JP5027451B2 - Resin sealing molding method of semiconductor chip - Google Patents

Description

  In the present invention, a resin material (liquid resin or the like) is placed in a mold cavity using an electronic component resin molding mold (electronic component compression mold) in a mold cavity. ) In a resin sealing molding method for electronic parts to be compression molded.

  Conventionally, a plurality of required semiconductor chips mounted on a substrate are individually molded by resin sealing (single-sided molding) by the top gate method. This method is performed as follows. ing.

  That is, using a mold for resin sealing molding of an electronic component (for example, an upper mold, a middle mold having a cavity, and a lower mold), first, a substrate is supplied and set at a predetermined position of the mold, and the above-described mold is used. The mold is clamped and the above-described required semiconductor chips are individually fitted into the mold cavities, and then the gate (top gate) provided on the top surface of the mold cavity is described above. By injecting and filling a resin material heated and melted into the mold cavity, each of the semiconductor chips described above is individually sealed and molded into individual packages corresponding to the shape of the mold cavity. Yes.

For example, in the case of a product in which packages are stacked, a product in a POP (Package On Package) format, etc., a mounting land (external electrode portion) on the substrate around the outer periphery of the package formed in the mold cavity described above Therefore, a configuration in which the gate and runner are arranged in a plane on the substrate, that is, a so-called side gate method cannot be employed.
Therefore, in the case of a POP type product or the like, that is, a product in which the external electrode portion of the substrate is formed on the outer periphery of the package, the above-described top gate method is adopted.

JP 2004-179283 A

However, in recent years, packages formed by the top gate method tend to be thinned. For example, when the gate resin is cut and removed, a connection portion with the gate resin in each of the thin packages described above is broken and damaged. There is an adverse effect that appearance defects (such as chipping) are likely to occur in the package described above.
Therefore, in order to solve the above-described adverse effects, compression molding by a cavity down method has been studied.
That is, a method has been studied in which a plurality of required semiconductor chips mounted on a substrate by supplying a liquid resin into the lower mold cavity are immersed in the resin in the lower mold cavity and compression molded. Since the liquid resin is supplied into the lower mold cavity, the resin supply time becomes long, and there is an adverse effect that the resin hardens early in the lower mold cavity.
Further, a batch application method in which liquid resin is applied to a plurality of required semiconductor chips mounted on the substrate as described above has been studied. However, since the liquid resin is applied to almost the entire surface of the substrate, There is an adverse effect that resin (resin beam) adheres to the mounting land (external electrode portion) and cannot be molded.
Therefore, when a plurality of required semiconductor chips mounted on a substrate having an external electrode portion on the outer periphery of each package are molded into each individual package by resin sealing, the aforementioned appearance defects of the package or early resin Problems with resin molding such as curing and adhesion of the resin to the external electrode portion of the substrate have occurred.

  That is, in the present invention, when a plurality of required semiconductor chips mounted on a substrate having an external electrode portion on the outer periphery of each package are molded into each individual package by resin sealing, It is an object of the present invention to provide a resin sealing molding method for an electronic component capable of efficiently solving problems in resin molding such as early curing of resin and adhesion of resin to an external electrode portion of a substrate. .

In order to solve the above technical problem, a semiconductor chip resin sealing molding method according to the present invention includes a substrate supply unit for supplying and setting an upper mold having a resin molding cavity and a substrate on which a plurality of required semiconductor chips are mounted. A step of preparing a mold for resin-sealing molding of a semiconductor chip comprising a lower die having a step, a step of heating the aforementioned die to a predetermined temperature, and a mold release on the inner surface of the upper die cavity and the upper die surface A step of coating a film, and a step of dripping a required amount of liquid resin individually into a required range of a plurality of semiconductor chip top surfaces mounted on the substrate in a state where the substrate is not heated by the mold described above A step of supplying and setting the liquid resin dropping substrate to the substrate supply section of the mold, a step of clamping the mold with a required mold clamping pressure, and a mold clamping step of the mold The upper mold A step of fitting a semiconductor chip coated with a liquid resin into the upper mold cavity in a state in which a mold release film is coated on the inner surface of the cavity, and during the mold clamping process, the upper mold surface is In the coated release film, at least during the step of covering the external electrode provided on the outer periphery of the cavity opening portion corresponding to the surface of the substrate and the step of mounting the semiconductor chip described above, In the package corresponding to the shape of the upper mold cavity coated with the mold film, a step of resin sealing molding with a liquid resin, and a pressing member provided on the top surface of the upper mold cavity during the resin sealing molding step And pressing the resin in the upper mold cavity uniformly and separately through a release film coated on the inner surface of the upper mold cavity .

