JPH0657414B2 - Method of resin-sealing and molding of electronic parts and mold device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for molding an electronic component such as an IC, a diode, a capacitor and the like by resin molding and an improvement of a mold device, and more particularly, to a resin molding method. The present invention relates to improving productivity by shortening molding cycle time.

[Conventional technology]

As a method and a device for sealing and molding electronic parts with a resin material, a transfer molding method and a mold device have been conventionally adopted.

The mold device for transfer molding is shown in FIGS.
As shown, the movable side comprising a center block 1 ₁ and an upper mold 1 of the fixed side comprising a cavity block 1 ₂ which, said the stationary upper mold 1 and arranged facing the center block 2 ₁ and cavity block 2 ₂ Metropolitan Lower mold 2 and both molds
The resin encapsulation molding cavities 4 and 5 of the electronic component 3 opposite to the PL (parting line) surface, the supply pot 7 for the resin tablet 6 disposed on the upper mold 1 side, and the fitting in the pot A plunger 8 and the like for pressurizing the resin material are provided.

Further, the upper and lower on the PL surface of the dies (1, 2), at the time of upper and lower dies of the mold clamping, cull 9 ₁ runner portion 9 ₂ gate communicating between pot 7 and the lower cavity 5 transport path 9 or the like of the molten resin material consisting of part 9 ₃ is provided. Incidentally, the cam portion 9 ₁ in the transfer passage, the upper mold pot 7
Is formed on the PL surface of the lower mold 2 facing the
When the upper and lower molds are clamped as shown in FIG. 6, the pot 7
And cull part 9 ₁ will be configured as a space for supplying and accommodating the resin tablet 6.

Resin encapsulation molding of electronic parts by such a mold device is
Usually, it is performed as follows.

First, when the upper and lower molds (1 and 2) shown in FIG. 5 are opened, the lead frame 10 on which the electronic component 3 is mounted is attached to the lower mold 2.
It is fitted and set at a predetermined position of the setting groove portion 11 formed on the PL surface, and in this state, the lower mold 2 is moved upward to clamp the upper and lower molds as shown in FIG.

Then, while supplying into the space portion made of resin tablets 6 from the pot 7 and cull 9 _1, pressurizing it at the plunger 8.

At this time, the resin tablet 6 is heated and melted by the heaters provided in both upper and lower molds (1, 2), and the plunger 8
It is pressurized by and is injected and filled from the pot 7 into the upper and lower cavities (4, 5) through the transfer passage 9. Therefore, after being heated and cured at a predetermined temperature (after a predetermined cure time), the upper and lower molds are opened again, and the cured resin in both the cavities (4, 5) and the transfer passage 9 is ejected by the upper and lower ejectors. By simultaneously releasing the pins 12 and 13 from each other, the electronic parts 3 in the cavities (4 and 5) can be molded in a resin molded body corresponding to the shapes of the cavities. it can.

[Problems to be solved by the invention]

Incidentally, the resin tablets 6 supplied into the space consisting of the pot 7 and cull part 9 ₁ is heated and melted by the upper and lower dies of the heater, the resin tablet 6, the peripheral closer to the inner circumferential surface of the pot 7 It will be melted sequentially from the surface portion. That is, the resin tablet 6 is the plunger 8
Since in the state of being pressed to the cull part 9 ₁ at by pressure, because the melting of the pressed resin portion to the cull part 9 _one side is delayed than the other portions.

Further, the molten resin material pressure transferred to both the cavity (4, 5) in the cull part 9 _1, the both cavities (4, 5) becomes to be heat cured at a predetermined temperature in the lower the gate opening is communicating port between the mold cavity 5 and the gate portion 9 _3, because it is provided in the embodiment of the limiting gate that is narrower than the runner 9 ₂ side, both the cavity (4, 5) in the The molten resin material injected under pressure is further heated by the friction / kneading action when passing through the gate port.

Thus, in the resin molding conditions as described above, the predetermined time for the molten resin material of the two cavities (4, 5) in heat cured at a predetermined temperature, the molten resin material Zantamari to cull 9 ₁ There will be a substantial difference in the time for curing by heating at the temperature.

