JPH028022A - Resin-sealing and molding method for electronic component and molding apparatus - Google Patents

Abstract

PURPOSE:To accelerate the curing of the remaining resin of a cull by increasing the surface area of the cull to increase the contact area of the cull with the remaining resin. CONSTITUTION:Since an uneven shape body 114 is provided on a cull 1091 to increase the surface area of the cull 1091, even if a resin tablet 106 is received by an applying pressure of a plunger 108 to become a state pressed to the face of the cull 1091 at the time of molding with resin, the pressed resin part is efficiently heated and melted by the face of the cull 1091 in which its contact area is increased through the uneven shape body 114, and cured as the remaining resin of the cull. The surface area of the cull 1091 is increased to increase the contact area of the remaining resin with the cull to enhance the thermal absorption efficiency of the remaining resin of the cull thereby to accelerate the curing of the resin, thereby shortening a resin molding cycle time.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to improvements in a method and mold device for molding electronic components such as ICs, diodes, and capacitors with resin, and in particular, This article relates to improving productivity by shortening molding cycle time.

[Conventional technology]

Transfer molding methods and mold devices have been conventionally employed as methods and devices for sealing and molding electronic components with resin materials.

The mold apparatus includes, for example, as shown in FIGS. 5 and 6, a fixed-side upper mold 1 consisting of a center block 11 and a cavity block 1°, and a fixed-side upper mold 1 disposed opposite to the fixed upper mold 1. Center block 2) and cavity block 22
a lower mold 2 on the movable side, consisting of cavities 4 and 5 for resin sealing molding of the electronic component 3 placed opposite to the P and L (parting line) surfaces of both molds, and cavities 4 and 5 placed on the upper mold 1 side. A pot 7 for supplying resin tablets (6), a plunger 8 for pressurizing the resin material fitted into the pot, and the like are provided.

In addition, when the molds are clamped, the cull part 9 runner part 92 which communicates between the pot 7 and the lower mold cavity 5 is also provided.
- A transfer path 9 for the molten resin material consisting of a gate portion 93 is provided, and the cull portion 91 is formed on the P and L surfaces of the lower mold 2 facing the upper mold pot 7, and therefore When both molds are clamped as shown in FIG. 6, the pot 7 and the cull 91 are configured as a space for supplying and accommodating the resin tablet 6.

Resin sealing molding of electronic components using the mold apparatus is performed in the following manner.

First, when opening both molds 1 and 2 shown in FIG.
It is fitted and set in a predetermined position in the setting groove 11 formed on the surface, and in this state, as shown in FIG. 6, the lower mold 2 is moved upward to clamp the two molds together.

Next, the resin tablet 6 is supplied into the space formed by the pot 7 and the cull 9, and is pressurized by the plunger 8.

At this time, the resin tablet 6 is heated and melted by the heaters provided in both the molds 1 and 2, and is pressurized by the plunger 8, and is injected and filled into the upper and lower cavities 4 and 5 through the passage 9 from the pot 7. will be done. Therefore, after heating and curing to a predetermined temperature (after a predetermined curing time), both molds are opened again, and both cavities 4 and
By simultaneously releasing the cured resin inside 5 and the passage 9 from the mold using both the upper and lower ejector pins 12 and 13, the electronic component 3 inside the two cavities is molded to correspond to the shape of the two cavities. It can be sealed and molded into a resin molded body.

[Problem that the invention seeks to solve]

By the way, the resin tablet 6 supplied into the space consisting of the pot 7 and the cull part 9□ is heated and melted by both types of heaters. It will be sequentially melted from the beginning. That is, since the resin tablet 6 is pressed against the cull portion 91 by the pressure applied by the plunger 8,
However, the melting of the resin portion pressed against the surface of the cull portion 91 is delayed compared to other portions.

Further, the molten resin material transferred under pressure from the cull part 91 into the cavities 4 and 5 is heated and hardened at a predetermined temperature in the cavities, but the contact between the cavity (5) and the gate part 93 is The gate opening, which is a communication opening, is provided in the form of a restricting gate that is narrower than the runner section 9□ side, so the molten resin material that is pressurized and injected into the cavities 4 and 5 flows through this gate opening. It will be further heated by the friction and kneading effect as it passes through.

Under such resin molding conditions, the cavity 4.
There is a substantial difference between the time required to heat and harden the molten resin material in 5 at a predetermined temperature and the time required to heat and harden the molten resin material remaining in the cull portion 91 at a predetermined temperature.

