JPH11300781A - Molding method for resin and mold equipment for molding - Google Patents

Molding method for resin and mold equipment for molding

Info

Publication number
JPH11300781A
JPH11300781A JP11232898A JP11232898A JPH11300781A JP H11300781 A JPH11300781 A JP H11300781A JP 11232898 A JP11232898 A JP 11232898A JP 11232898 A JP11232898 A JP 11232898A JP H11300781 A JPH11300781 A JP H11300781A
Authority
JP
Japan
Prior art keywords
mold
molding
resin
cured product
plunger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11232898A
Other languages
Japanese (ja)
Inventor
Akihiro Okamoto
昭弘 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP11232898A priority Critical patent/JPH11300781A/en
Publication of JPH11300781A publication Critical patent/JPH11300781A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a molding method for a resin wherein after the resin for molding is supplied into a cavity and molded, a first mold and a second mold are separated and a cured material of the resin for molding is removed and formed and wherein the cured material of the resin for molding can be removed in a joined state and is hardly left in the mold, and mold equipment for molding which allows removal of the cured material of the resin for molding in the joined state and makes the cured material hardly left in the mold. SOLUTION: A counter plunger 18 is provided beforehand so that it is opposed to an injection plunger 17, on the other side of a face whereon a first mold 11 and a second mold 12 come into contact with each other. After the injection plunger 17 and the counter plunger 18 are separated from a cured material B of resin for molding in a state wherein the first mold 11 and the second mold 12 are brought into contact with each other, the first mold 11 and the second mold 12 are separated and the cured material B of the resin for molding is removed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、トランスファー成
形により成形する樹脂成形方法、及びこの樹脂成形方法
に用いる成形用金型装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method for molding by transfer molding, and a molding die apparatus used for the resin molding method.

【0002】[0002]

【従来の技術】電子部品の封止や、食器等の製造方法と
して、エポキシ樹脂等の成形用樹脂を用いて、トランス
ファー成形により成形する方法が汎用されている。
2. Description of the Related Art As a method for encapsulating electronic parts and manufacturing tableware and the like, a method of molding by transfer molding using a molding resin such as an epoxy resin is widely used.

【0003】このトランスファー成形により成形する方
法としては、例えば、図4(a)に示すような、第一金
型31と、その第一金型31に対向して配設され、第一
金型31と当接及び離間可能に形成された第二金型32
と、第一金型31と第二金型32とを当接させたときに
これらの間に形成される樹脂成形用のキャビティー33
と、そのキャビティー33に供給するための成形用樹脂
Aを収納するポット36と、そのポット36に対して摺
動自在に設けられた注入プランジャー37と、ポット3
6及びキャビティー33の間を接続し、成形用樹脂Aを
ポット36からキャビティー33へ移送するための移送
用通路34とを備えた成形用金型装置を用いる。
As a method of molding by the transfer molding, for example, as shown in FIG. 4 (a), a first mold 31 and a first mold 31 are disposed so as to face the first mold 31. Second mold 32 formed so as to be able to contact and separate from 31
And a resin molding cavity 33 formed between the first mold 31 and the second mold 32 when they are brought into contact with each other.
A pot 36 for storing a molding resin A to be supplied to the cavity 33; an injection plunger 37 slidably provided with respect to the pot 36;
6 and the cavity 33, and a molding die apparatus having a transfer passage 34 for transferring the molding resin A from the pot 36 to the cavity 33 is used.

【0004】そして、必要に応じて部品素子を搭載した
リードフレーム39を装着した後、第一金型31と第二
金型32とを当接させ、次いでポット36に収納された
成形用樹脂Aを注入プランジャー37で押し出してキャ
ビティー33内に供給した後、第一金型31や第二金型
32でキャビティー33内の成形用樹脂を加熱して硬化
させる。次いで、図4(b)に示すように、第一金型3
1及び第二金型32を離間させて成形用樹脂の硬化物B
を取り出す方法で成形が行われている。
After mounting a lead frame 39 on which component elements are mounted as necessary, the first mold 31 and the second mold 32 are brought into contact with each other, and then the molding resin A stored in the pot 36 is formed. Is extruded by the injection plunger 37 and supplied into the cavity 33, and then the molding resin in the cavity 33 is heated and cured by the first mold 31 and the second mold 32. Next, as shown in FIG.
The first and second molds 32 are separated from each other to cure the molding resin B
The molding is performed by a method of taking out.

【0005】なお、第二金型32には、成形用樹脂の硬
化物Bを第二金型32から引き剥がすためのエジェクト
ピン35がキャビティー33内に突出可能に設けられて
おり、図4(a)に示すような、キャビティー33内に
成形用樹脂Aを供給するときや、加熱して成形用樹脂A
を硬化させるときは、エジェクトピン35がキャビティ
ー33の底面と面一になるように配設され、図4(b)
に示すような、成形用樹脂の硬化物Bを取り出すときに
は、エジェクトピン35で硬化物Bを加圧することによ
り、エジェクトピン35をキャビティー33内に突出さ
せると共に、硬化物Bを第二金型32から引き剥がして
取り出すようになっている。
In the second mold 32, an eject pin 35 for peeling off the cured product B of the molding resin from the second mold 32 is provided so as to protrude into the cavity 33, as shown in FIG. When the molding resin A is supplied into the cavity 33 as shown in FIG.
When hardening, the eject pin 35 is disposed so as to be flush with the bottom surface of the cavity 33, and FIG.
When taking out the cured product B of the molding resin as shown in FIG. 1, the ejected pin 35 is pressed by the eject pin 35 so that the eject pin 35 projects into the cavity 33 and the cured product B is removed from the second mold. 32 to be taken out.

