JPH06132331A - Semiconductor sealing mold - Google Patents

Semiconductor sealing mold

Info

Publication number
JPH06132331A
JPH06132331A JP27864592A JP27864592A JPH06132331A JP H06132331 A JPH06132331 A JP H06132331A JP 27864592 A JP27864592 A JP 27864592A JP 27864592 A JP27864592 A JP 27864592A JP H06132331 A JPH06132331 A JP H06132331A
Authority
JP
Japan
Prior art keywords
resin
cavity
runner
heated
cull
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27864592A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Abe
光浩 阿部
Mitsuo Yamada
三男 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP27864592A priority Critical patent/JPH06132331A/en
Publication of JPH06132331A publication Critical patent/JPH06132331A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the generation of defective molding due to shortage of pressure transmission to a cavity caused by the flowing in of insufficiently heated resin of high drift resistance, and the resin is heated up without extending molding cycle in a resin molding mold with which molten resin is molded by feeding it to the cavity via a runner. CONSTITUTION:The heat transfer area for resin is increased by providing protruding parts 8 and 9 on a cull part 4 and a runner part 5. As a result, the resin can be heated up and melted sufficiently, low viscosity resin is fed to a cavity 7 without loss of pressure, and it is molded.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体の樹脂封止に用
いられる金型に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold used for resin sealing of semiconductors.

【0002】[0002]

【従来の技術】以下に、従来の半導体封止金型について
図面を参照しながら説明する。図2は従来の半導体封止
金型である。まずポット1に樹脂を投入する。加熱され
ているポット1,プランジャー3およびカル部4よりの
伝熱により、溶融状態になった樹脂2にプランジャー3
で圧力をかける。樹脂2はランナー部5,ゲート6を経
てキャビティ7に充填される。キャビティ7内に充填さ
れた樹脂は硬化を開始する。硬化に必要な所定時間経過
後、硬化し成形が完了した製品を取り出す。
2. Description of the Related Art A conventional semiconductor sealing mold will be described below with reference to the drawings. FIG. 2 shows a conventional semiconductor sealing mold. First, the resin is put into the pot 1. Due to heat transfer from the heated pot 1, plunger 3 and cull part 4, the resin 2 in the molten state is transferred to the plunger 3
Apply pressure with. The resin 2 is filled in the cavity 7 through the runner portion 5 and the gate 6. The resin filled in the cavity 7 starts to cure. After a lapse of a predetermined time required for curing, the product which is cured and molded is taken out.

【0003】[0003]

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、樹脂にカル部より熱が十分に伝わらず、
プランジャー動作が不安定になる、樹脂粘度が高い状態
でキャビティ7内に樹脂が封入され空気を巻き込み、成
形した樹脂内にボイド(void)が発生するという問題を有
していた。本発明はこの問題を解決するため、樹脂の可
塑化を促進し、より短い時間で樹脂を溶融することでプ
ランジャー動作を安定させ、ボイドのより少ない半導体
封止成形品を成形する半導体封止金型を提供することを
目的とするものである。
However, in the above-mentioned conventional structure, heat is not sufficiently transmitted from the cull portion to the resin,
There has been a problem that the plunger operation becomes unstable, the resin is enclosed in the cavity 7 in a state where the resin viscosity is high, and air is entrained, and a void is generated in the molded resin. In order to solve this problem, the present invention promotes plasticization of the resin, stabilizes the plunger operation by melting the resin in a shorter time, and forms a semiconductor encapsulation molded product with fewer voids. The purpose is to provide a mold.

【0004】[0004]

【課題を解決するための手段】本発明は、上記目的を達
成するために、成形用樹脂を投入するポットと、このポ
ットに接続されたプランジャーの押圧により樹脂を溶融
するためのすりばち状の形状を有するカル部と、キャビ
ティ内に溶融した樹脂を供給する通路となるランナー部
を持つ樹脂封止金型装置において、前記カル部と前記ラ
ンナー部とに突起物を有するものである。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a pot into which a molding resin is put, and a platter-like shape for melting the resin by pressing a plunger connected to the pot. In a resin-sealed mold device having a cull portion having a shape and a runner portion serving as a passage for supplying molten resin into a cavity, the cull portion and the runner portion have protrusions.

【0005】[0005]

【作用】したがって本発明によれば、カル部およびラン
ナー部に凹凸形状等の突起物を有しているため、樹脂が
プランジャーの圧力により、カル部に押しつけられたと
きより広い面積で熱を受けることが可能となり、より早
く樹脂が溶融しプランジャー動作が安定するとともに、
キャビティ内により低い粘度で流れるため、空気の巻き
込みが抑えられ、ボイド発生が抑えられ内部ボイドの少
ない半導体封止成形品を得ることが可能となる。
Therefore, according to the present invention, since the cull portion and the runner portion have projections such as irregularities, heat is applied in a wider area than when the resin is pressed against the cull portion by the pressure of the plunger. It is possible to receive it, the resin melts faster and the plunger operation stabilizes,
Since it flows with a lower viscosity in the cavity, entrapment of air is suppressed, generation of voids is suppressed, and it becomes possible to obtain a semiconductor-sealed molded product with few internal voids.

