-encapsulating and molding electronic components, which improve the productivity of products.
[0011]
【Example】
Hereinafter, the present embodiment will be described in detail with reference to FIGS.
1 to 5 are schematic longitudinal sectional views of the resin molding apparatus according to the present invention.
[0012]
That is, in the resin-sealing molding apparatus of the present invention, as shown in FIG. 1, the upper mold 1, the lower mold 2 opposed to the upper mold 1, and the intermediate plate 3 provided between the two molds 1 and 2. A mold for resin-sealing molding of an electronic component, a release film supply mechanism (not shown) for supplying a release film 4 between the lower die 2 and the intermediate plate 3, and a lower die 2 and the intermediate plate 3. A required amount of resin material is supplied into a cavity space 29 formed by the cavity 17 and the mold surface of the lower mold 2 covered with the release film 4 by clamping the release film 4 by clamping the mold. And a sealing member 5 that is provided on the mold surfaces of the upper mold 1 and the lower mold 2 and that forms an outside air blocking space 32 in which at least the inside of the cavity space 29 is in an outside air blocking state. And forcibly remove air and the like from the outside air blocking space 32. Evacuation mechanism for pulling discharging the (not shown) are at least provided.
[0013]
Further, as shown in FIG. 1, for example, the substrate 6 in the present embodiment includes a plurality of semiconductor chips 7 (electronic components) die-bonded at predetermined locations on the substrate 6 having an arbitrary shape. And at least a wire 8 for electrically connecting the chip 7 to the chip 7. The resin molded body 9 on the electronic component side is collectively resin-molded (one-sided molding) using a mold. It is configured.
[0014]
The mold surfaces of the molds 1, 2, and 3 are formed by clamping the upper mold surface 10 of the upper mold 1 and the upper mold surface 11 of the intermediate plate 3 via the substrate 6 to form an intermediate plate. The lower mold side 12 of the lower mold 3 and the lower mold surface 13 of the lower mold 2 are clamped via the release film 4.
As shown in FIG. 1, the upper mold 1 has a substrate fixing means 14 which can be mounted and fixed at a predetermined position with the resin molded body 9 side (electronic component side) of the substrate 6 facing downward, and at least a cavity space. The seal member 5 provided on the upper mold surface 10 having the inside of the portion 29 as an outside air blocking space 32 and the upper mold surface 10 for forcibly sucking and discharging air and the like from the inside of the outside air blocking space 32 and having a vacuum An air suction / discharge hole 15 serving as a path communicating with the pulling mechanism is provided.
Therefore, the substrate 6 with the resin molded body 9 facing downward is mounted and fixed to the substrate fixing means 14 of the upper mold 1, and the resin molded body 9 side is resin-sealed and molded with the molten resin 31. Is cured to form a cured resin to form a resin-sealed substrate (product).
At this time, on the resin-sealed substrate, a cured resin molded body 9 portion and a substrate outer peripheral portion 16 that is not resin-sealed and formed are formed.
[0015]
Also, as shown in FIG. 1, the intermediate plate 3 is provided in a state penetrating the intermediate plate 3 and fits the resin molded body 9 side mounted on the substrate 6 and a lower mold And an inclined portion 18 for holding the film, which is formed so as to cover the mold surface of the second mold and to tighten and clamp the mold.
In addition, the lower mold 2 is provided with the seal member 5 provided on the lower mold surface 13 having at least the inside of the cavity space 29 as the outside air blocking space 32, and forcibly discharges air and the like from the inside of the outside air blocking space 32. And an air suction / discharge hole 19 that penetrates the lower mold surface 13 and communicates with the evacuation mechanism.
The lower mold surface 13 is provided with a planar position A provided with the seal member 5 at the outermost outer periphery, and is formed lower than the planar position A inside the lower mold surface 13 and includes first and second holding members to be described later. A concave bottom position B in the concave 20 in which the 22 and 23 can be fitted is formed, and a convex top position C in the convex 21 formed higher than the plane position A is formed in a substantially central portion. I have.
[0016]
The first holding member 22 is provided with a through hole 27 at a substantially central portion so as to protrude at least the top surface of the convex portion 21 of the lower die 2, and a supporting member 24 which can penetrate the concave bottom surface B and move up and down. For example, a first elastic member 25 such as a spring is embedded in the lower mold 2 via a support member 24, and when the two molds 2 and 3 shown in FIG. The first elastic member 25 is moved up on the bottom surface of the member 24 so that at least the top surface of the first holding member 22 is higher than the top position C of the convex portion, and the first holding member 22 is on standby. When the mold 3 is completely clamped, the top surface of the first holding member 22 and the plane position A are configured to be on the same plane.