Therefore, if you set the Kyaataimu relative to the heat curing time of the two cavities (4, 5) has an advantage of obtaining work to shorten the resin molding cycle time, this time, of the cull part 9 ₁ Since the molten resin material is in an uncured state where it is not heat-cured at a predetermined temperature, the releasing action of the uncured resin in the cull part is impaired, and all or part of the uncured resin remains in the cull part. However, there is a serious problem in resin molding that the next resin molding work becomes impossible.

Conversely, if you set the curing time relative to the heat curing time of the molten resin material Zantamari to cull 9 _1, it is possible to efficiently release action on the cured resin of the cull section 9 ₁ However, there is an adverse effect that productivity is lowered because the resin molding cycle time becomes long.

The present invention enhances the heat absorption efficiency of the resin material remaining in the cull part and accelerates the curing action of the cull part residual resin, thereby shortening the overall resin molding cycle time,
An object of the present invention is to provide a resin encapsulation molding method for an electronic component and a die device that can achieve high-efficiency production.

[Means for solving problems]

A resin encapsulation molding method for an electronic component according to the present invention is a space composed of a pot in which a resin tablet is disposed in one side of a die and a cull portion opposed to the other side die corresponding to the pot position. And heat the resin tablet with a plunger to melt it, and at the same time, the molten resin material is pressure-transferred from the cull portion into the mold cavity to be heated and cured at a predetermined temperature. A method for resin-molding an electronic component set in the mold cavity by forming a large number of uneven surface-shaped bodies on the cull portion to increase the surface area of the cull portion and By increasing the contact area between the resin remaining in the portion and a large number of uneven surface-shaped bodies and increasing the heat absorption efficiency of the residual resin in the cull portion, the curing of the residual resin in the cull portion can be accelerated. Which is characterized by That.

Further, a mold device for resin sealing molding of an electronic component according to the present invention includes a fixed side mold, a movable side opposite to the fixed mold, and a mold.
A pot provided on one of the fixed die and the movable die, a cull portion provided on the other die corresponding to the pot position, and a resin tablet supplied to a space formed by the pot and the cull portion. A heater for heating the resin, a plunger for pressurizing the resin tablet in the space, and a resin encapsulation for the electronic component including a passage for transferring the resin material melted in the pot and the cull into the cavities of both molds. A static-molding die device, wherein the cull portion is provided with a large number of concave-convex surface-shaped bodies having a required shape for increasing the surface area of the cull portion and increasing the contact area with the resin material remaining in the cull portion. It is characterized by being formed and configured.

[Action]

According to the present invention, a large number of concave-convex shaped bodies are formed in the cull part of the mold to increase the surface area of the cull part, and the contact area between the cull part and the resin material remaining in the cull part is increased. By increasing the amount of heat, the heat absorption efficiency of the residual resin in the cull portion can be increased, and thus the curing of the residual resin in the cull portion can be accelerated.

That is, the resin tablet is pressed against the surface of the cull portion by the pressure applied by the plunger, but the resin portion pressed against the surface of the cull portion has a contact area enlarged and increased by a large number of uneven surface-shaped bodies. Since the residual resin material remains on the surface of the cull portion, the residual resin material on the surface of the cull portion is heated under the condition that the contact area is expanded / increased.

Accordingly, the curing of the residual resin in the cull portion is caused by the synergistic action of the positive residual material or the storage action of the resin material on the surface of the residual cull portion and the efficient heating action on the residual resin material. The acceleration and the cure time of the residual resin in the cal portion can be substantially shortened.

In addition, by forming a large number of uneven surface-shaped bodies in the cull portion, the resin transfer / distribution efficiency or pressure in transferring the pressure from the cull portion into each cavity through each runner portion and gate portion The resin injection balance in the cavity is improved.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 shows a main part of a mold device for resin sealing molding of an electronic component according to the present invention.

