JP2626971B2 - Resin encapsulation molding method and mold for electronic parts - Google Patents

Resin encapsulation molding method and mold for electronic parts

Info

Publication number
JP2626971B2
JP2626971B2 JP7113695A JP11369595A JP2626971B2 JP 2626971 B2 JP2626971 B2 JP 2626971B2 JP 7113695 A JP7113695 A JP 7113695A JP 11369595 A JP11369595 A JP 11369595A JP 2626971 B2 JP2626971 B2 JP 2626971B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
mold
recess
setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7113695A
Other languages
Japanese (ja)
Other versions
JPH08288326A (en
Inventor
道男 長田
Original Assignee
トーワ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トーワ株式会社 filed Critical トーワ株式会社
Priority to JP7113695A priority Critical patent/JP2626971B2/en
Priority to PL95320829A priority patent/PL183619B1/en
Publication of JPH08288326A publication Critical patent/JPH08288326A/en
Application granted granted Critical
Publication of JP2626971B2 publication Critical patent/JP2626971B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】この発明は、プラスチック製等の
柔軟性を有する板状部材に形成したＩＣ等の電子部品を
樹脂材料にて封止成形する電子部品の樹脂封止成形方法
及び樹脂封止成形用金型の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing molding method for an electronic component, in which an electronic component such as an IC formed on a flexible plate member made of plastic or the like is molded with a resin material. The present invention relates to an improvement in a die for stopping molding.

【０００２】[0002]

【従来の技術】従来より、トランスファモールド法によ
って、リードフレームに装着した電子部品を樹脂封止成
形することが行われているが、この方法は、樹脂封止成
形用の金型を用いて、通常、次のようにして行われてい
る。2. Description of the Related Art Conventionally, an electronic component mounted on a lead frame is resin-molded by a transfer molding method. However, this method uses a resin molding die. Usually, it is performed as follows.

【０００３】即ち、予め、上記した成形用金型における
固定上型及び可動下型を加熱手段にて樹脂成形温度にま
で加熱すると共に、上記した上下両型を型開きする。次
に、電子部品を装着したリードフレームを上記下型の型
面における所定位置に供給セットすると共に、樹脂材料
を下型ポット内に供給する。次に、上記下型を上動し
て、該上下両型を型締めする。このとき、電子部品とそ
の周辺のリードフレームは、該上下両型に対設された上
下両キャビティ内に嵌装セットされることになり、ま
た、上記ポット内の樹脂材料は加熱されて順次に溶融化
されることになる。次に、上記したポット内の樹脂材料
をプランジャにより加圧して溶融化された樹脂材料を移
送用通路を通して上記上下両キャビティ内に注入充填さ
せると、該上下両キャビティ内の電子部品とその周辺の
リードフレームは、該両キャビティの形状に対応して成
形される樹脂封止成形体内に封止されることになる。従
って、上記した溶融樹脂材料の硬化に必要な所要時間の
経過後に、上記した上下両型を型開きすると共に、上記
両キャビティ内の樹脂封止成形体とリードフレーム及び
移送用通路内の硬化樹脂を該両型に設けられたエジェク
ターピンにて離型するようにしている。That is, the fixed upper die and the movable lower die in the above-mentioned molding die are heated to the resin molding temperature by a heating means, and the upper and lower dies are opened. Next, the lead frame on which the electronic components are mounted is supplied and set at a predetermined position on the mold surface of the lower mold, and the resin material is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and the lead frame around it are fitted and set in the upper and lower cavities opposed to the upper and lower molds, and the resin material in the pot is heated and sequentially heated. It will be melted. Next, when the resin material in the pot is pressurized by a plunger and the molten resin material is injected and filled into the upper and lower cavities through a transfer passage, the electronic components in the upper and lower cavities and the peripheral parts thereof are removed. The lead frame is sealed in a resin-sealed molded body that is molded according to the shapes of the two cavities. Therefore, after the required time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the resin sealing molded body in both the cavities and the cured resin in the lead frame and the transfer passage are removed. Are released by ejector pins provided on both the molds.

【０００４】ところで、上記したリードフレームには、
通常、金属製のものが用いられているが、この金属製リ
ードフレームに代わるものとして、所謂、ＰＣボードと
呼ばれるプリント回路板（Printed Circuit Board ）が
提案されている。このプリント回路板は従前の金属製リ
ードフレームと同様にして上記したようなトランスファ
モールドに使用することができる。例えば、図５の(1)
及び(2) に示すように、固定上型50及び可動下型51から
成る金型において、まず、該下型51の型面に設けられた
セット用凹所52にプリント回路板53を供給セットして上
下両型50・51 を型締めすると共に、上記プリント回路板
53の上面に装着した電子部品（図示なし）を上型50に設
けられたキャビティ54内に嵌装セットし、次に、溶融樹
脂材料を上型50に設けた移送用通路55を通してキャビテ
ィ54内に注入充填させることにより、上記プリント回路
板53の上面に装着した電子部品を該キャビティ54の形状
に対応して成形される樹脂封止成形体56・59 内に封止す
ることができる。By the way, the above-mentioned lead frame includes:
Usually, a metal board is used. As an alternative to the metal lead frame, a printed circuit board called a PC board has been proposed. This printed circuit board can be used for the transfer mold as described above in the same manner as the conventional metal lead frame. For example, (1) of FIG.
As shown in (2) and (2), in a mold including a fixed upper mold 50 and a movable lower mold 51, first, a printed circuit board 53 is supplied to a setting recess 52 provided on the mold surface of the lower mold 51. The upper and lower dies 50 and 51 and tighten the printed circuit board.
An electronic component (not shown) mounted on the upper surface of 53 is fitted and set in a cavity 54 provided in the upper mold 50, and then the molten resin material is passed through a transfer passage 55 provided in the upper mold 50 so as to fit in the cavity 54. The electronic components mounted on the upper surface of the printed circuit board 53 can be sealed in the resin sealing molded bodies 56 and 59 which are molded corresponding to the shape of the cavity 54.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、この種
のプリント回路板は、次のような問題がある。即ち、上
記プリント回路板53は、通常、その厚さにバラツキ（厚
さの範囲）があると共に、上記凹所52の深さＤの設定
は、該プリント回路板53の厚さの平均値を採用している
ため、該凹所の深さＤと該プリント回路板53の厚さとの
差は必然的に大きくなる場合がある。従って、上記両型
50・51 の型締状態において、上記凹所52の深さＤとプリ
ント回路板53の厚さの差に起因して上記両型50・51 間等
に構成された隙間に溶融樹脂材料が浸入して樹脂バリが
発生すると云う重大な弊害がある。However, this type of printed circuit board has the following problems. That is, the printed circuit board 53 generally has a variation in thickness (range of thickness), and the setting of the depth D of the recess 52 depends on the average value of the thickness of the printed circuit board 53. Because of this, the difference between the depth D of the recess and the thickness of the printed circuit board 53 may inevitably increase. Therefore, both types
In the mold clamping state of the molds 50 and 51, the molten resin material enters the gap formed between the molds 50 and 51 due to the difference between the depth D of the recess 52 and the thickness of the printed circuit board 53. As a result, there is a serious adverse effect that resin burrs are generated.