  Further, in the resin sealing molding method of the electronic component according to the present invention for solving the technical problem described above, at least the air is forcibly sucked and discharged from the upper mold cavity during the resin sealing molding process. The method includes a step of evacuating.

  According to the present invention, when a plurality of required semiconductor chips mounted on a substrate having an external electrode portion on the outer periphery of each package are resin-sealed and molded into each individual package, the external appearance of the package or the resin Excellent effect that it is possible to provide a resin sealing molding method for electronic parts that can efficiently solve the problems of resin molding such as early curing of resin and adhesion of resin to the external electrode portion of the substrate It plays.

Hereinafter, it demonstrates in detail based on an Example figure.
FIG. 1 (1), FIG. 1 (2), and FIG. (3) are substrates used in the present invention.
2, 3, and 4 are resin-sealing molds for electronic parts (molds for compression molding of electronic parts) used in the present invention.

(Substrate structure)
First, the substrate used in the present invention will be described.
That is, as shown in FIG. 1A, the substrate 2 is configured by mounting a plurality of required electronic components 3 (hereinafter referred to as semiconductor chips), and the semiconductor chip 3 and the substrate 2 side described above. The electronic circuit (internal electrode portion) is electrically connected by a gold wire 4.
Although not shown, in the above-described substrate 2, individual packages 5 (the above-described substrate 2) molded in an upper mold cavity 10 provided in a resin sealing molding die 1 of an electronic component described later. The substrate mounting land (external electrode portion) is formed on the outer periphery of the cavity opening equivalent portion on the surface of the substrate.
Further, in the present invention, as shown in FIG. 1 (2), a liquid resin 9 (resin material) having a required amount of resin is separately dropped onto a plurality of required semiconductor chips 3 mounted on the substrate 2 described above. A resin application mechanism [dispenser 8 in the example shown in FIG. 1 (2)] is used.
That is, outside the mold 1 described later (in a state where it is not heated by the mold 1 described later), the semiconductor chip 3 (on the top surface side) mounted on the substrate 2 by the dispenser 8 in advance. A liquid resin 9 having a required amount of resin is separately dropped, and the liquid resin 9 can be applied to the required range of the semiconductor chip 3.

(Mold configuration)
Next, a resin sealing molding die 1 (electronic component compression molding die) for an electronic component according to the present invention will be described.
That is, as shown in FIG. 2, the above-described mold 1 is configured by providing an upper mold 6 and a lower mold 7 disposed opposite to the upper mold 6.
The lower die 7 is provided with a substrate supply unit 13 (lower die surface) for supplying and setting the substrate 2 on which the required plurality of semiconductor chips 3 are mounted, and the upper die 6 described above. The upper die cavity 10 is provided in which the required plurality of semiconductor chips 3 mounted on the substrate 2 are individually fitted.
Accordingly, the above-described upper and lower dies 6 and 7 are clamped with a required clamping pressure, so that a plurality of required semiconductor chips 3 mounted on the substrate 2 can be individually fitted. Has been.
The required clamping pressure of the upper and lower molds 6 and 7 is the molding pressure for compression molding according to the present invention.
Further, the above-described substrate supply unit 13 employs a configuration in which the substrate 2 is adsorbed and fixed by forcibly sucking and discharging air from an adsorption hole (not shown) provided in the substrate supply unit 13. May be.