Therefore, if the curing time is set based on the former heat curing time, there is an advantage that the resin molding cycle time can be shortened. Since it is in an uncured state that has not been heat-cured, the mold release effect of the uncured resin in the cull is impaired, and all or part of the uncured resin remains in the cull, making the next resin molding operation impossible. There are serious adverse effects on resin molding, such as.

On the other hand, if the curing time is set based on the latter heat curing time, it is possible to efficiently release the cured resin in the cull portion 9, but the resin molding cycle time becomes longer. This has the disadvantage of reducing productivity.

The present invention aims to shorten the overall resin molding cycle time and achieve highly efficient production by increasing the heat absorption efficiency of the resin remaining in the cull and promoting the curing action of the resin remaining in the cull. The object of the present invention is to provide a resin sealing molding method and a mold apparatus for electronic components that can perform the following steps.

[Means for solving problems]

The resin encapsulation molding method for electronic components according to the present invention includes (supplying and heating an M resin tablet into a space consisting of a mold pot and a cull portion provided opposite to the pot, and using a plunger to heat the M resin tablet. In a method of molding an electronic component set in a cavity with a resin by pressurizing and melting the material, transferring the molten resin material from the cull part to a cavity under pressure, and heating and hardening it at a predetermined temperature. By enlarging the surface area of the cull and increasing the contact area with the resin remaining in the cull, the heat absorption efficiency of the resin remaining in the cull is increased, and the resin remaining in the cull is cured. This feature is characterized by the fact that it is designed to promote.

Furthermore, the mold device for resin-sealing molding of electronic components according to the present invention used in the method of the present invention includes a fixed side mold, a movable side mold opposite to the fixed mold, and either of the two molds. A pot provided on one side, a cull part provided in the mold on the other side corresponding to the pot, a heater that heats the resin tablet supplied to the space consisting of the pot and the cull part, and pressurizes the resin tablet. In a mold device for resin sealing of electronic components, which includes a plunger and a passage for transferring the resin material melted in the pot and the cull into the cavities of both molds, the cull is placed in the cull. The present invention is characterized in that it is configured by forming a necessary uneven surface shape body to enlarge the surface area of the cull portion and increase the contact area with the resin remaining in the cull portion.

[Effect]

According to the present invention, by expanding the surface area of the cull to increase the contact area with the resin remaining in the cull, it is possible to increase the heat absorption efficiency of the resin remaining in the cull, and therefore, It is possible to promote the curing of the resin remaining in the cull portion.

That is, the resin tablet is pressed against the surface of the cull part by the pressure applied by the plunger.

However, the resin portion pressed against the surface of the cull remains on the expanded surface of the cull, which is formed into a structure such as an uneven surface, and the residual resin is left on the cull side. The area of contact with the material is increased and the heating effect is applied.

Therefore, due to the synergistic effect of the positive residual (or storage) action of the resin on the surface of the cull and the efficient heating action on the residual resin, the resin remaining in the cull is substantially reduced. This makes it possible to shorten the curing time.

Further, according to the present invention, a concavo-convex surface shaped body having a necessary and simple structure is provided in the cull portion for enlarging its surface area and increasing the contact area with the resin remaining in the cull portion. Since it is configured by forming, for example, it is possible to efficiently and reliably promote the curing of the resin remaining in the cull portion without providing a dedicated heater or the like.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

FIG. 1 shows the main parts of a mold apparatus for resin-sealing molding of electronic components according to the present invention.

This mold device includes a fixed-side upper mold 101 consisting of a center block 101 and a cavity block 1012.
, a center block 102) and a cavity block 102□ arranged opposite to the fixed upper mold 101; Cavities 104 and 10 for fastening molding
5 and a resin tablet (106) placed on the upper mold 101 side.
) and a plunger 108 for pressurizing the resin material fitted into the pot.

In addition, when the two molds are clamped, the cull portion 1091 that communicates between the pot 107 and the lower mold cavity 105 is also provided.
A molten resin material transfer passage 109 consisting of a runner part 109□ and a gate part 1093 is provided, and the cull part 109 is connected to the lower mold 102 facing the upper mold pot 107.
Therefore, when both molds are clamped, the pot 107 and the cull portion 109□ are configured as a space for supplying and accommodating the resin tablet 106. Become.

Further, as shown in FIGS. 1 to 4, the cull portion 1091 is formed with a necessary uneven surface shape body 114 for enlarging the surface area of the cull portion 109t. In this case, the area of contact with the resin remaining in the cull portion 109 is increased.

The adoption of this means of enlarging the surface area of the cull portion 109 is based on the following experimental results.