【0006】なお、上記硬化物Bは、キャビティー33
の部分で硬化した硬化物Bと、移送用通路34の部分で
硬化した硬化物Bと、ポット36内に残った成形用樹脂
が硬化した硬化物Bとが、つながった状態となっている
ため、キャビティー33の部分で硬化した硬化物Bをエ
ジェクトピン35で加圧することにより、硬化物B全体
がつながった状態で取り出せるようになっている。
[0006] The above cured product B is supplied to the cavity 33
, The cured product B cured in the portion of the transfer passage 34, and the cured product B cured of the molding resin remaining in the pot 36 are in a connected state. By pressing the cured product B cured in the cavity 33 with the eject pin 35, the cured product B can be taken out in a connected state.

【0007】しかし、接着強度が高い成形用樹脂Aを使
用した場合等には、硬化物Bをエジェクトピン35で加
圧したときに、硬化物Bの途中で割れが発生してポット
36内等に硬化物Bの一部が残留してしまう場合があっ
た。この場合、以降の成形時に成形用樹脂Aがキャビテ
ィー33に送られ難くなり、以降得られる成形品の品質
が低下するという問題が発生する場合があるため、硬化
物B全体をつながった状態で取り出すことができ、硬化
物Bが金型内に残りにくい樹脂成形方法が求められてい
る。
However, when the molding resin A having a high adhesive strength is used, when the cured product B is pressed by the eject pin 35, a crack occurs in the cured product B and the inside of the pot 36 or the like is generated. In some cases, part of the cured product B remained. In this case, the molding resin A becomes difficult to be sent to the cavity 33 at the time of subsequent molding, which may cause a problem that the quality of a molded product obtained thereafter deteriorates. There is a need for a resin molding method that can be taken out and hardly causes the cured product B to remain in the mold.

【0008】そのため、例えば特開平2−266907
号に記載されたように、第一金型と第二金型とを当接さ
せた状態で成形用樹脂の硬化物から注入プランジャーを
離間させた後、第一金型と第二金型とを離間させて成形
用樹脂の硬化物を取り出す方法や、注入プランジャーを
成形用樹脂の硬化物に接触させた状態で第一金型と第二
金型を離間させた後、注入プランジャーと成形用樹脂の
硬化物を離間させて成形用樹脂の硬化物を取り出す方法
や、第一金型と第二金型を離間させるときに同時に注入
プランジャーと成形用樹脂の硬化物を離間させて成形用
樹脂の硬化物を取り出す方法等が検討されている。
For this reason, for example, Japanese Patent Application Laid-Open No. 2-266907
As described in No. 2, after separating the injection plunger from the cured product of the molding resin in a state where the first mold and the second mold are in contact with each other, the first mold and the second mold And a method of taking out the cured product of the molding resin by separating the first mold and the second mold in a state where the injection plunger is in contact with the cured product of the molding resin. Separating the injection plunger and the cured resin of the molding resin at the same time as separating the first mold and the second mold by separating the cured resin of the molding resin from the cured resin of the molding resin. For example, a method of taking out a cured product of a molding resin by using the method has been studied.

【0009】しかし、このようないずれの方法であって
も硬化物が金型内に残る場合があり、更に硬化物が金型
内に残りにくい樹脂成形方法が望まれている。
However, in any of these methods, the cured product may remain in the mold, and a resin molding method in which the cured product is less likely to remain in the mold is desired.

【0010】[0010]

【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、ポット内に収納された成形用樹脂を、第一金型と
第二金型とを当接させたときにこれらの間に形成される
キャビティー内に、注入プランジャーで押し出して供給
して成形した後、第一金型と第二金型とを離間させて成
形用樹脂の硬化物を取り出して成形する樹脂成形方法で
あって、成形用樹脂が硬化した硬化物をつながった状態
で取り出すことができ、硬化物が金型内に残りにくい樹
脂成形方法を提供することにある。また、この樹脂成形
方法に用いる、成形用樹脂が硬化した硬化物をつながっ
た状態で取り出すことができ、硬化物が金型内に残りに
くい成形用金型装置を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to make a molding resin stored in a pot compatible with a first mold. After the second mold is brought into contact with the cavity and formed by extruding and supplying with the injection plunger into the cavity formed therebetween, the first mold and the second mold are separated from each other. This is a resin molding method in which a cured product of the molding resin is taken out and molded, and the cured product obtained by curing the molding resin can be taken out in a connected state, and the cured product is less likely to remain in the mold. To provide. Another object of the present invention is to provide a molding die apparatus which can be used in this resin molding method and can take out a cured product obtained by curing a molding resin in a connected state, and the cured product hardly remains in a mold.

【0011】[0011]

【課題を解決するための手段】本発明の請求項1に係る
樹脂成形方法は、ポット内に収納された成形用樹脂を、
第一金型と第二金型とを当接させたときにこれらの間に
形成されるキャビティー内に、注入プランジャーで押し
出して供給して成形した後、第一金型と第二金型とを離
間させて成形用樹脂の硬化物を取り出して成形する樹脂
成形方法において、第一金型と第二金型とを離間させて
成形用樹脂の硬化物を取り出す方法が、第一金型と第二
金型とが当接する面を挟んで、注入プランジャーと対向
するように対プランジャーを設けておき、第一金型と第
二金型とを当接させた状態で成形用樹脂の硬化物から注
入プランジャー及び対プランジャーを離間させた後、第
一金型と第二金型とを離間させて成形用樹脂の硬化物を
取り出す方法であることを特徴とする。
According to a first aspect of the present invention, there is provided a resin molding method comprising the steps of:
After the first mold and the second mold are extruded and supplied by an injection plunger into a cavity formed between the first mold and the second mold when they are brought into contact with each other, the first mold and the second mold are formed. In a resin molding method of separating a mold and taking out a cured product of a molding resin and molding, a method of separating a first mold and a second mold and taking out a cured product of the molding resin is a first metal mold. A plunger is provided so as to face the injection plunger with the surface where the mold and the second mold abut, and molding is performed with the first mold and the second mold in contact with each other. After the injection plunger and the plunger are separated from the cured resin, the first mold and the second mold are separated from each other to take out the cured molding resin.