【０００６】例えば、図５(1) に示すように、プリント
回路板53a の厚さが最大値Ｈである場合において、両型
50・51 を通常の所定型締圧力にて型締めするときは、該
両型50・51 の型面間に隙間が形成されることになる。従
って、この状態で樹脂封止成形すれば、該型面間の隙間
に溶融樹脂材料が浸入して樹脂バリ57が発生することに
なる。また、これを防止する目的で、例えば、両型50・5
1 の型締圧力を所定の型締圧力よりも高めて両型の型面
間に隙間が生じないようにするときは、プリント回路板
53a の表面等に過大な型締圧力が加えられて該表面部に
配設された電子回路が切断されると云った重大な弊害が
生じる場合がある。For example, as shown in FIG. 5A, when the thickness of the printed circuit board 53a is the maximum value H,
When the molds 50 and 51 are clamped at a normal predetermined mold clamping pressure, a gap is formed between the mold surfaces of the molds 50 and 51. Therefore, if resin molding is performed in this state, the molten resin material enters the gaps between the mold surfaces, and resin burrs 57 are generated. For the purpose of preventing this, for example,
To increase the mold clamping pressure in Step 1 above the specified mold clamping pressure so that there is no gap between the mold surfaces of both molds, use a printed circuit board.
A serious adverse effect may occur in that an excessive clamping pressure is applied to the surface of 53a and the electronic circuit disposed on the surface is cut off.

【０００７】また、例えば、図５(2) に示すように、プ
リント回路板53b の厚さが最小値ｈである場合におい
て、両型50・51 を型締めすると、上記凹所52に供給セッ
トされたプリント回路板53b の上面と上記上型50の型面
との間に隙間が形成されることになる。従って、この状
態で樹脂封止成形すれば、該型面間の隙間に溶融樹脂材
料が浸入して樹脂バリ58が発生することになる。更に、
この場合においては、上記樹脂バリ58が形成されること
によって、該キャビティ54内で成形される樹脂封止成形
体59の厚さが、該樹脂バリ58の厚さに相当する分だけ増
加することになると云った問題がある。For example, as shown in FIG. 5 (2), when the thickness of the printed circuit board 53b is the minimum value h and the molds 50 and 51 are closed, the supply set A gap is formed between the upper surface of the printed circuit board 53b and the mold surface of the upper mold 50. Therefore, if resin molding is performed in this state, the molten resin material enters the gaps between the mold surfaces, and resin burrs 58 are generated. Furthermore,
In this case, by forming the resin burr 58, the thickness of the resin sealing molded body 59 formed in the cavity 54 is increased by an amount corresponding to the thickness of the resin burr 58. Problem.

【０００８】そこで、本発明は、上下両型間にプリント
回路板を供給セットして、該上下両型を通常の所定型締
圧力にて型締めしたときに、該プリント回路板を水平状
に弾性支持させると共に、該上下両型の型面と該プリン
ト回路板の上面を確実に合致させることにより、該上下
両型間に上記したような隙間が構成されないように改善
して、樹脂バリの形成を防止することができる樹脂封止
成形方法及び樹脂封止成形用金型を提供することを目的
とするものである。Accordingly, the present invention provides a printed circuit board which is supplied and set between upper and lower dies, and when the upper and lower dies are clamped at a normal predetermined clamping pressure, the printed circuit board is horizontally placed. By elastically supporting the upper and lower molds and the upper surface of the printed circuit board, it is ensured that the upper and lower molds are aligned with each other, so that the above-mentioned gap is not formed between the upper and lower molds. An object of the present invention is to provide a resin sealing molding method and a resin sealing molding die capable of preventing formation.

【０００９】また、本発明は、上下両型を通常の所定型
締圧力によって型締めしたときに、柔軟性を有するプリ
ント回路板の全体を過大に押圧することのないように構
成して、該プリント回路板に装着された電子回路が切断
される等の弊害を防止すると共に、該プリント回路板の
周縁部の所要個所を押圧することにより該プリント回路
板を該上下両型間に確実且つ適正に供給セットすること
ができる樹脂封止成形方法及び樹脂封止成形用金型を提
供することを目的とするものである。Further, the present invention is configured such that when the upper and lower dies are clamped by a normal predetermined clamping pressure, the entire flexible printed circuit board is not excessively pressed. The electronic circuit mounted on the printed circuit board is prevented from being adversely affected, such as being cut off, and the printed circuit board is pressed between the upper and lower dies by pressing a required portion of a peripheral portion of the printed circuit board. It is an object of the present invention to provide a resin encapsulation molding method and a resin encapsulation molding die that can be supplied and set.

【００１０】[0010]

【課題を解決するための手段】上記した技術的課題を解
決するための本発明に係る電子部品の樹脂封止成形方法
は、上型と下型とを対向配置させた金型を用いて、その
上下両型の型面に設けた凹所に電子部品を装着したプリ
ント回路板を供給すると共に、該両型の型締時におい
て、該プリント回路板に装着した電子部品を該両型の型
面に設けたキャビティ内に嵌装セットし、この状態で、
上記金型に設けたポット内に樹脂材料を供給して加熱溶
融化し、且つ、該溶融樹脂材料を移送用通路を通して上
記キャビティ内に注入充填することによって、該キャビ
ティ内に嵌装セットしたプリント回路板上の電子部品を
樹脂封止成形する電子部品の樹脂封止成形方法であっ
て、上記プリント回路板のセット用凹所の深さを、該プ
リント回路板の厚さの最小値よりも若干浅くなる形状に
設定する工程と、上記プリント回路板の底部を上記セッ
ト用凹所の底部に設けた係止部に係止させる工程と、上
記係止部に係止される範囲を除くプリント回路板の底部
を所要の弾性にて支持するプリント回路板の弾性支持工
程と、上記上下両型の型締時に、該両型の所定型締圧力
にて、上記セット用凹所底部の係止部に係止した上記プ
リント回路板の底部を強く押圧する工程とを有すること
を特徴とするものである。According to the present invention, there is provided a resin sealing molding method for an electronic component, which solves the above-mentioned technical problem, by using a mold in which an upper mold and a lower mold are opposed to each other. A printed circuit board on which electronic components are mounted is supplied to a recess provided on the mold surface of each of the upper and lower molds, and the electronic components mounted on the printed circuit board are mounted on the molds of both types when the molds of both the molds are clamped. Set in the cavity provided on the surface, in this state,
A printed circuit fitted and set in the cavity by supplying a resin material into a pot provided in the mold to be heated and melted, and injecting and filling the molten resin material into the cavity through a transfer passage. What is claimed is: 1. A resin sealing molding method for an electronic component, which comprises molding an electronic component on a board by resin molding, wherein the depth of the recess for setting the printed circuit board is slightly smaller than the minimum value of the thickness of the printed circuit board. A step of setting the shape of the printed circuit board to be shallow, a step of locking the bottom of the printed circuit board to a locking portion provided at the bottom of the setting recess, and a printed circuit excluding a range locked by the locking portion. A step of elastically supporting the printed circuit board for supporting the bottom of the board with required elasticity; and, at the time of clamping the upper and lower dies, at the predetermined clamping pressure of the two dies, the locking portion of the set recess bottom. The bottom of the printed circuit board locked to Is characterized in that a step of strongly pressing.