Further, the second holding member 23 has, for example, an L-shape, and is provided with an inclined portion 28 that is joined to the inclined portion 18 of the intermediate plate 3 via the release film 4 and has at least a convex portion. The L-shaped top surface of at least the vertical portion can protrude through the through hole 27 of the first holding member 22 in a state where it penetrates the substantially central portion so that the top surface of the first holding member 21 can protrude. A second elastic member 26 such as a spring, for example, attached to the bottom surface of the holding member 23 is embedded in the lower mold 2, and when the two molds 2 and 3 shown in FIG. The top surface of the second holding member 23 is configured to stand by on the same plane as the top position C of the convex place by extending, so that the two dies 2 and 3 shown in FIG. Of the outer peripheral bottom surface of the first holding member 22 and the L-shaped horizontal portion of the second holding member 23 The first and second holding members 22 and 23 move downward by contact with the surfaces, and the bottom surface of the second holding member 23 contacts the concave bottom position B, so that the top surface of the second holding member 23 is convex. It is configured to be lower than the top surface position C and higher than the plane position A.
When the two dies 2 and 3 shown in FIG. 1 are opened, the release film 4 held horizontally while being stretched to a predetermined tension is supplied and sent out by the release film supply mechanism. It is configured.
[0017]
Therefore, when the substrate 6 on which the chip 7 and the wire 8 are mounted is molded with resin using the molds 1, 2, and 3 mounted on the apparatus of the present embodiment, first, the upper mold 1, the lower mold 2, and the middle While the plate 3 is open, the substrate 6 with the resin molded body 9 facing downward is supplied between the upper mold 1 and the upper mold surface 11 of the intermediate plate 3. The release film 4 is supplied between the lower mold surface 12 and the lower mold 2 (see FIG. 1).
Next, the fixed surface of the substrate 6 on which the resin molded body 9 is not mounted is fixed at a predetermined position of the upper die surface 10 of the substrate fixing means 14 of the upper die 1, and the intermediate plate 3 is moved downward so that a predetermined tension is applied. The release film 4 stretched and stretched comes into contact with the lower mold side mold surface 12 of the intermediate plate 3, and then the release film 4 and the first holding member 22 that contact the lower mold side mold surface 12. When the top surface contacts, the lower mold side mold surface 12 of the intermediate plate 3 and the top surface of the first holding member 22 hold the release film 4 (see FIG. 2).
[0018]
Next, by moving the intermediate plate 3 in the state of FIG. 2 further downward, the release film 4 covering the portion of the through hole 27 in the first holding member 22 has The top surface of the vertical portion of the second holding member 23 contacts and coats at substantially the same time, and then the intermediate plate 3 is further moved downward, so that the bottom surface of the first holding member 22 and the second holding member 23 Is in contact with the top surface of the horizontal portion, and the inclined portion 18 of the intermediate plate 3 and the inclined portion 28 of the second holding member 23 are joined to hold the release film 4 so that they are on the same plane. The release film 4 is covered with the top surface of the convex portion 21 of the lower mold surface 13 and the top surface of the vertical portion of the second holding member 23 under tension (see FIG. 3).
At this time, as shown in FIG. 3, the second holding member 23 does not move downward, and the bottom surface position B of the recess and the bottom surface of the second holding member 23 are separated from each other, and The lower mold side mold surface 12 is in contact with the sealing member 5 provided on the lower mold 2 via the release film 4, and the air suction / discharge hole 19 in the lower mold 2 is perpendicular from the bottom position B of the recess to the plane position A. Communicate in the direction.
In other words, when the two dies 2 and 3 shown in FIG. 3 are clamped, the cavity 17 of the intermediate plate 3 and the top surface of the convex portion 21 on the same plane, which is covered with the release film 4 under tension, are held in the second clamping state. A cavity space 29 formed by the top surface of the vertical portion of the member 23 is formed.
[0019]
Next, in a state where both dies 2 and 3 shown in FIG. 3 are clamped, for example, a required amount of the resin material composed of the granular resin 30 is uniformly supplied to the cavity space portion 29 from the resin material supply mechanism. At the same time, resin sealing molding is performed using a high-density granular resin 30 containing no release material.