Further, in the present invention, it is configured so that the release film 11 (release film) can be stretched between the upper and lower molds 6 and 7, and the upper mold is not shown in the figure. 6, the release film 11 is formed on the inner surface of the upper mold cavity 10 by forcibly sucking and discharging air from the inner surface of the upper mold cavity 10 and a suction hole (not shown) provided in the upper mold surface. A release film adsorbing mechanism (not shown) for covering along the shape and the shape of the upper mold surface is provided.
Accordingly, by clamping the above-described upper and lower molds 6 and 7 in a state where the aforementioned release film 11 is covered along the shape of the inner surface of the upper mold cavity 10 by the aforementioned suction mechanism, the above-described substrate is obtained. 2 is configured so that the required plurality of semiconductor chips 3 attached to 2 can be individually fitted into the upper mold cavity 10 (within the upper mold cavity 10) covered with the release film 11 described above. Yes.
In the present invention, the upper and lower molds 6 and 7 are clamped at the required clamping pressures so that the upper mold cavity 10 covered with the release film 11 (the upper mold cavity described above) is used. The semiconductor chip 3 is configured to be compression-molded with the resin 9 (within 10).
That is, it corresponds to the shape of the upper mold cavity 10 covered with the above-described release film 11 (
The semiconductor chip 3 described above can be separately molded in a package 5 (resin molding) corresponding to the shape of the upper mold cavity 10.
Therefore, by adopting the compression molding method according to the present invention as compared with the conventional top gate method, it is possible to efficiently prevent chipping or the like that occurs when the gate resin is cut and removed, resulting in poor package appearance. Can be efficiently prevented.

Further, when the upper and lower molds 6 and 7 are clamped at a required clamping pressure, at least the cavity opening on the surface of the substrate 2 is formed on the upper mold surface coated with the release film 11 described above. The external electrode portion provided on the outer periphery of the corresponding portion can be covered.
Therefore, on the surface of the substrate 2 described above, the resin 9 (from the above-described upper mold cavity 10) from the cavity opening equivalent portion (resin heated and melted in the above-described upper mold cavity 10) or liquid The resin can be efficiently prevented from entering the external electrode portion described above.

Further, a pressing member that presses the resin in the above-described upper mold cavity 10 uniformly and separately at a required pressure via the above-described cavity-covered release film 11 on the top surface of the upper mold cavity 10 in the above upper mold. 12 is provided.
That is, the above-described semiconductor chip is formed in each upper mold cavity 10 by pressing the resin 9 in the above-described upper mold cavity 10 equally and individually with the required pressing force by the above-described pressing member 12. 3 is configured to be able to adjust and absorb the variation of the resin amount of the liquid resin 9 dropped onto the resin 3.
Further, the above-described upper and lower molds 6 and 7 are clamped at the required clamping pressure, and the above-described pressing member 12 is used to clamp the resin 9 in the upper mold cavity 10 with the required pressing force. The semiconductor chip 3 is configured to be compression-molded in the upper mold cavity 10 by being pressed evenly and separately.
Therefore, by using the pressing member 12 described above, the semiconductor chip 3 described above can be separately molded in the package 5 corresponding to the shape of the upper mold cavity 10 described above.
In the illustrated example, a compression spring 14 (elastic member) is used as an equal pressure mechanism that presses the pressing member 13 evenly with a required pressing force and separately.
In the illustrated example, the pressing member 12 presses the resin 9 in the upper mold cavity 10 through the release film 11 described above.

In addition, an O-ring 15 (outside air blocking member) is disposed around the required plurality of upper mold cavities 10 around the required plurality of upper mold cavities 10 in the upper mold 6. The above-described O-ring 15 is configured to protrude from the above-described upper mold surface at a required height.
Therefore, at the time of the intermediate mold clamping of the upper and lower molds 6 and 7, the intermediate mold is clamped while holding the mold surfaces of the upper and lower molds 6 and 7 at a required distance, and the outside air provided in the upper mold 6 is also closed. By bringing the blocking member 15 (O-ring) into contact with the mold surface of the lower mold 7 described above, the inside of each cavity 10 and the space formed by the both mold surfaces are in an outside air blocking state, and the outside air blocking space. It is comprised so that a part can be formed.
Further, although not shown in the figure, the above-described mold 1 is forcibly sucked and discharged (by evacuating from the outside air blocking space) as described above. A vacuum evacuation mechanism such as a vacuum pump for setting the inside of the outside air blocking space to a required degree of vacuum is provided.
Accordingly, the upper and lower mold surfaces of the upper and lower molds 6 and 7 that are in the outside air blocking state are clamped from the middle mold clamping of the upper and lower molds 6 and 7 that are in the outside air blocking state. While the above-described upper and lower molds 6 and 7 are continuously clamped until they are completely clamped together, the air inside the outside air blocking space is forcibly sucked and discharged by the vacuuming mechanism, The inside of the above-described outside air blocking space (at least inside the upper mold cavity 10) can be set to a required degree of vacuum.
Needless to say, the above-described evacuation mechanism is configured so that at least the inside of the upper mold cavity 10 covered with the above-described release film can be set to a required degree of vacuum.