【００１１】また、上記した技術的課題を解決するため
の本発明に係る電子部品の樹脂封止成形用金型は、上型
と、該上型に対向配置した下型と、その上下両型の型面
に設けた電子部品を装着したプリント回路板のセット用
凹所と、該セット用凹所と対向する型面に設けたキャビ
ティと、該キャビティに連通接続させた溶融樹脂材料の
移送用通路とを備えた電子部品の樹脂封止成形用金型の
型締時に該プリント回路板を該両型の型面に設けたキャ
ビティ内に嵌装セットし、この状態で、上記金型に設け
たポット内に樹脂材料を供給して加熱溶融化し、且つ、
該溶融樹脂材料を移送用通路を通して上記キャビティ内
に注入充填することによって、該キャビティ内に嵌装セ
ットしたプリント回路板上の電子部品を樹脂封止成形用
金型であって、上記プリント回路板のセット用凹所の深
さを、該プリント回路板の厚さの最小値よりも若干浅く
なる形状に形成すると共に、上記セット用凹所には該セ
ット用凹所に嵌合セットした上記プリント回路板の底部
を係止させる係止部を形成し、更に、上記セット用凹所
には、上記係止部に係止される範囲を除くプリント回路
板の底部を所要の弾性にて支持するプリント回路板の弾
性支持部材を配設して構成したことを特徴とするもので
ある。[0011] Further, a mold for resin-sealing molding of an electronic component according to the present invention for solving the above-mentioned technical problems includes an upper die, a lower die opposed to the upper die, and both upper and lower dies. A recess for setting a printed circuit board on which electronic components are mounted provided on the mold surface, a cavity provided on the mold surface opposite to the recess for setting, and a transfer of the molten resin material connected to the cavity. The printed circuit board is fitted and set in the cavities provided on the mold surfaces of both the molds when the mold for resin-sealing molding of the electronic component having the passage is clamped, and in this state, the printed circuit board is provided in the mold. The resin material is supplied into the pot and melted by heating, and
An electronic component on a printed circuit board fitted and set in the cavity by injecting and filling the molten resin material into the cavity through a transfer passage. The depth of the set recess is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board, and the set recess is fitted in the set recess. A locking portion for locking the bottom of the circuit board is formed, and the set recess supports the bottom of the printed circuit board with a required elasticity except for a range locked by the locking portion. The present invention is characterized in that the printed circuit board is provided with an elastic support member.

【００１２】また、本発明に係る電子部品の樹脂封止成
形用金型は、上記プリント回路板のセット用凹所におけ
る底部に開口部を形成し、且つ、該開口部内に上記プリ
ント回路板の弾性支持部材を摺動自在に嵌合させると共
に、該弾性支持部材を上記プリント回路板のセット用凹
所側に向かって弾性押動させる弾性部材を配設し、更
に、上記開口部の全周縁に上記プリント回路板の係止部
を形成して構成したことを特徴とするものである。Further, according to the present invention, there is provided a resin sealing mold for an electronic component, wherein an opening is formed at the bottom of the recess for setting the printed circuit board, and the printed circuit board is formed in the opening. An elastic member is provided for fitting the elastic support member slidably and for elastically pushing the elastic support member toward the setting recess side of the printed circuit board. And a locking portion for the printed circuit board.

【００１３】また、本発明に係る電子部品の樹脂封止成
形用金型は、上記プリント回路板のセット用凹所におけ
る底部に開口部を形成し、且つ、該開口部内に上記プリ
ント回路板の弾性支持部材を摺動自在に嵌合させると共
に、該弾性支持部材を上記プリント回路板のセット用凹
所側に向かって弾性押動させる弾性部材を配設し、更
に、上記開口部周縁の所要個所に上記プリント回路板の
係止部を形成して構成したことを特徴とするものであ
る。Further, according to the present invention, there is provided a resin sealing mold for an electronic component, wherein an opening is formed at the bottom of the recess for setting the printed circuit board, and the printed circuit board is formed in the opening. An elastic member is provided for fitting the elastic support member slidably and for elastically pushing the elastic support member toward the setting recess side of the printed circuit board. The present invention is characterized in that the locking portion of the printed circuit board is formed at a location.

【００１４】[0014]

【作用】本発明は、プリント回路板のセット用凹所の深
さを該プリント回路板の厚さの最小値よりも若干浅くな
る形状すると共に、上記プリント回路板の底部を上記セ
ット用凹所の底部に設けた係止部に係止させ、更に、上
記係止部に係止される範囲を除くプリント回路板の底部
を所要の弾性にて支持させ、そして、この状態で、上下
両型による所定の型締圧力にて上記セット用凹所底部の
係止部に係止した上記プリント回路板の底部を強く押圧
するようにしたものである。即ち、このような状態で上
下両型の型締めを行うと、上型の型面は相対的に下動し
てプリント回路板をその水平状態を保ちながらセット用
凹所内に押し込むことになり、また、上記係止部と係合
しないプリント回路板の中央部分は弾性支持部材の弾性
に抗して下方の開口部内に押し込まれるが、それ以外の
底部は凹所の係止部に係止されているので、この部分は
両型による所定の型締圧力により該係止部に強く押圧さ
れて変形されるため、結局、該プリント回路板の底部と
凹所の係止部との間、及び、該プリント回路板の上部周
縁（表面側の周縁）と両型の型面との間に間隙が生じる
のを確実に防止することができる。従って、その結果、
樹脂成形時における樹脂流出を効率良く且つ確実に防止
することができる。According to the present invention, the depth of the recess for setting a printed circuit board is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board, and the bottom of the printed circuit board is set to the recess for the setting. And the bottom of the printed circuit board is supported with required elasticity except for the area locked by the locking portion. , The bottom of the printed circuit board, which is locked to the locking portion at the bottom of the setting recess, is strongly pressed by a predetermined clamping pressure. In other words, when the upper and lower molds are clamped in such a state, the upper mold surface is relatively lowered and the printed circuit board is pushed into the set recess while maintaining the horizontal state, The central portion of the printed circuit board that does not engage with the locking portion is pushed into the lower opening against the elasticity of the elastic support member, but the other bottom portion is locked by the locking portion of the recess. Since this portion is strongly pressed by the locking portion by a predetermined clamping pressure of both dies and is deformed, after all, between the bottom portion of the printed circuit board and the locking portion of the recess, and Thus, it is possible to reliably prevent a gap from being formed between the upper peripheral edge (the peripheral edge on the front surface side) of the printed circuit board and the mold surfaces of both the molds. Therefore, as a result,
Outflow of resin during resin molding can be efficiently and reliably prevented.

【００１５】また、本発明は、上記した係止部に係止さ
れる範囲を除くプリント回路板の底部を所要の弾性にて
支持するプリント回路板の弾性支持部材を配設して構成
したものであるから、該プリント回路板が軟質な素材に
より形成されていても、例えば、キャビティ内に加圧注
入される樹脂圧によってプリント回路板の中央部が弾性
変形される等の弊害を防止することができる。According to the present invention, there is provided a printed circuit board provided with an elastic support member for supporting the bottom of the printed circuit board with a required elasticity except for the area locked by the locking portion. Therefore, even if the printed circuit board is formed of a soft material, for example, it is possible to prevent adverse effects such as the central portion of the printed circuit board being elastically deformed by resin pressure injected into the cavity. Can be.

【００１６】[0016]

【実施例】以下、本発明を実施例図に基づいて詳細に説
明する。図１(1) 及び(2) は、本発明に係る電子部品の
樹脂封止成形用金型の要部と、該金型に嵌合セットする
プリント回路板の要部を示している。図２は、図１に示
す金型に他のプリント回路板を嵌合した状態を示してい
る。図３は、本発明金型の他の実施例を示している。図
４は、図３に対応する金型の下型面を示している。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIGS. 1 (1) and 1 (2) show a main part of a resin-sealing molding die for an electronic component according to the present invention and a main part of a printed circuit board fitted and set in the die. FIG. 2 shows a state where another printed circuit board is fitted to the mold shown in FIG. FIG. 3 shows another embodiment of the mold of the present invention. FIG. 4 shows a lower mold surface of the mold corresponding to FIG.

