KR0157100B1 - Metal mold for sealing semiconductor - Google Patents
Metal mold for sealing semiconductor Download PDFInfo
- Publication number
- KR0157100B1 KR0157100B1 KR1019940004350A KR19940004350A KR0157100B1 KR 0157100 B1 KR0157100 B1 KR 0157100B1 KR 1019940004350 A KR1019940004350 A KR 1019940004350A KR 19940004350 A KR19940004350 A KR 19940004350A KR 0157100 B1 KR0157100 B1 KR 0157100B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- cavity
- runner
- metal mold
- runner part
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
본 발명은, 반도체의 수지밀봉에 사용되는 금형에 관한 것이다. 용융수지가 러너부를 경유해서 캐비티에 공급되어, 성형하는 수지성형금형에 있어서, 불충분한 가열로 인한 저항이 큰 수지가 러너부에 유입되고, 캐비티에 압력을 전달하는 것이 불충분하여 불량한 성형으로 되는 것을 방지하고, 성형사이클을 연장하는 일없이 수지를 가열하는 것을 목적으로 한 것이며, 그 구성에 있어서, 컬부(4) 및 러너부(5)에 돌기물(8), (9)을 형성함으로써, 수지에 대한 전열면적을 증대시켜, 수지를 충분히 가열하고, 용융할 수 있어 낮은 점도의 수지가 압력이 손실되지 않고 캐비티에 공급되어 성형할 수 있는 것을 특징으로 한 것이다.TECHNICAL FIELD This invention relates to the metal mold | die used for resin sealing of a semiconductor. In the resin molding mold to be supplied to the cavity through the runner part and to form the molten resin, resin having a large resistance due to insufficient heating flows into the runner part, and insufficient pressure is applied to the cavity, resulting in poor molding. It aims at heating resin without preventing and extending a shaping | cycling cycle, In the structure, by forming protrusions 8 and 9 in the curl part 4 and the runner part 5, resin It is characterized in that the heat transfer area for the resin is increased, the resin can be sufficiently heated and melted, and the resin having a low viscosity can be supplied to the cavity and molded without losing pressure.
Description
제1도는 본 발명의 일실시예에 있어서의 반도체밀봉금형.1 is a semiconductor sealing mold in an embodiment of the present invention.
제2도는 종래의 반도체밀봉금형.2 is a conventional semiconductor sealing mold.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 포트 2 : 수지1: port 2: resin
3 : 풀런지 4 : 컬부3: full lunge 4: curl part
5 : 러너부 6 : 게이트5: runner part 6: gate
7 : 캐비티 8 : 컬부돌기물7: cavity 8: curl projection
9 : 러너부돌기물9: runner projections
본 발명은, 반도체의 수지밀봉에 사용되는 금형에 관한 것이다.TECHNICAL FIELD This invention relates to the metal mold | die used for resin sealing of a semiconductor.
이하에, 종래의 반도체밀봉금형에 대해서 도면을 참조하면서 설명한다. 제2도는 종래의 반도체밀봉금형이다. 먼저 포트(1)에 수지를 투입한다. 가열되어있는 포트(1), 플런저(3) 및 컬부(4)로부터의 전달된 열에 의하여, 용융상태로된 수지(2)에 플런저로 힘을 가하며 누른다. 수지(2)는 러너(runner)부, 게이트(6)를 거쳐서 캐비티(7)에 충전된다. 캐비티(7)내에 충전된 수지는 경화를 개시한다. 경화에 필요한 소정시간이 경과된 후에, 경화되어 성형이 완료된 제품을 꺼낸다.A conventional semiconductor sealing mold is described below with reference to the drawings. 2 is a conventional semiconductor sealing mold. First, resin is introduced into the pot (1). The heat transmitted from the pot 1, the plunger 3 and the curled portion 4, which are heated, presses the resin 2 in the molten state with a plunger. The resin 2 is filled in the cavity 7 via the runner portion and the gate 6. The resin filled in the cavity 7 starts curing. After the predetermined time required for curing has elapsed, the cured and molded product is taken out.
그러나 상기한 종래의 구성에서는, 열이 컬부로부터 수지에 충분히 전달되지 않고, 플런저동작이 불안정한 수지점도가 높은 상태에서 수지가 캐비티(7)내에 밀봉되어 공기를 흡입하여, 성형된 수지내에 보이드(Void)가 발생한다는 문제를 가지고 있었다.However, in the above-described conventional configuration, heat is not sufficiently transferred from the curl portion to the resin, and the resin is sealed in the cavity 7 to suck in air in a state where the plunger operation is unstable and the resin viscosity is high, thereby causing voids in the molded resin. ) Had the problem that occurs.