Although not shown in the figure, heating means for heating the mold 1 to a predetermined temperature is provided at a required portion of the mold 1 described above.
Therefore, as a matter of course, before the liquid resin dropping substrate 2 is supplied to the mold 1, the mold 1 (both upper and lower molds 6 and 7) is previously set by the heating means described above. It is comprised so that it can heat even to the temperature of.

(Molding method)
First, the mold 1 (upper and lower molds 6 and 7) is heated to a predetermined temperature, and the above-described release film 11 is covered in the upper mold cavity 10 and the upper mold surface.
At this time, the substrate 2 described above is not supplied and set to the mold 1 described above.
Next, outside the above-described mold 1 (in a state where the above-described substrate 2 is not heated by the above-described mold 1), as shown in FIGS. By dropping the liquid resin 9 in the required amount of the resin by the dispenser 8 onto the top surface side of the required plurality of semiconductor chips 3 mounted, the required range on the top surface side of the semiconductor chip 3 is achieved. A liquid resin is coated (see FIGS. 1 (2) and 1 (3)).
At this time, since the liquid resin 9 is dropped on each of the required plurality of semiconductor chips 3 mounted on the substrate 2 outside the mold 1, the cavity down method as in the conventional example is used. It is possible to efficiently prevent the resin from curing early.
The required amount of resin in the liquid resin 9 to which the semiconductor chip 3 is dropped is a capacity obtained by subtracting the capacity of the semiconductor chip 3 from the capacity of the upper mold cavity 10.
In addition, regarding the required range of the liquid resin on the top surface side of the semiconductor chip 3 described above, in the illustrated example, the liquid resin 9 described above reaches the vicinity of the wire 4 on the top surface side of the semiconductor chip 3 by the surface tension. It is formed by coating.

Next, as shown in FIG. 3, the liquid resin dropping substrate 2 [see FIG. 1 (3)] is supplied and set to the lower mold substrate supply unit 13.
Next, as shown in FIG. 4, the above-described upper and lower molds 6 and 7 are clamped at a required clamping pressure, so that each of the upper mold cavities 10 covered with the above-mentioned release film is described above. By fitting the semiconductor chip 3 in a state in which the liquid resin 9 is dropped and coated, the semiconductor chip 3 is individually compressed with the liquid resin 9 in the individual packages 5 corresponding to the shape of the upper mold cavity 10 described above. Molding (resin sealing molding).
At this time, a required pressure (clamping pressure) is applied to the resin 9 in the upper mold cavity 10 described above, and the liquid dropped on the top surface of the semiconductor chip 3 in the upper mold cavity 10. The entire semiconductor chip 3 described above is covered and encapsulated (encapsulated) with the resin 9.
Further, at this time, on the surface of the substrate described above, the external electrode portion of the substrate provided from the corresponding portion of the opening in each upper mold cavity to the outer periphery thereof, that is, the outer periphery of the corresponding portion of the cavity opening described above. In addition, it is possible to efficiently prevent the resin from entering, and it is possible to efficiently prevent the resin from adhering to the external electrode portion of the substrate.
After the time required for curing has elapsed, the above-described upper and lower molds 6 and 7 are opened to cover the required plurality of semiconductor chips 3 mounted on the aforementioned substrate 2 and to cover the aforementioned release film 11 separately. Resin sealing molding (compression molding) can be performed in each package 5 corresponding to the shape of the upper mold cavity.

