JPS5335760A - Mold for transfer molding - Google Patents
Mold for transfer moldingInfo
- Publication number
- JPS5335760A JPS5335760A JP10995476A JP10995476A JPS5335760A JP S5335760 A JPS5335760 A JP S5335760A JP 10995476 A JP10995476 A JP 10995476A JP 10995476 A JP10995476 A JP 10995476A JP S5335760 A JPS5335760 A JP S5335760A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- transfer molding
- molding
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10995476A JPS5335760A (en) | 1976-09-16 | 1976-09-16 | Mold for transfer molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10995476A JPS5335760A (en) | 1976-09-16 | 1976-09-16 | Mold for transfer molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5335760A true JPS5335760A (en) | 1978-04-03 |
JPS5440263B2 JPS5440263B2 (en) | 1979-12-03 |
Family
ID=14523332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10995476A Granted JPS5335760A (en) | 1976-09-16 | 1976-09-16 | Mold for transfer molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5335760A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717030A (en) * | 1985-11-29 | 1988-01-05 | Hitachi, Ltd. | Turbine building equipped with overhead traveling cranes |
JPH028022A (en) * | 1988-06-27 | 1990-01-11 | T & K Internatl Kenkyusho:Kk | Resin-sealing and molding method for electronic component and molding apparatus |
JPH04147814A (en) * | 1990-10-11 | 1992-05-21 | Daiichi Seiko Kk | Mold for resin seal molding |
US5358396A (en) * | 1991-01-29 | 1994-10-25 | Sony Corporation | Multi-functional mould |
US6200504B1 (en) | 1994-05-09 | 2001-03-13 | Fico B.V. | Method for encapsulating with plastic a lead frame with chips |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4210270Y1 (en) * | 1964-11-20 | 1967-06-06 |
-
1976
- 1976-09-16 JP JP10995476A patent/JPS5335760A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4210270Y1 (en) * | 1964-11-20 | 1967-06-06 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717030A (en) * | 1985-11-29 | 1988-01-05 | Hitachi, Ltd. | Turbine building equipped with overhead traveling cranes |
JPH028022A (en) * | 1988-06-27 | 1990-01-11 | T & K Internatl Kenkyusho:Kk | Resin-sealing and molding method for electronic component and molding apparatus |
JPH04147814A (en) * | 1990-10-11 | 1992-05-21 | Daiichi Seiko Kk | Mold for resin seal molding |
US5358396A (en) * | 1991-01-29 | 1994-10-25 | Sony Corporation | Multi-functional mould |
US6200504B1 (en) | 1994-05-09 | 2001-03-13 | Fico B.V. | Method for encapsulating with plastic a lead frame with chips |
Also Published As
Publication number | Publication date |
---|---|
JPS5440263B2 (en) | 1979-12-03 |
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