At this time, it is preferable that the granular resin 30 is heated and melted by raising the temperature of the molds 1, 2, and 3 by a heater (not shown) embedded in the molds 1, 2, and 3 in advance.
Next, in a state where the molds 2 and 3 shown in FIG. 3 are clamped, the molds 2 and 3 move upward, so that the sealing member 5 provided on the upper mold surface 10 of the upper mold 1 and the intermediate plate 3 are moved upward. The granular resin 30 supplied to the cavity space 29 is heated and melted into the molten resin 31 while the mold side mold surface 11 is in contact with the molten resin 31 (see FIG. 4).
At this time, the upper die surface 10 and the outer peripheral portion 16 of the substrate 6 are in a state of being separated from the upper die surface 11 of the intermediate plate 3, that is, the die 1, 2, 3 shown in FIG. A state where the mold is clamped indicates an intermediate mold clamping state.
In other words, the intermediate mold clamping state shown in FIG. 4 forms the outside air blocking space 32 that makes at least the inside of the cavity space 29 into the outside air blocking state, and forces air and the like from the outside air blocking space 32 to the vacuuming mechanism. To discharge (evacuate).
[0020]
Next, the resin molded body 9 side is gradually approached to the molten resin 31 in the cavity space 29 in the intermediate mold clamping state shown in FIG. Then, the upper die 1 and both dies 2 and 3 are gradually clamped so that the molten resin 31 is immersed in the chip 7 and the wire 8 (see FIG. 5).
At this time, the outer peripheral portion 16 of the substrate 6 abuts on the upper mold surface 11 of the intermediate plate 3, and the lower mold surface 12 of the intermediate plate 3 and the lower mold surface 13 at the plane position A are in contact with each other. The state in which the mold is clamped by holding it with the release film 4 interposed therebetween, that is, the state in which the molds 1, 2, and 3 shown in FIG.
In the complete mold clamping state shown in FIG. 5, the lower mold surface 13 and the top surface of the first holding member 22 at the plane position A are on the same plane, and the bottom surface of the first holding member 22 is The first and second holding members 22 and 23 move down to a position where the bottom surface of the second holding member 23 and the bottom surface position B of the recess come into contact with each other in a state of contact with the top surface of the horizontal portion of the holding member 23. As a result, the top surface of the vertical portion of the second holding member becomes lower than the top position B of the convex portion, that is, the resin is prevented so that the molten resin 31 in the cavity space 29 does not leak to the substrate outer peripheral portion 16. A resin amount adjusting means 33 for adjusting the amount is formed.
That is, the resin amount adjusting means 33 lowers the top surface of the vertical portion of the second holding member, which is the bottom surface of the cavity space portion 29, at the time of the resin sealing molding in the complete mold clamping state shown in FIG. Resin leakage of the molten resin 31 in the cavity space 29 can be prevented.
[0021]
Next, in a completely clamped state shown in FIG. 5, the resin molded body 9 mounted on the substrate 6 is cured to form a cured resin, and a resin-sealed substrate is molded. The resin-sealed substrate is mounted and fixed at a predetermined position of the substrate fixing means 14 of the upper die 1 with the resin molded body 9 side of the substrate facing downward, and the upper die 1 and both dies 2 and 3 It is opened and released from the release film 4 on the bottom surface of the cavity 29.
Next, the release film 4 held between the lower mold side mold surface 12 and the lower mold surface 13 of the intermediate plate 3 is opened by opening the intermediate plate 3 and the lower mold 2 to form the lower mold 2. When the first and second holding members 22 and 23 fitted on the first and second elastic members 25 and 26 are pushed back upward, the top surface of the first holding member 22 is supported via the support member 24. And the vertical position of the second holding member 23 is restored by moving upward on the same plane as the convex top position C. The first and second holding members 22 and 23 stand by separately (see FIG. 1).
At this time, the release film 4 used at the time of the resin sealing molding is stretched to a predetermined tension between the intermediate plate 3 and the lower die 2, and the lower die surface 12 of the intermediate plate 3 is stretched. And the lower mold surface 13 and are held horizontally (see FIG. 1).
In addition, from the completely clamped state shown in FIG. 5 until the upper mold 1 and the two molds 2 and 3 are opened, suction and discharge of air or the like by the vacuuming mechanism is stopped. I have.
Further, the used release film 4 after the resin sealing molding is sent out of the mold by the release film supply mechanism, and the release film 4 before use is transferred from the release film supply mechanism to the inside of the mold. It is configured to be supplied.