【００１７】図１の(1) 及び(2) に示す電子部品の樹脂
封止成形用金型は、固定上型１と、該上型１に対向配置
した可動下型２とから構成されている。また、上記した
下型２にはプリント回路板３を供給セットするセット用
凹所４が設けられると共に、上記セット用凹所４の深さ
Ａはプリント回路板３の厚さの最小値（図２の符号ｔ参
照）よりも若干浅くなる形状として設定されている。な
お、該プリント回路板３は、プラスチック、例えば、Ｂ
Ｔ樹脂等を素材として成形された柔軟性を有する板状部
材であって、単層として、或は、複数層（積層板）とし
て構成されると共に、その表面には所要の電子回路が施
されている。また、上記上型１には、上記プリント回路
板３に装着された電子部品５を封止成形するためのキャ
ビティ６が設けられると共に、上下両型(1・2) の型締時
において、該電子部品５は上記キャビティ６内に嵌装セ
ットされることになる。また、上記上型１には、上記キ
ャビティ６内に溶融樹脂材料を移送するための移送用通
路７が設けられている。なお、図示はしていないが、上
記した上型１及び／又は下型２には、単数個或は複数個
の樹脂材料供給用のポットが配設されると共に、上記ポ
ット内には樹脂加圧用のプランジャが嵌合されており、
該ポット内の樹脂材料を加熱溶融化し、且つ、これを上
記プランジャにて加圧することによって、該ポット内の
溶融樹脂材料を上記移送用通路７を通して所定のキャビ
ティ６内に注入充填することができるように設けられて
いる。The resin-molding mold for electronic parts shown in (1) and (2) of FIG. 1 is composed of a fixed upper die 1 and a movable lower die 2 opposed to the upper die 1. I have. The lower mold 2 is provided with a setting recess 4 for supplying and setting the printed circuit board 3, and the depth A of the setting recess 4 is a minimum value of the thickness of the printed circuit board 3 (see FIG. 2 is set to be slightly shallower than the reference t). The printed circuit board 3 is made of plastic, for example, B
A flexible plate-shaped member molded from T-resin or the like, and configured as a single layer or a plurality of layers (laminated plates), on the surface of which a required electronic circuit is provided. ing. The upper mold 1 is provided with a cavity 6 for sealing and molding the electronic component 5 mounted on the printed circuit board 3, and the upper and lower molds (1 and 2) are closed at the time of clamping. The electronic component 5 is fitted and set in the cavity 6. The upper die 1 is provided with a transfer passage 7 for transferring the molten resin material into the cavity 6. Although not shown, a single or a plurality of resin material supply pots are provided in the upper mold 1 and / or the lower mold 2 and a resin molding pot is provided in the pot. A pressure plunger is fitted,
By heating and melting the resin material in the pot and pressurizing the same with the plunger, the molten resin material in the pot can be injected and filled into the predetermined cavity 6 through the transfer passage 7. It is provided as follows.

【００１８】また、上記したプリント回路板３のセット
用凹所４には、該セット用凹所に嵌合セットした上記プ
リント回路板３の底部周縁を係止させる係止部４ａが形
成されており、更に、上記セット用凹所４には、上記係
止部４ａに係止される範囲を除くプリント回路板３の底
部を所要の弾性にて支持するプリント回路板３の弾性支
持部材９が配設されている。The setting recess 4 of the printed circuit board 3 is provided with a locking portion 4a for locking the bottom peripheral edge of the printed circuit board 3 fitted and set in the setting recess. Further, the set recess 4 has an elastic support member 9 of the printed circuit board 3 for supporting the bottom of the printed circuit board 3 with required elasticity except for the area locked by the locking portion 4a. It is arranged.

【００１９】また、上記したセット用凹所４の底部にお
ける係止部４ａの内側には、該係止部４ａの周縁形状に
沿って形成された開口部８が設けられている。また、上
記開口部８内には、プリント回路板３の弾性支持部材９
が上下方向へ摺動自在となるように嵌合されており、更
に、該弾性支持部材９を該プリント回路板３のセット用
凹所４側（上方向）に向かって弾性押動する圧縮スプリ
ングその他の適当な弾性部材10が配設されている。従っ
て、該弾性支持部材９は、上記弾性部材10にてセット用
凹所４側へ弾性押動されるように設けられている。ま
た、上記弾性支持部材の先端面（上端面）９ａは、両型
(1・2) の P.L面と平行するように水平に形成されてお
り、従って、該弾性支持部材の先端面９ａに載置したプ
リント回路板３を水平に支受した状態で弾性支持するこ
とができるように設けられている。An opening 8 formed along the periphery of the locking portion 4a is provided inside the locking portion 4a at the bottom of the setting recess 4 described above. In the opening 8, the elastic supporting member 9 of the printed circuit board 3 is provided.
Are fitted so as to be slidable in the vertical direction, and furthermore, a compression spring that elastically pushes the elastic support member 9 toward the setting recess 4 side (upward) of the printed circuit board 3. Other suitable elastic members 10 are provided. Therefore, the elastic support member 9 is provided so as to be elastically pushed toward the setting recess 4 by the elastic member 10. Further, the front end surface (upper end surface) 9a of the elastic support member is a two-type
It is formed horizontally so as to be parallel to the PL surface of (1) and (2). Therefore, the printed circuit board 3 mounted on the distal end surface 9a of the elastic support member is elastically supported in a state of being horizontally supported. It is provided to be able to.