【0012】本発明の請求項2に係る樹脂成形方法は、
請求項1記載の樹脂成形方法において、第一金型と第二
金型とを当接させた状態で成形用樹脂の硬化物から注入
プランジャー及び対プランジャーを離間させた後、第一
金型と第二金型とを離間させて成形用樹脂の硬化物を取
り出す方法が、第一金型と第二金型とを当接させた状態
で成形用樹脂の硬化物から注入プランジャー及び対プラ
ンジャーを離間させた後、その注入プランジャー及び対
プランジャーを成形用樹脂の硬化物に当接させ、次いで
第一金型と第二金型とを離間させると同時に、注入プラ
ンジャー及び対プランジャーのうち上側のプランジャー
をも成形用樹脂の硬化物から離間させて成形用樹脂の硬
化物を取り出す方法であることを特徴とする。
[0012] The resin molding method according to claim 2 of the present invention comprises:
2. The resin molding method according to claim 1, wherein the injection mold and the plunger are separated from the cured product of the molding resin while the first mold and the second mold are in contact with each other. A method of taking out the cured product of the molding resin by separating the mold and the second mold, the injection plunger and the injection mold from the cured product of the molding resin in a state where the first mold and the second mold are in contact with each other. After separating the plunger, the injection plunger and the plunger are brought into contact with the cured product of the molding resin, and then the first die and the second die are separated from each other. The method is characterized in that the upper plunger of the pair of plungers is separated from the cured product of the molding resin to take out the cured product of the molding resin.

【0013】本発明の請求項3に係る成形用金型装置
は、第一金型と、その第一金型と接離可能に配設された
第二金型と、第一金型と第二金型とを当接させたときに
これらの間に形成されるキャビティーと、第一金型と第
二金型とを当接させたときにこれらの間に形成され、キ
ャビティーに成形用樹脂を供給するための移送用通路
と、キャビティー内に突出可能に設けられたエジェクト
ピンと、第一金型と第二金型とが当接する面に開口する
ように第一金型に配設され、成形用樹脂を収納可能なポ
ットと、そのポットの内壁面と摺動自在に設けられ、ポ
ット内の成形用樹脂を加圧することにより、移送用通路
を介してキャビティーに成形用樹脂を供給可能な注入プ
ランジャーとを備え、第一金型と第二金型とを離間させ
て成形用樹脂の硬化物を取り出すことが可能に形成され
た成形用金型装置において、第一金型と第二金型とが当
接する面を挟んで注入プランジャーと対向する部分に形
成され且つ第二金型と摺動自在に設けられた対プランジ
ャーをも備え、第一金型と第二金型とを離間させて成形
用樹脂の硬化物を取り出す前に、第一金型と第二金型と
を当接させた状態で成形用樹脂の硬化物から注入プラン
ジャー及び対プランジャーを離間させた後、第一金型と
第二金型とが離間するよう形成されていることを特徴と
する。
According to a third aspect of the present invention, there is provided a molding die apparatus, comprising: a first die; a second die disposed so as to be able to contact and separate from the first die; A cavity formed between the two molds when they are brought into contact with each other, and a cavity formed between them when the first mold and the second mold are brought into contact with each other. A transfer passage for supplying resin for use, an eject pin protrudably provided in the cavity, and an opening arranged on the first mold so as to open on a surface where the first mold and the second mold abut. And a pot capable of storing a molding resin, and slidably provided on an inner wall surface of the pot, and by pressurizing the molding resin in the pot, a molding resin is formed in a cavity through a transfer passage. And an injection plunger capable of supplying the cured product of the molding resin by separating the first mold and the second mold. In a molding die device formed so as to be able to be taken out, the molding die device is formed at a portion facing the injection plunger across a surface where the first die and the second die abut, and slides with the second die. The plunger is also provided freely, and the first mold and the second mold are brought into contact before the first mold and the second mold are separated and the cured product of the molding resin is taken out. After the injection plunger and the counter plunger are separated from the cured product of the molding resin in this state, the first mold and the second mold are formed to be separated from each other.

【0014】本発明の請求項4に係る成形用金型装置
は、請求項3記載の成形用金型装置において、第一金型
と第二金型とを当接させた状態で成形用樹脂の硬化物か
ら注入プランジャー及び対プランジャーを離間させた
後、その注入プランジャー及び対プランジャーを成形用
樹脂の硬化物に当接し、次いで第一金型と第二金型とが
離間するよう形成されていることを特徴とする。
According to a fourth aspect of the present invention, there is provided a molding die apparatus according to the third aspect, wherein the first mold and the second mold are brought into contact with each other. After the injection plunger and the plunger are separated from the cured product, the injection plunger and the plunger are brought into contact with the cured product of the molding resin, and then the first die and the second die are separated. It is characterized by being formed as follows.

【0015】注入プランジャーの表面のうち成形用樹脂
の硬化物と接する部分及びその注入プランジャーと対向
する部分は、成形用樹脂を押し出すときの圧力により削
れて粗面化しやすいため、キャビティーの部分や移送用
通路の部分と比較して、成形用樹脂の硬化物との接着力
が高くなっていると考えられる。そのため、従来の方法
の場合、エジェクトピンで加圧して成形用樹脂の硬化物
を取り出すときの、剥がれにくさの位置による差が大き
く、早く剥がれる部分と剥がれてにくい部分が生じて成
形用樹脂の硬化物に曲げの力がかかり、注入プランジャ
ーと移送用通路の間等に割れが発生すると考えられる。
The portion of the surface of the injection plunger that comes into contact with the cured product of the molding resin and the portion that faces the injection plunger are easily shaved by the pressure at the time of extruding the molding resin and are easily roughened. It is considered that the adhesive strength to the cured product of the molding resin is higher than that of the portion or the portion of the transfer passage. Therefore, in the case of the conventional method, when the cured product of the molding resin is taken out by pressing with an eject pin, there is a large difference depending on the position of the difficulty in peeling, and a portion that is quickly peeled off and a portion that is difficult to be peeled off are generated. It is considered that a bending force is applied to the cured product and cracks occur between the injection plunger and the transfer passage.