본 발명은 이 문제를 해결하기 위하여 수지의 가소화를 촉진하고, 보다 짧은시간에 수지를 용융함으로써 플러저동작을 안정시키고, 수지내에 보이드가 훨씬 적은 반도체밀봉선형품을 성형하는 반도체밀봉금형을 제공하는 것을 목적으로 하는 것이다.In order to solve this problem, the present invention provides a semiconductor sealing mold which promotes plasticization of the resin, stabilizes the plunger operation by melting the resin in a shorter time, and molds a semiconductor sealing linear article having much less voids in the resin. It is intended to be.
본 발명은, 상기 목적을 달성하기 위하여, 성형용수지를 투입하는 포트와, 이 포트에 접속된 플런저의 압압에 의해 수지를 용융하기 위한 절구통형상을 가진 컬부와, 캐비티내에 용융한 수지를 공급하는 통로가 되는 러너부를 가진 수지밀봉 금형장치에 있어서, 상기 컬부와 상기 러너부에 돌기물을 가진 것이다.In order to achieve the above object, the present invention provides a port into which a molding resin is introduced, a curl portion having a mortar shape for melting the resin by pressing the plunger connected to the port, and a passage for supplying the molten resin into the cavity. In the resin sealing mold apparatus which has a runner part which becomes a part, it has a projection in the said curl part and the said runner part.
따라서 본 발명에 의하면, 컬부 및 러너부에 요철형상등의 돌기물을 가지고 있기 때문에, 수지가 플런저의 압력에 의하여, 컬부에 힘이 가해졌을때보다 넓은 면적으로 열을 받을 수 있게 되어, 보다 빨리 수지가 용융하여 플러저동작이 안정되는 동시에, 캐비티내에 보다 낮은 점도로 흐르기 때문에, 공기의 흡입을 억제할 수 있고, 보이드의 발생을 억제할 수 있어 내부 보이드가 적은 반도체밀봉성형품을 얻는 일이 가능하게 된다.Therefore, according to the present invention, because the curl portion and the runner portion have protrusions such as irregularities, the resin can receive heat in a larger area than when a force is applied to the curl portion due to the pressure of the plunger. Since the melted resin stabilizes the plunger operation and flows at a lower viscosity in the cavity, the intake of air can be suppressed and the generation of voids can be suppressed, so that a semiconductor sealed molded article with less internal voids can be obtained. Done.
본 발명의 실시예에 대해서, 이하에 도면을 참조하면서 설명한다.Embodiments of the present invention will be described below with reference to the drawings.
제1도에 본 발명의 일실시예에 있어서의 반도체밀봉금형이다. 제1도에 있어서, (1)은 포트, (2)는 수지, (3)은 플런저, (4)는 컬부, (5)는 러너부(runner), (6)은 게이트, (7)은 캐비티로서, 이들은 종래예와 동일한 번호가 붙여져 있다. (8)은 컬부에 형성된 돌기물, (9)는 러너부에 형성된 돌기물이다. 본 실시예에 의하면, 수지가 상기 돌기물(8), (9)에 의해서, 보다 빨리 용융하므로써 반도체밀봉성형품의 내부 보이드를 적게하는 것이 가능하게 된다.1 is a semiconductor sealing mold in one embodiment of the present invention. In FIG. 1, (1) is a port, (2) is a resin, (3) is a plunger, (4) is a curl, (5) is a runner, (6) is a gate, and (7) is As cavities, these are assigned the same numbers as in the prior art. (8) is a projection formed in the curl portion, and (9) is a projection formed in the runner portion. According to this embodiment, the resin melts faster by the projections 8 and 9, so that the internal voids of the semiconductor sealed molded article can be reduced.
이상과 같이 본 발명은, 컬부 및 러너부에 돌기물을 형성함으로써, 플런저의 압력을 상승시키지 않고, 또 가열시간을 연장하는 일없이 수지온도를 균일하게 상승시켜, 점도를 저하시킴으로써, 캐비티에 도달하는 수지의 성형압력을 확보할 수 있고, 불량한 성형을 없애는 일이 가능하게 되는 동시에, 성형사이클의 연장을 방지하는 것도 가능하게 되는 등의 효과가 있다.As described above, the present invention reaches the cavity by forming the projections on the curled portion and the runner portion so as to raise the resin temperature uniformly without lowering the pressure of the plunger and to extend the heating time and to lower the viscosity. The molding pressure of the resin can be ensured, poor molding can be eliminated, and the extension of the molding cycle can be prevented.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940004350A KR0157100B1 (en) | 1994-03-07 | 1994-03-07 | Metal mold for sealing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940004350A KR0157100B1 (en) | 1994-03-07 | 1994-03-07 | Metal mold for sealing semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950028021A KR950028021A (en) | 1995-10-18 |
| KR0157100B1 true KR0157100B1 (en) | 1998-12-01 |
Family
ID=19378452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940004350A KR0157100B1 (en) | 1994-03-07 | 1994-03-07 | Metal mold for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0157100B1 (en) |
-
1994
- 1994-03-07 KR KR1019940004350A patent/KR0157100B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950028021A (en) | 1995-10-18 |
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