That is, as described above, a configuration in which the required plurality of semiconductor chips 3 mounted on the substrate 2 in the above-described upper mold cavity 10 are individually compressed into individual packages 5 (a configuration without using a top gate). Therefore, it is possible to efficiently prevent defects in the appearance of the package such as chips formed when cutting and removing the gate resin by the top gate method as shown in the conventional example.
In addition, as described above, outside the above-described mold 1 (in a state where the above-described substrate 2 is not heated by the above-described mold 1), liquid is applied to the required plurality of semiconductor chips 3 mounted on the above-described substrate 2. Since the configuration in which the resin 9 is dropped and applied separately is adopted, the heating of the resin by the mold 1 can be efficiently prevented, and the early curing of the resin by the cavity down method as shown in the conventional example is efficiently performed. Can be prevented.
Further, as described above, the upper and lower molds 6 and 7 are clamped at a required clamping pressure in a state where the above-described release film 11 is covered in the above-described upper mold cavity 10 and the upper mold surface. Thus, the external electrode portion provided on the outer periphery of the portion corresponding to the cavity opening of the substrate can be covered with the release film 11 so that the inside of the upper mold cavity 10 (the portion corresponding to the cavity opening). From the above, it is possible to efficiently prevent the resin from entering the external electrode portion of the substrate 2 [in the gap between the substrate 2 (external electrode portion) and the release film 11 (upper mold surface) described above] It is possible to efficiently prevent the resin from adhering to the external electrode portion of the substrate by the batch application method as shown in the conventional example.
Therefore, according to the present invention, the appearance of the package by the top gate method as shown in the conventional example, the early curing of the resin by the cabinet down method, and the adhesion of the resin to the external electrode portion of the substrate by the batch coating method. It is possible to provide a resin sealing molding method for an electronic component that can efficiently solve the problems in resin molding.

Moreover, in an above-described Example, the structure which does not use the above-mentioned release film 11 is employable.
Therefore, similarly to the above-described embodiment, it is possible to provide a resin sealing molding method for an electronic component that can efficiently solve the above-described problems in resin molding.
In this case, the external electrode portion of the substrate 2 described above is covered with the above-described upper mold surface, and the resin enters the gap between the substrate 2 (external electrode portion) and the upper mold surface. Thus, it is possible to efficiently prevent the resin from adhering to the external electrode portion of the substrate by the batch application method as shown in the conventional example.

Further, in each of the above-described embodiments, it is possible to adopt a configuration in which the resin in the upper mold cavity 10 is pressed evenly and separately by the pressing member 12 with a required pressing force.
That is, when the upper and lower molds 6 and 7 are clamped (when the mold 1 is compression-molded), the resin 9 in the upper mold cavity 10 is evenly applied with the required pressing force by the pressing member 12 described above. In addition, by pressing each separately, it is possible to adjust and absorb the variation in the amount of the liquid resin dripped onto each of the required plurality of semiconductor chips 3 in the above-described upper mold cavity 10.
Accordingly, in the configuration using the pressing member 12 described above, a resin sealing molding method for an electronic component that can efficiently solve the above-described problems in resin molding can be provided, as in the above-described embodiment.
In the configuration using the pressing member 12 described above, the configuration in which the resin in the upper mold cavity 10 is pressed through the release film 11 described above, or the release film 11 described above is not used. A configuration in which the resin in the upper mold cavity 10 is pressed can be employed.

Further, in each of the above-described embodiments, it is possible to employ a configuration in which air is forcibly sucked and discharged from at least the above-described upper mold cavity when the upper and lower molds 6 and 7 are clamped.
That is, when the upper and lower molds 6 and 7 are clamped, an outside air blocking space portion (at least, formed by contacting the mold surface of the lower mold 7 and the outside air blocking member 15 provided on the upper mold 6 described above. It is possible to adopt a configuration in which air is forcibly sucked and discharged from the upper mold cavity 10).
Therefore, voids (bubbles) formed in the package 5 molded in the upper mold cavity 10 can be efficiently reduced.
In addition, in the configuration using the vacuuming mechanism described above, it is possible to provide a resin sealing molding method for an electronic component that can efficiently solve the above-described problems in resin molding as in the above-described embodiments. .
In addition, in the above-described configuration of evacuating from the outside air blocking space, at least the above-described configuration of evacuating from the inside of the upper mold cavity 10 coated with the release film 11, or at least without using the above-described release film 11, A configuration in which a vacuum is drawn from the above-described upper mold cavity 10 can be employed.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention. It is.

Further, with respect to the structure for evacuating from the above-described outside air blocking space, when the above-described upper and lower molds 6 and 7 are clamped between the middle molds, that is, between the mold surfaces of the above-described upper and lower molds 6 and 7 at an intermediate distance It is possible to employ a configuration in which vacuuming is performed instantaneously (in a short time) from the above-described outside air blocking space during mold clamping.
In this case, a configuration may be adopted in which vacuuming is continuously performed between the intermediate mold clamping and the complete mold clamping.