【００２０】上記したように、プリント回路板３のセッ
ト用凹所４には、該セット用凹所４に嵌合セットした上
記プリント回路板３の底部周縁を係止させる係止部４ａ
が形成されており、更に、上記セット用凹所４には上記
係止部４ａに係止される範囲を除くプリント回路板３の
底部を所要の弾性にて支持するプリント回路板３の弾性
支持部材９が配設されている。そして、上記プリント回
路板３のセット用凹所４の深さＡは、該プリント回路板
３の厚さの最小値(t) よりも若干浅くなる形状に設定さ
れている。従って、セット用凹所４にプリント回路板３
を嵌合すると、該プリント回路板３の周縁部（底部周
縁）11は該凹所４の係止部４ａに係止されると共に、該
係止部４ａに係止される範囲を除くプリント回路板３の
底部、即ち、係止部４ａと係合しないプリント回路板３
の中央部分は弾性支持部材９により弾性支持される状態
となる。そして、この状態で上下両型(1・2) の型締めを
行うと、上型１の型面は相対的に下動してプリント回路
板３をその水平状態を保ちながらセット用凹所４内に押
し込むことになる。しかしながら、このとき、上記した
係止部４ａと係合しないプリント回路板３の中央部分は
弾性支持部材９（弾性部材10）の弾性に抗して下方の開
口部８内に押し込まれるが、その周縁部（底部周縁）11
は凹所４の係止部４ａに係止されているので、この部分
は両型(1・2) による所定の型締圧力により該係止部４ａ
に強く押圧されて変形し圧縮弾性変形部12となるため、
該プリント回路板３の周縁部と凹所４の係止部４ａとの
間に隙間が生じることはない。また、上記プリント回路
板３の表面（上面）側は、上記したように、上下両型(1
・2) による所定型締圧力によって該上型１の型面に押圧
された状態となるので該プリント回路板３の表面と両型
(1・2) の型面間に隙間が生じることはない。As described above, the setting recess 4 of the printed circuit board 3 has the locking portion 4a for locking the bottom peripheral edge of the printed circuit board 3 fitted and set in the setting recess 4.
Further, the set recess 4 has an elastic support of the printed circuit board 3 for supporting the bottom of the printed circuit board 3 with a required elasticity except for a range locked by the locking portion 4a. A member 9 is provided. The depth A of the setting recess 4 of the printed circuit board 3 is set to be slightly smaller than the minimum value (t) of the thickness of the printed circuit board 3. Therefore, the printed circuit board 3 is set in the set recess 4.
Is fitted, the peripheral portion (bottom peripheral portion) 11 of the printed circuit board 3 is locked by the locking portion 4a of the recess 4 and the printed circuit board excluding the range locked by the locking portion 4a. The bottom of the board 3, ie, the printed circuit board 3 that does not engage with the locking portion 4a
Is in a state of being elastically supported by the elastic support member 9. Then, when the upper and lower molds (1 and 2) are clamped in this state, the mold surface of the upper mold 1 is relatively moved downward, and the printed circuit board 3 is maintained in a horizontal state, and the setting recess 4 is held. Will be pushed inside. However, at this time, the central portion of the printed circuit board 3 that does not engage with the locking portion 4a is pushed into the lower opening 8 against the elasticity of the elastic supporting member 9 (elastic member 10). Perimeter (bottom perimeter) 11
Is locked by the locking portion 4a of the recess 4 so that this portion is locked by the locking portion 4a by a predetermined mold clamping pressure of both dies (1.2).
Because it is strongly pressed and deforms to become the compression elastic deformation part 12,
There is no gap between the periphery of the printed circuit board 3 and the locking portion 4a of the recess 4. As described above, the upper and lower molds (1)
(2) The upper mold 1 is pressed against the mold surface by the predetermined mold clamping pressure according to 2), so that the surface of the printed circuit board 3 and both molds
There is no gap between the mold surfaces of (1 ・ 2).

【００２１】以下、上記プリント回路板の厚さが最大値
であるものを用いて該プリント回路板に装着した電子部
品を樹脂封止成形する場合を、図１に基づいて説明す
る。まず、図１(1) に示すように、上下両型(1・2) の型
開状態において、下型２の凹所４に電子部品５を装着し
たプリント回路板３を嵌合すると共に、図１(2) に示す
ように、通常の型締圧力にて両型(1・2) を型締めする。
このとき、上記凹所４の深さＡよりもプリント回路板３
(3a)の厚さＴが大きいため、上記したように、該凹所４
にプリント回路板３を嵌合すると、該プリント回路板３
の周縁部（底部周縁）11は該凹所４の係止部４ａに係止
されると共に、該係止部４ａと係合しないプリント回路
板３の中央部分は弾性支持部材９により弾性支持される
状態となる。そして、該プリント回路板３は、相対的に
下動する上型１の型面によって水平状態を保ちながら該
凹所４内に押し込まれ、且つ、上記係止部４ａと係合し
ない部分は弾性支持部材９の弾性に抗して下方の開口部
８内に押し込まれ、また、上記係止部４ａに係止されて
いるプリント回路板３の周縁部11は両型(1・2) による所
定の型締圧力によって該係止部４ａに強く押圧されて変
形し圧縮弾性変形部12となるため、該プリント回路板３
の周縁部と凹所４の係止部４ａとの間に隙間が生じるこ
とはない。また、上記プリント回路板３の表面（上面）
側は、上下両型(1・2) による所定型締圧力によって該上
型１の型面に押圧された状態となるので該プリント回路
板３の表面と両型(1・2) の型面間に隙間が生じることは
ない。次に、上記した状態で、金型のポット内に樹脂材
料を供給して加熱溶融化し、且つ、該溶融樹脂材料を移
送用通路７を通してキャビティ６内に注入充填させるこ
とにより、該キャビティ６内に嵌装セットしたプリント
回路板３上の電子部品５を樹脂封止成形することができ
る。このとき、上記したプリント回路板３の周縁部と凹
所４の係止部４ａとの間、及び、プリント回路板３の表
面と両型(1・2) の型面間には隙間が構成されていないの
で、樹脂封止成形時における樹脂バリの発生を効率良く
且つ確実に防止することができる。Hereinafter, a case where the electronic component mounted on the printed circuit board is molded with a resin using a printed circuit board having a maximum thickness will be described with reference to FIG. First, as shown in FIG. 1A, in the open state of the upper and lower molds (1 and 2), the printed circuit board 3 on which the electronic components 5 are mounted is fitted into the recess 4 of the lower mold 2 and As shown in Fig. 1 (2), the molds (1 and 2) are clamped with normal mold clamping pressure.
At this time, the printed circuit board 3 is larger than the depth A of the recess 4.
Since the thickness T of (3a) is large, as described above,
When the printed circuit board 3 is fitted to the
Of the printed circuit board 3 that is not engaged with the locking portion 4a is elastically supported by the elastic supporting member 9. State. The printed circuit board 3 is pushed into the recess 4 while being kept horizontal by the mold surface of the upper mold 1 which moves relatively downward, and a portion which does not engage with the locking portion 4a is elastic. The peripheral portion 11 of the printed circuit board 3 which is pushed into the lower opening 8 against the elasticity of the support member 9 and is locked by the locking portion 4a is a predetermined shape by both types (1.2). Is strongly pressed by the locking portion 4a due to the mold clamping pressure and deforms to become the compression elastic deformation portion 12, so that the printed circuit board 3
There is no gap between the peripheral edge of the recess and the locking portion 4a of the recess 4. The surface (upper surface) of the printed circuit board 3
The side is pressed against the mold surface of the upper mold 1 by a predetermined mold clamping pressure by the upper and lower molds (1, 2), so that the surface of the printed circuit board 3 and the mold surface of both molds (1, 2) are formed. There is no gap between them. Next, in the above-described state, the resin material is supplied into the mold pot to be heated and melted, and the molten resin material is injected and filled into the cavity 6 through the transfer passage 7 so as to fill the cavity 6. The electronic component 5 on the printed circuit board 3 fitted and set on the substrate can be molded with resin. At this time, a gap is formed between the peripheral edge of the printed circuit board 3 and the locking portion 4a of the recess 4 and between the surface of the printed circuit board 3 and the mold surface of both molds (1 and 2). Since it is not performed, it is possible to efficiently and reliably prevent the occurrence of resin burrs at the time of resin sealing molding.

