JPH06132331A - Semiconductor sealing mold - Google Patents
Semiconductor sealing moldInfo
- Publication number
- JPH06132331A JPH06132331A JP27864592A JP27864592A JPH06132331A JP H06132331 A JPH06132331 A JP H06132331A JP 27864592 A JP27864592 A JP 27864592A JP 27864592 A JP27864592 A JP 27864592A JP H06132331 A JPH06132331 A JP H06132331A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- runner
- heated
- cull
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体の樹脂封止に用
いられる金型に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold used for resin sealing of semiconductors.
【０００２】[0002]
【従来の技術】以下に、従来の半導体封止金型について
図面を参照しながら説明する。図２は従来の半導体封止
金型である。まずポット１に樹脂を投入する。加熱され
ているポット１，プランジャー３およびカル部４よりの
伝熱により、溶融状態になった樹脂２にプランジャー３
で圧力をかける。樹脂２はランナー部５，ゲート６を経
てキャビティ７に充填される。キャビティ７内に充填さ
れた樹脂は硬化を開始する。硬化に必要な所定時間経過
後、硬化し成形が完了した製品を取り出す。2. Description of the Related Art A conventional semiconductor sealing mold will be described below with reference to the drawings. FIG. 2 shows a conventional semiconductor sealing mold. First, the resin is put into the pot 1. Due to heat transfer from the heated pot 1, plunger 3 and cull part 4, the resin 2 in the molten state is transferred to the plunger 3
Apply pressure with. The resin 2 is filled in the cavity 7 through the runner portion 5 and the gate 6. The resin filled in the cavity 7 starts to cure. After a lapse of a predetermined time required for curing, the product which is cured and molded is taken out.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、樹脂にカル部より熱が十分に伝わらず、
プランジャー動作が不安定になる、樹脂粘度が高い状態
でキャビティ７内に樹脂が封入され空気を巻き込み、成
形した樹脂内にボイド(void)が発生するという問題を有
していた。本発明はこの問題を解決するため、樹脂の可
塑化を促進し、より短い時間で樹脂を溶融することでプ
ランジャー動作を安定させ、ボイドのより少ない半導体
封止成形品を成形する半導体封止金型を提供することを
目的とするものである。However, in the above-mentioned conventional structure, heat is not sufficiently transmitted from the cull portion to the resin,
There has been a problem that the plunger operation becomes unstable, the resin is enclosed in the cavity 7 in a state where the resin viscosity is high, and air is entrained, and a void is generated in the molded resin. In order to solve this problem, the present invention promotes plasticization of the resin, stabilizes the plunger operation by melting the resin in a shorter time, and forms a semiconductor encapsulation molded product with fewer voids. The purpose is to provide a mold.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記目的を達
成するために、成形用樹脂を投入するポットと、このポ
ットに接続されたプランジャーの押圧により樹脂を溶融
するためのすりばち状の形状を有するカル部と、キャビ
ティ内に溶融した樹脂を供給する通路となるランナー部
を持つ樹脂封止金型装置において、前記カル部と前記ラ
ンナー部とに突起物を有するものである。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a pot into which a molding resin is put, and a platter-like shape for melting the resin by pressing a plunger connected to the pot. In a resin-sealed mold device having a cull portion having a shape and a runner portion serving as a passage for supplying molten resin into a cavity, the cull portion and the runner portion have protrusions.
【０００５】[0005]
【作用】したがって本発明によれば、カル部およびラン
ナー部に凹凸形状等の突起物を有しているため、樹脂が
プランジャーの圧力により、カル部に押しつけられたと
きより広い面積で熱を受けることが可能となり、より早
く樹脂が溶融しプランジャー動作が安定するとともに、
キャビティ内により低い粘度で流れるため、空気の巻き
込みが抑えられ、ボイド発生が抑えられ内部ボイドの少
ない半導体封止成形品を得ることが可能となる。Therefore, according to the present invention, since the cull portion and the runner portion have projections such as irregularities, heat is applied in a wider area than when the resin is pressed against the cull portion by the pressure of the plunger. It is possible to receive it, the resin melts faster and the plunger operation stabilizes,
Since it flows with a lower viscosity in the cavity, entrapment of air is suppressed, generation of voids is suppressed, and it becomes possible to obtain a semiconductor-sealed molded product with few internal voids.
【０００６】[0006]
【実施例】本発明の実施例について、以下に図面を参照
しながら説明する。図１は本発明の一実施例における半
導体封止金型である。図１において、１はポット、２は
樹脂、３はプランジャー、４はカル部、５はランナー
部、６はゲート、７はキャビティであって、これらは従
来例と同一番号を付してある。８はカル部に付けられた
突起物、９はランナー部に付けられた突起物である。本
実施例によれば、樹脂が前記突起物８，９によって、よ
り早く溶融することで半導体封止成形品の内部ボイドを
少なくすることが可能となる。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a semiconductor encapsulating mold according to an embodiment of the present invention. In FIG. 1, 1 is a pot, 2 is a resin, 3 is a plunger, 4 is a cull part, 5 is a runner part, 6 is a gate, and 7 is a cavity, and these are given the same numbers as in the conventional example. . Reference numeral 8 is a protrusion attached to the cull portion, and 9 is a protrusion attached to the runner portion. According to the present embodiment, the resin is melted faster by the protrusions 8 and 9, so that the internal voids of the semiconductor encapsulation molded article can be reduced.