According to an experiment that compared the resin melting (resin hardening) effect of the cull portion 91 with mirror finish treatment or satin finish treatment, the resin melting effect is more efficient in the latter case. It showed a tendency to be carried out well. That is,
Since the mirror-treated cull part has poor mold releasability of the cured resin, by forming the cull part into the required rough surface shape,
It was thought that it would be better to increase the contact area between the surface of the cull and the resin remaining in the cull to promote its melting (hardening of the cull resin).

Note that the shape of the uneven surface shaped body 114 is similar to that of the cull portion 109.
Since it is necessary to efficiently release the residual hardened resin in step 1, it is preferable not to have a so-called undercut structure.

Further, the uneven surface shape body 114 has a required plurality of triangular (or conical) cross sections in a fixed arrangement manner or not in such a fixed arrangement R, for example, as shown in FIG. It may be constructed from an uneven surface shaped body 1141.

In addition, the uneven surface shaped body 114 may have, for example, a plurality of uneven surfaces having a trapezoidal (or truncated conical) cross section in a fixed arrangement or not in such a fixed arrangement, as shown in FIG. It may also be constructed from a surface-shaped body 1142.

Further, the uneven surface shaped body 114 may have a plurality of circumferential grooves (for example, a circumferential groove made of concentric circles) arranged in a fixed manner or not in such a fixed arrangement manner, as shown in FIG. 4, for example. groove or rectangular groove) 114
It may be composed of 3.

Resin sealing molding of the electronic component 103 using the above-mentioned mold apparatus is as follows:
This is done in the same way as the conventional method described above.

First, when opening the above two molds (101 and 102),
The lead frame 110 with the electronic component 103 mounted thereon is fitted and set in the predetermined positions of the setting grooves 111 formed on the P and L surfaces of the lower mold 102, and in this state, the lower mold 102 is moved upward to set both molds. Perform mold clamping.

Next, the resin tablet 106 is supplied and housed in the space consisting of the pot 107 and the cull 109, and is pressurized by the first langeer 108.

At this time, the resin tablet 106 is heated and melted by a heater (not shown) provided in both molds, is pressurized by a plunger 108, and is passed from the pot 107 to the upper and lower cavities (104, 105) through the transfer passage 109.
) will be injected and filled.

Therefore, after heating and curing to a predetermined temperature, both molds (10
1, 102) is opened again, and the cured resin in both the upper and lower cavities (104, 105) and the transfer passage 109 is simultaneously released from the mold by both the upper and lower ejector turbines (112, 113). The electronic components 103 in both the upper and lower cavities can be sealed and molded into a resin molded body that is molded to correspond to the shapes of both the cavities.

However, in the configuration of the above embodiment, the cull portion 1
091 is provided with an uneven surface shaped body 114 to form the cull portion 10.
Since the surface area of 9□ has been expanded, as mentioned above,
During resin molding, even if the resin tablet 106 receives pressure from the plunger 108 and is pressed against the surface of the cull portion 109 □, the pressed resin portion will not penetrate through the uneven surface shaped body 114. Due to the increased contact area of the cull portion 109 □ surface, the resin is efficiently heated and melted, and the resin is cured as a residual resin in the cull portion.

That is, the resin tablet 106 is pressed against the surface of the cull portion 1091 by the pressing force of the plunger 10g, but the resin portion is formed into the required uneven surface shape body 114 and the expanded cull portion 109 , and the residual resin remains (or accumulates) on the surface of the cull part 109. The contact area with the side is increased and the heating effect is applied.

Therefore, due to the synergistic effect of the positive residual effect of the resin on the surface of the cull part 109□ and the efficient heating effect on the residual resin, the substantial curing time of the resin remaining in the cull part can be reduced. can be shortened. Also,
By enlarging the surface area of the cull portion 1091 and increasing the contact area with the resin remaining in the cull portion, an efficient heating action can be applied to the residual resin. It is possible to efficiently and reliably accelerate the curing of the resin remaining in the cull portion without providing a dedicated heater or the like in the cull portion.

In short, by expanding the surface area of the cull 1091 and increasing the contact area with the resin remaining in the cull, the heat absorption efficiency of the resin remaining in the cull can be increased. It is possible to promote the curing of residual resin.

Therefore, under the resin molding conditions in the above embodiment, the time required to heat and harden the molten resin material in both the upper and lower cavities (104 and 105) at a predetermined temperature, and the cull portion 109
The time for heating and curing the molten resin material remaining in the molten resin material 1 at a predetermined temperature becomes a gap, or the latter heating curing time becomes shorter than the former heating curing time. For this reason,
If the curing time is set based on the former heat curing time, the mold release action of the cured resin in the cull portion 1091 can be performed efficiently without causing the above-mentioned disadvantages in resin molding. This makes it possible to shorten cycle time.