【００２２】図２に示すように、プリント回路板の厚さ
が最小値ｔである場合の電子部品の樹脂封止成形におい
ても、上記した樹脂封止成形の場合と実質的に同様に行
うことができる。即ち、図２に示すように、プリント回
路板３(3b)の厚さが異なる点を除いて、その他の設定条
件等は上記した樹脂封止成形の場合と実質的に同一であ
るから、プリント回路板３ｂを下型凹所４に嵌合して両
型(1・2) を通常の型締圧力にて型締めし、通常の樹脂封
止成形を行えばよい。このとき、凹所４の係止部４ａに
よるプリント回路板３ｂの係止状態と弾性支持部材９に
よる弾性支持状態は、上記した樹脂封止成形の場合と同
一である。また、プリント回路板周縁部11を該係止部４
ａに押圧して圧縮弾性変形部12を形成することにより、
該周縁部11と係止部４ａとの間に隙間を構成しないこ
と、及び、プリント回路板３ｂの表面と両型(1・2) の型
面間には隙間が構成されないこと等は、上記した樹脂封
止成形の場合と実質的に同一であるから、この状態で溶
融樹脂材料を移送用通路７を通してキャビティ６内に注
入充填させると云った通常の樹脂封止成形を行うことに
より、上記した樹脂封止成形の場合と実質的に同じ作用
効果を得ることができる。As shown in FIG. 2, when the thickness of the printed circuit board is the minimum value t, the resin encapsulation of the electronic component is performed in substantially the same manner as the resin encapsulation described above. Can be. That is, as shown in FIG. 2, except for the difference in the thickness of the printed circuit board 3 (3b), the other setting conditions and the like are substantially the same as those in the case of the resin sealing molding described above. The circuit board 3b may be fitted into the lower mold recess 4 and both molds (1 and 2) may be clamped with a normal mold clamping pressure to perform normal resin molding. At this time, the locking state of the printed circuit board 3b by the locking portion 4a of the recess 4 and the elastic supporting state by the elastic supporting member 9 are the same as those in the case of the resin sealing molding described above. Further, the printed circuit board peripheral portion 11 is connected to the locking portion 4.
a to form the compression elastic deformation portion 12,
The fact that no gap is formed between the peripheral edge portion 11 and the locking portion 4a, and that no gap is formed between the surface of the printed circuit board 3b and the mold surfaces of both molds (1 and 2) are described above. In this state, the molten resin material is injected and filled into the cavity 6 through the transfer passage 7 in this state. It is possible to obtain substantially the same operation and effect as in the case of the resin sealing molding described above.

【００２３】なお、上記した凹所４の係止部４ａは、プ
リント回路板周縁部の全周縁を係止するような全周縁係
止部として形成してもよく、また、図３及び図４に示す
ように、プリント回路板周縁部の全周縁における必要
な、若しくは、所要の個所の夫々を各別に係止するよう
な形状の係止部として形成しても差し支えない。The locking portion 4a of the recess 4 described above may be formed as a full-peripheral locking portion for locking the entire peripheral edge of the printed circuit board. As shown in (1), a necessary or necessary portion on the entire periphery of the printed circuit board peripheral portion may be formed as a locking portion having a shape for locking each of them separately.

【００２４】図３及び図４に示す金型は、上型20と下型
21から構成されており、該下型21には電子部品29を装着
したプリント回路板30(30a) を嵌合セットするセット用
凹所22が設けられ、また、該凹所22の底面には上記プリ
ント回路板30ａの全周縁における必要な、若しくは、所
要の個所の夫々を各別に係止するような形状の係止部22
ａが夫々設けられている。上記したプリント回路板30の
全周縁における必要な、若しくは、所要の個所とは、例
えば、図４に示すように、上型キャビティ23内へ溶融樹
脂材料を注入するための移送用通路24の部位と対応する
位置を云う。The mold shown in FIGS. 3 and 4 is composed of an upper mold 20 and a lower mold.
The lower die 21 is provided with a setting recess 22 for fitting and setting a printed circuit board 30 (30a) on which an electronic component 29 is mounted, and a bottom surface of the recess 22 is provided on the lower surface of the recess 22. Locking portions 22 each having a shape that locks each required or required portion on the entire peripheral edge of the printed circuit board 30a separately.
a is provided respectively. Necessary or required locations on the entire periphery of the printed circuit board 30 include, for example, a portion of the transfer passage 24 for injecting the molten resin material into the upper mold cavity 23, as shown in FIG. And the corresponding position.

【００２５】なお、図３及び図４に示した金型の構成
は、図１に示した金型構成と基本的に同じであり、同各
図において、符号25は開口部を、同26は支持部材を、同
27は弾性部材を、同31はプリント回路板30ａの周縁部
を、同32は圧縮弾性変形部を夫々示している。The configuration of the mold shown in FIGS. 3 and 4 is basically the same as that of the mold shown in FIG. 1. In each of the figures, reference numeral 25 denotes an opening, and reference numeral 26 denotes Support members
27 denotes an elastic member, 31 denotes a peripheral portion of the printed circuit board 30a, and 32 denotes a compression elastic deformation portion.

【００２６】また、図３に示した支持部材26には、弾性
部材27による弾性押動を規制するための適宜なストッパ
ー28が設けられている場合を示している。即ち、該支持
部材26が弾性部材27によって上方へ弾性押動されたと
き、該支持部材26の先端面26ａが凹所22の底面位置と同
じ位置にて停止させることができるように設けられてお
り、上記弾性部材27による弾性押動力が支持部材26を介
してプリント回路板30ａに必要以上に加えられないよう
に構成されている。FIG. 3 shows a case where the support member 26 shown in FIG. 3 is provided with an appropriate stopper 28 for restricting the elastic pushing by the elastic member 27. That is, when the support member 26 is elastically pushed upward by the elastic member 27, the tip surface 26a of the support member 26 can be stopped at the same position as the bottom surface position of the recess 22. Also, the elastic pressing force of the elastic member 27 is not applied to the printed circuit board 30a via the support member 26 more than necessary.

【００２７】また、上記プリント回路板が軟質素材によ
り形成されていても、セット用凹所の係止部に係止され
る範囲を除くプリント回路板の底部を所要の弾性を有す
る弾性支持部材によって支持するように構成したので、
このプリント回路板底部が、例えば、キャビティ内に注
入充填された溶融樹脂材料に対する樹脂加圧力によって
下方へ弾性変形される等の弊害を未然に防止することが
できる。Further, even if the printed circuit board is formed of a soft material, the bottom of the printed circuit board except for the area where the printed circuit board is locked by the locking portion of the setting recess is provided by an elastic supporting member having a required elasticity. Because it was configured to support,
For example, it is possible to prevent such a problem that the bottom portion of the printed circuit board is elastically deformed downward due to a resin pressing force against the molten resin material injected and filled into the cavity.

【００２８】また、本発明は、上記したプリント回路板
に限られず、本発明の趣旨にしたがって、柔軟性を有
し、且つ、厚さの最大値と最小値の間に大きな差を有す
る板状部材に採用することができる。Further, the present invention is not limited to the above-described printed circuit board, but in accordance with the gist of the present invention, has a flexibility and a plate shape having a large difference between the maximum value and the minimum value of the thickness. It can be used for members.