【0016】しかし本発明のように、注入プランジャー
と対向するように対プランジャーを設けておき、成形用
樹脂の硬化物から注入プランジャー及び対プランジャー
を離間させた後、第一金型と第二金型とを離間させる方
法の場合、接着力が高い注入プランジャー及び対プラン
ジャーの部分は先に剥がれているため、エジェクトピン
で硬化物を加圧したときの、剥がれにくさの差は小さく
なる。そのため、硬化物の途中で割れが発生しにくくな
り、硬化物が金型内に残りにくくなる。
However, as in the present invention, the plunger is provided so as to face the injection plunger, and after separating the injection plunger and the plunger from the cured product of the molding resin, the first mold is formed. In the case of the method of separating the injection plunger and the second mold from the second mold, since the part of the injection plunger and the counter plunger having a high adhesive strength is peeled off first, when the hardened material is pressed with the eject pin, it is difficult to peel off. The difference becomes smaller. Therefore, cracks are less likely to occur in the middle of the cured product, and the cured product is less likely to remain in the mold.

【0017】[0017]

【発明の実施の形態】本発明に係る樹脂成形方法及び成
形用金型装置を図面に基づいて説明する。図1及び図2
は、本発明に係る樹脂成形方法及び成形用金型装置の一
実施の形態を説明する破断して示した正面図であり、図
3は、本発明に係る樹脂成形方法及び成形用金型装置の
他の実施の形態を説明する破断して示した正面図であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin molding method and a molding die apparatus according to the present invention will be described with reference to the drawings. 1 and 2
FIG. 1 is a cutaway front view illustrating an embodiment of a resin molding method and a molding die apparatus according to the present invention. FIG. 3 is a resin molding method and a molding die apparatus according to the present invention. It is the front view which showed and fractured and demonstrated other Embodiment of this invention.

【0018】本発明に係る樹脂成形方法の一実施の形態
は、図2に示すような成形用金型装置(本発明の請求項
3に係る成形用金型装置)を用いる。この成形用金型装
置は、第一金型11と、その第一金型11に対向して配
設された第二金型12を備える成形用金型装置である。
なお、第二金型12は、第一金型11と接離可能に配設
されており、また、第一金型11及び第二金型12は、
ヒーターや温度センサー(共に図示せず)を内設又は外
設して温度調整可能に形成されている。そして、第一金
型11と第二金型12とを当接させたときには、これら
の間に樹脂成形用のキャビティー13と、そのキャビテ
ィー13に成形用樹脂Aを供給するための移送用通路1
4が形成されるようになっている。また第二金型12に
は、エジェクトピン15がキャビティー13内に突出可
能に設けられている。
In one embodiment of the resin molding method according to the present invention, a molding die apparatus as shown in FIG. 2 (a molding die apparatus according to claim 3 of the present invention) is used. This molding apparatus is a molding apparatus including a first mold 11 and a second mold 12 disposed to face the first mold 11.
The second mold 12 is disposed so as to be able to contact and separate from the first mold 11, and the first mold 11 and the second mold 12 are
A heater and a temperature sensor (both not shown) are provided inside or outside so that the temperature can be adjusted. When the first mold 11 and the second mold 12 are brought into contact with each other, a cavity 13 for molding resin and a transfer cavity for supplying molding resin A to the cavity 13 are provided therebetween. Passage 1
4 are formed. An eject pin 15 is provided on the second mold 12 so as to protrude into the cavity 13.

【0019】また、第一金型11には、第二金型12と
当接する面に開口するようにポット16が配設されてお
り、そのポット16の内壁面に対して摺動自在に注入プ
ランジャー17が設けられている。そして第二金型12
には、第一金型11と当接する面を挟んで注入プランジ
ャー17と対向する位置に、対プランジャー18が設け
られており、この対プランジャー18は第二金型12と
摺動自在に設けられている。
A pot 16 is disposed in the first mold 11 so as to open on a surface that comes into contact with the second mold 12, and the pot 16 is slidably injected into the inner wall surface of the pot 16. A plunger 17 is provided. And the second mold 12
Is provided with a plunger 18 at a position facing the injection plunger 17 with a surface in contact with the first mold 11, and the plunger 18 is slidable with the second mold 12. It is provided in.

【0020】そして成形を開始する場合には、必要に応
じて例えばコンデンサー素子や半導体素子等の部品素子
を所定の位置に搭載したリードフレームを、第一金型1
1と第二金型12の間に装着する。次いで、ポット16
内に固体状の成形用樹脂Aを収納して加熱することによ
り成形用樹脂Aを液状化してから、図1(a)に示すよ
うに、注入プランジャー17で押し出し、移送用通路1
4を介してキャビティー13に成形用樹脂Aを供給す
る。なおこのとき、対プランジャー18を第一金型11
に近い位置で且つ移送用通路14を塞がない位置に配置
して成形用樹脂Aを供給する。
When molding is to be started, if necessary, a lead frame in which component elements such as a capacitor element and a semiconductor element are mounted at predetermined positions is inserted into the first mold 1.
It is mounted between the first mold 12 and the second mold 12. Next, the pot 16
The molding resin A is liquefied by storing and heating the solid molding resin A therein, and then extruded by the injection plunger 17 as shown in FIG.
4, the molding resin A is supplied to the cavity 13. At this time, the plunger 18 is connected to the first mold 11.
The molding resin A is supplied at a position close to the position and at a position where the transfer passage 14 is not closed.

