JPS5335760A - Mold for transfer molding - Google Patents

Mold for transfer molding

Info

Publication number
JPS5335760A
JPS5335760A JP10995476A JP10995476A JPS5335760A JP S5335760 A JPS5335760 A JP S5335760A JP 10995476 A JP10995476 A JP 10995476A JP 10995476 A JP10995476 A JP 10995476A JP S5335760 A JPS5335760 A JP S5335760A
Authority
JP
Japan
Prior art keywords
mold
transfer molding
molding
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10995476A
Other languages
Japanese (ja)
Other versions
JPS5440263B2 (en
Inventor
Masaki Yoshii
Kimio Jin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10995476A priority Critical patent/JPS5335760A/en
Publication of JPS5335760A publication Critical patent/JPS5335760A/en
Publication of JPS5440263B2 publication Critical patent/JPS5440263B2/ja
Granted legal-status Critical Current

Links

JP10995476A 1976-09-16 1976-09-16 Mold for transfer molding Granted JPS5335760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10995476A JPS5335760A (en) 1976-09-16 1976-09-16 Mold for transfer molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10995476A JPS5335760A (en) 1976-09-16 1976-09-16 Mold for transfer molding

Publications (2)

Publication Number Publication Date
JPS5335760A true JPS5335760A (en) 1978-04-03
JPS5440263B2 JPS5440263B2 (en) 1979-12-03

Family

ID=14523332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10995476A Granted JPS5335760A (en) 1976-09-16 1976-09-16 Mold for transfer molding

Country Status (1)

Country Link
JP (1) JPS5335760A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717030A (en) * 1985-11-29 1988-01-05 Hitachi, Ltd. Turbine building equipped with overhead traveling cranes
JPH028022A (en) * 1988-06-27 1990-01-11 T & K Internatl Kenkyusho:Kk Resin-sealing and molding method for electronic component and molding apparatus
JPH04147814A (en) * 1990-10-11 1992-05-21 Daiichi Seiko Kk Mold for resin seal molding
US5358396A (en) * 1991-01-29 1994-10-25 Sony Corporation Multi-functional mould
US6200504B1 (en) 1994-05-09 2001-03-13 Fico B.V. Method for encapsulating with plastic a lead frame with chips

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4210270Y1 (en) * 1964-11-20 1967-06-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4210270Y1 (en) * 1964-11-20 1967-06-06

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717030A (en) * 1985-11-29 1988-01-05 Hitachi, Ltd. Turbine building equipped with overhead traveling cranes
JPH028022A (en) * 1988-06-27 1990-01-11 T & K Internatl Kenkyusho:Kk Resin-sealing and molding method for electronic component and molding apparatus
JPH04147814A (en) * 1990-10-11 1992-05-21 Daiichi Seiko Kk Mold for resin seal molding
US5358396A (en) * 1991-01-29 1994-10-25 Sony Corporation Multi-functional mould
US6200504B1 (en) 1994-05-09 2001-03-13 Fico B.V. Method for encapsulating with plastic a lead frame with chips

Also Published As

Publication number Publication date
JPS5440263B2 (en) 1979-12-03

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