Further, if the upper mold 1 and the molds 2 and 3 are opened from the completely closed state shown in FIG. 5, the resin-sealed board is released from the board fixing means 14 and released. The substrate 6 on which the chip 7 and the wire 8 before the next resin encapsulation are mounted is supplied to the substrate fixing means 14 of the upper die 1 and is moved to a predetermined position. It is configured so that it can be mounted and fixed.
[0022]
In other words, since the intermediate plate 3 and the lower mold 2 are clamped to form the cavity structure 29 by sandwiching the release film 4, the mold structure in the conventional transfer molding is formed. The intermediate film 3 and the lower mold 2 are clamped without any pot, plunger, cull part, gate part and runner part, and the release film 4 is held between the two molds. A cavity space 29 is formed, and the upper mold 1 and the two dies 2 and 3 are clamped in an intermediate mold so that the inside of the cavity space 29 is cut off from the outside air. In this state, the upper die 1 and the two dies 2 and 3 fixed with the substrate side on which the electronic components (semiconductor chip 7) and the wires 8 are mounted face downward are completely clamped, so that the cavity space 29 is Heat melting By immersing and the chip 7 and wire 8 to resin-seal-molding the reduction has been in the resin material.
In addition, at the time of the above-mentioned resin sealing molding, the resin amount in the cavity space portion 29 can be adjusted by the resin amount adjusting means 33 formed in the cavity space portion 29.
In other words, by using a high-density resin material, which is a problem in the conventional resin molding, it is possible to efficiently remove the poor sliding of the plunger, the poor wire, and the adhesion of the resin residue on the mold surface that directly contacts the resin material. It is possible to solve this problem without weakening the adhesion between the electronic component and the resin material, thereby lowering the yield of the resin-sealed substrate (product), and using a high-density resin material without a release material. Stop molding can be performed.
Accordingly, it is possible to efficiently solve various problems in resin molding when the substrate 6 on which a plurality of semiconductor chips 7 as electronic components are mounted is molded using the resin molding molds 1, 2, and 3. It is possible to provide a method and an apparatus for resin-encapsulating and molding electronic components, which can solve the problem and improve the productivity of products.
[0023]
In the seal member 5 according to the present embodiment, if at least the cavity space portion 29 is in the outside air blocking state to form the outside air blocking space portion 32, the upper mold surface 10, the lower mold surface 13, and the upper mold surface of the intermediate plate 3 are formed. At least one of the side mold surface 11 and the lower mold surface 12 may be appropriately selected and provided, or the entire apparatus or the entire mold may be used as the outside air blocking space 32. This is also possible as appropriate.
[0024]
Further, the present invention may be carried out using a release film 4 in which an adhesive layer is formed on the release film 4 in this embodiment.
[0025]
Further, in the present embodiment, the substrate 6 before resin molding is mounted and fixed to the substrate fixing means 14 of the upper die 1 in the state shown in FIG. 2, but until the intermediate die clamping state shown in FIG. If the substrate 6 is mounted and fixed, it can be arbitrarily changed and implemented.
[0026]
In the present embodiment, in the intermediate mold clamping state where the molds 1, 2, and 3 shown in FIG. 4 are clamped, the above-described intermediate mold clamping state and the complete mold clamping state (see FIG. 5) are intermittently stopped. Alternatively, without stopping both dies 2 and 3, the mold clamping speed (both dies 2 and 3) can be maintained from the above-described intermediate clamped position to the fully clamped position. (Clamping speed) can be appropriately set so as to be performed continuously while decreasing the speed.
[0027]
Further, in the present embodiment, the mold for resin-sealing molding is constituted by the fixed upper mold 1, the intermediate plate 3 capable of reciprocating up and down, and the movable lower mold 2. However, the movable mold can be arbitrarily changed. It is also possible to carry out.
[0028]
Further, in the present embodiment, the first and second holding members 22 and 23 provided around the inclined portions 18 and 28 and the outer periphery of the lower mold 2 on the second holding member 23 of the intermediate plate 3 and the lower mold 2. With the configuration of the support member 24 and the first and second elastic members 25 and 26, the release film 4 is tensioned and covered on the top surface of the projection 21 of the lower mold surface 13 on the bottom surface of the cavity space 29. However, if the structure is such that the bottom surface of the cavity 29 is covered with the release film 4 by tension, the member, shape, material, arrangement and the like can be arbitrarily changed.