【0006】[0006]

【実施例】本発明の実施例について、以下に図面を参照
しながら説明する。図1は本発明の一実施例における半
導体封止金型である。図1において、1はポット、2は
樹脂、3はプランジャー、4はカル部、5はランナー
部、6はゲート、7はキャビティであって、これらは従
来例と同一番号を付してある。8はカル部に付けられた
突起物、9はランナー部に付けられた突起物である。本
実施例によれば、樹脂が前記突起物8,9によって、よ
り早く溶融することで半導体封止成形品の内部ボイドを
少なくすることが可能となる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a semiconductor encapsulating mold according to an embodiment of the present invention. In FIG. 1, 1 is a pot, 2 is a resin, 3 is a plunger, 4 is a cull part, 5 is a runner part, 6 is a gate, and 7 is a cavity, and these are given the same numbers as in the conventional example. . Reference numeral 8 is a protrusion attached to the cull portion, and 9 is a protrusion attached to the runner portion. According to the present embodiment, the resin is melted faster by the protrusions 8 and 9, so that the internal voids of the semiconductor encapsulation molded article can be reduced.

【0007】[0007]

【発明の効果】以上のように本発明は、カル部およびラ
ンナー部に突起物を設けることにより、プランジャーの
圧力を上げることなく、また加熱時間を延長することな
く樹脂温度を均一に高め、粘度を低下させることによ
り、キャビティに達する樹脂の成形圧力を確保すること
ができ、成形不良をなくすことが可能となるとともに、
成形サイクルの延長を防ぐことも可能となる等の効果を
有する。
As described above, according to the present invention, by providing the protrusions on the cull portion and the runner portion, the resin temperature is uniformly increased without increasing the pressure of the plunger and without extending the heating time. By lowering the viscosity, the molding pressure of the resin reaching the cavity can be secured, and it becomes possible to eliminate molding defects, and
It also has an effect such that extension of the molding cycle can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における半導体封止金型であ
る。
FIG. 1 is a semiconductor encapsulating mold according to an embodiment of the present invention.

【図2】従来の半導体封止金型である。FIG. 2 is a conventional semiconductor sealing mold.

【符号の説明】[Explanation of symbols]

1…ポット、 2…樹脂、 3…プランジャー、 4…
カル部、 5…ランナー部、 6…ゲート、 7…キャ
ビティ、 8…カル部突起物、 9…ランナー部突起
物。
1 ... pot, 2 ... resin, 3 ... plunger, 4 ...
Cull part, 5 ... Runner part, 6 ... Gate, 7 ... Cavity, 8 ... Cull part protrusion, 9 ... Runner part protrusion.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 成形用樹脂を投入するポットと、このポ
ットに接続されたプランジャーの押圧により樹脂を溶融
するためのすりばち状の形状を有するカル部と、キャビ
ティ内に溶融した樹脂を供給する通路となるランナー部
を持つ樹脂封止金型装置において、前記カル部と前記ラ
ンナー部とに突起部を有することを特徴とする半導体封
止金型。
1. A pot into which a molding resin is put, a cull portion having a mortar-like shape for melting the resin by pressing a plunger connected to the pot, and the molten resin is supplied into the cavity. A resin encapsulation mold device having a runner part that serves as a passage, wherein the cull part and the runner part have protrusions.
JP27864592A 1992-10-16 1992-10-16 Semiconductor sealing mold Pending JPH06132331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27864592A JPH06132331A (en) 1992-10-16 1992-10-16 Semiconductor sealing mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27864592A JPH06132331A (en) 1992-10-16 1992-10-16 Semiconductor sealing mold

Publications (1)

Publication Number Publication Date
JPH06132331A true JPH06132331A (en) 1994-05-13

Family

ID=17600170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27864592A Pending JPH06132331A (en) 1992-10-16 1992-10-16 Semiconductor sealing mold

Country Status (1)

Country Link
JP (1) JPH06132331A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290491A (en) * 1994-04-27 1995-11-07 Nec Corp Mold
US5556647A (en) * 1994-03-07 1996-09-17 Matsushita Electric Industrial Co., Ltd. Encapsulation mold
KR100304921B1 (en) * 1998-12-29 2001-11-02 마이클 디. 오브라이언 structure for mold die in fabrication of semiconductor package
KR100521977B1 (en) * 2000-10-17 2005-10-17 앰코 테크놀로지 코리아 주식회사 Mold block for manufacturing semiconductor package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5556647A (en) * 1994-03-07 1996-09-17 Matsushita Electric Industrial Co., Ltd. Encapsulation mold
JPH07290491A (en) * 1994-04-27 1995-11-07 Nec Corp Mold
KR100304921B1 (en) * 1998-12-29 2001-11-02 마이클 디. 오브라이언 structure for mold die in fabrication of semiconductor package
KR100521977B1 (en) * 2000-10-17 2005-10-17 앰코 테크놀로지 코리아 주식회사 Mold block for manufacturing semiconductor package

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