【０００７】[0007]
【発明の効果】以上のように本発明は、カル部およびラ
ンナー部に突起物を設けることにより、プランジャーの
圧力を上げることなく、また加熱時間を延長することな
く樹脂温度を均一に高め、粘度を低下させることによ
り、キャビティに達する樹脂の成形圧力を確保すること
ができ、成形不良をなくすことが可能となるとともに、
成形サイクルの延長を防ぐことも可能となる等の効果を
有する。As described above, according to the present invention, by providing the protrusions on the cull portion and the runner portion, the resin temperature is uniformly increased without increasing the pressure of the plunger and without extending the heating time. By lowering the viscosity, the molding pressure of the resin reaching the cavity can be secured, and it becomes possible to eliminate molding defects, and
It also has an effect such that extension of the molding cycle can be prevented.
【図１】本発明の一実施例における半導体封止金型であ
る。FIG. 1 is a semiconductor encapsulating mold according to an embodiment of the present invention.
【図２】従来の半導体封止金型である。FIG. 2 is a conventional semiconductor sealing mold.
１…ポット、 ２…樹脂、 ３…プランジャー、 ４…
カル部、 ５…ランナー部、 ６…ゲート、 ７…キャ
ビティ、 ８…カル部突起物、 ９…ランナー部突起
物。1 ... pot, 2 ... resin, 3 ... plunger, 4 ...
Cull part, 5 ... Runner part, 6 ... Gate, 7 ... Cavity, 8 ... Cull part protrusion, 9 ... Runner part protrusion.
Claims (1)
ットに接続されたプランジャーの押圧により樹脂を溶融
するためのすりばち状の形状を有するカル部と、キャビ
ティ内に溶融した樹脂を供給する通路となるランナー部
を持つ樹脂封止金型装置において、前記カル部と前記ラ
ンナー部とに突起部を有することを特徴とする半導体封
止金型。1. A pot into which a molding resin is put, a cull portion having a mortar-like shape for melting the resin by pressing a plunger connected to the pot, and the molten resin is supplied into the cavity. A resin encapsulation mold device having a runner part that serves as a passage, wherein the cull part and the runner part have protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27864592A JPH06132331A (en) | 1992-10-16 | 1992-10-16 | Semiconductor sealing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27864592A JPH06132331A (en) | 1992-10-16 | 1992-10-16 | Semiconductor sealing mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06132331A true JPH06132331A (en) | 1994-05-13 |
Family
ID=17600170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27864592A Pending JPH06132331A (en) | 1992-10-16 | 1992-10-16 | Semiconductor sealing mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06132331A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07290491A (en) * | 1994-04-27 | 1995-11-07 | Nec Corp | Mold |
| US5556647A (en) * | 1994-03-07 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | Encapsulation mold |
| KR100304921B1 (en) * | 1998-12-29 | 2001-11-02 | 마이클 디. 오브라이언 | structure for mold die in fabrication of semiconductor package |
| KR100521977B1 (en) * | 2000-10-17 | 2005-10-17 | 앰코 테크놀로지 코리아 주식회사 | Mold block for manufacturing semiconductor package |
-
1992
- 1992-10-16 JP JP27864592A patent/JPH06132331A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5556647A (en) * | 1994-03-07 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | Encapsulation mold |
| JPH07290491A (en) * | 1994-04-27 | 1995-11-07 | Nec Corp | Mold |
| KR100304921B1 (en) * | 1998-12-29 | 2001-11-02 | 마이클 디. 오브라이언 | structure for mold die in fabrication of semiconductor package |
| KR100521977B1 (en) * | 2000-10-17 | 2005-10-17 | 앰코 테크놀로지 코리아 주식회사 | Mold block for manufacturing semiconductor package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5204122A (en) | Mold for use in resin encapsulation molding | |
| JP2778608B2 (en) | Method for manufacturing resin-molded semiconductor device | |
| JPH06132331A (en) | Semiconductor sealing mold | |
| JP3383701B2 (en) | Mold for resin encapsulation | |
| JPH1158449A (en) | Resin seal molding die for semiconductor device | |
| KR0157100B1 (en) | Metal mold for sealing semiconductor | |
| JP2666630B2 (en) | Method for manufacturing semiconductor device | |
| JP3795684B2 (en) | Resin sealing molding method for electronic parts | |
| JP3125765B2 (en) | Resin package equipment for semiconductor devices | |
| JPS57139931A (en) | Resin-sealing mold for semiconductor device | |
| JPH1158454A (en) | Thermosetting resin molding die | |
| KR0139128Y1 (en) | Moulding apparatus of molding press for semiconductor package | |
| JPH04208430A (en) | Isothermal injection molding process | |
| JPH0431285B2 (en) | ||
| JPS5852106Y2 (en) | Transfer molding machine | |
| JPS59172241A (en) | Semiconductor resin sealing device | |
| JPH04179242A (en) | Sealing method for semiconductor element | |
| JPH03280440A (en) | Molding of semiconductor device using resin | |
| JPS6154635A (en) | Metal mold for semiconductor resin sealing | |
| JP2002113739A (en) | Resin sealing apparatus and method | |
| JPH06132332A (en) | Semiconductor sealing mold | |
| JP2001196402A (en) | Method of manufacturing semiconductor device | |
| JPH0582572A (en) | Semiconductor device resin sealing mold and resin sealing method | |
| JPH0351111A (en) | Resin sealing apparatus | |
| JPH0679750A (en) | Method for transfer molding |