This mold device, the movable composed of an upper mold 101 of the fixed side comprising a center block 101 ₁ and the cavity block 101 ₂ which faces disposed in the stationary upper mold 101 has the center blocks 102 ₁ and the cavity block 102 ₂ Metropolitan Side lower mold 102 and electronic parts 103 opposite to the P and L surfaces of the upper and lower molds (101 and 102)
Both cavities 104 and 105 for resin encapsulation molding and upper mold 101
Feeding pot 107 for resin tablets 106 placed on the side
Further, a resin tablet 106 fitted in the pot 107, a plunger 108 for pressurizing, and the like are provided.

Also, on the P and L surfaces of the upper and lower molds (101 and 102), when the upper and lower molds are clamped, the pot 107 and the lower mold cavity 10 are
5 is provided with such transfer passage 109 of the molten resin material consisting of cull 109 ₁ runners 109 ₂ gate 109 ₃ communicating between, at the time of upper and lower dies of the mold clamping, the pot 107 and the cull part 109 ₁ supply the resin tablet 106.
It will be configured as a space for accommodating.

In addition, as shown in FIGS. ₁ to 4, the cull portion 109 ₁ is provided to increase the surface area of the cull portion 109 ₁ so as to increase the contact area with the resin material remaining in the cull portion. A large number of uneven surface-shaped bodies 114 having a required shape are formed.

The reason why the means for increasing the surface area of the cull portion 109 ₁ is adopted is based on the following experimental results.

That is, when an experiment was conducted to compare the resin melting (resin hardening) effects of both the cull portion having a mirror-finished surface and that having a matte surface treatment, it was found that Tended to be efficiently melted.
Further, in the case of the cull portion subjected to the mirror surface treatment, the releasing property of the cured resin was poor. From this, by forming the cull portion into a rough surface shape and enlarging the contact area between the cull portion surface and the resin remaining in the cull portion to promote its melting (curing of the cull portion resin) Therefore, it was thought that it is possible to improve the releasability of the cull portion cured resin.

The shape of the uneven surface shape body 114, it is necessary to effectively release the Zantamari cured resin cull 109 _1,
It suffices to consider so-called undercut structure.

Further, the uneven surface-shaped body 114 may be formed of, for example, an uneven surface-shaped body 114 ₁ formed of a large number of triangular cross sections (or conical shapes) provided in a fixed arrangement as shown in FIG. Alternatively, the uneven surface-shaped bodies 114 ₁ may be provided in an indeterminate array mode other than such an array mode.

Further, the uneven surface-shaped body 114 may be configured by, for example, an uneven surface-shaped body 114 _{2 having} a large number of trapezoidal cross sections (or frustoconical shapes) provided in a fixed arrangement as shown in FIG. Alternatively, the uneven surface-shaped bodies 114 ₂ may be provided in an indeterminate array mode other than such an array mode.

Further, the uneven surface shape body 114 is, for example, an uneven surface shape formed by a large number of circumferential grooves (for example, concentric circular grooves or rectangular grooves) provided in a fixed arrangement as shown in FIG. It may be composed of the body 114 ₃ , or the uneven surface-shaped body 114 ₃ may be provided in an irregular arrangement mode which is not such an arrangement mode.

The resin encapsulation molding of the electronic component 103 by the mold device is performed in the same manner as the conventional one described above.

First, when the upper and lower molds (101 and 102) are opened, the lead frame 110 on which the electronic component 103 is mounted is attached to the P and L of the lower mold 102.
Fitting and setting is performed at a predetermined position of the setting groove portion 111 formed on the surface, and in this state, the lower mold 102 is moved upward to clamp the upper and lower molds.

Then, while supplying into the space portion made of the resin tablet 106 from the pot 107 and the cull part 109 ₁ Tokyo, this plunger
Pressurize at 108.

At this time, the resin tablet 106 in the space is heated and melted by a heater or the like provided in the upper and lower molds (101 and 102) and pressurized by the plunger 108, and the molten resin material is vertically moved through the transfer passage 109. Both cavities (10
4 ・ 105) will be filled by injection.