It should be noted that the present invention is not limited to the above embodiments, and may be modified as necessary without departing from the spirit of the present invention.
Other methods and configurations can be arbitrarily and appropriately changed and selected.

For example, the uneven surface shaped body 114 shown in the above embodiment may be of any type as long as it increases the contact area with the resin remaining in the cull portion 1091 during resin molding. The 1091 side may be subjected to a required satin finish. However, since this satin surface is formed into a relatively fine protruding surface shape, there is a problem in that it is relatively easy to wear out. It is preferable.

Further, a lower ejector turbine for releasing the cured resin in the cull portion 1091 may be disposed at the cull portion position, but since the cured resin has extremely good mold releasability, the first As shown in the figure, a lower ejector turbine 1131 disposed at the runner section 1092 may also be configured to serve as an ejector turbine for releasing the cull portion cured resin.

In addition, the upper mold 101 and the lower mold 102 shown in the above embodiment diagrams
Regarding the arrangement, for example, it may be used upside down or arranged horizontally in the left and right directions, and the selection of the arrangement position is arbitrary.

Further, in the combination of the above two types, it is also possible to select which side is the fixed side or the movable side.

Further, although the embodiment diagram shows a configuration in which the pot 107 and the plunger 108 are disposed on the upper mold 101 side, a reverse configuration may be adopted in which the pot 107 and the plunger 108 are disposed on the lower mold 102 side.

In addition, in the embodiment diagram, the transfer passage 1 for the molten resin material is
09 shows an example of a runner type mold device having a runner portion 1092, but a runnerless type mold device in which the cull portion 1091 and the gate portion 1093 are directly connected without having such a runner portion 1092 is shown. It is clear that it can also be applied to mold devices.

In addition, in the embodiment diagram, an upper mold 101 and a lower mold 102 are shown.
Although shown as having been divided into a center block and a cavity block, the two types may be formed integrally.

〔Effect of the invention〕

According to the present invention, since the overall resin molding cycle time can be shortened, the conventional drawbacks as described above can be overcome, and the resin encapsulation of electronic components can achieve highly efficient production of this type of product. This has excellent practical effects in that it can provide a molding method and mold device.

4,

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway longitudinal sectional front view showing the main parts of a mold device for resin encapsulation molding according to the present invention. FIG. 2 is an enlarged longitudinal sectional front view showing the uneven surface shape body. FIGS. 3 and 4 are a longitudinal sectional front view and a plan view showing other examples of the shape of the uneven surface shaped body. 5 and 6 are partially cutaway MIUr front views showing an example of the configuration of a transfer molding device, with FIG. 5 showing the mold in its open state, and FIG. 6 showing its mold closing state, respectively. There is. [Explanation of symbols] ... Fixed upper mold ... Movable lower mold ... Electronic parts ... Cavity ... Cavity ... Resin tablet ... Pot 108 ... Plunger 109 ... Transfer passage 1091... Cull portion 114... Uneven surface shaped body 114! ...Uneven surface shaped body 1142...Uneven surface shaped body 1143...Uneven surface shaped body

Claims (2)

[Claims] (1) A resin tablet is supplied into a space consisting of a mold pot and a cull placed opposite the pot, heated, and pressurized with a plunger to melt it, and the molten resin material is In a method for molding an electronic component set in a cavity with a resin by pressurizing transfer from the cull part into a cavity and heating and curing it at a predetermined temperature, the surface area of the cull part is expanded and the cull part An electronic component characterized in that the heat absorption efficiency of the resin remaining in the cull portion is increased by increasing the contact area with the resin remaining in the cull portion, thereby promoting the curing of the resin remaining in the cull portion. resin encapsulation molding method. (2) A mold on the fixed side, a mold on the movable side opposite to the fixed mold, a pot provided on one side of both molds, and a cull portion provided on the mold on the other side corresponding to the pot. a heater that heats the resin tablet supplied to the space formed by the pot and the cull, a plunger that pressurizes the resin tablet, and a heater that heats the resin tablet supplied to the space consisting of the pot and the cull, and a plunger that applies the resin material melted in the pot and the cull to the cavities of both types. In a mold device for resin-sealing molding of electronic components, which is provided with a passageway for transferring the inside of the mold, the surface area of the cull portion is expanded to increase the contact area with the resin remaining in the cull portion. A mold device for resin-sealing molding of electronic components, characterized in that it is configured by forming a body with a desired uneven surface shape.