【0021】なお、成形用樹脂Aをキャビティー13に
供給する前に、対プランジャー18を第一金型11に接
触するまで上昇させて移送用通路14を塞いだ後、注入
プランジャー17と対プランジャー18間で成形用樹脂
Aを加圧することにより、成形用樹脂A内部の空気を減
らしてから、対プランジャー18を第一金型11から離
間させて移送用通路14を通過可能状態にする方法で、
キャビティー13に成形用樹脂Aを供給するようにして
も良い。この場合、得られる成形品の内部に気泡が生じ
にくくなり好ましい。
Before supplying the molding resin A to the cavity 13, the plunger 18 is raised until it contacts the first mold 11 to close the transfer passage 14. By pressing the molding resin A between the plungers 18 to reduce the air inside the molding resin A, the plungers 18 are separated from the first mold 11 and can pass through the transfer passage 14. In the way
The molding resin A may be supplied to the cavity 13. In this case, air bubbles are less likely to be generated inside the obtained molded product, which is preferable.

【0022】次いで所定の時間加熱して成形用樹脂Aを
硬化させた後、第一金型11と第二金型12とを離間さ
せ、次いでエジェクトピン15で加圧して成形用樹脂の
硬化物Bを取り出す方法により成形を行う。なおこのと
き、第一金型11と第二金型12とを離間させて成形用
樹脂の硬化物Bを取り出す前に、図1(b)に示すよう
に、第一金型11と第二金型12とを当接させた状態
で、成形用樹脂の硬化物Bから注入プランジャー17及
び対プランジャー18を離間させた後、図1(c)に示
すように、第一金型11と第二金型12とを離間させて
成形用樹脂の硬化物Bを取り出すことが重要である。
Next, after heating for a predetermined time to cure the molding resin A, the first mold 11 and the second mold 12 are separated from each other, and then pressurized by the eject pin 15 to cure the molding resin A. The molding is performed by a method of taking out B. At this time, before the first mold 11 and the second mold 12 are separated from each other and the cured product B of the molding resin is taken out, as shown in FIG. After the injection plunger 17 and the plunger 18 are separated from the cured product B of the molding resin in a state where the mold 12 is in contact with the mold 12, as shown in FIG. It is important that the cured product B of the molding resin is taken out by separating the first mold 12 from the second mold 12.

【0023】第一金型11と第二金型12とを当接させ
た状態で成形用樹脂の硬化物Bから注入プランジャー1
7及び対プランジャー18を離間させた後、第一金型1
1と第二金型12とを離間させて成形用樹脂の硬化物B
を取り出すと、硬化物Bの途中で割れが発生しにくくな
り、硬化物が金型内に残りにくくなる。これは、注入プ
ランジャー17の表面のうち成形用樹脂の硬化物Bと接
する部分及びその注入プランジャーと対向する部分(本
発明の場合、対プランジャー18の表面。図4に示す従
来の方法の場合、第二金型32の一部)は、成形用樹脂
Aを押し出すときの圧力により削れて粗面化しやすいた
め、キャビティー13の部分や移送用通路14の部分と
比較して、成形用樹脂の硬化物Bとの接着力が高くなっ
ていると考えられる。そのため、従来の方法の場合、エ
ジェクトピン15で加圧して成形用樹脂の硬化物Bを取
り出すときの、剥がれにくさの位置による差が大きく、
早く剥がれる部分と剥がれにくい部分が生じるため、成
形用樹脂の硬化物Bに曲げの力がかかり、注入プランジ
ャー17と移送用通路14の間等に割れが発生すると考
えられる。
With the first mold 11 and the second mold 12 in contact with each other, the injection plunger 1
7 and the plunger 18 are separated from each other.
1 and the second mold 12 are separated from each other to cure the molding resin B
When the resin is taken out, cracks are less likely to occur in the cured product B, and the cured product is less likely to remain in the mold. This is a portion of the surface of the injection plunger 17 that comes into contact with the cured product B of the molding resin and a portion that faces the injection plunger (in the case of the present invention, the surface of the plunger 18; the conventional method shown in FIG. 4). In the case of, the part of the second mold 32) is easily shaved and roughened by the pressure at the time of extruding the molding resin A, and therefore, compared with the part of the cavity 13 and the part of the transfer passage 14, It is considered that the adhesive strength between the resin for use and the cured product B is high. Therefore, in the case of the conventional method, when the cured product B of the molding resin is taken out by pressing with the eject pin 15, there is a large difference depending on the position of difficulty in peeling,
It is considered that since a portion that peels off quickly and a portion that does not easily peel off occur, a bending force is applied to the cured product B of the molding resin, and a crack is generated between the injection plunger 17 and the transfer passage.

【0024】しかし本発明のように、注入プランジャー
17と対向するように対プランジャー18を設けてお
き、成形用樹脂の硬化物Bから注入プランジャー17及
び対プランジャー18を離間させた後、第一金型11と
第二金型12とを離間させる方法の場合、接着力が高い
注入プランジャー17及び対プランジャー18の部分は
先に剥がれているため、エジェクトピン15で硬化物B
を加圧したときの、剥がれにくさの差は小さくなる。そ
のため、硬化物Bの途中で割れが発生しにくくなり、硬
化物Bが金型内に残りにくくなる。
However, as in the present invention, the plunger 18 is provided so as to face the injection plunger 17, and after the injection plunger 17 and the plunger 18 are separated from the cured product B of the molding resin. In the case of the method in which the first mold 11 and the second mold 12 are separated from each other, the portions of the injection plunger 17 and the plunger 18 having a high adhesive force are peeled off first, so that the cured product B
When the pressure is applied, the difference in the difficulty of peeling is reduced. Therefore, cracks are less likely to occur in the middle of the cured product B, and the cured product B is less likely to remain in the mold.