[0029]
Further, in the present embodiment, the resin molded body 9 composed of at least the semiconductor chip 7 and the wire 8 has been described with a configuration in which the resin molding is molded with the granular resin 30. Instead, it is also possible to employ a required amount of liquid resin or powdery resin as appropriate.
[0030]
Further, in the present embodiment, the configuration in which the wire-bonded electronic component is molded with resin is described. However, the above-described resin molding is also applied to a flip chip substrate or the like on which an electronic component without wires 8 is mounted. It is possible to apply molding, and in the case of a substrate without wires 8, it is also possible to adopt a configuration in which a required amount of tablet-like resin is supplied.
[0031]
In addition, when the resin-sealed substrate, the molds 2 and 3 and the release film 4 are separated from each other, the mold and the metal are at least in contact with the molten resin 31 so that the resin-sealed substrate can be easily released. The surface of the mold surface may be changed to a surface treatment or a material capable of obtaining a low release force, and may be appropriately changed.
[0032]
Also, a measuring device such as a pressure sensor may be buried so that the mold clamping pressure can be monitored via the release film 4 covering the top surface of the convex portion 21 of the lower mold 2, or the resin molded body 9 may be molded at the time of resin molding. Is immersed in the molten resin 31 to adjust the amount of resin by the resin amount adjusting means 33 provided in the cavity space 29, and the intermediate plate 3 in contact with the outer peripheral portion 16 of the substrate having a role of releasing the molten resin 31. It is also possible to form a dummy cavity portion (not shown) provided on the upper mold side mold surface 11 to further adjust the resin amount.
[0033]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .
[0034]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the board | substrate which mounted the several semiconductor chip which is an electronic component can solve various problems in resin molding at the time of resin molding using resin molding die efficiently. The present invention has an excellent effect of providing a method and an apparatus for resin-encapsulating and molding electronic components, which improves the productivity of products.
[Brief description of the drawings]
FIG. 1 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding apparatus for an electronic component according to the present invention, showing a state in which an upper mold, a lower mold, and an intermediate plate are opened.
FIG. 2 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing and molding apparatus for an electronic component according to the present invention, showing a state where an intermediate plate is moved downward.
FIG. 3 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding apparatus for an electronic component according to the present invention, showing a state where a substrate is mounted and a granular resin is supplied.
FIG. 4 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding apparatus for an electronic component according to the present invention, in which an upper mold, a lower mold, and an intermediate plate are clamped in an intermediate mold and evacuated. Indicates the status.
FIG. 5 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding apparatus for an electronic component according to the present invention, showing a state in which an upper mold, a lower mold, and an intermediate plate are completely clamped.
[Explanation of symbols]
1 Upper type
2 lower mold
3 Intermediate plate
4 Release film
5 Seal members
6 substrate
7 Semiconductor chip
8 wires
9 Resin molding
10 Upper mold surface
11 Upper mold side mold surface
12 Lower mold side mold surface
13 Lower mold surface
14 Substrate fixing means
15.19 Air suction discharge hole
16 Perimeter of substrate
17 cavities
18.28 Inclined part
20 recess
21 Convex place
22 First holding member
23 Second holding member
24 Supporting members
25 First elastic member
26 Second elastic member
27 Through hole
29 Cavity space
30 Granular resin
31 molten resin
32 Outside air blocking space

Claims (2)

上型と下型と前記両型の間に設けられ且つ貫通した状態の樹脂成形用キャビティを備えた中間プレートとから成る電子部品の樹脂封止成形用金型を搭載した装置と、前記した上型と中間型との間に供給する基板側とワイヤで電気的に接続した電子部品を装着した基板と、前記した中間プレートと下型との間に供給する離型フィルムとを用意する工程と、