  In each of the above-described embodiments, a resin communication path that adjusts the resin in the upper mold cavity may be provided between the cavities 10 of the upper mold 6.

  In each of the above-described embodiments, the dropping range onto the semiconductor chip 3 may be a range that does not adhere to the external electrode portion of the substrate.

  Further, in each of the above-described embodiments, when the liquid resin 9 is dropped on the semiconductor chip 3 mounted on the substrate 2, it is sufficient that the liquid resin 9 is not heated, and the inside of the mold 1, For example, a configuration in which the liquid resin 9 is dropped onto the semiconductor chip 3 between the upper and lower molds 6 and 7 in the mold open state may be employed.

  In the above-described embodiment, a fluid pressurizing mechanism such as hydraulic pressure or pneumatic pressure may be adopted as an equal pressurizing mechanism that presses the pressing member 12 evenly and at a required pressure.

  In each of the above-described embodiments, the configuration using the liquid resin 9 is disclosed. However, as the resin material, a powdery resin material, a granular resin material, or a sheet-like resin material can be used.

  Further, in each of the embodiments described above, the single-layer semiconductor chip 3 has been described as an example of the electronic component. However, as the electronic component, a configuration in which a plurality of the semiconductor chips 3 described above are stacked is adopted. Can do.

1 (1), FIG. 1 (2), and FIG. 1 (3) are schematic front views schematically showing a substrate used in the resin seal molding method for an electronic component according to the present invention. ) Shows a substrate before molding, FIG. 1B shows a state in which a liquid resin is dropped on a semiconductor chip mounted on the substrate, and FIG. 1C shows a substrate on which the liquid resin is dropped. FIG. 2 is a schematic longitudinal sectional view schematically showing a resin sealing molding die (electronic component compression molding die) for an electronic component used in the resin sealing molding method for an electronic component according to the present invention. The mold open state of the above-described mold is shown. FIG. 3 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 2, in which the liquid resin dropping substrate shown in FIG. 1 (3) is supplied to the substrate supply unit provided in the above-described mold. Shows the state. FIG. 4 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 2, and shows a mold clamping state of the above-described mold.

1. Mold for resin sealing molding of electronic parts (mold for compression molding of electronic parts)
2 Substrate 3 Semiconductor chip (electronic component)
4 Wire 5 Package 6 Upper mold 7 Lower mold 8 Dispenser 9 Liquid resin 10 Upper mold cavity 11 Release film (release film)
12 Pressing member 13 Substrate supply unit 14 Compression spring (elastic member)
15 O-ring (outside air blocking member)

Claims (2)

Preparing a resin mold for molding a semiconductor chip consisting of an upper mold having a resin molding cavity and a lower mold having a substrate supply unit for supplying and setting a substrate on which a plurality of semiconductor chips are mounted;
Heating the mold to a predetermined temperature;
A step of coating the inner surface of the upper mold cavity and the upper mold surface with a release film;
Dropping the required amount of the liquid resin into the required range of the required top surfaces of the plurality of semiconductor chips mounted on the substrate in a state where the substrate is not heated by the mold described above;
Supplying and setting the liquid resin dropping substrate as described above to the substrate supply part of the mold,
A step of clamping the above-described mold with a required clamping pressure;
A step of fitting a semiconductor chip coated with a liquid resin into the upper mold cavity in a state where a mold release film is coated on the inner surface of the upper mold cavity during the mold clamping process;
A step of covering at least the outer periphery of the portion corresponding to the cavity opening on the surface of the substrate with a release film covering the upper mold surface in the mold clamping step of the mold; ,
In the above-described semiconductor chip fitting step, a step of resin-sealing each separately with a liquid resin in a package corresponding to the shape of the upper mold cavity coated with the release film,
During the resin sealing molding step, the resin in the upper mold cavity is uniformly and separately pressed through a release film coated on the inner surface of the upper mold cavity with a pressing member provided on the top surface of the upper mold cavity. And a resin sealing molding method for a semiconductor chip . The method of resin-encapsulating a semiconductor chip according to claim 1, further comprising a step of forcibly sucking and discharging air from the upper mold cavity and evacuating at least during the resin-encapsulating molding process.

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