【0025】なお、第一金型11と第二金型12とを当
接させた状態で成形用樹脂の硬化物Bから注入プランジ
ャー17及び対プランジャー18を離間させる工程と、
第一金型11と第二金型12とを離間させて成形用樹脂
の硬化物Bを取り出す工程の間に、図3(a)に示すよ
うに、注入プランジャー17及び対プランジャー18を
成形用樹脂の硬化物Bに再度当接させた後、第一金型1
1と第二金型12とを離間させると同時に、注入プラン
ジャー17(この実施の形態の場合の、注入プランジャ
ー17及び対プランジャー18のうち上側のプランジャ
ー)をも成形用樹脂の硬化物Bから離間させ、次いでエ
ジェクトピン15で加圧して成形用樹脂の硬化物Bを取
り出すようにしても良い。
A step of separating the injection plunger 17 and the plunger 18 from the cured product B of the molding resin while the first mold 11 and the second mold 12 are in contact with each other;
As shown in FIG. 3A, during the step of separating the first mold 11 and the second mold 12 to take out the cured product B of the molding resin, the injection plunger 17 and the paired plunger 18 are moved. After being brought into contact with the cured product B of the molding resin again, the first mold 1
At the same time that the first and second molds 12 are separated from each other, the injection plunger 17 (the upper plunger of the injection plunger 17 and the paired plunger 18 in this embodiment) is also cured with the molding resin. The cured product B of the molding resin may be taken out by separating from the product B and then applying pressure by the eject pin 15.

【0026】また、エジェクトピン15で加圧して成形
用樹脂の硬化物Bを取り出す時に、対プランジャー18
(この実施の形態の場合の、注入プランジャー17及び
対プランジャー18のうち下側のプランジャー)でも加
圧して成形用樹脂の硬化物Bを取り出すようにすると、
成形用樹脂の硬化物Bを剥がす力が均等化するため、成
形用樹脂の硬化物Bが割れることが更に発生しにくくな
り、特に硬化物が金型内に残りにくくなり好ましい。な
おこの場合、対プランジャー18及びエジェクトピン1
5を成形用樹脂の硬化物Bに当接してから同時に加圧す
ると、硬化物Bにかかる応力が安定するため、成形用樹
脂の硬化物Bが割れることが特に発生しにくくなり好ま
しい。
When the cured product B of the molding resin is taken out by applying pressure with the eject pin 15, the plunger 18
If (the lower plunger of the injection plunger 17 and the counter plunger 18 in this embodiment) is also pressed to take out the cured product B of the molding resin,
Since the force for peeling the cured product B of the molding resin is equalized, the cured product B of the molding resin is less likely to be cracked, and the cured product is less likely to remain in the mold, which is preferable. In this case, the plunger 18 and the eject pin 1
When 5 is simultaneously pressed after abutting on the cured product B of the molding resin, the stress applied to the cured product B is stabilized, so that the cured product B of the molding resin is less likely to be cracked, which is preferable.

【0027】上記対プランジャー18(この実施の形態
の場合の、注入プランジャー17及び対プランジャー1
8のうち下側のプランジャー)でも加圧して成形用樹脂
の硬化物Bを取り出す方法の場合、注入プランジャー1
7(この実施の形態の場合の、注入プランジャー17及
び対プランジャー18のうち上側のプランジャー)をも
成形用樹脂の硬化物Bに当接してから対プランジャー1
8及びエジェクトピン15で加圧すると、対プランジャ
ー18の加圧力を注入プランジャー17で一部受け止め
て安定化することが可能になるため、成形用樹脂の硬化
物Bが割れることが特に発生しにくくなり好ましい。
The plunger 18 (the injection plunger 17 and the plunger 1 in this embodiment)
In the case of the method of taking out the cured product B of the molding resin by pressurizing even the lower plunger 8 of FIG.
7 (in the case of this embodiment, the upper plunger of the injection plunger 17 and the counter plunger 18) also contacts the cured product B of the molding resin and then the counter plunger 1
8 and the eject pin 15, it is possible to stabilize the pressing force of the plunger 18 by partially receiving it by the injection plunger 17, so that the cured product B of the molding resin is particularly cracked. This is preferable because it is difficult to perform.

【0028】なお、本発明に用いる成形用樹脂Aとして
は、ポット16の開口形状と略同様の断面を有する円柱
状樹脂や、粒状に造粒した樹脂や、粉砕した樹脂等が挙
げられる。なお、粒状に造粒した樹脂の場合、各種大き
さのポット16に収納して成形することが可能なため、
汎用性に優れると共に、粉砕した樹脂と比較して微粒子
が少ないため、微粒子が飛散して成形用金型装置の周囲
を汚すことが発生しにくく好ましい。なお、粒状の樹脂
の大きさとしては、平均粒径が0.3〜1mm程度のも
のが収納性に優れ好ましい。
Examples of the molding resin A used in the present invention include a columnar resin having a cross section substantially similar to the shape of the opening of the pot 16, a resin granulated, and a pulverized resin. In the case of granulated resin, the resin can be housed in pots 16 of various sizes and molded.
Since it is excellent in versatility and contains less fine particles than the pulverized resin, it is preferable that the fine particles do not easily scatter and stain the periphery of the molding die apparatus. As the size of the granular resin, a resin having an average particle size of about 0.3 to 1 mm is preferable because of excellent storability.

【0029】なお、粒状の樹脂や、粉砕した樹脂のよう
に、ポット16に収納したとき、樹脂間に隙間が生じる
成形用樹脂Aの場合には、上記したように、注入プラン
ジャー17と対プランジャー18間で成形用樹脂Aを加
圧することにより、成形用樹脂A内部の空気を減らして
から、キャビティー13に樹脂を供給するようにすると
好ましい。
As described above, in the case of the molding resin A in which a gap is formed between the resins when stored in the pot 16 such as a granular resin or a crushed resin, as described above, the molding plunger 17 is paired with the injection plunger 17. It is preferable to supply the resin to the cavity 13 after the air inside the molding resin A is reduced by pressurizing the molding resin A between the plungers 18.