【００２９】なお、この種の樹脂封止成形に用いられる
樹脂材料はプリント回路板との密着性が高いため、該プ
リント回路板に装着された電子部品を樹脂封止成形する
ためには好都合であるが、逆に、該プリント回路板から
製品としては不要である硬化樹脂を剥離する場合にはそ
の剥離作業が面倒であると云った問題がある。即ち、樹
脂封止成形時において、溶融樹脂材料をキャビティ23に
注入するための移送用通路24（ゲート24ａ及びランナ24
ｂ）内にも溶融樹脂材料が残存した状態で硬化すること
になるが、この硬化樹脂は、製品としては不要なもので
あるため、該プリント回路板から剥離除去する必要があ
る。そこで、上記したような製品としては不要となる硬
化樹脂を簡易に剥離除去することができるように、この
ような硬化樹脂が付着するプリント回路板の表面部に、
該硬化樹脂との密着性が低い、例えば、金めっき層33や
テフロン層、或は、シリコン層等を施すようにしてもよ
い。Since the resin material used for this type of resin encapsulation has high adhesion to a printed circuit board, it is convenient for resin encapsulation of electronic components mounted on the printed circuit board. On the contrary, there is a problem that when the cured resin which is unnecessary as a product is peeled off from the printed circuit board, the peeling operation is troublesome. That is, at the time of resin molding, the transfer passage 24 (the gate 24a and the runner 24) for injecting the molten resin material into the cavity 23 is formed.
Although the molten resin material is cured in the state of b), the cured resin is unnecessary as a product, and therefore needs to be removed from the printed circuit board. Therefore, the surface of the printed circuit board to which such a cured resin adheres, so that the cured resin unnecessary for the above-described product can be easily removed and removed,
For example, a gold plating layer 33, a Teflon layer, a silicon layer, or the like having low adhesion to the cured resin may be applied.

【００３０】本発明は、上記した実施例のものに限定さ
れるものではなく、本発明の趣旨を逸脱しない範囲内
で、必要に応じて、任意に且つ適宜に変更・選択して採
用できるものである。The present invention is not limited to the above-described embodiment, but can be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

【００３１】[0031]

【発明の効果】本発明によれば、プリント回路板の底部
と該プリント回路板のセット用凹所の係止部との間、及
び、該プリント回路板の上部周縁と両型の型面との間に
間隙が生じるのを確実に防止することができるので、樹
脂成形時における樹脂流出を効率良く且つ確実に防止す
ることができる。従って、前述したような従来の弊害を
解消し得て、樹脂バリの形成を効率良く且つ確実に防止
することができる樹脂封止成形方法及び樹脂封止成形用
金型を提供することができると云った優れた実用的な効
果を奏するものである。According to the present invention, between the bottom of the printed circuit board and the locking portion of the recess for setting the printed circuit board, and the upper peripheral edge of the printed circuit board and the mold surfaces of both types. It is possible to reliably prevent a gap from being generated therebetween, so that resin outflow during resin molding can be efficiently and reliably prevented. Therefore, it is possible to provide a resin sealing molding method and a resin sealing molding die which can solve the conventional adverse effects as described above and can efficiently and reliably prevent the formation of resin burrs. It has excellent practical effects.

【００３２】また、本発明によれば、上下両型を通常の
所定型締圧力によって型締めしたときに柔軟性を有する
プリント回路板の全体を過大に押圧することがないの
で、該プリント回路板に装着された電子回路が切断する
等の従来の弊害を確実に解消し得て、高品質性及び高信
頼性を備えたこの種の製品を成形することができると云
った優れた実用的な効果を奏するものである。Further, according to the present invention, when the upper and lower dies are clamped by a normal predetermined clamping pressure, the entire flexible printed circuit board is not excessively pressed. It is possible to reliably resolve the conventional problems such as cutting of the electronic circuit mounted on the product, and to mold this kind of product with high quality and high reliability. It is effective.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る電子部品の樹脂封止成形用金型の
要部と、該金型に嵌合セットするプリント回路板の要部
を示す縦断面図であって、図１(1) は型開状態を、図１
(2) は金型の型締状態を、また、プリント回路板の厚さ
が最大値の場合を示している。FIG. 1 is a longitudinal sectional view showing a main part of a mold for resin sealing molding of an electronic component according to the present invention and a main part of a printed circuit board fitted and set in the mold. ) Indicates the mold open state.
(2) shows a mold clamping state of the mold and a case where the thickness of the printed circuit board is the maximum value.

【図２】図１に対応した金型に他のプリント回路板を嵌
合した状態を示す縦断面図であって、金型の型締状態
を、また、プリント回路板の厚さが最小値の場合を示し
ている。FIG. 2 is a longitudinal sectional view showing a state in which another printed circuit board is fitted to the mold corresponding to FIG. 1, wherein the mold is in a clamped state, and the thickness of the printed circuit board is a minimum value. Is shown.

【図３】本発明に係る金型の他の実施例を示す縦断面図
であって、金型にプリント回路板を嵌合して型締めした
状態を示している。FIG. 3 is a longitudinal sectional view showing another embodiment of the mold according to the present invention, showing a state where a printed circuit board is fitted to the mold and the mold is clamped.

【図４】図３に対応した金型の下型面にプリント回路板
を供給セットした状態を示す平面図である。FIG. 4 is a plan view showing a state in which a printed circuit board is supplied and set on a lower mold surface of the mold corresponding to FIG. 3;

【図５】従来の樹脂封止成形用金型の要部を示す縦断面
図であって、樹脂封止成形後の型締状態を示すと共に、
図５(1) はプリント回路板の厚さが最大値の場合を、図
５(2) はプリント回路板の厚さが最小値の場合を夫々示
している。FIG. 5 is a longitudinal sectional view showing a main part of a conventional resin molding die, showing a state of clamping after resin molding, and
5A shows the case where the thickness of the printed circuit board is the maximum value, and FIG. 5B shows the case where the thickness of the printed circuit board is the minimum value.

【符号の説明】[Explanation of symbols]

１・20 上 型 ２・21 下 型 ３・３ａ・３ｂ・30・30ａ プリント回路板 ４・22 セット用凹所 ４ａ・22ａ 係止部 ５・29 電子部品 ６・23 キャビティ ７・24 移送用通路 ８・25 開口部 ９・26 支持部材 ９ａ・26ａ 先端面 10・27 弾性部材 11・31 周縁部 12・32 圧縮弾性変形部 24ａ ゲート 24ｂ ランナ 28 ストッパー 33 金めっき層 Ａ 深さ ｔ 最小値 Ｔ 厚さ 1.20 upper die 2.21 lower die 3.3a.3b.30.30a printed circuit board 4.22 recess for set 4a.22a locking part 5.29 electronic parts 6.23 cavity 7.24 transfer passage 8.25 Opening 9.26 Supporting member 9a.26a Tip surface 10.27 Elastic member 11.31 Peripheral edge 12.32 Compressive elastic deformation part 24a Gate 24b Runner 28 Stopper 33 Gold plating layer A Depth t Minimum value T Thickness Sa

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 31:34 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical indication // B29L 31:34