Therefore, after being heated and cured at a predetermined temperature, the upper and lower molds (101, 102) are opened again, and the cured resin in both the upper and lower cavities (104, 105) and the transfer passage 109 is lifted by the upper and lower ejector pins. By simultaneously releasing the molds at (112/113), the electronic components 10 in the upper and lower cavities are
3 can be molded by sealing in a resin molded body molded according to the shape of both cavities.

Incidentally, in the configuration of the above embodiment, since a number of uneven surface body 114 to cull 109 ₁ is provided with the surface area of the cull part 109 ₁ is enlarged, as described above, at the time of resin molding, resin Even when the tablet 106 is pressed by the plunger 108 and is strongly pressed against the surface of the cull portion 109 ₁ , the pressed resin portion has many uneven surface-shaped bodies.
The surface of the cull portion 109 ₁ whose contact area is increased by 114 is efficiently heated and melted, and is cured as a residual resin of the cull portion.

That is, the resin tablet 106 is strongly pressed against the cull portion 109 ₁ surface by the pressure applied by the plunger 108,
The resin portion remains (or accumulates) on the surface of the cull portion 109 ₁ enlarged by the large number of uneven surface-shaped bodies 114, and the residual resin has a contact area with the cull portion 109 ₁ side. In the increased state, it will be subjected to the heating and melting action.

Therefore, by the synergistic action of such a positive resin residual action on the surface of the cull portion 109 ₁ and an efficient heating action on the residual resin, a substantial cure time of the residual cull portion resin is obtained. Can be shortened. Moreover, the above-mentioned Cal part
By increasing the surface area of 109 ₁ and increasing the contact area with the resin remaining in the cull portion, it is possible to add an efficient heating and melting action to the remaining resin. It is possible to efficiently and surely accelerate the curing of the cull residual resin without providing a dedicated heater or the like in the cull portion.

Or, in short, by increasing the contact area with the resin Zantamari to the cull portion by expanding the surface area of the cull part 109 _1, because it is possible to enhance the heat absorption efficiency of the cull part Zantamari resin, the The curing of the residual resin in the cull portion can be accelerated.

Therefore, under the resin molding conditions in the above-mentioned embodiment, the time for heating and curing the molten resin material in the upper and lower cavities (104, 105) at a predetermined temperature and the molten resin material remaining in the cull portion 109 ₁ The heat curing time at a predetermined temperature is substantially the same, or the heat curing time of the latter is shorter than the heat curing time of the former. Therefore, if the cure time is set on the basis of the former heat-curing time, the above-mentioned calc
Since the releasing action of the cured resin in 109 ₁ can be efficiently performed, the resin molding cycle time can be shortened.

In addition, in the configuration of the above-described embodiment, since a large number of uneven surface-shaped bodies are formed in the cull portion, it is possible to pressurize and transfer from the cull portion into each cavity through each runner portion and gate portion. There is an advantage that the resin transfer / distribution efficiency or the resin injection balance into each cavity is improved.

It should be noted that the present invention is not limited to the above-described embodiments, and other methods and configurations are arbitrarily and appropriately changed and selected as necessary within the scope not departing from the gist of the present invention. It is possible.

For example, uneven surface shape 114 shown in the above embodiment, at the time of resin molding, since the contact area with the resin Zantamari to cull 109 ₁ as long as it increases, as described above,
The surface of the cull portion 109 ₁ may be subjected to the required satin finish, and may be used. However, this matte surface has a problem that it is relatively easily worn because it is formed in a relatively fine protruding surface shape. Therefore, it is formed as a granular uneven surface shape body as large as possible. It is preferable.

Further, a lower ejector pin for releasing the cured resin in the cull portion 109 ₁ may be arranged at the position of the cull portion, but since the releasing property of the cured resin is extremely good,
As shown in FIG. 1, the lower ejector pin 113 ₁ disposed at the position of the runner 109 ₂ may also serve as the release ejector pin for the cull portion cured resin.