【0030】なお、成形用樹脂Aの材質としては、特に
限定するものではなく、エポキシ樹脂等の熱硬化性樹脂
や、それに無機充填材等を配合した熱硬化性樹脂等各種
のものが使用できる。そして、成形用樹脂Aを加熱して
硬化させる場合には、使用した成形用樹脂の硬化する温
度に合わせて適宜第一金型11及び第二金型12の温度
を調整して加熱する。
The material of the molding resin A is not particularly limited, and various materials such as a thermosetting resin such as an epoxy resin and a thermosetting resin blended with an inorganic filler and the like can be used. . When heating and curing the molding resin A, the temperatures of the first mold 11 and the second mold 12 are appropriately adjusted and heated in accordance with the curing temperature of the molding resin used.

【0031】[0031]

【発明の効果】本発明に係る樹脂成形方法は、第一金型
と第二金型とが当接する面を挟んで、注入プランジャー
と対向するように対プランジャーを設け、第一金型と第
二金型とを当接させた状態で成形用樹脂の硬化物から注
入プランジャー及び対プランジャーを離間させた後、第
一金型と第二金型とを離間させて成形用樹脂の硬化物を
取り出すため、成形用樹脂の硬化物が金型内に残りにく
い樹脂成形方法となる。
According to the resin molding method of the present invention, a pair of plungers is provided so as to face an injection plunger with a surface where a first mold and a second mold abut against each other. After the injection plunger and the plunger are separated from the cured product of the molding resin in a state where the molding resin is brought into contact with the second mold, the molding resin is separated by separating the first mold and the second mold. In this case, the cured product of the molding resin is hardly left in the mold.

【0032】本発明に係る成形用金型装置は、第一金型
と第二金型とが当接する面を挟んで注入プランジャーと
対向する部分に形成され且つ第二金型と摺動自在に設け
られた対プランジャーをも備え、第一金型と第二金型と
を離間させて成形用樹脂の硬化物を取り出す前に、第一
金型と第二金型とを当接させた状態で成形用樹脂の硬化
物から注入プランジャー及び対プランジャーを離間させ
た後、第一金型と第二金型とが離間するよう形成されて
いるため、成形用樹脂の硬化物が金型内に残りにくい成
形用金型装置となる。
The molding die apparatus according to the present invention is formed at a portion facing the injection plunger with a surface where the first die and the second die abut, and slidable with the second die. The first mold and the second mold are brought into contact with each other before the first mold and the second mold are separated and the cured product of the molding resin is taken out. After the injection plunger and the counter plunger are separated from the cured product of the molding resin in the inclined state, the first mold and the second mold are formed so as to be separated from each other. It becomes a molding die apparatus that is difficult to remain in the die.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る樹脂成形方法及び成形用金型装置
の一実施の形態を説明する破断して示した正面図であ
る。
FIG. 1 is a cutaway front view for explaining one embodiment of a resin molding method and a molding die apparatus according to the present invention.

【図2】本発明に係る樹脂成形方法及び成形用金型装置
の一実施の形態を説明する破断して示した正面図であ
る。
FIG. 2 is a cutaway front view for explaining one embodiment of a resin molding method and a molding die apparatus according to the present invention.

【図3】本発明に係る樹脂成形方法及び成形用金型装置
の他の実施の形態を説明する破断して示した正面図であ
る。
FIG. 3 is a cutaway front view for explaining another embodiment of the resin molding method and the molding die apparatus according to the present invention.

【図4】従来の樹脂成形方法及び成形用金型装置を説明
する破断して示した正面図である。
FIG. 4 is a cutaway front view for explaining a conventional resin molding method and a molding die apparatus.

【符号の説明】[Explanation of symbols]

11,31 第一金型 12,32 第二金型 13,33 キャビティー 14,34 移送用通路 15,35 エジェクトピン 16,36 ポット 17,37 注入プランジャー 18 対プランジャー A 成形用樹脂 B 硬化物 11, 31 First mold 12, 32 Second mold 13, 33 Cavity 14, 34 Transfer passage 15, 35 Eject pin 16, 36 Pot 17, 37 Inject plunger 18 Plunger A Molding resin B Curing Stuff

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01L 21/56 H01L 21/56 T // B29L 31:34 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI H01L 21/56 H01L 21/56 T // B29L 31:34