前記した中間プレートと下型とを型締めして前記した両型間に前記した離型フィルムを挟持することにより、前記したキャビティと前記した離型フィルムを被覆した下型の金型面とから前記した電子部品とワイヤとを嵌装する樹脂成形用キャビティ空間部を形成する工程と、
前記したキャビティ空間部内に樹脂材料を供給して加熱溶融化する工程と、
前記した上型の金型面の所定位置に前記電子部品側を下方向に向けた状態で前記基板を供給セットした状態で且つ少なくとも前記したキャビティ空間部を外気遮断状態にして真空引きした状態で前記した上型と中間プレートとを型締めすることにより、前記したキャビティ空間部内における加熱溶融化された樹脂材料内に前記した電子部品とワイヤとを浸漬して樹脂封止成形する工程と、
前記した樹脂封止成形工程時に、前記したキャビティ空間部に形成される樹脂量調整手段にて、前記したキャビティ空間部内に前記した電子部品とワイヤとを浸漬して前記した加熱溶融化された樹脂材料の樹脂量を調整する工程とを含むことを特徴とする電子部品の樹脂封止成形方法。
An apparatus mounted with a mold for resin-sealing molding of an electronic component comprising an upper mold, a lower mold, and an intermediate plate provided with a resin molding cavity in a state penetrated between the two dies; A step of preparing a substrate on which the electronic component electrically connected by wires and the substrate side to be supplied between the mold and the intermediate mold is mounted, and a release film to be supplied between the intermediate plate and the lower mold. ,
By clamping the intermediate plate and the lower mold, and holding the release film between the two dies, the cavity and the lower mold surface coated with the release film are removed from the mold surface. Forming a cavity space for resin molding for fitting the electronic component and the wire,
A step of supplying a resin material into the cavity space and heating and melting the resin material,
In a state where the substrate is supplied and set in a state where the electronic component side faces downward at a predetermined position on the mold surface of the upper mold, and in a state where at least the cavity space described above is evacuated to an outside air blocking state. By clamping the upper mold and the intermediate plate, a step of immersing the electronic component and the wire in a resin material that has been heated and melted in the cavity space to perform resin sealing molding,
At the time of the resin encapsulation molding step, the electronic component and the wire are immersed in the cavity space by the resin amount adjusting means formed in the cavity space, and the resin is heated and melted. Adjusting the amount of resin of the material.
上型と該上型に対向配置した下型と前記した両型間に設けた中間プレートとから成る電子部品の樹脂封止成形用金型と、該上型の所定位置に設けられ且つ基板側とワイヤとで電気的に接続した電子部品を装着した基板を前記した電子部品側を下方向に向けた状態で固定する基板固定手段と、前記した中間プレートに貫通した状態で設けられ且つ前記した基板に装着した電子部品側を嵌装するキャビティと、前記した下型の金型面を被覆する離型フィルムを前記した下型と中間プレートとの間に供給する離型フィルム供給機構と、前記した下型と中間プレートとを型締めして前記した離型フィルムを挟持することにより前記したキャビティと前記した離型フィルムを被覆した下型の金型面とで形成されるキャビティ空間部内に樹脂材料を供給する樹脂材料供給機構と、前記したキャビティ空間部に形成され且つ前記したキャビティ空間部内に前記した電子部品とワイヤとを加熱溶融化された前記樹脂材料に浸漬して樹脂量を樹脂封止成形時に調整する樹脂量調整手段と、前記した上型の金型面と前記した下型の金型面と前記した中間プレートの上型側及び下型側の金型面における少なくとも一方の金型面に設けられ且つ少なくとも前記したキャビティ空間部内を外気遮断状態にして外気遮断空間部を形成するシール部材と、前記した外気遮断空間部内から空気等を強制的に吸引排出する真空引き機構とを含むことを特徴とする電子部品の樹脂封止成形装置。A resin-sealing-molding mold for an electronic component comprising an upper mold, a lower mold opposed to the upper mold, and an intermediate plate provided between the molds; Board fixing means for fixing the board on which the electronic components electrically connected by the wire and the electronic component are mounted with the above-mentioned electronic component side facing downward; and A cavity for fitting the electronic component side mounted on the substrate, a release film supply mechanism for supplying a release film covering the mold surface of the lower die between the lower die and the intermediate plate, In the cavity space formed by the above-mentioned cavity and the mold surface of the lower mold coated with the above-mentioned release film by clamping the above-mentioned release film by clamping the lower die and the intermediate plate, Supply material A resin material supply mechanism and an electronic component and a wire formed in the cavity space and immersed in the resin material that is heated and melted in the cavity space to adjust the amount of resin during resin sealing molding. Resin amount adjusting means to be provided, provided on at least one of the upper mold surface, the lower mold surface, and the upper and lower mold surfaces of the intermediate plate. And a sealing member for forming at least the above-mentioned cavity space portion so as to block the outside air to form an outside air blocking space portion, and a vacuuming mechanism for forcibly sucking and discharging air and the like from the inside of the outside air blocking space portion. Resin molding equipment for electronic parts.
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