Regarding the arrangement of the upper mold 101 and the lower mold 102 shown in the above-mentioned embodiment, for example, they may be arranged upside down, or they may be arranged horizontally and used.
The selection of the arrangement position is arbitrary.

Further, in the combination of the upper and lower molds, it is optional to select which of them is the fixed side or the movable side.

Further, in the above-mentioned embodiment diagram, the configuration in which the pot 107 and the plunger 108 are arranged on the upper mold 101 side is shown.
This may be the reverse configuration mode in which it is disposed on the lower mold 102 side.

Further, in the embodiment diagram, the molten resin material transfer passage 10
It is shown a mold structure example of the runner type having runners 109 ₂ to 9, without providing such runner section, cull
109 ₁ and the gate portion 109 ₃ were directly connected, it is clear that so-called may be applied to the mold apparatus of the runner-less type.

Further, although the upper mold 101 and the lower mold 102 are divided into a center block and a cavity block, respectively, in the embodiment drawings, the upper mold and the lower mold may be integrally formed.

〔The invention's effect〕

According to the present invention, the heat absorption efficiency of the resin material remaining in the cull portion can be increased, and the curing action of the cull portion residual resin can be promoted. Therefore, the conventional drawbacks described above are eliminated. The present invention has an excellent practical effect that it is possible to provide a resin encapsulation molding method for an electronic component and a mold apparatus capable of achieving high-efficiency production of this type of product.

[Brief description of drawings]

FIG. 1 is a partially cutaway vertical front view showing a main part of a resin encapsulation molding die apparatus according to the present invention, showing a mold open state thereof. FIG. 2 is an enlarged vertical sectional front view showing an uneven surface-shaped body in the cull portion of the mold. FIG. 3 is a vertical sectional front view showing an example of the shape of another uneven surface-shaped body. FIG. 4 is a plan view showing a shape example of another uneven surface-shaped body. 5 and 6 are partially cutaway vertical front views showing a configuration example of the transfer molding apparatus. FIG. 5 shows the mold open state, and FIG. 6 shows the mold clamped state. There is. [Explanation of symbols] 101 …… Fixed upper mold 102 …… Movable lower mold 103 …… Electronic parts 104 …… Cavity 105 …… Cavity 106 …… Resin tablet 107 …… Pot 108 …… Plunger 109 …… Transfer passage 109 ₁ ...... Cull part 114 ...... Concavo-convex shape body 114 ₁ ...... Concavo-convex shape body 114 ₂ ...... Concavo-convex shape body 114 ₃ ...... Concavo-convex shape body

Claims (2)

[Claims] 1. A resin tablet is supplied to an intermediate portion consisting of a pot disposed in one side of the die and a cull portion opposed to the other side die corresponding to the pot position and heated.
In addition, the resin tablet is pressurized by a plunger to be melted, and the molten resin material is pressure-transferred from the cull portion into the mold cavity to be heated and cured at a predetermined temperature, whereby the mold cavity Is a method of resin-molding an electronic component set in, wherein a large number of uneven surface shapes are formed in the cull portion to increase the surface area of the cull portion, and a large amount of resin and a large amount of resin remaining in the cull portion are formed. An electronic component characterized in that the contact area with the uneven surface-shaped body is increased and the heat absorption efficiency of the cull portion residual resin is increased to accelerate the curing of the cull portion residual resin. Resin encapsulation molding method. 2. A fixed mold, a movable mold that opposes the fixed mold, a pot provided on one of the fixed mold and the movable mold, and the other corresponding to the pot position. Cull portion provided on the side mold, a heater that heats the resin tablet supplied to the space portion formed by the pot and the cull portion, a plunger that pressurizes the resin tablet in the space portion, and melting at the pot and cull portion. What is claimed is: 1. A mold device for resin-sealing molding of an electronic component, comprising a passage for transferring a resin material that has been liquefied into the cavities of both molds, wherein the surface area of the cull part is enlarged in the cull part. A mold device for resin encapsulation molding of electronic parts, characterized in that a large number of concavo-convex surface shaped bodies having a required shape for increasing a contact area with a resin material remaining in a portion are formed.