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 上型と下型とを対向配置させた金型を用
いて、その上下両型の型面に設けた凹所に電子部品を装
着したプリント回路板を供給すると共に、該両型の型締
時において、該プリント回路板に装着した電子部品を該
両型の型面に設けたキャビティ内に嵌装セットし、この
状態で、上記金型に設けたポット内に樹脂材料を供給し
て加熱溶融化し、且つ、該溶融樹脂材料を移送用通路を
通して上記キャビティ内に注入充填することによって、
該キャビティ内に嵌装セットしたプリント回路板上の電
子部品を樹脂封止成形する電子部品の樹脂封止成形方法
であって、 上記プリント回路板のセット用凹所の深さを、該プリン
ト回路板の厚さの最小値よりも若干浅くなる形状に設定
する工程と、 上記プリント回路板の底部を上記セット用凹所の底部に
設けた係止部に係止させる工程と、 上記係止部に係止される範囲を除くプリント回路板の底
部を所要の弾性にて支持するプリント回路板の弾性支持
工程と、 上記上下両型の型締時に、該両型の所定型締圧力にて、
上記セット用凹所底部の係止部に係止した上記プリント
回路板の底部を強く押圧する工程とを有することを特徴
とする電子部品の樹脂封止成形方法。1. A printed circuit board in which electronic components are mounted in recesses provided in the upper and lower mold surfaces by using a mold in which an upper mold and a lower mold are arranged to face each other. At the time of closing the mold, the electronic components mounted on the printed circuit board are fitted and set in the cavities provided on the mold surfaces of the two molds, and in this state, the resin material is placed in the pot provided on the mold. By supplying and heating and melting, and by injecting and filling the molten resin material into the cavity through a transfer passage,
A resin sealing molding method for an electronic component, wherein the electronic component on a printed circuit board fitted and set in the cavity is molded with a resin. Setting the shape to be slightly shallower than the minimum value of the thickness of the board; locking the bottom of the printed circuit board to a locking portion provided at the bottom of the setting recess; An elastic supporting step of the printed circuit board for supporting the bottom of the printed circuit board with a required elasticity except for a range locked to the above, at the time of clamping the upper and lower dies, at a predetermined clamping pressure of the two dies,
Strongly pressing the bottom of the printed circuit board locked in the locking portion of the bottom of the setting recess. 【請求項２】 上型と、該上型に対向配置した下型と、
その上下両型の型面に設けた電子部品を装着したプリン
ト回路板のセット用凹所と、該セット用凹所と対向する
型面に設けたキャビティと、該キャビティに連通接続さ
せた溶融樹脂材料の移送用通路とを備えた電子部品の樹
脂封止成形用金型の型締時に該プリント回路板を該両型
の型面に設けたキャビティ内に嵌装セットし、この状態
で、上記金型に設けたポット内に樹脂材料を供給して加
熱溶融化し、且つ、該溶融樹脂材料を移送用通路を通し
て上記キャビティ内に注入充填することによって、該キ
ャビティ内に嵌装セットしたプリント回路板上の電子部
品を樹脂封止成形用金型であって、 上記プリント回路板のセット用凹所の深さを、該プリン
ト回路板の厚さの最小値よりも若干浅くなる形状に形成
すると共に、上記セット用凹所には該セット用凹所に嵌
合セットした上記プリント回路板の底部を係止させる係
止部を形成し、更に、上記セット用凹所には、上記係止
部に係止される範囲を除くプリント回路板の底部を所要
の弾性にて支持するプリント回路板の弾性支持部材を配
設して構成したことを特徴と電子部品の樹脂封止成形用
金型。2. An upper mold, a lower mold opposed to the upper mold,
A recess for setting a printed circuit board on which electronic components are mounted provided on the mold surfaces of the upper and lower molds, a cavity provided on the mold surface facing the recess for setting, and a molten resin which is connected to the cavity. The printed circuit board is fitted and set in a cavity provided in a mold surface of both molds at the time of mold clamping of a resin sealing molding die of an electronic component having a material transfer passage, and in this state, A printed circuit board fitted and set in a cavity by supplying a resin material into a pot provided in a mold, heating and melting the resin material, and injecting and filling the molten resin material into the cavity through a transfer passage. The above electronic component is a mold for resin sealing molding, wherein the depth of the recess for setting the printed circuit board is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board. , A locking portion for locking the bottom of the printed circuit board fitted and set in the setting recess is formed, and further, the printed circuit board excluding a range locked by the locking portion is formed in the setting recess. The present invention is characterized in that an elastic supporting member for a printed circuit board for supporting the bottom of the board with a required elasticity is provided, and a resin sealing mold for electronic components. 【請求項３】 プリント回路板のセット用凹所における
底部に開口部を形成し、且つ、該開口部内に上記プリン
ト回路板の弾性支持部材を摺動自在に嵌合させると共
に、該弾性支持部材を上記プリント回路板のセット用凹
所側に向かって弾性押動させる弾性部材を配設し、更
に、上記開口部の全周縁に上記プリント回路板の係止部
を形成して構成したことを特徴とする請求項２に記載の
電子部品の樹脂封止成形用金型。3. An opening is formed at the bottom of the recess for setting a printed circuit board, and an elastic support member of the printed circuit board is slidably fitted in the opening, and the elastic support member is provided. An elastic member that elastically pushes toward the setting recess side of the printed circuit board is provided, and furthermore, a locking portion of the printed circuit board is formed on the entire periphery of the opening. The mold for resin-sealing molding of an electronic component according to claim 2. 【請求項４】 プリント回路板のセット用凹所における
底部に開口部を形成し、且つ、該開口部内に上記プリン
ト回路板の弾性支持部材を摺動自在に嵌合させると共
に、該弾性支持部材を上記プリント回路板のセット用凹
所側に向かって弾性押動させる弾性部材を配設し、更
に、上記開口部周縁の所要個所に上記プリント回路板の
係止部を形成して構成したことを特徴とする請求項２に
記載の電子部品の樹脂封止成形用金型。4. An opening is formed at the bottom of the recess for setting a printed circuit board, and the elastic supporting member of the printed circuit board is slidably fitted in the opening, and the elastic supporting member is provided. An elastic member that elastically pushes the printed circuit board toward the setting recess side of the printed circuit board, and further, a locking portion of the printed circuit board is formed at a required position on the periphery of the opening. The mold for resin sealing molding of an electronic component according to claim 2, wherein:
JP7113695A 1994-12-12 1995-04-14 Resin encapsulation molding method and mold for electronic parts Expired - Lifetime JP2626971B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP7113695A JP2626971B2 (en) 1995-04-14 1995-04-14 Resin encapsulation molding method and mold for electronic parts
PL95320829A PL183619B1 (en) 1994-12-12 1995-12-12 Aniline derivatives exhibiting inhibitive effect in respect to nitrogen oxide synthesis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7113695A JP2626971B2 (en) 1995-04-14 1995-04-14 Resin encapsulation molding method and mold for electronic parts

Publications (2)

Publication Number Publication Date
JPH08288326A JPH08288326A (en) 1996-11-01
JP2626971B2 true JP2626971B2 (en) 1997-07-02

Family

ID=14618844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7113695A Expired - Lifetime JP2626971B2 (en) 1994-12-12 1995-04-14 Resin encapsulation molding method and mold for electronic parts

Country Status (1)

Country Link
JP (1) JP2626971B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19935441A1 (en) * 1999-07-28 2001-03-01 Siemens Ag Method and mold for wrapping electronic components
JP4431252B2 (en) * 2000-05-22 2010-03-10 フィーサ株式会社 Insert molding method and mold
JP4549521B2 (en) * 2000-12-14 2010-09-22 フィーサ株式会社 Insert molding method and mold
ITTO20050506A1 (en) * 2005-07-22 2007-01-23 Incos Spa PROCEDURE AND EQUIPMENT FOR THE PRODUCTION OF PLASTIC MATERIALS WITH AT LEAST ONE OVER-PRINTED COMPONENT.
KR100980104B1 (en) * 2005-09-28 2010-09-07 주식회사 엘지화학 Apparatus for Manufacturing Secondary Battery
JP4568258B2 (en) * 2006-09-13 2010-10-27 住友重機械工業株式会社 Mold and molding method
DE102019205203A1 (en) * 2019-04-11 2020-10-15 Volkswagen Aktiengesellschaft Tool for overmolding and / or overmolding a curved glass body and methods for overmolding and / or overmolding a curved glass body

Also Published As

Publication number Publication date
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