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 ポット内に収納された成形用樹脂を、第
一金型と第二金型とを当接させたときにこれらの間に形
成されるキャビティー内に、注入プランジャーで押し出
して供給して成形した後、第一金型と第二金型とを離間
させて成形用樹脂の硬化物を取り出して成形する樹脂成
形方法において、第一金型と第二金型とを離間させて成
形用樹脂の硬化物を取り出す方法が、第一金型と第二金
型とが当接する面を挟んで、注入プランジャーと対向す
るように対プランジャーを設けておき、第一金型と第二
金型とを当接させた状態で成形用樹脂の硬化物から注入
プランジャー及び対プランジャーを離間させた後、第一
金型と第二金型とを離間させて成形用樹脂の硬化物を取
り出す方法であることを特徴とする樹脂成形方法。
1. A molding resin housed in a pot is extruded by an injection plunger into a cavity formed between a first mold and a second mold when the first mold and the second mold are brought into contact with each other. In the resin molding method in which the first mold and the second mold are separated from each other and then the cured product of the molding resin is taken out and molded, the first mold and the second mold are separated from each other. The method of taking out the cured product of the molding resin is to provide a pair of plungers so as to face the injection plunger with the surface where the first mold and the second mold abut, sandwiching the first mold. After separating the injection plunger and the counter plunger from the cured product of the molding resin while the mold and the second mold are in contact with each other, the first mold and the second mold are separated from each other for molding. A resin molding method, which is a method of taking out a cured product of a resin.
【請求項2】 第一金型と第二金型とを当接させた状態
で成形用樹脂の硬化物から注入プランジャー及び対プラ
ンジャーを離間させた後、第一金型と第二金型とを離間
させて成形用樹脂の硬化物を取り出す方法が、第一金型
と第二金型とを当接させた状態で成形用樹脂の硬化物か
ら注入プランジャー及び対プランジャーを離間させた
後、その注入プランジャー及び対プランジャーを成形用
樹脂の硬化物に当接させ、次いで第一金型と第二金型と
を離間させると同時に、注入プランジャー及び対プラン
ジャーのうち上側のプランジャーをも成形用樹脂の硬化
物から離間させて成形用樹脂の硬化物を取り出す方法で
あることを特徴とする請求項1記載の樹脂成形方法。
2. An injection plunger and a plunger are separated from a cured product of a molding resin in a state where the first mold and the second mold are in contact with each other, and then the first mold and the second mold are separated. The method of taking out the cured resin of the molding resin by separating the mold is to separate the injection plunger and the counter plunger from the cured resin of the molding resin with the first mold and the second mold in contact with each other. After that, the injection plunger and the plunger are brought into contact with the cured product of the molding resin, and then the first mold and the second mold are separated from each other. The resin molding method according to claim 1, wherein the upper plunger is also separated from the cured product of the molding resin to take out the cured product of the molding resin.
【請求項3】 第一金型と、その第一金型と接離可能に
配設された第二金型と、第一金型と第二金型とを当接さ
せたときにこれらの間に形成されるキャビティーと、第
一金型と第二金型とを当接させたときにこれらの間に形
成され、キャビティーに成形用樹脂を供給するための移
送用通路と、キャビティー内に突出可能に設けられたエ
ジェクトピンと、第一金型と第二金型とが当接する面に
開口するように第一金型に配設され、成形用樹脂を収納
可能なポットと、そのポットの内壁面と摺動自在に設け
られ、ポット内の成形用樹脂を加圧することにより、移
送用通路を介してキャビティーに成形用樹脂を供給可能
な注入プランジャーとを備え、第一金型と第二金型とを
離間させて成形用樹脂の硬化物を取り出すことが可能に
形成された成形用金型装置において、第一金型と第二金
型とが当接する面を挟んで注入プランジャーと対向する
部分に形成され且つ第二金型と摺動自在に設けられた対
プランジャーをも備え、第一金型と第二金型とを離間さ
せて成形用樹脂の硬化物を取り出す前に、第一金型と第
二金型とを当接させた状態で成形用樹脂の硬化物から注
入プランジャー及び対プランジャーを離間させた後、第
一金型と第二金型とが離間するよう形成されていること
を特徴とする成形用金型装置。
3. A first mold, a second mold disposed so as to be able to contact and separate from the first mold, and a first mold and a second mold when the first mold and the second mold are brought into contact with each other. A cavity formed between the first mold and the second mold when the first mold and the second mold are brought into contact with each other, and a transfer passage for supplying molding resin to the cavity; An eject pin provided to be protrudable into the tee, a pot arranged in the first mold so as to open on a surface where the first mold and the second mold come into contact, and a pot capable of storing molding resin, An injection plunger slidably provided on the inner wall surface of the pot and capable of supplying the molding resin to the cavity via a transfer passage by pressing the molding resin in the pot; Molding metal formed so that the cured product of molding resin can be taken out by separating the mold from the second mold The mold device further includes a pair plunger formed at a portion facing the injection plunger with a surface where the first mold and the second mold abut on each other and slidably provided with the second mold. Before the first mold and the second mold are separated from each other to take out the cured product of the molding resin, the first mold and the second mold are brought into contact with each other from the cured product of the molding resin. A molding die apparatus, wherein the first die and the second die are formed to be separated after the injection plunger and the plunger are separated from each other.
【請求項4】 第一金型と第二金型とを当接させた状態
で成形用樹脂の硬化物から注入プランジャー及び対プラ
ンジャーを離間させた後、その注入プランジャー及び対
プランジャーを成形用樹脂の硬化物に当接し、次いで第
一金型と第二金型とが離間するよう形成されていること
を特徴とする請求項3記載の成形用金型装置。
4. The injection plunger and the plunger are separated from the cured product of the molding resin while the first die and the second die are in contact with each other. 4. The molding die apparatus according to claim 3, wherein the first die and the second die are formed so as to abut against a cured product of the molding resin.
JP11232898A 1998-04-22 1998-04-22 Molding method for resin and mold equipment for molding Pending JPH11300781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11232898A JPH11300781A (en) 1998-04-22 1998-04-22 Molding method for resin and mold equipment for molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11232898A JPH11300781A (en) 1998-04-22 1998-04-22 Molding method for resin and mold equipment for molding

Publications (1)

Publication Number Publication Date
JPH11300781A true JPH11300781A (en) 1999-11-02

Family

ID=14583937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11232898A Pending JPH11300781A (en) 1998-04-22 1998-04-22 Molding method for resin and mold equipment for molding

Country Status (1)

Country Link
JP (1) JPH11300781A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008093511A1 (en) * 2007-01-30 2008-08-07 Konica Minolta Opto, Inc. Optical element forming apparatus and optical element forming method
US7704801B2 (en) 1999-12-27 2010-04-27 Oki Semiconductor Co., Ltd. Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
CN102324394A (en) * 2011-09-26 2012-01-18 铜陵三佳山田科技有限公司 Continuous filling/packaging module box for DIP (double in-line package) integrated circuits
KR102067654B1 (en) * 2019-05-02 2020-01-17 케이에스엠테크놀로지(주) Molding apparatus for semiconductor package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704801B2 (en) 1999-12-27 2010-04-27 Oki Semiconductor Co., Ltd. Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
WO2008093511A1 (en) * 2007-01-30 2008-08-07 Konica Minolta Opto, Inc. Optical element forming apparatus and optical element forming method
JPWO2008093511A1 (en) * 2007-01-30 2010-05-20 コニカミノルタオプト株式会社 Optical element molding apparatus and optical element molding method
CN102324394A (en) * 2011-09-26 2012-01-18 铜陵三佳山田科技有限公司 Continuous filling/packaging module box for DIP (double in-line package) integrated circuits
KR102067654B1 (en) * 2019-05-02 2020-01-17 케이에스엠테크놀로지(주) Molding apparatus for semiconductor package

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